Thermal balance for enclosures

Dimensions by enclosure

Position of the enclosure

Height,
Wight,
Depth,

Accessible from every side

Placed against a wall
On the end when suited
On the end when suited, placed against a wall
In the middle when suited
In the middle when suited, placed against a wall
In the middle when suited, placed against a wall with the top coverred

1000
800
400

Thermal power dissipated by

operational component
2000 W

Heat dissipation area, m2

Characteristic of the environment air

Coefficient thermal conduction

Material of the enclosure:
65
Plastic
-10
Painting steel
Stainless steel
Aluminum

Maximum ambient temperature, C

Minimum ambient temperature, C

Average desired internal temperatures

Maximum internal temperature,
Minimum internal temperature, C

30
5

Final temperature inside the enclosure with no thermal system

Maximum internal temperature,
Minimum internal temperature, C

128.86
53.86

Determining the type of thermal device and its power

Heater

0 W, Permanent operation
0 W, Discontinuous operation

Circulation fan may be used in to the enclosure

Ventilation, fan, exchanger, cooling unit.

see spacial table for cooling unit
YES

2.61
2.61
2.29
1.50
2.13
2.29
1.97
1.74

top coverred

conduction
f the enclosure:

anger, cooling unit.

m2
m2
m2
m2
m2
m2
m2

12
3.5
5.5
3.7
12

W/2/
W/2/
W/2/
W/2/

3096.2 W