CB_w 150[mm] Circuit board width

CB_l 150[mm] Circuit board length

CB_t 3[mm] Circuit board thickness
IC1_w 50[mm] IC 1 width
IC1_l 50[mm] IC 1 length
IC1_t 3[mm] IC 1 thickness
IC2_w 15[mm] ICs 2 width
IC2_l 20[mm] ICs 2 length
IC2_t 3[mm] ICs 2 thickness
IC3_w 15[mm] ICs 3 width
IC3_l 40[mm] ICs 3 length
IC3_t 3[mm] IC2 3 thickness
P1 20[W] Power dissipated by IC 1
P2 1[W] Power dissipated by ICs 2
P3 2[W] Power dissipated by ICs 3
htc 20[W/(m^2*K)] Heat transfer coefficient
T0 273.15[K] Air flow temperature
e_fins 0.3[mm] Fins thickness
i_radius 5[mm] Inner radius
o_radius 25[mm] Outer radius
air_sp 3[mm] Air spacing between sink fins
n_fins 10 Number of fins
t_h air_sp*n_fins Heat sink tube height