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Chapter 1 Basics
Chapter 1 Basics
Structure
Sub atomic electrons and nuclei (protons
and neutrons)
Atomic organization of atoms or
molecules
Microscopic groups of atoms that are
normally agglomerated together
Macroscopic viewable with the un-aided
eye
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University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1
Terminology
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University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1
The 21st century challenge -- Fashion materials at the nanoscale with desired properties and functionality
Things Natural 100 m 1 meter (m) Things Manmade
10-1 m 0.1 m
100 mm
Objects fashioned from
Progress in miniaturization
metals, ceramics, glasses, polymers ...
Monarch butterfly
~ 0.1 m 0.01 m
Dust mite 10-2 m
300 m 1 cm
Head of a pin
10 mm 1-2 mm
Cat
~ 0.3 m
10-3 m 1 millimeter (mm)
Microworld
Progress in atomic-level understanding
~ 15 mm
The
10-5 m 0.01 mm
10 m
spectrum
Visible
Red blood cells
with white cell Atoms of silicon
Magnetic ~ 2-5 m Red blood cells
domains garnet spacing ~tenths of nm Pollen grain
film 10-7 m 0.1 m
11 m wide 100 nm
Nanoworld
stripes
Schematic, central core ATP synthase
The
10-8 m 0.01 m
10 nm
Processing
Structure
Properties
Performance
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University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1
600
Hardness (BHN)
30m
500 (c)
Data obtained from Figs. 10.21(a)
400 (b) and 10.23 with 4wt%C composition,
(a) and from Fig. 11.13 and associated
4m discussion, Callister 6e.
300 Micrographs adapted from (a) Fig.
10.10; (b) Fig. 9.27;(c) Fig. 10.24;
30m
and (d) Fig. 10.12, Callister 6e.
200 30m
100
0.01 0.1 1 10 100 1000
Cooling Rate (C/s)
Processing can change structure
ex: structure vs cooling rate of steel
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University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1
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University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1
Composition
Bonding Crystal Structure
Thermomechanical
Processing
Microstructure
ELECTRICAL
Electrical Resistivity of Copper:
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Ni Adapted from Fig. 18.8, Callister 6e.
t% (Fig. 18.8 adapted from: J.O. Linde,
5 . 32a Ann Physik 5, 219 (1932); and
+ 3
Resistivity,
u +2 . 1 2a 1970.)
C
u +1
3 edC
f orm % Ni
d e a t
2 . 12
u +1
C
1 e Cu
r
Pu
0
-200 -100 0 T (C)
Adding impurity atoms to Cu increases resistivity.
Deforming Cu increases resistivity.
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University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1
MAGNETIC
Magnetic Storage: Magnetic Permeability
--Recording medium vs. Composition:
is magnetized by --Adding 3 atomic % Si
recording head. makes Fe a better
recording medium!
Magnetization
Fe+3%Si
Fe
Magnetic Field
Adapted from C.R. Barrett, W.D. Nix, and
Fig. 20.18, Callister 6e. A.S. Tetelman, The Principles of
(Fig. 20.18 is from J.U. Lemke, MRS Bulletin, Engineering Materials, Fig. 1-7(a), p. 9,
Vol. XV, No. 3, p. 31, 1990.) 1973. Electronically reproduced
by permission of Pearson Education, Inc.,
Upper Saddle River, New Jersey.
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University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1
OPTICAL
Transmittance:
--Aluminum oxide may be transparent, translucent, or
opaque depending on the material structure.
polycrystal: polycrystal:
single crystal low porosity high porosity
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University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1
DETERIORATIVE
Stress & Saltwater... Heat treatment: slows
--causes cracks! crack speed in salt water!
increasing load
Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation and
Fracture Mechanics of Engineering Materials" (4th ed.), p. 505,
Adapted from Fig. 17.0, Callister 6e. John Wiley and Sons, 1996. (Original source: Markus O.
(Fig. 17.0 is from Marine Corrosion, Causes, Speidel, Brown Boveri Co.)
and Prevention, John Wiley and Sons, Inc.,
4m
1975.)
--material:
7150-T651 Al "alloy"
(Zn,Cu,Mg,Zr)
Types of Materials
(a) (b)
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University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1
Types of Materials
Let us classify materials according to the way the atoms are bound together
(Chapter 2).
Metals: valence electrons are detached from atoms, and spread in an 'electron
sea' that "glues" the ions together. Strong, ductile, conduct electricity and heat
well, are shiny if polished.
Semiconductors: the bonding is covalent (electrons are shared between
atoms). Their electrical properties depend strongly on minute proportions of
contaminants. Examples: Si, Ge, GaAs.
Ceramics: atoms behave like either positive or negative ions, and are bound
by Coulomb forces. They are usually combinations of metals or
semiconductors with oxygen, nitrogen or carbon (oxides, nitrides, and
carbides). Hard, brittle, insulators. Examples: glass, porcelain.
Polymers: are bound by covalent forces and also by weak van der Waals
forces, and usually based on C and H. They decompose at moderate
temperatures (100 400 C), and are lightweight. Examples: plastics rubber. 15
University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1
Metals
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University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1
Ceramics
Ceramics
Ceramics
Polymers
Polymers
Semiconductors
(a)
(b)
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University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1
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University of Tennessee, Dept. of Materials Science and Engineering