MANUFACTURING OF LED

A
Project Report
submitted
in partial fulfilment
for the award of the Degree of
Bachelor of Technology in
Department of Mechanical Engineering
by

Bharat Bhushan
020712012

Under the supervision of

Dr. M.P. Singh

[ H.O.D.]

Department of Mechanical Engineering

Jagan Nath University

Jaipur
Jan-July 2016

1
 Candidate Declaration

I, Bharat Bhushan hereby declare that the work presented in this report
entitled Manufacturing Of LED in partial fulfillment of the requirements
for the award of Degree of Bachelor of Technology, submitted in the
Department of Mechanical Engineering at Jagan Nath University, Jaipur,
is an authentic record of my work under the supervision of Dr.M.P. Singh.

I also declare that the work embodied in the present project report is my
original work/extension of the existing work and has not been copied from
any Journal/thesis/book, and has not been submitted by me for any other
Degree/Diploma.

( Bharat Bhushan )

Enrollment No. 020712012

Date: 1 June 2016

2
 Certificate of the Supervisor

This is to certify that the project report entitled Manufacturing Of LED

submitted by Bharat Bhushan for the award of Degree of Bachelor of
Technology in the Department of Mechanical Engineering of Jagan Nath
University, Jaipur, is a record of authentic work carried out by him/her under
my/our supervision.

The matter embodied in this project report is the original work of the
candidate and has not been submitted for the award of any other degree or
diploma. It is further certified that he/she has worked with me/us for the
required period in the Department of Mechanical Engineering, Jagan Nath
University, Jaipur.

Dr. M.P.Singh

Date: 1 June 2016

3
 Acknowledgements

I would like to express my sincere gratitude to my project guide & professor

Dr. M.P.Singh [H.O.D.] for giving me the opportunity to work on this
topic. It would never be possible for us to take this project to this level
without his innovative ideas and his relentless support and encouragement.

Bharat Bhushan
1204012

4
CONTENT
Chapter 1: Introduction and manufacturing processes
1.1- LED installation in India---------------------------------------------------------10
1.2- Fluorescence and its properties--------------------------------------------------12
1.3- Products of Autopal---------------------------------------------------------------15
1.4- Introduction of SMT machine---------------------------------------------------17
1.5- Process involved-------------------------------------------------------------------17
1.6- Process:
1- Surface mount design and PCB design--------------------------------------18
2- Solder paste application-------------------------------------------------------24
3- Component placement---------------------------------------------------------27
4- Soldering------------------------------------------------------------------------28
5- Cleaning-------------------------------------------------------------------------28
6- Repair/Rework------------------------------------------------------------------29

1.7- How to use SMT machine-------------------------------------------------------29

1.8- Safety-------------------------------------------------------------------------------30

1.9- Machine installation and adjustment-------------------------------------------31

1.10- Advantages and Disadvantages-------------------------------------------------32

Chapter 2: Literature review

2.1- Facility shapes and dimensions----------------------------------------------33

2.2- Material handling system-----------------------------------------------------34

2.3- Multi floor layout--------------------------------------------------------------35

2.4- Facility layout problem-------------------------------------------------------36

2.5- Time and motion study-------------------------------------------------------37

2.6- Assembly line balancing-----------------------------------------------------38

2.7- 5s--------------------------------------------------------------------------------40

2.8- SWOT analysis-----------------------------------------------------------------43

Chapter 3: Data Analysis and Result

3.1- Computerized relatives allocation of facilities techniques (CRAFT)-----------45

3.2- Systematic layout planning-----------------------------------------------------------51

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3.3- Analysis of layout with minimum product travel method-------------------------53

3.4- Line balancing and efficiency---------------------------------------------------------56

3.5- Capacity calculation: time study------------------------------------------------------60

3.6- Implementation of 5s-------------------------------------------------------------------62

3.7- Bill of material--------------------------------------------------------------------------63

3.8- SWOT analysis-------------------------------------------------------------------------66

Chapter 4: Discussion and Result

4.1- CRAFT-----------------------------------------------------------------------------------68

4.2- Systematic layout planning------------------------------------------------------------69

4.3- Assembly time balancing--------------------------------------------------------------70

4.4- Demand forecasting--------------------------------------------------------------------71

4.5- Ergonomics------------------------------------------------------------------------------72

4.6- Safety of workplace --------------------------------------------------------------------75

4.7- Lean process ----------------------------------------------------------------------------78

Chapter 5: Conclusion and Recommendation

5.1- Conclusion -------------------------------------------------------------------------------83

5.2- Recommendation -----------------------------------------------------------------------84

References---------------------------------------------------------------------------------85
Appendixes--------------------------------------------------------------------------------86

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 Abstract

Autopal group, a 40 years old enterprise with excellence and pioneer-ship in many
engineering and lighting products. Autopal was the first company to manufacture the
CFL technology in India. The group extends its State-of-Art technology, Avant-garde
design in consumer durable goods like CFL, MHL, domestic use Fan Series. Autopal forays
wide products range of Energy saving lamps CFL , MHL, Downlighters, LED Series &
Tubelight.

In case of LED industry to increase the profit and quality of the product and to
reduce the manufacturing cost and also for en effective work place. For these an effective
layout model is necessary for the industry. By decreasing process bottlenecks, reducing
lead times and increasing the production line efficiency productivity can be improved.
Line balancing and time study are effective to reduce the operation time and improvement
for the productivity. Time study was performed in the industry to increase its production
efficiency and reduce the operation time and associated cost. Assembly line balancing
technique was also used in single production line to identify and remove the non-value
added activities and increase the productivity. Computerized Relative Allocation of
Facilities Technique (CRAFT), Systematic layout planning (SLP) and Analysis of layout
with Minimum Product Travel Method (MPTM) were used for an effective layout.

In this facility layout system, time study is performed and the production lines are
balanced through the distribution of works among the work stations by line balancing. A
new product layout is modeled with the balanced capacity combining both modular line
and traditional manufacturing system together. The feasible problem areas which
occurred in different places are pin pointed by strength, weakness, opportunities and
threats for the facility layout was also identified by SWOT analysis. This project report
will provide practical and pragmatic guidelines for the improvement of facility layout of
small LED manufacturing industry to improve their industrial productivity and capacity
by applying some essential tools like- CRAFT, SLP, MPTM, 5S etc.

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 List of figures
1.1- Advanced SMT machine-----------------------------------------------------------------17
1.2- SMT machine -----------------------------------------------------------------------------18
1.3- Printed circuit board through hole leaded resistor -----------------------------------21
1.4- Surface mount component including resistor and IC ---------------------------------22
1.5- Soldering paste ----------------------------------------------------------------------------24
1.6- a. Feeder device without feed -----------------------------------------------------------27
b. Feeder device with feed ---------------------------------------------------------------27

1.7- Soldering of circuit board----------------------------------------------------------------29

2.1- Material handling system ----------------------------------------------------------------35

2.2- Time and motion study---------------------------------------------------------------------37

2.3- Assembly line balancing ------------------------------------------------------------------40

2.4- 5s ---------------------------------------------------------------------------------------------43

3.1- Centroid allocation of departments in initial layout ----------------------------------47

3.2- Centroid allocation in changed layout---------------------------------------------------49

3.3- Centroid allocation in changed layout -------------------------------------------------50

3.4- Initial relationship diagram---------------------------------------------------------------52

3.5- Block diagram for initial layout----------------------------------------------------------53

3.6- Block diagram for improved layout -----------------------------------------------------54

3.7- Line balancing ------------------------------------------------------------------------------57

3.8- Activity relationship diagram-------------------------------------------------------------59

4.1- Proposed U shape layout ------------------------------------------------------------------70

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 List of Tables
3.1- Included tasks and are area of the departments --------------------------------------------47

3.2- From to chart ---------------------------------------------------------------------------------48

3.3- Rectilinear distance between the departments for initial layout -------------------------48

3.4- Total distances travelled per hour between departments for initial layout--------------48

3.5- Rectilinear distance between the departments ----------------------------------------------49

3.6- Total distances travelled per hour between departments layout--------------------------50

3.7- Rectilinear distance between the departments ----------------------------------------------50

3.8- Total distances travelled per hour between departments layout--------------------------51

3.9- Reason for rating various departments ------------------------------------------------------51

3.10- Closeness and line code for various departments -----------------------------------------52

3.11- Relationship chart -----------------------------------------------------------------------------52

3.12- Distance between the adjacent departments -----------------------------------------------55

3.13- Precedence chart ------------------------------------------------------------------------------58

3.14- Time study--------------------------------------------------------------------------------------60

4.1- Monthly demand for four months ------------------------------------------------------------71

9
Chapter-1
Introduction

1.1 LED installation in India:

The LED lighting projects being undertaken in several states of India will open up huge
business opportunity for the local LED industry. For example, the Andhra Pradesh
government has ordered that in the procurement of LED lights, preference will be given to
the LED industry in the state.

Replacing domestic incandescent lights and conventional streetlights with LED lights will
result in conservation of billions of units of power every year. The total number of
streetlights in the country is about 3.5 crore and currently, 99.5 per cent of these lights are
conventional lights. If all the lights are replaced with LED lights it will save 50 per cent
energy and 5 billion units of power every year. However, it is estimated that it will take
five years to replace all the incandescent bulbs with LED lights.

About 77 crore incandescent bulbs are sold every year in India and replacing them with
LED lights will result in saving 25 billion units of power, annually in India.

Replacing a 60W CFL bulb with a 7W LED light will result in saving Rs 500-600 every
year on each bulb. Moreover, an LED light has a 10 year lifespan compared to just six
months of an incandescent bulb and two years of a CFL.

The cost of a 7W LED bulb has come down from Rs 400 to Rs 204 in the last one and a
half years. As the demand increases, prices will further fall sharply.

Currently, there are 80-90 small manufacturers of LED lights in India.

LED streetlights in Visakhapatnam

Visakhapatnam, a major city in the Indian state of Andhra Pradesh, has realised the need
for LED streetlights to reduce power consumption in the city. The civic body Greater
Visakhapatnam Municipal Corporation (GVMC) will replace 94,000 sodium vapour lamps
in the city with LED lights. This activity will be completed by January 2015. Work of
replacing the streetlights with LED lights is being done in 30 out of 72 municipal wards,
and soon work will start in Anakapalle and Bheemili.

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LED lights distributed in Guntur in Andhra Pradesh

Under the programme Demand Side Efficient Lighting Programme (DELP) about 2.25
lakh LED lights were distributed in the Guntur district of Andhra Pradesh. DELP aims to
save electricity consumption in the state of Andhra Pradesh. This project to help the state
use more and more LED lights, was started as a pilot project in Guntur. The project is
being implemented by the Andhra Pradesh government and the Energy Efficiency Services
Ltd (EESL).

Tata Power installing LED lights in Delhi: Discom Tata Power is installing LED
streetlights in Delhi, the capital of India. Tata Power Delhi Distribution Limited. Tata
Power is using Astro Timers along with the LED lights for accurate switching on/off. This
will prevent wastage of electricity significantly.

LED streetlights in Punjab

Punjab government in India has decided to replace all traditional streetlights across all
cities of the state. These streetlights will be LED lights as the state government has decided
to save power, at the same time make the streets well lit with the help of LED lights.
Besides saving energy, the LED project will help to improve visibility at night which will
make the streets save for drivers and pedestrians.

LED lighting project in Kerala

All LED lighting projects in Thiruvananthapuram, in the Indian state of Kerala, will be
entrusted to Keltron, nullifying the need for the tender process.

LED lights in all Puducherry homes

Government of Puducherry, earlier known as Pondicherry, an Indian Union, has started

distributing low cost LED bulbs to every household with the aim to light every home with
LED bulbs. This project has been taken up under the Demand Side Management based
Efficient Lighting Programme (DLEP). Nearly 7.35 lakh 7watt LEDs were distributed to
2.45 lakh households at Rs 10 each. This way, Puducherry will save up to 48.75 million
units of energy per annum.

Uttar Pradesh to get LED streetlights

The Indian state of Uttar Pradesh has decided to install LED streetlights across the state.
The chief minister of the state has already approved the project. It was decided to install
LED lights on streets, government buildings and parks.

LED streetlights to illuminate Patna

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Urban development and housing department Indian state Bihar will install 5,000 LED
streetlights in the state capital Patna. About 1,000 LED streetlights each in 10 municipal
corporations of the state, excluding Patna Municipal Corporation (PMC), will be installed.

1.2 Fluorescence and its properties:

It is the emission of light by a substance that has absorbed light or other electromagnetic
radiation. It is a form of luminescence. In most cases, the emitted light has a longer
wavelength, and therefore lower energy, than the absorbed radiation. The most striking
example of fluorescence occurs when the absorbed radiation is in the ultraviolet region of
the spectrum, and thus invisible to the human eye, while the emitted light is in the visible
region, which gives the fluorescent substance a distinct color that can only be seen when
exposed to UV light. However, unlike phosphorescence, where the substance would
continue to glow and emit light for some time after the radiation source has been turned
off, fluorescent materials would cease to glow immediately upon removal of the excitation
source. Hence, it is not a persistent phenomenon. Strongly fluorescent pigments often have
an unusual appearance which is often described colloquially as a "neon color." This
phenomenon was termed "Farbenglut" by Hermann von Helmholtz and "fluoresce" by
Ralph M. Evans. It is generally thought to be related to the high brightness of the color
relative to what it would be as a component of white. Fluorescence shifts energy in the
incident illumination from shorter wavelengths to longer (such as blue to yellow) and thus
can make the fluorescent color appear brighter (more saturated) than it could possibly be
by reflection alone.

Fluorescence has many practical applications, including mineralogy, gemology, chemical

sensors (fluorescence spectroscopy), fluorescent labelling, dyes, biological detectors,
cosmic-ray detection, and, most commonly, fluorescent lamps. Fluorescence also occurs
frequently in nature in some minerals and in various biological states in many branches of
the animal kingdom.

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 a. Photochemistry

Fluorescence occurs when an orbital electron of a molecule, atom, or nanostructure,

relaxes to its ground state by emitting a photon from an excited singlet state:

Excitation:

Fluorescence (emission):

Here is a generic term for photon energy with h = Planck's constant and = frequency
of light. The specific frequencies of exciting and emitted light are dependent on the
particular system.

S0 is called the ground state of the fluorophore (fluorescent molecule), and S1 is its first
(electronically) excited singlet state.

A molecule in S1 can relax by various competing pathways. It can undergo non-radiative

relaxation in which the excitation energy is dissipated as heat (vibrations) to the solvent.
Excited organic molecules can also relax via conversion to a triplet state, which may
subsequently relax via phosphorescence, or by a secondary non-radiative relaxation step.

Relaxation from S1 can also occur through interaction with a second molecule through
fluorescence quenching. Molecular oxygen (O2) is an extremely efficient quencher of
fluorescence just because of its unusual triplet ground state.

In most cases, the emitted light has a longer wavelength, and therefore lower energy, than
the absorbed radiation; this phenomenon is known as the Stokes shift. However, when the
absorbed electromagnetic radiation is intense, it is possible for one electron to absorb two
photons; this two photon absorption can lead to emission of radiation having a shorter
wavelength than the absorbed radiation. The emitted radiation may also be of the same
wavelength as the absorbed radiation, termed "resonance fluorescence".

Molecules that are excited through light absorption or via a different process (e.g. as the
product of a reaction) can transfer energy to a second 'sensitized' molecule, which is
converted to its excited state and can then fluoresce.

b. Quantum yield

The fluorescence quantum yield gives the efficiency of the fluorescence process. It is
defined as the ratio of the number of photons emitted to the number of photons absorbed.

13
The maximum fluorescence quantum yield is 1.0 (100%); each photon absorbed results in
a photon emitted. Compounds with quantum yields of 0.10 are still considered quite
fluorescent. Another way to define the quantum yield of fluorescence, is by the rate of
excited state decay:

Where, is the rate constant of spontaneous emission of radiation and

is the sum of all rates of excited state decay. Other rates of excited state decay are caused
by mechanisms other than photon emission and are, therefore, often called "non-radiative
rates", which can include: dynamic collisional quenching, near-field dipole-dipole
interaction (or resonance energy transfer), internal conversion, and intersystem crossing.
Thus, if the rate of any pathway changes, both the excited state lifetime and the
fluorescence quantum yield will be affected.

Fluorescence quantum yields are measured by comparison to a standard. The quinine salt
quinine sulfate in a sulfuric acid solution is a common fluorescence standard.

c. Lifetime

.The fluorescence lifetime refers to the average time the molecule stays in its excited state
before emitting a photon. Fluorescence typically follows first order kinetics:

14
where is the concentration of excited state molecules at time , is the initial
concentration and is the decay rate or the inverse of the fluorescence lifetime. This is an
instance of exponential decay. Various radiative and non-radiative processes can de-
populate the excited state. In such case the total decay rate is the sum over all rates:

where is the total decay rate, the radiative decay rate and the non-radiative
decay rate. It is similar to a first-order chemical reaction in which the first-order rate
constant is the sum of all of the rates (a parallel kinetic model). If the rate of spontaneous
emission, or any of the other rates are fast, the lifetime is short. For commonly used
fluorescent compounds, typical excited state decay times for photon emissions with
energies from the UV to near infrared are within the range of 0.5 to 20 nanoseconds. The
fluorescence lifetime is an important parameter for practical applications of fluorescence
such as fluorescence resonance energy transfer and Fluorescence lifetime imaging
microscopy.

1.3 Products of Autopal:

Surface-mount type panels are specially introduced for existing interiors.

They can be easily installed on ceiling.

Slim LED panel are slim & sleek panel with higher efficiency with uniform
lighting.

MINI Down light small in size but efficient in performance. Mini Down
light is widely applied in hi-lighting cabinets.

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 The Merito sky lite 2x2 led luminaire series is a commercial ceiling twofer
that provides natural light manufacture and supply superb quality

COB lighting is the latest energy efficient light which produces bright and
vibrant light..

Centro series with anti-glare effect is widely used for creating soothing
environmental ambiance.

Cab-lite spot series in pearl & satin finish is widely used as directional
lighting.

CAB Lite Diffused is Sleek and Compact design Led Spot Series is widely
used as spot light for area hi-lighting

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SMT machine:

1.4 Introduction
SMT (surface mount technology) component placement systems, commonly called
pick-and-place machines or P&Ps, are robotic machines which are used to place surface-
mount devices (SMDs) onto a printed circuit board (PCB). They are used for high speed,
high precision placing of broad range of electronic components, like capacitors, resistors,
integrated circuits onto the PCBs which are in turn used in computers, consumer
electronics as well as industrial, medical, automotive, military and telecommunications
equipment.

Fig. 1.1 Advanced SMT (surface mount machine) machine

1.5 PROCESSES INVOLVED :

SURFACE MOUNT DESIGN

SOLDER PASTE APPLICATION
COMPONENT PLACEMENT
SOLDERING
CLEANING
REPAIR/REWORK
17
 Fig. 1.2 SMT (surface mount machine) machine

1.6 PROCESS :

1. Surface mount design :

Surface-mount technology (SMT) is a method for producing electronic circuits in which

the components are mounted or placed directly onto the surface of printed circuit boards
(PCBs). An electronic device so made is called a surface-mount device (SMD). In the
industry it has largely replaced the through-hole technology construction method of fitting
components with wire leads into holes in the circuit board. Both technologies can be used
on the same board, with the through-hole technology used for components not suitable for
surface mounting such as large transformers and heat-sinked power semiconductors.

An SMT component is usually smaller than its through-hole counterpart because it has
either smaller leads or no leads at all. It may have short pins or leads of various styles, flat
contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.

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Printed circuit board:

Not to be confused with printed electronics. Printed circuit redirects here. For the
defunct company, see Printed Circuit Corporation.
A printed circuit board (PCB) mechanically supports

and electrically connects electronic components using conductive tracks, pads and other
features etched from copper sheets laminated onto a non-conductive substrate. PCBs can
be single sided (one copper layer), double sided (two copper layers) or multi-layer.
Conductors on different layers are connected with plated-through holes called vias.
Advanced PCBs may contain components - capacitors, resistors or active devices -
embedded in the substrate.

Printed circuit boards are used in all but the simplest electronic products. Alternatives to
PCBs include wire wrap and point-to-point construction. PCBs require the additional
design effort to lay out the circuit but manufacturing and assembly can be automated.
Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as
components are mounted and wired with one single part. Furthermore, operator wiring
errors are eliminated.

When the board has only copper connections and no embedded components, it is more
correctly called a printed wiring board (PWB) or etched wiring board. Although more
accurate, the term printed wiring board has fallen into disuse. A PCB populated with
electronic components is called a printed circuit assembly (PCA), printed circuit board
assembly or PCB assembly (PCBA). The IPC preferred term for assembled boards is circuit
card assembly (CCA), and for assembled backplanes it is backplane assemblies. The term
PCB is used informally both for bare and assembled boards.

The world market for bare PCBs reached nearly $60 billion in 2012

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Design:

Printed circuit board artwork generation was initially a fully manual process done on
clear mylar sheets, usually at a scale of 2 or 4 times the true size. The schematic diagram
was first converted into a layout of components pin pads, then traces were routed to
provide the required interconnections. Rub-on dry transfers of common component
footprints increased efficiency. Traces between devices were made with self-adhesive
tape. Pre-printed non-reproducing mylar grids assisted in layout. The finished artwork
was then photographically reproduced on resist coated on the blank copper-clad
boards.

Nowadays computers automatically perform many of the layout steps. The general
progression for the design of a commercial printed circuit board design.

1. Schematic capture through an electronic design automation (EDA) tool.

2. Card dimensions and template are decided based on required circuitry and case of
the PCB. The fixed components and heat sinks (if required) are determined.

3. Layer stack of the PCB is decided, with one to tens of layers depending on complexity.
Ground and power planes are decided. A power plane is the counterpart to a ground
plane and behaves as an AC signal ground while providing DC power to the circuits
mounted on the PCB. Signal interconnections are traced on signal planes. Signal
planes can be on the outer as well as inner layers. For optimal EMI performance high
frequency signals are routed in internal layers between power or ground planes

4. Line impedance is determined using dielectric layer thickness, routing copper

thickness and trace-width. Trace separation is also taken into account in case of
differential signals. Microstrip, stripline or dual stripline can be used to route signals.
20
 5. Components are placed. Thermal considerations and geometry are taken into
account. Vias and lands are marked.
6. Signal traces are routed. Electronic design automation tools usually create clearances
and connections in power and ground planes automatically.
7. Gerber files are generated for manufacturing.

PCB characteristics
Much of the electronics industrys PCB design, assembly, and quality control follows
standards published by the IPC organization.

Through-hole technology

Fig 1.3 Through-hole (leaded) resistors

The first PCBs used through-hole technology, mounting electronic components by leads
inserted through holes on one side of the board and soldered onto copper traces on the
other side. Boards may be single-sided, with an unplated component side, or more
compact double-sided boards, with components soldered on both sides. Horizontal
installation of through-hole parts with two axial leads (such as resistors, capacitors, and
diodes) is done by bending the leads 90 degrees in the same direction, inserting the part
in the board (often bending leads located on the back of the board in opposite directions
to improve the parts mechanical strength), soldering the leads, and trimming off the
ends. Leads may be soldered either manually or by a wave soldering machine.[34]

Through-hole PCB technology almost completely replaced earlier electronics assembly

techniques such as point-to-point construction. From the second generation of
computers in the 1950s until surface-mount technology became popular in the late
1980s, every component on a typical PCB was a through-hole component.

21
Through-hole manufacture adds to board cost by requiring many holes to be drilled
accurately, and limits the available routing area for signal traces on layers immediately
below the top layer on multilayer boards since the holes must pass through all layers to
the opposite side. Once surface-mounting came into use, small-sized SMD components
were used where possible, with through hole mounting only of components unsuitably
large for surface-mounting due to power requirements or mechanical limitations, or
subject to mechanical stress which might damage the PCB.

Through-hole devices mounted on the circuit board of a mid-1980s home computer

A box of drill bits used for making holes in printed circuit boards. While tungsten-carbide
bits are very hard, they eventually wear out or break. Making holes is a considerable part
of the cost of a through hole printed circuit board.

Surface-mount technology
Main article: Surface-mount technology Surface-mount technology emerged in the 1960s,
gained

fig 1.4 Surface mount components, including resistors, transistors and an IC

Components were mechanically redesigned to have small metal tabs or end caps that
could be soldered directly onto the PCB surface, instead of wire leads to pass through
holes. Components became much smaller and component placement on both sides of the
board became more common than with through-hole mounting, allowing much smaller
PCB assemblies with much higher circuit densities. Surface mounting lends itself well to a
high degree of automation, reducing labor costs and greatly increasing production rates.
Components can be supplied mounted on carrier tapes. Surface mount components can
be about one-quarter to one tenth of the size and weight of through-hole components,
and passive components much cheaper; prices of semiconductor surface mount devices
(SMDs) are determined more by the chip itself than the package, with little price
advantage over larger packages. Some wire-ended components, such as 1N4148 small-
signal switch diodes, are actually significantly cheaper than SMD equivalents.

22
Materials:
Excluding exotic products using special materials or processes all printed circuit boards
manufactured today can be built using the following four materials:

1. Laminates

2. Copper-clad laminates

3. Resin impregnated B-stage cloth

4. Copper foil

Laminates

Laminates are manufactured by curing under pressure and temperature layers of cloth or
paper with thermoset resin to form an integral final piece of uniform thickness. The size
can be up to 4 by 8 feet (1.2 by 2.4 m) in width and length. Varying cloth weaves (threads
per inch or cm), cloth thickness, and resin percentage are used to achieve the desired
final thickness and dielectric characteristics.

The cloth or fiber material used, resin material, and the cloth to resin ratio determine the
laminates type designation (FR-4, CEM-1, G-10, etc.) and therefore the characteristics of
the laminate produced. Important characteristics are the level to which the laminate is
fire retardant, the dielectric constant (e), the loss factor (t), the tensile strength, the
shear strength, the glass transition temperature (T ), and the Z-axis expansion coefficient
(how much the thickness changes with temperature).

There are quite a few different dielectrics that can be chosen to provide different
insulating values depending on the requirements of the circuit. Some of these dielectrics
are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM1 or CEM-3. Well known prepare
materials used in the PCB industry are FR-2 (phenolic cotton paper), FR-3 (cotton paper
and epoxy), FR-4 (woven glass and epoxy), FR-5 (woven glass and epoxy), FR-6 (matte
glass and polyester), G-10 (woven glass and epoxy), CEM-1 (cotton paper and epoxy),
CEM-2 (cotton paper and epoxy), CEM-3 (non-woven glass and epoxy), CEM-4 (woven
glass and epoxy), CEM-5 (woven glass and polyester). Thermal expansion is an important
consideration especially with ball grid array (BGA) and naked die technologies, and glass
fiber offers the best dimensional stability.

FR-4 is by far the most common material used today. The board with copper on it is called
copper-clad laminate.

23
Copper thickness

Copper thickness of PCBs can be specified as units of length (in micrometers or mils) but
is often specified as weight of copper per area (in ounce per square foot) which is easier
to measure. One ounce per square foot is 1.344 mils or 34 micrometres thickness.

Safety certification (US)

Safety Standard UL 796 covers component safety requirements for printed wiring boards
for use as components in devices or appliances. Testing analyzes characteristics such as
flammability, maximum operating temperature, electrical tracking, heat deflection, and
direct support of live electrical parts.

2 SOLDER PASTE :

Solder paste is a material used in the manufacture of printed circuit boards to connect
surface mount components to the copper traces of the board. The paste initially adheres
components in place by being sticky, it is then heated (along with the rest of the board)
melting the paste and forming a mechanical connection as well as an electrical connection.
The paste is applied to the board by silk screening and then the components are put in
place by a pick-and-place machine.

Fig. 1.5 soldering paste

24
Properties of solder paste :

In using solder paste for circuit assemblies, one needs to test and understand the various
rheological properties of a solder paste.

Viscosity
The degree to which the material resists the tendency to flow. In this case, varying
viscosities of solder paste are desired at different levels of shearing force. Such a
material is called thixotropic. When solder paste is moved by the squeegee on the
stencil, the physical stress applied to the paste causes the viscosity to break down,
thinning the paste and helping it flow easily through the apertures on the stencil.
When the stress on the paste is removed, it regains it shape, preventing it from
flowing on the circuit board. The viscosity for a particular paste is available from
the manufacturer's catalog; in-house testing is sometimes needed to judge the
remaining usability of solder paste after a period of use.
Slump
The characteristic of a material's tendency to spread after application.
Theoretically, the paste's sidewalls are perfectly straight after the paste is deposited
on the circuit board, and it will remain like that until the part placement. If the paste
has a high slump value, it might deviate from the expected behavior, as now the
paste's sidewalls are not perfectly straight. A paste's slump should be minimized, as
slump creates the risk of forming solder bridges between two adjacent lands,
creating a short circuit.
Working life
The amount of time solder paste can stay on a stencil without affecting its printing
properties. The paste manufacturer provides this value.

Use :

Solder paste is typically used in a screen printing process, in which paste is deposited over
a stainless steel or polyester mask to create the desired pattern on a printed circuit board.
The paste may be dispensed pneumatically, by pin transfer (where a grid of pins is dipped
in solder paste and then applied to the board), or by jet printing (where the paste is sprayed
on the pads through nozzles, like an inkjet printer).

25
As well as forming the solder joint itself, the paste carrier/flux must have sufficient
tackiness to hold the components while the assembly passes through the various
manufacturing processes, perhaps moved around the factory.

Printing is followed by pre-heating and reflow (melting).

The paste manufacturer will suggest a suitable reflow temperature profile to suit their
individual paste; however, one can expend too much energy on this. The main requirement
is a gentle rise in temperature to prevent explosive expansion ("solder balling"), yet
activate the flux. Thereafter, the solder melts. The time in this area is known as Time
Above Liquidus. A reasonably rapid cool-down period is required after this time.

A good tin/lead solder joint will be shiny and relatively concave. This will be less so with
lead-free solders.

As with all fluxes used in electronics, residues left behind may be harmful to the circuit,
and standards (e.g., J-std, JIS, IPC) exist to measure the safety of the residues left behind.

Storage

Solder paste must be transported while refrigerated and stored in an airtight container at a
temperature between 0-10C. It should be warmed to room temperature for use.

Recently, new solder pastes have been introduced that remain stable at 26.5C for one year
and at 40C for one month.

Exposure of the solder particles, in their raw powder form, to air causes them to oxidize, so
exposure should be minimized. .

26
3. COMPONENTS PLACED :

Components to be placed on the boards are usually delivered to the production line in
either paper/plastic tapes wound on reels or plastic tubes. Numeric Control pick-and-place
machines remove the parts from the tapes, tubes or trays and place them on the PCB.

Fig. 1.6(a) Feeder device without feed

Fig. 1.6(b) Feeder device with feed

27
4. SOLDERING :

Soldering is a process in which two or more items (usually metal) are joined together by
melting and putting a filler metal (solder) into the joint, the filler metal having a lower
melting point than the adjoining metal. Soldering differs from welding in that soldering
does not involve melting the work pieces. In brazing, the filler metal melts at a higher
temperature, but the work piece metal does not melt. In the past, nearly all solders
contained lead, but environmental and health concerns have increasingly dictated use of
lead-free alloys for electronics and plumbing purposes.

PROCESSES:

There are three forms of soldering, each requiring progressively higher temperatures and
producing an increasingly stronger joint strength:

1. Soft soldering, which originally used a tin-lead alloy as the filler metal,
2. Silver soldering, which uses an alloy containing silver,
3. Brazing which uses a brass alloy for the filler.

TEMPERATURE:

There is no proper soldering iron temperature just for a given type of solder - the iron
temperature should be set for both the component and the solder. When soldering surface
mount components, a small tip and 600F (315C) should be sufficient to quickly solder the
joint well without overheating the component.

5. CLEANING :

A specially formulated alloy in wire form is designed to melt at the low

temperature of around 136 degrees F, 58 degrees C. It eliminates the potential for
damage to the circuit, adjacent components, and the device itself.

Liquid flux and a soldering iron are used to melt this low temperature alloy that is
specially formulated to stay molten long enough to react with existing solder. The
SMT device can then be easily removed with a vacuum pen.

28
 Fig. 1.7 soldering of circuit board

6. REPAIR/ REWORK :

Finally, the boards are visually inspected for missing or misaligned components
and solder bridging.
If needed, they are sent to a rework station where a human operator corrects any
errors.
They are then sent to the testing stations to verify that they operate correctly.

1.7 HOW TO USE SMT MACHINE ?

HT-XF chip mounter( SMT machine ) is the dedicated full-automatic chip mounter for
1.2 meter LED light board, according to the regular features of the

PCB matrix, with the group picking and the group placing way and the currently fastest
and most stable pick and place speed in the world. The most advanced visual positioning
way can ensure high precision requirements of the pick and place.

29
Main features of the machine:

Visual positioning and industrial computer control system.

Sound and light alarm function, with the alarm reason tips, which is convenient for
troubleshooting and handling.
Standard electri feeder with strong universality.
Automatically adjust the width according to PCB width.
Vacuum detection function for automatically detecting the lack of the material.
With signal communication interface, which can connect with other machines
online.
Main technical parameters:

1. Overall dimension : 2700*1900*1400 mm

2. Weight : 1240 kg
3. PCB size: maximum 300*1200 mm, minimum 60*300mm.
4. Pick and place accuracy : 0.02 mm
5. Pick and place height:
6. Pick and place speed : 130000-150000 CPH
7. Pick and place method : group picking and group placing
8. Power supply : AC220/50HZ
9. Power : 6KW
10. Air source : 0.5 MPa
11. Service environment :
12. Guide rail transmission : maximum length 1.2M

1.8 User precautions

Safety tips:

The machine can only be operated by professional maintenance and repair

personnal or qualified trained personnel.
Before energising, confirm whether the externl input power and the machines
rated voltage and current match.
This machine contains mechanical transmission so please pay attention to person
safety during the operation.

Precautions:

Do not install the machine near the electromagnetic interference source.

Use the specified voltage, current and power.
When the machine is not in use, turn off the power supply and gas supply.
Turn off the machine power supply before maintainance and repair.
Do periodic machine maintainance according to the manual.
Do not change the software and hardware settings in the machine electrical
control.

30
1.9 Machine installation and adjustment
Working conditions and adjustment
This device should be placed on a flat and solid ground;
The operating ambient temperature should be between 22 to 28 degree;
The operating ambient humidity should be between 45 and 75 RH%;
Do not have a strong magnetic field near the machine;
Use the power supply with three-phase AC220 v (50-60HZ) stable voltage;
Use the gas source 0.5-0.6MPa.
Altitude :1000m or less

Machine installation
1. After unpacking, the machine falls smoothly with three-color signal lights.
2. According to the connection situation between the machine and next station
device, adjust it to the correct position.
3. Increase and adjust the fixed foot cup at the bottom of the rack, making the
rack in the horizontal status and reach the correct height.
4. Connect the power supply and air source.

Machine adjustment
The device has finished debugging before leaving the factory, and you can adjust
according to the following methods:
1. Adjust the foot cup at the bottom of the machine to make the machine in the
horizontal status.
2. For other adjustments, please contact our after-sales service department.

Machine equipments
In addition to the machine in the packaging box, if the following accessories lack,
please contact Eton after-sales service department
Nozzle a lot
Dongle: 1
Toolbox: 1
8 mm electric feeder
Fuse : 3A and 6A for 5 each

31
1.10 ADVANTAGES OF SMT :
Smaller components. Smallest is currently 0.4 x 0.2 mm.
Much higher number of components and many more connections per component.
Fewer holes need to be drilled through abrasive boards.
Small errors in component placement are corrected automatically.
Components can be placed on both sides of the circuit board.
Lower resistance and inductance at the connection (leading to better performance
for high frequency parts).
Better mechanical performance under shake and vibration conditions.
SMT parts generally cost less than through-hole parts.

DISADVANTAGE OF SMT :
The manufacturing processes for SMT are much more sophisticated than
through-hole boards, raising the initial cost and time of setting up for
production.
Manual prototype assembly or component-level repair is more difficult
given the very small sizes of many SMDs.
SMDs can't be used with breadboards , requiring a custom PCB for every
prototype. The PCB costs dozens to hundreds of dollars to fabricate and
must be designed with specialized software.
SMDs' solder connections may be damaged by potting compounds going.

32
Chapter 2
Literature Review

A facility layout is an arrangement of everything needed for production of goods or

delivery of services. A facility is an entity that facilitates the performance of any job. It
may be a machine tool, a work center, a manufacturing cell, a machine shop, a department,
a warehouse etc. Due to the variety of considerations found in the articles, researchers do
not agree about a common and exact definition of layout problems. The most encountered
formulations are related to static layout problems. were among the first to consider this
class of problems, and they defined the facility layout problem as a common industrial
problem in which the objective is to configure facilities, so as to minimize the cost of
transporting materials between them.
Considered that the facility layout problem consists in finding a non-overlapping planar
orthogonal arrangement of rectangular facilities within a given rectangular plan site so as
to minimize the distance based measure. Defined that the facility layout problem as the
determination of the relative locations for, and allocation of, the available space among a
given number of facilities. Reported that the facility layout problem consists in arranging
unequal-area facilities of different sizes within a given total space, which can be bounded
to the length or width of site area in a way to minimize the total material handling cost and
slack area cost. Defined the facility layout problem as an optimization problem that tries to
make layouts more efficient by taking into account various interactions between facilities
and material handling systems while designing layouts.

2.1Facility shapes and dimensions

Two different facility shapes are often distinguished regular, i.e., generally
rectangular and irregular, i.e., generally polygons containing at least a 2708 angle. As
mentioned by a facility can have given dimensions, defined by a fixed length (L) and a
fixed width (W). In this case, the facilities are called fixed or rigid blocks. According to
the same authors, a facility can also be defined by its area, its aspect ratio: ai =L /W.

33
2.2 Material handling systems

A material handling system ensures the delivery of material to the appropriate

locations. Material handling equipment can be conveyors (belt, roller, wheel), automated
guided vehicles (AGV), robots, etc. estimated that 2050% of the manufacturing costs are
due to the handling of parts and then a good arrangement of handling devices might to
reduce them for 1030%. When dealing with a material handling system, the problem
consists in arranging facilities along the material handling path. Two dependent design
problems are considered: finding the facility layout and selecting the handling equipment.
The type of material-handling device determines the pattern to be used for the layout of
machine also pointed out that the facility layout impacts the selection of the handling
device.
Given the difficulty of solving both problems jointly, they are mainly solved
sequentially. Among the major types of layout arrangement based on that type of material
handling, one can distinguish, single row layout, multi-rows layout, loop layout and open-
field layout. The single row layout problem occurs When facilities have to be placed
along a line. Several shapes may be considered from this basic situation, such as straight
line, semi-circular or U-shape. The loop layout problem deals with the assignment of
facilities to candidate locations in a closed ring network, around which parts are
transported in one. The loop layout incorporates a Load/Unload (L/U) station, i.e., location
from which a part enters and leaves the loop. This station is unique. The multi-rows layout
involves several rows of facilities

The movements of parts occur between facilities from the same row and from different
rows The open field layout corresponds to situations where facilities can be placed without
the restrictions or constraints that would be induced by such arrangements as single row.

34
 Fig. 2.1 material handling system

2.3 Multi-floor layout

Nowadays, when it comes to construct a factory in urban area, land supply is

generally insufficient and expensive. The limitation of available horizontal space creates a
need to use a vertical dimension of the workshop. Then, it can be relevant to locate the
facilities on several floors. The vertical movement of parts requires a vertical
transportation device: elevator. In such situations, both the position on the floor and the
levels has to be determined for each facility, so that the related problems are referred to as
multi-floor layout problems seems to be among the firsts to address a multiple-floor layout
problem. He dealt with the problem of defining relative locations of facilities in a multiple-
floor building. Later, other researchers focused on taking into consideration vertical
movements of parts from one floor to another

Elevators are often the material handling system reported There number and location are
either known (Lee et al., 2005) or to be determined through optimization
The capacity of each elevator was considered as a constraint. The number of floors can be
known or to be determined, depending on each floor area and on the number and
dimensions of the facilities.

35
Backtracking and bypassing

Backtracking and bypassing are two particular movements that can occur in flow-
line layouts, which impact the flow of the products. Backtracking is the movement of a
part, from one facility to another preceding it in the sequence of facilities in the flow-line
arrangement.

2.4 Facility Layout Problem

Plant layout of pulleys factory to eliminate obstructions in material flow and thus obtain
maximum productivity. The present plant layout and the operation process of each section
have been investigated. The problem in term of material flow of each operation section
was identified.

Disassembly surface finishing and inspection sections should be* allocated to make
the good material flow. The suitable of new plant layout can decrease the distance of
material flow, which rises production. Study plant layout of iron manufacturing based on
the systematic layout planning pattern theory (SLP) for increased productivity. The
detailed study of the plant layout such as operation process chart, flow of material and
activity relationship chart has been investigated. The new plant layout has been designed
and compared with the present plant layout. The SLP method showed that new plant
layout significantly decrease the distance of material flow from billet cutting process until
keeping in ware house. Experiments application of different heuristic approaches to a real
facility layout problem at a furniture manufacturing company. All the models are
compared (Graph Theory, CRAFT, BLOCPLAN, Optimum Sequence) here a number of
parameters of interest are employed. The experiment shows that formal layout modeling
approaches can be effectively used real problems faced in industry, leading to significant
improvements, address the problem of designing flexible plant layouts for manufacturing
facilities where product demands are subject to variability. A flexible layout is one that
maintains low material handling costs despite fluctuations in the product demand levels.
Optimal and heuristic methods (CRAFT) are presented for generating flexible layouts and
determining flow allocations under various design and operation assumptions.

36
2.5 Time and Motion Study
Time study is considered to be one of the most widely used means of work
measurement. Time study procedure involves timing a sample of a workers performance
and using it to set a standard The worker sample can be selected from a single facility or it
may be a composite sample selected from several facilities Time study is a work
measurement technique for recording the times of performing a certain specific j. or its
elements carried out under specified condition, and for analyzing the data to obtain the
time necessary for an operator to carry it out at a defined rate of performance 1t is the
application of a scientific method of determining process times using data collection and
statistical analysis. This study is concerned with the establishment of time standards for a
worker to perform a specified job at a defined level of performance. It was originally
proposed by and was modified to include a performance rating adjustment. Taylor used the
most qualified different parameters such as machine time, material handling (with personal
allowances) time and bundle time. Material handling and bundle time is calculated by
motion analysis.

Fig. 2.2 time and motion study

Motion study offer a great potential for saving any areas of human effort and
reduce the cost by combining the elements of one task with elements of another. It
involves the analysis of the basic hand, arm and body movements of workers as they
perform work. Motion study uses the principles of motion economy to develop the work
37
stations that are friendly to the human body and efficient in their operation. This study is
used to develop the best work method and create motion consciousness on the part of all
employees by developing economical and efficient tools, fixtures and production aids. In
RMG industries the purpose of motion study is to analysis the motions of the operator's
hand, leg, shoulder and eyes in a single motion of work or in a single operation cycle, to
that unless motions can be eliminated. Motion study was first introduced to look at how
body motions were used in the process of completing a job by using camera. This concept
provide smooth and easy motion to improve capability of performer and get more output
of time investment done by the particular resource towards their given tasks. So, it is vital
to analyze the movement of workers and eliminate the unwanted motions, which lead
increased worker's efficiency and improved productivity in a firm.

2.6 Assembly Line Balancing

Assembly Line Balancing (ALB) is the term commonly used to refer to the
decision process of assigning tasks to workstations in a serial production system. Line
balancing is an optimum distribution of the workload evenly across all process in a cell or
value stream to remove bottleneck or excess capacity. It is the assignment of work to
stations in a line to as to achieve the desired output rate with the smallest number of
workstations. .Line balancing is one of the most common optimization technique which is
used to allocate task of workers in different workstation in Order to in union productivity
Single model represents a type of assembly line when product is assigned in the same
direction from the certain set up and wont variant its set up.

A mix model assembly line produces several items belonging to same family. In
contras-t single model assembly line produces one type of product with no variation but
mixed enables a plant to achieve both high volume production and product variety.
However, it complicates scheduling and increases the need for good communication about
the specific parts to be produced at each station and minimizing the number of station.

Multi model assembly line is the combination of simple and mix model assembly
line. In this model the uniformity of the assembled products and the production system is
not that much sufficient to accept the enabling of the product and the production levels. To
reduce the time and money this assembly is arranged in batches, and this allows the short
term lot-sizing issues which made in groups of the models to batches and result will be on
the assembly levels. The line balancing method sometime s causes an unequal time
assignments .The U shaped layout which is assigned by standard task helps to solve these
38
unequal time assignments situations in line balancing U shaped .It avoids constant
displacement to the start of the line and solve money of the distribution problem. It
improves the tasks assignment by offering production rate flexibility. The number of
workers assigned can be changed at any time. It makes easy to adapt the cycle time to the
tack time without rearranging the task assignments.

A sequence of operations is involved in making a product. In bulk production

works in an assembly line (Progressive Bundle system) and each operator does one
operation and passes it to other operator to do the next operation. In this way product
finally reaches to the end of the line as a finished product. In the assembly line after
sometime of the line setting, it is found that at some places in the line, work is started to
pile up and few operators sit idle due to unavailability of work. This type of situation is
known as bottleneck. So bottleneck can tined as delay in transmission that causes slow
production rate. When this situation happens in the line it is called an imbalanced line.
Normally it happens due to two main reasons which are variation in work content (time
needed to do an operation) in different operations and operator's performance level. To
identify the location of bottleneck and eliminate them line balancing is important.
A well-balanced assembly line reduces wastes such as operator idleness, the need of
fluctuating operators, stock and faulty products. It also decreases the production costs of
the unit and allows the company to reduce the price of their products. To meet the
production target, maintaining level work flow in the line is very essential. So it is very
important to know the basics of quick line balancing. Line balancing can be classified as
follows

Initial balancing: The sequence of operations of an industry is analyzed and the
Standard Minute Values (SMV) is allocated. The SMVs are determined by most
manufacturers using standard databases available whereas some companies use
their own databases based on past experience and using time studies.

Rebalancing: This is performed after few hours while the whole line is completely
laid down and may be performed several times in order to make the material flow
with the last bottle necks in the line. Capacity studies conducted on the line a help
the line balancing process.

Reactive balancing: Despite the production line being balanced spontaneous
39
 variations are inevitable due to problems on the line. Reactive balancing is often
done due to machine break down, operator absenteeism, quality defects and
shortages. The operators or the machines are moved to the bottleneck until the
severity of the problem is concealed.

Late hour balancing: In order to fulfill the daily demanded output from a
production line the upstream operators are moved to the line end by the supervisors
of some garment manufacturing companies. This happens unofficially but not
uncommon and makes the line unbalanced in the next day especially in early
hours. The downstream operators are waiting to receive garment pieces resulting
extremely low output in early hours.
The proposed manufacturing cells for garment manufacturing totally oppose late
hour balancing and only initial balancing can give the preeminent result. In Indian
industries assembly line was designed with a number of operations by simulation
and heuristic method to minimum the balancing loss and system loss.

Fig. 2.3 Assembly line balancing

2.7: 5S
Sort (Seiri) Sorting is the first step-removing all surplus items from the work
center which are not needed for the immediate continual operations. At this stage it is
decided what is really needed and what is not. Any item or tool that is
Unaccounted out of place or unnecessary needs to be clearly documented. A red tag is a
document made on red colored paper that is attached to potential junk items in a
workplace. The items are stored temporarily until assignable action can be undertaken; it
40
is usually the starting point of a 5S exercise. Items are red tagged with the best description
of use or placement recorded on it. All red tagged articles are moved to a temporary
holding area, and that area clearly is identified as the red tag or Seiri area. Equipment or
anything else that is not of use, should be discarded as refuse to be thrown out. To
implement the first step of 5S, a production team needs to know what material is used
when the material in storage are to used where the required materials are, and what the
users requirement. This is an opportunity for every team to re-evaluate the tools at their
disposal and make sure that they are using the best available tools for the process.
Set in Order (Seiton) The second step in a 5S launch is taking the stored items and
putting them where they best support the function they provide. Workers should be
motivated to place items at their point of use and improve the workplace as visual
management. Before and after photos should be taken to document progress and explain
activity benefits are of key importance at this stage.
One important advantage of Set in order is that everything needed for the job is clearly
visible. Another objective of this step is to arrange the work in such a manner that missteps
can be easily identified and corrected which is one of the main reason why the
implementation of visual controls is encouraged during this step. Associates may apply
these philosophies by referring to checklists, designing tool boards, parts container and
improving workplace design. The practice of shadow boarding can be quickly identified
when a piece of equipment is missing from a work station. The main advantage of tool
shadowing is that people instantly know which tool is missing and where
it stored.
Shine (Seiso) Once the unneeded is thrown away and sorting and set in order
Has taken place.

Sometimes referred to as shine or sweep stage where teams thoroughly remove clutter
Ad fix Equipment Or building components .
phase is to identify and eliminate the root cause of waste, dirt and damage as well
as clean up the work station 5S projects that are almost entirely
focused on cleaning and painting prevent recording the valuable information that can be
gained from assessing it This step needs to have the full involvement
of employees to gather the data of what they feel needs to be cleaned and how often
it should be cleaned Although it is imperative to create a cleaning schedule along with
appointed duties for all personal working in designated areas, some employees may
mistakenly believe that they are not being paid to clean. In that situation, make the

41
suggestion to list all applicable responsibilities in detail, including an area to be cleaned
and desired expectations where they are assigned. Another
Issue worth considering is that an unclean area is more susceptible to safety hazards

Standardize (Seiketsu) After the organizing and cleaning of a Production

area, it is essential that the area is maintained.
The improvements of the previous three phases are maintained. Thats why organization
develop standardized procedures, rules and expectations for maintaining continuous
activity in all of the areas shift by shift and crew. This is a means of creating consistent
ways for implementing the tasks outlined above on daily basis. The challenge is to visually
maintain known agreed upon conditions rather than to write work instructions Teams can
develop their own standards by using the 5Ms borrowed from Kaoru Ishikawas Fishbone
diagram. In it, he lists Manpower, Methods, Materials, Machines and Measurements as the
5 components of the standardizing step an organization achieves conformity when
employees value working to one common metric, rather than working however they feel
like working or how they think a job should be done.

Sustain (Shitsuke) The benefits of the above four phases of 5S are powerful,
visual and easily measured. However without self-discipline, elements for sustainability
the success of 5S program is brief and everything will atrophy or revert to the previous
messy state. In daily life, when we diet to lose weight, we still need discipline to help us
maintain our objective. Therefore discipline and motivation go hand and hand to reach
your goals. Several studies identify the fifth phase as the most difficult phase to perform of
this program. To continue the gains from implementing the 5S system, efforts should be
taken to instill the importance of maintaining employee dedication for a neat, orderly and
safe workplace and reinforcing good work habits. Every employee needs to understand the
importance of safety, order and cleanliness and be willing to take the necessary steps that
guarantee the prescribed standards are accommodated when every square foot of a
production floor is assigned to an associate then clutter will not build up.

42
 Fig. 2.4 5S

2.8 SWOT Analysis

The SWOT analysis is an extremely useful for understanding and decision-making tools.
SWOT is an acronym for Strengths, Weaknesses, Opportunities and Threats. SWOT
analysis is a subjective assessment of data which is organized into a logical order that
helps understanding, presentation, discussion and decision-making. It provides a
framework for analyzing a company's strengths, weaknesses, opportunities and threats it
faces. This analysis can be carried out for a product place, an industry or person. A SWOT
analysis enables firms to identify factors which need to be taken into account when
developing marketing and corporate strategy. The objective of the firm or industry should
be determined after the SWOT analysis has been performed. This would allow to eliminate
the unwanted motions, which lead increased worker's efficiency and improved
productivity in a firm. organization to achieve the goals or objectives. 1n this analysis
strengths and weaknesses, are 'mapped or 'graphed' against opportunities and threats.

43

Strengths refer to the characteristics which are of high importance as well as

provide a business or project significant advantages over others.

Weaknesses refer to the characteristics or the areas which provide disadvantages

and require immediate actions.

Opportunities are the dements those should be further implemented and exploited

to achieve the desired performance

Threats refer to the elements in the environment that could cause trouble for the

business or project.
SWOT analysis aims to identify the key internal and external factors seen as important to
achieving an objective. The factors come from within a company's unique value chain.
Internal factors - the strengths and weaknesses internal to the organization. External
factors- the opportunities and threats presented by the environment external to the
organization. The SWOT analysis provides information that is helpful in matching the

firm's resources and capabilities to the competitive environment in which it operates.

In India, SWOT analysis was practiced to throw light on its present retail scenario and to
identify weakness such as multi-diversified business, no bargaining markets etc. and
various threats such as increasing competitors, government and local policies
unrecognized modem retailing etc. The analysis also discussed some customer -centric
initiatives to be taken in future by the retailers.

SWOT analysis helped to identify the strengths challenges, opportunities and

threats of LED sector in Bangladesh. According to the analysis, many problems area were
identified in the factory which is related to the global challenges of the organization such
as high prices of quality products, high rated gas, electricity and oil prices, political unrest
and inadequate sales for the local market etc.

44
Chapter-3
Data Analysis and Result
3.1 Computerized Relative Allocation of Facilities Technique (CRAFT)
Now days use computer is well established in every type of designing so is the facility
layout also. A number of computerized layout programs have been developed since the
1970s to help devise good manufacturing layouts. Out of these, the most widely applied is
the Computerized Relative Allocation of Facilities Technique (CRAFT).The CRAFT
method follows the same basic idea, but with some significant operational differences, it
requires a load matrix and a distance matrix as initial inputs, but in addition, it requires a
cost per unit distance traveled, With basic inputs and an initial layout in the program,
CRAFT tries to improve the relative placement of the departments as measured by total
material handling cost for the layout. (Material handling cost between departments (Flow
points) = Number of loads Rectilinear distance between department centroids Cost per
unit distance.) It makes improvements by exchanging pair departments iteratively until no
further cost reductions are possible. That is, the program calculates the effect on total cost
of exchanging departments; if this yields a reduction, the exchange is made, which
constitutes iteration. Departments are part of a material flow network, so even a simple
pairwise exchange generally will affect flow patterns among many other departments. It is
a heuristic program.

1. CRAFT uses a simple rule of thumb in making evaluations that is Compare two
departments at a time and exchange them if it reduces the total cost of the layout.
This type of rule is obviously necessary to analyze even a modest size layout.
2. CRAFT does not guarantee an optimal or model solution.
3. CRAFT is biased by its starting conditions: where you start (that is, the initial
layout) will determine the final layout.
4. Starting with a reasonably good solution is more likely to yield a lower -cost final
solution, but it does not always. This means that a good strategy for using CRAFT

45
 is to generate a variety of different starting layouts to expose the program to
different pairwise exchange.
5. It can handle up to 40 departments and rarely exceeds 10 iterations in arriving at a
solution.
6. CRAFT departments consist of combinations of square modules. This permits
multiple departmental configurations, but often results in strange departmental
shapes that have to be modified manually to obtain a realistic layout.
7. A modified version called SPACECRAFT has been developed to handle multistory
layout problems.

8. CRAFT assumes the existence of variable-path material handling equipment such

as forklift trucks. Therefore, when computerized fixed-path equipment is
employed, CRAFTs applicability is greatly reduced.

The result of design shows minimum total transfer cost between departments. The
calculation is based on the following equation:
If the distance between departments are rectilinear, dij is calculated based on the following
equation-
dij= |x| + |y|

If the distance between departments is Euclidean, dij is calculated based on the following
equation-
Dij = (x) 2 + (y) 2
To calculate the distance between departments, centroid of each department is calculated
using the following equation
X = (x22 - x12) (y2 y1)

Y = (y22 y12) (x2 x1)

Based on these calculations, the result design will show only a transfer cost
between departments. The good result design means less transfer cost between
departments. However, there are other parameters missing such as total time in system,
waiting time, or utilization.

46
Cost matrix analysis using CRAFT method
The 26 processes of producing 3W LED bulb (shown in appendix A) are included
into 6 departments (A, B, C, D, E, and F). The process names are shown in table no 2.1

Table 3.1 Included tasks and Area of the departments

Department Included task Area (sq. ft.)
A A,B,C,M 15*15=225
B D,E,F,G,H 20*15=300
C I,J,K 25*15=375
D N,L,O 15*15=225
E P,Q,R 15*15=225
F S,T,U,V,W,X,Y,Z 30*15=450

Fig.3.1 Centroid allocation of departments in initial layout

One of the inputs required by craft is the flow data. That is the number of material
handling trips per unit time from every department to other department. This data is given
in the from-to chart appearing in the table 2.2.

The distance between departments is assumed to be the rectilinear distance

between centroid locations. From figure- 2.1, the centroid locations of the initial layout are
(XA, YA) = (7.5, 7.5), (XB, YB) = (10.5, 22.5)
(XC, YC)= (32.5, 22.5), (XD, YD) = (22.5, 7.5)
(XE, YE) = (52.5, 22.5), (XF, YF) = (45, 7.5)

47
The rectilinear distance between A and B. for example, is given by the formula-
|XA-XB| + |YA-YB| = |7.5-10.5| + |7.5-22.5| = 17.5

Table 3.2 From-To chart (Number trips of material per hour)

F T A B C D E F
A 18 11 42
B 25 24
C 33 28
D 85
E 30
F

Table 3.3 Rectilinear distance between the departments for initial layout

F T A B C D E F
A 17.5 40 15 60 37.5
B 22.5 27.5 42.5 50
C 25 20 27.5
D 45 22.5
E 22.5
F

Table 3.4 Total distances travelled per hour between departments for initial layout

F T A B C D E F
A 315 165 1575 2055
B 562 1020 1582
C 825 560 1385
D 3825 3825
E 675 675
F
315 562 990 5405 2250 9522

Total distance = Number of material handling per hour Rectilinear distance between the
departments
If B and C are exchanged then the predicted cost extending from 9522 to 10172.50,
or about 6 percent.
If A and B are exchanged the new layout with A and B exchanged appear in figure.
Because A has the small area, it is placed in the upper left hand corner of the space
formally occupied by B, so that the remaining space allows B to be continuous. Notice that

48
B is no longer rectangular. The actual cost of the new layout is not necessarily equal to the
predicted value of 9522. The centroid of B is determined by first finding the moments M X
and MY.
Here, MX = {(152-0) (15-0) + (202-152) (30-15)}/2A where A = area of B =300 sq.
ft. =6000/2*300 =10

And MY= {(152-0) (15-0) + (302-152) (20-

15)}/2A =11.3

Now, interchanging departments B and C

Fig.3.2 Centroid allocation in changed layout (Departments B and C)

Table 3.5 Rectilinear distance between the departments

F T A B C D E F
A 42.5 20 15 60 37.5
B 22.5 27.5 42.5 25
C 25 40 47.5
D 45 22.5
E 22.5
F

49
 Table 3.6 Total distances travelled per hour between departments for layout

FT A B C D E F
A 765 165 1575 2505
B 562.5 660 1222.5
C 825 1120 1945
D 3825 3825
E 675 675
F
765 562.5 990 5605 2250 10174.5

Now interchanging the departments A and B

Fig.3.3 Centroid allocation in changed layout (Departments A and B)

Table 3.7 Rectilinear distance between the departments

F T A B C D E F
A 13.7 25 30 45 52.5
B 33.7 16.3 53.7 38.8
C 25 20 27.5
D 45 22.5
E 22.5
F

50
 Table 3.8 Total distances travelled per hour between departments for layout

F T A B C D E F
A 246.6 330 2205 2781.6
842.5 1288.8 2131.3
C 825 560 1385
D 3825 3825
E 675 675
F
246.6 842.5 1150 5673.8 2880 10797.9

3.2 Systematic layout planning (SLP)

In certain types of layout problems, numerical flow of items between departments
either is impractical to obtain or does not reveal the qualitative factors that may be crucial
to the placement decision. In these situations, the venerable technique known as systematic
layout planning (SLP) can be used. It involves developing a relationship chart showing the
degree of importance of having each department located adjacent to every other
department. From this chart, an activity relationship diagram, similar to the flow graph
used for illustrating material handling between departments, is developed. The activity
relationship diagram is then adjusted by trial and error until a satisfactory adjacency
pattern is obtained.

This pattern, in turn, is modified department by department to meet building space

limitations. The SLP approach has been quantified for ease of evaluating alternative
layouts. This entails assigning numerical weights to the closeness preferences and then
trying different layout arrangements.

Table 3.9 Reason for rating various departments

Rating Reason
1 Type of works
2 Ease of supervision
3 Common personnel
4 Contact necessary
5 Share same space
6 Psychology

51
 Table 3.10 Closeness and line code for various departments

Value Closeness Line code

A Absolutely necessary
E Especially important
I Important
O Ordinary closeness OK
U Unimportant
X Undesirable

Table 3.11 Relationship chart

FT A B C D E F Area
(sq.ft)
A A/4 O/2 A/4 U/1 U 225

B U I/4 A/1 U 300

C O/2 U 375

D A/ O 225

E A 225

F 450

A D

B E C

Fig.3.4 Initial Relationship diagram

52
3.3 Analysis of layout with minimum product travel method
A layout which minimizes the product or material travel with in manufacturing
process is obtained by minimum product travel method (MPTM). The input for MPTM is
processing sequence, number of product processing department movement combination
and distance between departments.
The block diagram for existing layout,

8 9

7 10

6
1

5 2

4
3

Fig.3.5. Block diagram for initial layout

53
Block diagram for proposed layout on the basis of minimum product travel length,

9 10

8
1

7
2

6 3

5
4

Fig.3.6 Block diagram for improved layout

54
 Table 3.12 Distances between the adjacent departments

SR NO Department Distance between (in feet)

movement
condition Original layout Improved layout

1 1-2 12 12
2 2-3 12 12
3 2-7 30 15
4 3-4 12 12
5 3-6 30 15
6 4-5 12 15
7 1-5 48 45
8 5-6 15 12
9 6-7 12 12
10 7-8 12 12
11 8-9 12 12
12 9-10 12 15
219 189

We assumed prescribed travel length to be = 200 ft.

Efficiency of original layout =

=.913
=91.30%

Efficiency of improved layout =

=1.05
=105%

Percentage improvement =

=15.90 %

55
3.4 Line balancing and efficiency
Assembly Lines are a special case of product layout. In a general sense, the term
assembly line refers to progressive assembly linked by some material handling device. The
usual assumption is that some form of pacing is present and the allowable processing time
is equivalent for all workstations. Within this broad definition, there are important
differences among line types.

A few of these are material handling devices (belt or roller conveyor, overhead
crane).

Line configuration (U-shape, straight, branching).

Pacing (mechanical, human).

Product mix (one product or multiple products).

Workstation characteristics (workers may sit, stand, walk with the line, or ride the
line).

Length of the line (few or many workers).

Assembly Line Balancing Though primarily a scheduling issue, assembly-line

balancing often has implications for layout. This would occur when, for balance purposes,
workstation size or the number used would have to be physically modified.

The most common assembly line is a moving conveyor that passes a series of work
stations in a uniform time interval called the work station cycle time. At each workstation,
work is per-formed on a product either by adding parts or by completing assembly
operations. The work performed at each station is made up of many bits of work, termed
tasks, elements, and work units. Such tasks are described by motiontime analysis.
Generally, they are groupings that cannot be subdivided on the assembly line without
paying a penalty in extra motions.

56
 Cycle time which is also the time between successive units coming off the end of
the line.
Cycle time
=

Minimum number of work station =

Efficiency =

Fig.3.7 line balancing

57
 Table 3.13 Precedence chart

Task Task name Performance time Task must followed

(min)

A Wire cutting (long + short) 0.63 None

B Wire stapling (long + short) 0.94 A
C Wire leading (long + short) 1.78 A
D Driver lead 0.21 None
E Soldering wear and driver outline 0.78 B,C,D

F Cutting tube fiber 0.65 E

G Fiber enter driver 0.26 F
H Driver heating 0.60 G
I PCB LED soldering 0.63 None
J Helper (PCB folding + passing) 0.76 I
K PCB breaking 0.43 J
L PCB heat paste 0.37 K
M Shell lock 0.17 None

N Shell heat paste 0.33 M

O Shell +PCB 0.003 L ,N
P Cleaning shell + PCB 0.958 O
Q Shell + PCB cover adjust 0.45 P
R Driver pass (helper) 0.50 H
S Driver input 1.90 R,Q
T PCB soldering 0.56 S
U End capping 1.50 T
V Fiber heating 0.76 U
W End cap fitting 0.40 V
X Cleaning 0.25 W
Y Testing 0.50 X
Z Packaging 0.68 Y
Total performance time 17.001

58
 Fig.3.8 Activity relationship diagram

Here, Production time available per day = 7 hours

= 420 min
Unit required per day = 200 units

Cycle time =

= 2.1 min/day

Minimum number of work station =

= 8.0957
9

Efficiency =

= 0.899
= 89.90 %

59
3.5 Capacity Calculation: Time Study

Table 3.14 Time Study

No Task name Total Average Rating Basic

Observation no
O.T O.T time
1 2 3
1 Wire cutting (long 0.61 0.63 0.65 1.90 0.63 100 0.63
+ short)
2 Wire stapling 0.98 0.94 0.902 2.8 0.94 100 0.94
(long + short)
3 Wire leading 1.78 1.76 1.80 5.3 1.78 100 1.78
(long + short)
4 Driver lead 0.21 0.25 0.17 0.60 0.21 100 0.21
5 Soldering wear 0.78 0.74 0.82 2.3 0.78 100 0.78
and driver outline
6 Cutting tube fiber 0.65 0.60 0.70 2.0 0.65 100 0.65
7 Fiber enter driver 0.26 0.24 0.28 0.8 0.26 100 0.26
8 Driver heating 0.59 0.60 0.61 1.8 0.60 100 0.60
9 PCB LED 0.60 0.57 0.63 1.9 0.63 100 0.63
soldering
10 Helper (PCB 0.76 0.75 0.77 2.3 0.76 100 0.76
folding + passing)
11 PCB breaking 0.42 0.43 0.41 1.3 0.43 100 0.43
12 PCB heat paste 0.37 0.35 0.39 1.1 0.37 100 0.37
13 Shell lock 0.17 0.11 0.22 0.5 0.17 100 0.17
14 Shell heat paste 0.33 0.30 0.35 1.0 0.33 100 0.33
15 Shell +PCB 0.003 0.003 0.003 0.009 0.003 100 0.003
16 Cleaning shell + 0.958 0.10 0.901 2.87 0.958 100 0.958
PCB
17 Shell + PCB cover 0.45 0.42 0.48 1.35 0.45 100 0.45
adjust
18 Driver pass 0.49 0.51 0.50 1.50 0.50 100 0.50
(helper)
19 Driver input 1.90 1.91 1.91 5.7 1.90 100 1.90
20 PCB soldering 0.52 0.56 0.60 1.68 0.56 100 0.56
21 End capping 1.49 1.48 1.53 4.50 1.50 100 1.50
22 Fiber heating 0.76 0.73 0.79 2.28 0.76 100 0.76
23 End cap fitting 0.40 0.41 0.40 1.2 0.40 100 0.40
24 Cleaning 0.25 0.26 0.25 0.75 0.25 100 0.25
25 Testing 0.50 0.52 0.54 1.5 0.50 100 0.50
26 Packaging 0.68 0.70 0.67 2.04 0.68 100 0.68
Total basic time 17.001 17.001

60
Calculation of Standard Minute Value (SMV):
Total basic time = 17.001 min
Personal allowances = 11 %
Machine allowances = 2 %
SAM (Standard Allowed Minute)
SAM = Basic time + total allowance time
= 17.001 + (11*17.001/100) + (2 17.001/100)
= 19.211 min
Calculation of line efficiency:
Number of operators = 36
Working hours = 7 hours

Line output (production) = 200

units SAM = 19.211 min
Total minute attended = no. of operators working hours 60
= 36 7 60
=15120 min
Total minute produced = Line output SAM
=200 19.211 min
=3842.2 min

Line efficiency =

= .2541 100%
= 25.41 %
Capacity in hours:
Number of operators = 36
Total working hours = 7 hours
So, factory capacity (in hours) = (36 7) hours
= 252 hours

61
Production capacity of factory (in pieces):
Capacity =

=199.98
~ 200 pieces
3.6 Implementation of 5S

5S is a philosophy based on five Japanese terms utilized for creating and sustaining
a well-organized workplace that is more efficient and productive in operation.
The objective of implementation of 5S in the industry was to increase the storing
place create and preserve standards and service procedures specific to the workshop,
reduce unproductive time redefine access, working and storage spaces, readjust the
location. Changes that take place after 5S Implementation in our industry-
1S

During the activity Red labels have been applied to all marks which were not
necessary within the workshop.

All useless things have been sorted and eliminated.

Rubbish about approximately 300kg was thrown away.

The reason for scantling accumulation was found out.

The activity related rules have been stated and are to be implemented.
2S

The inappropriate objects have been taken inventory.

In the workshop, the location of all necessary objects have been defined and
marked.

Colors have been used to mark the different areas.

The arranging way has been set according to destination and degree of usage.
3S

Washing of floors was done.

All floors have been cleaned.

All storing shelves have been cleaned.

62

All machines and tools have been washed and cleaned.

Existing disturbances/non conformities have been detected.

All boards have been cleaned as well as all the windows.

The supply wiring has been redone.

4S

It gives a scope for Workers participation in the work area design and maintenance.

Workers absenteeism has been lowered down.

Team spirit and discipline developed
5S

of operation effectiveness in a better working environment was
Enhancement
created

.

5S slogans and posters were introduced.

Daily checklists were carried out.

The specific procedure was followed.

All obligatory rules in the company are obeyed.

Rules and regulations of the company were followed.
Establishment of Rules and Standard Operation Procedure (SOP)
Improvement in operation and workflow

3.7 Bill of material

A bill of materials or product structure (sometimes bill of material, BOM or

associated list) is a list of the raw materials, sub-assemblies, intermediate assemblies, sub-
components, parts and the quantities of each needed to manufacture an end product. A
BOM may be used for communication between manufacturing partners, or confined to a
single manufacturing plant. A BOM can define products as they are designed (engineering
bill of materials), as they are ordered (sales bill of materials), as they are built
(manufacturing bill of materials), or as they are maintained (service bill of materials or
pseudo bill of material). The different types of BOMs depend on the business need and use
for which they are intended. In process industries, the BOM is also known as the formula,
recipe, or ingredients list. In electronics, the BOM represents the list of components used
on the printed wiring board or printed circuit board. Once the design of the circuit is

63
completed, the BOM list is passed on to the PCB layout engineer as well as component
engineer who will procure the components required for the design.

Creating a Bill of Materials Creating a bill of material should include:

BOM level

Part number

Part name

Phase

Description

Quantity

Unit of measure

Procurement type

Reference designations

BOM notes
What to include in an effective bill of materials

Because one of the main functions of the BOM is to ensure that the product is built
right, it is best to include specific pieces of product data in the BOM record. Whether you
are creating your first bill of materials or are looking for ways to improve how you create a
bill of materials, here is a high level list of information to include in your BOM record:

BOM LevelAssign each part or assembly a number to detail where it fits inthe
hierarchy of the BOM. This allows anyone with an understanding of the BOM

structure to quickly decipher the BOM.

Part NumberAssign a part number to each part or assembly in order to

reference and identify parts quickly. It is common for manufacturers to choose

either an intelligent or non-intelligent part numbering scheme. Whichever scheme

you use, make sure you avoid creating multiple part numbers for the same part.

Part NameRecord the unique name of each part or assembly. This will help you
identify parts more easily.

PhaseRecord what stage each part is at in its lifecycle. For parts in production, it
is common to use a term like In Production to indicate the stage of the part. New
parts that have not yet been approved can be classified as 'Unreleased' or 'In
Design'. This is helpful during new product introduction (NPI) because it allows

you to easily track progress and create realistic project timelines.

64

DescriptionProvide a detailed description of each part that will help you and
others distinguish between similar parts and identify specific parts more easily.

QuantityRecord the number of parts to be used in each assembly or
subassembly to help guide purchasing and manufacturing decisions and activities.

Unit of MeasureClassify the measurement in which a part will be usedor
purchased. It is common to use each, but standard measures like inches, feet,

Ounces and drops are also suitable classifications.

Procurement TypeDocument how each part is purchased or made (i.e. off-the-
shelf or made-to-specification) to create efficiencies in manufacturing, planning

And procurement activities.

Reference Designatorsif your product contains printed circuit board assemblies
(PCBAs), you should include reference designators that detail where the part fits on
the board in your BOM. Capturing this information
in the BOM can save time and
help you avoid confusion down the road.

BOM Notescapture other relevant
notes to keep everyone who interacts with
your BOM on the same page.

Documenting all this information in your BOM will keep business activities and
manufacturing tasks on target. In addition to capturing this information, you should also
consider the following questions when creating a bill of materials.
An accurate BOM supports efficient manufacturing processes
Creating a bill of materials is not only a necessary step in the product development
process; it is also what makes your product design a reality. Before you create a BOM
record, it is important to consider who will utilize the information and how you will
maintain and manage all associated product documentation like part datasheets and CAD
files. Develop more efficient manufacturing practices by capturing detailed part
information when creating a bill of materials.

65
3.8 SWOT analysis
A SWOT analysis (alternatively SWOT matrix) is a structured planning method
used to evaluate the strengths, weaknesses, opportunities and threats involved in a project
or in a business venture. A SWOT analysis can be carried out for a product, place,
industry or person. It involves specifying the objective of the business venture or project
and identifying the internal and external factors that are favorable and unfavorable to
achieve that objective. Some authors credit SWOT to Albert Humphrey, who led a
convention at the Stanford Research Institute (now SRI International) in the 1960s and
1970s using data from Fortune 500 companies. However, Humphrey himself does not
claim the creation of SWOT, and the origins remain obscure. The degree to which the
internal environment of the firm matches with the external environment is expressed by the
concept of strategic fit.

Strengths characteristics
of the business or project that give it an advantage
over others.

Weaknesses characteristics that place the business or project at a
disadvantage relative to others.

Opportunities elements that the project could exploit to its advantage.

Threats elements in the environment that could cause trouble for the
business or project.

Identification of SWOTs is important because they can inform later steps in planning to
achieve the objective.

First, the decision makers should consider whether the objective is attainable, given
the SWOTs. If the objective is not attainable a different objective must be selected and the
process repeated. Users of SWOT analysis need to ask and answer questions that generate
meaningful information for each category (strengths, weaknesses, opportunities, and
threats) to make the analysis useful and find their competitive advantage.

66
 Strengths Weakness

This layout reduces lead time
The raw materials were kept
It increases the workers
unorganized in the ware house
efficiency and production time
Same route for raw material flow
There is a high degree of labor and final product flow
and equipment utilization
A constraints was found that the
Easy material handling process shell lock machine is fixed

It reduces production time

Opportunities Threats

The industry has the ability to The work area may be crowded as
the little storage space is available.
handle a variety of processing
Requirements
This also can cause material
Since workers are crossed trained handling problems.
to perform every jobs, boredom
is less of a factor.

67
Chapter-4
Discussion on Results
4.1 CRAFT

In CRAFT method obtains the hourly cost of transporting materials to and from
each of the department s by simply multiplying the entries in the from-to-chart of figure by
the entries in the fromto-chart of figure. The total distance traveled per hour for the initial
layout is 9522 feet.

If B and C are exchanged then the predicted cost extending from 9522 to 10172.50,
or about 6 percent.

If A and B are exchanged the new layout with A and B exchanged appear in
Because A has the small area, it is placed in the upper left hand corner of the space
formally occupied by B,

So that the remaining space allows B to be continuous. Notice that B is no longer

rectangular. The actual cost of the new layout is not necessarily equal to the predicted
value of 9522. The centroid of B is determined by first finding the moments MX and MY.
Exchanging A and B, the predicted cost is 10977.90 .

Since none of the predicted cost is less than the initial cost the lay out
recommended by CRAFT ,pictured in figure , required two iterations and resulted in a
reduction of total distance traveled from 10977.90 feet to 9522 feet, or about 15 percent.

Limitation of applying CRAFT

It cannot handle a change in material flow. It assumes the material flow is
deterministic. For different material flows it creates different layouts.

68

Path dependence: Different initial layouts give different final solutions.

Department shapes deteriorate rapidly with the number of iterations. Outputs
contain unrealistic locations, shapes, and alignments. Manual adjustments are
always required.

The improvement algorithms cannot generally consider a negative "X"
relationship.

The improvement algorithms do not deal easily with other-than flow
relationship.

Architectural influences and other qualitative factors are very difficult to
consider. They are usually ignored.

Costs may not be significant, known, and linear in distance as assumption.

4.2 Systematic layout planning (SLP)

This pattern, in turn, is modified department by department to meet building space
limitations. The SLP approach has been quantified for ease of evaluating alternative
layouts. This entails assigning numerical weights to the closeness preferences and then
trying different layout arrangements. The layout with the highest total closeness score is
selected.

Limitation of SLP

It cannot handle a change in relationship among departments. If a relationship

changes, SLP has to create a new layout.

The building shape may be irregular. Manual adjustment is needed.

Shortest rectilinear path may not always be a realistic measure.

Limitations for general construction routines

Ignores the direction of flow among departments.

Some important relationships are not considered.

It is the departments instead of relationships that are considered in order of

priority or importance.

69

4.3 Assembly Line Balancing
In assembly line balancing cycle time was 2.1 min and the longest time required
for the task Driver input is 1.9 min. If the task time was greater than the cycle time the
bottleneck is created. In that case following steps might be taken in action-
1. Split the task: splitting the task so that complete units are processed in two
workstations.
2. Share the task: The task somehow to be shared with an adjacent workstation
which is part of the work.
3. Use parallel workstations: It may be necessary to assign the task to two
work-stations that would operate in parallel.
4. Use a more skilled worker: Because this task exceeds the workstation cycle
time a faster worker may be able to meet the task time.
5. Work overtime: working overtime may reduce the task time
6. Redesign: It may be possible to redesign the product to reduce the task time
slightly.

U- Shape line layout for further expansion can be implemented in line layout with
minimum worker movement.

Fig 4.1 Proposed U- shape line layout

70
Advantages of U-shape line layout

The IN and OUT are close, allowing visual control and management, according

to the production, a single person can handle both the cell input feeding.

The shortening of distances allow sharing of work, as well as reduction of

transportation waste.

These layouts provide convenient foundation for one piece flow.

Communication among team mates in the cell is easier

The work is done inside the , supplies remain outside

Usually machines and tables are on rollers (if possible) for quick
reconfiguration.

The floor space is generally fewer with a U cell than stretched line

(including inventories and supplies), walk distances are also reduced, as
they are Muda

(waste).

4.4 Demand forecasting

During the line balancing the daily production rate was assumed by the
monthly demand of LED lights. The demand is forecasted by SMA or WMA
method.
Table 4.1 Monthly demand for 4 month

Time period/ month Demand (units)

January 4200
February 4800
March 4500
April 5000

SMA (Simple Moving Average)

Here, actual data is available for 4 periods
(months) So, t = 4
And Dt = D4
We need the forecast for period 5
(May) So F5 =Ft+1 =F4+1
Here, n= 4, its a 4 period or 4 months moving average
71
 Weight Moving Average (WMA)
In simple moving average equal weight are assigned to all the value in the moving
average.

WMA assigns more weights to the more recent values.

Now we want to forecast for 5th period (May)
In a 4 period weighted moving average the weights may be given as-
The most recent period (April) might be assigned a weight of 0.5
The most recent period (March) might be assigned a weight of 0.2
The most recent period (February) might be assigned a weight of 0.2
The most recent period (January) might be assigned a weight of 0.1
The summation of the weight must be equal to 1.0
Now, F5 = 0.5*5000+0.2*4500+0.2*4800+0.1*4200 = 4780 units

4.5 Ergonomics
Ergonomics is the study of how to interact with working environment and how
these interactions can be improved so that the wellbeing is maximized. Ergonomics can be
applied to offices in several ways. Looking at how the industry is laid out, including where
people sit in relation to equipment, windows, doors and each other. Then check that
equipment and furniture is suitable for the type of work that people are doing. This
includes seating, desks, computers, printers and anything else that they might use to do
their job. Assess the environment that is, the temperature, ventilation, lighting, decoration.
All these aspects of an industry are considered in relation to the individuals in the industry
with emphasis on their safety, health, comfort - and productivity! Much of the following
information and advice can be applied to anywhere. After all, healthy computing is good
for everybody.

The layout which is proposed to the industry includes the following-

Arranging where people need to sit that work in the industry

What equipment the workers need to do their job

What sort of working environment they need

Some workers need a very quiet area to work, for example if they need to
concentrate, and could be put in a separate area away from noisy people and
Equipment. The facilities that people will need for storage.
The furniture used by the worker also used by the officers and the environment should be
as follows-
72
 Seats should be adjustable so that the range of users can be accommodated
comfortably and they provide support where it's needed. Seats should have an adjustable
seat pan height, backrest height and backrest tilt, at least. Computer seats are available with
more features than this, such as seat pan tilt, many of which make sitting more
comfortable.
Armrests can provide good support but should be removable if you don't want
them, or they restrict posture, such as when they stop you getting as close to the desk as
you would like. Seats should have a 5-castor base for stability. It is also important that
everyone understands how to adjust their seats and what posture they should be aiming for
some seats can be quite complicated. Make sure that the seat comes with clear instructions.

Desks are usually a standard height of about 720mm. This is fine for most people,
but it should be checked to make sure that all users can be seated comfortably at a desk of
this height. Particularly short or tall people may need an adjustable-height desk. Enough
desk space is required for paperwork, the computer (monitor, keyboard and mouse) and
any additional equipment.

The desk should not have any obstructions underneath like drawers or supports
those forces to sit in uncomfortable positions. Computer desks should also have a fairly
'thin' top - not like a kitchen worktop. This is to make sure that worker can get legs under
without squashing thighs.

Some desks are 'radial' - L-shaped with a curve in the middle. These can be quite
comfortable for computer work as operators can have everything they need close at hand in
an arc around.

Lighting Most people like to be able to see daylight as it gives them a feeling
about how the day is going outside and natural light is also thought to make people feel
better too. Most people also like to be able to control the artificial lighting levels in their
work area but individual control is not often possible in large offices. Different amounts of
light are needed for paperwork and screen work as screens emit their own light. In this
case, individual desk lights may be better for some people.

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 Temperature and ventilation It is clearly important to be warm enough, but
temperature and humidity can also make a difference to how alert or tired you feel by the
end of the day. Your response to the temperature of your environment depends not only
upon air temperature but also upon radiant temperatures (such as sunshine coming through
a window), air movement and humidity, as well as the type of clothing you are wearing
and what you are doing. Humans produce about 100 Watts of heat for typical office
activities, and computer terminals about twice that much or more depending upon type.
Remember that some people will not be able to move away from an uncomfortable or
stressful environment. Personal control systems where individuals have local control over
the air movement and temperature of their own environment - by the use of fans or heaters
etc., can help.

Noise In the work place can affect concentration, can be an irritation, and can be a
source of stress to some people. With the development of quieter equipment, especially
printers, noise levels in offices have generally decreased. However, in open-plan offices it
can still be a problem with the noise mainly due to people! Screens and good quality
flooring and ceiling tiles can help to absorb noise.

When assemblers need to sit to perform tasks, the optimal work surface height varies
with the type of work performed:

Precision work: 31 to 37 inches

Reading and writing: 28 to 31 inches

Typing and light assembly: 21 to 28 inches

The height of both the chair seat and the backrest should be adjustable. For a
seated person, the boundary for vertically reaching to grasp objects is 32 inches,
with an occasional extended reach of 38 to 40 inches.

When assemblers must stand to perform tasks, workbench heights should be as follows:

Precision work: above elbow height.

74

Light work: just below elbow height.

Heavy work: 4 to 6 inches below elbow height.

Individuals with good posture should have their elbows at a 90 -degree angle and
their wrists in a neutral position. The head should be straight, not too far forward, and
operators should neither lean forward at the waist nor lift their arms above shoulder height.
This workstation features a rack with bins set up so all the parts are within the operators
reach.

4.6 Safety of workplace

When it comes to warehouse safety there are many benefits that are often
overlooked. Safety procedures are frequently disregarded in a variety of workplaces due to
insufficient time, inadequate resources or an opportunity to cut corners in an attempt to
save money. However, when safety procedures are soundly implemented there are major
benefits such as higher employee satisfaction as well as increased productivity. By
minimizing the risk of injury, fewer workplace disruptions take place and absenteeism
associated with injury is also reduced. Equipment downtime is another factor which can be
avoided through the appropriate use of safety procedures.

Here a few safety guidelines to help keep the industry safe

Ensure Safety Equipment is used at all Times In the warehouse it is vital that
forklifts or hydraulic dollies are used to lift items that are too heavy. Appropriate eyewear
and hard hats should also be worn when required. Employees should be aware of
emergency exits and the sprinklers installed in the roof should not be blocked at any time.
Safety equipment is implemented in order to minimize workplace injury, so although it
may be time consuming to initiate its use; it does pay off in the long run.

75
Eliminate Any Potential Safety Hazards Ensure all warehousing floors are free of slip
and trip hazards. It is important that this safety check is carried out on a regular basis, by
all employees, and that the floor is always free of stray cords, liquids and any other
potentially hazardous items. It is also essential that any cracks and pits in the flooring are
attended to as these can cause serious injuries to employers as well as damaging expensive
machinery.

Clearly Label Designated Hazardous Zones Dangerous equipment should be stored

away in an area that is clearly labeled and safe walk ways should be highlighted through
necessary signage. The easiest way to illuminate hazardous zones is by using tape or
painting black and white stripes on the floor of the designated area. This enables
employees to be aware of dangerous surroundings and can be useful in avoiding accidents
that can cause serious injury.

Always Use Safe Lifting Techniques When a load requires transporting, firstly
assess what method is the best option for its movement. If lifting is the most suitable
method; check the route to ensure no obstacles are in the way and ensure there is enough
space for the load at its destination. Safe lifting techniques should always be carried out
and the load should not obstruct the view of the lifter. Use all materials handling
equipment carefully and follow the proper operating procedures including push rather than
pull, whenever possible and lean in the direction that is being travelled.

76
 Provide Training and Refresher Courses Ensure all staffs are educated and up to
date with knowledge about safe practices within the workplace. This allows for greater
adherence to procedures as staff members will be completely aware of the consequences
that can emanate from an unsafe workplace. Accidents most commonly occur when
corners are cut in an attempt to save time. If staff and management are completely aware
of the repercussions that can arise from this fact, procedures may be followed more
closely.

Promote Awareness in your Warehouse Having a sense of awareness in the work

place is an important safety factor. This can be achieved through communication between
staff members. By employees being vocal and yelling out to others their location, collision
incidents can be drastically reduced. When carrying items or driving machinery, a simple
coming through can alert other coworkers of their whereabouts and can allow them to
steer clear of dangerous pathways. All staff members should be encouraged to be
constantly aware of whats around them and to communicate where they are to ensure the
avoidance of collision accidents.

77
4.7 Lean Processes

While it hasnt always been practiced with any great rigor, the concept of waste
reduction has long been a part of American business tradition. Ben Franklin's common-
sense reminders of "waste not, want not," and "a penny saved is a penny earned" have
been well taken by such luminaries as Henry Ford, who introduced the modern assembly
line, and the founders of time-and-motion studies and scientific management,
Systematic elimination of these wastes can result in faster processes, lower costs, higher
quality, happier workers and, most importantly, happier customers.

Defects, mistakes that require additional time, resources, and money to fix. In a
manufacturing process, a defect might involve a defective part that has to be remade; in a
white-collar job, it might include erroneous paperwork that needs to be redone. Defects
tend to be the result of:

Poor quality control

Poor repair

Poor documentation

Lack of standards

Weak or missing processes

A misunderstanding of customer needs

Poor inventory control

Poor design

Undocumented design changes
Over production, In some organizations, workers just blindly keep producing,
even when those who receive their output either aren't ready for it or don't need it.
Basically, what you end up with is too much stuff, too early, that the customer doesn't
necessarily want. This is especially common in manufacturing, but it can occur in any
workplace situation in which there's a bottleneck. Overproduction may occur due to:

Just-in-case production

Unclear customer needs

Producing to a forecast

Long set-up times

Attempts to avoid long set-up times

Poorly applied automation

78
The solution to overproduction is to establish a reasonable work flow for the benefit of the
customer, which in this case is whoever acts as the downstream consumer of what you
produce: your client, another organization within the company, the general public, or
whatever the case may be. Be sure that there are well-established procedures in place for
every process in your organization, and if necessary, implement new processes to keep
work from backing up behind particular bottlenecks in the organization.

Waiting, speaking of bottlenecks, one of the worst in any organization. This is

actual downtime, which occurs whenever work has to stop for some reason: because the
next person in line is overwhelmed, because something broke down, because you're
waiting for approval, or because you've run out of something. Causes of waiting can also
include:

Mismatched production rates

Very long set-up time

Poor shop layout

Insufficient staffing

Work absences

Poor communications
Non-utilized/underutilized talent, while not included in the original Japanese list
of the seven wastes, is an integral part of the American concept. Rather than being
transparent to the system, people themselves have been plugged into the equation, in the
sense that poor utilization of existing talents, ideas, abilities, and skill sets is a waste as real
as using ten pounds of iron when five will do. This type of waste can be caused by a
myriad of things, not least:

Lack of teamwork

Lack of training

Poor communications

Management's refusal to include employees in problem-solving

Narrowly defined jobs and expectations

Poor management in general

79
 Transportation, waste caused by moving things around. This is less of a problem
in a business office than in a manufacturing plant, since most of what white collar workers
"Transport" can be sent by email these days. Otherwise, too much transportation tends to
increase costs, wastes time, increases the likelihood of product damage and deterioration,
and can result in poor communication. In general, transportation waste can be caused by:

Poor plant/office layout

Excessive or unnecessary handling

Misaligned process flow

Poorly-designed systems

Unnecessary steps in system processes

Transportation issues can be defeated by common-sense efforts such as simplifying

processes, repairing physical layouts, handling products less often, and making distances
between steps as short as possible. In an office situation, simply providing enough printers
and other equipment for everyone can limit transportation waste.

Inventory, another item more important in manufacturing that in the standard

office environment, but still something you must be aware of. The actual issue here is
having too much inventory. Excess Inventory may be caused by:

Overproduction

Poor layout

Mismatched production speeds

Unreliable suppliers

Long set-up times

Misunderstood customer needs
Basically, eliminating excess inventory involves adjusting the workflow and
adopting the JIT process, which can be adapted to office environments as well as
manufacturing. Remember, all you really need to do is produce enough to satisfy your
downstream customer.

Motion, because simply having to move around too much can slow down
significantly. Typical causes of excessive motion include:

Poor workstation/shop layout

Poor housekeeping

Shared tools and machines

Workstation congestion

Isolated operations

80


Lack of standards

Poor process design and controls
The solution here is to tighten things up: basically, to make sure everything can be easily located
and put into play whenever it's needed. Re-arrange the office or shop layout to decrease the
distance between stations, and make it easier to reach things that are often used. Make sure all
tools and parts are close at hand, and provide extra printers, copiers, and fax machines for your
employees. Standardize all folders, drawers, and cabinets, and make sure everything stays
organized so that it doesn't take more than a few seconds for anyone to find a file they need.
Finally, make sure everything about the work area stays neat.
Excess Processing, This is any unnecessary effort expended in order to complete a task:
double-handling, permission seeking, unnecessary steps, re-entering data, making too many
copies or reports, and the like. Excess Processing can arise from:

Poor process control

Lack of standards

Poor communication

Overdesigned equipment

Misunderstanding of the customer's needs

Human error

Producing to forecast
Whatever the cause, the result is predictable: wasted money, time, effort, and resources.
Your only option is to closely examine your processes and fix them: institute standard operating
procedures, empower employees, get your documentation up to par, implement J-I-T processes
(if applicable), and do everything you can to shrink processes without sacrificing quality. If
you're working in an office, stop copying everyone on emails and quit sending out so many
reports...and see who screams. Eliminate as many meetings as you can, and let people do their
jobs without getting permission every step of the way.

81
4.8 Approach of 5S
The advantages from implementing the 5S rules:
1S

Process development by cost reduction

Stock confinement

Better usage of workplace

Prevention of losing tools

2S

Process growth

Increasing Efficiency

Shortening of time required for searching necessary things

3S

Improvised working conditions for workers.

of customers has been increased after maintaining a clean and neat
The number
layout.

Machine maintenance cost has been reduced.

4S

The standards of the company came to next level.

Improvement in safety has supported in reducing the injuries of workers.

Slips and falls of the material have been reduced.

Travel time of materials is reduced which led to reduction of work hazards.

5S

It gives a scope for Workers participation in the work area design and maintenance.

Workers absenteeism has been lowered down.

Increasing of the awareness and morale.

Decreasing of mistakes quantity resulting from the inattention.

Proceedings according to decisions.

Improvement of the internal communication processes.

Improvement of the inter human relations.

82
Chapter-5
Conclusions and Recommendations
5.1 Conclusions

A layout is considered with keeping A, D and F departments together and B, C and

E together at the first time when the distances traveled is 9522 feet. There are two types of
distance. They are rectilinear distance and Euclidian distance. The rectilinear distance is
considered.
If B and C are exchanged then the predicted cost extending from 9522 to 10172.50, or
about 6 percent.
If A and B are exchanged the new layout with A and B exchanged appear in fig. 2.1
Exchanging A and B, the distances traveled is 10977.90 feet.
Since none of the predicted cost is less than the initial cost the lay out recommended by
CRAFT, pictured in figure 2.2, required two iterations and resulted in a reduction of total
distance traveled from 10977.90 feet to 9522 feet, or about 15 percent.
Comparing this exchanging layout, the layout 1 is preferable due to the lowest distances
traveled among the departments.

An enter relation among the department is found by SLP. The departments is also rated
by various types of reason such as types of work, ease of supervision, common personal, contact
necessary, share same space and psychology. Absolutely necessary is found among A and B, A
and D , B and E, C and D and E and F department.
Three layouts are proposed. In the first layout picture in appendix B.1. the distance from
department 2 to department 7, department 3 to department 6 and department 1 to department 5
are high. In the second proposed lay out the distance from department 2 to department 7,
department 3 to department 6 are minimized. As the shell lock machine is fixed so the distance
from department 1 to department 5 could not be minimized. If the shell lock machine could be
replaced, then this distance will be minimized.

83
 By the time study, SMV and production capacity of the processes were calculated
separately for production line. Line balancing has decreased 3-10 % work force. After line
balancing 2-10% of work stations, 27-28 % of waiting time and 20-100% of process bottlenecks
are reduced from the production line. The reduced workforce after line balancing can be shifted
to other production lines to minimize the total labor cost.
Different problem areas associated to man, machine, maintenance, material, method,
measurement, management and environment were recognized during observation.
In the industry, the layout is planned very carefully, as many people with different jobs
will be using the area. As the space is restricted, the layout becomes important to ensure that the
working space isn't too cramped, and people don't get in each other's way. Access and emergency
routes need to be defined and laid out to ensure that people can move around the industry easily
and quickly if necessary.

By SWOT analysis it becomes possible to identify various internal factors such as

strength and weakness and external factors such as opportunity and threats of LED light
manufacturing industry to improve its productivity, capacity, and export growth in the global
markets
5.2 Recommendations
A layout is proposed for the future expansion pictured in Appendix A3. Here the shell
lock machine is replaced and the lead time is reduced. An exit door for the final production
with the warehouse. The ware house is decorated with some selves for the product storage.

Only skilled workers should be entitled for the production processes and thats why
proper training and supervision must necessary to achieve the optimum improvements in
productivity and efficiency.

84
References:
Company manual
Manufacturing process by R.K. Jain
Industrial engineering by M. Mahajan
Digital electronics by S. Salivahanan
https://shop.bajajelectricals.com/LED-Lights-c-44.aspx
http://www.lighting.philips.com.au/home
http://syskaledlights.com/home-offices-led-lightings.html
http://www.havells.com/content/havells/en/consumer/lighting/consumer-
lighting/ledlighting.html
http://omegaelectronics.co.in/LED.html
http://www.surya.co.in/home.php
Electronic Packaging:Solder Mounting Technlogies in K.H. Buschow et al (ed), Encyclopedia of
Materials:Science and Technology, Elsevier, 2001 ISBN 0-08-043152-6, pages 27082709

Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies. IPC.
September 1991. IPC4101.

Specification for Base Materials for Rigid and Multilayer Printed Boards (IPC-4101).
ANSI/IPC. December 1997. ANSI/IPC-D-275.

Borkes, Tom. SMTA TechScan Compendium: 0201 Design, Assembly and Process. Surface
Mount Technology Association. Retrieved 2010-01-11.

Function with a Chebychev Dynamic Pick-and-place Point Ayob M. and Kendall G. (2005) A
Triple Objective Specification Approach to Optimise the Surface Mount Placement Machine.
European Journal of Operational Research, 164(3), pp 609626 (http://dx.doi.org/10.1016/j.
ejor.2003.09.034)

85
 Appendix 1

The procedures of a 3W LED bulb manufacturing

SR. No Task Task name Performance time (min)

1 A Wire cutting (long + short) 0.63

2 B Wire stapling (long + short) 0.94
3 C Wire leading (long + short) 1.78
4 D Driver lead 0.21
5 E Soldering wear and driver outline 0.78

6 F Cutting tube fiber 0.65

7 G Fiber enter driver 0.26
8 H Driver heating 0.60
9 I PCB LED soldering 0.63
10 J Helper (PCB folding + passing) 0.76
11 K PCB breaking 0.43
12 L PCB heat paste 0.37
13 M Shell lock 0.17

14 N Shell heat paste 0.33

15 O Shell +PCB 0.003
16 P Cleaning shell + PCB 0.958
17 Q Shell + PCB cover adjust 0.45
18 R Driver pass (helper) 0.50
19 S Driver input 1.90
20 T PCB soldering 0.56
21 U End capping 1.50
22 V Fiber heating 0.76
23 W End cap fitting 0.40
24 X Cleaning 0.25
25 Y Testing 0.50
26 Z Packaging 0.68

86
 Appendix B.1

Existing layout

87
Appendix-B.2

Proposed layout

88
 Appendix B.3

Future expansion layout

89
 Appendix C
Distance matrix chart

Chart Title
10400

10200

10000
Distance

9800

9600

9400

9200

9000
layout 1 layout 2 layout 3

Layout

Appendix D
Proposed layout by SLP

90
 Appendix E

Bill of material

No. of Quantit
Component Price Unit Cost
Part y
01
Wire 1200 56.63 sq-ft 31 24

03 Aluminum shell 8 57.20 557 60

05 Aluminum hi-comer bracket 8 52.40 519.20
06 Fiber 10
0.4 69.00 sheets 527.60
08 Teensy 2.0 Microcontroller 1 516.00 516.00
09 Micro SD Card Adapter 1 8.00 58.00
10 USB adapter 1 55.50 5.50
11 Individually addressable RGB 1 strand
LED pixel strands 4 39. 95 = 25 5159.80
pixels
12 5V DC power supply 1 525.00 525.00
13 PCB Board 0.5 46.95 523.48
14 Molex Header + Wiring 1 51.95 51 95
15 DC Barrel Jack 1 52.95 52.95
16 Rocker power switch 1 50.96 50.96
17 Momentary Button 1 51.80 1.80
18 Terminal Block 1 2.43 2.43
19 22awg wire 50.00
20 Resistor 50.00
Total 5539.39

91