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Solar Energy 77 (2004) 803814

www.elsevier.com/locate/solener

High-eciency polycrystalline CdTe thin-lm solar cells


Xuanzhi Wu *

National Renewable Energy Laboratory (NREL), 1617 Cole Blvd., Golden C0 80401, USA

Received 12 December 2003; received in revised form 29 June 2004; accepted 30 June 2004
Available online 4 August 2004

Communicated by: Associate Editor T. M. Razykov

Abstract

Cadmium telluride is a promising photovoltaic material for thin-lm solar cells. However, further improvements on
performance and reproducibility of devices have been limited by the conventional SnO2/poly-CdS/poly-CdTe device
structure used for more than 30 years. In this paper, we review partial R&D approaches at NREL to understand
the issues related to the conventional device structure and to develop several novel materials and a modied device
structure for minimizing these issues. We have achieved a CdTe polycrystalline thin-lm solar cell demonstrating an
NREL-conrmed, total-area eciency of 16.5% by using new materials and the modied device structure. To apply
the high-eciency CdTe cell fabrication technique, we developed two manufacturing processes for producing high-e-
ciency CdTe modules with the potential of high throughput and low cost.
 2004 Elsevier Ltd. All rights reserved.

Keywords: CdTe; Thin-lm; High-eciency

1. Introduction performance and the ability to attract production-scale


capital investments (Ullal et al., 2000). However, further
Cadmium telluride (CdTe) has been recognized as a improvements on performance and reproducibility of
very promising material for thin-lm solar cells. CdTe CdTe cells have been limited by the conventional
is a IIVI compound semiconductor with a direct optical SnO2/poly-CdS/poly-CdTe device structure used for
bandgap of 1.5 eV that is nearly optimally matched to more than 30 years (Adirovich et al., 1969). For exam-
the solar spectrum for photovoltaic (PV) energy conver- ple, conventional transparent conductive oxides, prima-
sion. CdTe also has a high absorption coecient, rily SnO2 lms, have an average transmission of only
>5 105/cm, which means that 99% of photons with 80% when a sheet resistivity of 10 X/sq is used. This
energy greater than the bandgap (Eg) can be absorbed does not provide adequate design latitude when trying
within 2 lm of CdTe lm. Small-area CdTe cells with to optimize either device performance or manufacturing
eciencies of more than 15% have been developed (Britt cost. The cadmium sulde (CdS) window layer has a low
and Ferekides, 1993; Ohyama et al., 1997). Large-area bandgap (2.4 eV) that causes absorption in the short-
monolithic CdTe modules have also demonstrated high wavelength region. The CdS lm with a thickness of
0.1 lm can absorb about 63% of the incident radiation
with energy greater than Eg (Chu and Chu, 1993). High-
*
Tel.: +1 303 3846552; fax: +1 303 3846430. er short-circuit current densities (Jsc) can be achieved by
E-mail address: xuanzhi_wu@nrel.gov reducing the CdS thickness to improve the blue response

0038-092X/$ - see front matter  2004 Elsevier Ltd. All rights reserved.
doi:10.1016/j.solener.2004.06.006
804 X. Wu / Solar Energy 77 (2004) 803814

in the conventional CdS/CdTe device structure. How- CTO TCO lms have several advantages over SnO2
ever, reducing the CdS thickness can adversely impact TCO lms (Wu et al., 1996b; Wu et al., 1997). They
device open-circuit voltage (Voc) and ll factor (FF) have electrical resistivities (1.5 10 4 X cm) two
(McCandess and Hegedus, 1991). Finally, it is well times and six times lower than SnO2 lms produced
known that the CdCl2 treatment is important for using a Sn(CH3)4 (TMT) and SnCl4 chemistry, respec-
making high-eciency CdTe devices and oers sev- tively (see Table 1). Both SnO2 lms were prepared by
eral substantial benets such as: increased grain size, chemical vapor deposition (CVD) at 400500 C, and
grain-boundary passivation, increased CdS/CdTe inter- doped with uorine (F). The high conductivity of the
face alloying, and reduced lattice mismatch between CTO lms is attributed to its high mobility with high
the CdS and CdTe layers. However, one disadvantage carrier concentration. CTO lms also have signi-
of the CdCl2 treatment is that over-treatment can result cantly better optical properties than conventional
in loss of adhesion. The adhesion problems can limit SnO2 lms. This is, in part, due to the lower resistiv-
the optimal CdCl2 treatment process, as well as device ities, which allow thinner lm to be used. Fig. 1 shows
performance. the transmittance and absorbance of the Cd2SnO4 and
In the past years, we tried to understand these issues SnO2 lms with similar sheet resistivities (10 X/sq).
related to the conventional device structure, and devel- We can see from Fig. 1 that the CTO lm has higher
oped several novel materials and a modied device struc- transmittance and lower absorbance than the SnO2
ture for minimizing these issues. We have developed the lm. It is worth noting that this feature can be main-
following: (1) a high-quality cadmium stannate tained in the longer-wavelength region. Therefore,
(Cd2SnO4, or CTO) transparent conductive oxide Cd2SnO4 lms have the potential for application in
(TCO) to replace the conventional SnO2; (2) a high- polycrystalline thin-lm multijunction devices (Wu
resistivity ZnSnOx (ZTO) buer layer located between et al., 2003a). In our earlier work, we pointed out
the TCO and the CdS lm; (3) an oxygenated, nanocrys- that the excellent electrical and optical properties of
talline CdS:O window layer with higher bandgap; (4) a Cd2SnO4 lms are well-correlated to its single-phase
modied CTO/ZTO/CdS/CdTe device structure; and spinel polycrystalline microstructure. Recently, we
(5) two manufacturing processes for producing high-e- found that its high transmission and conductivity are
ciency CdTe modules, as an application of the high-e-
ciency CdTe cell fabrication technique.
In this paper, we review the preparation, properties,
and application of new materials, the updated results
of high-eciency CdTe devices, and manufacturing
processes.

2. Novel materials and their application in CdTe cells

2.1. Cadmium stannate transparent conductive oxide

CTO TCO lms were prepared by RF magnetron


sputtering. The deposition was carried out in pure oxy-
gen at room temperature using a commercial hot-
pressed oxide target. Then, CTO lms were annealed
at 600660 C in Ar or CdS/Ar atmospheres for 1020
min. More details about the CTO lm preparation have
been described in previous papers (Wu et al., 1996a; Fig. 1. Transmittance and absorbance of Cd2SnO4 and a SnO2
Coutts et al., 1996). lms with similar sheet resistivity of 10 X/sq.

Table 1
Comparison of electrical properties between Cd2SnO4 and SnO2 lms (Wu et al., 2000a)
Sample Thickness (nm) n (cm 3) l (cm2/Vs) Resistivity (X cm) Rs (X/sq)
20 4
Cd2SnO4 510 8.94 10 54.5 1.28 10 2.6
SnO2 (SnCl4) 1000 4.95 1020 15.4 8.18 10 4
8.6
SnO2 (TMT) 1000 4.52 1020 42.0 3.29 10 4
3.3
X. Wu / Solar Energy 77 (2004) 803814 805

2.2. High-resistivity zinc-tin-oxide buer layer

In our earlier work, we used zinc stannate


(Zn2SnO4) lm as a buer layer (Wu et al., 1998). In
the preparation recipe of the Zn2SnO4 target, there is
a high-temperature pre-reaction process that results in
a problem in reproducibility. To simplify target prepa-
ration, we developed a ZnSnOx (ZTO) buer layer to
replace the Zn2SnO4 lm. Both Zn2SnO4 lm and
ZnSnOx lm have similar material properties, such as
bandgaps of 3.6 eV and resistivities of 110 X cm
after post-anneal. ZTO lms were prepared by RF
magnetron sputtering. The deposition was performed
in pure oxygen at room temperature using the commer-
cial oxide target.
An as-grown ZTO lm has a very high resistivity
(>104 X cm). After post-anneal at higher temperature
(540620 C) for 35 min, the lm resistivity is reduced
to 110 X cm. After anneal, the ZTO bandgap remains
Fig. 2. TEM plan view of an annealed Cd2SnO4 TCO lm (Wu the same (3.6 eV), but its transmission is slightly im-
et al., 2000a). proved. By integrating a ZTO buer layer in a CdTe cell,
the probability of forming localized TCO/CdTe junc-
tions can be signicantly reduced when the CdS lm is
Table 2 thinned, because the ZTO lm has both high optical
Jsc loss due to TCO absorption for four dierent TCO lms bandgap and high resistivity that roughly matches that
TCO Rs (X/sq) Jsc loss due to TCO of the CdS lm. The ZTO buer layer can also act as
absorption (mA/cm2) an etch-stop layer during the back-contact formation
SnO2 (SnCl4) 810 2.8 process and greatly reduce shunting problems (Wu et al.,
SnO2 (TMT) 78 1.3 2001a), because the ZTO lm resists the etchant (e.g., a
Cd2SnO4 78 0.62 nitric/phosphoric-based, or NP, acid etchant) used for
CTO/ZTO 78/105106 0.68 back-contact formation. For example, there is almost
no etch for ZTO lm in the NP etchant for more than
30 min, but 1000-A-thick chemical-bath-deposited
(CBD) CdS lm can be completely etched in the NP
related to its excellent microstructure and near-homo- etchant within 20 min.
geneity (Wu et al., 2003a). Fig. 2 shows a transmission We also found that there is interdiusion between the
electron microscopy (TEM) plan view of an annealed CdS and ZTO lms. This interdiusion can occur either
CTO lm. The extent of the fringes indicates that at higher temperature (570650 C) in Ar, or at lower
there is a high degree of material perfection. In con- temperature (400420 C) in a CdCl2 atmosphere (Wu
trast, there are a number of defects (such as disloca- et al., 2001b).
tions and twins) in a typical SnO2 lm.
Because of the excellent material properties of 2.2.1. Interdiusion at high temperature
Cd2SnO4 lms, our results have demonstrated that Jsc In this study, two test samples were prepared. A CdS
can be improved by replacing the SnO2 lm with a lm and a ZTO lm were deposited on independent 7059
CTO TCO lm in CdTe cells. Table 2 shows the Jsc Corning glass substrates by the CBD technique and RF
loss due to glass/TCO absorption for three dierent magnetron sputtering, respectively. X-ray photoemis-
TCO substrates. We can calculate the Jsc loss due to sion spectroscopy (XPS) was used to measure the
glass/TCO absorption from their absorbance curves changes of lm composition before and after these lms
and AM1.5 solar spectrum in the CdTe active range were annealed face to face at 600 C.
between 300 and 860 nm. Three lms were prepared Fig. 3(a) indicates an absence of Cd in the ZTO lm
on 7059 Corning glass (1.11.2 mm thick) and had before annealing within the detection limits of XPS, and
nearly the same sheet resistivity. The CTO TCO has about 35 at.% Cd diuses into the ZTO lm from the
the lowest Jsc loss (0.7 mA/cm2) due to its absorption CdS layer after annealing. Similarly, we cannot detect
in CdTe cellstwo to four times lower than SnO2 lms any Zn in the CdS lm before annealing, whereas we de-
prepared by the precursors TMT and SnCl4, tect about 23 at.% Zn in the CdS lm after annealing
respectively. (Fig. 3(b)).
806 X. Wu / Solar Energy 77 (2004) 803814

Fig. 3. XPS survey spectra of ZTO lm (a) and CdS lm (b) before and after annealing at 600 C in Ar (Wu et al., 2001b).

6 6
10 S 10 S
As-Deposited Annealed
Cd Cd
Secondary Ion Counts
5
Secondary Ion Counts

5
10 Zn 10 Zn
4 Sn 4 Sn
10 10
3 3
10 10
2 2
10 10
1 1
10 10
0 0
10 10
0.0 0.1 0.2 0.3 0.4 0.0 0.1 0.2 0.3 0.4
(a) Depth (m) (b) Depth (m)

Fig. 4. Interdiusion of ZTO and CdS lms at 420 C in a CdCl2 atmosphere (SIMS data) (Wu et al., 2001b).

2.2.2. Interdiusion at lower temperature in CdCl2 (CdTe) in the conventional CdTe cell during device fab-
atmosphere rication processes. Using this feature, we can improve
A test sample with ZTO/CdS/glass structure was pre- the blue response of the device. This property may also
pared and annealed at 420 C for 15 min in a CdCl2 be exploited in production by using thicker CdS lms,
atmosphere. Secondary-ion mass spectroscopy (SIMS) thereby enhancing yield without reducing Jsc.
depth proling was used to determine the extent of inter- In the interdiusion of the CdS and ZTO lms, the
diusion at the ZTO/CdS interface. SIMS data (see ZTO lm acts as a Zn source to alloy with the CdS lm
Fig. 4) also indicate a considerable amount of Cd and and form a ZnxCd1 xS layer that has a higher bandgap
Zn diusion into the ZTO and the CdS lm, respectively. than CdS. This shifts the short-wavelength cut-o to a
In the later studies of TEM and energy-dispersive smaller value (from 520 to 480 nm), which leads to
spectroscopy (EDS), we also found interdiusion be- an increase in Jsc.
tween the ZnSnOx and CdS lms in a completed CdTe The interdiusion also signicantly improves the
cell, in which the CdTe lm was deposited at lower tem- adhesion between the TCO and the CdS layer after
perature (570 C) (Wu and Zhou, 2004). CdCl2 treatment. Performance and reproducibility of
We have successfully applied the interdiusion fea- CdTe cells are signicantly inuenced by the CdCl2
ture to minimize issues related to the conventional treatment, which is used by all cell manufactures. How-
SnO2/CdS/CdTe device structure and to improve device ever, a CdCl2 over-treatment can result in adhesion-loss
performance and reproducibility. The interdiusion of problems. Grain growth of the CdS lm, which occurs
the CdS and ZTO layers improved the quantum e- during the CdCl2 treatment, may introduce stress at
ciency of a CdTe cell over the entire active wavelength the TCO/CdS interface, resulting in lm blistering or
region (400860 nm). peeling. The interdiusion between the CdS and ZTO
The interdiusion consumes CdS lm from both layers may relieve the stress at the CdS/ZTO interface,
the CdTe and ZTO sides, rather than from one side thereby improving device adhesion.
X. Wu / Solar Energy 77 (2004) 803814 807

10
5 we believe it is related to the interdiusion feature and
=2200ps improvement of junction quality.
104
Counts (a.u.)

=730ps 2.3. Oxygenated nanocrystalline cadmium sulde


1000 W380-A window layer
=180ps W380-D
100 W380-C
In the conventional CdTe device, the poly-CdS lm
10 has been used most commonly as a window material.
But it has three main issues that limit device perform-
1
0 5 10 15 20 ance. First, the CdS1 yTey alloy with lower bandgap
Time (ns) can be formed between the CdTe and poly-CdS lms,
which aects device performance (McCandess and
Fig. 5. TRPL decay curves of three CdTe cells with dierent
Hegedus, 1991). Second, poly-CdS lm has a bandgap
CdCl2 treatment (Wu et al., 2001b).
of 2.42 eV, which causes considerable absorption in
the short-wavelength region. Third, there is a nearly
The signicant improvement of device adhesion not 10% lattice mismatch between the poly-CdTe lm and
only improves the device reproducibility, but also pro- the poly-CdS lm, which causes high defect density at
vides greater latitude in optimizing the CdCl2 treatment the junction region. To reduce the lattice mismatch be-
process. Fig. 5 shows time-resolved photoluminescence tween the CdS and CdTe lms, high-temperature device
(TRPL) results of three cells with dierent CdCl2 treat- fabrication processes must be used to enhance the inter-
ment. We can see that an optimally CdCl2-treated device diusion of the CdS and CdTe lms and form inter-
(W380-A) has the longest TRPL lifetime (2.2 ns), which mixed layers (CdS1 yTey and CdTe1 xSx). But during
is three times higher than the device (W380-D) with a the high-temperature processes, new defects and impuri-
normal CdCl2 treatment, and more than 10 times than ties are introduced that limit the improvement of device
the device (W380-C) without CdCl2 treatment. NREL Voc and FF. Therefore, a new window material that
experimental results demonstrated that the TRPL life- has higher optical bandgap, a better lattice match with
time correlates well with the quality of the junction the CdTe absorber, and minimum Te diusion is an
and CdTe lm, and with the absolute internal quantum important project for further improving CdTe cell
eciency in the wavelength region of 580840 nm. For performance.
example, the 16.5%-ecient world-record CdTe cell We developed a novel window material, oxygenated
(see Section 3) has TRPL lifetime of more than 2 ns, nanocrystalline CdS lm (nano-CdS:O), prepared at
and also has an excellent red spectra response (see Fig. room temperature in an oxygen/argon gas mixture by
11(b)). Even in CdTe cells prepared at lower tempera- RF magnetron sputtering. Details about the CdS:O lm
ture (450 C), there is still a direct correlation between preparation have been described in previous papers (Wu
TRPL lifetime and cell-eciency parameters (Moutinho et al., 2002; Wu et al., 2003b).
et al., 2000). The CdS:O lm has a higher optical bandgap (2.53.1
Finally, we found that the CdTe cell with a high- eV) than the poly-CdS lm and has a nanostructure; the
resistivity ZTO buer layer has the lowest series resistiv- bandgap increases with an increase of oxygen content
ity of 1 X cm2. The mechanism related to improving (from 4 to 23 at.% measured by XPS) and the grain
device series resistivity is not yet completely clear, but size decreases (from about a few hundred angstrom to a

Fig. 6. TEM and electron diraction pattern of CdS lm deposited in pure Ar (Wu et al., 2003b).
808 X. Wu / Solar Energy 77 (2004) 803814

Fig. 7. TEM and electron diraction pattern of CdS lm deposited in 2% O2/Ar gas mixture (Wu et al., 2003b).

few tenths angstrom measured by TEM). Fig. 6(a) shows same select aperture as for Fig. 6(b). It shows diraction
a bright-eld image of a CdS lm sputtered in an oxy- rings only with no diraction spots, indicating that the
gen-free environment. The average grain size is around grain sizes are very small. Our TEM results suggest that
25 nm, which is consistent with the results from AFM. one of the eects of oxygen in the growth environment is
Fig. 6(b) shows a selected-area electron diraction pat- to reduce signicantly the grain sizes of the sputtered
tern taken from the same sample. It clearly reveals that CdS thin lms, which results in the increase of their opti-
the CdS lm is polycrystalline. Fig. 7(a) shows a high- cal bandgap.
resolution TEM image of a CdS thin lm sputtered in TEM and EDS results have also demonstrated that
an 2% oxygen/argon environment. The lm is still poly- the higher oxygen content presented in the nanocrystal-
crystalline, but average grain size is around 35 nm, line CdS:O lms can signicantly suppress the Te diu-
much smaller than the CdS lm sputtered in an oxy- sion from the CdTe into the CdS lm and the formation
gen-free environment. Fig. 7(b) is a selected-area elec- of a CdS1 yTey alloy with a lower bandgap that results
tron diraction pattern, which was taken using the in poor quantum eciency in the short-wavelength

Fig. 8. Cross-sectional TEM images of a poly-CdS/CdTe cell (a) and a nano-CdS:O/CdTe cell (b) (Wu et al., 2003b).

Fig. 9. EDS (a) (left) and (b) (right) taken from points P1 and P2 marked on Fig. 8(a) and (b) (Wu et al., 2003b).
X. Wu / Solar Energy 77 (2004) 803814 809

region. Fig. 8(a) and (b) show cross-sectional TEM (NH4OH), and thiourea [CS(NH2)2] in an aqueous solu-
images of a poly-CdS/CdTe cell (a) and a nanocrystal- tion. Integrating nanocrystalline CdS:O lm into devices
line CdS:O/CdTe cell (b), respectively. In the poly-CdTe for preparing high-eciency CdTe cells is under way,
cell, the CdS lm with a polycrystalline structure was but it has been used in novel manufacturing processes
deposited in pure Ar by RF sputtering. In Fig. 8(a), (see Section 4). The CdTe lms were prepared by the
the CdS layer is not visible in some regions, which indi- close-spaced sublimation (CSS) technique at 600625
cates total consumption of the CdS lm. In some areas, C for 35 min in O2/He atmosphere. After CdTe depo-
the CdS is seen, but with signicantly reduced thickness, sition, samples received a vapor CdCl2 treatment at 400
suggesting that the CdS consumption is spatially varia- 430 C for 1015 min. HgTe:CuTe-doped graphite paste
ble in the plane of the lm. The EDS measurements annealed at 270 C for 30 min, followed by a layer of
(see Fig. 9(a)) also indicate Te diusion into the CdS Ag paste, was then applied to the devices as the back-
layer (point P1 in Fig. 8(a)). Optical bowing in the contact layer. An 1000 A MgF2 antireection (AR)
CdS1 yTey alloy system is such that small changes in coating was deposited on some of the cells.
the Te content of CdS can result in a large decrease in Using the modied CTO/ZTO/CdS/CdTe device
bandgap (Ohata et al., 1973; Wei et al., 2000). The for- structure, we achieved a high FF of 77.34%, a high Jsc
mation of CdS1 yTey alloy having a lower bandgap re- of near 26 mA/cm2, and an eciency of 16.5% measured
sults in poor quantum eciency in the short-wavelength by NRELs standard currentvoltage (IV) measure-
region. In contrast, the nanocrystalline CdS:O layer is ment, which represents individual optimized cases.
still very visible (see Fig. 8(b)). The nanocrystalline NRELs standard IV test conditions are 1000 W/m2
CdS:O lm has much higher oxygen atomic concentra- illumination intensity under AM1.5 global solar spec-
tion than poly-CdS lm (Wu et al., 2002). Therefore, this trum, and cell temperature of 25 C.
strongly indicates that oxygen present in nanocrystalline
CdS:O lms signicantly suppresses the Te interdiusion 3.1. High ll factor
from the CdTe to the CdS lm and the formation of a
CdS1 yTey alloy. The EDS results (see Fig. 9(b)) also Table 3 lists IV parameters of two high-eciency
conrm that Te cannot be found in the CdS:O layer CdTe cells with FF of more than 77%. These are the
(point P1 in Fig. 8(b)), which results in a higher quan- highest FF values ever reported for CdS/CdTe polycrys-
tum eciency in the short-wavelength region and a high- talline thin-lm solar cells. Device analyses indicate that
er Jsc. The Jsc values up to near 26 mA/cm2 in a CTO/ these cells with a high FF have a lower series resistivity
ZTO/CdS:O/CdTe cell are achieved by using the nano- Rs (1 X cm2), a higher shunt resistivity Rsh (35 103
crystalline CdS:O lm. The Si peak in Fig. 9(a) and (b) X cm2), and better diode quality factor A (1.62). The
is due to contamination during preparation of the test reduction of Rs is mainly due to the use of a CTO
sample.

Back contact (C:HgTe:CuxTe)


3. CTO/ZTO/CdS/CdTe device structure and updated
high-eciency CdTe cell results
CdTe (~10 m)
Fig. 10 shows the modied CTO/ZTO/CdS/CdTe de-
vice structure. In this device structure, a CTO TCO lm Front
CBD-CdS (0.07-0.1 m)
deposited on a borosilicate glass replaces the conven- contact (In)
tional SnO2 TCO lm as a front contact, and a ZTO lm ZnSnOx (0.1-0.2 m)
is integrated as a buer layer located between the CTO
and CdS layers. The thickness of both CTO and ZTO Cd2SnO4 (0.15-0.3 m)
lms was varied from 100 to 300 nm. In this case, the
Borosilicate glass substrate
CdS lm was prepared by a CBD technique (Chu
et al., 1992), using cadmium acetate [Cd(C2H3O2)2],
ammonium acetate (NH4C2H3O2), ammonia hydroxide Fig. 10. Modied CTO/ZTO/CdS/CdTe device structure.

Table 3
High-eciency CdTe cells with high ll factor (Wu et al., 2001a)
Cell # Voc (mV) Jsc (mA/cm2) FF (%) Eciency (%) Area (cm2)
1 842.1 24.12 77.26 15.7 1.001
2 848.1 23.97 77.34 15.7 0.976
810 X. Wu / Solar Energy 77 (2004) 803814

Table 4
High-eciency CdTe cells with high Jsc (Wu et al., 2001a)
Cell # Voc (mV) Jsc (mA/cm2) FF (%) Eciency (%) Area (cm2)
1 847.5 25.86 74.45 16.4 1.131
2 845.0 25.88 75.51 16.5 1.032

Table 5
Jsc losses in a 16.1%-ecient CTO/ZTO/CdS/CdTe solar cell
Jsc loss mechanism J (mA/cm2) J/Jtheoretical (%)
J1 Absorption of CTO/ZTO 0.74 2.51
J2 Absorption of CdS 1.40 4.75
J3 Recombination in junction and CdTe 0.52 1.76
J4 Reection 1.19 4.03
Jloss J1 + J2 + J3 + J4 3.85 13.05
Jsc 25.65 86.95
Jtheoretical Eg  1.48 eV 29.5 100

TCO lm with high conductivity, and integrating a ZTO absorption measurements of individual layers (including
buer layer to optimize CdCl2 treatment for improving glass substrate, CTO, ZTO, and CdS) (Sites, 2003).
junction quality. The increase of Rsh is mainly due to It can be seen from Table 5 that (1) the Jsc loss due to
integrating a ZTO buer layer, which reduces the prob- glass/CTO/ZTO absorption is reduced to 0.74 mA/cm2,
ability of forming localized TCO/CdTe junctions when because both the CTO TCO lm and the ZTO buer
the CdS lm is thinned and acts as an etch-stop layer layer have high transmission and near-zero absorbance
during the back-contact formation process. in the active wavelength region (400860 nm); (2) the
Jsc loss due to CdS absorption is reduced to 1.4 mA/
3.2. High short-circuit current density cm2, because a thinner CdS lm (700800 nm) can
be used, and CdS can be consumed partially during
Table 4 lists IV parameters of two high-eciency the CdTe deposition and CdCl2 treatment processes by
CdTe cells with Jsc of nearly 26 mA/cm2. In this work, integrating a ZTO buer layer; (3) the Jsc loss due to
high Jscs were achieved in three ways: reducing Jsc loss recombination in the junction and CdTe regions is re-
due to TCO absorption; reducing Jsc loss due to CdS duced to 0.52 mA/cm2, because the CdCl2 treatment
absorption; and reducing Jsc loss due to recombination has been optimized to improve junction and CdTe lm
in the junction and CdTe regions. Table 5 lists four dif- quality by integrating a ZTO buer layer.
ferent Jsc losses in a 16.1%-ecient CTO/ZTO/CdS/
CdTe cell (Voc = 842.2 mV, Jsc = 25.65 mA/cm2, and 3.3. High-eciency CTO/ZTO/CdS/CdTe cells
FF = 74.67%), which can be calculated from AM1.5 glo-
bal solar spectrum, the absolute internal quantum e- A number of CTO/ZTO/CdS/CdTe cells with NREL-
ciency of this cell, and independent reection and conrmed eciencies of more than 15.8% have been

Table 6
High-eciency CTO/ZTO/CdS/CdTe solar cells (Wu et al., 2001a)
Cell # Voc (mV) Jsc (mA/cm2) FF (%) Eciency (%) Area (cm2)
1 844.0 25.21 74.41 15.9 1.004
2 848.2 25.55 73.55 15.9 1.040
3 846.3 25.43 74.24 16.0 1.130
4 849.9 25.50 74.07 16.1 1.029
5 835.6 25.25 76.52 16.1 0.961
6 842.2 25.65 74.67 16.1 0.948
7 842.7 25.24 76.04 16.2 1.116
8 847.5 25.86 74.45 16.4 1.131
9 845.0 25.88 75.51 16.5 1.032
X. Wu / Solar Energy 77 (2004) 803814 811

Fig. 11. Currentvoltage (a) and relative quantum eciency (b) curves for 16.5%-ecient CdS/CdTe polycrystalline thin-lm solar
cell.

fabricated (see Table 6). These results also indicate that manufacturing processes. First, further improvement on
the modied CTO/ZTO/CdS/CdTe device structure pro- performance and yield of CdTe modules have been lim-
vides better reproducibility. ited by use of the conventional SnO2/poly-CdS/poly-
In Fig. 11(a), we show a CTO/ZTO/CdS/CdTe poly- CdTe device structure. For example, a thicker CdS layer
crystalline thin-lm solar cell with an NREL-conrmed has to be used for maintaining high yield, which also re-
total-area eciency of 16.5% (Voc = 845.0 mV, sults in low Jsc and low eciency. Second, the conven-
Jsc = 25.88 mA/cm2, FF = 75.51%, and area = 1.032 tional processes include time-consuming and expensive
cm2). We believe that this is the highest eciency ever re- heat-up and cool-down segments that limit throughput
ported for a CdTe-based solar cell. Fig. 11(b) shows the and yield, and some wet processes that generate a
relative quantum eciency curve for this cell. large amount of liquid waste.
To apply our high-eciency CdTe cell fabrication
3.4. Future work technique, we developed two manufacturing processes
for minimizing these issues and producing high-e-
The best photovoltaic parameters achieved in our ciency CdTe modules.
work are Voc = 858 mV (only 58% of the CdTe band- (1) Process #1 (Wu and Sheldon, 2000b). Fig. 12(a)
gap Eg of 1.48 eV for NREL CdTe lm), Jsc = 25.9 shows a schematic representation of this novel process.
mA/cm2 (87.7% of the theoretical maximum Jsc of Compared to conventional manufacturing processes,
29.5 mA/cm2), and FF = 77.3%. In the short term, a there are several new aspects in this process. First, a
conversion eciency of 1718% can be expected by borosilicate glass/CTO/ZTO/nano-CdS:O/CdTe device
optimizing the device Jsc to 90% of theoretical and structure was used (see Fig. 12(b)) in this process, which
the FF to 7880%. To achieve CdTe cells with an e- is similar to that used in a high-eciency CdTe cell. This
ciency of 1820%, research should focus on improving means that much knowledge on novel materials and the
the ratio of Voc/Eg to at least 60% (Voc  900 mV). This modied device structure can easily transfer to a manu-
could be achieved in three ways: (1) improve the built-in facturing process. Second, the rst three layers (includ-
potential by minimizing compensation and increasing ing CTO TCO layer, ZTO buer layer, and CdS:O
doping of the CdTe lm; (2) improve the diode quality window layer) are prepared by the same deposition tech-
factor A by minimizing the recombination-center density niqueRF magnetron sputtering at room temperature.
in the junction region; and (3) reduce the back-contact RF sputtering is a mature technology with demonstrated
barrier height. production scalability. Third, the new process has only
one heat-up segment in the entire device fabrication
process. The recrystallization of the rst three layers
4. Novel manufacturing processes and the interdiusion at the three interfaces (including
the CTO/ZTO, ZTO/CdS, and CdS/CdTe interfaces)
Commercial-scale CdTe modules with eciencies of are completed during CdTe deposition by the CSS
68% were produced by several CdTe deposition tech- technique.
niques, and they have demonstrated the ability to attract We have fabricated a CTO/ZTO/nano-CdS:O/CdTe
production-scale capital investments. However, there cell with an NREL-conrmed eciency of 14.7%
are undesirable issues in the conventional CdTe module (Voc = 833.8 mV, Jsc = 24.06 mA/cm2, FF = 73.29%,
812 X. Wu / Solar Energy 77 (2004) 803814

Fig. 12. (a) Schematic representation of novel manufacturing process #1, and (b) a borosilicate glass/CTO/ZTO/nano-CdS:O/CdTe
device structure used in process #1.

and area = 1.159 cm2) by this process. This result is not prepared by RF magnetron sputtering at room temper-
optimized yet. The device results also demonstrate that ature. The entire process contains only one heat-up seg-
CdTe cells prepared by this process have good uniform- ment. When using commercial SnO2/SL-glass substrates
ity, which is desirable for scaling up the process and with a lower softening temperature, CdTe deposition
helping reduce the eciency gap between small-area must be performed at temperatures below 570 C. The
cells and modules. eects of lowering the CdTe deposition temperature im-
(2) Process #2 (Wu and Zhou, 2004). This process pact structural properties and density of the CdTe lms.
can fabricate high-eciency CdTe cells on low-cost com- The CdTe lm can be deposited by CSS or vapor trans-
mercial SnO2/soda-lime (SL) glass substrates. Fig. 13(a) port deposition (VTD). We have optimized the deposi-
and (b) show a schematic representation of process #2 tion parameters in CSS process, such as the source and
and the device structure used in this process, respec- substrate temperature, total pressure, and partial O2
tively. Soda-lime glass has poorer properties than boro- pressure, to obtain high-quality and denser CdTe lms.
silicate glass, such as higher thermal expansion We have fabricated a number of CdTe cells on commer-
coecient, higher Na and Fe content, higher absorb- cial Tek 15 SnO2/SL-glass (produced by LOF) with
ance, and lower softening temperature. Commercial NREL-conrmed eciencies of more than 14%. The
SnO2 TCO lms have an inherent sheet resistivity of best cell has an eciency of 14.4% (Voc = 829.3 mV,
10 15 X/sq and an average transmission of 80%, Jsc = 23.48 mA/cm2, and FF = 74.07%). This process
which is not good enough to improve CdTe cell per- also demonstrated better uniformity, which can help to
formance. However, commercial SnO2/SL-glass sub- reduce the eciency gap between small-area cells and
strates are inexpensive, which is helpful for reducing modules.
the CdTe module cost. In this process, performance These two novel manufacturing processes provide
and reproducibility of CdTe cells were improved signif- attractive alternatives for producing CdTe modules with
icantly by integrating a ZTO buer layer. The Jsc values a potential of high throughput and low cost by (1)
of CdTe cells were also improved greatly by using nano- increasing device eciency, (2) improving device yield,
CdS:O lm. Both the ZTO lm and the CdS:O lm are and (3) simplifying the device fabrication process.

Fig. 13. (a) Schematic representation of novel manufacturing process #2, and (b) a soda-lime glass/SnO2/ZTO/nano-CdS:O/CdTe
device structure used in process #2.
X. Wu / Solar Energy 77 (2004) 803814 813

5. Conclusions References

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The author would like to thank his colleagues: R.G. Wu, X., Sheldon, P., Coutts, T.J., Rose, D.H., Moutinho,
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