Printed Circuit Board

Design
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Capabilities

Solution Capabilities

• Direct connections to major ECAD packages via

standard exchange files like IDF (V2, 3, & 4) as
well as Zuken.
• Robust transmission with cross-checking and
visualization of results
• Powerful compare and update functionality with
reporting
• Automatically creates a ready-to-solve thermal
model

Unrestricted © Siemens AG 2017

Siemens PLM Software
Demonstration

Unrestricted © Siemens AG 2017

Siemens PLM Software
Benefits

Solution Benefits
• Cross-checking of changes between MCAD and
ECAD reduces error and design time
• Vendor-specific transmission protocols enables
more robust data linkages with ECAD
• Automates the creation of thermal simulation
model saving valuable preprocessing time

Unrestricted © Siemens AG 2017

Siemens PLM Software