rraouerton 10 FINE-PITCH LEAD FORMING FOR SURFACE MOUNT COMPONENTS By: Robert G. Antonelli & Matt Brown August 1992 FANCORT INDUSTRIES, INC. 31 Fairfield Place Wes® caldwert, MJ 07005 USS.A, Tel: (201) §75-9610 Fax: (201) 875-9234Been ggsanrn TABLE OF CONTENTS SUBJEC Scope General ‘The Challenges of Fine-Pitch Components Dimensioning & ‘Tolerances ‘Common SMD Package Styles Package/Component Variation Lead Material Thickness and Grain Optional Lead Forms Gullwing Lead Forming Rules of Thumb for Gullwing Lead Forming Common Lead Forming Questions Lead Forming Equipment Glossary of Terme Sources, References, and Credits Appendix A: MIL-$T7D-2000 ‘Appendix B: JEDEC BIA ILLUSTRATIONS: SMD Gullwing Form ‘Typical SMD Lead Forming Dimensions ‘Top, Side, and Bottom Brazed SMD Components Dimensions of CQFP Lead Material Grain at 46° Gullwing, "J" Lead, end Butt Mount Forms Camel Hump Form Minimum Edge Distance Lead CoplanasityOUR PURPOSE: To introduce users of leaded microelectronic packages to practical issues that relate to lead forming and trinming for SHT. 1. scope Since 1973, Fancort Industries, Inc. has been designing and manufacturing ‘microolecteonie package lead forming & timming equipment for fne-pitch SMD components. During’ this time, we have remained at the forefront of new evelopments in package design and SMD lead preparation. It is our intention to fasist ond-users in formulating workable and practical lead-forming. specifications ‘and therefore realistic expectations. We also hope to influence package ‘manufacturers to be more sensitive to the needs of end-users when designing and marketing their products, IT. GENERAL ‘The increased use of fine-pitch devices such as CQFPs, PQFPs, MCRs, TapePak, TAB ‘end. others have forced industry-wide changes in package preparation, handling, and. placement procedures from package manufacturers to. end-users, Demands are increasing. on package manufacturers, chip supplicrs and end-users to provide perfectly formed, coplanar SMDs that conform to the proper footprint Wwith undamaged leads and seals, End-users simply cannot afford to employ crude Jead forming methods, nor can’ they afford labor-intensive lead preparation. In ‘addition, end-users require formed components with leads that are of appropriate Tength, “configuration, and orientation for placement and soldering. By their hature, the required ‘process and product improvements are made gradually: Each package manufacturer and supplier must weigh customer needs against the costs, ‘nd all of this occurs within a highly competitive global marketplace. Figure 1: SMD Gullwing FormTIT, THE CHALLENGES OF FINE-PITCH COMPONENTS ‘Today's microslectronic components incorporate many technological advancements ‘and efficiencies... along with many challenges in thelt usage. Some basic. insies ‘that “serve to inhibit accurate and repeatable fine-pitch device placement and soldering’ are: Low to Mediun Production Volume Package Cost Limited PCB Space Available (Real Estate) Manufacturers’ Part Consistency Positioning and Placement Requirenents for Soldering Specific package problens that directly affect quality and consistency during jad forming: Package Manufacturers Ceramic Poorly Aligned with Lead Frame Inconsistent Meniscus on Metal Packages Excessive ‘Tolerance in Lead-Frame Thickness Inconsistent Lead-Frame_ Gi Lead-Frame Temper Variations Poor Parallelism on Lead Exit Position No Non-Conductive ‘ie-Bars Chip Suppliers Lesd Damage During Testing Poor Package Handling Procedures No Non-Conductive Tie-Bars Package End-Users Lead Damage During Testing Poor Package Handling Procedures Lead Damage During ‘ning Process Improper Forming Too! electionIV. DIMENSIONING & TOLERANCES Perhaps the most critical iste involving the process of lead forming is to develop workable specifications for the formed component. Often, end-users have only the purchased:part drawings published by" the manufacturer. ‘These dimensions and tolerances frequently overlap and are unworkably broad. In order to formulate the applicable lead forming specifications, it is suggested that the following dimensioning. and tolerancing standards be” employed to narrow oF tighten the specifications to a workable sot of numbers: ANSI/IPC-CM-770C IMPORTANT LEAD FORMING DIMENSIONS: TIP-TO-TIP DIMENSION AND TOLERANCE PACKAGE OFFSET HEIGHT AND TOLERANCE FOOT LENGTH AND TOLERANCE LEAD MATERIAL THICKNESS AND TOLERANCE EDGE DISTANCE (SHOULDER) PCB Offset Lead Materiel “Thickness e— 6 Tip-to-Np Foot verall Body Thickness Shoulder Radive Hoel Radius Body Thickness Under Lead Lead Pitch Lead Width a : ie wi +E , iF 1 eee Hm | a. Figure 2: Typical SMD Lead Forming DimensionsV. COMMON SHD PACKAGE STYLES Package manufacturers typially produce f\ne-pitch ceramic components (with broad tolerances) in three atylesi ‘top, side and bottom brazed. — Frequently, this Introduces new problems to end-users who are often forced to Intermix. these braze styles within a given component design. While each lead exit style may have special design characteristics or cost benefits, each also har lead-forming idiosymeracies. Since top-brazed packages are the most popular because of lead complianey, end-users should take into account that. top-brazed packages are subject to greater lead ‘springback’ than elther side-exit_ or botiom-brazed because of the length of the lead. leg. The longer the lead length, the more “springback” one can expect. Although this factor should not be’ considered critics! in package choice, when compounded with lead thickness variations and standoff height tolerances, it compels end-users vo assign realistic tip-to-tip tolerances for SMD components, ‘and to provide adequate real estate for sultable ped contact duting soldering. ‘oP onaze s=T stoe ext OTTOH BRAZE Figure 3: Top, Side, and Bottom Brazed SMB Components 4VI. PACKAGE/COMPONENT VARIATION From lot to lot, dimensional variations will likely occur in both the lead frames fand package bodies. Since form & tim tooling must be designed to accept the largest package within a given tolerance, special attention is required to. aesure that packages on the low end of the tolerance will form. correctly and Consistently. In Figure 4 below, it Is easy to sae that for these dimensions, one lot may vary a great deal from another. For example, the package width dimension (A) hein, oan vary at mich ae 096". This “meant. a powsible variation of up to */-.0125" in’ the formed tip-to-tip dimension (8). "itis because of this variation ‘that Fancort dedicated taols locate quadpacks from the ead frame (L), instead of locating from the component body. Four raised corner posts (castleations) provide location and they are slightly chamfered to Permit easy part placement’ and removal. For 2-sided components, one solution Would be to ‘specify separate neste that’ would accommodate package variations, and in some "instances, a “centering” “device can’ compensate for” minor : Figure 4: Dimensions of CQFP 5 (oterola, Ine.)VIL. LEAD MATERIAL THICKNESS AND GRAIN Jn addition to the risks of transportation, in-house proparation and testing of fino-pitch devices ‘of which rerve to work agalnst dimensional stability = we also -have lead material thickness and grain to consider. Although these Tactors are not likely to be decisive in your package choice, they do” warrant ‘consideration ‘as leads and PCE real estate become smaller and’ smaller. Material Thickness ‘Lead material thickness refers to the overall thickness including plating, tinning, ‘and maximum tolerance. ‘This is very Important because the forming tool must be built with adequate (but not excessive) clearance for the leads. If the material thickness is not correctly specified for the tool, bumishing, scoring, ‘springback, toe angle, and coplanarity may all be sub-standard. Lead Material Grain ‘The material from which lead-frames are made has @ grain similar to that of wood. The direction of this grain, as it relates to the plane of the lead-frame, affects finished part consistency after the form & tim process. A. solution ‘would be for the grain to run consistently in one direction. That ‘is, every lead ‘would be either parallel to the grain or perpendicular to the grain. As an ideal to work toward,” package manufacturers ‘should provide leads etched on a 45° langle that are brezed consistently on all aides. Although this is not a cure-all (because some materials cannot be used if the lead-frame is etched on a 45° bias), material consistency and predictability is desired whenever possible. Lead Material Grain at 45° FigureVELL. OPTIONAL LEAD FORMS ‘Typically, SMDs are mounted .010° - 015° off the plane of the PCB, This clearance is specified to facilitate cleaning and visual inspection under the Components. In some cases, the component is mounted flush to the PCB or on top of a heat sink for thermal dissipation ‘There are basically three styles of SMD lead forms: Gullwing, "J" lead and Butt Mount. The Gullwing ehape has become the style of choice because of compliency,ingpection, and rework; although it takes up more real estate than the "J" bond. There are some variations on the conventional Gullwing, such as the “"Camel-Hump", which increases lead compliancy during thermal expansion or shook. ‘The foot angle may be in the same plane us the body, but depending upon the Placement und soldering 'pfocess, @ toe-down or toe-up configuration may be Preferred. The heel of the foot must be coplanar within the JEDEC standard of He 002", Figure 7: Camel Hump Form Figure 6: Guuwing, “s* Lesa, fand Butt Mount Forms (CE array Teensoiegy)TK, GULLWING LEAD FORMING Proper gullwing lead forming is accomplished by fool design snd reasonable specifications. Lets exami result from footprint layout and_tool design combination of appropriate ‘the variables, which Since PCB real estate is always ata promium, fine pitch package users logically Gesign the footprint. of @ given component tw be as small at possible, This ‘translates into an edge distance (or shoulder’) the tool must use for clamping Prior to forming. If the surface clamping area is too small, it can result in Inconsistent tip-to-tip dimensions, excessive springback, and skewing, It may even cause damage to hermetic seals if there is insufficient clearence. Fancort ecommends a minimum edge distance of .036" from the meniscus or ‘braze point to the centerline of tho radius 035 Figure 8: Minimum Edge Distance Springback and Tip-to-Tip Forming tools are designed for the thickest lead material within the stated tolerance, and so care must be taken by end-users to specify © tolerance on the Lip-to-tip’ that relates to the variations in material thickness. For example, if the operator attempts to form @ component where the leads are thinner than the fool, is intended to process, sprinback will increase the Uip-to-tin dimension ramatically. “In short, as" the lead. thickness tolerance is tightened, so. the overall tip-to-tip tolerance may be tightened. Leg height also has an effect: the longer the leg, the greater the impact of springback.Standoff Height ‘Another problem created by a wide variation in fine pitch package construction is the control of standoff height, oF tho height a component sits above the PCB. ‘This height is critical in some applications because of thermal adhesive bonding, fir circulation for cooling, clearance for cleaning or neighboring components, oF visual inspection. On Figure 4, the reason that dimension "C” has a range from 40" 10-168" is because the package vendor cant precisely control ceramic thickness and lead exit positions. Any. variation in this. body thickness dimension will produce a variation in. standoff height (CH on Figure 4) unless each package is measured prior to forming. Once @ component is measured, Uhe tool’ anvils are adjusted ‘either manually or automatically to produce @ consistent. standoft height. Coplanarity Coplanarity is the relationship between the lead-frame plane and the PCB plane. Most fine’ pitch parts are now machine placed, which requires coplanarity of ‘f= 002", “The “ability to meet. this specification is a function of package onstruction and tool design. If the leads don't exit the package in one Consistent plana, or if the edge distance i too narrow, the formed part may not be coplanar. }4X, VERSUS REFERENCE 2X, VERSUS CALCULATED PLANE PLANE Figure 9: Lead CoplavstityRe-colning Frequently, fine-pitch devices are malformed, or are not coplanar due to handling, shipping, or other reasons. Since fine-pltch components are usual ‘expensive, recovery ie desired, For this purpose, Fancort has developed forming tools which will re-coin malformed components and re-set the standoff height. ann If the tinning process is performed before lend forming, additional variables must bbe dealt with in the forming process. The lead material thickness is increased, fand the surface material is far sofier than standard Kovar or Alloy 42. lead material." More clearance must be provided inthe tool for tinned leads, and feate must be taken £0 the tool doesn't “plow” the tinning material as it forms the leads down, Very precise tinning procedures are required to assure that lead thickness tolerances are maintained: If the tinning showld run thicker than the tool is designed to process, unacceptable lead forms and even potential tool damage may result, Obvioudly, the easiest solution is to specify tinning AFTER. the forming and trimming processes. ‘As this technology requires: special expertise, Fancort recommends the following ‘companies for high-reliaility lead tinning on gullwing-formed SMDs: Cortin, Ine, 2001 Champlain Blvd. Chambly, Montreal, QB, J3L 4W8 Canada ‘514 ‘6589900 Fax 614 658 6800 Corfin, Ine. ‘7B Raymond Avenue Salem, NH 03079 603 69 9900 Fax 603. 895 6500 Vanguard Automation 10900. N Stallard Pl. Suite. 122 ‘Tucson, AZ 85787 ‘602,207 2621 ax 602544 0595, ‘intronies 2122 Metro Circle suite A Hunteville, AL 35801 205.650 0220 ax 205. 6500230 10RULES OF THUNG FOR GULLWING FOOTPRINT LAYOUT 1, Allow for springback of .012" - .016" overall with, @ leg height of -100". A longer leg will produce more springback. 2 Tip-to-tip tolerance of +/- .005" should be considered as standard. To form to « tighter tolerance, be Certain thai reasonable tolerances are given on the unformed component, 3, Minimum edge distance of +/- 036", 4. Bxpect @ log angle of 4? - 5. Minimum foot of 035" from the back of the heel to the toe, 6. For IR soldering, foot is flat or slightly too-up. 7. For hot bar soldering, the foot is slightly toe-down, 8 Minimum bend radius of 1.6 times the material thickness. uxl CON LEAD FORMING PROCESS QUESTIONS: How close can the first bend be to the component: body? Depending on the lead material thickness and pitch, from 036" - .050° minimum edge distance. "There is a positive relationship between increased Clamping area, and tip-to-tip dimension and consisteney in coplanarity and ead “alignment, How close of @ tolerance in the tip-to-tip dimension can one reasonably ‘expect from Fancort equipment? ‘Typically 4/- 005", As low as +/+ 002: Variable factors affecting this tolerance include: 1) Lead exit position 2) Lead thickness variation 8) Total available clamping arce Note: ‘The impact of springback is always greater on top brazed ‘components because of the ley length, and therefore tip-to-tip tolerances may need to be higher. How do you control the standoff height (component height above the PCB)? 1) Manual adjustment. via micrometer-driven wedge on standard form & trim equipment; requires pre- measurement of components. 2) Automatic height adjustment via microprocessor ‘controlled stepper motor on “Floating Anvil’ equipment; no pre-measurement. required, How are components located in the equipment nest when body dimensions vary? Lend-frame registeation on quadpack tools; centering mechanism oF Inverchangeble nests for fuipucks wXIT. LEAD FORMING & TRIMMING EQUIPHENT ‘The following list outlines basic considerations regarding the overall construction, design, and quality of SMD forming and trimming equipment. We recommend You investigate these issies when solecting a vendor. In addition, we have’ listed ‘areas of expertise that are unique to Fancort, followed by a list’ of our standard equipment. Considerations in selecting a vendor: 1. Coplanarity is more consistent because critical die mating sections are constructed from solld block that are EDM (electric discharge machined) for accuracy, 2 Standoff height is consistently maintained by a wedge design on micrometer-adjustable. tools, 3. Custom die shoes with longer bushings are used for increased accuracy and less flexibility than standard die shoes, 4, Maintenance is almost nil because EDM construction means fewer parts 5, Lifters are included on quadpack tools so the components may be easily ‘removed by the operator 6. Centering devices are available on flatpack tools to compensate for component body ‘size variation ‘Customer support is available, along with experiencod engineering advice ‘and footprint design, In addition to meeting the points above, Fancort’s tools also include these features, which result from over 18 years of experience in the field 1, ‘Overbending” is carefully calculated und adjusted to help achieve coplanarity and maintain tip-to-tip dimension. 2 Clamping pressure is correctly applied to obtain the desired lead Ccanfiguration and fontprint dimensions 3. Full protection is provided for hermetic glass seals/braze points. 4 Correct fit, clearances, and materials are employed to minimize lead bbumishing, scoring, nicking, and scraping. 18Fancort’s form-and-trim equipment & services: 1 Universal systems will process flat packages up to 2.50" x 2.50" to almost ‘any footprint. Can handle variations in’ foot length, radii, shoulder Tength, case size, and material thickness. Current modele process fone side oF two ‘sides of the component per stroke, 2 Micrometer-adjustable anvil tools are dedicated systems that allow the ‘operator to. manually adjust standoff height. ‘By manually” pre- fdjusting the anvils, compensation may be mado for variations in lead exit position and ceramic thickness in order to maintain consistent ‘standoff height, 3 Automatic standoff control is accomplished by our patented "Floating Anvil” systems, which incorporate ‘an electronically controlied stepper ‘motor to adjust the forming anvil. These tools measure cach component's actual lead exit position relative to the package bottom, then lock the forming anvils at the correct height to produce a pre-selected standoff, The. standoff can be controlled Accurately and ropeatably to +/- .001". 4 ‘TapePak and TAB. Tools are available for these packages which can stand alone, or the tools may be used in our new Shuttle System that can be integrated to pick-and-place equipment, 5 Non-Conductive-Tie-Bar. Attachment systems are available to remove metal tie bars and install NCTBs, When NCTBs are installed, hhandling damage is much less likely to accur before forming, and lead configuration is easier to control during forming. Typical NCTR material is Kapton or Mylar. 6 Automated form and trim may be accomplished with our series of manual, ‘automatic, and semi-automatic handling systems. Components are Centered, loaded, processed, unloaded, and handled into matrix trays rough various combinations of movement modules operating in "X", "Y'y and "Z" axes, 7 Our new lead forming service is available if a tool purchase is not possible because of manufacturing deadlines or tooling. cost Fancort can turn around small quantitios of packages in less than two weeks and rotum them in our adjustable matrix. trays uuGLOSSARY OF TERMS ‘Avto Height Control SMD Tooling Component standoff height is automatically maintained regard Variations in package lead-exit position and/or Dody thickness. Production ‘application: the use of thermal ‘adhesive Bumishing ‘Lead damage that extends below the surface plating of a leaded ‘component. JEDEC allows 10% of a lead’s surface ares to be bumished land still meet most electrical and reliability standards. Castieations Raleed poste on the four comers of the lower member of » quadpack forming tool. The castleations locate the package from the comer leads. cQFP Ceramic Quad Plat Pack Coplansrity Symmetrical and linear plane along which package leads (feet) are positioned. JEDEC specifies leads that are within 4/- .002" of the reference lesd plane. Die Shoe ‘That section of precision tooling that moves accurately up and down, This section houses the die-set or tool age Distance ‘The section of the lead on a “gull-wing’ bend that extends from the side fof a component to the centerline of the radius. Also known as the fmoulger or the “clamping area’. Blectrie Discharge Machining, A method of metal fabrication utilizing high voltage rather than steel cutters. Floating Anvil See “Automatic Height Control". 6GLOSSARY (courswuea) ‘Tne section of the lead on a “gull-wing” bend that meets the PCR surface pad. Plat Pack. Gull. Wing Leads formed to « SMD configuration via two 90° degree bends. ‘The section of a “gull-wing” bend that is inboard of the lead's foot. |The rear portion of the lower radius of the bend, The position of this bond is critical to successful soldering. “at Leads Leads that when formed are turned under the body of the component. Lead_Complianey ‘A term used to describe the strenth of a lead braze or weld while subject to stress, Leed_Grain Direction of the lead material grain as opposed to the X/Y registration of the lead frame. Temper Relative hardness of the lead mate during’ the production process 11 due to various heat treatments Leg ‘The section of "gull-wing’ bend that is directly above the heel and toe. Mem Multi Chip Module, or "Hybrid". 16GLOSSARY ¢covriwuea) Molded Carrier Ring. A package type in which the lead frame and package body are molded in one piece, facilitating easy assembly. throuch tte une of metal tape ‘The seal for packages with center exit leads, Frequenty glass and usually hermetically sealed. Nore Non-Conductive-Tie-Bar Package Carrier, usually metal or plastic, which houses the chip or MOM. PQFP Plastic Quad Flat Pack Pitch Distance from lead center to lead center. gre Quad Flat Pack. A. microel sides, ctronic package whose leads exit on four Estate ‘Tee amount of room available to mount components on a PCB. Like mid- town Manahttan, always ata premium. Shoulder See "Rage Distance” X/¥ misalignment from lead to lead, Likely cause; component construction/design, malfunctioning form tool, or poor handling, ”GLOSSARY (comrsweo) Surface. Mounted Device sur Surface Mount Technology Specifically when the toes of lends Lead tip-to-tip distance that @ given lead-frame will move after forming & cutting. Physical variables include: lead thickness and temper, lead ‘material, nd overall length. Standoff Height ‘That distance botwoen the PCR surface and the bottom of a component, ‘Also Inown as the package “offset TAB ‘Tape Avtomated Bonding TapePak Package configuration thet uses a Molded Carrier Ring to arrange production lots on metal "tape". Patent: National Semiconductor Corp. ‘Tp-to-Tp Component footprint. “mean” dimer PCR pate for earrect soldering. jon, necessary in designing layout of ‘The outer end or tip of a “gull-wing” bend, otherwise known as “out imension for purposes of component placement and position. 16GLOSSARY ¢covrimues) ‘Tos-Down Lead profile, after forming, when the lead toe rests on the PCE, This configuration is most effective when “Hot-Bar" soldering Up Lead profile, after forming, when the lead heel rests on the PCB. Commonly specified for "reflow" soldering. ‘Top, Side, or Bottom Breze Lead exit position with reepect to the package body. 19Source ANSI/IPC-CM-7700 BIA JEDEC ‘MIL-S7D-2000 ‘MIL-STD-28510 WS-6536, Lead Springback, ‘Equipment Construction and Features ustration Lead Coplanarity iustration: Dimensions of COPP, lusteation: J Lead, and Butt’ Mount Forms SOURCES, REFERENCES & CREDITS: Publication & Revision C, January 1987 Institute for Invorconnecting and Packaging 7880 N. Lincoln Ave., Lincolnwood IL 60646 Solid State Engineering Council Pub. #95 dated 9/89 JEDEC/Electronic Industry Association EIA Washington, DC 20008 US Government Publication, DOD US Govt. Printing Office, Washington, D.C. Fancort Industries, Ine. West Caldwell, Ni 07006 ‘Ted Staviski, Chief Engineer Richard Tensen, Manufacturing Manager Phillip. Mursford C. Charles Hutchins & Associates, Inc. Po, Hox 90399 Raleigh, NC 27622 Motorola. Semiconductor Military Produets Operations 2100 East Elliot Road ‘Tempe, AZ 5284 TOE Array Technology % 20APPENDIX A 00-579~2000~2 20 NOVENGER i986 5. jl:10.3 Lead seatine for planar mounted’ flatoacks. Leads shal? be peated such that the heel to terminal area relationsnip small contors to Figure 43; Leads shall be seated such that there 1s no side overnang. Toe oyerhang (see Figures 44 and 45) is acceptable provided that the reqvirenets -10.3.1 through §.1.1,10.3.6 are met. of si, Nyy mam 2} ACCEPTABLE FIGURE 43. Heel mounting requirements for ribbon leads (see §.1.1.10. §.1;1-10:3.1 The length of lead contact shall be a minimum of 150 per= ent of the width (see figures 44 and 48). 5.1.1.10-2.2 Toe overhang is permissible provided that it does not fygeed 25 percent of the wigth or dianeter of the lead and the spacing to adjacent conductive elenents remains greater than the minimums seecitves*in paragraphs 4.2.1.1 and 4.2.1.2 (see figure 44). L_—zsrentenr wono ma. FIGURE 48. Toe overnana Vimits for ribbon teads a00-sT0-2000-3A ‘30 APRIL 1987 moran oETweEN sero cower oF Lowen aso 8 athe nat MaxiMUM ACCEDTAR wn ACCEPTABEE NEEL MLLET Mee Hi E F + agus 1 pao oaro0-srD-2000-28 20 NOVEMBER 1586 \ >A _ ie ia SNS ee FONE $1. Conftauration of riahon leads for planar ountes fTacoacks (see 5. Gontiouration of cithon Leads for through toe mounted HlatoacKs (see 5.APPENDIX 8 Tee Te 45a BEEF oenesona DATUM PLAN fe i i} c nase, AL PLANE, SEATING PLANE coe FIGURE PRINCIPAL DIMENSIONS & DATUMS re gesssacane| ae |] MO-082SE @[cPO-20n5) coi ee Tae FIGURE 2 BODY DETAILS cae~| oe ee, | MO-082> I (ez bt 4 929/033 we“ apazaia N PLES a etic a [el =toe © |¢/A@-3O10) FIGURE 3. TERMINAL DETAILS & ee ar [ euiasoz0 2088/008 Susase~| ===) M0082 coum gate peomer | "Me Etbet SEP ae ahae| ey | Peo(DEPICTING ACTUAL PACKAGE OUTLINE CONFIGURATION? LID SHOWN FOR RECOGNITION CNLY sare. | sur son iieemer Mo cis a9 cr oo cra EF Es ae GeO sia UUCUU OOOO ——— CAVITY UP LEELA | l MO-082 2: VARIATIONS as nmensrans mi an o z AA Fy AB t AC 3 aD ig f : : 13 L_| MIN. | MAX. & | MIN, | MAX. | & | MIN, | Max. | & | MIN. | Max, | A | 454 154 | 194 454 | 94 as4 | a94 4,| 920 20 | 940 ceo | 040 seo | 040 D'| 675 4] o75 | zes | 4] a7 | ees | 4 | 075 | wes | 4. Di} 460 37| 60 | 600 |s7] .cco | 700 |s7| eco | 200 |s7! D3| 00 500 REF 600 RE: 800 REF E | 67s 4| 775 | 7es | 4] 975 | ses | 4 | 1075 | 198s | «4 E,} 460 s7| seo | 600 |s7) 660 | 700 |57| .60 | .900 E5| 400 500 REF 600 REF 800 REF Li} s20 20 | .030 20 | 030 20 | 930 N 34 100 we VARIATIONS ate ammensions ny maumerers AB AC 4 MIN. [MAX.| ¢ [ MIN. | MAX.| € | MIN | MAX. A MIN. | MAX. 5 ¥ ™ 2 o L = A | ase | ase ase | 492 ase | 492 ase | 492 Ay} ost | uo ost | tor ost} 101 ost | 10 D | tas | 17.39 | 4 | 1969 | 19:99 | 4 | e223 | 2247 | 4 | e7a | 275s | 4 D D. E E 7 C N ings | i270 [57] 12a | i524 |'s7) 16277 | w70|s7| aves | 220s |57] 1046 REF 1270 REF 1824 REF 2038 REF was | as] | ise | 1993} | ezza| zea7| | azn] eres] | | uss | 1270 | «| sea | sea | 4 | 16.77 | v7.70 | 4 | exes | 2206 | + 1016 REF | 57| we70REF |57| iseeRrer |s7) e0a2RE [57 ost | a76 asi | a76 asi | 076 ast | a76 68 84 100 132 | ae gifres | asesasczse| oy lpe,| MO-082 26| | | | | $ y 3 AE i AF, | u_[wn. [Max.] Fain, Tmax. 354 | 94 asa | 384 ‘seo | 240 veo | 040 ul u2es | 4 | 1475 | 1485 1060 | 1.200 x60 | 1300 | L000 REF 1.200 | 1275 | sees | 4] ia7s|iaes| 4) | | toso } 1200 |5:7| 1260 | 300 | 57 | L000 REF L200 REF seo | 030 azo | 220 | 16 6 | =| i ¥ VARIATIONS ae pmenstons mm mnLumevers M a [ae F AF ra 3 5 ] $ : $ t_ [urn [max.| ¢ Pin. [max] é [win Tmax] é | man. Tax. | & j ase | 492 392 | 492 seas | se6a| 4 | a77 | 977 | 4 2540 REP sows ar || seas | 3263 3747 | a7 || | zesa | 2784 | «| sem | 3302 | « | | 25.40 REF | 57] 9048 REF | 57) | asi | 076 asi | a76 | | | | 164 196 | we giieen [ro ges reau ansem| SAP MO-082 2PP PP PP PPB NOTES: LL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5N~1982. DATUM PLANE [FAR] IS LOCATED AT THE UNDERSIDE oF LEADS, WHERE CEADS ExIT PaCRAGE BDLY, DATUMS [A-B] AND TO BE DETERMINED WHERE CENTER LEADS EXIT PACKAGE BODY aT DATUM TO BE DETERMINED AT SEATING PLANE [EG=] DIMENSIONS Dy AND £; DEFINE MAXIMUM CERAMIC BODY DIMENSIONS INCLUDING GLASS PROTRUSION AND MISMATCH OF CERAMIC BODY TOP AND BOTTOM, DETAILS OF PIN t IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONES INDICATED. THESE DIMENSIONS TO BE DETERMINED AT DATUM PLANE CH) CONTROLLING DIMENSION: INCH THIS OUTLINE IS FOOTPRINT COMPATABLE WITH THE O25 INCH PGFP ITEM MO-069, ALL BODY DIMENSIONS ARE_IN COMMON WITH 050 INCH CQFP JEDEC ITEM 10-255, SOME FOOTPRINT DIMENSIONS ARE IN COMMON WITH 050 INCH PQFP JEDEC ITEM 11-231, asdigone [vo meseeca anaes| we |, MO-082 30INSTRUCTIONS FOR SPECIFICATION DATA SHEETS FANCORT INDUSTRIES, INC. MARCH, 1994 ‘The following is a guide to help you £111 out our Quad Pack and Flat Pack Spec Sheets. Please call us if you need further information or technical assistance A oft stand- of ~ This dimension is usually 015 for Military and Aerospace applications, or may Sometimes include clearance for a heat sink.” On the tool, this dimension is adjustable with a micrometer, usual, tolerance is + .002, Ta only noted on our Universal Spec sheeta, It is a reference from the body of the device to the first bend. LEAD_MATERIAL THICKNESS - is the total thickness including plating. This is a very critical dimenaion, and enormously effects spring-back foot position, burnish (on the leg), and your tip-to-tip "D" tolerance. ‘The smaller the range the better. Usual tolerance here is + .002 TIB-70-TIE - This is the actual size of the device after form and trim, This dimension includes spring-back and all cumulative tolerance. Usual tolerance here is + .008 HOOT OPTION #1 - 16 the total foot length that will encounter solder tolerance here is 4 .005, minimum size here is about .040 - Ts the JEDEC style of measuring. This is a more accurate way of specifying this dimension. Typical dimension here is .025 and the tolerance should be 4/008. overall body thickness should include covers and or heat sinks. Pleage use or send us the manufacturer's case drawings to eliminate confusion Radiius Upper and Lower. This is a general rule. G & H = 22/2 X your maximum material thickness *C*, Here should be about 2 X your material thickness "C" aJ. BODY THICKNESS under the lead. Refer to "P". We need a tolerance here of + .005. K/t, LEAD PITCH. This is important to lay out the tool. We heed to know the pitch and total pin counts per side, as Well ag the manufacturer's lead frame drawings. AlsS, the width of the lead "L" is equally important. LOWER TAR - Note, for anall two-sided flat pack only. BODY WIDTH - Hopefully 2 .007. Y¥. BODY LENGTH - Note: For two-sided flat packs only. Leads per side, Also if package orientation (up or down) is important. + otal # of leade. It ie important to highlight if this is square or rectangular. Note, for rectangular, use dimension "x" and dimension "Y" on the’ quad sheet. LBADS_TINNED - is important to note, and be sure t add this tolerance range and thickness to your "C" dimension. Metal with glass seals requires a much greater shoulder "3" Ginenaion. ‘Ceramic can be as low as .030 and plastic parts might be acceptable down to .010 ref. or a .017 typical range. LEAD TYPE - Flat leads are standard to our tools. Round Leads generally require more spring pressure and stepped pressure pads to reduce coining. The radiius should be Phereased on round leade to.2 X/e - 21/2 X 'C" and flatting within mil-apec (10 per cent) should be expected. Please Rote the *B" dimension should be extended as much as possible. (The same as with a metal package.) . ‘TOE UP OR DOWN - As we have been lead to believe, most euatoners using hot bar soldering want the toe’s'0 degrees flat to 2 degrees toe down. ‘This dimension can be held fairly accurate if the "C" dimeneion is maintained +- .001: For custonera doing IR oven the typical foot position has bean 0 degrees flat to 2 degrees toe up. PACKAGE TYPE: Top braze, side exit and bottom exit are important to produce consistent "D" tip-to-tip dimensions of 008. If a top brazed and bottom brazed are to be used in the same tool, the tip-to-tip tolerance should be +- .020 maximum + .015 minimum 2bel QWS 1HS te L AINNA33HS NOILVOISII3dS MOVd LWI4 ‘OUT’ S8TULSNpUT Tuosuey