218 3.131 ‘The extent to which the ip condition alfects the ther mal performance of afin depends on the fin geometry and thermal conductivity, as well as the convection coefficient. Consider an alloyed aluminum (k= 180 Wim-K) rectangular fin of length L = 10 mm, Ubickness ¢ = Imm, and width w #1. The base tem perature ofthe fn is 7, = 100°C, and the fin is exposed toa fiid of temperature 7. = 25°C. (@) Assuming a uniform convection coefliient of = 100 Wim K over the entre fin surface, deter- mine the fin heat transfer rate per unit width q, Cffcieney 2, effectiveness sj, thermal resistance per unit width A, andthe tip temperature TL) for Cases A and B of Table 3.4, Contrast your results ‘with those based on an imate n approximation JExplore the effect of variations in the convection ‘coefficient on the heat rate for 10-< h< 1000 Wim#-K. Also consider the effect of such vara tions fora stainless steal fin (= 15 Wim“). ‘A pin fin of uniform, cross-sectional area is fabricated ‘of an aluminum alloy (k= 160Wim-K), The fin diameter is D = 4mm, and the fin is exposed to con- veetive conditions characterized by f= 220 Win?-K. Wis reported that the fin efficiency is ny = 0465. Deter mine the fin length £ and the fin effectiveness «> ‘Account for tip convection, ‘The extent to which the tp condition affects the thermal performance of a fin depends on the fin geometry and ‘thermal conductivity, as well as the convection coef ent. Consider an alloyed aluminum (k = 180 Win-K) rectangular fin whose base temperature is T, = 100°C, ‘The fin is exposed to a Huid of temperature T. = 25°C, and a uniform convection coefficient of A= 100 WK may be assumed for the fn surface. (@) For a fin of length L= 10mm, thickness 1 1mm, and width w > 1, determine the fin heat transfer rte per unit wid q), efliieney mp effec tiveness gp thermal resistance per unit width Rip, and tp temperature TIL) for Cases A and B of ‘Table 3.4. Contrast your results with those based ‘on an inne» approximation, Explore the eect of variations in Lon the heat rate for 3 << 50 mm. Also consider the eflect of such ‘variations fora stiles steel fin (k= 15 Wim: K), ‘A straight fin fabricated from 2024 aluminum slloy (= 185 Wim: K) has a base thickness of = 3 mm and a length of L = 15 mm. lis base temperature is T, = 100'C, and it is exposed to a fluid for which T. = 20°C and h~ 50 Wim?>K. For the foregoing ‘conditions and a fn of unit wie, compare the fin heat 3132 333 31M 337 338 Chapter 3 = One-Dimensional, Steady-State Conduction rate, eficiency, and volume for rectangular, triangular, and parabolic profiles [Triangular and parabolic straight fins are subjected to ‘the same thermal conditions asthe rectangular straight fin of Problem 3.134. (@) Determine the length ofa triangular fn of unit width and base thickness ¢= 3mm that will provide the same fin heat rile as the staight rectangular fin. Determine the ratio of the mast of the tangular straight fn to that of the retangular stright fin (©) Repeat part (a) fora parabolic straight Gn “Two long copper ods of diameter D = 10mm are sal- ered together end to end, with solder having a melt- ing point of 650°C. The rods ace in air at 25°C with a convection coeflicient of 10.Wimn’K. What is the ‘minimum power input needed to effect the soldering? Circular copper rods of diameter D= 1mm and length L = 25mm are used to enhance beat transfer ‘rom surface that is maintained at T,y = 100°C. One end of the rod is attached to this surface (at x = 0), ‘while the other end (x = 25 mm) is joined toa second surface, which is maintained at T,, = O°C. Aie owing between the surfaces (and over the rods) is aso at a temperature of T= 0°C, and a convection coeicient cof k= 100 Wim-K is maintained, (a) What is the rate of heat transfer by convection from a single copper rod to the air? (©) What is the total rate of heat transfer from a Im x Im section of the surface at 100°C, if a bundle of the rods is installed on 4-mm centers? During the inital stages ofthe growth of the nanowire of Problem 3.109, slight perturbation of the liquid catalyst droplet ean cause it to be suspended on the top of the nanowire in an off-center postion. The resulting ronuniform deposition of solid at the solid-liquid interface can be manipulated to form engineered shapes such asa nanospring, that is characterized by a spring radius r, spring pitch s, overall chord length F (leagth running along the spring) and end-to-end length L, as shown in the sketch, Consider a silicon carbide anospring of diameter D = 15am, r= 300m, 5 25 nm, and L, = 425 nm. From experiments, itis known that the average spring pitch s varies with average tem= perature T by the relation dsid = 0.1 nm/K. Using {his information, a student suggest that a nanoactuator cean be consinicted by connecting one end of the ‘nanospring to a small heater and raising the tempera ture ofthat end ofthe nano spring above its nial value. Calculate the actuation distance AL for conditions where = 108 Wim!+K, 7. = 7, = 25°C, with a base3.139) 3.140 = Probleme temperature of 7, = SO°C. If the base temperature can be controlled to within I°C, caleulate the accuracy to Which the actuation distance can be controlled. Hint: Assume the spring radius does not change when the spring is heated, The overall spring length may be approximated by the formals, 3k UVF wae L Consider two long, slender rods ofthe same diameter but different materials. One end of cach rod is atuched toa base surface maintained at 100°C, while the surfaces of the rods are exposed fo ambient air at 207. By traversing the length of each rod witha ther- rmocouple, it was observed that the temperatures of the rods were equal atthe positions x, = 0.15 m and (0.075 m, where x is measured from the base sirface. IF the thermal conductivity of rod A is known, to be ky = 70Wim + K, determine the value of ky for rod B. ‘A 40-mmm-long, 2-mm-liameter pin fn is fabricated of sn aluminum alloy (& = 140 Wim K), (@) Determine the fn heat transfer rate for T= SO°C, T. = 25°C, h = 1000 Wim *K, and an adiabatic tip condition, ‘An engineer suggests that by holding the fin Gp at a Tow temperature, the fin heat ransfer rate ean be increased. For Tix = L) = 0°C, determine the new fin heat transfer rate, Other conditions are as in part. Plot the temperature distribution, TU), over the range 0x for the adiabatic ip case and lhe presribed Gp temperature case, Also show the ambient temperature in your graph. Discuss relevant eatures ofthe temperature distribution. © © (@) Plot the fin heat sansfer rate over the range 0. k= 1000Wim'-K for the adiabatic tip case and the prescribed tip temperature ease, For the prescribed tip temperature case, what would the 219 calculated fin heat transfer rate be if Equation 3.78 were used to determine q, rather than Equa tion 3.762 AMIAL_ An experimental arrangement for measuring the ther- ‘mal conductivity of solid materials involves the use of two long rods that ate equivalent in every respect, ‘except that one is fabricated from a standard material fof known thermal conductivity ky while the other is fabricated from the material whose thermal conduetiv- ity fy is desired. Both rods ae attached stone end to-a heat source of fixed temperature T;, are exposed to a fluid of temperature T., and are instrumented with thermocouples to measure the temperature at fixed distance x, from the heat source. Ifthe standand mater- ial i aluminum, with ky = 200 Wim K, and measure ‘ments reveal values of T, = 75°C and Ty = 60°C at for T, = 100°C and T= 25°C, what is the thermal ‘conductivity ky ofthe test material? Fin Systems and Arrays 4B 142. Finned passages are frequently formed between paral- lel plates to enhance convection heat transfer in com- pact heat exchanger cores. An important application is in electonic equipment cooling, where one oF more air-cooled stacks are placed between heat-dissipating electrical components. Consider a single stack of rex. ‘angular fins of length L and thickness ¢, with convee- tion conditions coresponding toh and T., F200 mm, > tl a (a) Obtain expressions for the fin heat transfer rates, jo ad gi. in terms of the base temperatures, T, and Ty, (©) In a specific application, a stack that is 200mm ‘wide and 100mm deep contains SO fins, each of Tength L ~ 12 mm. The entice stack is made from aluminum, which is everywhere 1.0mm thick, If temperature limitations associated with electrical ‘componens joined to opposite plates dictate mani- ‘mum allowable plate temperatures of T, = 400K220 and T, = 350K, what are the corresponding maxi- ‘mum power dissipation if = 150 Wim?-K and 1. = 300K? 3.4143 The fin aay of Probl in compact heat exchangers, whose function is 10 provide & large surface area per unit volume in trans: {erring heat from one fluid to another. Consider con- ditions for which the second fluid maintains equiva Tent temperatures at the parallel plates, T, = Tis thereby establishing symmetry about the midplane of the fin aay. The heat exchanger is 1m long in the irection of the low of air (Fist Muid) and 1 m wide in a direction normal to both the airflow and the fin surfaces. ‘The length of the fin passages between adjoining parallel plates is L= mm, whereas the fin thermal conductivity and convection coefficient are = 200 Wim-K (shuminom) and ft = 150Wim?+K, respectively. (@) If the fin thickness and piteh are ¢ Imm and $= 4mm, respectively, what is the value of the thermal resistance R,, for a one-half section of the fin acray? | Subject co the constraints thatthe fin thickness and pitch may not be less than 0.5 and 3 mm, respec: lively, assess the effect of changes in rand S. 34144 An isothermal silicon chip of width W = 20 mm on a Side is soldered to an aluminum heat sink (k= 180 Wim) of equivalent wid. The heatsink has a base thickness of L, = 3 mm and an aay of retangy lar ins, each of length Z~ 15 mm. Anfow at 7. ~ 20°C is maintained throtgh channels formed by the fins anda cover plat, and for a convection coefficient fof k= 100 Win’-K, a minimum in spacing of 1.8 mm is ditated by limitations on the low pressure ‘op. The solder joint has a thermal resistance of Bic 2107 KW. Chip. Te ae Coverite Chapter 3 = One-Dimensional, Steady-State Conduction (@) Consider limitations for which the amay has 1N'= 11 fins, in which case values of the fin thickness 1 0.182 mm and pitch § = 1.982 mm are obtained from the requirements that W'= (= 1)S +1 and S—1= 18mm. If the maximum allowable chip temperature is T_= 85°C, what isthe corresponding value of the ehip power q.? An adiabati in tp eon- dition may be assumed, and airflow along the outer surfaces ofthe heat sink may be assumed to provide ‘a convection coeflicient equivalent o that associated ‘with airflow through the channels vith ($0) and h fixed at 18mm and 100 ‘Win? K, respectively, explore the effet of increas ing the fn thickness by reducing the mumber of fins With N= 11 and S—4 fixed at 18mm, bot relaxation of the constraint on the pressure drop, explore the effect of increasing the airflow, and hence the convection coefficient, {MAS As scen in Problem 3.109, silicon carbide nanowires of diameter D = 15 nm can be grown onto a solid silicon carbide surface by carefully depositing droples of cata: Ist liquid onto fat silicon carbide substrate. Silicon ctbide nanowires grow upward from the deposited drops, and if the drops are deposited in a pattem, an array of nanowire fins ean be grown, forming a silicon carbide nano-heat sink. Consider finned and unfinned clectonics packages in which an extremely small, 10pm X 10m electronics device is sandwiched bperwoentwod - 100-m-thick silicon cabide sheets In ‘oth eases, the coolant isa dielectric liquid at 20°C. A beat transfer coefficient of k= 1 % 10° Wim? K exists ‘on the top and botiom ofthe unfinned package and on all, surfaces of the exposed silicon carbide fins, whieh are cach L = 300 am long. Fach nano-heat sink includes 3 200 X 200 array of nanofins. Determine the maximum allowable beat rate that can be generated by the elee- twonie device so that its temperature is maintained at 7,< 85°C forthe unfnned and finned packages. Th Unsinnes= Probleme 3.46 As more and more components are placed on single integrated cieuit (chip) the amount of heat that is dissipated continues to increase, However, this increase is limited by the maximum allowable chip operating temperature, which is approximately 78°C. To maximize heat dissipation, i is proposed that a 44 array of copper pia fins be metallurgi- cally joined to the outer surface ofa square chip that is 12.7 mm on a side, Tevew infin Dy chi, ah Contet = \ Rake Bow be (a) Sketch the equivalent thermal circuit for the pin— hip-bourd assembly, assuming one-dimensional, steady-state conditions and negligible contact resistance between the pins and the chip. In var able form, label approprile resistances, tempers tures, and heat rates, () For the conditions prescribed in Problem 3.27, What is the maximum rate at which heat can be Aissipated inthe chip when the pins are in lace? ‘Thats, what isthe value of q, for T; = 75°C? The pin diameter and length are D,~ 1.5mm and 115 AA homeowner's wood stove fs equipped with 2 tp bbumer for cooking. The D = 200-mm-dimter burner is fabricated of eas ison (& = 65 Win-K). Toe botomn {combstion) sie ofthe burner has 8 seaight fas of uni for cross section, aranged as shown in the sketch. A ‘very thin cera coating (e = 05) applied to al sur foes ofthe bume. The top ofthe bumer is exposed to room conditions Tuy = Toy ~ 20°C, = 40 Win“), ‘while the botom of the bums s exposed o combs tion condition (Tapp = T= = 450°C, hy, = 50 Wis. Compare the top surface temperate of the finned ‘ume to that which would exist for a burner without fins. Hint: Use the same expression fr radiation beat transfer tothe boom of the finaed bums a8 for the ‘ume with no ins restores, 221 [Euifi]in Problem 3.146, the presribed value off 1000 ‘Wie -K is args and characteristic of isi ootng In rosie it would be far mor preferable ou ai coal [ng for which aretonale upper lini ote env: tion coefficient would be h, = 250 W/mK. Assess the effet of changes in the pin fin geometry onthe chip heat rat if the remaining conditions of Problem 3.146, incading a maximum allowable chip temperanxe of 75°C, remain in effect. Parametric vation that may coms inl the tol number of pins in the square aay the pin diameter Dy andthe pin length Ly However, the product ND, should not exceed 9 mm to ensure adequate tirfow passage through the ay Recommend design tit nhances chip colin ‘Water is heated by submerging S0-mm-diameter, thin ‘valled copper tubes ina tank and passing hot combus- tion gases (T, = 750 K) through the tubes. To enhance heat wansfer to the water, fou straight Gas of uniform ‘ross section, which form a eross, are inserted in each tube. The fins are $ mm thick and are also made of copper (k= 400 Wim K). If the tube surface temperature is T, = 350 K and the ‘gasside convection coeficient is y= 30 Wim'>K, hat isthe rate of heat transfer tothe water per meter of pipe length? 3.1580 As a means of enhancing heat transfer from high- performance logic chips, it is common to attach a