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SERVICE MANUAL

Electrocardiograph

FX-2111

4R2043

FUKUDA DEIMSHI CO., LTD.


Copyright © 1997 by Fukuda Denshi Co., Ltd.
No part of this document may be copied
or transmitted in any form without
the prior written permission of Fukuda
Denshi Co., Ltd.

Manufactured in Japan
Foreword

A
We list up here the warning marks used in Fukuda operation and
service manuals.
When you sen/ice the FX-2111, read this service manual thorough-
ly and pay attention especially to instructions bearing the fol-
lowing marks:

Warning Marks
Warning marks used in operation and service manuals and labelled
on the instrument have the following meanings:
Read them carefully to understand the meanings and make sure of
the significance of each particular.

A
This mark is used to indicate the direct hazards

Danger which may lead to the death or serious injury of the


person, may wholly damage the instrument, or may
cause fire hazard, unless the instructions written
there are followed.

A This mark is used to indicate the indirect potential


Warning hazards which may lead to the death or serious injury
of the person, may wholly damage the instrument
or may cause fire hazard, unless the instructions
written there are followed.

A
This mark is used to indicate the possible hazards
Caution which may lead to a mild or medium injury of the
person, may partially damage the instrument or may
erase data from the computer.

NOTE "NOTE" is not warning instructions but offers infor-


mation to prevent the person from doing erroneous
sen/icing.

Other Marks

0 Notice to indicate general unspecific prohibited


matters.

Notice to indicate general unspecific caution, warn-


A ing or hazard.
This service manual describes technical information on FX-2111 to
aid the service engineer in troubleshooting.
The manual is intended to be used by service engineers of Fukuda
representatives and authorized technical staff concerned with medical elec-
tronic equipment. Description includes repairing and assembling methods
of each component unit of FX-2111. For parts lists and diagrams, refer to
the Part II of the service manual.

The service manual consists of the following nine chapters:


1. General Description
The outline of FX-2111, specifications, controls and indicators are
described.

2 . Circuit Description
Circuit configuration and functions are explained.
3 . Troubleshooting
Troubles vs. causes and countermeasures are described.

4 Maintenance
.

Procedures to replace the power fuse, ROM and battery and to perform
self-test are described.

5 . Periodical Inspection
Inspection procedures to prevent troubles and ensure safe and com-
plete operation of the instrument are described.
6 . Circuit Diagrams
7 . Assembly Diagrams
8 Electrical Parts Lists
.

9 .
Structural Diagrams

A Caution
. Never remodel Fukuda medical electronic equipment
0 .

. The service manual is intended for the service


engineers of Fukuda representatives and the techni-
cal staff concerned with medical electronic equip-
ment. Servicing, reassembling, and adjustment shall
be performed by authorized service engineers.
. Prepare proper facilities and tools when servicing .

. Be sure to follow the instructions of operation manual


when operating the instrument. For operating precau-
tions, refer to the operation manual.

ii
A Servicing Precautions
A Cautions listed below are the instructions of prohibit danger, warn-
,

ing, and caution described in this service manual. When taking the
procedure bearing the following mark, read the description thoroughly,
then start the task.

A Caution (page 3-2)


When checking the power supply and related circuits for troubleshoot-
ing, take sufficient care to avoid a short circuit.

A Caution (page 3-3)


When checking power fuses, be sure to turn the power off and discon-
nect the power plug from the wall outlet beforehand.

A Caution (page 3-8)


The inserting part of key connector is made of carbon. Avoid frequent
repeated disconnection and connection.

A Caution (page 4-1)


When replacing power fuses, be sure to turn the power off and discon-
nect the power plug from the wall outlet beforehand.

A Caution (page 4-1)


When replacing the ROM, be sure to turn the power off. Also, take care
to install the ROM in correct position.

A Caution (page 4-2)


When replacing the battery, be sure to turn the power off and discon-
nect the power plug from the wall outlet beforehand.

iii
A Caution (page 4-6)
Disassembling/Reassembling Precautions
Be sure to disconnect the power cord and make sure the instrument
is turned off before disassembling or reassembling.
. Do not remove the battery before disconnect any PC board .

Take care that repeated disconnection of the key panel and sensor
board may result in poor contact.
Use proper tools to loosen screws.
. When reassembling make sure that all screws are securely tight-
,

ened and all connectors are completely inserted.


PC Board Handling Precautions
. PC boards are equipped with highly sensitive components to static
electricity.
. PC boards are highly sensitive electronic devices Put removed PC
.

boards in a proper protective bag or take appropriate measures to


protect them.
Handle PC boards carefully. A shock to them may damage the com-
ponents.
Never insert a connector to the powered PC board nor remove the
powered PC board.

A Caution (page 5-2)


If you find a value which exceeds the allowable level, be sure to let
the user avoid using the FX-2111. If the user operates the FX-2111 as
it is, he/she may receive an hazardous accident.

Equipment Classification
The FCP-2155 is classified into the following equipment:

1 . Protection against electrical shock


Class I

2 . Type against electrical shock


Applied part: Type CF
3 . Degree of protection against harmful water invasion
Other equipment
4 . Degree of safety in using under air-inflammable anesthetic gases or
oxygen/nitrous oxide-anesthetic gases
Equipment used under an environment containing no inflammable
anesthetic gases or no inflammable cleaning agent.
5 . Running mode
Continuous running mode

iv
CHAPTER
1
General Information

1 Outline of the FX-2111


.
1-1
2 . Specifications 1-1
2 1 Electrocardiograph Section
. 1-1
2 2 General
.
1-2
23
.
Environmental Conditions 1-2
3 Controls and Indicators
.
1-3
3.1 Top Panel 1-4
3 2 Side Panels, Left and Right
. 1-4
33 .
Bottom Panel 1-4
1 Outline of the FX-2111
.

The FX-2111 is the easy-to-use single-channel electrocardiograph


featuring a simple operation panel. The compact yet high-performance
design makes it suitable not only for use in the consultation room but
'

also for-carrying in a visit to the hospital ward or patient s home and


examination at an emergency site.
It has a high-density thermal dot printer incorporated to provide clear
ECG recording. The FX-2111 can operate on either AC line or rechargea-
ble Ni-MH battery.

2 . Specifications
2 . 1 Electrocardiograph Section
Input circuit: Floating from the ground
Leads: Standard and Cabrera 12 leads
Input impedance: 20MQ min. (referred to 10Hz)
Input circuit current: 5x10"8 max.
Calibration voltage: 1mV within ±5%
Common mode rejection: 10mm or less per IEC 62DC06 test
method
Polarization voltage: ±300mV min.
Time constant: 3 2 sec min.
.

Sensitivities: 1/2, 1 and 2 cm/mV


Frequency response: 0 05
. to 150Hz (within -3dB)
AC filter: 50/60Hz, -20dB or lower
Muscle filter: 35 to 45Hz, -3dB (-6dB/oct)
DC input: 10mm/0.5V, unbalanced, 100kfi min.
Display: Liquid-crystal display, 20 chars, x 2 lines
(character: 5x7 dots)
Recording system: Thermal dot printer, 8 dots/mm
Paper speeds: 25 and 50 mm/sec within ±3%
Chart papers-
Roll paper: 63mm or 50mm wide x 30m long
Z-fold paper: 63mm or 50mm wide x 20m long,
75mm/fold
AID conversion: 12 bits
Sampling rate: 1ms

1-1
2 2 General
.

Safety: I EC 601-1 Class I


.Type CF
. Internally powered equipment Type
CF (IEC 601-1)
Power requirements-
AC operation: 115V AC, 50/60H2; 19VA max.
230V AC, 50/60Hz; 19VA max.
DC operation: 9 6V, 7W max. (rechargeable Ni-MH
.

battery)
Continuous operation: approx. 120 min
at 20oC (according to IEC 62D Testing
Method)
Charging time: within 3 hours
Dimensions: 26 (W) x 18.2(D) x 6.3(H) cm
Weight: Approx. 1.7kg (excluding battery)

2 3 Environmental Conditions
.

Operating-
Temperature: 10 to 40oC
Humidity: 30 to 80%RH (no dew condensation)
Atmospheric pressure: 70 to 106kPa
Transportation & Storage-
Temperature: -10 to 40oC
Humidity: 10 to 95%RH (no dew condensation)
Atmospheric pressure: 70 to 106kPa

1-2
3 Controls and Indicators
.

Top Panel

X Liquid-crystal Display

31 -

k »

@ Paper Magazine (D Operation Panel

Left Panel Right Panel

® Potential Equalization o«
Terminal
0
0 0
© Power Connector

F3 © Main Power Switch


D @ DC Input Terminal

Q © Lead Connector

Bottom Panel

@
o o
{
*

I i<
© Rechargeable feattery Room
"

iii
© Fuse Holders 0

§)
~

0
~

® 0

1-3
3 1 Top Panel
.

© Display: Indicates current status such as recording mode, lead, sensitiv-


ity, heart rate, or program setting.
© Operation Panel:
ON Turns the FX-2111 on in DC operation.
OFF Turns the FX-2111 off in DC operation.
Pressing this key during AC operation lets the FX-2111 enter the
charge mode.
Mode Select a mode in the following order when pressed during cessa-
tion of recording:
|-> Automatic recording -» Manual recording -> Programming -|

Holding this key during automatic recording lets the FX-2111 record
the current lead continuously until detached.
Holding this key during manual recording lets the FX-2111 record
an event mark until detached.
Sensitivity Selects a recording sensitivity.
Lead Select < Select a lead for recording. In programming mode, these keys allow
you to select a setting value.
Reset Resets the measuring circuit while held during recording. In
programming mode, this key selects a setting parameter.
1mV Applies a 1mV calibration waveform when pressed during record-
ing. In programming mode, this key selects a setting parameter.
Start/Stop Starts the FX-2111 recording the ECG waveform. Another press stops
it from recording.
© Paper Magazine: Accommodates a chart paper.

3 . 2 Side Panels, Left and Right


® DC Input: Inputs external DC signals with a sensitivity of 10mm/0.5V.
© Lead Connector Connects to the lead cable.

© Power Connector Connects to the power cable.


© Main Power Switch: Turns AC power on/off.
@ Potential Equalization
Terminal: Makes the FX-2111 equipotential to another instrument used in com-
bination with it. To that effect, connect both instruments to a
common grounding conductor using an optional grounding wire.

3 3 Bottom Panel
.

© Battery Room: Houses the rechargeable Ni-MH battery.


© Fuse Holders: Have power fuses inserted.

1-4
CHAPTER
2
Circuit Description

1 .
Introduction 2-1
2 . Isolated Input Circuit 2-2
2 1 Buffer Amplifier and RF Driver
. 2-2
2 .
2 Lead Network and Lead Selector 2-3
2 . 3 Preamplifier and 1mV Generator 2-3
2 4 R-wave Detector and Overinput Detector
.
2-4
2 5 Amplifier Control
. 2-5
2 6 Signal Isolator
. 2-5
27 .
Power Isolator 2-6
3 . Middle Amplifier and AID Converter 2-6
31 Middle Amplifier and DC Input
. 2-6
3 2 AID Converter
.
2-7
4 Motor Control
.
2-8
5 Sensor Circuit
.
2-8
5 1 Detection of Magazine Open Condition
. 2-9
5 2 Detection of Paper End and Paper Marks
. 2-9
6 CPU Circuit
.
2-9
61 .
Reset Circuit 2-9
6 2 CPU, ROM and RAM
.
2-9
63 . Gate Array 2-9
7 LCD Control Circuit
.
2-11
8 Thermal Print Head Control Circuit
.
2-11
9 Memory Backup Circuit
. 2-12
10. Power Supply and Charging Circuit 2-13
10.1 Introduction 2-13
10.2 Rectifier/Smoothing Unit and ON/OFF Control 2-13
10.3 + 10V and +5Vd Power Generators 2-14
10.4 ±5Va Power Generator 2-15
10.5 +24V Power Generator 2-15
10.6 Charging Circuit 2-16
1 Introduction
.

The FX-2111 is composed of the following circuits:


(1) Main Board PCB-6409
-Isolated input circuit
-Middle amplifier and AID converter circuit
-Motor control circuit
-Sensor circuit
-Reset circuit
-CPU circuit (CPU ROM, RAM, gate array)
,

-LCD control circuit


-Thermal print head control circuit
-Memory backup circuit
-Power supply and charging circuit
(2) Sensor Board PCB-6239
(3) AC Inlet Board PCB-6410

ECG signals input through the lead connector are amplified by the
isolated input circuit and the middle amplifier circuit, then converted from
analog to digital signals by the AID converter circuit. The digitized signals
are digitally filtered, if the filter is set to ON, then sent through the gate
array to the thermal print head control so that they are recorded as ECG
waveform by the thermal print head.

During these processes, the heart rate detected by a hardware


technique and operation status such as filter ON/OFF setting are displayed
on the LCD.

The power supply provides circuits with necessary powers. The


charging circuit, if activated, charges the Ni-MH battery in AC operation
or transfers the power from the Ni-MH battery to the power supply. The
state of battery is indicated on the LCD.
PCB-6409 : :pcb-64io

- i5V AC Inlet
I0V
Power Supply
"

re
O -24V
Isolated Input Circuit i

3
If VDO
+2 5V
AC Power

ZEE

/Charging;-;
'
-

'

DC
AyiCircuil ;--
Input NiMH
*
Battery

DC Motor
Motor Control
5 M mt :'
J Gate Array , CPU Circuit Key Panel
Thermal ] Thermal
*
Print Print it
Head . Head [
Control

1
LCD
LCD Backup
Control PCB- .
Circuit
Sensor
6239
Board

Overall Block Diagram

2-1
2
. Isolated Input Circuit
The isolated input circuit is composed of the following:
(1) Buffer amplifier and RF driver
(2) Lead network and lead selector
(3) Preamplifier and 1mV generator
(4) R-wave detector and overinput detector
(5) Amplifier control
(6) Signal isolator
(7) Power isolator

R 5
I
-

ECG
L O
-
5 Preamplifier "

> Signal
5
2
-

F 5 5 Isolator
D c t a5 5
-

I
CI 5
I 2
-

"

1 D .
-

I 5 5 -

5 "
1mV RESET
S
-

C6
Amplifier
T Control
Signal
RF Drive <- RF Isolator

Overinput/ (Photo
R-Wave Detector
Coupler)
Circuit
i
I
i

.e- Power
Isolator <-

Block Diagram of Isolated Input Circuit

2 . 1 Buffer Amplifier and RF Driver

oac- Hit icr

9 ISO* 0
.

3
5

Since the buffer amplifier should input signals with high impedance
and output them with low impedance, it is configured as an impedance
conversion circuit using an operational amplifier. The circuit shown above
is individually applied to all leads except for RF (right foot). Also, a limiter
using a dual transistor is mounted for protection against overinput.
The RF driver feeds back the composite signal of limb leads to the
right foot for improved common mode rejection ratio.
2-2
2 2 Lead Network and Lead Selector
.

OK

211
OK

*a? i
z 10
Ox

> -

304
OK
3
i
20 1
0*

Lead Select Signals


Leads A BCD
It:? STD 0 0 0 0
? io«r
ft:
10 0 0
II 0 10 0
Ok
4;
III 110 0
200
0-<

' a Vr 0 0 10

J Z0«
OK
I El
aVL 10 10
aVF 0 110
10*

VI 1110
Tan
V2 0 0 0 1
m V3 10 0 1
l OX t
V4 0 10 1
V5 110 1
T UNS2 L]

V6 0 0 11

The lead network is formed with resistors and lead selector, with multi-
plexors IC36, IC38, IC41 and IC4. Input signals to multiplexors are selected
from RA, LA, LF, and CI to C6 according to four signals of A, B, C, and
D then synthesized to produce each ECG lead (see table above).
,

2 . 3 Preamplifier and 1mV Generator


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23 1 Preamplifier
. .

Signals output from the lead selector (multiplexors) are amplified 8


times by a differential amplifier, then 25 times by a noninverting amplifier,
thereby letting the isolated input circuit amplify the input signals by 200
times in total. Signals output at the first stage are sent to the overinput
detector.

2-3
The 3.5Mfi resistor and 1|jF capacitor set the time constant at 3.5
seconds.

2 3 2 1mV Generator
. .

The 1mV generator divides the high-precision voltage reference out-


put of 1.235V by a high-precision resistor, thereby applying a 8mV voltage
to the preamplifier when the 1mV application signal is at a low level.

2 . 4 R-wave Detector and Overinput Detector


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2 41. .
R-wave Detector
RA and LF signals of lead network are synthesized to II lead. The R-
wave detector detects R wave by picking up R-wave component from the
II lead signal through a band-pass filter, then sending it to a comparator.
24 . . 2 Overinput Detector
The signal output at the first stage of preamplifier is sent to a com-
parator and if the signal exceeds ±360mV, the output of the comparator
becomes inverted.

Signals output from the R-wave detector and overinput detector are
adjusted in the pulse width by the multivibrator IC40 (TC4538), then input
into the photo coupler.

+2 9V.

+0 31V
.

1T63 ov OV

0 31V
.

2 9V
.

TP19

* 170»S

TP20 ITOins

R-wave Detection Wavelorm Overinput Detection Waveform

2-4
2 . 5 Amplifier Control

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This circuit picks up a reset, 1mV,or lead select signal from the serially
transferred amplifier control signals.
!<-% 1ms ;
I

1 KH 2

AMP
C L K

AM P -
DATA DO D7 D6 D5 D4 D3 D2 Dl DO D7 D6 D5 D4 D3 D2 DL DO D7 DO

i
OLD DATA <- i
-

> NEW DATA


i

8ms -

Data wfitlen (rom CPU are latched.


Response
K time: 32ms + a max. ? 0
a 0 8ms
_

16ms + a mm.

2 . 6 Signal Isolator
CT*

IC21 rjJiSJLp-Iil-
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1
The signal isolator modulates input analog ECG signals with FETs
Q31 and Q32 and pulses TRF1 + and TRF1 -, then transfers the modulated
signals through the T1 isolation transformer (1:1). FETs Q22 and Q23
demodulate the signals. A low-pass filter formed with capacitors and
resistors in two stages eliminates noise in the demodulated signals.
Digital signals (AMPCLK, AMPDATA and HR) are transferred using a photo
coupler.
2-5
2 7 Power Isolator
.

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.

T lisjoj

T 0 . 1
T

C 10
200xhi

The power is transferred using 10V pulse at 100kHz. At the isolated


side, a 3-terminal regulator supplies ±5V.

3 . Middle Amplifier and AID Converter


3 . 1 Middle Amplifier and DC Input
C4 T °-
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ECG signals demodulated at the isolated signal transmission section


are output to the middle amplifier just after passing through a low-pass
filter formed with capacitors and resistors in two stages. The middle am-
plifier amplifies the input signals 1.25 times to a total gain of 250 times
and sends them to the AID converter. Signals output from the AID converter
are digitally filtered with a software technique. The isolated input circuit
and the middle amplifier are designed so as to provide a general hard-
ware frequency response of 150Hz (-3dB).
The DC input amplifies input signals 0.5 times, then sends the signals
to the AID converter through a buffer amplifier.

2-6
3 2 AID Converter
.

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The A/D converter is a single slope type. It is composed of a triangular


wave generator, sample & hold circuit, and comparator. The comparator
compares input signals with ±3.2\/ triangle wave generated at every 1ms.
The signals are then converted from the voltage to a pulse width and trans-
ferred to the gate array. In the gate array, the pulse width is counted, then
converted into a digital value.
< 520ps 5k 480,1s Si

A/D CLK

--<? 96ps > ;< 96)13

S/H
(TP35)
Bps
+3 2V.

Triangular OV
(TP7)

-
3 2V.

Start ol counting
A/D Conversion Timing

Besides ECG signals, the AID converter digitizes DC input signals,


battery voltage, thermistor signals of thermal print head, and the refer-
ence voltage of 2.5V for calibration of A/D conversion.

2-7
4 Motor Control
.

</00

. LJJ J .«

(IT ® I

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i

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I C «1

The motor to drive the recorder is the DC motor which has a photo
sensor built in for detection of motor speed. The PLL control IC25 com-
pares a signal detected by the photo sensor with the reference frequency
in phase, thereby providing a motor control signal at pin 13 of IC25.

The motor control signal goes to the integrator circuit formed with
R140, R142, and C64 and is made by a proper motor drive voltage of the
PWM control IC24.

25mm/s (256Hz) SOmra/s (5L2Hz)


r i n r~i m -+5V
~

IC25 (pin 14)


SIN
-

ov
-

+5V
IC25 (pin 3)
CIN
.OV
.+5V
IC25 (pin 13) . +3 IV .

P2
+2 2V
\ K \ / OV
.

Delayed Early Delayed Delayed Delayed Early

5 Sensor Circuit
.

The sensor circuit is provided to check for a magazine opening


condition and paper end as well as detecting paper marks.

1*4

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t la
7

1 : il 3£
i &
if* 4 n* re it© t*ii

lit > <1 llflOl


-

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2-8
51
. Detection of Magazine Open Condition
When the paper magazine is open, the microswitch SPVC2-1 is turned
off to send an interrupt signal to the gate array. Magazine opening is de-
tected with the fall signal and magazie closed is detected with the rise signal.

52
. Detection of Paper End and Paper Marks
A reflection type photo interrupter acknowledges a black paper mark
or paper end status (no paper remaining) if receiving no reflection from the
location of paper. It discriminates between paper end status and paper mark
based on a duration of the low level starting from a fall signal.

6 CPU Circuit
.

The CPU circuit is composed of a reset circuit, CPU, ROM, RAM, gate
array, and backup power circuit.

61
.
Reset Circuit
VOO

1 14
10K

vsa vACSEt J
ION
*

ViB K OUIC -
QhO
*12 VSC h Cf
0 C%3
!2M
- k cj Q-i
L'ltV

M O T
. . .

Using NJM2103, the reset circuit generates a reset pulse as well as


monitoring the battery voltage. It outputs the reset pulse when Vdd falls
to lower than 4.27V or when it receives a signal from WDT.
As for the battery voltage, the reset circuit monitors the power voltage
divided by resistor and when the voltage becomes lower than 7.5V referred
to the battery terminal, it outputs a pulse to the LOWS terminal to turn
the power off. To protect the output pulse against power fluctuation noise,
a filter formed with a capacitor and resistor in one stage and a Schmidt
trigger inverter are provided.

6 2 CPU, ROM and RAM


.

The CPU is HD63B09E. It controls the overall circuit of the instrument


through the gate array. The ROM is 64K-byte AM27C512-150DC and the
RAM is 8K-byte SRM2264LM12. By changing the jumper connection, the
ROM can be replaced with a 128K-byte ROM and the RAM, with a 32K-
byte RAM (with a data holding current of lower than 2\iA).

6 . 3 Gate Array
The gate array is FD88007-AC with a clock frequency of 16MHz. Its
control signals are as follows:

2-9
631
. .
2MHz E and Q Clocks for CPU
'

< -5 00 n s-->

500ns V, $->, 125ns

63
. 2 Interrupt Signals
.

There are three types of interrupt signals-NMI, FIRQ and IRQ. All
these signals, active at low level, are output to the CPU.
-NMI Output at every 1ms.
-FIRQ Output at every 10ms.
-IRQ Output when any one of MAGAZIN, MARK, HR, LOWB, CHG
IRQ and AC/DC signals is input.
,

!< S> Ims


NM I

j* 500jis

1 0 0 Hz

1 Oras

FIRQ
. CLEAR

MARK

RUN

PAPER
END

a = 390ms (9.75mm) with a paper speed of 25mm/sec


190ms (9.75mm) with a paper speed of 50mm/sec
NOTE: ACDC, CHG IRQ, and MAGAZIN DOWN signals are detected at
their rise and others are at their fall.

63
. . 3 Watchdog Timer (WDT)
.
10ms ,
'

< =»

1 0 0Hz

WDT
CLEAR , a i

70ras .

WDT

a = Response time of IC

2-10
634
. . Chip Select Signals
Chip select signals are all active at low level.
WE: Write enable signal
RD: Read enable signal

ROM ] 1 |
RAM [
KEY J 1 1
WE I
RD J ' 1 ' '
NOTE: LCD signal differs from the above since the memory is ready. (See
LCD control circuit.)

7 LCD Control Circuit


.

Since the LCD (NDM202A00) has a controller built in, it is interfaced direct-
ly with the CPU. However, E and Q clocks make the bus timing as shown below.

LCD

Data
Bus
CM >
Address
Bus
ZX $3040 ~ $30<tF
X
8 Thermal Print Head Control Circuit
.

A waveform is traced at every 1ms and alphanumerics are at every


6ms with a paper speed of 25mm/sec or every 3ms with a paper speed
of 50mm/sec. The RAM for the thermal print head control uses 4K-byte
for alphanumeric data. This circuit controls dot heating temperatures based
on previously printed data to provide a proper printing condition.
When the paper is not driven or when the magazine is open or there
remains no paper in the magazine, the circuit generates TOFF signal to
shut off power supply to the thermal print head at the FET Q24, thereby
protecting the thermal print head.
There are four control signals of CLOCK, DATAIN, LATCH, and STROBE.
The STROBE signal is varied in pulse width according to thermal print
head temperatures.
2-11
1ms

LATCH e- I us

8,3 -
STROBE !< -

960vs
(Max)
895,is
CLOCK 9 . 5us
(SOOKHz) < S

DATA

2v s

CLOCK

1 . Sks 1

DATA

9. Memory Backup Circuit


The battery-backed RAM SRM2264LM12 is installed to keep program
contents when the FX-2111 is turned off. The RAM should feature a data
holding current of lower than 2nA.

J 2 k otci 1 . o>
O . I

T ." 5 "

When the FX-2111 is turned on, Vdd is supplied to the circuit and
turns Q6 and Q7 on to send +5\/ Vdd to the RAM.
When the FX-2111 is turned off, Q6 and Q7 are turned off but the back-
up lithium battery supplies +3V to the RAM to let it keep the stored data.

2-12
10. Power Supply and Charging Circuit
10.1 Introduction

The power supply transforms the AC power by the transformer or


receives DC power from the battery, then regulates the power to stabilized
voltages required by respective circuits.
The FX-2111 is equipped with a charging circuit to permit the user
to charge the Ni-MH battery.

AC Power
+ 1 0 VN
Transformer 5
- Rectifier

Regulated
Power
Supplies
+ I 0 V
I
ON/OFF

DC Power
Battery
Control
+ 5 VD
!
± 5 VA

Charging + 2 4 V
Circuit

Block Diagram

10.2 Rectifier/Smoothing Unit and ON/OFF Control


10.2.1 AC Operation
The AC power voltage is transformed by the transformer, then rectified
by D1 to D4 and smoothed by C136. D1 to D4 are Schottky diodes with
low Vpand form a bridge circuit. This rectifier circuit suppresses voltage
decrease and features less heat generation.
10.2.2 ON/OFF Control
In battery operation, a press of the ON key switches FET 04 on and
electrifies D7, thereby making the base of 05 driven. If the operator
detaches the finger from the ON key, 04 is kept on and the power is
supplied to the FX-2111.
The battery voltage is detected via D6. If the voltage between battery
terminals is lower than 7.5V or so, the gate array generates POWER OFF
signal to turn 03 on and cancel the bias voltage of 05, thereby switching
04 off. As the result, the FX-2111 receives no power supply and is turned off.
Similarly, a press of the OFF key cancels the bias voltage of 05, thereby
turning the FX-2111 off. In AC operation, 01 is on; therefore the base of
05 cannot be driven and 04 cannot be kept on, thereby making battery
operation impossible.

2-13
VDO

D 1 - « AC DETECT rpBHogy

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10.3 +10V and +5Vd Power Generators


10.3.1 10V Power Generator
The dropper type 4-terminal regulator IC22 is used to regulate unstabi-
lized IOVnU) stabilized lOV. R118 and R119 are to set the output voltage.
The 10V power is supplied to the motor and the 5Vd power generator.
If the battery voltage becomes lower than 10V in battery operation,
IC25 drops the voltage to several ten millivolts.
10.3.2 5Vd Power Generator
C7 is a drop type low-loss 3-terminal regulator. It produces regulated
5V power from 10V. IC7 can operate if an input-output voltage difference
becomes up to 0.5V and thus it can output the stable 5V power if the input
voltage fluctuates due to lowered battery voltage.
The 5V power thus produced is supplied to the CPU and other digital
circuits.

IC22 IPS* IC7


POIQIV11
TP27
iovn -> - I U- msz
-

11?
3 C20 [
O.Ol
CIS *
TP38
O . I
3 119
« JO

gno >

2-14
10.4 ± 5Va Power Generator

Using the unregulated 10Vn power from the AC power supply or the
battery, the 3-terminal regulator ICQ produces +5V. IC10 is a CMOS inverting
type switching regulator, in which the output voltage is fixed and which
inverts the input +5V and outputs -5V. A capacitor at the output is an
organic semiconductor capacitor which features superior characteristics
at low temperatures and least leakage current.

±5V powers thus produced are supplied to analog circuits such as


operational amplifier.
ICS

GEC
.Not hj n«
C I J
D Ol
.
ZZ.

VIN -VOUI
oT*

ss ir 44*
, - C2» ft

® >

10.5 +24V Power Generator

Using the unregulated 10Vn power from the AC power supply or the
battery, the +24V power generator, a boosting type DC-DC converter,
produces 24V power for driving the thermal print head and charging the
battery.

IC6 is a PWM-controlled switching regulator. R22 and C18 determine


the oscillation frequency. The PWM control is performed at approximately
170kHz to drive Q9 at a high speed. While Q9 is on, the current flows to
LI which in turn stores the energy. When Q9 is turned off, the stored energy
becomes a counter-electromotive force and is stored in C137 via D13. By
repeating a series of these operations, the +24V power generator can
produce an output voltage larger than the input voltage. R41 and R42 set
the output voltage at 24V. R24 checks for an overcurrent and a charac-
teristic is provided to gradually lower the output voltage when the load
current increases to over 0.4A.

The 24V power thus boosted is used to drive the thermal print head.
When the thermal print head is printing, a signal from pin 21 of the gate
array drives the base of Q15 to switch FET Q24 on so that the -I-24V is
supplied to the thermal print head. When the thermal print head is not
printing, Q15 and Q24 are off and the thermal print head is not supplied
with power.
Pin 16 of IC6 outputs 2.5V, which is used by the AID converter and
the thermistor temperature detector of thermal print head.

I 1 UJ

-
1

11 ;; i-0-<nm
j1UY
i 111 * 51 i ;v ..

= LIL -
_
J

2-15
10.6 Charging Circuit
The charging circuit is equipped with the quick charging IC18 (bq2003),
which performs constant current control as a frequency modulation con-
troller for switching regulation of the charging current and monitors the
battery temperature and voltage and the charging time to ensure proper
charging. It also checks whether or not the Ni-MH battery is connected
and enables charging only when the battery is connected.
In AC operation, the circuit is supplementarily charging the battery
even if the FX-2111 is not placed in charging mode.

10.6.1 Starting the Charging Circuit


When the OFF key is pressed in AC operation, Q11 is turned on to
supply +5V for operation of the IC. Since the base of Q12 is driven by
turning Q11 on, Q11 is kept on. When +5V is supplied to IC18, the charg-
ing circuit automatically starts operating.
10.6.2 Charging Temperature and Voltage Monitoring/Control
Charging is limited by battery temperature and voltage so that it is
made in a preset range.

To monitor the battery temperature, a thermistor (with negative tem-


perature coefficient) is installed in the battery pack. The thermistor outputs
a voltage signal to pin 6 (TS) of IC18 and charging is enabled if the voltage
is within the preset limits in voltage converted from battery temperature.
The sensitivity of a battery temperature rising ratio (AT/At) is adjusted by
resistances of the thermistor and R59, R61, and R62 on the charging circuit.

The battery voltage is divided to a voltage per cell by R58 and R60
which are connected between battery terminals, then sent to pin 7 (BAT)
of IC18. Charging is enabled if the voltage is within the preset limits in
voltage per cell.
Divided +5V powers of R84 and R85 are used to determine the maxi-
mum cell voltage (MCV) of the battery and the maximum voltage (TCO)
for the battery temperature to stop charging, respectively. They are output
to pin 10 (TCO) and pin 11 (MCU) of IC18.
Preset battery temperature limits and cell voltage limits are as follows:
. Battery temperature limits
Minimum charge enable temperature limit LTF: Approx. -50C
(voltage level 2.0V)
Maximum charge enable temperature limit HTF: Approx. 60oC
(voltage level 1.13V)
High temperature to stop charging TCO: Approx. 650C
(voltage level 1.01V)
. Battery cell voltage limits to enable charging
Minimum: Approx. 1.0V
Maximum: Approx. 1.78V

That is, when the charging circuit is turned on, it starts charging the
battery if the battery temperatre is within a range of 50C to 60oC and
the cell voltage is within a range of 1.0V to 1.78V. If either one of the above

2-16
conditions is not satisfied, it does not start charging the battery but is
placed in a standby status until both conditions are satisfied.
Once the charging circuit starts charging the battery, the charge com-
plete system described later will be effective. However, if the maximum
cell voltage of 1.78V is exceeded before the start of charging, the charging
circuit judges the battery abnormal and does not start charging.

10.6.3 Charge Current Control


The power required for charging is supplied from the 24V power
generator. The charging current to the battery is detected by the resistor
R18 then sent to pin 9 (SNS) of IC18. The output of pin 14 (MOD) of IC18
is switched based on the voltage value of R18 to switch Q17 on/off, thereby
making the current constant. The charging current is set at approximately
0 45C (480mA).
.

Q16, D22, and Q10 form a MOS FET driver and level shifter circuit to
heighten the switching frequency.
10.6.4 Charge Complete System
When the battery temperature and cell voltage are within the respec-
tive ranges, the charging circuit continues to charge the battery until one
of the following five conditions is satisfied:
. - AV detected
. - AllAt (temperature rising ratio) detected
. Maximum temperature of 650C to stop charging TCO reached
. Maximum charging time of 3 hours reached
. Maximum cell voltage MCV of 1 78V reached .

Usually, the charging circuit stops charging by detecting -AV.


However, if charging is started at high ambient temperatures, the charging
circuit may detect the maximum temperature (TCO) to stop charging. Also,
as a safety measure against no - AV detection, the maximum charging
time of three hours is set by timer and TM1 and TM2 signals at pins 4
and 5 of IC18, respectively, stop the charging circuit from charging if the
time is reached.

...... jLL1Ji -
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2-17
10.6.5 Other Functions
In AC operation, supplemental charging is made by R66. In AC oper-
ation, Q14 is on and the base of Q13 is driven to supply R66 with the 24V
power. The current of which the value is determined based on a voltage
difference at R66 flows for supplemental charging. However, if the battery
is not connected, Q8 is turned on and Q14 is kept on, thereby disabling
supplemental charging and at the same time cancelling the bias voltage
of Q12. Thus, the 5V power to operate the charging circuit is not held and
charging is impossible.

The charging circuit outputs CHG IRQ and CHG STATUS signals. When
the circuit is supplied with 5V, the CHG IRQ signal becomes high level
to indicate the instrument is placed in charge mode. The CHG STATUS
signal is output from pin 13 (CHG) of IC18 to indicate the current charging
status. If the battery is not connected, the CHG IRQ signal cannot become
higher than 0.7V since D15 is electrified. Thus, the instrument is not placed
in charge mode.

The CHG signal is output in the following manner:

CHG STATUS Output Level


High Low

Abnormal power voltage Continuous

Start of charging Continuous (rise)


Standby 1 375s ± 0.225s
.
125ms ±20ms

Charging Continuous

Charged 125ms ±20ms 125ms ±20ms

CHG IRQ Signal


CHG swilch ON Cha/ping Mode

2 0s.

'
* *

CHG STATUS Signal


in ordinary charging

\ Start of Charging Mode Charolng In Progress Churging ConipleloiJ

CHG STATUS Signal


with some pending of charging
2 0s.

Rending Charging in Progress

CHG STATUS Signal


with abnormal battery voltage No charging made

CANT CHARGE" message appears aller 5 seconds Irom the start


"

2-18
CHAPTER
3
Troubleshooting
1 Introduction
.
3-1
1 1 Internal Power Supplies
. 3-1
1 2 Faulty Power Supplies vs. Troubles
. 3-2
2. Troubleshooting 3-3
2 1 All Specified Secondary Power Supplies Are Not Available
.

in AC Operation 3-3
2 2 All Specified Secondary Power Supplies Are Not Available
.

in Ni MH Battery Operation 3-3


2 3 +24V Is Not Output
. 3-4
2 4 + 10V Is Not Output
. 3-4
2 5 Vdd Is Not Output
. 3-4
2 6 Unisolated ±5Va Are Not Output
. 3-5
2 7 Isolated ±5V Are Not Output
. 3-5
2 8 Troubles Related to Charging
. 3-6
2 8 1 Charging Mode or "CHARGING" Status Is Not Effected.
. . 3-6
2 8 2 Virtually No Charging Is Made Despite "CHARGING
. .

COMPLETE" on Display 3-7


2 9 LCD Operation Is Abnormal
. 3-7
2 10 No Key Operation Is Possible
. 3-8
2 11 Paper Is Not Driven or Abnormally Driven
. 3-8
2 12 No Mark Detection on Z-fold Paper Is Available
. 3-9
2 13 No Paper End Detection Is Available Or "PAPER END"
.

Alarm Is Constantly Displayed 3-9


2 14 Program Contents Change
. 3-9
2 15 Buzzer Does Not Operate
. 3-9
2 16 No Waveform Recording Nor Alphanumeric Printout
.

Is Available 3-10
2 17. No DC Input Waveform Recording Is Available 3-10
2 18 . Any Waveform of All 12 Leads Is Recorded As Baseline 3-10
2 19 . Waveform of Some Specific Lead Is Recorded As Baseline... 3-11
2 20. Checking AID Converter 3-11
1 Introduction
.

11
. Internal Power Supplies
First, understand internal power supplies and their functions.
10Vn

The IOVn power is output from the secondary side of transformer.


Since it is not regulated, it fluctuates depending on the load status
and AC input voltage. It is transformed to various regulated voltages
to be supplied to respective circuits.
+10V

Inputting 10Vn, the low-loss 4-terminal regulator outputs regu-


lated 10V. However, if the input is lower than 10V, the output
voltage will be lower by several ten millivolts than 10V.
This voltage is supplied to the motor and the regulator which
produces -i-5Vd.

+ 5Yp
Inputting + 10V, the dropper type low-loss regulator outputs
regulated -(-5Vd.
This voltage is used as the power supply for digital circuits,
such as CPU, of the unisolated section.

+ 24V

Inputting 10Vn, the switching regulator outputs regulated


+24V. A limiter is applied at approximately 0.4A referred to 10V,
thereby lowering the output voltage.
The +24V voltage is supplied to the thermal print head. In the
case of FX-2111N, it is also used as a charging power supply.

+5Va (unisolated)
Inputting IOVn, the dropper type 3-terminal regulator outputs
regulated -i-5Va.
-

5Va (unisolated)
Inputting +5Va, the inverting type switching regulator
produces -5Va.
±5Va are used as analog power supplies for DC input, ECG
circuit and AID converter.

± 5Vf (isolated)
Receiving 10Vn through the isolation transformer which
isolates the voltage from other circuits, the 3-terminal regulator
outputs regulated ±5Vf.
The ±5Vf are used as power supplies for digital circuits of the
isolated section.

± 5Vb (isolated)
±5Vb are produced from ±5Vf through diodes. They are
used as power supplies for analog circuits (input amplifiers)
of the isolated section.

3-1
1. 2 Faulty Power Supplies vs. Troubles
1 21
. If 10Vn is not output...
.

The FX-2111 does not operate at all since 5V, 24V and all other powers
are not produced.
122
. If 10V only is not output...
.

The dropper type low-loss regulator cannot produce +5Vd, thereby dis-
abling the CPU, etc. to operate. The FX-2111 does not apparently operate
at all while 24V and others are available.

12
. 3 If +5Vd only is not output...
.

The CPU and other components are not supplied with power. The
FX-2111 does not apparently operate at all while powers other than +5Vd
are available.

12
. . 4 If +24V only is not output...
The LCD and keys operate normally but waveform recording and al-
phanumeric printout are not available at all.
12 . . 5 If unisolated ±5Va are not output...
The AID converter and comparator do not operate normally, thereby
making ECG waveform or DC input waveform a baseline with alphanumerics
printed out normally.
12 6 If isolated ±5Vf and ±5Vb are not output...
. .

All 12 leads are displayed and recorded as baselines with alphanumerics


printed out normally.

A Caution
When checking the power supply and related circuits for troubleshoot-
ing, take sufficient care to avoid a short circuit.

3-2
2 . Troubleshooting
2 1 All Specified Secondary Power Supplies Are Not
.

Available in AC Operation
(1) Check the FX-2111 is securely connected to the wall outlet using the
specified power cord.
(2) Check the AC inlet has two specified power fuses inserted and the fuses
are not blown out.

(3) Check AC voltage at the secondary side of power transformer. Discon-


nect the output jack, which comes from the transformer, from P1 con-
nector and measure the voltage between pins 1 and 3 of the output
jack. The AC voltage should be as follows:
9 9V to 12.5V for 115V version
.

8 5V to 12.5V for 230V version


.

(4) Check supply voltages on PCB-6236.


1) Check voltages between the anode side of D2 and D3 and the cathode
side of D1 and D4. They should be in a range of 10 to 16V DC.
If DC power output is not available on the board while the transformer
output is found normal, the contact of PI connector may be faulty
or diodes D1 to D4 may be damaged.
2) Also verify that the voltage between the cathode side (TP22) of D5
and GND (TP21) is in a range of 10 to 16V DC.
If the voltage between the cathode side of D5 and GND is not avail-
able, the fuse F1 on the board may be blown out or D5 may be
damaged.

A Caution
When checking power fuses, be sure to turn the power off and discon-
nect the power plug from the wall outlet beforehand.

2 . 2 All Specified Secondary Power Voltages Are Not


Available in Ni-MH Battery Operation
(1) Open the rear cover of instrument and check the presence of battery.
Then check that the battery is securely connected to the FX-2111 via
the connector.

(2) Check supply voltages on PCB-6236.


1) Verify that the battery voltage is available between pins 1 and 4 of
P10 and between the plus side (TP25) and GND (TP21).
If the battery voltage is not available there, the contact of P10 may
be faulty or the fuse F2 may be blown out.
2) Press the ON key and verify that the battery voltage is available
between the drain of Q4 (anode side of D6) and GND.
If the battery voltage is not available there, the holding circuit around
Q4, D7 and Q5 may be faulty or the connection of key panel may
be inferior.
3) Verify that the battery voltage is available between the cathode side
(TP22) of D6 and GND.
If the battery voltage is not available there, D6 may be faulty.

3-3
2. 3 +24V Is Not Output
(1) Check the presence of IOVn (8V to 16V). Then verify that the voltage
is aupplied to pins 10 and 13 of IC6.
(2) Check operations of components around IC6.
1) Using the oscilloscope, verify that pin 4 of IC6 outputs a triangular
wave at approximately 170kHz.
If not, IC6 may be faulty.
2) Using the oscilloscope, verify that the gate of Q9 outputs a rectan-
gular wave at approximately 170kHz.
If not, IC6 may be faulty.
3) Using the oscilloscope, verify that the waveform at the drain of Q9
is switched at approximately 170kHz.
If not, Q9 or D13 may be faulty.
4) If +24V is supplied to the thermal print head only, conduct the
following:
Press the START/STOP key to place the instrument in recording con-
dition. Then verify that -I-24V is available at the drain of Q24 and
pins 13, 14 and 15 of P5 connector.
If the + 24V is not available there, consider Q24 or Q15 may be faulty
or check whether or not signals are sent from the gate array (pin 21).
Signal level of Q15's base input: High-24V ON
Low- 24V OFF
If +24V is available there, check the cable of thermal print head.

2 .4 + 10V Is Not Output


(1) Check the presence of IOVn at pin 1 of IC22. To make 10V output avail-
able, the input 10Vn should be higher than 10V.
If the input voltage is present but the output is not available, setting
resistors R119 and R118 or IC22 may be faulty.

2 . 5 Vdd Is Not Output


(1) Verify that 10V input is available at pin 1 of IC7. If the IOVn output from
the secondary side of power transformer is lower than 10V, however,
the 10V input at pin 1 of IC7 is lower by several ten millivolts than the
specified -I-10V.
If the input voltage is present but the output is not available, IC7 may
be faulty.

3-4
2. 6 Unisolated ±5Va Are Not Output
(1) Verify that the 10Vn input is available at pin 3 of ICQ.
If not, both ±5Va should not be output. Conduct the steps described
in 2.1 and 2.2.

(2) Verify that +5Va is output at pin 1 of ICQ and pins 3 and 5 of IC10.
If not, ICQ may be faulty.

(3) Verify that -5Va is output at pin 4 of IC10 (TP2Q, TP53).


If not, IC10, L2 or D14 may be faulty.

2 . 7 Isolated ± 5V Are Not Output


(1) Verify that +10Vn (8V to 16V) is supplied to pins 6 and 7 of 12.
If not, check whether or not 10Vn is output from the secondary side of
power transformer.
(2) Check the circuit around 12.
1) Verify that pin 11 (TP49) of IC20 inputs a 200kHz rectangular wave as
clock signal.
If not, IC16 or IC1Q on the oscillator circuit may be faulty.
2) Verify that pins 8 and 9 of IC20 output rectangular waves at 100kHz
in reversed phases.
If not, IC20 may be faulty.
3) Verify that pin 3 (TP60) of D29 and pin pin 3 (TP61) of D30, each at
the isolated side, output rectangular waves at 100kHz.
If not, check Q20, Q21 and 12, which may be faulty.
4) Verify that rectified and smoothed voltages in plus and minus direc-
tions are input into pin 3 of IC33 and pin 2 of IC34, respectively.
If not, D29 or D30 may be faulty.

If all the abovementioned inputs and outputs are found normal but
isolated ±5V are not output, IC33 or IC34 may be faulty.

3-5
2 .8 Troubles Related to Charging
28
. 1 Charging Mode or "CHARGING" Status Is Not Effected
.

If charging mode is not effected, +5V (CHG IRQ) may not be output
at pin 9 of IC18 or +5V may not be supplied to the charging circuit. Conduct
steps (1) and (2)-1) below.

If charging mode is effected but "CHARGING" status is not initiated,


+ 5V may be available on the charging circuit and at pin 9 (CHG IRQ) of
IC18 but either the battery voltage or temperature may not satisfy the charging
condition. Also, if +5V is not correctly output, the voltage may vary con-
siderably and may be beyond the specified range. So conduct steps (1), (2)-1)
and (2)-2) below.

(1) Open the rear cover of instrument and check the presence of battery.
Then check the battery is securely connected to the instrument via the
connector and the battery cable is not disconnected.

(2) Check the circuit around IC18.


1) Press the OFF key in AC operation and verify that pin 16 (TP44) of
IC18 outputs + 5V. Also verify that pin 9 (CHG IRQ) of gate array IC8
outputs +5\/.
If not, check the operation of + 5V power supply.
. If +5V is output only when the OFF key is pressed Q12 may be
,

faulty.
. If +5V is not output at all even if the OFF key is pressed Q11, Q12,
,

or D8 may be faulty.
. If only +5V for CHG IRQ is not output check whether or not the
,

collector (TP48) of Q8 is at low level. If it is low, Q8 may be faulty.


2) Verify that voltages between pin 6 (TS) and pin 9 (SNS) and between
pin 7 (BAT) and pin 9 (SNS) of IC18 are in the specified ranges as
follows:
Pin 6 (TP42) 1.01V to 2.0V
Pin 7 (TP2) 1.0V to 1.78V
. If the voltage at pin 7 (BAT) is beyond the specified range check ,

the terminal voltage of battery. If the battery voltage is not higher


than 8.0V or so, the FX-2111 is not placed in "CHARGING" status.
Owing to this, supplemental charging is made in AC operation. Check
whether or not 24V output is available at the collector of Q13 in AC
operation.
. If the voltage at pin 6 (TS) is beyond the specified range remove
,

the battery and check the thermistor in the battery. Measure the
resistance between pin 2 (blue) and pin 4 (black) of the collector.
The resistance should be in a range of 3kft to 30kl2 (lOkft at 250C).
Ambient temperatures should be proper.

3-6
28
. .2 Virtually No Charging Is Made Despite "CHARGING
COMPLETE" on Display
(1) Check the circuit around IC18.
1) Verify that the source side of Q17 is supplied with +24V.
If not, conduct the steps described in "8.3 +24V Is Not Output:'
2) Verify that pin 14 (MOD) of IC18 outputs a rectangular wave at
approximately 140kHz; the drain (TP52) of Q17 outputs a rectangular
wave at approximately 140kHz; and pin 9 (SNS) of IC18 outputs a
triangular wave at approximately 140kHz.
If not, check the following:
. R18 and R82 including their mounting condition
,

. 017 Q10, 016, and D22


,

. If above components are found normal IC18 may be faulty.


,

NOTE: Charging current is detected as a voltage value at pin 9 (SNS),


thereby switching the output of pin 14 (MOD).
(2) Check the number of charge-discharge times and the number of oper-
ating times after charging.
Usually, the number of charge-discarge times is 200 max, though it may
decrease depending on the operating environment.
The larger the number of operating times after charging, the shorter
the service life of battery becomes.
Thus, if the charging circuit is found normal but virtually no charging
is made despite "CHARGING COMPLETE" on display, the battery may
exhaust the service life.

2 . 9 LCD Operation Is Abnormal


(1) Check sure connection between the P2 connector on the main board
and the connector of LCD.
Check the connector terminals for any possible inferior soldering.
(2) Verify the following voltages on the P2 connector:
GND level at pin 1 (Vss)
+5V at pin 2 (Vdd)
+ 0.238V at pin 3 (Vee)
(3) Check the continuity of the following signal lines referring to "4.2 LCD
Control Circuit!'
Rs signal
R/W
E signal
Signals of DB0 to DB7
NOTE: The LCD module used for FX-2111 has a built-in control driver and
is directly accessed by the CPU, with MEMORY READY put.

3-7
2 10
. No Key Operation Is Possible
(1) Verify sure connection between the P7 connector on the main board
and the flexible cable of key panel.
Check the P7 connector for any possible inferior soldering.
Check the flexible cable of key panel for any possible disconnection
and wear of the carbon part.

(2) Verify that key signal lines except for ON and OFF keys are normally
pulled up by checking TP120 to 125 and TP128.
(3) Check the voltage at pin 20 (power supply) of IC15.
Check signals at pin 1 (KEY) and pin 19 (AO) of IC15. Signal at pin 1
should be at low level at every one millisecond.
Verify that pins 2 to 9 and 11 to 18 of IC15 are at low level when a key
is pressed.

NOTE: If only some specific key is not effective, the key may have a poor
contact.

A Caution
The inserting part of key connector is made of carbon. Avoid frequent
repeated disconnection and connection.

2 .11 Paper Is Not Driven or Abnormally Driven


(1>/erify sure connection between the P4 connector on the main board
and the motor cable.
Check the P4 connector for any possible inferior soldering.
Check the motor cable for any possible disconnection.

(2Verify that pins 3 and 5 (TP103) of P4 connector are supplied with +5V.
(3yerify that the following signal is available at pin 1 (TP101) of P4 con-
nector.
!< 5|19. 5;s ;< 5*L9. 5,s
+ 10V

JUULJUU
Paper speed 25mm/sec Paper speed 50mm/sec

Check the signal at pin 14 (TP59) of IC25. (Refer to "2.4 Motor Control:")
It should be 256Hz with a paper speed of 25mm/sec and 512Hz with
a paper speed of 50mm/sec.
Verify that the signal at pin 2 (JP5Q) of IC12 is at high level when the
paper is driven.

3-8
2 .
12 No Mark Detection on Z-fold Paper Is Available
(1) Verify that "RECORDING MODE" is set to "MARK" in the program.
(2) Check the mark sensor for any possible dirt deposit and inferior mount-
ing condition.

(3) Verify sure connection between the P6 connector on the main board
and the flexible sensor cable.
Check the P6 connector for any possible inferior soldering.
Check the flexible sensor cable for any possible disconnection.
NOTE: The mark sensor is the one and only part in the FX-2111, which is
adjusted by a variable resistor. Before conducting the steps
described above, therefore, check the variable resistor for any
possible peeling-off of the paint lock and slippage.

2 13.
No Paper End Detection Is Available Or "PAPER
END" Alarm Is Constantly Displayed
(1) Check the mark sensor for any possible dirt deposit and inferior mount-
ing condition.
Verify that the magazine sensor switch is positioned in place and
pressed when the magazine is closed.
(2) Verify sure connection between the P6 connector on the main board
and the flexible sensor cable.
Check the P6 connector for any possible inferior soldering.
Check the flexible sensor cable for any possible disconnection.

NOTE: The mark sensor is the one and only part in the FX-2111, which is
adjusted by a variable resistor. Before conducting the steps
described above, therefore, check the variable resistor for any
possible peeling-off of the paint lock and slippage.

2 14. Program Contents Change


(1) Verify that the lithium battery voltage is +2.5V.
Check the lithium battery for any possible inferior soldering.
(2) Verify that when the FX-2111 is turned off, pin 28 of IC2 is supplied with
+3V from the lithium battery to back up the RAM.

NOTE: Program contents are stored in the RAM IC2 and backed by the
lithium battery when the FX-2111 is turned off.
If program contents change despite sufficient lithium battery
"

voltage, refer to 2 9 Memory Backup Circuit:'


.

2 15. Buzzer Does Not Operate


(1) Verify that pin 15 (or R73) of the gate array outputs a rectangular wave
at 1kHz under the condition where the buzzer should sound.
If the wave is normally output, R73, soldering of the buzzer or the buzzer
itself may be faulty.
In the case where no QRS-synchronized sound is generated, make sure
that "QRS BEEP" is set to "ON" in the program.

3-9
2 16
. No Waveform Recording Nor Alphanumeric
Printout Is Available

(1) Verify sure connection between the P5 connector on the main board
and the thermal print head cable.
Verify sure connection between the thermal print head and the cable.
Check the P5 connector for any possible inferior soldering.

(2) Verify that +24V is available between pins 13 and 15 (TP112) of the P5
connector under the condition where a waveform should be recorded.
Verify that pin 9 of P5 connector is supplied with +5V.
(3) Verify that the TOFF signal at pin 21 of gate array or the base of Q15
is at high level under the condition where recording should be made.
Verify that signals of LATCH (pin 2 of P5 or TP107), CLOCK (pin 3 of
P5 or TP108), STROBE (pins 5, 6,and 7 of P5 or TP109) and DATA IN
(pin 1 of p5 or TP106) are available at the timings as described "2.8
Thermal Print Head Control Circuit;'

(4) To make sure of the correct operation of the RAM for thermal print head:
. Verify that pin 28 of IC5 is supplied with +5V .

. Verify that JP3 is short-circuited by soldering .

NOTE: If electrical signals are normal mechanical failure may make wave-
,

form recording and alphanumeric printout impossible. So check


the spring mounting condition and other mechanical status around
the thermal print head.

2 17
. No DC Input Waveform Recording Is Available
(1) Make sure that "DC RECORDING" is set to "ON" in the program.
(2) Check the P3 connector on the main board for any possible inferior
soldering.

(3) Verify that pin 4 of IC21 is supplied with +5V and pin 11, with -5V.
If IC21 is not correctly supplied with power, the FX-2111 should not be
able to record ECG waveform too.

(4) Check the AID converter referring to "2.20 Checking AID Converter"
If the AID converter is faulty, the FX-2111 should not be able to record
ECG waveform too.

2 18 . Any Waveform of All 12 Leads Is Recorded As Baseline


(1) Check isolated ±5V and unisolated ±5V referring to 2.6 and 2.7.
Verify that power supply pins of IC12,13,17, 21, 31 and 35-45 (opera-
tional amplifier, multiplexor, etc.) are supplied with power.
(2) To check the reset circuit and the control signal, verify that pin 13 of
IC44 is not fixed to high level.

3-10
2 . 19 Waveform of Some Specific Lead Is Recorded As
Baseline

(1) Check the lead cable for any possible internal disconnection and inferior
hookup.

(2) In relation to the lead which results in a baseline, check the buffer IC,
the resistance of resistance network, power supplies to lead selector
ICs (IC36,38,41 and 45) and their connection status such as soldering.

2 20 Checking AID Converter


.

Check the AID converter if the trouble occurs despite the normal con-
dition detected by taking steps described in Section 2.16, 2.17 or 2.18.
(1) Verify that pin 7 (TP7) of IC13 outputs a triangular wave with an ampli-
tude of ±3.2V and a pulse width of 520ns. If the triangular wave is
normally output, proceed to step (4) below.
(2) Verify that power supply pins of IC17,21 and 13 are supplied with power.
Verify that the reference voltage of +2.5V is supplied.
If not, check the power supply.

(3) Verify that a rectangular wave ADCLK (L: 520(is, H: 480|js) of 1ms cycle
is output at 1ms cycles from the collector terminal of Q1.
(4) Verify that the low level S/H signal with a pulse width of 96ns is output
"

at every 1ms from pin 6 of IC17, referring to 2 3 AID Converter Circuit!'


.

(5) Check the output of comparator as follows. *


Verify that pin 1 (ECG signal) of IC13, pin 8 (DC input signal) or pin 14
(battery/thermistor temperature) outputs a pulse which changes in the
pulse width corresponding to the changing input signal.
Verify that pins 4, 6 and 8 of IC12 output the abovementioned pulse
signal of which the amplitude is limited to a range of 0 to 5V.

3-11
CHAPTER
4
Maintenance

1 . Replacing Power Fuses 4-1


2 . Replacing ROM 4-1
3 . Replacing Rechargeable Battery 4-2
4 . Operation Check by Self-testing 4-3
4 1 Self-testing Procedures
. 4-3
4 2 Examples of Test Results
. 4-4
4 3 System Errors
. 4-5
5 . Disassembling/Reassembling the FX-2111 4-6
5 1 Disassembling Procedure
. 4-7
1 . Replacing Power Fuses
Power fuses are hardly blown out. But if they are blown out due to
some reason, turn the FX-2111 off and disconnect the power cord from
the wall outlet. Then pull fuse holders off the bottom panel as shown
below. Insert spare fuses and put fuse holders in original positions.

A Caution
When replacing power fuses, be sure to turn the power off and dis-
connect the power plug from the wall outlet beforehand.

2 . Replacing ROM
(1) Remove the upper casing.
(2) The ROM will be accessible on the PC board. Remove the ROM.
(3) Mount the new ROM, taking care of the direction. The ROM's socket
has 36 pins.
If 1M-byte ROM is used, it will be mounted taking the full space for
it. If the ROM is other than "IM-byte ROM, put it aside the rear of the
socket (aside IC3).
(4) Check the ROM is not contacted with feet of R18 when mounted.
(5) If there is no problem, put the upper cover and fix it with screws.
(6) Turn the FX-2111 on. Verify that the control program version on the
standby display is the same as the label on the ROM.

A Caution
When replacing the ROM, be sure to turn the power off. Also, take
care to install the ROM in correct position.

tfC6 tft
i)

4-1
3. Replacing Rechargeable Battery
(1) Turn the FX-2111 off and disconnect the power cord from the wall
outlet.

(2) Put the FX-2111 upside down. Loosen two screws off the battery cover.

(3) Replace the battery with new one. Insert the connector of battery cable
securely in place.

(4) Put the battery cover in the original position and fix it with two screws.
If the battery cover is not put squarely, rearrange the battery cable,
etc. to neatly accommodate the battery in the room.

(5) Press the ON key to verify that the FX-2111 is powered.


(6) The new battery may have been stored for a long period of time and
lowered in capacity due to self-discharge. So be sure to charge the
battery after replacing.

A Caution
When replacing the battery, be sure to turn the power off and dis-
connect the power plug from the wall outlet beforehand.

"v - V

NOTE: It is recommended to charge the battery in the stock every six


months. Also to make full use of the battery in the FX-2111, fol-
low instructions in the operation manual.

4-2
4 . Operation Check by Self-testing
The self-testing function permits you to perform the following tests:
1 Total Test
.
6. LCD Test
2 . Sensitivity Test 7. Key Test
3 Time Constant Test
.
8. Status Test
4 Print Test
.
9. Automatic Power-off Test
5 Recorder Test
.

41
. Self-testing Procedures
(1) Press the MODE key to place the FX-2111 in the program mode. The
display will be as follows:
1 AC FILTER
(OFF)

(2) Press the ImV (A) key. The following message will appear:
MAINTENANCE
PUSH (START) KEY ]
(3) Press the START/STOP key. The display will be as follows:
M-1 AC FILTER
FREQUENCY (50HZ)

(4) Press the ImV (A) key. The following message will appear:
SELF TEST
PUSH (START) KEY

(5) Press the START/STOP key. The display will be as follows:


1 TOTAL TEST

Press the START/STOP key once more. The total test will start to test
sensitivity, time constant, print, recorder, and LCD.
To proceed to the Key Test, Status Test or Auto Power-off Test, select
it using the < or key.
9 AUTO POWER OFF

4-3
r


Z
1/2 1

TEST

42.
.
2 Print Test

n t a» « * '
1 *

'

: ;

42 .
.
3 Recorder Test ....

;..>. !

Mm"

RECORDER 'EST

42 .
.
4 LCD Test
0 o
0 0 0 0 0
0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0
0 0 0 0 0
0 0 0 0 0
0 0 0 0 0
0 0

4-4
4. 3 System Errors
System errors are caused by troubles with hardware or software.
Usually, they cannot be treated by users.

If a system error occurs, the following alarm message blinks and


the buzzer sounds:
(Blinks)

S Y S T E M m R R O R
CODE 9 0

If a system error occurs during recording, the operator should stop


the FX-2111 from recording (stop the motor). All the operation keys will
be ineffective. Also, the normal operation will not be recovered unless
the power is turned off once.
Error codes and causes are as follows:

Code Type Description


01 Overheat Thermal print head is abnormally heat-
ed to over 60oC.
02 ROM error Checksum error
03 RAM error RAM's read/write error

04 Unused interrupt 1 Unused software interrupt


05 Unused interrupt 2 Unused software interrupt
06 RTM error 1 Task No. to RTM macro is illegal.
07 RTM error 2 Task status to RTM macro is improper.
08 RTM error 3 Task's queue area overflows.
RTM: Real-time monitor

4-5
5 .
Disassembling/Reassembling the FX-2111
For maintenance, inspection and replacement of ROM and other
components, you need to disassemble the instrument. Use the follow-
ing steps to disassemble: The FX-2111 will be reassembled in the reverse
"

order. Also, refer to the Chapter 9 Structural Diagrams" when disas-


sembling.

When disasssembling or reassembling the FX-2111, take the follow-


ing cautions:

A Caution
Disassembling/Reassembling Precautions
. Be sure to disconnect the power cord and make sure the instru-
ment is turned off before disasasembling or reassembling.
. Do not remove the battery before disconnecting any PC board .

. Take care that repeated disconnection of the key panel and sen-
sor board may result in poor contact.
. Use proper tools to loosen screws .

. When reassembling make sure that all screws are securely tight-
,

ened and all connectors are completely inserted.


PC Board Handling Precautions
. PC boards are equipped with highly sensitive components to static
electricity.
. PC boards are highly sensitive electronic devices Put removed PC
.

boards in a proper protective bag or take appropriate measures to


protect them.
Handle PC boards carefully. A shock to them may damage the com-
ponents.
. Never insert a connector to the powered PC board nor remove the
powered PC board.

4-6
51 .
Diassemling Procedure
Take the following steps to disassemble the FX-2111: (The procedure described here
is for the model equipped with the battery.)

Doublt Semus Screw (S)


~ ~
,

M3x8

e7)
g3
jo

Step 1: Remove the cover of paper magazine Step 2: Open the battery cover on the bottom
and the paper shaft. panel and remove the battery.

Irom Ttanslormer
2-Double Semus Screw (S)
,

Irom RecodJer Motor


Thermal Array Head Cable
Sensor Cable
fe I
Double Semus Sciew (S) .
M3x8

1/
-

51

.
*

0*
4-Double Semus Sciew (S) M3x8
.

Step 3: Loosen four screws on the bottom Step 4: Diconnect connectors from the PC
panel and remove the upper case. board and loosen two screws on the
PC board. Then, the PC board can be
removed.

4-7
Double Semus Screw (S), M3x8

3-Double Semus Screw (I). M3xB

r -
-

>

8
0
8
0
0
8
0

Step 5: Loosen three screws which fix the Step 6: Loosen the screw which fixes the
recorder onto the botton panel and power board PCB-6238 and the trans-
remove the recorder. former onto the bottom panel. Dis-
connect the connector from the
transformer and remove the power
board.

2- Double Semus Screw (S) ,


M3»8

el
0

Step 7: Loosen the screws whch fix the


transformer onto the bottom panel.
Then, remove the transformer and
grounding parts. Now, disassem-
bling is complete.
4-8
CHAPTER
5
Periodical Inspection
1 . Periodical Inspection 5-1
1 1 Checking lead cable and power cord
. 5-1
1 2 Visual inspection
. 5-1
1 3 Cleaning the FX-2111
. 5-1
1 4 Self-test and total function check
.
5-1
15
. Battery check 5-2
2 . Safety Inspection 5-2
2 1 Measuring leakage current
. 5-2
2 2 Measuring protective grounding resistance
. 5-5
2 3 Remarks
.
5-6
1 . Periodical Inspection
In this chapter, we describe the inspection to prevent troubles and
let the FX-2111 keep the sufficient safety and complete operating condition.
Perform the following at least once a year:
Check the lead cable, power cord, and grounding wire for any possible
damage.
. Conduct visual inspection .

. Clean the FX-2111 .

. Perform the self-test and total function check .

. Check the battery .

. Check the leakage current .

Measure the protective grounding resistance.

As with simple inspection, recommend the user to make it every day


or week. But let the user refer a complete function check and troubleshoot-
ing to the service engineer authorized by Fukuda Denshi.

11 .
Checking lead cable and power cord
Visually check the lead cable and power cord for any possible damage.
Check also the connectors for any possible looseness. If a damage is
found, replace them as required. Merely applying a tape may not repair
the cable sufficiently.
Also measure the resistance of each electrode to check for internal
cable disconnection and damage.

1 . 2 Visual inspection
. Check that mechanical parts such as screws are securely fitted .

. Check that connectors inside the FX-2111 are securely connected .

. Check that there is no trace of damage .

. If a loose part is found tighten it securely.


,

1 . 3 Cleaning the FX-2111


The recommended number of cleaning times depends on the oper-
ating frequency and environment.

For cleaning, wipe the casing with a properly wetted soft cloth. You
can use the cleanser for tableware by weakening it with water. However,
take care that the cleaning solution or water may not enter the inside
through openings. Finally, wipe off wetty substance with a dry cloth.

1 4 Self-test and total function check


.

Perform the self-test described in "4. Maintenance" and check the total
function of the FX-2111 to ensure that the equipment operates safely and
completely.

5-1
15
. Battery check
Measure the voltage between plus and minus sides of battery to check
the capacity. If it is below 9V, charge the battery. Also, if the battery has
not been charged for six months, charge it. If the battery will not be used
for a long period of time, remove it from the FX-2111 and store in a cool
place.

If the battery is below 6V, it may be difficult or impossible to charge.


In such a case, replacement is required.

2 . Safety Inspection
To ensure the safety of FX-2111, it is recommended to perform safety
inspection. The test methods and measuring instruments are stipulated
in the standard for safety test. It is considered extremely difficult to fully
follow the standard for the safety test at the health care site. In checking
for maintenance and inspection, therefore, measure each specified value
as a rough rule of thumb.

We describe here examples of simplified measurement of leakage


current and protective grounding resistance.

A Caution
If you find a value which exceeds the allowable level, be sure to let
the user avoid using the FX-2111. If the user operates the FX-2111 as
it is, he/she may receive an hazardous accident.

2. 1 Measuring leakage current


Prepare an instrument to measure the leakage current (electronic or
digital voltmeter), impedance device and power switch box.

The impedance device has the following configuration:

R1: 10kn ±5%


R2: 1kfi ±1%
R 1 C1: 0.015tiF ±5%
V: Voltmeter
R 2 C 1 -r V

You can obtain a leakage current by measuring voltages at both ends


of the impedance device.

5-2
The digital voltmeter shall indicate a true root mean square value to
a composite waveform of a frequency band from DC to 1MHz. If such a
voltmeter is not available in hand, you may use a commercially available
digital voltmeter for the purpose of simple maintenance and inspection.
However, make sure of the frequency band of the voltmeter and note that
the voltmeter will not indicate a leakage current at a frequency exceeding
the capacity.

(1) Example of checking ground leakage current (current flowing in pro-


tective grounding conductor)

Power Switch Box

Polarity Switches
oa
POWER -
-

ob Medical
-
O Electronic
a
Wall Outlet Instalment
-
°b

GND
o
GND Oft
'
-

A Point 8 Point
Power Cord

M D MD=lmpedance Measurement Device

See the figure above. A gounding terminal and the power switch box
which allows you to switch the polarity facilitate measurement of
ground leakage current.

The procedure to measure ground leakage current using the power


switch box is as follows:
. Measurement of ground leakage current is made by measuring
voltages at B point (grounding conductor of power cord) and A point
(wall grounding terminal) under normal condition and single fault con-
dition.

Normal condition
. Measurement of ground leakage current under normal condition is
"

made by switching the polarity switches to a" positions, then to


"
b" positions. Thus, measurement is made in two ways.

Single fault condition


. Measurement of ground leakage current under single fault condi-
tion is made with a power fuse removed by switching the polarity
switches as above. Since the same measurement is made with
another fuse removed, measurement for single fault condition is made
in four ways.

5-3
(2) Example of measuring enclosure leakage current (current flowing from
enclosure to the ground)

Power Swdch Box

; Polanty Switches !
POWER -

Oj-
-

ob
Medical
Wall OuUel Electronic
Insirument
GND
GND T-O
B Point
A Point Opsn lor ilngla lauli condillocy-
Power Cord

| M D \- Metal Foil

Probe

MO Impedance Measuiement Device

Or

Apply a metal foil of 20 x 10 cm to the isolated enclosure. Put the probe


to the metal foil for measurement.

Measurement of enclosure leakage current is made by measuring


voltages at A point (wall grounding terminal) and B point (desired
part of enclosure).
If the enclosure is isolated, stick a metal foil (e.g. aluminium foil) onto
the enclosure with a conductive tape and apply the probe to that
metal foil.
Measurement of enclosure leakage current under normal condition
is made by switching the polarity switches to "a" positions, then to
"
b" positions. A value measured under normal condition will be a
very small value near zero.
Measurement of enclosure leakage current under single fault con-
dition is made with the wall grounding terminal and the grounding
conductor of power cord removed and by switching the polarity of
power source.

In leakage current measurement, take a maximum value as the meas-


urement result.

The following are maximum allowable ground leakage current and


enclosure leakage current: In inspection, it is important to compare meas-
urement values with past ones to check for any outstanding difference.
Maximum allowable leakage currents (117/253V AC)
Normal condition Single fault condition
Ground leakage current 0 5mA
.
1 0mA
.

Enclosure leakage current 0 1mA


.
0 5mA
.

5-4
22. Measuring protective grounding resistance
According to the standard, protective grounding resistance shall be
measured by letting the testing transformer flow an AC current of 10-20A
from a power source of which the voltage with no load does not exceed
6V. Practically, however, it is not easy to prepare such a testing device.
We show therefore a simplified method as follows:

O o
Power Iranslormer shall be able lo let a curfent of 1-
3A How at a voltage ol less than 6V with no load .

Medical Eqjipmenl
VW Or
Power A Point 30 C Point EO
Transformer (SOW) Metal Part
VI (Voltage between
6
A C A and C)

6V o
2 30 V
V2 (Voltage between R: Protective Grounding
B and C) Resistance

B Point
.
O

El
t
Power Cord '

Simplified Measurement of Protective Grounding Resistance


The testing circuit above allows you to measure the protective ground-
ing resistance of equipment using an AC current of 2A or so. Connect the
power cord of equipment to El and the metal part (such as equipoten-
tialization terminal) to EO. Make the conductor to EO shortest possible to
suppress the contact resistance. Flow a current of 2A or so to the equip-
ment and measure voltage V1 between A and C points and V2 between
B and C points.

Since the flowing current is the same, the subject protective grounding
resistance can be obtained through the relations between the voltage ratio
and resistance ratio as follows:

R/3 = V2/V1 R (protective grounding resistance) = 3 V2A/1 (fi)


"

. .

Measurement current may be 1A or so.


With the standard, the resistance between an accessible conductive
part and the protective grounding terminal shall be 0.1 Q maximum. In meas-
urement at the grounding conductor of power cord with the power cord
connected, the grounding resistance including that of the protective
grounding conductor of power cord shall be 0.2ft maximum.
Protective grounding resistance
Resistance between protective grounding terminal 0 10 maximum
and potential equalization terminal
.

Protective grounding conductor of power cord and 0 20 maximum


potential equalization terminal
.

5-5
2 3 Remarks
.

Abovementioned measurement of protective grounding resistance


requires the power transformer which can flow an AC current of several
amperes and a testing fixture. If you cannot prepare such a testing power
transformer, you may measure it with the following method to obtain a
rough rule of thumb:
Measure the resistance between an accessible conductive part and
the protective grounding terminal to verify that it is lower than 0.1ft. If you
measure the protective grounding resistance with the grounding conductor
of power cord as the protective grounding terminal, the resistance shall
be lower than 0.2ft including that of the protective grounding conductor.
You need also to adjust the resistance of the testing lead or probe
used for measurement.

Reslsianca Measuring InsUument Medical Ecjjipmenl


Testing Lead
Accessible Conductive Part
(e.g. potential equalization terminal)
< 0 . 1 fi

Protective Grounding Terminal

Potential Equalization Terminal


po-m
nvj

Protective Grounding Terminal

Simplified Method of Resistance Measurement


This method considerably differs from that of the standard. Consider
the result as a rough rule of thumb.

Protective grounding resistance


Resistance between protective grounding terminal 0 1ft maximum
and potential equalization terminal
.

Protective grounding conductor of power cord and 0 2ft maximum


potential equalization terminal
.

5-6
CHECK SHEET FOR PERIODICAL INSPECTION

Inspection Date: Inspected by:

Model Number Installation Site

Serial Number Years of Use

Check Items Judgment/Measurement : Remarks (Repair Required)


VISUAL INSPECTION

1 Cords and Cables


.

Power cord and lead cable for damage Pass/Fail

Connections of power cord and lead cable Pass/Fail

2. Casing and Accessories


. Casing for damage such as crack Pass/Fail
. Casing for dirt Pass/Fail
. Labels for fading letters Pass/Fail '
. Screws for loooseness and dropout Pass/Fail
. Electrodes for dirt and rust Pass/Fail
. Expendables and operation manual Pass/Fail

3 Connectors
.

. Power and lead connectors for damage and looseness Pass/Fail


r
-

4 Others
.

. Power fuses for breakdown Pass/Fail

Protective grounding terminal for damage Pass/Fail

Switch panel for damage and dirt Pass/Fail

Thermal print head for damage and dirt Pass/Fail

Paper magazine for damage and dirt Pass/Fail

LCD module for damage and dirt Pass/Fail

ELECTRICAL INSPECTION
. AC operation and battery operation Pass/Fail
. Time constant test Pass/Fail

. Recorder test (paper speed & sensitivity) Pass/Fail

. Printout test (for missed dots) Pass/Fail

. Key test Pass/Fail


. LCD test Pass/Fail

. Auto power-off test Pass/Fail

. Battery charge V) Pass/Fail Charge OK/NG


SAFETY

. Ground leakage current (normal condition) |jA Pass/Fail


(single fault condition) pA Pass/Fail
. Enclosure leakage current (normal condition) |iA Pass/Fail
(single fault condition) |jA Pass/Fail
. Protective grounding resistance Q Pass/Fail

OTHERS

5-7
CHAPTER
6
Circuit Diagrams

Overall Block Diagram 433-5125 6-1


Overall Block Diagram 433-4893 6-3
Main Board Circuit Diagram, 1/9 to 9/9 523-2020... 6-5 to 6-21
Power Board Circuit Diagram 524-2021 6-23
Sensor Board Circuit Diagram 524-1959 6-24
Motor Module Circuit Diagram 524-1960 6-25
Battery Pack Circuit Diagram 524-1961 6-26
Overall Connection Diagram 433-5126 6-27
Overall Connection Diagram 433-4894 6-29
LCD Connection Diagram 434-4895 6-31
Motor Connection Diagram 434-4896 6-32
r .

.
Main Board

DC Input *
.
Bult.r
Pr.B-6409 , i
Amplifier' Power Supply ' : i

>
A C 1 1 5 V
i
- 5V
I i
5 Isolated Section I
rs
u
J
! fi! T .
""

i r- 1
c - 1
n
Butttr
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Resislanct
NelworK lor
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Preamplilici
it
Time
ConsUnt/
Reset
'
Middle
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ModulaiJon
Circuit
.

Tranjlormer
Demodulation
Circuit I->
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i US
< £ IA
. +5V
'

: i
I . , AC Input
i
i
I
i25 .

I
.
u
Circuit '
I . AC Inlet Board
'

I I \\ PCB-€410
5 Triangular |_ '

r-»Wav*
j- \\
liaV
_
'
Generator ~
i:

1
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i . - - -
. I
*
i
i
I +VFB J
Circuit

21
I Digital
Power
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.

i
i
Oscillator Supplies
Rectifier
Trans I or mc/
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R-wav* Overinpul f jlse
t
i
: i
Detector Detector Generator
Circuit Circuit Circuit i
T
+ 10'/ ; i
i
,

CPU ; i

KM
Photo
Photo i 1 i
Coupler Coupler H063B09
i
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i
?.
i .
A _ + 24V

In i
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-

Sensor
.
T 0 i i
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'

PCB-62 39 Circuit ROM i


A R
i

FD88O07-AC E AM27C512 , i
Charging
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I

Motor Module Motor U S »| A V A T :i


NF-26P1/25|* Control
s _
7t :i
B RAM
I ji
4 \

TEMP U SRM2264-12 r

t
Thermal S SKbvte
Prinl Head
T
Ni-MH
QS6-F RAM CLK r Battery
L - . - - . .1
SRH2254-12 16HHz LCD i PacK

8Kbyte NOH202AOO Key Panel


i
lor Thermal Prinl Head

TITLE DRAWING NO.

Overall Block Diagram 433-5125

MODEL NO. ASSEMBLY NO. DATE

FX-2111 (USA) 96.10.9

6-1
,
Main Board .

DC Inpul -
3
.
Butter
'
pcb-6409 Power Supply 1 ;
-.1

Amplitief

i
- sv AC 230 V
o
rs Isolated Section
i
1
|i
c
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Preamplilicr Middle
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5£ ! .
, AC Input
5 Network lor ConslanU Isolation Amplifier
V
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-

xB '
-
3 Amplifier Circuit
Circuit o
Lead Seltctior Reset Transformer' xl.25 + 5V
125
o
Circuit AC Inlet Board
fc
3 I
I Triangular u
1 ,
pcB-e4io
I
r-SWave
11.
ItnV
_

Generator
Push-
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Pull
Control Circuit Translormer Circuit
i I Digital i *
i iVFB AT in
Power
+ 5V
i

i
Oscillator Supplies
Rectifier
Transformer
Circuit
R-wave Overinput Pulse
Oelector Detector -
5 Generator
+ 10V t
Circuit Circuit Circuit
v I

Photo Photo CPU


Coupler Coupler HD63809

Recorder D 2MHz
A FET +2 V
> i

Sensor Board: Sensoi


.
T i D
Circuit X Gate Array
PCB-5239 -
5 A R ROM
FD88007-AC E AM27C512
Charging
8 S 64Kbyte Circuit
I
Motor Module Motor
< -
U S > AVJT
Control i
NF-26P1/25 S
B RAM
J
TEMP U SRM2264-12 r
.

i
Thermal S 8Kbyte
Print Head
Ni-MH
056-F R AM CLK
Battery
U ?
I

i
SRH2264-12 16MHz LC 0 i Pack

8Kbyte NDM202AOO Key Panel


-
i
lor Thermal Prim Head
t

TITLE DRAWING NO.

Overall Block Diagram 4334893

MODEL NO. ASSEMBLY NO. DATE

FX-2111 (CE) 96.10.9

6-3
noi!) i miss omtnsi smcifih
.
.

AU IEC1ST01S tit IN Q ±\%, I. ||


,

ALL cmcims tit IK U F

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Fl F2 +RV -RV VDD


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IC23 TC74HC04RF ±4.

TITLE DRAWING NO.

Main Board Circuit Diagram, 1/9 523-2020

MODEL NO. ASSEMBLY NO. DATE

FX-2111 PCB-6409 95.01.09

6-5
co1 rc:200H>
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DRAWING NO.
TITLE

Main Board Circuit Diagram, 2/9 523-2020

ASSEMBLY NO. DATE


MODEL NO.

FX-2111 PCB-6409 95.01.08

6-7
R12(. 2K
v/V -
>
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TITLE DRAWING NO.

Main Board Circuit Diagram, 3/9 523-2020

MODEL NO. ASSEMBLY NO. DATE

FX-2111 PCB-6409 95.01.08

6-9
-
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.
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TITLE DRAWING NO.

Main Board Circuit Diagram, 4/9 523-2020

MODEL NO. ASSEMBLY NO. DATE

FX-2111 PCB-6409 95.01.08

6-11
V/OD
6

Rise
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1 K
1 t <i5b4

TITLE DRAWING NO.

Main Board Circuit Diagram, 5/9 523-2020

MODEL NO. ASSEMBLY NO. DATE

FX-2111 PCB-6409 95.01.08

6-13
2SC

R 14

22; Jfcv
2i

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TITLE DRAWING NO.

Main Board Circuit Diagram, 6/9 523-2020

MODEL NO. ASSEMBLY NO. DATE

FX-2111 PCB-6409 95.01.08

6-15
6 nC PCTCCT rpBBOO?
03 01 -* " "

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TITLE DRAWING NO.

Main Board Circuit Diagram, 7/9 523-2020

MODEL NO. ASSEMBLY NO. DATE

FX-2111 PCB-6409 95.01.08

6-17
P7
0637015 1000600 CKY0CERO ELC0>

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DRAWING NO.
TITLE
Main Board Circuit Diagram, 8/9 523-2020

DATE
MODEL NO. ASSEMBLY NO.

FX-2111 PCB-6409 95.01.08

6-19
P2
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MODULE THERMAL HEPD


MODULE

TITLE DRAWING NO.

Main Board Circuit Diagram, 9/9 523-2020

MODEL NO. ASSEMBLY NO. DATE

FX-2111 PCB-6409 95.01.08

6-21
J

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TITLE DRAWING NO.

Power Board Circuit Diagram 524-2021

MODEL NO. ASSEMBLY NO. DATE


FX-2111 PCB-6410 96.01.08

6-23
r I s r>
L

3 5
-
a

IN

DRAWING NO.
TITLE
524-1959
Sensor Board Circuit Diagram
DATE
MODEL NO. ASSEMBLY NO.
PCB-6239 94.07.14
FX-2111

6-24
NF-26P . /2'i
.

M 1
r: i to
WED
n72 Or3i>-SP-2D50
2

n; 3

MT 4

_ ELU£ .

MOTOR
MODULE

TITLE DRAWING NO.

Motor Module Circuit Diagram 524-1960

MODEL NO. ASSEMBLY NO. DATE

FX-2111 94.07.14

6-25
VHfl-4M
©(- VHfi-ON

H 1

2
t
9 6V
. HOOmOh
3

1 I
-I H H H '
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Ni-MH BATTERY PRCK


6-HRflRFD

TITLE DRAWING NO.

Battery Pack Circuit Diagram 524-1961

MODEL NO. ASSEMBLY NO. DATE

FX-2111 94.07.14

6-26
F C P-2 2 2 2 A T
INLET BOARD

PI LCD P10

0
Ni-MH
i

PZ P2 i
BATTERY
PACK

MOTOR P3 DC [ N
0 0
NF-26P1/25 P4
PC8-6410
MOTOR CABLE

MA I N B 0 A RD i- \

THE RMAL THEMAL CABLE P5


HEAD P8 PATIENT
CABLE
/
Q56-F P6
P7

S W PANEL
SENSOR BOARD F X - 2 1 1 1

PCB-6239

TITLE DRAWING NO.

Overall Connection Diagram 433-5126

MODEL NO. ASSEMBLY NO. DATE

FX-2111 (USA) 96.10.09

6-27
FCP-2222W
INLET BOARD

PI L CD : pio

i Ni-MH
P2 P2 BATTERY
PACK

MOTOR P3 DC TN
u u

PCB-6410
v.
6 NF-26P1/25 P4

MOTOR CABLE

MA IN BOARD \

THE RMAL THEMAL CABLE P5 s


HEAD P8 PATIENT
CABLE

Q56-F P6
P7

SW PANEL
SENSOR BOARD F X-2 1 1 1

PCB-6239

TITLE DRAWING NO.

Overall Connection Diagram 4334894

MODEL NO. ASSEMBLY NO. DATE

FX-2111 (CE) 96.01.08

6-29
SOLDER

NDM202AOO
14
3

2
>
33 AXL214901
2

(7)

TO F4

TITLE DRAWING NO.

LCD Connection Diagram 434-4895

MODEL NO. ASSEMBLY NO. DATE

FX-2111 96.01.08

6-31
MOTOR
NF-26P1/2 5

r
10

SUMITUBE F2
3 xO. 25 SDMI TUBE F2
6x 0. 25

o 1 0 0 mm

HIRING (BRN) HIRING (RED)


SOLDER SOLDER

HIRING UL1007 AHG28


6 1
HIRING LENGTH BRN 1 6 Omml pin connector
RED 14 0 2 pin DF3-6S-2C
ORG 1 7 0 3 pin contact
YEL 4 pin DF3-24 28SC
BLU Spin
PUR Spin

TITLE DRAWING NO.

Motor Connection Diagram 434-4896

MODEL NO. ASSEMBLY NO. DATE

FX-2111 96.01.08

6-32
CHAPTER
7
laqram

Main Board Assembly Diagram, 1/2 & 2/2 433-4897 7-1 to 7-3
Inlet Board Assembly Diagram 434-4899 7-5
HOW 10 MOUNT IC22
(PQ30RV11)

COMPONENT SIDE
PCS-6X09 C35
SILK CHART

is FLUX AREA . 65 CI

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IC31

TITLE DRAWING NO.

Main Board Assembly Diagram, 1/2 433-4897

MODEL NO. ASSEMBLY NO. DATE


PC BOARD
FX-2111 PCB-6409 95.12.15

OMPOfCNT SIDE
7-1
is FLUX AREA . tV jr''
5
1

W AREA ARE NOT REQUI

TITLE DRAWING NO.

Main Board Assembly Diagram, 2/2


MODEL NO. ASSEMBLY NO. DATE

FX-2111 PCB-6409
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TITLE DRAWING NO.

Inlet Board Assembly Diagram 434-4899

MODEL NO. ASSEMBLY NO. DATE

FX-2111 PCB-6410 96.01.08

7-5
CHAPTER
8
Electrical Parts Lists

1 FX-2111 Main Blocks


.
674-11338 8-1
2 Main Board, PCB-6409 SAS SMD for FX-2111
.
674-11339 8-2
3 Main Board, PCB-6409 THD for FX-2111
.
674-11340 8-9
4. AC Inlet Board, PCB-6410 THD for FX-2111 (115V)... 674-11664 8-11
5 .
AC Inlet Board, PCB-6410 THD for FX-2111 (230V)... 674-11340 8-12
6 . LCD Assembly for FX-2111 674-11342 8-13
7 . Parts Supplied to Wiring/Assembling Process
for FX-2111 674-11343 8-14
1 FX-2111 Main Blocks
.

674-11338

Parts No. Symbol Description Drawing No. Q'ty Remarks

9E3041 PC Board AS 1

Main Board

9F3419 PCB-6409 with ROM 1

9F3293 ROM Set 674-10486 1

9F3424 PCB-6409 SAS 1

9G3739 PCB-6409 SMD 674-11339 1

9G3740 PCB-6409 THD 674-11340 1

AC Inlet Board

9F3420 PCB-6410 Assembly 674-11341 1

9F3421 LCD Assembly 674-11342 1

9D0995 Set of Supplied Parts to Assembling Process (CE) 1

9E2793 Set of Assembled Electrical Parts (2307) 674-10513 1

9E3042 Set of Assembled Electrical Parts (CE) 674-11359 1

9D0996 Set of Supplied Parts to Wiring Process (CE) 674-11343 1

8-1
2 Main Board, PCB-6409 SAS SMD for FX-2111
.

674-11339

Parts No. Symbol Description Drawing No. Q'ty Remarks

Resistors

1A7510A R1, 15, 23, RK73H2AF, Square Chip lOkfi 30


75-77,
145, 163,
168, 176,
181, 192,
197, 200,
202, 207,
209, 212,
219, 220,
226, 227,
229, 230,
232, 236,
239, 242,
245

1A7503A R2~11, 14, RK73H2AF, Square Chip 20kfi 51


26, 29, 30,
34-40,
43, 46 57,
,

68-70,
86-92,
140, 158,
182, 183,
189-191,
195, 196,
201, 204,
210, 211,
225, 241,
254, 255

1A7685A R12, 84, 110 RK73H2AF, Square Chip 12kG 3

1A9662A R13, 41, 51, RK73H2AF, Square Chip 30kn 8


72, 80,
199, 206,
215

1A7641A R16, 117, RK73H2AF, Square Chip 560kn 3


148

1A9666A R17, 32, 58, RK73H2AF, Square Chip 200kn 8


116, 169,
173, 231,
252

1A9657A R19, 59, RK73H2AF, Square Chip 3kil 5


119, 164,
222

1A9655A R20, 28, 64, RK73H2AF, Square Chip 1kfi 14


65, 67, 82,
93-100,
105, 109,
132, 133,
136, 144,
150, 156,
217, 248

8-2
2 Main Board, PCB-6409 SAS SMD for FX-2111. continued
.

674-11339

Parts No. Symbol Description Drawing No. Q'ty Remarks

1A7512A R85, 147 RK73H2AF, Square Chip 16kn 2

1A7502A R22 RK73H2AF, Square Chip 6 8kG


.
1

1A9263A R24 SR73K2EJ, Metal Film 0 1fi/0.5W


.
1

1A7522A R25, 63, 81, RK73H2AF, Square Chip lOOkfi 5


141,142

1A7545A R27, 61, RK73H2AF, Square Chip 5 1k0


.
10
103, 171,
174, 214,
216, 228,
249, 250

1A7571A R31 RK73H2AF, Square Chip 300fl 1

1A9631A R33 RK73K2AF, Square Chip 100 1

1A7534A R42, 62 RK73H2AF, Square Chip 3 48kU


.
2

1A7584A R44, 45, 56, RK73H2AF, Square Chip 1Mfi 11


78, 124,
125, 165,
166 , 218,
244, 246

1A9653A R47, 48, 55, RK73H2AF, Square Chip 1001] 6


74, 115,
161

1A9656A R49, 50, 52, RK73H2AF, Square Chip 2kU 14

71, 73,
126-129,
143, 159,
178, 179,
187

1A9396 R53 RN73F2ATD-B, Metal Film 1

1A9398 R54 RN73F24TD-B, Metal Film 1

1A9303A R60 RH73H2AF, Square Chip 28.7k(] 1

1A9271 R66 RK73H3AF, Metal Film IkO/IW 1

1A7681A R79 RK73H2AF, Square Chip 2 2kQ


.
1

R7519A R83, 146, RK73H2AF, Square Chip 51 kl) 15


160, 193,
198, 203,
205, 208,
213, 221,
223, 237,
240, 243,
247

8-3
2 Main Board, PCB6409 SAS SMD for FX-2111., continued
.

674-11339

Parts No. Symbol Description Drawing No. Q'ty Remarks

1A7547A R85, 147 RK73H2AF, Square Chip 16kn 2

1A7656A R101, 151, RK73H2AF, Square Chip 240ki] 3


162

1A7558A R104, 122 RK73K2AF, Square Chip 42.2fl 2

1A7689A R106, 108, RK73H2AF, Square Chip 82kn 5


111, 155,
167

1A9665A R107 RK73H2AF, Square Chip 120kQ 1

1A9397 R112~114 RN73F2ATD-B, Metal Film 78.7ki] 3

1A7674A R118, 121, RK73H2AF, Square Chip 430n 5


123, 149,
152

1A7652A R120, 131, RK73H2AF, Square Chip 13kn 4


157, 238

1A7616A R130 RK73H2AF, Square Chip 56kn 1

1A9270A R134 SR73H2EF, Metal Film 0 51Q/0.25W


.
1

1A7604A R135 RK73H2AF, Square Chip 1 43k£l


.
1

1A7540A R137, 138, RK73H2AF, Square Chip 24kQ 4


233, 251

1A7554A R139 RK73H2AF, Square Chip 36kfi 1

1A7578A R153, 154 RK73H2AF, Square Chip 150fi 2

1A7202 R170 TRN60LG, Cylindrical Tantalum Alloy


3 5Mn
.
1
1A7591A R175, 180, RK73H2AF, Square Chip 160kfi 4
234, 253

1A7526A R172, 177 RK73H2AF, Square Chip 2

1A9393 R184 RN73F2ATD-B, Metal Film 11011 1

1A7640A R185, 186 RK73H2AF, Square Chip 140kfi 2

1A7587A R188 RK73H2AF, Square Chip 3 4kQ.


1

1A9395 R194 RN73F2ATD-B, Metal Film 13kn 1

1A7668A R256~259 RK73H2AF, Square Chip 220n 4

1A7528A R224 RK73H2AF, Square Chip 698kH 1

8-4
2 Main Board, PCB-6409 SAS SMD for FX-2111, continued
.

674-11339

Parts No. Symbol Description Drawing No. Q'ty Remarks

Capacitors

1B5021A 01,2, 4, 6, GRM40F104Z50, Layered Ceramic Chip 0.1 pF 59


7 11, 13,
,

14, 22, 25,


26, 28-34,
36, 37, 39,
40, 42, 43,
45, 49, 50,
52, 53,
61 -63,
66-68,
73, 76, 77,
85, 86, 89,
93, 94, 96,
97, 99,
100,
105-108,
116-119,
125-128

1B1701 C3 ECSTCY105, Tantalum Electrolytic 1.0(jF 1

1B5412A C5, 27 EEV-H81CV220, Aluminum Electrolytic 22nF/16V 2

1B5408A C8 EEV-HBIHV0010, Aluminum Electrolytic 1mF/50V 1

1B5073A C9, 16, 41, GRM40CH1U2J50, Layered Ceramic lOOOpF 7


56, 58, 87,
88

1B0702 C10 25CV100GX, Aluminum Electrolytic Chip


for High Frequency 100uF/25V 1

1B5055A C12, 51, 69, GRM40B222K, Layered Ceramic 2200pF 4


134

1B0209 C15 16SM6R8M, OS 6.8mF/16V 1

1B0208 C17, 21 10SM22M, OS 22tiF/10V 2

1B5019A C18 GRM40CH101J, Layered Ceramic 100pF 1

1B5022A C18, 20, 57, GRM40B103K, Layered Ceramic O.OIpF 8


59, 60, 65,
75, 115

1B5062 C23, 24, 38, MCH215C223K, Layered Ceramic 0.022mF 5


47, 71

1B5002A C35 GRM40CH510J, Layered Ceramic 51pF 1

1B8501 C44, 90, 91 35CV47GX, Aluminum Electrolytic Chip


for High Frequency 47pF/35V 3

1B5815 C46 ECHU1H102G, Layered Film 1000pF 1

8-5
2 Main Board, PCB-6409 SAS SMD for FX-2111
.

674-11339

Parts No. Symbol Description Drawing No. Q'ty Remarks

1B5027 C48, 131, MCH215A561J, Layered Ceramic 3


133

1B5816 C54 ECHU1C332G, Layered Film 3300pF 1

1B5402A C64, 70, 95 EEV-HB1 EV4R, Aluminum Electrolytic


4 7nF/25V
.
3

1B5513A C55, 83 GRM42-6F224Z, Layered Ceramic 0.22nF 2

1B5011A C72, 74 GRM42-6B473K, Layered Ceramic 0.047mF 2

1B5818 C78 ECHU1C683J, Layered Film 0.068mF 1

1B5261 C79, 80, 92 ECWU1C224J, Layered Film 0.22nF 3

1B5076A C81, 100, GRM40B332K, Layered Ceramic 3300pF 6


110, 112,
124, 135

1B5044A C84 GRM40B153K, Layered Ceramic 0.015nF 1

1B5003A C98, 103, GRM40CH101J, Layered Ceramic 150pF 9


104, 113,
114, 120,
121, 123,
129

1B5403A C101, 102 EEV-HB1EV330, Aluminum Electrolytic


4 7nF/16V
.
2

1B5808 C111,113 ECHU1H140J, Layered Film O.lpF 2

1B5014C C130 MCH325F274Z, Layered Ceramic 0.47nF 1

1B5001A C132 GRM40CH300J, Layered Ceramic 30pF 1

1B5074A C138 GRM40CH331J, Layered Ceramic 330pF 1

Diodes

3929 D1~6 D3FS4A (2.6A, 40V) 6

1D4200 D7 02CZ-5.1V, Zener 1

1B3885 D8, 1, 15, 32 1SS301 3

1D3886 D9, 11, 12, 1SS302 18


16, 17, 19,
20, 23-31,
33, 34

1D4113 D10 02CZ-3.0K, Zener 1

1D3928 D13, 14, 18, D1FS4A 4


21

8-6
2 Main Board, PCB-6409 SAS SMD for FX-2111, continued
.

674-11339

Parts No. Symbol Description Drawing No. Q'ty Remarks

1D4552 D22 U1ZB12, Zener 1

Transistors

1D1735 Q1~3, 5, 8, UN5212 13


12 14, 15,
,

27, 29, 30,


33, 38

1D989 Q6 2SC-2713GR 1

1D0116 Q7 2SA-1163G 1

1D2385 Q9 2SK-739-2, FET 6

1D2392 Q10 2SK-1062, FET 1

1D0117 Q11 2SA-1162V 1

1D1734 Q13, 18, 26, UN5112, Digital 6


28, 42, 43

1D0968 Q16 2SC-1623(L5/L6) 1

1D2394 Q17 2SJ245S, FET 1

1D2382 Q19, 22, 23, SST4393, FET 6


31, 32, 34

1D2342 Q20, 21 2SK1920-FA, FET 2

1D0153 Q25 2SA-1463(1 K) 1

1D1713 Q35~37, FMW2 9


39-41,
44-46

Integrated Circuits

1E5037A IC2, 5 HM6264BLFP-10LT, RAM 2

1E2769 IC4 NJM2103M, Reset IC 1

1E6168 IC6 HA16120FP, Switching Regulator 1

1E6245 IC7 PQ05SZ5, Low-loss Regulator 1

IE2621 ICS FD88007-AC, Gate Array 1

1E6235 IC9, 33 NJM78L05UA, 3-terminal Regulator 2

1E7205 IC10 S-8437AF , Inversion-type Switching Regulator 1

1E5390A IC11 TC-74HC245AF, CMOS Logic 1

8-7
2 Main Board, PCB-6409 SAS SMD for FX-2111, continued
.

674-11339

Parts No. Symbol Description Drawing No. Q'ty Remarks

1E4424 IC12, 19 TC-4584BF, CMOS Logic 2

1E0374 IC13 HPC4074G2, Low-noise FET-input OP Amp. 1

1E5397A IC14, 23 TC-74HC04AF, CMOS Logic 2

1E5412A IC15 TC-74HC541AF, CMOS Logic 1

1E6167 IC18 bq2003S> Quick Charging IC 1

1E5543 IC16 TC7W04F, L-MOS Logic 1

1E4169 IC17 TC-4053BF, CMOS Logic 1

1E5595 IC20 TC-74AC74F, CMOS Logic 1

1E0198 IC21, 31 pPC4064G2, Low Power CoSsumption J-FET


Input Operational Amplifier

1E0715 IC24 pPC4064G2(2), Low Power Oonsumption J-FET


Input Operational Amplifier

1E2613A IC25 HEF4046BT, PLL 1

1E0266 IC26 MPC358G2, Comparator 1

1E5542 IC27 TC7W02F, L-MOS Logic 1

1E8961 IC28~30 PS2652L2-V(K), Photo Coupler 3

1E2083 IC32 LT1004CS8-1.2, Voltage Reference 1

1E7221 IC34 NJM79L05UA, 3-terminal Regulator 1

1E4177 IC35 TC-4093BF, CMOS Logic 1

1E4170 IC36, 38, 41, TC-4051BF, CMOS Logic 4


45

1E0264 IC37, 39, 42 MPC4064G2(2), Low Power Oonsumption J-FET


Input Operational Amplifier

1E4423 IC40 TC-4535BF, CMOS Logic 1

1E0365 IC43 pPC339G2, Comparator 1

1E4182 IC44 TC-4094BF, CMOS Logic 1

Coil

1T6047 L2 LPC4045TE-471K 470mH 1

1H6409 Printed Circuit Board, PCG-6409 1

8-8
3 Main Board, PCB-6409 THD for FX-2111
.

674-11340

Parts No. Symbol Description Drawing No. Q'ty Remarks

Resistor
1A7040 R18 RSSX3L20 0.01J/3W, Metal Film 1

Capacitors

1B4701 C82 ECHE1H105JZ, Metalized 1

1B0866 IC136 URS1E222MHZ 2200/25V, Aluminum Electrolytic 1

1B0713 CI37 URS1V102MHZ 1000/35V, Aluminum Electrolytic 1

Transistors

1D2393 Q4, 24 2SJ245L, FET 2

Crystal Oscillator

1D7620 XI JX0-5S 16MHz (with stand) 1

Integrated Circuits

1E1957 IC3 HD63B09E, CPU 1

1E7021 IC22 PQ30RV1/11, Low-loss Regulator 1

1E9198 DIC«?iG11S1 IC Socket


,
1

1E9199 DIC640G11S1, IC Socket 1

Lithium Battery

1U0231 BT1 CR-1/3-FT2-1 684-2428 1

Connectors

1F0215 P1 B3P-VH 1

1F1068 P2 AXB114001 BB 1

1F3208 P3 S-G8036 #01 1

1F0562 P4 DF3A-6P-2DSA 1

1F9376 P5 DF3A-15P-2DSA 1

1F0548 P6 008370061000800 1

1F1131 P7 008370151000800 1

1F1004 P8 RDAG-15SE1(F) 1

8-9
3 Main Board, PCB-6409 THD, continued
.

674-11340

Parts No. Symbol Description Drawing No. Q'ty Remarks

1F0365 P10 B4P-VH 1

Arrestor

1L4807A NE1 Y06S-230B 1

Fuses

1L4057 F1, 2 TR-5 K19374 3 15A


.
2

Coils & Ferrite Core

1T6242 L1 HK-05S035-2010 RBP 200mH 684-2109 1

1T6243 L3 HK-04D030-1510 RBP 150nH 684-2108 1

1L4584 L4 BL01RN1-A62, Ferrite Core 1

Isolation Transformers

1T6015A T1 FT-2111 684-2153 1

1T6016A T2 FT-2155 684-2154 1

Piezoelectric Buzzer

1S3200 BZ1 PKM13EPP-4002 1

8-10
4 .
AC Inlet Board, PCB-6410 THD for FX-2111 (115V)
674-11664

Parts No. Symbol Description Drawing No. Q'ty Remarks

Fuses

1L4476 239001 1A 2

1L4905 MF-561A, Fuse Holder 2

Locker Switch

1G3508 SJ-2S4A-07BB 1

AC Inlet

1D2393 NC176-1.5 1

GND Terminal

1K1151 FX-2111GND (A) 1

Connector

1F0159 B2P-VH 1

Choke Coil

1T6342 TF1028S-801Y2R0-01 1

Spacer

1Z4311 LR-1.5 1/2

Printed Circuit Board

1H6410 PCB-6410 323-3961 1

8-11
5 . AC Inlet Board, PCB-6410 THD for FX-2111 (230V)
674-11340

Parts No. Symbol Description Drawing No. Q'ty Remarks

Fuses

1L4091 No. 19195 500mA 2

1L4905 MF-561A, Fuse Holder 2

Locker Switch

1G3508 SJ-2S4A-07BB 1

AC Inlet

1D0288 NC176-1.5 1

GND Terminal

1K1151A GND (A) 314-3471 1

Connector

1F0159 B2P-VH 1

Choke Coil

1T6342 TF10283-801Y2R0-O1 1

Spacer

1Z4311 LR-1.5 1/2

Printed Circuit Board

1H6410 PCB-6410 1

8-12
5 . LCD Assembly for FX-2111
674-11342

Parts No. Symbol Description Drawing No. Q'ty Remarks

LCD

1 LI 709 NDM202A00 1

Connector

1F1085 AXL214901 1

Spacers

6B8308 SP-15 2

6B9216 Grounding Piece 1

Shielding Fingers

6B9217 (A) 1

6B9218 (B) 1

8-13
7
. Parts Supplied to Wiring/Assembling Process for FX-2111
674-11343

Parts No. Symbol Description Drawing No. Q'ty Remarks

1M0385 Motor Assembly 434-4725 1

1M0466 Inlet Board Grouding Cable 3 with Core 1

1M0482 Inlet Board Grounding Cable 3 684-2415 1

1L4581 Ferrite Core, 5977-000601 1

6G0234 Heat Shrink Tube, F2 25x0.4, 30mm long 1

1K0031 Press-fit Terminal, TMEV1.25-3 1

8-14
CHAPTER
9
Spare Parts Lists
1 PCB-6238
.
674-10554 9-1
2 PCB-6236
.
674-10555 9-2
3 . Paper Magazine 674-10556 9-3
4 .
Recorder 674-10557 9-4
5 . Upper Case 674-10558 9-5
6 Lower Case
.
674-10559 9-6
7 Screws
.
674-10560 9-7
1 PCB-6238
.

674-10554

Parts No. Symbol Description Drawing No. Q'ty Remarks

9E2963 PCB-6238B (2) Assembly for 115V 1

9F3331 PCB-6238 Assembly for 115V

5T3111 Nuts, Type 3 M6 2

5T2009 Spring Washer, Nominal Dia. 6mm 1

9E2964 PCB-6238B (3) Assembly for 230V 1

9F3310 PCB-6238 Assembly for 230V 1

5T3111 Nut, Type 3 M6 2

5T2009 Spring Washer, Nominal Dia. 6mm 1

1L4476 Fuse, 239001 for 115V 2

1L4475 Fuse, 239500 for 230V 2

9-1
2 PCB-6236
.

674-10555

Parts No. Symbol Description Drawing No. Q'ty Remarks

9E2965 PCB-6236 (1) Assembly 1

9F3307 PCB-6236 Assembly for FX-2111(N) 1

5R1604 Double Semus Screw, M3x6 2

9E2966 PCB-6236 (2) Assembly 1

9F3309 PCB-6236 (with ROM) for FX-2111 (N) 1

5R1604 Double Semus Screw, M3x6 2

1E8531 Programmed ROM for FX-2111 (36-202) 1

1L4057 Fuse, TR-5 K19374, 3.15A 2

1U0231 Lithium Battery, CR-1/3-FT2-1 684-2428 1

9F3305 LCD Assembly 634-4726 1

9F3305 Spacer, SP-15 2

9-2
3
. Paper Magazine
674-10556

Parts No. Symbol Description Drawing No. Q'ty Remarks

9H0402 Platen Roll Assembly 1

6B8324A Platen Roll 224-0890 1

6A5350 Bearing, LF-740ZZ 2

6B8325 Gear, 38A 224-0313 1

5R3003 Countersunk Screw, M2x6 1

9F2648 Paper Magazine Assembly 1

6B8323 Paper Magazine 222-0889 1

9H0402 Platen Roll Assembly 1

9-3
4 Recorder
.

674-10557

Parts No. Symbol Description Drawing No. Q'ty Remarks

9H0617 Gear 38B Assembly 1

6B8320 Gear, 38B 244-0314 1

5R8001 Setscrew, M3x3 1

9H0812 Thermal Array Head Assembly 1

6B8316 Thermal Array Head, Q56-F 684-2092 1

6B8316A Thermal Array Head Mounting Plate 213-3448 1

6B8394 Tension Coil Spring, DE542 2

5R0602 Semus Screw, M3x5 2

9F3354 Recorder Assembly 1

9H0812 Thermal Array Head Assembly 1

9H3215 Recorder Chassis SU 1

1M0385 Motor Assembly 1

9H0617 Gear 38B Assembly 1

9H3216 Grounding Piece (C) SU 313- 3461 1

6B8307 Grounding Flexible Conductor 6B8307 1

6B8395 Sensor Presser Sponge 314- 3465 1

9F3289B PCB-6295SMD Sensor Board 674-10490 1

1M0381 Thermal Array Head Cable 684-2093 1

5R1851 Double Semus Screw, M3x4 1

5R1604 Double Semus Screw, M3x8 1

9H3522 Paper Shaft SU 224-0891 1

9-4
5 . Upper Case
674-10558

Parts No. Symbol Description Drawing No. Q'ty Remarks

9F3355 Upper Case Assembly 1

9H3211C Upper Case SU 111-6621 1

6B8305 LCD Filter 114-6625 1

6B9171 Lock Spring 114-6811 1

1G9340A Key Panel 684-2146 1

5H9128 Rated Power Label (B) for 115V 154-4573 1

5H9130 Rated Power Label (C) for 230V 154-4575 1

9-5
6 Lower Case
.

674-10559

Parts No. Symbol Description Drawing No. Q'ty Remarks

9F3356 Lower Case Assembly (1) 1

9H3212C Lower Case SU 111-6622 1

6B8306 Insulation Sheet 314-3463 1

6B8327 Batter Presser Sponge 314-3466 1

9H3213A Grounding Piece (A) SU 313-3459 1

1T1558 Transformer, FCP2222AT for 115V 684-2158 1

1T1559 Transformer, FCP-2222UT for 230V 684-2157 1

6B8326A Battery Cover 112-6624 1

5H9127 Instructions Label (B) 154-4572 1

5H9138 Instructions Label (C) for 230V 154-4577 1

5H9129 Fuse Label (B) for 115V 154-4574 1

5H9131 Fuse Label (C) for 230V 154-4576 1

5H5639 Lithium Battery Label 154-3574 1

6B6796 TM-166 No. 12 1

9-6
7 Screws
.

674-10560

Parts No. Symbol Description Drawing No. Q'ty Remarks

9H3238 Set of Screws for Ni-MH 1

5R1604 Double Semus Screw, M3x8 24

5R0602 Semus Screw, M3x5 2

5R1851 Double Semus Screw, M3x4 1

5R3003 Countersunk Screw, M2x6 1

5R8001 Setscrew, M3x3 1

9-7
CHAPTER
10
Structural Diagrams
FX-2111 (USA)
External Appearance (1) 413-0994 10-1
External Appearance (2) 413-0995 10-3
AC Inlet Board 424-3619 10-5
Upper Case 423-3620 10-7
Lower Case Assembly (1) 423-3621 10-9
Lower Case Assembly (2) 422-3622 10-11
Lower Case Assembly (3) 422-3623 10-13
Exploded View 412-0996 10-15
FX-2111 (CE)
External Appearance (1) 413-0849 10-17
External Appearance (2) > 413-0927 10-19
AC Inlet Board 424-3443 10-21
Main Board* 423-3444 10-23
Paper Magazine Assembly* 423-3250 10-25
Paper Shaft Assembly* 424-3251 10-27
Recorder Assembly* 423-3252 10-29
Upper Case Assembly 423-3445 10-31
Lower Case Assembly (1) 423-3446 10-33
Lower Case Assembly (2) 423-3447 10-35
Lower Case Assembly (3) 422-3448 10-37
Exploded View 412-0928 10-39
Asterisked diagrams are common to both FX-2111 (USA) and FX-2111 (CE).
2
6
0

3sg

II
8 .S5

ii
Of
A
as TO

[J
a

TITLE DRAWING NO.

External Appearance (1) 413-0994

MODEL NO. ASSEMBLY NO. DATE

FX-2111 (USA) 96.09.30

10-1
JUL JUL

©
0) Q
ClITIOI-Ti r ii»n til r i 11 if dtclric ibid, ti ul rii*Tc tirtr.

I«I.t iti(tci«| It t*tIi(i «d if f i 111 firiooi. 1,


D
DASOBI-liil *f ciflniiB if ttti ii the grtietct tf
<1 flmtblt ittilkitici.
DA NG B K - 1 i ii it d'tiplntoi. Ii pn dpUr*' ei

9
'

pruiii* d lBtltkttilstt ilflilBikltl.

o -

D ruse 2jnv

51 [ Vrjcuwdensh)
10DE HIJITIIltT

$1 i
C A R D I MA X
Pi- 2 111 HAD

<3
Mil
Dl DFF 1ISBT

@ ®
taV
START

@
0 IS

V A

3J
STOP

a o
7

2 6 0

CA8T10R:FBD8RAl Ul SISTIICTS T8IS DtVICt TO SALS


BT 01 01 71! 0IDI1 01 A PB1S1CIA1.

Tizr
-
1

6 5mm

DRAWING NO.
TITLE

External Appearance (2) 413-0995

ASSEMBLY NO. DATE


MODEL NO.
96.09.30
FX-2111 (USA)

10-3
2

a*
o

0
® O

2-M8 Nut & Plain Washer

r i

Key
No.
Parts No. Drawing Na Description Q'ty Remarks

1 1L4476 Fuse, 239001 2

2 1K1151A 314-3471 GND Terminal (A) 1

TITLE DRAWING NO.

AC inlet Board 424-3619

MODEL NO. ASSEMBLY NO. DATE

FX-2111 (USA) PC 6-6410 96.09.30

10-5
5

3 i
6

''
1

-
55

33

2
ti 1
»l 4
Si'S
II s
Of
S»!|!Li
TO
8

Key Description Q'ty Remarks


No.
Parts Na Drawing Na

1 Upper Case Assembly 1

2 9H3494 111-6862 Upper Case Assembly SU for USA 1

3 1G9340A 684-2146 Key Panel 1


TITLE DRAWING NO.
4 6B8305 114-6625 LCD Filter 1
Upper Case 423-3620
5 5H9128 154-4573 Rated Power Label (B) 1

1 MODEL NO. ASSEMBLY NO. DATE


6 6B9171 114-6811 Lock Spring
1 FX-2111 (USA) 96.09.30
7 5H9237 154-4670 Caution Label

10-7
4
2-Double Semus Screw M3x8
,

2-Taping Pan-head Screw M2.6x6


,

6
A

A
A

Pasted

2
A

C
f_ o

TV

Key Description Q'ty Remarks


Na
Parts Na Drawing Na

1 Lower Case Assembly (1) 1

2 9H3495 111-6863 Lower Case Assembly SU for USA 1


TITLE DRAWING NO.
3 6B8327 314-3466 Battery Presser Sponge 1 423-3621
Lower Case Assembly (1)
4 6B8326 112-6624 Battery Cover 1
MODEL NO. ASSEMBLY NO. DATE
5 5H9374 154-4669 Fuse Label (D) 1
FX-2111 (USA) 96.09.30
6 9E7329 Rating label 1

10-9
7

Key Parts No.


No. Drawing No. Description Q'ty Remarks

B 1 Lower Case Assembly (1) 1

A 2 423- 3621 Lower Case Assembly (1) 1


4
3 9H3213A 313- 3459 Grounding Piece 1

4 1T1558 684-2156 Transformer, FCP2222AT 1

5 9F3420 424- 3619 PCB-6410 Assembly 1

6 6B8306 314- 3463 Insulation Sheet 1

7 6B9198A 314-3601 Insulation Cover 1

.v

3
B

3
o

9
a
0

6 o
o

TITLE DRAWING NO.

Lower Case Assembly (2) 422-3622

MODEL NO. ASSEMBLY NO. DATE

FX-2111 (USA) 96.09.30

10-11
2
9-Double Semus Screw M3x8
,

c
4

F
IF

0
.

A G
it

E
5
B

3 F

0 5 11

-1
p
6
V

o
Key Parts Na Q'ty Remarks
Na
Drawing Na Description 7

1 422- 3622 Lower Case Assembly (2) 1

2 9F3354 423- 3252 Recorder Assembly 1

3 1M0381 684-2093 Thermal Array Head Cable 1


TITLE DRAWING NO.
4 1T1558 423-3444 PCB-6409 Assembly 1
Lower Case Assembly (3) 422-3623
5 5H9615 154-4836 Lead Label (C) 1

MODEL NO. ASSEMBLY NO. DATE


6 5H5639 154-3574 Lithium Battery Label 1
FX-2111 (USA) 96.09.30
7 5H9417 154-4821 Patient Label 1

10-13
2

5S>

'
II
D
At
r
A

m 3*

Li

Double Semus Screw


3
M3x8

ii
s"

2-D-jubl
e Semus Screw M3x8
,
11

Key Q'ty
Na
Parts No. Drawing Na Description Remarks

TITLE DRAWING NO.


1 423-3623 Lower Case Assembly (3) 1
Exploded View 412-0996
2 423-3620 Upper Case Assembly 1

MODEL NO. ASSEMBLY NO. DATE


3 9F2648 423-3250 Paper Magazine Assembly 1

9H3522 224-0891 FX-2111 (USA) 96.09.30


4 Paper Shaft SU 1

10-15
o

2?5

v .

>5-

TITLE DRAWING NO.

External Appearance (1) 413-0849

MODEL NO. ASSEMBLY NO. DATE

FX-2111 (CE) 94.10.07

10-17
-

I I

@ /Ft,
o
[ u
Cilil01-Ti

Itfir
TtAtEi

itttitin
tki

11 .
nil »f

tiflid
ilttltit

nrvlci
tkit t* tit

pt r 11 d i * 1.
rtiif* ititt.

DkHQtl'litl If tlfltiitt if tie* ii tk* frimci sf


f 11 mm t k It (inlbitiei.
D A B C E S -1 i n»« *'h|Iiii»i. It in tMplertf >
0
ptititu d inttl«*Miii iifliaiiMn.
o

o S n
I 2»TI

5i 1DDI UISITITITT
oo

; 5 I
CA R D I MA X
FX-Z11 J IBID
'

11
"

0
oil:?:
!=.

PIT OTf
STAKT
ii -
si I

V A

3J
STOP

] a o
Y v .

2 6 0

nzr

DRAWING NO.
TITLE

External Appearance (2) 413-0927

ASSEMBLY NO. DATE


MODEL NO.

FX-2111 (CE) 96.01.24

10-19
2

o
® O

2_M8 Nut & Plain Washer

T 1

Key Parts Na Remarks


No. Drawing Na Description Q'ty

1 1L4475 Fuse, 239500 2

2 1K1151A 314-3471 GND Terminal (A) 1

TITLE DRAWING NO.

AC Inlet Board 424-3443

MODEL NO. ASSEMBLY NO. DATE

FX-2111 (CE) PCB-6410 96.01.24

10-21
5
2-Binding Screw M3x8
,

CD

.j
3
o

r 3
0

v.

6
y
y
y

0 y

y
y
4
y
y
y

0
y 2-Double Semus Screw M3x8 ,
y

Key Q'ty Remarks


No.
Parts No. Drawing No. Description

1 9F3424 PCB-6409 SAS 1

2 9F3419 PCB-6409 with ROM 1

3 1L4057 Fuse, TR-5 K1937, 3.15A 2

4 1U0231 684-2428 Lithium Battery, CR-1/3N-FT-2-1 1

5 1E8631 Programmed ROM, FX-2111 (36-202) 1

6 9F3421 LCD Assembly 1

7 1L1709 LCD, NDM202A0O 1


TITLE DRAWING NO.
8 6B8308 Spaeer, SP-15 2
Main Board 423-3444
9 6B9216 314-3602 Grounding Piece (D) 1

10 6B9217 314-3603 Shielding Finger (A) 1 MODEL NO. ASSEMBLY NO. DATE

11 6B9218 314-3604 Shielding Finger (B) 1 FX-2111 (CE) 96.01.24

10-23
5
Countersunk Screw M2x6
,

1
-

J6

-
-
1 J

Key Q'ty Remarks


Na
Parts No. Drawing No. Description

1 6B8323 222-0889 Paper Magazine 1

2 9H0402 Platen Roll Assembly 1

3 6B8324A Platen Roll 1

4 6A5350 LF-740ZZ Bearing 2

5 6B8325 224-0313 Gear, 38A 1

TITLE DRAWING NO.

Paper Magazine Assembly 423-3250

MODEL NO. ASSEMBLY NO. DATE

FX-2111 94.10.01

10-25
2

Key Q'ty
No.
Parts Na Drawing Na Description Remarks

1 6B8321 223-0892 Paper Shaft 1

2 6B8322 224-0893 Back Tension Spring 1

TITLE DRAWING NO.

Paper Shaft Assembly 424-3251

MODEL NO. ASSEMBLY NO. DATE

FX-2111 94.10.07

10-27
2-Double Semus Screw M3x5
,

5
3

1
1 7
4

Setscrew, M3x3
A
A

)
a

«1

v
.

j c

Key Parts Na
Na Drawing Na Description Q'ty Remarks

1 9H3215 211-3447 Recorder Chassis SU 1

2 1M0385 434-4725 Motor Assembly 1

3 9H0617 Gear 38B Assembly 1

1 1 4 6B8320 224-0314 Gear 38B 1

9 5 9H0812 Thermal Array Head Assembly 1


Double Semus Screw M3x4
,
6 6B8316A 213-3448 Thermal Array Head Mounting Plate 1

7 6B8317 Tension Coil Spring, DE511 1


C
8 1W3006 684-2092 Thermal Array Head Q56-F
,
1

9 9F3289B 674-10490 PCB-6239 SMD, Sensor Board 1

10 9H3216 313- 3461 Grounding Piece C SU 1

11 6B8395 314- 3465 Sensor Presser Sponge 1

2 12 6B8307 314-3464 Flexible Grounding Conductor 1

D TITLE DRAWING NO.


3-Double Semus Screw, M3x8
Recorder Assembly 423-3252
Double Semus Screw,

M3x8 MODEL NO. ASSEMBLY NO. DATE

FX-2111 94.10.07

10-29
7

3
6

II
II
It
A

.St

.4>

Key Parts Na
Na Drawing Na Description Q'ty Remarks

1 9F3355 Upper Case Assembly 1

2 9H3211C 111-6621 Upper Case Assembly SU 1

3 1G9340A 684-2146 Key Panel 1


TITLE DRAWING NO.
4 6B8305 114-6625 LCD Filter 1

5 5H9130 154-4575
Upper Case Assembly 423-3445
Rated Power Label (C) 1

6 6B9171 114-6811 Lock Spring 1 MODEL NO. ASSEMBLY NO. DATE

7 5H9428 154-4694 CE Marking Label 1 FX-2111 (CE) 96.01.24

10-31
b
2-Double Semus Screw M3x8
,

rJ5

A
A
c 6

Pasted <S>

. r
2
A

<s> C

1/

OS

Key Parts Na '


Q ty Remarks
No.
Drawing Na Description

1 9F3356 Lower Case Assembly (1) 1

2 9H3212D 111-6622 Lower Case Assembly SU 1


TITLE DRAWING NO.
4 6B8327 314-3466 Battery Presser Sponge 1
Lower Case Assembly (1) 423-3446
5 6B8326 112-6624 Battery Cover 1

6 5H9131 154-4576 Fuse Labell MODEL NO. ASSEMBLY NO. DATE

7 9E7293 Rating Label 1 FX-2111 (CE) 96.01.24

10-33
7
Key Parts Na
No. Drawing Na Description Q'ty Remarks

1 9F3356
B Lower Case Assembly (1) 1
2 423- 3446
A 4
Lower Case Assembly (1) 1
3 9H3213A 313- 3459 Grounding Piece (A) SU 1
4 1T1559 684-2157 Transformer FCP2222UT
, 1
5 9F3420 424- 3443 PCB-6410 Assembly 1
6 6B8306 314- 3463 Insulation Sheet 1
7 6B91108A 314-3601 Insulation Cover 1
A 8 6B6796 TM-166 No 12
.

A
IB

ft 2

8
o

0
0

6
o
O

TITLE DRAWING NO.

Lower Case Assembly (2) 422-3447

MODEL NO. ASSEMBLY NO. DATE

FX-2111 (CE) 96.01.24

10-35
2
4-Double Semus Screw M3x&
,

C
4

1 D

A G

B 5

3 F

9
0 si fi'
1
ii

i"
6 /I
41
V

Key Parts Na Q ty
'
Remarks
Na Drawing Na Description

1 422-3271 Lower Case Assembly (2) 1

2 9F3354 Recorder Assembly 1


TITLE DRAWING NO.
3 1M0381 684-2093 Thermal Array Head Cable 1
Lower Case Assembly (3) 422-3448
4 423-3444 PCB-6409 Assembly 1

5 5H9138 154-4577 Lead Label (C) 1 MODEL NO. ASSEMBLY NO. DATE

6 5H5639 154-3574 Lithium Battery Label 1 FX-2111 (CE) 96.01.24

10-37
2

it
3§5
r
5S>
"J

ir.>
r

re

3 z Double Semus Screw, M3x8

si

'

t'
4-Doubte Semus Screw M3x8
,

Key Parts No. Q'ty Remarks


Na
Drawing Na Description

TITLE DRAWING NO.


1 Lower Case Assembly (3) 1
Exploded View 412-0928
2 Upper Case Assembly 1

3 9F2648 Paper Magazine Assembly 1 MODEL NO. ASSEMBLY NO. DATE

4 9H3522 224-0891 Paper Shaft SU 1 FX-2111 (CE) 96.01.24

10-39
FUKUDA DENSHI CO., LTD.
39-4, Hongo 3-chonne, Bunkyo-ku, Tokyo 113, Japan
Phone:(03)3815-2121 Fax: (03)5684-3791

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