Professional Documents
Culture Documents
sn74lvc161284 PDF
sn74lvc161284 PDF
SCAS583J − NOVEMBER 1996 − REVISED FEBRUARY 2005
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
! " #$%! " &$'(#! )!%* Copyright 2005 Texas Instruments Incorporated
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
ORDERING INFORMATION
ORDERABLE TOP-SIDE
TA PACKAGE†
PART NUMBER MARKING
TSSOP – DGG Tape and reel SN74LVC161284DGGR PACKAGE PREVIEW
Tape SN74LVC161284DL
SSOP – DL LVC161284
Tape and reel SN74LVC161284DLR
0°C to 70°C
TSSOP – DGG Tape and reel 74LVC161284DGGRG4 PACKAGE PREVIEW
Tape 74LVC161284DLRE4
SSOP – DL LVC161284
Tape and reel 74LVC161284DLRG4
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OUTPUT MODE
DIR HD
Open drain A9−A13 to Y9−Y13 and PERI LOGIC IN to PERI LOGIC OUT
L L
Totem pole B1−B8 to A1−A8 and C14−C17 to A14−A17
L H Totem pole B1−B8 to A1−A8, A9−A13 to Y9−Y13, PERI LOGIC IN to PERI LOGIC OUT, and C14−C17 to A14−A17
Open drain A1−A8 to B1−B8, A9−A13 to Y9−Y13, and PERI LOGIC IN to PERI LOGIC OUT
H L
Totem pole C14−C17 to A14−A17
H H Totem pole A1−A8 to B1−B8, A9−A13 to Y9−Y13, C14−C17 to A14−A17, and PERI LOGIC IN to PERI LOGIC OUT
logic diagram
42
VCC CABLE
See Note B
48
DIR
See Note B
1
HD
See Note A
A1−A8
B1−B8
A9−A13 Y9−Y13
19 30
PERI LOGIC IN PERI LOGIC OUT
A14−A17 C14−C17
24 25
HOST LOGIC OUT HOST LOGIC IN
NOTES: A. The PMOS transistor prevents backdriving current from the signal pins to VCC CABLE when VCC CABLE is open or at GND.
B. The PMOS transistors prevent backdriving current from the signal pins to VCC CABLE when VCC CABLE is open or at GND. The
PMOS transistor is turned off when the associated driver is in the low state.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range: VCC CABLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input and output voltage range, VI and VO: Cable side (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . −2 V to 7 V
Peripheral side (see Note 1) . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO: Except PERI LOGIC OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
PERI LOGIC OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Continuous current through each VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Output high sink current, ISK (VO = 5.5 V and VCC CABLE = 3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 mA
Package thermal impedance, θJA (see Note 3): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The ac input voltage pulse duration is limited to 40 ns if the amplitude is greater than −0.5 V.
3. The package thermal impedance is calculated in accordance with JESD 51.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figures 1 and 2)
FROM TO
PARAMETER MIN TYP† MAX UNIT
(INPUT) (OUTPUT)
tPLH 1 40
Totem pole A or B B or A ns
tPHL 1 40
tslew Totem pole Cable-side outputs 0.05 0.4 V/ns
ten Totem pole HD B, Y, and PERI LOGIC OUT 1 25 ns
tdis Totem pole HD B, Y, and PERI LOGIC OUT 1 25 ns
ten−tdis 1 10 ns
ten DIR A 1 50 ns
A 1 15
tdis DIR ns
B 1 50
tr, tf Open drain A B or Y 120 ns
tsk(o)‡ A or B B or A 2.5 10 ns
† Typical values are measured at VCC = 3.3 V, VCC CABLE = 5 V, and TA = 25°C.
‡ Skew is measured at 1/2 (VOH + VOL) for signals switching in the same direction.
tPLH tPHL
TP1 Sink Load
From VOH
B or Y Output tPHL Output
VOL + 1.4 V VOH − 1.4 V
Under Test tPLH (see Note B)
VOL
Source Load
VCC
2.7 V
Input
1.4 V 1.4 V
(see Note C)
0V
TP1 500 Ω
VOH
From Output 2V 2V
B or Y Output (see Note C) 0.8 V 0.8 V
CL = 50 pF VOL
(see Note A) tr tf
2.7 V
LOAD CIRCUIT Output
1.4 V 1.4 V
Control
0V
tPZL tPLZ
Input 2.7 V Output 3V
(see Note B) 1.4 V 1.4 V Waveform 1 1.4 V
0V S1 at VCC × 2 V VOL + 0.3 V
VOL
(see Note C)
tPLH tPHL tPZH tPHZ
VOH Output
VOH
Waveform 2 VOH − 0.3 V
Output 50% VCC 50% VCC 1.4 V
S1 at GND
VOL 0V
(see Note C)
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (B to A) ENABLE AND DISABLE TIMES
VCC
CL = 50 pF
500 Ω (see Note A) tw
2.7 V
Input
TP1 Sink Load 1.4 V 1.4 V
(see Note D)
From 0V
B or Y Output tPHL
Under Test tPLH tPLH tPHL
www.ti.com 28-May-2009
PACKAGING INFORMATION
Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
74LVC161284DGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74LVC161284DLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC161284DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC161284DL ACTIVE SSOP DL 48 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC161284DLG4 ACTIVE SSOP DL 48 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC161284DLR ACTIVE SSOP DL 48 1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
0,27
0,50 0,08 M
0,17
48 25
6,20 8,30
6,00 7,90 0,15 NOM
Gage Plane
0,25
1 24
0°– 8°
A 0,75
0,50
Seating Plane
0,15
1,20 MAX 0,10
0,05
PINS **
48 56 64
DIM
4040078 / F 12/97