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Chap 4
Chap 4
• Point defects
– Vacancy
– Interstitial point defect
– Substitutional point
defect
Defects in compounds
(b) Schottky defect: a pair of
vacancies having opposite sign
(c) Frenkel defect: consisting of a
vacancy-self-interstial pair
Interstitial sites in
FCC structure
Interstitial sites in
BCC structure
Equiblium of point defects
• Formation of point defect
– The enthalpy of the system H increases, and the configurational
entropy S also increases.
• At equilibrium, ∆G = 0.
∆G = ∆H – T∆S ; ∆S = nkln(N/n); ∆H = nHf
– X = n/N = exp(-Hf/kT);
• n and N are number of point defects and lattice sites
• Hf: formation enthalpy of point defect
– Hi > H v (i: interstial; v: vacancy)
– Xv >> Xi
be
Electron micrographs of dislocations
Dislocation loops
Shear loop Prismatic loop
Movement of dislocations
Screw dislocation
Edge dislocation
σ 11 = −
(
Gbx2 3x12 + x22 )
(
2π (1 − υ ) x + x 2
1
2 2
2 )
σ 12 =
(
Gbx1 x12 − x22 )
(
2π (1 − υ ) x + x 2
1
2 2
2 )
σ 22 =
(
Gbx2 x12 − x22 )
(
2π (1 − υ ) x12 + x22 ) 2
σ 33 = υ ( σ 11 + σ 22 )
Energy of dislocations
ρ −1 / 2
Ur =
Gb 2
+
Gb 2
10 4π (1 − υ )
(
1 − υ cos 2 α ln
5b
)
(core energy ~ Gb2/10; edge α = π/2; screw α = 0; R ~ ρ-1/2; ro = 5b)
Force on dislocation
• A curved dislocation is considered to have “line tension” T.
T = U = (Gb2/4π) ln(R/5b), R: radius of curvature
T ~ U ~ Gb2/2
b
v D = vk
L
Effects of temperature and strain rate on the
movement of dislocations
• Thermal energy may help
the applied stress to
overcome the obstacle.
∀ τ = τ* + τG
τ* depends on strain rate and
temperature.
Temperature dependence of
τG is the same as G.
• BCC metals: Peierls-
Nabarro stress is the major
obstacle at low temperature.
• FCC metals: forest
dislocations are the major
obstacles.