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SPI07N60C3, SPA07N60C3
Maximum Ratings
Parameter Symbol Value Unit
SPP_I SPA
Continuous drain current ID A
TC = 25 °C 7.3 7.31)
TC = 100 °C 4.6 4.61)
Pulsed drain current, tp limited by Tjmax ID puls 21.9 21.9 A
Avalanche energy, single pulse EAS 230 230 mJ
ID=5.5A, VDD =50V
Maximum Ratings
Parameter Symbol Value Unit
Drain Source voltage slope dv/dt 50 V/ns
V DS = 480 V, ID = 7.3 A, Tj = 125 °C
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Thermal resistance, junction - case RthJC - - 1.5 K/W
Thermal resistance, junction - case, FullPAK RthJC_FP - - 3.9
Thermal resistance, junction - ambient, leaded RthJA - - 62
Thermal resistance, junction - ambient, FullPAK RthJA_FP - - 80
SMD version, device on PCB: RthJA
@ min. footprint - - 62
@ 6 cm 2 cooling area 3) - 35 -
Soldering temperature, wavesoldering Tsold - - 260 °C
1.6 mm (0.063 in.) from case for 10s
Electrical Characteristics
Parameter Symbol Conditions Values Unit
min. typ. max.
Inverse diode continuous IS TC=25°C - - 7.3 A
forward current
Inverse diode direct current, ISM - - 21.9
pulsed
Inverse diode forward voltage VSD VGS=0V, IF=IS - 1 1.2 V
Reverse recovery time trr VR=480V, IF=IS , - 400 600 ns
Reverse recovery charge Qrr diF/dt=100A/µs - 4 - µC
Peak reverse recovery current Irrm - 28 - A
Peak rate of fall of reverse dirr /dt Tj=25°C - 800 - A/µs
recovery current
T am b
SPP07N60C3
100 34
W W
28
80
70 24
Ptot
Ptot
60 20
50
16
40
12
30
8
20
4
10
0 0
0 20 40 60 80 100 120 °C 160 0 20 40 60 80 100 120 °C 160
TC TC
A A
10 1 10 1
ID
ID
10 0 10 0
tp = 0.001 ms
tp = 0.001 ms
tp = 0.01 ms
tp = 0.01 ms
10 -1 tp = 0.1 ms 10 -1 tp = 0.1 ms
tp = 1 ms
tp = 1 ms
DC
tp = 10 ms
DC
10 -2 0 1 2 3
10 -2 0 1 2 3
10 10 10 V 10 10 10 10 V 10
VDS VDS
K/W K/W
10 0 10 0
ZthJC
ZthJC
10 -1 10 -1
D = 0.5
D = 0.2 D = 0.5
D = 0.1 D = 0.2
D = 0.05 D = 0.1
D = 0.02 D = 0.05
10 -2 D = 0.01 10 -2 D = 0.02
single pulse D = 0.01
single pulse
10 -3 -7 -6 -5 -4 -3 -1
10 -3 -7 -6 -5 -4 -3 -2 -1 1
10 10 10 10 10 s 10 10 10 10 10 10 10 10 s 10
tp tp
6,5V 9
16
ID
ID
8
5.5V
7
12 6V
6
5 5V
8 5,5V
4
3 4.5V
5V
4 2
4V
4,5V
1
0 0
0 5 10 15 VDS 25 0 2 4 6 8 10 12 14 16 18 20 22 V 25
V VDS
4.5V 2.8
8
RDS(on)
RDS(on)
7 2.4
5V
6 2
6V
5
6.5V 1.6
8V
4 5.5V
20V
1.2
3
0.8 98%
2
typ
0.4
1
0 0
0 2 4 6 8 10 12 A 15 -60 -20 20 60 100 °C 180
ID Tj
18 12
VGS
10
6
8
6 4
4
2
2
0 0
0 2 4 6 8 10 12 14 16 V 20 0 4 8 12 16 20 24 28 nC 34
VGS Q Gate
ns
A
td(off)
70
10 1 60
IF
t
50
40
10 0 30
tf
Tj = 25 °C typ
td(on)
Tj = 150 °C typ 20 tr
Tj = 25 °C (98%)
Tj = 150 °C (98%) 10
10 -1 0
0 0.4 0.8 1.2 1.6 2 2.4 V 3 0 1 2 3 4 5 6 A 8
VSD ID
350
2000
di/dt
300
t
200 di/dt(on)
1000
150
td(on)
100 tf
tr 500
di/dt(off)
50
0 0
0 20 40 60 80 100 Ω 130 0 20 40 60 80 100 Ω 130
RG RG
mWs
80
70
dv/dt
E
60 0.015
50
dv/dt(on)
40 0.01 Eoff
30
20 0.005
dv/dt(off) Eon*
10
0 0
0 20 40 60 80 Ω 120 0 1 2 3 4 5 6 A 8
RG ID
0.16 Tj(START)=25°C
6
0.14
IAR
5
E
0.12 Tj(START)=125°C
0.1 4
Eoff
0.08
3
0.06
Eon*
2
0.04
1
0.02
0 0 -3 -2 -1 0 1 2 4
0 20 40 60 80 100 Ω 130 10 10 10 10 10 10 µs 10
RG t AR
200 680
V(BR)DSS
180
EAS
660
160
140 640
120
620
100
600
80
60 580
40
560
20
0 540
20 40 60 80 100 120 °C 160 -60 -20 20 60 100 °C 180
Tj Tj
pF
W Ciss
3
10
PAR
300
10 2
Coss
200
10 1
Crss
100
0 4 5 6
10 0
10 10 MHz 10 0 100 200 300 400 V 600
f VDS
5.5
µJ
4.5
4
Eoss
3.5
2.5
1.5
0.5
0
0 100 200 300 400 V 600
VDS
1 2 3
MILLIMETERS
DIMENSIONS
MIN. MAX.
DOCUMENT NO.
A 4.50 4.90
Z8B00003319
A1 2.34 2.85
A2 2.42 2.86 REVISION
b 0.65 0.90 07
b1 0.95 1.38
b2 0.95 1.51 SCALE 5:1
b3 0.65 1.38 0 1 2 3 4 5mm
b4 0.65 1.51
c 0.40 0.63
D 15.67 16.15
D1 8.97 9.83 EUROPEAN PROJECTION
E 10.00 10.65
e 2.54
H 28.70 29.75
L 12.78 13.75
L1 2.83 3.45
øP 3.00 3.30 ISSUE DATE
Q 3.15 3.50 27.01.2017
PG-TO-262-3-1/PG-TO262-3-21 (I²-PAK)
RevisionHistory
SPx07N60C3
Revision:2018-02-27,Rev.2.3
Previous Revision
Revision Date Subjects (major changes since last revision)
3.3 2018-02-27 Outline PG-TO-220 FullPAK update
TrademarksofInfineonTechnologiesAG
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PRIMARION™,PrimePACK™,PrimeSTACK™,PROFET™,PRO-SIL™,RASIC™,REAL3™,ReverSave™,SatRIC™,SIEGET™,SIPMOS™,SmartLEWIS™,
SOLIDFLASH™,SPOC™,TEMPFET™,thinQ™,TRENCHSTOP™,TriCore™.
TrademarksupdatedAugust2015
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15 Rev.3.3,2018-02-27