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Datasheet 6103
Datasheet 6103
DATA SHEET
TDA6103Q
Triple video output amplifier
Preliminary specification March 1994
File under Integrated Circuits, IC02
Philips Semiconductors
Philips Semiconductors Preliminary specification
ORDERING INFORMATION
BLOCK DIAGRAM
VDD
6
VDD VDD VDD
3x
MIRROR 2
TDA6103Q
VDD VDD
MIRROR 3
FLASH-
DIODE
THERMAL
MIRROR 1 PROTECTION
4
MGA968
GND
March 1994 2
Philips Semiconductors Preliminary specification
PINNING
MGA969
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). Voltages measured with respect to GND (pin 4);
currents as specified in Fig.1; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VDD supply voltage 0 250 V
Vi input voltage 0 12 V
Vidm differential mode input voltage −6 +6 V
Voc cathode output voltage 0 VDD V
IocsmL LOW non-repetitive peak cathode flashover discharge = 50 µC 0 5 A
output current
IocsmH HIGH non-repetitive peak cathode flashover discharge = 100 nC 0 10 A
output current
Tstg storage temperature −55 +150 °C
Tj junction temperature −20 +150 °C
Ves electrostatic handling
human body model (HBM) − tbf V
machine model (MM) − tbf V
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices”).
QUALITY SPECIFICATION
Quality specification “SNW-FQ-611 part E” is applicable and can be found in the “Quality reference pocketbook” (ordering
number 9398 510 34011).
March 1994 3
Philips Semiconductors Preliminary specification
THERMAL RESISTANCE
Note
1. An external heatsink is necessary.
Thermal protection
MGA972 The internal thermal protection circuit gives a decrease of
6
the slew rate at high temperatures: 10% decrease at
130 °C and 30% decrease at 145 °C (typical values on the
5
P tot spot of the thermal protection circuit).
(W)
4
(1)
(2) OUTPUTS
2
5 K/W
1
Thermal protection circuit
0 6 K/W
–50 0 50 100 150
T amb ( o C)
FIN MGA970
March 1994 4
Philips Semiconductors Preliminary specification
CHARACTERISTICS
Operating range: Tj = −20 to 150 °C; VDD = 180 to 210 V; Vip = 1 to 4 V.
Test conditions (unless otherwise specified): Tamb = 25 °C; VDD = 200 V; Vip = 1.3 V; Voc1 = Voc2 = Voc3 = 1⁄2VDD;
CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth h-a = 18 K/W; measured in test circuit Fig.5.
March 1994 5
Philips Semiconductors Preliminary specification
March 1994 6
Philips Semiconductors Preliminary specification
Test circuit
C par
R4
V DD
100 kΩ
C par C11
100 nF
R5 Voc1
100 kΩ C13
6.8 R7
C1 C7 2 MΩ
6 C12 pF
3.2 probe 1
22 µF 8.2 pF 1
pF C14
Vi1 136 R8
C2 R1 100 kΩ
Vin1 9 pF
667 Ω
1
22 nF 0.987
mA
C3 C8
Voc2
TDA6103Q
22 µF 8.2 pF 2 C16
Vi2 6.8 R9
C4 R2 2 MΩ
Vin2 8 C15 pF
2 3.2 probe 2
22 nF 667 Ω C17
0.987 pF R10
mA 136
pF 100 kΩ
C5 C9
22 µF 8.2 pF 3
Vi3
C6 R3
Vin3 7 Voc3
3
22 nF 667 Ω C19
0.987 5 R11
6.8
mA 2 MΩ
C18 pF
3.2 probe 3
4 pF C20
C10 136 R12
100 C par pF 100 kΩ
1.3 V
nF
R6
100 kΩ
MGA976
Cpar = 70 fF.
March 1994 7
Philips Semiconductors Preliminary specification
MGA973
200
194
188
Voc
100
5
0
1.2 0.633 0 0.583 1.1 1.2
∆V i
Fig.6 Typical low-frequency (f < 1 MHz) response of ∆Vi1, 2,3 to Voc1, 2,3.
Vi
0
t
ts
150
140
Voc 149
100
60
50
t
tr
t pd MGA974
Fig.7 Output voltage (pins 7, 8 and 9) rising edge as a function of the AC input signal.
March 1994 8
Philips Semiconductors Preliminary specification
Vi
0
t
ts
150
140
Voc
100
overshoot (in %)
51
60
50
49
t
tf
t pd MGA975
Fig.8 Output voltage (pins 7, 8 and 9) falling edge as a function of the AC input signal.
March 1994 9
March 1994
Philips Semiconductors
Triple video output amplifier
X1
C3 R16 R24
1
185 V
100 kΩ 47 Ω 2
R5 R9 AQUA
R17 C6 R25 3
10 µF V ff
220 Ω 3.3 kΩ 1.2 Ω 4
R10 100 kΩ V ff (GND)
680 Ω (250 V)
R13
470 Ω
TDA6103Q
EHT
C1 1 2 3 4 5 6 7 8 9
X3
4 R6
R C5
3 R7 R21
G
2
B 470 Ω 3.3 kΩ
R12
100 R19 1.5 kΩ kR
1 nF
GND 680 Ω 220
kΩ R22 kG A51EAL . . X02
R15
470 Ω
10
1.5 kΩ
C4 R20 kB
220 nF 1.5 R23
kΩ g1 g2 g3
C2 1.5 kΩ
C7
R4 2.7 nF
R8 R18 (500 V)
1 nF
(2000 V)
Vg2 AQUA
X2 X4
Preliminary specification
TDA6103Q
Fig.9 Application diagram.
Philips Semiconductors Preliminary specification
GND VDD
4 6
to
differential from
stage input
1,2,3 TDA6103Q circuit
(1)
7,8,9
Vbias
from
to to to input
differential differential differential circuit
stage stage stage
5
MGA971
(1) All pins have an energy protection for positive or negative overstress situations.
Dissipation
Regarding dissipation, distinction must first be made between static dissipation (independent of frequency) and dynamic
dissipation (proportional to frequency).
The static dissipation of the TDA6103Q is due to voltage supply currents and load currents in the feedback network and
CRT.
The static dissipation equals:
Pstat = VDD × IDD − 3 × Voc × (Voc/Rfb − IOC)
Rfb = value of feedback resistor.
IOC = DC-value of cathode current.
The dynamic dissipation equals:
Pdyn = 3 × VDD × (CL + Cfb + Cint) × fi × Vo(p-p) × δ
CL = load capacitance.
Cfb = feedback capacitance.
Cint = internal load capacitance (≈4 pF).
fi = input frequency.
Vo(p-p) = output voltage (peak-to-peak value).
δ = non-blanking duty-cycle.
The IC must be mounted on the picture tube base print to minimize the load capacitance (CL).
March 1994 11
Philips Semiconductors Preliminary specification
PACKAGE OUTLINE
22.00
21.35
21.4
20.7
15.1 3.85
14.9 3.45
2.75 3.4
2.50 3.2 fin 1.75
(2x) 1.55
8.7
8.0
5.9
5.7 4.4
4.2
18.5
17.8
6.48
6.14
1 2 3 4 5 6 7 8 9
seating plane
1.1
0.7
0.76
3.9
3.4
0.45 0.47
1.0 1.0 0.25
0.3 0.7 2.54 0.38
(8x) 0.67 2.54
1.40 0.50 0.25 M
1.14
1.40
(9x) 65 o
1.14 55 o
MBC376 - 1
Dimensions in mm.
March 1994 12
Philips Semiconductors Preliminary specification
SOLDERING
Plastic single in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
DEFINITIONS
March 1994 13
Philips Semiconductors Preliminary specification
NOTES
March 1994 14
Philips Semiconductors Preliminary specification
NOTES
March 1994 15
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