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Introduction

IBM research

Deep computing

Bio array chip reaction

Series-connectd heat dissipator

I. Thermal management of computer chip

II. Cooling multi chip using heat pipes

III. Water cooling radiator for computer-chip

IV. Heat transfer engineering in modern laptops

V. Turbo computer

VI. conclusion
Introduction
The technique, called "high thermal conductivity interface technology,"
allows a twofold improvement in heat removal over current methods.
This paves the way for continued development of creative electronic
products through the use of more powerful chips without complex and
costly systems simply to cool them.

As chip performance continues to progress according to Moore's Law,

efficient chip cooling has become one of the most vexing problems for
designers of electronic products. The IBM technique outlined today is
one of several being explored by scientists from IBM Research - Zurich
to address the issue.

"Electronic products are capable of amazing things, largely because of

the more powerful chips at their heart," said Bruno Michel, manager of
the Advanced Thermal Packaging research group at IBM's Zurich lab.
"We want to help electronics makers keep the innovations coming. Our
chip-cooling technology is just one tool at our disposal to help them do
that."

IBM research
The approach used by IBM addresses the connection point between the
hot chip and the various cooling components used today to draw the heat
away, including heat sinks. Special particle-filled viscous pastes are
typically applied to this interface to guarantee that chips can expand and
contract owing to the thermal cycling. This paste is kept as thin as
possible in order to transport heat from chip to the cooling components
efficiently. Yet, squeezing these pastes too thin between the cooling
components and chip would damage or even crack the chip if the
conventional technologies are used.
Using sophisticated micro-technology, the IBM researchers developed a
chip cap with a network of tree-like branched channels on its surface.
The pattern is designed such that when pressure is applied, the paste
spreads much more evenly and the pressure remains uniform across the
chip. This allows the right uniformity to be obtained with nearly two
times less pressure, and a ten times better heat transport through the
interface.

This unique and extremely powerful design for chip cooling is borrowed
from biology. Systems of hierarchical channels can be found manifold in
nature, e.g. tree leaves, roots, or the human circulatory system. They can
serve very large volumes with little energy, which is crucial in all
organisms larger than a few millimeters. Ancient water irrigation
systems also used the same approach.
The demonstrated prototype is part of a large effort within IBM's
Research and Development organizations to improve cooling
performance of next and future generations of computer systems.

Deep computing
The cooling bottleneck results from the demand for ever more powerful
computer chips and becomes one of the most severe constraints of
overall chip performance. Today's high-performance chips already
generate a power density of 100 Watts per square centimeter — one
order of magnitude more than that of a typical hotplate. Tomorrow's
chips may attain even higher power densities, which would create
surface temperatures close to that of the sun when not cooled (approx.
6000 °C). Current cooling technologies, mainly based on forced air
convection (fans) blowing across heat sinks with densely spaced fins,
have essentially reached their limits with the current generation of
electronic products. To make matters worse, energy needed to cool
computer systems is rapidly approaching the power used for
calculations, thus almost doubling the overall power budget.
"Cooling is a holistic challenge from the individual transistor to the
datacenter. Powerful techniques, brought as close as possible to the chip
right where the cooling is needed, will be crucial for tackling the power
and cooling issues," states Michel.

Looking beyond the limits of air-cooling systems, Zurich researchers are

taking their concept of branched channel design even further and are
developing a novel and promising approach for water-cooling. Called
direct jet impingement, it squirts water onto the back of the chip and
sucks it off again in a perfectly closed system using an array of up to
50,000 tiny nozzles and a complicated tree-like branched return
architecture.

Bio array chip reaction

By developing a perfectly closed system, there is also no fear of coolant

getting into the electronics on the chips. What's more, the IBM team was
able to enhance the cooling capabilities of the system by devising ways
to apply it directly to the back of the chip and thereby avoiding the
resistive thermal interfaces in between the cooling system and the
silicon.

First lab results are impressive. The team has demonstrated cooling
power densities of up to 370 Watts per square centimeter with water as
coolant. This is more than six times beyond the current limits of air-
cooling techniques at about 75 Watts per square centimeter. Yet, the
system uses much less energy for pumping than other cooling systems
do.

A cooling assembly for cooling an electronic component with direct air

comprising; a housing, at least one electronic component disposed in
said housing, a nozzle supported in said housing for directing cooling air
over said electronic component, an open air cycle cooling unit disposed
in said housing for supplying the cooling air to said nozzle, said cooling
unit including a casing and a compressor rotatably supported by said
casing for moving air, wherein said casing includes opposite casing ends
and a casing axis extending therebetween, a shaft extending along said
casing axis between said shaft and said compressor being supported on
said shaft, said air bearings being between said shaft and said casing, air
bearings supporting said compressor in said casing on a thin film of air
for maintaining a contaminate free housing, an electric motor disposed
in said casing for rotating said shaft, and an expander supported on said
shaft for reducing pressure of air that flows through said expander.
Series connected heat dissipater
A cooling assembly for cooling electronic components with direct air
comprising; a housing of metal and having a generally rectangular
periphery to define four corners and including a housing bottom and a
housing top with spaced and parallel side walls being solid and
extending between said housing bottom and said housing top, said
housing having opposite housing ends and a housing axis with said
housing bottom and said side walls and said housing top extending
axially between said housing ends to define an air entrance at one of said
housing ends and an air exit at the other of said housing ends to allow
the flow of air through said housing, an entrance plate of metal and
disposed at said air entrance and having a plurality of entrance apertures
for the flow of air through said air entrance, an exit plate of metal and
disposed at said air exit and having a plurality of exit apertures for the
flow of air through said air exit, a first electronics box disposed at a first
corner adjacent a first side wall and said air entrance for providing
electric signals to said assembly, a second electronics box disposed at a
second corner adjacent said first side wall and said air exit for providing
electric signals to said assembly, a plurality of electronic components
disposed within said housing, said components including a mother board
disposed on said housing bottom, said components including a plurality
of circuits disposed on said mother board, said components including a
plurality of electronic chips disposed on said mother board, a plurality of
cold plates having a plurality of heat transfer fins disposed on said chips,
an open air cycle cooling unit disposed in said housing for cooling the
air that cools said electronic components, said cooling unit including a
plurality of fans disposed side-by-side between said second electronics
box and a second side wall and parallel to said exit plate for moving air
through said exit plate, said cooling unit including a heat exchanger for
cooling air and disposed between said plurality of fans and said exit
plate and including a heat exchanger inlet and a heat exchanger outlet
for the flow air through said heat exchanger, said cooling unit including
a casing having opposite casing ends and a casing axis extending parallel
to said housing axis and supported on said housing bottom between said
plurality of fans and said air entrance, a shaft being rotatably supported
along said casing axis between said casing ends, a compressor mounted
on said shaft at the one of said casing ends nearer said air entrance and
having a compressor inlet and a compressor outlet for compressing air, a
expander mounted on said shaft at the one of said casing ends nearer
said air exit and having an expander inlet and an expander outlet for
reducing the pressure of air that flows through said expander and for
rotating said shaft, an electric motor disposed between said compressor
and said expander in said casing for rotating said shaft, said cooling unit
including a nozzle having a nozzle inlet and a plurality of nozzle outlets
disposed over said cold plates for distributing air over said cold plates, a
first air tube interconnecting said compressor outlet to said heat
exchanger inlet for the flow of air

a second air tube interconnecting said heat exchanger outlet to said

expander inlet for the flow of air therebetween, a third air tube
interconnecting said expander outlet to said nozzle inlet for the flow of
air therebetween, and air bearings supporting said shaft on a thin film of
air for maintaining a contaminate free air stream, said air bearings
including a plurality of journal bearings for supporting the radial load of
said shaft and a plurality of thrust bearings for supporting the axial load
of said shaft.

Thermal management of computer chip

Electronic systems, such as computer systems, usually employ a number
of electrical components that generate heat. Excessive heat accumulated
therein will adversely affect operation of the computer system, and may
cause the computer system to be unstable. Therefore, heat dissipation
assemblies are widely used for dissipating heat from heat-generating
devices of a computer system to outside thereof. Typically, a heat
dissipation assembly such as a heat sink is disposed on the heat-
generating device for heat dissipation.

Nowadays, developments in computer chip technology have provided

computer central processing units (CPUs) with more functions and faster
processing speeds. Accordingly, modern CPUs generate copious
amounts of heat. Generally speaking, a heat-generating quantity of a
CPU is in a range from 50 to 90 Watts, which results a surface
temperature of the CPU of approximately 40 to 80 degrees Celsius. For
example, the heat-generating quantity of a Pentium IV 2.8 G CPU is
about 68 Watts, and a surface temperature of the CPU configured with a
conventional heat dissipation assembly is about 70 degrees Celsius.
Such a high surface temperature may adversely affect operation of the
computer system, thus a heat dissipation assembly having very high heat
dissipation efficiency is becoming increasingly important.

Heat transfer engineering in moden laptops

A typical computer system--personal computer, monitor, and printer--
can use as much as 1,000 kWh of electricity each year. And despite this
high consumption, consumers often base their buying decisions on initial
cost and equipment features rather than on energy efficiency. To
encourage manufacturers to produce more energy-efficient computer
equipment and consumers to purchase them, the U.S. Environmental
Protection Agency (EPA) is developing the EPA Energy Star Computers
program. Manufacturers who have signed a commitment contract with
EPA and whose equipment meets the established efficiency criteria--
personal computers with the ability to enter a low-power state of 30 W
or less, for example--will display an EPA Energy Star Pollution
Preventer logo, making it easy for consumers to distinguish energy-
efficient from inefficient equipment. The program, which is still being
developed, has an estimated potential to save 25 billion kWh and reduce
carbon dioxide emissions by 20 million tons each year.

Conclusion
In another aspect, fuel cells are more and more popular as a green
energy source, particularly for portable electronic devices. Compared
with the secondary cells which need a considerable time to recharge, the
fuel cells have advantages of continuous power supply and quick
refilling of fuel. A fuel cell is an electrochemical device for continuously
converting chemical energy into electrical energy at a suitable reaction
temperature. Currently, fuel cells can be classified into proton exchange
membrane fuel cells (PEMFCs), alkaline fuel cells (AFCs), direct
methanol fuel cells (DMFCs), etc. Generally, a fuel cell includes a cell
base, a fuel cartridge for supplying fuel to the cell base, and an external
heater for heating the fuel up to a reaction temperature, which is
approximately in a range from 50 to 120 degrees Celsius. The cell base
generally includes an anode, a cathode, an electrolyte sandwiched
therebetween, and an external circuit connected to the anode and the
cathode. The fuel is fed to the anode, and an oxidizer is fed to the
cathode. However, the external heater consumes an amount of electrical
energy, thereby an energy utilization efficiency of the fuel cell is
lowered in a sense.