Register Number: 9093 ‘Name of the Candidate: B.E. DEGREE EXAMINATION, 2011 (ELECTRONICS AND INSTRUMENTATION ENGINEERING) (EIGHTH SEMESTER) EIEE-804,MICRO ELECTRO MECHANICAL SYSTEMS (Time: 3 Hours ‘Maximum: 60 Marks ‘Answer any ONE FULL question from each unit ‘All questions carry equal marks UNIT a) Giye the schematic illustration of MEMS components and explain. 8) b) List the advantages of MEMS as a manufacturing technology. 4 ‘a) Write a note on MEMS in i) Automotive applications. @ ii) Electronics applications @ ) Explain the mechanical properties of silicon. (4) UNIT a) Differentiate isotropic from anisotropic etching. @ b) Explain isotropic etching with and without agitation _with the help of a neat diagram.(8)10. 2 ) Explain wet etching of non metallic thin film and metallic thin film for micromachining in detail. (8) b) Write a note on electroless plating. 4 ‘UNIT-IIT a) Explain silicon fusion bonding and _ its characterization. (8) b) Explain compound processes with bonding. (4) Explain phase change release method with a neat diagram. (12) UNIT-IV a) Explain in detail surface micromachined pressure sensors using poly silicon piezo resistors. (8) b) Explain the various sensing mechanisms in detail. (4) Explain with neat diagram force _ balance accelerometers and force balance capacitive accelerometer in detail. (12) UNIT-V a) Explain in detail electrostatic rotary micro motors and electrostatic linear motors. 8) b) Write a note on cantilever resonators. @) a) Explain the working principle of electrostatic micro gripper. © b) Write a note on electrostatic relay and switching. © eens