Micromedia Sttsi Ram Chip Only

LEMBAGA PELATIHAN TEKNISI TELEPON SELULER INFORMASI PELATIHAN, LOKASI JARINGAN / REPRESENTATI STTSI DISELURUH INDONESIA
SMARTPHONE - TABLETS - PERSONAL PC
0822.3016.0000
PENDIDIKAN BERBASIS KOMPETENSI SIAP SERTIFIKASI BNSP
SKKNI 421 PLUS KEAHLIAN TERKINI TEORI DAN PRAKTIK TERPADU
SARANA TEKNISI TELEPON SELULER INDONESIA
AHU-0056980.AH.01.01.2018
Kantor : Jl. Bunga cengkeh no.5b, Lowokwaru, Malang, Jawa Timur. Telp +62 822.301.60000 Website : www.sttsi.co.id email : pelatihan@sttsi.co.id page : www.facebook.com/micromedia.hptc
FBGA 168
RAM CHIP PACKAGE
(X16, X32)
MOBILE LPDDR2
SUPPLEMENTARY MODUL NOMOR 1/001/202/2018 TENTANG PIN DISTRIBUSI BERBAGAI PACKAGE RAM IC
REMAP AND DRAW BY YONGKY FELAZ, SP.PIT UNTUK MATERI BELAJAR LEMBAGA PELATIHAN TEKNISI PONSEL STTSI MICROMEDIA 2003 C
0822.3016.0000
AHU-0056980.AH.01.01.2018
FBGA 178
RAM CHIP PACKAGE
SINGLE CHANNEL
MOBILE LPDDR3
0822.3016.0000
AHU-0056980.AH.01.01.2018
FBGA 253
RAM CHIP PACKAGE
DUAL CHANNEL
MOBILE LPDDR3
0822.3016.0000
AHU-0056980.AH.01.01.2018
FBGA 200
RAM CHIP PACKAGE
DUAL CHANNEL
MOBILE LPDDR4
0822.3016.0000
AHU-0056980.AH.01.01.2018
FBGA 170
RAM CHIP PACKAGE
( X16, X32 ) DUAL CHANNEL
MOBILE GDDR SGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14
A VSSQ DQ1 VSSQ DQ0 NC VREFD DQ8 VSSQ DQ9 VSSQ
B VDDQ DQ3 VDDQ DQ2 VSS VSS DQ10 VDDQ DQ11 VDDQ
C VSSQ EDC0 VSSQ VSSQ VDD VDD VSSQ VSSQ EDC1 VSSQ
D VDDQ DBI0_n VDDQ WCK01_t WCK01_c VSS VDD VDDQ DBI1_n VDDQ
E VSSQ DQ5 VSSQ DQ4 VDDQ VDDQ DQ12 VSSQ DQ13 VSSQ
F VDDQ DQ7 VDDQ DQ6 VSSQ VSSQ DQ14 VDDQ DQ15 VDDQ
G VDD VDDQ RAS_n VDD VSS VSS VDD CS_n VDDQ VDD
H VSS VSSQ VDDQ A10, A0 A9, A1 BA3, A3 BA0, A2 VDDQ VSSQ VSS
J MF RESET_n CKE_n ABI_n A12, A13 SEN CK_c CK_t ZQ VREFC
K VSS VSSQ VDDQ A8, A7 A11, A6 BA1, A5 BA2, A4 VDDQ VSSQ VSS
L VDD VDDQ CAS_n VDD VSS VSS VDD WE_n VDDQ VDD
M VDDQ DQ31 VDDQ DQ30 VSSQ VSSQ DQ22 VDDQ DQ23 VDDQ
N VSSQ DQ29 VSSQ DQ28 VDDQ VDDQ DQ20 VSSQ DQ21 VSSQ
P VDDQ DBI3_n VDDQ WCK23_t WCK23_c VSS VDD VDDQ DBI2_n VDDQ
R VSSQ EDC3 VSSQ VSSQ VDD VDD VSSQ VSSQ EDC2 VSSQ
T VDDQ DQ27 VDDQ DQ26 VSS VSS DQ18 VDDQ DQ19 VDDQ
U VSSQ DQ25 VSSQ DQ24 NC VREFD DQ16 VSSQ DQ17 VSSQ
Note: 1. Balls shown with a heavy, solid outline are off in x16 mode.
Data Addresses GDDR5 Supply Ground
0822.3016.0000
AHU-0056980.AH.01.01.2018
FBGA 96
RAM CHIP PACKAGE
SINGLE CHANNEL
MOBILE LPDDR3
Figure 7: 96-Ball FBGA – x16 (Top View)
1 2 3 4 5 6 7 8 9
Notes:
A
2. A comma separates the configuration; a slash defines a selectable function.
1. Ball descriptions listed in Table 4 (page 21) are listed as “x4, x8” if unique; otherwise,
VDDQ DQ13 DQ15 DQ12 VDDQ VSS
fined in Table 4).

to the x8 configuration only—selectable between NF or TDQS# via MRS (symbols are de-
Example D7 = NF, NF/TDQS#. NF applies to the x4 configuration only. NF/TDQS# applies
x4 and x8 are the same.

B
VSSQ VDD VSS UDQS# DQ14 VSSQ
C
VDDQ DQ11 DQ9 UDQS DQ10 VDDQ
D
VSSQ VDDQ UDM DQ8 VSSQ VDD
E
VSS VSSQ DQ0 LDM VSSQ VDDQ
F
VDDQ DQ2 LDQS DQ1 DQ3 VSSQ
G
VSSQ DQ6 LDQS# VDD VSS VSSQ
H
VREFDQ VDDQ DQ4 DQ7 DQ5 VDDQ
J
NC VSS RAS# CK VSS NC
K
ODT VDD CAS# CK# VDD CKE
L
NC CS# WE# A10/AP ZQ NC
M
VSS BA0 BA2 NC VREFCA VSS
N
VDD A3 A0 A12/BC# BA1 VDD
P
VSS A5 A2 A1 A4 VSS
R
VDD A7 A9 A11 A6 VDD
T
VSS RESET# NC NC A8 VSS
0822.3016.0000
AHU-0056980.AH.01.01.2018
FBGA 78
RAM CHIP PACKAGE
( x4, x8 )
MOBILE LPDDR3
Figure 6: 78-Ball FBGA – x4, x8 (Top View)
1 2 3 4 5 6 7 8 9
Notes: 1. Ball descriptions listed in Table 3 (page 19) are listed as “x4, x8” if unique; otherwise,
A
2. A comma separates the configuration; a slash defines a selectable function.

VSS VDD NC NF, NF/TDQS# VSS VDD
fined in Table 3).

to the x8 configuration only—selectable between NF or TDQS# via MRS (symbols are de-
Example D7 = NF, NF/TDQS#. NF applies to the x4 configuration only. NF/TDQS# applies
x4 and x8 are the same.

B
VSS VSSQ DQ0 DM, DM/TDQS VSSQ VDDQ
C
VDDQ DQ2 DQS DQ1 DQ3 VSSQ
D
VSSQ NF, DQ6 DQS# VDD VSS VSSQ
E
VREFDQ VDDQ NF, DQ4 NF, DQ7 NF, DQ5 VDDQ
F
NC VSS RAS# CK VSS NC
G
ODT VDD CAS# CK# VDD CKE
H
NC CS# WE# A10/AP ZQ NC
J
VSS BA0 BA2 NC VREFCA VSS
K
VDD A3 A0 A12/BC# BA1 VDD
L
VSS A5 A2 A1 A4 VSS
M
VDD A7 A9 A11 A6 VDD
N
VSS RESET# A13 NC A8 VSS
0822.3016.0000
AHU-0056980.AH.01.01.2018
FBGA 134
RAM CHIP PACKAGE
x16, x32
MOBILE LPDDR2 S4 SDRAM
0822.3016.0000
AHU-0056980.AH.01.01.2018
FBGA 366
RAM CHIP PACKAGE
x16, x32
MOBILE LPDDR4 S4 SDRAM
0822.3016.0000
AHU-0056980.AH.01.01.2018
FBGA 216
RAM CHIP PACKAGE
DUAL CHANNEL
MOBILE LPDDR3 SDRAM

Micromedia Sttsi Ram Chip Only

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Micromedia Sttsi Ram Chip Only

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LEMBAGA PELATIHAN TEKNISI TELEPON SELULER INFORMASI PELATIHAN, LOKASI JARINGAN / REPRESENTATI STTSI DISELURUH INDONESIA

SMARTPHONE - TABLETS - PERSONAL PC

A VSSQ DQ1 VSSQ DQ0 NC VREFD DQ8 VSSQ DQ9 VSSQ

J MF RESET_n CKE_n ABI_n A12, A13 SEN CK_c CK_t ZQ VREFC

U VSSQ DQ25 VSSQ DQ24 NC VREFD DQ16 VSSQ DQ17 VSSQ

Data Addresses GDDR5 Supply Ground

Figure 7: 96-Ball FBGA – x16 (Top View)

2. A comma separates the configuration; a slash defines a selectable function.

fined in Table 4).

x4 and x8 are the same.

Figure 6: 78-Ball FBGA – x4, x8 (Top View)

2. A comma separates the configuration; a slash defines a selectable function.

fined in Table 3).

x4 and x8 are the same.

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