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SPECIFICATION
CUSTOMER :
APPROVED BY:
( FOR CUSTOMER USE ONLY ) PCB VERSION: DATA:
1
Winstar Display Co., MODLE NO:
LTD
REVISED
PAGE NO. SUMMARY
VERSION DATE
2
Contents
1.Module Classification Information
3.General Specification
5.Electrical Characteristics
6.Optical Characteristics
9.Function Description
11.Instruction Table
12.Timing Characteristics
13.Initializing of LCM
14.Reliability
15.Backlight Information
3
1.Module
1.Module Classification Information
W H 1 6 0 4 A-T M I- CT#
Brand:WINSTAR DISPLAY CORPORATION
Display Type:H→Character Type, G→Graphic Type
Display Font:Character 16 words, 4Lines.
Model serials no.
Backlight Type: N→Without backlight P→LED, Blue
B→EL, Blue green A→LED, Amber
D→EL, Green R→LED, Red
W→EL, White O→LED, Orange
F→CCFL, White G→LED, Green
Y→LED, Yellow Green
LCD Mode: B→TN Positive, Gray T→FSTN Negative
N→TN Negative,
G→STN Positive, Gray
Y→STN Positive, Yellow Green
M→STN Negative, Blue
F→FSTN Positive
LCD Polarize A→Reflective, N.T, 6:00 H→Transflective, W.T,6:00
Type/ Temperature D→Reflective, N.T, 12:00 K→Transflective, W.T,12:00
range/ View G→Reflective, W. T, 6:00 C→Transmissive, N.T,6:00
direction J→Reflective, W. T, 12:00 F→Transmissive, N.T,12:00
B→Transflective, N.T,6:00 I→Transmissive, W. T, 6:00
E→Transflective, N.T.12:00 L→Transmissive, W.T,12:00
Special Code CT : English and Cyrillic standard font
#:Fit in with the ROHS Directions and regulations
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2.Precautions in use of LCD Modules
(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of
LCD module.
(3)Don’t disassemble the LCM.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist LCM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
(8). Winstar have the right to change the passive components
(9). Winstar have the right to change the PCB Rev.
3.General Specification
Duty 1/16
View direction 6 o’clock
Backlight Type LED White
5
4.Absolute Maximum Ratings
5.Electrical Characteristics
* Note: Please design the VOP adjustment circuit on customer's main board
Vdd
LCM
VR Vo
10K~20K Module
VSS
6
6.Optical Characteristics
Contrast Ratio CR - - 3 - -
Non-selected Non-selected
Conition Selected Conition Conition
Intensity Selected Wave
100% Non-selected Wave Intensity
10%
Cr Max
Cr = Lon / Loff 90%
100%
Vop
Driving Voltage(V) Tr Tf
Conditions :
Operating Voltage : Vop Viewing Angle(θ,φ) : 0°, 0°
Frame Frequency : 64 HZ Driving Waveform : 1/N duty , 1/a bias
≧2)
Definition of viewing angle(CR≧
θb
θf
φ= 180°
θl
θr
φ= 270° φ= 90°
φ= 0°
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7.Interface Pin Function
16 K - LED -
8
8.Contour Drawing &Block Diagram
87.0 0.5
10.0 P2.54*15=38.1 13.6 MAX
2.5
2.5
2.0 16- 1.0 9.0
1 Vss
11.3
1 16 2 Vdd
19.6
17
3 Vo
4 RS
5 R/W
60.0 0.5
26.0(VA)
20.8(AA)
55.0
37.4
6 E
7 DB0
8 DB1
9 DB2
10 DB3
11 DB4
2.5 82.0 4- 2.5 PTH 1.6
56.2(AA) 4- 5.0 PAD
12 DB5
15.4
12.5 62.0(VA) 13 DB6
LED B/L
4 79 14 DB7
15 A
2.95 0.6 16 K
0.6
0.55
DOT SIZE
SCALE 5/1
RS Com1~16
R/W Controller/Com Driver
MPU
E HD44780
DB0~DB7 or
Com17~32
16X4 LCD
80 series Equivalent
or
68 series
Power Circuit
Seg1~40
Vdd Seg41~80 Seg80~160
D
Bias and
M
CL1
Generator
CL2
Vee
N.V.
Vdd,Vss,V1~V5
External contrast adjustment.
Optional
Character located 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
DDRAM address 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
DDRAM address 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F
DDRAM address 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F
DDRAM address 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F
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9.Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an
instruction register (IR) and a data register (DR).
The IR stores instruction codes, such as display clear and cursor shift, and address information for
display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the
MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When
address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM.
By the register selector (RS) signal, these two registers can be selected.
RS R/W Operation
0 0 IR write as an internal operation (display clear, etc.)
0 1 Read busy flag (DB7) and address counter (DB0 to DB7)
1 0 Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM)
1 1 Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)
AC
AC6 AC5 AC4 AC3 AC2 AC1 AC0 1 0 0 1 1 1 0
(hexadecimal)
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Display position DDRAM address
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F
10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F
50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F
4-Line by 16-Character Display
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Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns
Table 1.
F o r 5 * 8 d o t c h a ra c te r p a tte rn s
C h a ra c te r C o d e s C h a ra c te r P a tte rn s
C G R A M A d d re ss
( D D R A M d a ta ) ( C G R A M d a ta )
7 6 5 4 3 2 1 0 5 4 3 2 1 0 7 6 5 4 3 2 1 0
H ig h Low H ig h Low H ig h Low
0 0 0 * * * 0
0 0 1 * * * 0 0 0
0 1 0 * * * 0 0 0
0 1 1 * * * 0 C h a ra c te r
0 0 0 1 0 0 * * * 0 0 0 p a tte rn ( 1 )
0 0 0 0 * 0 0 0
1 0 1 * * * 0 0 0
1 1 0 * * * 0 0 0
1 1 1 * * * 0 0 0 0 0 C u rs o r p a tte rn
0 0 0 * * * 0 0 0
0 0 1 * * * 0 0 0
0 1 0 * * *
0 1 1 * * * 0 0 0 0 C h a ra c te r
0 0 0 0 * 0 0 1 0 0 1 1 0 0 * * * p a tte rn ( 2 )
1 0 1 * * * 0 0 0 0
1 1 0 * * * 0 0 0 0
1 1 1 * * * 0 0 0 0 0 C u rs o r p a tte rn
0 0 0 * * *
0 0 1
0 0 0 0 * 1 1 1 1 1 1 1 0 0
1 0 1
1 1 0
1 1 1 * * *
F o r 5 * 1 0 d o t c h a ra c te r p a tte rn s
C h a ra c te r C o d e s C h a ra c te r P a tte rn s
C G R A M A d d ress
( D D R A M d a ta ) ( C G R A M d a ta )
7 6 5 4 3 2 1 0 5 4 3 2 1 0 7 6 5 4 3 2 1 0
H ig h Low H ig h Low H ig h Low
0 0 0 0 * * * 0 0 0 0 0
0 0 0 1 * * * 0 0 0 0 0
0 0 1 0 * * * 0 0
0 0 1 1 * * * 0 0
0 1 0 0 * * * 0 0 0
0 0 0 0 * 0 0 0 0 0 0 1 0 1 * * * 0 0 0
0 1 1 0 * * * 0 C h a ra c te r
0 1 1 1 * * * 0 0 0 0 p a tte rn
1 0 0 0 * * * 0 0 0 0
1 0 0 1 * * * 0 0 0 0
1 0 1 0 * * * 0 0 0 0 0 C u rs o r p a tte rn
1 1 1 1 * * * * * * * *
: " H ig h "
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10.Character
10.Character Generator ROM Pattern
Table.2
Upper
4 bit
Lower LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH
4 bit
CG
LLLL RAM
(1)
CG
LLLH RAM
(2)
CG
LLHL RAM
(3)
CG
LLHH RAM
(4)
CG
LHLL RAM
(5)
CG
LHLH RAM
(6)
CG
LHHL RAM
(7)
CG
LHHH RAM
(8)
CG
HLLL RAM
(1)
CG
HLLH RAM
(2)
CG
HLHL RAM
(3)
CG
HLHH RAM
(4)
CG
HHLL RAM
(5)
CG
HHLH RAM
(6)
CG
HHHL RAM
(7)
CG
HHHH RAM
(8)
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11.Instruction Table
Instruction Code
Execution time
Instruction Description
(fosc=270Khz)
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
* ”-”:don’t care
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12.Timing Characteristics
12.1 Write Operation
Ta=25℃, VDD=5.0V
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12.2 Read Operation
Ta=25℃, VDD=5V
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13.Initializing of LCM
Power on
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control
0 0 0 0 0 0 * * * *
0 0 1 D C B * * * *
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear
0 0 0 0 0 0 * * * *
0 0 0 0 0 1 * * * *
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set
0 0 0 0 0 0 * * * *
0 0 0 1 I/D SH * * * *
Initialization ends
4-Bit Ineterface
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Power on
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control
0 0 0 0 0 0 1 B C D
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear
0 0 0 0 0 0 0 0 0 1
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set
0 0 0 0 0 0 0 1 I/D S
Initialization ends
8-Bit Ineterface
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14.Reliability
℃~70℃
Content of Reliability Test (wide temperature, -20℃ ℃)
Environmental Test
Test Item Content of Test Test Condition Note
High Temperature Endurance test applying the high storage temperature 80℃
2
storage for a long time. 200hrs
Low Temperature Endurance test applying the high storage temperature -30℃
1,2
storage for a long time. 200hrs
Endurance test applying the electric stress (Voltage &
High Temperature 70℃
Current) and the thermal stress to the element for a ——
Operation 200hrs
long time.
Low Temperature Endurance test applying the electric stress under low -20℃
1
Operation temperature for a long time. 200hrs
The module should be allowed to stand at 60
℃,90%RH max
High Temperature/ For 96hrs under no-load condition excluding the 60℃,90%RH
1,2
Humidity Operation polarizer, 96hrs
Then taking it out and drying it at normal
temperature.
The sample should be allowed stand the following 10
cycles of
operation
Thermal shock -20℃ 25℃ 70℃ -20℃/70℃
——
resistance 10 cycles
VS=800V,RS=1.5k
Endurance test applying the electric stress to the Ω
Static electricity test ——
terminal. CS=100pF
1 time
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15.Backlight Information
Specification
Reverse Voltage VR - - 5 V -
Chromaticity X ─ 0.300 -
Y 0.310
Color White
Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
minimum and maximum).
Note 1:50K hours is only an estimate for reference.
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16. Inspection specification
Black or white 2.1 White and black spots on display ≦0.25mm, no more than
02 spots on LCD three white or black spots present. 2.5
(display only) 2.2 Densely spaced: No more than two spots or lines within 3mm
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NO Item Criterion AQL
05 Scratches Follow NO.3 LCD black spots, white spots, contamination
Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length:
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NO Item Criterion
AQL
Symbols :
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
Glass
06 2.5
crack
y≦ L x≦1/8a 0 < z≦t
☉If the chipped area touches the ITO terminal, over 2/3 of the ITO must
remain and be inspected according to electrode terminal specifications.
☉If the product will be heat sealed by the customer, the alignment mark
not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width x: length
y≦1/3L x≦a
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NO Item Criterion
AQL
07 Cracked glass The LCD with extensive crack is not acceptable. 2.5
10.1 COB seal may not have pinholes larger than 0.2mm or 2.5
contamination.
2.5
10.2 COB seal surface may not have pinholes through to the IC.
0.65
10.3 The height of the COB should not exceed the height
indicated in the assembly diagram. 2.5
10.4 There may not be more than 2mm of sealant outside the
seal area on the PCB. And there should be no more than
three places. 2.5
10.5 No oxidation or contamination PCB terminals. 0.65
10 PCB、COB 10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts,
missing parts or excess parts. 0.65
10.7 The jumper on the PCB should conform to the product
characteristic chart. 2.5
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or
screw hold pad, make sure it is smoothed down. 2.5
10.9 The Scraping testing standard for Copper Coating of PCB
X
Y
X * Y<=2mm2
24
NO Item Criterion AQL
25
17. Material List of Components for RoHs
1. WINSTAR Display Co., Ltd hereby declares that all of or part of products (with the mark
“#”in code), including, but not limited to, the LCM, accessories or packages, manufactured
and/or delivered to your company (including your subsidiaries and affiliated company)
directly or indirectly by our company (including our subsidiaries or affiliated companies) do
not intentionally contain any of the substances listed in all applicable EU directives and
regulations, including the following substances.
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