Lm2731 0.6/1.6-Mhz Boost Converters With 22-V Internal Fet Switch in Sot-23

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LM2731
SNVS217G – MAY 2004 – REVISED SEPTEMBER 2015
LM2731 0.6/1.6-MHz Boost Converters With 22-V Internal FET Switch in SOT-23
1 Features 3 Description
•
1 22-V DMOS FET Switch The LM2731 switching regulators are current-mode
boost converters operating at fixed frequencies of 1.6
• 1.6-MHz (X Option), 0.6-MHz (Y Option) Switching MHz (X option) and 600 kHz (Y option).
Frequency
• Low RDS(ON) DMOS FET The use of SOT-23 package, made possible by the
minimal power loss of the internal 1.8-A switch, and
• Switch Current Up to 1.8 A use of small inductors and capacitors result in the
• Wide Input Voltage Range (2.7 V to 14 V) highest power density of the industry. The 22-V
• Low Shutdown Current (<1 µA) internal switch makes these solutions perfect for
boosting to voltages up to 20 V.
• 5-Lead SOT-23 Package
• Uses Tiny Capacitors and Inductors These parts have a logic-level shutdown pin that can
reduce quiescent current and extend battery life.
• Cycle-by-Cycle Current Limiting
• Internally Compensated Protection is provided through cycle-by-cycle current
limiting and thermal shutdown. Internal compensation
simplifies design and reduces component count.
2 Applications
• White LED Current Sources Device Information(1)
• PDAs and Palm-Top Computers PART NUMBER PACKAGE BODY SIZE (NOM)
• Digital Cameras LM2731 SOT-23 (5) 1.60 mm × 2.90 mm
• Portable Phones and Games (1) For all available packages, see the orderable addendum at
the end of the data sheet.
• Local Boost Regulators
Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2731
SNVS217G – MAY 2004 – REVISED SEPTEMBER 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 8 Application and Implementation ........................ 13
2 Applications ........................................................... 1 8.1 Application Information............................................ 13
3 Description ............................................................. 1 8.2 Typical Application .................................................. 13
4 Revision History..................................................... 2 8.3 System Examples ................................................... 18
5 Pin Configuration and Functions ......................... 3 9 Power Supply Recommendations...................... 20
6 Specifications......................................................... 3 10 Layout................................................................... 20
6.1 Absolute Maximum Ratings ...................................... 3 10.1 Layout Guidelines ................................................. 20
6.2 ESD Ratings.............................................................. 3 10.2 Layout Example .................................................... 20
6.3 Recommended Operating Conditions....................... 4 10.3 Thermal Considerations ........................................ 21
6.4 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 22
6.5 Electrical Characteristics........................................... 5 11.1 Device Support...................................................... 22
6.6 Typical Characteristics .............................................. 7 11.2 Community Resources.......................................... 22
7 Detailed Description ............................................ 11 11.3 Trademarks ........................................................... 22
7.1 Overview ................................................................. 11 11.4 Electrostatic Discharge Caution ............................ 22
7.2 Functional Block Diagram ....................................... 11 11.5 Glossary ................................................................ 22
7.3 Feature Description................................................. 11 12 Mechanical, Packaging, and Orderable
7.4 Device Functional Modes........................................ 12 Information ........................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (November 2012) to Revision G Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
2 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated
Product Folder Links: LM2731

LM2731
www.ti.com SNVS217G – MAY 2004 – REVISED SEPTEMBER 2015
5 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View
FB GND SW
3 2 1
4 5
SHDN VIN
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
FB 3 I Feedback point that connects to external resistive divider.
GND 2 PWR Analog and power ground
SHDN 4 I Shutdown control input. Connect to VIN if the feature is not used.
SW 1 O Drain of the internal FET switch
VIN 5 PWR Analog and power input
6 Specifications
6.1 Absolute Maximum Ratings (1)
MIN MAX UNIT
Operating Junction Temperature –40 125 °C
Lead Temperature (Soldering, 5 sec.) 300 °C
Power Dissipation (2) Internally Limited
FB Pin Voltage –0.4 6 V
SW Pin Voltage –0.4 22 V
Input Supply Voltage –0.4 14.5 V
SHDN Pin Voltage –0.4 VIN + 0.3 V
Storage Temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation which can be safely dissipated for any application is a function of the maximum junction temperature,
TJ(MAX) = 125°C, the junction-to-ambient thermal resistance for the SOT-23 package, RθJA = 265°C/W, and the ambient temperature,
TA. The maximum allowable power dissipation at any ambient temperature for designs using this device can be calculated using the
TJ (MAX) - TA 125 - TA
P (MAX) = =
formula: qJ - A 265 . If power dissipation exceeds the maximum specified above, the internal thermal
protection circuitry will protect the device by reducing the output voltage as required to maintain a safe junction temperature.
6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 3

LM2731
6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input Supply Voltage 2.7 14 V
Vsw SW Pin Voltage 3 20 V
Vshdn Shutdown Supply Voltage (1) 0 VIN V
TJ Junction Temperature Range –40 125 ºC
(1) This pin should not be allowed to float or be greater than VIN + 0.3 V.
6.4 Thermal Information

LM2731
THERMAL METRIC (1) DBV (SOT-23) UNIT
5 PINS
RθJA Junction-to-ambient thermal resistance 209.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 122 °C/W
RθJB Junction-to-board thermal resistance 38.4 °C/W
ψJT Junction-to-top characterization parameter 12.8 °C/W
ψJB Junction-to-board characterization parameter 37.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.

LM2731
6.5 Electrical Characteristics

Limits are for TJ = 25°C. Unless otherwise specified: VIN = 5 V, VSHDN = 5 V, IL = 0 A.
PARAMETER TEST CONDITIONS MIN (1) TYP (2) MAX (1) UNIT
VIN Input Voltage −40°C ≤ TJ ≤ 125°C 2.7 14 V
VIN = 2.7 V 7
−40°C ≤ TJ ≤
5.4
125°C
RL = 43 Ω
VIN = 3.3 V 10
X Option (3)
−40°C ≤ TJ ≤
8
125°C
VIN = 5 V 16
VIN = 2.7 V 7.5
−40°C ≤ TJ ≤
6
125°C
RL = 43 Ω
VIN = 3.3 V 11
Y Option (3)
−40°C ≤ TJ ≤
8.75
125°C
VIN = 5 V 15
VOUT (MIN) Minimum Output Voltage Under Load V
VIN = 2.7 V 5
−40°C ≤ TJ ≤
3.75
125°C
RL = 15 Ω
VIN = 3.3 V 6.5
X Option (3)
−40°C ≤ TJ ≤
5
125°C
VIN = 5 V 10
VIN = 2.7 V 5
−40°C ≤ TJ ≤
4
125°C
RL = 15 Ω
VIN = 3.3 V 7
Y Option (3)
−40°C ≤ TJ ≤
5.5
125°C
VIN = 5 V 10
TJ = 25°C 1.8 2
ISW Switch Current Limit See (4) −40°C ≤ TJ ≤ A
1.4
125°C
TJ = 25°C 260 400
ISW = 100 mA
Vin = 5 V −40°C ≤ TJ ≤
500
125°C
RDS(ON) Switch ON-Resistance mΩ
TJ = 25°C 300 450
ISW = 100 mA
Vin = 3.3 V −40°C ≤ TJ ≤
550
125°C
−40°C ≤ TJ ≤
Device ON 1.5
125°C
SHDNTH Shutdown Threshold V
−40°C ≤ TJ ≤
Device OFF 0.5
125°C
VSHDN = 0 0
TJ = 25°C 0
ISHDN Shutdown Pin Bias Current µA
VSHDN = 5 V −40°C ≤ TJ ≤
2
125°C
TJ = 25°C 1.230
VFB Feedback Pin Reference Voltage VIN = 3 V −40°C ≤ TJ ≤ V
1.205 1.255
125°C
TJ = 25°C 60
IFB Feedback Pin Bias Current VFB = 1.23 V −40°C ≤ TJ ≤ nA
500
125°C
(1) Limits are ensured by testing, statistical correlation, or design.

(2) Typical values are derived from the mean value of a large quantity of samples tested during characterization and represent the most
likely expected value of the parameter at room temperature.
(3) L = 10 µH, COUT = 4.7 µF, duty cycle = maximum
(4) Switch current limit is dependent on duty cycle (see Typical Characteristics).
LM2731
Electrical Characteristics (continued)

Limits are for TJ = 25°C. Unless otherwise specified: VIN = 5 V, VSHDN = 5 V, IL = 0 A.
PARAMETER TEST CONDITIONS MIN (1) TYP (2) MAX (1) UNIT
TJ = 25°C 2
VSHDN = 5 V, Switching
"X" −40°C ≤ TJ ≤
3
125°C
mA
TJ = 25°C 1
VSHDN = 5 V, Switching
"Y" −40°C ≤ TJ ≤
IQ Quiescent Current 2
125°C
TJ = 25°C 400
VSHDN = 5 V, Not
Switching −40°C ≤ TJ ≤
500 µA
125°C
VSHDN = 0 0.024 1
ΔVFB/ΔVIN FB Voltage Line Regulation 2.7 V ≤ VIN ≤ 14 V 0.02 %/V
TJ = 25°C 1.6
“X” Option −40°C ≤ TJ ≤
1 1.85
125°C
FSW Switching Frequency (5) MHz
TJ = 25°C 0.6
“Y” Option −40°C ≤ TJ ≤
0.4 0.8
125°C
TJ = 25°C 86%
“X” Option −40°C ≤ TJ ≤
78%
125°C
DMAX Maximum Duty Cycle (5)
TJ = 25°C 93%
“Y” Option −40°C ≤ TJ ≤
88%
125°C
IL Switch Leakage Not Switching VSW = 5 V 1 µA
(5) Specified limits are the same for Vin = 3.3 V input.

LM2731
6.6 Typical Characteristics

Unless otherwise specified: VIN = 5 V, SHDN pin tied to VIN.
2.2 1.25
2.15 1.2
2.1 1.15
IQ VIN ACTIVE (mA)

IQ VIN ACTIVE (mA)
2.05 1.1
2 1.05
1.95 1
1.9
0.95
1.85
0.9
-50 -25 0 25 50 75 100 125 150
1.8
-50 -25 0 25 50 75 100 125 150 o
TEMPERATURE ( C)
o
TEMPERATURE ( C)
Figure 1. Iq VIN (Active) vs Temperature - X Option Figure 2. Iq VIN (Active) vs Temperature - Y Option
1.58 0.6
1.56 VIN = 5V VIN = 5V

OSCILLATOR FREQUENCY (MHz)
0.58
1.54
1.52 0.56
VIN = 3.3V VIN = 3.3V
1.5
0.54
1.48
1.46 0.52
1.44
0.5
1.42
1.4 0.48
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
TEMPERATURE (oC) TEMPERATURE (oC)

Figure 3. Oscillator Frequency vs Temperature - X Option Figure 4. Oscillator Frequency vs Temperature - Y Option
0.6 96.8
VIN = 5V 96.7
0.58
96.6
MAX DUTY CYCLE (%)
0.56 96.5
VIN = 3.3V
VIN = 3.3V
96.4
0.54
96.3
0.52 96.2 VIN = 5V
96.1
0.5
96
0.48 95.9
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Figure 5. Maximum Duty Cycle vs Temperature - X Option Figure 6. Maximum Duty Cycle vs Temperature - Y Option

LM2731
Typical Characteristics (continued)

380 0.09
0.08
375
0.07
FEEDBACK BIAS CURRENT (PA)

370
0.06
IQ VIN (IDLE) (PA)
365
0.05
360
0.04
355
0.03
350 0.02
345 0.01
340 0
0 25 50 100 125 150 -50 -25 0 25 50 75 100 125 150

-50 -25 75
o o
TEMPERATURE ( C) TEMPERATURE ( C)
Figure 7. Iq VIN (Idle) vs Temperature Figure 8. Feedback Bias Current vs Temperature

1.231 0.5
1.23 0.45
1.229 0.4
Vin = 3.3V
FEEDBACK VOLTAGE (V)
0.35
1.228
RDS(ON) (:)
0.3
1.227
0.25 Vin = 5V
1.226
0.2
1.225
0.15
1.224 0.1
1.223 0.05
1.222 0
-40 -25 0 25 50 75 100 125 -40 -25 0 25 50 75 100 125

Figure 9. Feedback Voltage vs Temperature Figure 10. RDS(ON) vs Temperature
2.6 350
300
2.5
250
CURRENT LIMIT (A)
2.4
RDS_ON (m:)
200
2.3
150
2.2
100
2.1 50
2 0
-40 -25 0 25 50 75 100 125 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5
TEMPERATURE (oC) VIN (V)

Figure 11. Current Limit vs Temperature Figure 12. RDS(ON) vs VIN

LM2731

100 100
90 90
80 80
70
EFFICIENCY (%)
70
EFFICIENCY (%)
60 60
50 50
40 40
30 30
20 20
10 10
0 0
0 50 100 150 200 250 300 0 200 400 600 800 1000 1200 1400
LOAD (mA) LOAD (mA)
VIN = 2.7 V VOUT = 5 V VIN = 4.2 V VOUT = 5 V
Figure 13. Efficiency vs Load Current - X Option Figure 14. Efficiency vs Load Current - X Option
80 100
70 90
80
60
70
EFFICIENCY (%)
50
EFFICIENCY (%)
60
40 50
30 40
20 30
20
10
10
0
0
0 10 20 30 40 50
0 100 200 300 400 500 600
LOAD (mA) LOAD (mA)

VIN = 2.7 V VOUT = 12 V VIN = 5 V VOUT = 12 V
100 100
90 90
80 80
70
EFFICIENCY (%)
70
EFFICIENCY (%)
60 60
50 50
40 40
30 30
20 20
10 10
0
0
0 50 100 150 200 250 300 350
0 50 100 150 200 250 300 350 400
LOAD (mA) LOAD (mA)

VIN = 5 V VOUT = 18 V VIN = 2.7 V VOUT = 5 V
Figure 17. Efficiency vs Load Current - X Option Figure 18. Efficiency vs Load Current - Y Option

LM2731

100 100
90 90
80 80
EFFICIENCY (%)
70
EFFICIENCY (%)
70
60
60
50
50
40
40
30
30
20
20
10
10
0
0 0 200 400 600 800 1000 1200 1400
0 200 400 600 800 1000 1200 1400 LOAD (mA)
LOAD (mA) VIN = 4.2 V VOUT = 5 V
VIN = 3.3 V VOUT = 5 V
Figure 19. Efficiency vs Load Current - Y Option Figure 20. Efficiency vs Load Current - Y Option
100 100
90 90
80 80
70
EFFICIENCY (%)
70
EFFICIENCY (%)
60
60
50
50
40
40
30
30
20
20
10
10
0
0 0 50 100 150 200 250
0 20 40 60 80
LOAD (mA) LOAD (mA)

VIN = 2.7 V VOUT = 12 V VIN = 3.3 V VOUT = 12 V
Figure 21. Efficiency vs Load Current - Y Option Figure 22. Efficiency vs Load Current - Y Option
100
90
80
70
EFFICIENCY (%)
60
50
40
30
20
10
0
0 100 200 300 400 500 600
LOAD (mA)
VIN = 5 V VOUT = 12 V
Figure 23. Efficiency vs Load Current - Y Option

LM2731
7 Detailed Description
7.1 Overview
The LM2731 device is a switching converter IC that operates at a fixed frequency (0.6 or 1.6 MHz) for fast
transient response over a wide input voltage range and incorporates pulse-by-pulse current limiting protection.
Because this is current mode control, a 33-mΩ sense resistor in series with the switch FET is used to provide a
voltage (which is proportional to the FET current) to both the input of the pulse width modulation (PWM)
comparator and the current limit amplifier.
7.1.1 Theory of Operation

At the beginning of each cycle, the S-R latch turns on the FET. As the current through the FET increases, a
voltage (proportional to this current) is summed with the ramp coming from the ramp generator and then fed into
the input of the PWM comparator. When this voltage exceeds the voltage on the other input (coming from the
Gm amplifier), the latch resets and turns the FET off. Because the signal coming from the Gm amplifier is derived
from the feedback (which samples the voltage at the output), the action of the PWM comparator constantly sets
the correct peak current through the FET to keep the output voltage in regulation.
Q1 and Q2 along with R3 - R6 form a bandgap voltage reference used by the IC to hold the output in regulation.
The currents flowing through Q1 and Q2 will be equal, and the feedback loop will adjust the regulated output to
maintain this. Because of this, the regulated output is always maintained at a voltage level equal to the voltage at
the FB node "multiplied up" by the ratio of the output resistive-divider.
The current limit comparator feeds directly into the flip-flop that drives the switch FET. If the FET current reaches
the limit threshold, the FET is turned off and the cycle terminated until the next clock pulse. The current limit
input terminates the pulse regardless of the status of the output of the PWM comparator.
7.2 Functional Block Diagram
7.3 Feature Description

The LM2731 is a fixed-frequency boost regulator IC that delivers a minimum 1.8-A peak switch current.
The device provides cycle-by-cycle current limit protection as well as thermal shutdown protection. The device
can also be controlled through the shutdown pin.

LM2731
7.4 Device Functional Modes

7.4.1 Shutdown Pin Operation
The device is turned off by pulling the shutdown pin low. If this function is not going to be used, the pin should be
tied directly to VIN. If the SHDN function will be needed, a pullup resistor must be used to VIN (approximately 50
kΩ to 100 kΩ recommended). The SHDN pin must not be left unterminated.
7.4.2 Thermal Shutdown

Thermal shutdown limits total power dissipation by turning off the output switch when the IC junction temperature
exceeds 160°C. After thermal shutdown occurs, the output switch doesn’t turn on until the junction temperature
drops to approximately 150°C.
7.4.3 Current Limit

The LM2731 uses cycle-by-cycle current limiting to protect the internal NMOS switch. It is important to note that
this current limit will not protect the output from excessive current during an output short-circuit. The input supply
is connected to the output by the series connection of an inductor and a diode. If a short circuit is placed on the
output, excessive current can damage both the inductor and diode.

LM2731
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information

The device will operate with input voltage range from 2.7 V to 14 V and provide a regulated output voltage. This
device is optimized for high-efficiency operation with minimum number of external components. For component
selection, see Detailed Design Procedure.
8.2 Typical Application

100
D1
L1/10PH MBR0520 5 - 12V Boost
5 VIN ^y_ s Œ•]}v
VIN U1 SW
90
12V
EFFICIENCY (%)
R3 LM2731 ³;´ R1/117K
51K OUT
SHDN
FB 500mA
SHDN (TYP)
GND
80
C1
R2 CF C2
2.2PF
GND 13.3K 220pF 4.7PF
70
0 100 200 300 400 500
LOAD CURRENT (mA)
Figure 24. Application Schematic Figure 25. Efficiency vs Load Current
8.2.1 Design Requirements

The device must be able to operate at any voltage within the recommended operating range. The load current
must be defined in order to properly size the inductor, input, and output capacitors. The inductor must be able to
handle full expected load current as well as the peak current generated during load transients and start-up.
Inrush current at start-up will depend on the output capacitor selection. More details are provided in Detailed
Design Procedure.
The device has a shutdown pin which is used to disable the device. This pin is active-LOW and care must be
taken that the voltage on this pin does not exceed VIN + 0.3 V. This pin must also not be left floating.
8.2.2 Detailed Design Procedure
8.2.2.1 Selecting the External Capacitors

The best capacitors for use with the LM2731 are multi-layer ceramic capacitors. These capacitors have the
lowest ESR (equivalent series resistance) and highest resonance frequency which makes them optimum for use
with high-frequency switching converters.
When selecting a ceramic capacitor, only X5R and X7R dielectric types should be used. Other types such as
Z5U and Y5F have such severe loss of capacitance due to effects of temperature variation and applied voltage,
they may provide as little as 20% of rated capacitance in many typical applications. Always consult capacitor
manufacturer’s data curves before selecting a capacitor. High-quality ceramic capacitors can be obtained from
Taiyo-Yuden, AVX, and Murata.

LM2731
8.2.2.2 Selecting the Output Capacitor

A single ceramic capacitor of value 4.7 µF to 10 µF will provide sufficient output capacitance for most
applications. If larger amounts of capacitance are desired for improved line support and transient response,
tantalum capacitors can be used. Aluminum electrolytics with ultra low ESR such as Sanyo Oscon can be used,
but are usually prohibitively expensive. Typical AI electrolytic capacitors are not suitable for switching frequencies
above 500 kHz due to significant ringing and temperature rise due to self-heating from ripple current. An output
capacitor with excessive ESR can also reduce phase margin and cause instability.
In general, if electrolytics are used, TI recommends that they be paralleled with ceramic capacitors to reduce
ringing, switching losses, and output voltage ripple.
8.2.2.3 Selecting the Input Capacitor

An input capacitor is required to serve as an energy reservoir for the current which must flow into the coil each
time the switch turns ON. This capacitor must have extremely low ESR, so ceramic is the best choice. TI
recommends a nominal value of 2.2 µF, but larger values can be used. Since this capacitor reduces the amount
of voltage ripple seen at the input pin, it also reduces the amount of EMI passed back along that line to other
circuitry.
8.2.2.4 Feedforward Compensation

Although internally compensated, the feedforward capacitor Cf is required for stability (see Figure 26). Adding
this capacitor puts a zero in the loop response of the converter. The recommended frequency for the zero fz
should be approximately 6 kHz. Cf can be calculated using the formula:
Cf = 1 / (2 × π X R1 × fz) (1)
8.2.2.5 Selecting Diodes

The external diode used in the typical application should be a Schottky diode. TI recommends a 20-V diode such
as the MBR0520.
The MBR05XX series of diodes are designed to handle a maximum average current of 0.5 A. For applications
exceeding 0.5-A average but less than 1 A, a Microsemi UPS5817 can be used.
8.2.2.6 Setting the Output Voltage

The output voltage is set using the external resistors R1 and R2 (see Figure 26). A minimum value of 13.3 kΩ is
recommended for R2 to establish a divider current of approximately 92 µA. R1 is calculated using the formula:
R1 = R2 × (VOUT/1.23 − 1) (2)
8.2.2.7 Switching Frequency

The LM2731 is provided with two switching frequencies: the “X” version is typically 1.6 MHz, while the “Y” version
is typically 600 kHz. The best frequency for a specific application must be determined based on the trade-offs
involved:
Higher switching frequency means the inductors and capacitors can be made smaller and cheaper for a given
output voltage and current. The down side is that efficiency is slightly lower because the fixed switching losses
occur more frequently and become a larger percentage of total power loss. EMI is typically worse at higher
switching frequencies because more EMI energy will be seen in the higher frequency spectrum where most
circuits are more sensitive to such interference.
Figure 26. Basic Application Circuit


LM2731
8.2.2.8 Duty Cycle

The maximum duty cycle of the switching regulator determines the maximum boost ratio of output-to-input
voltage that the converter can attain in continuous mode of operation. The duty cycle for a given boost
application is defined as:
VOUT + VDIODE - VIN
Duty Cycle =
VOUT + VDIODE - VSW (3)
This applies for continuous mode operation.
8.2.2.9 Inductance Value

The first question that is usually asked is: “How small can I make the inductor?” (because they are the largest
sized component and usually the most costly). The answer is not simple and involves trade-offs in performance.
Larger inductors mean less inductor ripple current, which typically means less output voltage ripple (for a given
size of output capacitor). Larger inductors also mean more load power can be delivered because the energy
stored during each switching cycle is:
E = L/2 × (lp)2 (4)
Where “lp” is the peak inductor current. An important point to observe is that the LM2731 will limit its switch
current based on peak current. This means that since lp(max) is fixed, increasing L will increase the maximum
amount of power available to the load. Conversely, using too little inductance may limit the amount of load
current which can be drawn from the output.
Best performance is usually obtained when the converter is operated in “continuous” mode at the load current
range of interest, typically giving better load regulation and less output ripple. Continuous operation is defined as
not allowing the inductor current to drop to zero during the cycle. All boost converters shift over to discontinuous
operation as the output load is reduced far enough, but a larger inductor stays “continuous” over a wider load
current range.
To better understand these trade-offs, a typical application circuit (5-V to 12-V boost with a 10-µH inductor) will
be analyzed. We will assume:
VIN = 5 V, VOUT = 12 V, VDIODE = 0.5 V, VSW = 0.5 V (5)
Because the frequency is 1.6 MHz (nominal), the period is approximately 0.625 µs. The duty cycle will be 62.5%,
which means the ON-time of the switch is 0.390 µs. When the switch is ON, the voltage across the inductor is
approximately 4.5 V.
Using the equation:
V = L (di/dt) (6)
The di/dt rate of the inductor can then be calculated, which is found to be 0.45 A/µs during the ON time. Using
these facts, what the inductor current will look like during operation can be shown:
0.176A
ILOAD
1 - DC
0
0.390 µs 0.235 µs
Figure 27. 10 µH Inductor Current, 5 V–12 V Boost (LM2731X)
During the 0.390-µs ON-time, the inductor current ramps up 0.176 A and ramps down an equal amount during
the OFF-time. This is defined as the inductor “ripple current”. If the load current drops to about 33 mA, the
inductor current will begin touching the zero axis which means it will be in discontinuous mode. A similar analysis
can be performed on any boost converter, to make sure the ripple current is reasonable and continuous
operation will be maintained at the typical load current values.

LM2731
8.2.2.10 Maximum Switch Current

The maximum FET switch current available before the current limiter cuts in is dependent on duty cycle of the
application. This is illustrated in the graphs below which show typical values of switch current for both the "X" and
"Y" versions as a function of effective (actual) duty cycle:
3000 3000
2500 2500
VIN = 5V
SW CURRENT LIMIT (mA)

VIN = 5V
SW CURRENT LIMIT (mA)
2000
2000
VIN = 3.3V
VIN = 3.3V 1500
1500
VIN = 3V
1000
1000
VIN = 2.7V 500 VIN = 2.7V

500
VIN = 3V
0
0 20 30 40 50 60 70 80 90 100
20 30 40 50 60 70 80 90 100
DUTY CYCLE (%) = [1 - EFF*(VIN / VOUT)]
DUTY CYCLE (%) = [1 - EFF*(VIN / VOUT)]

Figure 28. Switch Current Limit vs Duty Cycle - X Option Figure 29. Switch Current Limit vs Duty Cycle - Y Option
8.2.2.11 Calculating Load Current

As shown in the figure which depicts inductor current, the load current is related to the average inductor current
by the relation:
ILOAD = IIND(AVG) × (1 - DC) (7)
Where "DC" is the duty cycle of the application. The switch current can be found by:
ISW = IIND(AVG) + ½ (IRIPPLE) (8)
Inductor ripple current is dependent on inductance, duty cycle, input voltage and frequency:
IRIPPLE = DC × (VIN-VSW) / (f × L) (9)
Combining all terms, an expression can be developed which allows the maximum available load current to be
calculated:
æ DC(VIN - VSW ) ö
ILOAD (max) = (1 - DC) ´ ç ISW (max) - ÷
è 2fL ø (10)
The equation shown to calculate maximum load current takes into account the losses in the inductor or turn-OFF
switching losses of the FET and diode. For actual load current in typical applications, we took bench data for
various input and output voltages for both the "X" and "Y" versions of the LM2731 and displayed the maximum
load current available for a typical device in graph form:

LM2731
1200 1200
1000 1000
MAX LOAD CURRENT (mA)
MAX LOAD CURRENT (mA)

800 800
VOUT = 5V
600 VOUT = 5V
600
VOUT = 8V VOUT = 8V
400 VOUT = 10V 400

VOUT = 10V
VOUT = 12V
200 VOUT = 12V
VOUT = 18V 200
0
2 3 4 5 6 7 8 9 10 11 0
2 3 4 5 6 7 8
VIN (V)
VIN (V)
Figure 30. Maximum Load Current (Typical) vs VIN - X Figure 31. Maximum Load Current (Typical) vs VIN - Y
Option Option
8.2.2.12 Design Parameters VSW and ISW

The value of the FET "ON" voltage (referred to as VSW in the equations) is dependent on load current. A good
approximation can be obtained by multiplying the "ON-Resistance" of the FET times the average inductor
current.
FET on resistance increases at VIN values less than 5 V, since the internal N-FET has less gate voltage in this
input voltage range (see Typical Characteristics curves). Above VIN = 5V, the FET gate voltage is internally
clamped to 5V.
The maximum peak switch current the device can deliver is dependent on duty cycle. For higher duty cycles, see
Typical Characteristics.
8.2.2.13 Inductor Suppliers

Recommended suppliers of inductors for this product include, but are not limited to Sumida, Coilcraft, Panasonic,
TDK, and Murata. When selecting an inductor, make certain that the continuous current rating is high enough to
avoid saturation at peak currents. A suitable core type must be used to minimize core (switching) losses, and
wire power losses must be considered when selecting the current rating.

LM2731
8.2.3 Application Curves

See Typical Characteristics.
100 80
90 70
80
60
70
EFFICIENCY (%)
50
EFFICIENCY (%)
60
50 40
40
30
30
20
20
10 10
0
0
0 100 200 300 400 500 600 700
0 20 40 60 80 100 120 140 160
LOAD (mA)
VIN = 3.3 V VOUT = 5 V LOAD (mA)
VIN = 3.3 V VOUT = 12 V
8.3 System Examples

100
D1
L1/6.8PH MBR0520 3.3 -5V Boost
3.3 VIN ^z_ s Œ•]}v
VIN U1 SW
90
EFFICIENCY (%)
R3 LM2731 ³<´ R1/40.5K 5V

51K OUT
SHDN
FB 700mA
SHDN (TYP)
GND 80
C1
2.2PF R2 CF C2
GND 13.3K 470pF 22PF
70
0 200 400 600 800
LOAD CURRENT (mA)
Figure 34. VIN = 3.3 V, VOUT = 5 V at 700 mA Figure 35. Efficiency vs Load Current

LM2731
100
D1
L1/6.8PH MBR0520 90
3.3 VIN
80
VIN U1 SW
EFFICIENCY (%)
70
60
R3 LM2731 ³<´ R1/117K 12V
51K OUT 50
SHDN
FB 230mA
40
SHDN (TYP)
GND 30
20
C1
CF 3.3 -12V
2.2PF R2 C2 10
270pF Boost
GND 13.3K 10PF ^z_ s Œ•]}v
0
0 50 100 150 200 250
LOAD (mA)
100
D1
L1/10PH 9V OUT 90
MBR0520
3.3 VIN 240mA (typ)
80
VIN U1 SW
EFFICIENCY (%)
70
R3 LM2731 ³;´ R1/84K 60
51K D2 D4 3.3 -9V
SHDN 50
FB ^y_ s Œ•]}v
SHDN
40
GND D3 D5
30
C1
R2 CF C2 20
2.2PF R5
GND 13.3K 330pF R4
4.7PF
10
0
0 50 100 150 200 250 300
LOAD (mA)
B1
LI-ION L1 / 1.5 PH
3.3 - 4.2V D1
MBR0520
- + VIN SW
R3
LM2731"Y"
51K
SHDN FB
GND WHITE
0 FLASH
ENABLE C1 R2 LED's C2
4.7PF 120 4.7PF
Figure 40. White LED Flash Application

LM2731
9 Power Supply Recommendations

The LM2731 device is designed to operate from various DC power supplies. The impedance of the input supply
rail should be low enough that the input current transient does not cause a drop below SHUTDOWN level. If the
input supply is connected by using long wires, additional bulk capacitance may be required in addition to normal
input capacitor.
10 Layout
10.1 Layout Guidelines

High-frequency switching regulators require very careful layout of components to get stable operation and low
noise. All components must be as close as possible to the LM2731 device. TI recommends that a 4-layer PCB
be used so that internal ground planes are available.
As an example, a recommended layout of components is shown in Figure 41.
Some additional guidelines to be observed:
• Keep the path between L1, D1, and C2 extremely short. Parasitic trace inductance in series with D1 and C2
will increase noise and ringing.
• The feedback components R1, R2 and CF must be kept close to the FB pin of U1 to prevent noise injection
on the FB pin trace.
• If internal ground planes are available (recommended), use vias to connect directly to ground at pin 2 of U1,
as well as the negative sides of capacitors C1 and C2.
10.2 Layout Example
Figure 41. Recommended PCB Component Layout

LM2731
10.3 Thermal Considerations

At higher duty cycles, the increased ON-time of the FET means the maximum output current will be determined
by power dissipation within the LM2731 FET switch. The switch power dissipation from ON-state conduction is
calculated by:
P(SW) = DC × IIND(AVE)2 × RDS(ON) (11)
There will be some switching losses as well, so some derating needs to be applied when calculating IC power
dissipation.

LM2731
11 Device and Documentation Support
11.1 Device Support

11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM
www.ti.com 9-Jun-2015
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM2731XMF NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 125 S51A
LM2731XMF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 S51A
& no Sb/Br)
LM2731XMFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 S51A
& no Sb/Br)
LM2731YMF ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 125 S51B
LM2731YMF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 S51B
& no Sb/Br)
LM2731YMFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 S51B
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jun-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Dec-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2731XMF SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM2731XMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM2731XMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM2731YMF SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM2731YMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM2731YMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Dec-2016
*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2731XMF SOT-23 DBV 5 1000 210.0 185.0 35.0
LM2731XMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LM2731XMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LM2731YMF SOT-23 DBV 5 1000 210.0 185.0 35.0
LM2731YMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LM2731YMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
C
3.0
2.6 0.1 C
1.75
B A 1.45 MAX
1.45
PIN 1
INDEX AREA
1 5
2X 0.95
3.05
2.75
1.9 1.9
2
4
3
0.5
5X
0.3
0.15
0.2 C A B (1.1) TYP
0.00
0.25
GAGE PLANE 0.22
TYP
0.08
8
TYP 0.6
0 TYP SEATING PLANE
0.3
4214839/D 11/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A SOT-23 - 1.45 mm max height
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X (0.95)
3 4
(R0.05) TYP (2.6)
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
EXPOSED METAL EXPOSED METAL
0.07 MAX 0.07 MIN

ARROUND ARROUND
NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/D 11/2018
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A SOT-23 - 1.45 mm max height
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
2 (1.9)
2X(0.95)
3 4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/D 11/2018
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
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warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated

Lm2731 0.6/1.6-Mhz Boost Converters With 22-V Internal Fet Switch in Sot-23

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Changes from Revision F (November 2012) to Revision G Page

2 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated

Product Folder Links: LM2731

5 Pin Configuration and Functions

6.2 ESD Ratings

Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 3

6.3 Recommended Operating Conditions

6.4 Thermal Information

4 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated

Product Folder Links: LM2731

6.5 Electrical Characteristics

(1) Limits are ensured by testing, statistical correlation, or design.

Electrical Characteristics (continued)

6 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated

Product Folder Links: LM2731

6.6 Typical Characteristics

IQ VIN ACTIVE (mA)

1.56 VIN = 5V VIN = 5V

TEMPERATURE (oC) TEMPERATURE (oC)

0.52 96.2 VIN = 5V

Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 7

Typical Characteristics (continued)

FEEDBACK BIAS CURRENT (PA)

0 25 50 100 125 150 -50 -25 0 25 50 75 100 125 150

Figure 7. Iq VIN (Idle) vs Temperature Figure 8. Feedback Bias Current vs Temperature

TEMPERATURE (oC) TEMPERATURE (oC)

TEMPERATURE (oC) VIN (V)

8 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated

Product Folder Links: LM2731

Typical Characteristics (continued)

LOAD (mA) LOAD (mA)

LOAD (mA) LOAD (mA)

Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 9

Typical Characteristics (continued)

LOAD (mA) LOAD (mA)

Figure 23. Efficiency vs Load Current - Y Option

10 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated

Product Folder Links: LM2731

7.1.1 Theory of Operation

7.2 Functional Block Diagram

7.3 Feature Description

Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 11

7.4 Device Functional Modes

7.4.2 Thermal Shutdown

7.4.3 Current Limit

12 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated

Product Folder Links: LM2731

8 Application and Implementation

8.1 Application Information

8.2 Typical Application

LOAD CURRENT (mA)

Figure 24. Application Schematic Figure 25. Efficiency vs Load Current

8.2.1 Design Requirements

8.2.2 Detailed Design Procedure

8.2.2.1 Selecting the External Capacitors

Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 13

8.2.2.2 Selecting the Output Capacitor

8.2.2.3 Selecting the Input Capacitor

8.2.2.4 Feedforward Compensation

8.2.2.5 Selecting Diodes

8.2.2.6 Setting the Output Voltage