Chih-Ju Chan, Feng-Mao Hsu, Y. Su and K.

Chiang, "Study on current and junction temperature stress aging

effect for accelerated aging test of Light emitting diodes," 2016 International Conference on Electronics
Packaging (ICEP), Sapporo, 2016, pp. 62-65.
doi: 10.1109/ICEP.2016.7486783
Abstract: In recent years, Light emitting diodes (LEDs) has become more and more popular because of their low
power consumption, low-pollution and long-life. Currently, the common lumen maintenance test of LED follows
IES LM80-08 standard, which costs at least 6000 hours for measurement and prolongs the time-to-market
schedule. In our previous researches, a modified accelerated aging test algorithm using different high
temperature stress without input current was successfully proposed. And through the experiment, it shows that
the modified accelerated aging test algorithm, which derived from Arrhenius equation, cannot fit the lifetime of
LEDs aging in temperature and current stress. It recommends that the life prediction model has to make
consideration of both heat and current. First of all, we need to measure the lumen maintenance in same junction
temperature with different current. In this research we will use a validated finite element model and use thermal
resistance of LED to predict the junction temperature of chip under different current input. And use the forward
voltage method to measure the junction temperature to validate the simulation result and calculation result.
During the experiment we found out the heating type and the size of oven will influence junction temperature of
LED seriously. We need to consider about the oven when conducting aging test of LED in the future to make
sure whether the measured result is correct. In summary, we found out the corresponding relation between
current and ambient temperature for same junction temperature and oven's effect for junction temperature
measurement. It would provide some considerations to the accelerated aging test with developed degradation
prediction model in the future.
keywords: {finite element analysis;life testing;light emitting diodes;thermal management (packaging);thermal
resistance;temperature stress aging effect;accelerated aging test algorithm;light emitting diodes;LED test;IES
LM80-08 standard;Arrhenius equation;life prediction model;finite element model;thermal resistance;forward
voltage method;junction temperature;Temperature measurement;Junctions;Light emitting diodes;Thermal
resistance;Current measurement;Ovens;Accelerated aging test;Junction temperature;Forward voltage method},
URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7486783&isnumber=7486763