SMT Packaging

OC SMTA 9/16/04
Packaging

n New packages have had a

major influence on the
development of new and next
generation products not possible
without innovation.
Packaging

n New Packages Impact Design

l Smaller Footprint
l Lower Parasitics

l Lower Height

l Lower Cost
Package Trends
Some Fading Packages

n PLCC & SOJ Packages

n .050” Pitch Gullwing SO & QFP
n MELF’s
n High lead count QFP’s
n 1206 & 1210 Chips
BGA Packages

n Ceramic first developed in 1965

by IBM
n Plastic developed by Motorola
1988
MicroSMT Package
MLF Packages
BBUL Package
Wafer Level Packaging
Chip Stacking
Stacked Packages
High Speed Interconnects
Other Expanding Lines

n QFN
n LCN
n LCC
n SOT
n PCN
n BGS/CSP
n Flip Chip
Chip Components

n 0402 Standard
n 0302
n 0201
n 0101
n Buried Resistors
Chip Components

n Standard Fillets
n Minimal Fillets
n Filletless
Chip Components

n Minimal Fillets
Chip Components

n Filletless Lands
Gullwing Leads
n Finer Pitch, narrower leads, shorter
foot length, thinner
SON, PowerSOP

n Add heat tabs

PCN, MQFP, L/TQFP Pkg

n Adds thermal pad

n 5-40 mm, 32-304 leads
SOT, SSOT Packages

n Traditional 3-4 Leads

n New Smaller Size 6-8 Leads
LPN, LCN Package (leadless)
LGA Package
MLF Package (80-100 Lds)
Flip Chip
Wafer Bumping
RF Packages
RF Packages
RF Packages
LED’s
Land Pattern Trends

n Shorter toe extensions

n Narrower Lands
n Smaller Heel fillets
n Thinner joints
Design Challenges

n More leads per sq in

n More vias required per sq in
n More traces per sq in
n More layers to route
n Thermal Pads
New Design Demands

n Placement is critical
n Optimize Rotations
n Optimize gate and package
swaps
n Minimize complex crossovers
n Evaluate package types vs
design
PCB Manufacturability

n PC Fab requirements increase

n Smaller vias
n Smaller traces
n More Layers
Assembly

n Higher lead count packages

n Finer pitch increases placement
and rotation accuracy
n Thermal Pads complicate repair
rework (RR)
n Spacing is tighter making
inspection and RR harder
n Lead-Free hi temperatures
Summary

n Evolution is constant change

n Package evolution will continue
n Lots of new high density
solutions will appear
n Key is whether they are well
thought out to be practical and
cost effective in new products