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P.Code:BEO+ SSC-JB | 2019 (Mains) : Test Series Rake =akswe saad ay Nj BS) LANATIONS 1. @ Drift Velocity : It is the velocity of an e when an voltage is applied. The value of drift velocity is given by V,=pE Gi) Mobility (u) : Mobility denotes how fast the charge carrier will be moving from one place to another place. Mobility is defined as Drift velocity = Field Intensity Na AoE i =-my,m Unit for p = wee’ V = m/V sec or = cm’/V-sec iii) P-type Semiconductor : the impurity is trivalent Acceptor's Energy Level (F,) Crystalline. Structure“) at OK Energy Bond Diagram Incomplete Bond E- 0.01lw for Ge a |0.05w for Si * Acceptor energy level is a discrete energy level created just above the valence bond and it represents the energy level of all the trivalent atoms added to the SC. info@engineersacademy.org

ENGINEERS ACADEMY | ACADEMY | P-type SC at k will be working as a insulator. Acceptor's Energy Level (E,) H0.01 ev 9.05 ev Energy Bond Diagram at 300K In P-type SC every impurity atom will be receiving one e to complete is co-valuect bounding (Hence p-type sc is also called acceptors) Po>N * When p-type SC is at room temperature, a large number of co- valent bonds will be broken and equal number of e+ and holes are created and most of these e* will be moving from valence bond into acceptor energy level to complete the bounding and very few electrons is moving from VB to CB, so that hole come in VB is for greater than e~ conc. in the CB and therefore holes are majority carrier's and e? are minority carries, e In p-type SC the current is dominated by holes. p-type > Positive type N-type — Negative type ¢ The condition for p-type SC is p>nanda ENGINEERS ACADEMY | ACADEMY | * The conductivity due to minority carrier is almost neglisible > 99% due to majority < 1% due to minority The conductivity of p-type SC is o, = nd, + pap, Ofem o, = N, dh, Ofem ¢ n-type SC is superior to p-type SC because pt > M,. Representation of p-type SC S O'S oo Se SoS In p-type SC every impurity atom will be receiving le” to complete it's covalent bonding and impurity atom will become a Ove ion Ove ion means a neutral atom with excess e*. (iv) Energy Gap : It is the gap between highest energy level of valence band and lowest energy level of conduction band. BandGap) G, Ss E. f Ego = 0.785 ev 1.21 ev Ei 4>Forbiddens Ey Energy 227 4W4,=0.72ev lev Energy gap decreases with tamp. E, 4 with T E,% Temp Energy gap at any temp. T E,(T) = E,, — B,T ev B, is a material constant and expressed in ew/°K. ev Unit of B, - $e info@engineersacademy.org

ENGINEERS ACADEMY | ACADEMY | For G, E,(T) = 0.785 - 2.23 x 104 T For §,: E,(T) = 1.21 - 3.6 « 10¢T (vy) Ripple factor of centre tapped full wave rectifier : Ripple Factor : The AC component present in pulsating DC output of rectifier is called ripple. Riple factor is a measure of the amount of AC component or ripple present in the output of rectifier. Higher ripple factor indicates large amount of AC. Since AC component is unwanted ripple factor should be smaller and ideally it should be zero. rms value of AC component DC component = TB), _ Te T= al ona =yg7! r= 0.483 (vi) Intrinsic Semiconductor : Crystalline structure at OK (diamond structure) : Cy +-Empty Vs + Filled Energy Bond Diagram at OK © The sharing of e+ with the neigh bouring atoms is called co- valent bouding. * Co-Valent bounding consists of two valence e+. P.Code:BEO4 SSC-JB : 2019 (Mains] : Test Series Wayeln maui os mend © All valence e+ are in perfect co-valent banding. ¢ Intrivsec SC at OK will be working as an insulatory. Crystalline Structure at 300 K : Hole Free & Energy Bond Diagram at 300 K ¢ When a co-valent bond is broken it will create le and 1 hole (The e- will be moving from valence band into conduction band. and becomes a free e and hole will remain in the valence band) ¢ Free e is also called conduction band e- ¢ Hole is defined as deficiency of an e-in the broken covalent bond. ¢ Hole is a carrier of current with a positive charge of +1.6 = 10-" C. Always n=p The condition for intensic SC is n-p=n, I=L 41 ¢ Inthe SC e+ and holes always moves in the opposite direction. but they contribute the current in the same direction. ¢ Free e“ full be moving in the conduction band and contributing current at the same time hole will be moving in the VB, in the opposite direction and contribute some current and the total current is the sum of e- and hole current. The conductivity of intrisic SC is 9,=nq H, tpq p, O/em But n = nin intrisic SC o,=niqth th) 6,0 n But n, a T? ¢ Hence o, 1 with T as a non-linear variation info@engineersacademy.org

ENGINEERS ACADEMY | ACADEMY | Intrinsic Resistivi Pi- G, P= nqu.+n,] Om ¢ The main disadvantage of intrinsic SC is very law conductivity and this is due to the smaller value of n. ¢ The only electronic device fabricated with intrinsic SC is PIN diode (microwave switch). 2. (a) Forward Bias : Vz, or, += {1 IW V=V,+V, V=IR, +IR, R, — Current limiting Resistance Vp L= le — 1 y, L® Lem n= 1 for c,, | Earlier methods 1 = 2 for Si of writing 1 = 1 for larger current | Latest 1 =2 for smaller current Notation. When P-N Junction is forward Bias : ¢ The width of the depletion layer decreases. ¢ The barrier height reduces. ¢ Forward current is only due to majority carriers. It, Saturation current gets doubled for every 5°C, as against the thumbruts which indicates doubles for every 10°C. ¢ The forward current exponentially increases with the forward voltage across the diode. info@engineersacademy.org

ENGINEERS ACADEMY | ACADEMY | P N Soe rs es! fo | Minority Minority Carriers Carriers of P of N In a forward biased diode the minority carriers of P and N region will be moving away from the junction and they will deposit in the device and the will not contribute any flow of current. 2 ¢ Ina forward biased diode the current up to the edge of depletion layer is a drift current due to majority carriers. ¢ Forward current is a diffusion current forward current is due to majority carriers and these majority carriers will be crossing the junction from higher conc. to lower conc. i.e. due to the property called diffusion. ¢ Forward current is due to excess minority carriers. « The majority carriers of P and N regions are crossing the junction and will become minority carriers and they are called excess minority carriers. ¢ Forward current is controlled by excess minority carrier conc. crossing the junction. ¢ Forward current flows from P to N. ¢ Forward current is due to excess minority carriers. ngineersacedemy.ora ENTER CL MME www.engineersacademy.org> 11 2. b) P.Code:EE04 SSC-JE : 2019 (Mains) : Test EEsED> ENGINEERS ACADEMY | ACADEMY | Minimum current which pass through R, is I VM s Vg— Vo Rs 30-11 Rs R, 3. (a) Common Emitter Characteristic : o—_____ iv IA Li th Lt 1+ 10 ll ll ll mA 1.818 kQ | __‘g ¢ Input Characteristic : A plot of I, V, V, while maintaining V._ constant. ¢ For a BJT Base current V,, is due to compensating carriers which enter the base region to maintain it neutral. P.Code:EE04 SSC-JE : 2019 (Mains) : Test EEsED> ENGINEERS ACADEMY | ACADEMY | ¢ 1, & Number of recombination. ¢ Number of recombination inside base is proportional to current I. L Vou Ver Vers Vex Vers > Ver > Vea I, is neglisible for small V,, values but it increases rapidly when V,, = V, BE out in’ v. <* V for S, \ EE atin For npn 0.1 V for G, mp I, also depends on V,,, due to early effect. ¢ Higher V,, will produce lower base current. If Vz 1 > Vag(Veg — Veg) > Effective base width | > Number of hole recombination | > I, L ¢ When V,, is increased input characteristic shifts towards right. Output Characteristic : ¢ Aplot of I, V, 1,, while maintaining 1, constant. I, “| Saturation —— Active region t La Vig saturation cut-off region Cut-off Region : Region where 1, is almost zero. It list on urve and to right of Vv, ce NCE sat ngineersacedemy.ora ENTER LMM www.engineersacademiy.org> 13 P.Code:EE04 SSC-JE : 2019 (Mains) : Test EEsED> ENGINEERS ACADEMY | ACADEMY | If I, then 1,= (1+ Bl, For 8, 1, is in nA => I, will be neglisible in cut-off. For G,, [,, is in pA = I, will be considerable. ¢ Therefore the make I, = 0 or make a G, transistor for off base to emitter voltage should be slightly negative the value of V,, for which [, becomes almost zero is called V, BE cubaff vy OV for S, sem brow NPN —0.1 V for G, Saturation Region : Region where I, increases with V_,. It les above I, = 0 curve and to the left of V,, = V, CE sit" Vv. 0.2 V for S, st < en npn. 0.1 V for G, Vax V, cese — Transistor is in saturation region. Active Region : Region where I, is approximately constant but not exactly constant w.r.t. V',, it lies above I, = 0 curve and to the right of Vi. = Vex sa in active region I, = Bl, + + BI, ¢ The small increase in 1, w.r.t. V., in active region is because of increase in B. B increase due to early effect. ¢ = Ifthe output characteristic are projected backward they intersect the voltage axis at 0 single point (-V,, 0) I info@engineersacademy.org

ENGINEERS ACADEMY | rear Consider A and B L-0 Slope ~ Veg att Va I, Slope = Ve Consider B and C, slope (b) N-Channel JFET : G G Channel 0 o. JFET is a symmetrical device. When JFET is open circuited channel cross sector area will be maximum and channel current density is maximum. Teoma ear e ENGINEERS ACADEMY | ACADEMY | Tosa Ls Vine « InJFET, the maximum drain current is Tyg > Drain to source safe current or drain to source saturation current. ¢ In JFET, I, = 1g only when Vig = ¢ The conc. of majority carriers in the channel depends on (i) Doping conc. of the channel. (ii) Cross sectional area of the channel. e In JFET, if gate to source is more RB : (i) Depletion layer will penetrate more into the channel and there by reduces the channel width. (ii) Less majority carriers will be moving from source to drain and therefore I, reduces. ¢ The minimum gate to source voltage required to cut-off the channel or the reduce the drain current to zero is called Nesaiom) Of Vasc «= The process where the channel width is altered by varying the gate to source voltage is called channel width modulation. ¢ Channel width modulation is similar to base width modulation. or early effect in the BJT. Step-II : Keeping V,, Constant and By varying V,, 1, Vy Voslig I -~Parabola_ Break down Region — P.Code:EE04 SSC-JE : 2019 (Mains) : Test EEsED> ENGINEERS ACADEMY | ACADEMY | ¢ The drain characteristics of FET are called constant current characteristics (and they are saturation collector characteristics of CB transit for) ¢ FET can work as a current source. ¢ FET is VCCS. ¢ CB transistor is CCCS. ¢ The break down in FET is due to avalanche-effect. * In JFET, Breakdown is between drain and gate junction. ¢ Inthe ohmic region, fet is working as a linear device i.e., a resistor. Example: Voliage variable Resistor (VVR) or voltage dependent resistor (VDR) ¢ Inthe ohmic region channel behaves as a resistor. ¢ Inthe ohmic region FET can work VVR. by varying gate to source voltage. (V.,). ¢ Saturation region is also called current saturation region or pinch of region. « FET is generally operated in the saturation region. 4. (a) Comparison of Controlling Systems : Gravity Control Spring Control [Adjustable small weight is used hwhich produces the controlling torque. ‘Two hair springs are used which exert c ortrolling torque. (Controlling torque can be varied. Controlling torque is fixed. The performance is not temperature The performance is temperature sin 8. dependent dependent. The scale is non-uniform The scale is uniform TT he controlling torque is proportional to |The controlling torque is proportional to 8. 'T he readings can not be taken accurately. The readings can be taken very accurately. The system must be used in vertical position only. The system need not be necessarily in vertical position Proper levelling & required as gravity control. Simple, cheap but delicate, The levelling is not required. Simple, rigid but costlier compared to gravity control. Rarely used for indicating & portable instruments. Very popularly used in most of the instruments. Tecmo ear e ENGINEERS ACADEMY | ACADEMY | Consider that current coil is on the load side : Power indicated by wattmeter, P,, = Power consumed by load + Power loss in current coil =P, + PR, = 2640 + (20/(0.03) 2652 watt Pu-Pr gg _ 2652-2640 PB 2650 % Error = 0.45% At this current equal errors are obtained. 5. (a) Assuming square coil, A= P= 16 = 16 = 256 mm? G = NBA = 200 « 10 x 10% x 256 x 10° = 5.12 x 104 Nnv/A Gi _ 5.12K10“ xIx10 % Error = 100 ® OF & T2x10° = 0.04266 rad = 20 x r= 2X 0.04266 x 1000 d = 85.3333 mm (r= 1m = 1000 mm) a) 8,= ¢ = 85.3333 mmv/pA Git) s,= gh = 853333 = o711 mmuv ~~ GR, ~ Txiz0 u , _ ad _ 85,333 ay) So= Toe * Teo x10? = 85.333 MQimm JaIK—D? O= 50x10 12107 (Sxl - 2x 50x10? = 0.4873 rad/sec £,— $8 = 4873 _ 0775 He Qn Eman info@engineersacademy.org

ENGINEERS ACADEMY | ACADEMY 2m Qn TS = EIN = Ja2xd0? 50x10) = 12.825 sec vii) 9, = Oise | wh _D__D oe, S$ D> 2K 5x10? = p50? xd2eloe ~ 9-102 9 = 0.01266) 1+ ee moog 07358 rad = 2 x 1000 x 0.07358 mm = 147.164 mm __ ...First maximum deflection (viii) & = Relative damping = 0.102 . me 7x 0.102 Gx) R= f= Ji-@.102" = 0.3221 b) I, _ 2000 = 2a = K,= [= 7 = 400 I, sind +1, cosd R=0+2—— Where, 1, = 5 A (fall load) _ 399 Sin36.869")+ 3x08 _ 96 59 % ratio error = Ka 199 = 0,3713% 180] 1,,cosd—[,sind =F nl, 180] 8x 0.8 —3xsin(-36.8698°) a 399x5 = 0.2355° = 14.13 P.Code:EE04 SSC-JE : 2019 (Mains) : Test EEsED> ENGINEERS ACADEMY | ACADEMY | 6. (a) For Balanced Load : Let us consider the rms values of the currents and voltages to prove that sum of two wattmeter gives total power consumed by three phase load. W, = 1, X Vig X coat, © Vig) W,= I, * Vi, * cos(I, * V,.) To find angle between (I, and V,,) and (I, and V,,) let us draw phasor diagram. (Assuming load pf be cosh lagging) Ve and Veg = W-Va P.Code:EE04 SSC-JE : 2019 (Mains) : Test EEsED> ENGINEERS ACADEMY | ACADEMY | WwW. V_T.cos(30° — 4) and W, = LV, c08(30° + 6) W, = V_Tcos(30° + 4) W, + W, = V,I,[eos(30° — 6) + cos(30° + 6)] V,I_[cos30° cos + sin30° sin @ + cos30° cas — sin30° sino] = 2V_T_cos30° cosh = 2v,t, Borg Ww, + W, = 3 VI, cosp = total 3 phase power Consider delta connected balanced load, as shown in the figure. Ww, R Figure : Two wattmeter method for deita connected load For W,, I= I, and V,. = Vip For W,, 1,= I, and V,, = Vi W, = 1,008, * Vig) W,= IV,,cost], * V,,) To find I, * V,, and I, * V,, let us draw phasor diagram. Assume load having cosd lagging p.f. W,+W, = V],[eos(30° — 0) + cos(30° + 4)] 3 V1, coso = Total power consumed by three phase load. For load having leading power factor, L,. will lead V, oh by angle and it can be observed from phasor diagram that W, reading and W, reading will get interchanged as 30° — > will become 30 ° + @ and viceversa. info@engineersacademy.org

ENGINEERS ACADEMY | ACADEMY | Refer figure for leading power factor phasor diagram. Ve Vee Figure : Star Connected Leading pf ) R, = 6600 Q V= 120 V T=20A 8 = 160° Vv e=- aL cong ix AM R, dé Where, K = Spring constant Assuming nw constant throughout the operation. K! e=—%*P R, ,_ 1dM Where, K'= Kd and P = VI cosb 160° = op li20«20x1] K' = 440 degrees Q/W If Meter constant = 20 W/degree then — P Meter constant P.Code:EE04 SSC-JE : 2019 (Mains) : Test EEsED> ENGINEERS ACADEMY | ACADEMY | 1 2400 _ oqe 8 = = = 120 At this time, R,=R,/+R, 440 120° = prX2400 R R, = 8800 Q = 6600 + R ? “ R, = 2200 Q Additional resistance required. 7. (a) W, = 5000 W, W, = -1000 W @ cos} = co [ea _, | ¥3[5000—(1000)] - can eas | ¥3x6000 = co | Se so0e = cos( 68.948} = 0.3592 lag Gi) Now capacitance is connected at the source which does not affect the active power consumption. W = 5000 — 1000 = 4000 W Before connecting capacitor W= BVI, cosd A000 1. = \Bxa40x03502 ~ M612 A For delta, Vin =V=40V and 1, = VBI, ie, L, = 8.4362 A pa v, — ye _ 4400 _ l= Ty = gaagg = 21561 2 6 = 68.948° X,, = Z,, sind = 48.6749 Q (inductive) * ‘ =Z,, cosd = 18.7352 © (resistive) ph Spt info@engineersacademy.org

ENGINEERS ACADEMY | ACADEMY | After connecting capacitor W, = W = 4000 W A W,=0 W But W, = V,I.cos (30° + 9) = 0 ie, 30° + 6 = 90° ie, > = 60° cosh = cos(60°) = 0.5 lagging Due to pure capacitor, Ra remains same. = 18. 7352 "2 x - oS Now, tang = Rn Where, =X), = New reactance x ey = sh tan(60%) = 737355 Xi, = 32.4503 Xi =X, — Xa = 48.6749 — 32.4503 = 16.226.Q 1 But Koon ~ CaO) C= pe ae =~ 196.28 UF 2nx 50x 16.2246 (b) Maxweil’s Inductance Bridge : Using this bridge, we can measure inductance by comparing it with a standard variable self inductance arrangeed in bridge circuit as shown in figure. Detector P.Code:EE04 SSC-JE : 2019 (Mains) : Test EEsED> ENGINEERS ACADEMY | ACADEMY | Vo Vy ini, iRAR, — (Ret1)-iR, Figure (b) : Phasor diagram Consider Maxwell's inductance bridge as shown in the figure. Two branches consist of non-inductive resistances R, and R,. One of the arms consists variable inductance with series resistance 1. The remaining arm consists unknown inductance L.. At balance, we get condition as — Rk _ RL [R; +1) + jobs] ~ Ry + jal, RIRHeL] = RR, + DHeL,] RRjAoP L, = RAR, + 1) + joRL, Equating imaginary terms, we can write RL,= RL, L,= Ris Equating real terms, we can write, R,R, = RR, + 1) R= RRA 999 info@engineersacademy.org

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