Professional Documents
Culture Documents
June 1989
54LS00/DM54LS00/DM74LS00
Quad 2-Input NAND Gates
General Description Features
This device contains four independent gates each of which Y Alternate Military/Aerospace device (54LS00) is avail-
performs the logic NAND function. able. Contact a National Semiconductor Sales Office/
Distributor for specifications.
Connection Diagram
Dual-In-Line Package
TL/F/6439 – 1
Order Number 54LS00DMQB, 54LS00FMQB, 54LS00LMQB, DM54LS00J, DM54LS00W, DM74LS00M or DM74LS00N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
Y e AB
Inputs Output
A B Y
L L H
L H H
H L H
H H L
H e High Logic Level
L e Low Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max, DM54 2.5 3.4
V
Voltage VIL e Max
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max, DM54 0.25 0.4
Voltage VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.36 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2)
DM74 b 20 b 100
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
3 10 4 15 ns
Low to High Level Output
tPHL Propagation Delay Time
3 10 4 15 ns
High to Low Level Output
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
2
Physical Dimensions inches (millimeters)
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS00/DM54LS00/DM74LS00 Quad 2-Input NAND Gates
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
54LS02/DM54LS02/DM74LS02
Quad 2-Input NOR Gates
General Description Features
This device contains four independent gates each of which Y Alternate Military/Aerospace device (54LS02) is avail-
performs the logic NOR function. able. Contact a National Semiconductor Sales Office/
Distributor for specifications
Connection Diagram
Dual-In-Line Package
TL/F/6441 – 1
Order Number 54LS02DMQB, 54LS02FMQB, 54LS02LMQB, DM54LS02J, DM54LS02W, DM74LS02M or DM74LS02N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
YeAaB
Inputs Output
A B Y
L L H
L H L
H L L
H H L
H e High Logic Level
L e Low Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max, DM54 2.5 3.4
V
Voltage VIL e Max
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max, DM54 0.25 0.4
Voltage VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.40 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2)
DM74 b 20 b 100
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
13 18 ns
Low to High Level Output
tPHL Propagation Delay Time
10 15 ns
High to Low Level Output
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
2
Physical Dimensions inches (millimeters)
3
Physical Dimensions inches (millimeters) (Continued)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS02/DM54LS02/DM74LS02 Quad 2-Input NOR Gates
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
54LS03/DM54LS03/DM74LS03 Quad 2-Input NAND Gates with Open-Collector Outputs
June 1989
54LS03/DM54LS03/DM74LS03
Quad 2-Input NAND Gates
with Open-Collector Outputs
General Description Pull-Up Resistor Equations
This device contains four independent gates each of which VCC (Min) b VOH
performs the logic NAND function. The open-collector out- RMAX e
N1 (IOH) a N2 (IIH)
puts require external pull-up resistors for proper logical op-
eration. VCC (Max) b VOL
RMIN e
IOL b N3 (IIL)
Features
Y Alternate Military/Aerospace device (54LS03) is avail- Where: N1 (IOH) e total maximum output high current for all
able. Contact a National Semiconductor Sales Office/ outputs tied to pull-up resistor
Distributor for specifications. N2 (IIH) e total maximum input high current for all
inputs tied to pull-up resistor
N3 (IIL) e total maximum input low current for all
inputs tied to pull-up resistor
Connection Diagram
Dual-In-Line Package
TL/F/6344 – 1
Order Number 54LS03DMQB, 54LS03FMQB, 54LS03LMQB,
DM54LS03J, DM54LS03W, DM74LS03M or DM74LS03N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
Y e AB
Inputs Output
A B Y
L L H
L H H
H L H
H H L
H e High Logic Level
L e Low Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
ICEX High Level Output VCC e Min, VO e 5.5V,
100 mA
Current VIL e Max
VOL Low Level Output VCC e Min, IOL e Max, DM54 0.25 0.4
Voltage VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.36 mA
ICCH Supply Current with VCC e Max
0.8 1.6 mA
Outputs High
ICCL Supply Current with VCC e Max
2.4 4.4 mA
Outputs Low
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
6 20 20 45 ns
Low to High Level Output
tPHL Propagation Delay Time
3 15 4 20 ns
High to Low Level Output
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
2
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS03/DM54LS03/DM74LS03 Quad 2-Input NAND Gates with Open-Collector Outputs
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
SN5404, SN54LS04, SN54S04,
SN7404, SN74LS04, SN74S04
HEX INVERTERS
SDLS029B – DECEMBER 1983 – REVISED FEBRUARY 2002
SN5404 . . . W PACKAGE
(TOP VIEW)
1A 1 14 1Y
2Y 2 13 6A
2A 3 12 6Y
VCC 4 11 GND
3A 5 10 5Y
3Y 6 9 5A
4A 7 8 4Y
VCC
NC
1Y
1A
6A
3 2 1 20 19
2A 4 18 6Y
NC 5 17 NC
2Y 6 16 5A
NC 7 15 NC
3A 8 14 5Y
9 10 11 12 13
3Y
4Y
4A
NC
GND
NC – No internal connection
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright 2002, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments On products compliant to MIL-PRF-38535, all parameters are tested
standard warranty. Production processing does not necessarily include unless otherwise noted. On all other products, production
testing of all parameters. processing does not necessarily include testing of all parameters.
ORDERING INFORMATION
ORDERABLE TOP-SIDE
TA PACKAGE†
PART NUMBER MARKING
Tube SN7404N SN7404N
PDIP – N Tube SN74LS04N SN74LS04N
Tube SN74S04N SN74S04N
Tube SN7404D 7404
Tube SN74LS04D
LS04
0°C to 70°C SOIC – D Tape and reel SN74LS04DR
Tube SN74S04D
S04
Tape and reel SN74S04DR
Tape and reel SN7404NSR SN7404
SOP – NS
Tape and reel SN74LS04NSR 74LS04
SSOP – DB Tape and reel SN74LS04DBR LS04
Tube SN5404J SN5404J
Tube SNJ5404J SNJ5404J
Tube SN54LS04J SN54LS04J
CDIP – J
Tube SN54S04J SN54S04J
Tube SNJ54LS04J SNJ54LS04J
–55°C to 125°C Tube SNJ54S04J SNJ54S04J
Tube SNJ5404W SNJ5404W
CFP – W Tube SNJ54LS04W SNJ54LS04W
Tube SNJ54S04W SNJ54S04W
Tube SNJ54LS04FK SNJ54LS04FK
LCCC – FK
Tube SNJ54S04FK SNJ54S04FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
FUNCTION TABLE
(each inverter)
INPUT OUTPUT
A Y
H L
L H
1A 1Y
2A 2Y
3A 3Y
4A 4Y
5A 5Y
6A 6Y
Y=A
4 kΩ 1.6 kΩ 130 Ω
Input A
Output Y
1 kΩ
GND
’LS04 ’S04
VCC VCC
20 kΩ 8 kΩ 120 Ω 2.8 kΩ 50 Ω
900 Ω
Input
A 3.5 kΩ Output
Input 4 kΩ Output Y
A Y
12 kΩ
250 Ω
500 Ω
3 kΩ
1.5 kΩ
GND
GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI: ’04, ’S04 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
’LS04 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. This are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3V
High-Level Timing
Pulse 1.5 V 1.5 V Input 1.5 V
0V
tw th
tsu
3V
Low-Level Data
1.5 V 1.5 V 1.5 V 1.5 V
Pulse Input
0V
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PULSE DURATIONS SETUP AND HOLD TIMES
Output 3V
Control
(low-level 1.5 V 1.5 V
3V
Input 1.5 V 1.5 V enabling) 0V
0V tPZL tPLZ
tPLH tPHL
Waveform 1 ≈1.5 V
In-Phase VOH (see Notes C 1.5 V
Output 1.5 V 1.5 V and D) VOL + 0.5 V
(see Note D) VOL
VOL
tPZH tPHZ
tPHL tPLH
VOH
Out-of-Phase VOH Waveform 2 VOH – 0.5 V
(see Notes C 1.5 V
Output 1.5 V 1.5 V ≈1.5 V
(see Note D) and D)
VOL
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
3V
High-Level Timing
Pulse 1.3 V 1.3 V Input 1.3 V
0V
tw th
tsu
3V
Low-Level Data
1.3 V 1.3 V 1.3 V 1.3 V
Pulse Input
0V
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PULSE DURATIONS SETUP AND HOLD TIMES
Output 3V
Control
(low-level 1.3 V 1.3 V
3V
Input enabling)
1.3 V 1.3 V 0V
0V tPZL tPLZ
tPLH tPHL
In-Phase
Waveform 1 ≈1.5 V
VOH (see Notes C 1.3 V
Output 1.3 V 1.3 V VOL + 0.5 V
and D)
(see Note D) VOL VOL
tPZH tPHZ
tPHL tPLH
VOH
Out-of-Phase Waveform 2 VOH – 0.5 V
VOH
(see Notes C 1.3 V
Output 1.3 V 1.3 V
and D) ≈1.5 V
(see Note D) VOL
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL.
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns.
G. The outputs are measured one at a time with one input transition per measurement.
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third–party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Connection Diagram
Dual-In-Line Package
TL/F/6346 – 1
Order Number 54LS05DMQB, 54LS05FMQB, DM54LS05J, DM54LS05W, DM74LS05M or DM74LS05N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
YeA
Input Output
A Y
L H
H L
H e High Logic Level
L e Low Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
ICEX High Level Output VCC e Min, VO e 5.5V
100 mA
Current VIL e Max
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ VCC e Max, VI e 7V
0.1 mA
Max Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.36 mA
ICCH Supply Current with VCC e Max
1.2 2.4 mA
Outputs High
ICCL Supply Current with VCC e Max
3.6 6.6 mA
Outputs Low
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
6 20 20 45 ns
Low to High Level Output
tPHL Propagation Delay Time
3 15 4 20 ns
High to Low Level Output
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
2
Physical Dimensions inches (millimeters)
3
54LS05/DM54LS05/DM74LS05 Hex Inverters with Open-Collector Outputs
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
SN54LS06, SN74LS06, SN74LS16
HEX INVERTER BUFFERS/DRIVERS
The SN74LS16 is obsolete
and is no longer supplied. WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS
SDLS020B – MAY 1990 – REVISED JANUARY 2002
VCC
NC
1Y
1A
6A
driving high-current loads, and also are character-
ized for use as inverter buffers for driving TTL
inputs. The ’LS06 devices have a rated output 3 2 1 20 19
2A 4 18 6Y
voltage of 30 V, and the SN74LS16 has a rated NC 5 17 NC
output voltage of 15 V. The maximum sink current 2Y 6 16 5A
for the SN54LS06 is 30 mA, and for the NC
NC 7 15
SN74LS06 and SN74LS16 is 40 mA. 14 5Y
3A 8
9 10 11 12 13
These devices are compatible with most TTL
families. Inputs are diode-clamped to minimize
3Y
4Y
4A
NC
GND
transmission effects, which simplifies design.
Typical power dissipation is 175 mW and average
NC – No internal connection
propagation delay time is 8 ns.
ORDERING INFORMATION
ORDERABLE TOP-SIDE
TA PACKAGE†
PART NUMBER MARKING
Tube SN74LS06D
SOIC – D LS06
Tape and reel SN74LS06DR
0°C to 70°C SOP – NS Tape and reel SN74LS06NSR 74LS06
SSOP – DB Tape and reel SN74LS06DBR LS06
PDIP – N Tube SN74LS06N SN74LS06N
Tube SN54LS06J SN54LS06J
CDIP – J
–55°C to 125°C Tube SNJ54LS06J SNJ54LS06J
LCCC – FK Tube SNJ54LS06FK SNJ54LS06FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB
design guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright 2002, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments On products compliant to MIL-PRF-38535, all parameters are tested
standard warranty. Production processing does not necessarily include unless otherwise noted. On all other products, production
testing of all parameters. processing does not necessarily include testing of all parameters.
1 2 1Y
1A
3 4 2Y
2A
5 6
3A 3Y
9 8
4A 4Y
11 10
5A 5Y
13 12
6A 6Y
9 kΩ 2.5 kΩ
15 kΩ 1 kΩ
2.5 kΩ Output
Input
2 kΩ 2 kΩ
GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Output voltage, VO (see Notes 1 and 2): SN54LS06, SN74LS06 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
SN74LS16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. This is the maximum voltage that should be applied to any output when it is in the off state.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
3V
High-Level Timing
Pulse 1.3 V 1.3 V Input 1.3 V
0V
tw th
tsu
3V
Low-Level Data
1.3 V 1.3 V 1.3 V 1.3 V
Pulse Input
0V
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PULSE DURATIONS SETUP AND HOLD TIMES
Output 3V
Control
(low-level 1.3 V 1.3 V
3V
Input enabling)
1.3 V 1.3 V 0V
0V tPZL tPLZ
tPLH tPHL
In-Phase
Waveform 1 ≈1.5 V
VOH (see Notes C 1.3 V
Output 1.3 V 1.3 V VOL + 0.5 V
and D)
(see Note D) VOL VOL
tPZH tPHZ
tPHL tPLH
VOH
Out-of-Phase Waveform 2 VOH – 0.5 V
VOH
(see Notes C 1.3 V
Output 1.3 V 1.3 V
and D) ≈1.5 V
(see Note D) VOL
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL.
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns.
G. The outputs are measured one at a time with one input transition per measurement.
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third–party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
ORDERING INFORMATION
ORDERABLE TOP-SIDE
TA PACKAGE†
PART NUMBER MARKING
Tube SN7407D
7407
Tape and reel SN7407DR
SOIC – D
Tube SN7417D
7417
0°C to 70°C Tape and reel SN7417DR
SN7407N SN7407N
PDIP – N Tube
SN7417N SN7417N
SOP – NS Tape and reel SN7407NSR SN7407
SNJ5407J SNJ5407J
CDIP – J Tube
SNJ5417J SNJ5417J
55°C to 125°C
–55°C
SNJ5407W SNJ5407W
CFP – W Tube
SNJ5417W SNJ5417W
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB
design guidelines are available at www.ti.com/sc/package.
A Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright 2001, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments On products compliant to MIL-PRF-38535, all parameters are tested
standard warranty. Production processing does not necessarily include unless otherwise noted. On all other products, production
testing of all parameters. processing does not necessarily include testing of all parameters.
schematic
VCC
6 kΩ 3.4 kΩ 1.6 kΩ
Input A
Output Y
100 Ω
1 kΩ
GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 5.5 V
Output voltage, VO (see Notes 1 and 2): SN5407, SN7407 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
SN5417, SN7417 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. This is the maximum voltage that should be applied to any output when it is in the off state.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
RL
From Output
Test Point
Under Test
CL
(see Note A)
LOAD CIRCUIT
3V
Input 1.5 V 1.5 V
0V
tPLH tPHL
VOH
High-Level In-Phase
1.5 V 1.5 V 1.5 V 1.5 V
Pulse Output
VOL
tw tPHL tPLH
Low-Level VOH
Out-of-Phase
Pulse 1.5 V 1.5 V 1.5 V 1.5 V
Output
VOL
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PULSE WIDTHS PROPAGATION DELAY TIMES
ORDERING INFORMATION
ORDERABLE TOP-SIDE
TA PACKAGE†
PART NUMBER MARKING
Tube SN7407D
7407
Tape and reel SN7407DR
SOIC – D
Tube SN7417D
7417
0°C to 70°C Tape and reel SN7417DR
SN7407N SN7407N
PDIP – N Tube
SN7417N SN7417N
SOP – NS Tape and reel SN7407NSR SN7407
SNJ5407J SNJ5407J
CDIP – J Tube
SNJ5417J SNJ5417J
55°C to 125°C
–55°C
SNJ5407W SNJ5407W
CFP – W Tube
SNJ5417W SNJ5417W
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB
design guidelines are available at www.ti.com/sc/package.
A Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright 2001, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments On products compliant to MIL-PRF-38535, all parameters are tested
standard warranty. Production processing does not necessarily include unless otherwise noted. On all other products, production
testing of all parameters. processing does not necessarily include testing of all parameters.
schematic
VCC
6 kΩ 3.4 kΩ 1.6 kΩ
Input A
Output Y
100 Ω
1 kΩ
GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 5.5 V
Output voltage, VO (see Notes 1 and 2): SN5407, SN7407 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
SN5417, SN7417 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. This is the maximum voltage that should be applied to any output when it is in the off state.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
RL
From Output
Test Point
Under Test
CL
(see Note A)
LOAD CIRCUIT
3V
Input 1.5 V 1.5 V
0V
tPLH tPHL
VOH
High-Level In-Phase
1.5 V 1.5 V 1.5 V 1.5 V
Pulse Output
VOL
tw tPHL tPLH
Low-Level VOH
Out-of-Phase
Pulse 1.5 V 1.5 V 1.5 V 1.5 V
Output
VOL
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PULSE WIDTHS PROPAGATION DELAY TIMES
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its products to the specifications applicable at the time of sale in accordance with
TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary
to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except
those mandated by government requirements.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
products or services might be or are used. TI’s publication of information regarding any third party’s products
or services does not constitute TI’s approval, license, warranty or endorsement thereof.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations and notices. Representation
or reproduction of this information with alteration voids all warranties provided for an associated TI product or
service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Resale of TI’s products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service,
is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Also see: Standard Terms and Conditions of Sale for Semiconductor Products. www.ti.com/sc/docs/stdterms.htm
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Connection Diagram
Dual-In-Line Package
TL/F/6347 – 1
Order Number 54LS08DMQB, 54LS08FMQB, 54LS08LMQB, DM54LS08J, DM54LS08W, DM74LS08M or DM74LS08N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
Y e AB
Inputs Output
A B Y
L L L
L H L
H L L
H H H
H e High Logic Level
L e Low Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max, DM54 2.5 3.4
V
Voltage VIH e Min DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max, DM54 0.25 0.4
Voltage VIL e Max DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.36 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 20 b 100
ICCH Supply Current with VCC e Max
2.4 4.8 mA
Outputs High
ICCL Supply Current with VCC e Max
4.4 8.8 mA
Outputs Low
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
4 13 6 18 ns
Low to High Level Output
tPHL Propagation Delay Time
3 11 5 18 ns
High to Low Level Output
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
2
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS08/DM54LS08/DM74LS08 Quad 2-Input AND Gates
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
SN54ALS09, SN74ALS09
QUADRUPLE 2-INPUT POSITIVE-AND GATES
WITH OPEN-COLLECTOR OUTPUTS
SDAS084B – APRIL 1982 – REVISED DECEMBER 1994
VCC
often used to generate higher VOH levels.
NC
1B
1A
4B
The SN54ALS09 is characterized for operation
3 2 1 20 19
over the full military temperature range of – 55°C 1Y 4 18 4A
to 125°C. The SN74ALS09 is characterized for NC 5 17 NC
operation from 0°C to 70°C. 16
2A 6 4Y
NC 7 15 NC
FUNCTION TABLE
2B 8 14 3B
(each gate) 9 10 11 12 13
INPUTS OUTPUT
GND
2Y
3Y
3A
NC
A B Y
H H H
L X L NC – No internal connection
X L L
PRODUCTION DATA information is current as of publication date. Copyright 1994, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Off-state output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Operating free-air temperature range, TA: SN54ALS09 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C
SN74ALS09 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
S1
RL
R1
From Output Test From Output Test From Output Test
Under Test Point Under Test Point Under Test Point
CL RL CL
CL R2
(see Note A) (see Note A)
(see Note A)
3.5 V
Output
Control 1.3 V 1.3 V
(low-level
enabling) 0.3 V 3.5 V
tPZL Input 1.3 V 1.3 V
tPLZ
[3.5 V 0.3 V
tPHL
Waveform 1 tPLH
S1 Closed 1.3 V
In-Phase VOH
(see Note B) 1.3 V 1.3 V
VOL Output
tPHZ 0.3 V VOL
tPZH tPLH
VOH tPHL
Waveform 2 VOH
Out-of-Phase
S1 Open 1.3 V 0.3 V 1.3 V 1.3 V
Output
(see Note B)
[0 V (see Note C) VOL
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
54LS10/DM54LS10/DM74LS10
Triple 3-Input NAND Gates
General Description Features
This device contains three independent gates each of which Y Alternate Military/Aerospace device (54LS10) is avail-
performs the logic NAND function. able. Contact a National Semiconductor Sales Office/
Distributor for specifications.
Connection Diagram
Dual-In-Line Package
TL/F/6349 – 1
Order Number 54LS10DMQB, 54LS10FMQB, 54LS10LMQB,
DM54LS10J, DM54LS10W, DM74LS10M or DM74LS10N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
Y e ABC
Inputs Output
A B C Y
X X L H
X L X H
L X X H
H H H L
H e High Logic Level
L e Low Logic Level
X e Either Low or High Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max, DM54 2.5 3.4
V
Voltage VIL e Max
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max, DM54 0.25 0.4
Voltage VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.36 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2)
DM74 b 20 b 100
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
3 10 4 15 ns
Low to High Level Output
tPHL Propagation Delay Time
3 10 4 15 ns
High to Low Level Output
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
2
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS10/DM54LS10/DM74LS10 Triple 3-Input NAND Gates
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
54LS11/DM54LS11/DM74LS11 Triple 3-Input AND Gates
June 1989
Connection Diagram
Dual-In-Line Package
TL/F/6350 – 1
Order Number 54LS11DMQB, 54LS11FMQB, 54LS11LMQB,
DM54LS11J, DM54LS11W, DM74LS11M or DM74LS11N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
Y e ABC
Inputs Output
A B C Y
X X L L
X L X L
L X X L
H H H H
H e High Logic Level
L e Low Logic Level
X e Either Low or High Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIH e Min DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.36 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 20 b 100
ICCH Supply Current with VCC e Max
1.8 3.6 mA
Outputs High
ICCL Supply Current with VCC e Max
3.3 6.6 mA
Outputs Low
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
4 13 6 18 ns
Low to High Level Output
tPHL Propagation Delay Time
3 11 5 18 ns
High to Low Level Output
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
2
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS11/DM54LS11/DM74LS11 Triple 3-Input AND Gates
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Connection Diagram
Dual-In-Line Package
TL/F/6353 – 1
Order Number 54LS14DMQB, 54LS14FMQB,
54LS14LMQB, DM74LS14M or DM74LS14N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
YeA
Input Output
A Y
L H
H L
H e High Logic Level
L e Low Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 2)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max 54LS 2.5 3.4
V
Voltage VIL e Max
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max 54LS 0.25 0.4
Voltage VIH e Min
DM74 0.35 0.5 V
VCC e Min, IOL e 4 mA DM74 0.25 0.4
IT a Input Current at VCC e 5V, VI e VT a DM74
b 0.14 mA
Positive-Going Threshold
IT b Input Current at VCC e 5V, VI e VTb DM74
b 0.18 mA
Negative-Going Threshold
II Input Current @ Max VCC e Max, VI e 7V DM74
0.1 mA
Input Voltage
VCC e Max, VI e 10.0V 54LS
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.4 mA
IOS Short Circuit VCC e Max 54LS b 20 b 100
mA
Output Current (Note 3) DM74 b 20 b 100
2
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
5 22 8 25 ns
Low to High Level Output
tPHL Propagation Delay Time
5 22 10 33 ns
High to Low Level Output
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS14/DM74LS14 Hex Inverters with Schmitt Trigger Inputs
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
SN54LS06, SN54LS16, SN74LS06, SN74LS16
HEX INVERTER BUFFERS/DRIVERS WITH
OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS
SDLS020A – MAY 1990
description
SN54LS06, SN54LS16 . . . FK PACKAGE
These monolithic hex inverter buffers/drivers (T0P VIEW)
feature high-voltage open-collector outputs to
VCC
NC
1Y
1A
6A
interface with high-level circuits (such as MOS), or
for driving high-current loads, and are also
characterized for use as inverter buffers for driving 3 2 1 20 19
2A 4 18 6Y
TTL inputs. The ′LS06 has a rated output voltage NC NC
5 17
of 30 V and the ′LS16 has a rated output voltage
2Y 6 16 5A
of 15 V. The maximum sink current for the
NC 7 15 NC
SN54LS06 and SN54LS16 is 30 mA and the
3A 8 14 5Y
SN74LS06 and SN74LS16 is 40 mA. 9 10 11 12 13
3Y
4Y
4A
NC
GND
families. Inputs are diode-clamped to minimize
transmission-effects, which simplifies design.
NC – No internal connection
Typical power dissipation is 175 mW and average
propagation delay time is 8 ns.
The SN54LS06 and SN54LS16 are characterized over the full military temperature range of – 55°C to 125°C.
The SN74LS06 and SN74LS16 are characterized for operation from 0°C to 70°C.
3A 5 6 3Y
3 4
2A 2Y
4A 9 8 4Y
5A 11 10 5Y
5 6
3A 3Y
6A 13 12 6Y
9 8
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC 4A 4Y
Publication 617-12.
Pin numbers shown are for D, J, and N packages. 10
11 5Y
5A
13 12
6A 6Y
UNLESS OTHERWISE NOTED this document contains PRODUCTION Copyright 1990, Texas Instruments Incorporated
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
9 kΩ 2.5 kΩ
15 kΩ 1 kΩ
2.5 kΩ Output
Input
2 kΩ 2 kΩ
GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Output voltage, VO (see Notes 1 and 2): SN54LS06, SN74LS06 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
SN54LS16, SN74LS16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Operating free-air temperature range: SN54LS06, SN54LS16 . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C
SN74LS06, SN74LS16 . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. This are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. This is the maximum voltage that should be applied to any output when it is in the off state.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
•
3Y 6 9 4A
Package Options Include “Small Outline”
GND 7 8 4Y
Packages, Ceramic Chip Carriers, and
Standard and Ceramic 300-mil DIPs
SN54LS07 . . . FK PACKAGE
description (T0P VIEW)
VCC
NC
1Y
1A
6A
high-voltage open-collector outputs to interface
with high-level circuits or for driving high-current
3 2 1 20 19
loads. They are also characterized for use as 2A 4 18 6Y
buffers for driving TTL inputs. The ′LS07 has a NC 5 17 NC
rated output voltage of 30 V and the ′LS17 has a 2Y 6 16 5A
rated output voltage of 15 V. The maximum sink NC 7 15 NC
current is 30 mA for the SN54LS07 and 40 mA for 3A 8 14 5Y
the SN74LS07 and SN74LS17. 9 10 11 12 13
3Y
4Y
4A
These circuits are compatible with most TTL
NC
GND
families. Inputs are diode-clamped to minimize
transmission-line effects, which simplifies design. NC – No internal connection
Typical power dissipation is 140 mW and average
propagation delay time is 12 ns.
The SN54LS07 is characterized over the full military temperature range of –55°C to 125°C. The SN74LS07 and
SN74LS17 are characterized for operation from 0°C to 70°C.
13 12
6A 6Y
9 kΩ 1 kΩ
5 kΩ
Input Output
2 kΩ
2 kΩ
GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Output voltage, VO (see Notes 1 and 2): SN54LS07, SN74LS07 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
SN74LS17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Operating free-air temperature range: SN54LS07 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C
SN54LS07, SN74LS17 . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. This is the maximum voltage that should be applied to any output when it is in the off state.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Connection Diagram
Dual-In-Line Package
TL/F/6355 – 1
Order Number 54LS20DMQB, 54LS20FMQB, 54LS20LMQB,
DM54LS20J, DM54LS20W, DM74LS20M or DM74LS20N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
Y e ABCD
Inputs Output
A B C D Y
X X X L H
X X L X H
X L X X H
L X X X H
H H H H L
H e High Logic Level
L e Low Logic Level
X e Either Low or High Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max, DM54 2.5 3.4
V
Voltage VIL e Max DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max, DM54 0.25 0.4
Voltage VIH e Min DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.36 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 20 b 100
ICCH Supply Current with VCC e Max
0.4 0.8 mA
Outputs High
ICCL Supply Current with VCC e Max
1.2 2.2 mA
Outputs Low
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
3 10 4 15 ns
Low to High Level Output
tPHL Propagation Delay Time
3 10 4 15 ns
High to Low Level Output
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
2
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS20/DM54LS20/DM74LS20 Dual 4-Input NAND Gates
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
54LS21/DM54LS21/DM74LS21 Dual 4-Input AND Gates
June 1989
Connection Diagram
Dual-In-Line Package
TL/F/6356 – 1
Order Number 54LS21DMQB, 54LS21FMQB, 54LS21LMQB,
DM54LS21J, DM54LS21W, DM74LS21M or DM74LS21N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
Y e ABCD
Inputs Output
A B C D Y
X X X L L
X X L X L
X L X X L
L X X X L
H H H H H
H e High Logic Level
L e Low Logic Level
X e Either Low or High Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max, DM54 2.5 3.4
V
Voltage VIH e Min DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max, DM54 0.25 0.4
Voltage VIL e Max DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.36 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 20 b 100
ICCH Supply Current with VCC e Max
1.2 2.4 mA
Outputs High
ICCL Supply Current with VCC e Max
2.2 4.4 mA
Outputs Low
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
4 13 6 18 ns
Low to High Level Output
tPHL Propagation Delay Time
3 11 5 18 ns
High to Low Level Output
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
2
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS21/DM54LS21/DM74LS21 Dual 4-Input AND Gates
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
DM54LS27/DM74LS27
Triple 3-Input NOR Gates
General Description
This device contains three independent gates each of which
performs the logic NOR function.
Connection Diagram
Dual-In-Line Package
TL/F/6359 – 1
Function Table
YeAaBaC
Inputs Output
A B C Y
L L L H
X X H L
X H X L
H X X L
H e High Logic Level
L e Low Logic Level
X e Either Low or High Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max, DM54 2.5
V
Voltage VIL e Max DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max, DM54 0.4
Voltage VIH e Min DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.36 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 20 b 100
ICCH Supply Current with VCC e Max
2 4 mA
Outputs High
ICCL Supply Current with VCC e Max
3.4 6.8 mA
Outputs Low
2
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
DM54LS27/DM74LS27 Triple 3-Input NOR Gates
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
54LS30/DM54LS30/DM74LS30
8-Input NAND Gate
General Description Features
This device contains a single gate which performs the logic Y Alternate Military/Aerospace device (54LS30) is avail-
NAND function. able. Contact a National Semiconductor Sales Office/
Distributor for specifications.
Connection Diagram
Dual-In-Line Package
TL/F/6360 – 1
Order Number 54LS30DMQB, 54LS30FMQB,
54LS30LMQB, DM54LS30J, DM54LS530W, DM74LS30M or DM74LS30N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
Y e ABCDEFGH
Inputs Output
A thru H Y
All Inputs H L
One or More H
Input L
H e High Logic Level
L e Low Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIL e Max
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.4 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2)
DM74 b 20 b 100
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
4 12 5 18 ns
Low to High Level Output
tPHL Propagation Delay Time
4 15 5 20 ns
High to Low Level Output
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
2
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS30/DM54LS30/DM74LS30 8-Input NAND Gate
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
54LS32/DM54LS32/DM74LS32
Quad 2-Input OR Gates
General Description Features
This device contains four independent gates each of which Y Alternate Military/Aerospace device (54LS32) is avail-
performs the logic OR function. able. Contact a National Semiconductor Sales Office/
Distributor for specifications.
Connection Diagram
Dual-In-Line Package
TL/F/6361 – 1
Order Number 54LS32DMQB, 54LS32FMQB, 54LS32LMQB,
DM54LS32J, DM54LS32W, DM74LS32M or DM74LS32N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
YeAaB
Inputs Output
A B Y
L L L
L H H
H L H
H H H
H e High Logic Level
L e Low Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIH e Min DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.36 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 20 b 100
ICCH Supply Current with VCC e Max
3.1 6.2 mA
Outputs High
ICCL Supply Current with VCC e Max
4.9 9.8 mA
Outputs Low
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
3 11 4 15 ns
Low to High Level Output
tPHL Propagation Delay Time
3 11 4 15 ns
High to Low Level Output
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
2
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters)
5
54LS32/DM54LS32/DM74LS32 Quad 2-Input OR Gates
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
PRODUCTION DATA information is current as of publication date. Copyright 1988, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
D SUFFIX
SOIC
16
1 CASE 751B-03
1 2 3 4 5 6 7 8 ORDERING INFORMATION
B C LT BI / RBO RBI D A GND SN54LSXXJ Ceramic
SN74LSXXN Plastic
LOGIC DIAGRAM SN74LSXXD SOIC
A LOGIC SYMBOL
b 7 1 2 6 3 5
B
INPUT
A B C D LT RBI
C c
D SN54 / 74LS48
OUTPUT BI/
d a b c d e f g RBO
BLANKING INPUT OR
RIPPLE-BLANKING
OUTPUT e 13 12 11 10 9 15 14 4
VCC = PIN 16
GND = PIN 8
f
RIPPLE-BLANKING
INPUT
LAMP-TEST
INPUT g
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
TRUTH TABLE
SN54 / 74LS48
INPUTS OUTPUTS
DECIMAL
OR LT RBI D C B A BI / RBO a b c d e f g NOTE
FUNCTION
0 H H L L L L H H H H H H H L 1
1 H X L L L H H L H H L L L L 1
2 H X L L H L H H H L H H L H NOTES:
3 H X L L H H H H H H H L L H (1) BI/RBO is wired-AND logic serving as blanking input (BI) and/or
4 H X L H L L H L H H L L H H ripple-blanking output (RBO). The blanking out (BI) must be open
or held at a HIGH level when output functions 0 through 15 are
5 H X L H L H H H L H H L H H
desired, and ripple-blanking input (RBI) must be open or at a HIGH
6 H X L H H L H L L H H H H H
level if blanking of a decimal 0 is not desired. X=input may be HIGH
7 H X L H H H H H H H L L L L or LOW.
8 H X H L L L H H H H H H H H (2) When a LOW level is applied to the blanking input (forced condition)
9 H X H L L H H H H H L L H H all segment outputs go to a LOW level, regardless of the state of any
other input condition.
10 H X H L H L H L L L H H L H
(3) When ripple-blanking input (RBI) and inputs A, B, C, and D are at
11 H X H L H H H L L H H L L H LOW level, with the lamp test input at HIGH level, all segment
12 H X H H L L H L H L L L H H outputs go to a HIGH level and the ripple-blanking output (RBO)
13 H X H H L H H H L L H L H H goes to a LOW level (response condition).
(4) When the blanking input/ripple-blanking output (BI/RBO) is open or
14 H X H H H L H L L L H H H H
held at a HIGH level, and a LOW level is applied to lamp-test input,
15 H X H H H H H L L L L L L L all segment outputs go to a LOW level.
BI X X X X X X L L L L L L L L 2
RBI H L L L L L L L L L L L L L 3
LT L X X X X X H H H H H H H H 4
Output
p LOW Voltage
g 54, 74 0.4 V IOL = 1.6 mA VCC = MAX,, VIH = 2.0 V
VOL
BI / RBO 74 0.5 V IOL = 3.2 mA VIL = VIL MAX
Input
p HIGH Current 20 µA VCC = MAX, VIN = 2.7 V
IIH
(Except BI / RBO) 0.1 mA VCC = MAX, VIN = 7.0 V
Input LOW Current
IIL – 0.4 mA VCC = MAX, VIN = 0.4 V
(Except BI / RBO)
IIL Input LOW Current BI / RBO – 1.2 mA VCC = MAX, VIN = 0.4 V
ICC Power Supply Current 25 38 mA VCC = MAX
IOS Short Circuit Current BI / RBO (Note 1) – 0.3 –2.0 mA VCC = MAX
Note 1: Not more than one output should be shorted at a time, nor for more than 1 second.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Connection Diagram
Dual-In-Line Package
TL/F/6372 – 1
Order Number DM54LS73AJ, DM54LS73AW, DM74LS73AM or DM74LS73AN
See NS Package Number J14A, M14A, N14A or W14B
Function Table
Inputs Outputs
CLR CLK J K Q Q
L X X X L H
H v L L Q0 Q0
H v H L H L
H v L H L H
H v H H Toggle
H H X X Q0 Q0
H e High Logic Level
L e Low Logic Level
X e Either Low or High Logic Level
v e Negative going edge of pulse.
Q0 e The output logic level before the indicated input conditions were es-
tablished.
Toggle e Each output changes to the complement of its previous level on
each falling edge of the clock pulse.
2
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max, VIH e Min DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max J, K 0.1
Input Voltage VI e 7V Clear 0.3 mA
Clock 0.4
IIH High Level Input VCC e Max J, K 20
Current VI e 2.7V Clear 60 mA
Clock 80
IIL Low Level Input VCC e Max J, K b 0.4
Current VI e 0.4V
Clear b 0.8 mA
Clock b 0.8
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From (Input)
Symbol Parameter To (Output) CL e 15 pF CL e 50 pF Units
Min Max Min Max
fMAX Maximum Clock
30 25 MHz
Frequency
tPHL Propagation Delay Time Clear
20 28 ns
High to Low Level Output to Q
tPLH Propagation Delay Time Clear
20 24 ns
Low to High Level Output to Q
tPLH Propagation Delay Time Clock to
20 24 ns
Low to High Level Output Q or Q
tPHL Propagation Delay Time Clock to
20 28 ns
High to Low Level Output Q or Q
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second. For devices, with feedback from the outputs, where
shorting the outputs to ground may cause the outputs to change logic state, an equivalent test may be performed where VO e 2.25V and 2.125V for DM54 and
DM74 series, respectively, with the minimum and maximum limits reduced by one half from their stated values. This is very useful when using automatic test
equipment.
Note 3: With all outputs open, ICC is measured with the Q and Q outputs high in turn. At the time of measurement, the clock is grounded.
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
DM54LS73A/DM74LS73A Dual Negative-Edge-Triggered
Master-Slave J-K Flip-Flops with Clear and Complementary Outputs
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
D Flip-Flops with Preset, Clear and Complementary Outputs
54LS74/DM54LS74A/DM74LS74A Dual Positive-Edge-Triggered
June 1989
54LS74/DM54LS74A/DM74LS74A
Dual Positive-Edge-Triggered D Flip-Flops
with Preset, Clear and Complementary Outputs
General Description
This device contains two independent positive-edge-trig- violated. A low logic level on the preset or clear inputs will
gered D flip-flops with complementary outputs. The informa- set or reset the outputs regardless of the logic levels of the
tion on the D input is accepted by the flip-flops on the posi- other inputs.
tive going edge of the clock pulse. The triggering occurs at a
voltage level and is not directly related to the transition time Features
of the rising edge of the clock. The data on the D input may Y Alternate military/aerospace device (54LS74) is avail-
be changed while the clock is low or high without affecting able. Contact a National Semiconductor Sales Office/
the outputs as long as the data setup and hold times are not Distributor for specifications.
Connection Diagram
Dual-In-Line Package
TL/F/6373 – 1
Order Number 54LS74DMQB, 54LS74FMQB, 54LS74LMQB,
DM54LS74AJ, DM54LS74AW, DM74LS74AM or DM74LS74AN
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
Inputs Outputs
PR CLR CLK D Q Q
L H X X H L
H L X X L H
L L X X H* H*
H H u H H L
H H u L L H
H H L X Q0 Q0
H e High Logic Level
X e Either Low or High Logic Level
L e Low Logic Level
u e Positive-going Transition
* e This configuration is nonstable; that is, it will not persist when either the preset
and/or clear inputs return to their inactive (high) level.
Q0 e The output logic level of Q before the indicated input conditions were established.
2
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max, VIH e Min DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max Data 0.1
Input Voltage VI e 7V Clock 0.1
mA
Preset 0.2
Clear 0.2
IIH High Level Input VCC e Max Data 20
Current VI e 2.7V Clock 20
mA
Clear 40
Preset 40
IIL Low Level Input VCC e Max Data b 0.4
Current VI e 0.4V
Clock b 0.4
mA
Preset b 0.8
Clear b 0.8
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From (Input)
Symbol Parameter To (Output) CL e 15 pF CL e 50 pF Units
Min Max Min Max
fMAX Maximum Clock Frequency 25 20 MHz
tPLH Propagation Delay Time Clock to
25 35 ns
Low to High Level Output Q or Q
tPHL Propagation Delay Time Clock to
30 35 ns
High to Low Level Output Q or Q
tPLH Propagation Delay Time Preset
25 35 ns
Low to High Level Output to Q
tPHL Propagation Delay Time Preset
30 35 ns
High to Low Level Output to Q
tPLH Propagation Delay Time Clear
25 35 ns
Low to High Level Output to Q
tPHL Propagation Delay Time Clear
30 35 ns
High to Low Level Output to Q
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS74/DM54LS74A/DM74LS74A Dual Positive-Edge-Triggered
D Flip-Flops with Preset, Clear and Complementary Outputs
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
54LS83A/DM54LS83A/DM74LS83A
4-Bit Binary Adders with Fast Carry
General Description Features
These full adders perform the addition of two 4-bit binary Y Full-carry look-ahead across the four bits
numbers. The sum (R) outputs are provided for each bit and Y Systems achieve partial look-ahead performance with
the resultant carry (C4) is obtained from the fourth bit. the economy of ripple carry
These adders feature full internal look ahead across all four Y Typical add times
bits. This provides the system designer with partial look- Two 8-bit words 25 ns
ahead performance at the economy and reduced package Two 16-bit words 45 ns
count of a ripple-carry implementation. Y Typical power dissipation per 4-bit adder 95 mW
The adder logic, including the carry, is implemented in its Y Alternate Military/Aerospace device (54LS83A) is avail-
true form meaning that the end-around carry can be accom- able. Contact a National Semiconductor Sales Office/
plished without the need for logic or level inversion. Distributor for specifications.
Connection Diagram
Dual-In-Line Package
TL/F/6378 – 1
Order Number 54LS83ADMQB, 54LS83AFMQB,
DM54LS83AJ, DM54LS83AW, DM74LS83AWM or DM74LS83AN
See NS Package Number J16A, M16B, N16E or W16A
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max, VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max A or B 0.2
mA
Input Voltage VI e 7V
C0 0.1
IIH High Level Input VCC e Max A or B 40
mA
Current VI e 2.7V
C0 20
IIL Low Level Input VCC e Max A or B b 0.8
mA
Current VI e 0.4V
C0 b 0.4
2
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From (Input)
Symbol Parameter CL e 15 pF CL e 50 pF Units
To (Output)
Min Max Min Max
tPLH Propagation Delay Time C0 to
24 28 ns
Low to High Level Output R1 or R2
tPHL Propagation Delay Time C0 to
24 30 ns
High to Low Level Output R1 or R2
tPLH Propagation Delay Time C0 to
24 28 ns
Low to High Level Output R3
tPHL Propagation Delay Time C0 to
24 30 ns
High to Low Level Output R3
tPLH Propagation Delay Time C0 to
24 28 ns
Low to High Level Output R4
tPHL Propagation Delay Time C0 to
24 30 ns
High to Low Level Output R4
tPLH Propagation Delay Time Ai, Bi
24 28 ns
Low to High Level Output to Ri
tPHL Propagation Delay Time Ai, Bi
24 30 ns
High to Low Level Output to Ri
tPLH Propagation Delay Time C0 to
17 24 ns
Low to High Level Output C4
tPHL Propagation Delay Time C0 to
17 25 ns
High to Low Level Output C4
tPLH Propagation Delay Time Ai, Bi
17 24 ns
Low to High Level Output to C4
tPHL Propagation Delay Time Ai, Bi
17 26 ns
High to Low Level Output to C4
Truth Table
3
Logic Diagram
TL/F/6378 – 2
4
5
Physical Dimensions inches (millimeters)
6
Physical Dimensions inches (millimeters) (Continued)
7
54LS83A/DM54LS83A/DM74LS83A 4-Bit Binary Adders with Fast Carry
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
54LS85/DM54LS85/DM74LS85 4-Bit Magnitude Comparators
June 1989
54LS85/DM54LS85/DM74LS85
4-Bit Magnitude Comparators
General Description
These 4-bit magnitude comparators perform comparison of have a high-level voltage applied to the A e B input. The
straight binary or BCD codes. Three fully-decoded decisions cascading path is implemented with only a two-gate-level
about two, 4-bit words (A, B) are made and are externally delay to reduce overall comparison times for long words.
available at three outputs. These devices are fully expand-
able to any number of bits without external gates. Words of Features
greater length may be compared by connecting compara- Y Typical power dissipation 52 mW
tors in cascade. The A l B, A k B, and A e B outputs of a Y Typical delay (4-bit words) 24 ns
stage handling less-significant bits are connected to the cor- Y Alternate Military/Aerospace device (54LS85) is avail-
responding inputs of the next stage handling more-signifi-
able. Contact a National Semiconductor Sales Office/
cant bits. The stage handling the least-significant bits must
Distributor for specifications.
Connection Diagram
Dual-In-Line Package
TL/F/6379 – 1
Function Table
Comparing Cascading
Outputs
Inputs Inputs
A3, B3 A2, B2 A1, B1 A0, B0 AlB AkB AeB AlB AkB AeB
A3 l B3 X X X X X X H L L
A3 k B3 X X X X X X L H L
A3 e B3 A2 l B2 X X X X X H L L
A3 e B3 A2 k B2 X X X X X L H L
A3 e B3 A2 e B2 A1 l B1 X X X X H L L
A3 e B3 A2 e B2 A1 k B1 X X X X L H L
A3 e B3 A2 e B2 A1 e B1 A0 l B0 X X X H L L
A3 e B3 A2 e B2 A1 e B1 A0 k B0 X X X L H L
A3 e B3 A2 e B2 A1 e B1 A0 e B0 H L L H L L
A3 e B3 A2 e B2 A1 e B1 A0 e B0 L H L L H L
A3 e B3 A2 e B2 A1 e B1 A0 e B0 L L H L L H
A3 e B3 A2 e B2 A1 e B1 A0 e B0 X X H L L H
A3 e B3 A2 e B2 A1 e B1 A0 e B0 H H L L L L
A3 e B3 A2 e B2 A1 e B1 A0 e B0 L L L H H L
H e High Level, L e Low Level, X e Don’t Care
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max, VIH e Min DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max AkB 0.1
Input Voltage VI e 7V
AlB 0.1 mA
Others 0.3
IIH High Level Input VCC e Max AkB 20
Current VI e 2.7V
AlB 20 mA
Others 60
IIL Low Level Input VCC e Max AkB b 0.4
Current VI e 0.4V AlB b 0.4 mA
Others b 1.2
2
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From To Number of
Symbol Parameter Input Output Gate Levels CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time Any A or B A k B,
3 36 42
Low-to-High Level Output Data Input AlB ns
AeB 4 40 40
tPHL Propagation Delay Time Any A or B A k B,
3 30 40
High-to-Low Level Output Data Input AlB ns
AeB 4 30 40
tPLH Propagation Delay Time AkB
AlB 1 22 26 ns
Low-to-High Level Output or A e B
tPHL Propagation Delay Time AkB
AlB 1 17 26 ns
High-to-Low Level Output or A e B
tPLH Propagation Delay Time
A eB AeB 2 20 25 ns
Low-to-High Level Output
tPHL Propagation Delay Time
AeB AeB 2 17 26 ns
High-to-Low Level Output
tPLH Propagation Delay Time AlB
AkB 1 22 26 ns
Low-to-High Level Output or A e B
tPHL Propagation Delay Time AlB
AkB 1 17 26 ns
High-to-Low Level Output or A e B
3
Logic Diagram
TL/F/6379 – 2
4
5
Physical Dimensions inches (millimeters)
6
Physical Dimensions inches (millimeters) (Continued)
7
54LS85/DM54LS85/DM74LS85 4-Bit Magnitude Comparators
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
DM54LS86/DM74LS86 Quad 2-Input Exclusive-OR Gates
June 1989
DM54LS86/DM74LS86
Quad 2-Input Exclusive-OR Gates
General Description
This device contains four independent gates each of which
performs the logic exclusive-OR function.
Connection Diagram
Dual-In-Line Package
TL/F/6380 – 1
Order Number DM54LS86J, DM54LS86W, DM74LS86M or DM74LS86N
See NS Package Number J14A, M14A, N14A or W14B
Function Table
YeA Z B e AB a AB
Inputs Output
A B Y
L L L
L H H
H L H
H H L
H e High Logic Level
L e Low Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max, DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max, DM54 0.25 0.4
Voltage VIL e Max, VIH e Min DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.2 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 40 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.6 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 20 b 100
ICCH Supply Current with VCC e Max
6.1 10 mA
Outputs High (Note 3)
ICCL Supply Current with VCC e Max
9 15 mA
Outputs Low (Note 4)
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
Note 3: ICCH is measured with all outputs open, one input at each gate at 4.5V, and the other inputs grounded.
Note 4: ICCL is measured with all outputs open and all inputs grounded.
2
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter Conditions CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
Other 18 23 ns
Low to High Level Output
Input
tPHL Propagation Delay Time Low
17 21 ns
High to Low Level Output
tPLH Propagation Delay Time
Other 10 15 ns
Low to High Level Output
Input
tPHL Propagation Delay Time High
12 15 ns
High to Low Level Output
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
DM54LS86/DM74LS86 Quad 2-Input Exclusive-OR Gates
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
DM74LS90/DM74LS93 Decade and Binary Counters
June 1989
DM74LS90/DM74LS93
Decade and Binary Counters
General Description
Each of these monolithic counters contains four master- count pulses are applied to input A and the outputs are as
slave flip-flops and additional gating to provide a divide-by- described in the appropriate truth table. A symmetrical di-
two counter and a three-stage binary counter for which the vide-by-ten count can be obtained from the ’LS90 counters
count cycle length is divide-by-five for the ’LS90 and divide- by connecting the QD output to the A input and applying the
by-eight for the ’LS93. input count to the B input which gives a divide-by-ten square
All of these counters have a gated zero reset and the LS90 wave at output QA.
also has gated set-to-nine inputs for use in BCD nine’s com-
plement applications. Features
To use their maximum count length (decade or four bit bina- Y Typical power dissipation 45 mW
ry), the B input is connected to the QA output. The input Y Count frequency 42 MHz
TL/F/6381 – 1
TL/F/6381 – 2
Order Number DM74LS90M or DM74LS90N
Order Number DM74LS93M or DM74LS93N
See NS Package Number M14A or N14A
See NS Package Number M14A or N14A
2
’LS90 Electrical Characteristics
over recommended operating free air temperature range (unless otherwise noted) (Continued)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
IIH High Level Input VCC e Max, VI e 2.7V Reset 20
Current A 40 mA
B 80
IIL Low Level Input VCC e Max, VI e 0.4V Reset b 0.4
Current A b 2.4 mA
B b 3.2
3
Recommended Operating Conditions
DM74LS93
Symbol Parameter Units
Min Nom Max
VCC Supply Voltage 4.75 5 5.25 V
VIH High Level Input Voltage 2 V
VIL Low Level Input Voltage 0.8 V
IOH High Level Output Current b 0.4 mA
IOL Low Level Output Current 8 mA
fCLK Clock Frequency (Note 1) A to QA 0 32
B to QB 0 16
MHz
fCLK Clock Frequency (Note 2) A to QA 0 20
B to QB 0 10
tW Pulse Width (Note 1) A 15
B 30 ns
Reset 15
tW Pulse Width (Note 2) A 25
B 50 ns
Reset 25
tREL Reset Release Time (Note 1) 25 ns
tREL Reset Release Time (Note 2) 35 ns
TA Free Air Operating Temperature 0 70 §C
Note 1: CL e 15 pF, RL e 2 kX, TA e 25§ C and VCC e 5V.
Note 2: CL e 50 pF, RL e 2 kX, TA e 25§ C and VCC e 5V.
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max
2.7 3.4 V
Voltage VIL e Max, VIH e Min
VOL Low Level Output VCC e Min, IOL e Max
Voltage VIL e Max, VIH e Min 0.35 0.5 V
(Note 4)
IOL e 4 mA, VCC e Min 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V Reset 0.1
Input Voltage VCC e Max A 0.2 mA
VI e 5.5V B 0.4
IIH High Level Input VCC e Max Reset 20
Current VI e 2.7V
A 40 mA
B 80
4
’LS93 Electrical Characteristics
over recommended operating free air temperature range (unless otherwise noted) (Continued)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
IIL Low Level Input VCC e Max, VI e 0.4V Reset b 0.4
Current A b 2.4 mA
B b 1.6
RL e 2 kX
From (Input)
Symbol Parameter To (Output) CL e 15 pF CL e 50 pF Units
Min Max Min Max
fMAX Maximum Clock A to QA 32 20
MHz
Frequency
B to QB 16 10
tPLH Propagation Delay Time
A to QA 16 20 ns
Low to High Level Output
tPHL Propagation Delay Time
A to QA 18 24 ns
High to Low Level Output
tPLH Propagation Delay Time
A to QD 70 85 ns
Low to High Level Output
tPHL Propagation Delay Time
A to QD 70 90 ns
High to Low Level Output
tPLH Propagation Delay Time
B to QB 16 23 ns
Low to High Level Output
tPHL Propagation Delay Time
B to QB 21 30 ns
High to Low Level Output
tPLH Propagation Delay Time
B to QC 32 37 ns
Low to High Level Output
tPHL Propagation Delay Time
B to QC 35 44 ns
High to Low Level Output
tPLH Propagation Delay Time
B to QD 51 60 ns
Low to High Level Output
tPHL Propagation Delay Time
B to QD 51 70 ns
High to Low Level Output
tPHL Propagation Delay Time SET-0 to
40 52 ns
High to Low Level Output Any Q
5
Function Tables
LS90 LS90
BCD Count Sequence Bi-Quinary (5-2)
(See Note A) (See Note B)
Output Output
Count Count
QD QC QB QA QA QD QC QB
0 L L L L 0 L L L L
1 L L L H 1 L L L H
2 L L H L 2 L L H L
3 L L H H 3 L L H H
4 L H L L 4 L H L L
5 L H L H 5 H L L L
6 L H H L 6 H L L H
7 L H H H 7 H L H L
8 H L L L 8 H L H H
9 H L L H 9 H H L L
LS93 LS90
Count Sequence Reset/Count Truth Table
(See Note C)
Reset Inputs Output
Output
Count R0(1) R0(2) R9(1) R9(2) QD QC QB QA
QD QC QB QA
H H L X L L L L
0 L L L L H H X L L L L L
1 L L L H X X H H H L L H
2 L L H L X L X L COUNT
3 L L H H L X L X COUNT
4 L H L L L X X L COUNT
5 L H L H X L L X COUNT
6 L H H L
7 L H H H
8 H L L L LS93
9 H L L H Reset/Count Truth Table
10 H L H L
Reset Inputs Output
11 H L H H
12 H H L L R0(1) R0(2) QD QC QB QA
13 H H L H H H L L L L
14 H H H L L X COUNT
15 H H H H X L COUNT
Note A: Output QA is connected to input B for BCD count.
Note B: Output QD is connected to input A for bi-quinary count.
Note C: Output QA is connected to input B.
Note D: H e High Level, L e Low Level, X e Don’t Care.
6
Logic Diagrams
LS90 LS93
TL/F/6381 – 4
TL/F/6381 – 3
The J and K inputs shown without connection are for reference only and are functionally at a high level.
7
8
Physical Dimensions inches (millimeters)
9
DM74LS90/DM74LS93 Decade and Binary Counters
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
TL/F/6386 – 1
Order Number DM74LS123M or DM74LS123N
See NS Package Number M16A or N16E
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max
2.7 3.4 V
Voltage VIL e Max, VIH e Min
VOL Low Level Output VCC e Min, IOL e Max
0.35 0.5
Voltage VIL e Max, VIH e Min V
IOL e 4 mA, VCC e Min 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.4 mA
IOS Short Circuit VCC e Max b 20 b 100 mA
Output Current (Note 2)
ICC Supply Current VCC e Max (Notes 3,4 and 5) 12 20 mA
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
Note 3: Quiescent ICC is measured (after clearing) with 2.4V applied to all clear and A inputs, B inputs grounded, all outputs open, CEXT e 0.02 mF, and
REXT e 25 kX.
Note 4: ICC is measured in the triggered state with 2.4V applied to all clear and B inputs, A inputs grounded, all outputs open, CEXT e 0.02 mF, and REXT e 25 kX.
Note 5: With all outputs open and 4.5V applied to all data and clear inputs, ICC is measured after a momentary ground, then 4.5V is applied to the clock.
Note 6: TA e 25§ C and VCC e 5V.
2
Switching Characteristics at VCC e 5V and TA e 25§ C
RL e 2 kX
From (Input) CL e 15pF CL e 15pF
Symbol Parameters Units
To (Output) CEXT e 0 pF, REXT e 5 kX CEXT e 1000 pF, REXT e 10 KX
Min Max Min Max
tPLH Propagation Delay Time
A to Q 33 ns
Low to High Level Output
tPLH Propagation Delay Time
B to Q 44 ns
Low to High Level Output
tPHL Propagation Delay Time
A to Q 45 ns
High to Low Level Output
tPHL Propagation Delay Time
B to Q 56 ns
High to Low Level Output
tPLH Propagation Delay Time
Clear to Q 45 ns
Low to High Level Output
tPHL Propagation Delay Time
Clear to Q 27 ns
High to Low Level Output
tWQ(Min) Minimum Width of Pulse
A or B to Q 200 ns
at Output Q
tW(out) Output Pulse Width A or B to Q 4 5 ms
Operating Rules
1. An external resistor (RX) and an external capacitor (CX) 3. For CX ll 1000 pF the output pulse width (TW) is de-
are required for proper operation. The value of CX may fined as follows:
vary from 0 to any necessary value. For small time con- TW e KRX CX
stants high-grade mica, glass, polypropylene, polycarbon- where [RX is in kX]
ate, or polystyrene material capacitors may be used. For
[CX is in pF]
large time constants use tantalum or special aluminum
capacitors. If the timing capacitors have leakages ap- [TW is in ns]
proaching 100 nA or if stray capacitance from either ter- K & 0.37
minal to ground is greater than 50 pF the timing equations 4. The multiplicative factor K is plotted as a function of CX
may not represent the pulse width the device generates. below for design considerations:
2. When an electrolytic capacitor is used for CX a switching
diode is often required for standard TTL one-shots to pre-
vent high inverse leakage current. This switching diode is
not needed for the ’LS123 one-shot and should not be
used. In general the use of the switching diode is not
recommended with retriggerable operation.
Furthermore, if a polarized timing capacitor is used on the
’LS123 the negative terminal of the capacitor should be
connected to the ‘‘CEXT’’ pin of the device (Figure 1 ).
TL/F/6386 – 2
FIGURE 2
TL/F/6386 – 8
FIGURE 1
3
Operating Rules (Continued)
5. For CX k 1000 pF see Figure 3 for TW vs CX family
curves with RX as a parameter:
TL/F/6386 – 7
FIGURE 7
9. Under any operating condition CX and RX must be kept
TL/F/6386 – 3 as close to the one-shot device pins as possible to mini-
FIGURE 3 mize stray capacitance, to reduce noise pick-up, and to
6. To obtain variable pulse widths by remote trimming, the reduce I-R and Ldi/dt voltage developed along their
following circuit is recommended: connecting paths. If the lead length from CX to pins (6)
and (7) or pins (14) and (15) is greater than 3 cm, for
example, the output pulse width might be quite different
from values predicted from the appropriate equations. A
non-inductive and low capacitive path is necessary to
ensure complete discharge of CX in each cycle of its
operation so that the output pulse width will be accurate.
TL/F/6386 – 4
10. The CEXT pins of this device are internally connected to
FIGURE 4 the internal ground. For optimum system performance
Note: ‘‘Rremote’’ should be as close to the device pin as possible. they should be hard wired to the system’s return ground
7. The retriggerable pulse width is calculated as shown be- plane.
low: 11. VCC and ground wiring should conform to good high-fre-
T e TW a tPLH e K c RX c CX a tPLH quency standards and practices so that switching tran-
The retriggered pulse width is equal to the pulse width sients on the VCC and ground return leads do not cause
plus a delay time period (Figure 5). interaction between one-shots. A 0.01 mF to 0.10 mF
bypass capacitor (disk ceramic or monolithic type) from
VCC to ground is necessary on each device. Further-
more, the bypass capacitor should be located as close
to the VCC-pin as space permits.
For further detailed device characteristics and output performance
please refer to the NSC one-shot application note AN-372.
TL/F/6386 – 5
FIGURE 5
8. Output pulse width variation versus VCC and tempera-
tures: Figure 6 depicts the relationship between pulse
width variation versus VCC, and Figure 7 depicts pulse
width variation versus temperatures.
TL/F/6386 – 6
FIGURE 6
4
Physical Dimensions inches (millimeters)
5
DM74LS123 Dual Retriggerable One-Shot
with Clear and Complementary Outputs
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
54LS125A/DM54LS125A/DM74LS125A Quad TRI-STATE Buffers
June 1989
54LS125A/DM54LS125A/DM74LS125A
Quad TRI-STATEÉ Buffers
General Description
This device contains four independent gates each of which that two outputs will attempt to take a common bus to oppo-
performs a non-inverting buffer function. The outputs have site logic levels, the disable time is shorter than the enable
the TRI-STATE feature. When enabled, the outputs exhibit time of the outputs.
the low impedance characteristics of a standard LS output
with additional drive capability to permit the driving of bus Features
lines without external resistors. When disabled, both the Y Alternate Military/Aerospace device (54LS125) is avail-
output transistors are turned off presenting a high-imped- able. Contact a National Semiconductor Sales Office/
ance state to the bus line. Thus the output will act neither as Distributor for specifications.
a significant load nor as a driver. To minimize the possibility
Connection Diagram
Dual-In-Line Package
TL/F/6387 – 1
Order Number 54LS125ADMQB, 54LS125AFMQB, 54LS125ALMQB,
DM54LS125AJ, DM54LS125AW, DM74LS125AM or DM74LS125AN
See NS Package Number E20A, J14A, M14A, N14A or W14B
Function Table
YeA
Inputs Output
A C Y
L L L
H L H
X H Hi-Z
H e High Logic Level
L e Low Logic Level
X e Either Low or High Logic Level
Hi-Z e TRI-STATE (Outputs are disabled)
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max
2.4 3.4 V
Voltage VIL e Max, VIH e Min
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max
DM74 0.35 0.5 V
IOL e 12 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input VCC e Max, VI e 2.7V 20 mA
Current
IIL Low Level Input VCC e Max, VI e 0.4V b 0.4 mA
Current
IOZH Off-State Output Current VCC e Max, VO e 2.4V
with High Level Output VIH e Min, VIL e Max 20 mA
Voltage Applied
IOZL Off-State Output Current VCC e Max, VO e 0.4V
with Low Level Output VIH e Min, VIL e Max b 20 mA
Voltage Applied
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2)
DM74 b 20 b 100
ICC Supply Current VCC e Max (Note 3) 11 20 mA
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
Note 3: ICC is measured with the data control (C) inputs at 4.5V and the data inputs grounded.
2
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 667X
Symbol Parameter CL e 50 pF CL e 150 pF Units
Min Max Min Max
tPLH Propagation Delay Time Low
15 21 ns
to High Level Output
tPHL Propagation Delay Time High
18 22 ns
to Low Level Output
tPZH Output Enable Time to
25 35 ns
High Level Output
tPZL Output Enable Time to
25 40 ns
Low Level Output
tPHZ Output Disable Time from
20 ns
High Level Output (Note 1)
tPLZ Output Disable Time from
20 ns
Low Level Output (Note 1)
Note 1: CL e 5pF.
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS125A/DM54LS125A/DM74LS125A Quad TRI-STATE Buffers
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
DM54LS132/DM74LS132 Quad 2-Input NAND Gates with Schmitt Trigger Inputs
June 1989
Connection Diagram
Dual-In-Line Package
TL/F/6389 – 1
Order Number DM54LS132J, DM54LS132W, DM74LS132M or DM74LS132N
See NS Package Number J14A, M14A, N14A or W14B
Function Table
Y e AB
Inputs Output
A B Y
L L H
L H H
H L H
H H L
H e High Logic Level
L e Low Logic Level
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 2)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max, DM54 2.5 3.4
V
Voltage VI e VTb Min
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max, DM54 0.25 0.4
Voltage
VI e VT a Max DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
IT a Input Current at VCC e 5V, VI e VT a
b 0.14 mA
Positive-Going Threshold
IT b Input Current at VCC e 5V, VI e VTb
b 0.18 mA
Negative-Going Threshold
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.4 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 3)
DM74 b 20 b 100
2
Switching Characteristics at VCC 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
Symbol Parameter CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time
5 22 8 25 ns
Low to High Level Output
tPHL Propagation Delay Time
5 22 10 33 ns
High to Low Level Output
3
DM54LS132/DM74LS132 Quad 2-Input NAND Gates with Schmitt Trigger Inputs
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
54LS138/DM54LS138/DM74LS138,
54LS139/DM54LS139/DM74LS139
Decoders/Demultiplexers
General Description
These Schottky-clamped circuits are designed to be used in Schottky diodes to suppress line-ringing and simplify system
high-performance memory-decoding or data-routing appli- design.
cations, requiring very short propagation delay times. In
high-performance memory systems these decoders can be Features
used to minimize the effects of system decoding. When Y Designed specifically for high speed:
used with high-speed memories, the delay times of these Memory decoders
decoders are usually less than the typical access time of the Data transmission systems
memory. This means that the effective system delay intro- Y LS138 3-to-8-line decoders incorporates 3 enable in-
duced by the decoder is negligible.
puts to simplify cascading and/or data reception
The LS138 decodes one-of-eight lines, based upon the con- Y LS139 contains two fully independent 2-to-4-line decod-
ditions at the three binary select inputs and the three enable ers/demultiplexers
inputs. Two active-low and one active-high enable inputs Y Schottky clamped for high performance
reduce the need for external gates or inverters when ex- Y Typical propagation delay (3 levels of logic)
panding. A 24-line decoder can be implemented with no ex-
LS138 21 ns
ternal inverters, and a 32-line decoder requires only one
LS139 21 ns
inverter. An enable input can be used as a data input for
demultiplexing applications.
Y Typical power dissipation
LS138 32 mW
The LS139 comprises two separate two-line-to-four-line de-
LS139 34 mW
coders in a single package. The active-low enable input can Y Alternate Military/Aerospace devices (54LS138,
be used as a data line in demultiplexing applications.
54LS139) are available. Contact a National Semicon-
All of these decoders/demultiplexers feature fully buffered ductor Sales Office/Distributor for specifications.
inputs, presenting only one normalized load to its driving
circuit. All inputs are clamped with high-performance
Connection Diagrams
Dual-in-Line Package
Dual-in-Line Package
TL/F/6391 – 1 TL/F/6391 – 2
Order Number 54LS138DMQB, 54LS138FMQB, Order Number 54LS139DMQB, 54LS139FMQB,
54LS138LMQB, DM54LS138J, DM54LS138W, 54LS139LMQB, DM54LS139J, DM54LS139W,
DM74LS138M or DM74LS138N DM74LS139M or DM74LS139N
See NS Package Number E20A, J16A, See NS Package Number E20A, J16A,
M16A, N16E or W16A M16A, N16E or W16A
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max, DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max, DM54 0.25 0.4
Voltage VIL e Max, VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.36 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 20 b 100
2
’LS138 Switching Characteristics
at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From (Input) Levels
Symbol Parameter To (Output) of Delay CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time Select to
2 18 27 ns
Low to High Level Output Output
tPHL Propagation Delay Time Select to
2 27 40 ns
High to Low Level Output Output
tPLH Propagation Delay Time Select to
3 18 27 ns
Low to High Level Output Output
tPHL Propagation Delay Time Select to
3 27 40 ns
High to Low Level Output Output
tPLH Propagation Delay Time Enable to
2 18 27 ns
Low to High Level Output Output
tPHL Propagation Delay Time Enable to
2 24 40 ns
High to Low Level Output Output
tPLH Propagation Delay Time Enable to
3 18 27 ns
Low to High Level Output Output
tPHL Propagation Delay Time Enable to
3 28 40 ns
High to Low Level Output Output
3
’LS139 Electrical Characteristics
over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max, DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max, VIH e Min DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.36 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 20 b 100
RL e 2 kX
From (Input)
Symbol Parameter To (Output) CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time Select to
18 27 ns
Low to High Level Output Output
tPHL Propagation Delay Time Select to
27 40 ns
High to Low Level Output Output
tPLH Propagation Delay Time Enable to
18 27 ns
Low to High Level Output Output
tPHL Propagation Delay Time Enable to
24 40 ns
High to Low Level Output Output
Function Tables
LS138 LS139
Inputs Inputs
Outputs Outputs
Enable Select Enable Select
G1 G2* C B A YO Y1 Y2 Y3 Y4 Y5 Y6 Y7 G B A Y0 Y1 Y2 Y3
X H X X X H H H H H H H H H X X H H H H
L X X X X H H H H H H H H L L L L H H H
H L L L L L H H H H H H H L L H H L H H
H L L L H H L H H H H H H L H L H H L H
H L L H L H H L H H H H H L H H H H H L
H L L H H H H H L H H H H H e High Level, L e Low Level, X e Don’t Care
H L H L L H H H H L H H H
H L H L H H H H H H L H H
H L H H L H H H H H H L H
H L H H H H H H H H H H L
* G2 e G2A a G2B
H e High Level, L e Low Level, X e Don’t Care
4
Logic Diagrams
LS138
TL/F/6391 – 3
LS139
TL/F/6391 – 4
5
Physical Dimensions inches (millimeters)
6
Physical Dimensions inches (millimeters) (Continued)
7
54LS138/DM54LS138/DM74LS138,
54LS139/DM54LS139/DM74LS139 Decoders/Demultiplexers
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
TL/F/6394–1
Order Number DM54LS154J,
DM74LS154WM or DM74LS154N
See NS Package Number J24A, M24B or N24A
TL/F/6394 – 2
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max, VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.4 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2)
DM74 b 20 b 100
ICC Supply Current VCC e Max (Note 3) 9 14 mA
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
Note 3: ICC is measured with all outputs open and all inputs grounded.
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From (Input)
Symbol Parameter To (Output) CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time Data to
30 35 ns
Low to High Level Output Output
tPHL Propagation Delay Time Data to
30 35 ns
High to Low Level Output Output
tPLH Propagation Delay Time Strobe to
20 25 ns
Low to High Level Output Output
tPHL Propagation Delay Time Strobe to
25 35 ns
High to Low Level Output Output
2
Function Table
Inputs Outputs
G1 G2 D C B A 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
L L L L L L L H H H H H H H H H H H H H H H
L L L L L H H L H H H H H H H H H H H H H H
L L L L H L H H L H H H H H H H H H H H H H
L L L L H H H H H L H H H H H H H H H H H H
L L L H L L H H H H L H H H H H H H H H H H
L L L H L H H H H H H L H H H H H H H H H H
L L L H H L H H H H H H L H H H H H H H H H
L L L H H H H H H H H H H L H H H H H H H H
L L H L L L H H H H H H H H L H H H H H H H
L L H L L H H H H H H H H H H L H H H H H H
L L H L H L H H H H H H H H H H L H H H H H
L L H L H H H H H H H H H H H H H L H H H H
L L H H L L H H H H H H H H H H H H L H H H
L L H H L H H H H H H H H H H H H H H L H H
L L H H H L H H H H H H H H H H H H H H L H
L L H H H H H H H H H H H H H H H H H H H L
L H X X X X H H H H H H H H H H H H H H H H
H L X X X X H H H H H H H H H H H H H H H H
H H X X X X H H H H H H H H H H H H H H H H
H e High Level, L e Low Level, X e Don’t Care
3
4
Physical Dimensions inches (millimeters)
5
DM54LS154/DM74LS154 4-Line to 16-Line Decoders/Demultiplexers
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
54LS157/DM54LS157/DM74LS157,
54LS158/DM54LS158/DM74LS158
Quad 2-Line to 1-Line Data Selectors/Multiplexers
General Description Features
These data selectors/multiplexers contain inverters and Y Buffered inputs and outputs
drivers to supply full on-chip data selection to the four out- Y Typical Propagation Time
put gates. A separate strobe input is provided. A 4-bit word LS157 9 ns
is selected from one of two sources and is routed to the four LS158 7 ns
outputs. The LS157 presents true data whereas the LS158 Y Typical Power Dissipation
presents inverted data to minimize propagation delay time. LS157 49 mW
LS158 24 mW
Applications Y Alternate Military/Aerospace device (54LS157,
Y Expand any data input point 54LS158) is available. Contact a National Semiconduc-
Y Multiplex dual data buses tor Sales Office/Distributor for specifications.
Y Generate four functions of two variables (one variable
is common)
Y Source programmable counters
Connection Diagrams
Dual-In-Line Package Dual-In-Line Package
TL/F/6396 – 1 TL/F/6396 – 2
Function Table
Inputs Output Y
Strobe Select A B LS157 LS158
H X X X L H
L L L X L H
L L H X H L
L H X L L H
L H X H H L
H e High Level, L e Low Level, X e Don’t Care
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max, VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max S or G 0.2
mA
Input Voltage VI e 7V
A or B 0.1
IIH High Level Input VCC e Max S or G 40
mA
Current VI e 2.7V
A or B 20
IIL Low Level Input VCC e Max S or G b 0.8
mA
Current VI e 0.4V
A or B b 0.4
2
’LS157 Switching Characteristics
at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From (Input)
Symbol Parameter To (Output) CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time Data
14 18 ns
Low to High Level Output to Y
tPHL Propagation Delay Time Data
14 23 ns
High to Low Level Output to Y
tPLH Propagation Delay Time Strobe
20 24 ns
Low to High Level Output to Y
tPHL Propagation Delay Time Strobe
21 30 ns
High to Low Level Output to Y
tPLH Propagation Delay Time Select
23 28 ns
Low to High Level Output to Y
tPHL Propagation Delay Time Select
27 32 ns
High to Low Level Output to Y
3
’LS158 Switching Characteristics
at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From (Input)
Symbol Parameter To (Output) CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time Data
12 18 ns
Low to High Level Output to Y
tPHL Propagation Delay Time Data
12 21 ns
High to Low Level Output to Y
tPLH Propagation Delay Time Strobe
17 23 ns
Low to High Level Output to Y
tPHL Propagation Delay Time Strobe
18 28 ns
High to Low Level Output to Y
tPLH Propagation Delay Time Select
20 24 ns
Low to High Level Output to Y
tPHL Propagation Delay Time Select
24 36 ns
High to Low Level Output to Y
Logic Diagrams
LS157 LS158
TL/F/6396–3 TL/F/6396 – 4
4
5
Physical Dimensions inches (millimeters)
6
Physical Dimensions inches (millimeters) (Continued)
7
54LS157/DM54LS157/DM74LS157, 54LS158/DM54LS158/DM74LS158
Quad 2-Line to 1-Line Data Selectors/Multiplexers
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
VCC TC Q0 Q1 Q2 Q3 CET PE
16 15 14 13 12 11 10 9 D SUFFIX
NOTE: SOIC
16
The Flatpak version
1 CASE 751B-03
has the same pinouts
(Connection Diagram) as
the Dual In-Line Package.
ORDERING INFORMATION
*MR for LS160A and LS161A
*SR for LS162A and LS163A SN54LSXXXJ Ceramic
1 2 3 4 5 6 7 8 SN74LSXXXN Plastic
*R CP P0 P1 P2 P3 CEP GND SN74LSXXXD SOIC
STATE DIAGRAM
LS160A • LS162A LS161A • LS163A
LOGIC EQUATIONS
0 1 2 3 4 0 1 2 3 4
Count Enable = CEP • CET • PE
TC for LS160A & LS162A = CET • Q0 • Q1 • Q2 • Q3
TC for LS161A & LS163A = CET • Q0 • Q1 • Q2 • Q3
15 5 15 5 Preset = PE • CP + (rising clock edge)
Reset = MR (LS160A & LS161A)
Reset = SR • CP + (rising clock edge)
14 6 14 6 Reset = (LS162A & LS163A)
13 7 13 7 NOTE:
The LS160A and LS162A can be preset to any state,
but will not count beyond 9. If preset to state 10, 11,
12 11 10 9 8 12 11 10 9 8 12, 13, 14, or 15, it will return to its normal sequence
within two clock pulses.
FUNCTIONAL DESCRIPTION
The LS160A / 161A / 162A / 163A are 4-bit synchronous the Binary counters). Note that TC is fully decoded and will,
counters with a synchronous Parallel Enable (Load) feature. therefore, be HIGH only for one count state.
The counters consist of four edge-triggered D flip-flops with The LS160A and LS162A count modulo 10 following a
the appropriate data routing networks feeding the D inputs. All binary coded decimal (BCD) sequence. They generate a TC
changes of the Q outputs (except due to the asynchronous output when the CET input is HIGH while the counter is in state
Master Reset in the LS160A and LS161A) occur as a result of, 9 (HLLH). From this state they increment to state 0 (LLLL). If
and synchronous with, the LOW to HIGH transition of the loaded with a code in excess of 9 they return to their legitimate
Clock input (CP). As long as the set-up time requirements are sequence within two counts, as explained in the state
met, there are no special timing or activity constraints on any diagram. States 10 through 15 do not generate a TC output.
of the mode control or data inputs. The LS161A and LS163A count modulo 16 following a
Three control inputs — Parallel Enable (PE), Count Enable binary sequence. They generate a TC when the CET input is
Parallel (CEP) and Count Enable Trickle (CET) — select the HIGH while the counter is in state 15 (HHHH). From this state
mode of operation as shown in the tables below. The Count they increment to state 0 (LLLL).
Mode is enabled when the CEP, CET, and PE inputs are HIGH. The Master Reset (MR) of the LS160A and LS161A is
When the PE is LOW, the counters will synchronously load the asynchronous. When the MR is LOW, it overrides all other
data from the parallel inputs into the flip-flops on the LOW to input conditions and sets the outputs LOW. The MR pin should
HIGH transition of the clock. Either the CEP or CET can be never be left open. If not used, the MR pin should be tied
used to inhibit the count sequence. With the PE held HIGH, a through a resistor to VCC, or to a gate output which is
LOW on either the CEP or CET inputs at least one set-up time permanently set to a HIGH logic level.
prior to the LOW to HIGH clock transition will cause the The active LOW Synchronous Reset (SR) input of the
existing output states to be retained. The AND feature of the LS162A and LS163A acts as an edge-triggered control input,
two Count Enable inputs (CET • CEP) allows synchronous overriding CET, CEP and PE, and resetting the four counter
cascading without external gating and without delay accu- flip-flops on the LOW to HIGH transition of the clock. This
mulation over any practical number of bits or digits. simplifies the design from race-free logic controlled reset
The Terminal Count (TC) output is HIGH when the Count circuits, e.g., to reset the counter synchronously after
Enable Trickle (CET) input is HIGH while the counter is in its reaching a predetermined value.
maximum count state (HLLH for the BCD counters, HHHH for
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
DEFINITION OF TERMS
SETUP TIME (ts) — is defined as the minimum time required nition. A negative HOLD TIME indicates that the correct logic
for the correct logic level to be present at the logic input prior to level may be released prior to the clock transition from LOW to
the clock transition from LOW to HIGH in order to be recog- HIGH and still be recognized.
nized and transferred to the outputs.
RECOVERY TIME (trec) — is defined as the minimum time re-
HOLD TIME (th) — is defined as the minimum time following quired between the end of the reset pulse and the clock transi-
the clock transition from LOW to HIGH that the logic level must tion from LOW to HIGH in order to recognize and transfer
be maintained at the input in order to ensure continued recog- HIGH Data to the Q outputs.
AC WAVEFORMS
tW
tW(H) tW(L) MR 1.3 V
1.3 V OTHER CONDITIONS: trec OTHER CONDITIONS:
CP 1.3 V
PE = MR (SR) = H PE = L
1.3 V
tPHL tPLH CEP = CET = H CP P0 = P1 = P2 = P3 = H
tPHL
Q 1.3 V 1.3 V
Q0 ⋅ Q1 ⋅ Q2 ⋅ Q3 1.3 V
Figure 1. Clock to Output Delays, Count Figure 2. Master Reset to Output Delay, Master Reset
Frequency, and Clock Pulse Width Pulse Width, and Master Reset Recovery Time
AC WAVEFORMS (continued)
The positive TC pulse is coincident with the output state tPLH tPHL
(Q0 • Q1 • Q2 • Q3) state for the LS161 and LS163 and
(Q0 • Q1 • Q2 • Q3) for the LS161 and LS163. TC 1.3 V 1.3 V
CP 1.3 V 1.3 V
The shaded areas indicate when the input is permitted to P0 • P1 • P2 • P3 1.3 V 1.3 V 1.3 V
change for predictable output performance.
Q0 • Q1 • Q2 • Q3
Q RESPONSE TO SR Q
OTHER CONDITIONS: PE = H, MR = H
Figure 6 Figure 7
54LS164/DM54LS164/DM74LS164
8-Bit Serial In/Parallel Out Shift Registers
General Description Features
These 8-bit shift registers feature gated serial inputs and an Y Gated (enable/disable) serial inputs
asynchronous clear. A low logic level at either input inhibits Y Fully buffered clock and serial inputs
entry of the new data, and resets the first flip-flop to the low Y Asynchronous clear
level at the next clock pulse, thus providing complete con- Y Typical clock frequency 36 MHz
trol over incoming data. A high logic level on either input Y Typical power dissipation 80 mW
enables the other input, which will then determine the state Y Alternate Military/Aerospace device (54LS164) is avail-
of the first flip-flop. Data at the serial inputs may be changed
able. Contact a National Semiconductor Sales Office/
while the clock is high or low, but only information meeting
Distributor for specifications.
the setup and hold time requirements will be entered. Clock-
ing occurs on the low-to-high level transition of the clock
input. All inputs are diode-clamped to minimize transmis-
sion-line effects.
TL/F/6398 – 1
Order Number 54LS164DMQB, 54LS164FMQB,
54LS164LMQB, DM54LS164J, DM54LS164W,
DM74LS164M or DM74LS164N
See NS Package Number E20A,
J14A, M14A, N14A or W14B
Logic Diagram
TL/F/6398 – 2
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max, VIH e Min DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.4 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 20 b 100
ICC Supply Current VCC e Max (Note 3) 16 27 mA
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
Note 3: ICC is measured with all outputs open, the SERIAL input grounded, the CLOCK input at 2.4V, and a momentary ground, then 4.5V, applied to the CLEAR
input.
Note 4: TA e 25§ C and VCC e 5V.
2
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From (Input)
Symbol Parameter To (Output) CL e 15 pF CL e 50 pF Units
Min Max Min Max
fMAX Maximum Clock Frequency 25 MHz
tPLH Propagation Delay Time Clock to
27 30 ns
Low to High Level Output Output
tPHL Propagation Delay Time Clock to
32 40 ns
High to Low Level Output Output
tPHL Propagation Delay Time Clear to
36 45 ns
High to Low Level Output Output
Timing Diagram
TL/F/6398 – 3
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS164/DM54LS164/DM74LS164 8-Bit Serial In/Parallel Out Shift Registers
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
54LS174/DM54LS174/DM74LS174,
54LS175/DM54LS175/DM74LS175
Hex/Quad D Flip-Flops with Clear
General Description Features
These positive-edge-triggered flip-flops utilize TTL circuitry Y LS174 contains six flip-flops with single-rail outputs
to implement D-type flip-flop logic. All have a direct clear Y LS175 contains four flip-flops with double-rail outputs
input, and the quad (175) versions feature complementary Y Buffered clock and direct clear inputs
outputs from each flip-flop. Y Individual data input to each flip-flop
Information at the D inputs meeting the setup time require- Y Applications include:
ments is transferred to the Q outputs on the positive-going Buffer/storage registers
edge of the clock pulse. Clock triggering occurs at a particu- Shift registers
lar voltage level and is not directly related to the transition Pattern generators
time of the positive-going pulse. When the clock input is at Y Typical clock frequency 40 MHz
either the high or low level, the D input signal has no effect Y Typical power dissipation per flip-flop 14 mW
at the output. Y Alternate Military/Aerospace device (54LS174,
54LS175) is available. Contact a National Semiconduc-
tor Sales Office/Distributor for specifications.
Connection Diagrams
Dual-In-Line Package Dual-In-Line Package
TL/F/6404 – 1 TL/F/6404 – 2
Order Number 54LS174DMQB, 54LS174FMQB, Order Number 54LS175DMQB, 54LS175FMQB,
54LS174LMQB, DM54LS174J, 54LS175LMQB, DM54LS175J
DM54LS174W, DM74LS174M or DM74LS174N DM54LS175W, DM74LS175M or DM74LS175N
See NS Package Number E20A, J16A, See NS Package Number E20A, J16A,
M16A, N16E or W16A M16A, N16E or W16A
2
’LS174 Switching Characteristics
at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From (Input)
Symbol Parameter To (Output) CL e 15 pF CL e 50 pF Units
Min Max Min Max
fMAX Maximum Clock Frequency 30 25 MHz
tPLH Propagation Delay Time Clock to
30 32 ns
Low to High Level Output Output
tPHL Propagation Delay Time Clock to
30 36 ns
High to Low Level Output Output
tPHL Propagation Delay Time Clear to
35 42 ns
High to Low Level Output Output
3
’LS175 Electrical Characteristics
over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max, VIH e Min DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input VCC e Max Clock b 0.4
Current VI e 0.4V Clear b 0.4 mA
Data b 0.36
RL e 2 kX
From (Input)
Symbol Parameter To (Output) CL e 15 pF CL e 50 pF Units
Min Max Min Max
fMAX Maximum Clock Frequency 30 25 MHz
tPLH Propagation Delay Time Clock to
30 32 ns
Low to High Level Output Q or Q
tPHL Propagation Delay Time Clock to
30 36 ns
High to Low Level Output Q or Q
tPLH Propagation Delay Time Clear to
25 29 ns
Low to High Level Output Q
tPHL Propagation Delay Time Clear to
35 42 ns
High to Low Level Output Q
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
Note 3: With all outputs open and 4.5V applied to all data and clear inputs, ICC is measured after a momentary ground, then 4.5V applied to the clock input.
4
Logic Diagrams
LS174 LS175
TL/F/6404 – 4
TL/F/6404 – 3
5
Physical Dimensions inches (millimeters)
6
Physical Dimensions inches (millimeters) (Continued)
7
54LS174/DM54LS174/DM74LS174, 54LS175/DM54LS175/DM74LS175
Hex/Quad D Flip-Flops with Clear
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
54LS193/DM54LS193/DM74LS193
Synchronous 4-Bit Up/Down Binary
Counters with Dual Clock
General Description
This circuit is a synchronous up/down 4-bit binary counter. These counters were designed to be cascaded without the
Synchronous operation is provided by having all flip-flops need for external circuitry. Both borrow and carry outputs
clocked simultaneously, so that the outputs change togeth- are available to cascade both the up and down counting
er when so instructed by the steering logic. This mode of functions. The borrow output produces a pulse equal in
operation eliminates the output counting spikes normally as- width to the count down input when the counter underflows.
sociated with asynchronous (ripple-clock) counters. Similarly, the carry output produces a pulse equal in width to
The outputs of the four master-slave flip-flops are triggered the count down input when an overflow condition exists.
by a low-to-high level transition of either count (clock) input. The counters can then be easily cascaded by feeding the
The direction of counting is determined by which count input borrow and carry outputs to the count down and count up
is pulsed while the other count input is held high. inputs respectively of the succeeding counter.
The counter is fully programmable; that is, each output may
be preset to either level by entering the desired data at the Features
inputs while the load input is low. The output will change Y Fully independent clear input
independently of the count pulses. This feature allows the Y Synchronous operation
counters to be used as modulo-N dividers by simply modify- Y Cascading circuitry provided internally
ing the count length with the preset inputs. Y Individual preset each flip-flop
A clear input has been provided which, when taken to a high Y Alternate Military/Aerospace device (54LS193) is avail-
level, forces all outputs to the low level; independent of the able. Contact a National Semiconductor Sales Office/
count and load inputs. The clear, count, and load inputs are Distributor for specifications.
buffered to lower the drive requirements of clock drivers,
etc., required for long words.
Connection Diagram
Dual-In-Line Package
TL/F/6406 – 1
Order Number 54LS193DMQB, 54LS193FMQB, 54LS193LMQB,
DM54LS193J, DM54LS193W, DM74LS193M or DM74LS193N
See NS Package Number E20A, J16A, M16A, N16E or W16A
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 3)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max, VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.4 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 4) DM74 b 20 b 100
2
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From (Input)
Symbol Parameter To (Output) CL e 15 pF CL e 50 pF Units
3
Logic Diagram
TL/F/6406 – 2
4
Timing Diagrams
Typical Clear, Load, and Count Sequences
TL/F/6406 – 3
Note A: Clear overrides load, data, and count inputs.
Note B: When counting up, count-down input must be high; when counting down, count-up input must be high.
5
Physical Dimensions inches (millimeters)
6
Physical Dimensions inches (millimeters) (Continued)
7
54LS193/DM54LS193/DM74LS193 Synchronous 4-Bit Up/Down Counters with Dual Clock
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
DM74LS221 Dual Non-Retriggerable One-Shot with Clear and Complementary Outputs
February 1992
TL/F/6409 – 2
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max
2.7 3.4 V
Voltage VIL e Max, VIH e Min
VOL Low Level Output VCC e Min, IOL e Max
0.35 0.5
Voltage VIL e Max, VIH e Min V
VCC e Min, IOL e 4 mA 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
2
Electrical Characteristics
over recommended operating free air temperature range (unless otherwise noted) (Continued)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input VCC e Max A1, A2 b 0.4
Current VI e 0.4V B b 0.8 mA
Clear b 0.8
Switching Characteristics
at VCC e 5V and TA e 25§ C
From (Input)
Symbol Parameter Conditions Min Max Units
To (Output)
tPLH Propagation Delay Time A1, A2 CEXT e 80 pF
70 ns
Low to High Level Output to Q REXT e 2 kX
CL e 15 pF
tPLH Propagation Delay Time B
RL e 2 kX 55 ns
Low to High Level Output to Q
tPHL Propagation Delay Time A1, A2
80 ns
High to Low Level Output to Q
tPHL Propagation Delay Time B
65 ns
High to Low Level Output to Q
tPLH Propagation Delay Time Clear to
65 ns
Low to High Level Output Q
tPHL Propagation Delay Time Clear
55 ns
High to Low Level Output to Q
tW(out) Output Pulse A1, A2 CEXT e 0
Width Using Zero to Q, Q REXT e 2 kX
20 70 ns
Timing Capacitance RL e 2 kX
CL e 15 pF
tW(out) Output Pulse A1, A2 CEXT e 100 pF
Width Using External to Q, Q REXT e 10 kX
600 750 ns
Timing Resistor RL e 2 kX
CL e 15 pF
CEXT e 1 mF
REXT e 10 kX
6 7.5 ms
RL e 2 kX
CL e 15 pF
CEXT e 80 pF
REXT e 2 kX
70 150 ns
RL e 2 kX
CL e 15 pF
3
Operating Rules
1. An external resistor (RX) and an external capacitor (CX) 5. For CX k 1000 pF see Figure 3 for TW vs CX family
are required for proper operation. The value of CX may curves with RX as a parameter:
vary from 0 to approximately 1000 mF. For small time
constants high-grade mica, glass, polypropylene, polycar-
bonate, or polystyrene material capacitor may be used.
For large time constants use tantalum or special alumi-
num capacitors. If timing capacitor has leakages ap-
proaching 100 nA or if stray capacitance from either ter-
minal to ground is greater than 50 pF the timing equations
may not represent the pulse width the device generates.
2. When an electrolytic capacitor is used for CX a switching
diode is often required for standard TTL one-shots to pre-
vent high inverse leakage current. This switching diode is
not needed for the ’LS221 one-shot and should not be
used.
TL/F/6409 – 4
Furthermore, if a polarized timing capacitor is used on the FIGURE 3
’LS221, the positive side of the capacitor should be con-
6. To obtain variable pulse widths by remote trimming, the
nected to the ‘‘CEXT’’ pin (Figure 1 ) .
following circuit is recommended:
TL/F/6409 – 5
Note: ‘‘Rremote’’ should be as close to the one-shot as possible.
FIGURE 4
TL/F/6409 – 8
7. Output pulse width versus VCC and temperatures: Figure
FIGURE 1 5 depicts the relationship between pulse width variation
3. For CX ll 1000 pF, the output pulse width (TW) is de- versus VCC. Figure 6 depicts pulse width variation versus
fined as follows: temperatures.
TW e KRX CX
where [RX is in kX]
[CX is in pF]
[TW is in ns]
K & Ln2 e 0.70
4. The multiplicative factor K is plotted as a function of CX
below for design considerations:
TL/F/6409 – 6
FIGURE 5
TL/F/6409 – 3
FIGURE 2
TL/F/6409 – 7
FIGURE 6
4
Operating Rules (Continued)
8. Duty cycle is defined as TW/T c 100 in percentage, if it 10. Although the ’LS221’s pin-out is identical to the ’LS123
goes above 50% the output pulse width will become it should be remembered that they are not functionally
shorter. If the duty cycle varies between low and high identical. The ’LS123 is a retriggerable device such that
values, this causes output pulse width to vary, or jitter (a the output is dependent upon the input transitions when
function of the REXT only). To reduce jitter , REXT should its output ‘‘Q’’ is at the ‘‘High’’ state. Furthermore, it is
be as large as possible, for example, with REXT e 100k recommended for the ’LS123 to externally ground the
jitter is not appreciable until the duty cycle approaches CEXT pin for improved system performance. However,
90%. this pin on the ’LS221 is not an internal connection to
9. Under any operating condition CX and RX must be kept the device ground. Hence, if substitution of an ’LS221
as close to the one-shot device pins as possible to mini- onto an ’LS123 design layout where the CEXT pin is
mize stray capacitance, to reduce noise pick-up, and to wired to the ground, the device will not function.
reduce I-R and Ldi/dt voltage developed along their con- 11. VCC and ground wiring should conform to good high-
necting paths. If the lead length from CX to pins (6) and frequency standards and practices so that switching
(7) or pins (14) and (15) is greater than 3 cm, for exam- transients on the VCC and ground return leads do not
ple, the output pulse width might be quite different from cause interaction between one-shots. A 0.01 mF to 0.10
values predicted from the appropriate equations. A non- mF bypass capacitor (disk ceramic or monolithic type)
inductive and low capacitive path is necessary to ensure from VCC to ground is necessary on each device. Fur-
complete discharge of CX in each cycle of its operation thermore, the bypass capacitor should be located as
so that the output pulse width will be accurate. close to the VCC-pin as space permits.
For further detailed device characteristics and output performance,
please refer to the NSC one-shot application note AN-372.
5
DM74LS221 Dual Non-Retriggerable One-Shot with Clear and Complementary Outputs
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
Octal TRI-STATE Buffers/Line Drivers/Line Receivers
DM54LS240/DM74LS240, DM54LS241/DM74LS241
April 1992
DM54LS240/DM74LS240,
DM54LS241/DM74LS241
Octal TRI-STATEÉ Buffers/Line Drivers/Line Receivers
Y Typical IOL (sink current)
General Description 54LS 12 mA
These buffers/line drivers are designed to improve both the 74LS 24 mA
performance and PC board density of TRI-STATE buffers/ Y Typical IOH (source current)
drivers employed as memory-address drivers, clock drivers,
54LS b 12 mA
and bus-oriented transmitters/receivers. Featuring 400 mV
74LS b 15 mA
of hysteresis at each low current PNP data line input, they Y Typical propagation delay times
provide improved noise rejection and high fanout outputs
Inverting 10.5 ns
and can be used to drive terminated lines down to 133X.
Noninverting 12 ns
Features Y Typical enable/disable time 18 ns
Y TRI-STATE outputs drive bus lines directly
Y Typical power dissipation (enabled)
Inverting 130 mW
Y PNP inputs reduce DC loading on bus lines
Noninverting 135 mW
Y Hysteresis at data inputs improves noise margins
Connection Diagrams
Dual-In-Line Package Dual-In-Line Package
TL/F/6411 – 1
TL/F/6411 – 2
Order Number DM54LS240J, Order Number DM54LS241J,
DM54LS240W, DM54LS240E, DM54LS241W, DM54LS241E,
DM74LS240WM or DM74LS240N DM74LS241WM or DM74LS241N
See NS Package Number E20A, J20A, See NS Package Number E20A, J20A,
M20B, N20A or W20A M20B, N20A or W20A
Function Tables
LS240 LS241
Inputs Output Inputs Outputs
G A Y G G 1A 2A 1Y 2Y
L L H X L L X L
L H L X L H X H
H X Z X H X X Z
H X X L L
H X X H H
L X X X Z
L e Low Logic Level
H e High Logic Level
X e Either Low or High Logic Level
Z e High Impedance
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
HYS Hysteresis (VT a b VTb) VCC e Min
0.2 0.4 V
Data Inputs Only
VOH High Level Output Voltage VCC e Min, VIH e Min DM74
2.7
VIL e Max, IOH e b1 mA
VCC e Min, VIH e Min DM54/DM74
2.4 3.4 V
VIL e Max, IOH e b3 mA
VCC e Min, VIH e Min DM54/DM74
2
VIL e 0.5V, IOH e Max
VOL Low Level Output Voltage VCC e Min IOL e 12 mA DM74 0.4
VIL e Max
IOL e Max DM54 0.4 V
VIH e Min
DM74 0.5
IOZH Off-State Output Current, VCC e Max VO e 2.7V
20 mA
High Level Voltage Applied VIL e Max
VIH e Min
IOZL Off-State Output Current, VO e 0.4V b 20 mA
Low Level Voltage Applied
II Input Current at Maximum VCC e Max, VI e 7V (DM74)
0.1 mA
Input Voltage VI e 10V (DM54)
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.2 mA
IOS Short Circuit Output Current VCC e Max (Note 2) b 40 b 225 mA
ICC Supply Current VCC e Max, Outputs High LS240, LS241 13 23
Outputs Open Outputs Low LS240 26 44
LS241 27 46 mA
Outputs Disabled LS240 29 50
LS241 32 54
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
2
Switching Characteristics at VCC e 5V and TA e 25§ C
DM54LS DM74LS
Symbol Parameter Conditions Units
Max Max
tPLH Propagation Delay Time CL e 45 pF LS240 18 14
ns
Low to High Level Output RL e 667X LS241 18 18
tPHL Propagation Delay Time CL e 45 pF LS240 18 18
ns
High to Low Level Output RL e 667X LS241 18 18
tPZL Output Enable Time to CL e 45 pF LS240 30 30
ns
Low Level RL e 667X LS241 30 30
tPZH Output Enable Time to CL e 45 pF LS240 23 23
ns
High Level RL e 667X LS241 23 23
tPLZ Output Disable Time CL e 5 pF LS240 25 25
ns
from Low Level RL e 667X LS241 25 25
tPHZ Output Disable Time CL e 5 pF LS240 18 18
ns
from High Level RL e 667X LS241 18 18
tPLH Propagation Delay Time CL e 150 pF LS240 18
ns
Low to High Level Output RL e 667X
LS241 21
tPHL Propagation Delay Time CL e 150 pF LS240 22
ns
High to Low Level Output RL e 667X
LS241 22
tPZL Output Enable Time to CL e 150 pF LS240 33
ns
Low Level RL e 667X
LS241 33
tPZH Output Enable Time to CL e 150 pF LS240 26
ns
High Level RL e 667X
LS241 26
Note: 54LS Output load is CL e 50 pF for tPLH, tPHL, tPZL and tPZH.
3
Physical Dimensions inches (millimeters) (Continued)
5
DM54LS240/DM74LS240, DM54LS241/DM74LS241
Octal TRI-STATE Buffers/Line Drivers/Line Receivers
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
54LS244/DM74LS244 Octal TRI-STATE Buffers/Line Drivers/Line Receivers
August 1989
Connection Diagram
Dual-In-Line Package
TL/F/8442 – 1
Order Number 54LS244DMQB, 54LS244FMQB, 54LS244LMQB,
DM74LS244WM or DM74LS244N
See NS Package Number E20A, J20A, M20B, N20A or W20A
Function Table
Inputs Output
G A Y
L L L
L H H
H X Z
L e Low Logic Level
H e High Logic Level
X e Either Low or High Logic Level
Z e High Impedance
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
HYS Hysteresis (VT a b VTb) VCC e Min
0.2 0.4 V
Data Inputs Only
VOH High Level Output Voltage VCC e Min, VIH e Min DM74
2.7
VIL e Max, IOH e b1 mA
VCC e Min, VIH e Min 54LS/DM74
2.4 3.4 V
VIL e Max, IOH e b3 mA
VCC e Min, VIH e Min 54LS/DM74
2
VIL e 0.5V, IOH e Max
VOL Low Level Output Voltage VCC e Min IOL e 12 mA 54LS/DM74 0.4
VIL e Max V
IOL e Max DM74 0.5
VIH e Min
IOZH Off-State Output Current, VCC e Max VO e 2.7V
20 mA
High Level Voltage Applied VIL e Max
VIH e Min
IOZL Off-State Output Current, VO e 0.4V
b 20 mA
Low Level Voltage Applied
II Input Current at Maximum VCC e Max VI e 7V (DM74)
0.1 mA
Input Voltage VI e 10V (54LS)
IIH High Level Input Current VCC e Max VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max VI e 0.4V b 0.5 b 200 mA
54LS b 50
IOS Short Circuit Output Current VCC e Max (Note 2) b 225 mA
DM74 b 40
2
Switching Characteristics at VCC e 5V, TA e 25§ C (see Section 1 for Test Waveforms and Output Load)
Symbol Parameter Conditions 54LS Max DM74LS Max Units
tPLH Propagation Delay Time CL e 45 pF
18 18 ns
Low to High Level Output RL e 667X
tPHL Propagation Delay Time CL e 45 pF
18 18 ns
High to Low Level Output RL e 667X
tPZL Output Enable Time to CL e 45 pF
30 30 ns
Low Level RL e 667X
tPZH Output Enable Time to CL e 45 pF
23 23 ns
High Level RL e 667X
tPLZ Output Disable Time CL e 5 pF
25 25 ns
from Low Level RL e 667X
tPHZ Output Disable Time CL e 5 pF
18 18 ns
from High Level RL e 667X
tPLH Propagation Delay Time CL e 150 pF
21 ns
Low to High Level Output RL e 667X
tPHL Propagation Delay Time CL e 150 pF
22 ns
High to Low Level Output RL e 667X
tPZL Output Enable Time to CL e 150 pF
33 ns
Low Level RL e 667X
tPZH Output Enable Time to CL e 150 pF
26 ns
High Level RL e 667X
Note: 54LS Output Load is CL e 50 pF for tPLH, tPHL, tPZL and tPZH.
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS244/DM74LS244 Octal TRI-STATE Buffers/Line Drivers/Line Receivers
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
54LS245/DM54LS245/DM74LS245 TRI-STATE Octal Bus Transceiver
June 1989
54LS245/DM54LS245/DM74LS245
TRI-STATEÉ Octal Bus Transceiver
General Description
These octal bus transceivers are designed for asynchro- Y PNP inputs reduce DC loading on bus lines
nous two-way communication between data buses. The Y Hysteresis at bus inputs improve noise margins
control function implementation minimizes external timing Y Typical propagation delay times, port-to-port 8 ns
requirements. Y Typical enable/disable times 17 ns
The device allows data transmission from the A bus to the B Y IOL (sink current)
bus or from the B bus to the A bus depending upon the logic 54LS 12 mA
level at the direction control (DIR) input. The enable input 74LS 24 mA
(G) can be used to disable the device so that the buses are Y IOH (source current)
effectively isolated. 54LS b 12 mA
74LS b 15 mA
Features Y Alternate Military/Aerospace device (54LS245) is avail-
Y Bi-Directional bus transceiver in a high-density 20-pin able. Contact a National Semiconductor Sales Office/
package Distributor for specifications.
Y TRI-STATE outputs drive bus lines directly
Connection Diagram
Dual-In-Line Package
TL/F/6413 – 1
Order Number 54LS245DMQB, 54LS245FMQB, 54LS245LMQB,
DM54LS245J, DM54LS245W, DM74LS245WM or DM74LS245N
See NS Package Number E20A, J20A, M20B, N20A or W20A
Function Table
Direction
Enable Operation
Control
G
DIR
L L B data to A bus
L H A data to B bus
H X Isolation
H e High Level, L e Low Level, X e Irrelevant
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
HYS Hysteresis (VT a b VTb) VCC e Min 0.2 0.4 V
VOH High Level Output Voltage VCC e Min, VIH e Min DM74
2.7
VIL e Max, IOH e b1 mA
VCC e Min, VIL e Min DM54/DM74
2.4 3.4 V
VIL e Max, IOH e b3 mA
VCC e Min, VIH e Min DM54/DM74
2
VIL e 0.5V, IOH e Max
VOL Low Level Output Voltage VCC e Min IOL e 12 mA DM74 0.4
VIL e Max
IOL e Max DM54 0.4 V
VIH e Min
DM74 0.5
IOZH Off-State Output Current, VCC e Max VO e 2.7V
20 mA
High Level Voltage Applied VIL e Max
IOZL Off-State Output Current, VIH e Min
VO e 0.4V
b 200 mA
Low Level Voltage Applied
II Input Current at Maximum VCC e Max A or B VI e 5.5V 0.1
mA
Input Voltage DIR or G VI e 7V 0.1
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.2 mA
IOS Short Circuit Output Current VCC e Max (Note 2) b 40 b 225 mA
ICC Supply Current Outputs High VCC e Max 48 70
Outputs Low 62 90 mA
Outputs at Hi-Z 64 95
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, not to exceed one second duration
2
Switching Characteristics VCC e 5V, TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
DM54/74
Symbol Parameter Conditions LS245 Units
Min Max
tPLH Propagation Delay Time, Low-to-High-Level Output 12 ns
tPHL Propagation Delay Time, High-to-Low-Level Output CL e 45 pF 12 ns
tPZL Output Enable Time to Low Level RL e 667X 40 ns
tPZH Output Enable Time to High Level 40 ns
tPLZ Output Disable Time from Low Level CL e 5 pF 25 ns
tPHZ Output Disable Time from High Level RL e 667X 25 ns
tPLH Propagation Delay Time, Low-to-High-Level Output 16 ns
tPHL Propagation Delay Time, High-to-Low-Level Output CL e 150 pF 17 ns
tPZL Output Enable Time to Low Level RL e 667X
45 ns
tPZH Output Enable Time to High Level 45 ns
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS245/DM54LS245/DM74LS245 TRI-STATE Octal Bus Transceiver
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
DM54LS259/DM74LS259 8-Bit Addressable Latches
May 1992
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 4)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5
V
Voltage VIL e Max, VIH e Min DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.4
Voltage VIL e Max, VIH e Min DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V DM74
0.1 mA
Input Voltage VI e 10V DM54
IIH High Level Input VCC e Max, VI e 2.7V
20 mA
Current
IIL Low Level Input VCC e Max, VI e 0.4V b 0.4
Current mA
Enable VCC e Max, VI e 0.4V b 0.8
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 5) DM74 b 20 b 100
ICC Supply Current VCC e Max (Note 6) 22 36 mA
Note 1: The symbols ( v, u) indicate the edge of the clock pulse used for reference: u for rising edge, v for falling edge.
Note 2: Setup and hold times are with reference to the enable input.
Note 3: The select-to-enable setup time is the time before the High-to-Low enable transition that the select must be stable so that the correct latch is selected and
the others not affected.
Note 4: All typicals are at VCC e 5V, TA e 25§ C.
Note 5: Not more than one output should be shorted at a time, and the duration should not exceed one second.
Note 6: ICC is measured with all inputs at 4.5V, and all outputs open.
Note 7: TA e 25§ C and VCC e 5V.
2
Switching Characteristics at VCC e 5V and TA e 25§ C
DM54LS DM74LS
From (Input) CL e 50 pF
Symbol Parameter CL e 15 pF Units
To (Output) RL e 2 kX
Min Max Min Max
tPLH Propagation Delay Time Enable to
27 38 ns
Low to High Level Output Output
tPHL Propagation Delay Time Enable to
24 32 ns
High to Low Level Output Output
tPLH Propagation Delay Time Data to
30 35 ns
Low to High Level Output Output
tPHL Propagation Delay Time Data to
20 30 ns
High to Low Level Output Output
tPLH Propagation Delay Time Select to
30 41 ns
Low to High Level Output Output
tPHL Propagation Delay Time Select to
29 38 ns
High to Low Level Output Output
tPHL Propagation Delay Time Clear to
18 36 ns
High to Low Level Output Output
3
Physical Dimensions inches (millimeters) (Continued)
4
Physical Dimensions inches (millimeters) (Continued)
5
DM54LS259/DM74LS259 8-Bit Addressable Latches
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
DM54LS260/DM74LS260 Dual 5-Input NOR Gate
April 1992
DM54LS260/DM74LS260
Dual 5-Input NOR Gate
General Description
This device contains two individual five input gates, each of
which perform the logic NOR function.
Connection Diagram
Dual-In-Line Package
TL/F/9824 – 1
Order Number DM54LS260J, DM54LS260W,
DN54LS260E, DM74LS260M or DM74LS260N
See NS Package Number E20A, J14A, M14A, N14A or W14B
Truth Table
AaBaCaDaEeY
Inputs Outputs
A B C D E Y
L L L L L H
X X X X H L
X X X H X L
X X H X X L
X H X X X L
H X X X X L
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b 18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5
V
Voltage VIL e Max
DM74 2.7
VOL Low Level Output VCC e Min, IOL e Max DM54 0.4
Voltage VIH e Min
DM74 0.5 V
IOL e 4 mA, VCC e Min DM74 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage VI e 10V DM54
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V DM54 b 0.40
mA
DM74 b 0.36
ICCH Supply Current with Outputs High VCC e Max, VIN e GND 4.0 mA
ICCL Supply Current with Outputs Low VCC e Max, VIN e Open 5.5 mA
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
2
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
DM54LS260/DM74LS260 Dual 5-Input NOR Gate
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
DM54LS273/DM74LS273 8-Bit Register with Clear
April 1992
DM54LS273/DM74LS273
8-Bit Register with Clear
General Description Features
The ’LS273 is a high speed 8-bit register, consisting of eight Y Edge-triggered
D-type flip-flops with a common Clock and an asynchronous Y 8-bit high speed register
active LOW Master Reset. This device is supplied in a 20- Y Parallel in and out
pin package featuring 0.3 inch row spacing. Y Common clock and master reset
Connection Diagram
Dual-In-Line Package
TL/F/9825 – 1
Order Number DM54LS273E, DM54LS273J,
DM54LS273W, DM74LS273M or DM74LS273N
See NS Package Number E20A, J20A, M20B,
N20A or W20A
Electrical Characteristics
Over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max, DM54 2.5
V
Voltage VIL e Max
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max, DM54 0.4
Voltage VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage VI e 10V (DM54)
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.4 mA
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 20 b 100
2
Switching Characteristics VCC e a 5.0V, TA e a 25§ C
CL e 15 pF
DM74LS
Symbol Parameter DM54LS Units
RL e 2 kX
Min Max Min Max
fmax Maximum Clock Frequency 30 30 MHz
tPLH Propagation Delay 24 24
ns
tPHL CP to Qn 24 24
tPLH Propagation Delay
27 27 ns
MR to Qn
Logic Symbol
TL/F/9825 – 2
VCC e Pin 20
GND e Pin 10
Logic Diagram
TL/F/9825 – 3
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
DM54LS273/DM74LS273 8-Bit Register with Clear
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
54LS279/DM54LS279/DM74LS279 Quad S-R Latches
May 1989
54LS279/DM54LS279/DM74LS279
Quad S-R Latches
General Description
The ’LS279 consists of four individual and independent Set- to be indeterminate. Both inputs are voltage level triggered
Reset Latches with active low inputs. Two of the four latch- and are not affected by transition time of the input data.
es have an additonal S input ANDed with the primary S
input. A low on any S input while the R input is high will be Features
stored in the latch and appear on the corresponding Q out- Y Alternate military/aerospace device (54LS279) is avail-
put as a high. A low on the R input while the S input is high able. Contact a National Semiconductor Sales Office/
will clear the Q output to a low. Simultaneous transistion of Distributor for specifications.
the R and S inputs from low to high will cause the Q output
Connection Diagram
Dual-In-Line Package
TL/F/6420 – 1
Order Number 54LS279DMQB, 54LS279FMQB, 54LS279LMQB,
DM54LS279J, DM74LS279M or DM74LS279N
See NS Package Number E20A, J16A, M16A, N16E or W16A
Function Table
Inputs Output
S(1) R Q
L L H*
L H H
H L L
H H Q0
H e High Level
L e Low Level
Q0 e The Level of Q before the indicated input conditions were established.
*This output level is pseudo stable; that is, it may not persist when the S and R
inputs return to their inactive (high) level.
Note 1: For latches with double S inputs:
H e both S inputs high
L e one or both S inputs low
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.5
V
Voltage
VIL e Max, VIH e Min DM74 2.7 3.5
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max, VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input VCC e Max, VI e 2.7V
20 mA
Current
IIL Low Level Input VCC e Max, VI e 0.4V
b 0.4 mA
Current
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 20 b 100
2
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From (Input)
Symbol Parameter To (Output) CL e 15 pF CL e 50 pF Units
Min Max Min Max
tPLH Propagation Delay Time S to
22 25 ns
Low to High Level Output Q
tPHL Propagation Delay Time S to
15 23 ns
High to Low Level Output Q
tPHL Propagation Delay Time R to
27 33 ns
High to Low Level Output Q
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS279/DM54LS279/DM74LS279 Quad S-R Latches
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
54LS283/DM54LS283/DM74LS283 4-Bit Binary Adders with Fast Carry
June 1989
54LS283/DM54LS283/DM74LS283
4-Bit Binary Adders with Fast Carry
General Description Features
These full adders perform the addition of two 4-bit binary Y Full-carry look-ahead across the four bits
numbers. The sum (R) outputs are provided for each bit and Y Systems achieve partial look-ahead performance with
the resultant carry (C4) is obtained from the fourth bit. the economy of ripple carry
These adders feature full internal look ahead across all four Y Typical add times
bits. This provides the system designer with partial look- Two 8-bit words 25 ns
ahead performance at the economy and reduced package Two 16-bit words 45 ns
count of a ripple-carry implementation. Y Typical power dissipation per 4-bit adder 95 mW
The adder logic, including the carry, is implemented in its Y Alternate Military/Aerospace device (54LS283) is avail-
true form meaning that the end-around carry can be accom- able. Contact a National Semiconductor Sales Office/
plished without the need for logic or level inversion. Distributor for specifications.
Connection Diagram
Dual-In-Line Package
TL/F/6421 – 1
Order Number 54LS283DMQB, 54LS283FMQB, 54LS283LMQB,
DM54LS283J, DM54LS283W, DM74LS283M or DM74LS283N
See NS Package Number E20A, J16A, M16A, N16E or W16A
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max DM54 2.5 3.4
V
Voltage VIL e Max, VIH e Min
DM74 2.7 3.4
VOL Low Level Output VCC e Min, IOL e Max DM54 0.25 0.4
Voltage VIL e Max, VIH e Min
DM74 0.35 0.5 V
IOL e 4 mA, VCC e Min DM74 0.25 0.4
II Input Current @ Max VCC e Max A, B 0.2
mA
Input Voltage VI e 7V
C0 0.1
IIH High Level Input VCC e Max A, B 40
mA
Current VI e 2.7V
C0 20
IIL Low Level Input VCC e Max A, B b 0.8
mA
Current VI e 0.4V
C0 b 0.4
2
Switching Characteristics at VCC e 5V and TA e 25§ C (See Section 1 for Test Waveforms and Output Load)
RL e 2 kX
From (Input)
Symbol Parameter CL e 15 pF CL e 50 pF Units
To (Output)
Min Max Min Max
tPLH Propagation Delay Time C0 to
24 28 ns
Low to High Level Output R1, R2
tPHL Propagation Delay Time C0 to
24 30 ns
High to Low Level Output R1, R2
tPLH Propagation Delay Time C0 to
24 28 ns
Low to High Level Output R3
tPHL Propagation Delay Time C0 to
24 30 ns
High to Low Level Output R3
tPLH Propagation Delay Time C0 to
24 28 ns
Low to High Level Output R4
tPHL Propagation Delay Time C0 to
24 30 ns
High to Low Level Output R4
tPLH Propagation Delay Time Ai or Bi
24 28 ns
Low to High Level Output to Ri
tPHL Propagation Delay Time Ai or Bi
24 30 ns
High to Low Level Output to Ri
tPLH Propagation Delay Time C0 to
17 24 ns
Low to High Level Output C4
tPHL Propagation Delay Time C0 to
17 25 ns
High to Low Level Output C4
tPLH Propagation Delay Time Ai or Bi
17 24 ns
Low to High Level Output to C4
tPHL Propagation Delay Time Ai or Bi
17 26 ns
High to Low Level Output to C4
Function Table
TL/F/6421 – 3
H e High Level, L e Low Level
Note: Input conditions at A1, B1, A2, B2, and C0 are used to determine outputs R1 and R2 and the value of the internal carry C2. The values at C2, A3, B3, A4, and
B4 are then used to determine outputs R3, R4, and C4.
3
Logic Diagram
LS283
TL/F/6421 – 2
4
5
Physical Dimensions inches (millimeters)
6
Physical Dimensions inches (millimeters) (Continued)
7
54LS283/DM54LS283/DM74LS283 4-Bit Binary Adders with Fast Carry
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
TRI-STATE Octal D-Type Transparent Latches and Edge-Triggered Flip-Flops
DM54LS373/DM74LS373, DM54LS374/DM74LS374
May 1992
DM54LS373/DM74LS373,
DM54LS374/DM74LS374
TRI-STATEÉ Octal D-Type Transparent
Latches and Edge-Triggered Flip-Flops
General Description Features
These 8-bit registers feature totem-pole TRI-STATE outputs Y Choice of 8 latches or 8 D-type flip-flops in a single
designed specifically for driving highly-capacitive or relative- package
ly low-impedance loads. The high-impedance state and in- Y TRI-STATE bus-driving outputs
creased high-logic level drive provide these registers with Y Full parallel-access for loading
the capability of being connected directly to and driving the Y Buffered control inputs
bus lines in a bus-organized system without need for inter- Y P-N-P inputs reduce D-C loading on data lines
face or pull-up components. They are particularly attractive
for implementing buffer registers, I/O ports, bidirectional
bus drivers, and working registers. (Continued)
Connection Diagrams
Dual-In-Line Packages
’LS373
Order Number
DM54LS373J,
DM54LS373W,
DM74LS373N or
DM74LS373WM
See NS Package Number
J20A, M20B, N20A or
W20A
TL/F/6431 – 1
’LS374
Order Number
DM54LS374J,
DM54LS374W,
DM74LS374WM or
DM74LS374N
See NS Package Number
J20A, M20B, N20A or
W20A
TL/F/6431 – 2
Function Tables
DM54/74LS373 DM54/74LS374
H e High Level (Steady State), L e Low Level (Steady State), X e Don’t Care
u e Transition from low-to-high level, Z e High Impedance State
Q0 e The level of the output before steady-state input conditions were established.
Logic Diagrams
DM54/74LS373 DM54/74LS374
Transparent Latches Positive-Edge-Triggered Flip-Flops
TL/F/6431–3 TL/F/6431 – 4
2
Absolute Maximum Ratings (See Note)
If Military/Aerospace specified devices are required, Note: The ‘‘Absolute Maximum Ratings’’ are those values
please contact the National Semiconductor Sales beyond which the safety of the device cannot be guaran-
Office/Distributors for availability and specifications. teed. The device should not be operated at these limits. The
Supply Voltage 7V parametric values defined in the ‘‘Electrical Characteristics’’
table are not guaranteed at the absolute maximum ratings.
Input Voltage 7V
The ‘‘Recommended Operating Conditions’’ table will define
Storage Temperature Range b 65§ C to a 150§ C
the conditions for actual device operation.
Operating Free Air Temperature Range
DM54LS b 55§ C to a 125§ C
DM74LS 0§ C to a 70§ C
IOL e 12 mA DM74
0.4
VCC e Min
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.4 mA
IOZH Off-State Output Current VCC e Max, VO e 2.7V
with High Level Output VIH e Min, VIL e Max
20 mA
Voltage Applied
IOZL Off-State Output Current VCC e Max, VO e 0.4V
with Low Level Output VIH e Min, VIL e Max b 20 mA
Voltage Applied
IOS Short Circuit VCC e Max DM54 b 20 b 100
mA
Output Current (Note 2) DM74 b 50 b 225
ICC Supply Current VCC e Max, OC e 4.5V,
24 40 mA
Dn, Enable e GND
3
‘LS373 Switching Characteristics at VCC e 5V and TA e 25§ C
(See Section 1 for Test Waveforms and Output Load)
From RL e 667X
Symbol Parameter (Input) CL e 45 pF CL e 150 pF Units
To
(Output) Min Max Min Max
4
’LS374 Electrical Characteristics
over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output Voltage VCC e Min DM54 2.4 3.4
IOH e Max DM74 2.4 3.1
VIL e Max V
VIH e Min
VOL Low Level Output Voltage VCC e Min DM54 0.25 0.4
IOL e Max DM74 0.35 0.5
VIL e Max
VIH e Min V
IOL e 12 mA DM74
0.25 0.4
VCC e Min
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.4 mA
IOZH Off-State Output VCC e Max, VO e 2.7V
Current with High VIH e Min, VIL e Max
20 mA
Level Output
Voltage Applied
IOZL Off-State Output VCC e Max, VO e 0.4V
Current with Low VIH e Min, VIL e Max b 20 mA
Level Output
Voltage Applied
IOS Short Circuit VCC e Max DM54 b 50 b 225
mA
Output Current (Note 2)
DM74 b 50 b 225
ICC Supply Current VCC e Max, Dn e GND, OC e 4.5V 27 45 mA
5
Physical Dimensions inches (millimeters)
6
Physical Dimensions inches (millimeters) (Continued)
7
DM54LS373/DM74LS373, DM54LS374/DM74LS374
TRI-STATE Octal D-Type Transparent Latches and Edge-Triggered Flip-Flops
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.