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    Liga Process Sensor Construction Techniques via Xray Lithography

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    This is about LIGA Process

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    26 views4 pages

    Liga Process Sensor Construction Techniques Via Xray Lithography

    Uploaded by

    abhishek ranjan
    This is about LIGA Process

    Copyright:

    © All Rights Reserved
    Download as PDF or read online from Scribd
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    LIGA PROCESS: SENSOR CONSTRUCTION TECHNIQUES VIA X-RAY LITHOGRAPHY W. Ehrfeld 1), F, Gotz 2), . MUnchmeyer 1), W. Schelb 1,. Schmidt 1) 1) Kernforschungszentrum Karlsruhe GmbH, Institut fur Kernverfahrenstechnik, P.O, Box 3640, 15:7500 Karlsruhe 1, Federal Republicof Germany 2) Steag AG, P.O. Box 10 37 62, 0-4300 Essen 1 Federal Republicof Germany Abstract A large variety of microsensors and components for microactustors can be fabricated by the so-called UGA method which s based on deep-etch Xray ithography, croforming and molding processes (im German Leh ‘raphie, Galvanoformung, Rbformung), This microfabn. Ebtion technique allows to generate devices wth minimal tateral dimensions inthe micrometer range and structural heights of several hundred micrometers rom metalic and plate materia, In contrast to rventation dependent Etching of monocrysaine silicon there are no retrtions inthe crow-sectional shape of the microstructures Various Concepts of sensors for measuring vibration, acceleration, postion, spectral distribution, radiation, composition of mixtures etc are presented {Introduction Technological advances in lithography continue to drive the level of integration and the reduction in minimum feature size of semiconductor products. In the laboratory scale, optical lithography which 1s by far the most im. portant technique in present production lines has reached the 0.5 um range required for the fabrication of 16 Mbit memory chips. For mass production of 64 Mbit and even more advanced devices, X-ray lithography is expected to Became the preferred technique [if itis capable to gen erate minimum dimensionsin the 0.2 um range. Besides semiconductor devices, a large number of other ‘microstructure products may be fabricated by means of X Fay lithography. The so-called LIGA process which i based on deepsetch X-ray lithography with high quantum ener ‘ay synchrotron radiation, electroforming and molding Brocesses {in German’ Lithographie, Galvanoformung, Abformung) allows to produce microstructures with lat feral dimensions in the micrometer range and structural heights of several hundred micrometers from a variety of materials (2, 3). ts application potential covers microelec tronics, sensors, microoptis, micromechanics and biotech nology (4 This paper gives a short overview of the LIGA process and its application patential for fabricating microsensors Microfabrication Process The principle of the LIGA method 1s evident from the pro- cess sequence shown in Figure 1. A polymeric material {resist} which changes its dissolution rate in a liquid folvent (developer) under higheneray irradiation, is ex posed through an X-ray mask to highly intensive parallel Kcrays. The radiation source ss an electton synchrotron oF an electron Storage ring which, at present, = the only pos Sibiiny to_generate the highly collimated photon flux in the spectral range required for precise deep.etch X-ray lithography in thick resist layers. f one considers a thick. ness between 10 and 1000 um for the resist layers to be Structured, the optimum critical wavelength of the syn- chrotron radiation source ranges from some 0.1 to 1 nm for typical resist materials. Fesist structure rp Ty evelopment Mott ciuclre STEER cabancterming tool ot ESTEE eo ae Moving mess STE — mou ting Fig. 1: Schematic representation of a process sequence of {heTIGA metho for mors fabrication of micro-sevices In the next step, the resist structure is used as a template in an electroforming process where metal is deposited onto the electrically conductive substrate, In this way, 9 com. plementary metallic structure is obtained which can oe either the final microstructure produet or can be used as 3 ‘microtool {mold insert) for multiple reproduction by means of a molding process. The micromolding process has been optimized usin methacrylate based casting resins with avspecial interna mold release agent In the process sequence shown v0 Fig, The mold matensal is introduced ino the mold cavities through the holes of gate plate. Ths plate which has a formlocking connection with the polymeric microstruc tures alter Rardering of he reanwrvet ava letras n 8 Second electroforming process for generating secondary imetallic merostructures, has been demonstrated by many experiments that inspite of on ospect rato of about {00 and minimum lateral dimensions of only some micro: meters, ayeld of approximately 100 % can be obtained in the micromolding process The secondary structures are perfect copies of the primary structures Consequently, mass production of plastic and metallic merostructures should be feasible without 3 Continuous utilization of a synchroteon radiation source ‘hich only necessary for fabricating mold inser Sensors The development of modern sensors aims at miniaturiza: tion, more complex or array structures and integration with electronic signal conditioning. Furthermore, the expenditure for adjustment, trimming and replacement Should be minimized and, accordingly, the manufacturing tolerances should be as small as oossible. In this respect ‘THO215~4/88/0000-0001$1-00@ 1988 TERE the LIGA method has a number of advantages which will be ilustrated by a description of several sensor devices in the following. ‘Measurement of vibration and acceleration: A.LIGA configuration for measuring vibration or acceler ‘tion is shown schematically in Figure 2. By means of deep-etch Xray ithography a template is generated ‘which allows to manufacture a spring plate and a rigid Hationary electrode directly upon a microelectronic creurt fr, correspondingly, a multitude of such arrangements Spon a completely processed silicon water. The change in capacity and the corresponding voltage change, respec- tively, may change directly the electric potential of the ‘gate electrode of a MOSFET circuit Spring Stationary |_ sprins oer. silicon Z ‘water MOSFET device Fig. 2: Schematic representation of a LIGA sensor for ‘measuring vibration or acceleration Compared to orientation dependent etching of mono: Gytaline silicon whichis 9 wellknown and proven tech nique for fabricating similar mntegrated sensors for vibra {lon measurement. the LIGA. technique should have ‘eveal advantages In partula, he fabrication of the tectonic circus can Be fully completed prior to the fabrication of the sensor structure Therefore, no mixing between micromechanical and microelectronic process Slepe occurs and a separate optimizations possible forthe ‘ifferent fabriestion procedures Since the sensor element miged vertcaly upon the electron eeu Une space quirement is minmized. This should be 2 further ad Vantage compared to siicon micromechanics where the Spring plates are usually fabricated in a plane parallel to ie'wface of the water, Nevertheless, the LIGA method Silows also to produce cantilever structures which are Sreanged parallel to the water surface. Moreover, «two axis sensor arrangement can be simply realized Measurement of position, displacement and magnetic For measuring position, displacement, small distances or changes of a magnetic field, sensor devices using inductive ‘ircuts are Used in alarge number of configurations. The LIGA method allows to generate small coils or complex coll arrays from matenais with high electrical conductivity 35 ‘well'as microstructures with high aspect ratio from ferro tlectne materials. Because of the large structural height attainable by the LIGA process, 2 low electrical resistance Gan De realized for small cals, which isan obvious advan. tage compared to corresponding configurations. gener ted by thin film techniques whereas, compared to thick film techniques, much smaller dimensions and tolerances can be obtained Figure 2 shows a scanning electron micrograph of a helical Structure generated by Xray lithography. It is used for Fabricating two intermeshing coils by electrodeposition which serve as the transmitting and receiving unit, re spectively fig. 2; Scanning electron micrograph of a resist template ft Tabncating eno intermesting mitocols Microoptical devices and spectrometry: In the field of microoptics, the LIGA process could be used for fabreating waveguides, gratings, small prisms and Small cylindrical lenses. zone plates, polarizers and spectral ters for the infrared range, spatial filters, modulators and many other optical devices and structures. More or less arbitrarily, one may discriminate between two basic configurations. One Is represented by a perforated, set Sepperting membrane of plate structure which is put into the path of rays and where the optical effect vs de. termined by the special pattern of perforation. The other configuration may be characterized by the fact that opti cal structures are generated on a stable substrate where the path of rays is parallel to the surface of the substrate land partially determined by a waveguide structure. In the follawing, two special examples of these basic configura: tions will be described. Figure 4 illustrates the principle of a small simultaneous spectrometer, It has @ Rowland configuration with 2 curved reflective grating and comprises a slab waveguide Consisting of three layers of transparent X-ray resist with matched refractive indices. In spite of the relatively low Tesglution of this microspectrometer, it might be a cheap ‘nd reliable sensor for photometric analysis of mixtures, chromatic testing, optical film thickness measurement, fete in the field of communication technology, this device ‘Gan be applied 28.9 low-cost wavelength division mult: lexeridemultipiexer. Fig. 4: Schematic representation of a simultaneous micro- spectrometer In the field of infrared spectroscopy, bondpass oF cut-off fiers can be realized as 9 So-called fesonant mesh, 6. By B metalic membrane wth a multitude of rose shaped, Y Shoped oF crcular openings whose cimensions and tances correspond to the mavelength to be transmitted (5, 61 Such seltupparting membranes with the desired con figuration of the openings can be fabricated by ray thography and electrotorming a demonstrated by Figures Fig_S: Seanning electron microgeaph of 9 Y-shaped ‘pening with 2 sit width of 5 ym in'9 nekel membrane ‘with a thickness af 300.3, further development work deals with the fabrication of highly preese supporting and positioning elements fo fiber optiesl sensors ana with ithographie generation of tnaveguide elements from transparent Xray ress Flusdic devices: The first development work on the LIGA process aimed at the fabrication of micron sized siit-shaped nozzles for Uranium sotape separation a shown Wm Figure & Con Sequently, other flow devices and, in particular, fluid Sertsars Tor measuring positon, gas densty, composition Gf mixtures ete. can be produced Because of the smal dimensions, a favorably low response time should be ob. tainabie and such devices would be applicable even unger Conditions where mergelectrome dewces are difficult 0 operate, eat high fadiation level Further flow de: kes might be columns for chramatograntiy, micra-coa ing systems based on the Joule. Thompron effect. anemo: mete sensors, sieves for determining the size distribution Gh partcles, miro-vaives ete Measurement of radiation Concepts have been worked out for fabricating micro: Shannel plates and arrays of secondary slectran mult Dliersn Contrast to the standara processes far producing Ehannel plates, the tolerances of the dimensions can be feduced nd the positions canbe exactly determined. AS 3 fesult single channels or groups of channels can be matched directly ta other dtcrete microstructures at the Input or output af a miero-channel platen the case of miniaturized electron multiplier arrays, the dynodes can Be"arranged ina ringishaped or any other curved con. figuration required nn experiment Fig 6. Scanning electron micragraph of » double de fiecting separation nozsie electioformed from miexel the minimum sit width of the curved nozzle is 3 um, the sit Fength is about 300 um tical and Optical Micraconnectors The continuous increase of logic functions in micro. processor chips and the decrease in

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