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Professor
Static Atomistic Simulations of
Department of Mechanical Engineering,
National Chung Cheng University, Nanoindentation and
Chia-Yi, Taiwan
e-mail: imeyrj@ccu.edu.tw Determination of Nanohardness
Chung-Ming Tan
Department of Mechanical Engineering, This paper develops a nonlinear finite element formulation to analyze nanoindentation
National Chung Cheng University, using an atomistic approach, which is conducive to observing the deformation mecha-
Chia-Yi, Taiwan nisms associated with the nanoindentation cycle. The simulation results of the current
and modified finite element formulation indicate that the microscopic plastic deformations of
Department of Mechanical Engineering, the thin film are caused by instabilities of the crystalline structure, and that the commonly
Wufeng Institute of Technology, used procedure for estimating the contact area in nanoindentation testing is invalid when
Chia-Yi, Taiwan the indentation size falls in the nanometer regime. 关DOI: 10.1115/1.1988349兴
1
Ui =
1
兺
2 j⫽i
共rij兲 + F共i兲 =
1
冉 兺冉 冊 冑 冊
a
2 j⫽i rij
n
− c i 共2兲
To whom correspondence should be addressed.
Contributed by the Applied Mechanics Division of THE AMERICAN SOCIETY OF where i is an electron densitylike term for atom i, which is de-
MECHANICAL ENGINEERS for publication in the ASME JOURNAL OF APPLIED MECHANICS. fined as
兺 f共r 兲 = 兺 冉 r 冊
Manuscript received by the Applied Mechanics Division December 30, 2004; final
m
revision January 19, 2005. Associate Editor: Z. Suo. Discussion on the paper should a
be addressed to the Editor, Prof. Robert M. McMeeking, Journal of Applied Mechan- i = ij 共3兲
ics, Department of Mechanical and Environmental Engineering, University of j⫽i j⫽i ij
California—Santa Barbara, Santa Barbara, CA 93106-5070, and will be accepted
until four months after final publication in the paper itself in the ASME JOURNAL OF where rij is the distance between atoms i and j. The copper con-
APPLIED MECHANICS. stants 共eV兲, a共Å兲, c, m, and n have values of 1.238⫻ 10−2, 3.6,
738 / Vol. 72, SEPTEMBER 2005 Copyright © 2005 by ASME Transactions of the ASME
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The differential of the atomic distance with respect to 兵u其i can
be expressed as
1
drij = 关xi + ui − x j,y i + vi − y j,zi + wi − z j兴d兵u其i = 关B兴d兵u其i
rij
共7兲
The principle of minimum work enforces the minimization of
the total energy of the whole system 共Etotal = 兺iEi兲 with respect to
兵u其i such that
Etotal
兵u其i
= 兺
j⫽i
冋 F f
+
F f
+
i ij j ij rij
r r
册
− 兵F其i = 兵0其. 共8兲
兵其i = 兺
j⫽i
冋 F f
+
F f
+
i rij j rij rij
− 兵F其i 册 共9兲
d兵其i = 再 冉兺 冊冉兺 冊 兺 再冉
2F
i2
F 关B兴
i rij
F 关B兴T
j rij
+
F F
+
i j
冊
册冎 兺 冋冉
j⫽i j⫽i j⫽i
⫻ 冋冉 2 f 1 f
2 −
rij rij rij
冊
关B兴关B兴T +
1 f
rij rij
关I兴 +
2
rij2
册冎
j⫽i
−
1
rij rij
冊
关B兴关B兴T +
1
rij rij
关I兴 d兵u其i = 关KT兴id兵u其i 共10兲
再
2 j⫽i where
j⫽i
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The displacement control scheme is so called because the qth
component of the incremental displacement vector is maintained
as a constant during the iteration process, i.e.,
iuiaq + duibq = duiq
duiq = 再 duq, i = 1
0, i ⬎ 1
冎 共17兲
兺
1
km
i
= i f ijrij 共18兲
V j⫽i k m
where i refers to the atom in question, j refers to the neighboring
ij
atom, rm is the displacement vector from atom i to atom j, N is the
number of nearest neighboring atoms, and Vi is the volume of the
atom in question.
Slip vector analysis 关6兴 is utilized to observe the dislocation
activity. The slip vector is given by
ns
兺 共r − r兲
1
s= j
t
j
共19兲
ns j
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Fig. 4 Atomic configurations of copper crystal at maximum indentation
depth following unloading for two indenters of different geometry. Note that
„a… and „b… represent the cross sections through the indenter tip and parallel
with the „1 0 0… plane for the pyramidal indenter, while „c… and „d… present the
equivalent cases for the spherical indenter.
Fig. 5 von Mises shear stress and slip vector distributions for indentation
to a depth of 4 Å using a spherical indenter. „a…–„b… Distributions of von
Mises shear stress viewed in the †111‡ and †001‡ directions, respectively.
„c…–„d… Distributions of the norm of the slip vector viewed in the †111‡ and
†001‡ directions, respectively.
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Fig. 6 Flooded contour diagrams of contact pressure distributions on the
copper surface. „a… Spherical indenter; „b… pyramidal indenter. The two bold
contour lines represent the boundaries of the contact areas where contact
pressure vanishes. „Stress units: GPa.…
of the atoms to slip. Therefore, a correlation must exist between hc = ht − Pmax/Smax 共20兲
the stresses at the atomic sites and the atom slippage. Using Eq.
共18兲, the stress tensor is calculated at each atomic site of the where = 0.72 for the pyramidal indenter, = 0.75 for the spheri-
copper crystal for indentation to a depth of 4 Å using the spherical cal indenter, and Smax is the stiffness, which is equal to the slope
indenter. Figures 5共a兲 and 5共b兲 show the distributions of von of the unloading curve 共dp / dh兲 at the maximum load 共Pmax兲.
Mises shear stress exceeding 4.5 GPa in the 关111兴, 关001兴 direc- The projected contact area is obtained by the projected contact
tions, respectively. Meanwhile, Figs. 5共c兲 and 5共d兲 present the area-to-contact depth relationship for the indenter geometry. The
distributions of the norm of the slip vector in the 关111兴, 关001兴 nanohardness is then determined by dividing the maximum load
directions, respectively. A comparison of the subplots in the upper by the projected contact area. Table 1 presents the results when
and lower rows of Fig. 5 indicates that the von Mises shear stress this procedure is applied to the simulated load-depth curves to
is a qualitatively good indicator of the plastic deformation induced determine the corresponding nanohardness values.
in the simulated nanoindentation. Table 1 shows that the nanohardness values calculated using
The principal goal of nanoindentation testing is to determine Eq. 共20兲 are far higher than those calculated using the true contact
the elastic modulus and nanohardness of the specimen material area identified by the contact pressure. Hence, Eq. 共20兲 signifi-
from experimental measurements of indenter load and penetration cantly underestimates the contact depth in all of the simulation
depth. These readings provide an indirect measure of the contact cases. The results also reveal that the nanohardness varies with the
area at full load, from which the mean contact pressure, and hence indentation depth and the indenter geometry. Therefore, it can be
the hardness, may then be estimated. Therefore, the validity of the concluded that the indentation size effect is significant in the
nanohardness and elastic modulus results depends largely upon nanoscale indentations simulated in this present study.
the analytical procedure employed to process the raw data. The It can also be seen that the nanohardness obtained using the
present simulations utilize the contact pressure to identify the true pyramidal indenter is higher than that obtained using the spherical
contact area at full load. Figures 6共a兲 and 6共b兲 present flooded indenter when the contact area is measured via the contact pres-
contour diagrams of the contact pressure distributions on the cop- sure. In contrast, if the contact area is obtained from Eq. 共20兲, the
per surface for spherical and pyramidal indentations, respectively. pyramidal indenter indentation yields a higher nanohardness. Fig-
The bold contour lines represent the boundaries of the contact ure 2 has demonstrated that the spherical indenter indentation con-
areas at which the contact pressure vanishes. Once the true contact sumes greater plastic work. This observation is consistent with the
area has been determined, the nanohardness can be computed by result that the nanohardness calculated by direct measurement of
dividing the load by the projected area of contact at that load. the contact area is higher. Therefore, it can be concluded that the
Table 1 presents the nanohardness magnitudes calculated using commonly used procedure for estimating the contact area in
this method for spherical and pyramidal indentations with maxi- nanoindentation testing is invalid when the indentation size falls
mum indentation depths of 4 Å, 7 Å, and 10 Å. in the nanometer regime. The reason why Eq. 共20兲 underestimates
In nanoindentation tests, analysis of the load-depth curve based the real contact area of nanoscale indentation depth is that the
on continuum mechanics contact theory gives an indirect measure assumption implied by Eq. 共20兲 fails significantly. In other words,
of the contact area. The contact depth 共hc兲 is estimated from the the deformation behavior at the incipient unloading is elastic-
plastic instead of purely elastic behavior implied by Eq. 共20兲.
total indentation depth 共ht兲 via
4 Conclusion
Table 1 Nanohardness values calculated using two methods In conclusion, this paper has presented a more efficient ap-
for two different indenter geometries and three indentation proach than conventional MD simulation for the investigation of
depths. the elastic-plastic deformations which occur during nanoscale in-
dentations of a thin film. The proposed approach utilizes the mini-
Nanohardness calculated Nanohardness mum energy principle via nonlinear finite element formulation to
using the true calculated reduce the indentation process to a quasistatic problem. The simu-
Geometry of Indentation contact area using Eq. 共20兲
lation results of the current modified finite element formulation
indenter depth ht 共Å兲 共GPa兲 共GPa兲
indicate that the microscopic plastic deformations of the thin film
pyramidal 4 5.1 15.7 are caused by instabilities of the crystalline structure. It has been
pyramidal 7 4.9 11.8 shown that the analytical procedure commonly adopted in nanoin-
pyramidal 10 4.7 9.5 dentation testing significantly overestimates the nanohardness.
spherical 4 7.6 8.1
spherical 7 6.2 7.3 The simulation results have confirmed that both the indentation
spherical 10 6.3 7.8 depth and the indenter geometry influence the nanohardness
results.
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Acknowledgment 165507.
关7兴 Fuente, O. R. de la, Zimmerman, J. A., Gonzalez, M. A., Figuera, J. de la,
The authors gratefully acknowledge the financial support pro- Hamilton, J. C., Pai, W. W., and Rojo, J. M., 2002, “Dislocation Emission
vided to this study by the National Science Council of Taiwan, around Nanoindentations on a 共001兲 fcc Metal Surface Studied by Scanning
under Grant No. NSC 91-2218-E-274-001, and American AFOSR, Tunneling Microscopy and Atomistic Simulations,” Phys. Rev. Lett., 88, p.
036101.
under Contract No. F62562-03-P-0378. 关8兴 Knap, J., and Ortiz, M., 2003, “Effect of Indenter-Radius Size on Au共001兲
Nanoindentation,” Phys. Rev. Lett., 90, p. 226102.
References 关9兴 Jeng, Y. R., and Tan, C. M., 2002, “Computer Simulation of Tension Experi-
ments of a Thin Film Using an Atomic Model,” Phys. Rev. B, 65, p. 174107.
关1兴 Lucas, B. N., Oliver, W. C., and Swindeman, J. E., 1998, “The Dynamics of 关10兴 Jeng, Y. R., and Tan, C. M., 2004, “Theoretical Study of Dislocation Emission
Frequency-Specific, Depth-Sensing Indentation Test,” Mater. Res. Soc. Symp. around a Nanoindentation Using a Static Atomistic Model,” Phys. Rev. B, 69,
Proc., 522, pp. 3–14.
p. 104109.
关2兴 Hay, J. C., and Pharr, G. M., 1998, “Experiment Investigation of the Sneddon
关11兴 Rafii-Tabar, H., 2000, “Modelling the Nano-Scale Phenomena in Condensed
Solution and an Improved Solution for the Analysis of Nanoindentation Data,”
Mater. Res. Soc. Symp. Proc., 522, pp. 39–44. Matter Physics via Computer-Based Numerical Simulations,” Phys. Rep., 325,
关3兴 Hay, J. L., O’Hern, M. E., and Oliver, W. C., 1998, “The Importance of pp. 239–310.
Contact Radius for Substrate-Independent Property Measurement of Thin 关12兴 Inamura, T., Suzuki, H., and Takezawa, N., 1991, “Cutting Experiments in a
Film,” Mater. Res. Soc. Symp. Proc., 522, pp. 27–32. Computer Using Atomic Models of a Copper Crystal and a Diamond Tool,”
关4兴 Lu, W., and Komvopoulos, K., 2001, “Nanotribological and Nanomechanical Int. J. Jpn. Soc. Precis. Eng., 25, pp. 259–266.
Properties of Ultrathin Amorphous Carbon Films Synthesized by Radio Fre- 关13兴 Alber, I., Bassani, J. L., Khantha, M., Vitek, V., and Wang, G. J., 1992, “Grain
quency Sputtering,” J. Tribol., 123, pp. 641–650. Boundaries as Heterorgeneous Systems: Atomic and Continuum Elastic Prop-
关5兴 Perez, R., Payne, M. C., and Simpson, A. D., 1995, “First Principles Simula- erties,” Philos. Trans. R. Soc. London, Ser. A, 339, pp. 555–586.
tions of Silicon Nanoindentation,” Phys. Rev. Lett., 75, pp. 4748–4751. 关14兴 Li, J., Vliet, K. J. V., Zhu, T., Yip, S., Suresh, S., 2002, “Atomistic Mecha-
关6兴 Zimmerman, J. A., Kelchner, C. L., Klein, P. A., Hamilton, J. C., and Foiles, S. nisms Governing Elastic Limit and Incipient Plasticity in Crystals,” Nature
M., 2001, “Surface Step Effects on Nanoindentation,” Phys. Rev. Lett., 87, p. 共London兲, 418, pp. 307–310.
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