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BIDI模块规格书
BIDI模块规格书
1 基本特性 Features
1.3 Operating data rate up to 6.2 Gbps and support 3.2/10.3Gb/s data links
Operating Humidity - 5 85 %
300 mA 高低温
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4 性能要求 Optical and Electrical Characteristics
光模块性能要求如表 3 所示。
表 3 光模块性能要求
Parameter Symbol Min Typical Max Unit Notes
Transmitter
AC coupled
Data Input Swing Differential VIN 180 1000 mV
inputs
Receiver
LOS Hysteresis 1 4 dB
AC coupled
Data Output Swing Differential Vout 300 850 mV
outputs
Output Impedance
ZOUT 85 100 115 ohms
(Differential)
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High 2.0 Vcc V
LOS
Low 0.8 V
6 DDMI 要求
DDMI(数字诊断)要求如表 5 所示,其它未提及的参数指标统一按行业相关标准要求。
表 5 光模块数字诊断功能要求
Temperature ±3 ºC
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Rx Power -14~0 ±2dB dBm
图1 光模块管脚定义示意图
光模块管脚描述如表6所示。
表6 光模块各个管脚描述
Pin Signal Name Description Plug Seq. Notes
1 VEET Transmitter Ground 1
2 TX FAULT Transmitter Fault Indication 3
3 TX DISABLE Transmitter Disable 3
4 MOD_DEF(2) SDA Serial Data Signal 3
5 MOD_DEF(1) SCL Serial Clock Signal 3
6 MOD_DEF(0) TTL Low 3
7 Rate Select Not Connected 3
8 LOS Loss of Signal 3
9 VEER Receiver ground 1
10 VEER Receiver ground 1
11 VEER Receiver ground 1
12 RD- Inv. Received Data Out 3
13 RD+ Received Data Out 3
14 VEER Receiver ground 1
15 VCCR Receiver Power Supply 2
16 VCCT Transmitter Power Supply 2
17 VEET Transmitter Ground 1
18 TD+ Transmit Data In 3
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19 TD- Inv. Transmit Data In 3
20 VEET Transmitter Ground 1
图2 光模块接口电路示意图
图 3 光模块结构尺寸图
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