Part G-7: References

Part G-7: References

MPE 635: Electronics Cooling 1

 Part G-7: References

References
1. Dave S. Steinberg," Cooling Techniques for Electronic Equipment ", Second Edition,
John Wiley & Sons, 1991.
2. Charles A. Harper," Electronic Packaging and Interconnection Hand Book ", Second
Edition, McGraw-Hill, 1997.
3. Joel L. Sloan, "Design and Packaging of Electronic Equipment", Van Nostrand
Reinhold Company, 1985.
4. J. P. Holman, "Heat Transfer", Eighth Edition, McGraw-Hill, 1997.
5. Frank P. Incropera, "Introduction to Heat Transfer ", Fourth Edition, John Wiley,
2002.
6. Incropera, F. P. and Dewitt, D. P, Fundamentals of Heat and Mass Transfer, John
Willey & Sons, New York., 1981.
7. Frank M. White, "Fluid Mechanics", Fourth Edition, McGraw-Hill, 1999.
8. Dave S. Steinberg, "Vibration Analysis for Electronic Equipment", Second Edition,
John Wiley & Sons, 1988.
9. Kays, W. M. and London, A.L., "Compact Heat Exchangers", Second Edition,
McGraw-Hill, 1964.
10. Gerhart, P. M. and Gross, R. J., "Fundamentals of Fluid Mechanics", Addison-Wesley
Publishing Company, Massachusetts, 1985.
11. Chapman, A. J., "Heat Transfer", Macmillan Publishing Company, New York, 1974.
12. Kays, W.M., London, A.L., "Compact Heat Exchangers", Third Edition, Krieger
Publishing Company, 1984.
13. Ellison G.N., "Fan Cooled Enclosure Analysis Using a First Order Method,
Electronics Cooling", Vol. 1, No. 2, October 1995.
14. Belady C., "Standardizing Heat Sink Performance for Forced Convection, Electronics
Cooling", Vol. 3, No. 3, September, 1997.
15. Biber C., Wakefield Engineering, Wakefield, Massachusetts, "Characterization of the
Performance of Heat Sinks,", Personal Communication, October 1997.
16. Butterbaugh M.A. and Kang S.S., IBM, Rochester, Minnesota, "Effect of Airflow
Bypass on the Performance of Heat Sinks in Electronic Cooling," Presented at the
ASME Winter Annual Meeting, 1995.
17. Idelchik, Handbook of Hydraulic Resistance, CRC Press, Florida, 1994.
18. Blevins R.D., Fluid Dynamics Handbook, Krieger Publishing Company, 1984.
19. Miller, D.S., Internal Flow Systems, Gulf Publishing Company, Texas, 1990.
20. Sung Jin Kim and Sang Woo Lee, "Air cooling Technology for Electronic Equipment",
CRC press, London, 1996.
21. Jerry E. Sergent Al Krum, "Thermal Management for Electronic Assemblies",
Mcgraw-Hill London, 1998.
22. Frank P. Incropera, "Liquid Cooling of Electronic Devices by Single-Phase
Convection", John Wiley& sons, inc, 1999.
23. Roger vizi, "Forced Hot Air Furnaces, Troubleshooting and Repair", mcgraw-Hill,
London, 1999.

MPE 635: Electronics Cooling 2