MLX90621 Datasheet Melexis PDF

MLX90621
16x4 IR array
Datasheet
Features and Benefits Applications Examples

Small size, low cost 16x4 pixels IR array High precision non-contact temperature
Easy to integrate measurements;
Industry standard four lead TO39 package Temperature sensing element for residential,
Factory calibrated infrared temperature commercial and industrial building air
measurement. conditioning;
Calibration parameters stored in EEPROM. Microwave ovens
Noise Equivalent Temperature Difference (NETD) Home appliances with temperature control;
0.20K RMS @4Hz refresh rate Thermal Comfort sensor in automotive Air
2
I C compatible digital interface Conditioning control system;
Programmable frame rate 0.5Hz…512Hz Passenger classification
2.6V supply voltage Automotive blind angle detection;
Current consumption less than 9mA Industrial temperature control of moving parts;
Sleep mode consumption less than 7µA Identifying thermal leaks in homes
Measurement start trigger for synchronization Thermal scanners
with external control unit Security / safety gates
3 FOV - 40°x10°, 60°x16° and 120°x25° Intrusion / Movement detection;
Ta -40°C to 85°C Presence detection / Person localization
To -20°C to 300°C
Complies with RoHS regulations
Ordering Information
Part No. Temperature Package Option Code Standard Packing
Code Code -X X X part form
MLX90621 E (-40°C to 85°C) SF (TO-39) (1) (2) (3) -000 -TU
(1) Supply Voltage (2) Number of (3) Package options:
B = 2.6V thermopiles: A = 120°x25° FOV
A = 16X4 B = 60°x16° FOV
C = reserved
D = 40°x10° FOV
Example:
MLX90621ESF-BAB-000-TU
Functional diagram General Description

The MLX90621 is a fully calibrated 16x4 pixels IR array
in an industry standard 4-lead TO-39 package. It
Digital Active Thermopile Array contains 2 chips in one package: the MLX90670 (IR
array with signal conditioning electronics) and the
24AA02 (256x8 EEPROM) chip.
Digital filtering The MLX90621 contains 64 IR pixels with dedicated
low noise chopper stabilized amplifier and fast ADC
integrated. A PTAT (Proportional To Absolute
RAM memory
Temperature) sensor is integrated to measure the
VDD ambient temperature of the chip. The outputs of both
EEPROM I2C interface IR and PTAT sensors are stored in internal RAM and
2
CLK SDA VSS are accessible through I C.
39001090621 Page 1 of 44 Datasheet IR16x4

Rev 3.0 15 September 2016
MLX90621
16x4 IR array
Datasheet
General Description (continued)

The results of the infrared sensor measurements are stored in RAM:
• 15...18-bit result of IR measurement for each individual sensor (64 words)
• 15…18-bit result of PTAT sensor
Depending on the application, the external microcontroller can read the different RAM data and, based on the
calibration data stored in the EEPROM memory, compensate for difference between sensors to build up a thermal
image, or calculate the temperature at each spot of the imaged scene.
These constants are accessible by the user microcontroller through the I2C bus and have to be used for external post
processing of the thermal data. This post processing includes:
• Ta calculation
• Pixel offset cancelling
• Pixel to pixel sensitivity difference compensation
• Object emissivity compensation
• Object temperature calculation
The result is an image with NETD better than 0.1K RMS at 1Hz refresh rate.
The refresh rate of the array is programmable by means of register settings or directly via I2C command. Changes of
the refresh rate have a direct impact on the integration time and noise bandwidth (faster refresh rate means higher
noise level). The frame rate is programmable in the range 0.5Hz…512Hz and can be changed to achieve the desired
trade-off between speed and accuracy.
The MLX90621 requires a single 2.6V…3.2V although the device is calibrated and performs best at VDD=2.6V.
The MLX90621 is factory calibrated in following temperature ranges:

• -40˚C…85˚C for the ambient temperature sensor
• -50˚C…300˚C for the object temperature.
NOTE: The sensor can detect higher temperatures, but is not calibrated for temperatures above 300°C.
See Table 21 for configuration specific properties.
Each pixel of the array measures the average temperature of all objects in its own Field Of View (called nFOV).
It is very important for the application designer to understand that the accuracy of the temperature measurement
is very sensitive to the thermal equilibrium isothermal conditions (there are no temperature differences across
the sensor package). The accuracy of the thermometer can be influenced by temperature differences in the
package induced by causes like (among others): Hot electronics behind the sensor, heaters/coolers behind or
beside the sensor or by a hot/cold object very close to the sensor that not only heats the sensing element in the
thermometer but also the thermometer package.

MLX90621
16x4 IR array
Datasheet
1. Table of contents
1. Table of contents.......................................................................................................................................................... 3
2. Glossary of terms ......................................................................................................................................................... 5
3. Absolute Maximum ratings .......................................................................................................................................... 5
4. Pin definition and description ...................................................................................................................................... 6
5. Electrical characteristics ............................................................................................................................................... 7
6. Block diagram ............................................................................................................................................................... 8
7. Principle of operation ................................................................................................................................................... 9
7.1. Initialization ......................................................................................................................................................... 10
7.1.1. Reading configuration .................................................................................................................................. 11
7.2. Read measurement data (RAM data) .................................................................................................................. 12
7.2.1. PTAT data read ............................................................................................................................................. 12
7.2.2. IR data read .................................................................................................................................................. 12
7.3. Calculation ........................................................................................................................................................... 14
7.3.1. Calculation of absolute chip temperature Ta (sensor temperature) ........................................................... 14
7.3.2. Example for Ta calculations .......................................................................................................................... 15
7.3.3. Calculation of To........................................................................................................................................... 17
7.3.4. Example for To calculations.......................................................................................................................... 20
8. Detailed description, Block description...................................................................................................................... 23
8.1. Pixel position ....................................................................................................................................................... 23
8.2. MLX90621 address map ...................................................................................................................................... 24
8.2.1. RAM .............................................................................................................................................................. 24
8.2.2. Internal registers .......................................................................................................................................... 25
8.2.2.1 Configuration register (0x92) ..................................................................................................................... 25
8.2.2.2 Trimming register (0x93) ............................................................................................................................ 26
8.2.3. EEPROM........................................................................................................................................................ 26
8.3. POR ...................................................................................................................................................................... 28
8.4. ESD ...................................................................................................................................................................... 28
9. Communication protocol ........................................................................................................................................... 28
9.1. Communication pins ........................................................................................................................................... 28
9.2. Low level communication protocol ..................................................................................................................... 29
9.2.1. Start / Stop condition ................................................................................................................................... 29
9.2.2. Device addressing......................................................................................................................................... 29
9.2.3. Acknowledge ................................................................................................................................................ 29
9.2.4. Low level communication operation ............................................................................................................ 29
9.3. Device modes ...................................................................................................................................................... 30
9.3.1. Normal mode ............................................................................................................................................... 30
9.3.2. Step mode .................................................................................................................................................... 30
9.3.3. Power saving mode ...................................................................................................................................... 30
9.4. Communication to IR array ................................................................................................................................. 31
9.4.1. Start measurement command ..................................................................................................................... 31
9.4.2. Read command ............................................................................................................................................ 31
9.4.3. Write configuration register command ........................................................................................................ 32
9.4.4. Write trimming command ............................................................................................................................ 32
9.5. Communication to EEPROM ................................................................................................................................ 33
10. Performance Graphs ................................................................................................................................................ 34
10.1. Temperature accuracy of the MLX90621 .......................................................................................................... 34
10.2. Noise performance and resolution ................................................................................................................... 35
10.3. Field Of View (FOV) ........................................................................................................................................... 36
11. Applications Information.......................................................................................................................................... 37
2
11.1. Use of the MLX90621 thermometer in I C configuration ................................................................................. 37

MLX90621
16x4 IR array
Datasheet
12. Application Comments ............................................................................................................................................. 37

13. Standard information regarding manufacturability of Melexis products with different soldering processes ......... 39
14. ESD Precautions ....................................................................................................................................................... 39
15. FAQ ........................................................................................................................................................................... 40
16. Mechanical specification .......................................................................................................................................... 42
16.1. Package outline ................................................................................................................................................. 42
16.2. Part marking ...................................................................................................................................................... 43
17. References ................................................................................................................................................................ 44
18. Disclaimer ................................................................................................................................................................. 44

MLX90621
16x4 IR array
Datasheet
2. Glossary of terms
POR Power On Reset
PTAT Proportional To Absolute Temperature sensor (package temperature)
IR Infra Red
IR_data Infrared data (raw data from ADC proportional to IR energy received by the sensor)
ADC Analog To Digital Converter
Ta Ambient Temperature measured from the chip – (the package temperature)
To Object Temperature, ‘seen’ from IR sensor
TGC Temperature Gradient Coefficient
FOV Field Of View
nFOV Field Of View of N-th pixel
ESD Electro-Static Discharge
EMC Electro-Magnetic Compatibility
2
IC Inter-Integrated Circuit communication protocol
SDA Serial Data
SCL Serial Clock
FpS Frames per Second – data refresh rate
MD Master Device
SD Slave Device
TBD To Be Defined
NA Not Applicable
Table 1 Glossary of terms
3. Absolute Maximum ratings

Parameter MLX90621
Supply Voltage, VDD (over voltage) 5.5V
Supply Voltage, VDD (operating max) 3.6V
Reverse Voltage (each pin) -0.3 V
Operating Temperature Range, TA -40…+85°C
Storage Temperature Range, TS -40…+125°C
ESD Sensitivity (AEC Q100 002) 4kV
DC sink current, SDA 50 mA
DC source current, SDA NA (open drain)
DC clamp current, SDA 25 mA
DC source current, SCL NA (input only)
DC clamp current, SCL 25 mA
Table 2 Absolute maximum ratings for MLX90621
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.

MLX90621
16x4 IR array
Datasheet
4. Pin definition and description
Figure 1 Pin description
Pin Name Function

SCL Serial clock input for 2 wire communications protocol
SDA Digital input / output 2 wire communications protocol.
VDD External supply voltage
VSS Ground (case)
Table 3 Pin description for MLX90621

MLX90621
16x4 IR array
Datasheet
5. Electrical characteristics
All parameters are valid for TA = 25˚C, VDD =2.6V (unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Units
Supplies
1
External supply VDD 2.5 2.6 3.3 V
Supply current IDD No load 5 9 mA
Sleep current Islp No load 7 µA
Power On Reset
POR level VPOR_up Power-up (full temp range) 2 2.2 2.4 V
POR level VPOR_down Power –down (full temp range) 1.9 2.1 2.3 V
POR hysteresis VPOR_hys Full temp range 0.1 V
VDD rise time (10% to 90% of
specified supply voltage) TPOR Ensure POR signal 100 µs
2
I C compatible 2-wire interface Sensor chip
Slave address SA Factory default 60 hex
Input high voltage VIH (Ta, V) Over temperature and supply 0.7VDD V
Input low voltage VIL (Ta, V) Over temperature and supply 0.3VDD V
SDA over temperature and supply,
Output low voltage VOL 0.6 V
Isink = 6mA (FM mode)
SDA over temperature and supply,
Output low voltage VOL 0.4 V
Isink = 20mA (FM+ mode)
SCL leakage ISCL, leak VSCL=4V, Ta=+85°C 2 µA
SDA leakage ISDA, leak VSDA=4V, Ta=+85°C 2 µA
SCL capacitance CSCL Two dies MLX90670 + EEPROM 20 pF
2
I C clock frequency SCLIR MLX90621 (FM+ mode) 1 MHz
Acknowledge setup time Tsuac(MD) 8-th SCL falling edge, Master 0.45 µs
Acknowledge hold time Thdac(MD) 9-th SCL falling edge, Master 0.45 µs
Acknowledge setup time Tsuac(SD) 8-th SCL falling edge, Slave 0.45 µs
Acknowledge hold time Thdac(SD) 9-th SCL falling edge, Slave 0.45 µs
EEPROM
Slave address SA Factory default 50 hex
2
I C clock frequency SCLEEPROM EEPROM (FM mode) 400 kHz
Data retention Ta = +85°C 200 years
Erase/write cycles Ta = +25°C 1M Times
Erase/write cycles Ta = +125°C 100K Times
Erase cell time T_erase 5 ms
Write cell time T_write 5 ms
Table 4 Electrical specification parameters of MLX90621

1) The device can be supplied with VDD = 2.6…3.3V but the best performance is achieved at VDD=2.6V. For supply
voltages above 2.7V a compensation algorithm should be applied for compensating the temperature readings.

MLX90621
16x4 IR array
Datasheet
6. Block diagram
Digital Active Thermopile Array
Digital filtering
RAM
memory
Voltage
EEPROM I2C interface regulator
CLK SDA VSS VDD
Figure 2 Block diagram

The device consists of 2 chips packed in single TO-39 package
• IR array and processing electronics

• EEPROM chip

MLX90621
16x4 IR array
Datasheet
7. Principle of operation
The output of all IR sensors and absolute temperature sensors is scanned according to the programmed refresh rate.
Using their output data as well as calibration constants written in EEPROM the absolute chip temperature and object
temperature, ‘seen’ by each pixel can be calculated. For this goal several sequential calculations must be done
according to the Figure 3 Operation block diagram
POR (see 8.3)
Wait 5ms
Read the EEPROM table (see 8.2.3, 9.5)
Store the calibration coefficients in the MCU RAM for fast access
Write the oscillator trim value into the IO at address 0x93 (see 7.1, 8.2.2.2, 9.4.4)
Write the configuration value (IO address 0x92) (see 8.2.2.1, 9.4.3)
The value is either read from the EEPROM or hard coded externally
Set the POR/ Brown Out flag to “1” (bit 10 at address 0x92)
Yes POR/Brown Out flag cleared?

(see 8.2.2.1)
No
Read measurement data (PTAT + desired IR data)
(see 7.2.1, 7.2.2, 8.2.1, 9.4.2)
Calcullations (see 7.3)

Tambient calculation
Pixel offset cancelling
Thermal Gradient Compensation
Pixel to pixel normalization
Object emissivity compensation
Object temperature calculation
Image processing and correction
Figure 3 Operation block diagram

MLX90621
16x4 IR array
Datasheet
7.1. Initialization
After the POR is released the external MCU must execute an initialization procedure.
This procedure must start at least 5ms after POR release.
- Read the whole EEPROM (see Figure 4). For maximum speed performance MELEXIS recommends that
the whole calibration data is stored into the client MCU RAM. However it is possible to read the
calibration data from the EEPROM only when needed during calculations. This will result in increased
time for temperature calculation i.e. low refresh rate.
Slave address Command Slave address
Initial address - 0x00 DATA(0x00) DATA(0x01) DATA(0xFF)
NACK
SDA
S 1 0 1 0 0 0 0 W A 0 0 0 0 0 0 0 0 A S 1 0 1 0 0 0 0 R A A A P
SCL
Figure 4 Whole EEPROM dump (SA = 0x50, command = 0x00)
- Store the EEPROM content into customer MCU RAM – This step could be omitted resulting in more
data processing time because calibration data needs to be reread for each calculation
- Write the oscillator trimming value (extracted from EEPROM content at address 0xF7) into the
corresponding register (0x93).
Slave address Command
LSByte check MSByte check

LSByte data MSByte data
SDA (LSByte - 0xAA) (MSByte - 0xAA)
S 1 1 0 0 0 0 0 W A 0 0 0 0 0 1 0 0 A A A A A P
SCL
Figure 5 Write oscillator trimming (SA = 0x60, command = 0x04)

Example: If the value that has to be uploaded is 0x0052 the following sequence must be sent:
1. Start condition (Falling edge of SDA while SCL is high)
2. Slave address (SA=0x60) plus write bit = 0xC0
3. Command = 0x04
4. LSByte check = LSByte – 0xAA = 0x52 – 0xAA = 0xA8
5. LSbyte = 0x52
6. MSByte check = MSByte – 0xAA = 0x00 – 0xAA = 0x56
7. MSbyte = 0x00
8. Stop condition (Rising edge of SDA while SCL is high)
- Write device configuration value. In EEPROM addresses (0xF5 and 0xF6) MELEXIS provides a typical
value of the configuration register (0x463E). So it is up to the user to copy that value or hardcode a new
value to be loaded into the configuration register. If the EEPROM value is to be used the 16 bits are
combined as follows:
For example: if EEPROM 0xF5 = 0x3E and 0xF6 = 0x46, the Configuration register value is:
0 6: 0 5

MLX90621
16x4 IR array
Datasheet
LSByte check MSByte check MSByte data

LSByte data (9:8)
SDA (LSByte - 0x55) (MSByte - 0x55) (15:11)
S 1 1 0 0 0 0 0 W A 0 0 0 0 0 0 1 1 A A A A 1 A P
SCL
Figure 6 Write configuration register (SA = 0x60, command = 0x03)

NOTE: The user must ensure that the bit 10 (POR or Brown-out flag) in Configuration register is set to “1” by the
MD. Furthermore, this bit must be checked regularly and if it is cleared it indicates that the device has been reset
and the initialisation procedure must be redone.
Example: If the value that has to be uploaded is 0x463E the following sequence must be sent:
1. Start condition (Falling edge of SDA while SCL is high)
2. Slave address (SA=0x60) plus write bit = 0xC0
3. Command = 0x03
4. LSByte check = LSByte – 0x55 = 0x3E – 0x55 = 0xE9
5. LSbyte = 0x3E
6. MSByte check = MSByte – 0x55 = 0x46 – 0x55 = 0xF1
7. MSbyte = 0x46
8. Stop condition (Rising edge of SDA while SCL is high)
The default configuration is:

- IR and Ta refresh rate = 1Hz;
- Normal mode (no sleep);
2
- I C FM+ mode enabled (maximum bit transfer up to 1000 Kbit/s);
- ADC low reference enabled;
7.1.1. Reading configuration

7.1.1.1 Reading configuration register (EEPROM data)
Slave address Command Start address Address step Number of reads Slave address
Configuration value Configuration value

SDA LSByte MSByte
S 1 1 0 0 0 0 0 W A 0 0 0 0 0 0 1 0 A 1 0 0 1 0 0 1 0 A 0 0 0 0 0 0 0 0 A 0 0 0 0 0 0 0 1 A S 1 1 0 0 0 0 0 R A A A P
SCL
Figure 7 Reading configuration register (SA = 0x60, command = 0x02,

Start address = 0x92, Address step = 0x00, Number of reads = 0x01)
7.1.1.2 Reading oscillator trimming register (EEPROM data)

Oscillator trim value Oscillator trim value

SDA LSByte MSByte
S 1 1 0 0 0 0 0 W A 0 0 0 0 0 0 1 0 A 1 0 0 1 0 0 1 1 A 0 0 0 0 0 0 0 0 A 0 0 0 0 0 0 0 1 A S 1 1 0 0 0 0 0 R A A A P
SCL
Figure 8 Reading configuration register (SA = 0x60, command = 0x02,

Start address = 0x93, Address step = 0x00, Number of reads = 0x01)

MLX90621
16x4 IR array
Datasheet
7.2. Read measurement data (RAM data)

7.2.1. PTAT data read
Absolute ambient temperature data of the device itself (package temperature) can be read by using following
command:
PTAT data PTAT data

SDA LSByte MSByte
S1 1 0 0 0 0 0 WA 0 0 0 0 0 0 1 0 A 0 1 0 0 0 0 0 0 A 0 0 0 0 0 0 0 0 A 0 0 0 0 0 0 0 1 A S1 1 0 0 0 0 0 R A A A P
SCL
Figure 9 PTAT (SA = 0x60, command = 0x02, Start address = 0x40,

Address step = 0x00, Number of reads = 0x01) measurement result read
! : " !
7.2.2. IR data read

There are four options available for reading IR data: (See section 8.2.1 for an overview of the RAM addresses).
- Whole frame read (MELEXIS recommends the whole frame read for maximum refresh rate)
SDA
S 1 1 0 0 0 0 0 W A 0 0 0 0 0 0 1 0 A 0 0 0 0 0 0 0 0 A 0 0 0 0 0 0 0 1 A 0 1 0 0 0 0 0 0 A S 1 1 0 0 0 0 0 R A
SCL
IR pixel(0, 0) IR pixel(0, 0) IR pixel(1, 0) IR pixel(1, 0) IR pixel(3, 15) IR pixel(3, 15)

LSByte MSByte LSByte MSByte LSByte MSByte
A A A A A A P
Figure 10 Whole frame (SA = 0x60, command = 0x02, Start address = 0x00,
- Single column read
Slave address Command Address step Number of reads Slave address
Start address
SDA
S 1 1 0 0 0 0 0 W A 0 0 0 0 0 0 1 0 A A 0 0 0 0 0 0 0 1 A 0 0 0 0 0 1 0 0 A S 1 1 0 0 0 0 0 R A
SCL
IR pixel(0, column) IR pixel(0, column) IR pixel(1, column) IR pixel(1, column) IR pixel(3, column) IR pixel(3, column)
A A A A A A P
Figure 11 Single column (SA = 0x60, command = 0x02, Start address = 0x00…0x3C (step 0x04),

MLX90621
16x4 IR array
Datasheet
- Single line read
Start address
SDA
S 1 1 0 0 0 0 0 W A 0 0 0 0 0 0 1 0 A A 0 0 0 0 0 1 0 0 A 0 0 0 1 0 0 0 0 A S 1 1 0 0 0 0 0 R A
SCL
IR pixel(line, 0) IR pixel(line, 0) IR pixel(line, 1) IR pixel(line, 1) IR pixel(line, 15) IR pixel(line, 15)

A A A A A A P
Figure 12 Single line (SA = 0x60, command = 0x02, Start address = 0x00…0x03 (step 0x01),
- Single pixel read
IR pixel data IR pixel data

Start address
SDA LSByte MSByte
S 1 1 0 0 0 0 0 W A 0 0 0 0 0 0 1 0 A A 0 0 0 0 0 0 0 0 A 0 0 0 0 0 0 0 1 A S 1 1 0 0 0 0 0 R A A A P
SCL
Figure 13 Single pixel (SA = 0x60, command = 0x02, Start address = 0x00…0x3F,
- Compensation pixel read
PTAT data PTAT data

SDA LSByte MSByte
S 1 1 0 0 0 0 0 WA 0 0 0 0 0 0 1 0 A 0 1 0 0 0 0 0 1 A 0 0 0 0 0 0 0 0 A 0 0 0 0 0 0 0 1 A S1 1 0 0 0 0 0 R A A A P
SCL
Figure 14 Compensation pixel (SA = 0x60, command = 0x02, Start address = 0x41,
The 16bit data for each pixel is:
# ( , &) # ( , &)()*+,- : # ( , &).)*+,-

MLX90621
16x4 IR array
Datasheet
7.3. Calculation
7.3.1. Calculation of absolute chip temperature Ta (sensor temperature)
The output signal of the IR sensors is relative to the cold junction temperature. That is why we need to know the
temperature of the die in order to be able to calculate the object temperature ‘seen’ by each pixel.
The Ta can be calculated using the formula:
0123 4 5123
6
0 4126 892: (25) 0 _ =
/ 4 25, 8>=
2126
Constants VTH ( 25) , KT 1 and KT 2 are stored in EEPROM at following addresses as two’s complement values:
EEPROM address Cell name Stored as Parameter

0xDA VTH_L
2’s complement VTH0 of absolute temperature sensor
0xDB VTH_H
0xDC KT1_L
2’s complement KT1 of absolute temperature sensor
0xDD KT1_H
0xDE KT2_L
2’s complement KT2 of absolute temperature sensor
0xDF KT2_H
[7:4] – KT1_scale
0xD2 KT_scale unsigned
[3:0] – KT2_scale
Table 5 EEPROM parameters for Ta calculations
92: (25) 256 ∗ 92:_: 4 92:_.
# 92: (25) @ 32767 → 92: (25) 92: (25) 0 65536
92: (25)
92: (25)
2DEFGHIJKL-K8M:N=
123 256 ∗ 123_: 4 123_.
123 @ 32767 → 123 123 0 65536
123
123
2OOLPQ( RST68U:N= ∗ 2DEFGHIJKL-K8M:N=
126 256 ∗ 126_: 4 126_.
126 @ 32767 → 126 126 0 65536
126
126
2 OOLPQ( RST68D:R=V3R ∗ 2DEFGHIJKL-K8M:N=

MLX90621
16x4 IR array
Datasheet
7.3.2. Example for Ta calculations

Let’s assume that the values in EEPROM are as follows
(Derived using maximum resolution – ConfigRegister[5:4] = 11b):
Cell values
EEPROM address Cell name
(hex)
0xDA VTH_L 0x20
0xDB VTH_H 0x64
0xDC KT1_L 0x89
0xDD KT1_H 0x55
0xDE KT2_L 0x7E
0xDF KT2_H 0x5E
0xD2 KT_scale 0x8B
Table 6 EXAMPLE for Ta calibration values
Let’s assume that the maximum resolution is set in the configuration register:
ConfigRegister[5:4] = 11b
92: (25) 256 ∗ 92:_: 4 92:_. 256 ∗ 100 4 32 25632
Sign check: 25632 X 32768 → 92: (25) 25632

92: (25) 25632
92: (25) 25632
2 DEFGHIJKL-K8M:N= 2DED
123 256 ∗ 123Z 4 123[ 256 ∗ 85 4 137 21897
Sign check: 21897 X 32768 → 123 21897
123 21897
123 85.53515625
2OOLPQ( RST68U:N= ∗ 2DEFGHIJKL-K8M:N= 2] ∗ 2DED
126 256 ∗ 126Z 4 126[ 256 ∗ 94 4 126 24190
Sign check: 24190 X 32768 → 126 24190
_à 6N3wR
126 0.01153469085
6bbcdef ghia8j:g=klg ∗6jmnopqrscts8u:v= 6llklg ∗6jmj

MLX90621
16x4 IR array
Datasheet
Let’s assume that the input data is:
PTAT _ data = 0x67DE = 26590 dec
Thus the ambient temperature is:
a EN_ 8y
E_`l Vx_`l à `Z (6M)EP2z2_{/,/=
/ 4 25
6_à
E]M.MDM3M|6MV5UD3|.6|6wMNU3EN∗R.R33MDN|wR]M∗86M|D6 E6|MwR=
/ 4 25
R.R6DR|wD]3U
E]M.MDM3M|6MV5UD3|.6|6wMNU3ER.RN|3D]U|DN∗(EwM])
/ 4 25
R.R6DR|wD]3U
E]M.MDM3M|6MV√UD|R.N|D]wRRM E]M.MDM3M|6MV]M.UwD3NMwD]|
/ 4 25 ≈ 4 25 ≈ 11.1832077 4 25
R.R6DR|wD]3U R.R6DR|wD]3U
/ ≈ 36.18 >
The calculated values for the different resolution settings are given in the table below:
ConfigRegister[5:4]
PTAT data (hex) VTH(25) KT1 KT2 Ta, °C
(bin)
00 0x0CFB 3323.750 10.69189453125 0.0014418363571167 36.18
01 0x19F7 6647.500 21.38378906250 0.0028836727142334 36.18
10 0x33EF 13295.000 42.76757812500 0.0057673454284668 36.18
11 0x67DE 26590.000 85.53515625000 0.0115346908569336 36.18
Table 7 Calculated values at different resolution settings

MLX90621
16x4 IR array
Datasheet
7.3.3. Calculation of To
Following formula is used to calculate the temperature seen by specific pixel in the matrix:
v y€c(r,•)
Q(J,•) x… nefdb‚ƒ„`bi
4 / _v 0 273.15, 8° =
†o‡ˆ(r,•) ∗(3E_‰v ∗6UD.3M)V)h(r,•)
Where:
9ŠL(J,•)_FQ(PO‹)z2OT is the parasitic free IR compensated signal as calculated in 7.3.3.1
Œ•GŽ•(J,•) is the compensated sensitivity coefficient for each pixel
1•N is the compensation factor for the sensitivity – for BAB and BAD, 1•N 0, resulting in a simplified
formula
/ _v ( / 4 273.15)N where / is the ambient temperature calculated in 7.3.2
S(J,•) 1 4 ∗5
4
Œ‘ ’“( ,&)
3 ∗ 9# ( ,&) ” •– •—
4 Œ‘ ’“( ,&)
4 ∗ 14
7.3.3.1 Calculating VIR(I,j)_COMPENSATED

1. Offset compensation
9ŠL(J,•)eqq‰tño‡ˆtp‰™˜tš 9ŠL(J,•) 0 › J(J,•) 4 J(J,•) ∗( / 0 /R )œ
Where:
9ŠL(J,•) is an individual pixel IR_data readout (RAM read)
J(J,•) is an individual pixel offset restored from the EEPROM using the following formula:
∆„r
z†o‡‡op V∆zr(r,•) ∗6 ‰†™žt
J(J,•) 6jmnopqrscts8u:v=
•GŽŽGH is the minimum offset value stored in the EEPROM at addresses 0xD0 and
0xD1 as 2’s complement value
∆ J is the difference between the individual offset and the minimum value. It is stored in
the EEPROM as unsigned values.
∆ J‰†™žt is the scaling coefficient for the ∆ J values and is stored in the EEPROM at
address 0xD9[7:4] as an unsigned value
J(J,•) is an individual pixel offset slope coefficient
*r(r,•)
bbdcef
J(J,•) Ÿr
6 ‰†™žt ∗6jmnopqrscts8u:v=
J(J,•)bbdcef is the value stored in EEPROM as two’s complements

MLX90621
16x4 IR array
Datasheet
J‰†™žt is a scaling coefficient for the slopes of IR pixels offset and is stored in the EEPROM at
address 0xD9[3:0] as an unsigned value
/ is the ambient temperature calculated in 7.3.2
/R 25> is a constant
NOTE: This applies to the compensation pixel as well ( FP and FP while J‰†™žt is the same) with the only
difference being that FP is stored in the EEPROM at addresses 0xD3 and 0xD4 as an unsigned value but not
calculated
2. Thermal Gradient Compensation (TGC)
9ŠL(J,•)` nno‡ˆtp‰™˜tš
9ŠL(J,•)_QII•-,FGŽ•-H•/,-{ 0 ¡ ∗ 9ŠL••eqq‰tño‡ˆtp‰™˜tš
Where:
9ŠL••eqq‰tño‡ˆtp‰™˜tš is the offset compensated IR signal of the thermal gradient compensation

pixel
2¢Fbbdcef
¡
D6
¡ OOPLQ( is a coefficient stored at EEPROM address 0xD8 as a two’s complement value
3. Emissivity compensation
y€c(r,•)
9ŠL(J,•)nefdb‚ƒ„`bi
` nno‡ˆtp‰™˜tš
£
Where:
¤ is the emissivity coefficient. The scaled value is stored into EEPROM as unsigned value
6M|∗£Z V£[
¤
D6U|]
7.3.3.2 Calculating ¥¦§¨©(ª,«)

Œ•GŽ•(J,•) ¬1 4 1 ∗( / 0 /R )- ∗ ¬Œ(J,•) 0 ¡ ∗ ŒFP -
Where:
/ is the ambient temperature calculated in 7.3.2
/R is a constant = 25°C
1 is Ta dependence of Œ•GŽ•(J,•) stored in EEPRPOM at addresses 0xE6 and 0xE7 as two’s

complement value and the scale coefficient is fixed to be 20.
6M|∗_•2/Z V_•2/[
1
6ag
au®∗¯oZ k¯g ∆¯(r,•)

[V
¯
a g‰†™žt a∆¯‰†™žt
Œ(J,•)
6jmnopqrscts8u:v=

MLX90621
16x4 IR array
Datasheet
6M|∗…ndZ V…nd[
ŒFP ¯
6 g‰†™žt ∗6jmnopqrscts8u:v=
ŒGZ , ŒR[ , ŒFPZ , ŒFP[ , ∆Œ(J,•) , ŒR‰†™žt and ∆Œ••/°- are stored in the EEPROM as unsigned values
7.3.3.1 Calculating ±²³

_‰v_bb
1•N , stored in EEPRPOM at addresses 0x9E as two’s complement value
6(´‰ _‰†™žtkµ)
All parameters necessary to calculate To are stored into EEPROM at following addresses:
EEPROM
Cell name Stored as Parameter
address
0x00…0x3F ∆ J unsigned IR pixel individual offset delta coefficient
Individual Ta dependence (slope)
0x40…0x7F J(J,•) 2’s complement
of IR pixels offset
0x80…0xBF ∆Œ(J,•) unsigned Individual sensitivity coefficient
[7:4] – NA
0xC0 Ks_scale unsigned
[3:0] – Ks_scale - 8
0xC4 1•N_OO 2’s complement Sensitivity To dependence (slope)
0xD0 •GŽŽGH[
2’s complement IR pixel common offset coefficient
0xD1 •GŽŽGHZ
0xD3 FP[
2’s complement Compensation pixel individual offset coefficient
0xD4 FPZ
Individual Ta dependence (slope)
0xD5 FP 2’s complement
of the compensation pixel offset
0xD6 ŒFP[
ŒFPZ
unsigned Sensitivity coefficient of the compensation pixel
0xD7
0xD8 ¡ 2’s complement Thermal gradient coefficient
∆ J‰†™žt ,
[7:4] – Scaling coeff for the IR pixels offset [3:0] –
0xD9 J‰†™žt unsigned
Scaling coeff of the IR pixels offset Ta dependence
0xE0 ŒR[
ŒRZ
unsigned Common sensitivity coefficient of IR pixels
0xE1
0xE2 ŒR‰†™žt unsigned Scaling coefficient for common sensitivity
0xE3 ∆Œ••/°- unsigned Scaling coefficient for individual sensitivity
0xE4 ¤.
¤:
unsigned Emissivity
0xE5
0xE6 1 .
1
2’s complement KsTa (fixed scale coefficient = 20)
0xE7 :
Table 8 EEPROM parameters for To calculations

MLX90621
16x4 IR array
Datasheet
7.3.4. Example for To calculations

Let’s assume that we have following EEPROM data for pixel i=2, j=8:
EEPROM
Cell name Stored as Cell values (hex)
address
0x22 ∆ J unsigned 0x21
0x62 J(J,•) 2’s complement 0xBC
0xA2 ∆Œ(J,•) unsigned 0xCD
0xC0 Ks_scale unsigned 0x99
0xC4 1•N 2’s complement 0x9E
0xD0 •GŽŽGH[ 0x8A
2’s complement
0xD1 •GŽŽGHZ 0xFF
0xD3 FP[ 0x9D
2’s complement
0xD4 FPZ 0xFF
0xD5 FP 2’s complement 0xA2
0xD6 ŒFP[ 0xA8
ŒFPZ
unsigned
0xD7 0x0F
0xD8 ¡ 2’s complement 0x18
0xD9 ∆ J‰†™žt , J‰†™žt unsigned 0x07
0xE0 ŒR[ 0xAE
ŒRZ
unsigned
0xE1 0x4E
0xE2 ŒR‰†™žt unsigned 0x26
0xE3 ∆Œ••/°- unsigned 0x1F
0xE4 ¤. 0x00
¤:
unsigned
0xE5 0x80
0xE6 1 . 0x0C
1
2’s complement
0xE7 : 0x02
Table 9 EXAMPLE for To calibration values
Let’s assume that we have the following input data:
9ŠL(6,]) 0 01 7 439, decimal value
Sign check 439 X 32768 → 9ŠL(6,]) 439 LSB
9FP 0 — 65500, decimal value (compensation pixel readings)
Sign check 65500 @ 32767 → 9FP 65500 0 65536 036 LSB
/ ≈ 36.18 > (as calculated in 7.3.2)

MLX90621
16x4 IR array
Datasheet
Reference routine for To computation:
v y€c(r,•)
Q(J,•) x… nefdb‚ƒ„`bi
4 / _v 0 273.15, 8° =
†o‡ˆ(r,•) ∗(3E_‰v ∗6UD.3M)V)h
9ŠL(6,])eqq‰tño‡ˆtp‰™˜tš 9ŠL(6,]) 0 › J(6,]) 4 J(6,]) ∗( / 0 /R )œ
∆„r
z†o‡‡op V∆zr(a,µ) ∗6 ‰†™žt
J(6,]) 6(jmnopqrscts8u:v=)
•GŽŽGH 256 ∗ •GŽŽGHZ 4 •GŽŽGH[ 256 ∗ 255 4 138 65418 LSB decimal value
Sign check 65418 @ 32767 → •GŽŽGH 65418 0 65536 0118 LSB
∆ J 33 LSB
∆„r
z†o‡‡op V∆zr(a,µ) ∗6 ‰†™žt E33]VDD∗6g
J(6,]) 085 LSB
6(jmnopqrscts8u:v=) 6(jmj)
*r(a,µ)
J(6,]) Ÿ
6 r‰†™žt ∗6(jmnopqrscts8u:v=)
J(6,])_OO 188
Sign check 188 @ 127 → J(6,]) 188 0 256 068
*r(a,µ) E|]
J(6,]) Ÿr 00.53125
6 ‰†™žt ∗6(jmnopqrscts8u:v=) 6· ∗6(jmj)
9ŠL(6,])eqq‰tño‡ˆtp‰™˜tš 439 0 ¬085 0 0.53125 ∗ (36.18 0 25)- ≈ 529.939375 LSB
FP 256 ∗ FPZ 4 FP[ 65437 , decimal value
Sign check 65437 @ 32768 → FP 65437 0 65536 099 LSB
znd Eww
FP 099
6(jmnopqrscts8u:v=) 6(jmj)
FP_OO 162
Sign check 162 @ 127 → FP 162 0 256 094
*nd EwN
FP Ÿ 00.734375
6 r‰†™žt ∗6(jmnopqrscts8u:v=) 6· ∗6(jmj)
9ŠLFPeqq‰tño‡ˆtp‰™˜tš 9FP 0 ¬ FP 4 FP ∗( / 0 /R )- 036 0 (099 0 0.734375 ∗ (36.18 0 25))
9ŠLFPeqq‰tño‡ˆtp‰™˜tš ≈ 71.2103125 LSB
¡ OOPLQ( 0 18 24, decimal value
Sign check 24 X 128 → ¡ _•• ” 24

MLX90621
16x4 IR array
Datasheet
2¢Fbbdcef 6N
¡ 0.75
D6 D6
9ŠL(6,])` nno‡ˆtp‰™˜tš
9ŠL(6,])_QII•-,FGŽ•-H•/,-{ 0 ¡ ∗ 9ŠL••eqq‰tño‡ˆtp‰™˜tš
9ŠL(6,])` nno‡ˆtp‰™˜tš
529.939375 0 0.75 ∗ 71.2103125 ≈ 475.531640625 LSB
6M|∗£Z V£[ 6M|∗36]VR D6U|]

¤ 1
D6U|] D6U|] D6U|]
y€c(a,µ)
9ŠL(6,])nefdb‚ƒ„`bi 476.531640625 LSB
` nno‡ˆtp‰™˜tš
£
Œ•GŽ•(6,]) ¬1 4 1 ∗( / 0 /R )- ∗ ¬Œ(6,]) 0 ¡ ∗ ŒFP -
1 256 ∗ 1 : 41 . 256 ∗ 2 4 12 524 , decimal value
Sign check 524 @ 32768 → FP 524 LSB
M6N
1 4.9972534.10EN decimal value
6ag
au®∗¯oZ k¯g[ ∆¯(a,µ)

V ∆¯ au®∗·µkl·v agu aglva agu
¯ V jl V
a g‰†™žt
Œ(6,]) a ‰†™žt ajµ a ajµ ajl
≈ 1.68736733031.10EU
6(jmnopqrscts8u:v=) 6(jmj) 6(jmj)
6M|∗…ndZ V…nd[ 6M|∗3MV3|] NRR]

ŒFP ¯ ≈ 1.45810190588.10E]
6 g‰†™žt ∗6jmnopqrscts8u:v= 6jµ ∗6(jmj) 6jµ
Œ•GŽ•(6,]) ¬1 4 4.9972534.10EN ∗ (36.18 0 25)- ∗ (1.68736733031.10EU 0 0.75 ∗ 1.45810190588.10E] )
Œ•GŽ•(6,]) 1.58682591595. 10EU
1•N 158 decimal value
Sign check 158 @ 127 → 1•N 158 0 256 098
_‰v Ew]
1•N 07.476806640625. 10EN
6(´‰ _‰†™žtkµ) 6(¸kµ)
/ _v ( / 4 273.15)N (36.18 4 273.15)N 9155628583
v
S 1)N ∗ xŒ•GŽ•(6,]) D ∗ 9ŠL(6,])nefdb‚ƒ„`bi 4 Œ•GŽ•(6,]) N ∗ / _v
07.476806640625. 10EN ∗ 5(1.58682591595. 10EU )D ∗ 476.531640625 4 (1.58682591595. 10EU )N ∗ 9155628583

v
S
S 03.93973510355. 10E]
v y€c(a,µ)
Q(6,]) x… nefdb‚ƒ„`bi
4 / _v 0 273.15 °C
†o‡ˆ(a,µ) ∗(3E_‰v ∗6UD.3M)V)h
NU|.MD3|NR|6M
x3.M]|]6Mw3MwM.3Rm·∗(3E(EU.NU|]R||NR|6M.3Rmv)∗6UD.3M)V(ED.wDwUDM3RDMM.3Rmµ) 4 9155628583 0 273.15 °C
v
Q(6,])
Q(6,]) 59.8546263694257 ≈ 59.85 °C

MLX90621
16x4 IR array
Datasheet
The calculated values for the different resolution settings are given in the table below:
ConfigRegister[5:4] (bin) ¹º»(¼,½) ¹¾¿ ¹º»(¼,½)¾ÀÁ¿ÂÃÄÅÆÂÇ ¥¦§¨©(¼,½) ÄÈ To, °C

00 0x0036 0xFFFB 59.066455078125 1.98353239494464E-08 -4.9221144181793E-09 59.67
01 0x006D 0xFFF7 118.38291015625 3.96706478988929E-08 -9.8455068127298E-09 59.72
10 0x00DB 0xFFEE 237.7658203125 7.93412957977857E-08 -1.9696122547076E-08 59.81
11 0x01B7 0xFFDC 476.531640625 1.58682591595571E-07 -3.9397351035512E-08 59.85
Table 10 Calculated values at different resolution settings
8. Detailed description, Block description

8.1. Pixel position
The array consists of 64 IR sensors (also called pixels). Each pixel is identified with its row and column position as
Pix(i,j) where i is its row number (from 0 to 3) and j is its column number (from 0 to 15)
Reference pin
Row 0
Row 1
Row 2
Row 3
Col 10
Col 11
Col 12
Col 13
Col 14
Col 15
Col 0
Col 1
Col 2
Col 3
Col 4
Col 5
Col 6
Col 7
Col 8
Col 9
Figure 15 Pixel position in the whole FOV

MLX90621
16x4 IR array
Datasheet
8.2. MLX90621 address map

The MLX90621 address map is shown below:
0x00
RAM
0x41
0x42
Not used
0x91
0x92
Configuration registers
0x93
0x93
Not used
0xFF
Figure 16 Address map
8.2.1. RAM
2
The on chip 146x16 RAM is accessible for reading via I C. The RAM is used for storing the results of measurements of
pixels and Ta sensor and is distributes as follows:
• 64 words for IR sensors. The data is in 2’s complement format (see 7.2.2)
• 1 word for measurement result of PTAT sensor. The data is 16 bit without sign. (see 7.2.1)
The memory map of the RAM is shown below:
RAM Address RAM variable description

0x00 IR sensor (0,0) result
… …
0x3B IR sensor (3,14) result
0x3C IR sensor (0,15) result
0x3D IR sensor (1,15) result
0x3E IR sensor (2,15) result
0x3F IR sensor (3,15) result
0X40 PTAT sensor result
0x41 Compensation pixel result
Table 11: Result address map
For IR sensors results, the addressing can be summarized:
IR(x,y) is on address:
IR( x, y)address = x + 4. y

MLX90621
16x4 IR array
Datasheet
8.2.2. Internal registers

8.2.2.1 Configuration register (0x92)
The configuration register defines the chip operating modes.
2
It can be read and written by the I C MD.
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Configuration register bit meaning (0x92)

0 0 0 0 - IR Refresh rate = 512Hz
1 1 1 0 - IR Refresh rate = 1Hz (default)
1 1 1 1 - IR Refresh rate = 0.5Hz
0 0 ADC set to 15 bit resolution*1
0 - Continuous measurement mode (default)
1 - Step mode
0 - Normal operation mode (default)
1 - Sleep mode
x - NA
0 - No IR measurement running (flag only cannot be written)
1 - IR measurement running (flag only cannot be written)
0 - POR or Brown-out occurred - Need to reload Configuration register
1 - MD must write "1" during uploading Configuration register (default)
0 - I2C FM+ mode enabled (max bit transfer rates up to 1000 kbit/s) (default)
1 - I2C FM+ mode disabled (max bit transfer rates up to 400 kbit/s)
0 - EEPROM enabled
1 - EEPROM disabled
0 - Melexis reserved
0 - ADC high reference enabled*2
1 - ADC low reference enabled (default)
0 - Melexis reserved
Table 12: Configuration register bit meaning

*1 – does not impacting the calibration of the device (may be changed and the calibration remain valid)
*2 – does impact the calibration of the device (if changed the calibration is no longer valid)

MLX90621
16x4 IR array
Datasheet
8.2.2.2 Trimming register (0x93)

2
It can be read and written by the I C MD.
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Trimming register bit meaning (0x93)

7 bit value - Oscillator trim value
x x x x x x x x x NA
Table 13 Oscillator trim bit meaning
8.2.3. EEPROM
2
A 2kbit, organized as 256x8 EEPROM is built in the Mlx90621. The EEPROM has a separate I C address SA=0x50 and is
used to store the calibration constants and the configuration of the device.
Address 0 1 2 3 4 5 6 7
00 ΔAi (0,0) ΔAi (1,0) ΔAi (2,0) ΔAi (3,0) ΔAi (0,1) ΔAi (1,1) ΔAi (2,1) ΔAi (3,1)
08 …
10
18
ΔAi - IR pixels individual offset coefficients
20
28
30 …
38 ΔAi (0,14) ΔAi (1,14) ΔAi (2,14) ΔAi (3,14) ΔAi (0,15) ΔAi (1,15) ΔAi (2,15) ΔAi (3,15)
40 Bi (0,0) Bi (1,0) Bi (2,0) Bi (3,0) Bi (0,1) Bi (1,1) Bi (2,1) Bi (3,1)
48 …
50
58
Bi - Individual Ta dependence (slope) of IR pixels offset
60
68
70 …
78 Bi (0,14) Bi (1,14) Bi (2,14) Bi (3,14) Bi (0,15) Bi (1,15) Bi (2,15) Bi (3,15)
80 Δα (0,0) Δα (1,0) Δα (2,0) Δα (3,0) Δα (0,1) Δα (1,1) Δα (2,1) Δα (3,1)
88 …
90
98
Individual sensitivity coefficients
A0
A8
B0 …
B8 Δα (0,14) Δα (1,14) Δα (2,14) Δα (3,14) Δα (0,15) Δα (1,15) Δα (2,15) Δα (3,15)
C0 Ks_scales reserved reserved reserved 1•N reserved reserved reserved
C8 reserved reserved reserved reserved reserved reserved reserved
D0 A common KT scale Compensation pixel coefficients
D8 TGC Scale offset PTAT
E0 Common sensitivity coefficients Emissivity KsTaL KsTaH
E8 MELEXIS reserved
F0 MELEXIS reserved Configuration register OSC trim
F8 Chip ID
Table 14: EEPROM map

MLX90621
16x4 IR array
Datasheet
Detailed descriptions of some of the EEPROM addresses are described here after:
C7 C6 C5 C4 C3 C2 C1 C0 EEPROM cell meaning

Ks_scale [7:4] - reserved
[3:0] - Ks_scale - 8
- MLX reserved
Table 15: C0…C7 EEPROM cell meaning
D7 D6 D5 D4 D3 D2 D1 D0 EEPROM cell meaning

AcommonH AcommonL - common offset
KT scale [7:4] - KT1 scale
[3:0] - KT2 scale -10
ACPH ACPL - Compensation pixel individial offset
BCP - Individual Ta dependence (slope) of the compensation pixel offset
ΔαCP_H ΔαCP_L - Sensitivity coefficient of the compensation pixel
Table 16: D0…D7 EEPROM cell meaning
DF DE DD DC DB DA D9 D8 EEPROM cell meaning

TGC - Thermal Gradien Coefficient
Offset scale [7:4] - Aiscale
[3:0] - Biscale
Vth_H Vth_L - Vth0 of absolute temperatire sensor
KT1_H KT1_L - KT1 of absolute temperature sensor
KT2_H KT2_L - Kt2 of absolute temperatire sensor
Table 17: DF…D8 EEPROM cell meaning
E7 E6 E5 E4 E3 E2 E1 E0 EEPROM cell meaning
α0_H α0_L - Common sensitivity coefficient

α0_scale - Common sensitivity scaling coefficient
Δαscale - Individual sensitivity scaling coefficient
ε_H ε_L - Emissivity coefficient
MELEXIS reserved - MELEXIS reserved
Table 18: E7…E0 EEPROM cell meaning
F7 F6 F5 F4 F3 F2 F1 F0 EEPROM cell meaning

MELEXIS reserved - MELEXIS reserved
CFG_H CFG_L - Config register value
OSC_trim - Oscillator trimming value
Table 19: F7…F0 EEPROM cell meaning

MLX90621
16x4 IR array
Datasheet
8.3. POR
The Power On Reset (POR) is connected to the Vdd supply. The on-chip POR circuit provides an active level of the
POR signal when the Vdd voltage rises above approximately 0.5V and holds the entire Mlx90621 in reset until the
Vdd is higher than 2.4V. The device will start approximately 5ms after the POR release.
8.4. ESD
ESD, 4KV Human Body Model (please check with electrical specification)
9. Communication protocol
2
The device supports Fast Mode Plus I C FM+ (IR array only up to 1MHz while the EEPROM can handle only up to 400
kHz) and will work in slave mode only.
The master device must provide the clock signal (SCL) for the communication. The data line SDA is bidirectional and
is driven by the master or the slave depending on the command. The selection of the SDA occupant is done
2
according to the I C specification. As the SDA is an open-drain IO, ‘0’ is transmitted by forcing the line ‘LOW’ and a
‘1’ just by releasing it. During data transfer, the data line could be changed only while SCL is low. Otherwise, it would
be interpreted as a start/stop condition
9.1. Communication pins

There are two communication pins SCL and SDA. SCL is an input only for the MLX90621 while the SDA pin is a
bidirectional one. The SDA line should be wired in an open-drain configuration.
90620
90621
90670
scl_in
sda_out
90670
+VDD Digital
external Block
sda_in
Rp Rp
SCL SCL
SCL (Serial Clock Line )
SDA SDA
SDA (Serial data Line )
24AA02
External I2C
Master
Figure 17 Communication pin diagram

MLX90621
16x4 IR array
Datasheet
9.2. Low level communication protocol

9.2.1. Start / Stop condition
Each communication session is initiated by a START condition and ends with a STOP condition. A START condition is
initiated by a HIGH to LOW transition of the SDA while a STOP is generated by a LOW to HIGH transition. Both
changes must be done while the SCL is HIGH (see the figure)
SCL
SDA
START
STOP
2
Figure 18: Start / Stop conditions of I C
9.2.2. Device addressing

The master is addressing the slave device by sending a 7-bit slave address after the START condition. The first seven
th
bits are dedicated for the address and the 8 is Read/Write (R/W) bit. This bit indicates the direction of the transfer:
• Read (HIGH) means that the master will read the data from the slave
• Write (LOW) means that the master will send data to the slave
Mlx90621 is responding to 2 different slave addresses:
1 0 1 0 0 0 0 R/W
for access to internal EEPROM
1 1 0 0 0 0 0 R/W
For access to IR array data
2
Figure 19: I C addresses
9.2.3. Acknowledge
th
During the 9 clock following every byte transfer the transmitter releases the SDA line. The receiver acknowledges
(ACK) receiving the byte by pulling SDA line to low or does not acknowledge (NoACK) by letting the SDA ‘HIGH’.
9.2.4. Low level communication operation

The low level operation communication is based on 8bits (1byte) transmissions. This includes start/stop event,
acknowledgement and errors detection.
I2C
transmission
S
S
T
T
A
O
R
8 Bits P
T A
C
K
2
Figure 20: I C communication

MLX90621
16x4 IR array
Datasheet
9.3. Device modes

The device can operate in following modes:
• Normal mode
• Step mode
• Power saving mode
9.3.1. Normal mode

In this mode the measurements are constantly running. Depending on the selected frame rate Fps in the
configuration register, the data for IR pixels and Ta will be updated in the RAM each 1/Fps seconds. In this mode the
external microcontroller has full access to the internal registers and memories of the device (both for 90670 and the
EEPROM chip).
9.3.2. Step mode

This mode is foreseen for single measurements triggered by an external device (microcontroller). Entering this mode
is possible by writing the appropriate code in the configuration register. A measurement is triggered by sending the
command StartMeas (see 9.4.1). On detecting the command, the Mlx90621 will start the measurements
2
immediately after the I C session is finished (STOP condition detected).
3
The measurement time is
Éˆ‰
While the Step mode measurement is ongoing all ‘start new measurement in step mode’ commands will be
acknowledged but not executed. All other valid commands are executed accordingly.
A flag bit in Configuration register (bit 0x09) is dedicated in order to be able to check whenever the measurement is
done.
Start Meas SDA

S 1 1 0 0 0 0 0 W A 0 0 0 0 0 0 0 1 A 0 0 0 0 1 0 0 0 A P
SCL
Figure 21 Write configuration register (SA = 0x60, command LSByte = 0x01 command MSByte = 0x08)
9.3.3. Power saving mode

In this mode the device will be completely shut down and the current consumption will be minimized to less than
6µA. Entering this mode is initiated by writing ‘1’ in the configuration register bit 7. Upon receiving it the device will
2
shut down all electronics, including the internal oscillator. The chip will monitor the I C line. Each START condition
will wake up the oscillator and the chip will receive and evaluate the slave address. If the address is 0x60 (address
programmed in Mlx90621) the device will evaluate the whole command and will execute it. If not, the oscillator will
be switched off again.

MLX90621
16x4 IR array
Datasheet
9.4. Communication to IR array

9.4.1. Start measurement command
Opcode – 0x01 (LSByte), 0x08 (MSByte).
This command is used to start measurement cycle in step mode.
Start Meas Start Meas

Slave address
S LSByte Opcode MSByte Opcode
S
T
T
A
O
R
0 A P
T A A
C C C
K K K
Figure 22: Start measurement command structure
9.4.2. Read command
Opcode – 0x02.
The read command is used to read measurement, configuration and other data from the chip to the external master.
The read command has the following parameters:
- Start address – 8bits. Address in the chip address space (0 to 255). It is the address of the first word read.
- Address step – 8bits. On every read word the next address is formed by adding the address step to the current
address.
- Number of reads – 8bits. Number of the words to be read.
Different combinations are possible in order to read all, one line, one column, one exact pixel of the IR or Ta sensors.
They are summarized in the table below:
Sensors read Start address Address step Number of reads

All IR 0x00 0x01 0x40
One line IR(i) i 0x04 0x10
One column IR(j) j*0x04 0x01 0x04
One pixel IR(i,j) I + j*0x04 0x00 0x01
Table 20 RAM readout options
Start address Address step Number reads Read Word0 Read Word0 Read WordN Read WordN
Slave address
Slave address Read Opcode parameter parameter parameter LSByte MSByte LSByte MSByte
S S
S
T T
T
A A
O
R R
0 A 1 P
T A A A A T A A A A A
C C C C C C C C C C
K K K K K K K K K K
Read N 16bit words
Figure 23: RAM readout command structure

MLX90621
16x4 IR array
Datasheet
9.4.3. Write configuration register command
Opcode – 0x03.
This command is used to set the configuration register (16bits) value – all configuration settings.
Each data byte is transmitted in two stages:
- First stage Data byte - 0x55
- Second stage Data byte
This way of transmitting the data is done in order to have a simple error check.
The chip adds 0x55 to the first byte and compares the result with the second one. If both match the configuration
register is updated.
Figure 24: Configuration register update command structure
9.4.4. Write trimming command
Opcode – 0x04.
This command is used to set the oscillator trimming oscillator trimming value.
This command is used to set the oscillator trimming register (16bits) value.
Each data byte is transmitted in two stages:
- First stage Data byte - 0xAA
- Second stage Data byte
This way of transmitting the data is done in order to have a simple error check.
The chip adds 0xAA to the first byte and compares the result with the second one. If both match the oscillator
trimming register is updated.
Write trimming Trimming data check Trimming data Trimming data check Trimming data
Slave address opcode LSByte LSByte MSByte MSByte
S
S
T
T
A
O
R
0 A A A A A A P
T
C C C C C C
K K K K K K
Figure 25: Oscillator trimming register update command structure

MLX90621
16x4 IR array
Datasheet
9.5. Communication to EEPROM

See datasheet of 24AA02. This can be found at
https://www.melexis.com/en/product/mlx90621/far-infrared-sensor-array-high-speed-low-noise

MLX90621
16x4 IR array
Datasheet
10. Performance Graphs

10.1. Temperature accuracy of the MLX90621
All accuracy specifications apply under settled isothermal conditions only.
Furthermore, the accuracy is only valid if the object fills the FOV of the sensor completely.
To, °C
300°C
(Uniformity ±1°C ±1.5%*|To-Ta|)
200°C
±4°C ±3% * |To-Ta|
±1°C ±3% * |To-Ta| ±2.5°C ±3%* |To-Ta|

(Uniformity ±1°C ±1.5%*|To-Ta|) (Uniformity ±1°C
±1.5%* |To-Ta|)
100°C
Ta, °C
0°C
±5.5°C ±3°C ±5% * |To-Ta| ±4°C ±5% * |To-Ta|
-20°C
-20°C 0°C 50°C 85°C
Figure 26: Absolute temperature accuracy for the central four pixels
All accuracy specifications apply under settled isothermal conditions only.
NOTE:
1) The accuracy is specified for the four central pixels. The accuracy of the rest of the pixels is according to the
uniformity statement
2) As a result of long term (years) drift there can be an additional measurement deviation of ± 3°C for object
temperatures around room temperature.

MLX90621
16x4 IR array
Datasheet
10.2. Noise performance and resolution

There are two bits in the configuration register that allow changing the resolution of the MLX90621 measurements.
Increasing the resolution decreases the quantization noise and improves the overall noise performance.
Measurement conditions for the noise are: To=Ta=25°C
NOTE: It is normal that the noise will decrease for high temperature and increase for lower temperatures
Central pixels RMS noise at different refresh rates and

maximum resolution (Configuration register[5:4] = 11b)
3.00
2.50
MLX90621BAA (120°X25°)
2.00
MLX90621BAB (60°X15°)
Noise, °C
MLX90621BAD (40°X10°)
1.50
1.00
0.50
0.00
0.5 1 2 4 8 16 32 64 128 256 512
Refresh rate, Hz
Figure 27: Central pixels noise
Corner pixels RMS noise at different refresh rates and

maximum resolution (Configuration register[5:4] =
6.00
11b)
5.00
MLX90621BAA (120°X25°)
4.00 MLX90621BAB (60°X15°)
Noise, °C
MLX90621BAD (40°X10°)
3.00
2.00
1.00
0.00
0.5 1 2 4 8 16 32 64 128 256 512
Refresh rate, Hz
Figure 28: Corner pixels noise

MLX90621
16x4 IR array
Datasheet
The higher resolution limits the maximum object temperature range of the MLX90621.
Maximum object temperature,

Configuration register[5:4],
Resolution °C
bin
BAA BAB BAD
00 15 bits ~750 ~950 ~1100
01 16 bits ~550 ~750 ~900
10 17 bits ~450 ~600 ~700
11 18 bits ~320 ~450 ~500
Table 21 Maximum object temperature at different resolution settings
NOTE: If object temperature exceeds the maximum object temperature specified for the corresponding resolution,
the MLX90621 may return invalid data due to measurements overflow.
10.3. Field Of View (FOV)

Point heat source Sensitivity
100%
50%
Field Of View
Rotated sensor Angle of incidence
Figure 29: Field Of View measurement
The specified FOV is calculated for the wider direction, in this case for the 16 pixels.
Angular alignment must be 5% of specified FOV and will be valid for both directions. For example for the 60° FOV in
the wider direction will come with 16° in the shorter direction.
X direction Y direction
FOV
Typ Typ
MLX90621-ESF-BAA 120 25
MLX90621-ESF-BAB 60 16
MLX90621-ESF-BAD 40 10
Table 22 Available FOV options

MLX90621
16x4 IR array
Datasheet
11. Applications Information

11.1. Use of the MLX90621 thermometer in I2C configuration
MCU VDD = 2.5...5V VDD
SENSOR VDD = 2.6V
VDD1
2 - SDA 3 - VDD
MCU
1 - SCL 4 - VSS
2
Figure 30: MLX90621 I C connection
2
As the MLX90621xxx is fully I C compatible it allows to have a system in which the MCU may be supplied with
VDD=2.5…5V while the sensor it’s self is supplied from separate supply VDD1=2.6V (or even left with no supply i.e.
2
VDD=0V), with the I C connection running at supply voltage of the MCU.
12. Application Comments

Significant contamination at the optical input side (sensor filter) might cause unknown additional filtering/distortion
of the optical signal and therefore result in unspecified errors.
IR sensors are inherently susceptible to errors caused by thermal gradients. There are physical reasons
for these phenomena and, in spite of the careful design of the MLX90621xxx, it is recommended not to
subject the MLX90621 to heat transfer and especially transient conditions.
The MLX90621 is designed and calibrated to operate as a non-contact thermometer in settled conditions.
Using the thermometer in a very different way will result in unknown results.
2
Capacitive loading on an I C can degrade the communication. Some improvement is possible with use of current
sources compared to resistors in pull-up circuitry. Further improvement is possible with specialized commercially
available bus accelerators. With the MLX90621 additional improvement is possible by increasing the pull-up current
2
(decreasing the pull-up resistor values). Input levels for I C compatible mode have higher overall tolerance than the
2 2
I C specification, but the output low level is rather low even with the high-power I C specification for pull-up
currents. Another option might be to go for a slower communication (clock speed), as the MLX90621 implements
2
Schmidt triggers on its inputs in I C compatible mode and is therefore not really sensitive to rise time of the bus (it is
2
more likely the rise time to be an issue than the fall time, as far as the I C systems are open drain with pull-up).

MLX90621
16x4 IR array
Datasheet
Power dissipation within the package may affect performance in two ways: by heating the “ambient” sensitive
element significantly beyond the actual ambient temperature, as well as by causing gradients over the package that
will inherently cause thermal gradient over the cap
Power supply decoupling capacitor is needed as with most integrated circuits. MLX90621 is a mixed-signal device
with sensors, small signal analog part, digital part and I/O circuitry. In order to keep the noise low power supply
switching noise needs to be decoupled. High noise from external circuitry can also affect noise performance of the
device. In many applications a 100nF SMD ceramic capacitor close to the Vdd and Vss pins would be a good choice. It
should be noted that not only the trace to the Vdd pin needs to be short, but also the one to the Vss pin. Using
MLX90621 with short pins improves the effect of the power supply decoupling.
Check www.melexis.com for most recent application notes about MLX90621.

MLX90621
16x4 IR array
Datasheet
13. Standard information regarding

manufacturability of Melexis products with
different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level
according to following test methods:
Wave Soldering THD’s (Through Hole Devices)

• EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)

• EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability THD’s (Through Hole Devices)

• EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature,
temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed
upon with Melexis.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information
on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain
Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx
The MLX90621 is RoHS compliant
14. ESD Precautions

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.

MLX90621
16x4 IR array
Datasheet
15. FAQ
When I measure aluminum and plastic parts settled at the same conditions I get significant errors on aluminum.
Why?
Different materials have different emissivity. A typical value for aluminum (roughly polished) is 0.18 and for plastics
values of 0.84…0.95 are typical. IR thermometers use the radiation flux between the sensitive element in the sensor
and the object of interest, given by the equation
Ê ¤1 ∗ Œ1 ∗ 4
1 ∗Ë∗ 1 ∗ 0Ì 0 ¤2 ∗ 4
2 ∗Ë∗ 2
Where:
¤3 and ¤6 are the emissivity of the two objects
Œ3 is the absorptivity of the sensor (in this case),
Ë is the the Stefan-Boltzmann constant,
3 and 6 are the surface areas involved in the radiation heat transfer,
zE* is the shape factor,
ÆÍ and Æ¼ are known temperature of the sensor die (measured with specially integrated and calibrated element)
and the object temperature that we need.
Note that the temperatures are all in Kelvin, heat exchange knows only physics.
When a body with low emissivity (such as aluminum) is involved in this heat transfer, the portion of the radiation
incident to the sensor element that really comes from the object of interest decreases – and the reflected
environmental IR emissions take place. (This is all for bodies with zero transparency in the IR band.) The IR
thermometer is calibrated to stay within specified accuracy – but it has no way to separate the incoming IR radiation
into real object and reflected environmental part. Therefore, measuring objects with low emissivity is a very
sophisticated issue and infra-red measurements of such materials are a specialized field.
What can be done to solve that problem? Look at paintings – for example, oil paints are likely to have emissivity of
0.85…0.95 – but keep in mind that the stability of the paint emissivity has inevitable impact on measurements.
It is also a good point to keep in mind that not everything that looks black is “black” also for IR. For example, even
heavily oxidized aluminum has still emissivity as low as 0.30.
How high is enough? Not an easy question – but, in all cases the closer you need to get to the real object
temperature the higher the needed emissivity will be, of course.
With the real life emissivity values the environmental IR comes into play via the reflectivity of the object (the sum of
Emissivity, Reflectivity and Absorptivity gives 1.00 for any material). The larger the difference between
environmental and object temperature is at given reflectivity (with an opaque for IR material reflectivity equals 1.00
minus emissivity) the bigger errors it produces.
After I put the MLX90621 in the dashboard I start getting errors larger than specified in spite that the module was
working properly before that. Why?
Any object present in the FOV of the module provides IR signal. It is actually possible to introduce error in the
measurements if the module is attached to the dashboard with an opening that enters the FOV. In that case portion
of the dashboard opening will introduce IR signal in conjunction with constraining the effective FOV and thus
compromising specified accuracy. Relevant opening that takes in account the FOV is a must for accurate

MLX90621
16x4 IR array
Datasheet
measurements. Note that the basic FOV specification takes 50% of IR signal as threshold (in order to define the area,
where the measurements are relevant), while the entire FOV at lower level is capable of introducing lateral IR signal
under many conditions.
When a hot (cold) air stream hits my MLX90621 some error adds to the measured temperature I read. What is it?
IR sensors are inherently sensitive to difference in temperatures between the sensitive element and everything
incident to that element. As a matter of fact, this element is not the sensor package, but the sensor die inside.
Therefore, a thermal gradient over the sensor package will inevitably result in additional IR flux between the sensor
package and the sensor die. This is real optical signal that cannot be segregated from the target IR signal and will add
errors to the measured temperature.
Thermal gradients with impact of that kind are likely to appear during transient conditions. The sensor used is
developed with care about sensitivity to this kind of lateral phenomena, but their nature demands some care when
choosing place to use the MLX90621 in order to make them negligible.
I measure human body temperature and I often get measurements that significantly differ from the +37°C I
expect.
IR measurements are true surface temperature measurements. In many applications this means that the actual
temperature measured by an IR thermometer will be temperature of the clothing and not the skin temperature.
Emissivity (explained first in this section) is another issue with clothes that has to be considered.
There is also the simple chance that the measured temperature is adequate – for example, in a cold winter human
hand can appear at temperatures not too close to the well-known +37°C.

MLX90621
16x4 IR array
Datasheet
16. Mechanical specification

16.1. Package outline
The height of the can depends on the selected FOV of the array
Figure 31 Overview of the different device FOV options
Figure 32 Mechanical drawing of Wide (120x25) FOV device (MLX90621BAA)

MLX90621
16x4 IR array
Datasheet
Figure 33 Mechanical drawing of Wide (60x16) FOV device (MLX90621BAB)
Figure 34 Mechanical drawing of Medium (40x10) FOV device (MLX90621BAD)
16.2. Part marking

The MLX90621 is laser marked with 10 symbols. The first is a 1, the next 3 letters indicate the version (BAA, BAB or
BAD) and the remaining 7 indicate the lot number.

MLX90621
16x4 IR array
Datasheet
17. References
2
[1] I C-bus specification and user manual Rev. 03 — 19 June 2007
http://www.nxp.com/documents/user_manual/UM10204.pdf
18. Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of
Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth
herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to
change specifications and prices at any time and without notice. Therefore, prior to designing this product into a
system, it is necessary to check with Melexis for current information. This product is intended for use in normal
commercial applications. Applications requiring extended temperature range, unusual environmental requirements,
or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not
recommended without additional processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to
recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of
profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in
connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or
liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services.
© 2015 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at

www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia: America:

Phone: +32 1367 0495 Phone: +1 248 306 5400
E-mail: sales_europe@melexis.com E-mail: sales_usa@melexis.com
ISO/TS 16949 and ISO14001 Certified


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MLX90621

Features and Benefits Applications Examples

Functional diagram General Description

39001090621 Page 1 of 44 Datasheet IR16x4

General Description (continued)

The MLX90621 is factory calibrated in following temperature ranges:

39001090621 Page 2 of 44 Datasheet IR16x4

39001090621 Page 3 of 44 Datasheet IR16x4

12. Application Comments ............................................................................................................................................. 37

39001090621 Page 4 of 44 Datasheet IR16x4

3. Absolute Maximum ratings

39001090621 Page 5 of 44 Datasheet IR16x4

4. Pin definition and description

Figure 1 Pin description

Pin Name Function

Table 3 Pin description for MLX90621

39001090621 Page 6 of 44 Datasheet IR16x4

Table 4 Electrical specification parameters of MLX90621

39001090621 Page 7 of 44 Datasheet IR16x4

CLK SDA VSS VDD

Figure 2 Block diagram

• IR array and processing electronics

39001090621 Page 8 of 44 Datasheet IR16x4

POR (see 8.3)

Read the EEPROM table (see 8.2.3, 9.5)

Yes POR/Brown Out flag cleared?

Calcullations (see 7.3)

Pixel offset cancelling

Thermal Gradient Compensation

Pixel to pixel normalization

Object emissivity compensation

Object temperature calculation

Image processing and correction

Figure 3 Operation block diagram

39001090621 Page 9 of 44 Datasheet IR16x4

Slave address Command Slave address

Initial address - 0x00 DATA(0x00) DATA(0x01) DATA(0xFF)

Figure 4 Whole EEPROM dump (SA = 0x50, command = 0x00)

Slave address Command

LSByte check MSByte check

Figure 5 Write oscillator trimming (SA = 0x60, command = 0x04)

39001090621 Page 10 of 44 Datasheet IR16x4

Slave address Command

LSByte check MSByte check MSByte data

Figure 6 Write configuration register (SA = 0x60, command = 0x03)

The default configuration is:

7.1.1. Reading configuration

Configuration value Configuration value

Figure 7 Reading configuration register (SA = 0x60, command = 0x02,

7.1.1.2 Reading oscillator trimming register (EEPROM data)

Oscillator trim value Oscillator trim value

Figure 8 Reading configuration register (SA = 0x60, command = 0x02,

39001090621 Page 11 of 44 Datasheet IR16x4

7.2. Read measurement data (RAM data)

PTAT data PTAT data

Figure 9 PTAT (SA = 0x60, command = 0x02, Start address = 0x40,

7.2.2. IR data read

IR pixel(0, 0) IR pixel(0, 0) IR pixel(1, 0) IR pixel(1, 0) IR pixel(3, 15) IR pixel(3, 15)

- Single column read

Slave address Command Address step Number of reads Slave address

39001090621 Page 12 of 44 Datasheet IR16x4

- Single line read

Slave address Command Address step Number of reads Slave address

# ( , &) # ( , &)()+,- : # ( , &).)+,-