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Fusible
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Features
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Test Qualification for Passive Components
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n 100 % electrically compatible with all n Standard 4532 mm (1812 mils) footprint
AE
Tripped
Max. Time
Ihold Itrip Resistance Power
To Trip
V max. I max. Dissipation
Model Amperes Ohms Amperes Seconds Watts
Volts Amps
at 23 °C at 23 °C at 23 °C at 23 °C at 23 °C
Hold Trip RMin. R1Max. Typ.
MF-MSMF010 60.0 40 0.10 0.30 0.70 15.00 0.5 1.50 0.8
MF-MSMF014 60.0 40 0.14 0.34 0.40 6.50 1.5 0.15 0.8
MF-MSMF020 30.0 80 0.20 0.40 0.40 6.00 6.0 0.06 0.8
MF-MSMF020/60 60.0 40 0.20 0.40 0.40 6.00 1.5 0.15 0.8
MF-MSMF030 30.0 10 0.30 0.60 0.30 3.00 8.0 0.10 0.8
MF-MSMF050 15.0 100 0.50 1.00 0.15 1.00 8.0 0.15 0.8
MF-MSMF050/30X 30.0 40 0.50 1.00 0.15 1.30 8.0 0.15 0.8
MF-MSMF050/40X*** 40.0 20 0.50 1.00 0.15 1.30 8.0 0.15 0.8
MF-MSMF075 13.2 100 0.75 1.50 0.11 0.45 8.0 0.20 0.8
MF-MSMF075/24 24.0 40 0.75 1.50 0.11 0.45 8.0 0.20 0.8
MF-MSMF075/33X*** 33.0 20 0.75 1.50 0.11 0.40 8.0 0.20 1.4
MF-MSMF110 6.0 100 1.10 2.20 0.04 0.21 8.0 0.30 0.8
MF-MSMF110/16 16.0 100 1.10 2.20 0.04 0.21 8.0 0.30 0.8
MF-MSMF110/24X 24.0 20 1.10 2.20 0.06 0.18 8.0 0.50 0.8
MF-MSMF125 6.0 100 1.25 2.50 0.05 0.14 8.0 0.40 0.8
MF-MSMF150 6.0 100 1.50 3.00 0.03 0.120 8.0 0.5 0.8
MF-MSMF150/12 12.0 100 1.50 3.00 0.03 0.120 8.0 0.5 0.8
MF-MSMF150/24X 24.0 20 1.50 3.00 0.03 0.120 8.0 1.50 1.0
MF-MSMF160 8.0 100 1.60 2.80 0.035 0.099 8.0 2.0 0.8
MF-MSMF200 8.0 40 2.00 4.00 0.020 0.080 8.0 2.0 0.8
MF-MSMF250/16X 16.0 100 2.50 5.00 0.015 0.100 8.0 5.0 1.2
MF-MSMF260 6.0 100 2.60 5.20 0.015 0.080 8.0 5.0 0.8
***TUV approval pending.
Environmental Characteristics
Operating Temperature.......................................... -40 °C to +85 °C
Recommended Storage........................................ 40 °C max./ 70 % RH max.
Passive Aging........................................................ +85 °C, 1000 hours................................................ ±5 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours.............................. ±5 % typical resistance change
Thermal Shock...................................................... +85 °C to -40 °C, 20 times..................................... ±10 % typical resistance change
Solvent Resistance................................................ MIL-STD-202, Method 215.................................... No change
Vibration................................................................ MIL-STD-883C, Method 2007.1,............................ No change (Rmin < R < R1max)
Condition A
Moisture Sensitivity Level (MSL)........................... See Note
ESD Classification - HBM...................................... Class 6
A B C D
Model Style
Min. Max. Min. Max. Min. Max. Min.
4.37 4.73 3.07 3.41 0.70 1.10 0.30
MF-MSMF010 1
(0.172) (0.186) (0.121) (0.134) (0.028) (0.043) (0.012)
4.37 4.73 3.07 3.41 0.70 1.10 0.30
MF-MSMF014 1
(0.172) (0.186) (0.121) (0.134) (0.028) (0.043) (0.012)
4.37 4.73 3.07 3.41 0.70 1.10 0.30
MF-MSMF020 1
(0.172) (0.186) (0.121) (0.134) (0.028) (0.043) (0.012)
4.37 4.73 3.07 3.41 0.70 1.10 0.30
MF-MSMF020/60 1
(0.172) (0.186) (0.121) (0.134) (0.028) (0.043) (0.012)
4.37 4.73 3.07 3.41 0.70 1.10 0.30
MF-MSMF030 1
(0.172) (0.186) (0.121) (0.134) (0.028) (0.043) (0.012)
4.37 4.73 3.07 3.41 0.55 0.85 0.30
MF-MSMF050 1
(0.172) (0.186) (0.121) (0.134) (0.022) (0.033) (0.012)
4.37 4.73 3.07 3.41 0.40 0.85 0.30
MF-MSMF050/30X 2
(0.172) (0.186) (0.121) (0.134) (0.016) (0.033) (0.012)
4.37 4.73 3.07 3.41 0.40 0.85 0.30
MF-MSMF050/40X 2
(0.172) (0.186) (0.121) (0.134) (0.016) (0.033) (0.012)
4.37 4.73 3.07 3.41 0.55 0.85 0.30
MF-MSMF075 1
(0.172) (0.186) (0.121) (0.134) (0.022) (0.033) (0.012)
4.37 4.73 3.07 3.41 0.55 0.85 0.30
MF-MSMF075/24 1
(0.172) (0.186) (0.121) (0.134) (0.022) (0.033) (0.012)
4.37 4.83 3.07 3.41 0.70 1.60 0.30
MF-MSMF075/33X 2
(0.172) (0.190) (0.121) (0.134) (0.028) (0.063) (0.012)
4.37 4.73 3.07 3.41 0.45 0.85 0.30
MF-MSMF110 1
(0.172) (0.186) (0.121) (0.134) (0.018) (0.033) (0.012)
4.37 4.73 3.07 3.41 0.45 0.85 0.30
MF-MSMF110/16 1
(0.172) (0.186) (0.121) (0.134) (0.018) (0.033) (0.012)
4.37 4.83 3.07 3.41 0.70 1.60 0.30
MF-MSMF110/24X 2
(0.172) (0.190) (0.121) (0.134) (0.028) (0.063) (0.012)
4.37 4.73 3.07 3.41 0.55 0.85 0.30
MF-MSMF125 1
(0.172) (0.186) (0.121) (0.134) (0.022) (0.033) (0.012)
4.37 4.73 3.07 3.41 0.55 0.85 0.30
MF-MSMF150 1
(0.172) (0.186) (0.121) (0.134) (0.022) (0.033) (0.012)
4.37 4.73 3.07 3.41 0.55 0.85 0.30
MF-MSMF150/12 1
(0.172) (0.186) (0.121) (0.134) (0.022) (0.033) (0.012)
4.37 4.83 3.07 3.41 0.70 1.60 0.30
MF-MSMF150/24X 2
(0.172) (0.190) (0.121) (0.134) (0.028) (0.063) (0.012)
4.37 4.73 3.07 3.41 0.55 0.85 0.30
MF-MSMF160 1
(0.172) (0.186) (0.121) (0.134) (0.022) (0.033) (0.012)
4.37 4.73 3.07 3.41 0.55 0.85 0.30
MF-MSMF200 1
(0.172) (0.186) (0.121) (0.134) (0.022) (0.033) (0.012)
4.37 4.83 3.07 3.41 0.70 1.60 0.30
MF-MSMF250/16X 2
(0.172) (0.190) (0.121) (0.134) (0.028) (0.063) (0.012)
4.37 4.73 3.07 3.41 0.48 0.85 0.30
MF-MSMF260 1
(0.172) (0.186) (0.121) (0.134) (0.019) (0.033) (0.012)
Packaging: DIMENSIONS:
MM
MF-MSMF010 through MF-MSMF030 = 1500 pcs. per reel. (INCHES)
MF-MSMF050 through MF-MSMF260 = 2000 pcs. per reel.
MF-MSMF075/33X, MF-MSMF110/24X , MF-MSMF150/24X & MF-MSMF250/16X = 1500 pcs. per reel.
Style 1
Top and Bottom View Side View Recommended Pad Layout Terminal material:
Electroless Ni under immersion Au
2.7 ± 0.1
0.1
(.106 ± .004)
D
MF-MSMF160
Style 2 MF-MSMF150
Top View Bottom View Side View Recommended Pad Layout MF-MSMF125
A C 0.01
MF-MSMF110
MF-MSMF014 MF-MSMF075
8 2.95 ± 0.10
C
B (.114 ± .004) MF-MSMF020
0.001 MF-MSMF050
0.1 1 10 100
1.68 ± 0.05 3.1 ± 0.10
D Fault Current (Amps)
(.066 ± .002) (.122 ± .004)
10 10
MF-MSMF030
MF-MSMF050/40X
MF-MSMF150/24X
Time to Trip (Seconds)
Time to Trip (Seconds)
1 1
MF-MSMF260
MF-MSMF250/16X
0.1 0.1
MF-MSMF160
MF-MSMF150
MF-MSMF125
0.01 0.01
MF-MSMF075/33X
MF-MSMF110
MF-MSMF014 MF-MSMF075 MF-MSMF020/60
MF-MSMF020
MF-MSMF110/16
MF-MSMF075/24
0.001 MF-MSMF050 0.001
MF-MSMF050/30X
0.1 1 10 100 0.1 1 10 100
The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer
applications may differ from these values due to the influence of other variables.
MF-MSMF150/12
100
10
MF-MSMF Series - PTC Resettable Fuses
Thermal Derating Chart - Ihold (Amps)
115Y
5 = 2015
MF-MSMF
3312 Series
- 2 mm SMD - PTC Resettable
Trimming Fuses
Potentiometer
Typical Part Marking
Represents total content. Layout may vary.
PART IDENTIFICATION EXAMPLES:
MF-MSMF050/30X & /40X = 4
BI-WEEKLY DATE CODE: MF-MSMF075/33X = H
WEEKS 49-50 = Y MF-MSMF110/24X = 6
YEAR CODE: MF-MSMF150/24X = 8
MF-MSMF250/16X = C
8
115Y
5 = 2015
tp Notes:
TP • MF-MSMF models cannot be wave soldered or hand
CRITICAL ZONE
RAMP-UP T L TO TP soldered. Please contact Bourns for soldering
recommendations.
TL
• All temperatures refer to topside of the package, measured
tL on the package body surface.
TS MAX. • If reflow temperatures exceed the recommended profile,
Temperature
t 25 *C TO PEAK
Time
F
A N(HUB DIA.)
E2 W
B1
B0
P1 W1(MEASURED
K0 AT HUB)
T1 A0
• Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s
application, including the PPTC device characteristics stated in the applicable data sheet.
• Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such
maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with
inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated
within the user’s application during the PTC selection and qualification process.
• Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature
conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions
are expected to be repetitive or prolonged.
• In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC
device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to
accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate
clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC
devices if the thermal expansion is inhibited.
• Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may
adversely affect the performance of polymer PTC devices.
• Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating,
potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene,
which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be
thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect
on the device.
• Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data
sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note:
https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf
MFAN 12/18
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
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the actual performance of the Bourns®/1.#4"3(-3'$(12/$"(="#$5("$2 -# //+(" 3(.-2 -#, *$3'$(1.6-(-#$/$-#$-3
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