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DATA SHEET
book, halfpage
M3D186
BC556; BC557
PNP general purpose transistors
Product specification 2004 Oct 11
Supersedes data of 1999 Apr 15
Philips Semiconductors Product specification
FEATURES PINNING
• Low current (max. 100 mA) PIN DESCRIPTION
• Low voltage (max. 65 V). 1 emitter
2 base
APPLICATIONS 3 collector
• General purpose switching and amplification.
1
MAM281
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
BC556 SC-43A plastic single-ended leaded (through hole) package; 3 leads SOT54
BC557
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter
BC556 − −80 V
BC557 − −50 V
VCEO collector-emitter voltage open base
BC556 − −65 V
BC557 − −45 V
VEBO emitter-base voltage open collector − −5 V
IC collector current (DC) − −100 mA
ICM peak collector current − −200 mA
IBM peak base current − −200 mA
Ptot total power dissipation Tamb ≤ 25 °C − 500 mW
Tstg storage temperature −65 +150 °C
Tj junction temperature − 150 °C
Tamb ambient temperature −65 +150 °C
2004 Oct 11 2
Philips Semiconductors Product specification
THERMAL CHARACTERISTICS
Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
Notes
1. VBEsat decreases by about −1.7 mV/K with increasing temperature.
2. VBE decreases by about −2 mV/K with increasing temperature.
2004 Oct 11 3
Philips Semiconductors Product specification
MBH726
300
handbook, full pagewidth
hFE
200
VCE = −5 V
100
0
−10−1 −1 −10 −102 IC (mA) −103
BC556A.
MBH727
400
handbook, full pagewidth
hFE
VCE = −5 V
300
200
100
0
−10−2 −10−1 −1 −10 −102 IC (mA) −103
BC556B; BC557B.
2004 Oct 11 4
Philips Semiconductors Product specification
MBH728
600
handbook, full pagewidth
hFE
500
VCE = −5 V
400
300
200
100
0
−10−2 −10−1 −1 −10 −102 IC (mA) −103
BC557C.
2004 Oct 11 5
Philips Semiconductors Product specification
PACKAGE OUTLINE
d A L
1
e1
2
D e
b1
L1
0 2.5 5 mm
scale
UNIT A b b1 c D d E e e1 L L1(1)
max.
5.2 0.48 0.66 0.45 4.8 1.7 4.2 14.5
mm 2.54 1.27 2.5
5.0 0.40 0.55 0.38 4.4 1.4 3.6 12.7
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
97-02-28
SOT54 TO-92 SC-43A
04-06-28
2004 Oct 11 6
Philips Semiconductors Product specification
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS DISCLAIMERS
Short-form specification The data in a short-form Life support applications These products are not
specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or
same type number and title. For detailed information see systems where malfunction of these products can
the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
Limiting values definition Limiting values given are in
for use in such applications do so at their own risk and
accordance with the Absolute Maximum Rating System
agree to fully indemnify Philips Semiconductors for any
(IEC 60134). Stress above one or more of the limiting
damages resulting from such application.
values may cause permanent damage to the device.
These are stress ratings only and operation of the device Right to make changes Philips Semiconductors
at these or at any other conditions above those given in the reserves the right to make changes in the products -
Characteristics sections of the specification is not implied. including circuits, standard cells, and/or software -
Exposure to limiting values for extended periods may described or contained herein in order to improve design
affect device reliability. and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information Applications that are
communicated via a Customer Product/Process Change
described herein for any of these products are for
Notification (CPCN). Philips Semiconductors assumes no
illustrative purposes only. Philips Semiconductors make
responsibility or liability for the use of any of these
no representation or warranty that such applications will be
products, conveys no license or title under any patent,
suitable for the specified use without further testing or
copyright, or mask work right to these products, and
modification.
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2004 Oct 11 7
Philips Semiconductors – a worldwide company
Contact information
Printed in The Netherlands R75/04/pp8 Date of release: 2004 Oct 11 Document order number: 9397 750 13571