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Table of Contents

1 INTRODUCTION.........................................................................................................................1
1.1 EDM Principle .......................................................................................................................1
1.2 Concept of 4-Axes Wire-cut Electric Discharge Machine.....................................................2
1.2.1 Machine Tool .....................................................................................................................2
1.2.2 Power supply......................................................................................................................2
1.2.3 Dielectric Supply................................................................................................................2
1.2.4 Part Programming .............................................................................................................3
1.3 Work Preparation ..................................................................................................................4
1.3.1 Work-Piece Material..........................................................................................................4
1.3.2 Wire Electrode ...................................................................................................................5
1.4 Water Dielectric.....................................................................................................................7
1.4.1 Characterization & Suitability To Wirecut EDM :............................................................7
1.4.2 Dielectric Strength :...........................................................................................................7
1.4.3 Flushing: ............................................................................................................................7
1.5 Setting up and Operation .......................................................................................................8
1.5.1 Job Mounting:....................................................................................................................8
1.5.2 Job Reference Point :.........................................................................................................8
2 TECHNOLOGY GUIDELINES..................................................................................................9
2.1 Machining Parameters ..........................................................................................................9
2.2 Guideline Parameters ..........................................................................................................13
2.3 Guideline Charts..................................................................................................................13
2.4 Important Notes ...................................................................................................................14
2.4.1 Proper Temperature Control:..........................................................................................14
2.4.2 Heat Treatment ................................................................................................................14
2.4.3 Conductivity of water (S) .................................................................................................15
2.4.4 Proper Flushing:..............................................................................................................15
2.4.5 Wire Offset:......................................................................................................................16
2.4.6 Applying the Technology Guidelines ...............................................................................16
3 GUIDE SPAN AND WORK TABLE HEIGHT.......................................................................19
3.1 Introduction .........................................................................................................................19
3.2 Measuring of Guide Span and Work-Table Height Using Slip Gauge................................19
3.3 Measuring of Guide Span and Work-Table Height Using GSWTH block...........................20
3.4 Information on measured and actual Guide Span of the machine. .....................................21
4 MACHINING ACCURACY’S...................................................................................................22
5 UNSTABLE MACHINING........................................................................................................24
5.1 Causes of Unstable Machining:...........................................................................................24
5.2 Measures of Unstable Machining:.......................................................................................24
6 TROUBLES DURING MACHINING ......................................................................................26
7 MAINTENANCE ........................................................................................................................28
8 APPLICATION TIPS .................................................................................................................29
8.1 Application Tip 1: Wire Verticality (Accurate Procedure) .................................................29
8.2 Application Tip 2: Procedure to Import Drawing from Autocad ........................................29
8.3 Application Tip 3: Job Clamping.........................................................................................30
8.4 Application Tip 4: Cutting Various Materials.....................................................................31
8.4.1 Carbide cutting. ...............................................................................................................31

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8.4.2 Aluminum Cutting. ...........................................................................................................32
8.4.3 Copper cutting. ................................................................................................................32
8.4.4 Inconel cutting. ................................................................................................................32
8.4.5 PCD cutting. (Applicable for Ultracut, Ultima and eNova Series) .................................32
8.5 Application Tip 5: Taper Cutting.........................................................................................32
8.6 Application Tip 6: Land & Taper cutting. ...........................................................................32
8.7 Application Tip 7: Maintaining Accuracy on Small Radii. .................................................33
8.8 Application Tip 8: Cutting Small Shapes / Holes. ...............................................................34
8.9 Application Tip 9: Cutting of Big Jobs ................................................................................34
8.10 Application Tip 10: Multi Cavity Job with Cavities Close to Each Other. .........................35
8.11 Application Tip 11: Cutting of Job with Thin Cross-Section ..............................................36
8.12 Application Tip 12: Cutting of Job with Thin Cross-Section and Long in Length ..............37
8.13 Application Tip 13: Entry Hole for Wire EDM ...................................................................39
9 TECHNOLOGY GUIDELINES................................................................................................40
9.1 Test Conditions Used for Technology Guidelines ...............................................................40
9.2 DC Pulse Technology Guidelines ........................................................................................41
9.2.1 10 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse ...............................41
9.2.2 20 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse ...............................42
9.2.3 30 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse ...............................43
9.2.4 50 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse ...............................44
9.2.5 80 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse ...............................45
9.2.6 100 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse .............................46
9.2.7 150 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse .............................47
9.2.8 200 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse .............................48
9.2.9 250 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse .............................49
9.2.10 20 mm Copper with Ø0.25 mm Bercocut (Hard) using DC Pulse...............................50
9.2.11 30 mm Copper with Ø0.25 mm Bercocut (Hard) using DC Pulse...............................51
9.2.12 50 mm Copper with Ø0.25 mm Bercocut (Hard) using DC Pulse...............................52
9.2.13 80 mm Copper with Ø0.25 mm Bercocut (Hard) using DC Pulse...............................53
9.2.14 10 mm Steel (HCHCr) with Ø0.20 mm Bercocut (Hard) using DC Pulse..................54
9.2.15 20 mm Steel (HCHCr) with Ø0.20 mm Bercocut (Hard) using DC Pulse..................55
9.2.16 30 mm Steel (HCHCr) with Ø0.20 mm Bercocut (Hard) using DC Pulse..................56
9.2.17 50 mm Steel (HCHCr) with Ø0.20 mm Bercocut (Hard) using DC Pulse..................57
9.2.18 20 mm Copper with Ø0.20 mm Shalimar using DC Pulse ..........................................58
9.2.19 30 mm Copper with Ø0.20 mm Shalimar using DC Pulse ..........................................59
9.2.20 50 mm Copper with Ø0.20 mm Shalimar using DC Pulse ..........................................60
9.2.21 80 mm Copper with Ø0.20 mm Shalimar using DC Pulse ..........................................61
9.2.22 120 mm Copper with Ø0.20 mm Shalimar using DC Pulse ........................................62
9.2.23 150 mm Copper with Ø0.20 mm Shalimar using DC Pulse ........................................63
9.2.24 10 mm Steel (HCHCr) with Ø0.15 mm Bercocut (Hard) using DC Pulse...................64
9.2.25 20 mm Steel (HCHCr) with Ø0.15 mm Bercocut (Hard) using DC Pulse...................65
9.2.26 30 mm Steel (HCHCr) with Ø0.15 mm Bercocut (Hard) using DC Pulse...................66
9.2.27 50 mm Steel (HCHCr) with Ø0.15 mm Bercocut (Hard) using DC Pulse...................67
9.2.28 80 mm Steel (HCHCr) with Ø0.15 mm Bercocut (Hard) using DC Pulse...................68
9.3 AE Pulse Technology Guidelines.........................................................................................69
9.3.1 30 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse................................69
9.3.2 40 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse................................70
9.3.3 50 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse................................71
9.3.4 60 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse................................72
9.3.5 70 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse................................73
9.3.6 80 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse................................74
9.3.7 90 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse................................75

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9.3.8 100 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse..............................76
9.3.9 20 mm Copper with Ø0.25 mm Bercocut using AE Pulse. ............................................77
9.3.10 30 mm Copper with Ø0.25 mm Bercocut using AE Pulse. ........................................78
9.3.11 50 mm Copper with Ø0.25 mm Bercocut using AE Pulse. ........................................79
9.3.12 80 mm Copper with Ø0.25 mm Bercocut using AE Pulse. ........................................80
9.3.13 10 mm Carbide with Ø0.25 mm Bercocut using AE Pulse. .......................................81
9.3.14 20 mm Carbide with Ø0.25 mm Bercocut using AE Pulse. .......................................82
9.3.15 30 mm Carbide with Ø0.25 mm Bercocut using AE Pulse. .......................................83
9.3.16 40 mm Carbide with Ø0.25 mm Bercocut using AE Pulse. .......................................84
9.3.17 50 mm Carbide with Ø0.25 mm Bercocut using AE Pulse. .......................................85
9.3.18 60 mm Carbide with Ø0.25 mm Bercocut using AE Pulse. .......................................86
9.3.19 70 mm Carbide with Ø0.25 mm Bercocut using AE Pulse. .......................................87
9.3.20 80 mm Carbide with Ø0.25 mm Bercocut using AE Pulse. .......................................88
9.3.21 90 mm Carbide with Ø0.25 mm Bercocut using AE Pulse. .......................................89
9.3.22 100 mm Carbide with Ø0.25 mm Bercocut using AE Pulse. .....................................90
9.3.23 30 mm Brass with Ø0.25 mm Brass Wire using AE Pulse.........................................91
9.3.24 50 mm Brass with Ø0.25 mm Brass Wire using AE Pulse.........................................92
9.3.25 80 mm Brass with Ø0.25 mm Brass Wire using AE Pulse.........................................93
9.3.26 10 mm Aluminum with Ø0.25 mm Bercocut using AE Pulse.......................................94
9.3.27 20 mm Aluminum with Ø0.25 mm Bercocut using AE Pulse.....................................95
9.3.28 30 mm Aluminum with Ø0.25 mm Bercocut using AE Pulse.....................................96
9.3.29 50 mm Aluminum with Ø0.25 mm Bercocut using AE Pulse.....................................97
9.3.30 80 mm Aluminum with Ø0.25 mm Bercocut using AE Pulse.....................................98
9.3.31 100 mm Aluminum with Ø0.25 mm Bercocut using AE Pulse...................................99
9.3.32 10 mm Steel (HCHCr) with Ø0.20 mm Bercocut using AE Pulse. ...........................100
9.3.33 20 mm Steel (HCHCr) with Ø0.20 mm Bercocut using AE Pulse. ...........................101
9.3.34 30 mm Steel (HCHCr) with Ø0.20 mm Bercocut using AE Pulse. ...........................102
9.3.35 50 mm Steel (HCHCr) with Ø0.20 mm Bercocut using AE Pulse. ...........................103
9.3.36 80 mm Steel (HCHCr) with Ø0.20 mm Bercocut using AE Pulse. ...........................104
9.3.37 100 mm Steel (HCHCr) with Ø0.20 mm Bercocut using AE Pulse. .........................105
9.3.38 20 mm Copper with Ø0.20 mm Shalimar using AE Pulse. ........................................106
9.3.39 30 mm Copper with Ø0.20 mm Shalimar using AE Pulse. ........................................107
9.3.40 50 mm Copper with Ø0.20 mm Shalimar using AE Pulse. ........................................108
9.3.41 80 mm Copper with Ø0.20 mm Shalimar using AE Pulse. ........................................109
9.3.42 120 mm Copper with Ø0.20 mm Shalimar using AE Pulse. ......................................110
9.3.43 150 mm Copper with Ø0.20 mm Shalimar using AE Pulse. ......................................111
9.3.44 10 mm Steel (HCHCr) with Ø0.15 mm Bercocut using AE Pulse. ............................112
9.3.45 20 mm Steel (HCHCr) with Ø0.15 mm Bercocut using AE Pulse. ............................113
9.3.46 30 mm Steel (HCHCr) with Ø0.15 mm Bercocut using AE Pulse. ............................114
9.3.47 50 mm Steel (HCHCr) with Ø0.15 mm Bercocut using AE Pulse. ............................115
9.3.48 80 mm Steel (HCHCr) with Ø0.15 mm Bercocut using AE Pulse. ............................116

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1 INTRODUCTION

1.1 EDM Principle

Electric Discharge Machining (EDM) is a process of repetitive sparking cycles.

Graphical Representation of Sparking Cycles

TON TOFF

VP

t(uS)
J

Series of Electrical Pulses At The Inter electrode Gap


TO N TO FF
Td

VP

t(u
js)

Inter electrode Gap Voltage Waveform During Sparking

TON TOFF
IP
t(JuS)
Inter electrode Gap Current Waveform During Sparking

Where: TON : Pulse ON period


TOFF : Pulse OFF period
Td : Spark initiation period (Ignition Delay)
VP : Open Gap Voltage
Vg : Average Gap voltage
IP : Machining peak current
A series of electrical pulses generated by the pulse generator unit is applied between the work-
piece and the traveling wire electrode. In the event of spark discharge, there is a flow of current
across the wire electrode - work-piece gap. The energy content of a single spark discharge can be
expressed as a product of TON x IP. Energy contained in a tiny spark discharge removes a
fraction of work-piece material. Large number of such time spaced tiny discharges between the
work-piece and wire electrode causes the electro-erosion of the work-piece material.

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1.2 Concept of 4-Axes Wire-cut Electric Discharge Machine

The ELEKTRA Wire-cut Electric Discharge Machine is comprised of a machine tool, a power
supply unit (ELPULS) and a dielectric supply unit. A schematic drawing of the Wire-cut EDM unit is
shown in Figure 1.

1.2.1 Machine Tool


The machine tool comprises of a main work table (called as X-Y table), an auxiliary table (called as
U-V table) and a wire drive mechanism. The work-piece is mounted and clamped on the main
work table. The main table moves along X and Y axes, in steps of 0.5 micron, by means of servo
motors, and also the U-V table moves, in steps of 0.5 micron, by means of servo motors. U & V
axes are parallel to X & Y axes respectively.
A traveling wire which is continuously fed from wire feed spool is caused to travel through the
work-piece and goes finally to the waste-wire box. Along its traveling path, the wire is supported
under tension, between a pair of wire guides which are disposed on both (lower and upper) sides
of the work-piece. Lower wire guide is stationary whereas the upper wire guide is supported by the
U-V Table. The upper wire guide can be displaced transversely, along U-V axes, with respect to
the lower wire guide. It can also be positioned vertically along Z axis by moving the vertical arm.
As the material removal or machining proceeds, the work table carrying the work-piece is
displaced transversely along a predetermined path which is stored in the controller. The path
specifications (path program) can be supplied to the controller through RS 232C port or floppy
diskette from the part programming system or directly through the controller key board.

When the X-Y table is moving along the predetermined path while the U-V table is kept stationary,
a straight cut with a predetermined pattern is formed.
In order to produce taper machining, the wire electrode has to be tilted. This is achieved by
displacing the upper wire guide (along U-V axes) with respect to the lower wire guide. The desired
taper angle is achieved by simultaneous control of the movement of X-Y table and U-V table along
their respective predetermined paths stored in the controller. The path information of X-Y table and
U-V table is given to the controller in terms of linear and circular elements via NC program.

1.2.2 Power supply


The power supply unit comprises of Electric pulse generator, motor driver units for X, Y, U, V axes
and CNC controller.

1.2.3 Dielectric Supply


While the machining is continued, the machining zone is continuously flushed with water passing
through the nozzles on both sides of the work-piece. The spark discharge across the work-piece -
wire electrodes causes ionization of the water which is used as a dielectric medium.

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It is important to note that ionization of water leads to the increase in water conductivity. An ion
exchange resin is used in dielectric distribution system, in order to prevent the increase in
conductivity and to maintain the conductivity of the water constant.

1.2.4 Part Programming


The geometry of the profile and the motion of the wire-electrode tool along the profile is fed to the
part programming system using keyboard. The profile geometry is defined in terms of various
geometrical definitions of point, line and circle as the wire-tool path elements on graphical screen,
by using a totally menu driven software. The wire compensation (for wire diameter and machining
overcuts) and taper angle can be specified for the total path or for each path element separately.
After the profile is fed to the computer, all the numerical information about the path is calculated
automatically and its printout is generated. The entered profile can be verified on the graphic
display screen and corrected, if necessary. After successful profile definition, the profile is
recorded by the computer on a floppy disc which can be used in the controller for the execution.

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Figure 1 Concept of CNC Wirecut EDM

1.3 Work Preparation

1.3.1 Work-Piece Material


Any slight dislocation in the work-piece material may result in distorted job. It is important to
use the material free from residual stresses, arising from various processes. This may affect
the machining accuracies to a very large extent.
Work-piece material should be...

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• Electrically conductive ( at least 0.1 micro-ohm/cm )
• Suitable for clamping.
• Non-combustible.
• Nonviolent chemical reactions with Water, Oxygen, Hydrogen.

1.3.2 Wire Electrode


The wire electrode is required to have a sufficient tensile strength and should be of uniform
diameter and free from kink or twist.

The electrode wire material should be -


• Brass / Diffused Brass / Zinc coated Brass
• Diameter variation within ±0.002 mm
• Tensile strength more than 50 Kgf/mm2
• Even winding, free from breaks/kinks.

1.3.2.1 Wire diameter and Minimum corner radius.


Wire diameter of the wire imposes a restriction on the minimum achievable corner radius.
(Refer Fig. 2.)
Minimum corner radius = (0.5 * diameter) + overcut.

Figure 2: Wire Diameter and Minimum Diameter

1.3.2.2 Current carrying capacity of the wire.


As a thumb rule, a brass wire of 0.2 mm in diameter can pass a current of about 0.3 to 0.7
Amperes (A) in air, but, the same wire can easily pass a current of about 6 to 9 A in water.

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While machining, therefore, wire should always be surrounded by the water column to avoid
wire breakage.

1.3.2.3 Wire Tension (WT)


Wire tension determines how much the wire is to be stretched between upper and lower wire
guides. More the thickness of job, more is the tension required. Improper setting of tension
may result in the job inaccuracies as well as wire breakage. Following chart gives nominal
values of wire tension for different setting. Minimum tension (For 0 setting of WT) is approx.
200 ~ 300 gms, which can be adjusted by clutch adjustment provided on feed-spool mounting
rod. This should be adjusted for different weight of spools.
1.3.2.4 Wire feed (WF)
Due to spark erosion, the traveling wire-electrode becomes thin and brittle. Wire feed is the
rate at which the wire-electrode travels along the wire guide path. It is always desirable to set
the wire feed to maximum. This will result in less wire breakage, better machining stability, and
slightly more cutting speed. With wire feed set at 6 M/min, on an average a 0.25 mm dia. brass
wire spool of 3.5 kg will last for 24 sparking hours.
Setting WF at 15 will correspond to 15 M/min (approx.)

1.3.2.5 Overcut
It is the lateral distance between the wire and work-piece during the sparking.
Overcut is larger if -
• machining gap voltage is higher
• discharge energy is higher
• wire tension is lower
• guide span is higher
• job thickness is higher
• dielectric conductivity is higher
• machining is unstable
1.3.2.6 Wire Compensation (OFFSET):
Wire compensation = (0.5* wire diameter) + overcut
Wire compensation can be to the left (G41) or right (G42) of profile depending upon the
direction of motion and wire being inside or outside of profile as shown in Figure 3.

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SP : START POINT
: WITHOUT COMPENSATION
.... : WITH COMPENSATION
: DIRECTION OF MOTION

SP SP

Figure 3
1.4 Water Dielectric

1.4.1 Characterization & Suitability To Wirecut EDM :


• The use of water as dielectric permits widening of spark gap to minimize short
circuit, resulting in high cutting speed.
• Water has good wire electrode cooling effect (than kerosene, for example).
• It is non-flammable and its vapors are non-toxic.

1.4.2 Dielectric Strength :


Since the insulation characterization of the dielectric fluid decides the overcut, it is imperative
to keep the conductivity as constant as possible. During machining, the conductivity of
dielectric water changes due to generation of metallic ions and dissolution of ambient gases.
The conductivity can be decreased by passing the water through deionizer resin. This is done
automatically by the machine.

1.4.3 Flushing:
Flushing is important to achieve a stable machining condition. It plays very important role as
far as cutting speed is concerned. Both the Nozzles (upper and lower) should be just about 0.1
~ 0.2 mm away from the work-piece, otherwise cutting performance drops considerably. Also
both the nozzles should be checked periodically for damages. Scratches or slight damage on
the contact edge affect cutting speed. Purity of the water should be maintained by timely
replacement of filters.

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1.5 Setting up and Operation
1.5.1 Job Mounting:
Mount the job and clamp it by maximum possible clamps. Dial the top surface of the job by dial
gauge. The dial gauge stand can be mounted on the upper flushing assembly provision for the
same is provided. Make the wire vertical with the help of verticality block provided along with
the machine.

1.5.2 Job Reference Point :


It is always desirable to have a reference point on the work-piece for setting the work co-
ordinate system (WCS). The programming should be done with the reference to the WCS. The
reference point can be defined by the ground edges of the work-piece or the center of a bored
hole on the work-piece.

1.5.2.1 Edge finding (EF) :


This function should be used to find the edge for setting work co-ordinate system. Find the
edge of the work-piece from a distance of 2 - 5 mm. Refer Figure 4.

Figure 4

Note: Remember that after edge finding, the wire center is away from the work-piece
edge by a distance equal to wire radius.

1.5.2.2 Center finding (CF):


This function should be used to find the center of the reference hole. Center finding should be
repeated at least twice to verify consistency.

Following care should be taken to perform CF and EF functions.


• Work-piece surface should be free from moisture, rust, dust and grease etc.
• Upper flushing assembly should not be wet
• WF should be at 3 and WT at 8

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2 TECHNOLOGY GUIDELINES

The technology charts give guidelines to the operator to set up the machining
parameters and get optimum performance from the machine. Actual process
results may differ to some extent.

Generally, by increasing the spark energy, one can achieve an increase in the cutting rate. To
achieve optimum results of cutting rate and the job accuracies, the machining parameters should
be properly set.
The parameters which control the pulse energy and ultimately the machining speed are described
below.
2.1 Machining Parameters
Different parameters controlling the pulse energy and machining conditions are given below along
with their setting formats.

Range TON TOFF IP VP WP WF WT SV SF CC CRK CS%


Min 000 00 10 1 000 0 0 0 0000 0 0 10
100 100 1000
200 2000
300
Max 031 63 12 2 015 15 15 99 0990 9 99 120
131 115 1999
231 2990
331

Note: For details of Range of TON, WF and SF see their description.

TON : Pulse ON Time.


During this period the voltage (VP) is applied across the electrodes.

Range: 000 - 031 (in step of 1) N-Pulse (Normal DC Pulse)


100 - 131 (in step of 1) e-Pulse (Equi-energy DC Pulse)
000 - 031 (in step of 1) N-Pulse (Normal AE Pulse)
100 - 131 (in step of 1) e-Pulse (Equi-energy AE Pulse)

Higher the TON setting larger is the pulse on period.

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The single pulse discharge energy increases with increasing TON period, resulting in higher
cutting rate. With higher values of TON, however, surface roughness tends to be higher. The
higher value of discharge energy may also cause wire breakage.

TOFF : Pulse OFF Time.


Voltage for the gap is absent during this period.

Range: 00 - 63 (in step of 1).


Higher the TOFF setting larger is the pulse off period.
With a lower value of TOFF, there are more number of discharges in a given time, resulting in
increase in the sparking efficiency. As a result, the cutting rate also increases.
Using very low values of TOFF period, however, may cause wire breakage which in turn reduces
the cutting efficiency.
As and when the discharge condition becomes unstable, one can increase the TOFF period. This
will allow lower pulse duty factor and will reduce the average gap current.

IP : Peak current (A).


This is for selection of pulse peak current.

Range: 010 - 230 (in step of 10)


Higher the IP setting larger is the peak current value.
Increase in the IP value will increase the pulse discharge energy which in turn can improve the
cutting rate further.
For higher value of IP, gap conditions may become unstable with improper combination of TON,
TOFF, SV & SF settings. As and when the discharge condition becomes unstable one must
reduce the IP value (and / or increase the Toff period).

VP : Pulse Peak Voltage setting.


This is for selection of open gap voltage.

Range: 1

WP : Flushing Pressure of Water Dielectric


This is for selection of flushing input pressure.

Range: 0 or 1 (0 - Low & 1 - High Pressure for machines with non-programmable flushing)
0 to 15 (For 16 step programmable flushing)

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High input pressure of water dielectric is necessary for cutting with higher values of pulse power
and also while cutting the jobs of higher thickness. Low input pressure is used for thin jobs and in
trim cuts.

WF : Wire Feed rate setting.


This is a feed rate at which the fresh wire is fed continuously for sparking.

Range: 01 - 15 (in step of 1)


Higher values of wire feed rate (above 6) are required for working with higher pulse power (where
the job cutting rates are higher).

WT : Wire Tension setting.


This is a gram-equivalent load with which the continuously fed and wire is kept under tension so
that it remains straight between the wire guides.

Range: 01 - 15 (in step of 1)


While the wire is being fed continuously, appropriate Wire tension avoids the unintentional wire
deflection from its straight path (between the wire guides). The wire deflection is caused due to
spark induced reaction forces and water pressure.

SV : Spark Gap Set Voltage


This is a reference voltage for the actual gap voltage.

Range: 00 - 99 (in step of 1) Volt

SF : Servo Feed Setting


This parameter decides the servo speed; the servo speed, at the set value of SF, can vary in
proportion with the gap voltage (normal feed mode) or can be held constant while machining (with
constant feed mode).

Range: 0000 - 0990 for Normal feed


1000 - 1999 for Constant feed
2000 - 2999 for Constant voltage

In constant feed mode, the 3 least significant digits of SF define the feed rate in tenths of mm/min.
1050 will give 5.0 mm/min constant speed.
In constant voltage mode, the feed is adjusted by the controller to maintain the gap voltage close
to SV setting.

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Here SF can be varied from
000 to 990 in normal mode
000 to 999 in constant feed mode and
000 to 990 in constant feed mode

CC : Corner Control factor used in rough cut (1st Cut).

Range: 0 - 9
e.g. If CC=3, cutting speed and power is reduced to 30% at corner.

CRK: Radius compensation factor.

CRK is the amount of corner correction in microns for 1 mm corner radius. From this value corner
correction of other corner radii is automatically done by controller.
CRK value depends on job material, Job thickness and cutting speed.
This parameter is set in E-Code table only. To find CRK value, please refer operating Manual.

CS%: Cutting Speed Over-ride %.

This on-line parameter is provided to reduce the cutting speed to set CS% value without modifying
the set machining condition parameters or the E-code tables.
This parameter is effective for rough machining conditions where TON is set to _16 or higher
value. It is automatically discarded in trim cuts where TON is less than _16.
This parameter is mainly used to reduce the cutting speed in order to avoid wire breakages in the
following rough machining conditions.
• If the wire electrode type or brand is different than the one specified in the technology
guidelines and if it is not suitable for high speed machining
• if the wire electrode is of inferior quality,
• if wire vibrations are excessive due to bad wire spool winding quality or wear-out / defects
in the wire drive system elements,
• if the work-piece material has defects,
• in difficult machining conditions where one or both of the flushing nozzles are far away from
the work-piece surface,
• for job profiles having very sharp corners,
• for Taper cut machining with large taper angles,
• for Complex profile machining with different top and bottom profiles,
• for unattended machining operation to avoid any risk of wire breakage,

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• In any other unstable machining conditions.

CS% = 100 = Normal cutting speed as per selected machining condition.

CDL: Corner Dwell


This parameter is used to provide Dwell (delay) in seconds at corner for achieving sharp corners, it
is active for linear – linear motion and if CC% is greater than zero.

Range – 0 to 99 Sec.
During installation default value will be set to 2 Sec.

2.2 Guideline Parameters


Apart from these parameters, the technology guideline chart also includes following two
parameters for process monitoring purpose.

Ig : Average Gap current (A).


This is the actual value of gap current read on ammeter. The values of average machining current
given in the guideline charts are indicative and may be different for each machine.

Vg : Average gap voltage (V).


This is the actual value of gap voltage read on yellow voltage bar on the screen. It depends on the
set values of SV and SF.
For stable machining during first rough cut, SF should be set in such a way that Vg is higher than
SV by 1 to 6 Volts.

2.3 Guideline Charts

The technology charts are prepared to support the wire EDM user and provide some guidelines.
Every technology chart comprises of a set of guidelines pertaining to a specific wire - job thickness
combination.

Technology guidelines are available for the following wire and work-piece material.

WIRE Material : DURACUT


JOB Material: Steel (HCHC) Hardness: 48 - 50 Rc Prior to machining, job
materials were properly stress relieved.
CONDUCTIVITY The guidelines refer to the de-ionized water as a dielectric (machining fluid)

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with conductivity value (S) of 20 units.
PRESSURE The maximum water inlet pressure is 15-16 kg / cm2.
kg / cm2
FLOW TOP This is a flow rate of water dielectric in Liters per min. (LPM) through Top wire
(LPM) guide nozzle.
FLOW BOT This is a flow rate of water dielectric in Liters per min. (LPM) through Bottom
(LPM) wire guide nozzle.
C. FEED This is job cutting rate displayed on the screen as the job is being cut, in units
mm/min of mm/min
OFFSET mm This is a guideline value for wire offset (in mm). While machining, set the
cutting size accordingly by considering the value of wire offset given in chart.
Guideline chart provides the wire offset values found under the test
conditions.

Guideline chart provides the cutting feed values found under the test conditions (with all
the required machining parameters properly set as given in the guideline chart for a
selected wire and job thickness).

2.4 Important Notes

2.4.1 Proper Temperature Control:


a. Room Temperature Control
To achieve better machining accuracies, it is recommended that the machine be
installed in a controlled atmosphere with room temperature of 20°C (±1)
b. Water Dielectric Temperature
The dielectric water temperature must be maintained within 1°C below the machine tool
temperature (approximately same as room temperature). Set the temperature difference
to ± 1°C on temperature controller of Dielectric Cooling System.
Before starting any job alignment or machining operation, the room temperature, machine
tool temperature and the job temperature must be stabilized by keeping the room air-
conditioner, machine power and the dielectric cooling system power ON for at least half an
hour. The dielectric water should also be kept splashing on the job and in the work area.

2.4.2 Heat Treatment


Proper heat treatment of the job material is necessary prior to machining. This is to reduce
the residual stresses to a minimum (quite often the cause of instability & inaccuracies).

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2.4.3 Conductivity of water (S)
It should be maintained during machining and be checked periodically. Replace the paper
filters & resin periodically.

2.4.4 Proper Flushing:


Rate of Dielectric Flow Adjustment
Case 1: For Rough Machining
i. To achieve maximum cutting rate in case when both guide nozzles can be set
close to the top and bottom surfaces of the work piece (0.1 to 0.2 mm away from
work-piece):-
1. Keep the upper and lower flushing valves fully open.
2. Adjust the position of upper and lower flushing nozzles so as to achieve the
required flow rate as per the technology guidelines.
ii. In case when upper guide nozzles can not be set close to the work surface:-
1. Keep the lower flushing valve fully open.
2. Adjust flow through the upper flushing valve in such a way that flushing flow
from the upper guide may suppress the flushing flow from the lower guide.
iii. In case when neither of the guide nozzles (upper or lower) be set close to the
work surface :-
1. Select LOW PRESSURE (Wp = 0) for the dielectric flushing.

Case 2: For Finish Machining

i. With Die machining (without taper cut)


a) For job thickness less than 30 mm, keep lower flushing valve fully close and upper
flushing flow at about 1 - 2 lit/min.
b) For job thickness greater than 30 mm, Adjust lower flushing flow in such a way so
as to reach the bottom surface of job and adjust upper flushing so as to achieve
healthy (blue) sparking.
c) For job thickness greater than 100 mm, use flushing nozzles with bigger diameter
hole.

ii. With Punch machining

Adjust lower flushing flow in such a way so as to reach the bottom surface of job
and adjust upper flushing to 2 - 3 lit/min.

iii. With Taper Cut machining

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For cutting job with taper profiles proceed as...
a) Keep the clearance of 0.5 mm to 1 mm between upper flushing nozzle and the top
surface of the job, and
b) Specify the Z height (quill position) in the program. ( New Height = Job Thickness +
1 mm )
c) Apply flushing condition as in 4.2 (i) a & b.
d) The cutting speed for taper cut should be lower (by about 20 - 40%) than that for
the straight cut machining.

iv. With Complex Profile machining (Different profiles at the top and
the bottom)

For cutting job with complex profiles proceed as...


a) Keep the clearance of 2 to 5 mm between upper flushing nozzle and the top
surface of the job, and
b) Specify the Z height (quill position), and Top and Bottom height in the Program. i.e.
Z Height = Job Thickness + 2 mm to 5 mm
c) Top Height = Work-piece Thickness
d) Bottom Height = (Normally) Zero
e) Apply flushing condition as in 4.2 (i) a & b.
f) The cutting speed for complex profiles should be lower (by about 30 - 40%) than
that for the straight cut machining.

2.4.5 Wire Offset:


The data, for Wire Offset values given in the technology guidelines, is obtained for cutting
square punches.
However, for cutting the job profiles of other shape and size may require some correction for
the offset values.
Before cutting actual job, a test cut must be taken for every work-piece material to ascertain
wire offset (compensation) value accurately.

The machining parameters (including water conductivity and flushing) selected for test cut
must be maintained exactly same during actual job cutting to maintain same overcut value.

2.4.6 Applying the Technology Guidelines

a) The selected pulse ON time (TON), the Machining Gap Voltage (SV), Peak current (IP)
and Servo feed (SF) must never be changed during machining, since it has maximum
effect on overcut values.

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b) Technology guidelines with CODE's A, B or C are for 1st cut only and be applied
appropriately.

CODE A: The guidelines are for cutting simple straight cuts with a maximum cutting
feed.
CODE B: The guidelines must be applied in the following cases for cutting with
optimized cutting feeds.
a. For cutting jobs with difficult machining conditions where One or both of
the flushing nozzles are far away from the work-piece surface.
b. For cutting taper job
CODE C: The guidelines parameters to be applied in the following cases.
a. While cutting jobs in single cut with better accuracies and finish or
b. While cutting smaller intricate profile jobs.

* Maximum cutting speed should not be used in single pass cutting of highly accurate jobs.
e.g. very fine, intricate job profiles should be cut at lower cutting rates of 50 mm² or below
for better profile accuracy.
Reduce the selected cutting rate using Cutting Speed Override % (CS %) parameter in the
following situations.
At sharp corners or, for intricate job profiles or, during taper cut or complex profiles or, due
to frequent wire breakages etc. (Please refer to CS% Parameter description in machining
conditions section)

Trim Cut
The “Trim Cut" (or Skim Cut) mode is used for machining of job profile in multi-pass cuts.
Multi-pass cutting of jobs is usually done in 2, 3 or more cuts.
Trim Cutting is used for
- Higher job accuracies
- improved surface finish
- Reducing inaccuracies produced by minor job deformations after first cut due to
residual stresses in the job material.
- Reducing bow effect on cut job surface produced in the first cut due to adverse
flushing conditions.
- Improving die life by reducing thermally affected layer formed, in the first cut, on the
machined surface.

Technology guidelines with CODE's D and E are given for cutting the job in more than one
pass.

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CODE D: The guidelines are for cutting the job accurately in two cuts.
D1: First Cut: The condition for first or rough cut.
D2: Second Cut: The condition for final or finish cut.
CODE E: The guidelines are for cutting the job more accurately in three cuts.
E1: First Cut: The condition for first or rough cut.
E2: Second Cut: The condition for second or semi-finish cut.
E3: Third Cut: The condition for final or finish cut.
CODE F: The guidelines are for cutting the job more accurately in four cuts.
F1: 1st Cut: The condition for first or rough cut.
F2: 2nd Cut: The condition for second cut.
F3: 3rd Cut: The condition for third or semi-finish cut.
F4: Fourth Cut: The condition for final or finish cut.

For multi-pass cutting of a punch, it is necessary to hold the punch in place for each cutting pass.
Usually it is done by leaving about 2 to 5 mm path length at the end of profile ‘uncut’ during each
cutting pass. For bigger punches it should be proportionally more. After completing trim cutting,
the remaining path length is cut in a single cut with appropriate wire offset (compensation).
The amount of material to be cut in second and third pass depends on the job height, size of the
job, cutting rate selected for the first cut, etc. Generally, for majority of the cases, the wire
compensation for multi-pass cuts should be selected such that approximately 40-50 micron
material is left for second cut and approximately 10 - 20 micron material is left for third cut.

As a general guideline, the following settings are recommended for trim cut.
- Flushing pressure: 1 to 2 kg/cm2
- Top flushing: 2 lpm
- Bottom flushing: 2 lpm
- Z position: For cutting Cavity 2 ~ 5 mm from the job surface
For cutting punch about 0.5 mm from the job surface

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3 Guide Span and Work Table Height
3.1 Introduction
The Guide span and work table height plays an important role while cutting Taper or complex
profile. The movement of auxiliary axis i.e. U and V is calculated based on these two parameters.
a. It is necessary to check these parameters in the following events.
b. When any one or both the wire guides are changed.
c. If upper or lower flushing assembly is removed and refitted.
d. If Upper and/or lower flushing assembly is realigned.
e. In case of accident of upper or lower flushing assembly.
The measured Guide Span and Work-Table Height is to be entered and saved in User Machine
Setup. Once saved, it will be used for further calculations,
Note: When these values are edited, it will be effective only while selecting the program.
3.2 Measuring of Guide Span and Work-Table Height Using Slip Gauge
The Guide Span and work-table height can be measured using slip gauge or similar equipment.
Before measuring Guide Span and Work-Table Height, note down the diamond distance of both
the wire guides. Normally it is engraved on the wire guide. In blow example C1 is for Upper wire
Guide and C2 is for lower wire guide.
Please refer to below definitions and measure the dimensions D1 and D2 using Slip Gauge. After
measurement calculate the Guide Span and Work-Table Height using given formulae.
A) Guide Span: (Ref. Figure 5)
It is dist. between lower & upper wire guide when quill i.e. Z-Axis is at zero position
i.e. GUIDE SPAN = D1 + C1 + C2.
If the Z axis cannot be moved to zero position then keep the Z at any position. Record this
position as Z1 and measure the dimension D1 and calculate the Guide Span using
GUIDE SPAN = D1 + C1 + C2 – Z1

Figure 5 Guide Span and Work-Table Height

B) Worktable Height:

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It is dist between lower wire guide and bottom surface of the work-piece i.e.
Worktable Height = D2 + C2
Here ‘C1’ and `C2’ is dist. between edge of the wire guide and diamond hole. For this value
ref. the value written on the guide or machine file.

3.3 Measuring of Guide Span and Work-Table Height Using GSWTH block.
We have devised a procedure to measure Guide Span and Work table height precisely. For
Higher taper angles Refer Figure. In some profiles (e.g. injection moulds dies, Complex), the
top and bottom dimensions are required to be very accurate. To achieve this accuracy, the
Guide Span and Work-Table Height dimensions plays important role. Hence it is required to
measure these dimensions precisely. To calculate these dimensions use the following
procedure.
Clamp the GSWTH measurement work piece, having sharp edges on the work table. Note
down the work piece thickness as WP.
1. Do the wire verticality in X direction. While doing verticality maintain the Z position
above WP. Note down the Z reading as Z.
2. Do the edge finding in X direction and set X co-ordinate as 0.000
3. Move the U axis by 5.000 mm in positive direction. Note down this reading as U.
4. Do the edge finding in X direction and note down this reading as X1.
5. Move the U axis by 10.000 mm in negative direction.
6. Do the edge finding in X direction and note down this reading as X2.
7. Enter these readings in following formula.

(X1)* WP
WTH = -------------------- (Work Table Height.)
(X2 - X1)

(WTH + WP) * (U - X2)


GS = (WTH + WP - Z) + ---------------------------- (Guide Span)
X2
Important points to be considered during procedure.
1. The GS WTH work piece should have sharp corners.
2. The squareness of the work piece should be maintained within 0.010mm
3. Align the work piece with respect to Z axis within 0.010 mm.
4. Repeat the edge finding operation for 3 times and take the average.
5. Do not consider the sign of X1, X2 while calculating.
6. Decide the U movement depending upon required angle.

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If the required taper angle is 11 deg. then move the U axis approximately
equal to TAN(11) * ( Z + Old Guide Span)

3.4 Information on measured and actual Guide Span of the machine.


Refer to Figure 6. This is exaggerated figure to explain the concept of measured and actual
guide span of the machine.
D1 is the measured Guide Span of the machine. However actual guide span is D2. This
happens due to taper angle and the hardness of the angle. Actual guide span will be always
less than measured guide span. The difference between measured and actual Guide Span
changes proportionally to taper angle and hardness of the wire.
One should consider this point while cutting highly accurate taper or complex jobs. It is
always recommended to measure guide span and worktable height using GSWTH block. The
user can prepare GSWTH block for their own use.

ø2

D2 D1

ø1

Figure 6 Measured and Actual Guide Span

For Higher Taper Angle


φ1 = Programmed Taper Angle
φ2 = Actual angle due to bending effect of wire
D1 = Measured guide span which remains valid only on lower taper angle i.e. up to 2 - 3
deg.
D2 = Changed guide span due to bending effect of wire at higher taper angle

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4 MACHINING ACCURACY’S

ACHIEVING OPTIMAL MACHINING ACCURACY’S


4.1. Wire should be perpendicular to the top surface of the job.
4.2. The start point should be preferably a hole and should be at proper place. Improper
workplace cutout and machining route will result in workplace distortion.

4.2.1. Workplace Cutout and Machining route (Refer Fig. 9.):

a) Inappropriate START Point


a
(machining from outside the
workplace causes distortion)

b) Inappropriate START Point, b


inadequate circumference
thickness.
t
GOOD

c) Adequate circumference thickness


(t) in die or punch machining. t
t
- Be sure to position START point inside the workplace.
Set the machining so that workplace clamp side may be machined finally.
Provide adequate circumference thickness (t) that will resist residual stress
deformation.
4.2.2. Work-piece Distortion:
- Minimize work-piece internal stress by premachining.

4.2.3. Heat treatment:


- Vacuum heat treatment
- Sub-zero annealing treatment etc.

4.2.4. Making of starting holes.


Steel, unhardened : Drill
Steel, hardened : Make hole by sink erosion with tubular electrode.

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4.2.5. Clamping Allowance for reliable Mounting:

Clamping allowance should be greater than 10 mm for light work-pieces


Greater than 35 mm for medium weight work-pieces
Greater than 50 mm for heavy work-pieces to permit working without risk of
collision.
4.3. The test cut should be performed on a trial piece to get the exact value of overcut. The
same technology parameters, viz. TON, TOFF, IP, WT, WF, SV, SF, as used in test cut
should be set while machining the actual job.

4.4. Machining should be stable.

4.5. Corner shape accuracy is required especially for punch and die which are used to make
thin plate product. Deviations at corner can be reduced by machining at lower spark
energy.

One can vary the spark energy by using...

4.5.1. TON position from 0 to 31 will increase spark energy in steps.


4.5.2. TOFF position from 0 to 63 will decrease spark energy in steps.

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5 UNSTABLE MACHINING

5.1 Causes of Unstable Machining:


¾ Insufficient wire tension or variation in tension during machining
¾ Improper setting of gap voltage (SV & SF settings)
¾ Unstable dielectric flow.
¾ Scratches or abrasion of wire guide, energizing current pickups & nozzles.
¾ Insufficient water dielectric cooling of the energizing current pickup. Contact point of wire and
energizing current pickup pin should be completely immersed in water.
¾ Insufficient water flow on contact surface of lower energizing current pickup and wire.
¾ Loose electrical connections of the work-tank.
¾ Upper and lower current pickup contacts are not proper.
¾ Conductivity is either high or low than required

5.2 Measures of Unstable Machining:


¾ Fluctuation of average gap voltage within ±10% of set value can be considered as a stable
machining. If the gap voltage is too low, i.e. narrower discharge gap between the wire and
work-piece in the direction of motion results in larger voltage fluctuations. This in turn may
cause frequent wire breakage. If the gap voltage is high, on the other hand, machining speed
decreases which will in turn increase the overcut.
¾ Upper guide should be as close as possible to the top surface of work-piece (about 0.1 to 0.2
mm for first cut and 1 mm for subsequent cuts). If the distance is too large, the wire will
vibrate and cause short circuit at the machining gap. This result in wide gap variation and
deteriorates the machining accuracies.
¾ The spark gap setting should be done by SV only. SF can be adjusted to get the optimum
speed with stable gap voltage.
¾ The major flushing is done through the lower flushing nozzle. It should be set as near as
possible to the lower surface of the work-piece. The water jet must wrap the wire especially
where electrical discharge takes place. If exposed to air, the wire electrode will cause aerial
discharge (Reddish spark can be seen if aerial discharge takes place). This causes wire
breakage and unstable machining.
¾ The diamond wireguides has a close tolerance with respect to wire passing through it. The
wire guide may deform or wear over a period of time. Diamond may come out or get
damaged due to external shock also. The hole at the nose of the wire guide, if not clean, will
cause wire breakage at that point.
¾ Roller inside lower flushing assembly is continuously splashed with ionized water which is
contaminated with EDM dust. This may spoil the bearing. Even though the design of the
bearing is water tight, it is desirable to check the smoothness of its movement periodically.

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¾ The carbide energizing current pickups are continuously in contact with wire, creating a
groove on it after a certain period. This may lead to improper energizing contact and lead to
wire breakage. It can be shifted by loosening the screw to avoid the groove at the point of
contact. Periodic check up is a must.
¾ Conductivity of Dielectric Water :
• The conductivity 'S' of dielectric plays a very important role in machining efficiency. Lower
the conductivity, lower is the gap between wire electrode and work-piece surface and
lower is the overcut and so on. Refer Figure 7.

Figure 7

As shown in the figure, the wire runs closer to top and bottom surface as compared to the
middle portion of the work-piece. Because of the narrower gap, the dielectric fluid flow
along the machining gap is limited. As a result there is a difficulty in flushing, which may
cause wire breakage.
The overcut size also will vary from top to bottom surface of the work-piece.
• Excessive Low Conductivity:
With very low dielectric conductivity, a serious problem of wire-metal deposition on the
work-piece can result.
Very low conductivity condition is indicated by an additional buzzer which is provided for
immediate attention of the operator.
• Excessive High Conductivity:
With very high dielectric conductivity, the water dielectric allows direct current to flow in
the gap. With more value of d.c. current, therefore, sufficient discharge voltage can not
built-up. As a result, the machining becomes unstable.
• Appropriate Conductivity:
The machining gap becomes uniform when the required value of conductivity is set. With
this condition, the water dielectric wraps the wire uniformly, thereby reducing the wire
breakage.
The conductivity should be maintained to the values are indicated in Technology chart.
In case of machining of Tungsten Carbide, Aluminum and other exotic materials, lower
conductivity below 10 is preferred.

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6 TROUBLES DURING MACHINING

Starting and stabilizing the machining is a skilled craft. For that reason it can only be
incompletely described. It is therefore best to have it demonstrated to you by our Service
Engineer and then to practice under his watchful eyes.

WIRE BREAKAGE:
There are many of causes for wire breakage. The location of the wire breakage provides
important clues to find the probable cause.

Wire Breakage Check Causes and Remedies


Position
1 Wire Inlet Side Wire Tension Reduce the wire tension Slightly
The movement of the tension roller should be smooth.
Check for any groove formation on the Tension roller.
Change if the wire gets trapped completely into the groove
2 Wire electrode Upper Upper flushing set inadequately. Twist or bent on wire.
Inlet position Flushing machining gap Set adequately

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3 Wire Outlet Wire Drive The wire after sparking has become weak due to wear.
Side Increase the feed
Wire-Feed Disturbed wire feed causes wire breakage or produces
mechanism Vertical streaks over the machined surface.
This may be due to Copper deposits or foreign particle got
stuck in the wire guide. Clean the guide
Unsmooth movement of lower roller
Change the bearing of the roller
Feedspool brake, which prevents over-travel of spool, is
not properly set. Set it right.
Machining Setting of IP, no load voltage etc. are too high, that
Condition increasing electrode wear
WF is too low
WT is too high
Set as per the Technology Chart & trim if required
Flushing Clean the lower flushing nozzle
4 Inside of Dielectric Excessive injection pressure causes water dielectric to
machining gap water escape or mix with air, thus developing aerial discharge.
Air will not be trapped if upper & lower flushing gets
balanced in the spark gap. Adjust Flushing.
Conductivity - Low conductivity will cause wire breakage.
Set at 20 & control it within 2 units
Wire Twisted or bent wire will develop discharge concentration
that causes wire breakage.
Wire position towards the end of winding is liable to snap.
WORK-PIECE. Machining of stacked Work-piece is to be cut at lower
Stacked speed.
Clearance between stacked pieces will cause air to be
trapped in between and result in aerial discharge.
Material Crack soles or any flaw in the internal structure of the
Quality work-piece can cause wire breakage.
Work-piece Machining thicker jobs 50 mm and above, parameters like
Thickness wire feed, tension, flushing, conductivity become critical.
Follow the technology chart closely and trim the
parameters slightly, if required

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7 MAINTENANCE

ELEKTRA WIRECUT Electric Discharge Machine is a precision machine and preventive


maintenance of the machine will give long trouble free operation. Improper maintenance will
slowly deteriorate the performance achievable from the machine.

What to Check Frequency Remark


A PULSE GENERATOR UNIT
Input power supply(i.e. 3 phase output of If voltage vary frequently Get the INPUT
1 Daily
stabilizer) power conditions corrected
Machine should not be run for a long
2 Cooling Fans Weekly
period when fan is not working.
Tighten the ring over the connector, if
3 Connectors on rear panel Monthly
looses
4 Fuses - HRC & glass cartridge Weekly Press or tighten, if loose
B MACHINE TOOL
Wire Drive Mechanism- Wire tension roller
1 Daily Wire feed should be smooth
Roller inside lower flushing assembly
2 Wire guide and flushing assemblies 100 M/c Hr Wire should go smoothly
Tighten properly, if loose
3 E & W connections 100 M/c Hr
Clean
Flushing hoses for upper & lower wire To be changed Change after every 6
4
guide assembly months
5 Backlash checking in table drive assembly 2 month Report if more than 4 μm
C DIELECTRIC SYSTEM
EDM dust settles at the bottom of the
Clean the complete system and hoses
1 250 M/c Hr system. Clean the system properly and
also
change water.
Change the paper cartridge filter, in series pressure
2
with filter pump When the > 2 Kg/cm2
Change the deionizer resin when correct
Life of resin may be less or more then
3 conductivity of water can not be
specified depending on water quality.
maintained
4 Conductivity cell 50 M/c Hr Clean it
D DIELECTRIC COOLING SYSTEM
1 Air Filter cleaning Weekly
E PART PROGRAMMING SYSTEM
1 Single phase stabilizer voltage output Daily Set the required value
2 Computer unit cooling fan Weekly

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8 Application TipS

8.1 Application Tip 1: Wire Verticality (Accurate Procedure)


1) Dial verticality block in X-Z & Y-Z plane in 0.002 mm. Dialing is must because normally
after some usage there will be some dent /scratch marks on table due to which there are
chances that verticality block will not be parallel to X-Z & Y-Z plane. Hence resulting in
inaccurate verticality.
2) Ensure Upper flushing assembly is dry. Blow air through QCC provided on Upper flushing
assembly. If there is some water this will result in false or incorrect Sensing /Sparking
resulting in inaccurate verticality.
3) Ensure even spark at both top & bottom Face. Keep Z-axis at 80 mm.

WHAT WILL HAPPEN IF VERTICALITY IS INCORRECT?

A) The squareness of profile cut with respect to top & bottom face will not be correct.
Please note this will also happen if parallelism & flatness of work-piece is not maintained & job top
face is not dialed.
It means that
1) It is necessary to have proper Work piece with parallelism & Flatness maintained.
2) To dial the top face of job
3) Proper verticality is done
4) Squareness of verticality block is O.K. This can be checked on surface plate using height
gauge. It is necessary that customer is maintaining this periodically by doing grinding.
B) If the verticality is not proper, it means that upper & lower guides are not exactly opposite to
each other. This will affect life of wire guide.
C) There are some practices of doing verticality on job. This can create confusion while checking
jobs, as we are not sure that Squareness of opposite sides is in one direction.

8.2 Application Tip 2: Procedure to Import Drawing from Autocad


While making drawing in AutoCAD ensure following things
1. Make poly-line of profile/s including entry element. The direction of the entry line should be
always towards the profile. (Otherwise the direction of the profile will get reversed in AutoCAD
itself. Check that the poly-line created is as per the requirement.
2. After defining poly-line select EXPORT/DXFOUT option.
3. Select required destination drive where you want to export the file.
4. If you are using older ELAPT version, select option of file type as DXF format for AutoCAD
R12.

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5. Select option menu & select `Select Entity’ option in it. This will ensure that you are making
DXF for required profile only.
6. Then select save. You will go back to main AutoCAD screen.
7. Select required profiles & press Enter.
8. Open ELAPT/ ELCAM software.
9. Ensure you have selected data drive where you have exported the DXF file.
10. Select DXF IN command & give necessary data required. You will get the require profile.
(While answering the Query ‘Close Automatically’ consider the requirement of your profile
carefully as the wire offset for first & last motion is zero in ELAPT and ELCAM)

One important care should be taken while defining entry line element in AutoCAD. The
direction of this element should be from start point to profile. Obviously while defining it in
AutoCAD everybody tend to define it from profile to start point. In AutoCAD the profile
elements are aligned to the direction of first element (entry line in our case), which results
in exactly reverse polyline. i.e. entry element will be last element of that polyline. In other
words if you make clockwise selection the poly line generated will be anti clockwise in
direction. This can be checked in AutoCAD itself by using edit option in polyline command.
It can be avoided if we define it properly in AutoCAD itself.

8.3 Application Tip 3: Job Clamping.

Job Clamping plays major role in getting optimum output in Wire Cut machines.
Sufficient margins on two adjacent sides should be provided to ensure claming of job on
worktable.

Ensure that both flushing nozzles are close to job resulting in optimum performance.

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In flush type machines if the flushing nozzles are not close to job then the cutting speed will drop
resulting in reduced output of the job. Drop in cutting speed will be less if one of the nozzles is
close to job.
In case when there is no possibility of having clamping margins where ever possible it is
recommend to hold the job using fixtures Such as Elax / Parallel Voice to ensure that flushing
nozzles are close to job.

8.4 Application Tip 4: Cutting Various Materials.


8.4.1 Carbide cutting.
Carbide is sintered material where carbide particles are sintered in cobalt or nickel base. Melting
point of carbide is much higher than cobalt or nickel so there are chances of cobalt depletion &
micro cracking on cut surface if wrong parameters and methods are used while cutting carbide. To
overcome this carbide cutting should be done at very low conductivity (Ideally at 2-3 units) and at
low current. It is advisable to use mineral bed filtration unit with resin bowl to achieve proper
results on ECOCUT while cutting carbide.

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8.4.2 Aluminum Cutting.
Melting point of aluminum is less. If Aluminum is cut at higher conductivity there are chances of
frequent wire breakages. If conductivity is very high then some times it become impossible to cut
Aluminum. Hence it is recommended to maintain conductivity at 10-20 units while cutting
Aluminum.
8.4.3 Copper cutting.
Copper is good conductor of electricity as well as the melting point is also low. So if the
conductivity of water is high the cutting performance of the machine will be affected. To achieve
good results it is suggested to maintain conductivity maximum at 10-20 units. Note that the
overcuts of copper will be slightly on higher side (0.02 to 0.025 mm/side) as compared to other
materials.
8.4.4 Inconel cutting.
Use of Antielecyrolysis (ae sq) pulse for cutting inconel material will give best results & minimize
the oxidation effect on cut surfaces. Standard steel parameters from technology are applicable. In
case of wire breakages increase Toff value. Cutting speed will drop down by 40-45 % of steel.
8.4.5 PCD cutting. (Applicable for Ultracut, Ultima and eNova Series)
To cut PCD higher sparking voltage level (Vp=2) is used. Keep Ton & Ip values Lower & Toff
value on higher side. (Typ. Ton=102 to 105 , Toff=58 to 63 , Wp=15 , Sv=20 , Sf= 0XXX)
The cutting speed will vary as per the grade of PCD material.
8.5 Application Tip 5: Taper Cutting.
Normally taper is cut to give relief in tool.
Following cares should be taken while cutting taper.
1) Guide span & Worktable height should be measured properly & entered in machine file in
ELAPT/ELCAM Editor. If this is not accurate, the taper will not be accurate.
2) Proper verticality should be done.
3) Grinding of job should be proper (Parallelism & flatness maintained.)
4) Ensure job top face is properly dialed.
5) Keep Z-axis position as mentioned in program.

8.6 Application Tip 6: Land & Taper cutting.


It is always advisable to cut taper first then land because this is economical and very much
essential to get even land. Land accuracies (variation) are mainly dependent on accuracy and
value of taper and variation in dimensional accuracies of the profile. Some variation will be there
because of secondary sparking also.
Please refer the following chart. The chart is applicable to all wire-cut machines in the world.
In this chart it is assumed that the dimensional accuracy of the profile is ± 0.010 mm.

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Taper Angle Land Variation due to Land variation due to
size variation (± 0.010 mm) secondary sparking
1.00 Deg 0.57 mm 0.30 mm
2.00 Deg 0.29 mm 0.15 mm
5.00 Deg 0.11 mm 0.05 mm

In this chart it is assumed that the dimensional accuracy of the profile is ± 0.020 mm.
Taper Angle Land Variation due to Land variation due to
size variation (± 0.020 mm) secondary sparking
1.00 Deg 1.14 0.60 mm
2.00 Deg 0.58 0.30mm
5.00 Deg 0.22 0.10mm

Here the inaccuracies of taper are not considered. There can be variation due to this also and if
the taper angle is less than 1 deg this variation can even be on higher side. However adjusting
program height can compensate these errors
8.7 Application Tip 7: Maintaining Accuracy on Small Radii.
Criticality: The burning effect is observed while cutting profiles with small radii. This is universal
drawback and applicable on all wire cut machines in the world. Use of Radius Control Strategy can
minimize the effect of burning. However, manual programming corrections are required, if the
machine does not support Radius Control Strategy (CRK).
The figure A shows actual profile. If the profile is cut without Radius control then the dimension B
will be oversized in case of Die as shown in figure B. The dimension B will be undersized in case
of Punch as shown in figure C.

This is due to Bicycle effect. In higher end machines there is a provision of corner control &
radius control. If such provisions are not available in machine, this can be done by
correcting it in program. i.e. while programming we will correct the radial dimension by that
error factor. In case of die we will have to reduce it & in case of punch we will have to
increase it.

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8.8 Application Tip 8: Cutting Small Shapes / Holes.
Criticality: It is difficult to maintain the required accuracies while cutting smaller profile. This is
mainly because of removal of slug in parts. This happens as the wall thickness between entry hole
and the final size is less and varying. This results unhealthy sparking which leads to variation in
over cuts and hence inaccuracy. This also results in wire breakages and increased job completion
time. The inaccuracies in this case cannot be removed even in trim cut. Besides this there can be
major problem of slug getting trapped between work-piece and nozzle, which also can damage the
wire guides.
FIGURE A FIGURE B FIGURE C

To overcome this no slug method can be used. The program will be made as shown in figure D
Do not increase the cut by more than 0.050 mm per pass and pass the last two cuts of 0.01 mm
using trim cut parameters and offset. This method does not form any slug. Hence it avoids all
possible inaccuracies. The user can use trim cut settings at high speed.
FIGURE D

8.9 Application Tip 9: Cutting of Big Jobs


Criticality: Maintaining accuracies on big and heavy jobs. If the weight of the job is more then it
tends to distort as the cutting progresses. This results in inaccuracies, which cannot be corrected

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even in, trim cuts. The amount of distortion is totally dependent on size and geometry of the
profile. Refer Figure A.

This is a typical case of material distortion. The profile is big (Dia 200) & thickness is 80 mm. If it is
cut using conventional method, distortions hence inaccuracies are bound to get on job.
Following strategies can be adopted to get desired results. Refer Fig B

A) Prepare the program in parts.


B) Do the roughing and trimming of program
A-B, C-D, E-F, G-H, I-J and K-R.
C) Do the roughing and trimming of program
A-M, C-N, E-O, G-P, I-Q and K-L.
D) Hold the job properly using shims and
adhesive.
E) Do the parting of program B-N, D-O, F-P, H-
J, Q-L and M-R.

8.10 Application Tip 10: Multi Cavity Job with Cavities Close to Each Other.
Criticality: If the wall thickness between two cavities is less, then it is difficult to get the optimum
cutting speed. Also there is a possibility of inaccuracies if the cavities are cut using normal cutting
sequence. This happens mainly because of flushing. If cavities are close to each other (dist
between cavities is less than half of nozzle hole diameter) the flushing gets distorted resulting in
lesser cutting speed. Refer Figure A.

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This is drawing of a copper electrode. Total 9 cavities and the outer profile are to be cut. In
conventional method, after cutting the cavity the slug will be removed resulting in poor flushing
conditions for next cavity. The difficulty will go on increasing as cutting progresses.
To overcome this following method is suggested.
1) Prepare a program as shown in Figure B and do the roughing of cavity no 1-5. However
the slug will not be removed since the full program is not prepared. This will ensure proper
flushing conditions while cutting cavities no 6-9.
2) Now cut cavities 6-9 completely in conventional method and remove the slugs. (Only
roughing)
3) Do the parting of cavities 1-5.
4) Take trim cuts of all cavities.

8.11 Application Tip 11: Cutting of Job with Thin Cross-Section


Criticality: The cross-section is thin. (1 to 2 mm). In these types of profiles, the distortions are
observed if they are cut normal way as shown in figure A. This leads to inaccuracies, which cannot
be removed even in trim cuts.

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Figure A

To avoid distortion following scheme is suggested.

1) Prepare the program as shown in figure B.


a) Cut the outer profile shown with bold line, first (Rough & trim cut)
b) After cutting the outer portion insert shims all through the cut portion. Adhesive is used to hold
the cut portion.
c) Cut the inner profile shown with thin lines. (Rough & trim cut)

By using this scheme the distortion of the profile due to cross-section can be avoided.

Figure B

8.12 Application Tip 12: Cutting of Job with Thin Cross-Section and Long in Length
.
Job Profile: Needle shape profile with length around 80 to 100 mm and width varying from
0.8 to 4 mm.
Criticality: The length of profile is long and the width is too small. Hence if we program and cut the
profile in normal way (as shown in fig A), the job tends to deflect towards ends resulting in
inaccuracies. This is normal phenomenon of material deformation. This will happen even if we
program it as shown in fig B.

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To minimize the effect of material distortion following method is suggested. (Refer figure C)

1) Provide two entry holes.


2) Finish the job in two parts.
3) Hold the job using shims and adhesives.
4) Do the parting.

Important:
1) Provide separate (dedicated) entry holes for each and every job. Do not take entry from Cut
portion, which also will lead to distortions. (Refer Fig D)
2) If wall thickness is very less use same strategy. Keep some material (Stock) in rough-cut &
remove it in trim cut.
3) As far as possible keep holding on larger area for proper strength.

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8.13 Application Tip 13: Entry Hole for Wire EDM

Entry hole plays important role in getting desired accuracies on wire cut job. Position of the entry
hole should be decided after studying the geometry of profile so as to have minimum distortions
during cutting. Ensure even distribution of weight along entry line which will cause minimum
distortions. Refer Figure 1 for details.
Figure 1

Avoid out side entries as this will lead to maximum distortion on job

While cutting punches it is always recommended to have separate entry hole for each punch.
However in some cases of small punches it is not economical then Scheme given in figure 2
should be followed.

Figure 2

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9 Technology Guidelines

9.1 Test Conditions Used for Technology Guidelines


The guidelines given in this manual are evolved under the following test conditions.
1. Input Supply - 3φ 415V AC (+/-1%).
2. Room temperature is maintained at 20°C (+/-1°C).
3. Dielectric water temperature is maintained within 1°C below the machine tool temperature.
4. Proper heat treatment of the work-piece material is done to minimize the residual stresses.
5. Profile entry is taken from a start hole.
6. Upper and lower nozzles are very close to the work-piece (within 0.1 mm to 0.2 mm) during
rough cut. For A, D1, E1, F1, keep the flow meter valve fully open and adjust the gap
between nozzle and work-piece to achieve the required flow rate given in the chart.
7. Wire used is ELEKTRA DURACUT (Special Brass).
8. For steel work-piece material hardness of work-piece is 48-50 Rc.
9. Surface finish mentioned in the chart is measured after glass beading.
10. Profile for Test Cut (Punch).

10MMSQ

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9.2 DC Pulse Technology Guidelines
9.2.1 10 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse
Material: Steel (HCHCr) Thickness: 10 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT HARD HARD
E-Code E20600130 E20600133 E20600134
TON 123 123 105
TOFF 40 40 30
IP 12 12 11
VP 1 1 1
WP 113 113 103
WF 8 8 8
WT 8 8 10
SV 30 30 10
SF 1140 1140 200
CC% 5 5 7
CDwell 0 0 0
CRK
Pressure Kg/cm2 13 13 1
Flushing Top 8 10 2
Flushing Bottom 8 10 2
V gap (Volts) 45~50 45~50 85~90
I gap (Amps) 9~10 9~10 0.4~0.5
Speed mm/min 13~14 13~14 14~16
Offset (R) mm 0.160 *** ***
Offset (R+1) mm *** 0.185 0.140
Offset (R+2) mm *** *** ***
Offset (R+3) mm *** *** ***
Ra (µm) 1.5~1.6 *** 1.15
Rmax (µm) 13~14.5 *** 7.68

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9.2.2 20 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse
Material: Steel (HCHCr) Thickness: 20 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT HARD HARD HARD HARD
E-Code E20600150 E20600153 E20600154 E20600155 E20600156 E20600159
TON 118 118 105 2 8 118
TOFF 36~40 38 30 10 2 55
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 112
WF 8 8 8 8 8 8
WT 8 8 10 10 10 8
SV 20 20 10 10 10 20
SF 2200 2200 150 150 150 2100
CC% 5 5 7 7 7 5
CDwell 0 0 0 0 0 0
CRK
Pressure Kg/cm2 16 15 1 1 1 11
Flushing Top 8 10 2 2 2 8
Flushing Bottom 8 10 2 2 2 8
V gap (Volts) 25~28 25~28 80~85 90~95 80~85 24~26
I gap (Amps) 10.5~11.5 9~10 0.5~0.7 0.2~0.3 0.2~0.3 5~6
Speed mm/min 7~7.5 6.5~7 10.5~12 12~14 10~11 3~3.5
Offset (R) mm 0.160 *** *** *** *** ***
Offset (R+1) mm *** 0.180 0.135 *** *** ***
Offset (R+2) mm *** 0.192 0.147 0.137 *** ***
Offset (R+3) mm *** 0.197 0.152 0.142 0.137 ***
Ra (µm) 1.5~1.6 *** 1~1.1 0.6~0.7 0.35~0.4 ***
Rmax (µm) 12~14 *** 8.5~9 5~6 3~4 ***

Electronica india limited Technology Guidelines for eNova Series Page 42


9.2.3 30 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse
Material: Steel (HCHCr) Thickness: 30 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT HARD HARD HARD HARD
E-Code E20600170 E20600173 E20600174 E20600175 E20600176 E20600179
TON 123 123 105 2 8 118
TOFF 36 43 30 10 2 55
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 112
WF 8 8 8 8 8 8
WT 8 8 10 10 10 8
SV 20 20 10 10 10 20
SF 2150 2150 150 150 150 2070
CC% 5 5 7 7 7 5
CDwell 0 0 0 0 0 0
CRK
Pressure Kg/cm2 16 15 1 1 1 11
Flushing Top 8 10 2 2 2 8
Flushing Bottom 8 10 2 2 2 8
V gap (Volts) 23~24 23~24 85~90 90~95 60~65 24~26
I gap (Amps) 12.5~13.5 9.5~10.5 0.7~0.9 0.4~0.6 0.3~0.4 5~6
Speed mm/min 5.5~6.0 5.1~5.3 11~12 12~13 7~8.5 2~2.5
Offset (R) mm 0.160 **** *** *** *** ***
Offset (R+1) mm *** 0.185 0.135 *** *** ***
Offset (R+2) mm *** 0.197 0.147 0.137 *** ***
Offset (R+3) mm *** 0.202 0.152 0.142 0.137 ***
Ra (µm) 1.5~1.6 *** 1.0~1.2 0.6~0.7 0.35~0.4 ***
Rmax (µm) 10~12 *** 8~9 5~6 3~4 ***

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9.2.4 50 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse
Material: Steel (HCHCr) Thickness: 50 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT HARD HARD HARD HARD
E20600201
E-Code
E20600210 E20600213 E20600214 E20600215 E20600216 9
TON 123 123 105 2 8 118
TOFF 34 42 30 10 2 55
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 112
WF 10 10 8 8 8 8
WT 8 8 10 10 10 8
SV 20 20 10 10 10 20
SF 2120 2100 150 150 150 2070
CC% 5 5 5 5 5 5
CDwell 0 0 0 0 0 0
CRK
Pressure Kg/cm2 16 15 1 1 1 11
Flushing Top 8 10 1 1 1 8
Flushing Bottom 8 10 1 1 1 8
V gap (Volts) 23~24 23~24 75~80 70~75 45~55 24~26
I gap (Amps) 13~14.5 11.0~12.0 0.8~1.0 0.6~0.8 0.4~0.5 5~6
Speed mm/min 4~4.1 3.2~3.4 8.0~10 7.5~9.5 4.5~5.5 2~2.5
Offset ® mm 0.165 *** *** *** *** ***
Offset (R+1) mm *** 0.190 0.135 *** *** ***
Offset (R+2) mm *** 0.202 0.147 0.137 *** ***
Offset (R+3) mm *** 0.207 0.152 0.142 0.137 ***
Ra (µm) 1.5~1.7 *** 1.0~1.2 0.6~0.7 0.4~0.45 ***
Rmax (µm) 10~12 *** 9~11 6~7.5 3~4 ***

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9.2.5 80 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse
Material: Steel (HCHCr) Thickness: 80 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT HARD HARD HARD HARD
E-Code E20600270 E20600273 E20600274 E20600275 E20600276 E20600279
TON 123 123 105 2 8 118
TOFF 40 42 30 10 2 58
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 112
WF 10 10 10 10 10 8
WT 8 8 10 10 10 8
SV 20 20 10 10 10 20
SF 2100 2100 120 120 120 2050
CC% 5 5 0 0 0 5
CDwell 0 0 0 0 0 0
CRK
Pressure Kg/cm2 16 15 2 2 2 11
Flushing Top 8 10 2 2 2 8
Flushing Bottom 8 10 2 2 2 8
V gap (Volts) 22~23 22~23 60~65 55~62 40~45 24~26
I gap (Amps) 11~12.5 10.5~11.5 1.2~1.4 0.6~0.8 0.4~0.5 5~6
Speed mm/min 1.9~2.1 1.7~1.9 6~7.5 6~7.5 4~4.5 1~1.2
Offset ® mm 0.170 *** *** *** *** ***
Offset (R+1) mm *** 0.195 0.135 *** *** ***
Offset (R+2) mm *** 0.208 0.148 0.138 *** ***
Offset (R+3) mm *** 0.215 0.155 0.145 0.140 ***
Ra (µm) 1.5~1.7 *** 1.0~1.2 0.6~0.7 0.4~0.5 ***
Rmax (µm) 11~13.5 *** 9~11 6~7.5 4~5 ***

Electronica india limited Technology Guidelines for eNova Series Page 45


9.2.6 100 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse
Material: Steel (HCHCr) Thickness: 100 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT HARD HARD HARD HARD
E-Code E20600310 E20600313 E20600314 E20600315 E20600316 E20600319
TON 123 123 105 2 8 118
TOFF 42 46 30 10 2 58
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 112
WF 10 10 10 10 10 8
WT 8 8 10 10 10 8
SV 20 20 10 10 10 20
SF 2070 2070 100 100 100 2030
CC% 3 3 3 3 3 5
CDwell 0 0 0 0 0 0
CRK
Pressure Kg/cm2 16 15 2 2 2 11
Flushing Top 8 10 2 2 2 8
Flushing Bottom 8 10 2 2 2 8
V gap (Volts) 21~23 21~23 55~60 54~58 40~45 24~26
I gap (Amps) 10.5~11.5 10~11 1.3~1.4 0.7~0.9 0.5~0.6 5~6
Speed mm/min 1.4~1.5 1.3~1.4 4.5~5.5 4.3~4.8 2.0~2.5 0.8~1
Offset ® mm 0.172 *** *** *** *** ***
Offset (R+1) mm *** 0.205 0.140 *** *** ***
Offset (R+2) mm *** 0.217 0.152 0.142 *** ***
Offset (R+3) mm *** 0.223 0.158 0.148 0.143 ***
Ra (µm) 1.5~1.7 *** 1.0~1.2 0.6~0.8 0.45~0.5 ***
Rmax (µm) 11.5~13.5 *** 9~11 6~8 4~5 ***

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9.2.7 150 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse
Material: Steel (HCHCr) Thickness: 150 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT HARD HARD HARD HARD
E-Code E20600410 E20600413 E20600414 E20600415 E20600416 E20600419
TON 123 123 105 2 8 118
TOFF 42 44 30 5 2 58
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 112
WF 10 10 10 10 10 8
WT 8 9 10 10 10 8
SV 20 20 10 10 10 20
SF 2050 2050 80 80 80 2030
CC% 3 3 3 3 3 5
CDwell 0 0 0 0 0 0
CRK
Pressure Kg/cm2 16 15 2 2 2 11
Flushing Top 8 10 2 2 2 8
Flushing Bottom 8 10 2 2 2 8
V gap (Volts) 21~23 26~28 48~50 45~50 30~38 24~26
I gap (Amps) 11~12 9~10 1.5~1.6 0.9~1 0.5~0.7 3~4.5
Speed mm/min 1.0~1.1 0.8~0.9 2.5~3.5 3.2~4 2.2~2.6 0.4~0.6
Offset ® mm 0.180 *** *** *** *** ***
Offset (R+1) mm *** 0.215 0.140 *** *** ***
Offset (R+2) mm *** 0.225 0.150 0.140 *** ***
Offset (R+3) mm *** 0.230 0.155 0.145 0.140 ***
Ra (µm) 1.6~1.8 *** 0.9~0.1 0.65~0.75 0.6~0.7 ***
Rmax (µm) 13~14.5 *** 8~10 5~6 4~5 ***

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9.2.8 200 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse
Material: Steel (HCHCr) Thickness: 200 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT HARD HARD HARD HARD
E-Code E20600510 E20600513 E20600514 E20600515 E20600516 E20600519
TON 123 123 105 8 12 118
TOFF 44 48 30 10 6 58
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 112
WF 12 12 12 12 12 8
WT 8 9 11 11 11 8
SV 25 25 10 10 10 20
SF 2030 2030 80 80 1020 2010
CC% 3 3 3 3 3 5
CDwell 0 0 0 0 0 0
CRK
Pressure Kg/cm2 16 15 2.5 2.5 2.5 11
Flushing Top 8 8 2.5 2.5 2.5 8
Flushing Bottom 8 8 2.5 2.5 2.5 8
V gap (Volts) 25~28 24~26 31~35 26~28 0.5~0.7 24~26
I gap (Amps) 8~9 7~7.5 2~2.2 0.8~0.9 16~18 3~4.5
Speed mm/min 0.5~0.55 0.5~0.55 1.6~1.8 1.4~1.8 2 0.2~0.3
Offset ® mm 0.185 *** *** *** *** ***
Offset (R+1) mm *** 0.230 0.145 *** *** ***
Offset (R+2) mm *** 0.245 0.157 0.147 *** ***
Offset (R+3) mm *** 0.247 0.162 0.152 0.147 ***
Ra (µm) 1.6~1.8 *** 0.9~1 0.65~0.75 0.55~0.6 ***
Rmax (µm) 13~14.5 *** 8~10 5~6 4~5 ***

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9.2.9 250 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using DC Pulse
Material: Steel (HCHCr) Thickness: 250 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT HARD HARD HARD HARD
E-Code E20600610 E20600613 E20600614 E20600615 E20600616 E20600619
TON 123 123 105 8 102 118
TOFF 46 48 30 10 10 58
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 112
WF 12 12 12 12 12 8
WT 8 9 11 11 11 8
SV 25 25 10 10 10 20
SF 2030 2030 50 50 1020 2010
CC% 3 3 3 3 3 5
CDwell 0 0 0 0 0 0
CRK
Pressure Kg/cm2 16 15 2.5 2.5 2.5 11
Flushing Top 8 8 2.5 2.5 2.5 8
Flushing Bottom 8 8 2.5 2.5 2.5 8
V gap (Volts) 25~27 24~25 26~28 32~38 20~23 24~26
I gap (Amps) 7~7.5 7~7.2 2~2.1 1.2~1.3 0.5~0.7 3~4.5
Speed mm/min 0.35~0.38 0.3~0.35 1.2~1.35 2~2.3 2 0.15~0.2
Offset ® mm 0.190 *** *** *** *** ***
Offset (R+1) mm *** 0.240 0.147 *** *** ***
Offset (R+2) mm *** 0.245 0.152 0.147 *** ***
Offset (R+3) mm *** 0.255 0.162 0.152 0.147 ***
Ra (µm) 1.6~1.8 *** 1.1~1.3 0.65~0.75 0.55~0.6 ***
Rmax (µm) 13~14.5 *** 11~13 5~6 4~5 ***

Electronica india limited Technology Guidelines for eNova Series Page 49


9.2.10 20 mm Copper with Ø0.25 mm Bercocut (Hard) using DC Pulse
Material: Copper Thickness: 20 mm Wire: 0.25 mm Bercocut (Hard) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


E-Code E20652150 E20652151 E20652152 E20652153 E20652154 E20652155 E20652156 E20652157 E20652158 E20652159
TON 123 123 102 2 116
TOFF 42 42 30 10 55
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 102 102 110
WF 9 9 9 9 8
WT 8 8 8 8 8
SV 25 25 10 10 25
SF 1075 1075 150 150 1030
CC% 5 5 5 5 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 28-32 28-32 80-95 70-85 35-40
I gap (Amps) 10-11.5 10-11.5 1 0.8 3.5-4.0
Speed mm/min 7.4-7.5 7.4-7.5 10-12.0 9-11.0 3
Offset ® mm 0.195 *** *** *** ***
Offset (R+1) mm *** 0.217 0.147 *** ***
Offset (R+2) mm *** 0.221 0.156 0.146 ****
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 **** 1.4-1.7 1-1.1 ****
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 50


9.2.11 30 mm Copper with Ø0.25 mm Bercocut (Hard) using DC Pulse
Material: Copper Thickness: 30 mm Wire: 0.25 mm Bercocut (Hard) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


E-Code E20652170 E20652171 E20652172 E20652173 E20652174 E20652175 E20652176 E20652177 E20652178 E20652179
TON 123 123 102 2 116
TOFF 42 42 30 10 55
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 102 102 110
WF 9 9 9 9 8
WT 8 8 8 8 8
SV 25 25 10 10 25
SF 1050 1050 150 150 1020
CC% 5 5 5 5 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 26~28 26~28 80-95 70-80 35-40
I gap (Amps) 10-11.5 10-11.5 1 0.8 3.5-4.0
Speed mm/min 4.9-5.0 4.9-5.0 10-12.0 9-11.0 2
Offset ® mm 0.195 *** *** *** ***
Offset (R+1) mm *** 0.21 0.145 *** ***
Offset (R+2) mm *** 0.22 0.155 0.145 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 **** 1.4-1.7 1-1.1 ****
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 51


9.2.12 50 mm Copper with Ø0.25 mm Bercocut (Hard) using DC Pulse
Material: Copper Thickness: 50 mm Wire: 0.25 mm Bercocut (Hard) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


E-Code E20652210 E20652211 E20652212 E20652213 E20652214 E20652215 E20652216 E20652217 E20652218 E20652219
TON 123 123 102 2 116
TOFF 42 42 30 10 55
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 102 102 110
WF 10 10 10 10 8
WT 8 8 8 8 8
SV 25 25 10 10 25
SF 1030 1030 150 150 1012
CC% 5 5 5 5 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 26~28 26~28 70-80 60-75 35-40
I gap (Amps) 10-11.5 10-11.5 1 0.8 3.5-4.0
Speed mm/min 2.9-3.0 2.9-3.0 9.0-11.0 9-11.0 1.2
Offset ® mm 197 *** *** *** ***
Offset (R+1) mm *** 0.213 0.148 *** ***
Offset (R+2) mm *** 0.218 0.153 0.143 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.4-1.7 1-1.1 ***
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 52


9.2.13 80 mm Copper with Ø0.25 mm Bercocut (Hard) using DC Pulse
Material: Copper Thickness: 80 mm Wire: 0.25 mm Bercocut (Hard) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


E-Code E20652270 E20652271 E20652272 E20652273 E20652274 E20652275 E20652276 E20652277 E20652278 E20652279
TON 123 123 102 2 116
TOFF 45 45 30 10 55
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 102 102 110
WF 10 10 10 10 8
WT 8 8 8 8 8
SV 25 25 10 10 25
SF 1019 1019 120 150 1008
CC% 5 5 5 5 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 26~28 26~28 60-75 55-70 35-40
I gap (Amps) 10-11.5 10-11.5 1 0.8 3.5-4.0
Speed mm/min 1.8-1.9 1.8-1.9 6.5-8 6-7.5 0.8
Offset ® mm 0.201 *** *** *** ***
Offset (R+1) mm *** 0.215 0.145 *** ***
Offset (R+2) mm *** 0.223 0.153 0.143 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.4-1.7 1-1.1 ***
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 53


9.2.14 10 mm Steel (HCHCr) with Ø0.20 mm Bercocut (Hard) using DC Pulse
Material: Steel (HCHCr) Thickness: 10 mm Wire: 0.20 mm Bercocut (Hard) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


E-Code E20550130 E20550131 E20550132 E20550133 E20550134 E20550135 E20550136 E20550137 E20550138 E20550139
TON 123 123 102 2 5 114
TOFF 55 55 30 10 0 58
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 9 9 9 9 9 8
WT 8 8 8 8 8 8
SV 20 20 10 10 10 20
SF 2150 2150 150 150 150 2050
CC% 4 4 4 4 4 0
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 0
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 24-26 24-26 90-98 90-98 95-99 25-28
I gap (Amps) 6.8-7.2 6.8-7.2 0.5-0.7 0.3-0.4 0.2-0.3 3.0-3.5
Speed mm/min 7.8-8.2 7.8-8.2 13-14 14-15 13-13.5 3.6-3.8
Offset ® mm 0.132 *** *** *** *** ***
Offset (R+1) mm *** 0.15 0.115 *** *** ***
Offset (R+2) mm *** 0.158 0.123 0.113 *** ***
Offset (R+3) mm *** 0.165 0.13 0.12 0.115 ***
Ra (µm) 2.5-2.9 2.5-2.9 1.6-1.8 1.0-1.2 0.4-0.5 ***
Rmax (µm) 17-20 17-20 11-14.0 7.0-10.0 4.0-6.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 54


9.2.15 20 mm Steel (HCHCr) with Ø0.20 mm Bercocut (Hard) using DC Pulse
Material: Steel (HCHCr) Thickness: 20 mm Wire: 0.20 mm Bercocut (Hard) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


E-Code E20550150 E20550151 E20550152 E20550153 E20550154 E20550155 E20550156 E20550157 E20550158 E20550159
TON 123 123 102 2 5 114
TOFF 52 52 30 10 0 58
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 9 9 9 9 9 8
WT 8 8 8 8 8 8
SV 20 20 10 10 10 20
SF 2150 2150 150 150 150 2050
CC% 4 4 4 4 4 0
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 0
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21-24 21-24 80-90 90-95 95-99 25-28
I gap (Amps) 6.5-7.5 6.5-7.5 0.8-1.0 0.4-0.5 0.2-0.3 3.0-3.5
Speed mm/min 4.0-4.3 4.0-4.3 10-12.0 11-12.5 13-14 2.0-2.3
Offset ® mm 0.135 *** *** *** *** ***
Offset (R+1) mm *** 0.154 0.114 *** *** ***
Offset (R+2) mm *** 0.164 0.124 0.114 *** ***
Offset (R+3) mm *** 0.168 0.128 0.118 0.113 ***
Ra (µm) 2.5-2.9 2.5-2.9 1.6-1.8 1.0-1.2 0.4-0.5 ***
Rmax (µm) 17-20 17-20 11-14.0 7.0-10.0 4.0-6.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 55


9.2.16 30 mm Steel (HCHCr) with Ø0.20 mm Bercocut (Hard) using DC Pulse
Material: Steel (HCHCr) Thickness: 30 mm Wire: 0.20 mm Bercocut (Hard) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


E-Code E20550170 E20550171 E20550172 E20550173 E20550174 E20550175 E20550176 E20550177 E20550178 E20550179
TON 123 123 102 2 5 114
TOFF 52 52 30 10 0 58
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 9 9 9 9 9 8
WT 8 8 8 8 8 8
SV 20 20 10 10 10 20
SF 2120 2100 120 120 120 2050
CC% 4 4 4 4 4 0
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 0
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21-24 21-24 70-80 80-90 95-99 25-28
I gap (Amps) 7.0-8.0 7.0-8.0 0.8-1.0 0.5-0.7 0.3-0.5 3.0-3.5
Speed mm/min 2.8-3.0 2.8-3.0 7.5-9.0 8.0-9.0 10.0-11.0 1.2-1.4
Offset ® mm 0.14 *** *** *** *** ***
Offset (R+1) mm *** 0.16 0.115 *** *** ***
Offset (R+2) mm *** 0.164 0.124 0.114 *** ***
Offset (R+3) mm *** 0.175 0.13 0.12 0.115 ***
Ra (µm) 2.5-2.9 2.5-2.9 1.6-1.8 1.0-1.2 0.4-0.5 ***
Rmax (µm) 17-20 17-20 11-14.0 7.0-10.0 4.0-6.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 56


9.2.17 50 mm Steel (HCHCr) with Ø0.20 mm Bercocut (Hard) using DC Pulse
Material: Steel (HCHCr_ Thickness: 50 mm Wire: 0.20 mm Bercocut (Hard) Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


E-Code E20550210 E20550211 E20550212 E20550213 E20550214 E20550215 E20550216 E20550217 E20550218 E20550219
TON 123 123 102 2 5 114
TOFF 52 52 30 10 0 58
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 10 10 10 10 10 8
WT 8 8 8 8 8 8
SV 20 20 10 10 10 20
SF 2100 2100 120 120 120 2050
CC% 4 4 4 4 4 0
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 0
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21-24 21-24 65-75 70-80 85-95 21-25
I gap (Amps) 6.5-7.5 6.5-7.5 1.0-1.4 0.7-1.0 0.3-0.5 3.0-3.5
Speed mm/min 1.6-1.7 1.6-1.7 6.0-8.0 7.0-8.0 9.0-10.0 0.6-0.8
Offset ® mm 0.142 *** *** *** *** ***
Offset (R+1) mm *** 0.17 0.115 *** *** ***
Offset (R+2) mm *** 0.18 0.124 0.114 *** ***
Offset (R+3) mm *** 0.185 0.13 0.12 0.115 ***
Ra (µm) 2.5-2.9 2.5-2.9 1.6-1.8 1.0-1.2 0.4-0.5 ***
Rmax (µm) 17-20 17-20 11-14.0 7.0-10.0 4.0-6.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 57


9.2.18 20 mm Copper with Ø0.20 mm Shalimar using DC Pulse
Material: Copper Thickness: 20 mm Wire: 0.20 mm Shalimar Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT
E-Code E20502150 E20502151 E20502152 E20502153 E20502154 E20502155 E20502156 E20502157 E20502158 E20502159
TON 120 120 102 2 116
TOFF 50 50 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 8 8 8 8 8
WT 7 7 8 8 7
SV 25 25 10 10 25
SF 2150 2150 150 150 2100
CC% 4 4 5 5 5
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 3 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 26~28 26~28 80~90 75~85 27~30
I gap (Amps) 7.0~7.5 7.0~7.5 0.9~1.1 0.7~0.8 3.5~4.5
Speed mm/min 5.2~5.3 5.2~5.3 10.5~11.5 10.5~11.5 3.15~3.25
Offset ® mm 0.158 *** *** *** ***
Offset (R+1) mm *** 0.184 0.124 *** ***
Offset (R+2) mm *** 0.193 0.133 0.123 ****
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.0~1.2 0.85~0.95 ****
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 58


9.2.19 30 mm Copper with Ø0.20 mm Shalimar using DC Pulse
Material: Copper Thickness: 30 mm Wire: 0.20 mm Shalimar Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT
E-Code E20502170 E20502171 E20502172 E20502173 E20502174 E20502175 E20502176 E20502177 E20502178 E20502179
TON 120 120 102 2 116
TOFF 50 50 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 9 9 8 8 8
WT 7 7 8 8 7
SV 25 25 10 10 25
SF 2100 2100 120 120 2040
CC% 4 4 5 5 5
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 26~29 26~29 75~85 60~70 26~28
I gap (Amps) 7.5~8.5 7.5~8.5 0.8~1.1 0.7~0.8 3.5~4.5
Speed mm/min 3.3~3.4 3.3~3.4 8.5~9.5 8.0~9.0 2.0~2.1
Offset ® mm 0.165 *** *** *** ***
Offset (R+1) mm *** 0.188 0.123 *** ***
Offset (R+2) mm *** 0.196 0.131 0.121 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.0~1.2 0.85~0.95 ****
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 59


9.2.20 50 mm Copper with Ø0.20 mm Shalimar using DC Pulse
Material: Copper Thickness: 50 mm Wire: 0.20 mm Shalimar Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT
E-Code E20502210 E20502211 E20502212 E20502213 E20502214 E20502215 E20502216 E20502217 E20502218 E20502219
TON 120 120 102 2 116
TOFF 50 50 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 9 9 8 8 8
WT 7 7 8 8 7
SV 25 25 10 10 25
SF 2080 2080 100 120 2040
CC% 4 4 5 5 5
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 26~28 26~28 60~70 60~70 16~29
I gap (Amps) 7.0~7.5 7.0~7.5 1.2~1.6 0.7~0.9 3.5~4.0
Speed mm/min 1.85~1.95 1.85~1.95 5.4~5.8 6.0~6.5 1.05~1.15
Offset ® mm 0.165 *** *** *** ***
Offset (R+1) mm *** 0.194 0.124 *** ***
Offset (R+2) mm *** 0.204 0.134 0.124 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.0~1.2 0.85~0.95 ***
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 60


9.2.21 80 mm Copper with Ø0.20 mm Shalimar using DC Pulse
Material: Copper Thickness: 80 mm Wire: 0.20 mm Shalimar Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT
E-Code E20502270 E20502271 E20502272 E20502273 E20502274 E20502275 E20502276 E20502277 E20502278 E20502279
TON 120 120 102 2 116
TOFF 51 51 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 9 9 8 8 8
WT 7 7 8 8 7
SV 25 25 10 10 25
SF 2040 2040 80 100 2020
CC% 4 4 5 5 5
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 26~29 26~29 50~60 50~60 26~29
I gap (Amps) 6.5~7.5 6.5~7.5 1.4~1.8 0.7~0.9 3.5~4.0
Speed mm/min 1.05~1.15 1.05~1.15 3.4~3.8 4.0~4.5 0.7~0.75
Offset ® mm 0.165 *** *** *** ***
Offset (R+1) mm *** 0.203 0.128 *** ***
Offset (R+2) mm *** 0.21 0.135 0.125 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.0~1.2 0.85~0.95 ***
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 61


9.2.22 120 mm Copper with Ø0.20 mm Shalimar using DC Pulse
Material: Copper Thickness: 120 mm Wire: 0.20 mm Shalimar Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT
E-Code E20502350 E20502351 E20502352 E20502353 E20502354 E20502355 E20502356 E20502357 E20502358 E20502359
TON 120 120 102 116
TOFF 52 52 30 56
IP 12 12 11 12
VP 1 1 1 1
WP 115 115 103 110
WF 10 10 10 9
WT 5 5 8 5
SV 25 25 10 25
SF 2025 2025 70 2020
CC% 4 4 4 5
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 15 15 2 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 26~29 26~29 50~60 26~29
I gap (Amps) 6.5~7.5 6.5~7.5 1.4~1.8 3.2~4.2
Speed mm/min 0.6~0.7 0.65~0.70 2.5~2.8 0.40~0.45
Offset ® mm 0.17 *** *** ***
Offset (R+1) mm *** 0.209 0.127 ***
Offset (R+2) mm *** *** *** ***
Offset (R+3) mm *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.0~1.2 ***
Rmax (µm) 15-19 *** 10-13.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 62


9.2.23 150 mm Copper with Ø0.20 mm Shalimar using DC Pulse
Material: Copper Thickness: 150 mm Wire: 0.20 mm Shalimar Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT
E-Code E20502410 E20502411 E20502412 E20502413 E20502414 E20502415 E20502416 E20502417 E20502418 E20502419
TON 120 120 102 116
TOFF 52 52 30 56
IP 12 12 11 12
VP 1 1 1 1
WP 115 115 103 110
WF 11 11 10 9
WT 5 5 8 5
SV 25 25 10 25
SF 2020 2020 70 2010
CC% 4 4 5 5
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 15 15 2 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 26~29 26~29 50~60 26~29
I gap (Amps) 5.5~6.5 5.5~6.5 1.4~1.8 3.5~4.0
Speed mm/min 0.50~0.55 0.50~0.55 1.8~2.0 0.30~0.35
Offset ® mm 0.175 *** *** ***
Offset (R+1) mm *** 0.21 0.128 ***
Offset (R+2) mm *** *** *** ***
Offset (R+3) mm *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.0~1.2 ***
Rmax (µm) 15-19 *** 10-13.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 63


9.2.24 10 mm Steel (HCHCr) with Ø0.15 mm Bercocut (Hard) using DC Pulse
Material: Copper Thickness: 10 mm Wire: 0.15 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E20450130 E20450131 E20450132 E20450133 E20450134 E20450135 E20450136 E20450137 E20450138 E20450139
TON 114 114 102 2 110
TOFF 52 52 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 112 112 103 103 110
WF 8 8 8 8 8
WT 4 4 6 6 4
SV 20 20 10 10 20
SF 2150 2150 100 150 2050
CC% 5 5 0 0 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 12 12 3 3 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 23~24 23~24 65~70 40~45 20~22
I gap (Amps) 3.5~4.0 3.5~4.0 0.5~0.6 0.3~0.5 2.0~2.3
Speed mm/min 4.8~5.0 4.8~5.0 6~6.5 4.5~5.2 3.3~3.4
Offset ® mm 0.1 *** *** *** ***
Offset (R+1) mm *** 0.112 0.087 *** ***
Offset (R+2) mm *** 0.127 0.102 0.087 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.6~2.8 2.6~2.8 1.5~1.7 1.1~1.2 ***
Rmax (µm) 16~19 16~19 11~13 8~10 ***

Electronica india limited Technology Guidelines for eNova Series Page 64


9.2.25 20 mm Steel (HCHCr) with Ø0.15 mm Bercocut (Hard) using DC Pulse
Material: Copper Thickness: 20 mm Wire: 0.15 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E20450150 E20450151 E20450152 E20450153 E20450154 E20450155 E20450156 E20450157 E20450158 E20450159
TON 114 114 102 2 110
TOFF 51 51 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 112 112 103 103 110
WF 10 10 10 10 8
WT 4 4 6 6 4
SV 20 20 10 10 20
SF 2100 2100 150 150 2050
CC% 5 5 0 0 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 12 12 3 3 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 21~24 21~24 40~45 30~40 20~23
I gap (Amps) 3.8~4.2 3.8~4.2 50~60 0.3~0.4 2.0~2.5
Speed mm/min 2.6~2.8 2.6~2.8 5.5~6.5 3.5~4.0 1.6~1.7
Offset ® mm 0.102 *** *** *** ***
Offset (R+1) mm *** 0.115 0.085 *** ***
Offset (R+2) mm *** 0.13 0.1 0.085 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.6~2.8 2.6~2.8 1.5~1.7 1.1~1.2 ***
Rmax (µm) 16~19 16~19 11~13 8~10 ***

Electronica india limited Technology Guidelines for eNova Series Page 65


9.2.26 30 mm Steel (HCHCr) with Ø0.15 mm Bercocut (Hard) using DC Pulse
Material: Copper Thickness: 30 mm Wire: 0.15 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E20450170 E20450171 E20450172 E20450173 E20450174 E20450175 E20450176 E20450177 E20450178 E20450179
TON 114 114 102 2 110
TOFF 52 52 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 112 112 103 103 110
WF 10 10 10 10 8
WT 4 4 6 6 4
SV 20 20 10 10 20
SF 2080 2080 150 150 2050
CC% 5 5 0 0 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 12 12 3 3 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 21~23 21~23 40~45 32~38 20~22
I gap (Amps) 3.5~4.5 3.5~4.5 0.6~0.7 0.3~0.4 2.0~2.5
Speed mm/min 1.5~1.6 1.5~1.6 5.0~5.5 3.2~3.8 0.80~0.85
Offset ® mm 0.102 *** *** *** ***
Offset (R+1) mm *** 0.118 0.088 *** ***
Offset (R+2) mm *** 0.135 0.103 0.088 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.6~2.8 2.6~2.8 1.5~1.7 1.1~1.2 ***
Rmax (µm) 16~19 16~19 11~13 8~10 ***

Electronica india limited Technology Guidelines for eNova Series Page 66


9.2.27 50 mm Steel (HCHCr) with Ø0.15 mm Bercocut (Hard) using DC Pulse
Material: Copper Thickness: 50 mm Wire: 0.15 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E20450210 E20450211 E20450212 E20450213 E20450214 E20450215 E20450216 E20450217 E20450218 E20450219
TON 114 114 102 2 110
TOFF 54 54 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 112 112 103 103 110
WF 10 10 10 10 8
WT 4 4 6 6 4
SV 20 20 10 10 20
SF 2060 2060 120 120 2040
CC% 5 5 0 0 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 12 12 3 3 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 20~22 20~22 36~42 38~45 20~23
I gap (Amps) 3.0~4.0 3.0~4.0 0.6~0.8 0.3~0.5 2.0~2.5
Speed mm/min 0.80~0.85 0.80~0.85 3.0~3.5 2.5~3.0 0.50~0.55
Offset ® mm 0.105 *** *** *** ***
Offset (R+1) mm *** 0.118 0.088 *** ***
Offset (R+2) mm *** 0.14 0.105 0.09 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.6~2.8 2.6~2.8 1.5~1.7 1.1~1.2 ***
Rmax (µm) 16~19 16~19 11~13 8~10 ***

Electronica india limited Technology Guidelines for eNova Series Page 67


9.2.28 80 mm Steel (HCHCr) with Ø0.15 mm Bercocut (Hard) using DC Pulse
Material: Copper Thickness: 80 mm Wire: 0.15 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: DC

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E20450270 E20450271 E20450272 E20450273 E20450274 E20450275 E20450276 E20450277 E20450278 E20450279
TON 114 114 102 2 110
TOFF 52 52 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 112 112 103 103 110
WF 10 10 10 10 8
WT 4 4 6 6 4
SV 20 20 10 10 20
SF 2020 2020 1025 1030 2020
CC% 5 5 0 0 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 12 12 3 3 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 21~24 21~24 22~28 20~25 20~23
I gap (Amps) 3.2~3.8 3.2~3.8 0.6~0.8 0.3~0.4 2~2.5
Speed mm/min 0.50~0.55 0.50~0.55 2.4~2.6 3.2~3.3 0.2~0.25
Offset ® mm 0.105 *** *** *** ***
Offset (R+1) mm *** 0.128 0.088 *** ***
Offset (R+2) mm *** 0.141 0.101 0.086 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.6~2.8 2.6~2.8 1.5~1.7 1.1~1.2 ***
Rmax (µm) 16~19 16~19 11~13 8~10 ***

Electronica india limited Technology Guidelines for eNova Series Page 68


9.3 AE Pulse Technology Guidelines
9.3.1 30 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse.
Material: Steel (HCHCr) Thickness: 30 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT HARD HARD HARD HARD HARD HARD
E-Code E21600170 E21650171 E21650172 E21650173 E21650174 E21650175 E21650176 E21650177 E21650178 E21650179
TON 323 322 323 305 202 203 316
TOFF 42~45 48 44~46 30 20 0 55
IP 12 12 12 11 11 10 12
VP 1 1 1 1 1 1 1
WP 115 108 115 102 102 102 110
WF 10 8 8 8 8 8 8
WT 11 9 12 12 12 12 11
SV 20 20 20 10 10 10 20
SF 2100 2100 2100 200 1070 1080 2050
CC% 5 5 5 7 7 7 0
CS % 100 100 75-80 100 100 100 100
CDwell 0 0 0 0 0 0 0
CRK 3 5 3 3 3 3 0
Pressure Kg/cm2 15 8 15 0 0 0 10
Flushing Top 8 8 8 2 2 2 8
Flushing Bottom 8 8 8 2 2 2 8
V gap (Volts) 23~24 21~23 23~24 46~50 37~43 50~55 24~26
I gap (Amps) 11 7.5~8.5 10 1.5 1 0.5 4.5~4.7
Speed mm/min 4.4~4.6 2.9~3.0 4.2~4.3 6.0~9.0 8.5~9.5 9~11 2.1~2.2
Offset (R) mm 0.16 0.16 *** *** *** *** ***
Offset (R+1) mm *** *** 0.183 0.133 *** *** ***
Offset (R+2) mm *** *** 0.193 0.143 0.133 *** ***
Offset (R+3) mm *** *** 0.197 0.147 0.137 0.133 ***
Ra (µm) 2.5~3.0 *** 2.5~3.0 1.4~1.6 1.0-1.2 0.3~0.5 ***
Rmax (µm) 25~32 *** 25~32 14~16 10~12 4~8 ***

Electronica india limited Technology Guidelines for eNova Series Page 69


9.3.2 40 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse.
Material: Steel (HCHCr) Thickness: 40 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD
E-Code E21650190 E21650191 E21650192 E21650193 E21650194 E21650195 E21650196 E21650197 E21650198 E21650199
TON 323 321 323 305 202 205 316
TOFF 48 54 48 30 10 0 55
IP 12 12 12 11 11 10 12
VP 1 1 1 1 1 1 1
WP 115 108 115 103 103 3 110
WF 9 8 9 9 9 9 8
WT 9 9 9 10 10 10 8
SV 20 20 20 10 10 10 20
SF 2100 2100 2100 170 1075 1075 2060
CC% 5 5 5 5 5 5 5
CS % 100 100 75-80 100 100 100 100
CDwell 0 0 0 0 0 0 0
CRK 5 5 5 5 5 5 0
Pressure Kg/cm2 15 8 15 3 3 3 10
Flushing Top 8 8 8 2 2 2 8
Flushing Bottom 8 8 8 2 2 2 8
V gap (Volts) 22~23 21~23 22~23 45~55 50~55 50~55 24~26
I gap (Amps) 10.0~10.5 7.5~8.5 10.0~10.5 1.0~1.5 0.8~1.1 0.4~0.5 4.5~4.7
Speed mm/min 3.0~3.5 2.15~2.25 3.0~3.5 6.0~7.0 7.2~7.5 7.0~7.5 2.1~2.2
Offset (R) mm 0.16 0.16 *** *** *** *** ***
Offset (R+1) mm *** *** 0.182 0.132 *** *** ***
Offset (R+2) mm *** *** 0.192 0.142 0.132 *** ***
Offset (R+3) mm *** *** 0.198 0.148 0.138 0.133 ***
Ra (µm) 2.5~3.0 *** *** 1.4~1.6 1.0~1.2 0.45~0.55 ***
Rmax (µm) 25~32 *** *** 14~16 10~12 4~8 ***

Electronica india limited Technology Guidelines for eNova Series Page 70


9.3.3 50 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse.
Material: Steel (HCHCr) Thickness:50 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT HARD HARD HARD HARD HARD HARD
E-Code E21600210 E21650211 E21650212 E21650213 E21650214 E21650215 E21650216 E21650217 E21650218 E21650219
TON 323 322 323 305 202 205 316
TOFF 45~48 48 46~49 30 20 0 55
IP 12 12 12 11 11 10 12
VP 1 1 1 1 1 1 1
WP 115 108 115 102 102 102 110
WF 10 8 10 10 10 10 8
WT 11 9 12 12 12 12 11
SV 20 20 20 10 10 10 20
SF 2100 2100 2100 150 1060 1050 2050
CC% 5 5 5 5 5 5 0
CS % 100 100 75-80 100 100 100 100
CDwell 0 0 0 0 0 0 0
CRK 5 5 5 5 5 5 0
Pressure Kg/cm2 15 8 15 0 0 0 10
Flushing Top 8 8 8 2 2 2 8
Flushing Bottom 8 8 8 2 2 2 8
V gap (Volts) 21~22 21~23 21~22 40~45 54~55 53~54 23~26
I gap (Amps) 12.5 7.5~8.5 11 1.5 1 0.5 5.5~6.0
Speed mm/min 2.8~2.9 1.7~1.8 2.7~2.8 4.4~4.8 6.0-6.1 5 1.2~1.3
Offset (R) mm 0.161 0.161 *** *** *** *** ***
Offset (R+1) mm *** *** 0.182 0.132 *** *** ***
Offset (R+2) mm *** *** 0.192 0.142 0.132 *** ***
Offset (R+3) mm *** *** 0.198 0.148 0.138 0.133 ***
Ra (µm) 2.5~3.0 *** 2.5~3.0 1.4~1.6 1.0-1.2 0.3~0.5 ***
Rmax (µm) 25~32 *** 25~32 14~16 10~12 4~8 ***

Electronica india limited Technology Guidelines for eNova Series Page 71


9.3.4 60 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse.
Material: Steel (HCHCr) Thickness: 60 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD
E-Code E21650230 E21650231 E21650232 E21650233 E21650234 E21650235 E21650236 E21650237 E21650238 E21650239
TON 323 321 323 305 202 205 316
TOFF 49 54 49 30 10 0 55
IP 12 12 12 11 11 10 12
VP 1 1 1 1 1 1 1
WP 115 108 115 103 103 3 110
WF 9 8 9 9 9 9 8
WT 9 9 9 10 10 10 11
SV 20 20 20 10 10 10 20
SF 2100 2100 2100 130 1052 1045 2060
CC% 5 5 5 5 5 5 5
CS % 100 100 75-80 100 100 100 100
CDwell 0 0 0 0 0 0 0
CRK 5 5 5 5 5 5 0
Pressure Kg/cm2 15 8 15 3 3 3 10
Flushing Top 8 8 8 2 2 2 8
Flushing Bottom 8 8 8 2 2 2 8
V gap (Volts) 22~23 21~23 22~23 45~50 50~55 50~55 24~26
I gap (Amps) 10.0~10.5 7.5~8.5 10.0~10.5 1.0~1.3 0.7~0.9 0.4~0.6 4.5~4.7
Speed mm/min 2.0~2.4 1.30~1.35 2.0~2.4 4.0~5.0 5.0~5.4 4.0~4.6 1.05~1.15
Offset (R) mm 0.162 0.162 *** *** *** *** ***
Offset (R+1) mm *** *** 0.184 0.133 *** *** ***
Offset (R+2) mm *** *** 0.194 0.143 0.133 *** ***
Offset (R+3) mm *** *** 0.199 0.148 0.138 0.133 ***
Ra (µm) 2.5~3.0 *** *** 1.4~1.6 1.0~1.2 0.45~0.55 ***
Rmax (µm) 25~32 *** *** 14~16 10~12 4~8 ***

Electronica india limited Technology Guidelines for eNova Series Page 72


9.3.5 70 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse.
Material: Steel (HCHCr) Thickness: 70 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD
E-Code E21650250 E21650251 E21650252 E21650253 E21650254 E21650255 E21650256 E21650257 E21650258 E21650259
TON 323 321 323 105 202 205 316
TOFF 49 54 49 30 10 0 55
IP 12 12 12 11 11 10 12
VP 1 1 1 1 1 1 1
WP 115 108 115 103 103 3 110
WF 9 8 9 9 9 9 8
WT 9 9 9 10 10 10 8
SV 20 20 20 10 10 10 20
SF 2100 2100 2100 100 1048 1042 2060
CC% 5 5 5 5 5 5 5
CS % 100 100 75-80 100 100 100 100
CDwell 0 0 0 0 0 0 0
CRK 5 5 5 5 5 5 0
Pressure Kg/cm2 15 8 15 3 3 3 10
Flushing Top 8 8 8 2 2 2 8
Flushing Bottom 8 8 8 2 2 2 8
V gap (Volts) 22~23 21~23 22~23 45~50 60~70 45~55 24~26
I gap (Amps) 10.0~10.5 7.5~8.5 10.0~10.5 0.8~1.2 0.7~0.8 0.4~0.5 4.2~4.5
Speed mm/min 1.8~2.0 1.15~1.25 1.8~2.0 3.0~4.0 4.0~4.8 4.0~4.3 0.85~0.95
Offset (R) mm 0.163 0.163 *** *** *** *** ***
Offset (R+1) mm *** *** 0.187 0.134 *** *** ***
Offset (R+2) mm *** *** 0.197 0.144 0.134 *** ***
Offset (R+3) mm *** *** 0.201 0.148 0.138 0.133 ***
Ra (µm) 2.4~2.6 2.5~3.0 *** 1.4~1.6 1.0~1.2 0.45~0.55 ***
Rmax (µm) 25~32 25~32 *** 14~16 10~12 4~8 ***

Electronica india limited Technology Guidelines for eNova Series Page 73


9.3.6 80 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse.
Material: Steel (HCHCr) Thickness: 80 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT HARD HARD HARD HARD HARD HARD
E-Code E21600270 E21650271 E21650272 E21650273 E21650274 E21650275 E21650276 E21650277 E21650278 E21650279
TON 323 322 323 305 202 203 316
TOFF 45~49 48 45~49 30 20 0 55
IP 12 12 12 11 11 10 12
VP 1 1 1 1 1 1 1
WP 115 108 115 102 103 103 110
WF 10 8 10 10 10 10 8
WT 9 9 12 12 12 12 11
SV 20 20 20 10 10 10 20
SF 2100 2100 2100 80 1040 1040 2050
CC% 3 5 3 3 3 3 0
CS % 100 100 75-80 100 100 100 100
CDwell 0 0 0 0 0 0 0
CRK 5 5 5 5 5 5 0
Pressure Kg/cm2 15 8 15 0 0 0 10
Flushing Top 8 8 8 2~3 2~3 2~3 8
Flushing Bottom 8 8 8 2~3 2~3 2~3 8
V gap (Volts) 23~24 21~23 23~24 43~45 52~54 30~35 23~26
I gap (Amps) 11 7.5~8.5 10 1 0.75 0.5 5~5.2
Speed mm/min 1.7~1.8 1.0~1.1 1.6~1.7 2.4~3 4~4.2 4 0.7~0.8
Offset (R) mm 0.165 0.165 *** *** *** *** ***
Offset (R+1) mm *** *** 0.19 0.135 *** *** ***
Offset (R+2) mm *** *** 0.2 0.145 0.135 *** ***
Offset (R+3) mm *** *** 0.204 0.149 0.139 0.134 ***
Ra (µm) 2.5~3.0 *** 2.5~3.0 1.4~1.7 1.0-1.2 0.4~0.6 ***
Rmax (µm) 25~32 *** 25~32 14~18 10~14 4~8 ***

Electronica india limited Technology Guidelines for eNova Series Page 74


9.3.7 90 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse.
Material: Steel (HCHCr) Thickness:90 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD
E-Code E21650290 E21650291 E21650292 E21650293 E21650294 E21650295 E21650296 E21650297 E21650298 E21650299
TON 323 321 323 305 202 210 316
TOFF 50 54 50 30 5 4 55
IP 12 12 12 11 11 10 12
VP 1 1 1 1 1 1 1
WP 115 110 115 103 103 3 110
WF 10 8 10 9 9 9 8
WT 10 9 10 10 10 10 8
SV 20 20 20 10 10 10 20
SF 2100 2100 2100 70 1038 180 2050
CC% 5 5 5 5 5 5 5
CS % 100 100 75-80 100 100 100 100
CDwell 0 0 0 0 0 0 0
CRK 5 5 5 5 5 5 0
Pressure Kg/cm2 15 8 15 3 3 3 10
Flushing Top 8 8 8 2 2 2 8
Flushing Bottom 8 8 8 2 2 2 8
V gap (Volts) 22~23 21~23 22~23 50~55 50~55 30~35 24~26
I gap (Amps) 8.5~9.0 7.5~8.0 8.5~9.0 1.5~1.8 0.7~0.8 0.4~0.5 4.8~5.0
Speed mm/min 1.2~1.4 0.90~0.95 1.2~1.4 2.2~2.6 3.5~3.8 3.0~3.2 0.65~0.70
Offset (R) mm 0.167 0.167 *** *** *** *** ***
Offset (R+1) mm *** *** 0.193 0.135 *** *** ***
Offset (R+2) mm *** *** 0.205 0.147 0.136 *** ***
Offset (R+3) mm *** *** 0.211 0.153 0.143 0.135 ***
Ra (µm) 2.5~3.0 *** *** 1.4~1.6 1.0~1.2 0.45~0.55 ***
Rmax (µm) 25~32 *** *** 14~16 10~12 4~8 ***

Electronica india limited Technology Guidelines for eNova Series Page 75


9.3.8 100 mm Steel (HCHCr) with Ø0.25 mm Brass Wire using AE Pulse.
Material: Steel (HCHCr) Thickness: 100 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT HARD HARD HARD HARD HARD HARD
E-Code E21600310 E21650311 E21650312 E21650313 E21650314 E21650315 E21650316 E21650317 E21650318 E21650319
TON 323 122 323 305 202 203 316
TOFF 48~50 48 48~50 30 20 0 55
IP 12 12 12 11 11 10 12
VP 1 1 1 1 1 1 1
WP 115 108 115 103 103 103 110
WF 10 8 10 8 10 10 8
WT 11 9 12 10 12 12 11
SV 20 20 20 12 10 10 20
SF 2100 2100 2100 60 1025 200 2050
CC% 3 5 3 3 3 3 0
CS % 100 100 75-80 100 100 100 100
CDwell 0 0 0 0 0 0 0
CRK 5 5 5 5 5 5 0
Pressure Kg/cm2 15 8 15 0 0 0 10
Flushing Top 8 8 8 2~3 2~3 2~3 8
Flushing Bottom 8 8 8 2~3 2~3 2~3 8
V gap (Volts) 23~24 21~23 23~24 40~43 50~53 25~28 23~26
I gap (Amps) 8.5 7.0~7.5 8.5 1.5~2.0 1 0.5 4~4.3
Speed mm/min 1~1.1 0.80~0.85 1~1.1 1.8~2.2 2.4-2.5 2.5 0.45~0.55
Offset (R) mm 0.17 0.17 *** *** *** *** ***
Offset (R+1) mm *** *** 0.196 0.136 *** *** ***
Offset (R+2) mm *** *** 0.209 0.149 0.137 *** ***
Offset (R+3) mm *** *** 0.217 0.157 0.145 0.135 ***
Ra (µm) 2.5~3.0 *** 2.5~3.0 1.5~2 1.0~1.4 0.5~0.7 ***
Rmax (µm) 25~32 *** 25~32 15~22 10~15 8~10 ***

Electronica india limited Technology Guidelines for eNova Series Page 76


9.3.9 20 mm Copper with Ø0.25 mm Bercocut using AE Pulse.
Material: Copper Thickness: 20 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E21652150 E21652151 E21652152 E21652153 E21652154 E21652155 E21652156 E21652157 E21652158 E21652159
TON 323 323 302 202 320
TOFF 48 48 30 10 55
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 102 102 110
WF 9 9 9 9 8
WT 10 10 10 10 8
SV 20 20 10 10 20
SF 1060 1060 180 1100 1035
CC% 5 5 5 5 5
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 24~25 24~25 45~55 40~50 22~25
I gap (Amps) 8.0~9.5 8.0~9.5 1.0~1.2 0.8~1.0 3.5~4.5
Speed mm/min 5.9~6.0 5.9~6.0 9.0~10.0 9.8~10.0 3.1~3.3
Offset (R) mm 0.175 *** *** *** ***
Offset (R+1) mm *** 0.191 0.141 *** ***
Offset (R+2) mm *** 0.202 0.152 0.142 ****
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 **** 1.4-1.7 1.0~1.1 ****
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 77


9.3.10 30 mm Copper with Ø0.25 mm Bercocut using AE Pulse.
Material: Copper Thickness: 30 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E21652170 E21652171 E21652172 E21652173 E21652174 E21652175 E21652176 E21652177 E21652178 E21652179
TON 323 323 302 202 320
TOFF 48 48 30 10 55
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 9 9 9 9 8
WT 10 10 10 10 8
SV 20 20 10 10 20
SF 1042 1042 150 1070 1022
CC% 5 5 5 5 5
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 22~23 22~23 50~60 94~98 22~25
I gap (Amps) 8.5~10.0 8.5~10.0 1.2~1.6 0.8~1.0 3.5~4.5
Speed mm/min 3.9~4.0 3.9~4.0 6.5~7.2 6.9~7.0 1.8~2.0
Offset (R) mm 0.177 *** *** *** ***
Offset (R+1) mm *** 0.196 0.141 *** ***
Offset (R+2) mm *** 0.206 0.151 0.141 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 **** 1.4-1.7 1-1.1 ****
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 78


9.3.11 50 mm Copper with Ø0.25 mm Bercocut using AE Pulse.
Material: Copper Thickness: 50 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E21652210 E21652211 E21652212 E21652213 E21652214 E21652215 E21652216 E21652217 E21652218 E21652219
TON 323 323 302 202 320
TOFF 48 48 30 10 55
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 9 9 9 9 8
WT 10 10 10 10 8
SV 20 20 10 10 20
SF 1025 1025 150 1055 1014
CC% 5 5 5 5 5
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 23~25 23~25 48~55 94~98 22~25
I gap (Amps) 8.5~10.0 8.5~10.0 1.0~1.2 0.7~0.9 3.5~4.5
Speed mm/min 2.2~2.3 2.2~2.3 5.0~5.5 5.4~5.6 1.15~1.25
Offset (R) mm 0.182 *** *** *** ***
Offset (R+1) mm *** 0.202 0.142 *** ***
Offset (R+2) mm *** 0.212 0.152 0.142 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.4-1.7 1.0-1.1 ***
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 79


9.3.12 80 mm Copper with Ø0.25 mm Bercocut using AE Pulse.
Material: Copper Thickness: 80 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E21652270 E21652271 E21652272 E21652273 E21652274 E21652275 E21652276 E21652277 E21652278 E21652279
TON 323 323 302 202 320
TOFF 48 48 30 10 55
IP 12 12 12 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 10 10 9 9 8
WT 10 10 10 10 8
SV 20 20 10 10 20
SF 1018 1018 150 1050 1010
CC% 5 5 5 5 5
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 15 2 10
Flushing Top 8 8 8 2 8
Flushing Bottom 8 8 8 2 8
V gap (Volts) 22~24 22~24 45~50 94~98 22~25
I gap (Amps) 8.5~10.5 8.5~10.5 1.0~1.2 0.8~1.0 3.5~4.5
Speed mm/min 1.50~1.55 1.50~1.55 4.8~5.2 4.9~5.0 0.85~0.95
Offset (R) mm 0.185 *** *** *** ***
Offset (R+1) mm *** 0.206 0.141 *** ***
Offset (R+2) mm *** 0.215 0.15 0.14 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.4-1.7 1.0-1.1 ***
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 80


9.3.13 10 mm Carbide with Ø0.25 mm Bercocut using AE Pulse.
Material: Carbide Thickness: 10 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21651130 E21651131 E21651132 E21651133 E21651134 E21651135 E21651136 E21651137 E21651138 E21651139
TON 323 323 305 202 208 320
TOFF 50 50 30 10 2 54
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 10 10 10 10 10 8
WT 10 10 10 10 10 8
SV 20 20 10 10 10 20
SF 2100 2100 150 120 100 2060
CC% 5 5 5 5 5 5
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 5
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21~24 21~24 60~70 80-90 50~60 22~24
I gap (Amps) 8.5~10.0 8.5~10.0 1.8~2.0 1.2-1.5 0.4~0.5 4.5-6.0
Speed mm/min 4.3 ~ 4.6 4.3 ~ 4.6 8.0~9.5 8.0~9.5 7.0~8.5 2.4~2.6
Offset (R) mm 0.156 *** *** *** *** ***
Offset (R+1) mm *** 0.18 0.14 *** *** ***
Offset (R+2) mm *** 0.19 0.15 0.14 *** ***
Offset (R+3) mm *** 0.194 0.154 0.144 0.139 ***
Ra (µm) 2.2~2.8 *** 0.9~1.1 0.7~0.8 0.4~0.5 ***
Rmax (µm) 15~22 *** 6.0~7.0 5.2~6.2 4.0~5.0 ****

Electronica india limited Technology Guidelines for eNova Series Page 81


9.3.14 20 mm Carbide with Ø0.25 mm Bercocut using AE Pulse.
Material: Carbide Thickness: 20 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21651150 E21651151 E21651152 E21651153 E21651154 E21651155 E21651156 E21651157 E21651158 E21651159
TON 323 323 305 202 208 320
TOFF 49 49 30 10 2 54
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 10 10 10 10 10 8
WT 10 10 10 10 10 8
SV 20 20 10 10 10 20
SF 2100 2100 140 100 100 2060
CC% 5 5 5 5 5 5
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 5
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21~24 21~24 60~70 80-90 50~60 22~24
I gap (Amps) 8.5-10.5 8.5-10.5 1.8~2.0 1.2-1.5 0.4~0.5 4.5-6.0
Speed mm/min 2.5~2.6 2.5~2.6 7.5~8.5 8.0~8.5 7.5~8.5 1.8~1.9
Offset (R) mm 0.156 *** *** *** *** ***
Offset (R+1) mm *** 0.18 0.14 *** *** ***
Offset (R+2) mm *** 0.19 0.15 0.14 *** ***
Offset (R+3) mm *** 0.194 0.154 0.144 0.139 ***
Ra (µm) 2.0~2.2 *** 0.9~1.1 0.7~0.8 0.4~0.5 ***
Rmax (µm) 15~22 *** 6.0~7.0 5.2~6.2 4.0~5.0 ****

Electronica india limited Technology Guidelines for eNova Series Page 82


9.3.15 30 mm Carbide with Ø0.25 mm Bercocut using AE Pulse.
Material: Carbide Thickness: 30 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21651170 E21651171 E21651172 E21651173 E21651174 E21651175 E21651176 E21651177 E21651178 E21651179
TON 323 323 305 202 208 320
TOFF 48 48 30 10 2 54
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 10 10 10 10 10 8
WT 10 10 10 10 10 8
SV 20 20 10 10 10 20
SF 2060 2060 90 90 70 2030
CC% 5 5 5 5 5 5
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 5
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21~22 21~22 56-70 60-70 70~80 22~24
I gap (Amps) 8.5~10.0 8.5~10.0 1.8-2.2 1.2-1.5 0.4~0.5 4.5-6.0
Speed mm/min 1.55~1.65 1.55~1.65 4.4-4.8 4.7-5.0 4.3~4.5 0.95~1.05
Offset (R) mm 0.155 *** *** *** *** ***
Offset (R+1) mm *** 0.18 0.14 *** *** ***
Offset (R+2) mm *** 0.19 0.15 0.14 *** ***
Offset (R+3) mm *** 0.194 0.154 0.144 0.139 ***
Ra (µm) 2.0~2.2 *** 0.9~1.1 0.7~0.8 0.4~0.5 ***
Rmax (µm) 15~22 *** 6.0~7.0 5.2~6.2 4.0~5.0 ****

Electronica india limited Technology Guidelines for eNova Series Page 83


9.3.16 40 mm Carbide with Ø0.25 mm Bercocut using AE Pulse.
Material: Carbide Thickness: 40 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21651190 E21651191 E21651192 E21651193 E21651194 E21651195 E21651196 E21651197 E21651198 E21651199
TON 323 323 305 202 208 320
TOFF 48 48 30 10 2 54
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 10 10 10 10 10 8
WT 10 10 10 10 10 8
SV 20 20 10 10 10 20
SF 2060 2060 70 50 60 2030
CC% 5 5 5 5 5 5
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 5
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21~22 21~22 50~60 70~75 60~70 22~24
I gap (Amps) 8.0~9.5 8.0~9.5 1.5~2.2 1.0~1.5 0.5~0.6 4.0~6.0
Speed mm/min 1.2 ~ 1.3 1.2 ~ 1.3 3.2~3.4 3.4-3.7 3.2~3.4 0.65~0.75
Offset (R) mm 0.155 *** *** *** *** ***
Offset (R+1) mm *** 0.18 0.14 *** *** ***
Offset (R+2) mm *** 0.19 0.15 0.14 *** ***
Offset (R+3) mm *** 0.194 0.154 0.144 0.139 ***
Ra (µm) 2.0~2.2 *** 0.9~1.1 0.7~0.8 0.4~0.5 ***
Rmax (µm) 15~22 *** 6.0~7.0 5.2~6.2 4.0~5.0 ****

Electronica india limited Technology Guidelines for eNova Series Page 84


9.3.17 50 mm Carbide with Ø0.25 mm Bercocut using AE Pulse.
Material: Carbide Thickness: 50 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21651210 E21651211 E21651212 E21651213 E21651214 E21651215 E21651216 E21651217 E21651218 E21651219
TON 323 323 305 202 208 320
TOFF 48 48 30 10 2 54
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 10 10 10 10 10 8
WT 10 10 10 10 10 8
SV 20 20 10 10 10 20
SF 2050 2050 70 50 60 2030
CC% 5 5 5 5 5 5
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 5
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21~22 21~22 50~60 70~75 60~70 22~24
I gap (Amps) 8.0~9.5 8.0~9.5 1.5~2.2 1.0~1.5 0.5~0.6 4.0~6.0
Speed mm/min 0.95~1.05 0.95~1.05 2.3~2.5 3.0~3.5 2.8~3.0 0.60~0.65
Offset (R) mm 0.154 *** *** *** *** ***
Offset (R+1) mm *** 0.185 0.14 *** *** ***
Offset (R+2) mm *** 0.195 0.15 0.14 *** ***
Offset (R+3) mm *** 0.199 0.154 0.144 0.139 ***
Ra (µm) 2.0~2.2 *** 0.9~1.1 0.7~0.8 0.4~0.5 ***
Rmax (µm) 15~22 *** 6.0~7.0 5.2~6.2 4.0~5.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 85


9.3.18 60 mm Carbide with Ø0.25 mm Bercocut using AE Pulse.
Material: Carbide Thickness: 60 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21651230 E21651231 E21651232 E21651233 E21651234 E21651235 E21651236 E21651237 E21651238 E21651239
TON 323 323 305 202 208 320
TOFF 49 49 30 10 2 54
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 10 10 10 10 10 8
WT 10 10 10 10 10 8
SV 20 20 10 10 10 20
SF 2050 2050 60 50 60 2030
CC% 5 5 5 5 5 5
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 5
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21~22 21~22 52~65 65-70 55~65 22~24
I gap (Amps) 8.0~9.5 8.0~9.5 1.5~2.2 1.0~1.5 0.5~0.6 4.0~6.0
Speed mm/min 0.8 ~ 0.85 0.8 ~ 0.85 2.6~2.7 3.1~3.5 2.9~3.0 0.55~0.60
Offset (R) mm 0.154 *** *** *** *** ***
Offset (R+1) mm *** 0.184 0.139 *** *** ***
Offset (R+2) mm *** 0.195 0.15 0.14 *** ***
Offset (R+3) mm *** 0.199 0.154 0.144 0.139 ***
Ra (µm) 2.0~2.2 *** 0.9~1.1 0.7~0.8 0.4~0.5 ***
Rmax (µm) 15~22 *** 6.0~7.0 5.2~6.2 4.0~5.0 ****

Electronica india limited Technology Guidelines for eNova Series Page 86


9.3.19 70 mm Carbide with Ø0.25 mm Bercocut using AE Pulse.
Material: Carbide Thickness: 70 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21651250 E21651251 E21651252 E21651253 E21651254 E21651255 E21651256 E21651257 E21651258 E21651259
TON 323 323 305 202 208 320
TOFF 49 49 30 10 2 54
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 10 10 10 10 10 8
WT 10 10 10 10 10 8
SV 20 20 10 10 10 20
SF 2030 2030 70 50 60 2030
CC% 5 5 5 5 5 5
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 5
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21~22 21~22 48~56 72~85 45~55 22~24
I gap (Amps) 8.0~9.5 8.0~9.5 1.5~2.2 1.0~1.5 0.5~0.6 4.0~6.0
Speed mm/min 0.7~0.75 0.7~0.75 2.4~2.6 2.9~3.1 2.5~2.8 0.5~0.55
Offset (R) mm 0.154 *** *** *** *** ***
Offset (R+1) mm *** 0.190 0.14 *** *** ***
Offset (R+2) mm *** 0.201 0.151 0.141 *** ***
Offset (R+3) mm *** 0.204 0.154 0.144 0.139 ***
Ra (µm) 2.0~2.2 *** 0.9~1.1 0.7~0.8 0.4~0.5 ***
Rmax (µm) 15~22 *** 6.0~7.0 5.2~6.2 4.0~5.0 ****

Electronica india limited Technology Guidelines for eNova Series Page 87


9.3.20 80 mm Carbide with Ø0.25 mm Bercocut using AE Pulse.
Material: Carbide Thickness: 80 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21651270 E21651271 E21651272 E21651273 E21651274 E21651275 E21651276 E21651277 E21651278 E21651279
TON 323 323 305 202 208 320
TOFF 48 48 30 10 2 54
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 10 10 10 10 10 8
WT 10 10 10 10 10 8
SV 20 20 10 10 10 20
SF 2030 2030 70 50 70 2020
CC% 5 5 5 5 5 5
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 5
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21~22 21~22 45-55 75~85 45~55 21-23
I gap (Amps) 8.5~10.0 8.5~10.0 1.8~2.2 0.8~1.2 0.5~0.6 4.5~5.5
Speed mm/min 0.6~0.65 0.6~0.65 2.5~2.6 3.1~3.3 2.5~2.8 0.4~0.45
Offset (R) mm 0.16 *** *** *** *** ***
Offset (R+1) mm *** 0.192 0.142 *** *** ***
Offset (R+2) mm *** 0.201 0.151 0.141 *** ***
Offset (R+3) mm *** 0.207 0.157 0.147 0.142 ***
Ra (µm) 2.0~2.2 *** 0.9~1.1 0.7~0.8 0.45~0.55 ***
Rmax (µm) 15~22 *** 8.0~9.0 6.0~8.0 4.0~6.0 ****

Electronica india limited Technology Guidelines for eNova Series Page 88


9.3.21 90 mm Carbide with Ø0.25 mm Bercocut using AE Pulse.
Material: Carbide Thickness: 90 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21651290 E21651291 E21651292 E21651293 E21651294 E21651295 E21651296 E21651297 E21651298 E21651299
TON 323 323 305 202 320
TOFF 49 49 30 5 54
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 10 10 10 10 8
WT 10 10 10 10 8
SV 20 20 10 10 20
SF 2020 2020 70 50 2020
CC% 5 5 5 5 5
CDwell 0 0 0 0 0
CRK 5 5 5 5 5
Pressure Kg/cm2 15 15 3 3 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 21~22 21~22 48-58 75~85 21-23
I gap (Amps) 8.5~10.0 8.5~10.0 1.8~2.2 0.8~1.2 4.5~5.5
Speed mm/min 0.50 ~ 0.55 0.50 ~ 0.55 2.4~2.5 3.1~3.2 0.35~0.4
Offset (R) mm 0.162 *** *** *** ***
Offset (R+1) mm *** 0.196 0.141 *** ***
Offset (R+2) mm *** 0.206 0.151 0.141 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.0~2.2 *** 0.9~1.1 0.7~0.8 ***
Rmax (µm) 15~22 *** 8.0~9.0 6.0~8.0 ****

Electronica india limited Technology Guidelines for eNova Series Page 89


9.3.22 100 mm Carbide with Ø0.25 mm Bercocut using AE Pulse.
Material: Carbide Thickness: 100 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21651310 E21651311 E21651312 E21651313 E21651314 E21651315 E21651316 E21651317 E21651318 E21651319
TON 323 323 305 202 320
TOFF 49 49 30 5 54
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 10 10 10 10 8
WT 10 10 10 10 8
SV 20 20 10 10 20
SF 2020 2020 60 50 2020
CC% 5 5 5 5 5
CDwell 0 0 0 0 0
CRK 5 5 5 5 5
Pressure Kg/cm2 15 15 3 3 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 21~22 21~22 45-55 75~85 21-23
I gap (Amps) 8.5~10.0 8.5~10.0 1.8~2.2 0.8~1.2 4.5~5.5
Speed mm/min 0.5 ~ 0.52 0.5 ~ 0.52 2.5~2.6 3.1~3.3 0.3~0.35
Offset (R) mm 0.165 *** *** *** ***
Offset (R+1) mm *** 0.197 0.142 *** ***
Offset (R+2) mm *** 0.206 0.151 0.141 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.0~2.2 *** 0.9~1.1 0.7~0.8 ***
Rmax (µm) 15~22 *** 8.0~9.0 6.0~8.0 ****

Electronica india limited Technology Guidelines for eNova Series Page 90


9.3.23 30 mm Brass with Ø0.25 mm Brass Wire using AE Pulse.
Material: Brass Thickness: 30 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21656170 E21656171 E21656172 E21656173 E21656174 E21656175 E21656176 E21656177 E21656178 E21656179
TON 323 323 305 316
TOFF 46 42 30 55
IP 12 12 11 12
VP 1 1 1 1
WP 115 115 103 110
WF 8 8 8 8
WT 9 9 9 8
SV 15 15 10 25
SF 2150 2150 1130 2050
CC% 4 4 0 0
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 15 15 2 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 19-21 19-21 40-48 35-40
I gap (Amps) 8.0-9.0 8.0-9.0 1.0-1.5 3.5-4.0
Speed mm/min 7.5-8.5 7.5-8.5 12.5-13.0 3
Offset (R) mm 0.175 *** *** ***
Offset (R+1) mm *** 0.19 0.14 ***
Offset (R+2) mm *** *** *** ****
Offset (R+3) mm *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.4-1.7 ***
Rmax (µm) 15-19 *** 10-13.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 91


9.3.24 50 mm Brass with Ø0.25 mm Brass Wire using AE Pulse.
Material: Brass Thickness: 50 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21656210 E21656211 E21656212 E21656213 E21656214 E21656215 E21656216 E21656217 E21656218 E21656219
TON 323 323 305 316
TOFF 46 46 30 55
IP 12 12 11 12
VP 1 1 1 1
WP 115 115 103 110
WF 9 9 9 8
WT 9 9 9 8
SV 15 15 10 25
SF 2150 2150 1100 2050
CC% 5 5 5 0
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 15 15 2 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 16-19 16-19 45-55 35-40
I gap (Amps) 9.0-10.0 9.0-10.0 1.2-1.6 3.5-4.0
Speed mm/min 4.9-5.1 4.9-5.1 9.9-10.2 2
Offset (R) mm 0.18 *** *** ***
Offset (R+1) mm *** 0.2 0.14 ***
Offset (R+2) mm *** *** *** ***
Offset (R+3) mm *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.4-1.7 ***
Rmax (µm) 15-19 *** 10-13.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 92


9.3.25 80 mm Brass with Ø0.25 mm Brass Wire using AE Pulse.
Material: Brass Thickness: 80 mm Wire: 0.25 mm DY(S) Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD HARD HARD HARD
E-Code E21656270 E21656271 E21656272 E21656273 E21656274 E21656275 E21656276 E21656277 E21656278 E21656279
TON 323 323 305 316
TOFF 46 46 30 55
IP 12 12 11 12
VP 1 1 1 1
WP 115 115 103 110
WF 10 10 10 8
WT 9 9 9 8
SV 15 15 10 25
SF 2120 2120 1070 2050
CC% 5 5 5 0
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 15 15 2 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 16-19 16-19 45-55 35-40
I gap (Amps) 9.0-10.0 9.0-10.0 1.2-1.8 3.5-4.0
Speed mm/min 3.0-3.1 3.0-3.1 6.3-6.5 1.2
Offset (R) mm 0.18 *** *** ***
Offset (R+1) mm *** 0.205 0.14 ***
Offset (R+2) mm *** *** *** ***
Offset (R+3) mm *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.4-1.7 ***
Rmax (µm) 15-19 *** 10-13.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 93


9.3.26 10 mm Aluminum with Ø0.25 mm Bercocut using AE Pulse.
Material: Aluminum Thickness: 10 mm Wire: 0.25 mm Bercocut Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD
E-Code E21653130 E21653131 E21653132 E21653133 E21653134 E21653135 E21653136 E21653137 E21653138 E21653139
TON 321 321 302 318
TOFF 54 54 30 56
IP 12 12 11 12
VP 1 1 1 1
WP 112 112 103 110
WF 9 9 9 9
WT 9 9 9 9
SV 15 15 10 15
SF 2300 2300 1300 2100
CC% 3 3 5 5
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 12 12 3 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 20~23 25-28 90~95 26-30
I gap (Amps) 5.5~6.0 5.5~6.0 0.6-0.8 2.5~3.0
Speed mm/min 21-23 21-23 28-30 9.5~10.0
Offset (R) mm 0.178 *** *** ***
Offset (R+1) mm *** 0.212 0.142 ***
Offset (R+2) mm *** *** *** ****
Offset (R+3) mm *** *** *** ***
Ra (µm) 3.5-4.0 *** 2.5-3.0 ***
Rmax (µm) 20-25 *** 15-18 ***

Electronica india limited Technology Guidelines for eNova Series Page 94


9.3.27 20 mm Aluminum with Ø0.25 mm Bercocut using AE Pulse.
Material: Aluminum Thickness: 20 mm Wire: 0.25 mm Bercocut Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD
E-Code E21653150 E21653151 E21653152 E21653153 E21653154 E21653155 E21653156 E21653157 E21653158 E21653159
TON 321 323 302 318
TOFF 50 50 30 54
IP 12 12 11 12
VP 1 1 1 1
WP 115 115 103 110
WF 9 9 9 9
WT 9 9 9 9
SV 15 15 10 15
SF 2280 2280 1250 2100
CC% 5 5 5 5
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 15 15 3 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 18~20 20~25 90~95 24~26
I gap (Amps) 8.5~9.0 8.5~9.0 0.8~1.0 2.5~3.0
Speed mm/min 17~18 17~18 24~25 7.5~8.0
Offset (R) mm 0.18 *** *** ***
Offset (R+1) mm *** 0.212 0.142 ***
Offset (R+2) mm *** *** *** ****
Offset (R+3) mm *** *** *** ***
Ra (µm) 3.5-4.0 *** 2.5-3.0 ***
Rmax (µm) 20-25 *** 15-18 ***

Electronica india limited Technology Guidelines for eNova Series Page 95


9.3.28 30 mm Aluminum with Ø0.25 mm Bercocut using AE Pulse.
Material: Aluminum Thickness: 30 mm Wire: 0.25 mm Bercocut Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD
E-Code E21653170 E21653171 E21653172 E21653173 E21653174 E21653175 E21653176 E21653177 E21653178 E21653179
TON 323 323 302 318
TOFF 50 50 30 56
IP 12 12 11 12
VP 1 1 1 1
WP 115 115 103 110
WF 9 9 9 9
WT 10 10 10 9
SV 15 15 10 15
SF 2280 2280 1180 2100
CC% 5 5 5 5
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 15 15 3 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 18~20 18~20 50~60 26~29
I gap (Amps) 9.0~10.0 9.0~10.0 0.8~1.0 4.5~5.0
Speed mm/min 12.5~13.0 12.5~13.5 17.0~18.0 5.5~6.2
Offset (R) mm 0.18 *** *** ***
Offset (R+1) mm *** 0.203 0.138 ***
Offset (R+2) mm *** *** *** ***
Offset (R+3) mm *** *** *** ***
Ra (µm) 3.5-4.0 *** 2.5-3.0 ***
Rmax (µm) 20-25 *** 15-18 ***

Electronica india limited Technology Guidelines for eNova Series Page 96


9.3.29 50 mm Aluminum with Ø0.25 mm Bercocut using AE Pulse.
Material: Aluminum Thickness: 50 mm Wire: 0.25 mm Bercocut Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD
E-Code E21653210 E21653211 E21653212 E21653213 E21653214 E21653215 E21653216 E21653217 E21653218 E21653219
TON 323 323 302 318
TOFF 45 45 30 56
IP 12 12 11 12
VP 1 1 1 1
WP 115 115 103 110
WF 10 10 10 9
WT 10 10 10 9
SV 15 15 10 15
SF 2200 2200 1150 2100
CC% 5 5 5 5
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 15 15 3 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 18~20 18~20 50~60 20-24
I gap (Amps) 9.5~10.5 9.5~10.5 1.0~1.2 4.5~5.0
Speed mm/min 10~10.5 10~10.5 14~15 4.5~5.0
Offset (R) mm 0.187 *** *** ***
Offset (R+1) mm *** 0.21 0.14 ***
Offset (R+2) mm *** *** *** ***
Offset (R+3) mm *** *** *** ***
Ra (µm) 3.5-4.0 *** 2.5-3.0 ***
Rmax (µm) 20-25 *** 15-18 ***

Electronica india limited Technology Guidelines for eNova Series Page 97


9.3.30 80 mm Aluminum with Ø0.25 mm Bercocut using AE Pulse.
Material: Aluminum Thickness: 80 mm Wire: 0.25 mm Bercocut Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD
E-Code E21653270 E21653271 E21653272 E21653273 E21653274 E21653275 E21653276 E21653277 E21653278 E21653279
TON 323 323 302 318
TOFF 47 47 30 56
IP 12 12 11 12
VP 1 1 1 1
WP 115 115 103 110
WF 10 10 10 9
WT 10 10 10 9
SV 15 15 10 15
SF 2200 2200 1090 2100
CC% 5 5 5 5
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 15 15 3 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 18~20 18~20 15~60 18~20
I gap (Amps) 8.0~10.0 8.0~10.0 1.0~1.2 4.5~5.0
Speed mm/min 5.8~6.0 5.8~6.0 9.0~9.2 2.6~2.7
Offset (R) mm 0.188 *** *** ***
Offset (R+1) mm *** 0.214 0.139 ***
Offset (R+2) mm *** *** *** ***
Offset (R+3) mm *** *** *** ***
Ra (µm) 3.5-4.0 *** 2.5-3.0 ***
Rmax (µm) 20-25 *** 15-18 ***

Electronica india limited Technology Guidelines for eNova Series Page 98


9.3.31 100 mm Aluminum with Ø0.25 mm Bercocut using AE Pulse.
Material: Aluminum Thickness: 100 mm Wire: 0.25 mm Bercocut Dielectric: Water Conductivity: 0 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD
E-Code E21653310 E21653311 E21653312 E21653313 E21653314 E21653315 E21653316 E21653317 E21653318 E21653319
TON 323 323 302 318
TOFF 47 47 30 56
IP 12 12 11 12
VP 1 1 1 1
WP 115 115 103 110
WF 10 10 10 9
WT 10 10 10 9
SV 15 15 10 15
SF 2200 2200 1075 2100
CC% 5 5 5 5
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 15 15 3 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 17~19 17~19 45~55 18~20
I gap (Amps) 8.0~10.0 8.0~10.0 1.0~1.2 4.5~5.0
Speed mm/min 4.8~5.0 4.8~5.0 7.4~7.5 2.4~2.6
Offset (R) mm 0.19 *** *** ***
Offset (R+1) mm *** 0.225 0.138 ***
Offset (R+2) mm *** *** *** ***
Offset (R+3) mm *** *** *** ***
Ra (µm) 3.5-4.0 *** 2.5-3.0 ***
Rmax (µm) 20-25 *** 15-18 ***

Electronica india limited Technology Guidelines for eNova Series Page 99


9.3.32 10 mm Steel (HCHCr) with Ø0.20 mm Bercocut using AE Pulse.
Material: Steel (HCHCr) Thickness: 10 mm Wire: 0.20 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD
E-Code E21550130 E21550131 E21550132 E21550133 E21550134 E21550135 E21550136 E21550137 E21550138 E21550139
TON 321 321 302 202 205 316
TOFF 55 55 30 10 0 56
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 9 9 9 9 9 8
WT 7 6 7 7 7 6
SV 20 20 10 10 10 20
SF 2150 2150 150 150 150 2100
CC% 4 4 6 6 6 0
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 0
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 24-26 24-26 90-98 90-98 95-99 23~25
I gap (Amps) 6.8-7.2 6.8-7.2 0.5-0.7 0.3-0.4 0.2-0.3 3.2~3.6
Speed mm/min 7.8-8.2 7.8-8.2 13-14 14-15 13-13.5 4.0~4.2
Offset (R) mm 0.132 *** *** *** *** ***
Offset (R+1) mm *** 0.15 0.115 *** *** ***
Offset (R+2) mm *** 0.158 0.123 0.113 *** ***
Offset (R+3) mm *** 0.165 0.13 0.12 0.115 ***
Ra (µm) 2.5-2.9 *** 1.6-1.8 1.0-1.2 0.4-0.5 ***
Rmax (µm) 17-20 *** 11-14.0 7.0-10.0 4.0-6.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 100
9.3.33 20 mm Steel (HCHCr) with Ø0.20 mm Bercocut using AE Pulse.
Material: Steel (HCHCr) Thickness: 20 mm Wire: 0.20 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD
E-Code E21550150 E21550151 E21550152 E21550153 E21550154 E21550155 E21550156 E21550157 E21550158 E21550159
TON 321 321 302 202 205 316
TOFF 53 53 30 10 0 56
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 9 9 9 9 9 8
WT 7 6 7 7 8 6
SV 20 20 10 10 10 20
SF 2100 2100 180 1100 1080 2060
CC% 4 4 6 6 6 0
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 0
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21-24 21-24 55~60 94~98 65~70 22~25
I gap (Amps) 7.0~8.0 7.0~8.0 1.0~1.2 0.8~1.0 0.4~0.5 3.5~4.0
Speed mm/min 3.8~3.9 3.8~3.9 6.5~8.5 10.0~10.2 7.5~8.0 2.0~2.1
Offset (R) mm 0.13 *** *** *** *** ***
Offset (R+1) mm *** 0.148 0.113 *** *** ***
Offset (R+2) mm *** 0.157 0.122 0.112 *** ***
Offset (R+3) mm *** 0.163 0.128 0.118 0.113 ***
Ra (µm) 2.5-2.9 *** 1.6-1.8 1.0-1.2 0.4-0.5 ***
Rmax (µm) 17-20 *** 11-14.0 7.0-10.0 4.0-6.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 101
9.3.34 30 mm Steel (HCHCr) with Ø0.20 mm Bercocut using AE Pulse.
Material: Steel (HCHCr) Thickness: 30 mm Wire: 0.20 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD HARD
E-Code E21550170 E21550171 E21550172 E21550173 E21550174 E21550175 E21550176 E21550177 E21550178 E21550179
TON 321 321 302 202 205 316
TOFF 53 53 30 10 0 56
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 9 9 9 9 9 8
WT 7 6 7 7 7 6
SV 20 20 10 10 10 20
SF 2080 2080 150 1080 1070 2040
CC% 4 4 6 6 6 0
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 0
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 22~23 22~23 50~60 50~60 50~60 22~25
I gap (Amps) 6.5~8.0 6.5~8.0 1.2~1.4 90~98 0.5~0.6 3.5~4.0
Speed mm/min 2.45~2.55 2.45~2.55 6.4~6.8 8.0~8.2 7.0~7.2 1.25~1.35
Offset (R) mm 0.131 *** *** *** *** ***
Offset (R+1) mm *** 0.154 0.114 *** *** ***
Offset (R+2) mm *** 0.165 0.125 0.115 *** ***
Offset (R+3) mm *** 0.169 0.129 0.119 0.114 ***
Ra (µm) 2.5-2.9 *** 1.6-1.8 1.0-1.2 0.4-0.5 ***
Rmax (µm) 17-20 *** 11-14.0 7.0-10.0 4.0-6.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 102
9.3.35 50 mm Steel (HCHCr) with Ø0.20 mm Bercocut using AE Pulse.
Material: Steel (HCHCr) Thickness: 50 mm Wire: 0.20 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD
E-Code E21550210 E21550211 E21550212 E21550213 E21550214 E21550215 E21550216 E21550217 E21550218 E21550219
TON 321 321 302 202 208 316
TOFF 53 53 30 10 2 56
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 9 10 10 10 110 8
WT 7 6 7 7 7 6
SV 20 20 10 10 10 20
SF 2080 2080 120 1060 1055 2040
CC% 4 4 4 4 6 0
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 0
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21-24 21-24 45~55 90~94 40~45 22~24
I gap (Amps) 6.0~7.0 6.0~7.0 1.2~1.6 0.8~1.0 0.5~0.6 4
Speed mm/min 1.5~1.6 1.5~1.6 4.5~5.5 5.9~6.1 5.4~5.6 3.2~3.4
Offset (R) mm 0.137 *** *** *** *** 0.80~0.85
Offset (R+1) mm *** 0.155 0.115 *** *** ***
Offset (R+2) mm *** 0.164 0.124 0.114 *** ***
Offset (R+3) mm *** 0.171 0.131 0.121 0.116 ***
Ra (µm) 2.5-2.9 *** 1.6-1.8 1.0-1.2 0.4-0.5 ***
Rmax (µm) 17-20 *** 11-14.0 7.0-10.0 4.0-6.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 103
9.3.36 80 mm Steel (HCHCr) with Ø0.20 mm Bercocut using AE Pulse.
Material: Steel (HCHCr) Thickness: 80 mm Wire: 0.20 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD
E-Code E21550270 E21550271 E21550272 E21550273 E21550274 E21550275 E21550276 E21550277 E21550278 E21550279
TON 321 321 302 202 208 316
TOFF 54 54 30 10 2 56
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 10 11 10 10 10 8
WT 6 6 7 7 7 6
SV 20 20 10 10 10 20
SF 2050 2050 100 1040 1035 2020
CC% 4 4 3 4 6 0
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 0
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21-23 21-23 40~50 40~50 30~35 22~24
I gap (Amps) 6.0~7.0 6.0~7.0 1.4~1.6 1.0-1.2 0.4~0.6 3.5~3.8
Speed mm/min 0.75~0.80 0.75~0.80 3.0~3.2 3.9~4.0 3.4~3.5 0.40~0.45
Offset (R) mm 0.14 *** *** *** *** ***
Offset (R+1) mm *** 0.16 0.115 *** *** ***
Offset (R+2) mm *** 0.17 0.125 0.115 *** ***
Offset (R+3) mm *** 0.174 0.129 0.119 0.114 ***
Ra (µm) 2.5-2.9 *** 1.6-1.8 1.0-1.2 0.5-0.6 ***
Rmax (µm) 17-20 *** 11-14.0 7.0-10.0 5.0-6.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 104
9.3.37 100 mm Steel (HCHCr) with Ø0.20 mm Bercocut using AE Pulse.
Material: Steel (HCHCr) Thickness: 100 mm Wire: 0.20 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD HARD
E-Code E21550310 E21550311 E21550312 E21550313 E21550314 E21550315 E21550316 E21550317 E21550318 E21550319
TON 321 321 302 202 208 316
TOFF 55 55 30 10 2 56
IP 12 12 11 11 10 12
VP 1 1 1 1 1 1
WP 115 115 103 103 3 110
WF 10 10 10 10 10 8
WT 6 6 7 7 7 6
SV 20 20 10 10 10 20
SF 2030 2030 80 1030 1025 2010
CC% 4 4 3 4 6 0
CDwell 0 0 0 0 0 0
CRK 5 5 5 5 5 0
Pressure Kg/cm2 15 15 3 3 3 10
Flushing Top 8 8 2 2 2 8
Flushing Bottom 8 8 2 2 2 8
V gap (Volts) 21-23 21-23 40~45 88~94 25~30 22~24
I gap (Amps) 5.5-6.5 5.5-6.5 1.5~1.8 1.0-1.2 0.5~0.6 2.6~3.2
Speed mm/min 0.55~0.65 0.55~0.65 2.2~2.6 2.9~3.0 2.4~2.5 0.30~0.35
Offset (R) mm 0.142 *** *** *** *** ***
Offset (R+1) mm *** 0.166 0.116 *** *** ***
Offset (R+2) mm *** 0.175 0.125 0.115 *** ***
Offset (R+3) mm *** 0.18 0.13 0.12 0.115 ***
Ra (µm) 2.5-2.9 *** 1.6-1.8 1.0-1.2 0.5-0.6 ***
Rmax (µm) 17-20 *** 11-14.0 7.0-10.0 5.0-6.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 105
9.3.38 20 mm Copper with Ø0.20 mm Shalimar using AE Pulse.
Material: Copper Thickness: 20 mm Wire: 0.20 mm Shalimar Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT
E-Code E21502150 E21502151 E21502152 E21502153 E21502154 E21502155 E21502156 E21502157 E21502158 E21502159
TON 320 320 302 202 316
TOFF 50 50 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 8 8 8 8 8
WT 7 7 8 8 7
SV 20 20 10 10 20
SF 2150 2150 1120 1130 2100
CC% 4 4 5 5 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 26~28 26~28 50~60 92~98 27~30
I gap (Amps) 7.0~7.5 7.0~7.5 1.2~1.6 1.0~1.4 3.5~4.5
Speed mm/min 6.2~6.3 6.2~6.3 12.0~12.5 12.5~13.0 3.4~3.5
Offset (R) mm 0.147 *** *** *** ***
Offset (R+1) mm *** 0.165 0.115 *** ***
Offset (R+2) mm *** 0.173 0.123 0.113 ****
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.0~1.2 0.85~0.95 ****
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 106
9.3.39 30 mm Copper with Ø0.20 mm Shalimar using AE Pulse.
Material: Copper Thickness: 30 mm Wire: 0.20 mm Shalimar Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT
E-Code E21502170 E21502171 E21502172 E21502173 E21502174 E21502175 E21502176 E21502177 E21502178 E21502179
TON 320 320 302 202 316
TOFF 50 50 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 9 9 9 9 9
WT 7 7 8 8 7
SV 20 20 10 10 20
SF 2120 2120 1090 1100 2060
CC% 4 4 5 5 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 21~23 21~23 50~60 85~95 23~25
I gap (Amps) 8.0~8.5 8.0~8.5 1.2~1.5 1.0~1.3 3.5~4.5
Speed mm/min 4.1~4.2 4.1~4.2 8.9~9.1 9.9~10.0 2.2~2.3
Offset (R) mm 0.145 *** *** *** ***
Offset (R+1) mm *** 0.165 0.115 *** ***
Offset (R+2) mm *** 0.174 0.124 0.114 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.0~1.2 0.85~0.95 ****
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 107
9.3.40 50 mm Copper with Ø0.20 mm Shalimar using AE Pulse.
Material: Copper Thickness: 50 mm Wire: 0.20 mm Shalimar Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT
E-Code E21502210 E21502211 E21502212 E21502213 E21502214 E21502215 E21502216 E21502217 E21502218 E21502219
TON 320 320 302 202 316
TOFF 50 50 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 9 9 9 9 9
WT 7 7 8 8 7
SV 20 20 10 10 20
SF 2080 2080 1065 1070 2050
CC% 4 4 5 5 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 21~22 21~22 45~55 90~95 22~24
I gap (Amps) 8.0~8.5 8.0~8.5 1.2~1.6 1.2~1.4 4.0~4.5
Speed mm/min 2.2~2.3 2.2~2.3 6.3~6.5 6.8~7.0 1.2~1.3
Offset (R) mm 0.155 *** *** *** ***
Offset (R+1) mm *** 0.17 0.115 *** ***
Offset (R+2) mm *** 0.179 0.124 0.114 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 *** 1.0~1.2 0.85~0.95 ***
Rmax (µm) 15-19 *** 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 108
9.3.41 80 mm Copper with Ø0.20 mm Shalimar using AE Pulse.
Material: Copper Thickness: 80 mm Wire: 0.20 mm Shalimar Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT
E-Code E21502270 E21502271 E21502272 E21502273 E21502274 E21502275 E21502276 E21502277 E21502278 E21502279
TON 320 320 302 202 316
TOFF 51 51 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 115 115 103 103 110
WF 9 9 9 9 9
WT 7 7 8 8 7
SV 20 20 10 10 20
SF 2060 2060 1040 1045 2030
CC% 4 4 4 5 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 15 15 2 2 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 21~23 21~23 45~55 90~95 22~23
I gap (Amps) 7.0~8.0 7.0~8.0 1.2~1.6 1.2~1.4 3.5~4.0
Speed mm/min 1.3~1.4 1.3~1.4 3.9~4.0 4.4~4.5 0.80~0.85
Offset (R) mm 0.158 *** *** *** ***
Offset (R+1) mm *** 0..174 0.114 *** ***
Offset (R+2) mm *** 0.185 0.125 0.115 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.4-2.6 1.0~1.2 0.85~0.95 ***
Rmax (µm) 15-19 10-13.0 6.5-9.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 109
9.3.42 120 mm Copper with Ø0.20 mm Shalimar using AE Pulse.
Material: Copper Thickness: 120 mm Wire: 0.20 mm Shalimar Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT
E-Code E21502350 E21502351 E21502352 E21502353 E21502354 E21502355 E21502356 E21502357 E21502358 E21502359
TON 320 320 302 316
TOFF 52 52 30 56
IP 12 12 11 12
VP 1 1 1 1
WP 115 115 103 110
WF 10 10 10 10
WT 7 7 8 7
SV 20 20 10 20
SF 2025 2025 1020 2020
CC% 4 4 4 0
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 15 15 2 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 22~24 22~24 45~55 22~23
I gap (Amps) 6.0~7.0 6.0~7.0 1.6~2.0 3.5~4.0
Speed mm/min 0.70~0.75 0.70~0.75 1.9~2.1 0.45~0.50
Offset (R) mm 0.158 *** *** ***
Offset (R+1) mm *** 0.188 0.118 ***
Offset (R+2) mm *** *** *** ***
Offset (R+3) mm *** *** *** ***
Ra (µm) 2.4-2.6 1.0~1.2 ***
Rmax (µm) 15-19 10-13.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 110
9.3.43 150 mm Copper with Ø0.20 mm Shalimar using AE Pulse.
Material: Copper Thickness: 150 mm Wire: 0.20 mm Shalimar Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT SOFT
E-Code E21502410 E21502411 E21502412 E21502413 E21502414 E21502415 E21502416 E21502417 E21502418 E21502419
TON 320 320 302 316
TOFF 52 52 30 56
IP 12 12 11 12
VP 1 1 1 1
WP 115 115 103 110
WF 10 10 10 10
WT 7 7 8 7
SV 20 20 10 20
SF 2020 2020 1020 2010
CC% 4 4 4 0
CDwell 0 0 0 0
CRK 5 5 5 0
Pressure Kg/cm2 15 15 2 10
Flushing Top 8 8 2 8
Flushing Bottom 8 8 2 8
V gap (Volts) 21~23 21~23 45~55 22~23
I gap (Amps) 6.0~6.5 6.0~6.5 1.6~2.0 3.5~4.0
Speed mm/min 0.55~0.60 0.55~0.60 1.8~2.0 0.35~0.40
Offset (R) mm 0.16 *** *** ***
Offset (R+1) mm *** 0.188 0.118 ***
Offset (R+2) mm *** *** *** ***
Offset (R+3) mm *** *** *** ***
Ra (µm) 2.4-2.6 1.0~1.2 ***
Rmax (µm) 15-19 10-13.0 ***

Electronica india limited Technology Guidelines for eNova Series Page 111
9.3.44 10 mm Steel (HCHCr) with Ø0.15 mm Bercocut using AE Pulse.
Material: Steel (HCHCr) Thickness: 10 mm Wire: 0.20 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E21450130 E21450131 E21450132 E21450133 E21450134 E21450135 E21450136 E21450137 E21450138 E21450139
TON 314 314 302 202 310
TOFF 54 54 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 112 112 103 103 110
WF 8 8 8 8 8
WT 4 4 6 6 4
SV 20 20 10 10 20
SF 2150 2150 100 150 2050
CC% 5 5 0 0 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 12 12 3 3 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 23~24 23~24 96~100 96~100 20~23
I gap (Amps) 3.5~4.0 3.5~4.0 0.4~0.5 0.2~0.3 2.0~2.3
Speed mm/min 4.9~5.1 4.9~5.1 8.4~8.8 12~12.5 3.3~3.4
Offset (R) mm 0.1 *** *** *** ***
Offset (R+1) mm *** 0.11 0.085 *** ***
Offset (R+2) mm *** 0.122 0.097 0.082 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.6~2.8 2.6~2.8 1.5~1.7 1.1~1.2 ***
Rmax (µm) 16~19 16~19 11~13 8~10 ***

Electronica india limited Technology Guidelines for eNova Series Page 112
9.3.45 20 mm Steel (HCHCr) with Ø0.15 mm Bercocut using AE Pulse.
Material: Steel (HCHCr) Thickness: 20 mm Wire: 0.20 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E21450150 E21450151 E21450152 E21450153 E21450154 E21450155 E21450156 E21450157 E21450158 E21450159
TON 314 314 302 202 310
TOFF 54 54 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 112 112 103 103 110
WF 10 10 10 10 8
WT 4 4 6 6 4
SV 20 20 10 10 20
SF 2100 2100 100 100 2050
CC% 5 5 0 0 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 12 12 3 3 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 21~24 21~24 60~70 96~100 21~24
I gap (Amps) 3.0~3.5 3.0~3.5 0.5~0.7 0.3~0.4 2.0~2.2
Speed mm/min 2.1~2.3 2.1~2.3 5.5~7.0 6.5~7.5 1.6~1.7
Offset (R) mm 0.102 *** *** *** ***
Offset (R+1) mm *** 0.118 0.083 *** ***
Offset (R+2) mm *** 0.13 0.095 0.085 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.6~2.8 2.6~2.8 1.5~1.7 1.1~1.2 ***
Rmax (µm) 16~19 16~19 11~13 8~10 ***

Electronica india limited Technology Guidelines for eNova Series Page 113
9.3.46 30 mm Steel (HCHCr) with Ø0.15 mm Bercocut using AE Pulse.
Material: Steel (HCHCr) Thickness: 30 mm Wire: 0.20 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E21450170 E21450171 E21450172 E21450173 E21450174 E21450175 E21450176 E21450177 E21450178 E21450179
TON 314 314 302 202 310
TOFF 56 56 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 112 112 103 103 110
WF 10 10 10 10 8
WT 4 4 6 6 4
SV 20 20 10 10 20
SF 2100 2100 100 100 2050
CC% 5 5 0 0 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 12 12 3 3 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 21~24 21~24 60~68 96~100 20~22
I gap (Amps) 3.0~3.8 3.0~3.8 0.6~0.7 0.3~0.4 2.0~2.5
Speed mm/min 1.4~1.5 1.4~1.5 5.0~6.0 7.0~8.0 0.80~0.85
Offset (R) mm 0.102 *** *** *** ***
Offset (R+1) mm *** 0.115 0.085 *** ***
Offset (R+2) mm *** 0.125 0.095 0.08 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.6~2.8 2.6~2.8 1.5~1.7 1.1~1.2 ***
Rmax (µm) 16~19 16~19 11~13 8~10 ***

Electronica india limited Technology Guidelines for eNova Series Page 114
9.3.47 50 mm Steel (HCHCr) with Ø0.15 mm Bercocut using AE Pulse.
Material: Steel (HCHCr) Thickness: 50 mm Wire: 0.20 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E21450210 E21450211 E21450212 E21450213 E21450214 E21450215 E21450216 E21450217 E21450218 E21450219
TON 314 314 302 202 310
TOFF 57 57 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 112 112 103 103 110
WF 10 10 10 10 8
WT 4 4 6 8 4
SV 20 20 10 10 20
SF 2060 2060 100 100 2030
CC% 5 5 0 0 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 12 12 3 3 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 20~22 21~23 35~45 98~100 20~22
I gap (Amps) 3.0~4.0 3.4~3.8 0.5~0.7 0.3~0.4 2.0~2.5
Speed mm/min 0.80~0.85 0.8~0.85 2.5~3.5 8.0~9.0 0.50~0.55
Offset (R) mm 0.105 *** *** *** ***
Offset (R+1) mm *** 0.118 0.083 *** ***
Offset (R+2) mm *** 0.13 0.095 0.085 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.6~2.8 2.6~2.8 1.5~1.7 1.1~1.2 ***
Rmax (µm) 16~19 16~19 11~13 8~10 ***

Electronica india limited Technology Guidelines for eNova Series Page 115
9.3.48 80 mm Steel (HCHCr) with Ø0.15 mm Bercocut using AE Pulse.
Material: Steel (HCHCr) Thickness: 80 mm Wire: 0.20 mm Bercocut Dielectric: Water Conductivity: 10 Pulse: AE

Process Max Speed Economy Rough Trim1 Trim2 Trim3 Entry


Wire Type HARD HARD HARD HARD HARD
E-Code E21450270 E21450271 E21450272 E21450273 E21450274 E21450275 E21450276 E21450277 E21450278 E21450279
TON 314 314 302 202 310
TOFF 52 52 30 10 56
IP 12 12 11 11 12
VP 1 1 1 1 1
WP 112 112 103 103 110
WF 10 10 10 10 8
WT 4 4 6 6 4
SV 20 20 10 10 20
SF 2020 2020 1025 1030 2020
CC% 5 5 0 0 0
CDwell 0 0 0 0 0
CRK 5 5 5 5 0
Pressure Kg/cm2 12 12 3 3 10
Flushing Top 8 8 2 2 8
Flushing Bottom 8 8 2 2 8
V gap (Volts) 21~24 21~24 35~40 70~78 20~23
I gap (Amps) 3.2~3.8 3.2~3.8 0.8~0.9 0.4~.5 2~2.5
Speed mm/min 0.45~0.50 0.45~0.50 2.4~2.6 3.0~3.2 0.2~0.25
Offset (R) mm 0.105 *** *** *** ***
Offset (R+1) mm *** 0.128 0.088 *** ***
Offset (R+2) mm *** 0.143 0.097 0.082 ***
Offset (R+3) mm *** *** *** *** ***
Ra (µm) 2.6~2.8 2.6~2.8 1.5~1.7 1.1~1.2 ***
Rmax (µm) 16~19 16~19 11~13 8~10 ***

Electronica india limited Technology Guidelines for eNova Series Page 116

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