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DATA SHEET
TDA3617
Multiple voltage regulator
Product specification 2002 Sep 20
Supersedes data of 2002 Sep 16
Philips Semiconductors Product specification
ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TDA3617J DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) SOT157-2
2002 Sep 20 2
Philips Semiconductors Product specification
BLOCK DIAGRAM
TEMPERATURE
LOAD DUMP
PROTECTION
4 (9 V/1.3 A)
& REGULATOR 1 REG1
Ven1 2
6 (5 V/600 mA)
& REGULATOR 2 REG2
Ven2 9
HOLD
TDA3617
8
GND MGL589
PINNING
MGL590
2002 Sep 20 3
Philips Semiconductors Product specification
FUNCTIONAL DESCRIPTION The TDA3617 has a hold circuit which indicates when one
of the regulators is out-of-regulation. The hold function is
The TDA3617 is a multiple output voltage regulator with
disabled when all the enable inputs are LOW (TDA3617 in
three independent switchable regulators. When the supply
standby mode). The HOLD output (open-collector output)
voltage is available (VP > 4.5 V), regulators 1, 2 and 3 can
can be wired OR-ed with other hold outputs of other
be operated by means of three independent enable inputs.
regulator parts (e.g. TDA3618). When all the regulators of
Schmitt trigger functions are included to switch the the TDA3617 are disabled (switched off), the HOLD output
regulators off at low battery voltage (VP < 4 V). will be high ohmic. Because of this feature, the hold will not
A hysteresis is included to avoid random switching. influence the hold information when wired OR-ed with
other regulator parts.
All output pins are fully protected. The regulators are
protected against load dump (the regulators switch off at Figure 3 shows the total timing of a semi-on/off logic set.
VP > 20 V) and short circuit (foldback current protection). Figure 4 shows the total timing of the HOLD signal.
enable ≥1.8 V
regulator 1 ≤1.2 V
9.0 V
regulator 1
0V
enable ≥1.8 V
regulator 2 ≤1.2 V
5.0 V
regulator 2
0V
enable ≥1.8 V
regulator 3 ≤1.2 V
3.3 V
regulator 3
0V
MGL621
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Philips Semiconductors Product specification
VP
enable
regulator
2 and/or 3
enable
regulator 1
out of out of
regulation regulation
regulator
output
short
2 and/or 3 circuit out of
regulation
regulator
output 1
temperature active
protection
>150 °C passive
HOLD
MGL622
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VP supply voltage
operating − 17.5 V
jump start t ≤ 10 minutes − 30 V
load dump protection for 50 ms; tr ≥ 2.5 ms − 50 V
Vbat(rp) reverse polarity battery voltage non-operating − −18 V
Ptot total power dissipation − 62 W
Tstg storage temperature non-operating −55 +150 °C
Tamb ambient temperature operating −40 +85 °C
Tj junction temperature operating − 175 °C
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611-E”.
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Philips Semiconductors Product specification
CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; measured in test circuit of Fig.6; unless otherwise specified.
2002 Sep 20 6
Philips Semiconductors Product specification
2002 Sep 20 7
Philips Semiconductors Product specification
2. The quiescent current is measured in the standby mode. Therefore, the enable inputs of regulators 1, 2 and 3 are
LOW (Ven < 1 V).
3. The drop-out voltage of regulators 1 and 2 is measured between VP and VREG1 or VREG2 respectively.
4. At current limit, IREGmn is held constant (see Fig.5 for the behaviour of IREGmn).
5. The foldback current protection limits the dissipated power at short circuit (see Fig.5).
6. Perform the load regulation test with sine wave load of 10 kHz on the regulator output under test. Measure the RMS
ripple voltage on each of the remaining regulator outputs, using a 80 kHz low-pass filter.
9V handbook, halfpage
VREG2 MGL592
VREG1 5V
2V 1V
IREG1
a. Regulator 1. b. Regulator 2.
handbook, halfpage
VREG3 MGL591
3.3 V
1V
c. Regulator 3.
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Philips Semiconductors Product specification
Note
1. Measured at a bandwidth of 200 kHz.
2002 Sep 20 9
Philips Semiconductors Product specification
Example 1
Regulators 1, 2 and 3 are stabilized with an electrolytic
output capacitor of 220 µF (ESR = 0.15 Ω).
At Tamb = −30 °C the capacitor value is decreased to handbook, halfpage
20
MGK612
Example 2
maximum ESR
10
Regulators 1, 2 and 3 are stabilized with an electrolytic
output capacitor of 10 µF (ESR = 3.18 Ω).
At Tamb = −30 °C the capacitor value is decreased to 5 stable region
3.3 µF and the ESR is increased to 23 Ω. The regulator will
be instable at Tamb = −30 °C.
0
0.1 1 10 100
Solution C (µF)
2002 Sep 20 10
Philips Semiconductors Product specification
PACKAGE OUTLINE
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) SOT157-2
non-concave
Dh
x
D
Eh
d A2
j E
L3
L Q
c v M
1 9
Z e1 w M m e2
bp
e
0 5 10 mm
scale
17.0 4.6 0.75 0.48 24.0 20.0 12.2 6 3.4 12.4 2.4 2.1 2.00
mm 10 5.08 2.54 5.08 4.3 0.8 0.25 0.03
15.5 4.4 0.60 0.38 23.6 19.6 11.8 3.1 11.0 1.6 1.8 1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
97-12-16
SOT157-2
99-12-17
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Philips Semiconductors Product specification
SOLDERING The total contact time of successive solder waves must not
exceed 5 seconds.
Introduction to soldering through-hole mount
packages The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
This text gives a brief insight to wave, dip and manual
specified maximum storage temperature (Tstg(max)). If the
soldering. A more in-depth account of soldering ICs can be
printed-circuit board has been pre-heated, forced cooling
found in our “Data Handbook IC26; Integrated Circuit
may be necessary immediately after soldering to keep the
Packages” (document order number 9398 652 90011).
temperature within the permissible limit.
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit Manual soldering
board.
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
Soldering by dipping or by solder wave
2 mm above it. If the temperature of the soldering iron bit
The maximum permissible temperature of the solder is is less than 300 °C it may remain in contact for up to
260 °C; solder at this temperature must not be in contact 10 seconds. If the bit temperature is between
with the joints for more than 5 seconds. 300 and 400 °C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING WAVE
DBS, DIP, HDIP, SDIP, SIL suitable suitable(1)
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2002 Sep 20 12
Philips Semiconductors Product specification
PRODUCT
DATA SHEET STATUS(1) DEFINITIONS
STATUS(2)
Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS DISCLAIMERS
Short-form specification The data in a short-form Life support applications These products are not
specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or
same type number and title. For detailed information see systems where malfunction of these products can
the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
Limiting values definition Limiting values given are in
for use in such applications do so at their own risk and
accordance with the Absolute Maximum Rating System
agree to fully indemnify Philips Semiconductors for any
(IEC 60134). Stress above one or more of the limiting
damages resulting from such application.
values may cause permanent damage to the device.
These are stress ratings only and operation of the device Right to make changes Philips Semiconductors
at these or at any other conditions above those given in the reserves the right to make changes, without notice, in the
Characteristics sections of the specification is not implied. products, including circuits, standard cells, and/or
Exposure to limiting values for extended periods may software, described or contained herein in order to
affect device reliability. improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
Application information Applications that are
the use of any of these products, conveys no licence or title
described herein for any of these products are for
under any patent, copyright, or mask work right to these
illustrative purposes only. Philips Semiconductors make
products, and makes no representations or warranties that
no representation or warranty that such applications will be
these products are free from patent, copyright, or mask
suitable for the specified use without further testing or
work right infringement, unless otherwise specified.
modification.
2002 Sep 20 13
Philips Semiconductors Product specification
NOTES
2002 Sep 20 14
Philips Semiconductors Product specification
NOTES
2002 Sep 20 15
Philips Semiconductors – a worldwide company
Contact information
Printed in The Netherlands 753503/04/pp16 Date of release: 2002 Sep 20 Document order number: 9397 750 10395