Professional Documents
Culture Documents
Electroless Nickel Applications Electronics: E.F. Duffek, D.W. Baudrand, CEF and J.G. Donaldson, CEF
Electroless Nickel Applications Electronics: E.F. Duffek, D.W. Baudrand, CEF and J.G. Donaldson, CEF
Electroless nickel baths have been developed to produce a wide range of deposit
characteristics that are desirable for electronic applications. Deposits that
exhibit excellent solderability, conductivity, corrosion protection, receptivity to
brazing, wire and die bonding, and act to retard precious metal migration are an
integral part of the fabrication and functional finishing of electronic devices.
Typical areas of use include electronic components and packages, printed
wiring boards, ceramic hybrid circuits, metal and plastic connectors, and
computer memory discs. Tables 9.1 and 9.2 show typical applications of
electroless nickel, deposit characteristics required, and alloys used.
Table 9.1
Applicatlons and Characteristics of Electroless Nickel Deposits
Table 9.2
Electroless Nickel Selector Chart
Brazing X X X X X X X X
Compressive
strength -
High hardness X
High temperature
resistance X
Non-magnetic -
Solderability
(RMA flux) X X X X X X X X
Wire bonding
(thermosonic/
ultrasonic) X X - - X X X X
Wire bonding
(thermo-
compression) -
Wear resistance X
Welding X
Corrosion
resistance
‘Phosphorus content
“Boron content.
areas of the part that are in contact with the solution, regardless of part shape or
complexity, and is the only practical method of providing corrosion protection,
solderability, hardness, and durability required on heat sinks.
Transistor chips, made from silicon wafers, are difficult to solder, and often
use electroless nickel deposits to form a solderable, adherent, and ohmic
contact on the back side of the wafer, which is used as a common ground.
Plating electroless nickel directly onto silicon wafers requires an alkaline plating
solution, with a deposit containing 1 to 5 percent phosphorus (1,2). Alkaline
nickel-boron solutions can also be used. An initial deposit of 0.1 to 0.2 pm is
thermally diffused into the surface of the silicon to “getter” contaminants and
enhanceadhesion. The part is then activated and replated with about 0.25 to0.35
232 ELECTROLESS PLATiNG
Fig. 9.1-TO-5 transistor packages plated with 60 to 90 pin. (1.5 to 2.25 pm) of nickel-boron.
Rinse.
Strip the zinc in 50 to 60 percent nitric acid for 30 sec to 1 minute.
Rinse.
Immersion zinc (20 to 25 sec at 70 to 80’ F), same as the immersion zinc step
above. A separate zincate solution is preferred.
Rinse (double rinse).
Electroless nickel plate.
Rinse and dry.
Fig. 9.6-Examples of copper transistor bases and a final assembly plated with electroless
nickel-phosphorus.
Electroless Nickel Applications in Electronics 237
Fig. 9.7-Printed circuit boards in various stages of fabrication, along with miscellaneous other
electronic components: LED, lead frames, transistor bases, and tube sockets.
improves wear resistance. In many applications, gold is plated onto the PWB
contacts and circuit traces to provide conductivity and oxidation resistance. If
the gold is plated directly onto the copper, however, migration and diffusion of
the copper into the gold can produce a surface that is easily oxidized, causing
high-resistance electrical connections or loss of contact. A deposit of electroless
nickel between the gold and the copper substrate forms a diffusion barrier that
retards the diffusion of copper into the gold (7). Although nickel will diffuse
through gold at elevated temperatures, electroless nickel has less tendency to
diffuse, resulting in longer life without significant loss of contact conductance.
Electroless nickel provides a superior diffusion barrier to that of electrolytic
nickel, which makes it more suitable for protecting all of the conductors of
PWBs, especially those which must operate at higher than room temperature
and, therefore, have increased diffusion rates. “Burn-in” boards (those that are
tested by cycling from high to low temperatures) will fail unless electrodeposited
238 ELECTROLESS PLATING
Rinse.
0 Catalyst predip.
catalyst system must be selected which will not lead to an immersion (chemical
replacement) deposit on the copper and will effectively catalyze the plastic
inside the holes. Sometimes a precatalyst conditioner (surfactant) is used to
increase the absorption of catalyst.
0 Rinse.
NOTE: Panel or pattern plating procedures can be used. Depending upon the
usual metal etch resist used, etching to remove unwanted copper is done in
peroxidelsulfuric acid, ferric chloride, persulfate, or cupric chloride solutions in
order to remove the electroless nickel deposit along with the copper. Alkaline
etchants are not effective in removing electroless nickel.
Fig. 9.8-IC chlp die bonded to substrate and wire bonded to external circuitry.
have been metallized by processes such as the ones using fused metal-glass
pastes, or by thin film vacuum deposition techniques. Direct electroless
deposition, although a problem in the past because of poor adhesion of metal to
ceramic, is now also practiced.
Extensive use is made of the nickel-boron and nickel-phosphorus electroless
systems. An important feature is the ability to plate electrically isolated areas and
fine lines.
Ceramics were the first type of insulating substrate for printed circuit
production, having been used in World War I1for miniature radio proximity fuses
(9).Although ceramic use has declined since the 1950s,there is renewed interest
in precision ceramics for printed circuit applications. Ceramics have important
properties such as high temperature strength, inertness, hardness, and high
dielectric and thermal conductivity. Applications include hybrid microwave
circuits, printed wiring boards, chip carriers, resistors, and capacitors (Figs.
9.8-9.10). Figure 9.8 shows an integrated circuit chip carrierthat has been silicon
bonded to the metallized substrate using a gold-silicon eutectic preform heated
to 850' C. Connection to the external circuitry is by aluminum or gold wire
bonding from the chip to metallized pads.
Alumina (Al2O3) isthe most commonly used material, although others, such as
beryllium oxide (BeO) and aluminum nitride (AIN), with higher heat dissipation
than alumina, barium titanate (BaTi03) and silicon nitride (Si,N,) are also
available. In each case, there is a need for a metallic coating or a conductive
pattern on the ceramic to support and interconnect the active and passive
Electroless Nickel Applicafions in Electronics 241
for high strength and for its compatibility with the thermal coefficient of
expansion (TCE). Patterns are screened or photo-etched with plating before or
after pattern delineation (10).
Mo-Mn Application
The Mo-Mn technique consists of forming a metallic layer on a ceramic surface
by applying a mixture of Mo and Mn powders with binders, with subsequent
heating in a hydrogen atmosphere (11-14). Bond strengths of 70 to 105 MPa
(10,000 to 15,000 psi) are typical.
Plating (15)
Typical process steps are as follows:
Alkaline cleaning (or vapor degreasing) for removal of soils.
Activation/microetching of surface to attain microporosity. A typical
activating solution consists of 200 to 300 g/L potassium ferricyanide and 100 g/L
potassium hydroxide, operated at 25 to 50" C for 30 to 60 sec. This should be
followed by deionized (DI) water rinsing.
Glass removal from Mo-Mn surfaces with a solution of 100 g/L potassium
hydroxide at 100" C for 8 to 15 min. Time is critical and must be accurately
determined. Rinse with DI water.
Acid activation with 10 percent HCI at room temperature for 5 to 15 sec.
Rinse with DI water.
Elecfroless Nickel Applications in Electronics 243
Ceramic Conditioning
The need for surface microporosity was first recognized by Stalnecker (16).
Processes using fluorides or molten inorganic compounds are now followed to
achieve bond strength.
Fluorides
Early work showed minimal metal adhesion on B e 0 (17) and Ab03 (18). B e 0
was conditioned with NaOH at 250" C and HBF4prior to plating. This process
achieved only 1.7 MPa (250 psi) bond strength, or about one-third the preferred
value of 5 MPa. Various fluoride solutions, e.g., ammonium fluoride-NaCl, HF-
NaCI, and ammonium bifluoride have been used, preferably on 90 to 97 percent
alumina for optimum porosity development (15,19,20). A typical process is:
g/L sodium chloride at 60" C for 2 to 20 min, followed by a DI water rinse with
ultrasonics:
0 Sensitization with 0.05 g/L SnCI2.2H2O and 1 mL/L HCI at 40" C for 5 min,
followed by a D1 water rinse.
Electroless nickel plating to a thickness of 2.5 to 5.0 p m . Borohydride
solutions are operated at pH 13 at 90" C; aminoboranesolution-pH 6 to 7,65" F;
hypophosphite solution-pH 6, 70" C.
Fine-line patterning, carried out using positive-type photoresist and etching
with nitric acid, ferric chloride, CrOl/H2SOI or H2S04/H202(13,22,25).
The system selected for patterning on a ceramic substrate depends on end use,
electrical parameters, mechanical strength, line width, and cost.
Electroless Nickel Applications in Electronics 245
The Mo-Mn system with electroless nickel plating, for example, is selected for
its resultant high mechanical strength, thermal coefficient of expansion,
compatibility of materials, and capability for hermetic packaging. Electronic
properties, with 60 percent electrical conductivity of other systems, and line
widths become secondary issues in the selection process; costs are moderate. A
metal(s) thickness of 0.5 mils on ceramic has been chosen in order to make line
width comparisons of these systemsequivalent. Practical line widths (for0.5 mil
metal thicknesses) are 7 to 10 mils for screened patterns and 4 to 7 mils for
photoetched patterns.
Screened conductor patterns show higher conductivities and lower costs than
Mo-Mn systems, although mechanical strength is lower. Typical line widthsof 7
to 10 mils are similar to screened patterns.
Direct plating on ceramics, notably the molten inorganic processes
discussed above, have application in electronics because of their optimum
electronic parameters, metal adhesion, variety of substrate materials, and
possible low production costs. Typical line widths at 0.5 mil metal thicknesses
are 2 mils.
Thin film systems are used in high-frequency, low-impedance applications.
Costs are high because of the need for expensive capital equipment such as
sputtering, electron beam, and evaporation machines; these systems also have a
low output. Line widthsdepend upon substratesmoothness and metal thickness.
Thus, at 0.08 mils (2 pm) and 0.5 mils (12.5 pm) thicknesses, practical line widths
are 1 to 5 pm and 1/2 to 1 mil, respectively.
Aluminum is used to fabricate the barrels, shells, coupling nuts, endbells, and
other metal components of electrical connectors (see Figs. 9.11 and 9.12)
because of its physical and metallurgical properties. Electroless nickel plating is
specified for a large percentage of these aluminum connector components.
The properties of the electroless nickel deposit have facilitated its
widespread use in many electronics applications. Its usage in the manufacture
of connectors is no exception. The electroless nickel properties cited by design
engineers as being the most important are:
Corrosion resistance
Hardness
Wear resistance
Lubricity and non-galling
Weldability and solderability
Relative ductility
Uniform deposit thickness
Non-magnetic
246 ELECTROLESS PLATING
Although the first six items on the list are most often cited, the last two are also
extremely important properties. Since electroless nickel deposition is uniform
on all surfaces with which the plating solution comes in contact, the integrity of
all dimensions are maintained both on I.D. and O.D. The non-magnetic property
of electroless nickel eliminates any interference with signal
transmissions.
The American Society for the Testing of Materials (ASTM) has issued a general
specification-6733-86, “Standard Specification for Autocatalytic Nickel-
Phosphorus Coatings on Metals”. This document specifies coating thicknesses
for meeting wear and corrosion requirements and defines test methods for
various coating properties.
While not a specification, another important document is ASTM 6-654,
“Standard Guide to Autocatalytic Nickel-Phosphorus Deposition on Metals for
Engineering Use”.
Equipment
Plating Systems
Whether designed to produce hundreds of thousands of components each
month, or just a few hundred, the required quality of the end product mandates
that the electroless nickel plating be performed in a satisfactory plating system.
A properly designed system should be large enough in volume to enable close
control over the process chemistry and variables, and will include the following
features:
240 ELECTROLESS PLATING
Tanks
Polypropylene, 316 stainless steel, Pyrex, or appropriate high-temperature
liners, such as 8- to 12-mil-thick PVDC. Agitation, either mechanical or by clean,
dry, low-pressure air, through CPVC or polypropylene pipes located on the tank
bottom is required, and part agitation using moving work rods is recommended.
Tank walls, seams, and welds must be as smooth as possible to reduce the
tendency for the solution to plate out.
Heaters
Heaters can be fabricated from teflon, quartz, Pyrex, and stainless steel. It is
important that they be sized large enough to avoid excessive heat-up time, but
have low heat density to prevent localized over-heating of the solution.
FIlters
Continuous filtration is important to preclude any chance of any degree of
surface roughness. In-tank filters are recommended, particularly CPVC
cartridge holders with 0.25 to 1 pm polypropylene cartridges. The size of the
filters should be adequate to permit 10 solution turnovers per hour.
Resewolr tanks
Also recommended are “hard-plumbed’’ reservoir tanks for the nitric acid
solution required for stripping the processing tanks after the inevitable, and
often times, all too frequent plate-out phenomena. These reservoirs can also
hold the plating solution while the stripping process is underway.
Handling Procedures
The appropriate technique for transporting the parts to be plated through the
preplating and plating operations are determined by the number of parts to be
processed, their size and shape, and how easily they might be damaged.
Racking
The larger components, and those having complex shapes, or that are easily
damaged, must be racked on appropriately designed racks. Spacing between
parts must be sufficient to allow good solution flow. Complex shapes, deep
bores, and recesses, must be positioned in such a way that the solution
impingement on those surfaces is optimized. Racked partsshould be at an angle
to avoid the chance of trapped gases causing roughness on undersurfaces, and
to promote good draining after each processing step. Rack marks may be
permitted by specification at sites indicated in engineering drawings. If not
permitted, the parts should be suspended loosely and the racks agitated
frequently to prevent shielding.
Electroless Nickel Applicafions in Electronics 249
Wlrlng
It is unlikely that appropriately-designed racks are feasible or economically
advisable for all of the many shapes and sizes of components that must be
plated. Affixing them to small diameter copper or aluminum soft wire, either
individually or in chains, is a common practice.
The parts must be suspended loosely to prevent shielding by the wire, and
each must be separated from its neighbor by 1 to 2 inches to be sure that there
will be no interference with solution impingement on a part, and to avoid
mechanical damage.
Baskets
Because aluminum components are light, they can be bulk-processed in
polypropylene or other heat-resistant, nonconductive dipping baskets. The
baskets should be filled to no more than 1/3 to 1/2 their height with parts, and the
same baskets can be used throughout the entire preplating sequence.
The basketsare immersed in theelectroless nickel solution suspended from a
suitable support or crossbar. In a manual installation, the plating operator must
carefully agitate and swirl the baskets at regular intervals to assure uniform
deposition on all parts.
By using separators in the baskets, it is possible to plate several types of
components at the same time, avoiding a post-plating sorting operation.
Barrels
Conventional horizontal plating cylinders, without cathode contacts, can also
be successfully used for electroless nickel plating aluminum connector
components that will not be damaged by tumbling. The effect of the tumbling
action can be minimized by rotating the cylinder just a few times per minute.
Rotation speed should beslow-Le., 3 rpm. The perforations in the barrel should
be as large as possible to assure good solution transfer.
The cylinders can be loaded to about the center line with parts that will tumble
freely, and which are small and light enough that threads and sharp edges will
not be adversely affected. About 1/3 of the barrel should be above the nickel
solution so that the gas being generated will escape. Preplating operations are
best performed in dipping baskets, with the parts being transferred to the plating
barrels before nickel plating.
complicate the task of the plater, fabricating techniques often include secondary
operations that produce lapped metal, burrs, abraded surfaces, and com-
binations of cast and machined areas.
Other factors that must be considered when establishing preplating
processesinclude the different types of lubricants used in the various fabricating
operations; the need to maintain critical dimensions, especially on threaded
parts; the presence of blind threaded holes; the size of the inner diameters that
must be plated; and the capability of the parts to trap solutions in small bores and
recesses.
Given all of the above complications, it would seem that a satisfactory
preplating process would be impossible to develop and maintain. However, it
can be accomplished, and surprisingly enough, with but little modifications to
conventional techniques that can be found in any text on the subject of plating
aluminum and its alloys.
Following is a typical processing sequence used for the 2000 and 6000 series
aluminum alloys from which connector components are fabricated, and which
may have either a machined or cast surface:
Solvent vapor degrease in perchloroethylene, 1,1,1-trichloroethane, or
equivalent.
Phosphoric acid etch for 1.5 min in a 40 percent by vol. solution.
Rinse (two-stage). Good rinsing between operations is very important. For
all rinses, a two-stage cascading rinse is advised, and air agitation is
recommended. Rinsing time should be from 30 sec to about 1 min. The
temperature of the water should not be less than 60' F, preferably at least 70' F.
Non-etch aluminum cleaner. The use of an inhibited cleaner is
recommended. Proprietary compounds containing alkaline silicates that inhibit
attack of the aluminum can be used; however, non-silicated cleaners are
preferred to avoid subsequent difficulties in removing a residual silicate film that
might form.
The solution should be operated according to the supplier's recommen:
dations; however, the operating temperature should be held between 120 and
130" F.
Immersion time should be about 2 to 4 minutes for racked parts, and 5 to 10
minutes for parts being processed in dipping baskets or horizontal barrels. The
pH should be maintained between 9.5 and 11.0.
Mild etch (optional). Alkaline solutions that etch aluminum are not
recommended for the purpose of cleaning. If it is desired to etch the surface to
improve the appearance of the component by masking machining marks,
scratches, or other surface imperfections, this operation should follow a non-
etch cleaning.
Both mildly alkaline and acidic proprietary etching solutions can be obtained
from the supply houses, and when operated in accordance with the supplier's
recommendations will produce a satisfactorily etched surface. The amount of
each etch desired will vary, depending on the nature of the parts. The degree of
etching is varied by (a) adjusting the immersion time; (b) raising or lowering the
solution temperature; or (c) raising or lowering the concentration of the
Electroless Nickel Applications in Electronics 251
0 Rinse.
Desmut for 10 to 30 sec. There are a number of proprietary desmutters
available; or use a mixture of 75 percent nitric acid and 25 percent hydrofluoric
acid; or 65 percent nitric acid, 25 percent sulfuric acid, and 10 percent
hydrofluoric acid.
Rinse.
0 Nitric acid (concentrated 42" Be) dip for 1 min at room temperature.
Rinse.
Zincate for 1 min. Formulas for zincating solutions can be found in most
plating texts. A typical formulation recommended forwrought and diecast alloys
consists of (28): 100 g/L zinc oxide, 400 g/L sodium hydroxide, 1 g/L ferrous
chloride, 5 g/L Rochelle salts, at a temperature of 60 to 80" F.
A number of especially formulated proprietary zincating solutions are
marketed by the many companies that feature processes for electroless nickel
plating on aluminum. The use of one of these is recommended rather than a
self-made solution in order that the user can benefit from the knowledge and
experience of the supplier.
Rinse.
Zincate strip with 50 percent nitric acid at room temperature for 30 sec.
0 Rinse.
DI water rinse.
Copper strike (optional). Two techniques may be used to improve the
adherence of nickel plating to aluminum. One is to submit the component to a
baking operation of 30 to 60 min at 375" F; the second is to copper strike the
zincated parts before immersing in the nickel solution.
If a copper strike is used, it must be one that is especially formulated for plating
on zincated aluminum. This is to avoid the possibility of an immersion copper
film, which will result in poor adherenceand the formation of blistersafter nickel
plating. This is particularly true when the parts are being plated in baskets or
barrels because of the inevitable presence of very low current density "pockets".
For the same reason, the zincated parts must be "hot" (cathodically charged)
when they enter the copper plating solution. A suggested copper strike solution
consists of 5.5 oz/gal copper cyanide, 8.5 oz/gal sodium cyanide, 8.0 oz/gal
Rochelle salts, at pH 10.2 to 10.5 and a free cyanide level of 2.0 to 2.8.
0 Rinse.
DI water rinse.
Electroless nickel plate.
Plating
Acid electroless nickel baths are commonly used for plating aluminum
connector components. The phosphorusshould be maintained between 11 and
252 ELECTROLESS PLATING
13 percent to sustain the desired properties of the deposit, and to assure that it
will be non-magnetic.
The process selected for plating aluminum connector hardware must be one
which will produce deposits having the properties specified and/or required for
optimum connector operation and reliability. In addition, the plater must
consider a number of other factors to assure the continuing production of parts
of suitable quality at the lowest possible cost:
Appearance
A semibright coating is the accepted standard of the connector industry.
Ease of control
The chemistry of the process must be maintained within close tolerances to
produce deposits of required characteristics, and to govern the deposition rate.
Therefore, the fewer additives required to sustain the process, the better.
Stability
A high tolerance for contaminants and high temperature stability are important
factors that improve the life of the solution and reduce the tendency for plate-
out-a common phenomena in electroless plating processes.
cost
Experienced electroless nickel platers know that to accurately determine plating
costs, a number of factors must be considered. These are items such as
controllability, stability, and plating rate, as well as chemical make-up costsand
the cost of replenishers. Obviously a solution that costs less at the start but
which is difficult to control, tends to plate-out too frequently, and/or has a
relatively short life expectancy is going to ultimately result in higher processing
costs.
The chemistry of electroless nickel plating solutions can be found in chapters
1 and 2 of this book, and in any of theconventional texts and guidebooks relating
to plating and metal finishing practices. Operation and control of these solutions
are also described, and many plating operations have used or are using them
successfully-but not necessarily for plating parts for electronic applications.
It is the recommendation of the authors, based on personal experience, that
when plating electronic components, particularly aluminum connector
hardware, commercially available processes be used. There are many available
that have been developed specifically for such applications, which provide all of
the characteristics required. It is critical in electronics applications that the
electroless nickel deposits consistently have all of the properties and
characteristics needed for optimum and reliable performance. To achieve this, it
is necessary that all process variables be closely controlled. Good practice
Electroless Nickel Applications in Electronics 253
includes the use of automatic bath controllers. If they are not used, it is
mandatory that the solutions be analyzed frgquently so that only small additions
of required chemicals are made. Some general operating guidelines include:
Loading
Typically, an electroless nickel solution can be loaded with about 0.25 to 1.0
ft2/gal of plating surface area per gallon. To attain closer control over the
deposition rate, it is recommended that the loading be restricted to 0.4 to 0.6
ft2/gal.
Temperature
Although the typical operating range of most solutions can vary 15to 20" F,it is
recommendedthat when used for plating electronic parts, particularly aluminum
connectors, that the range be kept smaller, preferably about t3" F, e.g., from 186
to 192" F. It may be advantageous to operate a new solution about 5 degrees
cooler for its first cycle.
Make sure, through good solution agitation, that the temperature of the
solution is equal throughout the entire tank, "Hot-spots'' around the heaters
cannot be allowed to occur.
Filfration
The importance of continuous filtration was discussed earlier in this chapter. For
best results, the filtering media should be 0.25 pm.
Agitation
Solution agitation is accomplished mechanically, Le., pumping and the use of
wires, and by air agitation using a low-pressure air blower. Agitating the parts
during plating using horizontal work rod movement is recommended, or when
this is not possible, the racks and plating baskets should beagitated manually at
frequent intervals.
Deposit monitoring
The most important of the characteristics and attributes of the deposit that can
be checked at the time of the plating process by the plater are thickness,
adherence, and ductility. The plating operator can perform these tests easily by
the following method:
With suitable process controls in place, the deposition rate of an electroless
nickel solution is quite predictable, and a typical plating specification of 0.0002
to 0.0004 in., or 0.0004 to 0.0007 in. is easy to meet. Thicker coatings of 2 to 3
mils, which are required for special connector applications may prove to be
more of a problem, particularly when the specified range may be a seemingly
impossible +0.0001 in. Depending on the age of the plating solution and other
conditions, the total plating time will be about 3 to 4 hours, and the plating
"window" will be about 8 to 10 minutes.
About the simplest technique used to monitor plating thickness, as well as
plating adherence and ductility, is to plate aluminum test panels along with the
parts being processed. The panels should be made from the same alloy and be
254 ELECTROLESS PLATING
about 1 x 4 in. and 0.03 to 0.04 in. thick. They should be run along with the parts
being plated through the complete process.
Several panels should be plated, wired, or racked to avoid shielding problems.
Both adherence and ductility can be tested by a standard bend test (see chapter
on testing of deposits). The hand-held micrometer can be used effectively by a
trained operator to determine how much additional time should be given the
parts in process, but if an X-ray unit is readily available for use, it is the preferred
and more accurate tool to employ. (It can also be used for checking the parts
themselves.) One of the advantages of the post-plating baking operation used to
enhance the adherence of the deposit is that blisters will be formed if pre-plating
operations have not adequately prepared the surface for plating. Since many of
the components will be subjected to higher temperatures during subsequent
bonding or marking operations, it is important that blistering be detected
immediately after plating. A baking test is recommended-30 minutes at about
400' F on several specimens before the entire lot is subjected to the baking
process.
Substrate preparation
0 Punching and machining aluminum alloy blanks
0 Precision grinding
0 Oxide removal
Immersion zinc
Electroless nickel plate
Fig. 9.13-3% and 5% in. electroless nickel-plated memory disks in a cassette carrier.
Finishing
Protective overcoats of chrome alloys and/or carbon
Antistiction coating
Burnishing
0 Rinse.
Rinse in DI water.
Electroless cobalt plate for 1 to 2 min at a bath temperature of 150 to 170" F
(65 to 76" C).
Rinse (DI water).
Dry.
Apply lubricant overcoating (carbon, silicon dioxide, fluocarbons,
oxidizing treatments, and other processes).
Test for magnetic characteristics.
REFERENCES