CPC1017N

60V Normally-Open Single-Pole

INTEGRATED CIRCUITS DIVISION 4-Pin SOP OptoMOS® Relay

Parameter Rating Units Description

Blocking Voltage 60 VP The CPC1017N is a miniature single-pole,
Load Current 100 mArms / mADC normally-open (1-Form-A) solid state relay in a
On-Resistance (max) 16  4-pin SOP package that employs optically coupled
LED Current to operate 1 mA MOSFET technology to provide 1500Vrms of input
to output isolation. The super-efficient MOSFET
switches and photovoltaic die use IXYS Integrated
Circuits Division’s patented OptoMOS architecture
Features
while the optically coupled output is controlled by a
• Designed for Use in Security Systems Complying highly efficient infrared LED.
with EN50130-4
• Only 1mA of LED Current Required to Operate IXYS Integrated Circuits Division’s state of the art
• 1500Vrms Input/Output Isolation double-molded vertical construction packaging
• High Reliability enables CPC1017N to be one of the world’s smallest
• Arc-Free With No Snubbing Circuits relays. It offers board space savings of at least 20%
• No EMI/RFI Generation over the competitor’s larger 4-pin SOP relay.
• Immune to Radiated EM Fields
• Halogen Free Approvals
• Tape & Reel Version Available
• Small 4-Pin SOP Package • UL Recognized Component: File E76270
• Flammability Rating UL 94 V-0 • CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1: Certificate # B 082667 0007

Applications
• Security
Ordering Information
• Passive Infrared Detectors (PIR) Part # Description
• Data Signalling CPC1017N 4-Pin SOP (100/tube)
• Sensor Circuitry CPC1017NTR 4-Pin SOP (2000/reel)
• Instrumentation
• Multiplexers
• Data Acquisition Pin Configuration
• Electronic Switching
1 4
• I/O Subsystems + Control Load
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation 2 3
• Aerospace – Control Load
• Industrial Controls

Switching Characteristics
of Normally-Open Devices

Form-A

IF

90%
10%
ILOAD
ton toff

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Absolute Maximum Ratings @ 25ºC

Parameter Ratings Units Absolute Maximum Ratings are stress ratings. Stresses in
Blocking Voltage 60 VP excess of these ratings can cause permanent damage to the
Reverse Input Voltage 5 V device. Functional operation of the device at conditions beyond
Input Control Current 50 mA
those indicated in the operational sections of this data sheet is
Peak (10ms) not implied.
1 A
Input Power Dissipation 1 70 mW Typical values are characteristic of the device at +25°C, and
Total Power Dissipation 2 400 mW are the result of engineering evaluations. They are provided for
Isolation Voltage, Input to Output 1500 Vrms information purposes only, and are not part of the manufacturing
Operational Temperature -40 to +85 ºC testing requirements.
Storage Temperature -40 to +125 ºC
1 Derate linearly 1.33 mW / ºC
2 Derate output linearly 3.33 mW / ºC

Electrical Characteristics @ 25ºC

Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1 IF=2mA IL - - 100 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance 2 IL=100mA RON - - 16 
Off-State Leakage Current VL=60VP ILEAK - - 1 A
Switching Speeds
Turn-On ton - - 10 ms
IF=5mA, VL=10V
Turn-Off toff - - 10 ms
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT - 5 - pF
Input Characteristics
Input Control Current to Activate 3 IL=100mA IF - 0.4 1 mA
Input Voltage to Deactivate 3 - VF 0.8 - - V
Input Voltage Drop IF=5mA VF 0.9 1.2 1.5 V
Reverse Input Current VR=5V IR - - 10 A
Common Characteristics
Capacitance, Input to Output VIO=0V, f=1MHz CIO - 1 - pF
1 Load current derates linearly from 100mA @ 25ºC to 80mA @ 80ºC.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (greater than 60ºC):
• To activate, a minimum LED drive current of 3mA is recommended.
• To deactivate, a maximum LED input voltage of 0.7V is recommended.

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PERFORMANCE DATA*

Typical LED Forward Voltage Drop Typical IF for Switch Operation Typical IF for Switch Dropout
(N=50, IF=5mA) (N=50, IL=100mA) (N=50, IL=100mA)
35 25 25

30
20 20

Device Count (N)

Device Count (N)

Device Count (N)

25

20 15 15

15 10 10
10
5 5
5

0 0 0
1.17 1.19 1.21 1.23 1.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.30 0.35 0.40 0.45 0.50 0.55 0.60
LED Forward Voltage Drop (V) LED Current (mA) LED Current (mA)

Typical On-Resistance Distribution Typical Turn-On Time Typical Turn-Off Time

(N=50, IL=100mA) (N=50, IF=5mA, IL=100mA) (N=50, IF=5mA, IL=100mA)
35 25 25

30
20 20
Device Count (N)

Device Count (N)

Device Count (N)

25

20 15 15

15 10 10
10
5 5
5

0 0 0
6.8 6.9 7.0 7.1 7.2 7.3 7.4 1.0 1.1 1.2 1.3 1.4 1.5 1.6 0.26 0.28 0.30 0.32 0.34 0.36 0.38
On-Resistance (:) Turn-On Time (ms) Turn-Off Time (ms)

Typical Blocking Voltage Distribution

(N=50)
35

30
Device Count (N)

25

20

15

10

0
80 82 84 86 88 90 92
Blocking Voltage (VP)

Typical IF for Switch Operation Typical Load Current

Typical LED Forward Voltage Drop vs. Temperature vs. Load Voltage
vs. Temperature (IL=80mA) (IF=5mA)
1.8 3.0 150
LED Forward Voltage Drop (V)

1.6 2.5 100

Load Current (mA)
LED Current (mA)

2.0 50
1.4
IF=50mA 1.5 0
1.2
IF=10mA 1.0 -50
IF=5mA
1.0
0.5 -100

0.8 0 -150
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 -1.5 -1.0 -0.5 0 0.5 1.0 1.5
Temperature (ºC) Temperature (ºC) Load Voltage (V)

*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.

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PERFORMANCE DATA*
Typical Turn-On Time Typical Turn-Off Time
vs. LED Forward Current vs. LED Forward Current Typical On-Resistance vs. Temperature
(IL=100mA) (IL=100mA) (IL=Max Rated @ Temperature)
3.0 0.7 14
2.7 IF=2mA
0.6 12
2.4

Turn-Off Time (ms)

Turn-On Time (ms)

On-Resistance (:)
IF=5mA
2.1 0.5
10
1.8 Steady State
0.4
1.5 8
0.3 Instantaneous
1.2 IF=5mA
0.9 6
0.2
0.6
0.1 4
0.3
0 0 2
0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50 -40 -20 0 20 40 60 80 100
LED Forward Current (mA) LED Forward Current (mA) Temperature (ºC)

Typical Turn-On Time vs. Temperature Typical Turn-Off Time vs. Temperature Typical Maximum Load Current
(IL=50mA) (IL=50mA) vs. Temperature
3.5 1.0 180
0.9 160
3.0 0.8 140

Load Current (mA)

Turn-On Time (ms)

Turn-Off Time (ms)

IF=2mA 0.7 120

2.5 0.6
100
0.5 IF=5mA
80
2.0 0.4 IF=2mA
IF=5mA 60
IF=5mA 0.3
1.5 0.2 40
0.1 20
IF=2mA
1.0 0 0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 120
Temperature (ºC) Temperature (ºC) Temperature (ºC)

Typical Leakage vs. Temperature

Typical Blocking Voltage Measured Across Pins 3&4 Output Capacitance vs. Load Voltage
vs. Temperature (VL=60V) (IF=0mA, f=1MHz)
91 0.016 14
0.014
Output Capacitance (pF)

89
Blocking Voltage (VP)

12
0.012
87
Leakage (PA)

0.010 10
85
0.008
83 8
0.006
81
0.004
6
79 0.002
77 0 4
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0 10 20 30 40 50 60
Temperature (ºC) Temperature (ºC) Load Voltage (V)

Energy Rating Curve

(TJ=25ºC)
1.0
0.9
0.8
Load Current (A)

0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Time

*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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Manufacturing Information
Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Classification

CPC1017N MSL 3

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Soldering Profile

Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum
dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification
Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes.

Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles
CPC1017N 260ºC 30 seconds 3

Board Wash

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to halide flux or solvents.

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MECHANICAL DIMENSIONS
CPC1017N
4.089 ± 0.025 Recommended PCB Land Pattern
(0.161 ± 0.001)
0.203 ± 0.025
0.60
(0.008 ± 0.001)
(0.024)

3.810 ± 0.025 6.096 ± 0.102

(0.150 ± 0.001) (0.240 ± 0.004)
0.559 ± 0.127
(0.022 ± 0.005) 3.85
Pin 1 0.910 ± 0.025 (0.152)
(0.036 ± 0.001)
2.54 Typ 1.54
(0.100 Typ) (0.061)
2.030± 0.025 2.54
(0.080± 0.001) Dimensions (0.10)
Package standoff: mm
0.064 ± 0.040 (inches)
0.481 (0.0025 ± 0.0015)
(0.019) CPC1017N device weight = 0.076 grams
0.381 ± 0.025 Note:
0-0.1
(0-0.004) (0.015 ± 0.001) 1. Lead dimensions do not include plating: 1000 microinches max.

CPC1017NTR Tape & Reel

330.2 Dia
(13.00 Dia)

W=12.00
Top Cover B0=4.70 (0.472)
Tape Thickness (0.185)
0.102 Max
(0.004 Max)

K0=2.70 A0=6.50 P1=8.00

(0.106) (0.256) (0.315)
K1=2.30
(0.091)
User Direction of Feed

Dimensions
Embossed mm
Carrier
(inches)

Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted

For additional information please visit our website at: www.ixysic.com

Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
Specification: DS-CPC1017N-R11
©Copyright 2019, Littelfuse, Inc.
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
6 All rights reserved. Printed in USA.
12/11/2019