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Features Description: Ltm8055/Ltm8055-1 36V, 8.5A Buck-Boost Μmodule Regulator
Features Description: Ltm8055/Ltm8055-1 36V, 8.5A Buck-Boost Μmodule Regulator
FEATURES DESCRIPTION
n Complete Buck-Boost Switch Mode Power Supply The LTM®8055/LTM8055-1 is a 36VIN, buck-boost
n V
OUT Equal, Greater, Less Than VIN µModule® (micromodule) regulator. Included in the pack-
n Wide Input Voltage Range: 5V to 36V age are the switching controller, power switches, inductor
n 12V/3A Output from 6V and support components. A resistor to set the switching
IN
n 12V/6A Output from 12V frequency, a resistor divider to set the output voltage,
IN
n 12V/8.5A Output from 24V and input and output capacitors are all that are needed
IN
n Up to 97.5% Efficient to complete the design. Other features such as input and
n Adjustable Input and Output Average Current Limits output average current regulation may be implemented
n Input and Output Current Monitors with just a few components. The LTM8055/LTM8055-1
n Parallelable for Increased Output Current operates over an input voltage range of 5V to 36V, and
n Wide Output Voltage Range: 1.2V to 36V can regulate output voltages between 1.2V and 36V. The
n Selectable Switching Frequency: 100kHz to 800kHz SYNC input and CLKOUT output allow easy synchronization.
n Synchronization from 200kHz to 700kHz
n External Compensation (LTM8055-1)
The LTM8055/LTM8055-1 is housed in a compact over-
n 15mm × 15mm × 4.92mm BGA Package
molded ball grid array (BGA) package suitable for auto-
mated assembly by standard surface mount equipment.
The LTM8055/LTM8055-1 is RoHS compliant.
APPLICATIONS Buck-Boost Selection Table
LTM8054 LTM8055/LTM8055-1 LTM8056
n High Power Battery-Operated Devices
VIN (Operation) 36 36 58
n Industrial Control
VIN Abs Max 40 40 60
n Solar Powered Voltage Regulator
VOUT Abs Max 40 40 60
n Solar Powered Battery Charging
IOUT (Peak) 5.4 8.5 5.5
All registered trademarks and trademarks are the property of their respective owners. 24VIN, 12VOUT
Package 15 × 11.25mm × 15 × 15mm × 4.92mm BGA
3.42mm BGA Pin and Function Compatible
TYPICAL APPLICATION
Maximum Output Current and Efficiency vs VIN
12VOUT from 5VIN to 36VIN Buck-Boost Regulator 10 98
EFFICIENCY
96
VIN VIN LTM8055/ VOUT VOUT 8
5V TO 36V LTM8055-1 12V
SVIN OUTPUT 94
OUTPUT CURRENT (A)
IIN IOUT
CURRENT
EFFICIENCY (%)
6
92
4.7µF 100k 68µF
50V RUN
90
×2 CTL 4
SS CLKOUT 22µF
25V 88
SYNC IINMON
2
36.5k COMP IOUTMON 11k 86
RT LL MODE GND FB
8055 TA01a 0 84
0 10 20 30 40
fSW = 600kHz VIN (V)
8055 TA01b
Rev C
8
Peak Solder Reflow Body Temperature.................. 245°C
7
BANK 2 4 RUN
VOUT
3 IINMON
2 IOUTMON
1 GND
A B C D E
F G H J K L
IOUT LL RT FB SS
CLKOUT
MODE SYNC CTL
COMP
BGA PACKAGE
121-LEAD (15mm × 15mm × 4.92mm)
TJMAX = 125°C, θJA = 20.5°C/W, θJCbottom = 11.0°C/W, θJCtop = 21.2°C/W, θJB = 10.5°C/W,
WEIGHT = 2.8g, θ VALUES DETERMINED PER JEDEC JESD51-9, 51-12
ORDER INFORMATION
PART NUMBER TERMINAL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE
DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM8055EY#PBF SAC305 (RoHS) LTM8055Y e1 BGA 3 –40°C to 125°C
LTM8055IY#PBF SAC305 (RoHS) LTM8055Y e1 BGA 3 –40°C to 125°C
LTM8055IY SnPb(63/37) LTM8055Y e0 BGA 3 –40°C to 125°C
LTM8055MPY#PBF SAC305 (RoHS) LTM8055Y e1 BGA 3 –55°C to 125°C
LTM8055MPY SnPb(63/37) LTM8055Y e0 BGA 3 –55°C to 125°C
LTM8055EY-1#PBF SAC305 (RoHS) LTM8055Y-1 e1 BGA 3 –40°C to 125°C
LTM8055IY-1#PBF SAC305 (RoHS) LTM8055Y-1 e1 BGA 3 –40°C to 125°C
• Device temperature grade is indicated by a label on the shipping This product is not recommended for second side reflow.
container. This product is moisture sensitive. For more information, go to
Recommended BGA PCB Assembly and Manufacturing Procedures.
• Pad or ball finish code is per IPC/JEDEC J-STD-609.
• BGA Package and Tray Drawings
Rev C
Note 1: Stresses beyond those listed under Absolute Maximum Ratings the full –55°C to 125°C internal operating temperature range. Note that
may cause permanent damage to the device. Exposure to any Absolute the maximum internal temperature is determined by specific operating
Maximum Rating condition for extended periods may affect device conditions in conjunction with board layout, the rated package thermal
reliability and lifetime. resistance and other environmental factors.
Note 2: The LTM8055E/LTM8055E-1 is guaranteed to meet performance Note 3: The LTM8055/LTM8055-1 contains overtemperature protection
specifications from 0°C to 125°C internal. Specifications over the full that is intended to protect the device during momentary overload
–40°C to 125°C internal operating temperature range are assured by conditions. The internal temperature exceeds the maximum operating
design, characterization and correlation with statistical process controls. junction temperature when the overtemperature protection is active.
The LTM8055I/LTM8055I-1 is guaranteed to meet specifications over Continuous operation above the specified maximum operating junction
the full –40°C to 125°C internal operating temperature range. The temperature may impair device reliability.
LTM8055MP/LTM8055MP-1 is guaranteed to meet specifications over
Rev C
80
80 80
EFFICIENCY (%)
EFFICIENCY (%)
EFFICIENCY (%)
60
60 60
40
80 80 80
EFFICIENCY (%)
EFFICIENCY (%)
EFFICIENCY (%)
60 60 60
Efficiency vs Output Current Input Current vs Output Current Input Current vs Output Current
(36VOUT) (3.3VOUT) (5VOUT)
100 7 10
5VIN 5VIN
12VIN 12VIN
90 6
24VIN 24VIN
8
36VIN 36VIN
5
INPUT CURRENT (A)
80
EFFICIENCY (%)
6
4
70
3
4
60
2
5VIN
12VIN 2
50 1
24VIN
36VIN
40 0 0
0 1 2 3 4 5 0 2 4 6 8 10 0 2 4 6 8 10
OUTPUT CURRENT (A) OUTPUT CURRENT (A) OUTPUT CURRENT (A)
8055 G07 8055 G08 8055 G09
Rev C
Input Current vs Output Current Input Current vs Output Current Input Current vs Output Current
(8VOUT) (12VOUT) (18VOUT)
10 10 10
5VIN 5VIN
12VIN 12VIN
24VIN 24VIN
8 8 8
36VIN 36VIN
6 6 6
4 4 4
2 5VIN
2 2
12VIN
24VIN
36VIN
0 0 0
0 2 4 6 8 10 0 3 6 9 0 2 4 6 8
OUTPUT CURRENT (A) OUTPUT CURRENT (A) OUTPUT CURRENT (A)
8055 G10 8055 G11 8055 G12
6 8
6
5
4
4
3 6
2 5VIN
2 3.3VOUT
12VIN
1 24VIN 5VOUT
36VIN 8VOUT
0 0 4
0 2 4 6 0 1 2 3 4 5 0 10 20 30 40
OUTPUT CURRENT (A) OUTPUT CURRENT (A) VIN (V)
8055 G13 8055 G14 8055 G15
6 60 60
4 40 40
12VOUT
2 18VOUT 20 20
24VOUT
36VOUT
0 0 0
0 10 20 30 40 0 2 4 6 8 10 0 2 4 6 8 10
VIN (V) OUTPUT CURRENT (A) OUTPUT CURRENT (A)
8055 G16 8055 G17 8055 G18
Rev C
80 80 80
TEMPERATURE RISE (°C)
40 40 40
Temperature Rise vs Output Temperature Rise vs Output Output Voltage Ripple, Unmodified
Current (24VOUT) Current (36VOUT) DC2017A Demo Board 12VOUT
100 100
MEASURED WITH HP461N
24VIN 150MHz AMPLIFIER
6A LOAD
80 80 (BUCK)
100mV/DIV
TEMPERATURE RISE (°C)
60 60 12VIN
6A LOAD
(BUCK-BOOST)
100mV/DIV
40 40
6
OUTPUT CURRENT (A)
5
CSS = 0.022µF
2V/DIV 4
CSS = 0.22µF 3
8055 G25
0
500µs/DIV 0 0.2 0.4 0.6 0.8 1 1.2 1.4
CTL VOLTAGE (V)
8055 G26
Rev C
BLOCK DIAGRAM
VIN VOUT
SVIN
IOUT
IIN 4.7µH
0.47µF
0.2µF 50V
RUN
GND
2V
FB
100k 100k
SS CLKOUT
BUCK-BOOST CONTROLLER
0.1µF IINMON
CTL IOUTMON
8055 BD
Rev C
Rev C
Rev C
through a unity gain buffer. The unity gain buffer is re- VIN
R1
quired to isolate the output impedance of the LTM8055/ RUN
LTM8055-1 from the integrated pull-up on the CTL pins. R2
8055 F02
CIN
GND
SVIN
VIN
RIN
GND/THERMAL VIAS
INPUT
IIN
SENSE
COUT
INPUT
RUN
ROUT
OUTPUT GND
IOUT SENSE
VOUT SIGNAL VIA
8055 F06
Rev C
JUNCTION-TO-BOARD RESISTANCE
JUNCTION AMBIENT
8055 F07
µMODULE CONVERTER
Figure 7
Given these definitions, it should now be apparent that none The blue resistances are contained within the µModule
of these thermal coefficients reflects an actual physical converter, and the green are outside.
operating condition of a µModule converter. Thus, none
The die temperature of the LTM8055/LTM8055-1 must be
of them can be individually used to accurately predict the
lower than the maximum rating of 125°C, so care should
thermal performance of the product. Likewise, it would
be taken in the layout of the circuit to ensure good heat
be inappropriate to attempt to use any one coefficient to
sinking of the LTM8055/LTM8055-1. The bulk of the heat
correlate to the junction temperature versus load graphs
flow out of the LTM8055/LTM8055-1 is through the bottom
given in the product’s data sheet. The only appropriate way
of the μModule converter and the BGA pads into the printed
to use the coefficients is when running a detailed thermal
circuit board. Consequently a poor printed circuit board
analysis, such as FEA, which considers all of the thermal
design can cause excessive heating, resulting in impaired
resistances simultaneously. performance or reliability. Please refer to the PCB Layout
A graphical representation of these thermal resistances section for printed circuit board design suggestions.
is given in Figure 7.
Rev C
fSW = 600kHz
0
0 0.5 1 1.5 2 2.5
OUTPUT CURRENT (A)
8055 TA03b
Rev C
IIN 3.0
0
fSW = 600kHz 0 1 2 3 4 5 6
OUTPUT CURRENT (A)
8055 TA04b
10µF RUN
50V 0.8
CTL +
VIOUTMON (V)
SS 22µF 68µF
100k 25V 25V 0.6
SYNC IINMON
47pF
36.5k COMP IOUTMON
RT FB 0.4
CLKOUT + MASTER
–
0
0.008Ω 0 5 10 15
VIN LTM8055/ VOUT
LTM8055-1 COMBINED CURRENTS OF BOTH CHANNELS (A)
SVIN IOUT 8055 TA05b
(SLAVE)
IIN
8055 TA05a
fSW = 600kHz
Rev C
8055 TA06a
fSW = 600kHz
12
2.0
10
INPUT CURRENT (A)
1.5 8
VOUT (V)
6
1.0
VOUT 4
0.5 INPUT CURRENT,
REGULATOR 1 2
INPUT CURRENT,
REGULATOR 2 0
0
0 1 2 3 4
OUTPUT CURRENT (A)
8055 TA06b
Rev C
PIN ID FUNCTION PIN ID FUNCTION PIN ID FUNCTION PIN ID FUNCTION PIN ID FUNCTION
G1 CLKOUT H1 RT J1 FB K1 SS L1 GND
G2 MODE H2 SYNC J2 COMP K2 CTL L2 IOUTMON
G3 GND H3 GND J3 GND K3 GND L3 IINMON
G4 GND H4 GND J4 GND K4 GND L4 RUN
G5 GND H5 GND J5 GND K5 GND L5 GND
G6 GND H6 GND J6 GND K6 GND L6 GND
G7 GND H7 GND J7 GND K7 GND L7 GND
G8 GND H8 GND J8 GND K8 GND L8 GND
G9 GND H9 GND J9 GND K9 GND L9 IIN
G10 VIN H10 VIN J10 VIN K10 VIN L10 VIN
G11 VIN H11 VIN J11 VIN K11 VIN L11 VIN
Rev C
Rev C
24
(Reference LTC DWG# 05-08-1891 Rev A)
Z SEE NOTES
A DETAIL A
aaa Z 7
E Y G
X A1 A2 SEE NOTES
PIN 1
3
ccc Z
A
PIN “A1” B
CORNER
4 b C
MOLD b1
CAP
D
SUBSTRATE
E
H1
H2
D F F
Z
DETAIL B G
// bbb Z
H
PACKAGE DESCRIPTION
Øb (121 PLACES)
J
LTM8055/LTM8055-1
ddd M Z X Y e
eee M Z K
L
aaa Z
11 10 9 8 7 6 5 4 3 2 1
PACKAGE TOP VIEW
PACKAGE BOTTOM VIEW
DETAIL B
PACKAGE SIDE VIEW NOTES:
DETAIL A
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
0.000
2. ALL DIMENSIONS ARE IN MILLIMETERS
6.350
5.080
3.810
2.540
1.270
0.3175
0.3175
1.270
2.540
3.810
5.080
6.350
3 BALL DESIGNATION PER JESD MS-028 AND JEP95
DIMENSIONS
0.635 ±0.025 Ø 121x 6.350 SYMBOL MIN NOM MAX NOTES 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
A 4.72 4.92 5.12 THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
5.080
A1 0.50 0.60 0.70 MARKED FEATURE
3.810 A2 4.22 4.32 4.42
5. PRIMARY DATUM -Z- IS SEATING PLANE
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION BGA 121 1112 REV A
Rev C
LTM8055/LTM8055-1
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER
A 01/16 Added Buck-Bost Selection Table 1
B 05/17 Added text to IOUTMON (pin L2) 8
C 08/18 Added LTM8055-1 1, 2, 7, 9, 10,
23
Rev C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For morebyinformation
is granted www.analog.com
implication or otherwise under any patent or patent rights of Analog Devices. 25
LTM8055/LTM8055-1
TYPICAL APPLICATION
14.4V, 3A Lead-Acid Battery Charger Input Current Limited to 2.1A Input Current vs Input Voltage,
IOUT = 3A
2.5
1µF
50V
2.0
100k
+ 47µF 1.0
10µF 25V
RUN
50V
CTL 0.5
SS CLKOUT 22µF
SYNC IINMON 25V
36.5k COMP IOUTMON 9.09k 0
0 10 20 30 40
RT FB
LL MODE GND INPUT VOLTAGE (V)
8055 TA07a 8055 TA07b
fSW = 600kHz
DESIGN RESOURCES
SUBJECT DESCRIPTION
µModule Design and Manufacturing Resources Design: Manufacturing:
• Selector Guides • Quick Start Guide/Demo Manual
• Demo Boards and Gerber Files • PCB Design, Assembly and Manufacturing Guidelines
• Free Simulation Tools • Package and Board Level Reliability
µModule Regulator Products Search 1. Sort table of products by parameters and download the result as a spread sheet.
2. Search using the Quick Power Search parametric table.
Digital Power System Management Analog Devices’ family of digital power supply management ICs are highly integrated solutions that
offer essential functions, including power supply monitoring, supervision, margining and sequencing,
and feature EEPROM for storing user configurations and fault logging.
RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
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LTM4609 Higher Power Buck-Boost (Up to 60W) External Inductor, Synchronous Switching Buck-Boost; Up to 36VIN, 0.8V ≤ VOUT ≤ 34V
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Rev C
26
D17085-0-8/18(C)
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