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Abstract—Structural damage to ball grid array interconnects acteristics of electronics [7]–[18]. Precise resistance measure-
incurred during vibration testing has been monitored in the ments based on the resistance spectroscopy method have been
prefailure space using resistance spectroscopy-based state space used to monitor interconnects for damage and prognosticate
vectors, rate of change of the state variable, and acceleration
of the state variable. The technique is intended for condition failure [19]–[24]. Avionics systems require ultrahigh reliability
monitoring in high reliability applications where the knowledge to fulfill critical roles in autonomous aircraft control and navi-
of impending failure is critical and the risks in terms of loss of gation, flight path prediction and tracking, and self-separation.
functionality are too high to bear. Future state of the system has Complex electrical power systems (EPS), which broadly com-
been estimated based on a second-order Kalman Filter model prise of energy generation, energy storage, power distribution,
and a Bayesian Framework. The measured state variable has
been related to the underlying interconnect damage in the form and power management, have a major impact on the operational
of inelastic strain energy density. Performance of the prognostic availability and reliability of electronic systems. Technology
health management algorithm during the vibration test has been trends in evolution of avionics systems pointtoward more elec-
quantified using performance evaluation metrics. The method- tric aircraft [25] and the prevalent use of powersemiconduc-
ology has been demonstrated on leadfree area-array electronic tor devices in future aircraft and space platforms.Advanced
assemblies subjected to vibration. Model predictions have been
correlated with experimental data. The presented approach is health management techniques for electrical powersystems and
applicable to functional systems where corner interconnects in avionics systems are required to meet the safety, reliability,
area-array packages may be often redundant. Prognostic metrics maintainability, and supportability requirements ofaeronautics
including α − λ precision, β accuracy, and relative accuracy have and space systems. Current health management techniques in
been used to assess the performance of the damage proxies. The EPS and avionics systems provide very limited or no visibility
presented approach enables the estimation of residual life based
on level of risk averseness. into health of power electronics packaging to predict impending
failures [26]–[30].
Index Terms—Health monitoring, leading indicators of failure, Maintenance has evolved over the years from corrective
prognostics, solder joint reliability.
maintenance to performing time-based preventive maintenance.
I. I NTRODUCTION Future improvements in reduction of system downtime require
emphasis on early detection of degradation mechanisms. Incen-
TABLE I
PACKAGE A RCHITECTURES U SED FOR T EST B OARD
Fig. 5. Raw resistance data. The data used as an input data vector is shown in
the brackets.
TABLE III
U NDEFORMED G EOMETRY OF S OLDER BALL
TABLE II
A NAND ’ S C ONSTANTS FOR SAC305
V. PHM F RAMEWORK
The strain-resistance relationships have been used to corre-
late the measured feature vector with the underlying damage
state of the system. Feature vectors monitoring system damage
have been constructed based on the sensor output (Fig. 11). The
feature vector is an input into the PHM algorithms.
Previous researchers have investigated various PHM frame-
works for assessment of accrued damage and estimation
of RUL. Examples include model or physics of failure-
based methods [7]–[22], statistical trending [31], artificial
intelligence-based prognostics [62], and state estimator meth-
Fig. 10. Simulated change in resistance of solder ball during pull test. Arrows ods [54]–[56]. In this paper, a Bayesian framework has been
indicate expected change in resistance at a strain of 0.1.
used [57], [58], [64], [65] to allow statistically defendable
decisions to be made based on the RUL predictions using the
solder joint of 0.1 corresponded to failure. Model predictions PHM algorithm. The probability that a flaw (F) exists given
indicate a change in resistance of 5 × 10−5 Ω correlates with a positive indication (I) depends on sensor’s probability of
interconnect strain of 0.1 prior-to-failure of the interconnect. detection given that a flaw exists P (I|F ), probability of false
This critical resistance value derived from the FEM simulation alarm P (I| ∼ F ), and prior probability that the flaw exists
will be used as a threshold value to define failure for the PHM before any measurements are made P(F)
algorithm. Since the daisy chained resistance of a package P (I|F )P (F )
is monitored in this study the critical resistance calculated P (F |I) =
P (I)
from the FEM simulation must be scaled up from a single
solder ball to account for changes in resistance of the entire P (I|F )P (F )
= (1)
package. This was achieved by approximating that every inter- P (I|F )P (F ) + P (I| ∼ F )P (∼ F )
connect feels the same strain. Therefore, the critical resistance
is multiplied by the number of I/O in the package, i.e., 676 where the prefix “∼” is used to represent “not,” P (I| ∼ F ) is
for the PBGA 676 to obtain the overall critical resistance the probability of detection if when the flaw does not exist, and
value (676 × 5 × 10−5 Ω = 3.38 × 10−2 Ω). Assuming that P (∼ F ) is the probability of the nonexistence of a flaw.
every interconnect feels the same strain is not strictly correct The PHM algorithm used in this study requires four inputs
since failure most often occurs in the corner interconnects. from the user prior to operation (Fig. 12).
This implied averaging of strain across all interconnects is 1) Maximum allowable probability of failure.
justified since deflections were small for the vibration test. 2) Maximum tolerable probability of proactive maintenance.
Ultimately, errors from this approximation add uncertainty to 3) Required lead time to receive a replacement component.
the RUL calculation. As will be demonstrated later in the 4) Required confidence in the RUL predictions.
paper, this uncertainty must be managed to obtain meaningful The PHM algorithm outputs the RUL at every point that
results. a measurement is made, and the accompanying confidence
4306 IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, VOL. 59, NO. 11, NOVEMBER 2012
Fig. 13. Generalized shape of feature vector for prognosticating failure. Fig. 15. Prediction of failure at time = 0.7.
Fig. 14. Detection and failure thresholds for feature vector. Fig. 16. Maximum allowable probability of failure (red shaded region).
Mk = Φk Pk−1 ΦT
k + Qk (4)
−1
Kk = Mk H T (HMk H T + Rk ) (5)
Pk = (1 − Kk H)Mk (6)
Fig. 26. Alpha-Lambda performance of PHM Algorithm. Fig. 27. Probability density function for RUL prediction at lambda = 0.5.
Fig. 31. Variation in the sum of the beta calculation for variations in the
Fig. 30. Relative accuracy of RUL prediction. critical-threshold of state variable.
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[64] B. Saha and K. Goebel, “Uncertainty management for diagnostics and Ryan Lowe is a doctoral candidate in the mechan-
prognostics of batteries using Bayesian techniques,” in Proc. IEEE ical engineering Department at Auburn University,
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M. Schwabacher, “Metrics for evaluating performance of prognostic
techniques,” in Proc. Int. Conf. Progn. Health Manage., Denver, CO,
Oct. 2008b, pp. 1–17. Kai Goebel received the degree of Diplom-Ingenieur
from the TechnischeUniversität München, München,
Germany, in 1990. He received the M.S. and
Ph.D. degrees from the University of California at
Pradeep Lall (M’93–SM’08–F’12) received the
Berkeley, in 1993 and 1996, respectively.
B.E. degree in mechanical engineering from the He worked at General Electric’s Corporate Re-
Delhi College of Engineering, Delhi, India, in 1988,
search Center in Niskayuna, NY, from 1997 to 2006
the M.S. and Ph.D. degrees in mechanical engi-
as a senior research scientist. He has carried out
neering from the University of Maryland, College
applied research in the areas of artificial intelligence,
Park, in 1989 and 1993, respectively, and the M.B.A.
soft computing, and information fusion. His research
degree from Kellogg School of Management, North-
interest lies in advancing these techniques for real-
western University, Evanston, IL, in 2002.
time monitoring, diagnostics, and prognostics. He holds 11 patents and has
He is the Thomas Walter Professor with Depart- published more than 150 papers in the area of systems health management.
ment of Mechanical Engineering and Director of
He is a Senior Scientist at NASA Ames Research Center where he leads
the NSF Center for Advanced Vehicle and Extreme
the Diagnostics and Prognostics groups in the Intelligent Systems Division.
Environment Electronics at Auburn University, Auburn, AL. He has 10 years of
In addition, he directs the Prognostics Center of Excellence, and he is the
industry experience. He was previously with Motorola’s Wireless Technology Associate Principal Investigator for Prognostics of NASA’s Integrated Vehicle
Center. He has published extensively in the area of electronic packaging with
Health Management Program.
emphasis on modeling and predictive techniques. He is author and coauthor of
2 books, 13 book chapters, and over 270 journal and conference papers in the
field of electronic packaging with emphasis on design, modeling and predictive
techniques.
Dr. Lall is a Fellow of the IEEE (2012) and a Fellow of the ASME (2008).
He is a member of the National Academies Committee on Electronic Vehicle
Controls and Unintended Acceleration. Dr. Lall is a member of the Beta
Gamma Sigma honorary Society. He is recipient of the Samuel Ginn College of
Engineering Senior Faculty Research Award and three-Motorola Outstanding
Innovation Awards. He has received five Motorola Engineering Awards and four
Publication Awards. He holds three U.S. Patents. He is a Six-Sigma Black-Belt
in Statistics. He is the founding faculty advisor for the SMTA student chapter
at Auburn University and member of the editorial advisory board for SMTA
Journal. He is a member of the IEEE Reliability Society Advisory Committee.
He is the Vice-Chair of the ASME Congress Steering Committee. Dr. Lall is the
Associate Editor of the ASME Journal of Electronic Packaging, and theIEEE
T RANSACTIONS ON C OMPONENTS AND PACKAGING T ECHNOLOGIES.