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Small Signal - Transistors, Fets and Diodes Device Databook PDF
Small Signal - Transistors, Fets and Diodes Device Databook PDF
Plastic-Encapsulated
2
Transistors
GreenLine Portfolio
3
Devices
Small-Signal Field-Effect
Transistors and MOSFETs
4
Small-Signal Tuning
5
and Switching Diodes
Surface Mount 7
Information
Package Outline
Dimensions
8
Reliability and
9
Quality Assurance
Replacement
10
Devices
Alphanumeric Index 11
This publication presents technical information for the several product families that comprise the Motorola
small–signal semiconductor line. The families include bipolar transistors, field–effect transistors, and diodes. These
are available in a variety of through hole and surface mount packages. Complete device specifications and typical
performance curves are given on individual data sheets, which are grouped by the various families.
A quick comparison of performance characteristics is presented in the easy–to–use selector guide in the first
section. The tables will assist in the selection of the proper device for a specific application.
Seperate sections are included to describe package outline drawings and footprints and product reliability and
quality considerations.
The information in this book has been carefully checked and is believed to be accurate; however, no responsibility
is assumed for inaccuracies. Furthermore, this information does not convey to the purchaser of semiconductor
devices any license under the patent rights to the manufacturer.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no
warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does
Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims
any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may
be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the
rights of others. Motorola products are not designed, intended, or authorized for use as components in systems
intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other
application in which the failure of the Motorola product could create a situation where personal injury or death may
occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer
shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges
that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered
trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
A Preferred device is a device which is recommended as a first choice for future use. These devices are ”preferred”
by virtue of their performance, price functionality, or combination of attributes which offer the overall ”best” value to
the customer. This category contains both advanced and mature devices which will remain available for the
foreseeable future (generally 3 to 5 years).
Device types identified as ”current” are not a first choice product for new designs, but will continue to be available
because of the popularity and/or standardization or volume usage in current production designs. These products can
be acceptable for new designs but the preferred types are considered better alternatives for long term usage.
Any device that has not been identified as a ”preferred device” is a ”current” device.
Products designated as ”Not Recommended for New Design” may become obsolete as dictated by poor market
acceptance, or a technology or package that is reaching the end of its life cycle. Devices in this category have an
uncertain future and do not represent a good selection for new device designs or long term usage.
All ”Not Recommended for New Design” devices have been removed from the data book. In the event the
device you need is no longer found within an appropriate section of the data book, refer to the Replacement
Devices index at the back of the book to see if there is a Replacement Part for the device in question.
In Brief . . .
This selector guide highlights semiconductors that are the
most popular and have a history of high usage for the most
applications.
A large selection of encapsulated plastic transistors, FETs
and diodes are available for surface mount and insertion
assembly technology. Plastic packages include TO-92
(TO–226AA), 1-Watt TO-92 (TO–226AE), SOT-23,
SC-70/SOT-323, SC–90/SOT–416, SC-59, SOD-123,
SOT–223, SOT–363, and TSOP–6. Plastic multiples are
available in 14–pin and 16–pin dual–in–line packages for
insertion applications: SO–14 and SO–16 for surface mount
applications.
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–1
Bipolar Transistors
CASE 29–05
TO–226AE
Plastic–Encapsulated 1 1–WATT (TO–92)
23
Transistors
Motorola’s Small Signal TO–226 plastic transistors
encompass hundreds of devices with a wide variety of
characteristics for general–purpose, amplifier and switching CASE 29–04
applications. The popular high–volume package combines TO–226AA
proven reliability, performance, economy and convenience to 1 (TO–92)
23
provide the perfect solution for industrial and consumer design
problems. All devices are laser marked for ease of
identification and shipped in antistatic containers, as part of
Motorola’s ongoing practice of maintaining the highest
standards of quality and reliability.
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–2
Plastic–Encapsulated Transistors (continued)
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–3
Plastic–Encapsulated Transistors (continued)
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–4
Plastic–Encapsulated Transistors (continued)
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–5
Plastic–Encapsulated Transistors (continued)
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–6
Plastic–Encapsulated Transistors (continued)
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–7
Plastic–Encapsulated
Multiple Transistors
The manufacturing trend has been toward printed circuit
board design with requirements for smaller packages with 14
more functions. In the case of discrete components the use 1
of the multiple device package helps to reduce board space CASE 646–06
requirements and assembly costs. (TO–116)
Many of the most popular devices are offered in the stan- STYLE 1
dard plastic DIP and surface mount IC packages. This in-
cludes small–signal NPN and PNP bipolar transistors,
N–channel and P–channel FETs, as well as diode arrays. 16
1
CASE 751B–05
SO–16
STYLE 4
Specification Tables
The following short form specifications include Quad and Dual transistors listed in alphanumeric order. Some columns
denote two different types of data indicated by either bold or italic typeface. See key and headings for proper identification.
This applies to Table 10 and 11 of this section only.
KEY
Ref. Point hFE1 ∆VBE Gp NF @ f
Subscript Unit mV dB dB
PD hFE2 Max Min Max
Watts VCE @
One IC fT Cob & IC
ton toff (sat) IC
Die VCE Amp hFE @ IC MHz pF ns ns Volts Unit
TYPE NO. ID Only Volts Max Min Min Max Max Max Max IB
Alphanumeric listing Common–emitter Gp — Power Gain
type numbers DC Current Gain. NF — Noise Figure
f — Test Frequency
Identification Code Units for test Current: AUD — 10–15 kHz
A — ampere Frequency Units:
First Letter: Polarity m — mA H — Hertz M — MHz
C — both types in multiple device u — µA K — kHz G — GHz
N — NPN
P — PNP VCE(sat) — Collector–Emitter
Second Letter: Use Saturation Voltage
A — General Purpose Amplifier Current–Gain–Bandwidth IC — Test Current
E — Low Noise Audio Amplifier Product Current Units: u — µA
F — Low Noise RF Amplifier m — mA
G — General Purpose Amplifier A — Amp
and Switch
H — Tuned RF/IF Amplifier hFE1/hFE2 — Current Gain Ratio
M — Differential Amplifier Continuous (DC) Collector Current VBE — Differential Base Voltage |VBE1 — VBE2|.
S — High Speed Switch Differential Amplifiers
D — Darlington ton — turn–on time
toff — turn–off time
Rated Minimum Collector–Emitter Voltage
Power Dissipation specified at 25°C. Single Subscript letter identifies base termination
die rating. listed below in order of preference. Output Capacitance, common–base. Shown without distinction:
Ref. Point: A — Ambient Temperature SUBSCRIPT: Ccb — Collector–Base Capacitance
C — Case Temperature 0 — VCEO, open Cre — Common–Emitter Reverse Transfer Capacitance
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–8
Plastic–Encapsulated Multiple Transistors (continued)
hFE1 ∆VBE Gp NF @ f
mV dB dB
PD hFE2 Max Min Max
Watts VCE Typ(1)
One IC fT Cob ton toff (sat) @ IC
Die VCEO Amp hFE @ IC MHz pF ns ns Volts IC
Device ID Only Volts Max Min Min Max Max Max Max IB
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–9
Plastic–Encapsulated 3 3 4
1 1
2 2
2 3 1
CASE 419–02 CASE 419B–01 CASE 463–01
SC–70/SOT–323 SOT–363 SOT–416/SC–90
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–10
Plastic–Encapsulated Surface Mount Transistors (continued)
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–11
C
(OUT)
B R1
Plastic–Encapsulated Surface Mount Transistors (continued) (IN)
R2
E
Table 12. Plastic–Encapsulated Surface Mount General–Purpose Transistors (continued) (GND)
Pinout: 1–Base, 2–Emitter, 3–Collector
Devices are listed in order of descending breakdown voltage.
hFE @ IC fT
Device Marking V(BR)CEO Min Max mA MHz Min
These devices include bias resistors on the semiconductor chip with the transistor. See the BRT diagram for orientation
of resistors.
Device Marking V(BR)CEO hFE@ IC IC
Volts mA R1 R2
NPN PNP NPN PNP (Min) Min mA Max Ohm Ohm
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–12
Plastic–Encapsulated Surface Mount Transistors (continued)
Table 13. Plastic–Encapsulated Surface Mount Bias Resistor Transistors
for General Purpose Applications (continued)
hFE @ IC IC
mA R1 R2
Device Marking V(BR)CEO Min mA Max Ohm Ohm
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–13
Plastic–Encapsulated Surface Mount Transistors (continued)
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–14
Plastic–Encapsulated Surface Mount Transistors (continued)
VCE(sat) hFE @ IC
Device Marking V(BR)CES Volts Max Min Max mA
Case 318–08 — TO–236AB (SOT–23) — NPN
MMBTA14LT1 1N 30 1.5 20K — 100
MMBTA13LT1 1M 30 1.5 10K — 100
Case 318–08 — TO–236AB (SOT–23) — PNP
MMBTA64LT1 2V 30 1.5 20K — 100
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–15
Plastic–Encapsulated Surface Mount Transistors (continued)
The following devices are designed to conserve energy. They offer ultra–low collector saturation voltage.
Case 318–08 — TO–236AB (SOT–23) — PNP
MMBT1010LT1 GLP 15 0.1 1.1 300 600 100
Case 318–03 — SC–59 — PNP
MSD1010T1 GLP 15 0.1 1.1 300 600 100
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–16
Plastic–Encapsulated Surface Mount Transistors (continued)
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–17
Field–Effect Transistors
JFETs
JFETs operate in the depletion mode. They are available in
both P– and N–channel and are offered in both Through–hole CASE 29–04
and Surface Mount packages. Applications include general– TO–226AA
1 (TO–92)
purpose amplifiers, switches and choppers, and RF amplifiers 23
and mixers. These devices are economical and very
rugged. The drain and source are interchangeable on many
typical FETs.
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–18
JFETs (continued)
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–19
CASE 29–05
TMOS FETs TO–226AE
1–WATT (TO–92)
1
2
3
D CASE 29–04
TO–226AA
(TO–92) 1
2 3
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–20
Surface Mount FETs 3
CASE 318–08
This section contains the FET plastic packages available for TO–236AB
1 SOT–23
surface mount applications. Most of these devices are the CASE 419–02
2 SC–70/SOT–323
most popular metal–can and insertion type parts carried over 6
to the new surface mount packages. 5
4
4
1
2
3 1
CASE 419B–01 CASE 318E–04 2
3
SOT–363 SOT–223
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–21
Surface Mount FETs (continued)
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–22
Tuning and Switching Diodes
CASE 29–04 1 3
Tuning Diodes — TO–226AA
(TO–92)
Abrupt Junction 1 2
2
STYLE 15
23
Motorola supplies voltage–variable capacitance diodes serving
CASE 51–02
the entire range of frequencies from HF through UHF. Used in RF 1 2
DO–204AA
receivers and transmitters, they have a variety of applications, (DO–7) STYLE 1
including:
• Phase–locked loop tuning systems
• Local oscillator tuning
1 CASE 182–02
• Tuned RF preselectors 2 1
TO–226AC
• RF filters (TO–92)
Cathode Anode
• RF phase shifters STYLE 1
1
• RF amplifiers
2
• Automatic frequency control
• Video filters and delay lines
3
• Harmonic generators CASE 318–08
TO–236AB 3 1
• FM modulators Cathode Anode
1 SOT–23
Two families of devices are available: Abrupt Junction and Hyper 2 STYLE 8
Abrupt Junction. The Abrupt Junction family includes devices
suitable for virtually all tuned–circuit and narrow–range tuning
applications throughout the spectrum. 3
1 2
2
1 STYLE 9
CASE 463–01 3
Typical Characteristics SOT–416/SC–90
Diode Capacitance versus Reverse Voltage
100 1000
70 1N5456A
C T , DIODE CAPACITANCE (pF)
50 MV1650
MV1638
1N5148
30
100
20
(See Tables 34
Thru 36)
10
7 10
5 TA = 25°C MV1628
f = 1 MHz
3
2 1
0.6 1 2 4 6 10 20 40 60 0.1 1 10 100
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
1000 100
MV2109
C T , DIODE CAPACITANCE (pF)
MV2115 70
MMBV2109LT1
100
40
MMBV432LT1
MV104
10 20
TA = 25°C
MV2101 MV2105
f = 1 MHz
MMBV2101LT1 MMBV2105LT1
EACH DIODE
1 10
0.1 1 10 100 0.3 0.5 1 2 3 5 10 20 30
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
(See Tables 37 and 38) (See Table 39)
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–23
Tuning Diodes — Abrupt Junction (continued)
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–24
Tuning Diodes — Abrupt Junction (continued)
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–25
Tuning Diodes —
2
Hyper–Abrupt Junction
CASE 51–02 1 2
DO–204AA Cathode Anode
The Hyper–Abrupt family exhibits higher capacitance, and a
(DO–7) STYLE 1
much larger capacitance ratio. It is particularly well suited for
wider–range applications such as AM/FM radio and TV tuning.
CASE 182–02 2 1
TO–226AC Anode Cathode
(TO–92) STYLE 1
1
2
3
CASE 318–08 3 1
TO–236AB Cathode Anode
1 SOT–23 STYLE 8
2
4
CASE 318E–04 1 2, 4
1
2 SOT–223
3 STYLE 2
Typical Characteristics
Diode Capacitance versus Reverse Voltage
20 40
18 36
C T , DIODE CAPACITANCE (pF)
16 32
C T , CAPACITANCE (pF)
14 MMBV105GLT1 28 MMBV109LT1
12 24 MV209
10 20
8 TA = 25°C 16
6 f = 1 MHz 12
4 8
2 4
0 0
0.3 0.5 1 2 3 5 10 20 30 1 3 10 30 100
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–26
Tuning Diodes — Hyper–Abrupt Junction (continued)
40 10
9
C T , DIODE CAPACITANCE (pF)
40 50
36
C T , DIODE CAPACITANCE (pF)
MV7005T1
1000
500
500 300 TA = 25°C
C T , DIODE CAPACITANCE (pF)
f = 1 MHz
200
C T , CAPACITANCE (pF)
100
100 MV1405
50
50 30
MV1403
20
10 MV1404
10 MV7404T1
1 3 5 7 9 1 2 3 4 5 6 7 8 9 10
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance versus Reverse Voltage Figure 8. Diode Capacitance versus Reverse Voltage
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–27
Tuning Diodes — Hyper–Abrupt Junction (continued)
Table 42. Hyper–Abrupt High Capacitance Voltage Variable Diode — Surface Mount
The following are high capacitance voltage variable diodes intended for low frequency applications and circuits requiring
large tuning capacitance.
CT @ f = 1.0 MHz
CV
V(BR)R IR Min Max Cap Ratio Q Curve
Device Volts nA pF pF Min Min Style Figure
Table 43. Hyper–Abrupt High Capacitance Tuning Diodes — Axial Lead Glass Package
CT @ VR
Cap Ratio Q CV
pF pF C2/C10 2.0 V, 1.0 MHz V(BR)R Curve
Device Min Max Volts Min Min Volts Style Figure
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–28
Schottky Diodes CASE 182–02
CASE 425–04
TO–226AC
SOD–123
Schottky diodes are ideal for VHF and UHF mixer and detector (TO–92)
STYLE 1
applications as well as many higher frequency applications. 1 STYLE 1
They provide stable electrical characteristics by eliminating 2 1 2
2 1 Cathode Anode
the point–contact diode presently used in many applications. Cathode Anode
3
CASE 318–08
TO–236AB
1 SOT–23
2
STYLE 8 STYLE 9 STYLE 11
1 3 1 21 2
Single
Series
3 3
Common Cathode
STYLE 12 STYLE 19
Cathode
1 2
Anode 1
3 Series
2 3
Cathode
Typical Characteristics
Capacitance versus Reverse Voltage
1 2.8
C T , CAPACITANCE (pF)
MMBD352LT1*
MMBD353LT1*
MMBD354LT1* 1.6 MBD301,
MMBD301LT1
0.8
1.2
0.8
0.7
0.4 MBD701, MMBD701LT1
0.6 0
0 1 2 3 4 0 5 10 15 20 25 30 35 40 45 50
VR, REVERSE VOLTAGE (VOLTS) * EACH DIODE VR, REVERSE VOLTAGE (VOLTS)
(See Table 44)
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–29
Schottky Diodes (continued)
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–30
Switching
Diodes
Small–signal switching diodes are intended for low current CASE 29–04 CASE 182–02
TO–226AA TO–226AC
switching and steering applications. Hot–Carrier, PIN and 1
1 (TO–92) (TO–92)
general–purpose diodes allow a wide selection for specific 2
3 2
application requirements.
STYLE 3
Typical Characteristics 1 2
Capacitance versus Reverse Voltage STYLE 1
3 2 1
10 Cathode Anode
STYLE 4
TA = 25°C
f = 1 MHz 1 2
C T , DIODE CAPACITANCE (pF)
2 3
MPN3404 3
CASE 318–08
1 TO–236AB
1
0.5 SOT–23
MMBV3401LT1 MPN3700 2
0.3
20 V MAX VR MMBV3700LT1
0.2 STYLE 8 STYLE 12
0
0 12 18 24 30 36 42 48 54 1 3 1 2
VR, REVERSE VOLTAGE (VOLTS) SINGLE
(See Table 45) 3
COMMON ANODE
STYLE 11 STYLE 19
ANODE CATHODE 1 2 1 2
3 3 3
3 3
2 SERIES SERIES
1
CASE 463–01
SOT–416/SC–90
3
1 2 1 2 CASE 318D–04
CATHODE ANODE SC–59 2
STYLE 4 STYLE 5 1
STYLE 2 STYLE 4
STYLE 2 3
CASE 419–02 2 3 2 3
1 3 SC–70/SOT–323 SINGLE SINGLE
1
SINGLE 2
STYLE 5 STYLE 4 STYLE 3 STYLE 5
1 2 1 2 1 2 1 2
3 3 3 3
COMMON CATHODE COMMON ANODE COMMON CATHODE COMMON ANODE
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–31
Switching Diodes (continued)
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–32
Switching Diodes (continued)
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–33
Switching Diodes (continued)
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–34
Multiple
Switching Diodes
Multiple diode configurations utilize monolithic structures fabricated by the planar process. They are designed to satisfy fast
switching requirements as in core driver and encoding/decoding applications where their monolithic configurations offer lower cost,
higher reliability and space savings.
14 16
1 1
1 4 7
11 3 8 Diode 14
7 6 5 4 3 2 1
Dual 10 Array Isolated
8 9 10 13 14 1 4 5 6 7 2 3 5 7 8 9 11 12
Diode (Common 7 Diode
Array NC Pin 1, 4, 6, 10, 13 Array 8 9 10 11 12 13 14
12 2 Anode)
2 5
1 1 8
16 Dual 8
Diode 2 3 5 7 8 9 11 12 Diode 2 3 11 12 4 5 9 10
Array Array
14 14 7
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–35
3
3 4
1 2 1
2
2 1 3
Plastic–Encapsulated 6
5
4
3
3 2
Energy. It’s something Motorola is putting a lot of energy 1
CASE 318G–02 CASE 419–02 CASE 425–04
into helping save. That’s why we’re introducing our Green- TSOP–6 SC–70/SOT–323 SOD–123
Line portfolio of devices, featuring energy–conserving traits
superior to those of our existing line of standard parts for the
same usage. GreenLine devices can actually help reduce • Small Signal HDTMOS: These devices provide our
the power demands of your products. lowest ever drain–source resistance versus package size.
Lower rDS(on) means less wasted energy through dissipation
Wide Range of Applications loss, making them especially effective for low–current
Currently, our portfolio consists of three families. applications where energy conservation is crucial, such as low
current switchmode power supplies, uninterruptable power
• Low–Leakage Switching Diodes: With reverse leakage supplies (UPS), power management systems, and bias
specifications guaranteed to 500 pA, they help extend battery switching. This makes them ideal for portable computer–type
life, making them ideal for small battery–operated systems in products or any system where the combination of power
which standby power is essential. Applications include ESD management and energy conservation is key.
protection, reverse voltage protection, and steering logic.
Save Energy — Save Money
• Bipolar Output Driver Transistors: Offering ultra–low In an increasingly power–hungry world, Motorola’s Green-
collector saturation voltage, they deliver more energy to the Line portfolio makes powerful sense. So much sense that we
intended load with less power wasted through dissipation loss. plan to continue adding devices to the portfolio. Chances
They are especially effective in today’s lower voltage are, there are Motorola GreenLine devices applicable to one
battery–powered applications, and prolong battery life in or more of your products — ones that can help save energy,
portable and hand–held communications and personal digital dollars — and the environment.
equipment.
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–36
GreenLine (continued)
Motorola Small–Signal Transistors, FETs and Diodes Device Data Selector Guide
1–37
Small Signal 6 3
5
Multi–integrated Devices 4
1 1
2 2
3
CASE 419B–01 CASE 318–08
SOT–363 SOT–23
R1 Vin 1.0 k
6.8 V
Q1 (1)
33 k
R2
GND (2)
R3 Vref (6)
MDC3105LT1
Q2 Iout (1)
VENBL
(5) R4
R5
Q4
R6
Selector Guide Motorola Small–Signal Transistors, FETs and Diodes Device Data
1–38
Section 2
Plastic-Encapsulated
Transistors
In Brief . . .
Motorola’s plastic transistors and diodes encompass
hundreds of devices spanning the gamut from
general-purpose amplifiers and switches with a wide variety
of characteristics to dedicated special-purpose devices for
the most demanding applications. The popular TO-92,
1-Watt TO-92 and TO-116 combine proven reliability CASE 29-04 CASE 29-05
performance and economy for through-the-hole 1 (TO-226AA) 1 (TO-226AE)
manufacturing, while the SOT-23, SC-59, SC-70/SOT-323, 2 TO-92 2 1 WATT TO-92
3 3
SC–90/SOT–416, SOT-223, and SO-16 offer the same
solutions for surface mount manufacturing.
As an additional service to our customers Motorola will, 3
upon request, supply many of these devices in tape and reel 3 4
for automatic insertion. 1
2 1
Contact your Motorola representative for ordering informa- 2 1
2
3
tion.
CASE 318-08 CASE 318D-04 CASE 318E-04
This section contains both single and multiple plastic-
(TO-236AB) SC-59 (TO-261AA)
encapsulated transistors. SOT-23 SOT-223
NOTE: All SOT-23 package devices have had a “T1” suffix
NOTE: added to the device title. 3 3
1 2
1
2
CASE 419-02 CASE 463-01
SC-70/SOT-323 SC-90/SOT-416
16
14
1
1
Not to Scale
*Refer to Section 6 on Packaging for Style code characters and additional information on ordering
*requirements.
ABC D
The “D” represents a smaller alpha digit Date Code. The Date Code indicates the actual month in which the
part was manufactured.
COLLECTOR
3
2
BASE
1
EMITTER 1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 40 Vdc
Collector – Base Voltage VCBO 60 Vdc
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 200 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS(1)
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage (2) V(BR)CEO 40 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 60 — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 10 mAdc, IC = 0)
Base Cutoff Current IBL — 50 nAdc
(VCE = 30 Vdc, VEB = 3.0 Vdc)
Collector Cutoff Current ICEX — 50 nAdc
(VCE = 30 Vdc, VEB = 3.0 Vdc)
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
SWITCHING CHARACTERISTICS
Delay Time ((VCC = 3.0 Vdc, VBE = 0.5 Vdc, td — 35 ns
Rise Time IC = 10 mAdc, IB1 = 1.0 mAdc) tr — 35 ns
Storage Time (VCC = 3.0 Vdc, IC = 10 mAdc, 2N3903 ts — 175 ns
IB1 = IB2 = 1.0 mAdc) 2N3904 — 200
Fall Time tf — 50 ns
10 k 10 k
0
– 0.5 V
< 1 ns CS < 4 pF* 1N916 CS < 4 pF*
– 9.1 V′
< 1 ns
Figure 1. Delay and Rise Time Figure 2. Storage and Fall Time
Equivalent Test Circuit Equivalent Test Circuit
TJ = 25°C
TJ = 125°C
10 5000
VCC = 40 V
3000
7.0 IC/IB = 10
2000
CAPACITANCE (pF)
5.0
Q, CHARGE (pC)
1000
700
Cibo
3.0 500
300 QT
2.0 Cobo 200
QA
100
70
1.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
100 100
50 50
30 30
40 V
20 20
15 V
10 10
7 td @ VOB = 0 V 2.0 V 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 5. Turn – On Time Figure 6. Rise Time
500 500
t′s = ts – 1/8 tf VCC = 40 V
300 IB1 = IB2 300
IC/IB = 20 IC/IB = 10 IB1 = IB2
200 200
IC/IB = 20
t s′ , STORAGE TIME (ns)
10 10
7 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
12 14
SOURCE RESISTANCE = 200 W f = 1.0 kHz IC = 1.0 mA
IC = 1.0 mA 12
10
NF, NOISE FIGURE (dB)
300 100
200
h fe , CURRENT GAIN
20
10
100
70 5
50
2
30 1
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
20 10
10
5.0
5.0
3.0
2.0 2.0
1.0
1.0
0.5
0.7
0.2 0.5
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0
h FE, DC CURRENT GAIN (NORMALIZED)
1.0 +25°C
0.7
0.5 – 55°C
0.3
0.2
0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
0.6
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)
1.2 1.0
TJ = 25°C
1.0 VBE(sat) @ IC/IB =10 0.5 +25°C TO +125°C
qVC FOR VCE(sat)
COEFFICIENT (mV/ °C)
V, VOLTAGE (VOLTS)
0 – 2.0
1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2
BASE
1
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol Value Unit
CASE 29–04, STYLE 1
Collector – Emitter Voltage VCEO 40 Vdc TO–92 (TO–226AA)
Collector – Base Voltage VCBO 40 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 200 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Power Dissipation @ TA = 60°C PD 250 mW
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS(1)
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage (2) V(BR)CEO 40 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 40 — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — Vdc
(IE = 10 mAdc, IC = 0)
Base Cutoff Current IBL — 50 nAdc
(VCE = 30 Vdc, VEB = 3.0 Vdc)
Collector Cutoff Current ICEX — 50 nAdc
(VCE = 30 Vdc, VEB = 3.0 Vdc)
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
SWITCHING CHARACTERISTICS
Delay Time ((VCC = 3.0 Vdc, VBE = 0.5 Vdc, td — 35 ns
Rise Time IC = 10 mAdc, IB1 = 1.0 mAdc) tr — 35 ns
Storage Time 2N3905 ts — 200 ns
2N3906 — 225
3 0 Vdc,
(VCC = 3.0 Vdc IC = 10 mAdc
mAdc,
Fall Time IB1 = IB2 = 1.0 mAd 2N3905 tf — 60 ns
2N3906 — 75
275 275
< 1 ns
+0.5 V 10 k 10 k
0
CS < 4 pF* 1N916 CS < 4 pF*
10.6 V
300 ns 10 < t1 < 500 ms
DUTY CYCLE = 2% t1 10.9 V
DUTY CYCLE = 2%
Figure 1. Delay and Rise Time Figure 2. Storage and Fall Time
Equivalent Test Circuit Equivalent Test Circuit
TJ = 25°C
TJ = 125°C
10 5000
VCC = 40 V
3000
7.0 IC/IB = 10
2000
CAPACITANCE (pF)
5.0 Cobo
Q, CHARGE (pC)
1000
700
Cibo
3.0 500
300
2.0 200 QT
QA
100
70
1.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS (VOLTS) IC, COLLECTOR CURRENT (mA)
500 500
IC/IB = 10 VCC = 40 V
300 300
IB1 = IB2
200 200
IC/IB = 20
t f , FALL TIME (ns)
100 100
70 70
TIME (ns)
50 tr @ VCC = 3.0 V 50
30 15 V 30
20 20 IC/IB = 10
40 V
10 2.0 V 10
7 td @ VOB = 0 V 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
5.0 12
SOURCE RESISTANCE = 200 W f = 1.0 kHz IC = 1.0 mA
IC = 1.0 mA
10
4.0
SOURCE RESISTANCE = 200 W IC = 0.5 mA
NF, NOISE FIGURE (dB)
0 0
0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100
f, FREQUENCY (kHz) Rg, SOURCE RESISTANCE (k OHMS)
Figure 7. Figure 8.
h PARAMETERS
(VCE = – 10 Vdc, f = 1.0 kHz, TA = 25°C)
300 100
hoe, OUTPUT ADMITTANCE (m mhos)
70
50
h fe , DC CURRENT GAIN
200
30
100 20
70
10
50
7
30 5
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
20 10
h re , VOLTAGE FEEDBACK RATIO (X 10 –4 )
7.0
h ie , INPUT IMPEDANCE (k OHMS)
10
7.0 5.0
5.0
3.0 3.0
2.0 2.0
1.0
0.7
1.0
0.5
0.7
0.3
0.2 0.5
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0
h FE, DC CURRENT GAIN (NORMALIZED)
TJ = +125°C VCE = 1.0 V
1.0 +25°C
0.7
– 55°C
0.5
0.3
0.2
0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
1.0
TJ = 25°C
0.8
IC = 1.0 mA 10 mA 30 mA 100 mA
0.6
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)
1.0 1.0
q V , TEMPERATURE COEFFICIENTS (mV/ °C)
0
0.6 – 55°C TO +25°C
– 0.5
0.4 +25°C TO +125°C
– 1.0
VCE(sat) @ IC/IB = 10 – 55°C TO +25°C
0.2 qVB FOR VBE(sat)
– 1.5
0 – 2.0
1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2
BASE
1
EMITTER 1
2
3
MAXIMUM RATINGS
Rating Symbol 2N4123 2N4124 Unit CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 30 25 Vdc
Collector – Base Voltage VCBO 40 30 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 200 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 1.0 mAdc, IE = 0) 2N4123 30 —
2N4124 25 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 10 mAdc, IE = 0) 2N4123 40 —
2N4124 30 —
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — 50 nAdc
(VCB = 20 Vdc, IE = 0)
ON CHARACTERISTICS
DC Current Gain(1) hFE —
(IC = 2.0 mAdc, VCE = 1.0 Vdc) 2N4123 50 150
2N4124 120 360
10 200
7.0
100 ts
5.0 70
CAPACITANCE (pF)
50 td
TIME (ns)
Cibo
3.0 30 tf tr
20
2.0 Cobo
VCC = 3 V
10.0 IC/IB = 10
7.0 VEB(off) = 0.5 V
1.0 5.0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
h PARAMETERS
(VCE = 10 V, f = 1 kHz, TA = 25°C)
300 100
hoe, OUTPUT ADMITTANCE (m mhos)
50
200
hfe , CURRENT GAIN
20
100 10
70 5
50
2
30 1
0.1 0.2 0.5 1.0 2.0 5.0 10 0.1 0.2 0.5 1.0 2.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
20 10
h re , VOLTAGE FEEDBACK RATIO (X 10 –4 )
7.0
10
hie , INPUT IMPEDANCE (kΩ )
5.0
5.0
3.0
2.0 2.0
1.0
1.0
0.5
0.7
0.2 0.5
0.1 0.2 0.5 1.0 2.0 5.0 10 0.1 0.2 0.5 1.0 2.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0
TJ = +125°C
h FE, DC CURRENT GAIN (NORMALIZED)
VCE = 1 V
1.0 +25°C
0.7
0.5 – 55°C
0.3
0.2
0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
1.0
TJ = 25°C
0.8
IC = 1 mA 10 mA 30 mA 100 mA
0.6
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)
1.2 1.0
θV, TEMPERATURE COEFFICIENTS (mV/°C)
TJ = 25°C
1.0 VBE(sat) @ IC/IB = 10 0.5 +25°C to +125°C
qVC for VCE(sat)
V, VOLTAGE (VOLTS)
0.8 0
– 55°C to +25°C
VBE @ VCE = 1 V
0.6 – 0.5
– 55°C to +25°C
0.4 – 1.0
VCE(sat) @ IC/IB = 10 +25°C to +125°C
0.2 – 1.5 qVB for VBE(sat)
0 – 2.0
1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Amplifier Transistor
PNP Silicon
2N4125
COLLECTOR
3
2
BASE
1
EMITTER 1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 30 Vdc
Collector – Base Voltage VCBO 30 Vdc
Emitter – Base Voltage VEBO 4.0 Vdc
Collector Current — Continuous IC 200 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 30 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 30 — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 4.0 — Vdc
(IE = 10 mAdc, IC = 0)
REV 2
ON CHARACTERISTICS
DC Current Gain(1) hFE —
(IC = 2.0 mAdc, VCE = 1.0 Vdc) 50 150
(IC = 50 mAdc, VCE = 1.0 Vdc) 25 —
Collector – Emitter Saturation Voltage(1) VCE(sat) Vdc
(IC = 50 mAdc, IB = 5.0 mAdc) — 0.4
Base – Emitter Saturation Voltage(1) VBE(sat) Vdc
(IC = 50 mAdc, IB = 5.0 mAdc) — 0.95
10 200
7.0 ts
100
5.0 Cobo 70 td
CAPACITANCE (pF)
50 tr
TIME (ns)
Cibo
3.0 30 tf
20
2.0
10.0 VCC = 3.0 V
IC/IB = 10
7.0 VBE(off) = 0.5 V
1.0 5.0
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 1.0 2.0 3.0 5.0 10 20 30 50 100 200
REVERSE BIAS (VOLTS) IC, COLLECTOR CURRENT (mA)
0 0
0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100
f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (kΩ)
h PARAMETERS
VCE = 10 V, f = 1 kHz, TA = 25°C
300 100
70
hoe, OUTPUT ADMITTANCE (m mhos)
50
200
hfe , CURRENT GAIN
30
100 20
70
10
50
7.0
30 5.0
0.1 0.2 0.5 1.0 2.0 5.0 10 0.1 0.2 0.5 1.0 2.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
20 10
h re , VOLTAGE FEEDBACK RATIO (X 10 –4 )
10 7.0
5.0
h ie , INPUT IMPEDANCE (k Ω)
5.0
3.0
2.0
2.0
1.0
1.0
0.5
0.7
0.2 0.5
0.1 0.2 0.5 1.0 2.0 5.0 10 0.1 0.2 0.5 1.0 2.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0
TJ = +125°C
h FE, DC CURRENT GAIN (NORMALIZED)
VCE = 1 V
1.0 +25°C
0.7
– 55°C
0.5
0.3
0.2
0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
1.0
TJ = 25°C
0.8
IC = 1 mA 10 mA 30 mA 100 mA
0.6
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)
1.0 1.0
θV, TEMPERATURE COEFFICIENTS (mV/°C)
0.5
0.8 qVC for VCE(sat) +25°C to +125°C
VBE @ VCE = 1 V
V, VOLTAGE (VOLTS)
– 55°C to +25°C
0
0.6
–0.5
0.4 +25°C to +125°C
–1.0 qVS for VBE(sat)
– 55°C to +25°C
0.2 VCE(sat) @ IC/IB = 10
–1.5
0 –2.0
1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2
BASE
1
EMITTER 1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 15 Vdc
Collector – Base Voltage VCBO 30 Vdc
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 200 mAdc
Total Device Dissipation @ TA = 25°C PD 350 mW
Derate above 25°C 2.8 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.0 Watts
Derate above 25°C 8.0 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
Thermal Resistance, Junction to Case RqJC 125 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) 15 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 10 mAdc, IE = 0) 30 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 mAdc, IC = 0) 6.0 —
REV 2
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 1.0 mAdc, VCE = 1.0 Vdc) 25 —
(IC = 10 mAdc, VCE = 1.0 Vdc) 40 160
(IC = 10 mAdc, VCE = 1.0 Vdc, TA = – 55°C) 20 —
(IC = 30 mAdc, VCE = 1.0 Vdc) 40 —
(IC = 100 mAdc, VCE = 1.0 Vdc)(1) 30 —
(IC = 200 mAdc, VCE = 1.0 Vdc)(1) 20 —
SWITCHING CHARACTERISTICS
Delay Time ( CC = 10 Vdc, VEB(off) = 2.0 Vdc,
(V td — 8.0 ns
Rise Time IC = 100 mAdc, IB1 = 10 mAdc) (Fig. 1, Test Condition C) tr — 15 ns
Storage Time VCC = 10 Vdc, (IC = 10 mAdc, for ts) ts — 20 ns
(IC = 100 mA for tf)
Fall Time (IB1 = –10 mA) (IB2 = 10 mA) (Fig. 1, Test Condition C) tf — 15 ns
Test VCC
ton toff
Condition IC VCC RS RC CS(max) VBE(off) V1 V2 V3
t1 t1 RC
mA V Ω Ω pF V V V V V1 V3
RB
A 10 3 3300 270 4 –1.5 10.55 –4.15 10.70 0 0
VEB(off) V2 CS
B 10 10 560 960 4 — — –4.65 6.55 < 2 ns < 2 ns
C 100 10 560 96 12 –2.0 6.35 –4.65 6.55
PULSE WIDTH (t1) = 300 ns DUTY CYCLE = 2%
100
2N4264
70 VCE = 1 V
h FE, DC CURRENT GAIN
TJ = 125°C
50
25°C
30 –15°C
– 55°C
20
10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
270 Ω
3V
t1 8 pF C < COPT
+10 V C=0
∆V
0 CS < 4 pF C COPT
<1 ns 9.2 kΩ
PULSE WIDTH (t1) = 5 µs DUTY CYCLE = 2% TIME
NOTE 1
When a transistor is held in a conductive state by a base current, IB, If IB were suddenly removed, the transistor would continue to
a charge, QS, is developed or “stored” in the transistor. QS may be conduct until QS is removed from the active regions through an
written: QS = Q1 + QV + QX. external path or through internal recombination. Since the internal
Q1 is the charge required to develop the required collector current. recombination time is long compared to the ultimate capability of a
This charge is primarily a function of alpha cutoff frequency. QV is the transistor, a charge, QT, of opposite polarity, equal in magnitude, can
charge required to charge the collector–base feedback capacity. QX is be stored on an external capacitor, C, to neutralize the internal charge
excess charge resulting from overdrive, i.e., operation in saturation. and considerably reduce the turn–off time of the transistor. Figure 3
The charge required to turn a transistor “on” to the edge of saturation shows the test circuit and Figure 4 the turn–off waveform. Given QT
is the sum of Q1 and QV which is defined as the active region charge, from Figure 13, the external C for worst–case turn–off in any circuit is:
QA. QA = IB1tr when the transistor is driven by a constant current step C = QT/∆V, where ∆V is defined in Figure 3.
IC
(IB1) and IB1 < < .
hFE
1.0
2N4264
VCE, MAXIMUM COLLECTOR–EMITTER
TJ = 25°C
0.8
IC = 10 mA 50 mA 100 mA 200 mA
VOLTAGE (VOLTS)
0.6
0.4
0.2
0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50
IB, BASE CURRENT (mA)
1.2 1.0
0.6 – 0.5
(25°C to 125°C)
0.4 MAX VCE(sat) – 1.0
qVB for VBE
(– 55°C to 25°C)
0.2 – 1.5
0 – 2.0
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 0 40 80 120 160 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
200 200
VCC = 10 V IC/IB = 10
TJ = 25°C TJ = 25°C
100 100
TJ = 125°C
70 70
t d, DELAY TIME (ns)
VCC = 10 V
30 30
2V
20 20 VCC = 3 V
10 0V 10
7.0 7.0
5.0 5.0
1.0 2.0 5.0 10 20 50 100 200 1.0 2.0 5.0 10 20 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
50 200
TJ = 25°C VCC = 10 V
TJ = 125°C TJ = 25°C
IC/IB = 20 100 TJ = 125°C
30
t s , STORAGE TIME (ns)
IC/IB = 10 70
t f , FALL TIME (ns)
20 50
30 IC/IB = 20
20
10
IC/IB = 10
7.0 ts′ ^ ts – 1/8 tf 10
IB1 = IB2 7.0
5.0 5.0
1.0 2.0 5.0 10 20 50 100 200 1.0 2.0 5.0 10 20 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
10 1000
MAX 700 IC/IB = 10
TYP TJ = 25°C
500
7.0 Cibo TJ = 125°C
CAPACITANCE (pF)
300
Q, CHARGE (pC)
5.0 200
QT
100
VCC = 3 V
Cobo 70
3.0 50
VCC = 10 V QA
30 VCC = 3 V
2.0 20
0.1 0.2 0.5 1.0 2.0 5.0 10 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS (Vdc) IC, COLLECTOR CURRENT (mA)
COLLECTOR
3
2
BASE
1
EMITTER 1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 40 Vdc
Collector – Base Voltage VCBO 60 Vdc
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 600 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 40 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 60 — Vdc
(IC = 0.1 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 0.1 mAdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
ON CHARACTERISTICS(1)
DC Current Gain hFE —
(IC = 0.1 mAdc, VCE = 1.0 Vdc) 2N4401 20 —
SWITCHING CHARACTERISTICS
Delay Time ( CC = 30 Vdc, VBE = 2.0 Vdc,
(V td — 15 ns
Rise Time IC = 150 mAdc, IB1 = 15 mAdc) tr — 20 ns
Storage Time ( CC = 30 Vdc, IC = 150 mAdc,
(V ts — 225 ns
Fall Time IB1 = IB2 = 15 mAdc) tf — 30 ns
1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%.
+ 30 V + 30 V
1.0 to 100 µs, 1.0 to 100 µs, 200 Ω
200 Ω
+16 V DUTY CYCLE ≈ 2.0%
+16 V DUTY CYCLE ≈ 2.0%
0 0
1.0 kΩ –14 V 1.0 kΩ CS* < 10 pF
– 2.0 V CS* < 10 pF
< 2.0 ns < 20 ns
30 10
7.0
VCC = 30 V
20 5.0
IC/IB = 10
Cobo 3.0
CAPACITANCE (pF)
QT
Q, CHARGE (nC)
2.0
10
1.0
7.0
0.7
5.0 0.5
Ccb 0.3
3.0 0.2 QA
2.0 0.1
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 10 20 30 50 70 100 200 300 500
REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
100 100
70 IC/IB = 10 70 VCC = 30 V
tr IC/IB = 10
50 50
tr @ VCC = 30 V
30 30 tf
t, TIME (ns)
t, TIME (ns)
tr @ VCC = 10 V
td @ VEB = 2.0 V
20 td @ VEB = 0 20
10 10
7.0 7.0
5.0 5.0
10 20 30 50 70 100 200 300 500 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
300 100
ts′ = ts – 1/8 tf VCC = 30 V
70
IB1 = IB2 IB1 = IB2
200
IC/IB = 10 to 20 50 IC/IB = 20
t s′, STORAGE TIME (ns)
30
100
20 IC/IB = 10
70
50 10
7.0
30 5.0
10 20 30 50 70 100 200 300 500 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4.0 4.0
2.0 2.0
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (OHMS)
20 k 2N4400 UNIT 1
2N4400 UNIT 2
hfe , CURRENT GAIN
10 k
100
5.0 k
70
2N4401 UNIT 1
50
2N4401 UNIT 2 2.0 k
2N4400 UNIT 1
30 2N4400 UNIT 2 1.0 k
20 500
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
10 100
h re , VOLTAGE FEEDBACK RATIO (X 10 –4 )
7.0
hoe, OUTPUT ADMITTANCE (m mhos)
5.0 50
2N4401 UNIT 1
3.0 2N4401 UNIT 2
2N4400 UNIT 1 20
2.0 2N4400 UNIT 2
10
1.0
0.7 5.0
2N4401 UNIT 1
0.5 2N4401 UNIT 2
2.0 2N4400 UNIT 1
0.3 2N4400 UNIT 2
0.2 1.0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
3.0
VCE = 1.0 V
2.0 VCE = 10 V
h FE, NORMALIZED CURRENT GAIN
TJ = 125°C
1.0
25°C
0.7
0.5 – 55°C
0.3
0.2
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.0
TJ = 25°C
0.8
0.6
IC = 1.0 mA 10 mA 100 mA 500 mA
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50
IB, BASE CURRENT (mA)
1.0 + 0.5
TJ = 25°C
VBE(sat) @ IC/IB = 10
0.8 0 qVC for VCE(sat)
COEFFICIENT (mV/ °C)
VOLTAGE (VOLTS)
– 0.5
0.6 VBE @ VCE = 10 V
– 1.0
0.4
– 1.5
0 – 2.5
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
COLLECTOR
3
2
BASE
1
EMITTER 1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 40 Vdc
Collector – Base Voltage VCBO 40 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 600 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watt
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 40 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 40 — Vdc
(IC = 0.1 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — Vdc
(IE = 0.1 mAdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 0.1 mAdc, VCE = 1.0 Vdc) 2N4403 30 —
SWITCHING CHARACTERISTICS
Delay Time ( CC = 30 Vdc, VBE = + 2.0 Vdc,
(V td — 15 ns
Rise Time IC = 150 mAdc, IB1 = 15 mAdc) tr — 20 ns
Storage Time ( CC = 30 Vdc, IC = 150 mAdc,
(V ts — 225 ns
Fall Time IB1 = 15 mA, IB2 = 15 mA) tf — 30 ns
– 30 V – 30 V
200 Ω 200 Ω
< 2 ns < 20 ns
+2 V +14 V
0 0
1.0 kΩ 1.0 kΩ CS* < 10 pF
CS* < 10 pF
– 16 V –16 V
10 to 100 µs, 1.0 to 100 µs,
DUTY CYCLE = 2% DUTY CYCLE = 2% + 4.0 V
Scope rise time < 4.0 ns
*Total shunt capacitance of test jig connectors, and oscilloscope
30 10
7.0
VCC = 30 V
20 5.0
Ceb IC/IB = 10
3.0
CAPACITANCE (pF)
Q, CHARGE (nC)
2.0
10
1.0
7.0
0.7
Ccb
5.0 0.5
QT
0.3
QA
0.2
2.0 0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 10 20 30 50 70 100 200 300 500
REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
100 100
70 IC/IB = 10 70 VCC = 30 V
50 IC/IB = 10
50
tr @ VCC = 30 V
t r , RISE TIME (ns)
30 tr @ VCC = 10 V 30
t, TIME (ns)
td @ VBE(off) = 2 V
20 td @ VBE(off) = 0 20
10 10
7.0 7.0
5.0 5.0
10 20 30 50 70 100 200 300 500 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
200
IC/IB = 10
t s′, STORAGE TIME (ns)
100
IC/IB = 20
70
50
IB1 = IB2
ts′ = ts – 1/8 tf
30
20
10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1k 2k 5k 10 k 20 k 50 k
f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (OHMS)
300 10 k
200 5k
2N4403 UNIT 1 2k
100 2N4403 UNIT 2
1k
2N4402 UNIT 1
70 2N4402 UNIT 2 500
50
200
30 100
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
20 500
h re , VOLTAGE FEEDBACK RATIO (X 10 –4 )
10 2N4403 UNIT 1
2N4403 UNIT 2
5.0 100
2N4402 UNIT 1
2N4402 UNIT 2 50
2.0
20
1.0
10
0.5 2N4403 UNIT 1
5.0 2N4403 UNIT 2
2N4402 UNIT 1
0.2 2.0 2N4402 UNIT 2
0.1 1.0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
3.0
VCE = 1.0 V
2.0 VCE = 10 V TJ = 125°C
h FE, NORMALIZED CURRENT GAIN
25°C
1.0
– 55°C
0.7
0.5
0.3
0.2
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.0
0.8
0.6
IC = 1.0 mA 10 mA 100 mA 500 mA
0.4
0.2
0
0.005 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50
IB, BASE CURRENT (mA)
1.0 0.5
TJ = 25°C
0
0.8 VBE(sat) @ IC/IB = 10 qVC for VCE(sat)
COEFFICIENT (mV/ °C)
VOLTAGE (VOLTS)
0.5
0.6 VBE(sat) @ VCE = 10 V
1.0
0.4
1.5
0.2
2.0 qVS for VBE
VCE(sat) @ IC/IB = 10
0 2.5
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Amplifier Transistor
NPN Silicon
2N4410
COLLECTOR
3
2
BASE
1
EMITTER 1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 80 Vdc
Collector – Base Voltage VCBO 120 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 250 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 80 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Emitter Breakdown Voltage V(BR)CEX 120 — Vdc
(IC = 500 µAdc, VBE = 5.0 Vdc, RBE = 8.2 k ohms)
Collector – Base Breakdown Voltage V(BR)CBO 120 — Vdc
(IC = 10 µAdc, IE = 0)
REV 1
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 1.0 mAdc, VCE = 1.0 Vdc) 60 —
(IC = 10 mAdc, VCE = 1.0 Vdc) 60 400
Collector – Emitter Saturation Voltage VCE(sat) — 0.2 Vdc
(IC = 1.0 mAdc, IB = 0.1 mAdc)
Base – Emitter Saturation Voltage VBE(sat) — 0.8 Vdc
(IC = 1.0 mAdc, IB = 0.1 mAdc)
Base – Emitter On Voltage VBE(on) — 0.8 Vdc
(IC = 1.0 mAdc, VCE = 5.0 Vdc)
2. fT = |hfe| • ftest.
500
300 VCE = 1.0 V
TJ = 125°C
200 VCE = 5.0 V
h FE, DC CURRENT GAIN
25°C
100
– 55°C
50
30
20
10
7.0
5.0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0
0.9
0.8
0.7
IC = 1.0 mA 10 mA 30 mA 100 mA
0.6
0.5
0.4
0.3
0.2
0.1
0
0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IB, BASE CURRENT (mA)
101
VCE = 30 V
100
10–2 75°C
25°C
10–4
10–5
0.4 0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6
VBE, BASE–EMITTER VOLTAGE (VOLTS)
1.0 2.5
TJ = 25°C
100
70 TJ = 25°C
50
30
VBB VCC
C, CAPACITANCE (pF)
10.2 V
– 8.8 V 30 V 20
Vin
100 3.0 k RC 10
0.25 µF Cibo
10 µs RB 7.0
INPUT PULSE Vout 5.0
5.1 k
3.0 Cobo
tr, tf ≤ 10 ns Vin 100 1N914
DUTY CYCLE = 1.0% 2.0
1.0
Values Shown are for IC @ 10 mA 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20
VR, REVERSE VOLTAGE (VOLTS)
t, TIME (ns)
100 500
10 50
0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Amplifier Transistor
PNP Silicon
COLLECTOR
2N5087
3
Motorola Preferred Device
2
BASE
1
EMITTER
1
2
3
MAXIMUM RATINGS
CASE 29–04, STYLE 1
Rating Symbol Value Unit
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 50 Vdc
Collector – Base Voltage VCBO 50 Vdc
Emitter – Base Voltage VEBO 3.0 Vdc
Collector Current — Continuous IC 50 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 50 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 50 — Vdc
(IC = 100 µAdc, IE = 0)
Collector Cutoff Current ICBO — 50 nAdc
(VCB = 35 Vdc, IE = 0)
Emitter Cutoff Current IEBO — 50 nAdc
(VEB = 3.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
(Replaces 2N5086/D)
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 100 µAdc, VCE = 5.0 Vdc) 250 800
(IC = 1.0 mAdc, VCE = 5.0 Vdc) 250 —
(IC = 10 mAdc, VCE = 5.0 Vdc)(1) 250 —
Collector – Emitter Saturation Voltage VCE(sat) — 0.3 Vdc
(IC = 10 mAdc, IB = 1.0 mAdc)
Base – Emitter On Voltage VBE(on) — 0.85 Vdc
(IC = 1.0 mAdc, VCE = 5.0 Vdc)
Noise Figure NF dB
(IC = 20 µAdc, VCE = 5.0 Vdc, RS = 1.0 kΩ, f = 1.0 kHz) — 2.0
(IC = 100 µAdc, VCE = 5.0 Vdc, RS = 3.0 kΩ, f = 1.0 kHz) — 2.0
10 1.0
BANDWIDTH = 1.0 Hz 7.0 BANDWIDTH = 1.0 Hz
7.0 RS ≈ 0 5.0 RS ≈ ∞
IC = 10 µA IC = 1.0 mA
en, NOISE VOLTAGE (nV)
1.0 M 1.0 M
500 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
200 k 200 k
100 k 100 k
50 k 50 k
20 k 20 k
0.5 dB
10 k 10 k
0.5 dB
5.0 k 1.0 dB 5.0 k
2.0 k 2.0 k 1.0 dB
1.0 k 2.0 dB 1.0 k
2.0 dB
500 3.0 dB 500
3.0 dB
200 5.0 dB 200 5.0 dB
100 100
10 20 30 50 70 100 200 300 500 700 1.0 k 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
1.0 M
500 k 10 Hz to 15.7 kHz
RS , SOURCE RESISTANCE (OHMS)
200 k
100 k
ƪ ƫ
Noise Figure is Defined as:
2 2 1ń2
50 k
20 k NF + 20 log10 en2 ) 4KTR S ) In RS
4KTRS
10 k 0.5 dB
5.0 k en = Noise Voltage of the Transistor referred to the input. (Figure 3)
In = Noise Current of the Transistor referred to the input. (Figure 4)
2.0 k 1.0 dB K = Boltzman’s Constant (1.38 x 10–23 j/°K)
1.0 k T = Temperature of the Source Resistance (°K)
2.0 dB
500 RS = Source Resistance (Ohms)
3.0 dB
200
5.0 dB
100
10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (µA)
Figure 5. Wideband
400
TJ = 125°C
25°C
h FE, DC CURRENT GAIN
200
– 55°C
100
80
60 VCE = 1.0 V
VCE = 10 V
40
0.003 0.005 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
TA = 25°C TA = 25°C IB = 400 µA
PULSE WIDTH = 300 µs
350 µA
0.8 IC, COLLECTOR CURRENT (mA) 80 DUTY CYCLE ≤ 2.0%
300 µA 250 µA
IC = 1.0 mA 10 mA 50 mA 100 mA
0.6 60 200 µA
150 µA
0.4 40
100 µA
0.2 20 50 µA
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
θV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 0.8
VBE(on) @ VCE = 1.0 V
25°C to 125°C
0.4
1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 1000
VCC = 3.0 V 700 VCC = – 3.0 V
300 IC/IB = 10
IC/IB = 10 500
200 TJ = 25°C IB1 = IB2
ts
300 TJ = 25°C
100 200
t, TIME (ns)
t, TIME (ns)
70
50 100
30 70
tr 50
20 tf
td @ VBE(off) = 0.5 V 30
10 20
7.0
5.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
7.0
300 VCE = 20 V Cib
C, CAPACITANCE (pF) 5.0
5.0 V
200
3.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = –10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 70
5.0 50
3.0 30
2.0 20
1.0 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
400
1.0 ms 10 µs
The safe operating area curves indicate IC–VCE limits of the
200 transistor that must be observed for reliable operation. Collector load
IC, COLLECTOR CURRENT (mA)
100 µs
lines for specific circuits must fall below the limits indicated by the
100 TC = 25°C applicable curve.
1.0 s
dc The data of Figure 18 is based upon TJ(pk) = 150°C; TC or TA is
60 TA = 25°C variable depending upon conditions. Pulse curves are valid for duty
40 dc cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
the data in Figure 17. At high case or ambient temperatures, thermal
20 TJ = 150°C limitations will reduce the power than can be handled to values less
than the limitations imposed by second breakdown.
10 CURRENT LIMIT
THERMAL LIMIT
6.0
SECOND BREAKDOWN LIMIT
4.0
2.0 4.0 6.0 8.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
as shown in Figure 19. Using the model and the device thermal
ICEO response the normalized effective transient thermal resistance of
102 Figure 17 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 17 by the
101 steady state value RθJA.
ICBO
AND Example:
ICEX @ VBE(off) = 3.0 V The 2N5087 is dissipating 2.0 watts peak under the following
100
conditions:
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
10–1 Using Figure 17 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
10–2 The peak rise in junction temperature is therefore
– 40 – 20 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
TJ, JUNCTION TEMPERATURE (°C)
For more information, see AN–569.
Figure 19. Typical Collector Leakage Current
Amplifier Transistors
NPN Silicon 2N5088
2N5089
COLLECTOR
3
2
BASE
1
EMITTER 1
2
3
MAXIMUM RATINGS
Rating Symbol 2N5088 2N5089 Unit CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 30 25 Vdc
Collector – Base Voltage VCBO 35 30 Vdc
Emitter – Base Voltage VEBO 3.0 Vdc
Collector Current — Continuous IC 50 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA(1) 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) 2N5088 30 —
2N5089 25 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) 2N5088 35 —
2N5089 30 —
Collector Cutoff Current ICBO nAdc
(VCB = 20 Vdc, IE = 0) 2N5088 — 50
(VCB = 15 Vdc, IE = 0) 2N5089 — 50
Emitter Cutoff Current IEBO nAdc
(VEB(off) = 3.0 Vdc, IC = 0) — 50
(VEB(off) = 4.5 Vdc, IC = 0) — 100
1. RθJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%.
RS
in
en
IDEAL
TRANSISTOR
NOISE VOLTAGE
30 30
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
20 20
IC = 10 mA RS ≈ 0 RS ≈ 0
en , NOISE VOLTAGE (nV)
10 20
BANDWIDTH = 1.0 Hz
7.0
5.0
IC = 10 mA 16
In, NOISE CURRENT (pA)
2.0 3.0 mA
12
1.0 mA
1.0
IC = 1.0 mA
0.7 500 µA
300 µA 8.0
0.5
100 µA
0.3 100 µA
4.0 10 µA
0.2
10 µA 30 µA
RS ≈ 0
0.1 0
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) RS, SOURCE RESISTANCE (OHMS)
16 IC = 10 mA 3.0 mA
100 100 µA
NF, NOISE FIGURE (dB)
70 3.0 mA 1.0 mA
50 12
1.0 mA
30 300 µA
300 µA
20 30 µA 8.0
100 µA
10
10 µA
7.0 4.0 30 µA
10 µA
5.0
BANDWIDTH = 1.0 Hz
3.0 0
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
RS, SOURCE RESISTANCE (OHMS) RS, SOURCE RESISTANCE (OHMS)
0.5
0.4
0.3
0.2
0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA)
1.0 – 0.4
0.2 – 2.0
– 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
8.0 500
6.0 TJ = 25°C
300
Cob Cib
C, CAPACITANCE (pF)
4.0 Ceb
200
3.0 Ccb
2.0
100
VCE = 5.0 V
70
1.0 TJ = 25°C
0.8 50
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
Amplifier Transistors
NPN Silicon 2N5209
2N5210
COLLECTOR
3
2
BASE
1
EMITTER 1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 50 Vdc
Collector – Base Voltage VCBO 50 Vdc
Emitter – Base Voltage VEBO 4.0 Vdc
Collector Current — Continuous IC 50 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO 50 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 50 — Vdc
(IC = 0.1 mAdc, IE = 0)
Collector Cutoff Current ICBO — 50 nAdc
(VCB = 35 Vdc, IE = 0)
Emitter Cutoff Current IEBO — 50 nAdc
(VEB = 3.0 Vdc, IC = 0)
RS
in
en
IDEAL
TRANSISTOR
NOISE VOLTAGE
30 30
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
20 20
IC = 10 mA RS ≈ 0 RS ≈ 0
en , NOISE VOLTAGE (nV)
10 20
BANDWIDTH = 1.0 Hz
7.0
5.0
IC = 10 mA 16
In, NOISE CURRENT (pA)
2.0 3.0 mA
12
1.0 mA
1.0
IC = 1.0 mA
0.7 500 µA
300 µA 8.0
0.5
100 µA
0.3 100 µA
4.0 10 µA
0.2
10 µA 30 µA
RS ≈ 0
0.1 0
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) RS, SOURCE RESISTANCE (OHMS)
16 IC = 10 mA 3.0 mA
100 100 µA
NF, NOISE FIGURE (dB)
70 3.0 mA 1.0 mA
50 12
1.0 mA
30 300 µA
300 µA
20 30 µA 8.0
100 µA
10
10 µA
7.0 4.0 30 µA
10 µA
5.0
BANDWIDTH = 1.0 Hz
3.0 0
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
RS, SOURCE RESISTANCE (OHMS) RS, SOURCE RESISTANCE (OHMS)
0.5
0.4
0.3
0.2
0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA)
1.0 – 0.4
0.2 – 2.0
– 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
8.0 500
6.0 TJ = 25°C
300
Cob Cib
C, CAPACITANCE (pF)
4.0 Ceb
200
3.0 Ccb
2.0
100
VCE = 5.0 V
70
1.0 TJ = 25°C
0.8 50
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
COLLECTOR
3
2
BASE
1
EMITTER
1
2
3
MAXIMUM RATINGS
Rating Symbol 2N5400 2N5401 Unit CASE 29–04, STYLE 1
Collector – Emitter Voltage VCEO 120 150 Vdc TO–92 (TO–226AA)
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) 2N5400 120 —
2N5401 150 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) 2N5400 130 —
2N5401 160 —
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO
(VCB = 100 Vdc, IE = 0) 2N5400 — 100 nAdc
(VCB = 120 Vdc, IE = 0) 2N5401 — 50
(VCB = 100 Vdc, IE = 0, TA = 100°C) 2N5400 — 100 µAdc
(VCB = 120 Vdc, IE = 0, TA = 100°C) 2N5401 — 50
Emitter Cutoff Current IEBO — 50 nAdc
(VEB = 3.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
ON CHARACTERISTICS(1)
DC Current Gain hFE —
(IC = 1.0 mAdc, VCE = 5.0 Vdc) 2N5400 30 —
2N5401 50 —
150
TJ = 125°C
h FE, CURRENT GAIN
100
25°C
70
50
– 55°C
30 VCE = – 1.0 V
VCE = – 5.0 V
20
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100
IC, COLLECTOR CURRENT (mA)
1.0
0.9
0.8
0.7
0.6
IC = 1.0 mA 10 mA 30 mA 100 mA
0.5
0.4
0.3
0.2
0.1
0
0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IB, BASE CURRENT (mA)
103
VCE = 30 V
102
IC, COLLECTOR CURRENT ( µA)
IC = ICES
101
TJ = 125°C
100
75°C
10–1
REVERSE FORWARD
10–2 25°C
10–3
0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
VBE, BASE–EMITTER VOLTAGE (VOLTS)
0.7 1.0
VBE(sat) @ IC/IB = 10
0.6 0.5
θVC for VCE(sat)
0.5 0
0.4 –0.5
0.3 –1.0
0.2 VCE(sat) @ IC/IB = 10 –1.5
θVB for VBE(sat)
0.1 –2.0
0 –2.5
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
100
70 TJ = 25°C
VBB VCC 50
+ 8.8 V –30 V
30
C, CAPACITANCE (pF)
10.2 V
20 Cibo
100 3.0 k RC
Vin
Vout 10
10 µs 0.25 µF RB 7.0
INPUT PULSE 5.0 Cobo
5.1 k
tr, tf ≤ 10 ns Vin 100 1N914 3.0
DUTY CYCLE = 1.0% 2.0
1.0
Values Shown are for IC @ 10 mA 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20
VR, REVERSE VOLTAGE (VOLTS)
1000 2000
700 IC/IB = 10
TJ = 25°C tr @ VCC = 120 V 1000
500 IC/IB = 10 tf @ VCC = 120 V
700 TJ = 25°C
300
tr @ VCC = 30 V 500
200
tf @ VCC = 30 V
t, TIME (ns)
t, TIME (ns)
300
100 200
70 ts @ VCC = 120 V
50 100
70
30
50
20 td @ VBE(off) = 1.0 V
VCC = 120 V 30
10 20
0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2
BASE
1
EMITTER
MAXIMUM RATINGS 1
2
Rating Symbol 2N5550 2N5551 Unit 3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) 2N5550 140 —
2N5551 160 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 µAdc, IE = 0 ) 2N5550 160 —
2N5551 180 —
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 10 µAdc, IC = 0)
Collector Cutoff Current ICBO
(VCB = 100 Vdc, IE = 0) 2N5550 — 100 nAdc
(VCB = 120 Vdc, IE = 0) 2N5551 — 50
(VCB = 100 Vdc, IE = 0, TA = 100°C) 2N5550 — 100 µAdc
(VCB = 120 Vdc, IE = 0, TA = 100°C) 2N5551 — 50
Emitter Cutoff Current IEBO — 50 nAdc
(VEB = 4.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
ON CHARACTERISTICS(1)
DC Current Gain hFE —
(IC = 1.0 mAdc, VCE = 5.0 Vdc) 2N5550 60 —
2N5551 80 —
Noise Figure NF dB
(IC = 250 µAdc, VCE = 5.0 Vdc, RS = 1.0 kΩ, 2N5550 — 10
f = 1.0 kHz) 2N5551 — 8.0
10
7.0
5.0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0
0.9
0.8
0.7
IC = 1.0 mA 10 mA 30 mA 100 mA
0.6
0.5
0.4
0.3
0.2
0.1
0
0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IB, BASE CURRENT (mA)
101
VCE = 30 V
100
10–2 75°C
25°C
10–4
10–5
0.4 0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6
VBE, BASE–EMITTER VOLTAGE (VOLTS)
1.0 2.5
TJ = 25°C
100
70 TJ = 25°C
50
30
VBB VCC
C, CAPACITANCE (pF)
10.2 V
– 8.8 V 30 V 20
Vin
100 3.0 k RC 10
0.25 µF Cibo
10 µs RB 7.0
INPUT PULSE Vout 5.0
5.1 k
3.0 Cobo
tr, tf ≤ 10 ns Vin 100 1N914
DUTY CYCLE = 1.0% 2.0
1.0
Values Shown are for IC @ 10 mA 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20
VR, REVERSE VOLTAGE (VOLTS)
t, TIME (ns)
100 500
10 50
0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
BASE
2
EMITTER 1
1
2
MAXIMUM RATINGS 3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage (1) V(BR)CEO 40 — — Vdc
(IC = 10 mAdc, VBE = 0)
Collector – Base Breakdown Voltage V(BR)CBO 40 — — Vdc
(IC = 100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 12 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICES — — 1.0 mAdc
(VCE = 25 Vdc, IB = 0)
Collector Cutoff Current ICBO — — 50 nAdc
(VCB= 30 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — 50 nAdc
(VEB= 10 Vdc, IC = 0)
RS
in
en
IDEAL
TRANSISTOR
500 2.0
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
RS ≈ 0 1.0
200
0.7
en, NOISE VOLTAGE (nV)
100 µA 100 µA
0.1
20
0.07
IC = 1.0 mA 10 µA
0.05
10
0.03
5.0 0.02
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
200 14
VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)
10
70 IC = 10 µA 10 µA
8.0
50
100 µA
6.0
30 100 µA
4.0 IC = 1.0 mA
20
1.0 mA
2.0
10 0
1.0 2.0 5.0 10 20 50 100 200 500 100 1.0 2.0 5.0 10 20 50 100 200 500 100
RS, SOURCE RESISTANCE (kΩ) 0 RS, SOURCE RESISTANCE (kΩ) 0
20 4.0
VCE = 5.0 V
7.0 Cibo
1.0
5.0 Cobo 0.8
0.6
3.0 0.4
2.0 0.2
0.04 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 0.5 1.0 2.0 0.5 10 20 50 100 200 500
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
50 k 25°C
30 k 2.0
20 k
1.5
10 k
7.0 k
– 55°C
5.0 k 1.0
VCE = 5.0 V
3.0 k
2.0 k 0.5
5.0 7.0 10 20 30 50 70 100 200 300 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
1.6 – 1.0
RθV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 – 6.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2 SINGLE PULSE
0.05
0.1
0.1
0.07 SINGLE PULSE
0.05
0.03 ZθJC(t) = r(t) • RθJC TJ(pk) – TC = P(pk) ZθJC(t)
0.02 ZθJA(t) = r(t) • RθJA TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
1.0 k
FIGURE A
700 1.0 ms
500
IC, COLLECTOR CURRENT (mA)
tP
300 TC = 25°C 100 µs
TA = 25°C PP PP
200 1.0 s
100
70
50
t1
30
CURRENT LIMIT
20 THERMAL LIMIT 1/f
+ t1 f + ttP1
SECOND BREAKDOWN LIMIT
10 DUTY CYCLE
0.4 0.6 1.0 2.0 4.0 6.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS) PEAK PULSE POWER = PP
Figure 13. Active Region Safe Operating Area Design Note: Use of Transient Thermal Resistance Data
2
BASE
2
BASE PNP
NPN PNP
2N6519
1
EMITTER
1
EMITTER 2N6520
MAXIMUM RATINGS
2N6517 Voltage and current are negative
Rating Symbol 2N6515 2N6519 2N6520 Unit for PNP transistors
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) 2N6515 250 —
2N6519 300 —
2N6517, 2N6520 350 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 µAdc, IE = 0 ) 2N6515 250 —
2N6519 300 —
2N6517, 2N6520 350 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 µAdc, IC = 0) 2N6515, 2N6517 6.0 —
2N6519, 2N6520 5.0 —
REV 1
ON CHARACTERISTICS(1)
DC Current Gain hFE —
(IC = 1.0 mAdc, VCE = 10 Vdc) 2N6515 35 —
2N6519 30 —
2N6517, 2N6520 20 —
SWITCHING CHARACTERISTICS
Turn–On Time ton — 200 µs
(VCC = 100 Vdc, VBE(off) = 2.0 Vdc, IC = 50 mAdc, IB1 = 10 mAdc)
Turn–Off Time toff — 3.5 µs
(VCC = 100 Vdc, IC = 50 mAdc, IB1 = IB2 = 10 mAdc)
2N6515 2N6519
200 200
VCE = 10 V TJ = 125°C VCE = –10 V TJ = 125°C
hFE, DC CURRENT GAIN
70 70 – 55°C
– 55°C
50 50
30 30
20 20
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2N6517 2N6520
200 200
VCE = 10 V TJ = 125°C VCE = –10 V
TJ = 125°C
100 100
hFE , DC CURRENT GAIN
– 55°C
30 30
20 20
10 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
100 100
70 70
50 50
TJ = 25°C TJ = 25°C
30 VCE = 20 V 30 VCE = – 20 V
f = 20 MHz f = 20 MHz
20 20
10 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 –1.0
V, VOLTAGE (VOLTS)
V, VOLTAGE (VOLTS)
0.8 VBE(sat) @ IC/IB = 10 –0.8 VBE(sat) @ IC/IB = 10
2.0
IC
IB
+ 10 2.0
IC
IB
+ 10
1.5 1.5
1.0 25°C to 125°C 1.0 25°C to 125°C
0.5 0.5 RθVB for VBE
RθVC for VCE(sat)
0 0 – 55°C to 25°C
– 55°C to 25°C
– 0.5 – 0.5
– 1.0 – 1.0
– 55°C to 125°C
– 1.5 – 1.5 RθVC for VCE(sat)
RθVB for VBE – 55°C to 125°C
– 2.0 – 2.0
– 2.5 – 2.5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
20 20
10 10
7.0 7.0 Ccb
5.0 Ccb 5.0
3.0 3.0
2.0 2.0
1.0 1.0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 – 0.2 – 0.5 – 1.0 – 2.0 – 5.0 – 10 – 20 – 50 – 100 – 200
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
Figure 6. Capacitance
t, TIME (ns)
tr
100 100
70 70
50 50
30 30
20 20
10 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–9.2 V 1/2MSD7000
1.0
0.7
0.5 D = 0.5
RESISTANCE (NORMALIZED)
0.2
r(t), TRANSIENT THERMAL
0.3
0.2
0.05 SINGLE PULSE
0.1
0.1
0.07 SINGLE PULSE
0.05
ZθJC(t) = r(t) • RθJC TJ(pk) – TC = P(pk) ZθJC(t)
0.03
ZθJA(t) = r(t) • RθJA TJ(pk) – TA = P(pk) ZθJA(t)
0.02
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
500 FIGURE A
100 µs 10 µs
TA = 25°C
IC, COLLECTOR CURRENT (mA)
200 tP
100 TC = 25°C 1.0 ms
PP PP
50 100 ms
20
CURRENT LIMIT
10
THERMAL LIMIT
5.0 (PULSE CURVES @ TC = 25°C) t1
SECOND BREAKDOWN LIMIT
2.0
CURVES APPLY 2N6515 1/f
1.0 2N6519
0.5
BELOW RATED VCEO 2N6517, 2N6520 DUTY CYCLE + t1 f + ttP1
0.5 1.0 2.0 5.0 10 20 50 100 200 500
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS) PEAK PULSE POWER = PP
Figure 11. Active Region Safe Operating Area Design Note: Use of Transient Thermal Resistance Data
THERMAL CHARACTERISTICS
Rating Symbol Max Unit
Power Dissipation(1) PD 150 mW
Junction Temperature TJ 150 °C 1 2
Storage Temperature Range Tstg – 55 ~ + 150 °C BASE EMITTER
REV 1
1000
TA = 25°C VCE = 10 V
IC, COLLECTOR CURRENT (mA)
120 TA = 25°C
TA = 75°C
DC CURRENT GAIN
90
300 µA TA = – 25°C
250 100
60 200
150
100
30
IB = 50 µA
0 10
0 3 6 9 12 15 0.1 1 10 100
VCE, COLLECTOR VOLTAGE (V) IC, COLLECTOR CURRENT (mA)
2 900
VCE , COLLECTOR-EMITTER VOLTAGE (V)
TA = 25°C 800
500
1
400
300
0.5 TA = 25°C
200
VCE = 5 V
100
0 0
0.01 0.1 1 10 100 0.2 0.5 1 5 10 20 40 60 80 100 150 200
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
13 14
12 12
Cib, INPUT CAPACITANCE (pF)
11 10
10 8
9 6
8 4
7 2
6 0
0 1 2 3 4 0 10 20 30 40
VEB (V) VCB (V)
2
MAXIMUM RATINGS (TA = 25°C) 1
Rating Symbol Value Unit
CASE 463–01, STYLE 1
Collector-Base Voltage V(BR)CBO 50 Vdc
SOT–416/SC–90
Collector-Emitter Voltage V(BR)CEO 50 Vdc
Emitter-Base Voltage V(BR)EBO 5.0 Vdc
Collector Current — Continuous IC 100 mAdc COLLECTOR
3
DEVICE MARKING
2SC4617 = B9
THERMAL CHARACTERISTICS
Rating Symbol Max Unit
Power Dissipation(1) PD 125 mW
1 2
Junction Temperature TJ 150 °C
BASE EMITTER
Storage Temperature Range Tstg – 55 ~ + 150 °C
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
60 1000
TA = 25°C 160 µA VCE = 10 V
TA = 25°C
IC, COLLECTOR CURRENT (mA)
50
140 µA TA = 75°C
120 µA
DC CURRENT GAIN
40
TA = – 25°C
100 µA
30 100
80 µA
20 60 µA
40 µA
10 IB = 20 µA
0 10
0 2 4 6 8 0.1 1 10 100
VCE, COLLECTOR VOLTAGE (V) IC, COLLECTOR CURRENT (mA)
2 900
VCE , COLLECTOR-EMITTER VOLTAGE (V)
TA = 25°C 800
1 500
400
TA = 25°C
300
VCE = 5 V
0.5
200
100
0 0
0.01 0.1 1 10 100 0.2 0.5 1 5 10 20 40 60 80 100 150 200
IB, BASE CURRENT (mA)
IC, COLLECTOR CURRENT (mA)
Figure 3. Collector Saturation Region
Figure 4. On Voltage
20 7
6
Cib, INPUT CAPACITANCE (pF)
18
Cob, CAPACITANCE (pF)
5
16
4
14
3
12
2
10 1
0 1 2 3 4 0 10 20 30 40
VEB (V) VCB (V)
Amplifier Transistors
BC182,A,B
NPN Silicon
BC183
BC184
COLLECTOR
1
2
BASE
3
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol BC182 BC183 BC184 Unit
Collector – Emitter Voltage VCEO 50 30 30 Vdc CASE 29–04, STYLE 17
TO–92 (TO–226AA)
Collector – Base Voltage VCBO 60 45 45 Vdc
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 100 mAdc
Total Device Dissipation @ TA = 25°C PD 350 mW
Derate above 25°C 2.8 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.0 Watts
Derate above 25°C 8.0 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
Thermal Resistance, Junction to Case RqJC 125 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO V
(IC = 2.0 mA, IB = 0) BC182 50 — —
BC183 30 — —
BC184 30 — —
Collector – Base Breakdown Voltage V(BR)CBO V
(IC = 10 mA, IE = 0) BC182 60 — —
BC183 45 — —
BC184 45 — —
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — — V
(IE = 100 mA, IC = 0)
Collector Cutoff Current ICBO nA
(VCB = 50 V, VBE = 0) BC182 — 0.2 15
(VCB = 30 V, VBE = 0) BC183 — 0.2 15
BC184 — 0.2 15
Emitter–Base Leakage Current IEBO — — 15 nA
(VEB = 4.0 V, IC = 0)
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 10 µA, VCE = 5.0 V) BC182 40 — —
BC183 40 — —
BC184 100 — —
2.0 1.0
VCE = 10 V TA = 25°C
hFE, NORMALIZED DC CURRENT GAIN
1.5 0.9
TA = 25°C
0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
1.0 0.7
VBE(on) @ VCE = 10 V
0.8 0.6
0.6 0.5
0.4
0.4 0.3
0.3 0.2
VCE(sat) @ IC/IB = 10
0.1
0.2 0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
400 10
300
7.0
200 TA = 25°C
C, CAPACITANCE (pF)
5.0 Cib
100 VCE = 10 V
80 TA = 25°C 3.0
Cob
60
2.0
40
30
20 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.4 0.6 0.8 1.0 2.0 4.0 6.0 8.0 10 20 40
IC, COLLECTOR CURRENT (mAdc) VR, REVERSE VOLTAGE (VOLTS)
170
r b, BASE SPREADING RESISTANCE (OHMS)
160
150
VCE = 10 V
f = 1.0 kHz
140
TA = 25°C
130
120
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mAdc)
Amplifier Transistors
BC212,B
PNP Silicon
BC213
COLLECTOR BC214
3
2
BASE
1
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol BC212 BC213 BC214 Unit
Collector – Emitter Voltage VCEO –50 –30 –30 Vdc CASE 29–04, STYLE 17
TO–92 (TO–226AA)
Collector – Base Voltage VCBO –60 –45 –45 Vdc
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –100 mAdc
Total Device Dissipation @ TA = 25°C PD 350 mW
Derate above 25°C 2.8 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.0 Watts
Derate above 25°C 8.0 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
Thermal Resistance, Junction to Case RqJC 125 °C/W
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = –10 µAdc, VCE = –5.0 Vdc) BC212 40 — —
BC213 40 — —
BC214 100 — —
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product fT MHz
(IC = –10 mAdc, VCE = –5.0 Vdc, f = 100 MHz) BC212 — 280 —
BC214 — 320 —
BC213 — 360 —
Common–Base Output Capacitance Cob — — 6.0 pF
(VCB = –10 Vdc, IC = 0, f = 1.0 MHz)
Noise Figure NF dB
(IC = –0.2 mAdc, VCE = –5.0 Vdc,
RS = 2.0 kΩ , f = 1.0 kHz) BC214 — — 2
(IC = –0.2 mAdc, VCE = –5.0 Vdc,
RS = 2.0 kΩ, f = 1.0 kHz, f = 200 Hz) BC212, BC213 — — 10
Small–Signal Current Gain hfe —
(IC = –2.0 mAdc, VCE = –5.0 Vdc, f = 1.0 kHz) BC212 60 — —
BC213 80 — —
BC214 140 — —
BC212B 200 — 400
2.0 –1.0
VCE = –10 V TA = 25°C
hFE, NORMALIZED DC CURRENT GAIN
1.5 –0.9
TA = 25°C VBE(sat) @ IC/IB = 10
–0.8
V, VOLTAGE (VOLTS)
1.0 –0.7 VBE(on) @ VCE = –10 V
–0.6
0.7
–0.5
0.5 –0.4
–0.3
0.3 –0.2
VCE(sat) @ IC/IB = 10
–0.1
0.2 0
–0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
400 10
300 Cib
7.0
200
C, CAPACITANCE (pF)
150 VCE = –10 V 5.0 TA = 25°C
TA = 25°C
100
80 3.0
60 Cob
2.0
40
30
20 1.0
–0.5 –1.0 –2.0 –3.0 –5.0 –10 –20 –30 –50 –0.4 –0.6 –1.0 –2.0 –4.0 –6.0 –10 –20 –30 –40
IC, COLLECTOR CURRENT (mAdc) VR, REVERSE VOLTAGE (VOLTS)
1.0 150
r b′, BASE SPREADING RESISTANCE (OHMS)
hob, OUTPUT ADMITTANCE (OHMS)
0.1
120
0.05
0.03
110
0.01 100
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –0.1 –0.2 –0.3 –0.5 –1.0 –2.0 –3.0 –5.0 –10
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
Amplifier Transistors
BC237,A,B,C
NPN Silicon
BC238B,C
BC239,C
COLLECTOR
1
2
BASE
3
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol BC237 BC238 BC239 Unit
Collector – Emitter Voltage VCEO 45 25 25 Vdc CASE 29–04, STYLE 17
TO–92 (TO–226AA)
Collector – Emitter Voltage VCES 50 30 30 Vdc
Emitter – Base Voltage VEBO 6.0 5.0 5.0 Vdc
Collector Current — Continuous IC 100 mAdc
Total Device Dissipation @ TA = 25°C PD 350 mW
Derate above 25°C 2.8 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.0 Watts
Derate above 25°C 8.0 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
Thermal Resistance, Junction to Case RqJC 125 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage BC237 V(BR)CEO 45 — — V
(IC = 2.0 mA, IB = 0) BC238 25 — —
BC239 25 — —
Emitter – Base Breakdown Voltage BC237 V(BR)EBO 6.0 — — V
(IE = 100 mA, IC = 0) BC238 5.0 — —
BC239 5.0 — —
Collector Cutoff Current ICES
(VCE = 30 V, VBE = 0) BC238 — 0.2 15 nA
BC239 — 0.2 15
REV 1
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 10 µA, VCE = 5.0 V) BC237A — 90 —
BC237B/238B — 150 —
BC237C/238C/239C — 270 —
2.0 1.0
VCE = 10 V TA = 25°C
hFE, NORMALIZED DC CURRENT GAIN
1.5 0.9
TA = 25°C
0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
1.0 0.7
VBE(on) @ VCE = 10 V
0.8 0.6
0.6 0.5
0.4
0.4 0.3
0.3 0.2
VCE(sat) @ IC/IB = 10
0.1
0.2 0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
400 10
300
7.0
200 TA = 25°C
C, CAPACITANCE (pF)
5.0 Cib
100 VCE = 10 V
80 TA = 25°C 3.0
Cob
60
2.0
40
30
20 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.4 0.6 0.8 1.0 2.0 4.0 6.0 8.0 10 20 40
IC, COLLECTOR CURRENT (mAdc) VR, REVERSE VOLTAGE (VOLTS)
170
r b, BASE SPREADING RESISTANCE (OHMS)
160
150
VCE = 10 V
f = 1.0 kHz
140
TA = 25°C
130
120
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mAdc)
2
BASE
3
EMITTER
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
Thermal Resistance, Junction to Case RqJC 125 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage BC307,B,C V(BR)CEO –45 — — Vdc
(IC = –2.0 mAdc, IB = 0) BC308C –25 — —
Emitter – Base Breakdown Voltage BC307,B,C V(BR)EBO –5.0 — — Vdc
(IE = –100 mAdc, IC = 0) BC308C –5.0 — —
Collector–Emitter Leakage Current ICES
(VCES = –50 V, VBE = 0) BC307,B,C — –0.2 –15 nAdc
(VCES = –30 V, VBE = 0) BC308C — –0.2 –15
(VCES = –50 V, VBE = 0) TA = 125°C BC307,B,C — –0.2 –4.0 µA
(VCES = –30 V, VBE = 0) TA = 125°C BC308C — –0.2 –4.0
REV 1
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = –10 µAdc, VCE = –5.0 Vdc) BC307B — 150 —
BC307C/308C — 270 —
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product fT MHz
(IC = –10 mAdc, VCE = –5.0 Vdc, f = 100 MHz) BC307,B,C — 280 —
BC308C — 320 —
Common Base Capacitance Ccbo — — 6.0 pF
(VCB = –10 Vdc, IC = 0, f = 1.0 MHz)
Noise Figure NF dB
(IC = –0.2 mAdc, VCE = –5.0 Vdc, RS = 2.0 kΩ,
f = 1.0 kHz) BC307,B,C — 2.0 10
1. IC = –10 mAdc on the constant base current characteristic, which yields the point IC = –11 mAdc, VCE = –1.0 V.
2.0 –1.0
VCE = –10 V TA = 25°C
hFE, NORMALIZED DC CURRENT GAIN
1.5 –0.9
TA = 25°C VBE(sat) @ IC/IB = 10
–0.8
V, VOLTAGE (VOLTS)
1.0 –0.7 VBE(on) @ VCE = –10 V
–0.6
0.7
–0.5
0.5 –0.4
–0.3
0.3 –0.2
VCE(sat) @ IC/IB = 10
–0.1
0.2 0
–0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
400 10
300 Cib
7.0
200 C, CAPACITANCE (pF)
150 VCE = –10 V 5.0 TA = 25°C
TA = 25°C
100
80 3.0
60 Cob
2.0
40
30
20 1.0
–0.5 –1.0 –2.0 –3.0 –5.0 –10 –20 –30 –50 –0.4 –0.6 –1.0 –2.0 –4.0 –6.0 –10 –20 –30 –40
IC, COLLECTOR CURRENT (mAdc) VR, REVERSE VOLTAGE (VOLTS)
1.0 150
r b′, BASE SPREADING RESISTANCE (OHMS)
hob, OUTPUT ADMITTANCE (OHMS)
0.1
120
0.05
0.03
110
0.01 100
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –0.1 –0.2 –0.3 –0.5 –1.0 –2.0 –3.0 –5.0 –10
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
Amplifier Transistors
PNP Silicon BC327,-16,-25
BC328,-16,-25
COLLECTOR
1
2
BASE
3
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol BC327 BC328 Unit
Collector – Emitter Voltage VCEO –45 –25 Vdc CASE 29–04, STYLE 17
TO–92 (TO–226AA)
Collector – Base Voltage VCBO –50 –30 Vdc
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –800 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watt
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = –10 mA, IB = 0) BC327 –45 — —
BC328 –25 — —
Collector – Emitter Breakdown Voltage V(BR)CES Vdc
(IC = –100 µA, IE = 0) BC327 –50 — —
BC328 –30 — —
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — — Vdc
(IE = –10 mA, IC = 0)
Collector Cutoff Current ICBO nAdc
(VCB = –30 V, IE = 0) BC327 — — –100
(VCB = –20 V, IE = 0) BC328 — — –100
Collector Cutoff Current ICES nAdc
(VCE = –45 V, VBE = 0) BC327 — — –100
(VCE = –25 V, VBE = 0) BC328 — — –100
Emitter Cutoff Current IEBO — — –100 nAdc
(VEB = –4.0 V, IC = 0)
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = –100 mA, VCE = –1.0 V) BC327/BC328 100 — 630
BC327–16/BC328–16 100 — 250
BC327–25/BC328–25 160 — 400
(IC = –300 mA, VCE = –1.0 V) 40 — —
Base–Emitter On Voltage VBE(on) — — –1.2 Vdc
(IC = –300 mA, VCE = –1.0 V)
Collector – Emitter Saturation Voltage VCE(sat) — — –0.7 Vdc
(IC = –500 mA, IB = –50 mA)
SMALL–SIGNAL CHARACTERISTICS
Output Capacitance Cob — 11 — pF
(VCB = –10 V, IE = 0, f = 1.0 MHz)
Current – Gain — Bandwidth Product fT — 260 — MHz
(IC = –10 mA, VCE = –5.0 V, f = 100 MHz)
1.0
r(t), NORMALIZED EFFECTIVE TRANSIENT
0.7 D = 0.5
0.5
0.3
THERMAL RESISTANCE
0.2
0.2 0.1
θJC(t) = (t) θJC
0.1 0.05 θJC = 100°C/W MAX
P(pk)
0.07 0.02 θJA(t) = r(t) θJA
SINGLE PULSE
0.05 t1 θJA = 375°C/W MAX
0.01 D CURVES APPLY FOR POWER
0.03 SINGLE PULSE t2 PULSE TRAIN SHOWN
0.02 DUTY CYCLE, D = t1/t2 READ TIME AT t1
TJ(pk) – TC = P(pk) θJC(t)
0.01
0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
t, TIME (SECONDS)
–1000 1000
1.0 s 1.0 ms TJ = 135°C VCE = –1.0 V
TA = 25°C
IC, COLLECTOR CURRENT (mA)
100 µs
hFE, DC CURRENT GAIN
dc
TC = 25°C
dc
–100 TA = 25°C 100
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
(APPLIES BELOW RATED VCEO)
–10 10
–1.0 –3.0 –10 –30 –100 –0.1 –1.0 –10 –100 –1000
VCE, COLLECTOR–EMITTER VOLTAGE IC, COLLECTOR CURRENT (mA)
V, VOLTAGE (VOLTS)
–0.6 IC = –0.6
–500 mA
–0.4 –0.4
IC = –300 mA
–0.2 IC = –100 mA –0.2
VCE(sat) @ IC/IB = 10
IC = –10 mA
0 0
–0.01 –0.1 –1.0 –10 –100 –1.0 –10 –100 –1000
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
100
θV, TEMPERATURE COEFFICIENTS (mV/°C)
+1.0
C, CAPACITANCE (pF)
0
Cib
10
–1.0
Cob
θVB for VBE
–2.0
1.0
–1.0 –10 –100 –1000 –0.1 –1.0 –10 –100
IC, COLLECTOR CURRENT VR, REVERSE VOLTAGE (VOLTS)
Amplifier Transistors
NPN Silicon BC337,-16,-25,-40
BC338,-16,-25,-40
COLLECTOR
1
2
BASE
3
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol BC337 BC338 Unit
Collector – Emitter Voltage VCEO 45 25 Vdc CASE 29–04, STYLE 17
TO–92 (TO–226AA)
Collector – Base Voltage VCBO 50 30 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 800 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watt
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 10 mA, IB = 0) BC337 45 — —
BC338 25 — —
Collector – Emitter Breakdown Voltage V(BR)CES Vdc
(IC = 100 µA, IE = 0) BC337 50 — —
BC338 30 — —
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — — Vdc
(IE = 10 mA, IC = 0)
Collector Cutoff Current ICBO nAdc
(VCB = 30 V, IE = 0) BC337 — — 100
(VCB = 20 V, IE = 0) BC338 — — 100
Collector Cutoff Current ICES nAdc
(VCE = 45 V, VBE = 0) BC337 — — 100
(VCE = 25 V, VBE = 0) BC338 — — 100
Emitter Cutoff Current IEBO — — 100 nAdc
(VEB = 4.0 V, IC = 0)
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 100 mA, VCE = 1.0 V) BC337/BC338 100 — 630
BC337–16/BC338–16 100 — 250
BC337–25/BC338–25 160 — 400
BC337–40/BC338–40 250 — 630
(IC = 300 mA, VCE = 1.0 V) 60 — —
Base–Emitter On Voltage VBE(on) — — 1.2 Vdc
(IC = 300 mA, VCE = 1.0 V)
Collector – Emitter Saturation Voltage VCE(sat) — — 0.7 Vdc
(IC = 500 mA, IB = 50 mA)
SMALL–SIGNAL CHARACTERISTICS
Output Capacitance Cob — 15 — pF
(VCB = 10 V, IE = 0, f = 1.0 MHz)
Current – Gain — Bandwidth Product fT — 210 — MHz
(IC = 10 mA, VCE = 5.0 V, f = 100 MHz)
1.0
r(t), NORMALIZED EFFECTIVE TRANSIENT
0.7 D = 0.5
0.5
0.3
THERMAL RESISTANCE
0.2
0.2 0.1
θJC(t) = (t) θJC
0.1 0.05 θJC = 100°C/W MAX
P(pk)
0.07 0.02 θJA(t) = r(t) θJA
SINGLE PULSE
0.05 t1 θJA = 375°C/W MAX
0.01 D CURVES APPLY FOR POWER
0.03 SINGLE PULSE t2 PULSE TRAIN SHOWN
0.02 DUTY CYCLE, D = t1/t2 READ TIME AT t1
TJ(pk) – TC = P(pk) θJC(t)
0.01
0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
t, TIME (SECONDS)
1000 1000
1.0 s 1.0 ms TJ = 135°C
VCE = 1 V
IC, COLLECTOR CURRENT (mA)
100 µs TJ = 25°C
hFE, DC CURRENT GAIN
dc
TC = 25°C
dc
100 TA = 25°C 100
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
(APPLIES BELOW RATED VCEO)
10 10
1.0 3.0 10 30 100 0.1 1.0 10 100 1000
VCE, COLLECTOR–EMITTER VOLTAGE IC, COLLECTOR CURRENT (AMP)
V, VOLTAGE (VOLTS)
0.6 0.6
0.2 0.2
VCE(sat) @ IC/IB = 10
0 0
0.01 0.1 1 10 100 1 10 100 1000
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
100
θV, TEMPERATURE COEFFICIENTS (mV/°C)
+1
C, CAPACITANCE (pF)
0
Cib
10
–1
Cob
–2 θVB for VBE
1
1 10 100 1000 0.1 1 10 100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
Amplifier Transistors
COLLECTOR COLLECTOR NPN
2 2
BC368
3 3 PNP
BC369
BASE BASE
NPN PNP
1 1
EMITTER EMITTER
Voltage and current are negative
MAXIMUM RATINGS for PNP transistors
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO 20 — — Vdc
(IC = 10 mA, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 25 — — Vdc
(IC = 100 µA, IE = 0 )
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — — Vdc
(IE = 100 µA, IC = 0)
Collector Cutoff Current ICBO
(VCB = 25 V, IE = 0) — — 10 µAdc
(VCB = 25 V, IE = 0, TJ = 150°C) — — 1.0 mAdc
Emitter Cutoff Current IEBO — — 10 µAdc
(VEB = 5.0 V, IC = 0)
ON CHARACTERISTICS
DC Current Gain hFE —
(VCE = 10 V, IC = 5.0 mA) 50 — —
(VCE = 1.0 V, IC = 0.5 A) 85 — 375
(VCE = 1.0 V, IC = 1.0 A) 60 — —
Bandwidth Product (IC = 10 mA, VCE = 5.0 V, f = 20 MHz) fT 65 — — MHz
Collector–Emitter Saturation Voltage (IC = 1.0 A, IB = 100 mA) VCE(sat) — — 0.5 V
Base–Emitter On Voltage (IC = 1.0 A, VCE = 1.0 V) VBE(on) — — 1.0 V
100
0.6
70 50 mA
50 0.4 100 mA
VCE = 1.0 V
TJ = 25°C 1000 mA
0.2 500 mA
IC = 10 mA
250 mA
20 0
10 20 50 100 200 500 1000 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
1.0 –0.8
0.8 –1.2
V, VOLTAGE (VOLTS)
0.2 –2.4
VCE(sat) @ IC/IB = 10
0 –2.8
1.0 2.0 5.0 10 20 50 100 200 500 1000 1.0 2.0 5.0 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
300 160
TJ = 25°C
200
120
C, CAPACITANCE (pF)
100 80
70 Cibo
VCE = 10 V 40
50 TJ = 25°C
f = 20 MHz
Cobo
30 0
10 20 50 100 200 500 1000 Cobo 5.0 10 15 20 25
Cibo 1.0 2.0 3.0 4.0 5.0
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
COLLECTOR 3
BASE
2
1
2
3
EMITTER 1
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CES Vdc
(IC = 100 mAdc, IB = 0) BC372 100 — —
BC373 80 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) BC372 100 — —
BC373 80 — —
Emitter – Base Breakdown Voltage V(BR)EBO 12 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO nAdc
(VCB = 80 Vdc, IE = 0) BC372 — — 100
(VCB = 60 Vdc, IE = 0) BC373 — — 100
Emitter Cutoff Current IEBO — — 100 nAdc
(VEB = 10 V, IC = 0)
DYNAMIC CHARACTERISTICS
Current–Gain Bandwidth Product fT 100 200 — MHz
(IC = 100 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
Output Capacitance Cob — 10 25 pF
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Noise Figure NF — 2.0 — dB
(IC = 1.0 mAdc, VCE = 5.0 Vdc, Rg = 100 k ohm, f = 1.0 kHz)
100 K 1.6
VCE = 5 V VBE(sat) @ IC/IB = 100
1.4
TA = 125°C
hFE, DC CURRENT GAIN
10 K –55°C 0.8
0.4
0.2
1K 0
1 10 100 1000 5 10 100 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1000 100
VCE = 5 V
TJ = 25°C
C, CAPACITANCE (pF)
Cib
Cob
100 10
10 1
0.6 1 10 100 600 0.1 10 100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
2
BASE
3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit 2
3
Collector – Emitter Voltage VCEO 80 Vdc
CASE 29–04, STYLE 17
Collector – Base Voltage VCBO 80 Vdc
TO–92 (TO–226AA)
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 0.5 Adc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watt
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 80 — — Vdc
(IC = 10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 80 — — Vdc
(IC = 100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — 100 nAdc
(VCB = 60 Vdc, IE = 0)
ON CHARACTERISTICS*
DC Current Gain hFE —
(IC = 10 mAdc, VCE = 2.0 Vdc) 40 — —
(IC = 100 mAdc, VCE = 2.0 Vdc) BC489 60 — 400
BC489A 100 160 250
BC489B 160 260 400
(IC = 1.0 Adc, VCE = 5.0 Vdc)* 15 — —
DYNAMIC CHARACTERISTICS
Current–Gain — Bandwidth Product fT — 200 — MHz
(IC = 50 mAdc, VCE = 2.0 Vdc, f = 100 MHz)
Output Capacitance Cob — 7.0 — pF
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
5.0 µs
tr = 3.0 ns
C, CAPACITANCE (pF)
100 20
70
10
50 8.0
6.0
Cobo
30 4.0
2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
1.0 k
700
500 ts
300
200
t, TIME (ns)
100
70 tf
50
VCC = 40 V
30 tr
IC/IB = 10
20 IB1 = IB2
TJ = 25°C td @ VBE(off) = 0.5 V
10
5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.0
0.7
r(t) TRANSIENT THERMAL RESISTANCE
D = 0.5
0.5
0.3 0.2
0.1 P(pk)
0.2
(NORMALIZED)
t1
0.1 0.02 t2
0.07 0.01 DUTY CYCLE, D = t1/t2
0.05 SINGLE PULSE D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
0.03 SINGLE PULSE READ TIME AT t1 (SEE AN–469)
0.02 ZθJC(t) = r(t) • RθJC TJ(pk) – TC = P(pk) ZθJC(t)
ZθJA(t) = r(t) • RθJA TJ(pk) – TA = P(pk) ZθJA(t)
0.01
1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
1.0 k
700 100 µs
500
BC489
10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
400
200
25°C
–55°C
100
80
60
40
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.0 1.0
TJ = 25°C TJ = 25°C
0.8 0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
50
IC = 10 mA 100 mA 250 mA 500 mA
0.6 0.6 mA
VBE(on) @ VCE = 1.0 V
0.4 0.4
0.2 0.2
VCE(sat) @ IC/IB = 10
0 0
0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–0.8 –1.0
V, VOLTAGE (VOLTS)
VBE(sat) @ IC/IB = 10
–1.6 –0.6
VBE(on) @ VCE = –1.0 V
RθVB for VBE
–2.0 –0.4
–2.4 –0.2
VCE(sat) @ IC/IB = 10
–2.8 0
0.5 1.0 2.0 5.0 10 20 50 100 200 500 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–1.0 –0.8
–0.8 –1.2
–0.6 –1.6
–0.2 –2.4
0 –2.8
–0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 12. Collector Saturation Region Figure 13. Base–Emitter Temperature Coefficient
2
BASE
3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit 2
3
Collector – Emitter Voltage VCEO –80 Vdc
CASE 29–04, STYLE 17
Collector – Base Voltage VCBO –80 Vdc
TO–92 (TO–226AA)
Emitter – Base Voltage VEBO –4.0 Vdc
Collector Current — Continuous IC –0.5 Adc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watt
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO –80 — — Vdc
(IC = –10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –80 — — Vdc
(IC = –100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –4.0 — — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — –100 nAdc
(VCB = –60 Vdc, IE = 0)
ON CHARACTERISTICS*
DC Current Gain hFE —
(IC = –10 mAdc, VCE = –2.0 Vdc) 40 — —
(IC = –100 mAdc, VCE = –2.0 Vdc) BC490 60 — 400
BC490A 100 140 250
(IC = –1.0 Adc, VCE = –5.0 Vdc) 15 — —
DYNAMIC CHARACTERISTICS
Current–Gain — Bandwidth Product fT — 150 — MHz
(IC = –50 mAdc, VCE = –2.0 Vdc, f = 100 MHz)
Output Capacitance Cob — 9.0 — pF
(VCB = –10 Vdc, IE = 0, f = 1.0 MHz)
5.0 µs
tr = 3.0 ns
C, CAPACITANCE (pF)
100
30
70
20
50
10 Cobo
30
7.0
20 5.0
–2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
1.0 k
700
500
300 ts
200
t, TIME (ns)
100
70 td @ VBE(off) = –0.5 V tf
50
30 VCC = –40 V
IC/IB = 10
20 IB1 = IB2
TJ = 25°C tr
10
–5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500
IC, COLLECTOR CURRENT (mA)
1.0
0.7
r(t) TRANSIENT THERMAL RESISTANCE
D = 0.5
0.5
0.3 0.2
0.1 P(pk)
0.2
(NORMALIZED)
t1
0.1 0.02 t2
0.07 0.01 DUTY CYCLE, D = t1/t2
0.05 SINGLE PULSE D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
0.03 SINGLE PULSE READ TIME AT t1 (SEE AN–469)
0.02 ZθJC(t) = r(t) • RθJC TJ(pk) – TC = P(pk) ZθJC(t)
ZθJA(t) = r(t) • RθJA TJ(pk) – TA = P(pk) ZθJA(t)
0.01
1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
–1.0 k 1.0
–700 100 µs TJ = 25°C
IC, COLLECTOR CURRENT (mA) –500
0.8
–300 1.0 s VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
–200 1.0 ms 0.6 VBE(on) @ VCE = 1.0 V
TA = 25°C TC = 25°C
–100
–70 0.4
–50
CURRENT LIMIT
–30 THERMAL LIMIT
SECOND BREAKDOWN LIMIT 0.2
–20
VCE(sat) @ IC/IB = 10
–10 BC490 0
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 0.5 1.0 2.0 5.0 10 20 50 100 200 500
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1.0 –0.8
IC = 10 mA 50 500 mA
100 mA 250 mA
0.6 mA –1.6
0.4 –2.0
RθVB for VBE
0.2 –2.4
0 –2.8
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
400
TJ = 125°C
VCE = –1.0 V
hFE , DC CURRENT GAIN
200
25°C
–55°C
100
80
60
40
–0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500
IC, COLLECTOR CURRENT (mA)
–0.2 –0.2
VCE(sat) @ IC/IB = 10
0 0
–0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
–0.8
RθVB, TEMPERATURE COEFFICIENT (mV/°C)
–1.2
–1.6
–2.4
–2.8
–0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500
IC, COLLECTOR CURRENT (mA)
Darlington Transistors
NPN Silicon
COLLECTOR 1
BC517
BASE
2
EMITTER 3
MAXIMUM RATINGS 1
2
Rating Symbol Value Unit 3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CES 30 — — Vdc
(IC = 2.0 mAdc, VBE = 0)
Collector – Base Breakdown Voltage V(BR)CBO 40 — — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 10 — — Vdc
(IE = 100 nAdc, IC = 0)
Collector Cutoff Current ICES — — 500 nAdc
(VCE = 30 Vdc)
Collector Cutoff Current ICBO — — 100 nAdc
(VCB = 30 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — 100 nAdc
(VEB = 10 Vdc, IC = 0)
RS
in
en
IDEAL
TRANSISTOR
500 2.0
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
RS ≈ 0 1.0
200
0.7
en, NOISE VOLTAGE (nV)
100 µA 100 µA
0.1
20
0.07
IC = 1.0 mA 10 µA
0.05
10
0.03
5.0 0.02
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
200 14
VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)
10
70 IC = 10 µA 10 µA
8.0
50
100 µA
6.0
30 100 µA
4.0 IC = 1.0 mA
20
1.0 mA
2.0
10 0
1.0 2.0 5.0 10 20 50 100 200 500 100 1.0 2.0 5.0 10 20 50 100 200 500 100
RS, SOURCE RESISTANCE (kΩ) 0 RS, SOURCE RESISTANCE (kΩ) 0
20 4.0
VCE = 5.0 V
7.0 Cibo
1.0
5.0 Cobo 0.8
0.6
3.0 0.4
2.0 0.2
0.04 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 0.5 1.0 2.0 0.5 10 20 50 100 200 500
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
50 k 25°C
30 k 2.0
20 k
1.5
10 k
7.0 k
– 55°C
5.0 k 1.0
VCE = 5.0 V
3.0 k
2.0 k 0.5
5.0 7.0 10 20 30 50 70 100 200 300 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
1.6 – 1.0
RθV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 – 6.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
1.0 k
FIGURE A
700 1.0 ms
500
IC, COLLECTOR CURRENT (mA)
tP
300 TC = 25°C 100 µs
TA = 25°C PP PP
200 1.0 s
100
70
50
t1
30
CURRENT LIMIT
20 THERMAL LIMIT 1/f
+ t1 f + ttP1
SECOND BREAKDOWN LIMIT
10 DUTY CYCLE
0.4 0.6 1.0 2.0 4.0 6.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS) PEAK PULSE POWER = PP
Figure 13. Active Region Safe Operating Area Design Note: Use of Transient Thermal Resistance Data
Amplifier Transistors
BC546, B
NPN Silicon
BC547, A, B, C
BC548, A, B, C
COLLECTOR
1
2
BASE
3
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol BC546 BC547 BC548 Unit
Collector – Emitter Voltage VCEO 65 45 30 Vdc CASE 29–04, STYLE 17
TO–92 (TO–226AA)
Collector – Base Voltage VCBO 80 50 30 Vdc
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 100 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watt
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage BC546 V(BR)CEO 65 — — V
(IC = 1.0 mA, IB = 0) BC547 45 — —
BC548 30 — —
Collector – Base Breakdown Voltage BC546 V(BR)CBO 80 — — V
(IC = 100 µAdc) BC547 50 — —
BC548 30 — —
Emitter – Base Breakdown Voltage BC546 V(BR)EBO 6.0 — — V
(IE = 10 mA, IC = 0) BC547 6.0 — —
BC548 6.0 — —
Collector Cutoff Current ICES
(VCE = 70 V, VBE = 0) BC546 — 0.2 15 nA
(VCE = 50 V, VBE = 0) BC547 — 0.2 15
(VCE = 35 V, VBE = 0) BC548 — 0.2 15
(VCE = 30 V, TA = 125°C) BC546/547/548 — — 4.0 µA
REV 1
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 10 µA, VCE = 5.0 V) BC547A/548A — 90 —
BC546B/547B/548B — 150 —
BC548C — 270 —
SMALL–SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product fT MHz
(IC = 10 mA, VCE = 5.0 V, f = 100 MHz) BC546 150 300 —
BC547 150 300 —
BC548 150 300 —
Output Capacitance Cobo — 1.7 4.5 pF
(VCB = 10 V, IC = 0, f = 1.0 MHz)
Input Capacitance Cibo — 10 — pF
(VEB = 0.5 V, IC = 0, f = 1.0 MHz)
Small–Signal Current Gain hfe —
(IC = 2.0 mA, VCE = 5.0 V, f = 1.0 kHz) BC546 125 — 500
BC547/548 125 — 900
BC547A/548A 125 220 260
BC546B/547B/548B 240 330 500
BC547C/548C 450 600 900
Noise Figure NF dB
(IC = 0.2 mA, VCE = 5.0 V, RS = 2 kW, BC546 — 2.0 10
f = 1.0 kHz, ∆f = 200 Hz) BC547 — 2.0 10
BC548 — 2.0 10
Note 1: IB is value for which IC = 11 mA at VCE = 1.0 V.
2.0 1.0
VCE = 10 V TA = 25°C
hFE , NORMALIZED DC CURRENT GAIN
1.5 0.9
TA = 25°C
0.8 VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
1.0 0.7
0.8 0.6 VBE(on) @ VCE = 10 V
0.6 0.5
0.4
0.4 0.3
0.3 0.2
VCE(sat) @ IC/IB = 10
0.1
0.2 0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
2.0 1.0
VCE , COLLECTOR–EMITTER VOLTAGE (V)
0.4
2.8
0
0.02 0.1 1.0 10 20 0.2 1.0 10 100
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
BC547/BC548
f T, CURRENT–GAIN – BANDWIDTH PRODUCT (MHz)
10 400
300
7.0 TA = 25°C
200
C, CAPACITANCE (pF)
5.0 Cib
VCE = 10 V
100
3.0 TA = 25°C
80
Cob
60
2.0
40
30
1.0 20
0.4 0.6 0.8 1.0 2.0 4.0 6.0 8.0 10 20 40 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mAdc)
BC547/BC548
TA = 25°C
VCE = 5 V
TA = 25°C 0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
2.0
0.6
VBE @ VCE = 5.0 V
1.0
0.4
0.5
0.2
0.2
VCE(sat) @ IC/IB = 10
0
0.1 0.2 1.0 10 100 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0 –1.0
0.4 –2.6
0 –3.0
0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
BC546
40
f T, CURRENT–GAIN – BANDWIDTH PRODUCT
TA = 25°C VCE = 5 V
500 TA = 25°C
20
C, CAPACITANCE (pF)
Cib
200
10
100
6.0 50
4.0 Cob
20
2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 1.0 5.0 10 50 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
2
BASE
3
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol BC549 BC550 Unit
Collector – Emitter Voltage VCEO 30 45 Vdc CASE 29–04, STYLE 17
TO–92 (TO–226AA)
Collector – Base Voltage VCBO 30 50 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 100 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watt
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 10 mAdc, IB = 0) BC549B,C 30 — —
BC550B,C 45 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 10 µAdc, IE = 0) BC549B,C 30 — —
BC550B,C 50 — —
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO
(VCB = 30 V, IE = 0) — — 15 nAdc
(VCB = 30 V, IE = 0, TA = +125°C) — — 5.0 µAdc
Emitter Cutoff Current IEBO — — 15 nAdc
(VEB = 4.0 Vdc, IC = 0)
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 10 µAdc, VCE = 5.0 Vdc) BC549B/550B 100 150 —
BC549C/550C 100 270 —
(IC = 2.0 mAdc, VCE = 5.0 Vdc) BC549B/550B 200 290 450
BC549C/550C 420 500 800
Collector – Emitter Saturation Voltage VCE(sat) Vdc
(IC = 10 mAdc, IB = 0.5 mAdc) — 0.075 0.25
(IC = 10 mAdc, IB = see note 1) — 0.3 0.6
(IC = 100 mAdc, IB = 5.0 mAdc, see note 2) — 0.25 0.6
Base–Emitter Saturation Voltage VBE(sat) — 1.1 — Vdc
(IC = 100 mAdc, IB = 5.0 mAdc)
Base–Emitter On Voltage VBE(on) Vdc
(IC = 10 µAdc, VCE = 5.0 Vdc) — 0.52 —
(IC = 100 µAdc, VCE = 5.0 Vdc) — 0.55 —
(IC = 2.0 mAdc, VCE = 5.0 Vdc) 0.55 0.62 0.7
SMALL–SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product fT — 250 — MHz
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
Collector–Base Capacitance Ccbo — 2.5 — pF
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Small–Signal Current Gain hfe —
(IC = 2.0 mAdc, VCE = 5.0 V, f = 1.0 kHz) BC549B/BC550B 240 330 500
BC549C/BC550C 450 600 900
Noise Figure dB
(IC = 200 µAdc, VCE = 5.0 Vdc, RS = 2.0 kΩ, f = 1.0 kHz) NF1 — 0.6 2.5
(IC = 200 µAdc, VCE = 5.0 Vdc, RS = 100 kΩ, f = 1.0 kHz) NF2 — — 10
NOTES:
1. IB is value for which IC = 11 mA at VCE = 1.0 V.
2. Pulse test = 300 µs – Duty cycle = 2%.
RS
in
en
IDEAL
TRANSISTOR
2.0 1.0
VCE = 10 V TA = 25°C
hFE, NORMALIZED DC CURRENT GAIN
1.5 0.9
TA = 25°C
0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
1.0 0.7
VBE(on) @ VCE = 10 V
0.8 0.6
0.6 0.5
0.4
0.4 0.3
0.3 0.2
VCE(sat) @ IC/IB = 10
0.1
0.2 0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
10
400
300
7.0
200 TA = 25°C
C, CAPACITANCE (pF)
5.0 Cib
100
80 VCE = 10 V
TA = 25°C 3.0
60
Cob
40
30 2.0
20
1.0
0.5 0.7 1.0 2.0 5.0 7.0 10 20 50 0.4 0.6 1.0 2.0 4.0 10 20 40
IC, COLLECTOR CURRENT (mAdc) VR, REVERSE VOLTAGE (VOLTS)
170
r b, BASE SPREADING RESISTANCE (OHMS)
160
150
VCE = 10 V
f = 1.0 kHz
140
TA = 25°C
130
120
0.1 0.2 0.5 1.0 2.0 5.0 10
IC, COLLECTOR CURRENT (mAdc)
Amplifier Transistors
PNP Silicon BC556,B
BC557,A,B,C
COLLECTOR BC558B
1
2
BASE
3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol BC556 BC557 BC558 Unit 2
3
Collector – Emitter Voltage VCEO –65 –45 –30 Vdc
CASE 29–04, STYLE 17
Collector – Base Voltage VCBO –80 –50 –30 Vdc
TO–92 (TO–226AA)
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –100 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watt
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO V
(IC = –2.0 mAdc, IB = 0) BC556 –65 — —
BC557 –45 — —
BC558 –30 — —
Collector – Base Breakdown Voltage V(BR)CBO V
(IC = –100 µAdc) BC556 –80 — —
BC557 –50 — —
BC558 –30 — —
Emitter – Base Breakdown Voltage V(BR)EBO V
(IE = –100 mAdc, IC = 0) BC556 –5.0 — —
BC557 –5.0 — —
BC558 –5.0 — —
Collector–Emitter Leakage Current ICES
(VCES = –40 V) BC556 — –2.0 –100 nA
(VCES = –20 V) BC557 — –2.0 –100
BC558 — –2.0 –100
(VCES = –20 V, TA = 125°C) BC556 — — –4.0 µA
BC557 — — –4.0
BC558 — — –4.0
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = –10 µAdc, VCE = –5.0 V) BC557A — 90 —
BC556B/557B/558B — 150 —
BC557C — 270 —
(IC = –2.0 mAdc, VCE = –5.0 V) BC556 120 — 500
BC557 120 — 800
BC558 120 — 800
BC557A 120 170 220
BC556B/557B/558B 180 290 460
BC557C 420 500 800
(IC = –100 mAdc, VCE = –5.0 V) BC557A — 120 —
BC556B/557B/558B — 180 —
BC557C — 300 —
Collector – Emitter Saturation Voltage VCE(sat) V
(IC = –10 mAdc, IB = –0.5 mAdc) — –0.075 –0.3
(IC = –10 mAdc, IB = see Note 1) — –0.3 –0.6
(IC = –100 mAdc, IB = –5.0 mAdc) — –0.25 –0.65
Base – Emitter Saturation Voltage VBE(sat) V
(IC = –10 mAdc, IB = –0.5 mAdc) — –0.7 —
(IC = –100 mAdc, IB = –5.0 mAdc) — –1.0 —
Base–Emitter On Voltage VBE(on) V
(IC = –2.0 mAdc, VCE = –5.0 Vdc) –0.55 –0.62 –0.7
(IC = –10 mAdc, VCE = –5.0 Vdc) — –0.7 –0.82
SMALL–SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product fT MHz
(IC = –10 mA, VCE = –5.0 V, f = 100 MHz) BC556 — 280 —
BC557 — 320 —
BC558 — 360 —
Output Capacitance Cob — 3.0 6.0 pF
(VCB = –10 V, IC = 0, f = 1.0 MHz)
Noise Figure NF dB
(IC = –0.2 mAdc, VCE = –5.0 V, BC556 — 2.0 10
RS = 2.0 kW, f = 1.0 kHz, ∆f = 200 Hz) BC557 — 2.0 10
BC558 — 2.0 10
Small–Signal Current Gain hfe —
(IC = –2.0 mAdc, VCE = –5.0 V, f = 1.0 kHz) BC556 125 — 500
BC557/558 125 — 900
BC557A 125 220 260
BC556B/557B/558B 240 330 500
BC557C 450 600 900
Note 1: IC = –10 mAdc on the constant base current characteristics, which yields the point IC = –11 mAdc, VCE = –1.0 V.
BC557/BC558
2.0 –1.0
TA = 25°C
hFE , NORMALIZED DC CURRENT GAIN
V, VOLTAGE (VOLTS)
1.0 –0.7
–0.6 VBE(on) @ VCE = –10 V
0.7
–0.5
0.5 –0.4
–0.3
0.3 –0.2
–0.1 VCE(sat) @ IC/IB = 10
0.2 0
–0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
–2.0 1.0
1.6
–1.2
2.0
IC = IC = –50 mA IC = –200 mA
–0.8
–10 mA
2.4
IC = –100 mA
IC = –20 mA
–0.4
2.8
0
–0.02 –0.1 –1.0 –10 –20 –0.2 –1.0 –10 –100
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
10 400
Cib 300
7.0
TA = 25°C 200
C, CAPACITANCE (pF)
1.0 20
–0.4 –0.6 –1.0 –2.0 –4.0 –6.0 –10 –20 –30 –40 –0.5 –1.0 –2.0 –3.0 –5.0 –10 –20 –30 –50
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mAdc)
BC556
–1.0
hFE , DC CURRENT GAIN (NORMALIZED)
TJ = 25°C
VCE = –5.0 V
TA = 25°C –0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
2.0
–0.6
VBE @ VCE = –5.0 V
1.0
–0.4
0.5
–0.2
0.2 VCE(sat) @ IC/IB = 10
0
–0.1 –0.2 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200
IC, COLLECTOR CURRENT (AMP) IC, COLLECTOR CURRENT (mA)
–2.0 –1.0
–0.4 –2.6
TJ = 25°C
0 –3.0
–0.02 –0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
40
f T, CURRENT–GAIN – BANDWIDTH PRODUCT
VCE = –5.0 V
TJ = 25°C 500
20 Cib
C, CAPACITANCE (pF)
200
10 100
8.0
6.0 50
Cob
4.0
20
2.0
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –1.0 –10 –100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1.0
0.7
D = 0.5
0.5
RESISTANCE (NORMALIZED) 0.2
r(t), TRANSIENT THERMAL
0.3
0.2 SINGLE PULSE
0.05
0.1 ZθJC(t) = (t) RθJC
0.1 P(pk) RθJC = 83.3°C/W MAX
0.07 SINGLE PULSE ZθJA(t) = r(t) RθJA
0.05 t1 RθJA = 200°C/W MAX
D CURVES APPLY FOR POWER
0.03 t2 PULSE TRAIN SHOWN
0.02 DUTY CYCLE, D = t1/t2 READ TIME AT t1
TJ(pk) – TC = P(pk) RθJC(t)
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
–200
1s 3 ms
IC, COLLECTOR CURRENT (mA)
–100
The safe operating area curves indicate IC–VCE limits of the
TA = 25°C TJ = 25°C transistor that must be observed for reliable operation. Collector load
–50
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 14 is based upon TJ(pk) = 150°C; TC or TA is
BC558 variable depending upon conditions. Pulse curves are valid for duty
–10
BC557 cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
BC556 the data in Figure 13. At high case or ambient temperatures, thermal
–5.0 limitations will reduce the power than can be handled to values less
BONDING WIRE LIMIT
than the limitations imposed by second breakdown.
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
–2.0
–1.0 –5.0 –10 –30 –45 –65 –100
VCE, COLLECTOR–EMITTER VOLTAGE (V)
COLLECTOR
1
BC560C
2
BASE
3
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol BC559x BC560C Unit
Collector – Emitter Voltage VCEO –30 –45 Vdc CASE 29–04, STYLE 17
TO–92 (TO–226AA)
Collector – Base Voltage VCBO –30 –50 Vdc
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –100 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watt
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = –10 mAdc, IB = 0) BC559B, C –30 — —
BC560C –45 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = –10 µAdc, IE = 0) BC559B, C –30 — —
BC560C –50 — —
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICBO
(VCB = –30 Vdc, IE = 0) — — –15 nAdc
(VCB = –30 Vdc, IE = 0, TA = +125°C) — — –5.0 µAdc
Emitter Cutoff Current IEBO — — –15 nAdc
(VEB = –4.0 Vdc, IC = 0)
replaces BC559/D
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = –10 µAdc, VCE = –5.0 Vdc) BC559B 100 150 —
BC559C/560C 100 270 —
(IC = –2.0 mAdc, VCE = –5.0 Vdc) BC559B 180 290 460
BC559C/560C 380 500 800
Collector – Emitter Saturation Voltage VCE(sat) Vdc
(IC = –10 mAdc, IB = –0.5 mAdc) — –0.075 –0.25
(IC = –10 mAdc, IB = see note 1) — –0.3 –0.6
(IC = –100 mAdc, IB = –5.0 mAdc, see note 2) — –0.25 —
Base–Emitter Saturation Voltage VBE(sat) — –1.1 — Vdc
(IC = –100 mAdc, IB = –5.0 mAdc)
Base–Emitter On Voltage VBE(on) Vdc
(IC = –10 µAdc, VCE = –5.0 Vdc) — –0.52 —
(IC = –100 µAdc, VCE = –5.0 Vdc) — –0.55 —
(IC = –2.0 mAdc, VCE = –5.0 Vdc) –0.55 –0.62 –0.7
SMALL–SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product fT — 250 — MHz
(IC = –10 mAdc, VCE = –5.0 Vdc, f = 100 MHz)
Collector–Base Capacitance Ccbo — 2.5 — pF
(VCB = –10 Vdc, IE = 0, f = 1.0 MHz)
Small–Signal Current Gain hfe —
(IC = –2.0 mAdc, VCE = –5.0 V, f = 1.0 kHz) BC559B 240 330 500
BC559C/BC560C 450 600 900
Noise Figure dB
(IC = –200 µAdc, VCE = –5.0 Vdc, RS = 2.0 kΩ, f = 1.0 kHz) NF1 — 0.5 2.0
(IC = –200 µAdc, VCE = –5.0 Vdc, RS = 100 kΩ, f = 1.0 kHz, ∆f = 200 kHz) NF2 — — 10
NOTES:
1. IB is value for which IC = –11 mA at VCE = –1.0 V.
2. Pulse test = 300 µs – Duty cycle = 2%.
V, VOLTAGE (VOLTS)
1.0 –0.7
VBE(on) @ VCE = –10 V
0.8 –0.6
0.6 –0.5
–0.4
0.4 –0.3
0.3 –0.2
VCE(sat) @ IC/IB = 10
–0.1
0.2 0
–0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
10
400
300
7.0
200 TA = 25°C
C, CAPACITANCE (pF)
5.0 Cib
100
80 VCE = –10 V
60 3.0
TA = 25°C
Cob
40
30 2.0
20
1.0
–0.5 –0.7 –1.0 –2.0 –5.0 –7.0 –10 –20 –50 –0.4 –0.6 –1.0 –2.0 –4.0 –10 –20 –40
IC, COLLECTOR CURRENT (mAdc) VR, REVERSE VOLTAGE (VOLTS)
170
r b, BASE SPREADING RESISTANCE (OHMS)
160
150
VCE = –10 V
f = 1.0 kHz
140
TA = 25°C
130
120
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10
IC, COLLECTOR CURRENT (mAdc)
Darlington Transistors
NPN Silicon
BC618
COLLECTOR 1
BASE
2
EMITTER 3
1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 29–04, STYLE 17
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 55 Vdc
Collector – Base Voltage VCBO 80 Vdc
Emitter – Base Voltage VEBO 12 Vdc
Collector Current — Continuous IC 1.0 Adc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO 55 — — Vdc
(IC = 10 mAdc, VBE = 0)
Collector – Base Breakdown Voltage V(BR)CBO 80 — — Vdc
(IC = 100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 12 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICES — — 50 nAdc
(VCE = 60 Vdc, VBE = 0)
Collector Cutoff Current ICBO — — 50 nAdc
(VCB = 60 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — 50 nAdc
(VEB = 10 Vdc, IC = 0)
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product fT 150 — — MHz
(IC = 500 mA, VCE = 5.0 Vdc, P = 100 MHz)
Output Capacitance Cob — 4.5 7.0 pF
(VCB = 10 V, IE = 0, f = 1.0 MHz)
Input Capacitance Cib — 5.0 9.0 pF
(VEB = 5.0 V, IE = 0, f = 1.0 MHz)
RS
in
en
IDEAL
TRANSISTOR
500 2.0
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
RS ≈ 0 1.0
200
0.7
en, NOISE VOLTAGE (nV)
100 µA 100 µA
0.1
20
0.07
IC = 1.0 mA 10 µA
0.05
10
0.03
5.0 0.02
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
200 14
VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)
10
70 IC = 10 µA 10 µA
8.0
50
100 µA
6.0
30 100 µA
4.0 IC = 1.0 mA
20
1.0 mA
2.0
10 0
1.0 2.0 5.0 10 20 50 100 200 500 100 1.0 2.0 5.0 10 20 50 100 200 500 100
RS, SOURCE RESISTANCE (kΩ) 0 RS, SOURCE RESISTANCE (kΩ) 0
20 4.0
VCE = 5.0 V
7.0 Cibo
1.0
5.0 Cobo 0.8
0.6
3.0 0.4
2.0 0.2
0.04 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 0.5 1.0 2.0 0.5 10 20 50 100 200 500
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
50 k 25°C
30 k 2.0
20 k
1.5
10 k
7.0 k
– 55°C
5.0 k 1.0
VCE = 5.0 V
3.0 k
2.0 k 0.5
5.0 7.0 10 20 30 50 70 100 200 300 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
1.6 – 1.0
RθV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 – 6.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
1.0 k
FIGURE A
700 1.0 ms
500
IC, COLLECTOR CURRENT (mA)
tP
300 TC = 25°C 100 µs
TA = 25°C PP PP
200 1.0 s
100
70
50
t1
30
CURRENT LIMIT
20 THERMAL LIMIT 1/f
+ t1 f + ttP1
SECOND BREAKDOWN LIMIT
10 DUTY CYCLE
0.4 0.6 1.0 2.0 4.0 6.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS) PEAK PULSE POWER = PP
Figure 13. Active Region Safe Operating Area Design Note: Use of Transient Thermal Resistance Data
3
BASE
1
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol BC635 BC637 BC639 Unit
Collector – Emitter Voltage VCEO 45 60 80 Vdc CASE 29–04, STYLE 14
TO–92 (TO–226AA)
Collector – Base Voltage VCBO 45 60 80 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 0.5 Adc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watt
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 10 mAdc, IB = 0) BC635 45 — —
BC637 60 — —
BC639 80 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 µAdc, IE = 0) BC635 45 — —
BC637 60 — —
BC639 80 — —
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO
(VCB = 30 Vdc, IE = 0) — — 100 nAdc
(VCB = 30 Vdc, IE = 0, TA = 125°C) — — 10 µAdc
ON CHARACTERISTICS(1)
DC Current Gain hFE —
(IC = 5.0 mAdc, VCE = 2.0 Vdc) 25 — —
(IC = 150 mAdc, VCE = 2.0 Vdc) BC635 40 — 250
BC637 40 — 160
BC639 40 — 160
(IC = 500 mA, VCE = 2.0 V) 25 — —
Collector – Emitter Saturation Voltage VCE(sat) — — 0.5 Vdc
(IC = 500 mAdc, IB = 50 mAdc)
Base–Emitter On Voltage VBE(on) — — 1.0 Vdc
(IC = 500 mAdc, VCE = 2.0 Vdc)
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product fT — 200 — MHz
(IC = 50 mAdc, VCE = 2.0 Vdc, f = 100 MHz)
Output Capacitance Cob — 7.0 — pF
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance Cib — 50 — pF
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
200 PD TA 25°C
50 PD TC 25°C
100
20
10
50
5
BC635
PD TA 25°C
2 BC637
PD TC 25°C
BC639
1 20
1 2 3 4 5 7 10 20 30 40 50 70 100 1 3 5 10 30 50 100 300 500 1000
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
500 1
300
0.8 VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
VBE(on) @ VCE = 2 V
0.6
VCE = 2 V
100
0.4
50
0.2
VCE(sat) @ IC/IB = 10
20 0
1 10 100 1000 1 10 100 1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–0.2
θV, TEMPERATURE COEFFICIENTS (mV/°C)
–1.0
VCE = 2 VOLTS
∆T = 0°C to +100°C
–1.6
θV for VBE
–2.2
1 3 5 10 30 50 100 300 500 1000
IC, COLLECTOR CURRENT (mA)
1
EMITTER
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage* V(BR)CEO Vdc
(IC = –10 mAdc, IB = 0) BC636 –45 — —
BC638 –60 — —
BC640 –80 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = –100 µAdc, IE = 0) BC636 –45 — —
BC638 –60 — —
BC640 –80 — —
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICBO
(VCB = –30 Vdc, IE = 0) — — –100 nAdc
(VCB = –30 Vdc, IE = 0, TA = 125°C) — — –10 µAdc
ON CHARACTERISTICS(1)
DC Current Gain hFE —
(IC = –5.0 mAdc, VCE = –2.0 Vdc) 25 — —
(IC = –150 mAdc, VCE = –2.0 Vdc) BC636 40 — 250
BC638 40 — 160
BC640 40 — 160
(IC = –500 mA, VCE = –2.0 V) 25 — —
Collector – Emitter Saturation Voltage VCE(sat) — –0.25 –0.5 Vdc
(IC = –500 mAdc, IB = –50 mAdc) — –0.5 —
Base–Emitter On Voltage VBE(on) — — –1.0 Vdc
(IC = –500 mAdc, VCE = –2.0 Vdc)
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product fT — 150 — MHz
(IC = –50 mAdc, VCE = –2.0 Vdc, f = 100 MHz)
Output Capacitance Cob — 9.0 — pF
(VCB = –10 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance Cib — 110 — pF
(VEB = –0.5 Vdc, IC = 0, f = 1.0 MHz)
500 –1
300
–0.8 VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
–0.6 VBE(on) @ VCE = –2 V
VCE = –2 V
100
–0.4
50
–0.2
VCE(sat) @ IC/IB = 10
20 0
–1 –10 –100 –1000 –1 –10 –100 –1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 3. Current Gain Bandwidth Product Figure 4. “Saturation” and “On” Voltages
–0.2
θV, TEMPERATURE COEFFICIENTS (mV/°C)
–1.0
VCE = –2 VOLTS
∆T = 0°C to +100°C
–1.6
θV for VBE
–2.2
–1 –3 –5 –10 –30 –50 –100 –300 –500 –1000
IC, COLLECTOR CURRENT (mA)
1 3
EMITTER
1
2
MAXIMUM RATINGS
CASE 318 – 08, STYLE 6
Rating Symbol Value Unit
SOT– 23 (TO – 236AB)
Collector – Emitter Voltage VCEO –45 V
Collector – Base Voltage VCBO –50 V
Emitter – Base Voltage VEBO –5.0 V
Collector Current — Continuous IC –500 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board, (1) PD
TA = 25°C 225 mW
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD
Alumina Substrate, (2) TA = 25°C 300 mW
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BC807–16LT1 = 5A; BC807–25LT1 = 5B; BC807–40LT1 = 5C
REV 1
2 3
EMITTER
1
2
MAXIMUM RATINGS
CASE 318 – 08, STYLE 6
Rating Symbol Value Unit
SOT– 23 (TO – 236AB)
Collector – Emitter Voltage VCEO 45 V
Collector – Base Voltage VCBO 50 V
Emitter – Base Voltage VEBO 5.0 V
Collector Current — Continuous IC 500 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board, (1) PD
TA = 25°C 225 mW
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD
Alumina Substrate, (2) TA = 25°C 300 mW
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BC817–16LT1 = 6A; BC817–25LT1 = 6B; BC817–40LT1 = 6C
REV 2
MAXIMUM RATINGS
BC847 BC848
Rating Symbol BC846 BC850 BC849 Unit
3
Collector – Emitter Voltage VCEO 65 45 30 V
Collector – Base Voltage VCBO 80 50 30 V 1
Emitter – Base Voltage VEBO 6.0 6.0 5.0 V 2
DEVICE MARKING
BC846ALT1 = 1A; BC846BLT1 = 1B; BC847ALT1 = 1E; BC847BLT1 = 1F;
BC847CLT1 = 1G; BC848ALT1 = 1J; BC848BLT1 = 1K; BC848CLT1 = 1L
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage BC846A,B V(BR)CEO 65 — — V
(IC = 10 mA) BC847A,B,C, BC850B,C 45 — —
BC848A,B,C, BC849B,C 30 — —
Collector – Emitter Breakdown Voltage BC846A,B V(BR)CES 80 — — V
(IC = 10 µA, VEB = 0) BC847A,B,C, BC850B,C 50 — —
BC848A,B,C, BC849B,C 30 — —
Collector – Base Breakdown Voltage BC846A,B V(BR)CBO 80 — — V
(IC = 10 mA) BC847A,B,C, BC850B,C 50 — —
BC848A,B,C, BC849B,C 30 — —
Emitter – Base Breakdown Voltage BC846A,B V(BR)EBO 6.0 — — V
(IE = 1.0 mA) BC847A,B,C 6.0 — —
BC848A,B,C, BC849B,C, BC850B,C 5.0 — —
Collector Cutoff Current (VCB = 30 V) ICBO — — 15 nA
(VCB = 30 V, TA = 150°C) — — 5.0 µA
1. FR–5 = 1.0 x 0.75 x 0.062 in 2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
(IC = 2.0 mA, VCE = 5.0 V) BC846A, BC847A, BC848A 110 180 220
BC846B, BC847B, BC848B, BC849B, BC850B 200 290 450
BC847C, BC848C, BC849C, BC850C 420 520 800
Collector – Emitter Saturation Voltage (IC = 10 mA, IB = 0.5 mA) VCE(sat) — — 0.25 V
Collector – Emitter Saturation Voltage (IC = 100 mA, IB = 5.0 mA) — — 0.6
Base – Emitter Saturation Voltage (IC = 10 mA, IB = 0.5 mA) VBE(sat) — 0.7 — V
Base – Emitter Saturation Voltage (IC = 100 mA, IB = 5.0 mA) — 0.9 —
Base – Emitter Voltage (IC = 2.0 mA, VCE = 5.0 V) VBE(on) 580 660 700 mV
Base – Emitter Voltage (IC = 10 mA, VCE = 5.0 V) — — 770
SMALL– SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product fT 100 — — MHz
(IC = 10 mA, VCE = 5.0 Vdc, f = 100 MHz)
Output Capacitance (VCB = 10 V, f = 1.0 MHz) Cobo — — 4.5 pF
Noise Figure (IC = 0.2 mA, BC846A, BC847A, BC848A NF dB
VCE = 5.0 Vdc, RS = 2.0 kΩ, BC846B, BC847B, BC848B
f = 1.0 kHz, BW = 200 Hz) BC847C, BC848C — — 10
BC849B,C, BC850B,C — — 4.0
2.0 1.0
VCE = 10 V TA = 25°C
hFE , NORMALIZED DC CURRENT GAIN
1.5 0.9
TA = 25°C
0.8 VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
1.0 0.7
0.8 0.6 VBE(on) @ VCE = 10 V
0.6 0.5
0.4
0.4 0.3
0.3 0.2
VCE(sat) @ IC/IB = 10
0.1
0.2 0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
2.0 1.0
VCE , COLLECTOR–EMITTER VOLTAGE (V)
0.4
2.8
0
0.02 0.1 1.0 10 20 0.2 1.0 10 100
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
BC847/BC848
5.0 Cib
VCE = 10 V
100
3.0 TA = 25°C
80
Cob
60
2.0
40
30
1.0 20
0.4 0.6 0.8 1.0 2.0 4.0 6.0 8.0 10 20 40 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mAdc)
1.0
hFE , DC CURRENT GAIN (NORMALIZED)
TA = 25°C
VCE = 5 V
TA = 25°C 0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
2.0
0.6
VBE @ VCE = 5.0 V
1.0
0.4
0.5
0.2
0.2
VCE(sat) @ IC/IB = 10
0
0.1 0.2 1.0 10 100 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0 –1.0
θVB, TEMPERATURE COEFFICIENT (mV/ °C)
TA = 25°C
1.6 –1.4
20 mA 50 mA 100 mA 200 mA
1.2 –1.8
θVB for VBE
IC = –55°C to 125°C
0.8 –2.2
10 mA
0.4 –2.6
0 –3.0
0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
BC846
40
Cib
200
10
100
6.0 50
4.0 Cob
20
2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 1.0 5.0 10 50 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
2
EMITTER
MAXIMUM RATINGS
3
Rating Symbol BC846 BC847 BC848 Unit
Collector – Emitter Voltage VCEO 65 45 30 V 1
2
Collector – Base Voltage VCBO 80 50 30 V
Emitter – Base Voltage VEBO 6.0 6.0 5.0 V CASE 419–02, STYLE 3
SOT–323/SC–70
Collector Current — Continuous IC 100 100 100 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board, (1) PD 150 mW
TA = 25°C
Thermal Resistance, Junction to Ambient RqJA 833 °C/W
Total Device Dissipation PD 2.4 mW/°C
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BC846AWT1 = 1A; BC846BWT1 = 1B; BC847AWT1 = 1E; BC847BWT1 = 1F;
BC847CWT1 = 1G; BC848AWT1 = 1J; BC848BWT1 = 1K; BC848CWT1 = 1L
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage BC846 Series V(BR)CEO 65 — — V
(IC = 10 mA) BC847 Series 45 — —
BC848 Series 30 — —
Collector – Emitter Breakdown Voltage BC846 Series V(BR)CES 80 — — V
(IC = 10 µA, VEB = 0) BC847 Series 50 — —
BC848 Series 30 — —
Collector – Base Breakdown Voltage BC846 Series V(BR)CBO 80 — — V
(IC = 10 mA) BC847 Series 50 — —
BC848 Series 30 — —
Emitter – Base Breakdown Voltage BC846 Series V(BR)EBO 6.0 — — V
(IE = 1.0 mA) BC847 Series 6.0 — —
BC848 Series 5.0 — —
Collector Cutoff Current (VCB = 30 V) ICBO — — 15 nA
(VCB = 30 V, TA = 150°C) — — 5.0 µA
1. FR–5 = 1.0 x 0.75 x 0.062 in
(IC = 2.0 mA, VCE = 5.0 V) BC846A, BC847A, BC848A 110 180 220
BC846B, BC847B, BC848B 200 290 450
BC847C, BC848C 420 520 800
Collector – Emitter Saturation Voltage (IC = 10 mA, IB = 0.5 mA) VCE(sat) — — 0.25 V
Collector – Emitter Saturation Voltage (IC = 100 mA, IB = 5.0 mA) — — 0.6
Base – Emitter Saturation Voltage (IC = 10 mA, IB = 0.5 mA) VBE(sat) — 0.7 — V
Base – Emitter Saturation Voltage (IC = 100 mA, IB = 5.0 mA) — 0.9 —
Base – Emitter Voltage (IC = 2.0 mA, VCE = 5.0 V) VBE(on) 580 660 700 mV
Base – Emitter Voltage (IC = 10 mA, VCE = 5.0 V) — — 770
SMALL– SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product fT 100 — — MHz
(IC = 10 mA, VCE = 5.0 Vdc, f = 100 MHz)
Output Capacitance (VCB = 10 V, f = 1.0 MHz) Cobo — — 4.5 pF
Noise Figure (IC = 0.2 mA, BC846A, BC847A, BC848A NF dB
VCE = 5.0 Vdc, RS = 2.0 kΩ, BC846B, BC847B, BC848B — — 10
f = 1.0 kHz, BW = 200 Hz) BC847C, BC848C — — 4.0
2.0 1.0
VCE = 10 V TA = 25°C
hFE , NORMALIZED DC CURRENT GAIN
1.5 0.9
TA = 25°C
0.8 VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
1.0 0.7
0.8 0.6 VBE(on) @ VCE = 10 V
0.6 0.5
0.4
0.4 0.3
0.3 0.2
VCE(sat) @ IC/IB = 10
0.1
0.2 0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
2.0 1.0
VCE , COLLECTOR–EMITTER VOLTAGE (V)
0.4
2.8
0
0.02 0.1 1.0 10 20 0.2 1.0 10 100
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
BC847/BC848
5.0 Cib
VCE = 10 V
100
3.0 TA = 25°C
80
Cob
60
2.0
40
30
1.0 20
0.4 0.6 0.8 1.0 2.0 4.0 6.0 8.0 10 20 40 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mAdc)
1.0
hFE , DC CURRENT GAIN (NORMALIZED)
TA = 25°C
VCE = 5 V
TA = 25°C 0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
2.0
0.6
VBE @ VCE = 5.0 V
1.0
0.4
0.5
0.2
0.2
VCE(sat) @ IC/IB = 10
0
0.1 0.2 1.0 10 100 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0 –1.0
θVB, TEMPERATURE COEFFICIENT (mV/ °C)
TA = 25°C
1.6 –1.4
20 mA 50 mA 100 mA 200 mA
1.2 –1.8
θVB for VBE
IC = –55°C to 125°C
0.8 –2.2
10 mA
0.4 –2.6
0 –3.0
0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
BC846
40
Cib
200
10
100
6.0 50
4.0 Cob
20
2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 1.0 5.0 10 50 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
DEVICE MARKING
BC856ALT1 = 3A; BC856BLT1 = 3B; BC857ALT1 = 3E; BC857BLT1 = 3F;
BC858ALT1 = 3J; BC858BLT1 = 3K; BC858CLT1 = 3L
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage BC856 Series V(BR)CEO –65 — — V
(IC = –10 mA) BC857 Series –45 — —
BC858 Series –30 — —
Collector – Emitter Breakdown Voltage BC856 Series V(BR)CES –80 — — V
(IC = –10 µA, VEB = 0) BC857 Series –50 — —
BC858 Series –30 — —
Collector – Base Breakdown Voltage BC856 Series V(BR)CBO –80 — — V
(IC = –10 mA) BC857 Series –50 — —
BC858 Series –30 — —
Emitter – Base Breakdown Voltage BC856 Series V(BR)EBO –5.0 — — V
(IE = –1.0 mA) BC857 Series –5.0 — —
BC858 Series –5.0 — —
Collector Cutoff Current (VCB = –30 V) ICBO — — –15 nA
Collector Cutoff Current (VCB = –30 V, TA = 150°C) — — –4.0 µA
1. FR–5 = 1.0 x 0.75 x 0.062 in 2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
(IC = –2.0 mA, VCE = –5.0 V) BC856A, BC857A, BC858A 125 180 250
BC856B, BC857B, BC858B 220 290 475
BC858C 420 520 800
Collector – Emitter Saturation Voltage VCE(sat) V
(IC = –10 mA, IB = –0.5 mA) — — –0.3
(IC = –100 mA, IB = –5.0 mA) — — –0.65
Base – Emitter Saturation Voltage VBE(sat) V
(IC = –10 mA, IB = –0.5 mA) — –0.7 —
(IC = –100 mA, IB = –5.0 mA) — –0.9 —
Base – Emitter On Voltage VBE(on) V
(IC = –2.0 mA, VCE = –5.0 V) –0.6 — –0.75
(IC = –10 mA, VCE = –5.0 V) — — –0.82
SMALL– SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product fT 100 — — MHz
(IC = –10 mA, VCE = –5.0 Vdc, f = 100 MHz)
Output Capacitance Cob — — 4.5 pF
(VCB = –10 V, f = 1.0 MHz)
Noise Figure NF — — 10 dB
(IC = –0.2 mA, VCE = –5.0 Vdc, RS = 2.0 kΩ, f = 1.0 kHz, BW = 200 Hz)
BC857/BC858
2.0 –1.0
TA = 25°C
hFE , NORMALIZED DC CURRENT GAIN
V, VOLTAGE (VOLTS)
1.0 –0.7
–0.6 VBE(on) @ VCE = –10 V
0.7
–0.5
0.5 –0.4
–0.3
0.3 –0.2
–0.1 VCE(sat) @ IC/IB = 10
0.2 0
–0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
–2.0 1.0
1.6
–1.2
2.0
IC = IC = –50 mA IC = –200 mA
–0.8
–10 mA
2.4
IC = –100 mA
IC = –20 mA
–0.4
2.8
0
–0.02 –0.1 –1.0 –10 –20 –0.2 –1.0 –10 –100
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
10 400
Cib 300
7.0
TA = 25°C 200
C, CAPACITANCE (pF)
1.0 20
–0.4 –0.6 –1.0 –2.0 –4.0 –6.0 –10 –20 –30 –40 –0.5 –1.0 –2.0 –3.0 –5.0 –10 –20 –30 –50
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mAdc)
BC856
V, VOLTAGE (VOLTS)
2.0
–0.6
VBE @ VCE = –5.0 V
1.0
–0.4
0.5
–0.2
0.2 VCE(sat) @ IC/IB = 10
0
–0.1 –0.2 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200
IC, COLLECTOR CURRENT (AMP) IC, COLLECTOR CURRENT (mA)
–2.0 –1.0
–0.4 –2.6
TJ = 25°C
0 –3.0
–0.02 –0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
40
f T, CURRENT–GAIN – BANDWIDTH PRODUCT
VCE = –5.0 V
TJ = 25°C 500
20 Cib
C, CAPACITANCE (pF)
200
10 100
8.0
6.0 50
Cob
4.0
20
2.0
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –1.0 –10 –100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1.0
0.7
D = 0.5
0.5
RESISTANCE (NORMALIZED)
0.2
r(t), TRANSIENT THERMAL
0.3
0.2 SINGLE PULSE
0.05
0.1 ZθJC(t) = r(t) RθJC
0.1 P(pk) RθJC = 83.3°C/W MAX
0.07 SINGLE PULSE ZθJA(t) = r(t) RθJA
0.05 t1 RθJA = 200°C/W MAX
D CURVES APPLY FOR POWER
0.03 t2 PULSE TRAIN SHOWN
0.02 DUTY CYCLE, D = t1/t2 READ TIME AT t1
TJ(pk) – TC = P(pk) RθJC(t)
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
–200
1s 3 ms
IC, COLLECTOR CURRENT (mA)
–100
The safe operating area curves indicate IC–VCE limits of the
TA = 25°C TJ = 25°C transistor that must be observed for reliable operation. Collector load
–50
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 14 is based upon TJ(pk) = 150°C; TC or TA is
BC558 variable depending upon conditions. Pulse curves are valid for duty
–10
BC557 cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
BC556 the data in Figure 13. At high case or ambient temperatures, thermal
–5.0 limitations will reduce the power that can be handled to values less
BONDING WIRE LIMIT
than the limitations imposed by the secondary breakdown.
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
–2.0
–1.0 –5.0 –10 –30 –45 –65 –100
VCE, COLLECTOR–EMITTER VOLTAGE (V)
1
BASE
3
2
EMITTER
1
MAXIMUM RATINGS 2
Rating Symbol BC856 BC857 BC858 Unit
CASE 419–02, STYLE 3
Collector – Emitter Voltage VCEO –65 –45 –30 V SOT–323/SC–70
Collector – Base Voltage VCBO –80 –50 –30 V
Emitter – Base Voltage VEBO –5.0 –5.0 –5.0 V
Collector Current — Continuous IC –100 –100 –100 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board, (1) PD 150 mW
TA = 25°C
Thermal Resistance, Junction to Ambient RqJA 833 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BC856AWT1 = 3A; BC856BWT1 = 3B; BC857AWT1 = 3E; BC857BWT1 = 3F;
BC858AWT1 = 3J; BC858BWT1 = 3K; BC858CWT1 = 3L
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage BC856 Series V(BR)CEO –65 — — V
(IC = –10 mA) BC857 Series –45 — —
BC858 Series –30 — —
Collector – Emitter Breakdown Voltage BC856 Series V(BR)CES –80 — — V
(IC = –10 µA, VEB = 0) BC857 Series –50 — —
BC858 Series –30 — —
Collector – Base Breakdown Voltage BC856 Series V(BR)CBO –80 — — V
(IC = –10 mA) BC857 Series –50 — —
BC858 Series –30 — —
Emitter – Base Breakdown Voltage BC856 Series V(BR)EBO –5.0 — — V
(IE = –1.0 mA) BC857 Series –5.0 — —
BC858 Series –5.0 — —
Collector Cutoff Current (VCB = –30 V) ICBO — — –15 nA
Collector Cutoff Current (VCB = –30 V, TA = 150°C) — — –4.0 µA
1. FR–5 = 1.0 x 0.75 x 0.062 in
Preferred devices are Motorola recommended choices for future use and best overall value.
(IC = –2.0 mA, VCE = –5.0 V) BC856A, BC857A, BC858A 125 180 250
BC856B, BC857B, BC858B 220 290 475
BC858C 420 520 800
Collector – Emitter Saturation Voltage VCE(sat) V
(IC = –10 mA, IB = –0.5 mA) — — –0.3
(IC = –100 mA, IB = –5.0 mA) — — –0.65
Base – Emitter Saturation Voltage VBE(sat) V
(IC = –10 mA, IB = –0.5 mA) — –0.7 —
(IC = –100 mA, IB = –5.0 mA) — –0.9 —
Base – Emitter On Voltage VBE(on) V
(IC = –2.0 mA, VCE = –5.0 V) –0.6 — –0.75
(IC = –10 mA, VCE = –5.0 V) — — –0.82
SMALL– SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product fT 100 — — MHz
(IC = –10 mA, VCE = –5.0 Vdc, f = 100 MHz)
Output Capacitance Cob — — 4.5 pF
(VCB = –10 V, f = 1.0 MHz)
Noise Figure NF — — 10 dB
(IC = –0.2 mA, VCE = –5.0 Vdc, RS = 2.0 kΩ,
f = 1.0 kHz, BW = 200 Hz)
BC857/BC858
2.0 –1.0
TA = 25°C
hFE , NORMALIZED DC CURRENT GAIN
V, VOLTAGE (VOLTS)
1.0 –0.7
–0.6 VBE(on) @ VCE = –10 V
0.7
–0.5
0.5 –0.4
–0.3
0.3 –0.2
–0.1 VCE(sat) @ IC/IB = 10
0.2 0
–0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
–2.0 1.0
1.6
–1.2
2.0
IC = IC = –50 mA IC = –200 mA
–0.8
–10 mA
2.4
IC = –100 mA
IC = –20 mA
–0.4
2.8
0
–0.02 –0.1 –1.0 –10 –20 –0.2 –1.0 –10 –100
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
10 400
Cib 300
7.0
TA = 25°C 200
C, CAPACITANCE (pF)
1.0 20
–0.4 –0.6 –1.0 –2.0 –4.0 –6.0 –10 –20 –30 –40 –0.5 –1.0 –2.0 –3.0 –5.0 –10 –20 –30 –50
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mAdc)
BC856
–1.0
hFE , DC CURRENT GAIN (NORMALIZED)
TJ = 25°C
VCE = –5.0 V
TA = 25°C –0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
2.0
–0.6
VBE @ VCE = –5.0 V
1.0
–0.4
0.5
–0.2
0.2 VCE(sat) @ IC/IB = 10
0
–0.1 –0.2 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200
IC, COLLECTOR CURRENT (AMP) IC, COLLECTOR CURRENT (mA)
–2.0 –1.0
–0.4 –2.6
TJ = 25°C
0 –3.0
–0.02 –0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
40
f T, CURRENT–GAIN – BANDWIDTH PRODUCT
VCE = –5.0 V
TJ = 25°C 500
20 Cib
C, CAPACITANCE (pF)
200
10 100
8.0
6.0 50
Cob
4.0
20
2.0
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –1.0 –10 –100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1.0
0.7
D = 0.5
0.5
RESISTANCE (NORMALIZED) 0.2
r(t), TRANSIENT THERMAL
0.3
0.2 SINGLE PULSE
0.05
0.1 ZθJC(t) = r(t) RθJC
0.1 P(pk) RθJC = 83.3°C/W MAX
0.07 SINGLE PULSE ZθJA(t) = r(t) RθJA
0.05 t1 RθJA = 200°C/W MAX
D CURVES APPLY FOR POWER
0.03 t2 PULSE TRAIN SHOWN
0.02 DUTY CYCLE, D = t1/t2 READ TIME AT t1
TJ(pk) – TC = P(pk) RθJC(t)
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
–200
1s 3 ms
IC, COLLECTOR CURRENT (mA)
–100
The safe operating area curves indicate IC–VCE limits of the
TA = 25°C TJ = 25°C transistor that must be observed for reliable operation. Collector load
–50
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 14 is based upon TJ(pk) = 150°C; TC or TA is
BC558 variable depending upon conditions. Pulse curves are valid for duty
–10
BC557 cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
BC556 the data in Figure 13. At high case or ambient temperatures, thermal
–5.0 limitations will reduce the power that can be handled to values less
BONDING WIRE LIMIT
than the limitations imposed by the secondary breakdown.
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
–2.0
–1.0 –5.0 –10 –30 –45 –65 –100
VCE, COLLECTOR–EMITTER VOLTAGE (V)
This PNP Silicon Epitaxial transistor is designed for use in audio amplifier
applications. The device is housed in the SOT-223 package which is designed for MEDIUM POWER
medium power surface mount applications. PNP SILICON
HIGH CURRENT
• High Current: 1.5 Amps TRANSISTOR
• NPN Complement is BCP56 SURFACE MOUNT
• The SOT-223 Package can be soldered using wave or reflow. The formed leads
absorb thermal stress during soldering, eliminating the possibility of damage to
the die
4
• Available in 12 mm Tape and Reel COLLECTOR 2,4
Use BCP53T1 to order the 7 inch/1000 unit reel.
Use BCP53T3 to order the 13 inch/4000 unit reel. 1
BASE 2
3
1
CASE 318E-04, STYLE 1
TO-261AA
EMITTER 3
DEVICE MARKING
AH
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance — Junction-to-Ambient (surface mounted) RθJA 83.3 °C/W
Lead Temperature for Soldering, 0.0625″ from case TL 260 °C
Time in Solder Bath 10 Sec
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = – 5.0 mAdc, VCE = – 2.0 Vdc) 25 — —
(IC = –150 mAdc, VCE = – 2.0 Vdc) 40 — 250
(IC = – 500 mAdc, VCE = – 2.0 Vdc) 25 — —
Collector-Emitter Saturation Voltage (IC = – 500 mAdc, IB = – 50 mAdc) VCE(sat) — — – 0.5 Vdc
Base-Emitter On Voltage (IC = – 500 mAdc, VCE = – 2.0 Vdc) VBE(on) — — –1.0 Vdc
DYNAMIC CHARACTERISTICS
Current-Gain — Bandwidth Product fT — 50 — MHz
(IC = –10 mAdc, VCE = – 5.0 Vdc, f = 35 MHz)
500 500
VCE = 2 V
300
hFE , DC CURRENT GAIN
200
VCE = 2 V
100 100
50 50
20 20
1 3 5 10 30 50 100 300 500 1000 1 10 100 1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 1. DC Current Gain Figure 2. Current Gain Bandwidth Product
1 120
110
100
0.8
V(BE)sat @ IC/IB = 10 90
V, VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
V(BE)on @ VCE = 2 V 80
0.6 70 Cib
60
0.4 50
40
30
0.2
20
V(CE)sat @ IC/IB = 10 Cob
10
0 0
1 10 100 1000 0 2 4 6 8 10 12 14 16 18 20
IC, COLLECTOR CURRENT (mA) V, VOLTAGE (VOLTS)
Figure 3. Saturation and “ON” Voltages Figure 4. Capacitances
These NPN Silicon Epitaxial transistors are designed for use in audio amplifier
applications. The device is housed in the SOT-223 package, which is designed for MEDIUM POWER
medium power surface mount applications. NPN SILICON
• High Current: 1.0 Amp HIGH CURRENT
• The SOT-223 package can be soldered using wave or reflow. The formed leads TRANSISTOR
absorb thermal stress during soldering, eliminating the possibility of damage to SURFACE MOUNT
the die
• Available in 12 mm Tape and Reel
Use BCP56T1 to order the 7 inch/1000 unit reel 4
Use BCP56T3 to order the 13 inch/4000 unit reel COLLECTOR 2,4
• PNP Complement is BCP53T1 1
2
3
BASE
1
CASE 318E-04, STYLE 1
TO-261AA
EMITTER 3
DEVICE MARKING
BCP56T1 = BH
BCP56-10T1 = BK
BCP56-16T1 = BL
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance RθJA 83.3 °C/W
Junction-to-Ambient (surface mounted)
Maximum Temperature for Soldering Purposes TL 260 °C
Time in Solder Bath 10 Sec
1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
ON CHARACTERISTICS (2)
DC Current Gain hFE —
(IC = 5.0 mA, VCE = 2.0 V) All Part Types 25 — —
(IC = 150 mA, VCE = 2.0 V) BCP56T1 40 — 250
BCP56-10T1 63 — 160
BCP56-16T1 100 — 250
(IC = 500 mA, VCE = 2.0 V) All Types 25 — —
Collector-Emitter Saturation Voltage VCE(sat) — — 0.5 Vdc
(IC = 500 mAdc, IB = 50 mAdc)
Base-Emitter On Voltage VBE(on) — — 1.0 Vdc
(IC = 500 mAdc, VCE = 2.0 Vdc)
DYNAMIC CHARACTERISTICS
Current-Gain — Bandwidth Product fT — 130 — MHz
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 35 MHz)
1000
TJ = 125°C
hFE, DC CURRENT GAIN
TJ = 25°C
100
TJ = – 55°C
10
1 10 100 1000
IC, COLLECTOR CURRENT (mA)
1000 80
60
TJ = 25°C
C, CAPACITANCE (pF) 40
Cibo
20
100
10
8.0
6.0 Cobo
10 4.0
1.0 10 100 1000 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
1.0 1.0
TJ = 25°C
TJ = 25°C
0.8 0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
0.4 0.4
0.2 0.2
VCE(sat) @ IC/IB = 10
0 0
0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
This NPN Silicon Epitaxial Transistor is designed for use in low voltage, high current MEDIUM POWER
applications. The device is housed in the SOT-223 package, which is designed for NPN SILICON
medium power surface mount applications. HIGH CURRENT
• High Current: IC = 1.0 Amp TRANSISTOR
• The SOT-223 Package can be soldered using wave or reflow. SURFACE MOUNT
• SOT-223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed leads
absorb thermal stress during soldering, eliminating the possibility of damage to 4
the die
• Available in 12 mm Tape and Reel 1
COLLECTOR 2,4 2
Use BCP68T1 to order the 7 inch/1000 unit reel. 3
Use BCP68T3 to order the 13 inch/4000 unit reel.
• The PNP Complement is BCP69T1 BASE CASE 318E-04, STYLE 1
1 TO-261AA
EMITTER 3
DEVICE MARKING
CA
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance — Junction-to-Ambient (surface mounted) RθJA 83.3 °C/W
Maximum Temperature for Soldering Purposes TL 260 °C
Time in Solder Bath 10 Sec
1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
ON CHARACTERISTICS (2)
DC Current Gain hFE —
(IC = 5.0 mAdc, VCE = 10 Vdc) 50 — —
(IC = 500 mAdc, VCE = 1.0 Vdc) 85 — 375
(IC = 1.0 Adc, VCE = 1.0 Vdc) 60 — —
Collector-Emitter Saturation Voltage VCE(sat) — — 0.5 Vdc
(IC = 1.0 Adc, IB = 100 mAdc)
Base-Emitter On Voltage VBE(on) — — 1.0 Vdc
(IC = 1.0 Adc, VCE = 1.0 Vdc)
DYNAMIC CHARACTERISTICS
Current-Gain — Bandwidth Product fT — 60 — MHz
(IC = 10 mAdc, VCE = 5.0 Vdc)
300
200
300
hFE, DC CURRENT GAIN
TJ = 125°C
200
= 25°C
100 100
= – 55°C
70 VCE = 10 V
TJ = 25°C
50 f = 30 MHz
VCE = 1.0 V
10 30
1.0 10 100 1000 10 100 200 1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 80
TJ = 25°C
TJ = 25°C
0.8 VBE(sat) @ IC/IB = 10 70
0.4 50
0.2 40
VCE(sat) @ IC/IB = 10
0 30
1.0 10 100 1000 0 1.0 2.0 3.0 4.0 5.0
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
25 – 0.8
–1.6
RθVB for VBE
15
– 2.0
10
– 2.4
5.0 – 2.8
0 5.0 10 15 20 1.0 10 100 1000
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1.0
TJ = 25°C
VCE , COLLECTOR VOLTAGE (V)
0.8
0.6 = 1000 mA
0.4 I C = 10 mA = 50 mA = 100 mA
0.2
= 500 mA
0
0.01 0.1 1.0 10 100
IB, BASE CURRENT (mA)
This PNP Silicon Epitaxial Transistor is designed for use in low voltage, high current
applications. The device is housed in the SOT-223 package, which is designed for MEDIUM POWER
medium power surface mount applications. PNP SILICON
HIGH CURRENT
• High Current: IC = –1.0 Amp
TRANSISTOR
• The SOT-223 Package can be soldered using wave or reflow. SURFACE MOUNT
• SOT-223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed leads
absorb thermal stress during soldering, eliminating the possibility of damage to
the die. 4
EMITTER 3
DEVICE MARKING
CE
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance — Junction-to-Ambient (surface mounted) RθJA 83.3 °C/W
Lead Temperature for Soldering, 0.0625″ from case TL 260 °C
Time in Solder Bath 10 Sec
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
DYNAMIC CHARACTERISTICS
Current-Gain — Bandwidth Product fT — 60 — MHz
(IC = –10 mAdc, VCE = – 5.0 Vdc)
300
f T , CURRENT GAIN BANDWIDTH PRODUCT (MHz)
200
200
hFE , CURRENT GAIN
100
70 100
VCE = –10 V
50 VCE = –1.0 V 70 TJ = 25°C
TJ = 25°C f = 30 MHz
50
20 30
–10 –100 –1000 –10 –100 –1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–1.0 160
TJ = 25°C
TJ = 25°C
– 0.8 V(BE)sat @ IC/IB = 10
120
V, VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
– 0.6
V(BE)on @ VCE = –1.0 V
80
– 0.4 Cib
40
– 0.2
V(CE)sat @ IC/IB = 10
Cob
0 0
–1.0 –10 –100 –1000 Cob – 5.0 –1.0 –1.5 – 2.0 – 2.5
IC, COLLECTOR CURRENT (mA) Cib –1.0 – 2.0 – 3.0 – 4.0 – 5.0
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Saturation and “ON” Voltages
Figure 4. Capacitances
3
2
EMITTER
1
MAXIMUM RATINGS 2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board (1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RθJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate, (2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RθJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BCW29LT1 = C1; BCW30LT1 = C2
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage V(BR)CEO –32 — Vdc
(IC = –2.0 mAdc, IE = 0)
Collector–Emitter Breakdown Voltage V(BR)CES –32 — Vdc
(IC = –100 µAdc, VEB = 0)
Collector–Base Breakdown Voltage V(BR)CBO –32 — Vdc
(IC = –10 µAdc, IC = 0)
Emitter–Base Breakdown Voltage V(BR)EBO –5.0 — Vdc
(IE = –10 µAdc, IC = 0)
Collector Cutoff Current ICBO
(VCB = –32 Vdc, IE = 0) — –100 nAdc
(VCB = –32 Vdc, IE = 0, TA = 100°C) — –10 µAdc
ON CHARACTERISTICS
DC Current Gain hFE
(IC = –2.0 mAdc, VCE = –5.0 Vdc) BCW29 120 260 —
BCW30 215 500 —
Collector–Emitter Saturation Voltage VCE(sat) Vdc
(IC = –10 mAdc, IB = –0.5 mAdc) — –0.3
Base–Emitter On Voltage VBE(on) Vdc
(IC = –2.0 mAdc, VCE = –5.0 Vdc) –0.6 –0.75
SMALL–SIGNAL CHARACTERISTICS
Output Capacitance Cobo pF
(IE = 0, VCB = –10 Vdc, f = 1.0 MHz) — 7.0
Noise Figure NF dB
(IC = –0.2 mAdc, VCE = –5.0 Vdc, RS = 2.0 kΩ, f = 1.0 kHz, BW = 200 Hz) — 10
10 1.0
BANDWIDTH = 1.0 Hz 7.0 BANDWIDTH = 1.0 Hz
7.0 RS ≈ 0 5.0 RS ≈ ∞
IC = 10 µA IC = 1.0 mA
en, NOISE VOLTAGE (nV)
1.0 M 1.0 M
500 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
200 k 200 k
100 k 100 k
50 k 50 k
20 k 20 k
0.5 dB
10 k 10 k
0.5 dB
5.0 k 1.0 dB 5.0 k
2.0 k 2.0 k 1.0 dB
1.0 k 2.0 dB 1.0 k
2.0 dB
500 3.0 dB 500
3.0 dB
200 5.0 dB 200 5.0 dB
100 100
10 20 30 50 70 100 200 300 500 700 1.0 k 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
1.0 M
500 k 10 Hz to 15.7 kHz
RS , SOURCE RESISTANCE (OHMS)
200 k
100 k
ƪ ƫ
Noise Figure is Defined as:
Figure 5. Wideband
400
TJ = 125°C
25°C
h FE, DC CURRENT GAIN
200
– 55°C
100
80
BCW29LT1
60 VCE = 1.0 V
VCE = 10 V
40
0.003 0.005 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
TA = 25°C TA = 25°C IB = 400 µA
BCW29LT1 PULSE WIDTH = 300 µs
350 µA
150 µA
0.4 40
100 µA
0.2 20 50 µA
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
θV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 0.8
VBE(on) @ VCE = 1.0 V
25°C to 125°C
0.4
1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 1000
VCC = 3.0 V 700 VCC = – 3.0 V
300 IC/IB = 10
IC/IB = 10 500
200 TJ = 25°C IB1 = IB2
ts
300 TJ = 25°C
100 200
t, TIME (ns)
t, TIME (ns)
70
50 100
30 70
tr 50
20 tf
td @ VBE(off) = 0.5 V 30
10 20
7.0
5.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
7.0
300 VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
5.0 V
200
3.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = –10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 BCW29LT1 70
5.0 hfe ≈ 200 50
@ IC = –1.0 mA BCW29LT1
3.0 30
hfe ≈ 200
2.0 20 @ IC = 1.0 mA
1.0 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
as shown in Figure 19. Using the model and the device thermal
ICEO response the normalized effective transient thermal resistance of
102 Figure 17 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 17 by the
101 steady state value RθJA.
ICBO
AND Example:
ICEX @ VBE(off) = 3.0 V The BCW29LT1 is dissipating 2.0 watts peak under the following
100
conditions:
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
10–1 Using Figure 17 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
10–2 The peak rise in junction temperature is therefore
–4 –2 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
0 0 TJ, JUNCTION TEMPERATURE (°C)
For more information, see AN–569.
Figure 18. Typical Collector Leakage Current
1
BASE 3
1
2
2
EMITTER
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BCW33LT1 = D3
+ 3.0 V + 3.0 V
10 < t1 < 500 µs t1
300 ns 275 +10.9 V 275
+10.9 V DUTY CYCLE = 2%
DUTY CYCLE = 2%
10 k 10 k
– 0.5 V 0
<1.0 ns CS < 4.0 pF* CS < 4.0 pF*
– 9.1 V 1N916
< 1.0 ns
20 100
IC = 1.0 mA BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
50
RS = 0 IC = 1.0 mA RS ≈ ∞
300 µA 20 300 µA
en, NOISE VOLTAGE (nV)
2.0 0.1
10 20 50 100 200 500 1 k 2k 5k 10 k 10 20 50 100 200 500 1 k 2k 5k 10 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
500 k 1M
200 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
100 k 200 k
50 k 100 k
20 k 50 k
10 k 20 k
5k 10 k
2.0 dB 1.0 dB
2k 5k
3.0 dB 4.0 dB
1k 2k 2.0 dB
6.0 dB 3.0 dB
500 10 dB
1k
500 5.0 dB
200
100 200 8.0 dB
50 100
10 20 30 50 70 100 200 300 500 700 1k 10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
500 k
10 Hz to 15.7 kHz
200 k
RS , SOURCE RESISTANCE (OHMS)
100 k
50 k
ǒ Ǔ
Noise Figure is defined as:
20 k
10 k NF + 20 log10 en2 ) 4KTRS ) In 2RS2 1ń2
5k 4KTRS
1.0 dB
en = Noise Voltage of the Transistor referred to the input. (Figure 3)
2k 2.0 dB In = Noise Current of the Transistor referred to the input. (Figure 4)
1k 3.0 dB K = Boltzman’s Constant (1.38 x 10–23 j/°K)
500 T = Temperature of the Source Resistance (°K)
5.0 dB
200 RS = Source Resistance (Ohms)
8.0 dB
100
50
10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA)
Figure 7. Wideband
200 µA
0.4 40
100 µA
0.2 20
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
*APPLIES for IC/IB ≤ hFE/2
1.0
*qVC for VCE(sat)
0
0.8 VBE(sat) @ IC/IB = 10 – 55°C to 25°C
0.6 – 0.8
VBE(on) @ VCE = 1.0 V
0.4 25°C to 125°C
– 1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
300 1000
200 VCC = 3.0 V
700
IC/IB = 10 500
TJ = 25°C ts
100 300
70 200
50
t, TIME (ns)
t, TIME (ns)
30 tr 100 tf
20 70
td @ VBE(off) = 0.5 Vdc 50
10 30 VCC = 3.0 V
7.0 IC/IB = 10
20 IB1 = IB2
5.0
TJ = 25°C
3.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
f = 100 MHz 7.0 f = 1.0 MHz
300
VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
200 5.0 V
Cob
3.0
100 2.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
D = 0.5
0.5
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19A
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BCW60ALT1 = AA, BCW60BLT1 = AB, BCW60DLT1 = AD
SWITCHING CHARACTERISTICS
Turn–On Time ton ns
(IC = 10 mAdc, IB1 = 1.0 mAdc) — 150
Turn–Off Time toff ns
(IB2 = 1.0 mAdc, VBB = 3.6 Vdc, R1 = R2 = 5.0 kΩ, RL = 990 Ω) — 800
+ 3.0 V + 3.0 V
10 < t1 < 500 µs t1
300 ns 275 +10.9 V 275
+10.9 V DUTY CYCLE = 2%
DUTY CYCLE = 2%
10 k 10 k
– 0.5 V 0
<1.0 ns CS < 4.0 pF* CS < 4.0 pF*
– 9.1 V 1N916
< 1.0 ns
20 100
IC = 1.0 mA BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
50
RS = 0 IC = 1.0 mA RS ≈ ∞
300 µA 20 300 µA
en, NOISE VOLTAGE (nV)
2.0 0.1
10 20 50 100 200 500 1 k 2k 5k 10 k 10 20 50 100 200 500 1 k 2k 5k 10 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
500 k 1M
200 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
100 k 200 k
50 k 100 k
20 k 50 k
10 k 20 k
5k 10 k
2.0 dB 1.0 dB
2k 5k
3.0 dB 4.0 dB
1k 2k 2.0 dB
6.0 dB 3.0 dB
500 10 dB
1k
500 5.0 dB
200
100 200 8.0 dB
50 100
10 20 30 50 70 100 200 300 500 700 1k 10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
500 k
10 Hz to 15.7 kHz
200 k
RS , SOURCE RESISTANCE (OHMS)
100 k
50 k
ǒ Ǔ
Noise Figure is defined as:
20 k
10 k NF + 20 log10 en2 ) 4KTRS ) In 2RS2 1ń2
5k 4KTRS
1.0 dB
en = Noise Voltage of the Transistor referred to the input. (Figure 3)
2k 2.0 dB In = Noise Current of the Transistor referred to the input. (Figure 4)
1k 3.0 dB K = Boltzman’s Constant (1.38 x 10–23 j/°K)
500 T = Temperature of the Source Resistance (°K)
5.0 dB
200 RS = Source Resistance (Ohms)
8.0 dB
100
50
10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA)
Figure 7. Wideband
400
h FE, DC CURRENT GAIN TJ = 125°C
200 25°C
– 55°C
100
80
60 VCE = 1.0 V
VCE = 10 V
40
0.004 0.006 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
TJ = 25°C TA = 25°C
IB = 500 µA
PULSE WIDTH = 300 µs
200 µA
0.4 40
100 µA
0.2 20
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
*APPLIES for IC/IB ≤ hFE/2
θV, TEMPERATURE COEFFICIENTS (mV/°C)
TJ = 25°C
1.2
0.8
25°C to 125°C
V, VOLTAGE (VOLTS)
1.0
*qVC for VCE(sat)
0
0.8 VBE(sat) @ IC/IB = 10 – 55°C to 25°C
0.6 – 0.8
VBE(on) @ VCE = 1.0 V
0.4 25°C to 125°C
– 1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
300 1000
200 VCC = 3.0 V
700
IC/IB = 10 500
TJ = 25°C ts
100 300
70 200
50
t, TIME (ns)
t, TIME (ns)
30 tr 100 tf
20 70
td @ VBE(off) = 0.5 Vdc 50
10 30 VCC = 3.0 V
7.0 IC/IB = 10
20 IB1 = IB2
5.0
TJ = 25°C
3.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
f = 100 MHz 7.0 f = 1.0 MHz
300
VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
200 5.0 V
Cob
3.0
100 2.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = 10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 70
5.0 50 hfe ≈ 200 @ IC = 1.0 mA
3.0 30
2.0 20
1.0 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19A
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
102 ICEO Figure 19 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 19 by the
101 steady state value RθJA.
Example:
ICBO The MPS3904 is dissipating 2.0 watts peak under the following
100
AND conditions:
ICEX @ VBE(off) = 3.0 Vdc t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
10–1 Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
10–2 The peak rise in junction temperature is therefore
–4 –2 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
0 0 TJ, JUNCTION TEMPERATURE (°C)
For more information, see AN–569.
Figure 19A.
400
100 µs The safe operating area curves indicate IC–VCE limits of the
1.0 ms
200 transistor that must be observed for reliable operation. Collector load
IC, COLLECTOR CURRENT (mA)
10 µs
lines for specific circuits must fall below the limits indicated by the
100 TC = 25°C 1.0 s applicable curve.
dc The data of Figure 20 is based upon TJ(pk) = 150°C; TC or TA is
60 TA = 25°C variable depending upon conditions. Pulse curves are valid for duty
40 dc cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
20 TJ = 150°C limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.
10 CURRENT LIMIT
THERMAL LIMIT
6.0
SECOND BREAKDOWN LIMIT
4.0
2.0 4.0 6.0 8.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
Figure 20.
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BCW61BLT1 = BB, BCW61CLT1 = BC, BCW61DLT1 = BD
SWITCHING CHARACTERISTICS
Turn–On Time ton ns
(IC = –10 mAdc, IB1 = –1.0 mAdc) — 150
Turn–Off Time toff ns
(IB2 = –1.0 mAdc, VBB = –3.6 Vdc, R1 = R2 = 5.0 kΩ, RL = 990 Ω) — 800
10 1.0
BANDWIDTH = 1.0 Hz 7.0 BANDWIDTH = 1.0 Hz
7.0 RS ≈ 0 5.0 RS ≈ ∞
IC = 10 µA IC = 1.0 mA
en, NOISE VOLTAGE (nV)
1.0 M 1.0 M
500 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
200 k 200 k
100 k 100 k
50 k 50 k
20 k 20 k
0.5 dB
10 k 10 k
0.5 dB
5.0 k 1.0 dB 5.0 k
2.0 k 2.0 k 1.0 dB
1.0 k 2.0 dB 1.0 k
2.0 dB
500 3.0 dB 500
3.0 dB
200 5.0 dB 200 5.0 dB
100 100
10 20 30 50 70 100 200 300 500 700 1.0 k 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
1.0 M
500 k 10 Hz to 15.7 kHz
RS , SOURCE RESISTANCE (OHMS)
200 k
100 k
ƪ ƫ
Noise Figure is Defined as:
Figure 5. Wideband
150 µA
0.4 40
100 µA
0.2 20 50 µA
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
0.6 0.8
VBE(on) @ VCE = 1.0 V
25°C to 125°C
0.4
1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 1000
VCC = 3.0 V 700 VCC = – 3.0 V
300 IC/IB = 10
IC/IB = 10 500
200 TJ = 25°C IB1 = IB2
ts
300 TJ = 25°C
100 200
t, TIME (ns)
t, TIME (ns)
70
50 100
30 70
tr 50
20 tf
td @ VBE(off) = 0.5 V 30
10 20
7.0
5.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
7.0
300 VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
5.0 V
200
3.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
D = 0.5
0.5
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
1
3
BASE
1
2 2
EMITTER
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BCW65ALT1 = EA
SWITCHING CHARACTERISTICS
Turn–On Time ton — — 100 ns
(IB1 = IB2 = 15 mAdc)
Turn–Off Time toff — — 400 ns
(IC = 150 mAdc, RL = 150 Ω)
1
3
BASE
1
2
2
EMITTER
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector–Emitter Voltage VCEO –45 Vdc
Collector–Base Voltage VCBO –60 Vdc
Emitter–Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –800 mAdc
DEVICE MARKING
BCW68GLT1 = DH
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board (1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RθJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate, (2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RθJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (IC = –10 mAdc, IB = 0) V(BR)CEO –45 — — Vdc
Collector–Emitter Breakdown Voltage (IC = –10 µAdc, VEB = 0) V(BR)CES –60 — — Vdc
Emitter–Base Breakdown Voltage (IE = –10 µAdc, IC = 0) V(BR)EBO –5.0 — — Vdc
Collector Cutoff Current ICES
(VCE= –45 Vdc, IE = 0) — — –20 nAdc
(VCE= –45 Vdc, IB = 0, TA = 150°C) — — –10 µAdc
Emitter Cutoff Current (VEB = –4.0 Vdc, IC = 0) IEBO — — –20 nAdc
1. FR–5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = –10 mAdc, VCE = –1.0 Vdc) 120 — 400
(IC = –100 mAdc, VCE = –1.0 Vdc) 160 — —
(IC = –300 mAdc, VCE = –1.0 Vdc) 60 — —
Collector–Emitter Saturation Voltage (IC = –300 mAdc, IB = –30 mAdc) VCE(sat) — — –1.5 Vdc
Base–Emitter Saturation Voltage (IC = –500 mAdc, IB = –50 mAdc) VBE(sat) — — –2.0 Vdc
SMALL–SIGNAL CHARACTERISTICS
Current–Gain — Bandwidth Product fT 100 — — MHz
(IC = –20 mAdc, VCE = –10 Vdc, f = 100 MHz)
Output Capacitance Cobo — — 18 pF
(VCB= –10 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance Cibo — — 105 pF
(VEB= –0.5 Vdc, IC = 0, f = 1.0 MHz)
Noise Figure NF — — 10 dB
(IC= –0.2 mAdc, VCE = –5.0 Vdc, RS = 1.0 kΩ, f = 1.0 kHz,
BW = 200 Hz)
1 3
BASE
1
2 2
EMITTER
CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector–Emitter Voltage VCEO –45 Vdc
Emitter–Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –100 mAdc
DEVICE MARKING
BCW69LT1 = H1; BCW70LT1 = H2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board (1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RθJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate, (2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RθJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (IC = –2.0 mAdc, IB = 0) V(BR)CEO –45 — Vdc
Collector–Emitter Breakdown Voltage (IC = –100 µAdc, VEB = 0) V(BR)CES –50 — Vdc
Emitter–Base Breakdown Voltage (IE = –10 µAdc, IC = 0) V(BR)EBO –5.0 — Vdc
Collector Cutoff Current ICBO
(VCB = –20 Vdc, IE = 0) — –100 nAdc
(VCB = –20 Vdc, IE = 0, TA = 100°C) — –10 µAdc
SMALL–SIGNAL CHARACTERISTICS
Output Capacitance Cobo — 7.0 pF
(IE = 0, VCB = –10 Vdc, f = 1.0 MHz)
Noise Figure NF — 10 dB
(IC = –0.2 mAdc, VCE = –5.0 Vdc, RS = 2.0 kΩ, f = 1.0 kHz, BW = 200 Hz)
10 1.0
BANDWIDTH = 1.0 Hz 7.0 BANDWIDTH = 1.0 Hz
7.0 RS ≈ 0 5.0 RS ≈ ∞
IC = 10 µA IC = 1.0 mA
en, NOISE VOLTAGE (nV)
1.0 M 1.0 M
500 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
200 k 200 k
100 k 100 k
50 k 50 k
20 k 20 k
0.5 dB
10 k 10 k
0.5 dB
5.0 k 1.0 dB 5.0 k
2.0 k 2.0 k 1.0 dB
1.0 k 2.0 dB 1.0 k
2.0 dB
500 3.0 dB 500
3.0 dB
200 5.0 dB 200 5.0 dB
100 100
10 20 30 50 70 100 200 300 500 700 1.0 k 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
1.0 M
500 k 10 Hz to 15.7 kHz
RS , SOURCE RESISTANCE (OHMS)
200 k
100 k
ƪ ƫ
Noise Figure is Defined as:
Figure 5. Wideband
150 µA
0.4 40
100 µA
0.2 20 50 µA
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
0.6 0.8
VBE(on) @ VCE = 1.0 V
25°C to 125°C
0.4
1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 1000
VCC = 3.0 V 700 VCC = – 3.0 V
300 IC/IB = 10
IC/IB = 10 500
200 TJ = 25°C IB1 = IB2
ts
300 TJ = 25°C
100 200
t, TIME (ns)
t, TIME (ns)
70
50 100
30 70
tr 50
20 tf
td @ VBE(off) = 0.5 V 30
10 20
7.0
5.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
7.0
300 VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
5.0 V
200
3.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
1.0
0.7
r(t) TRANSIENT THERMAL RESISTANCE
D = 0.5
0.5
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 16
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
1
3
BASE
1
2
2
EMITTER
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BCW72LT1 = K2
+ 3.0 V + 3.0 V
10 < t1 < 500 µs t1
300 ns 275 +10.9 V 275
+10.9 V DUTY CYCLE = 2%
DUTY CYCLE = 2%
10 k 10 k
– 0.5 V 0
<1.0 ns CS < 4.0 pF* CS < 4.0 pF*
– 9.1 V 1N916
< 1.0 ns
20 100
IC = 1.0 mA BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
50
RS = 0 IC = 1.0 mA RS ≈ ∞
300 µA 20 300 µA
en, NOISE VOLTAGE (nV)
10
10 100 µA
5.0
7.0 100 µA
2.0
5.0
1.0
10 µA
30 µA 0.5 30 µA
3.0
0.2 10 µA
2.0 0.1
10 20 50 100 200 500 1 k 2k 5k 10 k 10 20 50 100 200 500 1 k 2k 5k 10 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
500 k 1M
200 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
500 k
10 Hz to 15.7 kHz
200 k
RS , SOURCE RESISTANCE (OHMS)
100 k
50 k
ǒ Ǔ
Noise Figure is defined as:
20 k
10 k NF + 20 log10 en2 ) 4KTRS ) In 2RS2 1ń2
5k 4KTRS
1.0 dB
en = Noise Voltage of the Transistor referred to the input. (Figure 3)
2k 2.0 dB In = Noise Current of the Transistor referred to the input. (Figure 4)
1k 3.0 dB K = Boltzman’s Constant (1.38 x 10–23 j/°K)
500 T = Temperature of the Source Resistance (°K)
5.0 dB
200 RS = Source Resistance (Ohms)
8.0 dB
100
50
10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA)
Figure 7. Wideband
400
h FE, DC CURRENT GAIN TJ = 125°C
200 25°C
– 55°C
100
80
60 VCE = 1.0 V
VCE = 10 V
40
0.004 0.006 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
TJ = 25°C TA = 25°C
IB = 500 µA
PULSE WIDTH = 300 µs
200 µA
0.4 40
100 µA
0.2 20
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
*APPLIES for IC/IB ≤ hFE/2
θV, TEMPERATURE COEFFICIENTS (mV/°C)
TJ = 25°C
1.2
0.8
25°C to 125°C
V, VOLTAGE (VOLTS)
1.0
*qVC for VCE(sat)
0
0.8 VBE(sat) @ IC/IB = 10 – 55°C to 25°C
0.6 – 0.8
VBE(on) @ VCE = 1.0 V
0.4 25°C to 125°C
– 1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
300 1000
200 VCC = 3.0 V
700
IC/IB = 10 500
TJ = 25°C ts
100 300
70 200
50
t, TIME (ns)
t, TIME (ns)
30 tr 100 tf
20 70
td @ VBE(off) = 0.5 Vdc 50
10 30 VCC = 3.0 V
7.0 IC/IB = 10
20 IB1 = IB2
5.0
TJ = 25°C
3.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
f = 100 MHz 7.0 f = 1.0 MHz
300
VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
200 5.0 V
Cob
3.0
100 2.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = 10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 70
5.0 50 hfe ≈ 200 @ IC = 1.0 mA
3.0 30
2.0 20
1.0 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19A
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
102 ICEO Figure 19 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 19 by the
101 steady state value RθJA.
Example:
ICBO The MPS3904 is dissipating 2.0 watts peak under the following
100
AND conditions:
ICEX @ VBE(off) = 3.0 Vdc t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
10–1 Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
10–2 The peak rise in junction temperature is therefore
–4 –2 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
0 0 TJ, JUNCTION TEMPERATURE (°C)
For more information, see AN–569.
Figure 19A.
400
100 µs The safe operating area curves indicate IC–VCE limits of the
1.0 ms
200 transistor that must be observed for reliable operation. Collector load
IC, COLLECTOR CURRENT (mA)
10 µs
lines for specific circuits must fall below the limits indicated by the
100 TC = 25°C 1.0 s applicable curve.
dc The data of Figure 20 is based upon TJ(pk) = 150°C; TC or TA is
60 TA = 25°C variable depending upon conditions. Pulse curves are valid for duty
40 dc cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
20 TJ = 150°C limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.
10 CURRENT LIMIT
THERMAL LIMIT
6.0
SECOND BREAKDOWN LIMIT
4.0
2.0 4.0 6.0 8.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
Figure 20.
PNP
COLLECTOR 3
General Purpose 1
BCX17LT1
Transistors BASE
BCX18LT1
2 EMITTER
NPN
COLLECTOR 3 BCX19LT1
1 BCX20LT1
BASE
Voltage and current are negative
for PNP transistors
2 EMITTER
1
2
MAXIMUM RATINGS
Value
BCX17LT1 BCX18LT1
Rating Symbol BCX19LT1 BCX20LT1 Unit
Collector–Emitter Voltage VCEO 45 25 Vdc
Collector–Base Voltage VCBO 50 30 Vdc
Emitter–Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 500 mAdc
DEVICE MARKING
BCX17LT1 = T1; BCX18LT1 = T2; BCX19LT1 = U1; BCX20LT1 = U2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board (1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RθJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate, (2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RθJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
1. FR–5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 10 mAdc, IB = 0) BCX17, 19 45 — —
BCX18, 20 25 — —
Collector–Emitter Breakdown Voltage V(BR)CES Vdc
(IC = 10 µAdc, IC = 0) BCX17, 19 50 — —
BCX18, 20 30 — —
Collector Cutoff Current ICBO
(VCB = 20 Vdc, IE = 0) — — 100 nAdc
(VCB = 20 Vdc, IE = 0, TA = 150°C) — — 5.0 µAdc
Emitter Cutoff Current IEBO — — 10 µAdc
(VEB = 5.0 Vdc, IC = 0)
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 100 mAdc, VCE = 1.0 Vdc) 100 — 600
(IC = 300 mAdc, VCE = 1.0 Vdc) 70 — —
(IC = 500 mAdc, VCE = 1.0 Vdc) 40 — —
Collector–Emitter Saturation Voltage VCE(sat) — — 0.62 Vdc
(IC = 500 mAdc, IB = 50 mAdc)
Base–Emitter On Voltage VBE(on) — — 1.2 Vdc
(IC = 500 mAdc, VCE = 1.0 Vdc)
1
BASE
2
3
EMITTER
1
2
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Collector – Emitter Voltage VCEO 45 Vdc
Collector – Base Voltage VCBO 45 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 200 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BCX70GLT1 = AG; BCX70JLT1 = AJ; BCX70KLT1 = AK
SWITCHING CHARACTERISTICS
Turn–On Time ton — 150 ns
(IC = 10 mAdc, IB1 = 1.0 mAdc)
Turn–Off Time toff — 800 ns
(IB2 = 1.0 mAdc, VBB = 3.6 Vdc, R1 = R2 = 5.0 kΩ, RL = 990Ω)
+ 3.0 V + 3.0 V
10 < t1 < 500 µs t1
300 ns 275 +10.9 V 275
+10.9 V DUTY CYCLE = 2%
DUTY CYCLE = 2%
10 k 10 k
– 0.5 V 0
<1.0 ns CS < 4.0 pF* CS < 4.0 pF*
– 9.1 V 1N916
< 1.0 ns
20 100
IC = 1.0 mA BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
50
RS = 0 IC = 1.0 mA RS ≈ ∞
300 µA 20 300 µA
en, NOISE VOLTAGE (nV)
2.0 0.1
10 20 50 100 200 500 1 k 2k 5k 10 k 10 20 50 100 200 500 1 k 2k 5k 10 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
500 k 1M
200 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
100 k 200 k
50 k 100 k
20 k 50 k
10 k 20 k
5k 10 k
2.0 dB 1.0 dB
2k 5k
3.0 dB 4.0 dB
1k 2k 2.0 dB
6.0 dB 3.0 dB
500 10 dB
1k
500 5.0 dB
200
100 200 8.0 dB
50 100
10 20 30 50 70 100 200 300 500 700 1k 10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
500 k
10 Hz to 15.7 kHz
200 k
RS , SOURCE RESISTANCE (OHMS)
100 k
50 k
ǒ Ǔ
Noise Figure is defined as:
20 k
10 k NF + 20 log10 en2 ) 4KTRS ) In 2RS2 1ń2
5k 4KTRS
1.0 dB
en = Noise Voltage of the Transistor referred to the input. (Figure 3)
2k 2.0 dB In = Noise Current of the Transistor referred to the input. (Figure 4)
1k 3.0 dB K = Boltzman’s Constant (1.38 x 10–23 j/°K)
500 T = Temperature of the Source Resistance (°K)
5.0 dB
200 RS = Source Resistance (Ohms)
8.0 dB
100
50
10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA)
Figure 7. Wideband
400
h FE, DC CURRENT GAIN TJ = 125°C
200 25°C
– 55°C
100
80
60 VCE = 1.0 V
VCE = 10 V
40
0.004 0.006 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
TJ = 25°C TA = 25°C
IB = 500 µA
PULSE WIDTH = 300 µs
200 µA
0.4 40
100 µA
0.2 20
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
*APPLIES for IC/IB ≤ hFE/2
θV, TEMPERATURE COEFFICIENTS (mV/°C)
TJ = 25°C
1.2
0.8
25°C to 125°C
V, VOLTAGE (VOLTS)
1.0
*qVC for VCE(sat)
0
0.8 VBE(sat) @ IC/IB = 10 – 55°C to 25°C
0.6 – 0.8
VBE(on) @ VCE = 1.0 V
0.4 25°C to 125°C
– 1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
300 1000
200 VCC = 3.0 V
700
IC/IB = 10 500
TJ = 25°C ts
100 300
70 200
50
t, TIME (ns)
t, TIME (ns)
30 tr 100 tf
20 70
td @ VBE(off) = 0.5 Vdc 50
10 30 VCC = 3.0 V
7.0 IC/IB = 10
20 IB1 = IB2
5.0
TJ = 25°C
3.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
f = 100 MHz 7.0 f = 1.0 MHz
300
VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
200 5.0 V
Cob
3.0
100 2.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = 10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 70
5.0 50 hfe ≈ 200 @ IC = 1.0 mA
3.0 30
2.0 20
1.0 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19A
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
102 ICEO Figure 19 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 19 by the
101 steady state value RθJA.
Example:
ICBO The MPS3904 is dissipating 2.0 watts peak under the following
100
AND conditions:
ICEX @ VBE(off) = 3.0 Vdc t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
10–1 Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
10–2 The peak rise in junction temperature is therefore
–4 –2 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
0 0 TJ, JUNCTION TEMPERATURE (°C)
For more information, see AN–569.
Figure 19A.
400
100 µs The safe operating area curves indicate IC–VCE limits of the
1.0 ms
200 transistor that must be observed for reliable operation. Collector load
IC, COLLECTOR CURRENT (mA)
10 µs
lines for specific circuits must fall below the limits indicated by the
100 TC = 25°C 1.0 s applicable curve.
dc The data of Figure 20 is based upon TJ(pk) = 150°C; TC or TA is
60 TA = 25°C variable depending upon conditions. Pulse curves are valid for duty
40 dc cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
20 TJ = 150°C limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.
10 CURRENT LIMIT
THERMAL LIMIT
6.0
SECOND BREAKDOWN LIMIT
4.0
2.0 4.0 6.0 8.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
Figure 20.
COLLECTOR
3
2
BASE
1
2
3
1
EMITTER
CASE 29–05, STYLE 1
TO–92 (TO–226AE)
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 80 Vdc
Collector – Base Voltage VCES 80 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 0.5 Adc
Total Device Dissipation PD 1.0 Watt
@ TA = 25°C 8.0 mW/°C
Derate above 25°C
Total Device Dissipation PD 2.5 Watt
@ TC = 25°C 20 mW/°C
Derate above 25°C
Operating and Storage Junction TJ, Tstg – 55 to °C
Temperature Range +150
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Voltage V(BR)CEO Vdc
(IC = 10 mA, IB = 0) 80 —
Collector Cutoff Current ICBO mAdc
(VCB = 80 V, IE = 0) — 0.01
Emitter Cutoff Current IEBO nAdc
(IC = 0, VEB = 5.0 V) — 100
REV 1
DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product fT 50 — MHz
(IC = 200 mA, VCE = 5.0 V, f = 20 MHz)
Output Capacitance Cob — 30 pF
(VCB = 10 V, IE = 0, f = 1.0 MHz)
400
200
25°C
–55°C
100
80
60
40
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.0 1.0
TJ = 25°C TJ = 25°C
0.8 0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
50
IC = 10 mA 100 mA 250 mA 500 mA
0.6 mA 0.6 VBE(on) @ VCE = 1.0 V
0.4 0.4
0.2 0.2
VCE(sat) @ IC/IB = 10
0 0
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
C, CAPACITANCE (pF)
–1.6
20
θVB for VBE
–2.0
10
8.0
–2.4
6.0
Cobo
–2.8 4.0
0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
300
VCE = 2.0 V
200 TJ = 25°C DUTY CYCLE ≤ 10%
2
BASE
1 1
EMITTER 2
3
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 29–05, STYLE 1
Collector – Emitter Voltage VCEO –80 Vdc TO–92 (TO–226AE)
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Voltage V(BR)CEO Vdc
(IC = –10 mA, IB = 0) –80 —
Collector Cutoff Current ICBO mAdc
(VCB = –80 V, IE = 0) — –0.1
Emitter Cutoff Current (IC = 0, VEB = –5.0 V) IEBO — –100 nAdc
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = –100 mA, VCE = –1.0 V) 40 400
(IC = –500 mA, VCE = –2.0 V) 25 —
Collector – Emitter Saturation Voltage(1) (IC = –1000 mA, IB = –100 mA) VCE(sat) — –0.7 Vdc
Collector – Emitter On Voltage(1) (IC = –1000 mA, VCE = –1.0 V) VBE(on) — –1.2 Vdc
DYNAMIC CHARACTERISTICS
Current–Gain — Bandwidth Product (IC = –200 mA, VCE = –5.0 V, f = 20 MHz) fT 50 — MHz
Output Capacitance (VCB = –10 V, IE = 0, f = 1.0 MHz) Cob — 30 pF
TJ = 125°C
VCE = –1.0 V
hFE, DC CURRENT GAIN
200
25°C
–55°C
100
80
60
40
–0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500
IC, COLLECTOR CURRENT (mA)
–1.0 –1.0
TJ = 25°C TJ = 25°C
–0.8 –0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
–0.6 –50 –0.6
IC = –10 mA –100 mA –250 mA –500 mA VBE(on) @ VCE = –1.0 V
mA
–0.4 –0.4
–0.2 –0.2
VCE(sat) @ IC/IB = 10
0 0
–0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–0.8 100
θ VB, TEMPERATURE COEFFICIENT (mV/°C)
70 TJ = 25°C
Cibo
–1.2
50
C, CAPACITANCE (pF)
–1.6 30
20
–2.0 θVB for VBE
10 Cobo
–2.4
7.0
–2.8 5.0
–0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
Figure 6. Current–Gain — Bandwidth Product Figure 7. Active Region — Safe Operating Area
COLLECTOR
2
3
BASE
1
2
3
1
EMITTER
CASE 29–05, STYLE 14
TO–92 (TO–226AE)
MAXIMUM RATINGS
Rating Symbol BDC01D Unit
Collector – Emitter Voltage VCEO 100 Vdc
Collector – Base Voltage VCBO 100 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 0.5 Adc
Total Device Dissipation @ TA = 25°C PD 1.0 Watts
Derate above 25°C 8.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 2.5 Watts
Derate above 25°C 20 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Voltage V(BR)CEO 100 — Vdc
(IC = 10 mA, IB = 0)
Collector Cutoff Current ICBO — 0.1 mAdc
(VCB = 100 V, IE = 0)
Emitter Cutoff Current IEBO — 100 nAdc
(IC = 0, VEB = 5.0 V)
DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product fT 50 — MHz
(IC = 200 mA, VCE = 5.0 V, f = 20 MHz)
Output Capacitance Cob — 30 pF
(VCB = 10 V, IE = 0, f = 1.0 MHz)
400
200
25°C
–55°C
100
80
60
40
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.0 1.0
TJ = 25°C TJ = 25°C
0.8 0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
50
IC = 10 mA 100 mA 250 mA 500 mA
0.6 mA 0.6 VBE(on) @ VCE = 1.0 V
0.4 0.4
0.2 0.2
VCE(sat) @ IC/IB = 10
0 0
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
C, CAPACITANCE (pF)
–1.6
20
θVB for VBE
–2.0
10
8.0
–2.4
6.0
Cobo
–2.8 4.0
0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
300
VCE = 2.0 V
200 TJ = 25°C DUTY CYCLE ≤ 10%
Figure 6. Current–Gain — Bandwidth Product Figure 7. Active Region — Safe Operating Area
RF Transistor
NPN Silicon
COLLECTOR
1
BF199
3
BASE
2
EMITTER
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
Thermal Resistance, Junction to Case RqJC 125 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) 25 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) 40 — —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 mAdc, IC = 0) 4.0 — —
Collector Cutoff Current ICBO nAdc
(VCB = 20 Vdc, IE = 0) — — 100
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 7.0 mAdc, VCE = 10 Vdc) 40 85 —
Base–Emitter On Voltage VBE(on) mVdc
(IC = 7.0 mAdc, VCE = 10 Vdc) — 770 900
SMALL–SIGNAL CHARACTERISTICS
Current Gain — Bandwidth Product fT MHz
(IC = 5.0 mAdc, VCE = 10 Vdc, f = 100 MHz) 400 750 —
Common Emitter Feedback Capacitance Cre pF
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz) — 0.25 0.35
Noise Figure Nf dB
(IC = 4.0 mAdc, VCE = 10 Vdc, RS = 50 Ω, f = 35 MHz) — 2.5 —
C, CAPACITANCE (pF)
200 2
Cib
100 1
0.7 Cob
0.5
0.4
0.3
20 0.2 Cre @ IE = 0
10
0.2 0.3 0.5 0.7 1 3 5 10 20 100 0.1 0.2 0.5 1 3 5 10 20
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
100
VCE = 10 V VCE = 10 V
TA = 25°C 50
hFE, DC CURRENT GAIN
100 MHz
200 20
100 mmhos 10
BF199
70
50 5 45 MHz
30
10.7 MHz
20 2
b11e 470 kHz < 0.2 mmhos
10 1
0.1 0.2 0.3 0.5 0.7 1 2 3 5 7 10 20 2 3 4 5 6 7 8
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–100 2000
VCE = 10 V 100 MHz
–50 1000 100 MHz
VCE = 10 V
45 MHz 500
–20
mmhos
µmhos
45 MHz
–10 10.7 MHz 200
–5 100
10.7 MHz
50
–2
b21e, at 470 kHz < 0.5 mmhos 470 kHz
–1 20
2 3 4 5 6 7 8 1 2 3 4 5 6 7
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
mmhos
mmhos
1 20
0.5 10
5
0.2
0.1 2
2 3 4 5 6 7 8 1 2 3 4 5 6 7
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
200
VCE = 10 V 100 MHz
100
50 45 MHz
10.7 MHz
µmhos
20 470 kHz
10
2
1 2 3 4 5 6 7
IC, COLLECTOR CURRENT (mA)
RF Transistor
NPN Silicon
COLLECTOR
1
BF224
3
BASE
2
EMITTER
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
Thermal Resistance, Junction to Case RqJC 125 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) 30 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) 45 — —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 100 mAdc, IC = 0) 4.0 — —
Collector Cutoff Current ICBO nAdc
(VCB = 20 Vdc, IE = 0) — — 100
Emitter Cutoff Current IEBO nAdc
(VEB = 3.0 Vdc, IC = 0) — — 100
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 7.0 mAdc, VCE = 10 Vdc) 30 — —
Base–Emitter On Voltage VBE(on) mVdc
(IC = 7.0 mAdc, VCE = 10 Vdc) — 0.77 0.9
Collector–Emitter Saturation Voltage VCE(sat) Vdc
(IC = 10 mAdc, IB = 1.0 mAdc) — — 0.15
SMALL–SIGNAL CHARACTERISTICS
Current Gain — Bandwidth Product fT MHz
(IC = 1.5 mAdc, VCE = 10 Vdc, f = 100 MHz) 300 600 —
(IC = 7.0 mAdc, VCE = 10 Vdc, f = 100 MHz) — 850 —
Common Emitter Feedback Capacitance Cre pF
(VCE = 10 Vdc, IE = 0, f = 1.0 MHz) — 0.28 —
Noise Figure Nf dB
(IC = 1.0 mAdc, VCE = 10 Vdc, RS = 50 Ω, f = 100 MHz) — 2.5 —
(IC = 1.0 mAdc, VCE = 10 Vdc, RS = 50 Ω, f = 200 MHz) — 3.5 —
C, CAPACITANCE (pF)
200 2
Cib
100 1
0.7 Cob
0.5
0.4
0.3
20 0.2 Cre @ IE = 0
10
0.2 0.3 0.5 0.7 1 3 5 10 20 100 0.1 0.2 0.5 1 3 5 10 20
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
100
VCE = 10 V VCE = 10 V
TA = 25°C 50
hFE, DC CURRENT GAIN
100 MHz
200 20
100 mmhos 10
BF224
70
50 5 45 MHz
30
10.7 MHz
20 2
b11e 470 kHz < 0.2 mmhos
10 1
0.1 0.2 0.3 0.5 0.7 1 2 3 5 7 10 20 2 3 4 5 6 7 8
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–100 2000
VCE = 10 V 100 MHz
–50 1000 100 MHz
VCE = 10 V
45 MHz 500
–20
mmhos
µmhos
45 MHz
–10 10.7 MHz 200
–5 100
10.7 MHz
50
–2
b21e, at 470 kHz < 0.5 mmhos 470 kHz
–1 20
2 3 4 5 6 7 8 1 2 3 4 5 6 7
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
mmhos
mmhos
1 20
0.5 10
5
0.2
0.1 2
2 3 4 5 6 7 8 1 2 3 4 5 6 7
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
200
VCE = 10 V 100 MHz
100
50 45 MHz
10.7 MHz
µmhos
20 470 kHz
10
2
1 2 3 4 5 6 7
IC, COLLECTOR CURRENT (mA)
AM/FM Transistor
NPN Silicon BF240
COLLECTOR
1
3
BASE
1
2
3
2
EMITTER
CASE 29–04, STYLE 21
MAXIMUM RATINGS TO–92 (TO–226AA)
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 40 Vdc
Collector – Base Voltage VCBO 40 Vdc
Emitter – Base Voltage VEBO 4.0 Vdc
Collector Current — Continuous IC 25 mAdc
Total Device Dissipation @ TA = 25°C PD 350 mW
Derate above 25°C 2.8 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.0 Watt
Derate above 25°C 8.0 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
Thermal Resistance, Junction to Case RqJC 125 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 40 — — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector–Base Breakdown Voltage (IC = 100 µAdc, IE = 0) V(BR)CBO 40 — — Vdc
Emitter–Base Breakdown Voltage (IE = 10 µAdc, IC = 0) V(BR)EBO 4.0 — — Vdc
Collector Cutoff Current (VCB = 20 Vdc, IE = 0) ICBO — — 100 nAdc
ON CHARACTERISTICS
DC Current Gain (IC = 1.0 mAdc, VCE = 10 Vdc) hFE 65 — 220 —
Base–Emitter On Voltage (IC = 1.0 mAdc, VCE = 10 Vdc) VBE(on) 0.65 0.7 0.74 Vdc
SMALL–SIGNAL CHARACTERISTICS
Current–Gain — Bandwidth Product fT — 600 — MHz
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
Common Emitter Feedback Capacitance Cre — 0.28 0.34 pF
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
REV 1
C, CAPACITANCE (pF)
200 2
Cib
100 1
0.7 Cob
0.5
0.4
0.3
20 0.2 Cre @ IE = 0
10
0.2 0.3 0.5 0.7 1 3 5 10 20 100 0.1 0.2 0.5 1 3 5 10 20
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
100
VCE = 10 V VCE = 10 V
TA = 25°C 50
hFE, DC CURRENT GAIN
100 MHz
200 mmhos 20
100 10
BF240
70
50 5 45 MHz
30
10.7 MHz
20 2
b11e 470 kHz < 0.2 mmhos
10 1
0.1 0.2 0.3 0.5 0.7 1 2 3 5 7 10 20 2 3 4 5 6 7 8
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–100 2000
VCE = 10 V 100 MHz
–50 1000 100 MHz
VCE = 10 V
45 MHz 500
–20
mmhos
µmhos
45 MHz
–10 10.7 MHz 200
–5 100
10.7 MHz
50
–2
b21e, at 470 kHz < 0.5 mmhos 470 kHz
–1 20
2 3 4 5 6 7 8 1 2 3 4 5 6 7
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
mmhos
mmhos
1 20
0.5 10
5
0.2
0.1 2
2 3 4 5 6 7 8 1 2 3 4 5 6 7
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
200
VCE = 10 V 100 MHz
100
50 45 MHz
10.7 MHz
µmhos
20 470 kHz
10
2
1 2 3 4 5 6 7
IC, COLLECTOR CURRENT (mA)
1
EMITTER
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to RqJA 200 °C/W
Ambient
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
(Replaces BF392/D)
TJ = +125°C
hFE, DC CURRENT GAIN
100
25°C
50
–55°C
30
20
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
50 70
C, CAPACITANCE (pF)
Ceb 50
20
TJ = 25°C
10 VCE = 20 V
30 f = 20 MHz
5.0
20
2.0 Ccb
1.0 10
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1.4 500
TJ = 25°C 100 µs 10 µs
1.2 200 TA = 25°C
IC, COLLECTOR CURRENT (mA)
1.0 ms
1.0 100 TC = 25°C
V, VOLTAGE (VOLTS)
50
0.8 100 ms
VBE(sat) @ IC/IB = 10
20
0.6 10 CURRENT LIMIT
VBE(on) @ VCE = 10 V
THERMAL LIMIT
5.0 (PULSE CURVES @ TC = 25°C)
0.4
SECOND BREAKDOWN LIMIT
2.0
0.2 VCE(sat) @ IC/IB = 10 CURVES APPLY
1.0 MPSA43
BELOW RATED VCEO
MPSA42
0 0.5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
3
BASE
1
EMITTER
MAXIMUM RATINGS
1
Rating Symbol BF420 BF422 Unit 2
3
Collector – Emitter Voltage VCEO 300 250 Vdc
CASE 29–04, STYLE 14
Collector – Base Voltage VCBO 300 250 Vdc
TO–92 (TO–226AA)
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 500 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) BF420 300 —
BF422 250 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) BF420 300 —
BF422 250 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 100 mAdc, IC = 0) BF420 5.0 —
BF422 5.0 —
Collector Cutoff Current ICBO µAdc
(VCB = 200 Vdc, IE = 0) BF420 — 0.01
BF422 — —
Emitter Cutoff Current IEBO nAdc
(VEB = 5.0 Vdc, IC = 0) BF420 — 100
BF422 — —
25°C
50
–55°C
30
20
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
50 70
C, CAPACITANCE (pF)
Ceb 50
20
TJ = 25°C
10 VCE = 20 V
30 f = 20 MHz
5.0
20
2.0 Ccb
1.0 10
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1.4 500
TJ = 25°C 100 µs 10 µs
1.2 200 TA = 25°C
IC, COLLECTOR CURRENT (mA)
1.0 ms
1.0 100 TC = 25°C
V, VOLTAGE (VOLTS)
50
0.8 100 ms
VBE(sat) @ IC/IB = 10
20
0.6 10 CURRENT LIMIT
VBE(on) @ VCE = 10 V
THERMAL LIMIT
5.0 (PULSE CURVES @ TC = 25°C)
0.4
SECOND BREAKDOWN LIMIT
2.0
0.2 VCE(sat) @ IC/IB = 10 CURVES APPLY
1.0 MPSA43
BELOW RATED VCEO
MPSA42
0 0.5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
3
BASE
1
EMITTER 1
2
MAXIMUM RATINGS 3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage (1) V(BR)CEO Vdc
(IC = –1.0 mAdc, IB = 0) BF421 –300 —
BF423 –250 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = –100 mAdc, IE = 0) BF421 –300 —
BF423 –250 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = –100 mAdc, IC = 0) BF421 –5.0 —
BF423 –5.0 —
Collector Cutoff Current ICBO mAdc
(VCB = –200 Vdc, IE = 0) BF421 — –0.01
BF423 — —
Emitter Cutoff Current IEBO nAdc
(VEB = –5.0 Vdc, IC = 0) BF421 — –100
BF423 — —
+25°C
70
50 –55°C
30
20
15
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –80 –100
IC, COLLECTOR CURRENT (mA)
20
40
10 30
5.0
20
2.0
Ccb
1.0 0
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100–200 –500 –1000 –1.0 –2.0 –5.0 –10 –20 –50 –100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
–1.0 –500
100 µs
1.0 ms
IC, COLLECTOR CURRENT (mA)
–100
–0.6
BF423
–50
1.5 WATT THERMAL
–0.4 LIMITATION @ TC = 25°C BF421
625 mW THERMAL
–20 LIMITATION @ TA = 25°C
–0.2
VCE(sat) @ IC/IB = 10 mA –10 BONDING WIRE LIMITATION
SECOND BREAKDOWN
LIMITATION TJ = 150°C
0 –5.0
–1.0 –2.0 –5.0 –10 –20 –50 –100 –3.0 –5.0 –10 –20 –30 –50 –100 –200 –300
IC, COLLECTOR CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
2
BASE
1 1
EMITTER 2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage (1) V(BR)CEO –350 — Vdc
(IC = –1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –350 — Vdc
(IC = –100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –6.0 — Vdc
(IE = –100 mAdc, IC = 0)
Collector Cutoff Current ICES — –10 nAdc
(VCE = –250 Vdc)
Emitter Cutoff Current IEBO — 0.1 mAdc
(VEB = –6.0 Vdc, IC = 0)
Collector Cutoff Current ICBO mAdc
(VCB = –250 Vdc, IE = 0, TA = 25°C) — –0.005
(VCB = –250 Vdc, IE = 0, TA = 100°C) — –1.0
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product fT 50 — MHz
(IC = –10 mAdc, VCE = –20 Vdc, f = 20 MHz)
Common–Emitter Feedback Capacitance Cre — 1.6 pF
(VCB = –100 Vdc, IE = 0, f = 1.0 MHz)
50 –55°C
30
20
15
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –80 –100
IC, COLLECTOR CURRENT (mA)
20
40
10 30
5.0
20
2.0
Ccb
1.0 0
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100–200 –500 –1000 –1.0 –2.0 –5.0 –10 –20 –50 –100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
–1.0 –500
100 µs
1.0 ms
IC, COLLECTOR CURRENT (mA)
–100
–0.6
MPSA93
–50
1.5 WATT THERMAL
–0.4 LIMITATION @ TC = 25°C MPSA92
625 mW THERMAL
–20 LIMITATION @ TA = 25°C
–0.2
VCE(sat) @ IC/IB = 10 mA –10 BONDING WIRE LIMITATION
SECOND BREAKDOWN
LIMITATION TJ = 150°C
0 –5.0
–1.0 –2.0 –5.0 –10 –20 –50 –100 –3.0 –5.0 –10 –20 –30 –50 –100 –200 –300
IC, COLLECTOR CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
MAXIMUM RATINGS 4
Rating Symbol Value Unit
Collector-Emitter Voltage VCEO 300 Vdc 1
2
3
Collector-Base Voltage VCBO 300 Vdc
Collector-Emitter Voltage VCER 300 Vdc CASE 318E-04, STYLE 1
SOT–223 (TO-261AA)
Emitter-Base Voltage VEBO 5.0 Vdc
Collector Current IC 100 mAdc
Total Power Dissipation up to TA = 25°C PD 1.5 Watts
Storage Temperature Range Tstg – 65 to +150 °C
Junction Temperature TJ 150 °C
DEVICE MARKING
DC
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance RθJA 83.3 °C/W
from Junction-to-Ambient(1)
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 in2.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
DYNAMIC CHARACTERISTICS
Current–Gain — Bandwidth Product fT 60 — MHz
(IC = 10 mAdc, VCE = 10 Vdc, f = 35 MHz)
Feedback Capacitance Cre — 1.6 pF
(VCE = 30 Vdc, IC = 0, f = 1.0 MHz)
PNP SILICON
BASE
TRANSISTOR
1
SURFACE MOUNT
EMITTER 3
MAXIMUM RATINGS 4
Rating Symbol Value Unit
1
Collector-Emitter Voltage VCEO – 300 Vdc 2
3
Collector-Base Voltage VCBO –300 Vdc
Collector-Emitter Voltage VCER – 300 Vdc CASE 318E-04, STYLE 1
SOT–223 (TO-261AA)
Emitter-Base Voltage VEBO – 5.0 Vdc
Collector Current IC –100 mAdc
Total Power Dissipation up to PD 1.5 Watts
TA = 25°C(1)
Storage Temperature Range Tstg – 65 to +150 °C
Junction Temperature TJ 150 °C
DEVICE MARKING
DF
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance from Junction to RθJA 83.3 °C/W
Ambient(1)
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage V(BR)CEO – 300 — Vdc
(IC = –1.0 mAdc, IB = 0)
Collector-Base Breakdown Voltage V(BR)CBO –300 — Vdc
(IC = –100 µAdc, IE = 0)
Collector-Emitter Breakdown Voltage V(BR)CER –300 — Vdc
(IC = –100 µAdc, RBE = 2.7 kΩ)
Emitter-Base Breakdown Voltage V(BR)EBO – 5.0 — Vdc
(IE = –10 µAdc, IC = 0)
Collector-Base Cutoff Current ICBO — –10 nAdc
(VCB = – 200 Vdc, IE = 0)
Collector–Emitter Cutoff Current ICER
(VCE = – 250 Vdc, RBE = 2.7 kΩ) — –50 nAdc
(VCE = – 200 Vdc, RBE = 2.7 kΩ, TJ = 150°C) — –10 µAdc
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 in2.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 3
DYNAMIC CHARACTERISTICS
Current-Gain — Bandwidth Product fT 60 — MHz
(VCE = – 10 Vdc, IC = –10 mAdc, f = 35 MHz)
Feedback Capacitance Cre — 1.6 pF
(VCE = – 30 Vdc, IC = 0, f = 1.0 MHz)
2
BASE
1
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 400 Vdc CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Base Voltage VCBO 450 Vdc
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 300 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watt
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 400 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Emitter Breakdown Voltage V(BR)CES 450 — Vdc
(IC = 100 µAdc, VBE = 0)
Collector – Base Breakdown Voltage V(BR)CBO 450 — Vdc
(IC = 100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — 0.1 µAdc
(VCB = 400 Vdc, IE = 0)
Collector Cutoff Current ICES — 500 nAdc
(VCE = 400 Vdc, VBE = 0)
Emitter Cutoff Current IEBO — 0.1 µAdc
(VEB = 4.0 Vdc, IC = 0)
DYNAMIC CHARACTERISTICS
High Frequency Current Gain |hfe| 1.0 —
(IC = 10 mAdc, VCE = 10 Vdc, f = 20 MHz)
140 TA = 125°C
0.4 IC = 1.0 mA IC = 10 mA IC = 50 mA
hFE, DC CURRENT GAIN
120 VCE = 10 V
100 0.3
TA = 25°C
25°C
80 0.2
60
0.1
40
–55°C
20 0
1.0 2.0 5.0 10 20 50 100 200 300 10 30 100 300 1.0 k 3.0 k 10 k 50 k
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
1.0 1000
TA = 25°C 1.0 ms 100 µs
TA = 25°C
100
0.6 VBE(on) @ VCE = 10 V
20
0.4
10 CURRENT LIMIT
THERMAL LIMIT
0.2 VCE(sat) @ IC/IB = 10 SECOND BREAKDOWN LIMIT
2.0 VALID FOR DUTY CYCLE ≤ 10%
0 1.0
0.1 0.3 1.0 3.0 10 30 100 300 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) VCE, COLLECTOR VOLTAGE (VOLTS)
100 10
Cib
|h fe |, SMALL–SIGNAL CURRENT GAIN
50
C, CAPACITANCE (pF)
20
10 VCE = 10 V
Cob
f = 10 MHz
3.0 TA = 25°C
5.0
2.0
1.0 0
0.5 –4.0 V
VCC = 150 V
IC/IB = 10 VCC
0.2 TA = 25°C tr
RL
VBE(off) = 4.0 Vdc td
0.1 Vout
1.0 3.0 10 30 50 100
RB
IC, COLLECTOR CURRENT (mA) Vin
CS ≤ 4.0 pF*
10
Vin
5.0 +10.7 V
ts
2.0 PW = 50 µs
DUTY CYCLE = 2.0%
t, TIME ( µs)
1.0
0.5 tf
VCC = 150 V –11.4 V
IC/IB = 10 VCC
0.2 TA = 25°C
RL
0.1
1.0 3.0 10 30 50 100 Vout
IC, COLLECTOR CURRENT (mA) RB
Vin
CS ≤ 4.0 pF*
VHF Transistor
NPN Silicon
COLLECTOR
BF959
1
3
BASE
2
EMITTER
MAXIMUM RATINGS
Rating Symbol Value Unit 1
2
Collector – Emitter Voltage VCEO 20 Vdc 3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0) V(BR)CEO 20 — — Vdc
Collector – Base Breakdown Voltage (IC = 10 mAdc, IE = 0) V(BR)CBO 30 — — Vdc
Emitter – Base Breakdown Voltage (IE = 10 mAdc, IC = 0) V(BR)EBO 3.0 — — Vdc
Collector Cutoff Current (VCB = 20 Vdc, IE = 0) ICBO — — 100 nAdc
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 5.0 mAdc, VCE = 10 Vdc) 35 — —
(IC = 20 mAdc, VCE = 10 Vdc) 40 — —
Collector – Emitter Saturation Voltage (IC = 30 mAdc, IB = 2.0 mAdc) VCE(sat) — — 1.0 Vdc
Base – Emitter Saturation Voltage (IC = 30 mAdc, IB = 2.0 mAdc) VBE(sat) — — 1.0 Vdc
500
200
hFE , DC CURRENT GAIN
200
100
mV
100
50
50 40
40 30
30
20 20
10 10
1 2 3 4 5 10 20 30 50 100 1 2 3 4 5 10 20 30 50
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0 1.8
1.8 1.6
1.6 1.4
C, CAPACITANCE (pF)
1.4 1.2
Cib
1.2 1
1 0.8 Cob
0.8 10 V 0.6
2V 5V Cre
0.6 0.4
0.4 0.2
1 2 3 4 5 10 20 30 40 50 100 1 2 3 4 5 10 20 30 50 100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
10 500
b22e
5 g11e 300
4
3 200 g22e
VCE = 10 V
2 VCE = 10 V
100
Y22e ( µs)
Y11e (ms)
1 b11e
50
0.5 40
0.4 30
0.3
0.2 20
0.1 10
1 2 3 4 5 10 20 30 50 100 1 2 3 4 5 10 20 30 50
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
PNP Silicon
COLLECTOR 2,4 SOT–223 PACKAGE
PNP SILICON
BASE
HIGH VOLTAGE
1 TRANSISTOR
SURFACE MOUNT
EMITTER 3
MAXIMUM RATINGS 1
2
Rating Symbol Value Unit 3
DEVICE MARKING
BT2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = –50 mAdc, IB = 0, L = 25 mH) –300 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = –100 mAdc, IE = 0) –300 —
Collector–Emitter Cutoff Current ICES µAdc
(VCE = –250 Vdc, IB = 0) — –50
Collector–Base Cutoff Current ICBO µAdc
(VCB = –280 Vdc, IE = 0) — –1.0
Emitter–Base Cutoff Current IEBO µAdc
(VEB = –6.0 Vdc, IC = 0) — –20
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
DYNAMIC CHARACTERISTICS
Current Gain – Bandwidth Product fT MHz
(VCE = – 10 Vdc, IC = –10 mAdc, f = 30 MHz) 15 —
Collector–Base Capacitance Cobo pF
(VCB = – 10 Vdc, IE = 0, f = 1.0 MHz) — 15
DEVICE MARKING
SP19A
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance from Junction-to-Ambient RθJA 156 °C/W
Maximum Temperature for Soldering Purposes TL 260 °C
Time in Solder Bath 10 Sec
1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
ON CHARACTERISTICS (2)
DC Current Gain hFE —
(IC = 20 mAdc, VCE = 10 Vdc) 40 —
Current-Gain — Bandwidth Product fT MHz
(IC = 10 mAdc, VCE = 10 Vdc, f = 5.0 MHz) 70 —
Collector-Emitter Saturation Voltage VCE(sat) Vdc
(IC = 50 mAdc, IB = 4.0 mAdc) — 0.5
Base-Emitter Saturation Voltage VBE(sat) Vdc
(IC = 50 mAdc, IB = 4.0 mAdc) — 1.3
This NPN small signal darlington transistor is designed for use in switching
applications, such as print hammer, relay, solenoid and lamp drivers. The device is MEDIUM POWER
housed in the SOT-223 package, which is designed for medium power surface mount NPN SILICON
applications. DARLINGTON
• The SOT-223 Package can be soldered using wave or reflow. The formed TRANSISTOR
leads absorb thermal stress during soldering, eliminating the possibility of SURFACE MOUNT
damage to the die
• Available in 12 mm Tape and Reel
Use BSP52T1 to order the 7 inch/1000 unit reel 4
COLLECTOR 2,4
Use BSP52T3 to order the 13 inch/4000 unit reel
• PNP Complement is BSP62T1 BASE 1
1 2
3
DEVICE MARKING
AS3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance – Junction-to-Ambient (surface mounted) RθJA 156 °C/W
Maximum Temperature for Soldering Purposes TL 260 °C
Time in Solder Bath 10 Sec
1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
ON CHARACTERISTICS (2)
DC Current Gain hFE —
(IC = 150 mAdc, VCE = 10 Vdc) 1000 —
(IC = 500 mAdc, VCE = 10 Vdc) 2000 —
Collector-Emitter Saturation Voltage VCE(sat) Vdc
(IC = 500 mAdc, IB = 0.5 mAdc) — 1.3
Base-Emitter On Voltage VBE(on) Vdc
(IC = 500 mAdc, IB = 0.5 mAdc) — 1.9
This PNP small signal darlington transistor is designed for use in switching
applications, such as print hammer, relay, solenoid and lamp drivers. The device is MEDIUM POWER
housed in the SOT-223 package which is designed for medium power surface mount PNP SILICON
applications. DARLINGTON
TRANSISTOR
• The SOT-223 Package can be soldered using wave or reflow. The formed SURFACE MOUNT
leads absorb thermal stress during soldering, eliminating the possibility of
damage to the die
• Available in 12 mm Tape and Reel
Use BSP62T1 to order the 7 inch/1000 unit reel. 4
COLLECTOR 2,4
Use BSP62T3 to order the 13 inch/4000 unit reel.
• NPN Complement is BSP52T1 BASE 1
2
1 3
DEVICE MARKING
BS3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance — Junction-to-Ambient (surface mounted) RθJA 83.3 °C/W
Maximum Temperature for Soldering Purposes TL 260 °C
Time in Solder Bath 10 Sec
1. Device mounted on a FR–4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
ON CHARACTERISTICS (2)
DC Current Gain hFE —
(IC = 150 mAdc, VCE = 10 Vdc) 1000 —
(IC = 500 mAdc, VCE = 10 Vdc) 2000 —
Collector-Emitter Saturation Voltage VCE(sat) Vdc
(IC = 500 mAdc, IB = 0.5 mAdc) — 1.3
Base-Emitter On Voltage VBE(on) Vdc
(IC = 500 mAdc, IB = 0.5 mAdc) — 1.9
100 TA = 125°C
hFE, DC CURRENT GAIN (X1.0 K)
70
50
10 V
30 25°C
20 VCE = 2.0 V
5.0 V
10
7.0
5.0 –55°C
3.0
2.0
0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300
IC, COLLECTOR CURRENT (mA)
10 2.0
|h FE |, HIGH FREQUENCY CURRENT GAIN
VCE = 5.0 V
TA = 25°C
4.0 f = 100 MHz 1.6 VBE(sat) @ IC/IB = 100
3.0 TA = 25°C
2.0 V, VOLTAGE (VOLTS)
1.2
1.0 VBE(on) @ VCE = 5.0 V
0.8 VCE(sat) @ IC/IB = 1000
0.4 IC/IB = 100
0.4
0.2
0.1 0
1.0 2.0 5.0 10 20 50 100 200 500 1K 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 300
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0
TA = 25°C
1.8
1.6
IC = 10 mA 50 mA 100 mA 175 mA 300 mA
1.4
1.2
1.0
0.8
0.6
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1K 2K 5K 10K
IB, BASE CURRENT (µA)
1
BASE
2 3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit 2
Collector – Emitter Voltage VCEO –100 Vdc
Collector – Emitter Voltage VCER Vdc CASE 318 – 08, STYLE 6
RBE = 10 kΩ –110 SOT– 23 (TO – 236AB)
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BSS63LT1 = T1
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = –100 µAdc) –100 — —
Collector – Emitter Breakdown Voltage V(BR)CER Vdc
(IC = –10 µAdc, IE = 0, RBE = 10 kΩ) –110 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IE = –10 mAdc, IE = 0) –110 — —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = –10 mAdc) –6.0 — —
Collector Cutoff Current ICBO nAdc
(VCB = –90 Vdc, IE = 0) — — –100
Collector Cutoff Current ICER µAdc
(VCE = –110 Vdc, RBE = 10 kΩ) — — –10
Emitter Cutoff Current IEBO nAdc
(VEB = –6.0 Vdc, IC = 0) — — –200
REV 1
1
BASE
2 3
EMITTER
1
MAXIMUM RATINGS
2
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 80 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Collector – Base Voltage VCBO 120 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 100 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BSS64LT1 = AM
REV 1
1
BASE
2 3
EMITTER
1
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 12 Vdc
Collector – Base Voltage VCBO 20 Vdc
Collector Current — Continuous IC 100 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
BSV52LT1 = B2
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 1.0 mAdc) 12 —
Collector Cutoff Current ICBO
(VCB = 10 Vdc, IE = 0) — 100 nAdc
(VCB = 10 Vdc, IE = 0, TA = 125°C) — 5.0 µAdc
SWITCHING CHARACTERISTICS
Storage Time ts ns
(IC = IB1 = IB2 = 10 mAdc) — 13
Turn–On Time ton ns
(VBE = 1.5 Vdc, IC = 10 mAdc, IB = 3.0 mAdc) — 12
Turn–Off Time toff ns
(IC = 10 mAdc, IB = 3.0 mAdc) — 18
R1 = 10 kΩ
R2 = 47 kΩ
DEVICE MARKING
DTA114YE = 59
THERMAL CHARACTERISTICS
Power Dissipation @ TA = 25°C(1) PD *125 mW
Operating and Storage Temperature Range TJ, Tstg – 55 to +150 °C
Junction Temperature TJ 150 °C
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
REV 1
1 180
TA = 75°C
140
25°C
0.1 120 –25°C
75°C
100
80
0.01 60
40
20
0.001 0
0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100
IO, OUTPUT CURRENT (mA) IO, OUTPUT CURRENT (mA)
100 10
TA = 75°C 25°C VO = 0.2 V 25°C
V I , INPUT VOLTAGE (VOLTS)
IO, OUTPUT CURRENT (mA)
TA = –25°C
–25°C 75°C
10 1
VO = 5 V
1 0.1
0 2 4 6 8 10 0 10 20 30 40 50
VI, INPUT VOLTAGE (V) IO, OUTPUT CURRENT (mA)
Figure 3. Output Current versus Input Voltage Figure 4. Input Voltage versus Output Current
+12 V
4.5
4 f = 1 MHz
lE = 0 V
3.5 TA = 25°C
Cob , CAPACITANCE (pF)
3 Typical Application
for PNP BRTs
2.5
2
1.5
1 LOAD
0.5
0
0 2 4 6 8 10 15 20 25 30 35 40 45 50
VR, REVERSE BIAS VOLTAGE (VOLTS)
R1 = 4.7 kΩ
R2 = 4.7 kΩ
DEVICE MARKING
DTA143EE = 43
THERMAL CHARACTERISTICS
Power Dissipation @ TA = 25°C(1) PD *125 mW
Operating and Storage Temperature Range TJ, Tstg – 55 to +150 °C
Junction Temperature TJ 150 °C
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
R1 = 10 kΩ GND (2)
DEVICE MARKING
DTC114TE = 94
THERMAL CHARACTERISTICS
Power Dissipation @ TA = 25°C(1) PD *125 mW
Operating and Storage Temperature Range TJ, Tstg – 55 to +150 °C
Junction Temperature TJ 150 °C
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
DEVICE MARKING
DTC114YE = 69
THERMAL CHARACTERISTICS
Power Dissipation @ TA = 25°C(1) PD *125 mW
Operating and Storage Temperature Range TJ, Tstg – 55 to +150 °C
Junction Temperature TJ 150 °C
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
REV 1
1 300
VO(on) = 10 TA = 75°C
TA = –25°C 250
25°C 25°C
0.1 200
75°C –25°C
150
0.01 100
50
0.001 0
0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100
IO, OUTPUT CURRENT (mA) IO, OUTPUT CURRENT (mA)
100 10
75°C
–25°C
10 1
VO = 5 V
1 0.1
0 2 4 6 8 10 0 10 20 30 40 50
VI, INPUT VOLTAGE (V) IO, OUTPUT CURRENT (mA)
Figure 3. Output Current versus Input Voltage Figure 4. Input Voltage versus Output Current
3.5 f = 1 MHz
lE = 0 V
3 TA = 25°C
Cob , CAPACITANCE (pF)
2.5
1.5
0.5
0
0 2 4 6 8 10 15 20 25 30 35 40 45 50
VR, REVERSE BIAS VOLTAGE (VOLTS)
+12 V
ISOLATED
LOAD
FROM µP OR
OTHER LOGIC
+12 V
VCC
OUT
IN
LOAD
Figure 7. Open Collector Inverter: Inverts the Input Signal Figure 8. Inexpensive, Unregulated Current Source
MBT3904DW1T1
Dual General Purpose Transistors MBT3906DW1T1
The MBT3904DW1T1, MBT3906DW1T1, and MBT3946DW1T1 devices are
MBT3946DW1T1
spin–offs of our popular SOT–23/SOT–323 three–leaded devices. They are designed
for general purpose amplifier applications and are housed in the SOT–363 six–leaded
surface mount package. By putting two discrete devices in one package, these
devices are ideal for low–power surface mount applications where board space is at
MBT3904DW1T1
a premium. MBT3906DW1T1
• hFE, 100–300 MBT3946DW1T1
• Low VCE(sat), ≤ 0.4 V 6 5
4
• Simplifies Circuit Design
• Reduces Board Space 1
2
• Reduces Component Count 3
• Available in 8 mm, 7–inch/3,000 Unit Tape and Reel CASE 419B–01, STYLE 1
MBT3904DW1T1
(3) (2) (1)
MAXIMUM RATINGS
Rating Symbol Value Unit Q1 Q2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit (4) (5) (6)
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) MBT3904DW1T1 (NPN) 40 —
(IC = –1.0 mAdc, IB = 0) MBT3906DW1T1 (PNP) –40 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 10 mAdc, IE = 0) MBT3904DW1T1 (NPN) 60 —
(IC = –10 mAdc, IE = 0) MBT3906DW1T1 (PNP) –40 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 mAdc, IC = 0) MBT3904DW1T1 (NPN) 6.0 —
(IE = –10 mAdc, IC = 0) MBT3906DW1T1 (PNP) –5.0 —
Base Cutoff Current IBL nAdc
(VCE = 30 Vdc, VEB = 3.0 Vdc) MBT3904DW1T1 (NPN) — 50
(VCE = –30 Vdc, VEB = –3.0 Vdc) MBT3906DW1T1 (PNP) — –50
Collector Cutoff Current ICEX nAdc
(VCE = 30 Vdc, VEB = 3.0 Vdc) MBT3904DW1T1 (NPN) — 50
(VCE = –30 Vdc, VEB = –3.0 Vdc) MBT3906DW1T1 (PNP) — –50
ON CHARACTERISTICS (2)
DC Current Gain hFE —
(IC = 0.1 mAdc, VCE = 1.0 Vdc) MBT3904DW1T1 (NPN) 40 —
(IC = 1.0 mAdc, VCE = 1.0 Vdc) 70 —
(IC = 10 mAdc, VCE = 1.0 Vdc) 100 300
(IC = 50 mAdc, VCE = 1.0 Vdc) 60 —
(IC = 100 mAdc, VCE = 1.0 Vdc) 30 —
SWITCHING CHARACTERISTICS
Delay Time (VCC = 3.0 Vdc, VBE = – 0.5 Vdc) MBT3904DW1T1 (NPN) td — 35
(VCC = –3.0 Vdc, VBE = 0.5 Vdc) MBT3906DW1T1 (PNP) — 35
ns
Rise Time (IC = 10 mAdc, IB1 = 1.0 mAdc) MBT3904DW1T1 (NPN) tr — 35
(IC = –10 mAdc, IB1 = –1.0 mAdc) MBT3906DW1T1 (PNP) — 35
Storage Time (VCC = 3.0 Vdc, IC = 10 mAdc) MBT3904DW1T1 (NPN) ts — 200
(VCC = –3.0 Vdc, IC = –10 mAdc) MBT3906DW1T1 (PNP) — 225
ns
Fall Time (IB1 = IB2 = 1.0 mAdc) MBT3904DW1T1 (NPN) tf — 50
(IB1 = IB2 = –1.0 mAdc) MBT3906DW1T1 (PNP) — 75
+3 V +3 V
DUTY CYCLE = 2% 10 < t1 < 500 ms t1
300 ns +10.9 V
+10.9 V DUTY CYCLE = 2%
275 275
10 k 10 k
0
– 0.5 V
< 1 ns Cs < 4 pF* 1N916 Cs < 4 pF*
– 9.1 V′
< 1 ns
Figure 1. Delay and Rise Time Figure 2. Storage and Fall Time
Equivalent Test Circuit Equivalent Test Circuit
10 5000
MBT3904DW1T1 (NPN) VCC = 40 V MBT3904DW1T1 (NPN)
3000
7.0 IC/IB = 10
2000
CAPACITANCE (pF)
5.0
Q, CHARGE (pC)
1000
700
Cibo
3.0 500
300 QT
2.0 Cobo 200
QA
100
70
1.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
500 500
IC/IB = 10 VCC = 40 V
300 300
IC/IB = 10
200 200
100 100
50 50
30 30
40 V
20 20
15 V
10 10 MBT3904DW1T1 (NPN)
MBT3904DW1T1 (NPN)
7 td @ VOB = 0 V 2.0 V 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 5. Turn – On Time Figure 6. Rise Time
500 500
t′s = ts – 1/8 tf VCC = 40 V
300 IB1 = IB2 300
IC/IB = 20 IC/IB = 10 IB1 = IB2
200 200
IC/IB = 20
t s′ , STORAGE TIME (ns)
12 14
SOURCE RESISTANCE = 200 W f = 1.0 kHz IC = 1.0 mA
IC = 1.0 mA 12
10
NF, NOISE FIGURE (dB)
h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25°C)
300 100
200
h fe , CURRENT GAIN
20
10
100
70 5
50
2
30 1
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
7.0
h ie , INPUT IMPEDANCE (k OHMS)
2.0 2.0
1.0
1.0
0.5
0.7
0.2 0.5
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 +25°C
0.7
0.5 – 55°C
0.3
0.2
0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
1.0
MBT3904DW1T1 (NPN) TJ = 25°C
0.8
IC = 1.0 mA 10 mA 30 mA 100 mA
0.6
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)
1.2 1.0
TJ = 25°C MBT3904DW1T1 (NPN) MBT3904DW1T1 (NPN)
1.0 VBE(sat) @ IC/IB =10 0.5 +25°C TO +125°C
qVC FOR VCE(sat)
COEFFICIENT (mV/ °C)
V, VOLTAGE (VOLTS)
0 – 2.0
1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
3V 3V
+9.1 V < 1 ns
275 275
< 1 ns
+0.5 V 10 k 10 k
0
Cs < 4 pF* 1N916 Cs < 4 pF*
10.6 V
300 ns 10 < t1 < 500 ms
DUTY CYCLE = 2% t1 10.9 V
DUTY CYCLE = 2%
Figure 19. Delay and Rise Time Figure 20. Storage and Fall Time
Equivalent Test Circuit Equivalent Test Circuit
10 5000
VCC = 40 V
MBT3906DW1T1 (PNP) 3000 MBT3906DW1T1 (PNP)
7.0 IC/IB = 10
2000
CAPACITANCE (pF)
5.0 Cobo
Q, CHARGE (pC)
1000
700
Cibo
3.0 500
300
2.0 200 QT
QA
100
70
1.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS (VOLTS) IC, COLLECTOR CURRENT (mA)
100 100
70 70
TIME (ns)
50 tr @ VCC = 3.0 V 50
30 15 V 30
20 20 IC/IB = 10
40 V
10 2.0 V 10
7 td @ VOB = 0 V 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
5.0 12
SOURCE RESISTANCE = 200 W f = 1.0 kHz IC = 1.0 mA
IC = 1.0 mA
10
4.0
SOURCE RESISTANCE = 200 W IC = 0.5 mA
NF, NOISE FIGURE (dB)
h PARAMETERS
(VCE = – 10 Vdc, f = 1.0 kHz, TA = 25°C)
300 100
hoe, OUTPUT ADMITTANCE (m mhos)
50
h fe , DC CURRENT GAIN
200
30
100 20
70
10
50
7
30 5
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
20 10
7.0
h ie , INPUT IMPEDANCE (k OHMS)
3.0 3.0
2.0 2.0
1.0
0.7
1.0
0.5
0.7
0.3
0.2 0.5
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 +25°C
0.7
– 55°C
0.5
0.3
MBT3906DW1T1 (PNP)
0.2
0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
1.0
MBT3906DW1T1 (PNP) TJ = 25°C
0.8
IC = 1.0 mA 10 mA 30 mA 100 mA
0.6
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)
1.0 1.0
q V , TEMPERATURE COEFFICIENTS (mV/ °C)
0
0.6 – 55°C TO +25°C
MBT3906DW1T1 (PNP) MBT3906DW1T1 (PNP)
– 0.5
0.4 +25°C TO +125°C
– 1.0
VCE(sat) @ IC/IB = 10 – 55°C TO +25°C
0.2 qVB FOR VBE(sat)
– 1.5
0 – 2.0
1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1
BASE
3
2
EMITTER 1
2
MAXIMUM RATINGS
CASE 318 – 08, STYLE 6
Rating Symbol Value Unit SOT– 23 (TO – 236AB)
Collector–Emitter Voltage VCEO –35 Vdc
Collector–Base Voltage VCBO –40 Vdc
Emitter–Base Voltage VEBO –25 Vdc
Collector Current — Continuous IC –150 mAdc
DEVICE MARKING
MMBT404ALT1 = 2N
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board,* PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RθJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,** TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RθJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
* FR–5 = 1.0 x 0.75 x 0.062 in.
** Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage V(BR)CEO –35 — — Vdc
(IC = –10 mAdc, IB = 0)
Collector–Emitter Breakdown Voltage V(BR)CBO –40 — — Vdc
(IC = –10 µAdc, IE = 0)
Emitter–Base Breakdown Voltage V(BR)EBO –25 — — Vdc
(IE = –10 µAdc, IC = 0)
Collector Cutoff Current ICBO — — –100 nAdc
(VCB = –10 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — –100 nAdc
(VEB = –10 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
ON CHARACTERISTICS
DC Current Gain hFE 100 — 400 —
(IC = –12 mAdc, VCE = –0.15 Vdc)
Collector–Emitter Saturation Voltage VCE(sat) Vdc
(IC = –12 mAdc, IB = –0.4 mAdc) — — –0.15
(IC = –24 mAdc, IB = –1.0 mAdc) — — –0.2
Base–Emitter Saturation Voltage VBE(sat) Vdc
(IC = –12 mAdc, IB = –0.4 mAdc) — — –0.85
(IC = –24 mAdc, IB = –1.0 mAdc) — — –1.0
SMALL–SIGNAL CHARACTERISTICS
Output Capacitance Cobo — — 20 pF
(VCB = –6.0 Vdc, IE = 0, f = 1.0 MHz)
SWITCHING CHARACTERISTICS
Delay time td — 43 — ns
(VCC = –10 Vdc, IC = –10 mAdc) (Figure 1)
Rise Time tr — 180 — ns
(IB1 = –1.0 mAdc, VBE(off) = –14 Vdc)
Storage Time ts — 675 — ns
(VCC = –10 Vdc, IC = –10 mAdc)
Fall Time tf — 160 — ns
(IB1 = IB2 = –1.0 mAdc) (Figure 1)
RBB
1.0 k
1.0 k
TO SCOPE
0.1 µF RB
Vin
10 k
51
Vin VBB
(Volts) (Volts)
ton, td, tr –12 +1.4
toff, ts and tf +20.6 –11.6
Voltages and resistor values shown are
for IC = 10 mA, IC/IB = 10 and IB1 = IB2
VHF/UHF Transistor
MMBT918LT1
NPN Silicon
COLLECTOR
3
1
BASE
3
2
EMITTER 1
MAXIMUM RATINGS
2
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 15 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Collector – Base Voltage VCBO 30 Vdc
Emitter – Base Voltage VEBO 3.0 Vdc
Collector Current — Continuous IC 50 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board,(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT918LT1 = M3B
VBB VCC
EXTERNAL
100 k 1000 pF BYPASS
0.018 µF
C RF
0.018 µF 50 Ω VM
3 G
0.018 µF
0.018 µF
NF TEST CONDITIONS
IC = 1.0 mA
VCE = 6.0 VOLTS
RS = 50 Ω
f = 60 MHz
MMBT1010LT1
Low Saturation Voltage MSD1010T1
PNP Silicon Driver Transistors Motorola Preferred Devices
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Condition Min Max Unit
Collector-Emitter Breakdown Voltage V(BR)CEO IC = 10 mA, IB = 0 15 — Vdc
Emitter-Base Breakdown Voltage V(BR)EBO IE = 10 µA, IE = 0 5.0 — Vdc
Collector-Base Cutoff Current ICBO VCB = 20 V, IE = 0 — 0.1 µA
Collector-Emitter Cutoff Current ICEO VCE = 10 V, IB = 0 — 100 µA
DC Current Gain hFE1(2) VCE = 5 V, IC = 100 mA 300 600 —
Collector-Emitter Saturation Voltage VCE(sat)(2) IC = 10 mA, IB = 1.0 mA — 0.1 Vdc
IC = 50 mA, IB = 5.0 mA — 0.1
IC = 100 mA, IB = 10 mA 0.19
Base-Emitter Saturation Voltage VBE(sat)(2) IC = 100 mA, IB = 10 mA — 1.1 Vdc
(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
(2) Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
Preliminary Information
General Purpose Transistor MMBT2222AWT1
NPN Silicon Motorola Preferred Device
1
1
BASE
2
2
CASE 419 – 02, STYLE 3
EMITTER
SOT– 323/SC – 70
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 40 Vdc
Collector – Base Voltage VCBO 75 Vdc
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 600 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board PD 150 mW
TA = 25°C
Thermal Resistance Junction to Ambient RqJA 833 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT2222AWT1 = 1P
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 40 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 75 — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 10 mAdc, IC = 0)
Base Cutoff Current IBL — 20 nAdc
(VCE = 60 Vdc, VEB = 3.0 Vdc)
Collector Cutoff Current ICEX — 10 nAdc
(VCE = 60 Vdc, VEB = 3.0 Vdc)
SWITCHING CHARACTERISTICS
Delay Time ((VCC = 3.0 Vdc, VBE = – 0.5 Vdc, td — 10
ns
Rise Time IC = 150 mAdc, IB1 = 15 mAdc) tr — 25
Storage Time ((VCC = 30 Vdc, IC = 150 mAdc, ts — 225
ns
Fall Time IB1 = IB2 = 15 mAdc) tf — 60
1
BASE
2 3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol 2222 2222A Unit 2
Collector – Emitter Voltage VCEO 30 40 Vdc
Collector – Base Voltage VCBO 60 75 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Emitter – Base Voltage VEBO 5.0 6.0 Vdc
Collector Current — Continuous IC 600 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT2222LT1 = M1B; MMBT2222ALT1 = 1P
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0) MMBT2222 V(BR)CEO 30 — Vdc
MMBT2222A 40 —
Emitter – Base Breakdown Voltage (IE = 10 mAdc, IC = 0) MMBT2222 V(BR)EBO 5.0 — Vdc
MMBT2222A 6.0 —
Collector Cutoff Current (VCE = 60 Vdc, VEB(off) = 3.0 Vdc) MMBT2222A ICEX — 10 nAdc
Collector Cutoff Current (VCB = 50 Vdc, IE = 0) MMBT2222 ICBO — 0.01 µAdc
(VCB = 60 Vdc, IE = 0) MMBT2222A — 0.01
(VCB = 50 Vdc, IE = 0, TA = 125°C) MMBT2222 — 10
(VCB = 60 Vdc, IE = 0, TA = 125°C) MMBT2222A — 10
Emitter Cutoff Current (VEB = 3.0 Vdc, IC = 0) MMBT2222A IEBO — 100 nAdc
Base Cutoff Current (VCE = 60 Vdc, VEB(off) = 3.0 Vdc) MMBT2222A IBL — 20 nAdc
1. FR– 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4 0.024 in. 99.5% alumina.
0.3
Preferred devices are Motorola recommended choices for future use and best overall value.
+ 30 V + 30 V
1.0 to 100 µs, 1.0 to 100 µs, 200
200
+16 V DUTY CYCLE ≈ 2.0%
+16 V DUTY CYCLE ≈ 2.0%
0 0
1 kΩ –14 V 1k CS* < 10 pF
–2 V CS* < 10 pF
< 2 ns < 20 ns
1N914
1000
700
500
hFE , DC CURRENT GAIN
300
200
100
70
50
30
20
10
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (mA)
1.0
0.8
0.6
0.4
0.2
0
0.005 0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50
IB, BASE CURRENT (mA)
30
t, TIME (ns)
70
20 tf
50
30
10
7.0 20
5.0
10
3.0 7.0
2.0 5.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
10 10
RS = OPTIMUM f = 1.0 kHz
IC = 1.0 mA, RS = 150 Ω RS = SOURCE
8.0 RS = RESISTANCE 8.0
500 µA, RS = 200 Ω IC = 50 µA
NF, NOISE FIGURE (dB)
4.0 4.0
2.0 2.0
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (OHMS)
30 500
VCE = 20 V
20 TJ = 25°C
300
Ceb
CAPACITANCE (pF)
10 200
7.0
5.0
100
Ccb
3.0 70
2.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
VBE(sat) @ IC/IB = 10
1.0 V – 0.5
0.6
VBE(on) @ VCE = 10 V – 1.0
0.4
– 1.5
0.2
– 2.0 RqVB for VBE
VCE(sat) @ IC/IB = 10
0 – 2.5
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2
MAXIMUM RATINGS EMITTER 3
Rating Symbol Value Unit
1
Collector – Emitter Voltage VCEO 15 Vdc
2
Collector – Emitter Voltage VCES 40 Vdc
Collector – Base Voltage VCBO 40 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Emitter – Base Voltage VEBO 4.5 Vdc
Collector Current — Continuous IC 200 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT2369LT1 = M1J; MMBT2369ALT1 = 1JA
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage (3) V(BR)CEO Vdc
(IC = 10 mAdc, IB = 0) 15 — —
Collector – Emitter Breakdown Voltage V(BR)CES Vdc
(IC = 10 µAdc, VBE = 0) 40 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 10 mAdc, IE = 0) 40 — —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 mAdc, IC = 0) 4.5 — —
Collector Cutoff Current ICBO µAdc
(VCB = 20 Vdc, IE = 0) — — 0.4
(VCB = 20 Vdc, IE = 0, TA = 150°C) — — 30
Collector Cutoff Current ICES µAdc
(VCE = 20 Vdc, VBE = 0) MMBT2369A — — 0.4
1. FR– 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3 0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
SWITCHING CHARACTERISTICS
Storage Time ts ns
(IB1 = IB2 = IC = 10 mAdc) — 5.0 13
Turn–On Time ton ns
(VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc) — 8.0 12
Turn–Off Time toff ns
(VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc, IB2 = 1.5 mAdc) — 10 18
t1 270 Ω t1 270 Ω
+10.6 V 3V +10.75 V
0 0
–1.5 V < 1 ns –9.15 V
3.3 k Cs* < 4 pF < 1 ns 3.3 k Cs* < 4 pF
PULSE WIDTH (t1) = 300 ns PULSE WIDTH (t1) = 300 ns
DUTY CYCLE = 2% DUTY CYCLE = 2%
95 Ω t1 95 Ω
t1 10 V 10 V
+10.8 V +11.4 V
0
0 –8.6 V
–2 V 1k Cs* < 12 pF
< 1 ns 1k Cs* < 12 pF < 1 ns
PULSE WIDTH (t1) = 300 ns PULSE WIDTH (t1) BETWEEN 1N916
DUTY CYCLE = 2% 10 AND 500 µs
DUTY CYCLE = 2%
TO OSCILLOSCOPE
TURN–ON WAVEFORMS
INPUT IMPEDANCE = 50 Ω
Vin 0.1 µF RISE TIME = 1 ns
10% 220 Ω
0 Vout TURN–OFF WAVEFORMS
Vout 3.3 kΩ
90% Vin 0 10%
ton Vin
3.3 k 50 Ω
0.0023 µF 0.0023 µF 90%
PULSE GENERATOR 50 Ω 0.005 µF 0.005 µF
Vout
Vin RISE TIME < 1 ns
SOURCE IMPEDANCE = 50 Ω VBB = +12 V
VBB +– 0.1 µF 0.1 µF +V =3V
PW ≥ 300 ns – CC toff Vin = –15 V
DUTY CYCLE < 2%
6 100
5 TJ = 25°C LIMIT βF = 10
TYPICAL VCC = 10 V
50
4 VOB = 2 V
SWITCHING TIMES (nsec)
CAPACITANCE (pF)
Cib tf
3 Cob tr (VCC = 3 V)
20 VCC = 10 V
tr
2 10
5 ts
td
1 2
0.1 0.2 0.5 1.0 2.0 5.0 10 1 2 5 10 20 50 100
REVERSE BIAS (VOLTS) IC, COLLECTOR CURRENT (mA)
10 pF MAX
100 ∆V
0
< 1 ns Cs* < 4 pF
50 4.3 k
PULSE WIDTH (t1) = 5 µs
QA, VCC = 10 V DUTY CYCLE = 2%
20 QA, VCC = 3 V
Figure 9. QT Test Circuit
10
1 2 5 10 20 50 100
IC, COLLECTOR CURRENT (mA)
t1 980
C < COPT +6 V 10 V
C=0 0
C COPT –4 V
< 1 ns 500 Cs* < 3 pF
PULSE WIDTH (t1) = 300 ns
TIME
DUTY CYCLE = 2%
Figure 10. Turn–Off Waveform Figure 11. Storage Time Equivalent Test Circuit
VCE , MAXIMUM COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.0
TJ = 25°C
0.8
IC = 3 mA IC = 10 mA IC = 30 mA IC = 50 mA IC = 100 mA
0.6
0.4
0.2
0.02 0.05 0.1 0.2 0.5 1 2 5 10 20
IB, BASE CURRENT (mA)
–55°C
20
1 2 5 10 20 50 100
IC, COLLECTOR CURRENT (mA)
1.4 1.0
βF = 10
V(sat) , SATURATION VOLTAGE (VOLTS)
0.2 –2.5
1 2 5 10 20 50 100 0 10 20 30 40 50 60 70 80 90 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 14. Saturation Voltage Limits Figure 15. Typical Temperature Coefficients
1
BASE
2 3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit 2
Collector – Emitter Voltage VCEO 60 Vdc
Collector – Base Voltage VCBO 60 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 50 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT2484LT1 = 1U
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 10 mAdc, IB = 0) 60 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 10 mAdc, IE = 0) 60 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 mAdc, IC = 0) 5.0 —
Collector Cutoff Current ICBO
(VCB = 45 Vdc, IE = 0) — 10 nAdc
(VCB = 45 Vdc, IE = 0, TA = 150°C) — 10 µAdc
Emitter Cutoff Current IEBO nAdc
(VEB = 5.0 Vdc, IC = 0) — 10
1. FR– 5 = 1.0 0.062 in.
0.75
2. Alumina = 0.4 0.024 in. 99.5% alumina.
0.3
RS
in
en
IDEAL
TRANSISTOR
NOISE VOLTAGE
30 30
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
20 20
IC = 10 mA RS ≈ 0 RS ≈ 0
en , NOISE VOLTAGE (nV)
10 20
BANDWIDTH = 1.0 Hz
7.0
5.0
IC = 10 mA 16
In, NOISE CURRENT (pA)
2.0 3.0 mA
12
1.0 mA
1.0
IC = 1.0 mA
0.7 500 µA
300 µA 8.0
0.5
100 µA
0.3 100 µA
4.0 10 µA
0.2
10 µA 30 µA
RS ≈ 0
0.1 0
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) RS, SOURCE RESISTANCE (OHMS)
16 IC = 10 mA 3.0 mA
100 100 µA
NF, NOISE FIGURE (dB)
70 3.0 mA 1.0 mA
50 12
1.0 mA
30 300 µA
300 µA
20 30 µA 8.0
100 µA
10
10 µA
7.0 4.0 30 µA
10 µA
5.0
BANDWIDTH = 1.0 Hz
3.0 0
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
RS, SOURCE RESISTANCE (OHMS) RS, SOURCE RESISTANCE (OHMS)
0.5
0.4
0.3
0.2
0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA)
1.0 – 0.4
0.2 – 2.0
– 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
8.0 500
6.0 TJ = 25°C
300
Cob Cib
C, CAPACITANCE (pF)
4.0 Ceb
200
3.0 Ccb
2.0
100
VCE = 5.0 V
70
1.0 TJ = 25°C
0.8 50
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
Preliminary Information
General Purpose Transistor MMBT2907AWT1
PNP Silicon Motorola Preferred Device
1
1
BASE
2
2
CASE 419 – 02, STYLE 3
EMITTER
SOT– 323/SC – 70
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO –60 Vdc
Collector – Base Voltage VCBO –60 Vdc
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –600 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 150 mW
TA = 25°C
Thermal Resistance Junction to Ambient RqJA 833 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT2907AWT1 = 2F
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO –60 — Vdc
(IC = –10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –60 — Vdc
(IC = –10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — Vdc
(IE = –10 mAdc, IC = 0)
Base Cutoff Current IBL — –50 nAdc
(VCE = –30 Vdc, VEB(off) = –0.5 Vdc)
Collector Cutoff Current ICEX — –50 nAdc
(VCE = –30 Vdc, VEB(off) = –0.5 Vdc)
SWITCHING CHARACTERISTICS
Turn–On Time ton — 45
(VCC = –30
30 Vd
Vdc,
Delay Time td — 10
IC = –150
150 mAdc, IB1 = –15
15 mAdc)
Rise Time tr — 40
ns
Storage Time ts — 80
(VCC = –6.0
6 0 Vd
Vdc, IC = –150
150 mAdc,
Ad
Fall Time tf — 30
IB1 = IB2 = 15 mAdc)
Turn–Off Time toff — 100
1
BASE
2 3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol 2907 2907A Unit 2
Collector – Emitter Voltage VCEO –40 –60 Vdc
Collector – Base Voltage VCBO –60 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –600 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT2907LT1 = M2B; MMBT2907ALT1 = 2F
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(3) V(BR)CEO Vdc
(IC = –10 mAdc, IB = 0) MMBT2907 –40 —
MMBT2907A –60 —
Collector – Base Breakdown Voltage (IC = –10 mAdc, IE = 0) V(BR)CBO –60 — Vdc
Emitter – Base Breakdown Voltage (IE = –10 mAdc, IC = 0) V(BR)EBO –5.0 — Vdc
Collector Cutoff Current (VCE = –30 Vdc, VBE(off) = –0.5 Vdc) ICEX — –50 nAdc
Collector Cutoff Current ICBO µAdc
(VCB = –50 Vdc, IE = 0) MMBT2907 — –0.020
MMBT2907A — –0.010
SWITCHING CHARACTERISTICS
Turn–On Time ton — 45
(VCC = –30
30 Vdc,
Vd IC = –150
150 mAdc,
Ad
Delay Time td — 10 ns
IB1 = –15
15 mAdc)
Rise Time tr — 40
Turn–Off Time toff — 100
(VCC = –6.0
6 0 Vd
Vdc, IC = –150
150 mAdc,
Ad
Storage Time ts — 80 ns
IB1 = IB2 = –15
15 mAdc)
Fall Time tf — 30
INPUT INPUT
Zo = 50 Ω –30 V Zo = 50 Ω +15 V –6.0 V
PRF = 150 PPS PRF = 150 PPS
RISE TIME ≤ 2.0 ns 200 RISE TIME ≤ 2.0 ns
1.0 k 37
P.W. < 200 ns P.W. < 200 ns
1.0 k 1.0 k
0 TO OSCILLOSCOPE 0 TO OSCILLOSCOPE
RISE TIME ≤ 5.0 ns RISE TIME ≤ 5.0 ns
–16 V 50 –30 V 50 1N916
200 ns 200 ns
Figure 1. Delay and Rise Time Test Circuit Figure 2. Storage and Fall Time Test Circuit
3.0
VCE = –1.0 V
hFE , NORMALIZED CURRENT GAIN
25°C
1.0
0.7 – 55°C
0.5
0.3
0.2
–0.1 –0.2 –0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500
IC, COLLECTOR CURRENT (mA)
–1.0
–0.8
IC = –1.0 mA –10 mA –100 mA –500 mA
–0.6
–0.4
–0.2
0
–0.005 –0.01 –0.02 –0.03 –0.05 –0.07 –0.1 –0.2 –0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50
IB, BASE CURRENT (mA)
300 500
200 300 VCC = –30 V
VCC = –30 V
IC/IB = 10 200 IC/IB = 10
100 tr
TJ = 25°C tf IB1 = IB2
70 100 TJ = 25°C
50
t, TIME (ns)
t, TIME (ns)
70
30 50
20 t′s = ts – 1/8 tf
30
td @ VBE(off) = 0 V
20
10
7.0 10
5.0 2.0 V
7.0
3.0 5.0
–5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500
IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT (mA)
10 10
f = 1.0 kHz
8.0 8.0
NF, NOISE FIGURE (dB)
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k
f, FREQUENCY (kHz) Rs, SOURCE RESISTANCE (OHMS)
10
100
7.0 80 VCE = –20 V
60 TJ = 25°C
5.0 Ccb
40
3.0 30
2.0 20
–0.1 –0.2 –0.3 –0.5 –1.0 –2.0 –3.0 –5.0 –10 –20 –30 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –1000
REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
–1.0 +0.5
TJ = 25°C
VBE(sat) @ IC/IB = 10 0
–0.8 RqVC for VCE(sat)
COEFFICIENT (mV/ ° C)
V, VOLTAGE (VOLTS)
–0.2
–2.0 RqVB for VBE
VCE(sat) @ IC/IB = 10
0 –2.5
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1
BASE
2 3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit 2
Collector – Emitter Voltage VCEO –12 Vdc
Collector – Base Voltage VCBO –12 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Emitter – Base Voltage VEBO –4.0 Vdc
Collector Current — Continuous IC –80 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT3640LT1 = 2J
1. FR– 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4 0.024 in. 99.5% alumina.
0.3
Preferred devices are Motorola recommended choices for future use and best overall value.
SWITCHING CHARACTERISTICS
Delay Time ((VCC = –6.0 Vdc, IC = –50 mAdc, td — 10
ns
Rise Time VEB(off) = –1.9 Vdc, IB1 = –5.0 mAdc) tr — 30
Storage Time ((VCC = –6.0 Vdc, IC = –50 mAdc, ts — 20
ns
Fall Time IB1 = IB2 = –5.0 mAdc) tf — 12
Turn–On Time ton ns
(VCC = –6.0 Vdc, IC = –50 mAdc, VEB(off) = –1.9 Vdc, IB1 = –5.0 mAdc) — 25
(VCC = –1.5 Vdc, IC = –10 mAdc, IB1 = –0.5 mAdc) — 60
Turn–Off Time toff ns
(VCC = –6.0 Vdc, IC = –50 mAdc, VEB(off) = –1.9 Vdc, IB1 = IB2 = –5.0 mAdc) — 35
(VCC = –1.5 Vdc, IC = –10 mAdc, IB1 = IB2 = –0.5 mAdc) — 75
110 130
1.0 k 5.0 k
0 Vout 5.0 V Vout
0.1 µF 680 0.1 µF 5.0 k
–6.8 V Vin 0 Vin
PULSE SOURCE TO SAMPLING SCOPE PULSE SOURCE TO SAMPLING SCOPE
51 INPUT Z ≥ 100 k 51 INPUT Z ≥ 100 k
RISE TIME ≤ 1.0 ns RISE TIME ≤ 1.0 ns
PULSE WIDTH ≥ 100 ns RISE TIME ≤ 1.0 ns PULSE WIDTH ≥ 200 ns RISE TIME ≤ 1.0 ns
Zin = 50 OHMS Zin = 50 OHMS
NOTES: Collector Current = 50 mA, NOTES: Collector Current = 10 mA,
FALL TIME ≤ 1.0 ns FALL TIME ≤ 1.0 ns
NOTES: Turn–On and Turn–Off Time NOTES: Turn–On and Turn–Off Time
NOTES: Base Currents = 5.0 mA. NOTES: Base Currents = 0.5 mA.
Figure 1. Figure 2.
V, VOLTAGE (VOLTS)
70
–0.8
50 –55°C
VBE(on) @ VCE = –1.0 V
–0.6
30
–0.4
20
–0.2 VCE(sat) @ IC/IB = 10
10 0
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–1.0 +0.5
*APPLIES FOR IC/IB ≤ hFE/4
–0.4 –1.0
2000 5.0
TJ = 25°C TJ = 25°C
f = 100 MHz VCE = –10 V
3.0
C, CAPACITANCE (pF)
1000
–1.0 V
800 2.0
Cobo
600 Cibo
400 1.0
0.7
200 0.5
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –0.2 –0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
1
BASE
3
2
EMITTER 1
MAXIMUM RATINGS 2
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 40 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Collector – Base Voltage VCBO 60 Vdc
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 200 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT3904LT1 = 1AM
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage (3) V(BR)CEO 40 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 60 — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 10 mAdc, IC = 0)
Base Cutoff Current IBL — 50 nAdc
(VCE = 30 Vdc, VEB = 3.0 Vdc)
Collector Cutoff Current ICEX — 50 nAdc
(VCE = 30 Vdc, VEB = 3.0 Vdc)
1. FR– 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3 0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width v
300 ms, Duty Cycle v
2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
SWITCHING CHARACTERISTICS
Delay Time ((VCC = 3.0 Vdc, VBE = – 0.5 Vdc, td — 35
ns
Rise Time IC = 10 mAdc, IB1 = 1.0 mAdc) tr — 35
Storage Time ((VCC = 3.0 Vdc, ts — 200
ns
Fall Time IC = 10 mAdc, IB1 = IB2 = 1.0 mAdc) tf — 50
10 k 10 k
0
– 0.5 V
< 1 ns CS < 4 pF* 1N916 CS < 4 pF*
– 9.1 V′
< 1 ns
Figure 1. Delay and Rise Time Figure 2. Storage and Fall Time
Equivalent Test Circuit Equivalent Test Circuit
TJ = 25°C
TJ = 125°C
10 5000
VCC = 40 V
3000
7.0 IC/IB = 10
2000
CAPACITANCE (pF)
5.0
Q, CHARGE (pC)
1000
700
Cibo
3.0 500
300 QT
2.0 Cobo 200
QA
100
70
1.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
100 100
50 50
30 30
40 V
20 20
15 V
10 10
7 td @ VOB = 0 V 2.0 V 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 5. Turn – On Time Figure 6. Rise Time
500 500
t′s = ts – 1/8 tf VCC = 40 V
300 IB1 = IB2 300
IC/IB = 20 IC/IB = 10 IB1 = IB2
200 200
IC/IB = 20
t s′ , STORAGE TIME (ns)
10 10
7 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
12 14
SOURCE RESISTANCE = 200 W f = 1.0 kHz IC = 1.0 mA
IC = 1.0 mA 12
10
NF, NOISE FIGURE (dB)
300 100
200
h fe , CURRENT GAIN
20
10
100
70 5
50
2
30 1
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
20 10
10
5.0
5.0
3.0
2.0 2.0
1.0
1.0
0.5
0.7
0.2 0.5
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0
h FE, DC CURRENT GAIN (NORMALIZED)
1.0 +25°C
0.7
0.5 – 55°C
0.3
0.2
0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
0.6
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)
1.2 1.0
TJ = 25°C
1.0 VBE(sat) @ IC/IB =10 0.5 +25°C TO +125°C
qVC FOR VCE(sat)
0 – 2.0
1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
MAXIMUM RATINGS
Rating Symbol Value Unit GENERAL PURPOSE
Collector – Emitter Voltage MMBT3904WT1 VCEO 40 Vdc AMPLIFIER TRANSISTORS
MMBT3906WT1 –40 SURFACE MOUNT
Collector – Base Voltage MMBT3904WT1 VCBO 60 Vdc
MMBT3906WT1 –40
Emitter – Base Voltage MMBT3904WT1 VEBO 6.0 Vdc
MMBT3906WT1 –5.0
3
Collector Current — Continuous MMBT3904WT1 IC 200 mAdc
MMBT3906WT1 –200
1
THERMAL CHARACTERISTICS 2
DEVICE MARKING
MMBT3904WT1 = AM
MMBT3906WT1 = 2A
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) MMBT3904WT1 40 —
(IC = –1.0 mAdc, IB = 0) MMBT3906WT1 –40 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 10 mAdc, IE = 0) MMBT3904WT1 60 —
(IC = –10 mAdc, IE = 0) MMBT3906WT1 –40 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 mAdc, IC = 0) MMBT3904WT1 6.0 —
(IE = –10 mAdc, IC = 0) MMBT3906WT1 –5.0 —
Base Cutoff Current IBL nAdc
(VCE = 30 Vdc, VEB = 3.0 Vdc) MMBT3904WT1 — 50
(VCE = –30 Vdc, VEB = –3.0 Vdc) MMBT3906WT1 — –50
Collector Cutoff Current ICEX nAdc
(VCE = 30 Vdc, VEB = 3.0 Vdc) MMBT3904WT1 — 50
(VCE = –30 Vdc, VEB = –3.0 Vdc) MMBT3906WT1 — –50
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum recommended footprint.
2. Pulse Test: Pulse Width v
300 ms; Duty Cycle v 2.0%.
+3 V +3 V
DUTY CYCLE = 2% 10 < t1 < 500 ms t1
300 ns +10.9 V
+10.9 V DUTY CYCLE = 2%
275 275
10 k 10 k
0
– 0.5 V
< 1 ns CS < 4 pF* 1N916 CS < 4 pF*
– 9.1 V
< 1 ns
Figure 1. Delay and Rise Time Figure 2. Storage and Fall Time
Equivalent Test Circuit Equivalent Test Circuit
TJ = 25°C
TJ = 125°C
10 5000
MMBT3904WT1 VCC = 40 V MMBT3904WT1
3000
7.0 IC/IB = 10
2000
CAPACITANCE (pF)
5.0
Q, CHARGE (pC)
1000
700
Cibo
3.0 500
300 QT
2.0 Cobo 200
QA
100
70
1.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
500 500
300 IC/IB = 10 300 VCC = 40 V
IC/IB = 10
200 200
100 100
50 50
30 30
20 40 V 20
15 V
10 MMBT3904WT1 10
MMBT3904WT1
7 td @ VOB = 0 V 2.0 V 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 5. Turn – On Time Figure 6. Rise Time
500 500
t′s = ts – 1/8 tf VCC = 40 V
300 300
IC/IB = 20 IC/IB = 10 IB1 = IB2 IB1 = IB2
200 200
IC/IB = 20
t s′ , STORAGE TIME (ns)
30 IC/IB = 10 30 IC/IB = 10
20 20
10 10
MMBT3904WT1 MMBT3904WT1
7 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
12 14
SOURCE RESISTANCE = 200 W f = 1.0 kHz IC = 1.0 mA
10 IC = 1.0 mA 12
NF, NOISE FIGURE (dB)
h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25°C)
300 100
200
h fe , CURRENT GAIN
20
100 10
70 5
50
2
30 1
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
20 10
h re , VOLTAGE FEEDBACK RATIO (X 10 –4 )
7.0
h ie , INPUT IMPEDANCE (k OHMS)
10 MMBT3904WT1 MMBT3904WT1
5.0
5.0
3.0
2.0 2.0
1.0
1.0
0.5
0.7
0.2 0.5
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 +25°C
0.7
0.5 – 55°C
0.3
0.2
0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
1.0
MMBT3904WT1 TJ = 25°C
0.8
IC = 1.0 mA 10 mA 30 mA 100 mA
0.6
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)
1.2 1.0
TJ = 25°C MMBT3904WT1 MMBT3904WT1
1.0 VBE(sat) @ IC/IB =10 0.5 +25°C TO +125°C
qVC FOR VCE(sat)
COEFFICIENT (mV/ °C)
V, VOLTAGE (VOLTS)
0 – 2.0
1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
3V 3V
< 1 ns
+ 9.1 V
275 275
< 1 ns
10 k 10 k
0
Figure 19. Delay and Rise Time Figure 20. Storage and Fall Time
Equivalent Test Circuit Equivalent Test Circuit
TJ = 25°C
TJ = 125°C
10 5000
MMBT3906WT1 VCC = 40 V MMBT3906WT1
7.0 3000
IC/IB = 10
2000
QT
5.0
CAPACITANCE (pF)
Cobo
Q, CHARGE (pC)
1000
Cibo 700
3.0 500
300
2.0 200
QA
100
70
1.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
500 500
IC/IB = 10 MMBT3906WT1 VCC = 40 V
300 MMBT3906WT1 300
IB1 = IB2
200 200
IC/IB = 20
t f , FALL TIME (ns)
100 100
70 70
tr @ VCC = 3.0 V
TIME (ns)
50 50
30 15 V 30 IC/IB = 10
20 20
40 V
10 2.0 V 10
7 td @ VOB = 0 V 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 23. Turn – On Time Figure 24. Fall Time
5.0 12
SOURCE RESISTANCE = 200 W f = 1.0 kHz IC = 1.0 mA
IC = 1.0 mA 10
4.0
SOURCE RESISTANCE = 200 W IC = 0.5 mA
NF, NOISE FIGURE (dB)
h PARAMETERS
(VCE = –10 Vdc, f = 1.0 kHz, TA = 25°C)
300 100
70
hoe, OUTPUT ADMITTANCE (m mhos)
MMBT3906WT1 MMBT3906WT1
50
200
hfe , CURRENT GAIN
30
100 20
70
10
50
7.0
30 5.0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
20 10
MMBT3906WT1 MMBT3906WT1
h re , VOLTAGE FEEDBACK RATIO (X 10 –4 )
10 7.0
7.0 5.0
h ie , INPUT IMPEDANCE (k Ω)
5.0
3.0
3.0
2.0
2.0
1.0
0.7 1.0
0.5
0.7
0.3
0.2 0.5
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
STATIC CHARACTERISTICS
2.0
TJ = +125°C
h FE, DC CURRENT GAIN (NORMALIZED)
VCE = 1.0 V
1.0 +25°C
0.7
– 55°C
0.5
0.3
MMBT3906WT1
0.2
0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
1.0
MMBT3906WT1 TJ = 25°C
0.8
IC = 1.0 mA 10 mA 30 mA 100 mA
0.6
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)
1.0 1.0
θV, TEMPERATURE COEFFICIENTS (mV/°C)
0 – 55°C TO +25°C
0.6
0 –2.0
1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1
BASE
2 3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit 2
Collector – Emitter Voltage VCEO –40 Vdc
Collector – Base Voltage VCBO –40 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –200 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT3906LT1 = 2A
1. FR– 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3 0.024 in. 99.5% alumina.
3. Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
SWITCHING CHARACTERISTICS
Delay Time ((VCC = –3.0 Vdc, VBE = 0.5 Vdc, td — 35
ns
Rise Time IC = –10 mAdc, IB1 = –1.0 mAdc) tr — 35
Storage Time ((VCC = –3.0 Vdc, IC = –10 mAdc, ts — 225
ns
Fall Time IB1 = IB2 = –1.0 mAdc) tf — 75
275 275
< 1 ns
+0.5 V 10 k 10 k
0
CS < 4 pF* 1N916 CS < 4 pF*
10.6 V
300 ns 10 < t1 < 500 ms
DUTY CYCLE = 2% t1 10.9 V
DUTY CYCLE = 2%
Figure 1. Delay and Rise Time Figure 2. Storage and Fall Time
Equivalent Test Circuit Equivalent Test Circuit
TJ = 25°C
TJ = 125°C
10 5000
VCC = 40 V
3000
7.0 IC/IB = 10
2000
CAPACITANCE (pF)
5.0 Cobo
Q, CHARGE (pC)
1000
700
Cibo
3.0 500
300
2.0 200 QT
QA
100
70
1.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS (VOLTS) IC, COLLECTOR CURRENT (mA)
100 100
70 70
TIME (ns)
50 tr @ VCC = 3.0 V 50
30 15 V 30
20 20 IC/IB = 10
40 V
10 2.0 V 10
7 td @ VOB = 0 V 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
5.0 12
SOURCE RESISTANCE = 200 W f = 1.0 kHz IC = 1.0 mA
IC = 1.0 mA
10
4.0
SOURCE RESISTANCE = 200 W IC = 0.5 mA
NF, NOISE FIGURE (dB)
0 0
0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100
f, FREQUENCY (kHz) Rg, SOURCE RESISTANCE (k OHMS)
Figure 7. Figure 8.
h PARAMETERS
(VCE = – 10 Vdc, f = 1.0 kHz, TA = 25°C)
300 100
hoe, OUTPUT ADMITTANCE (m mhos)
70
50
h fe , DC CURRENT GAIN
200
30
100 20
70
10
50
7
30 5
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
20 10
h re , VOLTAGE FEEDBACK RATIO (X 10 –4 )
7.0
h ie , INPUT IMPEDANCE (k OHMS)
10
7.0 5.0
5.0
3.0 3.0
2.0 2.0
1.0
0.7
1.0
0.5
0.7
0.3
0.2 0.5
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0
h FE, DC CURRENT GAIN (NORMALIZED)
TJ = +125°C VCE = 1.0 V
1.0 +25°C
0.7
– 55°C
0.5
0.3
0.2
0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
1.0
TJ = 25°C
0.8
IC = 1.0 mA 10 mA 30 mA 100 mA
0.6
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)
1.0 1.0
q V , TEMPERATURE COEFFICIENTS (mV/ °C)
0
0.6 – 55°C TO +25°C
– 0.5
0.4 +25°C TO +125°C
– 1.0
VCE(sat) @ IC/IB = 10 – 55°C TO +25°C
0.2 qVB FOR VBE(sat)
– 1.5
0 – 2.0
1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1
BASE
3
2
EMITTER 1
MAXIMUM RATINGS
2
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 40 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Collector – Base Voltage VCBO 60 Vdc
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 600 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT4401LT1 = 2X
Preferred devices are Motorola recommended choices for future use and best overall value.
SWITCHING CHARACTERISTICS
Delay Time ((VCC = 30 Vdc, VEB = 2.0 Vdc, td — 15
ns
Rise Time IC = 150 mAdc, IB1 = 15 mAdc) tr — 20
Storage Time ((VCC = 30 Vdc, IC = 150 mAdc, ts — 225
ns
Fall Time IB1 = IB2 = 15 mAdc) tf — 30
+ 30 V + 30 V
1.0 to 100 µs, 1.0 to 100 µs, 200 Ω
200 Ω
+16 V DUTY CYCLE ≈ 2.0%
+16 V DUTY CYCLE ≈ 2.0%
0 0
1.0 kΩ –14 V 1.0 kΩ CS* < 10 pF
– 2.0 V CS* < 10 pF
< 2.0 ns < 20 ns
30 10
7.0
VCC = 30 V
20 5.0
IC/IB = 10
Cobo 3.0
CAPACITANCE (pF)
QT
Q, CHARGE (nC)
2.0
10
1.0
7.0
0.7
5.0 0.5
Ccb 0.3
3.0 0.2 QA
2.0 0.1
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 10 20 30 50 70 100 200 300 500
REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
100 100
70 IC/IB = 10 70 VCC = 30 V
tr IC/IB = 10
50 50
tr @ VCC = 30 V
30 30 tf
t, TIME (ns)
t, TIME (ns)
tr @ VCC = 10 V
td @ VEB = 2.0 V
20 td @ VEB = 0 20
10 10
7.0 7.0
5.0 5.0
10 20 30 50 70 100 200 300 500 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
300 100
ts′ = ts – 1/8 tf VCC = 30 V
70
IB1 = IB2 IB1 = IB2
200
IC/IB = 10 to 20 50 IC/IB = 20
t s′, STORAGE TIME (ns)
30
100
20 IC/IB = 10
70
50 10
7.0
30 5.0
10 20 30 50 70 100 200 300 500 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4.0 4.0
2.0 2.0
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (OHMS)
20 k
hfe , CURRENT GAIN
10 k
100
MMBT4401LT1 UNIT 1 5.0 k
70
MMBT4401LT1 UNIT 2
50
2.0 k
30 1.0 k
20 500
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
10 100
h re , VOLTAGE FEEDBACK RATIO (X 10 –4 )
7.0
hoe, OUTPUT ADMITTANCE (m mhos)
5.0 50
MMBT4401LT1 UNIT 1
3.0 MMBT4401LT1 UNIT 2
20
2.0
10
1.0 MMBT4401LT1 UNIT 1
0.7 5.0 MMBT4401LT1 UNIT 2
0.5
2.0
0.3
0.2 1.0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
3.0
VCE = 1.0 V
2.0 VCE = 10 V
h FE, NORMALIZED CURRENT GAIN
TJ = 125°C
1.0
25°C
0.7
0.5 – 55°C
0.3
0.2
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.0
TJ = 25°C
0.8
0.6
IC = 1.0 mA 10 mA 100 mA 500 mA
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50
IB, BASE CURRENT (mA)
1.0 + 0.5
TJ = 25°C
VBE(sat) @ IC/IB = 10
0.8 0 qVC for VCE(sat)
COEFFICIENT (mV/ °C)
VOLTAGE (VOLTS)
– 0.5
0.6 VBE @ VCE = 10 V
– 1.0
0.4
– 1.5
0 – 2.5
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1
BASE
2 3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit 2
Collector – Emitter Voltage VCEO –40 Vdc
Collector – Base Voltage VCBO –40 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –600 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT4403LT1 = 2T
1. FR– 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3 0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width v
300 ms, Duty Cycle v
2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
SWITCHING CHARACTERISTICS
Delay Time ((VCC = –30 Vdc, VEB = –2.0 Vdc, td — 15
ns
Rise Time IC = –150 mAdc, IB1 = –15 mAdc) tr — 20
Storage Time ((VCC = –30 Vdc, IC = –150 mAdc, ts — 225
ns
Fall Time IB1 = IB2 = –15 mAdc) tf — 30
– 30 V – 30 V
200 Ω 200 Ω
< 2 ns < 20 ns
+2 V +14 V
0 0
1.0 kΩ 1.0 kΩ CS* < 10 pF
CS* < 10 pF
– 16 V –16 V
10 to 100 µs, 1.0 to 100 µs,
DUTY CYCLE = 2% DUTY CYCLE = 2% + 4.0 V
Scope rise time < 4.0 ns
*Total shunt capacitance of test jig connectors, and oscilloscope
30 10
7.0
VCC = 30 V
20 5.0
Ceb IC/IB = 10
3.0
CAPACITANCE (pF)
Q, CHARGE (nC)
2.0
10
1.0
7.0
0.7
Ccb
5.0 0.5
QT
0.3
QA
0.2
2.0 0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 10 20 30 50 70 100 200 300 500
REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
100 100
70 IC/IB = 10 70 VCC = 30 V
50 IC/IB = 10
50
tr @ VCC = 30 V
t r , RISE TIME (ns)
30 tr @ VCC = 10 V 30
t, TIME (ns)
td @ VBE(off) = 2 V
20 td @ VBE(off) = 0 20
10 10
7.0 7.0
5.0 5.0
10 20 30 50 70 100 200 300 500 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
200
IC/IB = 10
t s′, STORAGE TIME (ns)
100
IC/IB = 20
70
50
IB1 = IB2
ts′ = ts – 1/8 tf
30
20
10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1k 2k 5k 10 k 20 k 50 k
f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (OHMS)
500
20 k
hfe , CURRENT GAIN
300 10 k
200 5k
2k
MMBT4403LT1 UNIT 1
100 MMBT4403LT1 UNIT 2 1k
70 500
50
200
30 100
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
20 500
h re , VOLTAGE FEEDBACK RATIO (X 10 –4 )
10 MMBT4403LT1 UNIT 1
MMBT4403LT1 UNIT 2
5.0 100
50
2.0
20
1.0 MMBT4403LT1 UNIT 1
10 MMBT4403LT1 UNIT 2
0.5
5.0
0.2 2.0
0.1 1.0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
3.0
VCE = 1.0 V
2.0 VCE = 10 V TJ = 125°C
h FE, NORMALIZED CURRENT GAIN
25°C
1.0
– 55°C
0.7
0.5
0.3
0.2
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.0
0.8
0.6
IC = 1.0 mA 10 mA 100 mA 500 mA
0.4
0.2
0
0.005 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50
IB, BASE CURRENT (mA)
1.0 0.5
TJ = 25°C
0
0.8 VBE(sat) @ IC/IB = 10 qVC for VCE(sat)
COEFFICIENT (mV/ °C)
VOLTAGE (VOLTS)
0.5
0.6 VBE(sat) @ VCE = 10 V
1.0
0.4
1.5
0.2
2.0 qVS for VBE
VCE(sat) @ IC/IB = 10
0 2.5
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1
BASE 3
2 1
EMITTER 2
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector–Emitter Voltage VCEO –50 Vdc
Collector–Base Voltage VCBO –50 Vdc
Emitter–Base Voltage VEBO –3.0 Vdc
Collector Current — Continuous IC –50 mAdc
DEVICE MARKING
MMBT5087LT1 = 2Q
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board (1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RθJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate, (2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RθJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage V(BR)CEO –50 — Vdc
(IC = –1.0 mAdc, IB = 0)
Collector–Base Breakdown Voltage V(BR)CBO –50 — Vdc
(IC = –100 µAdc, IE = 0)
Collector Cutoff Current ICBO nAdc
(VCB = –10 Vdc, IE = 0) — –10
(VCB = –35 Vdc, IE = 0) — –50
Preferred devices are Motorola recommended choices for future use and best overall value.
SMALL–SIGNAL CHARACTERISTICS
Current–Gain — Bandwidth Product fT 40 — MHz
(IC = –500 µAdc, VCE = –5.0 Vdc, f = 20 MHz)
Output Capacitance Cobo — 4.0 pF
(VCB = –5.0 Vdc, IE = 0, f = 1.0 MHz)
Small–Signal Current Gain hfe 250 900 —
(IC = –1.0 mAdc, VCE = –5.0 Vdc, f = 1.0 kHz)
Noise Figure NF dB
(IC = –20 mAdc, VCE = –5.0 Vdc, RS = 10 kΩ, f = 1.0 kHz) — 2.0
(IC = –100 µAdc, VCE = –5.0 Vdc, RS = 3.0 kΩ, f = 1.0 kHz) — 2.0
10 1.0
BANDWIDTH = 1.0 Hz 7.0 BANDWIDTH = 1.0 Hz
7.0 RS ≈ 0 5.0 RS ≈ ∞
IC = 10 µA IC = 1.0 mA
en, NOISE VOLTAGE (nV)
1.0 M 1.0 M
500 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
200 k 200 k
100 k 100 k
50 k 50 k
20 k 20 k
0.5 dB
10 k 10 k
0.5 dB
5.0 k 1.0 dB 5.0 k
2.0 k 2.0 k 1.0 dB
1.0 k 2.0 dB 1.0 k
2.0 dB
500 3.0 dB 500
3.0 dB
200 5.0 dB 200 5.0 dB
100 100
10 20 30 50 70 100 200 300 500 700 1.0 k 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
1.0 M
500 k 10 Hz to 15.7 kHz
RS , SOURCE RESISTANCE (OHMS)
200 k
100 k
ƪ ƫ
Noise Figure is Defined as:
Figure 5. Wideband
150 µA
0.4 40
100 µA
0.2 20 50 µA
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
0.6 0.8
VBE(on) @ VCE = 1.0 V
25°C to 125°C
0.4
1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 1000
VCC = 3.0 V 700 VCC = – 3.0 V
300 IC/IB = 10
IC/IB = 10 500
200 TJ = 25°C IB1 = IB2
ts
300 TJ = 25°C
100 200
t, TIME (ns)
t, TIME (ns)
70
50 100
30 70
tr 50
20 tf
td @ VBE(off) = 0.5 V 30
10 20
7.0
5.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
7.0
300 VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
5.0 V
200
3.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
1.0
0.7
r(t) TRANSIENT THERMAL RESISTANCE
D = 0.5
0.5
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 16
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
1
BASE
2 3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol 5088LT1 5089LT1 Unit 2
Collector – Emitter Voltage VCEO 30 25 Vdc
Collector – Base Voltage VCBO 35 30 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Emitter – Base Voltage VEBO 4.5 Vdc
Collector Current — Continuous IC 50 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT5088LT1 = 1Q; MMBT5089LT1 = 1R
Preferred devices are Motorola recommended choices for future use and best overall value.
RS
in
en
IDEAL
TRANSISTOR
NOISE VOLTAGE
30 30
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
20 20
IC = 10 mA RS ≈ 0 RS ≈ 0
en , NOISE VOLTAGE (nV)
10 20
BANDWIDTH = 1.0 Hz
7.0
5.0
IC = 10 mA 16
In, NOISE CURRENT (pA)
2.0 3.0 mA
12
1.0 mA
1.0
IC = 1.0 mA
0.7 500 µA
300 µA 8.0
0.5
100 µA
0.3 100 µA
4.0 10 µA
0.2
10 µA 30 µA
RS ≈ 0
0.1 0
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) RS, SOURCE RESISTANCE (OHMS)
16 IC = 10 mA 3.0 mA
100 100 µA
NF, NOISE FIGURE (dB)
70 3.0 mA 1.0 mA
50 12
1.0 mA
30 300 µA
300 µA
20 30 µA 8.0
100 µA
10
10 µA
7.0 4.0 30 µA
10 µA
5.0
BANDWIDTH = 1.0 Hz
3.0 0
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
RS, SOURCE RESISTANCE (OHMS) RS, SOURCE RESISTANCE (OHMS)
0.5
0.4
0.3
0.2
0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA)
1.0 – 0.4
RθVBE, BASE–EMITTER
V, VOLTAGE (VOLTS)
0.2 – 2.0
– 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
8.0 500
6.0 TJ = 25°C
300
Cob Cib
C, CAPACITANCE (pF)
4.0 Ceb
200
3.0 Ccb
2.0
100
VCE = 5.0 V
70
1.0 TJ = 25°C
0.8 50
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1
BASE
2 3
EMITTER
1
2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT5401LT1 = 2L
1. FR– 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4 0.024 in. 99.5% alumina.
0.3
Preferred devices are Motorola recommended choices for future use and best overall value.
150
TJ = 125°C
h FE, CURRENT GAIN
100
25°C
70
50
– 55°C
30 VCE = – 1.0 V
VCE = – 5.0 V
20
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100
IC, COLLECTOR CURRENT (mA)
1.0
0.9
0.8
0.7
0.6
IC = 1.0 mA 10 mA 30 mA 100 mA
0.5
0.4
0.3
0.2
0.1
0
0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IB, BASE CURRENT (mA)
103
VCE = 30 V
102
IC, COLLECTOR CURRENT ( µA)
IC = ICES
101
TJ = 125°C
100
75°C
10–1
REVERSE FORWARD
10–2 25°C
10–3
0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
VBE, BASE–EMITTER VOLTAGE (VOLTS)
100
70 TJ = 25°C
VBB VCC 50
+ 8.8 V –30 V
30
C, CAPACITANCE (pF)
10.2 V
20 Cibo
100 3.0 k RC
Vin
Vout 10
10 µs 0.25 µF RB 7.0
INPUT PULSE 5.0 Cobo
5.1 k
tr, tf ≤ 10 ns Vin 100 1N914 3.0
DUTY CYCLE = 1.0% 2.0
1.0
Values Shown are for IC @ 10 mA 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20
VR, REVERSE VOLTAGE (VOLTS)
1000 2000
700 IC/IB = 10
TJ = 25°C tr @ VCC = 120 V 1000
500 IC/IB = 10 tf @ VCC = 120 V
700 TJ = 25°C
300
tr @ VCC = 30 V 500
200
tf @ VCC = 30 V
t, TIME (ns)
t, TIME (ns)
300
100 200
70 ts @ VCC = 120 V
50 100
70
30
50
20 td @ VBE(off) = 1.0 V
VCC = 120 V 30
10 20
0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1
BASE
2 3
MAXIMUM RATINGS EMITTER
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT5550LT1 = M1F; MMBT5551LT1 = G1
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(3) V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) MMBT5550 140 —
MMBT5551 160 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) MMBT5550 160 —
MMBT5551 180 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 mAdc, IC = 0) 6.0 —
Collector Cutoff Current ICBO
(VCB = 100 Vdc, IE = 0) MMBT5550 — 100 nAdc
(VCB = 120 Vdc, IE = 0) MMBT5551 — 50
(VCB = 100 Vdc, IE = 0, TA = 100°C) MMBT5550 — 100 µAdc
(VCB = 120 Vdc, IE = 0, TA = 100°C) MMBT5551 — 50
Emitter Cutoff Current IEBO nAdc
(VEB = 4.0 Vdc, IC = 0) — 50
1. FR– 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3 0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
25°C
100
– 55°C
50
30
20
10
7.0
5.0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0
0.9
0.8
0.7
IC = 1.0 mA 10 mA 30 mA 100 mA
0.6
0.5
0.4
0.3
0.2
0.1
0
0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IB, BASE CURRENT (mA)
101 1.0
TJ = 25°C
VCE = 30 V
100
IC, COLLECTOR CURRENT ( µA)
0.8
V, VOLTAGE (VOLTS)
10–2 75°C
0.4
10–3 REVERSE FORWARD
25°C 0.2
10–4
VCE(sat) @ IC/IB = 10
10–5 0
0.4 0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100
VBE, BASE–EMITTER VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
– 2.5
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100
Values Shown are for IC @ 10 mA
IC, COLLECTOR CURRENT (mA)
100 1000
70 TJ = 25°C IC/IB = 10
50 500 TJ = 25°C
20 200
tr @ VCC = 30 V
t, TIME (ns)
10 100
7.0 Cibo
5.0 50 td @ VEB(off) = 1.0 V
1.0 10
0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
5000
tf @ VCC = 120 V IC/IB = 10
3000
TJ = 25°C
2000
tf @ VCC = 30 V
1000
t, TIME (ns)
500
100
50
0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200
IC, COLLECTOR CURRENT (mA)
BASE
1
3
EMITTER 2
1
MAXIMUM RATINGS
2
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 40 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Collector – Base Voltage VCBO 40 Vdc
Emitter – Base Voltage VEBO 12 Vdc
Collector Current — Continuous IC 500 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT6427LT1 = 1V
RS
in
en
IDEAL
TRANSISTOR
500 2.0
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
RS ≈ 0 1.0
200
0.7
en, NOISE VOLTAGE (nV)
100 µA 100 µA
0.1
20
0.07
IC = 1.0 mA 10 µA
0.05
10
0.03
5.0 0.02
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
200 14
VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)
10
70 IC = 10 µA 10 µA
8.0
50
100 µA
6.0
30 100 µA
4.0 IC = 1.0 mA
20
1.0 mA
2.0
10 0
1.0 2.0 5.0 10 20 50 100 200 500 100 1.0 2.0 5.0 10 20 50 100 200 500 100
RS, SOURCE RESISTANCE (kΩ) 0 RS, SOURCE RESISTANCE (kΩ) 0
20 4.0
VCE = 5.0 V
7.0 Cibo
1.0
5.0 Cobo 0.8
0.6
3.0 0.4
2.0 0.2
0.04 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 0.5 1.0 2.0 0.5 10 20 50 100 200 500
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
50 k 25°C
30 k 2.0
20 k
1.5
10 k
7.0 k
– 55°C
5.0 k 1.0
VCE = 5.0 V
3.0 k
2.0 k 0.5
5.0 7.0 10 20 30 50 70 100 200 300 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
1.6 – 1.0
RθV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 – 6.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2 SINGLE PULSE
0.05
0.1
0.1
0.07 SINGLE PULSE
0.05
0.03 ZθJC(t) = r(t) • RθJC TJ(pk) – TC = P(pk) ZθJC(t)
0.02 ZθJA(t) = r(t) • RθJA TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
FIGURE A
tP
PP PP
t1
1/f
2 3
EMITTER
1
2
MAXIMUM RATINGS
Rating Symbol 6428LT1 6429LT1 Unit
CASE 318 – 08, STYLE 6
Collector – Emitter Voltage VCEO 50 45 Vdc SOT– 23 (TO – 236AB)
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT6428LT1 = 1KM; MMBT6429LT1 = 1L
RS
in
en
IDEAL
TRANSISTOR
NOISE VOLTAGE
30 30
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
20 20
IC = 10 mA RS ≈ 0 RS ≈ 0
en , NOISE VOLTAGE (nV)
10 20
BANDWIDTH = 1.0 Hz
7.0
5.0
IC = 10 mA 16
In, NOISE CURRENT (pA)
2.0 3.0 mA
12
1.0 mA
1.0
IC = 1.0 mA
0.7 500 µA
300 µA 8.0
0.5
100 µA
0.3 100 µA
4.0 10 µA
0.2
10 µA 30 µA
RS ≈ 0
0.1 0
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) RS, SOURCE RESISTANCE (OHMS)
16 IC = 10 mA 3.0 mA
100 100 µA
NF, NOISE FIGURE (dB)
70 3.0 mA 1.0 mA
50 12
1.0 mA
30 300 µA
300 µA
20 30 µA 8.0
100 µA
10
10 µA
7.0 4.0 30 µA
10 µA
5.0
BANDWIDTH = 1.0 Hz
3.0 0
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
RS, SOURCE RESISTANCE (OHMS) RS, SOURCE RESISTANCE (OHMS)
0.5
0.4
0.3
0.2
0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA)
1.0 – 0.4
0.2 – 2.0
– 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
8.0 500
6.0 TJ = 25°C
300
Cob Cib
C, CAPACITANCE (pF)
4.0 Ceb
200
3.0 Ccb
2.0
100
VCE = 5.0 V
70
1.0 TJ = 25°C
0.8 50
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1
BASE
3
2
EMITTER 1
MAXIMUM RATINGS
2
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 350 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Collector – Base Voltage VCBO 350 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Base Current IB 250 mAdc
Collector Current — Continuous IC 500 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBT6517LT1 = 1Z
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 1.0 mAdc) 350 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc) 350 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 mAdc) 6.0 —
Collector Cutoff Current ICBO nAdc
(VCB = 250 Vdc) — 50
Emitter Cutoff Current IEBO nAdc
(VEB = 5.0 Vdc) — 50
1. FR– 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4 0.024 in. 99.5% alumina.
0.3
Preferred devices are Motorola recommended choices for future use and best overall value.
25°C 50
70
50 TJ = 25°C
30 VCE = 20 V
– 55°C
30 f = 20 MHz
20
20
10 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 1. DC Current Gain
Figure 2. Current–Gain — Bandwidth Product
1.4 2.5
100
70 TJ = 25°C
50
Ceb
30
C, CAPACITANCE (pF)
20
10
7.0
5.0 Ccb
3.0
2.0
1.0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
VR, REVERSE VOLTAGE (VOLTS)
Figure 5. Capacitance
t, TIME (ns)
t, TIME (ns)
tr VCE(off) = 100 V
100 1.0 k tf IC/IB = 5.0
70 700 IB1 = IB2
50 500 TJ = 25°C
30 300
20 200
10 100
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
+VCC
–9.2 V 1/2MSD7000
1.0
0.7
0.5 D = 0.5
RESISTANCE (NORMALIZED)
0.2
0.3
0.2
0.05 SINGLE PULSE
0.1
0.1
0.07 SINGLE PULSE
0.05
ZθJC(t) = r(t) • RθJC TJ(pk) – TC = P(pk) ZθJC(t)
0.03
ZθJA(t) = r(t) • RθJA TJ(pk) – TA = P(pk) ZθJA(t)
0.02
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
tP
PP PP
t1
1/f
1
BASE
3
2
EMITTER 1
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector–Emitter Voltage VCEO –350 Vdc
Collector–Base Voltage VCBO –350 Vdc
Emitter–Base Voltage VEBO –5.0 Vdc
Base Current IB –250 mA
Collector Current — Continuous IC –500 mAdc
DEVICE MARKING
MMBT6520LT1 = 2Z
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board (1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RθJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate, (2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RθJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (IC = –1.0 mA) V(BR)CEO –350 — Vdc
Collector–Base Breakdown Voltage (IC = –100 µA) V(BR)CBO –350 — Vdc
Emitter–Base Breakdown Voltage (IE = –10 µA) V(BR)EBO –5.0 — Vdc
Collector Cutoff Current (VCB = –250 V) ICBO — –50 nA
Emitter Cutoff Current (VEB = –4.0 V) IEBO — –50 nA
1. FR–5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina
Preferred devices are Motorola recommended choices for future use and best overall value.
SMALL–SIGNAL CHARACTERISTICS
Current–Gain — Bandwidth Product fT 40 200 MHz
(IC = –10 mA, VCE = –20 V, f = 20 MHz)
Collector–Base Capacitance Ccb — 6.0 pF
(VCB= –20 V, f = 1.0 MHz)
Emitter–Base Capacitance Ceb — 100 pF
(VEB= –0.5 V, f = 1.0 MHz)
100 25°C 50
70 TJ = 25°C
– 55°C 30 VCE = 20 V
50 f = 20 MHz
20
30
20 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 1. DC Current Gain Figure 2. Current–Gain — Bandwidth Product
1.4 2.5
100 1.0 k
70 700
TJ = 25°C VCE(off) = 100 V
50 500 IC/IB = 5.0
Ceb td @ VBE(off) = 2.0 V
30 300 TJ = 25°C
C, CAPACITANCE (pF)
20 200
t, TIME (ns)
tr
10 100
7.0 70
5.0 Ccb 50
3.0 30
2.0 20
1.0 10
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
t, TIME (ns)
VCE(off) = 100 V
1.0 k tf IC/IB = 5.0
700 IB1 = IB2
500 TJ = 25°C
300
200
100
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
+VCC
–9.2 V 1/2MSD7000
1.0
0.7
0.5 D = 0.5
RESISTANCE (NORMALIZED)
0.2
r(t), TRANSIENT THERMAL
0.3
0.2
0.05 SINGLE PULSE
0.1
0.1
0.07 SINGLE PULSE
0.05
ZθJC(t) = r(t) • RθJC TJ(pk) – TC = P(pk) ZθJC(t)
0.03
ZθJA(t) = r(t) • RθJA TJ(pk) – TA = P(pk) ZθJA(t)
0.02
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
tP
PP PP
t1
1/f
1
BASE
3
2
EMITTER 1
2
MAXIMUM RATINGS
Rating Symbol MMBTA05 MMBTA06 Unit
CASE 318 – 08, STYLE 6
Collector – Emitter Voltage VCEO 60 80 Vdc SOT– 23 (TO – 236AB)
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBTA05LT1 = 1H; MMBTA06LT1 = 1GM
1. FR– 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3 0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width v
300 ms, Duty Cycle v
2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
COLLECTOR 3
BASE
1
3
1
EMITTER 2
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCES 30 Vdc
Collector – Base Voltage VCBO 30 Vdc
Emitter – Base Voltage VEBO 10 Vdc
Collector Current — Continuous IC 300 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBTA13LT1 = 1M; MMBTA14LT1 = 1N
1. FR– 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4 0.024 in. 99.5% alumina.
0.3
Preferred devices are Motorola recommended choices for future use and best overall value.
RS
in
en
IDEAL
TRANSISTOR
500 2.0
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
RS ≈ 0 1.0
200
0.7
en, NOISE VOLTAGE (nV)
100 µA 100 µA
0.1
20
0.07
IC = 1.0 mA 10 µA
0.05
10
0.03
5.0 0.02
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
200 14
VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)
10
70 IC = 10 µA 10 µA
8.0
50
100 µA
6.0
30 100 µA
4.0 IC = 1.0 mA
20
1.0 mA
2.0
10 0
1.0 2.0 5.0 10 20 50 100 200 500 100 1.0 2.0 5.0 10 20 50 100 200 500 100
RS, SOURCE RESISTANCE (kΩ) 0 RS, SOURCE RESISTANCE (kΩ) 0
20 4.0
VCE = 5.0 V
7.0 Cibo
1.0
5.0 Cobo 0.8
0.6
3.0 0.4
2.0 0.2
0.04 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 0.5 1.0 2.0 0.5 10 20 50 100 200 500
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
50 k 25°C
30 k 2.0
20 k
1.5
10 k
7.0 k
– 55°C
5.0 k 1.0
VCE = 5.0 V
3.0 k
2.0 k 0.5
5.0 7.0 10 20 30 50 70 100 200 300 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
1.6 – 1.0
RθV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 – 6.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
1.0 k
FIGURE A
700 1.0 ms
500
IC, COLLECTOR CURRENT (mA)
tP
300 TC = 25°C 100 µs
TA = 25°C PP PP
200 1.0 s
100
70
50
t1
30
CURRENT LIMIT
20 THERMAL LIMIT 1/f
+ t1 f + ttP1
SECOND BREAKDOWN LIMIT
10 DUTY CYCLE
0.4 0.6 1.0 2.0 4.0 6.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS) PEAK PULSE POWER = PP
Figure 13. Active Region Safe Operating Area Design Note: Use of Transient Thermal Resistance Data
1 3
BASE
1
2 2
EMITTER
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 40 Vdc
Emitter – Base Voltage VEBO 4.0 Vdc
Collector Current — Continuous IC 100 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR– 5 Board(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
DEVICE MARKING
MMBTA20LT1 = 1C
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO 40 — Vdc
(IC = 1.0 mAdc, IB = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 4.0 — Vdc
(IE = 100 mAdc, IC = 0)
Collector Cutoff Current ICBO — 100 nAdc
(VCB = 30 Vdc, IE = 0)
+ 3.0 V + 3.0 V
10 < t1 < 500 µs t1
300 ns 275 +10.9 V 275
+10.9 V DUTY CYCLE = 2%
DUTY CYCLE = 2%
10 k 10 k
– 0.5 V 0
<1.0 ns CS < 4.0 pF* CS < 4.0 pF*
– 9.1 V 1N916
< 1.0 ns
20 100
IC = 1.0 mA BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
50
RS = 0 IC = 1.0 mA RS ≈ ∞
300 µA 20 300 µA
en, NOISE VOLTAGE (nV)
2.0 0.1
10 20 50 100 200 500 1 k 2k 5k 10 k 10 20 50 100 200 500 1 k 2k 5k 10 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
500 k 1M
200 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
100 k 200 k
50 k 100 k
20 k 50 k
10 k 20 k
5k 10 k
2.0 dB 1.0 dB
2k 5k
3.0 dB 4.0 dB
1k 2k 2.0 dB
6.0 dB 3.0 dB
500 10 dB
1k
500 5.0 dB
200
100 200 8.0 dB
50 100
10 20 30 50 70 100 200 300 500 700 1k 10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
500 k
10 Hz to 15.7 kHz
200 k
RS , SOURCE RESISTANCE (OHMS)
100 k
50 k
ǒ Ǔ
Noise Figure is defined as:
20 k
10 k NF + 20 log10 en2 ) 4KTRS ) In 2RS2 1ń2
5k 4KTRS
1.0 dB
en = Noise Voltage of the Transistor referred to the input. (Figure 3)
2k 2.0 dB In = Noise Current of the Transistor referred to the input. (Figure 4)
1k 3.0 dB K = Boltzman’s Constant (1.38 x 10–23 j/°K)
500 T = Temperature of the Source Resistance (°K)
5.0 dB
200 RS = Source Resistance (Ohms)
8.0 dB
100
50
10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA)
Figure 7. Wideband
400
h FE, DC CURRENT GAIN TJ = 125°C
200 25°C
– 55°C
100
80
MPS390
60 VCE
4 = 1.0 V
VCE = 10 V
40
0.004 0.006 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
MPS3904 TA = 25°C
IB = 500 µA
TJ = 25°C PULSE WIDTH = 300 µs
200 µA
0.4 40
100 µA
0.2 20
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
*APPLIES for IC/IB ≤ hFE/2
θV, TEMPERATURE COEFFICIENTS (mV/°C)
TJ = 25°C
1.2
0.8
25°C to 125°C
V, VOLTAGE (VOLTS)
1.0
*qVC for VCE(sat)
0
0.8 VBE(sat) @ IC/IB = 10 – 55°C to 25°C
0.6 – 0.8
VBE(on) @ VCE = 1.0 V
0.4 25°C to 125°C
– 1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
300 1000
200 VCC = 3.0 V
700
IC/IB = 10 500
TJ = 25°C ts
100 300
70 200
50
t, TIME (ns)
t, TIME (ns)
30 tr 100 tf
20 70
td @ VBE(off) = 0.5 Vdc 50
10 30 VCC = 3.0 V
7.0 IC/IB = 10
20 IB1 = IB2
5.0
TJ = 25°C
3.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
f = 100 MHz 7.0 f = 1.0 MHz
300
VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
200 5.0 V
Cob
3.0
100 2.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = 10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 hfe ≈ 200 @ IC = 1.0 mA 70
5.0 50 MPS3904
3.0 30 hfe ≈ 200 @ IC = 1.0 mA
2.0 20
1.0 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19A
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
102 ICEO Figure 19 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 19 by the
101 steady state value RθJA.
Example:
ICBO The MPS3904 is dissipating 2.0 watts peak under the following
100
AND conditions:
ICEX @ VBE(off) = 3.0 Vdc t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
10–1 Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
10–2 The peak rise in junction temperature is therefore
–4 –2 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
0 0 TJ, JUNCTION TEMPERATURE (°C)
For more information, see AN–569.
Figure 19A.
400
100 µs The safe operating area curves indicate IC–VCE limits of the
1.0 ms
200 transistor that must be observed for reliable operation. Collector load
IC, COLLECTOR CURRENT (mA)
10 µs
lines for specific circuits must fall below the limits indicated by the
100 TC = 25°C 1.0 s applicable curve.
dc The data of Figure 20 is based upon TJ(pk) = 150°C; TC or TA is
60 TA = 25°C variable depending upon conditions. Pulse curves are valid for duty
40 dc cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
20 TJ = 150°C limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.
10 CURRENT LIMIT
THERMAL LIMIT
6.0
SECOND BREAKDOWN LIMIT
4.0
2.0 4.0 6.0 8.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
Figure 20.
2 3
MAXIMUM RATINGS EMITTER
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(3) V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) MMBTA42 300 —
MMBTA43 200 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) MMBTA42 300 —
MMBTA43 200 —
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 100 mAdc, IC = 0)
Collector Cutoff Current ICBO µAdc
(VCB = 200 Vdc, IE = 0) MMBTA42 — 0.1
(VCB = 160 Vdc, IE = 0) MMBTA43 — 0.1
Emitter Cutoff Current IEBO µAdc
(VEB = 6.0 Vdc, IC = 0) MMBTA42 — 0.1
(VEB = 4.0 Vdc, IC = 0) MMBTA43 — 0.1
1. FR–5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
TJ = +125°C
hFE, DC CURRENT GAIN
100
25°C
50
–55°C
30
20
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
50 70
C, CAPACITANCE (pF)
Ceb 50
20
TJ = 25°C
10 VCE = 20 V
30 f = 20 MHz
5.0
20
2.0 Ccb
1.0 10
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1.4
TJ = 25°C
1.2
1.0
V, VOLTAGE (VOLTS)
0.4
5.0
0.2 VCE(sat) @ IC/IB = 10
0
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
2
MAXIMUM RATINGS EMITTER
3
Rating Symbol MMBTA55 MMBTA56 Unit
Collector – Emitter Voltage VCEO –60 –80 Vdc 1
2
Collector – Base Voltage VCBO –60 –80 Vdc
Emitter – Base Voltage VEBO –4.0 Vdc
CASE 318 – 08, STYLE 6
Collector Current — Continuous IC –500 mAdc SOT– 23 (TO – 236AB)
DEVICE MARKING
MMBTA55LT1 = 2H; MMBTA56LT1 = 2GM
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR–5 Board,(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg –55 to +150 °C
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(3) MMBTA55 V(BR)CEO –60 — Vdc
(IC = –1.0 mAdc, IB = 0) MMBTA56 –80 —
Emitter – Base Breakdown Voltage (IE = –100 mAdc, IC = 0) V(BR)EBO –4.0 — Vdc
Collector Cutoff Current (VCE = –60 Vdc, IB = 0) ICES — –0.1 µAdc
Collector Cutoff Current (VCB = –60 Vdc, IE = 0) MMBTA55 ICBO — –0.1 µAdc
Collector Cutoff Current (VCB = –80 Vdc, IE = 0) MMBTA56 — –0.1
ON CHARACTERISTICS
DC Current Gain (IC = –10 mAdc, VCE = –1.0 Vdc) hFE 100 — —
DC Current Gain (IC = –100 mAdc, VCE = –1.0 Vdc) 100 —
Collector – Emitter Saturation Voltage (IC = –100 mAdc, IB = –10 mAdc) VCE(sat) — –0.25 Vdc
Base–Emitter On Voltage (IC = –100 mAdc, VCE = –1.0 Vdc) VBE(on) — –1.2 Vdc
SMALL– SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product(4) fT 50 — MHz
(IC = –100 mAdc, VCE = –1.0 Vdc, f = 100 MHz)
EMITTER 2
3
MAXIMUM RATINGS
Rating Symbol Value Unit 1
2
Collector – Emitter Voltage VCES –30 Vdc
Collector – Base Voltage VCBO –30 Vdc
CASE 318 – 08, STYLE 6
Emitter – Base Voltage VEBO –10 Vdc SOT– 23 (TO – 236AB)
Collector Current — Continuous IC –500 mAdc
DEVICE MARKING
MMBTA63LT1 = 2U; MMBTA64LT1 = 2V
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR–5 Board,(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg –55 to +150 °C
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage (IC = –100 µAdc) V(BR)CEO –30 — Vdc
Collector Cutoff Current (VCB = –30 Vdc) ICBO — –100 nAdc
Emitter Cutoff Current (VEB = –10 Vdc) IEBO — –100 nAdc
ON CHARACTERISTICS
DC Current Gain(3) hFE —
(IC = –10 mAdc, VCE = –5.0 Vdc) MMBTA63 5,000 —
(IC = –10 mAdc, VCE = –5.0 Vdc) MMBTA64 10,000 —
(IC = –100 mAdc, VCE = –5.0 Vdc) MMBTA63 10,000 —
(IC = –100 mAdc, VCE = –5.0 Vdc) MMBTA64 20,000 —
Collector – Emitter Saturation Voltage (IC = –100 mAdc, IB = –0.1 mAdc) VCE(sat) — –1.5 Vdc
Base–Emitter On Voltage (IC = –100 mAdc, VCE = –5.0 Vdc) VBE(on) — –2.0 Vdc
SMALL– SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product (IC = –10 mAdc, VCE = –5.0 Vdc, f = 100 MHz) fT 125 — MHz
1. FR–5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
3.0
2.0
–0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300
IC, COLLECTOR CURRENT (mA)
0 –0.6
–0.3 –0.5 –1.0 –2 –3 –5 –10 –20 –30 –50 –100 –200 –300 –0.1–0.2 –0.5 –1 –2 –5 –10 –20 –50 –100–200–500 –1K–2K –5K–10K
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
10
|h FE |, HIGH FREQUENCY CURRENT GAIN
VCE = –5.0 V
4.0 f = 100 MHz
3.0 TA = 25°C
2.0
1.0
0.4
0.2
0.1
–1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –1K
IC, COLLECTOR CURRENT (mA)
1
BASE
2 3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit
2
Collector–Emitter Voltage VCEO –40 Vdc
Emitter–Base Voltage VEBO –4.0 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Collector Current — Continuous IC –100 mAdc
DEVICE MARKING
MMBTA70LT1 = M2C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board,(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RθJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RθJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage V(BR)CEO –40 — Vdc
(IC = –1.0 mAdc, IB = 0)
Emitter–Base Breakdown Voltage V(BR)EBO –4.0 — Vdc
(IE = –100 µAdc, IC = 0)
Collector Cutoff Current ICBO — –100 nAdc
(VCB = –30 Vdc, IE = 0)
ON CHARACTERISTICS
DC Current Gain hFE 40 400 —
(IC = –5.0 mAdc, VCE = –10 Vdc)
Collector–Emitter Saturation Voltage VCE(sat) — –0.25 Vdc
(IC = –10 mAdc, IB = –1.0 mAdc)
SMALL–SIGNAL CHARACTERISTICS
Current–Gain – Bandwidth Product fT 125 — MHz
(IC = –5.0 mAdc, VCE = –10 Vdc, f = 100 MHz)
Output Capacitance (VCB = –10 Vdc, IE = 0, f = 1.0 MHz) Cobo — 4.0 pF
1. FR–5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
10 1.0
BANDWIDTH = 1.0 Hz 7.0 BANDWIDTH = 1.0 Hz
7.0 RS ≈ 0 5.0 RS ≈ ∞
IC = 10 µA IC = 1.0 mA
en, NOISE VOLTAGE (nV)
1.0 M 1.0 M
500 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
200 k 200 k
100 k 100 k
50 k 50 k
20 k 20 k
0.5 dB
10 k 10 k
0.5 dB
5.0 k 1.0 dB 5.0 k
2.0 k 2.0 k 1.0 dB
1.0 k 2.0 dB 1.0 k
2.0 dB
500 3.0 dB 500
3.0 dB
200 5.0 dB 200 5.0 dB
100 100
10 20 30 50 70 100 200 300 500 700 1.0 k 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
1.0 M
500 k 10 Hz to 15.7 kHz
RS , SOURCE RESISTANCE (OHMS)
200 k
100 k
ƪ ƫ
Noise Figure is Defined as:
Figure 5. Wideband
400
TJ = 125°C
25°C
h FE, DC CURRENT GAIN
200
– 55°C
100
80
60 VCE = 1.0 V
VCE = 10 V
40
0.003 0.005 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
TA = 25°C TA = 25°C IB = 400 µA
PULSE WIDTH = 300 µs
350 µA
0.8 IC, COLLECTOR CURRENT (mA) 80 DUTY CYCLE ≤ 2.0%
300 µA 250 µA
IC = 1.0 mA 10 mA 50 mA 100 mA
0.6 60 200 µA
150 µA
0.4 40
100 µA
0.2 20 50 µA
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
θV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 0.8
VBE(on) @ VCE = 1.0 V
25°C to 125°C
0.4
1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 1000
VCC = 3.0 V 700 VCC = – 3.0 V
300 IC/IB = 10
IC/IB = 10 500
200 TJ = 25°C IB1 = IB2
ts
300 TJ = 25°C
100 200
t, TIME (ns)
t, TIME (ns)
70
50 100
30 70
tr 50
20 tf
td @ VBE(off) = 0.5 V 30
10 20
7.0
5.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
7.0
300 VCE = 20 V Cib
C, CAPACITANCE (pF) 5.0
5.0 V
200
3.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = –10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 hfe ≈ 200 70
5.0 @ IC = –1.0 mA 50
3.0 30 hfe ≈ 200
@ IC = 1.0 mA
2.0 20
1.0 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
as shown in Figure 19. Using the model and the device thermal
ICEO response the normalized effective transient thermal resistance of
102 Figure 17 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 17 by the
101 steady state value RθJA.
ICBO
AND Example:
ICEX @ VBE(off) = 3.0 V Dissipating 2.0 watts peak under the following conditions:
100
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
Using Figure 17 at a pulse width of 1.0 ms and D = 0.2, the reading of
10–1 r(t) is 0.22.
The peak rise in junction temperature is therefore
10–2 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
–4 –2 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160
0 0 For more information, see AN–569.
TJ, JUNCTION TEMPERATURE (°C)
2
EMITTER
3
MAXIMUM RATINGS
Rating Symbol MMBTA92 MMBTA93 Unit 1
2
Collector – Emitter Voltage VCEO –300 –200 Vdc
Collector – Base Voltage VCBO –300 –200 Vdc
CASE 318 – 08, STYLE 6
Emitter – Base Voltage VEBO –5.0 –5.0 Vdc SOT– 23 (TO – 236AB)
DEVICE MARKING
MMBTA92LT1 = 2D; MMBTA93LT1 = 2E
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR–5 Board,(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RqJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg –55 to +150 °C
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(3) V(BR)CEO Vdc
(IC = –1.0 mAdc, IB = 0) MMBTA92 –300 —
MMBTA93 –200 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = –100 mAdc, IE = 0) MMBTA92 –300 —
MMBTA93 –200 —
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — Vdc
(IE = –100 mAdc, IC = 0)
Collector Cutoff Current ICBO µAdc
(VCB = –200 Vdc, IE = 0) MMBTA92 — –0.25
(VCB = –160 Vdc, IE = 0) MMBTA93 — –0.25
Emitter Cutoff Current IEBO — –0.1 µAdc
(VEB = –3.0 Vdc, IC = 0)
50 –55°C
30
20
15
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –80 –100
IC, COLLECTOR CURRENT (mA)
20
40
10 30
5.0
20
2.0
Ccb
1.0 0
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100–200 –500 –1000 –1.0 –2.0 –5.0 –10 –20 –50 –100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
–1.0
–0.8
VBE @ VCE = –10 V
V, VOLTAGE (VOLTS)
–0.6
–0.4
–0.2
VCE(sat) @ IC/IB = 10 mA
0
–1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mA)
1
BASE
3
2 1
EMITTER
2
DEVICE MARKING
MMBTH10LT1 = 3EM
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board (1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance Junction to Ambient RθJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate, (2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance Junction to Ambient RθJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
Preferred devices are Motorola recommended choices for future use and best overall value.
70 gib
y ib , INPUT ADMITTANCE (mmhos)
– 10
60
– 20
50
jb ib (mmhos)
– bib 1000 MHz
40 – 30
30 700
– 40
20 400 200 100
– 50
10
0 – 60
100 200 300 400 500 700 1000 0 10 20 30 40 50 60 70 80
f, FREQUENCY (MHz) gib (mmhos)
Figure 1. Rectangular Form Figure 2. Polar Form
70 60
bfb 400
60 200
50 50 600
100
40
700
– gfb
jb fb (mmhos)
30 40
20
10 30
1000 MHz
0
– 10 20
– 20
– 30 10
100 200 300 400 500 700 1000 70 60 50 40 30 20 10 0 – 10 – 20 – 30
f, FREQUENCY (MHz) gfb (mmhos)
Figure 3. Rectangular Form Figure 4. Polar Form
5.0 0
100
4.0 – 1.0 200
MPS H11
jb rb (mmhos)
3.0 – 2.0 400
–brb
2.0 –brb
– 3.0
700
MPS H10
1.0 – 4.0
–grb 1000 MHz
0 – 5.0
100 200 300 400 500 700 1000 –2.0 –1.8 –1.2 –0.8 –0.4 0 0.4 0.8 1.2 1.6 2.0
f, FREQUENCY (MHz) grb (mmhos)
8.0 8.0
7.0 700
jb ob(mmhos)
6.0 6.0
5.0 bob
4.0 4.0 400
3.0
200
2.0 2.0
gob
1.0 100
0 0
100 200 300 400 500 700 1000 0 2.0 4.0 6.0 8.0 10
f, FREQUENCY (MHz) gob (mmhos)
3
• Designed for
• fT = 400 MHz Min @ 8 mA 1
BASE
3
2 1
EMITTER
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector–Emitter Voltage VCEO 30 Vdc
Collector–Base Voltage VCBO 40 Vdc
Emitter–Base Voltage VEBO 4.0 Vdc
Collector Current – Continuous IC 50 mAdc
DEVICE MARKING
MMBTH24LT1 = M3A
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board (1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance Junction to Ambient RθJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate, (2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance Junction to Ambient RθJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
Preferred devices are Motorola recommended choices for future use and best overall value.
Conversion Gain — — — — dB
(213 MHz to 45 MHz)
(IC= 8.0 mAdc, VCC = 20 Vdc, Oscillator Injection = 150 mVrms) 19 24 —
(60 MHz to 45 MHz) CG
(IC = 8.0 mAdc, VCC = 20 Vdc, Oscillator Injection = 150 mVrms) 24 20 —
3. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%.
UHF/VHF Transistor
COLLECTOR MMBTH69LT1
PNP Silicon 3
Motorola Preferred Device
• Designed for UHF/VHF Amplifier Applications
1
• High Current Gain Bandwidth Product BASE
fT = 2000 MHz Min @ 10 mA
2
3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit
2
Collector–Emitter Voltage VCEO –15 Vdc
Collector–Base Voltage VCBO –15 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Emitter–Base Voltage VEBO –4.0 Vdc
DEVICE MARKING
MMBTH69LT1 = M3J
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board (1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance Junction to Ambient RθJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate, (2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance Junction to Ambient RθJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (IC = –1.0 mAdc, IB = 0) V(BR)CEO –15 — — Vdc
Collector–Base Breakdown Voltage (IC = –10 µAdc, IE = 0) V(BR)CBO –15 — — Vdc
Emitter–Base Breakdown Voltage (IE = –10 µAdc, IC = 0) V(BR)EBO –4.0 — — Vdc
Collector Cutoff Current (VCB = –10 Vdc, IE = 0) ICBO — — –100 nAdc
ON CHARACTERISTICS
DC Current Gain (IC = –10 mAdc, VCE = –10 Vdc) hFE 30 — 300 —
SMALL–SIGNAL CHARACTERISTICS
Current–Gain – Bandwidth Product fT 2000 — — MHz
(IC = –10 mAdc, VCE = –10 Vdc, f = 100 MHz)
Preferred devices are Motorola recommended choices for future use and best overall value.
UHF/VHF Transistor
MMBTH81LT1
COLLECTOR
PNP Silicon 3
Motorola Preferred Device
1
BASE
2 3
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit
2
Collector–Emitter Voltage VCEO –20 Vdc
Collector–Base Voltage VCBO –20 Vdc CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
Emitter–Base Voltage VEBO –3.0 Vdc
DEVICE MARKING
MMBTH81LT1 = 3D
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board,(1) PD 225 mW
TA = 25°C
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient RθJA 556 °C/W
Total Device Dissipation PD 300 mW
Alumina Substrate,(2) TA = 25°C
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient RθJA 417 °C/W
Junction and Storage Temperature TJ, Tstg – 55 to +150 °C
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (IC = –1.0 mAdc, IB = 0) V(BR)CEO –20 — — Vdc
Collector–Base Breakdown Voltage (IC = –10 µAdc, IE = 0) V(BR)CBO –20 — — Vdc
Emitter–Base Breakdown Voltage (IE = –10 µAdc, IC = 0) V(BR)EBO –3.0 — — Vdc
Collector Cutoff Current (VCB = –10 Vdc, IE = 0) ICBO — — –100 nAdc
Emitter Cutoff Current (VEB = –2.0 Vdc, IC = 0) IEBO — — –100 nAdc
ON CHARACTERISTICS
DC Current Gain (IC = –5.0 mAdc, VCE = –10 Vdc) hFE 60 — — —
Collector–Emitter Saturation Voltage (IC = –5.0 mAdc, IB = –0.5 mAdc) VCE(sat) — — –0.5 Vdc
Base–Emitter On Voltage (IC = –5.0 mAdc, VCE = –10 Vdc) VBE(on) — — –0.9 Vdc
SMALL–SIGNAL CHARACTERISTICS
Current–Gain – Bandwidth Product fT 600 — — MHz
(IC = –5.0 mAdc, VCE = –10 Vdc, f = 100 MHz)
Collector–Base Capacitance (VCB = –10 Vdc, IE = 0, f = 1.0 MHz) Ccb — — 0.85 pF
Collector–Emitter Capacitance (IB = 0, VCB = –10 Vdc, f = 1.0 MHz) Cce — — 0.65 pF
1. FR–5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
Preferred devices are Motorola recommended choices for future use and best overall value.
16
MAXIMUM RATINGS 1
Rating Symbol MMPQ2222 MMPQ2222A Unit
CASE 751B–05, STYLE 4
Collector – Emitter Voltage VCEO 30 40 Vdc
SO–16
Collector – Base Voltage VCB 60 75 Vdc
Emitter – Base Voltage VEB 5.0 Vdc
Collector Current — Continuous IC 500 mAdc
Four
Each Transistors
Transistor Equal Power
Total Power Dissipation PD Watts
@ TA = 25°C 0.52 1.0
Derate above 25°C 4.2 8.0 mW/°C
Total Power Dissipation PD Watts
@ TC = 25°C 0.8 2.4
Derate above 25°C 6.4 19.2 mW/°C
Operating and Storage TJ, Tstg –55 to +150 °C
Junction Temperature Range
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) MMPQ2222 V(BR)CEO 30 — — Vdc
(IC = 10 mAdc, IB = 0) MMPQ2222A 40 — —
Collector – Base Breakdown Voltage MMPQ2222 V(BR)CBO 60 — — Vdc
(IC = 10 mAdc, IE = 0) MMPQ2222A 75 — —
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — — Vdc
(IB = 10 mAdc, IC = 0) — — —
Collector Cutoff Current ICBO nAdc
(VCB = 50 Vdc, IE = 0) MMPQ2222 — — 50
(VCB = 60 Vdc, IE = 0) MMPQ2222A — — 10
Emitter Cutoff Current IEBO — — 100 nAdc
(VEB = 3.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product(1) fT 200 350 — MHz
(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)
Output Capacitance Cob — 4.5 — pF
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance Cib — 17 — pF
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
SWITCHING CHARACTERISTICS
Turn–On Time ton — 25 — ns
(VCC = 30 Vdc, VBE(off) = –0.5 Vdc, IC = 150 mAdc,
IB1 = 15 mAdc)
Turn–Off Time toff — 250 — ns
(VCC = 30 Vdc, IC = 150 mAdc, IB1 = IB2 = 15 mAdc)
Quad Switching
Transistor MMPQ2369
NPN Silicon 1
2
16
15
3 14
Motorola Preferred Device
4 13
5 12
6 11
7 10
8 9
16
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 15 Vdc
Collector – Base Voltage VCB 40 Vdc
Emitter – Base Voltage VEB 4.5 Vdc
Collector Current — Continuous IC 500 mAdc
Four
Each Transistors
Transistor Equal Power
Total Power Dissipation PD Watts
@ TA = 25°C 0.4 0.72
Derate above 25°C 3.2 6.4 mW/°C
Total Power Dissipation PD Watts
@ TC = 25°C 0.66 1.92
Derate above 25°C 5.3 15.4 mW/°C
Operating and Storage TJ, Tstg –55 to +150 °C
Junction Temperature Range
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 15 — — Vdc
(IC = 10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 40 — — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 4.5 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — 0.4 mAdc
(VCB = 20 Vdc, IE = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product fT 450 550 — MHz
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance Cob — 2.5 4.0 pF
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance Cib — 3.0 5.0 pF
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
SWITCHING CHARACTERISTICS
Turn–On Time ton — 9.0 — ns
(VCC = 3.0 Vdc, VEB(off) = 1.5 Vdc, IC = 10 mAdc,
IB1 = 3.0 mAdc)
Turn–Off Time toff — 15 — ns
(VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc, IB2 = 1.5 mAdc)
REV 1
SWITCHING CHARACTERISTICS
Turn–On Time ton — 30 — ns
(VCC = –30 Vdc, IC = –150 mAdc, IB1 = –15 mAdc)
Turn–Off Time toff — 100 — ns
(VCC = –6.0 Vdc, IC = –150 mAdc, IB1 = IB2 = –15 mAdc)
16
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO –40 — — Vdc
(IC = –10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –40 — — Vdc
(IC = –10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — –200 nAdc
(VCB = –30 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — –200 nAdc
(VEB = –3.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product fT — 190 — MHz
(IC = –50 mAdc, VCE = –10 Vdc, f = 100 MHz)
Output Capacitance Cob — 10 — pF
(VCB = –10 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance Cib — 55 — pF
(VEB = –0.5 Vdc, IC = 0, f = 1.0 MHz)
SWITCHING CHARACTERISTICS
Turn–On Time ton — 20 — ns
(IC = –500 mAdc, IB1 = –50 mAdc)
Turn–Off Time toff — 60 — ns
(IC = –500 mAdc, IB1 = IB2 = –50 mAdc)
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 40 — — Vdc
(IC = 10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CES 60 — — Vdc
(IC = 100 mAdc, VBE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — 0.5 mAdc
(VCB = 40 Vdc, IE = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product fT — 275 — MHz
(IC = 50 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance Cob — 5.1 — pF
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance Cib — 62 — pF
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
SWITCHING CHARACTERISTICS
Turn–On Time ton — 20 — ns
(IC = 500 mAdc, IB1 = 50 mAdc, VBE(off) = –3.8 Vdc)
Turn–Off Time toff — 50 — ns
(IC = 500 mAdc, IB1 = IB2 = 50 mAdc)
Quad Amplifier/Switch
Transistor MMPQ3904
NPN Silicon 1
2
16
15
3 14
Motorola Preferred Device
4 13
5 12
6 11
7 10
8 9
16
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 40 — — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 60 — — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — 50 nAdc
(VCB = 40 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — 50 nAdc
(VEB = 4.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product fT 250 300 — MHz
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
Output Capacitance Cob — 2.0 4.0 pF
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance Cib — 4.0 8.0 pF
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
SWITCHING CHARACTERISTICS
Turn–On Time ton — 37 — ns
(IC = 10 Vdc, VBE(off) = –0.5 Vdc, IB1 = 1.0 mAdc)
Turn–Off Time toff — 136 — ns
(IC = 10 mAdc, IB1 = IB2 = 1.0 mAdc)
Quad Amplifier/Switch
Transistor MMPQ3906
PNP Silicon 1
2
16
15
Motorola Preferred Device
3 14
4 13
5 12
6 11
7 10
8 9
16
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO –40 — — Vdc
(IC = –1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –40 — — Vdc
(IC = –10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — –50 nAdc
(VCB = –30 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — –50 nAdc
(VEB = –4.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product fT 200 250 — MHz
(IC = –10 mAdc, VCE = –20 Vdc, f = 100 MHz)
Output Capacitance Cob — 3.3 4.5 pF
(VCB = –5.0 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance Cib — 4.8 10 pF
(VEB = –0.5 Vdc, IC = 0, f = 1.0 MHz)
SWITCHING CHARACTERISTICS
Turn–On Time ton — 43 — ns
(IC = –10 mAdc, VBE(off) = 0.5 Vdc, IB1 = –1.0 mAdc)
Turn–Off Time toff — 155 — ns
(IC = –10 mAdc, IB1 = IB2 = –1.0 mAdc)
MAXIMUM RATINGS
Rating Symbol Value Unit 16
Collector – Emitter Voltage VCEO 40 Vdc
1
Collector – Base Voltage VCB 40 Vdc
Emitter – Base Voltage VEB 5.0 Vdc CASE 751B–05, STYLE 4
SO–16
Collector Current — Continuous IC 200 mAdc
Four
Each Transistors
Transistor Equal Power
Total Power Dissipation @ TA = 25°C PD 0.4 0.72 Watts
Derate above 25°C 3.2 6.4 mW/°C
Total Power Dissipation @ TC = 25°C PD 0.66 1.92 Watts
Derate above 25°C 5.3 15.4 mW/°C
Operating and Storage Junction TJ, Tstg –55 to +150 °C
Temperature Range
16
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 30 — — Vdc
(IC = 10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 30 — — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 4.0 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — 50 nAdc
(VCB = 20 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — 50 nAdc
(VEB = 3.0 Vdc, IC = 0)
DYNAMIC CHARACTERISTICS
Current – Gain — Bandwidth Product(1) fT 200 350 — MHz
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
Output Capacitance Cob — 3.0 4.5 pF
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance Cib pF
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz) PNP — 5.0 10
NPN — 4.0 8.0
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Resistance — Junction-to-Ambient (surface mounted) RθJA 625 °C/W
Operating and Storage Temperature Range TJ, Tstg – 65 to +150 °C
Maximum Temperature for Soldering Purposes, 260 °C
TL
Time in Solder Bath 10 Sec
1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.
(Replaces MMUN2111T1/D)
OFF CHARACTERISTICS
Collector-Base Cutoff Current (VCB = 50 V, IE = 0) ICBO — — 100 nAdc
Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0) ICEO — — 500 nAdc
Emitter-Base Cutoff Current MMUN2111LT1 IEBO — — 0.5 mAdc
(VEB = 6.0 V, IC = 0) MMUN2112LT1 — — 0.2
MMUN2113LT1 — — 0.1
MMUN2114LT1 — — 0.2
MMUN2115LT1 — — 0.9
MMUN2116LT1 — — 1.9
MMUN2130LT1 — — 4.3
MMUN2131LT1 — — 2.3
MMUN2132LT1 — — 1.5
MMUN2133LT1 — — 0.18
MMUN2134LT1 — — 0.13
Collector-Base Breakdown Voltage (IC = 10 µA, IE = 0) V(BR)CBO 50 — — Vdc
Collector-Emitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0) V(BR)CEO 50 — — Vdc
ON CHARACTERISTICS(3)
DC Current Gain MMUN2111LT1 hFE 35 60 —
(VCE = 10 V, IC = 5.0 mA) MMUN2112LT1 60 100 —
MMUN2113LT1 80 140 —
MMUN2114LT1 80 140 —
MMUN2115LT1 160 250 —
MMUN2116LT1 160 250 —
MMUN2130LT1 3.0 5.0 —
MMUN2131LT1 8.0 15 —
MMUN2132LT1 15 27 —
MMUN2133LT1 80 140 —
MMUN2134LT1 80 130 —
Collector-Emitter Saturation Voltage (IC = 10 mA, IE = 0.3 mA) VCE(sat) — — 0.25 Vdc
(IC = 10 mA, IB = 5 mA) MMUN2130LT1/MMUN2131LT1
(IC = 10 mA, IB = 1 mA) MMUN2115LT1/MMUN2116LT1/
MMUN2132LT1/MMUN2133LT1/MMUN2134LT1
Output Voltage (on) VOL Vdc
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kΩ) MMUN2111LT1 — — 0.2
MMUN2112LT1 — — 0.2
MMUN2114LT1 — — 0.2
MMUN2115LT1 — — 0.2
MMUN2116LT1 — — 0.2
MMUN2130LT1 — — 0.2
MMUN2131LT1 — — 0.2
MMUN2132LT1 — — 0.2
MMUN2133LT1 — — 0.2
MMUN2134LT1 — — 0.2
(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 kΩ) MMUN2113LT1 — — 0.2
IC/IB = 10
200
TA = –25°C
25°C
150
75°C
0.1
100
RθJA = 625°C/W
50
0 0.01
–50 0 50 100 150 0 20 40 60 80
TA, AMBIENT TEMPERATURE (°C) IC, COLLECTOR CURRENT (mA)
1000 4
VCE = 10 V
h FE, DC CURRENT GAIN (NORMALIZED)
f = 1 MHz
lE = 0 V
3 TA = 25°C
Cob , CAPACITANCE (pF)
TA = 75°C
25°C
100 2
–25°C
10 0
1 10 100 0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE BIAS VOLTAGE (VOLTS)
100 100
25°C
75°C
VO = 0.2 V
TA = –25°C
IC , COLLECTOR CURRENT (mA)
10
Vin, INPUT VOLTAGE (VOLTS)
TA = –25°C
10
1
25°C
75°C
0.1
1
0.01
VO = 5 V
0.001 0.1
0 1 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50
Vin, INPUT VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
Figure 5. Output Current versus Input Voltage Figure 6. Input Voltage versus Output Current
10 1000
0.1
0.01 10
0 20 40 60 80 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
75°C 25°C
f = 1 MHz TA = –25°C
IC , COLLECTOR CURRENT (mA)
lE = 0 V 10
3 TA = 25°C
Cob , CAPACITANCE (pF)
1
2
0.1
1
VO = 5 V
0.01
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 9. Output Capacitance Figure 10. Output Current versus Input Voltage
100
VO = 0.2 V
Vin, INPUT VOLTAGE (VOLTS)
TA = –25°C
10 25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1 1000
IC/IB = 10
75°C –25°C
0.1 100
0.01 10
0 10 20 30 40 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1 100
TA = 75°C 25°C
f = 1 MHz I C , COLLECTOR CURRENT (mA)
lE = 0 V
0.8 10 –25°C
TA = 25°C
Cob , CAPACITANCE (pF)
0.6 1
0.4 0.1
0.2 0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 14. Output Capacitance Figure 15. Output Current versus Input Voltage
100
VO = 2 V
TA = –25°C
Vin , INPUT VOLTAGE (VOLTS)
25°C
10 75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1 180
IC/IB = 10 TA = 75°C
100
80
0.01 60
40
20
0.001 0
0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4.5 100
4 f = 1 MHz TA = 75°C 25°C
lE = 0 V
3.5
IC, COLLECTOR CURRENT (mA)
TA = 25°C
Cob , CAPACITANCE (pF)
–25°C
3
2.5
10
2
1.5
1
VO = 5 V
0.5
0 1
0 2 4 6 8 10 15 20 25 30 35 40 45 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 19. Output Capacitance Figure 20. Output Current versus Input Voltage
10 +12 V
VO = 0.2 V TA = –25°C
25°C
V in , INPUT VOLTAGE (VOLTS)
LOAD
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
Figure 21. Input Voltage versus Output Current Figure 22. Inexpensive, Unregulated Current Source
This new series of digital transistors is designed to replace a single device and its
external resistor bias network. The BRT (Bias Resistor Transistor) contains a single
transistor with a monolithic bias network consisting of two resistors; a series base
resistor and a base-emitter resistor. The BRT eliminates these individual components NPN SILICON
by integrating them into a single device. The use of a BRT can reduce both system BIAS RESISTOR
cost and board space. The device is housed in the SOT-23 package which is TRANSISTOR
designed for low power surface mount applications.
• Simplifies Circuit Design
PIN 3
• Reduces Board Space
COLLECTOR
• Reduces Component Count (OUTPUT) 3
• The SOT-23 package can be soldered using wave or R1
reflow. The modified gull-winged leads absorb thermal 1
stress during soldering eliminating the possibility of PIN 1 R2 2
damage to the die. BASE
(INPUT)
• Available in 8 mm embossed tape and reel. Use the
PIN 2 CASE 318-08, STYLE 6
Device Number to order the 7 inch/3000 unit reel.
EMITTER SOT-23 (TO-236AB)
Replace “T1” with “T3” in the Device Number to order (GROUND)
the13 inch/10,000 unit reel.
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Symbol Value Unit
Collector-Base Voltage VCBO 50 Vdc
Collector-Emitter Voltage VCEO 50 Vdc
Collector Current IC 100 mAdc
Total Power Dissipation @ TA = 25°C(1) *200 mW
PD
Derate above 25°C 1.6 mW/°C
THERMAL CHARACTERISTICS
Thermal Resistance — Junction-to-Ambient (surface mounted) RθJA 625 °C/W
Operating and Storage Temperature Range TJ, Tstg – 65 to +150 °C
Maximum Temperature for Soldering Purposes, 260 °C
TL
Time in Solder Bath 10 Sec
1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.
(Replaces MMUN2211T1/D)
3. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%.
3. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%.
IC/IB = 10
200 TA = –25°C
25°C
0.1 75°C
150
100
0.01
RθJA = 625°C/W
50
0 0.001
–50 0 50 100 150 0 20 40 60 80
TA, AMBIENT TEMPERATURE (°C) IC, COLLECTOR CURRENT (mA)
1000 4
h FE, DC CURRENT GAIN (NORMALIZED)
VCE = 10 V f = 1 MHz
lE = 0 V
TA = 75°C 3 TA = 25°C
Cob , CAPACITANCE (pF)
25°C
–25°C
100 2
10 0
1 10 100 0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE BIAS VOLTAGE (VOLTS)
100 10
25°C
75°C VO = 0.2 V TA = –25°C
10 TA = –25°C 25°C
IC , COLLECTOR CURRENT (mA)
75°C
1
1
0.1
0.01
VO = 5 V
0.001 0.1
0 1 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50
Vin, INPUT VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1 1000
VCE = 10 V
100
0.01
–
0.001 10
0 20 40 60 80 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
3 TA = 25°C
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 9. Output Capacitance Figure 10. Output Current versus Input Voltage
100
VO = 0.2 V
TA = –25°C
Vin , INPUT VOLTAGE (VOLTS)
10
75°C 25°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
10 1000
IC/IB = 10 TA = –25°C VCE = 10 V
0.1
0.01 10
0 20 40 60 80 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1 100
75°C 25°C
f = 1 MHz
lE = 0 V
0.8 TA = 25°C I C , COLLECTOR CURRENT (mA) 10 TA = –25°C
Cob , CAPACITANCE (pF)
0.6 1
0.4 0.1
0.2 0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 14. Output Capacitance Figure 15. Output Current versus Input Voltage
100
VO = 0.2 V
TA = –25°C
25°C
V in , INPUT VOLTAGE (VOLTS)
10 75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1 300
IC/IB = 10 TA = –25°C TA = 75°C
0.01 100
50
0.001 0
0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
f = 1 MHz 75°C 25°C
3.5
lE = 0 V
IC, COLLECTOR CURRENT (mA)
3 TA = 25°C
Cob , CAPACITANCE (pF)
2.5
TA = –25°C
2 10
1.5
0.5 VO = 5 V
0 1
0 2 4 6 8 10 15 20 25 30 35 40 45 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 19. Output Capacitance Figure 20. Output Current versus Input Voltage
10
TA = –25°C
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
25°C
75°C
1
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
+12 V
ISOLATED
LOAD
FROM µP OR
OTHER LOGIC
+12 V
VCC
OUT
IN
LOAD
Figure 23. Open Collector Inverter: Inverts Figure 24. Inexpensive, Unregulated Current Source
the Input Signal
1 2 3 4 5 6 7
14
1
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 66 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 10 mAdc, IB = 0) MPQ2222 40 —
MPQ2222A 40 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 10 mAdc, IE = 0) MPQ2222 60 —
MPQ2222A 75 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 mAdc, IC = 0) MPQ2222 5.0 —
MPQ2222A 6.0 —
Collector Cutoff Current ICBO nAdc
(VCB = 50 Vdc, IE = 0) MPQ2222 — 50
(VCB = 60 Vdc, IE = 0) MPQ2222A — 10
Emitter Cutoff Current IEBO — 100 nAdc
(VEB = 3.0 Vdc, IC = 0)
(Replaces MPQ2221/D)
SWITCHING CHARACTERISTICS
Turn–On Time ton — 35 ns
(VCC = 30 Vdc, VBE(off) = –0.5 Vdc,
IC = 150 mAdc, IB1 = 15 mAdc) MPQ2222A
Turn–Off Time toff — 285 ns
(VCC = 30 Vdc, IC = 150 mAdc,
IB1 = IB2 = 15 mAdc) MPQ2222A
619 1.0 k
9.9 V
0
0 1N916
0.5 V
SCOPE –13.8 V SCOPE
Rin > 100 k ohms ≈ 500 ms Rin > 100 k ohms
Cin ≤ 12 pF –3.0 V Cin ≤ 12 pF
RISE TIME ≤ 5.0 ns RISE TIME ≤ 5.0 ns
Figure 1. Delay and Rise Time Figure 2. Storage Time and Fall Time
Equivalent Test Circuit Equivalent Test Circuit
25°C
1.0
0.7 –55°C
0.5
0.3
0.2
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.4 +1.6
0.6
VBE @ VCE = 1.0 V –0.8
0.4
–1.6 qVB FOR VBE
0.2 VCE(sat) @ IC/IB = 10
0 –2.4
0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
NOISE FIGURE
(VCE = 10 Vdc, TA = 25°C)
6.0 10
100 mA
f = 1.0 kHz
5.0 IC = 1.0 mA
8.0
NF, NOISE FIGURE (dB)
10 mA
NF, NOISE FIGURE (dB)
4.0
IC = 10 mA 6.0
3.0 RS = 4.3 kW
4.0
2.0 IC = 100 mA
RS = 1.0 kW
2.0
1.0
0 0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (k OHMS)
C, CAPACITANCE (pF)
100 Cib
70 10
50
7.0 Cob
30
20 5.0
10 3.0
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20
IC, COLLECTOR CURRENT (mAdc) VR, REVERSE VOLTAGE (VOLTS)
50 500 CHARGE
HIGH GAIN TYPES
300 300
ts
200 200
t s ,t f , STORAGE AND FALL TIME (ns)
ts IC/IB = 10
IC/IB = 10
100 100
IC/IB = 20
70 70
50 IC/IB = 20 50 IC/IB = 10
IC/IB = 10 tf tf
30 30
HIGH GAIN TYPES
20 LOW GAIN TYPES 20 TJ = 25°C
TJ = 25°C
10 10
10 20 30 50 70 100 200 300 10 20 30 50 70 100 200 300
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–3.0 V
Figure 14. Delay and Rise Time Figure 15. Storage Time and Fall Time
Equivalent Test Circuit Equivalent Test Circuit
Quad Switching
Transistor MPQ2369
NPN Silicon
Motorola Preferred Device
14 13 12 11 10 9 8
NPN
1 2 3 4 5 6 7
14
1
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 83 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 15 — — Vdc
(IC = 10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 40 — — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 4.5 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — 0.4 mAdc
(VCB = 20 Vdc, IE = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
SWITCHING CHARACTERISTICS
Turn–On Time ton — 9.0 — ns
(VCC = 3.0 Vdc, VBE = 1.5 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc)
Turn–Off Time toff — 15 — ns
(VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc, IB2 = 1.5 mAdc)
980
SCOPE
+6.0 V 500
0
CS ≤ 3.0 pF
–4.0 V
PULSE WIDTH = 300 ns
tf ≤ 1.0 ns
DUTY CYCLE ≤ 2.0%
200 200
IC/IB = 10 VCC = 10 V
100 TJ = 25°C 100 IC/IB = 10
70 70 TJ = 25°C
50 50
t, TIME (ns)
t, TIME (ns)
30 tr @ VCC = 3.0 V tr @ VCC = 10 V 30
tf
20 20
10 10
7.0 7.0 ts
5.0 5.0
270 270
1.0 k
2.0
Cob 700
500
1.0
0.7 300
0.5 200
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
500 1.4
TJ = 25°C
300 TJ = 150°C
1.2
200
25°C 1.0
h FE , DC CURRENT GAIN
V, VOLTAGE (VOLTS)
100
–55°C VBE(SAT) @ IC/IB = 10
70 0.8
50 VBE(ON) @ VCE = 1.0 V
0.6
30
20 0.4
VCE = 1.0 V
10 VCE = 5.0 V 0.2 VCE(SAT) @ IC/IB = 10
7.0
5.0 0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 +2.0
V CE , COLLECTOR–EMITTER VOLTAGE (VOLTS)
0.8 +1.0
25°C TO 150°C
30 mA 100 mA 200 mA *qVC FOR VCE(SAT)
0.6 0
–55°C TO 25°C
0.4 –1.0
25°C TO 150°C
qVB FOR VBE
0.2 –2.0
IC = 10 mA
–55°C TO 25°C
0 –3.0
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1 2 3 4 5 6 7
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 40 Vdc 14
Collector – Base Voltage VCBO 60 Vdc 1
THERMAL CHARACTERISTICS
Junction Junction
Characteristic to Case to Ambient Unit
Thermal Resistance Each Die 151 250 °C/W
Effective, 4 Die 52 134 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 34 70 %
Q1–Q2 or Q3–Q4 2.0 26 %
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO 40 — — Vdc
(IC = 10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 60 — — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — 20 nAdc
(VCB = 45 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — 20 nAdc
(VEB = 3.0 Vdc, IC = 0)
1. Second Breakdown occurs at power levels greater than 3 times the power dissipation rating.
2. Pulse Test: Pulse Width v
300 ms; Duty Cycle 2.0%. v
Preferred devices are Motorola recommended choices for future use and best overall value.
COMPLEMENTARY
1 2 3 4 5 6 7
MPQ6600A1
TYPE B
14
1
THERMAL CHARACTERISTICS
Junction to Junction to
Characteristic Case Ambient Unit
Thermal Resistance(1) Each Die 151 250 °C/W
Effective, 4 Die 52 139 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 34 70 %
Q1–Q2 or Q3–Q4 2.0 26 %
1. RθJA is measured with the device soldered into a typical printed circuit board.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO Vdc
(IC = 10 mAdc, IB = 0) MPQ6100A, 6600A1 45 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 10 mAdc, IE = 0) 60 — —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 mAdc, IC = 0) 5.0 — —
Collector Cutoff Current ICBO nAdc
(VCB = 50 Vdc, IE = 0) — — 10
ON CHARACTERISTICS(2)
DC Current Gain hFE —
(IC = 100 mAdc, VCE = 5.0 Vdc) MPQ6100A, 6600A1 100 — —
(IC = 500 µAdc, VCE = 5.0 Vdc) MPQ6100A, 6600A1 150 — —
(IC = 1.0 mAdc, VCE = 5.0 Vdc) MPQ6100A, 6600A1 150 — —
(IC = 10 mAdc, VCE = 5.0 Vdc) MPQ6100A, 6600A1 125 — —
Collector – Emitter Saturation Voltage VCE(sat) Vdc
(IC = 1.0 mAdc, IB = 100 µAdc) — — 0.25
Base – Emitter Saturation Voltage VBE(sat) Vdc
(IC = 1.0 mAdc, IB = 100 µAdc) — — 0.8
12 12
10 10 –1 mA
NOISE FIGURE (dB)
8 8 –100 µA
6 6
–10 µA
4 4
–100 µA
2 2
–10 µA
0 0
1.0 k 10 k 100 k 1.0 k 10 k 100 k
Rs, SOURCE RESISTANCE (OHMS) Rs, SOURCE RESISTANCE (OHMS)
Figure 1. Source Resistance Effects, f = 1.0 kHz Figure 2. Source Resistance Effects, f = 10 Hz
4 TA = – 55°C
200
2
0 0
1.0 k 10 k 100 k – 0.01 – 0.1 – 1.0 – 10
f, FREQUENCY (Hz) IC, COLLECTOR CURRENT (mAdc)
PNP MPQ2907A*
1 2 3 4 5 6 7
*Motorola Preferred Device
14
MAXIMUM RATINGS 1
MPQ2906
Rating Symbol MPQ2907 MPQ2907A Unit CASE 646–06, STYLE 1
Collector – Emitter Voltage VCEO –40 –60 Vdc TO–116
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 66 °C/W
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = –10 mAdc, IB = 0) MPQ2906, MPQ2907 –40 —
MPQ2907A –60 —
Collector – Base Breakdown Voltage V(BR)CBO –60 — Vdc
(IC = –10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICBO — –50 nAdc
(VCB = –30 Vdc, IE = 0) MPQ2906, MPQ2907
(VCB = –50 Vdc, IE = 0) MPQ2907A
Emitter Cutoff Current IEBO — –50 nAdc
(VEB = –3.0 Vdc, IE = 0) MPQ2906,7 Only
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 3
SWITCHING CHARACTERISTICS
Turn–On Time ton — 45 ns
(VCC = –30 Vdc, IC = –150 mAdc, IB1 = 15 mAdc) MPQ2907A Only
Turn–Off Time toff — 180 ns
(VCC = –6.0 Vdc, IC = –150 mAdc,
IB1 = IB2 = 15 mAdc) MPQ2907A Only
INPUT INPUT
Zo = 50 W 200 Zo = 50 W 1.0 k 37
PRF = 150 PPS PRF = 150 PPS
RISE TIME ≤ 2.0 ns RISE TIME ≤ 2.0 ms
1.0 k TO OSCILLOSCOPE 1.0 k TO OSCILLOSCOPE
0 RISE TIME ≤ 5.0 ns 0 RISE TIME ≤ 5.0 ns
200 ns 200 ns
Figure 1. Delay and Rise Time Figure 2. Storage and Fall Time
Test Circuit Test Circuit
1.0 +25°C
0.7
0.5
–55°C
0.3 VCE = 10 V
VCE = 1.0 V
0.2
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
2.0 +2.0
TJ = 25°C
1.6 +1.0 qVC FOR VCE(sat)
“ON” VOLTAGE (VOLTS)
NOISE FIGURE
(VCE = 10 V, TA = 25°C)
6.0 10
VCE = 10 Vdc f = 1.0 kHz
5.0 TA = 25°C
8.0 IC = 10 mA
NF, NOISE FIGURE (dB)
4.0
IC = 10 mA 6.0 100 mA
3.0 RS = 4.7 kW
4.0
IC = 1.0 mA
RS = 0.7 kW
2.0
C, CAPACITANCE (pF)
Cob
200 10
7.0
100 5.0
80
60 3.0
0.5 0.7 1.0 2.0 3.0 5.0 10 20 30 50 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
500 5000
VCC = 30 V, VBE(off) = 2.0 V
300 VCC = 10 V, VBE(off) = 0 V 3000 VCC = 30 V
TJ = 25°C
200 2000
IC/IB = 10
QT, TOTAL CONTROL CHARGE
TJ = 25°C Q, CHARGE (pC)
t, TIME (ns)
100 tr 1000
70 700
50 td 500
30 300
20 200 QA, ACTIVE REGION CHARGE
10 100
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 500
IC/IB = 20
t f , FALL TIME (ns)
100 100
IB1 = IB2
70 TJ = 25°C 70 IC/IB = 10
50 IC/IB = 10 50
30 30
20 IC/IB = 20 20
10 10
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
u
P.W. 200 ns
–30 V
P.W. ≈ 1.0 ms
–30 V
tr ≤ 2.0 ns tr ≤ 2.0 ns
DUTY CYCLE ≤ 2.0% 200 DUTY CYCLE ≤ 2.0% 200
+13.8 V
1.0 k SCOPE 1.0 k SCOPE
0 0
–3.0 V
Figure 14. Delay and Rise Time Figure 15. Storage and Fall Time
Test Circuit Test Circuit
14 13 12 11 10 9 8
PNP
1 2 3 4 5 6 7
MAXIMUM RATINGS
Rating Symbol Value Unit 14
THERMAL CHARACTERISTICS
RqJC RqJA
Junction Junction
Characteristic to Case to Ambient Unit
Thermal Resistance Each Die 100 193 °C/W
Effective, 4 Die 39 83.2 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 45 55 %
Q1–Q2 or Q3–Q4 5.0 10 %
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO –40 — — Vdc
(IC = –10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –40 — — Vdc
(IC = –10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — –200 nAdc
(VCB = –30 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — –200 nAdc
(VEB = –3.0 Vdc, IC = 0)
1. Second Breakdown occurs at power levels greater than 2 times the power dissipation rating.
2. Pulse Test: Pulse Width v
300 ms; Duty Cycle 2.0%. v
Preferred devices are Motorola recommended choices for future use and best overall value.
20 0
– 50 – 70 –100 – 200 – 300 – 500 – 700 – 1000 – 50 – 70 –100 – 200 – 300 – 500 – 700 – 1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
70
TJ = 125°C VCE = – 1.0 V
VCE = – 2.0 V
hFE , MINIMUM CURRENT GAIN
50 TJ = 25°C
30
TJ = – 55°C
20
10
– 50 – 70 – 100 – 200 – 300 – 500 – 700 – 1000
IC, COLLECTOR CURRENT (mA)
NPN
1 2 3 4 5 6 7
MAXIMUM RATINGS 14
Rating Symbol Value Unit 1
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Effective
One For Four
Transistor Transistors
Thermal Resistance, RqJA 125 50 °C/W
Junction to Ambient(1)
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO 40 — — Vdc
(IC = 10 mAdc, IB = 0)
Collector – Emitter Breakdown Voltage V(BR)CES 60 — — Vdc
(IC = 100 mAdc, VBE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — 0.5 mAdc
(VCB = 40 Vdc, IE = 0)
1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width v
300 ms; Duty Cycle 2.0%. v
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 3
SWITCHING CHARACTERISTICS
Turn–On Time ton — 20 35 ns
(IC = 500 mAdc, IB1 = 50 mAdc
VBE(off) = –3.8 Vdc)
Turn–Off Time toff — 50 60 ns
(IC = 500 mAdc, IB1 = IB2 = 50 mAdc)
–3.8 V +30 V
1.0 mF
15
TO
1.0 k SAMPLING
43 OSCILLOSCOPE
+9.7 V Zin ≥ 100 kW
1.0 mF 100 tr < 1.0 ns
0
PULSE GENERATOR
tr, tf ≤ 1.0 ns
PW ≈ 1.0 ms
62
Zin = 50 W
DUTY CYCLE ≤ 2.0%
TYPICAL DC CHARACTERISTICS
400 1.4
TJ = 25°C
VCE = 1.0 V
TJ = 125°C 1.2
h FE , DC CURRENT GAIN
200
1.0
V, VOLTAGE (VOLTS)
25°C
0.8
100
80 –55°C 0.6 VBE(sat) @ IC/IB = 10
60
0.4
40
0.2
VCE(sat) @ IC/IB = 10
20 0
10 20 50 100 200 500 1000 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 +2.5
VCE , COLLECTOR–EMITTER VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
30
200
20
10 Cob
100
7.0
70 5.0
50 3.0
4.0 6.0 10 20 40 60 100 200 400 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
200 200
IC /IB = 10 VCC = 10 Vdc
100 TJ = 25°C tf @ IC/IB = 10 TJ = 25°C
100
tf @ IC/IB = 20
50 tr @ VCC = 10 Vdc 70 ts @ IC/IB = 20
t, TIME (ns)
t, TIME (ns)
30
10
td @ VBE(off) = 0 V 20
5.0
VBE(off) = –3.8 Vdc
3.0 VCC = 30 Vdc
2.0 10
10 20 30 50 100 200 300 500 1000 10 20 30 50 100 200 300 500 1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1000
I CES , COLLECTOR CUTOFF CURRENT ( m A)
100
VCE = 60
10
VCE = 30
VCE = 10
1.0
0.1
0.01
0 20 40 60 80 100 120 140 160 180 200
TJ, JUNCTION TEMPERATURE (°C)
PNP
1 2 3 4 5 6 7
14
MAXIMUM RATINGS 1
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO –40 Vdc CASE 646–06, STYLE 1
TO–116
Collector – Base Voltage VCBO –40 Vdc
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –1.5 Adc
Four
Each Transistors
Transistor Equal Power
Total Device Dissipation PD
@ TA = 25°C 750 1700 mW
Derate above 25°C 5.98 13.6 mW/°C
Total Device Dissipation PD
@ TC = 25°C 1.25 3.2 Watts
Derate above 25°C 10 25.6 mW/°C
Operating and Storage Junction TJ, Tstg –55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Junction Junction
Characteristic to Case to Ambient Unit
Thermal Resistance(1) Each Die 100 167 °C/W
Effective, 4 Die 39 73.5 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 46 56 %
Q1–Q2 or Q3–Q4 5.0 10 %
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO –40 — — Vdc
(IC = –10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –40 — — Vdc
(IC = –10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — –100 nAdc
(VCB = –30 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — –100 nAdc
(VEB = –3.0 Vdc, IC = 0)
1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width v300 ms; Duty Cycle v
2.0%.
SWITCHING CHARACTERISTICS
Turn–On Time ton — — 50 ns
(VCC = –30 Vdc, IC = –1.0 Adc, IB1 = –100 mAdc, VBE(off) = 2.0 Vdc)
Turn–Off Time toff — — 120 ns
(VCC = –30 Vdc, IC = –1.0 Adc, IB1 = IB2 = –100 mAdc)
– 1.2 MAX
100 TJ = 125°C TJ = 25°C
– 1.0
70 βF = 10, 20 VBE(sat)
– 0.8
MIN
50 βF = 10 – 0.6
MAX VCE(sat)
βF = 20 – 0.4
30
t′s ≈ ts – 1/8 tf – 0.2
20 0
– 50 – 70 –100 – 200 – 300 – 500 – 700 – 1000 – 50 – 70 –100 – 200 – 300 – 500 – 700 – 1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
70
TJ = 125°C VCE = – 1.0 V
VCE = – 2.0 V
hFE , MINIMUM CURRENT GAIN
50 TJ = 25°C
30
TJ = – 55°C
20
10
– 50 – 70 – 100 – 200 – 300 – 500 – 700 – 1000
IC, COLLECTOR CURRENT (mA)
1 2 3 4 5 6 7
MAXIMUM RATINGS
Rating Symbol MPQ3798 MPQ3799 Unit
Collector – Emitter Voltage VCEO –40 –60 Vdc
14
Collector – Base Voltage VCBO –60 Vdc
1
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –50 mAdc CASE 646–06, STYLE 1
Four TO–116
Each Transistors
Transistor Equal Power
Total Device Dissipation PD
@ TA = 25°C(1) 0.5 0.9 Watts
Derate above 25°C 4.0 7.2 mW/°C
Total Device Dissipation PD
@ TC = 25°C 0.825 2.4 Watts
Derate above 25°C 6.7 19.2 m/°C
Operating and Storage Junction TJ, Tstg –55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
RqJC RqJA
Junction Junction
Characteristic to Case to Ambient Unit
Thermal Resistance Each Die 151 250 °C/W
Effective, 4 Die 52 139 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 34 70 %
Q1–Q2 or Q3–Q4 2.0 26 %
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO Vdc
(IC = –10 mAdc, IB = 0) MPQ3798 –40 — —
MPQ3799 –60 — —
Collector – Base Breakdown Voltage V(BR)CBO –60 — — Vdc
(IC = –10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — –10 nAdc
(VCB = –50 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — –20 nAdc
(VEB = –3.0 Vdc, IC = 0)
1. Second breakdown occurs at power levels greater than 3 times the power dissipation rating.
2. Pulse Test: Pulse Width v
300 ms; Duty Cycle 2.0%. v
Preferred devices are Motorola recommended choices for future use and best overall value.
h FE , CURRENT GAIN
200 200
100 100
10 10
0.01 0.1 1.0 10 100 0.01 0.1 1.0 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 1.0
0.8 0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
V, VOLTAGE (VOLTS)
VBE(sat) @ IC/IB = 10
0.6 0.6
0.4 0.4
0.2 0.2
VCE(sat) @ IC/IB = 10 VCE(sat) @ IC/IB = 10
0 0
0.01 0.1 1.0 10 100 0.01 0.1 1.0 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
NPN
1 2 3 4 5 6 7
MAXIMUM RATINGS
14
Rating Symbol Value Unit 1
Collector – Emitter Voltage VCEO 40 Vdc
Collector – Base Voltage VCBO 60 Vdc CASE 646–06, STYLE 1
TO–116
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 200 mAdc
Four
Each Transistors
Transistor Equal Power
Total Device Dissipation PD
@ TA = 25°C 500 900 mW
Derate above 25°C 4.0 7.2 mW/°C
Total Device Dissipation PD
@ TC = 25°C 825 2.4 Watts
Derate above 25°C 6.7 19.2 mW/°C
Operating and Storage Junction TJ, Tstg –55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Junction Junction
Characteristic to Case to Ambient Unit
Thermal Resistance Each Die 151 250 °C/W
Effective, 4 Die 52 139 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 34 70 %
Q1–Q2 or Q3–Q4 2.0 26 %
SWITCHING CHARACTERISTICS
Turn–On Time ton — 37 — ns
(IC = 10 mAdc, VBE(off) = –0.5 Vdc, IB1 = 1.0 mAdc)
Turn–Off Time toff — 136 — ns
(IC = 10 mAdc, IB1 = IB2 = 1.0 mAdc)
10 k 10 k
0
– 0.5 V
< 1 ns CS < 4 pF* 1N916 CS < 4 pF*
– 9.1 V′
< 1 ns
Figure 1. Delay and Rise Time Figure 2. Storage and Fall Time
Equivalent Test Circuit Equivalent Test Circuit
TJ = 25°C
TJ = 125°C
10 5000
VCC = 40 V
3000
7.0 IC/IB = 10
2000
CAPACITANCE (pF)
5.0
Q, CHARGE (pC)
1000
700
Cibo
3.0 500
300 QT
2.0 Cobo 200
QA
100
70
1.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
100 100
50 50
30 30
40 V
20 20
15 V
10 10
7 td @ VOB = 0 V 2.0 V 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 5. Turn – On Time Figure 6. Rise Time
500 500
t′s = ts – 1/8 tf VCC = 40 V
300 IB1 = IB2 300
IC/IB = 20 IC/IB = 10 IB1 = IB2
200 200
IC/IB = 20
t s′ , STORAGE TIME (ns)
10 10
7 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
12 14
SOURCE RESISTANCE = 200 W f = 1.0 kHz IC = 1.0 mA
IC = 1.0 mA 12
10
NF, NOISE FIGURE (dB)
300 100
200
h fe , CURRENT GAIN
20
10
100
70 5
50
2
30 1
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
20 10
10
5.0
5.0
3.0
2.0 2.0
1.0
1.0
0.5
0.7
0.2 0.5
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0
h FE, DC CURRENT GAIN (NORMALIZED)
1.0 +25°C
0.7
0.5 – 55°C
0.3
0.2
0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
0.6
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)
1.2 1.0
TJ = 25°C
1.0 VBE(sat) @ IC/IB =10 0.5 +25°C TO +125°C
qVC FOR VCE(sat)
0 – 2.0
1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
PNP
1 2 3 4 5 6 7
MAXIMUM RATINGS 14
Rating Symbol Value Unit 1
Collector – Emitter Voltage VCEO –40 Vdc
Collector – Base Voltage VCBO –40 Vdc CASE 646–06, STYLE 1
TO–116
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –200 mAdc
Four
Each Transistors
Transistor Equal Power
Total Device Dissipation PD
@ TA = 25°C 500 900 mW
Derate above 25°C 4.0 7.2 mW/°C
Total Device Dissipation PD
@ TC = 25°C 825 2.4 Watts
Derate above 25°C 6.7 19.2 mW/°C
Operating and Storage Junction TJ, Tstg –55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Junction Junction
Characteristic to Case to Ambient Unit
Thermal Resistance Each Die 151 250 °C/W
Effective, 4 Die 52 139 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 34 70 %
Q1–Q2 or Q3–Q4 2.0 26 %
SWITCHING CHARACTERISTICS
Turn–On Time ton — 43 — ns
(IC = –10 mAdc, VBE(off) = 0.5 Vdc, IB1 = –1.0 mAdc)
Turn–Off Time toff — 155 — ns
(IC = –10 mAdc, IB1 = IB2 = –1.0 mAdc)
3V 3V
+9.1 V < 1 ns
275 275
< 1 ns
+0.5 V 10 k 10 k
0
CS < 4 pF* 1N916 CS < 4 pF*
10.6 V
300 ns 10 < t1 < 500 ms
DUTY CYCLE = 2% t1 10.9 V
DUTY CYCLE = 2%
Figure 1. Delay and Rise Time Figure 2. Storage and Fall Time
Equivalent Test Circuit Equivalent Test Circuit
TJ = 25°C
TJ = 125°C
10 5000
VCC = 40 V
3000
7.0 IC/IB = 10
2000
CAPACITANCE (pF)
5.0 Cobo
Q, CHARGE (pC)
1000
700
Cibo
3.0 500
300
2.0 200 QT
QA
100
70
1.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS (VOLTS) IC, COLLECTOR CURRENT (mA)
500 500
IC/IB = 10 VCC = 40 V
300 300
IB1 = IB2
200 200
IC/IB = 20
t f , FALL TIME (ns)
100 100
70 70
TIME (ns)
50 tr @ VCC = 3.0 V 50
30 15 V 30
20 20 IC/IB = 10
40 V
10 2.0 V 10
7 td @ VOB = 0 V 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
5.0 12
SOURCE RESISTANCE = 200 W f = 1.0 kHz IC = 1.0 mA
IC = 1.0 mA
10
4.0
SOURCE RESISTANCE = 200 W IC = 0.5 mA
NF, NOISE FIGURE (dB)
0 0
0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100
f, FREQUENCY (kHz) Rg, SOURCE RESISTANCE (k OHMS)
Figure 7. Figure 8.
h PARAMETERS
(VCE = – 10 Vdc, f = 1.0 kHz, TA = 25°C)
300 100
hoe, OUTPUT ADMITTANCE (m mhos)
70
50
h fe , DC CURRENT GAIN
200
30
100 20
70
10
50
7
30 5
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
20 10
h re , VOLTAGE FEEDBACK RATIO (X 10 –4 )
7.0
h ie , INPUT IMPEDANCE (k OHMS)
10
7.0 5.0
5.0
3.0 3.0
2.0 2.0
1.0
0.7
1.0
0.5
0.7
0.3
0.2 0.5
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0
h FE, DC CURRENT GAIN (NORMALIZED)
1.0 +25°C
0.7
– 55°C
0.5
0.3
0.2
0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
1.0
TJ = 25°C
0.8
IC = 1.0 mA 10 mA 30 mA 100 mA
0.6
0.4
0.2
0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)
1.0 1.0
q V , TEMPERATURE COEFFICIENTS (mV/ °C)
0
0.6 – 55°C TO +25°C
– 0.5
0.4 +25°C TO +125°C
– 1.0
VCE(sat) @ IC/IB = 10 – 55°C TO +25°C
0.2 qVB FOR VBE(sat)
– 1.5
0 – 2.0
1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1 2 3 4 5 6 7
MPQ6502
TYPE B
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 30 Vdc 14
1
Collector – Base Voltage VCBO 60 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
CASE 646–06, STYLE 1
Collector Current — Continuous IC 500 mAdc TO–116
Four
Each Transistors
Transistor Equal Power
Total Device Dissipation PD
@ TA = 25°C(1) Watts
MPQ6001, MPQ6002,
MPQ6502 0.65 1.25
Derate above 25°C mW/°C
MPQ6001, MPQ6002,
MPQ6502 5.18 10
THERMAL CHARACTERISTICS
Junction to Junction to
Characteristic Case Ambient Unit
Thermal Resistance °C/W
Each Die MPQ6001, MPQ6002, MPQ6502 125 193
Effective, 4 Die MPQ6001, MPQ6002, MPQ6502 41.6 100
Coupling Factors %
Q1–Q4 or Q2–Q3 MPQ6001, MPQ6002, MPQ6502 30 60
Q1–Q2 or Q3–Q4 MPQ6001, MPQ6002, MPQ6502 20 24
REV 3
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO 30 — — Vdc
(IC = 10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 60 — — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — 30 nAdc
(VCB = 50 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — 30 nAdc
(VEB = 3.0 Vdc, IC = 0)
ON CHARACTERISTICS
DC Current Gain(2) hFE —
(IC = 1.0 mAdc, VCE = 10 Vdc) MPQ6001 25 — —
MPQ6002, MPQ6502 50 — —
SWITCHING CHARACTERISTICS
Turn–On Time ton — 30 — ns
(VCC = 30 Vdc, VEB = 0.5 Vdc, IC = 150 mAdc,
IB1 = 15 mAdc, Figure 1)
Turn–Off Time toff — 225 — ns
(VCC = 30 Vdc, IC = 150 mAdc,
IB1 = IB2 = 15 mAdc)
4.0
VCE = 1.0 V
h FE, DC CURRENT GAIN (NORMALIZED)
3.0 TJ = 150°C VCE = 10 V
2.0
+25°C
1.0
0.7 –55°C
0.5
0.3
0.2
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.4 +1.6
TJ = 25°C
0.6
VBE @ VCE = 1.0 V –0.8
0.4
–1.6 qVB FOR VBE
0.2 VCE(sat) @ IC/IB = 10
0 –2.4
0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
NOISE FIGURE
(VCE = 10 Vdc, TA = 25°C)
6.0 10
100 mA
f = 1.0 kHz
5.0 IC = 1.0 mA
8.0
NF, NOISE FIGURE (dB)
4.0 10 mA
IC = 10 mA 6.0
3.0 RS = 4.3 kW
4.0
2.0 IC = 100 mA
RS = 1.0 kW
2.0
1.0
0 0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (k OHMS)
Quad Darlington
Transistor MPQ6426
NPN Silicon
14 13 12 11 10 9 8
NPN
1 2 3 4 5 6 7
MAXIMUM RATINGS 14
Rating Symbol Value Unit 1
THERMAL CHARACTERISTICS
Characteristic Junction to Junction to Unit
Case Ambient
Thermal Resistance Each Die 151 250 °C/W
Effective, 4 Die 52 139 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 34 70 %
Q1–Q2 or Q3–Q4 2.0 26 %
1. Second Breakdown occurs at power levels greater than 3 times the power dissipation rating.
2. Pulse Test: Pulse Width v
300 ms; Duty Cycle v
2.0%.
500 2.0
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
200 RS ≈ 0 1.0
0.7
0.5
100 IC = 1.0 mA
10 mA 0.3
50 0.2
100 mA
0.1 100 mA
20 IC = 1.0 mA
0.07 10 mA
0.05
10
0.03
5.0 0.02
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
200 14
V T , TOTAL WIDEBAND NOISE VOLTAGE (nV)
IC = 10 mA
10
70 10 mA
8.0
100 mA
50
6.0
30 100 mA
4.0 IC = 1.0 mA
20
1.0 mA 2.0
10 0
1.0 2.0 5.0 10 20 50 100 200 500 1000 1.0 2.0 5.0 10 20 50 100 200 500 1000
RS, SOURCE RESISTANCE (kW) RS, SOURCE RESISTANCE (kW)
DYNAMIC CHARACTERISTICS
20 4.0
VCE = 5.0 V
h fe , SMALL–SIGNAL CURRENT GAIN
f = 100 MHz
TJ = 25°C
2.0 TJ = 25°C
C, CAPACITANCE (pF)
10
7.0 Cib
1.0
Cob 0.8
5.0
0.6
3.0 0.4
2.0 0.2
0.04 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 0.5 1.0 2.0 5.0 10 20 50 100 200 500
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
TYPE B MPQ6600A1
For Specifications,
See MPQ6100A Data
MAXIMUM RATINGS
Voltage and current are
Rating Symbol Value Unit negative for PNP transistors
Collector – Emitter Voltage VCEO 40 Vdc
Collector – Base Voltage VCBO 40 Vdc Motorola Preferred Device
THERMAL CHARACTERISTICS
Characteristic Junction to Junction to Unit
Case Ambient
Thermal Resistance Each Die 151 250 °C/W
Effective, 4 Die 52 139 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 34 70 %
Q1–Q2 or Q3–Q4 2.0 26 %
1. Second Breakdown occurs at power levels greater than 3 times the power dissipation rating.
2. Pulse Test: Pulse Width v
300 ms; Duty Cycle 2.0%. v
Preferred devices are Motorola recommended choices for future use and best overall value.
500 500
TJ = 125°C
300 300
200 TJ = 125°C 200
h FE, DC CURRENT GAIN
30 30
20 20
VCE = –1.0 V
VCE = 1.0 V
10 10 VCE = –5.0 V
VCE = 5.0 V
7.0 7.0
5.0 5.0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 1.0
TJ = 25°C VBE(sat) @ IC/IB = 10 TJ = 25°C
0.8 0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
V, VOLTAGE (VOLTS)
VBE(on) @ VCE = 1.0 V
0.4 0.4
0 0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
+2.0 +2.0
q V , TEMPERATURE COEFFICIENT (mV/°C)
+1.0 +1.0
25°C TO 125°C
25°C TO 125°C
*qVC FOR VCE(sat) *qVC FOR VCE(sat)
0 0
–55°C TO 25°C –55°C TO 25°C
–3.0 –3.0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 –1.0
VCE , COLLECTOR EMITTER VOLTAGE (VOLTS)
0.4 –0.4
0.2 –0.2
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 –0.005 –0.01 –0.02 –0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50
IB, BASE CURRENT (mA) IB, BASE CURRENT (mA)
500 500
300 IC/IB = 10 300 tr @ VCC = –40 V IC/IB = 10
200 TJ = 25°C 200 TJ = 25°C
100 100
t, TIME (ns)
t, TIME (ns)
70 70
50 50
tr @ VCC = 3.0 V
30 30
20 40 V 20
Tr @ VCC = –3.0 V
2.0 V –2.0 V
10 10
VBE(off) = 0
7.0 7.0 td @ VBE(off) = 0
5.0 5.0
2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 500
t′s = ts = 1/8 tf t′s = ts – 1/8 tf
300 VCC = 3.0 V 300
IC/IB = 20 VCC = –40 V
200 IB1 = IB2 200 IB1 = IB2
TJ = 25°C
100 IC/IB = 10 100 IC/IB = 10
t, TIME (ns)
t, TIME (ns)
70 20 70
50 IC/IB = 20 50 IC/IB = 20
30 tf @ IC/IB = 10 30 tf @ IC/IB = 10
20 20
10 10
7.0 7.0
5.0 5.0
2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
150
200
100
70 100
50 70
0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 –0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 13. Current–Gain — Bandwidth Product Figure 14. Current–Gain — Bandwidth Product
7.0 10
TJ = 25°C
5.0 TJ = 25°C 7.0
C, CAPACITANCE (pF)
C, CAPACITANCE (pF)
5.0
3.0 Cib
Cib
3.0
2.0
1.5 2.0
Cob
Cob
1.0
0.7 1.0
0.06 0.1 0.2 0.4 0.6 1.0 2.0 4.0 6.0 10 20 40 60 –0.04 –0.1 –0.2 –0.4 –1.0 –2.0 –4.0 –10 –20 –40
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
TYPE B
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 30 Vdc
Collector – Base Voltage VCBO 30 Vdc
14
Emitter – Base Voltage VEBO 4.0 Vdc
1
Collector Current — Continuous IC 200 mAdc
Four CASE 646–06, STYLE 1
Each Transistors TO–116
Transistor Equal Power TYPE B
Total Device Dissipation PD
@ TA = 25°C(1) 500 900 mW
Derate above 25°C 4.0 7.2 mW/°C
Total Device Dissipation PD
@ TC = 25°C 825 2400 mW
Derate above 25°C 6.7 19.2 mW/°C
Operating and Storage Junction TJ, Tstg –55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Junction to Junction to Unit
Case Ambient
Thermal Resistance Each Die 151 250 °C/W
Effective, 4 Die 52 139 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 34 70 %
Q1–Q2 or Q3–Q4 2.0 26 %
1. Second Breakdown occurs at power levels greater than 3 times the power dissipation rating.
2. Pulse Test: Pulse Width v
300 ms; Duty Cycle v
2.0%.
500 500
TJ = 125°C
300 300
200 TJ = 125°C 200
h FE, DC CURRENT GAIN
30 30
20 20
VCE = –1.0 V
VCE = 1.0 V
10 10 VCE = –5.0 V
VCE = 5.0 V
7.0 7.0
5.0 5.0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 –1.0
TJ = 25°C VBE(sat) @ IC/IB = 10 TJ = 25°C
0.8 –0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
V, VOLTAGE (VOLTS)
0.4 –0.4
0 0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 –0.2 –0.5 –1.0 –2.0 –4.0 –10 –20 –40 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
+2.0 +2.0
q V , TEMPERATURE COEFFICIENT (mV/°C)
+1.0 +1.0
25°C TO 125°C
25°C TO 125°C
*qVC FOR VCE(sat) *qVC FOR VCE(sat)
0 0
–55°C TO 25°C –55°C TO 25°C
–3.0 –3.0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 –1.0
VCE , COLLECTOR EMITTER VOLTAGE (VOLTS)
0.4 –0.4
0.2 –0.2
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 –0.005 –0.01 –0.02 –0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50
IB, BASE CURRENT (mA) IB, BASE CURRENT (mA)
VCC
33 pF +5 V
1k
5 0.1 mF CERAMIC
6
4.7 k 7
COMPLEMENTARY
10 9 8
MPQ7043*
*Motorola Preferred Device
1 2 3 4 5 6 7
TYPE B
MAXIMUM RATINGS
Rating Symbol MPQ7041 MPQ7042 MPQ7043 Unit
Collector – Emitter Voltage VCEO 150 200 250 Vdc
14
Collector – Base Voltage VCBO 150 200 250 Vdc
1
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current—Continuous IC 500 mAdc CASE 646–06, STYLE 1
TO–116
Each Die Four Die
Equal Power
Total Device Dissipation PD
@ TA = 25°C 750 1700 mW
Derate above 25°C 5.98 13.6 mW/°C
Total Device Dissipation PD
@ TC = 25°C 1.25 3.2 Watts
Derate above 25°C 10 25.6 mW/°C
Operating and Storage Junction TJ, Tstg –55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Junction to Junction to Unit
Case Ambient
Thermal Resistance Each Die 100 167 °C/W
Effective, 4 Die 39 73.5 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 46 56 %
Q1–Q2 or Q3–Q4 5.0 10 %
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) MPQ7041 150 — —
MPQ7042 200 — —
MPQ7043 250 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) MPQ7041 150 — —
MPQ7042 200 — —
MPQ7043 250 — —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 100 mAdc, IC = 0) 5.0 — —
Collector Cutoff Current ICBO nAdc
(VCB = 120 Vdc, IE = 0) MPQ7041 — — 100
(VCB = 150 Vdc, IE = 0) MPQ7042 — — 100
(VCB = 180 Vdc, IE = 0) MPQ7043 — — 100
Preferred devices are Motorola recommended choices for future use and best overall value.
DC CHARACTERISTICS
200 1.4
VCE = 10 V TJ = 125°C TJ = 25°C
1.2
h FE, DC CURRENT GAIN
V, VOLTAGE (VOLTS)
0.4
30
0.2 VCE(sat) @ IC/IB = 10
5.0
20 0
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.5
q V , TEMPERATURE COEFFICIENT (mV/°C)
2.0 IC/IB = 10
1.5
1.0
25°C TO 125°C
0.5 qVC FOR VCE(sat)
0
–55°C TO 25°C
–0.5
–1.0
–55°C TO 125°C
–1.5 qVB FOR VBE
–2.0
–2.5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
COMPLEMENTARY
Voltage and current are
1 2 3 4 5 6 7 negative for PNP transistors
TYPE B
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 150 Vdc
Collector – Base Voltage VCBO 150 Vdc 14
Emitter – Base Voltage VEBO 5.0 Vdc 1
THERMAL CHARACTERISTICS
Characteristic Junction to Junction to Unit
Case Ambient
Thermal Resistance Each Die 100 167 °C/W
Effective, 4 Die 39 73.5 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 46 56 %
Q1–Q2 or Q3–Q4 5.0 10 %
Preferred devices are Motorola recommended choices for future use and best overall value.
200 200
VCE = 10 V TJ = 125°C VCE = –10 V TJ = 125°C
h FE, DC CURRENT GAIN
70 70 –55°C
–55°C
50 50
30 30
20 20
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.4 –1.4
TJ = 25°C TJ = 25°C
1.2 –1.2
V, VOLTAGE (VOLTS)
V, VOLTAGE (VOLTS)
1.0 –1.0
0.4 –0.4
5.0
0.2 VCE(sat) @ IC/IB = 10 –0.2 VCE(sat) @ IC/IB = 10
5.0
0 0
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.5 2.5
q V , TEMPERATURE COEFFICIENT (mV/°C)
q V , TEMPERATURE COEFFICIENT (mV/°C)
1.5 1.5
25°C TO 125°C
1.0 1.0
25°C TO 125°C
0.5 0.5 qVC FOR VCE(sat)
qVC FOR VCE(sat)
–55°C TO 25°C
0 0
–55°C TO 25°C
–0.5 –0.5
–1.0 –1.0
–55°C TO 125°C –55°C TO 125°C
–1.5 qVB FOR VBE –1.5 qVB FOR VBE
–2.0 –2.0
–2.5 –2.5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
COMPLEMENTARY
*Motorola Preferred Device
1 2 3 4 5 6 7
TYPE B
MAXIMUM RATINGS
Rating Symbol MPQ7091 MPQ7093 Unit
Collector – Emitter Voltage VCEO –150 –250 Vdc
Collector – Base Voltage VCBO –150 –250 Vdc 14
THERMAL CHARACTERISTICS
Characteristic Junction to Junction to Unit
Case Ambient
Thermal Resistance Each Die 100 167 °C/W
Effective, 4 Die 39 73.5 °C/W
Coupling Factors Q1–Q4 or Q2–Q3 46 56 %
Q1–Q2 or Q3–Q4 5.0 10 %
Preferred devices are Motorola recommended choices for future use and best overall value.
DC CHARACTERISTICS
200 –1.4
VCE = –10 V TJ = 125°C TJ = 25°C
–1.2
h FE, DC CURRENT GAIN
25°C
V, VOLTAGE (VOLTS)
100 –1.0
–0.4
30 5.0
–0.2 VCE(sat) @ IC/IB = 10
20 0
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.5
q V , TEMPERATURE COEFFICIENT (mV/°C)
2.0 IC/IB = 10
1.5
25°C TO 125°C
1.0
0.5 qVC FOR VCE(sat)
–55°C TO 25°C
0
–0.5
–1.0
–55°C TO 125°C
–1.5 qVB FOR VBE
–2.0
–2.5
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100
IC, COLLECTOR CURRENT (mA)
Chopper Transistor
PNP Silicon MPS404A
COLLECTOR Motorola Preferred Device
3
2
BASE
1
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit 2
3
Collector – Emitter Voltage VCEO –35 Vdc
CASE 29–04, STYLE 1
Collector – Base Voltage VCBO –40 Vdc
TO–92 (TO–226AA)
Emitter – Base Voltage VEBO –25 Vdc
Collector Current — Continuous IC –150 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA(1) 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO –35 — Vdc
(IC = –10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –40 — Vdc
(IC = –10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –25 — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICBO — –100 nAdc
(VCB = –10 Vdc, IE = 0)
Emitter Cutoff Current IEBO — –100 nAdc
(VBE = –10 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
–100 –0.9
VBC, BASE–COLLECTOR VOLTAGE (VOLTS)
VEC , EMITTER–COLLECTOR VOLTAGE (mV)
VCE , COLLECTOR–EMITTER VOLTAGE (mV)
IC/IB = 2.0
–20 VEC(sat) @ IE/IB = 2.0 –0.58
0 –0.50
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
IE, EMITTER CURRENT (mA) IE, EMITTER CURRENT (mA)
200 10
TJ = 125°C
7.0 25°C
100 25°C
hFE , DC CURRENT GAIN
30
2.0
20
1.5
10 1.0
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100
IC, COLLECTOR CURRENT (mA) IE, EMITTER CURRENT (mA)
Figure 3. DC Current Gain @ VCE = –0.15 Vdc Figure 4. DC Current Gain @ VEC = –0.15 Vdc
600 10
40
30 1.0
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100
IC, COLLECTOR CURRENT (mA) IE, EMITTER CURRENT (mA)
Figure 5. DC Current Gain @ VCE = –1.0 Vdc Figure 6. DC Current Gain @ VEC = –1.0 Vdc
VCE , COLLECTOR–EMITTER VOLTAGE (VOLTS)
–0.5 –0.5
TJ = 25°C TJ = 25°C
–0.4 –0.4
–0.2 –0.2
–0.1 –0.1
0 0
–0.005 –0.01 –0.02 –0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50
IB, BASE CURRENT (mA) IB, BASE CURRENT (mA)
C, CAPACITANCE (pF)
10
30 Ie = 100 µA RMS
f = 1.0 kHz 7.0 Cob
20 TJ = 25°C
IE = 0 5.0
Cib
10
3.0
7.0
5.0 2.0
–0.1 –0.2 –0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50
IB, BASE CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
2.0 k 1.0 k
VCC = –10 V VCC = –10 V
1.0 k IC/IB = 0 700 IC/IB = 0
TJ = 25°C ts IB1 = IB2
700
TJ = 25°C
500 500
300
t, TIME (ns)
t, TIME (ns)
200 tr 300 tf
100
200
70
50
td @ VBE(off) = –1.4 V
30
20 100
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
RBB RC (560 Ω)
1.0 k 1.0 k VCC
(–6.0 V) C1
TO SCOPE
0.1 µF RB (0–250 pF)
Vin OUTPUT
10 k RB*
INPUT Vin (5.6 kΩ)
51
Figure 13. Switching Time Test Circuit Figure 14. Stored Base Charge Test Circuit
MPS750
MPS751 *
2 2
BASE BASE
NPN PNP
Voltage and current are
1 1 negative for PNP transistors
EMITTER EMITTER
*Motorola Preferred Devices
MAXIMUM RATINGS
MPS650 MPS651
Rating Symbol MPS750 MPS751 Unit
Collector – Emitter Voltage VCE 40 60 Vdc
Collector – Base Voltage VCB 60 80 Vdc
Emitter – Base Voltage VEB 5.0 Vdc 1
2
Collector Current — Continuous IC 2.0 Adc 3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 10 mAdc, IB = 0) MPS650, MPS750 40 —
MPS651, MPS751 60 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 µAdc, IE = 0 ) MPS650, MPS750 60 —
MPS651, MPS751 80 —
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — Vdc
(IC = 0, IE = 10 µAdc)
Collector Cutoff Current ICBO µAdc
(VCB = 60 Vdc, IE = 0) MPS650, MPS750 — 0.1
(VCB = 80 Vdc, IE = 0) MPS651, MPS751 — 0.1
Emitter Cutoff Current IEBO — 0.1 µAdc
(VEB = 4.0 V, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
NPN PNP
300 250
TJ = 125°C
270 VCE = 2.0 V 225 VCE = –2.0 V
240 TJ = 125°C 200
hFE, DC CURRENT GAIN
210 175
25°C
180 150
25°C
150 125
120 100
– 55°C – 55°C
90 75
60 50
30 25
0 0
10 20 50 100 200 500 1.0 A 2.0 A 4.0 A –10 – 20 – 50 –10 – 200 – 500 –1.0 A –2.0 A –4.0 A
IC, COLLECTOR CURRENT (mA) 0
IC, COLLECTOR CURRENT (mA)
NPN PNP
2.0 –2.0
1.8 –1.8
1.6 –1.6
V, VOLTAGE (VOLTS)
V, VOLTAGE (VOLTS)
1.4 –1.4
1.2 –1.2
1.0 VBE(sat) @ IC/IB = 10 –1.0 VBE(sat) @ IC/IB = 10
0.8 –0.8
VBE(on) @ VCE = 2.0 V VBE(on) @ VCE = 2.0 V
0.6 –0.6
0.4 –0.4
0.2 VCE(sat) @ IC/IB = 10 –0.2 VCE(sat) @ IC/IB = 10
0 0
50 100 200 500 1.0 A 2.0 A 4.0 A –50 –10 –20 –50 –1.0 A –2.0 A –4.0 A
IC, COLLECTOR CURRENT (mA) 0 IC, COLLECTOR
0 0
CURRENT (mA)
NPN PNP
10 –10
4.0 –4.0
100 µs 100 µs
IC, COLLECTOR CURRENT
2.0 –2.0
1.0 ms 1.0 ms
1.0 –1.0
MPS65
MPS75
0.5 0 –0.5
MPS65 0
MPS75
0.2 1 –0.2 1
TA = 25°C TC = 25°C TA = 25°C TC = 25°C
0.1 –0.1
0.05 –0.05
WIRE LIMIT WIRE LIMIT
0.02 THERMAL LIMIT –0.02 THERMAL LIMIT
SECOND BREAKDOWN LIMIT SECOND BREAKDOWN LIMIT
0.01 –0.01
1.0 2.0 5.0 10 20 50 100 –1.0 –2.0 –5.0 –10 –20 –50 –100
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
2
BASE
1
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol MPS918 MPS3563 Unit
Collector – Emitter Voltage VCEO 15 12 Vdc CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Base Voltage VCBO 30 30 Vdc
Emitter – Base Voltage VEBO 3.0 2.0 Vdc
Collector Current — Continuous IC 50 mAdc
Total Device Dissipation @ TA = 25°C PD 350 mW
Derate above 25°C 2.8 mW/°C
Total Device Dissipation @ TC = 25°C PD 0.85 Watts
Derate above 25°C 6.8 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA(1) 357 °C/W
Thermal Resistance, Junction to Case RqJC 147 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO Vdc
(IC = 3.0 mAdc, IB = 0) MPS918 15 —
MPS3563 12 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 1.0 mAdc, IE = 0) MPS918 30 —
(IC = 100 mAdc, IE = 0) MPS3563 30 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 mAdc, IC = 0) MPS918 3.0 —
MPS3563 2.0 —
Collector Cutoff Current ICBO nAdc
(VCB = 15 Vdc, IE = 0) MPS918 — 10
MPS3563 — 50
1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width v
300 ms; Duty Cycle v
1.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
FUNCTIONAL TEST
Common–Emitter Amplifier Power Gain Gpe dB
(IC = 6.0 mAdc, VCB = 12 Vdc, f = 200 MHz) MPS918 15 —
(IC = 8.0 mAdc, VCE = 10 Vdc, f = 200 MHz) MPS3563 14 —
(Gfd + Gre t–20 dB)
Power Output Pout 30 — mW
(IC = 8.0 mAdc, VCB = 15 Vdc, f = 500 MHz) MPS918
Oscillator Collector Efficiency η 25 — %
(IC = 8.0 mAdc, VCB = 15 Vdc, Pout = 30 mW, f = 500 MHz) MPS918
2
BASE
1
EMITTER
MAXIMUM RATINGS
1
Rating Symbol MPS2222 MPS2222A Unit 2
3
Collector – Emitter Voltage VCEO 30 40 Vdc
Collector – Base Voltage VCBO 60 75 Vdc CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Emitter – Base Voltage VEBO 5.0 6.0 Vdc
Collector Current — Continuous IC 600 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage MPS2222 V(BR)CEO 30 — Vdc
(IC = 10 mAdc, IB = 0) MPS2222A 40 —
Collector – Base Breakdown Voltage MPS2222 V(BR)CBO 60 — Vdc
(IC = 10 mAdc, IE = 0) MPS2222A 75 —
Emitter – Base Breakdown Voltage MPS2222 V(BR)EBO 5.0 — Vdc
(IE = 10 mAdc, IC = 0) MPS2222A 6.0 —
Collector Cutoff Current ICEX — 10 nAdc
(VCE = 60 Vdc, VEB(off) = 3.0 Vdc) MPS2222A
Collector Cutoff Current ICBO µAdc
(VCB = 50 Vdc, IE = 0) MPS2222 — 0.01
(VCB = 60 Vdc, IE = 0) MPS2222A — 0.01
(VCB = 50 Vdc, IE = 0, TA = 125°C) MPS2222 — 10
(VCB = 50 Vdc, IE = 0, TA = 125°C) MPS2222A — 10
Emitter Cutoff Current IEBO — 100 nAdc
(VEB = 3.0 Vdc, IC = 0) MPS2222A
Base Cutoff Current IBL — 20 nAdc
(VCE = 60 Vdc, VEB(off) = 3.0 Vdc) MPS2222A
Preferred devices are Motorola recommended choices for future use and best overall value.
+ 30 V + 30 V
1.0 to 100 µs, 1.0 to 100 µs, 200
200
+16 V DUTY CYCLE ≈ 2.0%
+16 V DUTY CYCLE ≈ 2.0%
0 0
1 kΩ –14 V 1k CS* < 10 pF
–2 V CS* < 10 pF
< 2 ns < 20 ns
1N914
1000
700
500 TJ = 125°C
hFE , DC CURRENT GAIN
300
200
25°C
100
70
–55°C
50
30 VCE = 1.0 V
20 VCE = 10 V
10
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (mA)
1.0
TJ = 25°C
0.8
0.4
0.2
0
0.005 0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50
IB, BASE CURRENT (mA)
30
t, TIME (ns)
70
20 tf
50
30
10
7.0 20
5.0
10
3.0 7.0
2.0 5.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
10 10
RS = OPTIMUM f = 1.0 kHz
IC = 1.0 mA, RS = 150 Ω RS = SOURCE
8.0 RS = RESISTANCE 8.0
500 µA, RS = 200 Ω IC = 50 µA
NF, NOISE FIGURE (dB)
4.0 4.0
2.0 2.0
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (OHMS)
30 500
VCE = 20 V
20 TJ = 25°C
300
Ceb
CAPACITANCE (pF)
10 200
7.0
5.0
100
Ccb
3.0 70
2.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
VBE(sat) @ IC/IB = 10
1.0 V – 0.5
0.6
VBE(on) @ VCE = 10 V – 1.0
0.4
– 1.5
0.2
– 2.0 RqVB for VBE
VCE(sat) @ IC/IB = 10
0 – 2.5
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Switching Transistors
NPN Silicon MPS2369
MPS2369A*
COLLECTOR *Motorola Preferred Device
3
2
BASE
1
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 15 Vdc CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCES 40 Vdc
Collector – Base Voltage VCBO 40 Vdc
Emitter – Base Voltage VEBO 4.5 Vdc
Collector Current — Continuous IC 200 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 15 — — Vdc
(IC = 10 mAdc, IB = 0) MPS2369A
Collector – Emitter Breakdown Voltage V(BR)CES 40 — — Vdc
(IC = 10 µAdc, VBE = 0) MPS2369,A
Collector – Base Breakdown Voltage V(BR)CBO 40 — — Vdc
(IC = 10 mAdc, IE = 0) MPS2369,A
Emitter – Base Breakdown Voltage V(BR)EBO 4.5 — — Vdc
(IE = 10 mAdc, IC = 0) MPS2369,A
Collector Cutoff Current ICBO µAdc
(VCB = 20 Vdc, IE = 0) — — 0.4
(VCB = 20 Vdc, IE = 0, TA = 125°C) MPS2369,A — — 30
Collector Cutoff Current ICES — — 0.4 µAdc
(VCE = 20 Vdc, VBE = 0) MPS2369,A
Preferred devices are Motorola recommended choices for future use and best overall value.
SWITCHING CHARACTERISTICS
Storage Time ts — 5.0 13 ns
(IB1 = IB2 = IC = 10 mAdc) (Figure 3) MPS2369,A
t1
+10.75 V 3.0 V
270
0
–4.15 V
< 1.0 ns 3.3 k CS* < 4.0 pF
PULSE WIDTH (t1) = 300 ns
DUTY CYCLE = 2.0%
t1 10 V
+6.0 V 980
0
–4.0 V
500 CS* < 3.0 pF
< 1.0 ns
PULSE WIDTH (t1) = 300 ns
DUTY CYCLE = 2.0%
2
BASE
1
EMITTER
MAXIMUM RATINGS
1
Rating Symbol MPS2907 MPS2907A Unit 2
3
Collector – Emitter Voltage VCEO –40 –60 Vdc
CASE 29–04, STYLE 1
Collector – Base Voltage VCBO –60 Vdc
TO–92 (TO–226AA)
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –600 mAdc
Total Device Dissipation PD
@ TA = 25°C 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation PD
@ TC = 25°C 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 500 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) MPS2907 V(BR)CEO –40 — Vdc
(IC = –10 mAdc, IB = 0) MPS2907A –60 —
Collector – Base Breakdown Voltage V(BR)CBO –60 — Vdc
(IC = –10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICEX — –50 nAdc
(VCE = –30 Vdc, VEB(off) = –0.5 Vdc)
Collector Cutoff Current ICBO µAdc
(VCB = –50 Vdc, IE = 0) MPS2907 — –0.02
MPS2907A — –0.01
(VCB = –50 Vdc, IE = 0, TA = 150°C) MPS2907 — –20
MPS2907A — –10
Base Current IB — –50 nAdc
(VCE = –30 Vdc, VEB(off) = –0.5 Vdc)
SWITCHING CHARACTERISTICS
Turn–On Time (VCC = –30 Vdc, IC = –150 mAdc, ton — 45 ns
IB1 = –15
15 mAdc)
Ad ) (Figures
(Fi 1 and
d 5)
Delay Time td — 10 ns
Rise Time tr — 40 ns
Turn–Off Time (VCC = –6.0 Vdc, IC = –150 mAdc, toff — 100 ns
Ad ) (Fi
IB1 = IB2 = 15 mAdc) (Figure 2)
Storage Time ts — 80 ns
Fall Time tf — 30 ns
INPUT INPUT
Zo = 50 Ω –30 V Zo = 50 Ω +15 V –6.0 V
PRF = 150 PPS PRF = 150 PPS
RISE TIME ≤ 2.0 ns 200 RISE TIME ≤ 2.0 ns
1.0 k 37
P.W. < 200 ns P.W. < 200 ns
1.0 k 1.0 k
0 TO OSCILLOSCOPE 0 TO OSCILLOSCOPE
RISE TIME ≤ 5.0 ns RISE TIME ≤ 5.0 ns
–16 V 50 –30 V 50 1N916
200 ns 200 ns
Figure 1. Delay and Rise Time Test Circuit Figure 2. Storage and Fall Time Test Circuit
3.0
VCE = –1.0 V
hFE , NORMALIZED CURRENT GAIN
25°C
1.0
0.7 – 55°C
0.5
0.3
0.2
–0.1 –0.2 –0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500
IC, COLLECTOR CURRENT (mA)
–1.0
–0.8
IC = –1.0 mA –10 mA –100 mA –500 mA
–0.6
–0.4
–0.2
0
–0.005 –0.01 –0.02 –0.03 –0.05 –0.07 –0.1 –0.2 –0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50
IB, BASE CURRENT (mA)
300 500
200 300 VCC = –30 V
VCC = –30 V
IC/IB = 10 200 IC/IB = 10
100 tr
TJ = 25°C tf IB1 = IB2
70 100 TJ = 25°C
50
t, TIME (ns)
t, TIME (ns)
70
30 50
20 t′s = ts – 1/8 tf
30
td @ VBE(off) = 0 V
20
10
7.0 10
5.0 2.0 V
7.0
3.0 5.0
–5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500
IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT (mA)
10 10
f = 1.0 kHz
8.0 8.0
NF, NOISE FIGURE (dB)
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k
f, FREQUENCY (kHz) Rs, SOURCE RESISTANCE (OHMS)
10
100
7.0 80 VCE = –20 V
60 TJ = 25°C
5.0 Ccb
40
3.0 30
2.0 20
–0.1 –0.2 –0.3 –0.5 –1.0 –2.0 –3.0 –5.0 –10 –20 –30 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –1000
REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
–1.0 +0.5
TJ = 25°C
VBE(sat) @ IC/IB = 10 0
–0.8 RqVC for VCE(sat)
COEFFICIENT (mV/ ° C)
V, VOLTAGE (VOLTS)
–0.2
–2.0 RqVB for VBE
VCE(sat) @ IC/IB = 10
0 –2.5
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Switching Transistor
PNP Silicon
COLLECTOR
MPS3638A
3
2
BASE
1
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit 2
3
Collector – Emitter Voltage VCEO –25 Vdc
CASE 29–04, STYLE 1
Collector – Emitter Voltage VCES –25 Vdc TO–92 (TO–226AA)
Collector – Base Voltage VCBO –25 Vdc
Emitter – Base Voltage VEBO –4.0 Vdc
Collector Current — Continuous IC –500 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA(1) 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CES –25 — Vdc
(IC = –100 mAdc, VBE = 0)
Collector – Emitter Sustaining Voltage(2) VCEO(sus) –25 — Vdc
(IC = –10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –25 — Vdc
(IC = –100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –4.0 — Vdc
(IE = –100 mAdc, IC = 0)
Collector Cutoff Current ICES mAdc
(VCE = –15 Vdc, VBE = 0) — –0.035
(VCE = –15 Vdc, VBE = 0, TA = –65°C) — –2.0
Emitter Cutoff Current IEBO — –35 nA
(VEB = –3.0 V, IC = 0)
Base Current IB — –0.035 mAdc
(VCE = –15 Vdc, VBE = 0)
1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width v
300 ms; Duty Cycle v2.0%.
(Replaces MPS3638/D)
SWITCHING CHARACTERISTICS
Delay Time td — 20 ns
(VCC = –10 Vdc
Vdc, IC = –300 mAdc
mAdc, IB1 = –30 mAdc)
Rise Time tr — 70 ns
Storage Time ( CC = –10 Vdc, IC = –300 mAdc,
(V ts — 140 ns
Fall Time IB1 = –30 mAdc, IB2 = –30 mAdc) tf — 70 ns
Turn–On Time (IC = –300 mAdc, IB1 = –30 mAdc) ton — 75 ns
Turn–Off Time (IC = –300 mAdc, IB1 = –30 mAdc, IB2 = 30 mAdc) toff — 170 ns
– 30 V – 30 V
200 Ω 200 Ω
< 2 ns < 20 ns
+2 V +14 V
0 0
1.0 kΩ 1.0 kΩ CS* < 10 pF
CS* < 10 pF
– 16 V –16 V
10 to 100 µs, 1.0 to 100 µs,
DUTY CYCLE = 2% DUTY CYCLE = 2%
+ 4.0 V
Scope rise time < 4.0 ns
*Total shunt capacitance of test jig connectors, and oscilloscope
TRANSIENT CHARACTERISTICS
25°C 100°C
30 10
7.0
VCC = 30 V
20 5.0
Ceb IC/IB = 10
3.0
CAPACITANCE (pF)
Q, CHARGE (nC)
2.0
10
1.0
7.0
0.7
Ccb
5.0 0.5
QT
0.3
QA
0.2
2.0 0.1
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 10 20 30 50 70 100 200 300 500
REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
100 100
70 IC/IB = 10 70 VCC = 30 V
50 IC/IB = 10
50
tr @ VCC = 30 V
td @ VBE(off) = 2 V
20 td @ VBE(off) = 0 20
10 10
7.0 7.0
5.0 5.0
10 20 30 50 70 100 200 300 500 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
200
IC/IB = 10
t s′, STORAGE TIME (ns)
100
IC/IB = 20
70
50
IB1 = IB2
ts′ = ts – 1/8 tf
30
20
10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1k 2k 5k 10 k 20 k 50 k
f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (OHMS)
500
20 k 2N4402 UNIT 1
2N4402 UNIT 2
hfe , CURRENT GAIN
300 10 k
200 5k
2k
100 1k
2N4402 UNIT 1
70 2N4402 UNIT 2 500
50
200
30 100
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
20 500
h re , VOLTAGE FEEDBACK RATIO (X 10 –4 )
10
5.0 100
2N4402 UNIT 1
2N4402 UNIT 2 50
2.0
20
1.0
10
0.5
5.0
2N4402 UNIT 1
0.2 2.0 2N4402 UNIT 2
0.1 1.0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)
3.0
VCE = 1.0 V
2.0 VCE = 10 V TJ = 125°C
h FE, NORMALIZED CURRENT GAIN
25°C
1.0
– 55°C
0.7
0.5
0.3
0.2
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.0
0.8
0.6
IC = 1.0 mA 10 mA 100 mA 500 mA
0.4
0.2
0
0.005 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50
IB, BASE CURRENT (mA)
1.0 0.5
TJ = 25°C
0
0.8 VBE(sat) @ IC/IB = 10 qVC for VCE(sat)
COEFFICIENT (mV/ °C)
VOLTAGE (VOLTS)
0.5
0.6 VBE(sat) @ VCE = 10 V
1.0
0.4
1.5
0.2
2.0 qVS for VBE
VCE(sat) @ IC/IB = 10
0 2.5
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Switching Transistor
PNP Silicon
MPS3640
COLLECTOR
3
2
BASE
1
EMITTER
MAXIMUM RATINGS
1
Rating Symbol Value Unit 2
3
Collector – Emitter Voltage VCEO –12 Vdc
CASE 29–04, STYLE 1
Collector – Base Voltage VCBO –12 Vdc
TO–92 (TO–226AA)
Emitter – Base Voltage VEBO –4.0 Vdc
Collector Current — Continuous IC –80 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CES –12 — Vdc
(IC = –100 µAdc, VBE = 0)
Collector – Emitter Sustaining Voltage(1) VCEO(sus) –12 — Vdc
(IC = –10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –12 — Vdc
(IC = –100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –4.0 — Vdc
(IE = –100 mAdc, IC = 0)
Collector Cutoff Current ICES µAdc
(VCE = –6.0 Vdc, VBE = 0) — –0.01
(VCE = –6.0 Vdc, VBE = 0, TA = 65°C) — –1.0
Base Current IB — –10 nAdc
(VCE = –6.0 Vdc, VEB = 0)
SWITCHING CHARACTERISTICS
Delay Time (VCC = –6.0 Vdc, IC = –50 mAdc, VBE(off) = –1.9 Vdc, td — 10 ns
IB1 = –5.0
5 0 mAdc)
Ad )
Rise Time tr — 30 ns
Storage Time (VCC = –6.0 Vdc, IC = –50 mAdc, IB1 = IB2 = –5.0 mAdc) ts — 20 ns
Fall Time tf — 12 ns
Turn–On Time ton ns
(VCC = –6.0 Vdc, IC = –50 mAdc, IB1 = –5.0 mAdc) — 25
(VCC = –1.5 Vdc, IC = –10 mAdc, IB1 = –0.5 mAdc) — 60
Turn–Off Time toff ns
(VCC = –6.0 Vdc, IC = –50 mAdc, IB1 = IB2 = –5.0 mAdc) — 35
(VCC = –1.5 Vdc, IC = –10 mAdc, IB1 = IB2 = –0.5 mAdc) — 75
110 130
1.0 k 5.0 k
0 Vout 5.0 V Vout
0.1 µF 680 0.1 µF 5.0 k
–6.8 V Vin 0 Vin
PULSE SOURCE TO SAMPLING SCOPE PULSE SOURCE TO SAMPLING SCOPE
51 INPUT Z ≥ 100 k 51 INPUT Z ≥ 100 k
RISE TIME ≤ 1.0 ns RISE TIME ≤ 1.0 ns
PULSE WIDTH ≥ 100 ns RISE TIME ≤ 1.0 ns PULSE WIDTH ≥ 200 ns RISE TIME ≤ 1.0 ns
Zin = 50 OHMS Zin = 50 OHMS
NOTES: Collector Current = 50 mA, NOTES: Collector Current = 10 mA,
FALL TIME ≤ 1.0 ns FALL TIME ≤ 1.0 ns
NOTES: Turn–On and Turn–Off Time NOTES: Turn–On and Turn–Off Time
NOTES: Base Currents = 5.0 mA. NOTES: Base Currents = 0.5 mA.
Figure 1. Figure 2.
V, VOLTAGE (VOLTS)
70
–0.8
50 –55°C
VBE(on) @ VCE = –1.0 V
–0.6
30
–0.4
20
–0.2 VCE(sat) @ IC/IB = 10
10 0
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–1.0 +0.5
*APPLIES FOR IC/IB ≤ hFE/4
–0.4 –1.0
2000 5.0
TJ = 25°C TJ = 25°C
f = 100 MHz VCE = –10 V
3.0
C, CAPACITANCE (pF)
1000
–1.0 V
800 2.0
Cobo
600 Cibo
400 1.0
0.7
200 0.5
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –0.2 –0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
Switching Transistor
NPN Silicon MPS3646
Motorola Preferred Device
COLLECTOR
3
2
BASE
1
1
EMITTER 2
3
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 15 Vdc
Collector – Emitter Voltage VCES 40 Vdc
Collector – Base Voltage VCBO 40 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 300 mAdc
— 10 ms Pulse 500
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CES 40 — Vdc
(IC = 100 mAdc, VBE = 0)
Collector – Emitter Sustaining Voltage(1) VCEO(sus) 15 — Vdc
(IC = 10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 40 — Vdc
(IC = 100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — Vdc
(IE = 100 mAdc, IC = 0)
Collector Cutoff Current ICES mAdc
(VCE = 20 Vdc, VBE = 0) — 0.5
(VCE = 20 Vdc, VBE = 0, TA = 65°C) — 3.0
Preferred devices are Motorola recommended choices for future use and best overall value.
SWITCHING CHARACTERISTICS
Turn–On Time ton — 18 ns
(VCC = 10 Vdc,
Vd IC = 300 mAdc,
Ad IB1 = 30 mAdc)
Ad )
Delay Time td — 10 ns
(Figure 1)
Rise Time tr — 15 ns
Turn–Off Time ((VCC = 10 Vdc, IC = 300 mAdc, IB1 = IB2 = 30 mAdc)) toff — 28 ns
Fall Time (Figure 1) tf — 15 ns
Storage Time ts — 18 ns
(VCC = 10 Vdc, IC = 10 mAdc, IB1 = IB2 = 10 mAdc) (Figure 2)
Test VCC
ton toff
Condition IC VCC RS RC CS(max) VBE(off) V1 V2 V3
t1 t1 RC
mA V Ω Ω pF V V V V V1 V3
RB
A 10 3 330 270 4 –1.5 10.55 –4.15 10.70 0 0
0 960 VEB(off) V2 CS
B 10 10 560 4 — — –4.65 6.55 < 2 ns < 2 ns
C 100 10 560 96 12 –2.0 6.35 –4.65 6.55
PULSE WIDTH (t1) = 300 ns DUTY CYCLE = 2%
100
MPS3646
70 VCE = 1 V
h FE, DC CURRENT GAIN
TJ = 125°C
50
25°C
30 –15°C
– 55°C
20
10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
200
MPS3646
TJ = 125°C
VCE = 1 V
25°C
h FE, DC CURRENT GAIN
100
–15°C
70
50 – 55°C
30
20
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
270 Ω
3V
t1 8 pF C < COPT
+10 V C=0
∆V
0 CS < 4 pF C COPT
<1 ns 9.2 kΩ
PULSE WIDTH (t1) = 5 µs DUTY CYCLE = 2% TIME
NOTE 1
When a transistor is held in a conductive state by a base current, IB, If IB were suddenly removed, the transistor would continue to
a charge, QS, is developed or “stored” in the transistor. QS may be conduct until QS is removed from the active regions through an
written: QS = Q1 + QV + QX. external path or through internal recombination. Since the internal
Q1 is the charge required to develop the required collector current. recombination time is long compared to the ultimate capability of a
This charge is primarily a function of alpha cutoff frequency. QV is the transistor, a charge, QT, of opposite polarity, equal in magnitude, can
charge required to charge the collector–base feedback capacity. QX is be stored on an external capacitor, C, to neutralize the internal charge
excess charge resulting from overdrive, i.e., operation in saturation. and considerably reduce the turn–off time of the transistor. Figure 3
The charge required to turn a transistor “on” to the edge of saturation shows the test circuit and Figure 4 the turn–off waveform. Given QT
is the sum of Q1 and QV which is defined as the active region charge, from Figure 13, the external C for worst–case turn–off in any circuit is:
QA. QA = IB1tr when the transistor is driven by a constant current step C = QT/∆V, where ∆V is defined in Figure 3.
IC
(IB1) and IB1 < < .
hFE
1.0
MPS3646
VCE, MAXIMUM COLLECTOR–EMITTER
TJ = 25°C
0.8
IC = 10 mA 50 mA 100 mA 200 mA
VOLTAGE (VOLTS)
0.6
0.4
0.2
0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50
IB, BASE CURRENT (mA)
1.0
MPS3646
VCE, MAXIMUM COLLECTOR–EMITTER
TJ = 25°C
0.8
IC = 10 mA 50 mA 100 mA 200 mA
VOLTAGE (VOLTS)
0.6
0.4
0.2
0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50
IB, BASE CURRENT (mA)
1.2 1.0
θV, TEMPERATURE COEFFICIENTS (mV/°C)
IC/IB = 10
Vsat , SATURATION VOLTAGE (VOLTS)
0.6 – 0.5
(25°C to 125°C)
0.4 MAX VCE(sat) – 1.0
qVB for VBE
(– 55°C to 25°C)
0.2 – 1.5
0 – 2.0
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 0 40 80 120 160 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
200 200
VCC = 10 V IC/IB = 10
TJ = 25°C TJ = 25°C
100 100
TJ = 125°C
70 70
t d, DELAY TIME (ns)
VCC = 10 V
30 30
2V
20 20 VCC = 3 V
10 0V 10
7.0 7.0
5.0 5.0
1.0 2.0 5.0 10 20 50 100 200 1.0 2.0 5.0 10 20 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
50 200
TJ = 25°C VCC = 10 V
TJ = 125°C TJ = 25°C
IC/IB = 20 100 TJ = 125°C
30
t s , STORAGE TIME (ns)
IC/IB = 10 70
t f , FALL TIME (ns)
20 50
30 IC/IB = 20
20
10
IC/IB = 10
7.0 ts′ ^ ts – 1/8 tf 10
IB1 = IB2 7.0
5.0 5.0
1.0 2.0 5.0 10 20 50 100 200 1.0 2.0 5.0 10 20 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
10 1000
MAX 700 IC/IB = 10
TYP TJ = 25°C
500
7.0 Cibo TJ = 125°C
CAPACITANCE (pF)
300
Q, CHARGE (pC)
5.0 200
QT
100
VCC = 3 V
Cobo 70
3.0 50
VCC = 10 V QA
30 VCC = 3 V
2.0 20
0.1 0.2 0.5 1.0 2.0 5.0 10 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS (Vdc) IC, COLLECTOR CURRENT (mA)
2
BASE
1
EMITTER
MAXIMUM RATINGS 1
2
3
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 40 Vdc CASE 29–04, STYLE 1
Collector – Base Voltage VCBO 60 Vdc TO–92 (TO–226AA)
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 40 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 60 — Vdc
(IC = 10 µAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 10 µAdc, IC = 0)
Collector Cutoff Current ICEX — 50 nAdc
(VCE = 30 Vdc, VEB(off) = 3.0 Vdc)
Base Cutoff Current IBL — 50 nAdc
(VCE = 30 Vdc, VEB(off) = 3.0 Vdc)
REV 1
ON CHARACTERISTICS(1)
DC Current Gain hFE —
(IC = 0.1 mAdc, VCE = 1.0 Vdc) 40 —
(IC = 1.0 mAdc, VCE = 1.0 Vdc) 70 —
(IC = 10 mAdc, VCE = 1.0 Vdc) 100 300
(IC = 50 mAdc, VCE = 1.0 Vdc) 60 —
(IC = 100 mAdc, VCE = 1.0 Vdc) 30 —
Collector – Emitter Saturation Voltage VCE(sat) Vdc
(IC = 10 mAdc, IB = 1.0 mAdc) — 0.2
(IC = 50 mAdc, IB = 5.0 mAdc) — 0.3
Base – Emitter Saturation Voltage VBE(sat) Vdc
(IC = 10 mAdc, IB = 1.0 mAdc) 0.65 0.85
(IC = 50 mAdc, IB = 5.0 mAdc) — 1.1
SWITCHING CHARACTERISTICS
Delay Time ( CC = 3.0 Vdc, VBE(off) = – 0.5 Vdc,
(V td — 35 ns
Rise Time IC = 10 mAdc, IB1 = 1.0 mAdc) tr — 50 ns
Storage Time ( CC = 3.0 Vdc, IC = 10 mAdc,
(V ts — 900 ns
Fall Time IB1 = IB2 = 1.0 mAdc) tf — 90 ns
1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%.
+ 3.0 V + 3.0 V
10 < t1 < 500 µs t1
300 ns 275 +10.9 V 275
+10.9 V DUTY CYCLE = 2%
DUTY CYCLE = 2%
10 k 10 k
– 0.5 V 0
<1.0 ns CS < 4.0 pF* CS < 4.0 pF*
– 9.1 V 1N916
< 1.0 ns
20 100
IC = 1.0 mA BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
50
RS = 0 IC = 1.0 mA RS ≈ ∞
300 µA 20 300 µA
en, NOISE VOLTAGE (nV)
2.0 0.1
10 20 50 100 200 500 1 k 2k 5k 10 k 10 20 50 100 200 500 1 k 2k 5k 10 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
500 k 1M
200 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
100 k 200 k
50 k 100 k
20 k 50 k
10 k 20 k
5k 10 k
2.0 dB 1.0 dB
2k 5k
3.0 dB 4.0 dB
1k 2k 2.0 dB
6.0 dB 3.0 dB
500 10 dB
1k
500 5.0 dB
200
100 200 8.0 dB
50 100
10 20 30 50 70 100 200 300 500 700 1k 10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
500 k
10 Hz to 15.7 kHz
200 k
RS , SOURCE RESISTANCE (OHMS)
100 k
50 k
ǒ Ǔ
Noise Figure is defined as:
20 k
10 k NF + 20 log10 en2 ) 4KTRS ) In 2RS2 1ń2
5k 4KTRS
1.0 dB
en = Noise Voltage of the Transistor referred to the input. (Figure 3)
2k 2.0 dB In = Noise Current of the Transistor referred to the input. (Figure 4)
1k 3.0 dB K = Boltzman’s Constant (1.38 x 10–23 j/°K)
500 T = Temperature of the Source Resistance (°K)
5.0 dB
200 RS = Source Resistance (Ohms)
8.0 dB
100
50
10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA)
Figure 7. Wideband
400
h FE, DC CURRENT GAIN TJ = 125°C
200 25°C
– 55°C
100
80
MPS3904
60 VCE = 1.0 V
VCE = 10 V
40
0.004 0.006 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
MPS3904 TA = 25°C
IB = 500 µA
TJ = 25°C PULSE WIDTH = 300 µs
200 µA
0.4 40
100 µA
0.2 20
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
*APPLIES for IC/IB ≤ hFE/2
θV, TEMPERATURE COEFFICIENTS (mV/°C)
TJ = 25°C
1.2
0.8
25°C to 125°C
V, VOLTAGE (VOLTS)
1.0
*qVC for VCE(sat)
0
0.8 VBE(sat) @ IC/IB = 10 – 55°C to 25°C
0.6 – 0.8
VBE(on) @ VCE = 1.0 V
0.4 25°C to 125°C
– 1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
300 1000
200 VCC = 3.0 V
700
IC/IB = 10 500
TJ = 25°C ts
100 300
70 200
50
t, TIME (ns)
t, TIME (ns)
30 tr 100 tf
20 70
td @ VBE(off) = 0.5 Vdc 50
10 30 VCC = 3.0 V
7.0 IC/IB = 10
20 IB1 = IB2
5.0
TJ = 25°C
3.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
f = 100 MHz 7.0 f = 1.0 MHz
300
VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
200 5.0 V
Cob
3.0
100 2.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = 10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 hfe ≈ 200 @ IC = 1.0 mA 70
5.0 50 MPS3904
3.0 30 hfe ≈ 200 @ IC = 1.0 mA
2.0 20
1.0 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19A
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
102 ICEO Figure 19 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 19 by the
101 steady state value RθJA.
Example:
ICBO The MPS3904 is dissipating 2.0 watts peak under the following
100
AND conditions:
ICEX @ VBE(off) = 3.0 Vdc t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
10–1 Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
10–2 The peak rise in junction temperature is therefore
– 40 – 20 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
TJ, JUNCTION TEMPERATURE (°C)
For more information, see AN–569.
Figure 19A.
400
100 µs The safe operating area curves indicate IC–VCE limits of the
1.0 ms
200 transistor that must be observed for reliable operation. Collector load
IC, COLLECTOR CURRENT (mA)
10 µs
lines for specific circuits must fall below the limits indicated by the
100 TC = 25°C 1.0 s applicable curve.
dc The data of Figure 20 is based upon TJ(pk) = 150°C; TC or TA is
60 TA = 25°C variable depending upon conditions. Pulse curves are valid for duty
40 dc cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
20 TJ = 150°C limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.
10 CURRENT LIMIT
THERMAL LIMIT
6.0
SECOND BREAKDOWN LIMIT
4.0
2.0 4.0 6.0 8.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
Figure 20.
2
BASE
1 1
EMITTER 2
3
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO –40 Vdc
Collector – Base Voltage VCBO –40 Vdc
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –200 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO –40 — Vdc
(IC = –1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –40 — Vdc
(IC = –10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICEX — –50 nAdc
(VCE = –30 Vdc, VEB(off) = –3.0 Vdc)
Base Cutoff Current IBL — –50 nAdc
(VCE = –30 Vdc, VEB(off) = –3.0 Vdc)
REV 1
SWITCHING CHARACTERISTICS
Delay Time ((VCC = –3.0 Vdc, VBE(off) = + 0.5 Vdc, td — 35 ns
Rise Time IC = –10 mAdc, IB1 = 1.0 mAdc) tr — 50 ns
Storage Time (VCC = –3.0 Vdc, IC = –10 mAdc, ts — 600 ns
IB1 = IB2 = –1.0
1 0 mAdc)
Ad )
Fall Time tf — 90 ns
10 1.0
BANDWIDTH = 1.0 Hz 7.0 BANDWIDTH = 1.0 Hz
7.0 RS ≈ 0 5.0 RS ≈ ∞
IC = 10 µA IC = 1.0 mA
en, NOISE VOLTAGE (nV)
1.0 M 1.0 M
500 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
200 k 200 k
100 k 100 k
50 k 50 k
20 k 20 k
0.5 dB
10 k 10 k
0.5 dB
5.0 k 1.0 dB 5.0 k
2.0 k 2.0 k 1.0 dB
1.0 k 2.0 dB 1.0 k
2.0 dB
500 3.0 dB 500
3.0 dB
200 5.0 dB 200 5.0 dB
100 100
10 20 30 50 70 100 200 300 500 700 1.0 k 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
1.0 M
500 k 10 Hz to 15.7 kHz
RS , SOURCE RESISTANCE (OHMS)
200 k
100 k
ƪ ƫ
Noise Figure is Defined as:
Figure 5. Wideband
400
TJ = 125°C
25°C
h FE, DC CURRENT GAIN
200
– 55°C
100
80
60 VCE = 1.0 V
VCE = 10 V
40
0.003 0.005 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
TA = 25°C TA = 25°C IB = 400 µA
PULSE WIDTH = 300 µs
350 µA
150 µA
0.4 40
100 µA
0.2 20 50 µA
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
θV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 0.8
VBE(on) @ VCE = 1.0 V
25°C to 125°C
0.4
1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 1000
VCC = 3.0 V 700 VCC = – 3.0 V
300 IC/IB = 10
IC/IB = 10 500
200 TJ = 25°C IB1 = IB2
ts
300 TJ = 25°C
100 200
t, TIME (ns)
t, TIME (ns)
70
50 100
30 70
tr 50
20 tf
td @ VBE(off) = 0.5 V 30
10 20
7.0
5.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
7.0
300 VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
5.0 V
200
3.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = –10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 MPS3906 70
5.0 hfe ≈ 200 50
@ IC = –1.0 mA MPS3906
3.0 30
hfe ≈ 200
2.0 20 @ IC = 1.0 mA
1.0 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
400
1.0 ms 10 µs
The safe operating area curves indicate IC–VCE limits of the
200 transistor that must be observed for reliable operation. Collector load
IC, COLLECTOR CURRENT (mA)
100 µs
lines for specific circuits must fall below the limits indicated by the
100 TC = 25°C applicable curve.
1.0 s
dc The data of Figure 18 is based upon TJ(pk) = 150°C; TC or TA is
60 TA = 25°C variable depending upon conditions. Pulse curves are valid for duty
40 dc cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
the data in Figure 17. At high case or ambient temperatures, thermal
20 TJ = 150°C limitations will reduce the power than can be handled to values less
than the limitations imposed by second breakdown.
10 CURRENT LIMIT
THERMAL LIMIT
6.0
SECOND BREAKDOWN LIMIT
4.0
2.0 4.0 6.0 8.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
as shown in Figure 19. Using the model and the device thermal
ICEO response the normalized effective transient thermal resistance of
102 Figure 17 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 17 by the
101 steady state value RθJA.
ICBO
AND Example:
ICEX @ VBE(off) = 3.0 V Dissipating 2.0 watts peak under the following conditions:
100
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
Using Figure 17 at a pulse width of 1.0 ms and D = 0.2, the reading of
10–1 r(t) is 0.22.
The peak rise in junction temperature is therefore
10–2 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
–4 –2 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160
0 0 For more information, see AN–569.
TJ, JUNCTION TEMPERATURE (°C)
Amplifier Transistor
NPN Silicon MPS4124
COLLECTOR
3
2
BASE
1
EMITTER 1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCE 25 Vdc
Collector – Base Voltage VCB 30 Vdc
Emitter – Base Voltage VEB 5.0 Vdc
Collector Current — Continuous IC 200 mAdc
Total Power Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Power Dissipation @ TC = 25°C PD 1.5 W
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 1.0 mA, IB = 0) 25 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 10 mA, IE = 0) 30 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IC = 0, IE = 10 mA) 5.0 —
Collector Cutoff Current ICBO nAdc
(VCB = 20 V, IE = 0) — 50
Emitter Cutoff Current IEBO nAdc
(VEB = 3.0 V, IC = 0) — 50
(Replaces MPS4123/D)
Amplifier Transistor
PNP Silicon MPS4126
COLLECTOR
3
2
BASE
1
EMITTER
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = –1.0 mA, IB = 0) –25 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = –10 mA, IE = 0) –25 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IC = 0, IE = –10 mA) –4.0 —
Collector Cutoff Current ICBO nAdc
(VCB = –20 V, IE = 0) — –50
Emitter Cutoff Current IEBO nAdc
(VEB = –3.0 V, IC = 0) — –50
(Replaces MPS4125/D)
Transistor
PNP Silicon MPS4250
COLLECTOR
3
2
BASE
1 1
EMITTER 2
3
MAXIMUM RATINGS
CASE 29–04, STYLE 1
Rating Symbol Value Unit TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO –40 Vdc
Collector – Emitter Voltage VCES –40 Vdc
Collector – Base Voltage VCBO –40 Vdc
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC — mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 mW
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CES –40 — Vdc
(IC = –5.0 mA)
Collector – Emitter Sustaining Voltage(1) V(BR)CEO(sus) –40 — Vdc
(IC = –5.0)
Collector – Base Breakdown Voltage V(BR)CBO –40 — Vdc
(IC = –10 mA)
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — Vdc
(IE = –10 mA)
Collector Cutoff Current ICBO
(VCB = –50 V) — –10 nA
(VCB = –40 V, TA = 65°C) — –3.0 mA
Emitter Cutoff Current IEBO — –20 nA
(VEB = –3.0 V)
2
BASE
1
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 12 Vdc CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Base Voltage VCBO 20 Vdc
Emitter – Base Voltage VEBO 2.5 Vdc
Collector Current — Continuous IC 50 mAdc
Total Device Dissipation @ TA = 25°C PD 200 mW
Derate above 25°C 1.14 mW/°C
Total Device Dissipation @ TC = 25°C PD 300 mW
Derate above 25°C 1.71 mW/°C
Storage Temperature Range Tstg – 55 to +150 °C
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector – Emitter Sustaining Voltage VCEO(sus) 12 — Vdc
(IC = 3.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 20 — Vdc
(IC = 0.001 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 2.5 — Vdc
(IE = 0.01 mAdc, IC = 0)
Collector Cutoff Current ICBO µAdc
(VCB = 15 Vdc, IE = 0) — 0.02
(VCB = 15 Vdc, IE = 0, TA = 150°C) — 1.0
ON CHARACTERISTICS
DC Current Gain hFE 25 250 —
(IC = 3.0 mAdc, VCE = 1.0 Vdc)
Collector – Emitter Saturation Voltage VCE(sat) — 0.4 Vdc
(IC = 10 mAdc, IB = 1.0 mAdc)
Base – Emitter Saturation Voltage VBE(sat) — 1.0 Vdc
(IC = 10 mAdc, IB = 1.0 mAdc)
Preferred devices are Motorola recommended choices for future use and best overall value.
TYPE
1N3195
TYPE
1N3195
DC L3 TO 50 Ω
2.0 – 10
COMMON LOAD
1200 1.0 – 5.0 C7
91 EXTERNAL
FROM 50 Ω
Q SHIELD 2.0 – 10
SOURCE 0.02 µF L1 L2
C6
Cin C2 0.1 µF
3.0 – 35 2.0 – 10 RFC
10 k 0.001 µF 1.0 µH
–VEE +VCC
1200 0.1 µF 1200
Amplifier Transistor
NPN Silicon MPS6428
COLLECTOR
3
2
BASE
1
1 2
3
EMITTER
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO 50 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 60 — Vdc
(IC = 0.1 mAdc, IE = 0)
Collector Cutoff Current ICES — 0.025 mA
(VCE = 30 Vdc)
Collector Cutoff Current ICBO — 0.01 mA
(VCB = 30 Vdc, IE = 0)
Emitter Cutoff Current IEBO — 0.01 mA
(VEB = 5.0 Vdc, IC = 0)
Amplifier Transistor
NPN Silicon COLLECTOR
3
MPS6507
2
BASE
1
EMITTER
MAXIMUM RATINGS
Rating Symbol Value Unit 1
2
3
Collector – Emitter Voltage VCEO 20 Vdc
Collector – Base Voltage VCBO 30 Vdc CASE 29–04, STYLE 1
Emitter – Base Voltage VEBO 3.0 Vdc TO–92 (TO–226AA)
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA(1) 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage (2) V(BR)CEO 20 — — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 30 — — Vdc
(IC = 100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 3.0 — — Vdc
(IE = 100 mAdc, IC = 0)
Collector Cutoff Current ICBO
(VCB = 15 Vdc, IE = 0) — — 50 nAdc
(VCB = 15 Vdc, IE = 0, TA = 60°C) — — 1.0 mAdc
ON CHARACTERISTICS
DC Current Gain(2) hFE 25 75 — —
(IC = 2.0 mAdc, VCE = 10 Vdc)
SMALL–SIGNAL CHARACTERISTICS
Current–Gain — Bandwidth Product fT 700 800 — MHz
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance Cobo — 1.25 2.5 pF
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Small–Signal Current Gain hfe 20 — — —
(IC = 2.0 mAdc, VCE = 10 Vdc, f = 20 MHz)
1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width v
300 ms; Duty Cycle v2.0%.
NPN
MPS6521*
2
BASE
1 EMITTER
PNP
MPS6523
COLLECTOR 3
Voltage and current are negative
2 for PNP transistors
BASE
*Motorola Preferred Device
1 EMITTER
MAXIMUM RATINGS
Rating Symbol NPN PNP Unit
Collector – Emitter Voltage VCEO Vdc
MPS6521 25 —
MPS6523 — 25
Collector – Base Voltage VCBO Vdc 1
MPS6521 40 — 2
3
MPS6523 — 25
Emitter – Base Voltage VEBO 4.0 Vdc CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector Current — Continuous IC 100 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
(Printed Circuit Board Mounting)
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO 25 — Vdc
(IC = 0.5 mAdc, IB = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 4.0 — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO mAdc
(VCB = 30 Vdc, IE = 0) MPS6521 — 0.05
(VCB = 20 Vdc, IE = 0) MPS6523 — 0.05
Preferred devices are Motorola recommended choices for future use and best overall value.
(Replaces MPS6520/D)
+ 3.0 V + 3.0 V
10 < t1 < 500 µs t1
300 ns 275 +10.9 V 275
+10.9 V DUTY CYCLE = 2%
DUTY CYCLE = 2%
10 k 10 k
– 0.5 V 0
<1.0 ns CS < 4.0 pF* CS < 4.0 pF*
– 9.1 V 1N916
< 1.0 ns
20 100
IC = 1.0 mA BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
50
RS = 0 IC = 1.0 mA RS ≈ ∞
300 µA 20 300 µA
en, NOISE VOLTAGE (nV)
10
10 100 µA
5.0
7.0 100 µA
2.0
5.0
1.0
10 µA
30 µA 0.5 30 µA
3.0
0.2 10 µA
2.0 0.1
10 20 50 100 200 500 1 k 2k 5k 10 k 10 20 50 100 200 500 1 k 2k 5k 10 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
500 k 1M
200 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
500 k
10 Hz to 15.7 kHz
200 k
RS , SOURCE RESISTANCE (OHMS)
100 k
50 k
ǒ Ǔ
Noise Figure is defined as:
20 k
10 k NF + 20 log10 en2 ) 4KTRS ) In 2RS2 1ń2
5k 4KTRS
1.0 dB
en = Noise Voltage of the Transistor referred to the input. (Figure 3)
2k 2.0 dB In = Noise Current of the Transistor referred to the input. (Figure 4)
1k 3.0 dB K = Boltzman’s Constant (1.38 x 10–23 j/°K)
500 T = Temperature of the Source Resistance (°K)
5.0 dB
200 RS = Source Resistance (Ohms)
8.0 dB
100
50
10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA)
Figure 7. Wideband
400
TJ = 125°C
h FE, DC CURRENT GAIN
200 25°C
– 55°C
100
80
60 VCE = 1.0 V
VCE = 10 V
40
0.004 0.006 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
TJ = 25°C TA = 25°C
IB = 500 µA
PULSE WIDTH = 300 µs
IC, COLLECTOR CURRENT (mA)
200 µA
0.4 40
100 µA
0.2 20
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
*APPLIES for IC/IB ≤ hFE/2
θV, TEMPERATURE COEFFICIENTS (mV/°C)
TJ = 25°C
1.2
0.8
25°C to 125°C
V, VOLTAGE (VOLTS)
1.0
*qVC for VCE(sat)
0
0.8 VBE(sat) @ IC/IB = 10 – 55°C to 25°C
0.6 – 0.8
VBE(on) @ VCE = 1.0 V
0.4 25°C to 125°C
– 1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
300 1000
200 VCC = 3.0 V
700
IC/IB = 10 500
TJ = 25°C ts
100 300
70 200
50
t, TIME (ns)
t, TIME (ns)
30 tr 100 tf
20 70
td @ VBE(off) = 0.5 Vdc 50
10 30 VCC = 3.0 V
7.0 IC/IB = 10
20 IB1 = IB2
5.0
TJ = 25°C
3.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
f = 100 MHz 7.0 f = 1.0 MHz
300
VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
200 5.0 V
Cob
3.0
100 2.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = 10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 70
5.0 50 hfe ≈ 200 @ IC = 1.0 mA
3.0 30
2.0 20
1.0 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0
0.7
r(t) TRANSIENT THERMAL RESISTANCE
D = 0.5
0.5
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19A
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
102 ICEO Figure 19 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 19 by the
101 steady state value RθJA.
Example:
ICBO The MPS6521 is dissipating 2.0 watts peak under the following
100
AND conditions:
ICEX @ VBE(off) = 3.0 Vdc t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
10–1 Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
10–2 The peak rise in junction temperature is therefore
–4 –2 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
0 0 TJ, JUNCTION TEMPERATURE (°C)
For more information, see AN–569.
Figure 19A.
400
100 µs The safe operating area curves indicate IC–VCE limits of the
1.0 ms
200 transistor that must be observed for reliable operation. Collector load
IC, COLLECTOR CURRENT (mA)
10 µs
lines for specific circuits must fall below the limits indicated by the
100 TC = 25°C 1.0 s applicable curve.
dc The data of Figure 20 is based upon TJ(pk) = 150°C; TC or TA is
60 TA = 25°C variable depending upon conditions. Pulse curves are valid for duty
40 dc cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
20 TJ = 150°C limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.
10 CURRENT LIMIT
THERMAL LIMIT
6.0
SECOND BREAKDOWN LIMIT
4.0
2.0 4.0 6.0 8.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
Figure 20.
10 1.0
BANDWIDTH = 1.0 Hz 7.0 BANDWIDTH = 1.0 Hz
7.0 RS ≈ 0 5.0 RS ≈ ∞
IC = 10 µA IC = 1.0 mA
en, NOISE VOLTAGE (nV)
1.0 M 1.0 M
500 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
200 k 200 k
100 k 100 k
50 k 50 k
20 k 20 k
0.5 dB
10 k 10 k
0.5 dB
5.0 k 1.0 dB 5.0 k
2.0 k 2.0 k 1.0 dB
1.0 k 2.0 dB 1.0 k
2.0 dB
500 3.0 dB 500
3.0 dB
200 5.0 dB 200 5.0 dB
100 100
10 20 30 50 70 100 200 300 500 700 1.0 k 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
Figure 23. Narrow Band, 100 Hz Figure 24. Narrow Band, 1.0 kHz
1.0 M
500 k 10 Hz to 15.7 kHz
RS , SOURCE RESISTANCE (OHMS)
200 k
ƪ ƫ
Noise Figure is Defined as:
400
TJ = 125°C
25°C
h FE, DC CURRENT GAIN
200
– 55°C
100
80
60 VCE = 1.0 V
VCE = 10 V
40
0.003 0.005 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
TA = 25°C TA = 25°C IB = 400 µA
PULSE WIDTH = 300 µs
350 µA
IC, COLLECTOR CURRENT (mA)
150 µA
0.4 40
100 µA
0.2 20 50 µA
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
θV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 0.8
VBE(on) @ VCE = 1.0 V
25°C to 125°C
0.4
1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 1000
VCC = 3.0 V 700 VCC = – 3.0 V
300 IC/IB = 10
IC/IB = 10 500
200 TJ = 25°C IB1 = IB2
ts
300 TJ = 25°C
100 200
t, TIME (ns)
t, TIME (ns)
70
50 100
30 70
tr 50
20 tf
td @ VBE(off) = 0.5 V 30
10 20
7.0
5.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
7.0
300 VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
5.0 V
200
3.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = –10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 MPS6521 70
5.0 hfe ≈ 200 50
@ IC = –1.0 mA MPS6521
3.0 30
hfe ≈ 200 MPS6523
2.0 MPS6523 20 @ IC = 1.0 mA hfe ≈ 100
hfe ≈ 100 @ IC = 1.0 mA
1.0 @ IC = –1.0 mA 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0
0.7
r(t) TRANSIENT THERMAL RESISTANCE
D = 0.5
0.5
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
400
1.0 ms 10 µs
The safe operating area curves indicate IC–VCE limits of the
200 transistor that must be observed for reliable operation. Collector load
IC, COLLECTOR CURRENT (mA)
100 µs
lines for specific circuits must fall below the limits indicated by the
100 TC = 25°C applicable curve.
1.0 s
dc The data of Figure 18 is based upon TJ(pk) = 150°C; TC or TA is
60 TA = 25°C variable depending upon conditions. Pulse curves are valid for duty
40 dc cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
the data in Figure 17. At high case or ambient temperatures, thermal
20 TJ = 150°C limitations will reduce the power than can be handled to values less
than the limitations imposed by second breakdown.
10 CURRENT LIMIT
THERMAL LIMIT
6.0
SECOND BREAKDOWN LIMIT
4.0
2.0 4.0 6.0 8.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
as shown in Figure 19. Using the model and the device thermal
ICEO response the normalized effective transient thermal resistance of
102 Figure 17 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 17 by the
101 steady state value RθJA.
ICBO
AND Example:
ICEX @ VBE(off) = 3.0 V The MPS6523 is dissipating 2.0 watts peak under the following
100
conditions:
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
10–1 Using Figure 17 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
10–2 The peak rise in junction temperature is therefore
–4 –2 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
0 0 TJ, JUNCTION TEMPERATURE (°C)
For more information, see AN–569.
Figure 39. Typical Collector Leakage Current
Audio Transistor
NPN Silicon MPS6560
COLLECTOR
3
2
BASE
1
1 2
3
EMITTER
CASE 29–04, STYLE 1
MAXIMUM RATINGS
TO–92 (TO–226AA)
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 25 Vdc
Collector – Base Voltage VCBO 25 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 500 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA(1) 200 °C/mW
Thermal Resistance, Junction to Case RqJC 83.3 °C/mW
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO 25 — Vdc
(IC = 10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 25 — Vdc
(IC = 100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — Vdc
(IE = 100 mAdc, IC = 0)
Collector Cutoff Current ICES — 100 nAdc
(VCE = 25 Vdc, IB = 0)
Collector Cutoff Current ICBO — 100 nAdc
(VCB = 20 Vdc, IE = 0)
Emitter Cutoff Current IEBO — 100 nAdc
(VEB(off) = 4.0 Vdc, IC = 0)
1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width v
300 ms; Duty Cycle v2.0%.
REV 1
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA(1) 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) MPS6601/6651 25 —
MPS6602/6652 40 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 µAdc, IE = 0) MPS6601/6651 25 —
MPS6602/6652 40 —
Emitter – Base Breakdown Voltage V(BR)EBO 4.0 — Vdc
(IE = 10 µAdc, IC = 0)
Collector Cutoff Current ICES µAdc
(VCE = 25 Vdc, IB = 0) MPS6601/6651 — 0.1
(VCE = 30 Vdc, IB = 0) MPS6602/6652 — 0.1
Collector Cutoff Current ICBO µAdc
(VCB = 25 Vdc, IE = 0) MPS6601/6651 — 0.1
(VCB = 30 Vdc, IE = 0) MPS6602/6652 — 0.1
1. RqJA is measured with the device soldered into a typical printed circuit board.
Preferred devices are Motorola recommended choices for future use and best overall value.
SWITCHING CHARACTERISTICS
Delay Time td — 25 ns
Rise Time (VCC = 40 Vdc, IC = 500 mAdc, tr — 30 ns
IB1 = 50 mAdc
mAdc,
Storage Time tp w300 ns Duty Cycle) ts — 250 ns
Fall Time tf — 50 ns
t 6.0 pF t 6.0 pF
0
tr = 3.0 ns * CS * CS
5.0 mF 5.0 mF
100 100
5.0 ms
tr = 3.0 ns
300 200
200
100
h FE , CURRENT GAIN
h FE , CURRENT GAIN
70
100
50
70
VCE = –1.0 V
TJ = 25°C
50 VCE = 1.0 V
TJ = 25°C
30 20
10 100 1000 –10 –100 –1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
200 200
100 100
70 70
VCE = 10 V VCE = –10 V
50 TJ = 25°C 50 TJ = 25°C
f = 30 MHz f = 30 MHz
30 30
10 100 200 1000 –10 –100 –200 –1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 4. Current Gain Bandwidth Product Figure 5. Current Gain Bandwidth Product
1.0 –1.0
TJ = 25°C VBE(SAT) @ IC/IB = 10 TJ = 25°C
VBE(SAT) @ IC/IB = 10
0.8 –0.8
V, VOLTAGE (VOLTS)
V, VOLTAGE (VOLTS)
0.4 –0.4
0 0
1.0 10 100 1000 –1.0 –10 –100 –1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
80 160
TJ = 25°C TJ = 25°C
60 120
C, CAPACITANCE (pF)
C, CAPACITANCE (pF)
40 Cib 80
Cib
20 40
Cob Cob
0 0
Cob 5.0 10 15 20 25 Cob –5.0 –10 –15 –20 –25
Cib 1.0 2.0 3.0 4.0 5.0 Cib –1.0 –2.0 –3.0 –4.0 –5.0
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
10 10
VCE = 5.0 V VCE = –5.0 V
f = 1.0 kHz f = 1.0 kHz
8.0 TA = 25°C 8.0 TA = 25°C
NF, NOISE FIGURE (dB)
IC = 100 mA
4.0 4.0
2.0 2.0
0 0
10 100 1k 10 k 10 100 1k 10 k
Rs, SOURCE RESISTANCE (OHMS) Rs, SOURCE RESISTANCE (OHMS)
Figure 10. MPS6601/6602 Noise Figure Figure 11. MPS6651/6652 Noise Figure
10 k 10 k
td @ VBE(off) = 0.5 V 5k td @ VBE(off) = –0.5 V
5k
VCC = 40 V VCC = –40 V
3k 3k
IC/IB = 10 IC/IB = 10
IB1 = IB2 IB1 = IB2
1k 1k TJ = 25°C
TJ = 25°C
t, TIME (NS)
t, TIME (NS)
500 500
ts ts
200 200
100 100
50 50 tf
tf
20 tr tr
20
td td
10 10
10 20 50 100 200 500 1000 –10 –20 –50 –100 –200 –500 –1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 12. MPS6601/6602 Switching Times Figure 13. MPS6651/6652 Switching Times
–0.8 –0.8
R qVB , TEMPERATURE COEFFICIENT (mV/ °C)
–2.0 –2.0
–2.4 –2.4
–2.8 –2.8
1.0 10 100 1000 –1.0 –10 –100 –1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1k –1 k
100 –100
50 –50 MPS6651
MPS6601
MPS6652
MPS6602
CURRENT LIMIT CURRENT LIMIT
20 THERMAL LIMIT –20 THERMAL LIMIT
SECOND BREAKDOWN LIMIT SECOND BREAKDOWN LIMIT
10 –10
1.0 2.0 5.0 10 20 40 –1.0 –2.0 –5.0 –10 –20 –40
VCE, COLLECTOR–EMITTER VOLTAGE VCE, COLLECTOR–EMITTER VOLTAGE
Figure 16. Safe Operating Area Figure 17. Safe Operating Area
1.0 –1.0
TJ = 25°C TJ = 25°C
VCE , COLLECTOR VOLTAGE (VOLTS)
0.8 –0.8
0.6 –0.6
IC = IC =
1000 mA –1000 mA
0.4 –0.4
IC = IC =
IC = 500 mA –500 mA
IC = IC = IC =
0.2 100 mA –0.2
50 mA IC = –50 mA –100 mA
IC = IC = IC =
10 mA –10 mA
250 mA –250 mA
0 0
0.01 0.1 1.0 10 100 –0.01 –0.1 –1.0 –10 –100
IB, BASE CURRENT (mA) IB, BASE CURRENT (mA)
Figure 18. MPS6601/6602 Saturation Region Figure 19. MPS6651/6652 Saturation Region
t, TIME (SECONDS)
2
BASE
1
EMITTER
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO Vdc 1
MPS6714 30 2
3
MPS6715 40
Collector – Base Voltage VCBO Vdc CASE 29–05, STYLE 1
MPS6714 40 TO–92 (TO–226AE)
MPS6715 50
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 1.0 Adc
Total Device Dissipation @ TA = 25°C PD 1.0 Watts
Derate above 25°C 8.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 2.5 Watts
Derate above 25°C 20 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 10 mAdc, IB = 0) MPS6714 30 —
MPS6715 40 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) MPS6714 40 —
MPS6715 50 —
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — Vdc
(IE = 100 mAdc, IC = 0)
Collector Cutoff Current ICBO µAdc
(VCB = 40 Vdc, IE = 0) MPS6714 — 0.1
(VCB = 50 Vdc, IE = 0) MPS6715 — 0.1
Emitter Cutoff Current IEBO — 0.1 µAdc
(VEB = 5.0 Vdc, IC = 0)
0.6
100
IC =
0.4 1000 mA
70 IC =
VCE = 1.0 V IC = 500 mA
IC = IC = IC =
50 TJ = 25°C 0.2 250 mA
10 mA 50 mA 100 mA
30 0
10 20 50 100 200 500 1000 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
1.0 –0.8
qVB , TEMPERATURE COEFFICIENT (mV/°C)
TJ = 25°C
VBE(sat) @ IC/IB = 10
0.8 –1.2
V, VOLTAGE (VOLTS)
0.4 –2.0
0 –2.8
1.0 2.0 5.0 10 20 50 100 200 500 1000 1.0 2.0 5.0 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
TJ = 25°C
200
60
C, CAPACITANCE (pF)
100 40 Cibo
70
VCE = 10 V
20
50 TJ = 25°C
f = 20 MHz
Cobo
30 0
10 20 50 100 200 1000 Cobo 5.0 10 15 20 25
IC, COLLECTOR CURRENT (mA) Cibo 1.0 2.0 3.0 4.0 5.0
VR, REVERSE VOLTAGE (VOLTS)
Figure 5. Current Gain — Bandwidth Product
Figure 6. Capacitance
1k
1.0 s 1.0 ms 100 ms
IC , COLLECTOR CURRENT (mA)
500
200
TA = 25°C TC = 25°C
100 DUTY CYCLE ≤ 10%
50 CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
20 MPS6714
MPS6715
10
1.0 2.0 5.0 10 20 30 40
VCE, COLLECTOR–EMITTER VOLTAGE (V)
2
BASE
1
EMITTER
1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 80 Vdc
Collector – Base Voltage VCBO 80 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 500 mAdc
Total Device Dissipation @ TA = 25°C PD 1.0 Watts
Derate above 25°C 8.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 2.5 Watts
Derate above 25°C 20 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 80 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 80 — Vdc
(IC = 100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — 0.1 µAdc
(VCB = 60 Vdc, IE = 0)
Emitter Cutoff Current IEBO — 10 µAdc
(VEB = 5.0 Vdc, IC = 0)
400
200
25°C
–55°C
100
80
60
40
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.0 1.0
TJ = 25°C TJ = 25°C
0.8 0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
50
IC = 10 mA 100 mA 250 mA 500 mA
0.6 mA 0.6 VBE(on) @ VCE = 1.0 V
0.4 0.4
0.2 0.2
VCE(sat) @ IC/IB = 10
0 0
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–1.2
40 Cibo
C, CAPACITANCE (pF)
–1.6
20
θVB for VBE
–2.0
10
8.0
–2.4
6.0
Cobo
–2.8 4.0
0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
300
VCE = 2.0 V
200 TJ = 25°C DUTY CYCLE ≤ 10%
Figure 6. Current–Gain — Bandwidth Product Figure 7. Active Region — Safe Operating Area
BASE
2
EMITTER 1
MAXIMUM RATINGS
Rating Symbol MPS6724 MPS6725 Unit
Collector – Emitter Voltage VCES 40 50 Vdc 1
2
3
Collector – Base Voltage VCBO 50 60 Vdc
Emitter – Base Voltage VEBO 12 Vdc CASE 29–05, STYLE 1
Collector Current — Continuous IC 1000 mAdc TO–92 (TO–226AE)
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage (1) V(BR)CES Vdc
(IC = 1.0 mAdc, IB = 0) MPS6724 40 —
MPS6725 50 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 1.0 mAdc, IE = 0) MPS6724 50 —
MPS6725 60 —
Emitter – Base Breakdown Voltage V(BR)EBO 12 — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO nAdc
(VCB = 30 Vdc, IE = 0) MPS6724 — 100
(VCB = 40 Vdc, IE = 0) MPS6725 — 100
Emitter Cutoff Current IEBO — 100 nAdc
(VEB = 10 Vdc, IC = 0)
REV 1
TA = 25°C TC = 25°C
200
1.5 2.0 5.0 10 20 30
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
200 k 3.0
VCE , COLLECTOR EMITTER VOLTAGE (VOLTS)
TJ = 125°C
TJ = 25°C
100 k IC = IC = IC = IC =
2.5
70 k 50 mA 250 mA 500 mA
h FE , DC CURRENT GAIN
10 mA
50 k 25°C
30 k 2.0
20 k
1.5
10 k
7.0 k
5.0 k –55°C 1.0
VCE = 5.0 V
3.0 k
2.0 k 0.5
5.0 7.0 10 20 30 50 70 100 200 300 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
–55°C TO 25°C
1.2 –3.0
0.6 –6.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4.0 20
VCE = 5.0 V
h FE , SMALL–SIGNAL CURRENT GAIN
TJ = 25°C
TJ = 25°C
2.0 f = 100 MHz C, CAPACITANCE (pF)
10
1.0 7.0
Cibo
0.8
5.0
0.6
Cobo
0.4 3.0
0.2 2.0
0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.04 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
2
BASE
1
EMITTER
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO Vdc 1
MPS6726 –30 2
3
MPS6727 –40
Collector – Base Voltage VCBO Vdc CASE 29–05, STYLE 1
MPS6726 –40 TO–92 (TO–226AE)
MPS6727 –50
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –1.0 Adc
Total Device Dissipation @ TA = 25°C PD 1.0 Watts
Derate above 25°C 8.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 2.5 Watts
Derate above 25°C 20 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = –10 mAdc, IB = 0) MPS6726 –30 —
MPS6727 –40 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = –100 mAdc, IE = 0) MPS6726 –40 —
MPS6727 –50 —
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — Vdc
(IE = –100 mAdc, IC = 0)
Collector Cutoff Current ICBO µAdc
(VCB = –40 Vdc, IE = 0) MPS6726 — –0.1
(VCB = –50 Vdc, IE = 0) MPS6727 — –0.1
Emitter Cutoff Current IEBO — –0.1 µAdc
(VEB = –5.0 Vdc, IC = 0)
200 –1.0
100
–0.6
70
VCE = –1.0 V
50 TJ = 25°C –0.4
–0.2
TJ = 25°C
20 0
–10 –20 –50 –100 –200 –500 –1000 –0.01 –0.02 –0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
–1.0 –0.8
qV B, TEMPERATURE COEFFICIENT (mV/ °C)
TJ = 25°C
–0.6 –1.6
VBE(ON) @ VCE = –1.0 V
qVB for VBE
–0.4 –2.0
–0.2 –2.4
VCE(SAT) @ IC/IB = 10
0 –2.8
–1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –1000 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
TJ = 25°C
200
120
C, CAPACITANCE (pF)
VCE = –10 V
100 TJ = 25°C 80
f = 20 MHz
70 Cibo
40
50
Cobo
30 0
–10 –20 –50 –100 –200 –500 –1000 Cobo –5.0 –10 –15 –20 –25
Cibo –1.0 –2.0 –3.0 –4.0 –5.0
IC, COLLECTOR CURRENT (mA)
VR, REVERSE VOLTAGE (VOLTS)
Figure 5. Current Gain — Bandwidth Product Figure 6. Capacitance
–1.0 k
1.0 s 1.0 ms 100 ms
–500
I C , COLLECTOR CURRENT (mA)
TA = 25°C
TC = 25°C
–200
–100
DUTY CYCLE ≤ 10%
–50 MPS6726
MPS6727
CURRENT LIMIT
–20 THERMAL LIMIT
SECOND BREAKDOWN LIMIT
–10
–1.0 –2.0 –5.0 –10 –20 –30 –40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 10 mAdc, IB = 0) MPS8098, MPS8598 60 —
MPS8099, MPS8599 80 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 µAdc, IE = 0) MPS8098, MPS8598 60 —
MPS8099, MPS8599 80 —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 10 µAdc, IC = 0) MPS8098, MPS8099 6.0 —
MPS8598, MPS8599 5.0 —
Collector Cutoff Current ICES — 0.1 µAdc
(VCE = 60 Vdc, IB = 0)
Collector Cutoff Current ICBO µAdc
(VCB = 60 Vdc, IE = 0) MPS8098, MPS8598 — 0.1
(VCB = 80 Vdc, IE = 0) MPS8099, MPS8599 — 0.1
Emitter Cutoff Current IEBO µAdc
(VEB = 6.0 Vdc, IC = 0) MPS8098, MPS8099 — 0.1
(VEB = 4.0 Vdc, IC = 0) MPS8598, MPS8599 — 0.1
t 6.0 pF t 6.0 pF
0
tr = 3.0 ns * CS * CS
5.0 mF 5.0 mF
100 100
5.0 ms
tr = 3.0 ns
70 70
50 50
30 30
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
40 40
TJ = 25°C TTJJ==25°C
25°C
20 20
C, CAPACITANCE (pF)
C, CAPACITANCE (pF)
Cibo
Cibo
10 10
8.0 8.0
6.0 6.0
Cobo
4.0 4.0
Cobo
2.0 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
1.0 k 1.0 k
VCC = 40 V VCC = –40 V
700 700
IC/IB = 10 ts IC/IB = 10
500 IB1 = IB2 500
ts IB1 = IB2
300 TJ = 25°C 300 TJ = 25°C
200 200
t, TIME (ns)
t, TIME (ns)
100 100 tf
70 70
50 tf 50
tr
30 30
20 tr 20
td @ VBE(off) = 0.5 V td @ VBE(off) = –0.5 V
10 10
10 20 30 50 70 100 200 –10 –20 –30 –50 –70 –100 –200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 k –1.0 k
700 –700
500 –500
I C , COLLECTOR CURRENT (mA)
100 –100
70 –70
50 CURRENT LIMIT –50 CURRENT LIMIT
THERMAL LIMIT THERMAL LIMIT
30 –30
SECOND BREAKDOWN LIMIT SECOND BREAKDOWN LIMIT
20 –20 MPS8598
MPS8098
DUTY CYCLE ≤ 10% DUTY CYCLE ≤ 10%
MPS8099 MPS8599
10 –10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
400 300
TJ = 125°C
TJ = 125°C 200
25°C
25°C
h FE , DC CURRENT GAIN
100
100 –55°C
70
80 VCE = 5.0 V
VCE = –5.0 V
50
60
40 30
0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 10. MPS8098/99 DC Current Gain Figure 11. MPS8598/99 DC Current Gain
1.0 1.0
TJ = 25°C TJ = 25°C
0.8 0.8
VBE(sat) @ IC/IB = 10 VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
V, VOLTAGE (VOLTS)
0.4 0.4
0.2 0.2
VCE(sat) @ IC/IB = 10 VCE(sat) @ IC/IB = 10
0 0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 12. MPS8098/99 “ON” Voltages Figure 13. MPS8598/99 “ON” Voltages
IC = IC = IC = IC = IC = IC = IC = IC = IC =
1.6 200 mA 1.6 10 mA 20 mA 50 mA 100 mA 200 mA
20 mA 50 mA 100 mA
1.2 1.2
0.8 0.8
0.4 0.4
IC =
10 mA TJ = 25°C
0 0
0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20
IB, BASE CURRENT (mA) IB, BASE CURRENT (mA)
Figure 14. MPS8098/99 Collector Saturation Figure 15. MPS8598/99 Collector Saturation
Region Region
–1.0 –1.0
R qVB , TEMPERATURE COEFFICIENT (mV/ °C)
–1.8 –1.8
RqVB FOR VBE
RqVB FOR VBE
–55°C TO 125°C –55°C TO 125°C
–2.2 –2.2
–2.6 –2.6
–3.0 –3.0
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0
0.7 D = 0.5
0.5
r(t), NORMALIZED TRANSIENT
0.2
THERMAL RESISTANCE
0.3
0.2 0.1
0.05 ZθJC(t) = r(t) • RθJC
TJ(pk) – TC = P(pk) ZθJC(t)
0.1 P(pk)
SINGLE PULSE 0.02 0.01 ZθJA(t) = r(t) • RθJA
0.07
TJ(pk) – TA = P(pk) ZθJA(t)
0.05 t1 D CURVES APPLY FOR
0.03 SINGLE PULSE t2 POWER PULSE TRAIN
SHOWN READ TIME AT t1
0.02
DUTY CYCLE, D = t1/t2 (SEE AN469)
0.01
1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width v
300 ms, Duty Cycle v
2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
t 6.0 pF t 6.0 pF
0
tr = 3.0 ns * CS * CS
5.0 mF 5.0 mF
100 100
5.0 ms
tr = 3.0 ns
100
70
100
50
70
50
30
30 20
2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
80 100
TJ = 25°C TJ = 25°C
60 70
40 50 Cibo
C, CAPACITANCE (pF)
C, CAPACITANCE (pF)
Cibo 30
20
20
10
8.0 10 Cobo
6.0 Cobo 7.0
4.0 5.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
1.0 k 1.0 k
700 700
500 500
ts ts
300 300
200 200
t, TIME (ns)
t, TIME (ns)
100 100
70 tf 70 tf
50 50
VCC = 40 V VCC = –40 V
30 IC/IB = 10 tr 30 IC/IB = 10
20 IB1 = IB2 20 IB1 = IB2
TJ = 25°C td @ VBE(off) = 0.5 V TJ = 25°C td @ VBE(off) = –0.5 V tr
10 10
5.0 7.0 10 20 30 50 70 100 200 300 500 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0 k –1.0 k
700 100 ms –700 100 ms
500 1.0 ms –500 1.0 ms
I C , COLLECTOR CURRENT (mA)
400 400
TJ = 125°C TJ = 125°C
VCE = 1.0 V VCE = –1.0 V
200 200
h FE , DC CURRENT GAIN
25°C 25°C
–55°C
–55°C
100 100
80 80
60 60
40 40
0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 300 500 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 10. MPSA05/06 DC Current Gain Figure 11. MPSA55/56 DC Current Gain
1.0 –1.0
TJ = 25°C TJ = 25°C
V, VOLTAGE (VOLTS)
0.6 –0.6
VBE(on) @ VCE = 1.0 V VBE(on) @ VCE = –1.0 V
0.4 –0.4
0.2 –0.2
VCE(sat) @ IC/IB = 10 VCE(sat) @ IC/IB = 10
0 0
0.5 1.0 2.0 5.0 10 20 50 100 200 500 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 12. MPSA05/06 “ON” Voltages Figure 13. MPSA55/56 “ON” Voltages
0.8 –0.8
IC = IC = IC = IC = IC = IC = IC = IC =
50 mA 100 mA 250 mA 500 mA –50 mA –100 mA –250 mA –500 mA
0.6 –0.6
0.4 –0.4
IC = IC =
0.2 10 mA –0.2 –10 mA
0 0
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 –0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50
IB, BASE CURRENT (mA) IB, BASE CURRENT (mA)
Figure 14. MPSA05/06 Collector Saturation Figure 15. MPSA55/56 Collector Saturation
Region Region
–0.8 –0.8
R qVB , TEMPERATURE COEFFICIENT (mV/ °C)
–1.6 –1.6
–2.4 –2.4
–2.8 –2.8
0.5 1.0 2.0 5.0 10 20 50 100 200 500 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.0
0.7 D = 0.5
0.5
r(t), NORMALIZED TRANSIENT
THERMAL RESISTANCE
0.3 0.2
0.2 0.1
0.05 ZθJC(t) = r(t) • RθJC
TJ(pk) – TC = P(pk) ZθJC(t)
0.1 P(pk)
SINGLE PULSE 0.02 0.01 ZθJA(t) = r(t) • RθJA
0.07
TJ(pk) – TA = P(pk) ZθJA(t)
0.05 t1 D CURVES APPLY FOR
0.03 SINGLE PULSE t2 POWER PULSE TRAIN
SHOWN READ TIME AT t1
0.02
DUTY CYCLE, D = t1/t2 (SEE AN469)
0.01
1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
EMITTER 1
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CES 30 — Vdc
(IC = 100 µAdc, IB = 0)
Collector Cutoff Current ICBO — 100 nAdc
(VCB= 30 Vdc, IE = 0)
Emitter Cutoff Current IEBO — 100 nAdc
(VEB= 10 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
RS
in
en
IDEAL
TRANSISTOR
500 2.0
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
RS ≈ 0 1.0
200
0.7
en, NOISE VOLTAGE (nV)
100 µA 100 µA
0.1
20
0.07
IC = 1.0 mA 10 µA
0.05
10
0.03
5.0 0.02
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
200 14
VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)
10
70 IC = 10 µA 10 µA
8.0
50
100 µA
6.0
30 100 µA
4.0 IC = 1.0 mA
20
1.0 mA
2.0
10 0
1.0 2.0 5.0 10 20 50 100 200 500 100 1.0 2.0 5.0 10 20 50 100 200 500 100
RS, SOURCE RESISTANCE (kΩ) 0 RS, SOURCE RESISTANCE (kΩ) 0
20 4.0
VCE = 5.0 V
7.0 Cibo
1.0
5.0 Cobo 0.8
0.6
3.0 0.4
2.0 0.2
0.04 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 0.5 1.0 2.0 0.5 10 20 50 100 200 500
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
50 k 25°C
30 k 2.0
20 k
1.5
10 k
7.0 k
– 55°C
5.0 k 1.0
VCE = 5.0 V
3.0 k
2.0 k 0.5
5.0 7.0 10 20 30 50 70 100 200 300 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
1.6 – 1.0
RθV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 – 6.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2 SINGLE PULSE
0.05
0.1
0.1
0.07 SINGLE PULSE
0.05
0.03 ZθJC(t) = r(t) • RθJC TJ(pk) – TC = P(pk) ZθJC(t)
0.02 ZθJA(t) = r(t) • RθJA TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
1.0 k
FIGURE A
700 1.0 ms
500
IC, COLLECTOR CURRENT (mA)
tP
300 TC = 25°C 100 µs
TA = 25°C PP PP
200 1.0 s
100
70
50
t1
30
CURRENT LIMIT
20 THERMAL LIMIT 1/f
+ t1 f + ttP1
SECOND BREAKDOWN LIMIT
10 DUTY CYCLE
0.4 0.6 1.0 2.0 4.0 6.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS) PEAK PULSE POWER = PP
Figure 13. Active Region Safe Operating Area Design Note: Use of Transient Thermal Resistance Data
Chopper Transistor
NPN Silicon
MPSA17
COLLECTOR Motorola Preferred Device
2
BASE
1
EMITTER
MAXIMUM RATINGS 1
2
Rating Symbol Value Unit 3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
Thermal Resistance, Junction to Case RqJC 125 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO 40 — Vdc
(IC = 1.0 mAdc, IB = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 15 — Vdc
(IE = 0.1 mAdc, IC = 0)
Collector Cutoff Current ICBO — 100 nAdc
(VCB = 30 Vdc, IE = 0)
Emitter Cutoff Current IEBO — 100 nAdc
(VEB = 10 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
(Replaces MPSA16/D)
200
100
70
50
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA)
1000 2.0
f = 1.0 kHz 1.8
h fe , SMALL SIGNAL CURRENT GAIN
700 TA = 25°C
1.6
VCE = 5.0 Vdc
V, VOLTAGE (VOLTS)
500 1.4
400 1.2
300 1.0
0.8 VBE(on)
200 0.6
0.4
VCE (SAT) @ IC/IB = 10
0.2
100 0
0.1 0.3 0.5 0.7 1.0 3.0 5.0 7.0 10 1.0 2.0 3.0 5.0 10 20 30 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
200 10
TA = 25°C
7.0
Cob , OUTPUT CAPACITANCE (pF)
100
4.0
70
50
TA = 25°C 2.0
VCE = 10 Vdc
30
20 1.0
0.2 0.5 1.0 2.0 5.0 10 20 0.4 0.7 1.0 2.0 4.0 7.0 10 20 40
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
COLLECTOR
3
2
BASE
1
EMITTER 1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage VCEO 45 Vdc
Collector – Base Voltage VCBO 45 Vdc
Emitter – Base Voltage VEBO 6.5 Vdc
Collector Current — Continuous IC 200 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA(1) 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO 45 — — Vdc
(IC = 10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 45 — — Vdc
(IC = 100 mAdc, IE = 0)
Emitter–Base Breakdown Voltage V(BR)EBO 6.5 — — Vdc
(IE = 10 µAdc, IC = 0)
1. RθJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
ON CHARACTERISTICS(2)
DC Current Gain hFE —
(IC = 10 µAdc, VCE = 5.0 Vdc) 400 580 —
(IC = 100 µAdc, VCE = 5.0 Vdc) 500 850 —
(IC = 1.0 mAdc, VCE = 5.0 Vdc) 500 1100 —
(IC = 10 mAdc, VCE = 5.0 Vdc) 500 1150 1500
Collector – Emitter Saturation Voltage VCE(sat) Vdc
(IC = 10 mAdc, IB = 0.5 mAdc) — — 0.2
(IC = 50 mAdc, IB = 5.0 mAdc) — 0.08 0.3
Base – Emitter On Voltage VBE(on) — 0.6 0.7 Vdc
(IC = 1.0 mAdc, VCE = 5.0 Vdc)
RS
in
en
IDEAL
TRANSISTOR
NOISE VOLTAGE
30 30
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
20 20
IC = 10 mA RS ≈ 0 RS ≈ 0
en , NOISE VOLTAGE (nV)
10 20
BANDWIDTH = 1.0 Hz
7.0
5.0
IC = 10 mA 16
In, NOISE CURRENT (pA)
2.0 3.0 mA
12
1.0 mA
1.0
IC = 1.0 mA
0.7 500 µA
300 µA 8.0
0.5
100 µA
0.3 100 µA
4.0 10 µA
0.2
10 µA 30 µA
RS ≈ 0
0.1 0
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) RS, SOURCE RESISTANCE (OHMS)
16 IC = 10 mA 3.0 mA
100 100 µA
NF, NOISE FIGURE (dB)
70 3.0 mA 1.0 mA
50 12
1.0 mA
30 300 µA
300 µA
20 30 µA 8.0
100 µA
10
10 µA
7.0 4.0 30 µA
10 µA
5.0
BANDWIDTH = 1.0 Hz
3.0 0
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
RS, SOURCE RESISTANCE (OHMS) RS, SOURCE RESISTANCE (OHMS)
0.5
0.4
0.3
0.2
0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA)
1.0 – 0.4
RθVBE, BASE–EMITTER
V, VOLTAGE (VOLTS)
0.2 – 2.0
– 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
8.0 500
6.0 TJ = 25°C
300
Cob Cib
C, CAPACITANCE (pF)
4.0 Ceb
200
3.0 Ccb
2.0
100
VCE = 5.0 V
70
1.0 TJ = 25°C
0.8 50
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
Amplifier Transistor
NPN Silicon
MPSA20
COLLECTOR
3
2
BASE 1
2
3
1
EMITTER CASE 29–04, STYLE 1
TO–92 (TO–226AA)
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 40 Vdc
Collector – Base Voltage VCBO 4.0 Vdc
Collector Current — Continuous IC 100 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA(1) 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(2) V(BR)CEO 40 — Vdc
(IC = 1.0 mAdc, IB = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 4.0 — Vdc
(IE = 100 µAdc, IC = 0)
Collector Cutoff Current ICBO — 100 nAdc
(VCB = 30 Vdc, IE = 0)
1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%.
+ 3.0 V + 3.0 V
10 < t1 < 500 µs t1
300 ns 275 +10.9 V 275
+10.9 V DUTY CYCLE = 2%
DUTY CYCLE = 2%
10 k 10 k
– 0.5 V 0
<1.0 ns CS < 4.0 pF* CS < 4.0 pF*
– 9.1 V 1N916
< 1.0 ns
20 100
IC = 1.0 mA BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
50
RS = 0 IC = 1.0 mA RS ≈ ∞
300 µA 20 300 µA
en, NOISE VOLTAGE (nV)
2.0 0.1
10 20 50 100 200 500 1 k 2k 5k 10 k 10 20 50 100 200 500 1 k 2k 5k 10 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
500 k 1M
200 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
100 k 200 k
50 k 100 k
20 k 50 k
10 k 20 k
5k 10 k
2.0 dB 1.0 dB
2k 5k
3.0 dB 4.0 dB
1k 2k 2.0 dB
6.0 dB 3.0 dB
500 10 dB
1k
500 5.0 dB
200
100 200 8.0 dB
50 100
10 20 30 50 70 100 200 300 500 700 1k 10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
500 k
10 Hz to 15.7 kHz
200 k
RS , SOURCE RESISTANCE (OHMS)
100 k
50 k
ǒ Ǔ
Noise Figure is defined as:
20 k
10 k NF + 20 log10 en2 ) 4KTRS ) In 2RS2 1ń2
5k 4KTRS
1.0 dB
en = Noise Voltage of the Transistor referred to the input. (Figure 3)
2k 2.0 dB In = Noise Current of the Transistor referred to the input. (Figure 4)
1k 3.0 dB K = Boltzman’s Constant (1.38 x 10–23 j/°K)
500 T = Temperature of the Source Resistance (°K)
5.0 dB
200 RS = Source Resistance (Ohms)
8.0 dB
100
50
10 20 30 50 70 100 200 300 500 700 1k
IC, COLLECTOR CURRENT (µA)
Figure 7. Wideband
400
h FE, DC CURRENT GAIN TJ = 125°C
200 25°C
– 55°C
100
80
MPSA20
60 VCE = 1.0 V
VCE = 10 V
40
0.004 0.006 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
MPSA20 TA = 25°C
IB = 500 µA
TJ = 25°C PULSE WIDTH = 300 µs
200 µA
0.4 40
100 µA
0.2 20
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
*APPLIES for IC/IB ≤ hFE/2
θV, TEMPERATURE COEFFICIENTS (mV/°C)
TJ = 25°C
1.2
0.8
25°C to 125°C
V, VOLTAGE (VOLTS)
1.0
*qVC for VCE(sat)
0
0.8 VBE(sat) @ IC/IB = 10 – 55°C to 25°C
0.6 – 0.8
VBE(on) @ VCE = 1.0 V
0.4 25°C to 125°C
– 1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 – 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
300 1000
200 VCC = 3.0 V
700
IC/IB = 10 500
TJ = 25°C ts
100 300
70 200
50
t, TIME (ns)
t, TIME (ns)
30 tr 100 tf
20 70
td @ VBE(off) = 0.5 Vdc 50
10 30 VCC = 3.0 V
7.0 IC/IB = 10
20 IB1 = IB2
5.0
TJ = 25°C
3.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
f = 100 MHz 7.0 f = 1.0 MHz
300
VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
200 5.0 V
Cob
3.0
100 2.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = 10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 hfe ≈ 200 @ IC = 1.0 mA 70
5.0 50 MPSA20
3.0 30 hfe ≈ 200 @ IC = 1.0 mA
2.0 20
1.0 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19A
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
102 ICEO Figure 19 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 19 by the
101 steady state value RθJA.
Example:
ICBO Dissipating 2.0 watts peak under the following conditions:
100
AND t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
ICEX @ VBE(off) = 3.0 Vdc Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
10–1 r(t) is 0.22.
The peak rise in junction temperature is therefore
10–2 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
–4 –2 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160
0 0 For more information, see AN–569.
TJ, JUNCTION TEMPERATURE (°C)
Figure 19A.
400
100 µs The safe operating area curves indicate IC–VCE limits of the
1.0 ms
200 transistor that must be observed for reliable operation. Collector load
IC, COLLECTOR CURRENT (mA)
10 µs
lines for specific circuits must fall below the limits indicated by the
100 TC = 25°C 1.0 s applicable curve.
dc The data of Figure 20 is based upon TJ(pk) = 150°C; TC or TA is
60 TA = 25°C variable depending upon conditions. Pulse curves are valid for duty
40 dc cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
20 TJ = 150°C limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.
10 CURRENT LIMIT
THERMAL LIMIT
6.0
SECOND BREAKDOWN LIMIT
4.0
2.0 4.0 6.0 8.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
Figure 20.
Darlington Transistor
NPN Silicon
COLLECTOR 3
MPSA27
BASE
2
EMITTER 1
1
2
3
MAXIMUM RATINGS
Rating Symbol MPSA27 Unit
Collector – Emitter Voltage VCES 60 Vdc
Emitter – Base Voltage VEBO 10 Vdc
Collector Current — Continuous IC 500 mAdc
Total Device Dissipation PD 625 mW
@ TA = 25°C 5.0 mW/°C
Derate above 25°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CES 60 — — Vdc
(IC = 100 µAdc, VBE = 0)
Collector – Base Breakdown Voltage V(BR)CBO 60 — — Vdc
(IC = 100 mAdc, IE = 0)
Collector Cutoff Current ICBO — — 100 nAdc
(VCB = 30 V, IE = 0)
(VCB = 40 V, IE = 0)
(VCB = 50 V, IE = 0)
Collector Cutoff Current ICES — — 500 nAdc
(VCE = 30 V, VBE = 0)
(VCE = 40 V, VBE = 0)
(VCE = 50 V, VBE = 0)
Emitter Cutoff Current IEBO — — 100 nAdc
(VEB = 10 Vdc)
VCE = 5.0 V
120
1.6 TA = 25°C
h FE , DC CURRENT GAIN (k)
TA = 125°C
100
V, VOLTAGE (VOLTS)
1.4 VBE(S) @ IC/IB = 1.0 k
80
1.2 VBE(ON) @ VCE = 5.0 V
60
TA = 25°C
1.0
40
0.8
20 TA = –55°C VCE(S) @ IC/IB = 1.0 k
0.6
0
1.0 2.0 3.0 10 20 30 100 200 500 1k 1.0 2.0 3.0 10 20 30 100 200 500 1k
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.6 4.0
VCE , COLLECTOR–EMITTER VOLTAGE (VOLTS)
1k
1.0 ms 100 ms
500
I C , COLLECTOR CURRENT (mA)
1.0 s
200
TA = 25°C TC = 25°C
100
50
CURRENT LIMIT
20 THERMAL LIMIT
SECOND BREAKDOWN LIMIT
10
1.0 2.0 4.0 6.0 10 20 40 50 60
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
Darlington Transistors
NPN Silicon MPSA28
COLLECTOR 3 MPSA29*
*Motorola Preferred Device
BASE
2
EMITTER 1
MAXIMUM RATINGS
Rating Symbol MPSA28 MPSA29 Unit 1
2
Collector – Emitter Voltage VCES 80 100 Vdc 3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CES Vdc
(IC = 100 µAdc, VBE = 0) MPSA28 80 — —
MPSA29 100 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) MPSA28 80 — —
MPSA29 100 — —
Emitter – Base Breakdown Voltage V(BR)EBO 12 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO nAdc
(VCB = 60 Vdc, IE = 0) MPSA28 — — 100
(VCB = 80 Vdc, IE = 0) MPSA29 — — 100
Collector Cutoff Current ICES nAdc
(VCE = 60 Vdc, VBE = 0) MPSA28 — — 500
(VCE = 80 Vdc, VBE = 0) MPSA29 — — 500
Emitter Cutoff Current IEBO — — 100 nAdc
(VEB = 10 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
VCE = 5.0 V
1.8
h FE , DC CURRENT GAIN (k) 200 VBE(S) @ IC/IB = 1.0 k
TA = 125°C
1.6
V, VOLTAGE (VOLTS)
100 TA = 25°C
50 TA = 25°C 1.4
VBE(ON) @ VCE = 5.0 V
20 TA = –55°C 1.2
10
1.0
5.0
VCE(S) @ IC/IB = 1.0 k
0.8
2.0
1.0 0.6
1.0 2.0 5.0 10 20 50 100 200 500 1k 1.0 2.0 5.0 10 20 50 100 200 500 1k
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0 2.4
qV, TEMPERATURE COEFFICIENT (mV/ °C)
TA = 25°C
IC = 250 mA
–3.0 1.2
25°C to 125°C IC = 10 mA IC = 100 mA
–55°C to 25°C
–4.0 0.8
qVB for VBE
–5.0 0.4
1.0 2.0 5.0 10 20 50 100 200 500 0.2 1.0 2.0 10 20 100 200 1 k 1.5 k
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
1k 10
h fe , HIGH FREQUENCY CURRENT GAIN
500 5.0
100 ms
I C , COLLECTOR CURRENT (mA)
Figure 5. Active Region — Safe Operating Figure 6. High Frequency Current Gain
Area
2
BASE
1
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol MPSA42 MPSA43 Unit
Collector – Emitter Voltage VCEO 300 200 Vdc CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Base Voltage VCBO 300 200 Vdc
Emitter – Base Voltage VEBO 6.0 6.0 Vdc
Collector Current — Continuous IC 500 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/mW
Thermal Resistance, Junction to Case RqJC 83.3 °C/mW
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) MPSA42 300 —
MPSA43 200 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) MPSA42 300 —
MPSA43 200 —
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 100 mAdc, IC = 0)
Collector Cutoff Current ICBO µAdc
(VCB = 200 Vdc, IE = 0) MPSA42 — 0.1
(VCB = 160 Vdc, IE = 0) MPSA43 — 0.1
Emitter Cutoff Current IEBO µAdc
(VEB = 6.0 Vdc, IC = 0) MPSA42 — 0.1
(VEB = 4.0 Vdc, IC = 0) MPSA43 — 0.1
Preferred devices are Motorola recommended choices for future use and best overall value.
TJ = +125°C
hFE, DC CURRENT GAIN
100
25°C
50
–55°C
30
20
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
50 70
C, CAPACITANCE (pF)
Ceb 50
20
TJ = 25°C
10 VCE = 20 V
30 f = 20 MHz
5.0
20
2.0 Ccb
1.0 10
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1.4 500
TJ = 25°C 100 µs 10 µs
1.2 200 TA = 25°C
IC, COLLECTOR CURRENT (mA)
1.0 ms
1.0 100 TC = 25°C
V, VOLTAGE (VOLTS)
50
0.8 100 ms
VBE(sat) @ IC/IB = 10
20
0.6 10 CURRENT LIMIT
VBE(on) @ VCE = 10 V
THERMAL LIMIT
5.0 (PULSE CURVES @ TC = 25°C)
0.4
SECOND BREAKDOWN LIMIT
2.0
0.2 VCE(sat) @ IC/IB = 10 CURVES APPLY
1.0 MPSA43
BELOW RATED VCEO
MPSA42
0 0.5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
2
BASE
1
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 400 Vdc CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Base Voltage VCBO 500 Vdc
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 300 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 400 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Emitter Breakdown Voltage V(BR)CES 500 — Vdc
(IC = 100 µAdc, VBE = 0)
Collector – Base Breakdown Voltage V(BR)CBO 500 — Vdc
(IC = 100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — 0.1 µAdc
(VCB = 400 Vdc, IE = 0)
Collector Cutoff Current ICES — 500 nAdc
(VCE = 400 Vdc, VBE = 0)
Emitter Cutoff Current IEBO — 0.1 µAdc
(VEB = 4.0 Vdc, IC = 0)
140 TA = 125°C
0.4 IC = 1.0 mA IC = 10 mA IC = 50 mA
hFE, DC CURRENT GAIN
120 VCE = 10 V
100 0.3
TA = 25°C
25°C
80 0.2
60
0.1
40
–55°C
20 0
1.0 2.0 5.0 10 20 50 100 200 300 10 30 100 300 1.0 k 3.0 k 10 k 50 k
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
1.0 1000
TA = 25°C 1.0 ms 100 µs
TA = 25°C
100
0.6 VBE(on) @ VCE = 10 V
20
0.4
10 CURRENT LIMIT
THERMAL LIMIT
0.2 VCE(sat) @ IC/IB = 10 SECOND BREAKDOWN LIMIT
2.0 VALID FOR DUTY CYCLE ≤ 10% MPSA44
0 1.0
0.1 0.3 1.0 3.0 10 30 100 300 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) VCE, COLLECTOR VOLTAGE (VOLTS)
100 10
Cib
|h fe |, SMALL–SIGNAL CURRENT GAIN
50
C, CAPACITANCE (pF)
20
10 VCE = 10 V
Cob
f = 10 MHz
3.0 TA = 25°C
5.0
2.0
1.0 0
0.5 –4.0 V
VCC = 150 V
IC/IB = 10 VCC
0.2 TA = 25°C tr
RL
VBE(off) = 4.0 Vdc td
0.1 Vout
1.0 3.0 10 30 50 100
RB
IC, COLLECTOR CURRENT (mA) Vin
CS ≤ 4.0 pF*
10
Vin
5.0 +10.7 V
ts
2.0 PW = 50 µS
DUTY CYCLE = 2.0%
t, TIME ( µs)
1.0
0.5 tf
VCC = 150 V –11.4 V
IC/IB = 10 VCC
0.2 TA = 25°C
RL
0.1
1.0 3.0 10 30 50 100 Vout
IC, COLLECTOR CURRENT (mA) RB
Vin
CS ≤ 4.0 pF*
Darlington Transistors
PNP Silicon MPSA62
MPSA63
COLLECTOR 3
MPSA64 *
BASE MPSA55, MPSA56
2 For Specifications,
See MPSA05, MPSA06 Data
MAXIMUM RATINGS
MPSA63
Rating Symbol MPSA62 MPSA64 Unit
Collector – Emitter Voltage VCES –20 –30 Vdc 1
2
3
Collector – Base Voltage VCBO –20 –30 Vdc
Emitter – Base Voltage VEBO –10 Vdc CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector Current — Continuous IC –500 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TA = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
Preferred devices are Motorola recommended choices for future use and best overall value.
ON CHARACTERISTICS(1)
DC Current Gain hFE —
(IC = –10 mAdc, VCE = –5.0 Vdc) MPSA63 5,000 —
MPSA64 10,000 —
MPSA62 20,000 —
3.0
2.0
–0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300
IC, COLLECTOR CURRENT (mA)
0 –0.6
–0.3 –0.5 –1.0 –2 –3 –5 –10 –20 –30 –50 –100 –200 –300 –0.1–0.2 –0.5 –1 –2 –5 –10 –20 –50 –100–200–500 –1K–2K –5K–10K
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
10 –1000
|h FE |, HIGH FREQUENCY CURRENT GAIN
VCE = –5.0 V
1.0 ms 100 µs
IC, COLLECTOR CURRENT (mA)
Figure 4. High Frequency Current Gain Figure 5. Active Region, Safe Operating Area
Amplifier Transistor
MPSA70
PNP Silicon
COLLECTOR
3
2
BASE
1
EMITTER
1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO –40 Vdc
Emitter – Base Voltage VEBO –4.0 Vdc
Collector Current — Continuous IC –100 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO –40 — Vdc
(IC = –1.0 mAdc, IB = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –4.0 — Vdc
(IE = –100 µAdc, IC = 0)
Collector Cutoff Current ICBO — –100 nAdc
(VCB = –30 Vdc, IE = 0)
10 1.0
BANDWIDTH = 1.0 Hz 7.0 BANDWIDTH = 1.0 Hz
7.0 RS ≈ 0 5.0 RS ≈ ∞
IC = 10 µA IC = 1.0 mA
en, NOISE VOLTAGE (nV)
1.0 M 1.0 M
500 k BANDWIDTH = 1.0 Hz 500 k BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)
200 k 200 k
100 k 100 k
50 k 50 k
20 k 20 k
0.5 dB
10 k 10 k
0.5 dB
5.0 k 1.0 dB 5.0 k
2.0 k 2.0 k 1.0 dB
1.0 k 2.0 dB 1.0 k
2.0 dB
500 3.0 dB 500
3.0 dB
200 5.0 dB 200 5.0 dB
100 100
10 20 30 50 70 100 200 300 500 700 1.0 k 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (µA) IC, COLLECTOR CURRENT (µA)
1.0 M
500 k 10 Hz to 15.7 kHz
RS , SOURCE RESISTANCE (OHMS)
200 k
100 k
ƪ ƫ
Noise Figure is Defined as:
Figure 5. Wideband
400
TJ = 125°C
25°C
h FE, DC CURRENT GAIN
200
– 55°C
100
80
MPSA70
60 VCE = 1.0 V
VCE = 10 V
40
0.003 0.005 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0 100
TA = 25°C TA = 25°C IB = 400 µA
MPSA70 PULSE WIDTH = 300 µs
350 µA
150 µA
0.4 40
100 µA
0.2 20 50 µA
0 0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 5.0 10 15 20 25 30 35 40
IB, BASE CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
1.4 1.6
θV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 0.8
VBE(on) @ VCE = 1.0 V
25°C to 125°C
0.4
1.6
0.2 qVB for VBE – 55°C to 25°C
VCE(sat) @ IC/IB = 10
0 2.4
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 1000
VCC = 3.0 V 700 VCC = – 3.0 V
300 IC/IB = 10
IC/IB = 10 500
200 TJ = 25°C IB1 = IB2
ts
300 TJ = 25°C
100 200
t, TIME (ns)
t, TIME (ns)
70
50 100
30 70
tr 50
20 tf
td @ VBE(off) = 0.5 V 30
10 20
7.0
5.0 10
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30 – 50 – 70 –100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
500 10
TJ = 25°C TJ = 25°C
7.0
300 VCE = 20 V Cib
5.0
C, CAPACITANCE (pF)
5.0 V
200
3.0
70
50 1.0
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
20 200
VCE = –10 Vdc VCE = 10 Vdc
hoe, OUTPUT ADMITTANCE (m mhos)
TA = 25°C TA = 25°C
7.0 MPSA70 70
5.0 hfe ≈ 200 50
@ IC = –1.0 mA MPSA70
3.0 30
hfe ≈ 200
2.0 20 @ IC = 1.0 mA
1.0 10
0.7 7.0
0.5 5.0
0.3 3.0
0.2 2.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.3
0.2
0.2
(NORMALIZED)
0.1
0.1
FIGURE 19
0.07 0.05 DUTY CYCLE, D = t1/t2
0.05 P(pk) D CURVES APPLY FOR POWER
0.02 PULSE TRAIN SHOWN
0.03 t1 READ TIME AT t1 (SEE AN–569)
0.01
0.02 SINGLE PULSE t2 ZθJA(t) = r(t) • RθJA
TJ(pk) – TA = P(pk) ZθJA(t)
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
t, TIME (ms)
400
1.0 ms 10 µs
The safe operating area curves indicate IC–VCE limits of the
200 transistor that must be observed for reliable operation. Collector load
IC, COLLECTOR CURRENT (mA)
100 µs
lines for specific circuits must fall below the limits indicated by the
100 TC = 25°C applicable curve.
1.0 s
dc The data of Figure 18 is based upon TJ(pk) = 150°C; TC or TA is
60 TA = 25°C variable depending upon conditions. Pulse curves are valid for duty
40 dc cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be calculated from
the data in Figure 17. At high case or ambient temperatures, thermal
20 TJ = 150°C limitations will reduce the power than can be handled to values less
than the limitations imposed by second breakdown.
10 CURRENT LIMIT
THERMAL LIMIT
6.0
SECOND BREAKDOWN LIMIT
4.0
2.0 4.0 6.0 8.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
as shown in Figure 19. Using the model and the device thermal
ICEO response the normalized effective transient thermal resistance of
102 Figure 17 was calculated for various duty cycles.
To find ZθJA(t), multiply the value obtained from Figure 17 by the
101 steady state value RθJA.
ICBO
AND Example:
ICEX @ VBE(off) = 3.0 V Dissipating 2.0 watts peak under the following conditions:
100
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
Using Figure 17 at a pulse width of 1.0 ms and D = 0.2, the reading of
10–1 r(t) is 0.22.
The peak rise in junction temperature is therefore
10–2 ∆T = r(t) x P(pk) x RθJA = 0.22 x 2.0 x 200 = 88°C.
–4 –2 0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160
0 0 For more information, see AN–569.
TJ, JUNCTION TEMPERATURE (°C)
Darlington Transistors
PNP Silicon MPSA75
MPSA77
COLLECTOR 3
BASE
2
EMITTER 1
1
MAXIMUM RATINGS 2
3
Rating Symbol MPSA75 MPSA77 Unit
Collector – Emitter Voltage VCES –40 –60 Vdc CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Emitter – Base Voltage VEBO –10 Vdc
Collector Current — Continuous IC –500 Adc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage MPSA75 V(BR)CES –40 — — Vdc
(IC = –100 µAdc, VBE = 0) MPSA77 –60 — —
Collector – Base Breakdown Voltage MPSA75 V(BR)CBO –40 — — Vdc
(IC = 100 mAdc, IE = 0) MPSA77 –60 — —
Collector Cutoff Current ICBO nAdc
(VCB= –30 V, IE = 0) MPSA75 — — –100
(VCB = –50 V, IE = 0) MPSA77 — — –100
Collector Cutoff Current ICES nAdc
(VCE = –30 V, VBE = 0) MPSA75 — — –500
(VCE = –50 V, VBE = 0) MPSA77 — — –500
Emitter Cutoff Current (VEB = –10 Vdc) IEBO — — –100 nAdc
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = –10 mA, VCE = –5.0 V) 10,000 — —
(IC = –100 mA, VCE = –5.0 V) 10,000 — —
Collector – Emitter Saturation Voltage (IC = –100 mA, IB = –0.1 mAdc) VCE(sat) — — –1.5 Vdc
Base – Emitter On Voltage (IC = –100 mA, VCE = –5.0 Vdc) VBE — — –2.0 Vdc
3.0
2.0
–0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300
IC, COLLECTOR CURRENT (mA)
0 –0.6
–0.3 –0.5 –1.0 –2 –3 –5 –10 –20 –30 –50 –100 –200 –300 –0.1–0.2 –0.5 –1 –2 –5 –10 –20 –50 –100–200–500 –1K–2K –5K–10K
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
10 –1000
|h FE |, HIGH FREQUENCY CURRENT GAIN
VCE = –5.0 V
1.0 ms 100 µs
IC, COLLECTOR CURRENT (mA)
Figure 4. High Frequency Current Gain Figure 5. Active Region, Safe Operating Area
2
BASE
1
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol MPSA92 MPSA93 Unit
Collector – Emitter Voltage VCEO –300 –200 Vdc CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Base Voltage VCBO –300 –200 Vdc
Emitter – Base Voltage VEBO –5.0 Vdc
Collector Current — Continuous IC –500 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = –1.0 mAdc, IB = 0) MPSA92 –300 —
MPSA93 –200 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = –100 mAdc, IE = 0) MPSA92 –300 —
MPSA93 –200 —
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — Vdc
(IE = –100 mAdc, IC = 0)
Collector Cutoff Current ICBO µAdc
(VCB = –200 Vdc, IE = 0) MPSA92 — –0.25
(VCB = –160 Vdc, IE = 0) MPSA93 — –0.25
Emitter Cutoff Current IEBO — –0.1 µAdc
(VEB = –3.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
+25°C
70
50 –55°C
30
20
15
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –80 –100
IC, COLLECTOR CURRENT (mA)
20
40
10 30
5.0
20
2.0
Ccb
1.0 0
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100–200 –500 –1000 –1.0 –2.0 –5.0 –10 –20 –50 –100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
–1.0 –500
100 µs
1.0 ms
IC, COLLECTOR CURRENT (mA)
–100
–0.6
MPSA93
–50
1.5 WATT THERMAL
–0.4 LIMITATION @ TC = 25°C MPSA92
625 mW THERMAL
–20 LIMITATION @ TA = 25°C
–0.2
VCE(sat) @ IC/IB = 10 mA –10 BONDING WIRE LIMITATION
SECOND BREAKDOWN
LIMITATION TJ = 150°C
0 –5.0
–1.0 –2.0 –5.0 –10 –20 –50 –100 –3.0 –5.0 –10 –20 –30 –50 –100 –200 –300
IC, COLLECTOR CURRENT (mA) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
VHF/UHF Transistors
NPN Silicon MPSH10
COLLECTOR MPSH11
3
Motorola Preferred Devices
1
BASE
2
EMITTER
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
Thermal Resistance, Junction to Case RqJC 125 °C/W
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO 25 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 30 — Vdc
(IC = 100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 3.0 — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — 100 nAdc
(VCB = 25 Vdc, IE = 0)
Emitter Cutoff Current IEBO — 100 nAdc
(VEB = 2.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
CATV Transistor
NPN Silicon
COLLECTOR
MPSH17
3
Motorola Preferred Device
1
BASE
2
EMITTER
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
(Printed Circuit Board Mounting)
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO 15 — — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 20 — — Vdc
(IC = 100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 3.0 — — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — 100 nAdc
(VCB = 15 Vdc, IE = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
FUNCTIONAL TEST
Amplifier Power Gain Gpe — 24 — dB
(IC = 5.0 mAdc, VCC = 12 Vdc, RS = 50 ohms, f = 200 MHz)
RF Amplifier Transistor
PNP Silicon MPSH81
COLLECTOR
Motorola Preferred Device
3
1
BASE
2
EMITTER
1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO –20 Vdc
Collector – Base Voltage VCBO –20 Vdc
Emitter – Base Voltage VEBO –3.0 Vdc
Total Device Dissipation @ TA = 25°C PD 350 mW
Derate above 25°C 2.81 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO –20 — — Vdc
(IC = –1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –20 — — Vdc
(IC = –10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –3.0 — — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICBO — — –100 nAdc
(VCB = –10 Vdc, IE = 0)
Emitter Cutoff Current IEBO — — –100 nAdc
(VEB = –2.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
–30 0
450 MHz 100 MHz
930
–40 –1.0
MHz IC = –4.0 mA 250
–50 –2.0
250 MHz 450
–60 –3.0
brb , (mmhos)
b ib , (mmhos)
–90 –6.0
–12 mA 930
–100 –7.0
–110 –8.0
–20 0 20 40 60 80 100 120 140 –2.4 –2.1 –1.8 –1.5 –1.2 –0.9 –0.6 –0.3 0
gib, (mmhos) grb, (mmhos)
120 14
100 MHz
110 12
–8.0 mA
100 250 930
–12 mA 10
90 IC = –4.0 mA
bfb , (mmhos)
bob , (mmhos)
80 –8.0 mA 8.0
450 –12 mA
70 6.0
60 930 4.0 450
50 IC = –4.0 mA
250
2.0
40 100 MHz
30 0
20 –2.0
–120 –100 –80 –60 –40 –20 0 20 40 –0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
gfb, (mmhos) gob, (mmhos)
1000
900
800
700
600
500
400
300 VCE = –10 V
f = 100 MHz
200
100
0
0 –2.0 –4.0 –6.0 –8.0 –10 –12 –14 –16 –18 –20
IC, COLLECTOR CURRENT (mA)
Amplifier Transistor
NPN Silicon MPSL01
COLLECTOR
3
2
BASE
1
EMITTER
1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 120 Vdc
Collector – Base Voltage VCBO 140 Vdc
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 150 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 120 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 140 — Vdc
(IC = 100 µAdc, IE = 0 )
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — Vdc
(IE = 10 µAdc, IC = 0)
Collector Cutoff Current ICBO — 1.0 µAdc
(VCB = 75 Vdc, IE = 0)
Emitter Cutoff Current IEBO — 100 nAdc
(VEB = 4.0 Vdc, IC = 0)
25°C
100
– 55°C
50
30
20
10
7.0
5.0
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
1.0
0.9
0.8
0.7
IC = 1.0 mA 10 mA 30 mA 100 mA
0.6
0.5
0.4
0.3
0.2
0.1
0
0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IB, BASE CURRENT (mA)
101
VCE = 30 V
100
IC, COLLECTOR CURRENT ( µA)
10–1 TJ = 125°C
IC = ICES
10–2 75°C
25°C
10–4
10–5
0.4 0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6
VBE, BASE–EMITTER VOLTAGE (VOLTS)
100
70 TJ = 25°C
50
30
VBB VCC
C, CAPACITANCE (pF)
10.2 V
– 8.8 V 30 V 20
Vin
100 3.0 k RC 10
0.25 µF Cibo
10 µs RB 7.0
INPUT PULSE Vout 5.0
5.1 k
3.0 Cobo
tr, tf ≤ 10 ns Vin 100 1N914
DUTY CYCLE = 1.0% 2.0
1.0
Values Shown are for IC @ 10 mA 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20
VR, REVERSE VOLTAGE (VOLTS)
1000 5000
IC/IB = 10 tf @ VCC = 120 V IC/IB = 10
3000
500 TJ = 25°C TJ = 25°C
2000
300 tr @ VCC = 120 V tf @ VCC = 30 V
200 1000
tr @ VCC = 30 V
t, TIME (ns)
t, TIME (ns)
100 500
10 50
0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Amplifier Transistor
PNP Silicon MPSL51
COLLECTOR
3
2
BASE
1
EMITTER
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO –100 — Vdc
(IC = –1.0 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –100 — Vdc
(IC = –100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –4.0 — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICBO — –1.0 µAdc
(VCB = –50 Vdc, IE = 0)
Emitter Cutoff Current IEBO — –100 nAdc
(VEB = –3.0 Vdc, IC = 0)
150
TJ = 125°C
h FE, CURRENT GAIN
100
25°C
70
50
– 55°C
30 VCE = – 1.0 V
VCE = – 5.0 V
20
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100
IC, COLLECTOR CURRENT (mA)
1.0
0.9
0.8
0.7
0.6
IC = 1.0 mA 10 mA 30 mA 100 mA
0.5
0.4
0.3
0.2
0.1
0
0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50
IB, BASE CURRENT (mA)
103
VCE = 30 V
102
IC, COLLECTOR CURRENT ( µA)
IC = ICES
101
TJ = 125°C
100
75°C
10–1
REVERSE FORWARD
10–2 25°C
10–3
0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
VBE, BASE–EMITTER VOLTAGE (VOLTS)
100
70 TJ = 25°C
VBB VCC 50
+ 8.8 V –30 V
30
C, CAPACITANCE (pF)
10.2 V
20 Cibo
100 3.0 k RC
Vin
Vout 10
10 µs 0.25 µF RB 7.0
INPUT PULSE 5.0 Cobo
5.1 k
tr, tf ≤ 10 ns Vin 100 1N914 3.0
DUTY CYCLE = 1.0% 2.0
1.0
Values Shown are for IC @ 10 mA 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20
VR, REVERSE VOLTAGE (VOLTS)
1000 2000
700 IC/IB = 10
TJ = 25°C tr @ VCC = 120 V 1000
500 IC/IB = 10 tf @ VCC = 120 V
700 TJ = 25°C
300
tr @ VCC = 30 V 500
200
tf @ VCC = 30 V
t, TIME (ns)
t, TIME (ns)
300
100 200
70 ts @ VCC = 120 V
50 100
70
30
50
20 td @ VBE(off) = 1.0 V
VCC = 120 V 30
10 20
0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2
BASE
1
EMITTER
MAXIMUM RATINGS
Rating Symbol Value Unit 1
2
Collector – Emitter Voltage VCEO Vdc 3
MPSW01 30
MPSW01A 40 CASE 29–05, STYLE 1
Collector – Base Voltage VCBO Vdc TO–92 (TO–226AE)
MPSW01 40
MPSW01A 50
Emitter – Base Voltage VEBO 5.0 Vdc
Collector Current — Continuous IC 1000 mAdc
Total Device Dissipation @ TA = 25°C PD 1.0 Watts
Derate above 25°C 8.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 2.5 Watts
Derate above 25°C 20 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 10 mAdc, IB = 0) MPSW01 30 —
MPSW01A 40 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 µAdc, IE = 0) MPSW01 40 —
MPSW01A 50 —
Emitter – Base Breakdown Voltage V(BR)EBO 5.0 — Vdc
(IE = 100 mAdc, IC = 0)
Collector Cutoff Current ICBO µAdc
(VCB = 30 Vdc, IE = 0) MPSW01 — 0.1
(VCB = 40 Vdc, IE = 0) MPSW01A — 0.1
Emitter Cutoff Current IEBO — 0.1 µAdc
(VEB = 3.0 Vdc, IC = 0)
300 1.0
TJ = 25°C
0.6
100
IC =
0.4 1000 mA
70 IC =
VCE = 1.0 V IC = 500 mA
IC = IC = IC =
50 TJ = 25°C 0.2 250 mA
10 mA 50 mA 100 mA
30 0
10 20 50 100 200 500 1000 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
1.0 –0.8
qVB , TEMPERATURE COEFFICIENT (mV/°C)
TJ = 25°C
VBE(sat) @ IC/IB = 10
0.8 –1.2
V, VOLTAGE (VOLTS)
0.4 –2.0
0 –2.8
1.0 2.0 5.0 10 20 50 100 200 500 1000 1.0 2.0 5.0 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
TJ = 25°C
200
60
C, CAPACITANCE (pF)
100 40 Cibo
70
VCE = 10 V
20
50 TJ = 25°C
f = 20 MHz
Cobo
30 0
10 20 50 100 200 1000 Cobo 5.0 10 15 20 25
IC, COLLECTOR CURRENT (mA) Cibo 1.0 2.0 3.0 4.0 5.0
VR, REVERSE VOLTAGE (VOLTS)
Figure 5. Current Gain — Bandwidth Product
Figure 6. Capacitance
1k
1.0 s 1.0 ms 100 ms
IC , COLLECTOR CURRENT (mA)
500
200
TA = 25°C TC = 25°C
100 DUTY CYCLE ≤ 10%
50 CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
20 MPSW01
MPSW01A
10
1.0 2.0 5.0 10 20 30 40
VCE, COLLECTOR–EMITTER VOLTAGE (V)
2
BASE
1
EMITTER
1
2
3
MAXIMUM RATINGS
Rating Symbol MPSW05 MPSW06 Unit CASE 29–05, STYLE 1
Collector – Emitter Voltage VCEO 60 80 Vdc TO–92 (TO–226AE)
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) MPSW05 60 —
MPSW06 80 —
Emitter – Base Breakdown Voltage V(BR)EBO 4.0 — Vdc
(IE = 100 mAdc, IC = 0)
Collector Cutoff Current ICES µAdc
(VCE = 40 Vdc, IB = 0) MPSW05 — 0.5
(VCE = 60 Vdc, IB = 0) MPSW06 — 0.5
Collector Cutoff Current ICBO µAdc
(VCB = 40 Vdc, IE = 0) MPSW05 — 0.1
(VCB = 60 Vdc, IE = 0) MPSW06 — 0.1
Emitter Cutoff Current IEBO — 0.1 µAdc
(VEB = 3.0 Vdc, IC = 0)
400
200
25°C
–55°C
100
80
60
40
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA)
1.0 1.0
TJ = 25°C TJ = 25°C
0.8 0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
50
IC = 10 mA 100 mA 250 mA 500 mA
0.6 mA 0.6 VBE(on) @ VCE = 1.0 V
0.4 0.4
0.2 0.2
VCE(sat) @ IC/IB = 10
0 0
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–1.2
40 Cibo
C, CAPACITANCE (pF)
–1.6
20
θVB for VBE
–2.0
10
8.0
–2.4
6.0
Cobo
–2.8 4.0
0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
300
VCE = 2.0 V
200 TJ = 25°C DUTY CYCLE ≤ 10%
Figure 6. Current–Gain — Bandwidth Product Figure 7. Active Region — Safe Operating Area
2
BASE
1
EMITTER
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 300 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector–Base Breakdown Voltage V(BR)CBO 300 — Vdc
(IC = 100 µAdc, IE = 0)
Emitter–Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 100 µAdc, IC = 0)
Collector Cutoff Current ICBO — 0.2 µAdc
(VCB = 200 Vdc, IE = 0)
Emitter Cutoff Current IEBO — 0.1 µAdc
(VEB = 6.0 Vdc, IC = 0)
ON CHARACTERISTICS(1)
DC Current Gain hFE —
(IC = 1.0 mAdc, VCE = 10 Vdc) 25 —
(IC = 10 mAdc, VCE = 10 Vdc) 40 —
(IC = 30 mAdc, VCE = 10 Vdc) 40 —
Collector–Emitter Saturation Voltage VCE(sat) — 0.75 Vdc
(IC = 30 mAdc, IB = 3.0 mAdc)
Base–Emitter On Voltage VBE(on) — 0.85 Vdc
(IC = 30 mAdc, VCE = 10 Vdc)
SMALL–SIGNAL CHARACTERISTICS
Current–Gain — Bandwidth Product fT 45 — MHz
(IC = 10 mAdc, VCE = 20 Vdc, f = 20 MHz)
Collector–Base Capacitance Ccb — 3.0 pF
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)
70 0.4
IC = 30 mA
–55°C 0.3
50
IC = 20 mA
0.2
30 IC = 10 mA
0.1
20 0
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 30
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
1.4 2.5
RθV, TEMPERATURE COEFFICIENTS (mV/°C)
1.2 TJ = 25°C
2.0
1.5
IC
IB
+ 10
25°C to 125°C
1.0
V, VOLTAGE (VOLTS)
1.0
0.4 –1.0
5.0 –55°C to 125°C
–1.5 RθVB for VBE
0.2 VCE(sat) @ IC/IB = 10 –2.0
0 –2.5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
50
20
10 TJ = 25°C
30
VCE = 20 V
7.0
f = 20 MHz
5.0 Ccb 20
3.0
2.0
1.0 10
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1k
CURRENT LIMIT
500 THERMAL LIMIT
IC, COLLECTOR CURRENT (mA)
SECOND BREAKDOWN
LIMIT
200 1.0 ms
1.0 s 100 µs
100
50
TA = 25°C
20
DUTY CYCLE ≤ 10%
10
10 20 50 100 200 300
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
EMITTER 1
1
2
3
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCES 30 Vdc
Collector – Base Voltage VCBO 30 Vdc
Emitter – Base Voltage VEBO 10 Vdc
Collector Current — Continuous IC 1.0 Adc
Total Device Dissipation @ TA = 25°C PD 1.0 Watts
Derate above 25°C 8.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 2.5 Watts
Derate above 25°C 20 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CES 30 — Vdc
(IC = 100 µAdc, VBE = 0)
Collector Cutoff Current ICBO — 100 nAdc
(VCB = 30 Vdc, IE = 0)
Emitter Cutoff Current IEBO — 100 nAdc
(VEB = 10 Vdc, IC = 0)
REV 1
ON CHARACTERISTICS(1)
DC Current Gain hFE —
(IC = 10 mAdc, VCE = 5.0 Vdc) MPSW13 5,000 —
MPSW14 10,000 —
SMALL–SIGNAL CHARACTERISTICS
Current–Gain — Bandwidth Product(2) fT 125 — MHz
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
TA = 25°C TC = 25°C
200
1.5 2.0 5.0 10 20 30
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
200 k 3.0
VCE , COLLECTOR EMITTER VOLTAGE (VOLTS)
TJ = 125°C
TJ = 25°C
100 k IC = IC = IC = IC =
2.5
70 k 50 mA 250 mA 500 mA
h FE , DC CURRENT GAIN
10 mA
50 k 25°C
30 k 2.0
20 k
1.5
10 k
7.0 k
5.0 k –55°C 1.0
VCE = 5.0 V
3.0 k
2.0 k 0.5
5.0 7.0 10 20 30 50 70 100 200 300 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
–55°C TO 25°C
1.2 –3.0
0.6 –6.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4.0 20
VCE = 5.0 V
h FE , SMALL–SIGNAL CURRENT GAIN
TJ = 25°C
TJ = 25°C
2.0 f = 100 MHz
C, CAPACITANCE (pF)
10
1.0 7.0
Cibo
0.8
5.0
0.6
Cobo
0.4 3.0
0.2 2.0
0.5 1.0 2.0 5.0 10 20 50 100 200 500 0.04 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
COLLECTOR
3
2
BASE
1 1
2
EMITTER 3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 300 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector–Base Breakdown Voltage V(BR)CBO 300 — Vdc
(IC = 100 µAdc, IE = 0)
Emitter–Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 100 µAdc, IC = 0)
Collector Cutoff Current ICBO — 0.1 µAdc
(VCB = 200 Vdc, IE = 0)
Emitter Cutoff Current IEBO — 0.1 µAdc
(VEB = 6.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 1.0 mAdc, VCE = 10 Vdc) 25 —
(IC = 10 mAdc, VCE = 10 Vdc) 40 —
(IC = 30 mAdc, VCE = 10 Vdc) 40 —
Collector–Emitter Saturation Voltage VCE(sat) — 0.5 Vdc
(IC = 20 mAdc, IB = 2.0 mAdc)
Base–Emitter Saturation Voltage VBE(sat) — 0.9 Vdc
(IC = 20 mAdc, IB = 2.0 mAdc)
SMALL–SIGNAL CHARACTERISTICS
Current–Gain — Bandwidth Product fT 50 — MHz
(IC = 10 mAdc, VCE = 20 Vdc, f = 20 MHz)
Collector Capacitance Ccb — 3.0 pF
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)
70 0.4
IC = 30 mA
–55°C 0.3
50
IC = 20 mA
0.2
30 IC = 10 mA
0.1
20 0
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 0.1 0.2 0.5 1.0 2.0 5.0 10 20 30
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
1.4 2.5
RθV, TEMPERATURE COEFFICIENTS (mV/°C)
1.2 TJ = 25°C
2.0
1.5
IC
IB
+ 10
25°C to 125°C
1.0
V, VOLTAGE (VOLTS)
1.0
0.4 –1.0
5.0 –55°C to 125°C
–1.5 RθVB for VBE
0.2 VCE(sat) @ IC/IB = 10 –2.0
0 –2.5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
50
20
10 TJ = 25°C
30
VCE = 20 V
7.0
f = 20 MHz
5.0 Ccb 20
3.0
2.0
1.0 10
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
1k
CURRENT LIMIT
500 THERMAL LIMIT
IC, COLLECTOR CURRENT (mA)
SECOND BREAKDOWN
LIMIT
200 1.0 ms
1.0 s 100 µs
100
50
TA = 25°C
20
DUTY CYCLE ≤ 10%
10
10 20 50 100 200 300
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
BASE
*Motorola Preferred Device
2
EMITTER 1
1
MAXIMUM RATINGS 2
3
Rating Symbol MPSW45 MPSW45A Unit
Collector – Emitter Voltage VCES 40 50 Vdc CASE 29–05, STYLE 1
TO–92 (TO–226AE)
Collector – Base Voltage VCBO 50 60 Vdc
Emitter – Base Voltage VEBO 12 12 Vdc
Collector Current — Continuous IC 1.0 1.0 Adc
Total Device Dissipation @ TA = 25°C PD 1.0 Watts
Derate above 25°C 8.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 2.5 Watts
Derate above 25°C 20 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CES Vdc
(IC = 100 µAdc, VBE = 0) MPSW45 40 —
MPSW45A 50 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) MPSW45 50 —
MPSW45A 60 —
Emitter – Base Breakdown Voltage V(BR)EBO 12 — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO nAdc
(VCB = 30 Vdc, IE = 0) MPSW45 — 100
(VCB = 40 Vdc, IE = 0) MPSW45A — 100
Emitter Cutoff Current IEBO — 100 nAdc
(VEB = 10 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
RS
in
en
IDEAL
TRANSISTOR
500 2.0
BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz
RS ≈ 0 1.0
200
0.7
en, NOISE VOLTAGE (nV)
100 µA 100 µA
0.1
20
0.07
IC = 1.0 mA 10 µA
0.05
10
0.03
5.0 0.02
10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
200 14
VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)
10
70 IC = 10 µA 10 µA
8.0
50
100 µA
6.0
30 100 µA
4.0 IC = 1.0 mA
20
1.0 mA
2.0
10 0
1.0 2.0 5.0 10 20 50 100 200 500 100 1.0 2.0 5.0 10 20 50 100 200 500 100
RS, SOURCE RESISTANCE (kΩ) 0 RS, SOURCE RESISTANCE (kΩ) 0
20 4.0
VCE = 5.0 V
7.0 Cibo
1.0
5.0 Cobo 0.8
0.6
3.0 0.4
2.0 0.2
0.04 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 0.5 1.0 2.0 0.5 10 20 50 100 200 500
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
50 k 25°C
30 k 2.0
20 k
1.5
10 k
7.0 k
– 55°C
5.0 k 1.0
VCE = 5.0 V
3.0 k
2.0 k 0.5
5.0 7.0 10 20 30 50 70 100 200 300 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
1.6 – 1.0
RθV, TEMPERATURE COEFFICIENTS (mV/°C)
0.6 – 6.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
t, TIME (ms)
1.0 k
FIGURE A
700 1.0 ms
500
IC, COLLECTOR CURRENT (mA)
tP
300 TC = 25°C 100 µs
TA = 25°C PP PP
200 1.0 s
100
70
50
t1
30
CURRENT LIMIT
20 THERMAL LIMIT 1/f
+ t1 f + ttP1
SECOND BREAKDOWN LIMIT
10 DUTY CYCLE
0.4 0.6 1.0 2.0 4.0 6.0 10 20 40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS) PEAK PULSE POWER = PP
Figure 13. Active Region Safe Operating Area Design Note: Use of Transient Thermal Resistance Data
BASE
1
EMITTER
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage MPSW51 VCEO –30 Vdc 1
MPSW51A –40 2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = –1.0 mAdc, IB = 0) MPSW51 –30 —
MPSW51A –40 —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = –100 mAdc, IE = 0) MPSW51 –40 —
MPSW51A –50 —
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — Vdc
(IE = –100 mAdc, IC = 0)
Collector Cutoff Current ICBO µAdc
(VCB = –30 Vdc, IE = 0) MPSW51 — –0.1
(VCB = –40 Vdc, IE = 0) MPSW51A — –0.1
Emitter Cutoff Current IEBO — –0.1 µAdc
(VEB = –3.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
200 –1.0
100
–0.6
70
VCE = –1.0 V
50 TJ = 25°C –0.4
–0.2
TJ = 25°C
20 0
–10 –20 –50 –100 –200 –500 –1000 –0.01 –0.02 –0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
–1.0 –0.8
qV B, TEMPERATURE COEFFICIENT (mV/ °C)
TJ = 25°C
–0.6 –1.6
VBE(ON) @ VCE = –1.0 V
qVB for VBE
–0.4 –2.0
–0.2 –2.4
VCE(SAT) @ IC/IB = 10
0 –2.8
–1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –1000 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
TJ = 25°C
200
120
C, CAPACITANCE (pF)
VCE = –10 V
100 TJ = 25°C 80
f = 20 MHz
70 Cibo
40
50
Cobo
30 0
–10 –20 –50 –100 –200 –500 –1000 Cobo –5.0 –10 –15 –20 –25
Cibo –1.0 –2.0 –3.0 –4.0 –5.0
IC, COLLECTOR CURRENT (mA)
VR, REVERSE VOLTAGE (VOLTS)
Figure 5. Current Gain — Bandwidth Product Figure 6. Capacitance
–1.0 k
1.0 ms 1.0 ms 100 ms
–500
I C , COLLECTOR CURRENT (mA)
TA = 25°C
TC = 25°C
–200
–100
DUTY CYCLE ≤ 10%
–50 MPSW51
MPSW51A
CURRENT LIMIT
–20 THERMAL LIMIT
SECOND BREAKDOWN LIMIT
–10
–1.0 –2.0 –5.0 –10 –20 –30 –40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
2
BASE
1
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol MPSW55 MPSW56 Unit
Collector – Emitter Voltage VCEO –60 –80 Vdc CASE 29–05, STYLE 1
TO–92 (TO–226AE)
Collector – Base Voltage VCBO –60 –80 Vdc
Emitter – Base Voltage VEBO –4.0 Vdc
Collector Current — Continuous IC –500 mAdc
Total Device Dissipation @ TA = 25°C PD 1.0 Watt
Derate above 25°C 8.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 2.5 Watts
Derate above 25°C 20 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO Vdc
(IC = –1.0 mAdc, IB = 0) MPSW55 –60 —
MPSW56 –80 —
Emitter – Base Breakdown Voltage V(BR)EBO –4.0 — Vdc
(IE = –100 mAdc, IC = 0)
Collector Cutoff Current ICES µAdc
(VCE = –40 Vdc, IB = 0) MPSW55 — –0.5
(VCE = –60 Vdc, IB = 0) MPSW56 — –0.5
Collector Cutoff Current ICBO µAdc
(VCB = –40 Vdc, IE = 0) MPSW55 — –0.1
(VCB = –60 Vdc, IE = 0) MPSW56 — –0.1
Emitter Cutoff Current IEBO — –0.1 µAdc
(VEB = –3.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
400
TJ = 125°C
VCE = –1.0 V
hFE, DC CURRENT GAIN
200
25°C
–55°C
100
80
60
40
–0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500
IC, COLLECTOR CURRENT (mA)
–1.0 –1.0
TJ = 25°C TJ = 25°C
–0.8 –0.8
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
–0.2 –0.2
VCE(sat) @ IC/IB = 10
0 0
–0.05 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500
IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)
C, CAPACITANCE (pF)
–1.6 30
20
–2.0 θVB for VBE
10 Cobo
–2.4
7.0
–2.8 5.0
–0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
200
VCE = –2.0 V
TJ = 25°C DUTY CYCLE ≤ 10%
BASE
2
EMITTER 1
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
Preferred devices are Motorola recommended choices for future use and best overall value.
ON CHARACTERISTICS(1)
DC Current Gain hFE —
(IC = –10 mAdc, VCE = –5.0 Vdc) MPSW63 5,000 —
MPSW64 10,000 —
SMALL–SIGNAL CHARACTERISTICS
Current–Gain — Bandwidth Product(2) fT 125 — MHz
(IC = –10 mAdc, VCE = –5.0 Vdc, f = 100 MHz)
100
70
50 –10 V
25°C
30 VCE = –2.0 V
20
–5.0 V
10
7.0 –55°C
5.0
3.0
2.0
–0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300
IC, COLLECTOR CURRENT (mA)
–2.0 –2.0
VCE , COLLECTOR–EMITTER VOLTAGE (VOLTS)
TJ = 25°C TJ = 25°C
–1.8
–1.6 VBE(sat) @ IC/IB = 100
V, VOLTAGE (VOLTS)
–1.6
–1.2 –50 mA –100 mA –175 mA –300 mA
VBE(on) @ VCE = –5.0 V –1.4
20 –2 k
Cobo CURRENT LIMIT
15 THERMAL LIMIT
100 ms
IC , COLLECTOR CURRENT (mA)
SECOND BREAKDOWN LIMIT
–1 k
Cibo
C, CAPACITANCE (pF)
10 1.0 mS
7.0 –500
TJ = 25°C 1.0 s
5.0
f = 1.0 MHz TA = 25°C TC = 25°C
–200
3.0
DUTY CYCLE ≤ 10%
2.0 –100
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –30 –1.5 –2.0 –5.0 –10 –20 –30
VR, REVERSE VOLTAGE (VOLTS) VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
2
BASE
1
EMITTER
1
2
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 125 °C/W
Thermal Resistance, Junction to Case RqJC 50 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO –300 — Vdc
(IC = –1.0 mAdc, IB = 0)
Collector–Base Breakdown Voltage V(BR)CBO –300 — Vdc
(IC = –100 µAdc, IE = 0)
Emitter–Base Breakdown Voltage V(BR)EBO –5.0 — Vdc
(IE = –100 µAdc, IC = 0)
Collector Cutoff Current ICBO — –0.25 µAdc
(VCB = –200 Vdc, IE = 0)
Emitter Cutoff Current IEBO — –0.1 µAdc
(VEB = –3.0 Vdc, IC = 0)
Preferred devices are Motorola recommended choices for future use and best overall value.
ON CHARACTERISTICS(1)
DC Current Gain hFE —
(IC = –1.0 mAdc, VCE = –10 Vdc) 25 —
(IC = –10 mAdc, VCE = –10 Vdc) 40 —
(IC = –30 mAdc, VCE = –10 Vdc) 25 —
Collector–Emitter Saturation Voltage VCE(sat) — –0.5 Vdc
(IC = –20 mAdc, IB = –2.0 mAdc)
Base–Emitter Saturation Voltage VBE(sat) — –0.9 Vdc
(IC = –20 mAdc, IB = –2.0 mAdc)
SMALL–SIGNAL CHARACTERISTICS
Current–Gain — Bandwidth Product fT 50 — MHz
(IC = –10 mAdc, VCE = –20 Vdc, f = 20 MHz)
Collector–Base Capacitance Ccb — 6.0 pF
(VCB = –20 Vdc, IE = 0, f = 1.0 MHz)
25°C
100 –0.5
70 –55°C –0.4
–0.3
50
IC = –10 mA
–0.2
30
–0.1
20 0
–1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –30
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
1.0
VBE(sat) @ IC/IB = 10 0.5 RqVC FOR VCE(sat)
–0.8 –55°C TO 25°C
0
–0.6 VBE(on) @ VCE = –10 V –0.5
30
C, CAPACITANCE (pF)
50
20
TJ = 25°C
VCE = –20 V
10 30 f = 20 MHz
7.0 Ccb
5.0
20
3.0
2.0
1.0 10
–0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
–1 k
–500
IC , COLLECTOR CURRENT (mA)
100 ms
–200
1.0 s CURRENT LIMIT
–100 THERMAL LIMIT
1.0 ms SECOND BREAKDOWN
LIMIT
–50
TC = 25°C MPSW92
TA = 25°C
–20
DUTY CYCLE ≤ 10%
–10
–10 –20 –50 –100 –200 –300
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
2
1
2 1
BASE EMITTER
MAXIMUM RATINGS (TA = 25°C) CASE 318D–03, STYLE 1
Rating Symbol Value Unit SC–59
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Power Dissipation PD 200 mW
Junction Temperature TJ 150 °C
Storage Temperature Tstg – 55 ~ +150 °C
DEVICE MARKING
Marking Symbol
ECX
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.
(Replaces MSA1022–BT1/D)
2
1
2 1
BASE EMITTER
MAXIMUM RATINGS (TA = 25°C) CASE 318D–03, STYLE 1
Rating Symbol Value Unit SC–59
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Power Dissipation PD 200 mW
Junction Temperature TJ 150 °C
Storage Temperature Tstg – 55 ~ +150 °C
DEVICE MARKING
Marking Symbol
ARX
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 3
3
2 1
2
BASE EMITTER 1
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Power Dissipation PD 200 mW
Junction Temperature TJ 150 °C
Storage Temperature Tstg – 55 ~ +150 °C
DEVICE MARKING
CRX
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.
replaces MSB710–QT1/D
This PNP Silicon Epitaxial Planar Transistor is designed for general purpose
amplifier applications. This device is housed in the SC–70/SOT–323 package
which is designed for low power surface mount applications. PNP GENERAL
• High hFE, 210 – 460 PURPOSE AMPLIFIER
• Low VCE(sat), < 0.5 V TRANSISTORS
SURFACE MOUNT
• Available in 8 mm, 7–inch/3000 Unit Tape and Reel
1
2
DEVICE MARKING
MSB1218A–RT1 = BR
1 2
THERMAL CHARACTERISTICS BASE EMITTER
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Min Max Unit
Collector–Emitter Breakdown Voltage (IC = 2.0 mAdc, IB = 0) V(BR)CEO 45 — Vdc
Collector–Base Breakdown Voltage (IC = 10 µAdc, IE = 0) V(BR)CBO 45 — Vdc
Emitter–Base Breakdown Voltage (IE = 10 µAdc, IE = 0) V(BR)EBO 7.0 — Vdc
Collector–Base Cutoff Current (VCB = 20 Vdc, IE = 0) ICBO — 0.1 µA
Collector–Emitter Cutoff Current (VCE = 10 Vdc, IB = 0) ICEO — 100 µA
DC Current Gain(2) (VCE = 10 Vdc, IC = 2.0 mAdc) hFE1 210 340 —
Collector–Emitter Saturation Voltage(2) (IC = 100 mAdc, IB = 10 mAdc) VCE(sat) — 0.5 Vdc
1. Device mounted on a FR–4 glass epoxy printed circuit board using the minimum recommended footprint.
2. Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
150 90
300 µA
250
100 60 200
150
RθJA = 833°C/W 100
50 30
IB = 50 µA
0 0
– 50 0 50 100 150 0 3 6 9 12 15
TA, AMBIENT TEMPERATURE (°C) VCE, COLLECTOR VOLTAGE (V)
1000 2
TA = – 25°C
100 1
0.5
10 0
0.1 1 10 100 0.01 0.1 1 10 100
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
900
800
COLLECTOR VOLTAGE (mV)
700
600
500
400
300
TA = 25°C
200
VCE = 5 V
100
0
0.2 0.5 1 5 10 20 40 60 80 100 150 200
IC, COLLECTOR CURRENT (mA)
Figure 5. On Voltage
12 12
Cib, INPUT CAPACITANCE (pF)
10 8
9 6
8 4
7 2
6 0
0 1 2 3 4 0 10 20 30 40
VEB (V) VCB (V)
3
2 1
2
BASE EMITTER 1
MAXIMUM RATINGS (TA = 25°C)
Rating Symbol Value Unit
CASE 318D–03, STYLE 1
Collector–Base Voltage V(BR)CBO 30 Vdc SC–59
Collector–Emitter Voltage V(BR)CEO 20 Vdc
Emitter–Base Voltage V(BR)EBO 5.0 Vdc
Collector Current — Continuous IC 30 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Power Dissipation PD 200 mW
Junction Temperature TJ 150 °C
Storage Temperature Tstg – 55 ~ +150 °C
DEVICE MARKING
Marking Symbol
VBX VCX
MSC2295–BT1 MSC2295–CT1
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.
2
1
2 1
BASE EMITTER
MAXIMUM RATINGS (TA = 25°C) CASE 318D–03, STYLE 1
Rating Symbol Value Unit SC–59
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Power Dissipation PD 200 mW
Junction Temperature TJ 150 °C
Storage Temperature Tstg – 55 ~ +150 °C
Marking Symbol
1SX
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.
3
2 1
MAXIMUM RATINGS (TA = 25°C) BASE EMITTER 2
1
Rating Symbol Value Unit
Collector–Base Voltage V(BR)CBO 60 Vdc
CASE 318D–03, STYLE 1
Collector–Emitter Voltage V(BR)CEO 50 Vdc SC–59
Emitter–Base Voltage V(BR)EBO 7.0 Vdc
Collector Current — Continuous IC 100 mAdc
Collector Current — Peak IC(P) 200 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Power Dissipation PD 200 mW
Junction Temperature TJ 150 °C
Storage Temperature Tstg – 55 ~ +150 °C
Marking Symbol
YRX YSX
MSD601–RT1 MSD601–ST1
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
2
2 1 1
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Power Dissipation PD 200 mW
Junction Temperature TJ 150 °C
Storage Temperature Tstg – 55 ~ +150 °C
Marking Symbol
WRX
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
2
1
2 1
BASE EMITTER
MAXIMUM RATINGS (TA = 25°C) CASE 318D–03, STYLE 1
Rating Symbol Value Unit SC–59
Collector–Base Voltage V(BR)CBO 25 Vdc
Collector–Emitter Voltage V(BR)CEO 20 Vdc
Emitter–Base Voltage V(BR)EBO 12 Vdc
Collector Current — Continuous IC 500 mAdc
Collector Current — Peak IC(P) 1000 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Power Dissipation PD 200 mW
Junction Temperature TJ 150 °C
Storage Temperature Tstg – 55 ~ +150 °C
Marking Symbol
1DRX
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.
This NPN Silicon Epitaxial Planar Transistor is designed for general purpose
amplifier applications. This device is housed in the SC-70/SOT-323 package
which is designed for low power surface mount applications. NPN GENERAL
• High hFE, 210 – 460 PURPOSE AMPLIFIER
TRANSISTORS
• Low VCE(sat), < 0.5 V
SURFACE MOUNT
• Available in 8 mm, 7-inch/3000 Unit Tape and Reel
THERMAL CHARACTERISTICS
Rating Symbol Max Unit
Power Dissipation(1) PD 150 mW
Junction Temperature TJ 150 °C
1 2
Storage Temperature Range Tstg – 55 ~ + 150 °C BASE EMITTER
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Min Max Unit
Collector-Emitter Breakdown Voltage (IC = 2.0 mAdc, IB = 0) V(BR)CEO 50 — Vdc
Collector-Base Breakdown Voltage (IC = 10 µAdc, IE = 0) V(BR)CBO 60 — Vdc
Emitter-Base Breakdown Voltage (IE = 10 µAdc, IE = 0) V(BR)EBO 7.0 — Vdc
Collector-Base Cutoff Current (VCB = 20 Vdc, IE = 0) ICBO — 0.1 µA
Collector-Emitter Cutoff Current (VCE = 10 Vdc, IB = 0) ICEO — 100 µA
DC Current Gain(2) —
(VCE = 10 Vdc, IC = 2.0 mAdc) hFE1 210 340
(VCE = 2.0 Vdc, IC = 100 mAdc) hFE2 90 —
Collector-Emitter Saturation Voltage(2) VCE(sat) — 0.5 Vdc
(IC = 100 mAdc, IB = 10 mAdc)
1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
40 120 µA
150
100 µA
30
80 µA
100
20 60 µA
RθJA = 833°C/W 40 µA
50 10 IB = 20 µA
0 0
– 50 0 50 100 150 0 2 4 6 8
TA, AMBIENT TEMPERATURE (°C) VCE, COLLECTOR VOLTAGE (V)
1000 2
TA = – 25°C
100 1
0.5
10 0
0.1 1 10 100 0.01 0.1 1 10 100
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)
900
800
COLLECTOR VOLTAGE (mV)
700
600
500
400
TA = 25°C
300
VCE = 5 V
200
100
0
0.2 0.5 1 5 10 20 40 60 80 100 150 200
IC, COLLECTOR CURRENT (mA)
Figure 5. On Voltage
6
Cib, INPUT CAPACITANCE (pF)
18
12
2
10 1
0 1 2 3 4 0 10 20 30 40
VEB (V) VCB (V)
Use the Device Number to order the 7 inch/3000 unit reel. EMITTER
(GROUND)
CASE 318D–03, STYLE 1
(SC–59)
THERMAL CHARACTERISTICS
Thermal Resistance — Junction–to–Ambient (surface mounted) RθJA 625 °C/W
Operating and Storage Temperature Range TJ, Tstg – 65 to +150 °C
Maximum Temperature for Soldering Purposes, TL 260 °C
Time in Solder Bath 10 Sec
REV 5
OFF CHARACTERISTICS
Collector–Base Cutoff Current (VCB = 50 V, IE = 0) ICBO — — 100 nAdc
Collector–Emitter Cutoff Current (VCE = 50 V, IB = 0) ICEO — — 500 nAdc
Emitter–Base Cutoff Current MUN2111T1 IEBO — — 0.5 mAdc
(VEB = 6.0 V, IC = 0) MUN2112T1 — — 0.2
MUN2113T1 — — 0.1
MUN2114T1 — — 0.2
MUN2115T1 — — 0.9
MUN2116T1 — — 1.9
MUN2130T1 — — 4.3
MUN2131T1 — — 2.3
MUN2132T1 — — 1.5
MUN2133T1 — — 0.18
MUN2134T1 — — 0.13
Collector–Base Breakdown Voltage (IC = 10 µA, IE = 0) V(BR)CBO 50 — — Vdc
Collector–Emitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0) V(BR)CEO 50 — — Vdc
ON CHARACTERISTICS(3)
DC Current Gain MUN2111T1 hFE 35 60 —
(VCE = 10 V, IC = 5.0 mA) MUN2112T1 60 100 —
MUN2113T1 80 140 —
MUN2114T1 80 140 —
MUN2115T1 160 250 —
MUN2116T1 160 250 —
MUN2130T1 3.0 5.0 —
MUN2131T1 8.0 15 —
MUN2132T1 15 27 —
MUN2133T1 80 140 —
MUN2134T1 80 130 —
Collector–Emitter Saturation Voltage VCE(sat) Vdc
(IC = 10 mA, IB = 0.3 mA) MUN2111T1 — — 0.25
MUN2112T1 — — 0.25
MUN2113T1 — — 0.25
MUN2114T1 — — 0.25
MUN2115T1 — — 0.25
MUN2130T1 — — 0.25
(IC = 10 mA, IB = 5.0 mA) MUN2131T1 — — 0.25
(IC = 10 mA, IB = 1.0 mA) MUN2116T1 — — 0.25
MUN2132T1 — — 0.25
MUN2134T1 — — 0.25
Output Voltage (on) VOL Vdc
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kΩ) MUN2111T1 — — 0.2
MUN2112T1 — — 0.2
MUN2114T1 — — 0.2
MUN2115T1 — — 0.2
MUN2116T1 — — 0.2
MUN2130T1 — — 0.2
MUN2131T1 — — 0.2
MUN2132T1 — — 0.2
MUN2133T1 — — 0.2
MUN2134T1 — — 0.2
(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 kΩ) MUN2113T1 — — 0.2
3. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%
250
PD , POWER DISSIPATION (MILLIWATTS)
200
150
100
RθJA = 625°C/W
50
0
– 50 0 50 100 150
TA, AMBIENT TEMPERATURE (°C)
1 1000
VCE = 10 V
TA = –25°C
25°C
TA = 75°C
75°C 25°C
0.1 100
–25°C
0.01 10
0 20 40 60 80 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
75°C 25°C
f = 1 MHz
lE = 0 V
TA = –25°C
IC, COLLECTOR CURRENT (mA)
3 TA = 25°C 10
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01 VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
10
25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
0.1
0.01 10
0 20 40 60 80 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
75°C 25°C
f = 1 MHz
TA = –25°C
lE = 0 V IC, COLLECTOR CURRENT (mA)
TA = 25°C 10
3
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 9. Output Capacitance Figure 10. Output Current versus Input Voltage
100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
10 25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1 1000
IC/IB = 10
0.01 10
0 10 20 30 40 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1 100
TA = 75°C 25°C
f = 1 MHz
lE = 0 V
0.8 10 –25°C
TA = 25°C
IC, COLLECTOR CURRENT (mA)
Cob , CAPACITANCE (pF)
0.6 1
0.4 0.1
0.2 0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 14. Output Capacitance Figure 15. Output Current versus Input Voltage
100
VO = 0.2 V
TA = –25°C
V in , INPUT VOLTAGE (VOLTS)
25°C
10 75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
100
80
0.01 60
40
20
0.001 0
0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4.5 100
4 f = 1 MHz TA = 75°C 25°C
lE = 0 V
3.5 TA = 25°C
IC, COLLECTOR CURRENT (mA)
Cob , CAPACITANCE (pF)
–25°C
3
2.5
10
2
1.5
1
VO = 5 V
0.5
0 1
0 2 4 6 8 10 15 20 25 30 35 40 45 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 19. Output Capacitance Figure 20. Output Current versus Input Voltage
10 +12 V
VO = 0.2 V TA = –25°C
25°C
V in , INPUT VOLTAGE (VOLTS)
LOAD
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
Figure 21. Input Voltage versus Output Current Figure 22. Inexpensive, Unregulated Current Source
Use the Device Number to order the 7 inch/3000 unit reel. (INPUT)
PIN1 CASE 318D–03, STYLE 1
EMITTER (SC–59)
(GROUND)
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Symbol Value Unit
Collector–Base Voltage VCBO 50 Vdc
Collector–Emitter Voltage VCEO 50 Vdc
Collector Current IC 100 mAdc
Total Power Dissipation @ TA = 25°C(1) PD *200 mW
Derate above 25°C 1.6 mW/°C
THERMAL CHARACTERISTICS
Thermal Resistance — Junction–to–Ambient (surface mounted) RθJA 625 °C/W
Operating and Storage Temperature Range TJ, Tstg – 65 to +150 °C
Maximum Temperature for Soldering Purposes, TL 260 °C
Time in Solder Bath 10 Sec
REV 4
OFF CHARACTERISTICS
Collector–Base Cutoff Current (VCB = 50 V, IE = 0) ICBO — — 100 nAdc
Collector–Emitter Cutoff Current (VCE = 50 V, IB = 0) ICEO — — 500 nAdc
Emitter–Base Cutoff Current MUN2211T1 IEBO — — 0.5 mAdc
(VEB = 6.0 V, IC = 0) MUN2212T1 — — 0.2
MUN2213T1 — — 0.1
MUN2214T1 — — 0.2
MUN2215T1 — — 0.9
MUN2216T1 — — 1.9
MUN2230T1 — — 4.3
MUN2231T1 — — 2.3
MUN2232T1 — — 1.5
MUN2233T1 — — 0.18
MUN2234T1 — — 0.13
Collector–Base Breakdown Voltage (IC = 10 µA, IE = 0) V(BR)CBO 50 — — Vdc
Collector–Emitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0) V(BR)CEO 50 — — Vdc
ON CHARACTERISTICS(3)
DC Current Gain MUN2211T1 hFE 35 60 —
(VCE = 10 V, IC = 5.0 mA) MUN2212T1 60 100 —
MUN2213T1 80 140 —
MUN2214T1 80 140 —
MUN2215T1 160 350 —
MUN2216T1 160 350 —
MUN2230T1 3.0 5.0 —
MUN2231T1 8.0 15 —
MUN2232T1 15 30 —
MUN2233T1 80 200 —
MUN2234T1 80 150 —
Collector–Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA) VCE(sat) — — 0.25 Vdc
(IC = 10 mA, IB = 5 mA) MUN2230T1/MUN2231T1
(IC = 10 mA, IB = 1 mA) MUN2215T1/MUN2216T1/
MUN2232T1/MUN2233T1/MUN2234T1
Output Voltage (on) VOL Vdc
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kΩ) MUN2211T1 — — 0.2
MUN2212T1 — — 0.2
MUN2214T1 — — 0.2
MUN2215T1 — — 0.2 Vdc
MUN2216T1 — — 0.2
MUN2230T1 — — 0.2
MUN2231T1 — — 0.2
MUN2232T1 — — 0.2
MUN2233T1 — — 0.2
MUN2234T1 — — 0.2
(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 kΩ) MUN2213T1 — — 0.2
3. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%
250
PD , POWER DISSIPATION (MILLIWATTS)
200
150
100
RθJA = 625°C/W
50
0
– 50 0 50 100 150
TA, AMBIENT TEMPERATURE (°C)
0.01
0.001 10
0 20 40 60 80 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
25°C
f = 1 MHz 75°C
IE = 0 V 10 TA = –25°C
IC, COLLECTOR CURRENT (mA)
3 TA = 25°C
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
10
VO = 0.2 V TA = –25°C
25°C
V in , INPUT VOLTAGE (VOLTS)
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1 1000
VCE = 10 V
100
0.01
0.001 10
0 20 40 60 80 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
10
3 TA = 25°C
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 9. Output Capacitance Figure 10. Output Current versus Input Voltage
100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
10
75°C 25°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
TA = 75°C
25°C 75°C
1 25°C
–25°C
100
0.1
0.01 10
0 20 40 60 80 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1 100
75°C 25°C
f = 1 MHz
IE = 0 V
0.8 10 TA = –25°C
TA = 25°C IC, COLLECTOR CURRENT (mA)
Cob , CAPACITANCE (pF)
0.6 1
0.4 0.1
0.2 0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 14. Output Capacitance Figure 15. Output Current versus Input Voltage
100
VO = 0.2 V
TA = –25°C
25°C
V in , INPUT VOLTAGE (VOLTS)
10 75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1 300
IC/IB = 10 TA = –25°C TA = 75°C
0.01 100
50
0.001 0
0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
3 TA = 25°C
Cob , CAPACITANCE (pF)
2.5
TA = –25°C
2 10
1.5
0.5 VO = 5 V
0 1
0 2 4 6 8 10 15 20 25 30 35 40 45 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 19. Output Capacitance Figure 20. Output Current versus Input Voltage
10
TA = –25°C
VO= 0.2 V
V in , INPUT VOLTAGE (VOLTS)
25°C
75°C
1
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
+12 V
ISOLATED
LOAD
FROM µP OR
OTHER LOGIC
+12 V
VCC
OUT
IN
LOAD
Figure 23. Open Collector Inverter: Inverts the Input Signal Figure 24. Inexpensive, Unregulated Current Source
integrating them into a single device. In the MUN5111DW1T1 series, two BRT devices 1
2
are housed in the SOT–363 package which is ideal for low–power surface mount 3
applications where board space is at a premium. CASE 419B–01, STYLE 1
• Simplifies Circuit Design SOT–363
Q2
R2
R1
MAXIMUM RATINGS (TA = 25°C unless otherwise noted, common for Q1 and Q2)
Rating Symbol Value Unit
Collector–Base Voltage VCBO – 50 Vdc
Collector–Emitter Voltage VCEO –50 Vdc
Collector Current IC –100 mAdc
THERMAL CHARACTERISTICS
Thermal Resistance — Junction–to–Ambient (surface mounted) RθJA 833 °C/W
Operating and Storage Temperature Range TJ, Tstg – 65 to +150 °C
Total Package Dissipation @ TA = 25°C(1) PD *150 mW
DEVICE MARKING AND RESISTOR VALUES: MUN5111DW1T1 SERIES
Device Marking R1 (K) R2 (K)
MUN5111DW1T1 0A 10 10
MUN5112DW1T1 0B 22 22
MUN5113DW1T1 0C 47 47
MUN5114DW1T1 0D 10 47
MUN5115DW1T1(2) 0E 10 ∞
MUN5116DW1T1(2) 0F 4.7 ∞
MUN5130DW1T1(2) 0G 1.0 1.0
MUN5131DW1T1(2) 0H 2.2 2.2
MUN5132DW1T1(2) 0J 4.7 4.7
MUN5133DW1T1(2) 0K 4.7 47
MUN5134DW1T1(2) 0L 22 47
MUN5135DW1T1(2) 0M 2.2 47
1. Device mounted on a FR–4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New resistor combinations. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
ON CHARACTERISTICS(3)
DC Current Gain MUN5111DW1T1 hFE 35 60 —
(VCE = –10 V, IC = – 5.0 mA) MUN5112DW1T1 60 100 —
MUN5113DW1T1 80 140 —
MUN5114DW1T1 80 140 —
MUN5115DW1T1 160 250 —
MUN5116DW1T1 160 250 —
MUN5130DW1T1 3.0 5.0 —
MUN5131DW1T1 8.0 15 —
MUN5132DW1T1 15 27 —
MUN5133DW1T1 80 140 —
MUN5134DW1T1 80 130 —
MUN5135DW1T1 80 140 —
Collector–Emitter Saturation Voltage (IC = –10 mA, IE = –0.3 mA) VCE(sat) — — – 0.25 Vdc
(IC = –10 mA, IB = – 5 mA) MUN5130DW1T1/MUN5131DW1T1
(IC = –10 mA, IB = –1 mA) MUN5115DW1T1/MUN5116DW1T1/
MUN5132DW1T1/MUN5133DW1T1/MUN5134DW1T1
Output Voltage (on) VOL Vdc
(VCC = –5.0 V, VB = –2.5 V, RL = 1.0 kΩ) MUN5111DW1T1 — — –0.2
MUN5112DW1T1 — — –0.2
MUN5114DW1T1 — — –0.2
MUN5115DW1T1 — — –0.2
MUN5116DW1T1 — — –0.2
MUN5130DW1T1 — — –0.2
MUN5131DW1T1 — — –0.2
MUN5132DW1T1 — — –0.2
MUN5133DW1T1 — — –0.2
MUN5134DW1T1 — — –0.2
MUN5135DW1T1 — — –0.2
(VCC = –5.0 V, VB = – 3.5 V, RL = 1.0 kΩ) MUN5113DW1T1 — — –0.2
3. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%
250
PD , POWER DISSIPATION (MILLIWATTS)
200
150
100
RθJA = 833°C/W
50
0
– 50 0 50 100 150
TA, AMBIENT TEMPERATURE (°C)
TA = –25°C TA = 75°C
25°C
0.1 100
25°C –25°C
75°C
0.01 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
75°C 25°C
f = 1 MHz
lE = 0 V IC, COLLECTOR CURRENT (mA) TA = –25°C
3 TA = 25°C 10
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01 VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
10
25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
10 1000
VCE = 10 V
TA = 75°C
1 25°C 25°C
TA = –25°C 100 –25°C
75°C
0.1
0.01 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
75°C 25°C
f = 1 MHz
TA = –25°C
lE = 0 V
IC, COLLECTOR CURRENT (mA)
10
3 TA = 25°C
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 9. Output Capacitance Figure 10. Output Current versus Input Voltage
100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
10 25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
75°C –25°C
0.1 100
0.01 10
0 10 20 30 40 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1 100
TA = 75°C 25°C
f = 1 MHz
lE = 0 V
0.8 TA = 25°C IC, COLLECTOR CURRENT (mA) 10 –25°C
Cob , CAPACITANCE (pF)
0.6 1
0.4 0.1
0.2 0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 14. Output Capacitance Figure 15. Output Current versus Input Voltage
100
VO = 0.2 V
TA = –25°C
V in , INPUT VOLTAGE (VOLTS)
25°C
10 75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1 180
TA = 75°C
80
0.01 60
40
20
0.001 0
0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4.5 100
4 f = 1 MHz TA = 75°C 25°C
lE = 0 V
3.5 TA = 25°C
IC, COLLECTOR CURRENT (mA)
Cob , CAPACITANCE (pF)
3 –25°C
2.5
10
2
1.5
1
VO = 5 V
0.5
0 1
0 2 4 6 8 10 15 20 25 30 35 40 45 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 19. Output Capacitance Figure 20. Output Current versus Input Voltage
10
VO = 0.2 V 25°C
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1000
VCE = 10 V
VCE = 5.0 V
100
1.0 10 100
IC, COLLECTOR CURRENT (mA)
1000
HFE, DC CURRENT GAIN (NORMALIZED)
TA = 25°C
VCE = 10 V
VCE = 5.0 V
100
1.0 10 100
IC, COLLECTOR CURRENT (mA)
Use the Device Number to order the 7 inch/3000 unit reel. PIN2
CASE 419–02, STYLE 3
Replace “T1” with “T3” in the Device Number to order EMITTER
SC–70/SOT–323
(GROUND)
the 13 inch/10,000 unit reel.
THERMAL CHARACTERISTICS
Thermal Resistance — Junction–to–Ambient (surface mounted) RθJA 833 °C/W
Operating and Storage Temperature Range TJ, Tstg – 65 to +150 °C
Maximum Temperature for Soldering Purposes, TL 260 °C
Time in Solder Bath 10 Sec
REV 2
250
PD , POWER DISSIPATION (MILLIWATTS)
200
150
100
RθJA = 833°C/W
50
0
– 50 0 50 100 150
TA, AMBIENT TEMPERATURE (°C)
TA = –25°C TA = 75°C
25°C
0.1 100
25°C –25°C
75°C
0.01 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
75°C 25°C
f = 1 MHz
lE = 0 V IC, COLLECTOR CURRENT (mA) TA = –25°C
3 TA = 25°C 10
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01 VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
10
25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
10 1000
VCE = 10 V
TA = 75°C
1 25°C 25°C
TA = –25°C 100 –25°C
75°C
0.1
0.01 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
75°C 25°C
f = 1 MHz
TA = –25°C
lE = 0 V
IC, COLLECTOR CURRENT (mA)
10
3 TA = 25°C
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 9. Output Capacitance Figure 10. Output Current versus Input Voltage
100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
10 25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
75°C –25°C
0.1 100
0.01 10
0 10 20 30 40 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1 100
TA = 75°C 25°C
f = 1 MHz
lE = 0 V
0.8 TA = 25°C IC, COLLECTOR CURRENT (mA) 10 –25°C
Cob , CAPACITANCE (pF)
0.6 1
0.4 0.1
0.2 0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 14. Output Capacitance Figure 15. Output Current versus Input Voltage
100
VO = 0.2 V
TA = –25°C
V in , INPUT VOLTAGE (VOLTS)
25°C
10 75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1 180
TA = 75°C
80
0.01 60
40
20
0.001 0
0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4.5 100
4 f = 1 MHz TA = 75°C 25°C
lE = 0 V
3.5 TA = 25°C
IC, COLLECTOR CURRENT (mA)
Cob , CAPACITANCE (pF)
3 –25°C
2.5
10
2
1.5
1
VO = 5 V
0.5
0 1
0 2 4 6 8 10 15 20 25 30 35 40 45 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 19. Output Capacitance Figure 20. Output Current versus Input Voltage
10 +12 V
VO = 0.2 V 25°C
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
75°C Typical Application
for PNP BRTs
1
LOAD
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
Figure 21. Input Voltage versus Output Current Figure 22. Inexpensive, Unregulated Current Source
Q2
R2
R1
MAXIMUM RATINGS (TA = 25°C unless otherwise noted, common for Q1 and Q2)
Rating Symbol Value Unit
Collector-Base Voltage VCBO 50 Vdc
Collector-Emitter Voltage VCEO 50 Vdc
Collector Current IC 100 mAdc
THERMAL CHARACTERISTICS
Thermal Resistance — Junction-to-Ambient (surface mounted) RθJA 833 °C/W
Operating and Storage Temperature Range TJ, Tstg – 65 to +150 °C
Total Package Dissipation @ TA = 25°C(1) PD *150 mW
DEVICE MARKING AND RESISTOR VALUES: MUN5211DW1T1 SERIES
Device Marking R1 (K) R2 (K)
MUN5211DW1T1 7A 10 10
MUN5212DW1T1 7B 22 22
MUN5213DW1T1 7C 47 47
MUN5214DW1T1 7D 10 47
MUN5215DW1T1(2) 7E 10 ∞
MUN5216DW1T1(2) 7F 4.7 ∞
MUN5230DW1T1(2) 7G 1.0 1.0
MUN5231DW1T1(2) 7H 2.2 2.2
MUN5232DW1T1(2) 7J 4.7 4.7
MUN5233DW1T1(2) 7K 4.7 47
MUN5234DW1T1(2) 7L 22 47
MUN5235DW1T1(2) 7M 2.2 47
1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New resistor combinations. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
OFF CHARACTERISTICS
Collector-Base Cutoff Current (VCB = 50 V, IE = 0) ICBO — — 100 nAdc
Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0) ICEO — — 500 nAdc
Emitter-Base Cutoff Current MUN5211DW1T1 IEBO — — 0.5 mAdc
(VEB = 6.0 V, IC = 0) MUN5212DW1T1 — — 0.2
MUN5213DW1T1 — — 0.1
MUN5214DW1T1 — — 0.2
MUN5215DW1T1 — — 0.9
MUN5216DW1T1 — — 1.9
MUN5230DW1T1 — — 4.3
MUN5231DW1T1 — — 2.3
MUN5232DW1T1 — — 1.5
MUN5233DW1T1 — — 0.18
MUN5234DW1T1 — — 0.13
MUN5235DW1T1 — — 0.2
Collector-Base Breakdown Voltage (IC = 10 µA, IE = 0) V(BR)CBO 50 — — Vdc
Collector-Emitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0) V(BR)CEO 50 — — Vdc
ON CHARACTERISTICS(3)
DC Current Gain MUN5211DW1T1 hFE 35 60 —
(VCE = 10 V, IC = 5.0 mA) MUN5212DW1T1 60 100 —
MUN5213DW1T1 80 140 —
MUN5214DW1T1 80 140 —
MUN5215DW1T1 160 350 —
MUN5216DW1T1 160 350 —
MUN5230DW1T1 3.0 5.0 —
MUN5231DW1T1 8.0 15 —
MUN5232DW1T1 15 30 —
MUN5233DW1T1 80 200 —
MUN5234DW1T1 80 150 —
MUN5235DW1T1 80 140 —
Collector-Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA) VCE(sat) — — 0.25 Vdc
(IC = 10 mA, IB = 5 mA) MUN5230DW1T1/MUN5231DW1T1
(IC = 10 mA, IB = 1 mA) MUN5215DW1T1/MUN5216DW1T1
MUN5232DW1T1/MUN5233DW1T1/MUN5234DW1T1
Output Voltage (on) VOL Vdc
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kΩ) MUN5211lDW1T1 — — 0.2
MUN5212DW1T1 — — 0.2
MUN5214DW1T1 — — 0.2
MUN5215DW1T1 — — 0.2
MUN5216DW1T1 — — 0.2
MUN5230DW1T1 — — 0.2
MUN5231DW1T1 — — 0.2
MUN5232DW1T1 — — 0.2
MUN5233DW1T1 — — 0.2
MUN5234DW1T1 — — 0.2
MUN5235DW1T1 — — 0.2
(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 kΩ) MUN5213DW1T1 — — 0.2
3. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%
250
PD , POWER DISSIPATION (MILLIWATTS)
200
150
100
RθJA = 833°C/W
50
0
– 50 0 50 100 150
TA, AMBIENT TEMPERATURE (°C)
1 1000
0.01
0.001 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
25°C
f = 1 MHz 75°C
IE = 0 V IC, COLLECTOR CURRENT (mA)
10 TA = –25°C
3 TA = 25°C
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
10
VO = 0.2 V TA = –25°C
V in , INPUT VOLTAGE (VOLTS)
25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
100
0.01
0.001 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 9. Output Capacitance Figure 10. Output Current versus Input Voltage
100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
10
75°C 25°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
10 1000
VCE = 10 V
TA = 75°C
1 25°C
–25°C
0.1 75°C
0.01 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1 100
f = 1 MHz 25°C
75°C
IE = 0 V
0.8 TA = 25°C IC, COLLECTOR CURRENT (mA) 10 TA = –25°C
Cob , CAPACITANCE (pF)
0.6 1
0.4 0.1
0.2 0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 14. Output Capacitance Figure 15. Output Current versus Input Voltage
100
VO = 0.2 V
TA = –25°C
V in , INPUT VOLTAGE (VOLTS)
25°C
10 75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
0.01 100
50
0.001 0
0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
2.5 –25°C
2 10
1.5
1
VO = 5 V
0.5
0 1
0 2 4 6 8 10 15 20 25 30 35 40 45 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 19. Output Capacitance Figure 20. Output Current versus Input Voltage
10
VO = 0.2 V TA = –25°C
25°C
V in , INPUT VOLTAGE (VOLTS)
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1000
VCE = 10 V
VCE = 5.0 V
100
1.0 10 100
IC, COLLECTOR CURRENT (mA)
1000
HFE, DC CURRENT GAIN (NORMALIZED)
TA = 25°C
VCE = 10 V
VCE = 5.0 V
100
1.0 10 100
IC, COLLECTOR CURRENT (mA)
REV 2
OFF CHARACTERISTICS
Collector-Base Cutoff Current (VCB = 50 V, IE = 0) ICBO — — 100 nAdc
Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0) ICEO — — 500 nAdc
Emitter-Base Cutoff Current MUN5211T1 IEBO — — 0.5 mAdc
(VEB = 6.0 V, IC = 0) MUN5212T1 — — 0.2
MUN5213T1 — — 0.1
MUN5214T1 — — 0.2
MUN5215T1 — — 0.9
MUN5216T1 — — 1.9
MUN5230T1 — — 4.3
MUN5231T1 — — 2.3
MUN5232T1 — — 1.5
MUN5233T1 — — 0.18
MUN5234T1 — — 0.13
Collector-Base Breakdown Voltage (IC = 10 µA, IE = 0) V(BR)CBO 50 — — Vdc
Collector-Emitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0) V(BR)CEO 50 — — Vdc
ON CHARACTERISTICS(3)
DC Current Gain MUN5211T1 hFE 35 60 —
(VCE = 10 V, IC = 5.0 mA) MUN5212T1 60 100 —
MUN5213T1 80 140 —
MUN5214T1 80 140 —
MUN5215T1 160 350 —
MUN5216T1 160 350 —
MUN5230T1 3.0 5.0 —
MUN5231T1 8.0 15 —
MUN5232T1 15 30 —
MUN5233T1 80 200 —
MUN5234T1 80 150 —
Collector-Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA) VCE(sat) — — 0.25 Vdc
(IC = 10 mA, IB = 5 mA) MUN5230T1/MUN5231T1
(IC = 10 mA, IB = 1 mA) MUN5215T1/MUN5216T1
MUN5232T1/MUN5233T1/MUN5234T1
Output Voltage (on) VOL Vdc
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kΩ) MUN5211lT1 — — 0.2
MUN5212T1 — — 0.2
MUN5214T1 — — 0.2
MUN5215T1 — — 0.2
MUN5216T1 — — 0.2
MUN5230T1 — — 0.2
MUN5231T1 — — 0.2
MUN5232T1 — — 0.2
MUN5233T1 — — 0.2
MUN5234T1 — — 0.2
(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 kΩ) MUN5213T1 — — 0.2
3. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%
250
PD , POWER DISSIPATION (MILLIWATTS)
200
150
100
RθJA = 833°C/W
50
0
– 50 0 50 100 150
TA, AMBIENT TEMPERATURE (°C)
1 1000
0.01
0.001 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
25°C
f = 1 MHz 75°C
IE = 0 V IC, COLLECTOR CURRENT (mA)
10 TA = –25°C
3 TA = 25°C
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
10
VO = 0.2 V TA = –25°C
V in , INPUT VOLTAGE (VOLTS)
25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
100
0.01
0.001 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 9. Output Capacitance Figure 10. Output Current versus Input Voltage
100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
10
75°C 25°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
10 1000
VCE = 10 V
TA = 75°C
1 25°C
–25°C
0.1 75°C
0.01 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1 100
f = 1 MHz 25°C
75°C
IE = 0 V
0.8 TA = 25°C IC, COLLECTOR CURRENT (mA) 10 TA = –25°C
Cob , CAPACITANCE (pF)
0.6 1
0.4 0.1
0.2 0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 14. Output Capacitance Figure 15. Output Current versus Input Voltage
100
VO = 0.2 V
TA = –25°C
V in , INPUT VOLTAGE (VOLTS)
25°C
10 75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
0.01 100
50
0.001 0
0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
2.5 –25°C
2 10
1.5
1
VO = 5 V
0.5
0 1
0 2 4 6 8 10 15 20 25 30 35 40 45 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 19. Output Capacitance Figure 20. Output Current versus Input Voltage
10
VO = 0.2 V TA = –25°C
25°C
V in , INPUT VOLTAGE (VOLTS)
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
+12 V
ISOLATED
LOAD
FROM µP OR
OTHER LOGIC
+12 V
VCC
OUT
IN
LOAD
Figure 23. Open Collector Inverter: Inverts the Input Signal Figure 24. Inexpensive, Unregulated Current Source
Q2
R2
R1
MAXIMUM RATINGS (TA = 25°C unless otherwise noted, common for Q1 and Q2, – minus sign for Q2 (PNP) omitted)
Rating Symbol Value Unit
Collector-Base Voltage VCBO 50 Vdc
Collector-Emitter Voltage VCEO 50 Vdc
Collector Current IC 100 mAdc
THERMAL CHARACTERISTICS
Thermal Resistance — Junction-to-Ambient (surface mounted) RθJA 833 °C/W
Operating and Storage Temperature Range TJ, Tstg – 65 to +150 °C
Total Package Dissipation @ TA = 25°C(1) PD *150 mW
DEVICE MARKING AND RESISTOR VALUES: MUN5311DW1T1 SERIES
Device Marking R1 (K) R2 (K)
MUN5311DW1T1 11 10 10
MUN5312DW1T1 12 22 22
MUN5313DW1T1 13 47 47
MUN5314DW1T1 14 10 47
MUN5315DW1T1(2) 15 10 ∞
MUN5316DW1T1(2) 16 4.7 ∞
MUN5330DW1T1(2) 30 1.0 1.0
MUN5331DW1T1(2) 31 2.2 2.2
MUN5332DW1T1(2) 32 4.7 4.7
MUN5333DW1T1(2) 33 4.7 47
MUN5334DW1T1(2) 34 22 47
MUN5335DW1T1(2) 35 2.2 47
1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New resistor combinations. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 4
OFF CHARACTERISTICS
Collector-Base Cutoff Current (VCB = 50 V, IE = 0) ICBO — — 100 nAdc
Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0) ICEO — — 500 nAdc
Emitter-Base Cutoff Current MUN5311DW1T1 IEBO — — 0.5 mAdc
(VEB = 6.0 V, IC = 0) MUN5312DW1T1 — — 0.2
MUN5313DW1T1 — — 0.1
MUN5314DW1T1 — — 0.2
MUN5315DW1T1 — — 0.9
MUN5316DW1T1 — — 1.9
MUN5330DW1T1 — — 4.3
MUN5331DW1T1 — — 2.3
MUN5332DW1T1 — — 1.5
MUN5333DW1T1 — — 0.18
MUN5334DW1T1 — — 0.13
MUN5335DW1T1 — — 0.2
Collector-Base Breakdown Voltage (IC = 10 µA, IE = 0) V(BR)CBO 50 — — Vdc
Collector-Emitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0) V(BR)CEO 50 — — Vdc
ON CHARACTERISTICS(3)
DC Current Gain MUN5311DW1T1 hFE 35 60 —
(VCE = 10 V, IC = 5.0 mA) MUN5312DW1T1 60 100 —
MUN5313DW1T1 80 140 —
MUN5314DW1T1 80 140 —
MUN5315DW1T1 160 350 —
MUN5316DW1T1 160 350 —
MUN5330DW1T1 3.0 5.0 —
MUN5331DW1T1 8.0 15 —
MUN5332DW1T1 15 30 —
MUN5333DW1T1 80 200 —
MUN5334DW1T1 80 150 —
MUN5335DW1T1 80 140 —
Collector-Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA) VCE(sat) — — 0.25 Vdc
(IC = 10 mA, IB = 5 mA) MUN5330DW1T1/MUN5331DW1T1
(IC = 10 mA, IB = 1 mA) MUN5315DW1T1/MUN5316DW1T1
MUN5332DW1T1/MUN5333DW1T1/MUN5334DW1T1
Output Voltage (on) VOL Vdc
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kΩ) MUN5311lDW1T1 — — 0.2
MUN5312DW1T1 — — 0.2
MUN5314DW1T1 — — 0.2
MUN5315DW1T1 — — 0.2
MUN5316DW1T1 — — 0.2
MUN5330DW1T1 — — 0.2
MUN5331DW1T1 — — 0.2
MUN5332DW1T1 — — 0.2
MUN5333DW1T1 — — 0.2
MUN5334DW1T1 — — 0.2
MUN5335DW1T1 — — 0.2
(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 kΩ) MUN5313DW1T1 — — 0.2
3. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%
250
PD , POWER DISSIPATION (MILLIWATTS)
200
150
100
RθJA = 833°C/W
50
0
– 50 0 50 100 150
TA, AMBIENT TEMPERATURE (°C)
1 1000
0.01
0.001 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
25°C
f = 1 MHz 75°C
IE = 0 V IC, COLLECTOR CURRENT (mA)
10 TA = –25°C
3 TA = 25°C
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
10
VO = 0.2 V TA = –25°C
V in , INPUT VOLTAGE (VOLTS)
25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
TA = –25°C TA = 75°C
25°C
0.1 100
25°C –25°C
75°C
0.01 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
75°C 25°C
f = 1 MHz
lE = 0 V IC, COLLECTOR CURRENT (mA) TA = –25°C
3 TA = 25°C 10
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01 VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
10
25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1 1000
VCE = 10 V
100
0.01
0.001 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 14. Output Capacitance Figure 15. Output Current versus Input Voltage
100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
10
75°C 25°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
TA = 75°C
1 25°C 25°C
TA = –25°C 100 –25°C
75°C
0.1
0.01 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
75°C 25°C
f = 1 MHz
TA = –25°C
lE = 0 V IC, COLLECTOR CURRENT (mA)
10
3 TA = 25°C
Cob , CAPACITANCE (pF)
1
2
0.1
1
0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 19. Output Capacitance Figure 20. Output Current versus Input Voltage
100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
10 25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
10 1000
VCE = 10 V
TA = 75°C
1 25°C
–25°C
0.1 75°C
0.01 10
0 20 40 50 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1 100
f = 1 MHz 25°C
75°C
IE = 0 V
0.8 TA = 25°C IC, COLLECTOR CURRENT (mA) 10 TA = –25°C
Cob , CAPACITANCE (pF)
0.6 1
0.4 0.1
0.2 0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 24. Output Capacitance Figure 25. Output Current versus Input Voltage
100
VO = 0.2 V
TA = –25°C
V in , INPUT VOLTAGE (VOLTS)
25°C
10 75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
75°C –25°C
0.1 100
0.01 10
0 10 20 30 40 1 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1 100
TA = 75°C 25°C
f = 1 MHz
lE = 0 V
0.8 TA = 25°C IC, COLLECTOR CURRENT (mA) 10 –25°C
Cob , CAPACITANCE (pF)
0.6 1
0.4 0.1
0.2 0.01
VO = 5 V
0 0.001
0 10 20 30 40 50 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 29. Output Capacitance Figure 30. Output Current versus Input Voltage
100
VO = 0.2 V
TA = –25°C
V in , INPUT VOLTAGE (VOLTS)
25°C
10 75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1 300
TA = 75°C
0.01 100
50
0.001 0
0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4 100
3 TA = 25°C
Cob , CAPACITANCE (pF)
2.5 –25°C
2 10
1.5
1
VO = 5 V
0.5
0 1
0 2 4 6 8 10 15 20 25 30 35 40 45 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 34. Output Capacitance Figure 35. Output Current versus Input Voltage
10
VO = 0.2 V TA = –25°C
25°C
V in , INPUT VOLTAGE (VOLTS)
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
80
0.01 60
40
20
0.001 0
0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
4.5 100
4 f = 1 MHz TA = 75°C 25°C
lE = 0 V
3.5 TA = 25°C
IC, COLLECTOR CURRENT (mA)
Cob , CAPACITANCE (pF)
3 –25°C
2.5
10
2
1.5
1
VO = 5 V
0.5
0 1
0 2 4 6 8 10 15 20 25 30 35 40 45 50 0 2 4 6 8 10
VR, REVERSE BIAS VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)
Figure 39. Output Capacitance Figure 40. Output Current versus Input Voltage
10
VO = 0.2 V 25°C
V in , INPUT VOLTAGE (VOLTS)
TA = –25°C
75°C
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
1000 1000
HFE, DC CURRENT GAIN (NORMALIZED)
VCE = 10 V
VCE = 10 V
VCE = 5.0 V
VCE = 5.0 V
100 100
1.0 10 100 1.0 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 42. DC Current Gain — PNP Figure 43. DC Current Gain — NPN
1000 1000
HFE, DC CURRENT GAIN (NORMALIZED)
TA = 25°C TA = 25°C
VCE = 10 V
VCE = 10 V
VCE = 5.0 V
VCE = 5.0 V
100 100
1.0 10 100 1.0 10 100
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 44. DC Current Gain — PNP Figure 45. DC Current Gain — NPN
Amplifier Transistors
NPN Silicon
COLLECTOR
P2N2222A
1
2
BASE
3
EMITTER
MAXIMUM RATINGS
Rating Symbol Value Unit 1
2
Collector – Emitter Voltage VCEO 40 Vdc 3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO 40 — Vdc
(IC = 10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO 75 — Vdc
(IC = 10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICEX — 10 nAdc
(VCE = 60 Vdc, VEB(off) = 3.0 Vdc)
Collector Cutoff Current ICBO µAdc
(VCB = 60 Vdc, IE = 0) — 0.01
(VCB = 60 Vdc, IE = 0, TA = 150°C) — 10
Emitter Cutoff Current IEBO — 10 nAdc
(VEB = 3.0 Vdc, IC = 0)
Collector Cutoff Current ICEO — 10 nAdc
(VCE = 10 V)
Base Cutoff Current IBEX — 20 nAdc
(VCE = 60 Vdc, VEB(off) = 3.0 Vdc)
SWITCHING CHARACTERISTICS
Delay Time ( CC = 30 Vdc, VBE(off) = –2.0 Vdc,
(V td — 10 ns
Rise Time IC = 150 mAdc, IB1 = 15 mAdc) (Figure 1) tr — 25 ns
Storage Time (VCC = 30 Vdc, IC = 150 mAdc, ts — 225 ns
IB1 = IB2 = 15 mAdc)
Ad ) (Fi
(Figure 2)
Fall Time tf — 60 ns
+ 30 V + 30 V
1.0 to 100 µs, 1.0 to 100 µs, 200
200
+16 V DUTY CYCLE ≈ 2.0%
+16 V DUTY CYCLE ≈ 2.0%
0 0
1 kΩ –14 V 1k CS* < 10 pF
–2 V CS* < 10 pF
< 2 ns < 20 ns
1N914
1000
700
500 TJ = 125°C
hFE , DC CURRENT GAIN
300
200
25°C
100
70
–55°C
50
30 VCE = 1.0 V
20 VCE = 10 V
10
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (mA)
1.0
TJ = 25°C
0.8
0.4
0.2
0
0.005 0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50
IB, BASE CURRENT (mA)
30
t, TIME (ns)
70
20 tf
50
30
10
7.0 20
5.0
10
3.0 7.0
2.0 5.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
10 10
RS = OPTIMUM f = 1.0 kHz
IC = 1.0 mA, RS = 150 Ω RS = SOURCE
8.0 RS = RESISTANCE 8.0
500 µA, RS = 200 Ω IC = 50 µA
NF, NOISE FIGURE (dB)
4.0 4.0
2.0 2.0
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (OHMS)
30 500
VCE = 20 V
20 TJ = 25°C
300
Ceb
CAPACITANCE (pF)
10 200
7.0
5.0
100
Ccb
3.0 70
2.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
VBE(sat) @ IC/IB = 10
1.0 V – 0.5
0.6
VBE(on) @ VCE = 10 V – 1.0
0.4
– 1.5
0.2
– 2.0 RqVB for VBE
VCE(sat) @ IC/IB = 10
0 – 2.5
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Amplifier Transistor
PNP Silicon
COLLECTOR
P2N2907A
1
2
BASE
3
EMITTER
MAXIMUM RATINGS
Rating Symbol Value Unit 1
2
Collector – Emitter Voltage VCEO –60 Vdc 3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO –60 — Vdc
(IC = –10 mAdc, IB = 0)
Collector – Base Breakdown Voltage V(BR)CBO –60 — Vdc
(IC = –10 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO –5.0 — Vdc
(IE = –10 mAdc, IC = 0)
Collector Cutoff Current ICEX — –50 nAdc
(VCE = –30 Vdc, VEB(off) = –0.5 Vdc)
Collector Cutoff Current ICBO µAdc
(VCB = –50 Vdc, IE = 0) — –0.01
(VCB = –50 Vdc, IE = 0, TA = 150°C) — –10
Emitter Cutoff Current IEBO — –10 nAdc
(VEB = –3.0 Vdc)
Collector Cutoff Current ICEO — –10 nAdc
(VCE = –10 V)
Base Cutoff Current IBEX — –50 nAdc
(VCE = –30 Vdc, VEB(off) = –0.5 Vdc)
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
SWITCHING CHARACTERISTICS
Turn–On Time ton — 50 ns
(VCC = –30
30 Vdc,
Vd IC = –150
150 mAdc,
Ad
Delay Time td — 10 ns
IB1 = –15
15 mAdc) (Figures 1 and 5)
Rise Time tr — 40 ns
Turn–Off Time toff — 110 ns
(VCC = –6.0
6 0 Vd
Vdc, IC = –150
150 mAdc,
Ad
Storage Time ts — 80 ns
IB1 = IB2 = –15
15 mAdc) (Figure 2)
Fall Time tf — 30 ns
INPUT INPUT
Zo = 50 Ω –30 V Zo = 50 Ω +15 V –6.0 V
PRF = 150 PPS PRF = 150 PPS
RISE TIME ≤ 2.0 ns 200 RISE TIME ≤ 2.0 ns
1.0 k 37
P.W. < 200 ns P.W. < 200 ns
1.0 k 1.0 k
0 TO OSCILLOSCOPE 0 TO OSCILLOSCOPE
RISE TIME ≤ 5.0 ns RISE TIME ≤ 5.0 ns
–16 V 50 –30 V 50 1N916
200 ns 200 ns
Figure 1. Delay and Rise Time Test Circuit Figure 2. Storage and Fall Time Test Circuit
3.0
VCE = –1.0 V
hFE , NORMALIZED CURRENT GAIN
25°C
1.0
0.7 – 55°C
0.5
0.3
0.2
–0.1 –0.2 –0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500
IC, COLLECTOR CURRENT (mA)
–1.0
–0.8
IC = –1.0 mA –10 mA –100 mA –500 mA
–0.6
–0.4
–0.2
0
–0.005 –0.01 –0.02 –0.03 –0.05 –0.07 –0.1 –0.2 –0.3 –0.5 –0.7 –1.0 –2.0 –3.0 –5.0 –7.0 –10 –20 –30 –50
IB, BASE CURRENT (mA)
300 500
200 300 VCC = –30 V
VCC = –30 V
IC/IB = 10 200 IC/IB = 10
100 tr
TJ = 25°C tf IB1 = IB2
70 100 TJ = 25°C
50
t, TIME (ns)
t, TIME (ns)
70
30 50
20 t′s = ts – 1/8 tf
30
td @ VBE(off) = 0 V
20
10
7.0 10
5.0 2.0 V
7.0
3.0 5.0
–5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500 –5.0 –7.0 –10 –20 –30 –50 –70 –100 –200 –300 –500
IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT (mA)
10 10
f = 1.0 kHz
8.0 8.0
NF, NOISE FIGURE (dB)
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k
f, FREQUENCY (kHz) Rs, SOURCE RESISTANCE (OHMS)
10
100
7.0 80 VCE = –20 V
60 TJ = 25°C
5.0 Ccb
40
3.0 30
2.0 20
–0.1 –0.2 –0.3 –0.5 –1.0 –2.0 –3.0 –5.0 –10 –20 –30 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –1000
REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
–1.0 +0.5
TJ = 25°C
VBE(sat) @ IC/IB = 10 0
–0.8 RqVC for VCE(sat)
COEFFICIENT (mV/ ° C)
V, VOLTAGE (VOLTS)
–0.2
–2.0 RqVB for VBE
VCE(sat) @ IC/IB = 10
0 –2.5
–0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500 –0.1 –0.2 –0.5 –1.0 –2.0 –5.0 –10 –20 –50 –100 –200 –500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
This NPN Silicon Epitaxial transistor is designed for use in industrial and consumer
applications. The device is housed in the SOT–223 package which is designed for SOT–223 PACKAGE
medium power surface mount applications. HIGH CURRENT
• High Current: 2.0 Amp NPN SILICON
• The SOT–223 package can be soldered using wave or reflow. TRANSISTOR
SURFACE MOUNT
• SOT–223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering, eliminating the possibility
of damage to the die. 4
• Available in 12 mm Tape and Reel COLLECTOR 2,4
Use PZT651T1 to order the 7 inch/1000 unit reel 1
2
Use PZT651T3 to order the 13 inch/4000 unit reel 3
BASE
• PNP Complement is PZT751T1 1
CASE 318E–04, STYLE 1
TO–261AA
EMITTER 3
DEVICE MARKING
651
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance from Junction–to–Ambient in Free Air RθJA 156 °C/W
Maximum Temperature for Soldering Purposes TL 260 °C
Time in Solder Bath 10 Sec
1. Device mounted on a FR–4 glass epoxy printed circuit board using minimum recommended footprint.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
ON CHARACTERISTICS (2)
DC Current Gain hFE —
(IC = 50 mAdc, VCE = 2.0 Vdc) 75 —
(IC = 500 mAdc, VCE = 2.0 Vdc) 75 —
(IC = 1.0 Adc, VCE = 2.0 Vdc) 75 —
(IC = 2.0 Adc, VCE = 2.0 Vdc) 40 —
Collector–Emitter Saturation Voltages VCE(sat) Vdc
(IC = 2.0 Adc, IB = 200 mAdc) — 0.5
(IC = 1.0 Adc, IB = 100 mAdc) — 0.3
Base–Emitter Voltages VBE(on) — 1.0 Vdc
(IC = 1.0 Adc, VCE = 2.0 Vdc)
Base–Emitter Saturation Voltage VBE(sat) — 1.2 Vdc
(IC = 1.0 Adc, IB = 100 mAdc)
Current–Gain — Bandwidth fT 75 — MHz
(IC = 50 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
This PNP Silicon Epitaxial transistor is designed for use in industrial and consumer
applications. The device is housed in the SOT–223 package which is designed for SOT–223 PACKAGE
medium power surface mount applications. HIGH CURRENT
PNP SILICON
• High Current: 2.0 Amp TRANSISTOR
• The SOT–223 Package can be soldered using wave or reflow. SURFACE MOUNT
• SOT–223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering, eliminating the possibility of
damage to the die 4
COLLECTOR 2, 4
• Available in 12 mm Tape and Reel
Use PZT751T1 to order the 7 inch/1000 unit reel. 1
2
Use PZT751T3 to order the 13 inch/4000 unit reel. BASE 3
1
• NPN Complement is PZT651T1 CASE 318E-04, STYLE 1
TO-261AA
EMITTER 3
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage V(BR)CEO 60 — Vdc
(IC = 10 mAdc, IB = 0)
Collector–Emitter Breakdown Voltage V(BR)CBO 80 — Vdc
(IC = 100 µAdc, IE = 0)
Emitter–Base Breakdown Voltage V(BR)EBO 5.0 — Vdc
(IE = 10 µAdc, IC = 0)
Base–Emitter Cutoff Current IEBO — 0.1 µAdc
(VEB = 4.0 Vdc)
Collector–Base Cutoff Current ICBO — 100 nAdc
(VCB = 80 Vdc, IE = 0)
ON CHARACTERISTICS (2)
DC Current Gain hFE —
(IC = 50 mAdc, VCE = 2.0 Vdc) 75 —
(IC = 500 mAdc, VCE = 2.0 Vdc) 75 —
(IC = 1.0 Adc, VCE = 2.0 Vdc) 75 —
(IC = 2.0 Adc, VCE = 2.0 Vdc) 40 —
Collector–Emitter Saturation Voltages VCE(sat) Vdc
(IC = 2.0 Adc, IB = 200 mAdc) — 0.5
(IC = 1.0 Adc, IB = 100 mAdc) — 0.3
Base–Emitter Voltages VBE(on) — 1.0 Vdc
(IC = 1.0 Adc, VCE = 2.0 Vdc)
Base–Emitter Saturation Voltage VBE(sat) — 1.2 Vdc
(IC = 1.0 Adc, IB = 100 mAdc)
Current–Gain–Bandwidth fT 75 — MHz
(IC = 50 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle = 2.0%.
This NPN Silicon Epitaxial transistor is designed for use in linear and switching
applications. The device is housed in the SOT-223 package which is designed for
medium power surface mount applications.
SOT-223 PACKAGE
• PNP Complement is PZT2907AT1
NPN SILICON
• The SOT-223 package can be soldered using wave or reflow. TRANSISTOR
• SOT-223 package ensures level mounting, resulting in improved thermal SURFACE MOUNT
conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering, eliminating the possibility of
damage to the die. COLLECTOR
• Available in 12 mm tape and reel 2, 4 4
Use PZT2222AT1 to order the 7 inch/1000 unit reel.
Use PZT2222AT3 to order the 13 inch/4000 unit reel. BASE 1
1 2
3
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector-Emitter Voltage VCEO 40 Vdc
Collector-Base Voltage VCBO 75 Vdc
Emitter-Base Voltage (Open Collector) VEBO 6.0 Vdc
Collector Current IC 600 mAdc
Total Power Dissipation up to TA = 25°C(1) PD 1.5 Watts
Storage Temperature Range° Tstg – 65 to +150 °C
Junction Temperature° TJ 150 °C
THERMAL CHARACTERISTICS
Thermal Resistance from Junction to Ambient RθJA 83.3 °C/W
Lead Temperature for Soldering, 0.0625″ from case TL 260 °C
Time in Solder Bath 10 Sec
DEVICE MARKING
P1F
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0) V(BR)CEO 40 — Vdc
Collector-Base Breakdown Voltage (IC = 10 µAdc, IE = 0) V(BR)CBO °75° °—° Vdc
Emitter-Base Breakdown Voltage (IE = 10 µAdc, IC = 0) V(BR)EBO 6.0 — Vdc
Base-Emitter Cutoff Current (VCE = 60 Vdc, VBE = – 3.0 Vdc) IBEX — 20 nAdc
Collector-Emitter Cutoff Current (VCE = 60 Vdc, VBE = – 3.0 Vdc) ICEX — 10 nAdc
Emitter-Base Cutoff Current (VEB = 3.0 Vdc, IC = 0) IEBO — 100 nAdc
1. Device mounted on an epoxy printed circuit board 1.575 inches x 1.575 inches x 0.059 inches; mounting pad for the collector lead min. 0.93 inches2.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 0.1 mAdc, VCE = 10 Vdc) 35 —
(IC = 1.0 mAdc, VCE = 10 Vdc) 50 —
(IC = 10 mAdc, VCE = 10 Vdc) 70 —
(IC = 10 mAdc, VCE = 10 Vdc, TA = – 55°C) 35 —
(IC = 150 mAdc, VCE = 10 Vdc) 100 300
(IC = 150 mAdc, VCE = 1.0 Vdc) 50 —
(IC = 500 mAdc, VCE = 10 Vdc) 40 —
Collector-Emitter Saturation Voltages VCE(sat) Vdc
(IC = 150 mAdc, IB = 15 mAdc) — 0.3
(IC = 500 mAdc, IB = 50 mAdc) — 1.0
Base-Emitter Saturation Voltages VBE(sat) Vdc
(IC = 150 mAdc, IB = 15 mAdc) 0.6 1.2
(IC = 500 mAdc, IB = 50 mAdc) — 2.0
Input Impedance° °hie° kΩ
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) 2.0 8.0
(VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz) 0.25 1.25
Voltage Feedback Ratio hre —
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) — 8.0x10-4
(VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz) — 4.0x10-4
Small-Signal Current Gain ť hfe ť —
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) 50 300
(VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz) 75 375
Output Admittance° °hoe° µmhos
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) 5.0 35
(VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz) 25 200
Noise Figure (VCE = 10 Vdc, IC = 100 µAdc, f = 1.0 kHz) F — 4.0 dB
DYNAMIC CHARACTERISTICS
Current-Gain — Bandwidth Product fT 300 — MHz
(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)
Input Capacitance Ce — 25 pF
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
90% R2
Vo
R1
10% Vi D.U.T.
0
tr tp
Figure 1. Input Waveform and Test Circuit for Determining Delay Time and Rise Time
Vi = – 0.5 V to +9.9 V, VCC = +30 V, R1 = 619 Ω, R2 = 200 Ω.
Vi VCC
+16.2 V
R2
D.U.T.
R1
0 Vi R3
TIME
Vo
D1 OSCILLOSCOPE
– 13.8 V R4
tf 100 µs
VBB
Figure 2. Input Waveform and Test Circuit for Determining Storage Time and Fall Time
This PNP Silicon Epitaxial transistor is designed for use in linear and
switching applications. The device is housed in the SOT-223 package which is
designed for medium power surface mount applications. SOT-223 PACKAGE
PNP SILICON
• NPN Complement is PZT2222AT1
TRANSISTOR
• The SOT-223 package can be soldered using wave or reflow SURFACE MOUNT
• SOT-223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering eliminating the possibility of
damage to the die. COLLECTOR
• Available in 12 mm tape and reel 2,4 4
Use PZT2907AT1 to order the 7 inch/1000 unit reel.
Use PZT2907AT3 to order the 13 inch/4000 unit reel. 1
BASE 1 2
3
DEVICE MARKING
P2F
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 4
DYNAMIC CHARACTERISTICS
Current-Gain — Bandwidth Product (IC = – 50 mAdc, VCE = – 20 Vdc, f = 100 MHz) fT 200 — — MHz
Output Capacitance (VCB = –10 Vdc, IE = 0, f = 1.0 MHz) Cc — — 8.0 pF
Input Capacitance (VEB = – 2.0 Vdc, IC = 0, f = 1.0 MHz) Ce — — 30 pF
SWITCHING TIMES
Turn-On Time ton — — 45 ns
Delay Time Vd IC = –150
(VCC = – 30 Vdc, 150 mAdc,
Ad
td — — 10
IB1 = –15
15 mAdc)
Rise Time tr — — 40
Turn-Off Time toff — — 100 ns
(VCC = – 6.0
6 0 Vdc,
Vd IC = –150
150 mAdc,
Ad
Storage Time ts — — 80
IB1 = IB2 = –15
15 mAdc)
Fall Time tf — — 30
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle = 2.0%.
– 30 V +15 V – 6.0 V
INPUT INPUT
Zo = 50 Ω 200 Zo = 50 Ω 1.0 k 37
PRF = 150 Hz PRF = 150 Hz
RISE TIME ≤ 2.0 ns RISE TIME ≤ 2.0 ns
1.0 k TO OSCILLOSCOPE 1.0 k TO OSCILLOSCOPE
0 RISE TIME ≤ 5.0 ns 0 RISE TIME ≤ 5.0 ns
– 16 V 50 – 30 V
50 1N916
200 ns 200 ns
TJ = 125°C
hFE, CURRENT GAIN
TJ = 25°C
100 100
TJ = – 55°C
VCE = – 20 V
TJ = 25°C
10 10
– 0.1 –1.0 –10 –100 –1000 –1.0 –10 –100 –1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
–1.0 30
TJ = 25°C
20
– 0.8 VBE(sat) @ IC/IB = 10
CAPACITANCE (pF) Ceb
VOLTAGE (VOLTS)
7.0
– 0.4 Ccb
5.0
– 0.2
VCE(sat) @ IC/IB = 10 3.0
0 2.0
– 0.1 – 0.2 – 0.5 –1.0 – 2.0 – 5.0 –10 – 20 – 50 –100 – 200 – 500 – 0.1 – 0.2 – 0.3 – 0.5 – 0.7 –1.0 – 2.0 – 3.0 – 5.0 – 7.0 –10 – 20 – 30
IC, COLLECTOR CURRENT (mA) REVERSE VOLTAGE (VOLTS)
This NPN small signal darlington transistor is designed for use in switching SOT–223 PACKAGE
applications, such as print hammer, relay, solenoid and lamp drivers. The MEDIUM POWER
device is housed in the SOT-223 package, which is designed for medium power NPN SILICON
surface mount applications. DARLINGTON
• High fT : 125 MHz Minimum TRANSISTOR
• The SOT-223 Package can be soldered using wave or reflow. SURFACE MOUNT
DEVICE MARKING
P1N
THERMAL CHARACTERISTICS
Thermal Resistance RθJA 83.3 °C/W
Junction-to-Ambient (surface mounted)
Maximum Temperature for Soldering Purposes TL 260 °C
Time in Solder Bath 10 Sec
1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
OFF CHARACTERISTICS
Collector-Base Breakdown Voltage V(BR)CBO 30 — — Vdc
(IC = 100 µAdc, IE = 0)
Collector-Emitter Breakdown Voltage V(BR)CES 30 — — Vdc
(IC = 100 µAdc, IB = 0)
Emitter-Base Breakdown Voltage V(BR)EBO 10 — — Vdc
(IE = 10 µAdc, IC = 0)
Collector-Base Cutoff Current ICBO — — 0.1 µAdc
(VCB = 30 Vdc, IE = 0)
Emitter-Base Cutoff Current IEBO — — 0.1 µAdc
(VEB = 10 Vdc, IC = 0)
ON CHARACTERISTICS (2)
DC Current Gain hFE —
(IC = 10 mAdc, VCE = 5.0 Vdc) 10,000 — —
(IC = 100 mAdc, VCE = 5.0 Vdc) 20,000 — —
Collector-Emitter Saturation Voltage VCE(sat) — — 1.5 Vdc
(IC = 100 mAdc, IB = 0.1 mAdc)
Base-Emitter On Voltage VBE(on) — — 2.0 Vdc
(IC = 100 mAdc, VCE = 5.0 Vdc)
DYNAMIC CHARACTERISTICS
Current-Gain — Bandwidth Product fT 125 — — MHz
(IC = 10 mAdc, VCE = 5.0 Vdc)
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%.
200 k 4.0
VCE = 5.0 V
50 k 25°C
30 k
1.0
20 k
0.8
10 k 0.6
7.0 k
0.4
5.0 k – 55°C VCE = 5.0 V
3.0 k
2.0 k 0.2
5.0 7.0 10 20 30 50 70 100 200 300 500 0.5 1.0 2.0 0.5 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
1.6 20
TJ = 25°C TJ = 25°C
1.4
V, VOLTAGE (VOLTS)
1.2
7.0 Cibo
VBE(on) @ VCE = 5.0 V
1.0 5.0 Cobo
0.8 3.0
VCE(sat) @ IC/IB = 1000
0.6 2.0
5.0 7.0 10 20 30 50 70 100 200 300 500 0.04 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
3.0 –1.0
RθV, TEMPERATURE COEFFICIENT (mV/°C)
0.5 – 6.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000 5.0 7.0 10 20 30 50 70 100 200 300 500
IB, BASE CURRENT (µA) IC, COLLECTOR CURRENT (mA)
MAXIMUM RATINGS
4
Rating Symbol Value Unit
Collector-Emitter Voltage (Open Base) VCEO 300 Vdc 1
2
3
Collector-Base Voltage (Open Emitter) VCBO 300 Vdc
Emitter-Base Voltage (Open Collector) VEBO 6.0 Vdc
CASE 318E-04, STYLE 1
Collector Current (DC) IC 500 mAdc TO-261AA
Total Power Dissipation @ TA = 25°C(1) PD 1.5 Watts
Storage Temperature Range Tstg – 65 to +150 °C
Junction Temperature TJ 150 °C
DEVICE MARKING
P1D
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction-to-Ambient(1) RθJA 83.3 °C/W
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage(2) V(BR)CEO 300 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector-Base Breakdown Voltage V(BR)CBO 300 — Vdc
(IC = 100 µAdc, IE = 0)
Emitter-Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 100 µAdc, IC = 0)
Collector-Base Cutoff Current ICBO — 0.1 µAdc
(VCB = 200 Vdc, IE = 0)
Emitter-Base Cutoff Current IEBO — 0.1 µAdc
(VBE = 6.0 Vdc, IC = 0)
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min 0.93 in2.
2. Pulse Test Conditions, tp = 300 µs, δ = 0.02.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
DEVICE MARKING
P2V
THERMAL CHARACTERISTICS
Thermal Resistance from Junction to Ambient (surface mounted) RθJA 83.3 °C/W
Maximum Temperature for Soldering Purposes TL 260 °C
Time in Solder Bath 10 Sec
1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 4
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage V(BR)CES 30 — Vdc
(IC = 100 µAdc, VBE = 0)
Collector-Base Breakdown Voltage V(BR)CBO 30 — Vdc
(IC = 100 µA, IE = 0)
Emitter-Base Breakdown Voltage V(BR)EBO 10 — Vdc
(IE = 100 µA, IC = 0)
Emitter-Base Cutoff Current IEBO — 0.1 µAdc
(VBE = 10 Vdc, IC = 0)
Collector-Base Cutoff Current ICBO — 0.1 µAdc
(VCB = 30 Vdc, IE = 0)
ON CHARACTERISTICS(2)
DC Current Gain hFE —
(IC = 10 mAdc, VCE = 5.0 Vdc) 10,000 —
(IC = 100 mAdc, VCE = 5.0 Vdc) 20,000 —
Collector-Emitter Saturation Voltage VCE(sat) — 1.5 Vdc
(IC = 100 mAdc, IB = 0.1 mAdc)
Base-Emitter On-Voltage VBE(on) — 2.0 Vdc
(VCE = 5.0 Vdc, IC = 100 mAdc)
DYNAMIC CHARACTERISTICS
Current-Gain — Bandwidth Product fT 125 — MHz
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%.
3.0
2.0
0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300
IC, COLLECTOR CURRENT (mA)
10 2.0
|h FE |, HIGH FREQUENCY CURRENT GAIN
VCE = 5.0 V
f = 100 MHz TA = 25°C
4.0 TA = 25°C 1.6 VBE(sat) @ IC/IB = 100
3.0
V, VOLTAGE (VOLTS)
2.0
1.2
1.0 VBE(on) @ VCE = 5.0 V
0.8 VCE(sat) @ IC/IB = 1000
0.4 IC/IB = 100
0.4
0.2
0.1 0
1.0 2.0 5.0 10 20 50 100 200 500 1K 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 300
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
2.0
TA = 25°C
1.8
1.4
1.2
1.0
0.8
0.6
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1K 2K 5K 10K
IB, BASE CURRENT (µA)
BASE
1
SOT–223 PACKAGE
PNP SILICON
EMITTER 3 HIGH VOLTAGE TRANSISTOR
MAXIMUM RATINGS SURFACE MOUNT
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (IC = –1.0 mAdc, IB = 0) V(BR)CEO – 300 — Vdc
Collector–Base Breakdown Voltage (IC = –100 µAdc, IE = 0) V(BR)CBO – 300 — Vdc
Emitter–Base Breakdown Voltage (IE = –100 µAdc, IC = 0) V(BR)EBO – 5.0 — Vdc
Collector–Base Cutoff Current (VCB = – 200 Vdc, IE = 0) ICBO — – 0.25 µAdc
Emitter–Base Cutoff Current (VBE = – 3.0 Vdc, IC = 0) IEBO — – 0.1 µAdc
ON CHARACTERISTICS
DC Current Gain(2) hFE —
(IC = – 1.0 mAdc, VCE = – 10 Vdc) 25 —
(IC = –10 mAdc, VCE = – 10 Vdc) 40 —
(IC = – 30 mAdc, VCE = – 10 Vdc) 25 —
Saturation Voltages Vdc
(IC = –20 mAdc, IB = –2.0 mAdc) VCE(sat) — – 0.5
(IC = –20 mAdc, IB = –2.0 mAdc) VBE(sat) — – 0.9
DYNAMIC CHARACTERISTICS
Collector–Base Capacitance @ f = 1.0 MHz (VCB = –20 Vdc, IE = 0) Ccb — 6.0 pF
Current–Gain — Bandwidth Product fT 50 — MHz
(IC = –10 mAdc, VCE = – 20 Vdc, f = 100 MHz)
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 in2.
2. Pulse Test: Pulse Width ≤ 300 µs; Duty Cycle = 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
BASE
1
SOT–223 PACKAGE
PNP SILICON
EMITTER 3 HIGH VOLTAGE TRANSISTOR
MAXIMUM RATINGS SURFACE MOUNT
DEVICE MARKING
ZTA96
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance from Junction to Ambient(1) RθJA 83.3 °C
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage V(BR)CEO – 450 — Vdc
(IC = –1.0 mAdc, IB = 0)
Collector–Emitter Breakdown Voltage V(BR)CBO – 450 — Vdc
(IC = –100 µAdc, IE = 0)
Emitter–Base Breakdown Voltage V(BR)EBO – 5.0 — Vdc
(IE = –10 µAdc, IC = 0)
Collector–Base Cutoff Current ICBO — – 0.1 µAdc
(VCB = – 400 Vdc, IE = 0)
Emitter–Base Cutoff Current IEBO — – 0.1 µAdc
(VBE = – 4.0 Vdc, IC = 0)
ON CHARACTERISTICS
DC Current Gain(2) hFE 50 150 —
(IC = – 10 mAdc, VCE = – 10 Vdc)
Saturation Voltages Vdc
(IC = –20 mAdc, IB = –2.0 mAdc) VCE(sat) — – 0.6
(IC = –20 mAdc, IB = –2.0 mAdc) VBE(sat) — – 1.0
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 in2.
2. Pulse Test: Pulse Width ≤ 300 µs; Duty Cycle = 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Supply Voltage VCC 6.0 Vdc
Recommended Operating Supply Voltage VCC 2.0–5.5 Vdc
Input Voltage Vin(fwd) 6.0 Vdc
Reverse Input Voltage Vin(rev) –0.5 Vdc
Output Sink Current Continuous IO 300 mA
Junction Temperature TJ 150 °C
Operating Ambient Temperature Range TA –40 to +85 °C
Storage Temperature Range Tstg –65 to +150 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation(1) PD 225 mW
Derate above 25°C
Thermal Resistance Junction to Ambient RqJA 556 °C/W
1. FR–5 PCB of 1″ x 0.75″ x 0.062″, TA = 25°C
Preferred devices are Motorola recommended choices for future use and best overall value.
This document contains information on a new product. Specifications and information herein are subject to change without notice.
OFF CHARACTERISTICS
Output Zener Breakdown Voltage V(BRout) 6.4 6.8 7.2 V
(@ IT = 10 mA Pulse) V(–BRout) — –0.7 —
ON CHARACTERISTICS
Input Bias Current @ Vin = 4.0 Vdc Iin mAdc
(IO = 250 mA, Vout = 0.4 Vdc, TA = –40°C) — 2.5 —
(correlated to a measurement @ 25°C)
Output Saturation Voltage Vdc
(IO = 250 mA, Vin = 4.0 Vdc, TA = –40°C) — 0.2 0.4
(correlated to a measurement @ 25°C)
Output Sink Current Continuous IC(on) mA
(TA = –40°C, VCE = 0.4 Vdc, Vin = 4.0 Vdc ) 250 — —
(correlated to a measurement @ 25°C)
tf tr
VCC
90%
50%
Vin
10% GND
tPLH tPHL
VZ
90% VCC
Vout 50%
10% GND
tTHL tTLH
+ +
AROMAT
TX2–L2–3 V
+ +
AROMAT
TX2–L2–3 V
+ +
AROMAT
TX2–L2–3 V
BAL99LT1 1k 1k BAL99LT1
74LS04 74LS04
6.8 V 6.8 V
33 k 33 k
Vin (1) Vin (1)
+ +
AROMAT AROMAT
R1 R2
TX2–5 V TX2–5 V
– –
4.5 225
3.5 175
V in (VOLTS)
IC (mA)
2.5 125
1.5 75
500M 25
10 30 50 70 90 10 30 50 70 90
TIME (ms) TIME (ms)
9 172
7 132
Vout (VOLTS)
IZ (mA)
5 92
3 52
1 12
10 30 50 70 90 10 30 50 70 90
TIME (ms) TIME (ms)
600 1
TJ = 125°C TJ = 25°C
Vo = 1.0 V
500 Vo = 0.25 V
0.8
OUTPUT VOLTAGE (V)
TJ = 85°C
400
0.6 175 250
TJ = 25°C
hFE
0.2
100
0 0
1 10 100 1000 1E–5 1E–4 1E–3 1E–2
Io, OUTPUT SINK CURRENT (mA) INPUT CURRENT
Figure 10. Pulsed Current Gain Figure 11. Collector Saturation Region
1
This device provides a reference voltage and acts as a DC feedback element 2
3
around an external discrete, NPN BJT or N–Channel FET. It allows the external
transistor to have its emitter/source directly grounded and still operate with a stable CASE 419B–01, Style 19
collector/drain DC current. It is primarily intended to stabilize the bias of discrete RF SOT–363
stages operating from a low voltage regulated supply, but can also be used to stabilize
the bias current of any linear stage in order to eliminate emitter/source bypassing and
achieve tighter bias regulation over temperature and unit variations. The “ENABLE”
polarity nulls internal current, Enable current, and RF transistor current in “STANDBY.” INTERNAL CIRCUIT DIAGRAM
This device is intended to replace a circuit of three to six discrete components.
The combination of low supply voltage, low quiescent current drain, and small VCC (4)
package make the MDC5001T1 ideal for portable communications applications such
as:
R1
• Cellular Telephones
Q1
• Pagers
R2
• PCN/PCS Portables
• GPS Receivers
R3 Vref (6)
• PCMCIA RF Modems
• Cordless Phones Q2 Iout (1)
VENBL
• Broadband and Multiband Transceivers and Other Portable Wireless Products R4
(5) R5
MAXIMUM RATINGS Q4
Rating Symbol Value Unit
Power Supply Voltage VCC 15 Vdc R6
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Power Dissipation PD mW
(FR–5 PCB of 1″ × 0.75″ × 0.062″, TA = 25°C) 150
Derate above 25°C 1.2 mW/°C
Thermal Resistance, Junction to Ambient RθJA 833 °C/W
REV 1
The following SPICE models are provided as a convenience to the user and every effort has been made to insure their accuracy.
However, no responsibility for their accuracy is assumed by Motorola.
10
= 1000 m A
= 500 m A
= 100 m A
= 10 mA
9
Iout
Iout
Iout
Iout
8
7
6
2
1
0
8
Vref (Vdc)
50 900
40 VCC = 2.75 Vdc Iout = 500 mA
800 VENBL = VCC
VENBL = VCC TJ = –40°C
Iout = 100 mA
500
0 Iout = 10 mA
400 TJ = 85°C
–10
300
–20
–30 200
–40 100
–50 0
–45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 0 1 2 3 4 5 6 7 8 9 10
TJ, JUNCTION TEMPERATURE (°C) VCC, SUPPLY VOLTAGE (Vdc)
1000 160
TJ = –40°C
TJ = –40°C VCC = 2.75 Vdc
140
500 TJ = 25°C Iref = 30 mA
TJ = 25°C
H FE , Q2 DC CURRENT GAIN
TJ = 85°C 120
300
IENABLE (m Adc)
200 100
TJ = 85°C
100 80
50 60
30 40
20 VCE2 = Vout – Vref = –1.5 Vdc
20
10 0
10 20 30 50 100 200 300 500 1000 0 0.5 1.0 1.5 2.0 2.5 3.0
Iout, DC OUTPUT CURRENT (mAdc) VENABLE (Vdc)
6.0
VCC = 5.0 Vdc Iout = 500 mA
5.0 Iout = 30 mA
4.0
3.3 Vdc
Vref , (Vdc)
1.5 4.0
VCC = 2.75 Vdc
1.0 IC3 = 15 mA VENBL = VCC 3.0 IC3 = 15 mA
IC3 = 10 mA
0.5 2.0 IC3 = 3 mA
IC3 = 10 mA IC3 = 1 mA
∆V ref (%)
0 IC3 = 3 mA 1.0
D IC 3 (%)
–0.5 0
–1.0 –1.0
IC3 = 1 mA VCC = 2.75 Vdc
–1.5 –2.0 VENBL = VCC
TA = 25°C
–2.0 –3.0
–45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 0 50 100 150 200 250 300
TA, AMBIENT TEMPERATURE (°C) EXTERNAL TRANSISTOR DC BETA @ IC3
10
VCC = 2.75 Vdc
VENBL = VCC
5.0 TA = 25°C
0
D I C 3 (%)
–5.0
IC3 = 15 mA
IC3 = 10 mA
–10 IC3 = 3 mA
IC3 = 1 mA
–15
0 50 100 150 200 250 300
HFE, EXTERNAL TRANSISTOR DC BETA
Q1
Q1
Q1 Q1
IB
+
+
VCC = Q1 Q1
2.75 V VCC
See NOTE 1
Figure 14. IENBL versus VENBL Test Circuit Figure 15. Vref versus VENBL Test Circuit
NOTE 1: VBE3 is used to simulate actual operating conditions that reduce VCE2 & HFE2, and increase IB2 & Vref.
VCC (4)
IC3
Q1
Vref (6)
ENABLE (5)
Q2 Iout (1) VBE3
A Q3
MDC5001 Iout
+ Q4 V Vref
VCC =
2.75 V
Figure 16. Vref and RF Stage IC3 versus HFE3 Test Circuit
VCC (4)
IC3
Q1
Vref (6)
ENABLE (5)
Q2 Iout (1) 1K VBE3 Q3
MRF941
HFE = 113
MDC5001 51
+ Q4
51
VCC =
2.75 V 0.1 mF 100 pF 100 pF
0.018 mF 0.018 mF
GND (2) & (3)
IC3 = 3 mAdc
Q1
R5
Vref (6) Vref = 2.025 Vdc 240 W
ENABLE
(5)
Q2 Iout (1)
VENBL 470 pF
30 nH
180
MDC5001 18 nH
+ 1K RF OUT
Q4 Q3
MRF9411
Iout
8.0 nH Typ
VCC = 2.75 V 470 pF
RF IN
GND (2) & (3) 9 pF
R5
43 W
Q1
RFC
Vref (6) Vref = 2.085 Vdc
ENABLE
(5)
Q2 Iout (1)
VENBL 1000 pF
6.8 nH
MDC5001 2.7 pF
+
Q4 1K RF OUT
Q3
R6 MRF9811
VCC = Iout 12.5 nH
22 K Typ
2.75 V 1000 pF
RF IN EGS
GND (2) & (3) 6.1 pF + 5 Vdc
In Brief . . .
New in this revision is Motorola’s GreenLine portfolio of
devices. These devices feature energy–conserving traits
superior to those of our existing line of standard parts for the 3
3
same usage. GreenLine devices can actually help reduce
the power demands of your products. In an increasingly 1
2
power–hungry world, Motorola’s GreenLine portfolio 2 1
makes powerful sense. So much sense that we plan to CASE 318-08 CASE 318D-04
continue adding devices to the portfolio. Chances are, there (TO-236AB) SC–59
are Motorola GreenLine devices applicable to one or more SOT-23
of your products – ones that can help save energy, dollars –
and the environment. 6
5
4 4
Currently, our portfolio consists of three families:
• Low–Leakage Switching Diodes: Reverse leakage 1
2
1
2
3 3
specifications guaranteed to 500 pA. They help extend bat-
tery life and are ideal for small battery powered systems in CASE 318E-04 CASE 318G-02
which standby power is essential. Applications include ESD (TO-261AA) TSOP–6
protection, reverse voltage protection, and steering logic. SOT-223
• Bipolar Output Driver Transistors: Ultra–low collector
saturation voltage. They deliver more energy to the intended 3 2
load with less power wasted through dissipation loss. Espe-
cially effective in lower voltage battery powered applications 1
1
and prolong battery life in portable and hand–held commu- 2
nications and personal digital equipment. Applications in- CASE 419-02 CASE 425-04
clude low voltage display light drivers and general output SC–70/SOT–323 SOD–123
drivers.
• Small Signal HDTMOS: Lowest ever drain–source re-
sistance versus package size. Lower rDS(on) means less
wasted energy through dissipation loss. Especially effective
for low–current applications where energy conservation is
crucial. These small MOSFETs are ideal for space–sensitive
power management circuitry. Applications include low cur-
rent switchmode power supplies, uninterruptable power sup-
plies (UPS), power management systems, and bias
switching.
This chapter exclusively highlights the GreenLine devices,
which are also listed in their respective Transistor, Diode and
MOSFET chapters.
BSS84LT1
Motorola Preferred Device
Low rDS(on) Small-Signal MOSFETs
TMOS Single P-Channel
Field Effect Transistors P–CHANNEL
ENHANCEMENT–MODE
Part of the Greenline Portfolio of devices with energy–conserv- TMOS MOSFET
ing traits.
These miniature surface mount MOSFETs utilize Motorola’s High
Cell Density, HDTMOS process. Reduced power loss conserves 3 DRAIN
energy, making this device ideal for use in small power manage- 3
ment circuitry. Typical applications are dc–dc converters, load
switching, power management in portable and battery–powered 1
products such as computers, printers, cellular and cordless
2
telephones. 1
CASE 318–08, Style 21
GATE
• Energy Efficient SOT–23 (TO–236AB)
• Miniature SOT–23 Surface Mount Package Saves Board Space
2 SOURCE
DEVICE MARKING
BSS84LT1 = PD
ORDERING INFORMATION
Device Reel Size Tape Width Quantity
BSS84LT1 7″ 8mm embossed tape 3000
BSS84LT3 13″ 8mm embossed tape 10,000
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
DYNAMIC CHARACTERISTICS
Input Capacitance (VDS = 5.0 Vdc) Ciss — 30 — pF
Output Capacitance (VDS = 5.0 Vdc) Coss — 10 —
Transfer Capacitance (VDG = 5.0 Vdc) Crss — 5.0 —
SWITCHING CHARACTERISTICS(2)
Turn–On Delay Time td(on) — 2.5 — ns
Rise Time ((VDD = –15 Vdc, ID = –2.5 Adc, tr — 1.0 —
Turn–Off Delay Time RL = 50 Ω) td(off) — 16 —
Fall Time tf — 8.0 —
Gate Charge QT — 6000 — pC
SOURCE–DRAIN DIODE CHARACTERISTICS
Continuous Current IS — — 0.130 A
Pulsed Current ISM — — 0.520
Forward Voltage(2) VSD — 2.5 — V
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperature.
0.6 0.5
VDS = 10 V 25°C TJ = 25°C VGS = 3.5 V
0.45
0.5
I D , DRAIN CURRENT (AMPS)
0.4 3.25 V
– 55°C
150°C
0.35
0.4
0.3 3.0 V
0.3 0.25
0.2 2.75 V
0.2
0.15
2.5 V
0.1
0.1
0.05 2.25 V
0 0
1 1.5 2 2.5 3 3.5 4 0 1 2 3 4 5 6 7 8 9 10
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS) VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
6 5
4.5
5 25°C
4 25°C
4 3.5
–55°C 3
3 –55°C
2.5
2 2
0 0.1 0.2 0.3 0.4 0.5 0.6 0 0.1 0.2 0.3 0.4 0.5 0.6
ID, DRAIN CURRENT (AMPS) ID, DRAIN CURRENT (AMPS)
Figure 3. On–Resistance versus Drain Current Figure 4. On–Resistance versus Drain Current
2 8
VDS = 40 V
1.8 VGS = 10 V 7 TJ = 25°C
ID = 0.52 A
1.6 6
(NORMALIZED)
5
1.4
VGS = 4.5 V
4
1.2 ID = 0.13 A
3 ID = 0.5 A
1
2
0.8
1
0.6 0
– 55 –5 45 95 145 0 500 1000 1500 2000
TJ, JUNCTION TEMPERATURE (°C) QT, TOTAL GATE CHARGE (pC)
1
I D , DIODE CURRENT (AMPS)
0.01
0.001
0 0.5 1.0 1.5 2.0 2.5 3.0
VSD, DIODE FORWARD VOLTAGE (VOLTS)
BSS138LT1
Motorola Preferred Device
1
GATE
2 SOURCE
DEVICE MARKING
BSS138LT1 = J1
ORDERING INFORMATION
Device Reel Size Tape Width Quantity
BSS138LT1 7″ 8mm embossed tape 3000
BSS138LT3 13″ 8mm embossed tape 10,000
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
DYNAMIC CHARACTERISTICS
Input Capacitance (VDS = 25 Vdc, VGS = 0, f = 1 MHz) Ciss — 40 50 pF
Output Capacitance (VDS = 25 Vdc, VGS = 0, f = 1 MHz) Coss — 12 25
Transfer Capacitance (VDG = 25 Vdc, VGS = 0, f = 1 MHz) Crss — 3.5 5.0
SWITCHING CHARACTERISTICS(2)
Turn–On Delay Time td(on) — — 20 ns
(VDD = 30 Vdc,
Vdc ID = 0.2
0 2 Adc,)
Adc )
Turn–Off Delay Time td(off) — — 20
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperature.
0.8 0.9
TJ = 25°C VGS = 3.5 V VDS = 10 V 25°C
0.7 0.8
– 55°C
I D , DRAIN CURRENT (AMPS)
0 0
0 1 2 3 4 5 6 7 8 9 10 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS) VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
2.2 1.25
RDS(on) , DRAIN–TO–SOURCE RESISTANCE
ID = 1.0 mA
2
VGS = 10 V
1.6
VGS = 4.5 V
1.4 ID = 0.5 A 1
1.2
1 0.875
0.8
0.6 0.75
– 55 –5 45 95 145 – 55 –30 –5 20 45 70 95 120 145
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
10
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
VDS = 40 V
TJ = 25°C
8
4
ID = 200 mA
2
0
0 500 1000 1500 2000 2500 3000
QT, TOTAL GATE CHARGE (pC)
6 5
5 4
25°C
4 25°C
3
3 –55°C
2 2 –55°C
1 1
0 0.05 0.1 0.15 0.2 0.25 0 0.05 0.1 0.15 0.2 0.25
ID, DRAIN CURRENT (AMPS) ID, DRAIN CURRENT (AMPS)
Figure 6. On–Resistance versus Drain Current Figure 7. On–Resistance versus Drain Current
RDS(on) , DRAIN–TO–SOURCE RESISTANCE (OHMS)
2.5 2
2 –55°C
1.5 –55°C
1.5
1 1
0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5
ID, DRAIN CURRENT (AMPS) ID, DRAIN CURRENT (AMPS)
Figure 8. On–Resistance versus Drain Current Figure 9. On–Resistance versus Drain Current
1 120
100
I D , DIODE CURRENT (AMPS)
60
Ciss
0.01 40
Coss
20
Crss
0.001 0
0 0.2 0.4 0.6 0.8 1.0 1.2 0 5 10 15 20 25
VSD, DIODE FORWARD VOLTAGE (VOLTS)
MGSF1N02LT1
Motorola Preferred Device
ORDERING INFORMATION
Device Reel Size Tape Width Quantity
MGSF1N02LT1 7″ 8mm embossed tape 3000
MGSF1N02LT3 13″ 8mm embossed tape 10,000
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
DYNAMIC CHARACTERISTICS
Input Capacitance (VDS = 5.0 Vdc) Ciss — 125 — pF
Output Capacitance (VDS = 5.0 Vdc) Coss — 120 —
Transfer Capacitance (VDG = 5.0 Vdc) Crss — 45 —
SWITCHING CHARACTERISTICS(2)
Turn–On Delay Time td(on) — 2.5 — ns
Rise Time ((VDD = 15 Vdc, ID = 1.0 Adc, tr — 1.0 —
Turn–Off Delay Time RL = 50 Ω) td(off) — 16 —
Fall Time tf — 8.0 —
Gate Charge (See Figure 6) QT — 6000 — pC
SOURCE–DRAIN DIODE CHARACTERISTICS
Continuous Current IS — — 0.6 A
Pulsed Current ISM — — 0.75
Forward Voltage(2) VSD — 0.8 — V
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperature.
2.5 3
VDS = 10 V
4V
2.5 3.25 V
I D , DRAIN CURRENT (AMPS)
2 3.5 V
2
1.5 – 55°C VGS = 3.0 V
1.5
1 TJ = 150°C
1 2.75 V
1.6
VDS = 16 V
1.5
VGS = 10 V TJ = 25°C
1.4 ID = 2 A 8
1.3
(NORMALIZED)
1 1000
VGS = 0 V
f = 1 MHz
I D , DIODE CURRENT (AMPS)
TJ = 25°C
TJ = 150°C 25°C –55°C
C, CAPACITANCE (pF)
0.1
Ciss
100
Coss
0.01
Crss
0.001 10
0 0.2 0.4 0.6 0.8 1 0 5 10 15 20
VSD, DIODE FORWARD VOLTAGE (VOLTS) VDS, DRAIN–TO–SOURCE VOLTAGE (Volts)
MGSF1N03LT1
Motorola Preferred Device
ORDERING INFORMATION
Device Reel Size Tape Width Quantity
MGSF1N03LT1 7″ 8mm embossed tape 3000
MGSF1N03LT3 13″ 8mm embossed tape 10,000
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 4
DYNAMIC CHARACTERISTICS
Input Capacitance (VDS = 5.0 Vdc) Ciss — 140 — pF
Output Capacitance (VDS = 5.0 Vdc) Coss — 100 —
Transfer Capacitance (VDG = 5.0 Vdc) Crss — 40 —
SWITCHING CHARACTERISTICS(2)
Turn–On Delay Time td(on) — 2.5 — ns
Rise Time ((VDD = 15 Vdc, ID = 1.0 Adc, tr — 1.0 —
Turn–Off Delay Time RL = 50 Ω) td(off) — 16 —
Fall Time tf — 8.0 —
Gate Charge (See Figure 6) QT — 6000 — pC
SOURCE–DRAIN DIODE CHARACTERISTICS
Continuous Current IS — — 0.6 A
Pulsed Current ISM — — 0.75
Forward Voltage(2) VSD — 0.8 — V
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperature.
2.5 2.5
VDS = 10 V VGS = 3.75 V
3.5 V
I D , DRAIN CURRENT (AMPS)
2 2
1.5 1.5
3.25 V
1 – 55°C 1
3.0 V
TJ = 150°C
0.5 0.5 2.75 V
25°C
2.5 V
0 0
1 1.5 2 2.5 3 3.5 0 2 4 6 8 10
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS) VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
25°C
0.14 0.1 25°C
–55°C 0.08
0.09 –55°C
0.06
0.04 0.04
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
ID, DRAIN CURRENT (AMPS) ID, DRAIN CURRENT (AMPS)
Figure 3. On–Resistance versus Drain Current Figure 4. On–Resistance versus Drain Current
1.8
VDS = 24 V
1.6 VGS = 10 V TJ = 25°C
1.4 ID = 2 A 8
1.2
(NORMALIZED)
VGS = 4.5 V
ID = 1 A 6
1
0.8
4
0.6
ID = 2.0 A
0.4
2
0.2
0 0
– 55 – 25 0 25 50 75 100 125 150 0 1000 2000 3000 4000 5000 6000
TJ, JUNCTION TEMPERATURE (°C) QT, TOTAL GATE CHARGE (pC)
1 350
VGS = 0 V
300 f = 1 MHz
I D , DIODE CURRENT (AMPS)
TJ = 25°C
TJ = 150°C 25°C –55°C
C, CAPACITANCE (pF)
250
0.1
200
150
Ciss
0.01
100
Coss
50
Crss
0.001 0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 4 8 12 16 20
VSD, DIODE FORWARD VOLTAGE (VOLTS) VDS, DRAIN–TO–SOURCE VOLTAGE (Volts)
MGSF1P02ELT1
Preliminary Information Motorola Preferred Device
ORDERING INFORMATION
Device Reel Size Tape Width Quantity
MGSF1P02ELT1 7″ 8mm embossed tape 3000
MGSF1P02ELT3 13″ 8mm embossed tape 10,000
Preferred devices are Motorola recommended choices for future use and best overall value.
DYNAMIC CHARACTERISTICS
Input Capacitance (VDS = 5.0 Vdc) Ciss — 130 — pF
Output Capacitance (VDS = 5.0 Vdc) Coss — 120 —
Transfer Capacitance (VDG = 5.0 Vdc) Crss — 60 —
SWITCHING CHARACTERISTICS(2)
Turn–On Delay Time td(on) — 2.5 — ns
Rise Time ((VDD = 15 Vdc, ID = 1.0 Adc, tr — 1.0 —
Turn–Off Delay Time RL = 50 Ω) td(off) — 16 —
Fall Time tf — 8.0 —
Gate Charge (See Figure 6) QT — 6000 — pC
SOURCE–DRAIN DIODE CHARACTERISTICS
Continuous Current IS — — 0.6 A
Pulsed Current ISM — — 0.75
Forward Voltage(2) VSD — 1.5 — V
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperature.
MGSF1P02LT1
Motorola Preferred Device
ORDERING INFORMATION
Device Reel Size Tape Width Quantity
MGSF1P02LT1 7″ 8mm embossed tape 3000
MGSF1P02LT3 13″ 8mm embossed tape 10,000
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
DYNAMIC CHARACTERISTICS
Input Capacitance (VDS = 5.0 Vdc) Ciss — 130 — pF
Output Capacitance (VDS = 5.0 Vdc) Coss — 120 —
Transfer Capacitance (VDG = 5.0 Vdc) Crss — 60 —
SWITCHING CHARACTERISTICS(2)
Turn–On Delay Time td(on) — 2.5 — ns
Rise Time ((VDD = 15 Vdc, ID = 1.0 Adc, tr — 1.0 —
Turn–Off Delay Time RL = 50 Ω) td(off) — 16 —
Fall Time tf — 8.0 —
Gate Charge (See Figure 6) QT — 6000 — pC
SOURCE–DRAIN DIODE CHARACTERISTICS
Continuous Current IS — — 0.6 A
Pulsed Current ISM — — 0.75
Forward Voltage(2) VSD — 1.5 — V
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperature.
1.5 1.5
VDS = 10 V VGS = 3.5 V
3.25 V
1.25 1.25
I D , DRAIN CURRENT (AMPS)
1 1
3.0 V
0.75 0.75
TJ = 150°C
– 55°C 2.75 V
0.5 0.5
25°C 2.5 V
0.25 0.25
2.25 V
0 0
1 1.5 2 2.5 3 3.5 0 1 2 3 4 5 6 7 8 9 10
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS) VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
1.25
VGS = 10 V VDS = 16 V
1.2
ID = 1.5 A TJ = 25°C
1.15 8
1.1
(NORMALIZED)
VGS = 4.5 V 6
1.05 ID = .75 A
1
4
0.95
ID = 1.5 A
0.9
2
0.85
0.8 0
– 55 –5 45 95 145 0 1000 2000 3000 4000 5000 6000
TJ, JUNCTION TEMPERATURE (°C) QT, TOTAL GATE CHARGE (pC)
1 1000
VGS = 0 V
f = 1 MHz
I D , DIODE CURRENT (AMPS)
TJ = 25°C
TJ = 150°C 25°C –55°C
C, CAPACITANCE (pF)
0.1
Ciss
100
Coss
0.01
Crss
0.001 10
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0 2 4 6 8 10
VSD, DIODE FORWARD VOLTAGE (VOLTS) VDS, DRAIN–TO–SOURCE VOLTAGE (Volts)
MGSF3441VT1
Preliminary Information Motorola Preferred Device
ORDERING INFORMATION
Device Reel Size Tape Width Quantity
MGSF3441VT1 7″ 8 mm embossed tape 3000
MGSF3441VT3 13″ 8 mm embossed tape 10,000
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.
DYNAMIC CHARACTERISTICS
Input Capacitance (VDS = 5.0 V) Ciss — 90 — pF
Output Capacitance (VDS = 5.0 V) Coss — 50 —
Transfer Capacitance (VDG = 5.0 V) Crss — 10 —
SWITCHING CHARACTERISTICS(2)
Turn–On Delay Time td(on) — 27 50 ns
Rise Time ( DD = 15 Vdc, ID = 1.0 A,
(V tr — 17 30
Turn–Off Delay Time VGEN = 10 V, RL = 10 Ω) td(off) — 52 80
Fall Time tf — 45 70
Gate Charge QT — 3000 — pC
SOURCE–DRAIN DIODE CHARACTERISTICS
Continuous Current IS — — 1.0 A
Pulsed Current ISM — — 20 A
Forward Voltage(2) VSD — 0.80 1.2 V
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperature.
20 20
VGS = 4.5 V 4.0 V
3.5 V TC = –55°C 125°C
16 16
3.0 V
25°C
12 12
2.5 V
8.0 8.0
2.0 V
4.0 4.0
1.5 V
0 0
0 1.0 2.0 3.0 4.0 5.0 0 1.0 2.0 3.0 4.0
VDS, DRAIN–TO–SOURCE VOLTAGE (V) VGS, GATE–TO–SOURCE VOLTAGE (V)
0.30 1400
1200
R DS(on) , ON–RESISTANCE ( W )
0.24
VGS = 2.5 V 1000
C, CAPACITANCE (pF)
0.18 800
600 Ciss
0.12
VGS = 4.5 V
400
0.06 Coss
200 Crss
0 0
0 4.0 8.0 12 16 20 0 4.0 8.0 12 16 20
ID, DRAIN CURRENT (A) VDS, DRAIN–TO–SOURCE VOLTAGE (V)
5.0 1.8
R DS(on) , ON–RESISTANCE ( W) (NORMALIZED)
VGS , GATE–TO–SOURCE VOLTAGE (V)
1.4
3.0
1.2
2.0
1.0
1.0
0.8
0 0.6
0 2.0 4.0 6.0 8.0 10 –50 –25 0 25 50 75 100 125 150
Qg, TOTAL GATE CHARGE (nC) TJ, JUNCTION TEMPERATURE (°C)
20 0.30
TJ = 150°C ID = 3.3 A
R DS(on) , ON–RESISTANCE ( W )
0.24
IS , SOURCE CURRENT (A)
10
TJ = 25°C
0.18
0.12
0.06
1.0 0
0 0.25 0.50 0.75 1.00 1.25 1.50 0 2.0 4.0 6.0 8.0
VSD, SOURCE–TO–DRAIN VOLTAGE (V) VGS, GATE–TO–SOURCE VOLTAGE (V)
0.4 20
0.3
16
V GS(th) , VARIANCE (V)
0.2
POWER (W)
12
0.1
ID = 250 mA 8.0
0
4.0
–0.1
–0.2 0
–50 –25 0 25 50 75 100 125 150 0.01 0.1 1.0 10
TJ, TEMPERATURE (°C) TIME (sec)
2.0
NORMALIZED EFFECTIVE TRANSIENT
1.0
DUTY CYCLE = 0.5
THERMAL IMPEDANCE
0.2
NOTES:
0.1
0.1 PDM 1. DUTY CYCLE, D = t1/t2
2. PER UNIT BASE =
0.05
2. RthJA = 62.5°C/W
3. TJM – TA = PDMZthJA(t)
0.02 t1 4. SURFACE MOUNTED
SINGLE PULSE t2
0.01
0.0001 0.001 0.01 0.1 1.0 10 30
MGSF3441XT1
Preliminary Information Motorola Preferred Device
ORDERING INFORMATION
Device Reel Size Tape Width Quantity
MGSF3441XT1 7″ 8 mm embossed tape 3000
MGSF3441XT3 13″ 8 mm embossed tape 10,000
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2