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APPLICATIONS FEATURES
• High Speed Optical Communications • High Responsivity
• Laser Range Finder • High Bandwidth / Fast Response
• Bar Code Readers • Low Noise
• Optical Remote Control • Low Bias Voltage
• Medical Equipment • Hermetically Sealed TO-Packages
• High Speed Photometry
Electro-Optical Characteristics (TA = 23° C, typical values at gain listed, unless otherwise specified)
Dark Breakdown
Active Area Current Q.E. Voltage Excess
Temperature (°C)
Temperature (°C)
Responsivity Gain
Package Style *2
Temperature Bandwidth
Ct Noise M
Coefficient
Operating
@Gain M Gain M M=1 100µA Figure
Storage
of -3dB
λ = 800 nm Gain λ = 800 λ=
Diameter*1
Area (mm2)
λ = 800
(A/W) nm nm
(pF) (%) nm
Typ Max Typ Max (V/°C) (MHz)
65 / TO-52 or
APD02-8-150-T52 0.2 0.03 0.05 1 1.5 75 150 250 0.45 1000 0.3 100 66 / TO-52L
65 / TO-52 or
APD05-8-150-T52 0.5 0.19 0.1 1 3 75 150 250 0.45 900 0.3 100
66 / TO-52L
50
65 / TO-52 or
APD10-8-150-T52 1.0 0.78 0.2 2 6 75 150 250 0.45 600 0.3 100
-55 ~ +125
-40 ~ +100
66 / TO-52L
APD15-8-150-TO5 1.5 1.77 0.5 5 10 75 150 250 0.45 350 0.3 100 67 / TO-5
46
APD Series 8-150
Silicon Avalanche Photodiodes, 800nm band
Typ. Spectral Response (TA= 23˚C, M = 100) Typ. Quantum Efficiency vs. Wavelength (TA= 23˚C)
100%
60
50 80%
Responsivity (A/W)
Responsivity (A/w)
Responsitivity (A/W)
Quantum Efficiency
40
60%
30
40%
20
20%
10
0%
0
400 500 600 700 800 900 1000 1100 400 500 600 700 800 900 1000 1100
Wavelength(nm)
(nm) Wavelength (nm)
Wavelength Wavelength (nm)
Typ. Dark Current vs. Reverse Bias (TA= 23˚C) Typ. Gain vs. Reverse Bias (TA= 23˚C, 800 nm)
APD30-8-150 APD50-8-150
APD15-8-150
Dark Current (pA)
APD10-8-150
Gain
APD05-8-150 APD02-8-150
APD50-8-150
APD30-8-150
APD15-8-150
APD10-8-150
APD05-8-150
APD02-8-150
Photodiodes in plastic packages should be given special care. Clear plastic packages are more sensitive to environmental stress than those
of black plastic. Storing devices in high humidity can present problems when soldering. Since the rapid heating during soldering stresses
the wire bonds and can cause wire to bonding pad separation, it is recommended that devices in plastic packages to be baked for 24 hours
at 85°C.
The leads on the photodiode SHOULD NOT BE FORMED. If your application requires lead spacing modification, please contact OSI
Optoelectronics Applications group at (310)978-0516 before forming a product’s leads. Product warranties could be voided.
*Most of our standard catalog products are RoHS Compliant. Please contact us for details
5. Windows
All ‘UV’ Enhanced products are provided with QUARTZ glass windows,
0.027 ± 0.002" thick.
All ‘XUV’ products are provided with removable windows.
All ‘DLS’ PSD products are provided with A/R coated glass windows.
All ‘FIL’ photoconductive and photovoltaic products are epoxy filled
instead of glass windows.
- Or -
visit our website at
www.osioptoelectronics.com
61
Mechanical Specifications
All units in inches. Pinouts are bottom view.
PIN-6DI, PIN-6DPI
APD50-8-150-TO8
PIN-44DI, PIN-44DPI,
OSD35-0, OSD35-7Q
P/N A
P/N A B W PIN-6DI/6DPI 0.115
PIN-020A 0.075 0.200 0.155 APD50-8-150-TO8
P/N A B W
PIN-040A 0.075 0.200 0.155 PIN-44DI/44DPI 0.125
All Others 0.094 0.180 0.240
OSD35-0 0.130
CD-25T 0.050 0.130 0.23
P/N A B
PIN-3CD / 3CDP 0.087 0.146
BPX-65 0.075 0.200
OSD-Prefix Devices 0.080 0.200
Quartz Window: OSD1.2-7Q
UV Transmissive Window: OSD1.2-7U
62
Mechanical Specifications
All units in inches. Pinouts are bottom view.
65 TO-52 66 TO-52L 67
0.213 0.213
0.185 0.185
0.098 0.059 .163
(W) 0.026
.091
0.098 0.128 0.150
0.098
0.511 min.
TO-8
0.551 min. 0.551 min.
0.08 0.08
NOM. 0.50 MIN. NOM. 0.50 MIN.
0.61
0.018 DIA.
0.018 DIA.
CATHODE & Q4
CATHODE &
CASE CASE
0.018 DIA. 1 2 3
0.012 DIA. ANODE 0.60 Q3 0.60
0.04 0.40 DIA.
0.40 DIA.
DIA. Q2 6 5 4