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1.3 µm resonant-cavity InGaAs/GaAs quantum dot light-emitting devices

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2001 Semicond. Sci. Technol. 16 844

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INSTITUTE OF PHYSICS PUBLISHING SEMICONDUCTOR SCIENCE AND TECHNOLOGY
Semicond. Sci. Technol. 16 (2001) 844–848 PII: S0268-1242(01)21999-3

1.3 µm resonant-cavity InGaAs/GaAs


quantum dot light-emitting devices
I L Krestnikov1 , N A Maleev1 , A V Sakharov1 , A R Kovsh1 ,
A E Zhukov1 , A F Tsatsul’nikov1 , V M Ustinov1 , Zh I Alferov1 ,
N N Ledentsov1,2 , D Bimberg2 and J A Lott3
1
Ioffe Physico-Technical Institute Russian Academy of Sciences, 26 Polytekhnicheskaya,
St Petersburg, 194021, Russia
2
Technische Universität Berlin, Hardenbergstrasse 36, 10623 Berlin, Germany
3
Air Force Institute of Technology, Department of Electrical and Computer Engineering,
2950 P Street B640, Wright-Patterson AFB, Ohio USA 45433

Received 14 February 2001, in final form 26 July 2001


Published 31 August 2001
Online at stacks.iop.org/SST/16/844

Abstract
Different types of microcavities for GaAs-based light emitting devices
operating in the 1.3 µm spectral range are analysed. Microcavity
light-emitting diodes (MC LEDs) can be fabricated with different designs of
distributed Bragg reflectors (DBRs), e.g.: top and bottom AlAs/GaAs
semiconductor DBRs; bottom AlAs/GaAs semiconductor and top dielectric
DBRs; and oxidized Alx Oy /GaAs DBRs. MC LEDs operating in the 1.3 µm
spectral range and characterized by spectral width (13 nm) and narrow
far-field pattern (<20 degrees) are reported. In the case of vertical-cavity
surface-emitting lasers (VCSELs), practical implementation of injection
lasing can be only achieved with oxidized Alx Oy /GaAs DBRs, despite the
fact that DBRs with nominally comparable parameters can be fabricated. It
is shown that the 1.3 µm InAs/InGaAs quantum dot (QD) VCSEL exhibits
remarkably low internal losses, compared with QD VCSELs operating near
1 µm. This enables use of high-reflectance DBRs, important for lasing in
low modal gain media, with high (>40%) differential efficiency retained. A
threshold current of <2 mA at 300 K is achieved (λ = 1.304 µm).

1. Introduction substrates instead of the conventional InP-based analogues for


the same spectral range. During more recent years, several
In recent years, light emitting devices operating at 1.3 and groups have demonstrated lasing operation at 1.3 µm in edge-
1.55 µm have gained a 70% share of the semiconductor emitting devices on GaAs substrates with various active media:
laser market and demonstrated a 60% annual sales growth InGaAs/GaAs quantum dots (QDs) [3, 4]; InGaAsN quantum
in 1999. In spite of this rapid progress, the lasers currently wells (QWs) [5, 6]; and GaAsSb QWs [7]. The possibility
sold operate in the edge-emitting mode. At the same of developing 1.3 µm VCSELs with GaAsSb/GaAs [8] or
time, 1.3 µm and 1.55 µm VCSELs are very attractive for GaInNAs/GaAs [9] QW active regions has also been reported.
TELECOM applications as lasers allowing better coupling However, in contrast to GaAs-related applications in the 0.85–
to fibre and ensuring good temperature stability of the 1.0 µm range for local networks (see references in [10, 11]),
emission wavelength, in contrast to edge-emitting devices. only few GaAs-based VCSELs have been reported for the
Currently, 1.3 µm VCSELs are fabricated using structures 1.3 µm range until very recently [12–14].
based on InGaAsP/InP optical microcavities fused to AlGaAs This stimulated attempts to find another candidate for
distributed Bragg reflectors (DBRs) [1] or employ the optical emitters operating in the 1.3 and 1.55 µm ranges, such as
pumping of 1.3 µm VCSELs by adjacent electrically injected a microcavity light-emitting diode (MC LED) [15]. This
0.85 µm VCSELs [2]. These devices may have only limited device shows high reliability, low temperature sensitivity and
application because of the high cost of production. This has narrow far-field pattern, is easy to fabricate and possesses no
stimulated attempts to use light-emitting devices on GaAs threshold characteristics. On the other hand, as compared with

0268-1242/01/100844+05$30.00 © 2001 IOP Publishing Ltd Printed in the UK 844


1.3 µm resonant-cavity InGaAs/GaAs QD light-emitting devices

VCSELs, MC LEDs have lower brightness and efficiency. In SiO2/ZrO2


(a)
this paper, we report on a study of various types of vertical DBR
microcavities with InAs/InGaAs QDs emitting at 1.3 µm. GaAs/GaAlAs ●






















● ● ●

Owing to the relatively small modal gain provided by the DBR ●






























● ● ● ●
● ● ● ●
● ● ● ●
● ● ● ●

QD media, only high finesse resonators are to be used in Cavity












▲ ▲ ▲ ▲ ▲ ▲ ▲▲ ▲ ▲ ▲ ▲
● ●

















VCSEL fabrication. However, low internal losses may provide with QDs ● ● ●




a sufficient efficiency.

2. Experimental
GaAs/AlAs
All the structures were grown by molecular beam epitaxy DBR
(MBE) on (001)GaAs substrates in a RIBER 32 chamber.
Test and MC LED structures were equipped with 33-period
bottom AlAs/GaAs distributed Bragg reflectors (DBRs). In
the test structures, three layers of InAs/InGaAs QDs [16] GaAs
separated by 25 nm GaAs spacers were placed at the centre substr.
of a 1λ undoped GaAs cavity (λ is the resonance wavelength).
For MC LED structures, we used a 2λ cavity with the same (b)
active region. On both sides of the active region, short-
period Al0.25 Ga0.75 As/GaAs superlattices (SL) with effective GaAs/AlO
DBR
thickness of λ/4 were placed as emitters. Two last pairs of the
AlAs/GaAs DBR and the bottom part of the cavity (including
the short-period SL) were n-doped with Si, while the top part
of the cavity (including the short-period SL) was p-doped
Cavity ▲ ▲ ▲ ▲▲▲ ▲ ▲ ▲ ▲ ▲
with Be. MC LED structures were completed with 2 pairs of with QDs
Al0.25 Ga0.75 As:Be/GaAs:Be DBRs necessary for better current
spreading. The top mirror was formed by thermal deposition of
ZrO2 /SiO2 DBR for both the test and the MC LED structures
(figure 1(a)). In the VCSEL structure, the role of mirrors GaAs/AlO
was played by Alx Oy /GaAs DBRs (5 and 7.5 periods for, DBR
respectively, the top and bottom DBRs) fabricated by post-
growth oxidation of AlAs layers. The symmetrical 5λ cavity
consisted of a 7/4λ GaAs:(Si or Be) layer adjoining the DBRs,
λ/4 AlAs:(Si or Be) layers linearly graded to GaAs on both GaAs
sides and central undoped GaAs layer. Three sheets of QDs substr.
were also placed at the cavity centre (figure 1(b)).
For both the MC LED and the VCSEL devices, intracavity Figure 1. Schematic view of MC LED (a) and VCSEL (b).
contacts were used. In MC LED devices, current confinement
was achieved by proton implantation, with aperture oxidation
states through QD size fluctuations is 55 nm (40 meV). Placing
serving this purpose in the VCSEL structure. In more
the QDs in a microcavity can strongly affect the PL spectra,
detail the device fabrication is described elsewhere [17,
with their broadening depending only on microcavity’s finesse.
18]. Photoluminescence (PL) was excited by an Ar+ laser
Raising the finesse by using a top dielectric DBR with varied
(100 W cm−2 ). The light of a tungsten lamp was used
number of pairs results in a strong narrowing of the PL spectra
for optical reflectivity (OR) measurements. A double-pass
(down to 4 nm) for a high-finesse microcavity (figure 2(a)).
monochromator and a Ge-photodetector were used together
The full width at half-maximum (FWHM) of the PL spectra
with a lock-in detecting system. The laser operated in the
corresponds to that of the dip in the OR spectra (figure 2(b)),
pulse regime with an off-duty factor of 10.
inversely proportional to the microcavity’s finesse.
In these experiments, we observed that the decrease in
3. Results and discussion the FWHM of the dip tends to a constant value of 4 nm
after deposition of 5–6 pairs of dielectric DBRs. This can
3.1. Photoluminescence and optical reflection from be accounted for by the nonideality of the bottom AlAs/GaAs
structures with quantum dots in a microcavity DBR, caused by fluctuations of the quarter-wavelength layer
thickness. The actual reflectance of the mirrors can be obtained
A typical PL spectrum of InAs/InGaAs QDs emitting at 1.3 µm
from the following equation [10]:
is presented in figure 2(a). This spectrum was obtained from a
satellite structure comprising only a QD active region without Nλ/2
any DBR. It can be clearly seen that this PL spectrum consists Rt Rb = 1 − 2π (1)
Q
of two peaks corresponding to the ground and excited states
of QDs (the results of digital peak analysis are represented by where Rt and Rb are the reflectivities of the top and bottom
broken curves). The inhomogeneous broadening of the ground DBRs, Nλ/2 is the effective order of the cavity, and Q is the

845
I L Krestnikov et al

10
(a) (b) (a) (b)

EL intensity (arb. units)


satellite 8
1
Normalized PL intensity

Light power (µW)


Optical reflection
6
0 pair top DBR 1.25 1.30 1.35
1 Wavelength (µm)
4 0
(c) −30 30
2 pair top DBR D1
1 2
D2
D3
13 pair top DBR 0
0 0 5 10 15 20 25 30 35 40 45 60 90 120 150 180
1.0 1.1 1.2 1.3 1.4 1.5 1.0 1.1 1.2 1.3 1.4 1.5 Current (mA) Angle (grad)
Wavelength (µm) Wavelength (µm)
Figure 3. L–I characteristics of MC LEDs with different
Figure 2. PL spectra at room temperature for satellite and test apertures (a), the spectral characteristics of MC LED (D1) measured
structures with different numbers of pairs in the top DBRs (a) and after coupling to an optical fibre at different drive currents (20, 5, 1,
OR spectra for the same test structures (b). Broken curves represent 0.3 and 0.15 mA) (b) and the angle distribution of the emission (c).
the results obtained on applying digital peak analysis to the The broken curve corresponds to the case of a conventional LED
experimental spectrum. with a cosine radiance pattern. The inset presents the same data in
polar co-ordinates.
quality factor of the cavity (Q = λ/λ, λ is the resonance
wavelength, and λ is the FWHM of the reflectivity dip). In LED and the VCSEL practical geometries used in this work,
the case in question, Nλ/2 ≈ 6 owing to the penetration of the modal gain in our vertical-emitting devices is 2 times
the electromagnetic field into DBRs and Q = 430, and, thus, less than that in the edge-emitting lasers and does not exceed
the actual value of Rt Rb calculated from (1) is 91% instead 10 cm−1 . This value is far too small compared with the EOLs
of 99.995% in the ideal case. The ideal and the real values of (200 cm−1 ) for the structure design with bottom semiconductor
Rt Rb can be used to calculate the external optical losses (EOL). AlAs/GaAs and top dielectric DBRs. Laser generation can
For our MC LED geometry, the effective cavity thickness at hardly be achieved in this case.
which the electromagnetic field penetration into the DBRs is To overcome this problem, we used Alx Oy /GaAs DBRs.
to be taken into account equals 2100 nm, and the EOL are 0.1– These materials have very different refractive indices (1.7 and
0.2 cm−1 for the ideal DBR structure. The estimated real losses 3.45 at 1.3 µm for Alx Oy and GaAs, respectively). This
are 250 cm−1 . For lasing to be successfully achieved, this value allows use of a DBR with only few periods and drastically
should be exceeded by the gain, which is hardly possible for the decreases the influence of the cell-depletion effect. On the
practical QD media. Such a high difference between the ideal other hand, the considerable difference between the refractive
and real DBR reflectivities may occur for the following two indices also makes it possible to obtain a very broad stop-
reasons: first, in the case under study it is relatively difficult to band of the DBR, and the displacement of the cavity mode
match the cavity mode and the DBR reflectivity maximum with respect to the maximum reflectivity wavelength affects
because of the molecular flux gradients over the substrate. the device performance to a much lesser extent. Calculations
Second, the flux transients are rather pronounced for very thick for oxidized DBRs show that EOL amount to 3 cm−1 in the
all-semiconductor DBR structures, and the top DBR periods ideal case. This value is much worse, compared with the EOL
differ from those prescribed by the design. in ideal all-semiconductor DBRs, but is still good enough to
achieve lasing. On the other hand, in spite of the relatively
3.2. Design of the device low EOL, a reasonable differential efficiency can be achieved
if the internal losses are lower. For QD based structures, the
Figure 3 shows electroluminescence (EL) spectra of typical value of the internal losses is 1–2 cm−1 [21], which is
conventional non-resonant LEDs with the same active region. much lower than the ideal EOL in the case of the aluminium
It can be clearly seen that, with increasing current, the peak oxide DBRs. On the other hand, for GaAs-based QD lasers
intensity of the QD ground state levels off while the integral emitting at 1 µm, the internal losses are close to 3–5 cm−1 ,
intensity is linear up to the highest current densities. The gain making difficult operation with high differential efficiency and
saturation at the QD ground state wavelength has also been requiring higher EOL to achieve high differential efficiency.
observed in edge-emitting lasers based on stacked QDs [19]. For example, the differential efficiency was ∼30% for a 1 µm
It has been shown that the modal gain does not exceed a value GaAs-based VCSEL with only a 3-period Alx Oy /GaAs top
of ∼4 cm−1 per QD sheet [20]. DBR and dropped to ∼4% for a 5-period DBR [22].
To apply this knowledge to the vertical emitting devices,
we first suggest that the QDs have similar material gains for
3.3. Characterization of the light emitting devices
all directions, which is true if the QD exciton wavefunction
symmetry is nearly spherical. Second, we consider the Since no conditions for low EOL are applicable to MC LEDs,
difference between the confinement γ -factors for edge- and we used only two pairs in the top dielectric DBR. In this
vertical-emitting devices, together with the effect of field case, the spectral width of the emission is narrow enough
enhancement in the cavity. For example, for both the MC (∼10 nm). Further enhancement of the reflection of this mirror,

846
1.3 µm resonant-cavity InGaAs/GaAs QD light-emitting devices

250 50 4. Conclusion

Differential quantum efficiency (%)


200 EL intensity (arb. units) 40 QD MC LEDs operating at 1.3 µm with a spectral bandwidth
of 13 nm and a far-field radiance pattern narrower than
Optical power (µW)

20 have been fabricated. Pulsed lasing at 1.3 µm via the


150 30
QD ground state has been achieved for GaAs-based VCSEL
containing three uncoupled sheets of InAs/InGaAs QD active
100 20 layers. The experimental devices operate at room temperature
with threshold currents below 2 mA and differential slope
50 1.29 1.30 1.31 1.32 10 efficiencies exceeding 40%.
Wavelength (µm)

0 0 Acknowledgments
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Current (mA)
This work was supported by NanOp, the Russian Foundation
Figure 4. Output power (full curve) and differential quantum for Basic Research, the Volkswagen Foundation, INTAS,
efficiency (broken curve) versus drive current for VCSEL at room and the US Air Force Office of Scientific Research (Dr
temperature. Inset shows an EL spectrum taken at I = 1.05Ith . H R Schlossberg). NNL acknowledges support from the
DAAD Guest Professorship.
achieved by making larger the number of pairs, results in a
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