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1. General description
The HEF4051B is an 8-channel analog multiplexer/demultiplexer with three address
inputs (S1 to S3), an active LOW enable input (E), eight independent inputs/outputs
(Y0 to Y7) and a common input/output (Z). The device contains eight bidirectional analog
switches, each with one side connected to an independent input/output (Y0 to Y7) and the
other side connected to a common input/output (Z). With E LOW, one of the eight
switches is selected (low-impedance ON-state) by S1 to S3. With E HIGH, all switches
are in the high-impedance OFF-state, independent of S1 to S3. If break before make is
needed, then it is necessary to use the enable input.
VDD and VSS are the supply voltage connections for the digital control inputs (S1 to S3,
and E). The VDD to VSS range is 3 V to 15 V. The analog inputs/outputs (Y0 to Y7, and Z)
can swing between VDD as a positive limit and VEE as a negative limit. VDD VEE may not
exceed 15 V. Unused inputs must be connected to VDD, VSS, or another input. For
operation as a digital multiplexer/demultiplexer, VEE is connected to VSS (typically
ground). VEE and VSS are the supply voltage connections for the switches.
3. Applications
Analog multiplexing and demultiplexing
Digital multiplexing and demultiplexing
Signal gating
NXP Semiconductors HEF4051B
8-channel analog multiplexer/demultiplexer
4. Ordering information
Table 1. Ordering information
All types operate from 40 C to +125 C.
Type number Package
Name Description Version
HEF4051BP DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
HEF4051BT SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
HEF4051BTS SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1
HEF4051BTT TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
5. Functional diagram
VDD
16
13 Y0
S1 11 14 Y1
15 Y2
S2 10 12 Y3
LOGIC
1 − OF − 8 1 Y4
LEVEL
DECODER
CONVERSION
S3 9 5 Y5
2 Y6
E 6 4 Y7
3 Z
8 7
VSS VEE 001aac277
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Yn
VDD VDD
Z
VEE
001aac281
11
1
10 0
X
9 7
Y0 3
13
6
S1 Y1 EN
11 14
S2 Y2
10 15
MUX/DMUX
S3 Y3 13
9 12 0
Y4 14
1 1
Y5 15
5 2
Y6 12
3 3
2
1
E Y7 4
6 4
3 5
5
Z 2
001aac278
6
4
7
001aac279
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Y0
Y1
LEVEL
S1
CONVERTER
Y2
LEVEL
S2
CONVERTER
Y3
LEVEL
S3
CONVERTER
Y4
LEVEL
E
CONVERTER
Y5
Y6
Y7
Z
001aac280
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
6. Pinning information
6.1 Pinning
HEF4051B
Y4 1 16 VDD
Y6 2 15 Y2 HEF4051B
Z 3 14 Y1
Y4 1 16 VDD
Y7 4 13 Y0 Y6 2 15 Y2
Z 3 14 Y1
Y5 5 12 Y3
Y7 4 13 Y0
E 6 11 S1 Y5 5 12 Y3
E 6 11 S1
VEE 7 10 S2
VEE 7 10 S2
VSS 8 9 S3 VSS 8 9 S3
001aak508 001aac282
Fig 6. Pin configuration SOT38-4 and SOT109-1 Fig 7. Pin configuration SOT338-1 and SOT403-1
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
7. Functional description
8. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0.5 +18 V
VEE supply voltage referenced to VDD [1] 18 +0.5 V
IIK input clamping current pins Sn and E; - 10 mA
VI < 0.5 V or VI > VDD + 0.5 V
VI input voltage 0.5 VDD + 0.5 V
II/O input/output current - 10 mA
IDD supply current - 50 mA
Tstg storage temperature 65 +150 C
Tamb ambient temperature 40 +125 C
Ptot total power dissipation Tamb = 40 C to +125 C [2]
[1] To avoid drawing VDD current out of terminal Z, when switch current flows into terminals Y, the voltage drop across the bidirectional
switch must not exceed 0.4 V. If the switch current flows into terminal Z, no VDD current will flow out of terminals Y, and in this case there
is no limit for the voltage drop across the switch, but the voltages at Y and Z may not exceed VDD or VEE.
[2] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C.
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
001aac285
15
VDD − VSS
(V)
10
operating area
0
0 5 10 15
VDD − VEE (V)
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
VDD
S1 to S3
VDD or VSS
Z Yn
E
IS VSS = VEE
VDD
VO VI
001aak513
VDD
S1 to S3 Y0 1
VDD or VSS switch
IS
Z Yn 2
E
VSS = VEE
VSS
VI VO
001aak514
Fig 10. Test circuit for measuring OFF-state leakage current Yn port
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
10.2 ON resistance
Table 7. ON resistance
Tamb = 25 C; ISW = 200 A; VSS = VEE = 0 V.
Symbol Parameter Conditions VDD VEE Typ Max Unit
RON(peak) ON resistance (peak) VI = 0 V to VDD VEE; 5V 350 2500
see Figure 11 and Figure 12 10 V 80 245
15 V 60 175
RON(rail) ON resistance (rail) VI = 0 V; see Figure 11 and Figure 12 5V 115 340
10 V 50 160
15 V 40 115
VI = VDD VEE; 5V 120 365
see Figure 11 and Figure 12 10 V 65 200
15 V 50 155
RON ON resistance mismatch VI = 0 V to VDD VEE; see Figure 11 5V 25 -
between channels 10 V 10 -
15 V 5 -
V
VDD VSW
S1 to S3
VDD or VSS
Z Yn
E
VSS = VEE
VSS
ISW VI
001aak512
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
001aae648
400
RON
(Ω)
VDD = 5 V
300
200
100 10 V
15 V
0
0 5 10 15
VI (V)
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
VDD
Yn or Z
input VM VDD
VEE Sn input VM
VSS
tPLH tPHL
tPLH tPHL
VO VO
90 %
Yn or Z
Z or Yn VM output
output VEE 10 %
VEE switch OFF switch ON switch OFF
001aak509 001aak510
Measurement points are given in Table 9. Measurement points are given in Table 9.
Fig 13. Yn, Z to Z, Yn propagation delays Fig 14. Sn to Yn, Z propagation delays
VDD
E input VM
VSS
tPLZ tPZL
VO 90 %
Yn or Z output
LOW-to-OFF
OFF-to-LOW 10 %
VEE
tPHZ tPZH
VO
90 %
Yn or Z output
HIGH-to-OFF
OFF-to-HIGH
VEE 10 %
001aak511
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
tW
VI
negative 90 %
VM VM
pulse
10 %
0V
tf tr
tr tf
VI
positive 90 %
VM VM
pulse 10 %
0V
tW
VDD
VDD VI
VI VO RL S1
PULSE open
DUT
GENERATOR
RT CL
VSS
VEE
001aaj903
[1] For Yn to Z or Z to Yn propagation delays use VEE. For Sn to Yn or Z propagation delays use VDD.
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
VDD VDD
S1 to S3 S1 to S3
VDD or VSS VDD or VSS
Z Yn Z Yn
E E
VSS = VEE VSS = VEE
VSS VSS
RL CL D RL CL dB
fi fi
001aak516 001aak517
Fig 17. Test circuit for measuring total harmonic Fig 18. Test circuit for measuring frequency response
distortion
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
VDD
S1 to S3 Y0 1
VDD or VSS switch
Z Yn 2
E
VSS = VEE
VSS RL CL dB
fi
001aak518
0.5VDD VDD
RL
S1 to S3 Y0 1
switch
Z Yn 2
E
G VSS = VEE RL CL V VO
VDD or VSS
001aak519
a. Test circuit
VO Vct
001aaj908
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
VDD
VDD
S1 to S3 Y0
S1 to S3 Y0 VDD or VSS
VDD or VSS
Z Yn
Z Yn
E
E
VSS = VEE
VSS = VEE VSS VI RL
VSS RL VO RL
VI RL VO
001aak520 001aak521
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
D ME
seating plane
A2 A
L A1
c
Z e w M
b1
(e 1)
b b2
16 9 MH
pin 1 index
E
1 8
0 5 10 mm
scale
UNIT
A A1 A2
b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 1.25 0.36 19.50 6.48 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 0.76
1.30 0.38 0.85 0.23 18.55 6.20 3.05 7.80 8.3
inches 0.068 0.021 0.049 0.014 0.77 0.26 0.14 0.32 0.39
0.17 0.02 0.13 0.1 0.3 0.01 0.03
0.051 0.015 0.033 0.009 0.73 0.24 0.12 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
95-01-14
SOT38-4
03-02-13
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
D E A
X
y HE v M A
16 9
Q
A2
(A 3) A
A1
pin 1 index
θ
Lp
1 8 L
e w M detail X
bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
99-12-27
SOT109-1 076E07 MS-012
03-02-19
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1
D E A
X
c
y HE v M A
16 9
Q
A2 A
A1 (A 3)
pin 1 index
θ
Lp
L
1 8 detail X
w M
e bp
0 2.5 5 mm
scale
mm 2
0.21 1.80 0.38 0.20 6.4 5.4 7.9 1.03 0.9 1.00 8o
0.25 0.65 1.25 0.2 0.13 0.1 o
0.05 1.65 0.25 0.09 6.0 5.2 7.6 0.63 0.7 0.55 0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT338-1 MO-150
03-02-19
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
D E A
X
y HE v M A
16 9
Q
A2 (A 3)
A
A1
pin 1 index
θ
Lp
L
1 8
detail X
w M
e bp
0 2.5 5 mm
scale
mm 1.1
0.15 0.95 0.30 0.2 5.1 4.5 6.6 0.75 0.4 0.40 8o
0.25 0.65 1 0.2 0.13 0.1 o
0.05 0.80 0.19 0.1 4.9 4.3 6.2 0.50 0.3 0.06 0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT403-1 MO-153
03-02-18
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Limited warranty and liability — Information in this document is believed to Limiting values — Stress above one or more limiting values (as defined in
be accurate and reliable. However, NXP Semiconductors does not give any the Absolute Maximum Ratings System of IEC 60134) will cause permanent
representations or warranties, expressed or implied, as to the accuracy or damage to the device. Limiting values are stress ratings only and (proper)
completeness of such information and shall have no liability for the operation of the device at these or any other conditions above those given in
consequences of use of such information. the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
In no event shall NXP Semiconductors be liable for any indirect, incidental,
repeated exposure to limiting values will permanently and irreversibly affect
punitive, special or consequential damages (including - without limitation - lost
the quality and reliability of the device.
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale — NXP Semiconductors
damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial
contract or any other legal theory. sale, as published at http://www.nxp.com/profile/terms, unless otherwise
Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective
customer for the products described herein shall be limited in accordance agreement shall apply. NXP Semiconductors hereby expressly objects to
with the Terms and conditions of commercial sale of NXP Semiconductors. applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without No offer to sell or license — Nothing in this document may be interpreted or
limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant,
notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or
to the publication hereof. other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed, Export control — This document as well as the item(s) described herein
authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior
safety-critical systems or equipment, nor in applications where failure or authorization from competent authorities.
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Non-automotive qualified products — Unless this data sheet expressly NXP Semiconductors’ specifications such use shall be solely at customer’s
states that this specific NXP Semiconductors product is automotive qualified, own risk, and (c) customer fully indemnifies NXP Semiconductors for any
the product is not suitable for automotive use. It is neither qualified nor tested liability, damages or failed product claims resulting from customer design and
in accordance with automotive testing or application requirements. NXP use of the product for automotive applications beyond NXP Semiconductors’
Semiconductors accepts no liability for inclusion and/or use of standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer 14.4 Trademarks
(a) shall use the product without NXP Semiconductors’ warranty of the
Notice: All referenced brands, product names, service names and trademarks
product for such automotive applications, use and specifications, and (b)
are the property of their respective owners.
whenever customer uses the product for automotive applications beyond
HEF4051B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
16. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Functional description . . . . . . . . . . . . . . . . . . . 6
7.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Recommended operating conditions. . . . . . . . 7
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
10.1 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
10.2 ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 9
10.2.1 ON resistance waveform and test circuit . . . . . 9
11 Dynamic characteristics . . . . . . . . . . . . . . . . . 10
11.1 Waveforms and test circuit . . . . . . . . . . . . . . . 11
11.2 Additional dynamic parameters . . . . . . . . . . . 13
11.2.1 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20
14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
14.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
14.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
15 Contact information. . . . . . . . . . . . . . . . . . . . . 22
16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.