Professional Documents
Culture Documents
COZZ1
COZZ3
COZZ4
PAC3502 PAU209
COU2
PAU208 COC40 PAR3702 PAR3701
COTP12 PATP1201 COC35 PAC3501 PAU2010 PAU207
COC28 COR20 PAC4002 PAC4001
PAQ404 PAQ304
PAU2011 PAU206
PAU2012 PAU205 PAC2801 PAR20 2 PAR20 1
COC19 PAU2013
PAU2014
PAU204
PAU203
PAC4401
COR15 COC44PAR1501
PAC2802 PAC4402 PAR1502
PAR1302 PAC1901
PAU40
PAC4501
COC18 PAC1801 PAC1802 PAC3302
COC45 PAQ401 PAQ403 PAQ301 PAQ303
PAC4502COR16
COC20
PAC2001 PAC2002 PATP1101 COQ4 COQ3
COD8 PAD801 PAD802
COD6 COD5
COC4 COJ1
PAD601 PAD602 PAD501 PAD502
PAC401 PAJ101 COU1
PAC402 PAJ102 PATP201 COR23 PPAARR22330012 PPAACC33220021 COC32 PAU109
PAU1010
PAU108
PAU107
COC39
PAC3902 PAC3901 COD1 COD2
COTP2 PAU1011 PAU106
COC12
PAJ103
PAU30
PATP401 COTP4 PAU1012 PAU105 PAC1201 PAR10 2 PAR10 1 COR10 COQ2 COQ1 PAD102 PAD101 PAD202 PAD201 PAU301
COJ4
PAJ401
COC9
PAR302 PAR301 COR3
PAC101 PAC102
COC1
COC3 PAC301 PAC302
COD4 PAD401
PAC1402
PAD402
PAC1302 COR6
COC14 COC13
PAQ204 PAQ104
PAD1001 PATP301 COR36
PAJ402
PAD1002
COD10 COD3
COR2
PAD301
PAR201 PAR202
PAD302
COTP3
PAR3601 PAR3602 PAR801 PAR701 PAR901
COR8 COR7 COR9
COJ5
PATP101 COTP1 COJ2 COC15 PAC1502 PAC1501 PAC10 1 PAC10 2COC10 PAR802 PAR702 PAR902
PAU301
COR34
PAJ502 PAJ201 PAL104 PAL101
COC41 PAC4102 PAC4101 PAC701 PAC702 COC7 PAR3401
COR24 COL1
PAJ501 PAJ202 PAR3402
PAR2401 PAR2402 PAD902 PAD901 COD9 PAL103 PAL102
COFID3
3ZZOC
4ZZOC
1DIFOC
102DIFAP 2051DAP 12008932CRAAPP 21008932CRAAPP 9832CROOCC
101DIFAP
51DOC
1051DAP
62COC 72COC 3JOC
304LAP 204LAP 1062CAP 1072CAP 103JAP
4LOC
PAU401
2022RAP 2023RAP 2033RAP PAU403
2053CAP
62ROC
1044CAP
2051RAP 104514RCAOP C205414RCOACP 2082CAP
402UAP
302UAP
3102UAP
4102UAP
91COC
1091CAP 2031RAP
PAU401
3UOC
2031DAP 1063CAP 2063CAP 63COC
2012RAP 2081RAP 2091RAP
5DOC 6DOC
1QOC 2QOC
1011CAP 401UAP 3101UAP
4PTOC 104PTAP 401JAP
101QAP 301QAP 102QAP 302QAP 205RAP 1051R1ACPOC52R01O1CCAP 2021CAP 301UAP
201UAP
4101UAP 2COC 1ROC
5101UAP 102CAP 201RAP
206RAP 10160R3A1CPAP 1041CAP 101UAP 6101UAP
202CAP 101RAP
501JAP
204RAP 209CAP
4ROC 104RAP 109CAP 601JAP
3ROC
9COC
103RAP 203RAP
104JAP
4JOC
43ROC
101LAP 401LAP 102JAP 205JAP
1043RAP 7COC 207CAP 107CAP 1014CAP 42R201O4CACP 14COC
1LOC
2043RAP 202JAP 105JAP
201LAP 301LAP 9DOC 109DAP 209DAP 2042RAP 1042RAP
3DIFOC
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your non-
compliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated