GENIV CELL - Confidential - 19001467V1.0 PDF

MICROHARMONY CELL
SIZES 40 - 260A
MANUAL
Manual Number: 19001467

Version 1.0
December 2006
FOR INTERNAL COMPANY USE ONLY!!
Siemens Energy & Automation, Inc.

Large Drives A
ROBICON
500 Hunt Valley Road, New Kensington, PA, USA, 15068

Phone: 724-339-9500 Customer Support Phone: 724-339-9501 (24-hours)
Fax: 724-339-9562 Customer Support Fax: 724-339-9507
Web: www.siemens.com Customer Support E-mail: documentcontrol@siemens.com
For the support representative nearest you, please call Siemens main office at 724.339.9500.
Version History
Version 1.0 (original) December 2006
© 2006 by s. No portion of this document may be reproduced either mechanically or electronically without the prior consent of s LD-A
Reference Documents
Always refer to the latest archived revision
40A BOM: 10000424.040

70A BOM: 10000424.070
100A BOM: 10000424.100
140A BOM: 10000424.140
200A BOM: 10000494.200
260A BOM: 10000494.260
40-140A Assembly: D10000424A.ALL

40-140A Schematic: D10000424S.ALL
200-260A Assembly: D10000494A.ALL
200-260A Schematic: D10000494.S.ALL
Production Test Specification: TSI-062

Ratings and Test Parameters: TSF-058
Repair Test Specification: TSI-063
Traceability Standard: QSF-013

Wiring Practices Standard: QSI-011
Fiber Optic Standard: MFI-025
Workmanship Standard: MFI-017
MicroHarmony Cell Sizes 40 - 260A Manual Table of Contents
Table of Contents
Safety Precautions and Warnings.................................................................................... v
Chapter 1: Cell Overview ..............................................................................................1-1
Introduction ..........................................................................................................1-1
Features ................................................................................................................1-3
Cell Racking System .....................................................................................1-3
Rear Blind-Mate Power Connections............................................................1-3
Snubberless design ........................................................................................1-4
Fusing............................................................................................................1-4
Cell Control Board ........................................................................................1-4
Gate Clamp Board.........................................................................................1-4
Overload........................................................................................................1-4
Heat Sink Design...........................................................................................1-5
Enclosure.......................................................................................................1-5
Increased input voltage rating .......................................................................1-5
Multiple Sources ...........................................................................................1-5
Simple Design ...............................................................................................1-5
Electrolytic Capacitors with Plastic Mounting Tray.....................................1-5
Chapter 2: Physical Description ...................................................................................2-1
Mechanical Specifications....................................................................................2-1
Connections 40-260A...........................................................................................2-2
Environmental Specifications...............................................................................2-2
40-140A Outline...................................................................................................2-4
200-260A Outline.................................................................................................2-5
Access and Connections.......................................................................................2-6
Indicators and Labels............................................................................................2-7
Key Components ..................................................................................................2-8
Bill of Material Structure ...................................................................................2-11
Assembly Notes..................................................................................................2-13
Heat Sink Thermal Compound....................................................................2-13
Semiconductor Torque Specifications ........................................................2-14
Capacitors....................................................................................................2-15
Multiple Sources .........................................................................................2-16
s
19001467: Version 1.0 i
Table of Contents MicroHarmony Cell Sizes 40 - 260A Manual
Chapter 3: Installation .................................................................................................. 3-1

Packaging Requirements...................................................................................... 3-1
Lifting Preferences............................................................................................... 3-1
System Installation and Removal ........................................................................ 3-2
System Requirements (40-140A)......................................................................... 3-3
Chapter 4: Electrical Description................................................................................ 4-1
Ratings and Performance ..................................................................................... 4-1
De-ratings............................................................................................................. 4-3
Schematic- 40-140A cells (10000424S) .............................................................. 4-4
Schematic- 200-260A cells (10000494S) ........................................................... 4-5
Chapter 5: Cell Control Board - 10000432................................................................. 5-1
New Features ....................................................................................................... 5-1
Outline, Mounting, and Connections ................................................................... 5-1
Power Supply ....................................................................................................... 5-2
Gate Drive............................................................................................................ 5-3
Typical Gate Drive Circuit ........................................................................... 5-3
Gate Drive Propagation Delay and Dead Time ............................................ 5-3
OOS Detection/Latch.................................................................................... 5-4
Bus Voltage Sensing and Protection............................................................. 5-4
Protection Features .............................................................................................. 5-5
Communication.................................................................................................... 5-6
Chapter 6: Gate Clamp Board ..................................................................................... 6-1
Chapter 7: Testing ......................................................................................................... 7-1
Documents for Testing Cells ............................................................................... 7-1
Testing Equipment ............................................................................................... 7-1
Required Tests ..................................................................................................... 7-1
Chapter 8: Repair Hints................................................................................................ 8-1
Reporting Failures................................................................................................ 8-1
Approved Components ........................................................................................ 8-1
Basic Rules .......................................................................................................... 8-1
General Repair Hints and Procedures .................................................................. 8-1
Component Re-use............................................................................................... 8-2
Non-Catastrophic Rectifier Failures ............................................................. 8-2
Non-Catastrophic IGBT Failures.................................................................. 8-2
Electrolytic Capacitors.................................................................................. 8-3
ii
s 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Table of Contents
In all cases the cell must pass all specified testing before re-using .............. 8-3
Chapter 9: Application Notes........................................................................................ 9-1
External Wiring.................................................................................................... 9-1
Fusing................................................................................................................... 9-1
Device Model Parameters .................................................................................... 9-2
40-140A Rectifier Modules .......................................................................... 9-2
200-260A Rectifier Modules ........................................................................ 9-3
IGBT Modules - Primary Sources ................................................................ 9-4
General Information ............................................................................................. 9-5
Cell Loss Calculations.......................................................................................... 9-6
Rectifier Losses vs Output Current............................................................... 9-6
Total IGBT/FWD Cell Losses vs Output Current ........................................ 9-7
Individual IGBT Losses vs Output Current .................................................. 9-8
Capacitor Losses vs Output Current ............................................................. 9-9
Total Cell Losses......................................................................................... 9-10
Heat Sink Temperature Monitor ........................................................................ 9-11
Exiting Air Temperature .................................................................................... 9-14
Capacitors........................................................................................................... 9-14
Flammability ............................................................................................... 9-14
Shelf Life and Reforming ........................................................................... 9-14
Failure Modes ............................................................................................. 9-15
Useful Life Calculations ............................................................................. 9-15
Disposal....................................................................................................... 9-16
Output Voltage Capability ................................................................................. 9-16
Normal Operation ....................................................................................... 9-16
Output Voltage capability after bypass....................................................... 9-17
Example of calculating Drive Output Voltage capability........................... 9-17
Output Current Capability.................................................................................. 9-17
Output frequency and switching frequency ....................................................... 9-17
MicroHarmony Volt Map .................................................................................. 9-18
Chapter 10: Drive Calc Express ................................................................................. 10-1
Chapter 11: Communication Protocol ....................................................................... 11-1
Operating Modes................................................................................................ 11-1
Reference Documents ........................................................................................ 11-1
Fiber Optic Message Protocol............................................................................ 11-1
Error Handling ................................................................................................... 11-2
19001467: Version 1.0

s iii
Table of Contents MicroHarmony Cell Sizes 40 - 260A Manual
Parity .................................................................................................................. 11-2

Cell Data ............................................................................................................ 11-3
Mode 00 Data..................................................................................................... 11-4
Modulator to CCB ...................................................................................... 11-4
CCB to Modulator ...................................................................................... 11-5
Mode 01 Data..................................................................................................... 11-6
Modulator to CCB ...................................................................................... 11-6
CCB to Modulator ...................................................................................... 11-6
Mode 10 Data..................................................................................................... 11-7
Modulator to CCB ...................................................................................... 11-7
CCB to Modulator ...................................................................................... 11-7
Mode 11 Data..................................................................................................... 11-8
Modulator to CCB ...................................................................................... 11-8
Device Testing ................................................................................................... 11-8
Device Test Control Data ........................................................................... 11-8
CCB to Modulator ...................................................................................... 11-9
NOTES ........................................................................................................................... N-1
iv
s 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Safety Precautions and Warnings
Safety Precautions and Warnings

MicroHarmony Power Cells are designed with considerable thought to personal safety. However, as with any piece of
high power equipment, there are numerous internal connections that present potentially lethal voltages. In addition,
some internal components are thermally hot to the touch. Follow the warnings below when working in or near a
MicroHarmony Power Cell.
Danger - Electrical Hazards!

• Always follow the proper lock-out/tag-out procedures before beginning any maintenance or trouble-
shooting work on the drive.
• Always follow standard safety precautions and local codes during installation of external wiring. Pro-
tective separation must be kept between extra low voltage (ELV) wiring and any other wiring as spec-
ified in IEC6180-5-1.
• Always use caution when handling the cell chassis. Even though sharp edges are deburred, the edges
can cause lacerations. Protective gloves are recommended when handling the cell.
• Always work with one hand, wear insulated or rubber safety shoes, and wear safety glasses. Also,
always work with another person present.
• Always use extreme caution when handling or measuring components that are inside the enclosure. Be
careful to prevent meter leads from shorting together or from touching other terminals.
• Use only instrumentation (e.g., meters, oscilloscopes, etc.) intended for high voltage measurements
(that is, isolation is provided inside the instrument, not provided by isolating the chassis ground of the
instrument).
• Never assume that switching off the input disconnect will remove all voltage from internal compo-
nents. Hazardous voltage is still present on the terminals of the input disconnect. Also, there may be
voltages present that are applied from other external sources.
• Allow at least 5-8 minutes after disconnecting power before accessing the cell. The DC Bus capacitors
must discharge through the bleeder resistor after the main is disconnected. A DC bus indicator light is
located at the front of the cell on the cell control board, and will stay lit at bus voltages greater than
50VDC.
• Never touch anything within the chassis or anything within the cell until verifying that it is neither
thermally hot nor electrically alive.
• Never remove safety shields (marked with a HIGH VOLTAGE sign) or attempt to measure points
beneath the shields.
• Never run the drive with cabinet doors open. The only exception is the control cabinet which contains
extra low voltages (ELV).
• Never connect any grounded (i.e., non-isolated) meters or oscilloscopes to the WCIII system.
• Never connect or disconnect any meters, wiring, or printed circuit boards while the drive is energized.
• Never defeat the instrument’s grounding.
• Only qualified individuals should install, operate, troubleshoot, and maintain this drive. A qualified
individual is “one familiar with the construction and operation of the equipment and the hazards
involved.”
• Hazardous voltages may still exist within the cell cabinet even when the disconnect switch is open
(off) and the supply power is shut off.
19001467: Version 1.0

s v
Safety Precautions and Warnings MicroHarmony Cell Sizes 40 - 260A Manual
Warning!
• Always comply with local codes and requirements if disposal of failed components is
necessary (for example, CPU battery, capacitors, etc.).
• Always ensure the use of an even and flat truck bed to transport the WCIII drive system. Before
unloading, be sure that the concrete pad is level for storage and permanent positioning.
• Always confirm proper tonnage ratings of cranes, cables, and hooks when lifting the
drive system. Dropping the cabinet or lowering it too quickly could damage the unit.
• Never disconnect control power while medium voltage is energized. This could cause
severe system overheating and/or damage.
• Never store flammable material in, on, or near the cell. This includes equipment drawings and manuals.
• Never use fork trucks to lift cabinets that are not equipped with lifting tubes. Be sure
that the fork truck tines fit the lifting tubes properly and are the appropriate length.
• Never run the cell with the chassis lid off or cell control board panel removed unless open area is prop-
erly covered and sealed off. This ensures personal safety and proper air flow.
• Do not energize the cell without air flow. Although the cell may not be loaded, the bleeder resistor will
dissipate heat during no load. This will stress the resistor and possible melt wires. Always have ade-
quate air flow before energizing.
• Always use the recommended fuses. Fuses were specifically selected to coordinate all known types of
faults, overloads, and inrush current. Improper fuse selection can cause nuisance trips or high imped-
ance arcing faults that do not clear which could result in a catastrophic fire.
• When lifting with cranes, be sure the crane, cables, and hooks have proper tonnage rating. Be careful
not to drop the cabinet or lower it too quickly. This could damage the unit.
• When transporting the drive system, the truck bed must be even and flat. Before unloading, be sure that
the concrete pad is level for storage as well as permanent positioning.
ESD Sensitive Equipment!

• IGBT gate emitter leads should be shorted when not installed in the cell or for transportation. Avoid
exposure to corrosive gases and dust.
• Always be aware of electrostatic discharge (ESD) when working near or touching components inside
the MicroHarmony cell. The cell contains components that are sensitive to static electricity. Handling
and servicing of components that are sensitive to ESD should be done only by qualified personnel
and only after reading and understanding proper ESD techniques. The following ESD guidelines
should be followed. Following these rules can greatly reduce the possibility of ESD damage to PC
board components.
• Always transport static sensitive equipment in antistatic bags.
• Always use a soldering iron that has a grounded tip. Also, use either a metallic vacuum-style plunger
or copper braid when desoldering.
• Make certain that anyone handling the printed circuit boards is wearing a properly grounded static
strap. The wrist strap should be connected to ground through a 1 megohm resistor. Grounding kits are
available commercially through most electronic wholesalers.
• Static charge buildup can be removed from a conductive object by touching the object to a properly
grounded piece of metal.
• When handling a PC board, always hold the card by its edges.
• Do not slide printed circuit boards across any surface (e.g., a table or work bench). If possible, per-
form PCB maintenance at a workstation that has a conductive covering that is grounded through a 1
megohm resistor. If a conductive tabletop cover is unavailable, a clean steel or aluminum tabletop is
an excellent substitute.
• Avoid plastic, Styrofoam™, vinyl and other non-conductive materials. They are excellent static gen-
erators and do not give up their charge easily.
• When returning components to Siemens LD A, always use static-safe packing. This limits any further
component damage due to ESD.
vi
s 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Safety Precautions and Warnings
Warning!
• Never exceed the specified terminal torque on semiconductors and capacitors. Excessive force will
damage the part.
• Use caution when inserting or extracting the gate leads on an IGBT. Excessive force can break or
stress the device.
• Dropping the cell or lowering it too quickly could damage the unit and/or be harmful to personal
safety.
• Be sure power plugs are properly aligned with the input/output bus before operating. Do not exceed
a 50 pound insertion force as this may damage the connectors. Never disconnect the cell while the
main is energized or while the cell is operating.
• Always adhere to the recommended thermal compound and thickness. Excessive or inadequate
compound application may cause an insufficient thermal connection between base plate and heat
sink that may damage the cell.
• Electrolytic capacitors are polarized. Installing a capacitor with the incorrect polarity will damage
the cell.
• If cell sits idle for 6 months or more, the capacitor bank requires reforming. Failure to follow
reforming procedures and guidelines may result in cell damage.
• The cell should be energized with a harmony transformer. The cell may be operated without a har-
mony transformer; however, it is important that the cell is pre-charged to at least 850vdc bus before
operating.
• Never substitute with non-approved components; never parallel or series non-identical manufac-
turer's (or Siemens MDIT numbers) for IGBTs or capacitors in the same power cell.
• Never use halogen type cleaning agents when cleaning a power cell. Use pressurized dry air, iso-
propyl alcohol, or water based solvent cleaning agents.
• Always comply with local codes and requirements if disposal of failed components is necessary (for
example, control boards, capacitors, etc.). Some components may contain lead.
Additional safety precautions and warnings appear throughout this manual. These important messages should be
followed to reduce the risk of personal injury or equipment damage.
∇ ∇ ∇
19001467: Version 1.0

s vii
Safety Precautions and Warnings MicroHarmony Cell Sizes 40 - 260A Manual
viii
s 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Cell Overview
CHAPTER
1
1 Cell Overview
1.1 Introduction
The MicroHarmony series power cells are designed to replace GEN 3 (NBH) cell sizes 70-260A.
Figure 1-1: MicroHarmony Cell
The latest air cooled power cells are available in 6 frames: 40A, 70A, 100A, 140A, 200A, and 260A. All cells in the
40-140A frame have an identical footprint and internal design. Only the number of parallel capacitors and IGBT kit
part numbers change from one cell to the next. The same applies to the 200-260A frame.
Figure 1-2: 40-140A Cell Anatomy (*Top Lid not shown)
s
19001467: Version 1.0 1-1
Cell Overview MicroHarmony Cell Sizes 40 - 260A Manual
Figure 1-3: 200-260A Cell Anatomy (*Top Lid not shown)
s
1-2 19001467: Version 1.0
1.2 Features
1.2.1 Cell Racking System 1
No hardware is required for mounting the cells in place within the drive.
The MicroHarmony cell is designed to be mounted on polyethylene coated mounting rails. The cell is equipped with
two locking latches on each side that latch into the mounting rail. The latches provide rear power plug alignment and
cell mounting. The latches are then rotated clockwise to pull the cell into place. Once the latches are in the vertical
position, the cell is properly aligned and locked into place. To remove, the latches are pulled back down to the
horizontal position.
High temperature foam forms an air tight seal between the cell chassis and backplane at the rear of the cell (not
shown).
1.2.2 Rear Blind-Mate Power Connections

No hardware is required for making the cell's input and output power connections.
Connections are made via blind-mate power plugs at the rear of the cell. The system is designed to tolerate as much
as 6 degrees of misalignment in all directions. The locking latches and mounting rails provide alignment.
s
19001467: Version 1.0 1-3
1.2.3 Snubberless design
1 A simple, low stray inductance bus, coupled with low self inductance capacitors and nomex insulation, eliminates the
need for snubber capacitors at the IGBT power terminals. This reduces parts count, reduces complexity, and
increases IGBT switching performance.
1.2.4 Fusing
Only 2 phases of each cell input are fused. These fuses are mounted externally to the cell in one easy-to-access
location. This reduces the complexity of the cell and allows the fuses to operate properly.
1.2.5 Cell Control Board

A new cell control board based on the 10000092 series has been developed. All MicroHarmony cells sizes 40-140A
and 200-260A use the same part number cell control board. This reduces parts inventory and allows the board to be
purchased with all of the necessary resistor values and jumper settings. This reduces labor costs.
1.2.6 Gate Clamp Board

A gate clamp board is installed on each dual IGBT module. The board protects the IGBT from over voltage
transients. “Personality” gate resistors and capacitors that are specific to the IGBT used, are installed on this board as
well.
1.2.7 Overload
The MicroHarmony cells have built-in output overload current capability. Standard ratings at 110% 1 min/10 min,
150% 1 min/10 min, and 200% 3 sec/10 min are given.
s
1-4 19001467: Version 1.0
1.2.8 Heat Sink Design

The heat sink assembly is designed for optimum IGBT cooling. The modules are arranged close together to reduce
size. The IGBTs are separated for input/output bus locations and to increase thermal performance. The heat sink is a
1
high performance, low pressure drop, light-weight aluminum design with a very thin base plate. A low pressure drop
mechanically swagged hollow fin design is offered that eliminates the thermal impedance of glue used in
conventional bonded fin designs.
1.2.9 Enclosure
The cell is enclosed in a solid hot-dipped galvanized steel chassis. In the event of a catastrophic failure, the damage
is contained to the faulted cell, protecting adjacent cells from any collateral damage. The top of the cell can be
removed for heat sink and capacitor access. The bottom of the cell houses the cell control board and can be easily
removed.
1.2.10 Increased input voltage rating

All MicroHarmony cells operate with a nominal 750Vrms input. This allows a 9-cell system to produce a 4160V
motor voltage with only 9 cells. Overmodulation is also used to increase the output voltage capability.
1.2.11 Multiple Sources

At least 2 sources for all components are standard on MicroHarmony cells. This encourages good quality control,
lowest cost, and shortest lead times.
1.2.12 Simple Design

The cell was designed with easier assembly, access, and troubleshooting in mind.
1.2.13 Electrolytic Capacitors with Plastic Mounting Tray

Economical 450V, 5600μF (40-140A) 10000μF (200-260A) electrolytic capacitors are used together with a simple
snap-in mounting tray for easy assembly.
∇ ∇ ∇
s
19001467: Version 1.0 1-5
s
1-6 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Physical Description
CHAPTER
2 Physical Description
2
2.1 Mechanical Specifications
Table 2-1: 40-140A Mechanical Specifications
10000424. 040 070 100 140
52Lbs 57.5Lbs 63Lbs 68.5Lbs

Weight 23.58kg 26kg 28.6kg 31kg
3.714 stone 4.11 stone 4.5 stone 4.89 stone
13.496” W x 10.255” H x 22.086” D

Envelope Dimensions
(342.8 x 260.48 x 560.98 mm)
12.62” W x 9.55” H x 21.77” D, neglecting latches and bolt heads

Chassis Dimensions
(320.55 x 242.57 x 552.96 mm)
Volume 2623.74 in^3, 1.518 ft^3, 4.3 m^3, 90.866 pints
Table 2-2: 200-260A Mechanical Specifications
10000494. 200 260
102.8 Lbs 112.6 Lbs

Weight 46.63 kg 51.07 kg
7.34 stone 8.04 stone
13.998” W x 13.117” H x 25.885” D

Envelope Dimensions
(355.55 x 333.17x 657.48 mm)
13.62” W x 12.41” H x 25.57” D, neglecting latches and bolt heads

Chassis Dimensions
(345.95 x 315.21 x 649.48 mm)
Volume 4753 in^3, 2.75 ft^3, 7.788 m^3, 164.6 pints
s
19001467: Version 1.0 2-1
Physical Description MicroHarmony Cell Sizes 40 - 260A Manual
2.2 Connections 40-260A

Table 2-3: Connections 40-260A
2
Bottom mount rails with polyethylene coated slider brackets. Front
Mounting accessible self-locking latches. No hardware required. See Access/
Connections section for more details.
Rear blind connection to nickel plated copper bus bars via cell
Electrical
mounted power plugs. No hardware required. See Access/Connec-
Connections
tions section for more details.
Control
Front access fiber optic
Connections
2.3 Environmental Specifications

Table 2-4: Environmental Specifications
Maximum Elevation 3300 FASL (1006 masl) without de-rating, 6563 FASL (200masl) MAX
45 °C (113 °F, 318.15 °K), up to 60 °C with de-rating.

Maximum Ambient
Note that over load and capacitor life are less above 40 °C
Storage Ambient -30 °C (-22 °F) minimum, 60 °C (140 °F) maximum
High humidity (93-95% RH) is not a concern unless there is a possibility of

Ambient Humidity
condensation formation.
Non conductive particulate contamination should be limited to <100 microns at

Ambient Air Quality
6.5mg/ft^3
40-140A Cell Minimum Air 180CFM (84.5 L/sec, 400 yd^3/hr) at 45 °C ambient.
Flow Typical air flow is 225-250CFM (105.6-117.36L/sec)
200-260A Cell Minimum Air 300CFM (141.58 L/sec, 667 yd^3/hr) at 45 °C ambient.
Flow Typical air flow is 300-350CFM (141.58-165.18L/sec)
s
2-2 19001467: Version 1.0
Air Flow vs Pressure Drop

1.00
40-140A 200-260A
2
0.90
R=8.1E-6 R=5.39E-
0.80
0.70
Pressure drop, inH2O
0.60
0.50
0.40
0.30
0.20
0.10
0.00
100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400
Air Flow , ft^3/m in
200-
CFM 40-140A
260A
50 0.02 0.01
75 0.05 0.03
100 0.08 0.05
125 0.13 0.08
150 0.18 0.12
175 0.25 0.17
200 0.32 0.22
225 0.41 0.27
250 0.51 0.34
275 0.61 0.41
300 0.73 0.49
325 0.86 0.57
350 0.99 0.66
375 1.14 0.76
400 1.30 0.86
s
19001467: Version 1.0 2-3
2.4 40-140A Outline
*Refer to Installation Section for mounting and bus connection information.

Figure 2-1: 40-140A Outline
s
2-4 19001467: Version 1.0
2.5 200-260A Outline
Figure 2-2: 200-260A Outline
s
19001467: Version 1.0 2-5
2.6 Access and Connections

The figures below illustrate all power input/output terminals and fiber optic control terminals. Power connections are
made via power plugs; no hardware is required. Fiber optic control connections are made at the front of the cell
directly to the cell control board.
2 The cell control board and power electronics can be accessed and tested at the same time by rotating the cell 90° as
shown, removing the chassis top cover and a trap door at the base of the cell chassis. The cell can be tested in either
position, however all open areas that are usually covered must be blocked off to allow for proper air flow through the
cell.
The + and - DC bus can be accessed by removing the top lid (not shown). Threaded studs are located on the bus for
connections.
Removable
top lid
(not shown)
T1 Fiber
L3
Optic
L2
L1
T2
Figure 2-3: Power Input/output Terminals and Fiber Optic Control Terminals
s
2-6 19001467: Version 1.0
2.7 Indicators and Labels

The figure below illustrates the indicator functions and labels of the MicroHarmony Cell. Particular attention should
be paid to the DC bus illumination LED that indicates that more than 50VDC is present on the DC bus. The cell
should not be touched, removed, or serviced if the indicator is illuminated. Remember that the cell chassis is not
grounded and when energized can float to lethal voltages. 2
OOOOOO
Fiber DC Bus Voltage Indicator

Q4
Q3
Q2
Q1
FAULT
LINK ON
Optic (>50VDC)
Figure 2-4: Indicators and Labels
s
19001467: Version 1.0 2-7
2.8 Key Components

The table below lists all the key components found within a MicroHarmony power cell as a reference. Always refer
to the latest revision BOM.
2 10000424. 040 070 100 140
Eupec Eupec Eupec Eupec

BSM100GB170DLC BSM100GB170DLC BSM150GB170DLC FF200R17KE3
IGBTs 1700V 100A 1700V 100A 1700V 150A 1700V 200A
P/N 097065 P/N 097065 P/N 097066 P/N 097067
QTY 2 QTY 2 QTY 2 QTY 2
RgON 20 ohm 20 ohm 15 ohm 15 ohm
RgOFF 25 ohm 25 ohm 20 ohm 20 ohm
ROOS 1000 ohm 1000 ohm 1000 ohm 1000 ohm
Cge 0.022 μF 0.022 μF 0.022 μF Not Installed
CCB 10000424.71 10000424.71 10000424.71 10000424.71

GCB 10000428.03 10000428.03 10000428.04 10000428.00
3S x 1P 3S x 2P 3S x 3P 3S x 4P
Capacitance qty 3 qty 6 qty 9 qty 12
1867μF, 1350VDC 3733μF, 1350VDC 5600μF, 1350VDC 7467μF, 1350VDC
5600μF, 450V electrolytic

144mm (5.7in) high x 78mm(3.07in) OD
Capacitors
Jianghai:ECG2WPC562M P/N 099545
UCC:E36F451CAN562MEE3N P/N 099348
BHC:ALS30C1048NX P/N 0100034
Eupec DD106N1800 QTY 3 Semikron SKKD100/18 Powerex CD411899B

1800V, 106A dual module P/N 0100375 P/N 010158
Input Rectifiers
92x25mm
P/N 099414
9K tapped at 3K, 300W total QTY 1
P/N 13000405.00
Double tabs
Bleeder Resistor
Milwaukee Resistor Corp.
Ohmite
Huntington Electric
P/N 11002091.00 QTY 1

12.5in wide x 4.2in deep
0.31" base plate, 3.41" fins
Heat Sink
R-Theta: 11002091.00 FEMA: 11002091.00
VEP: 11002091.00 ERM: 110002091.00
s
2-8 19001467: Version 1.0
10000424. 040 070 100 140
Western Electronic Company WPP4001-24 QTY 1

Thermodisc 100 ohm at 25°C, 250 ohm at 80°C
P/N 094595
P/N 099416 QTY 5

2
Power Plugs
Tyco: 538-17-00100
Anderson Power: PCL01
10000494. 200 260
Eupec FF200R17KE3 x 2P Eupec FF300R17KE3 x 2P

1700V 300A 1700V 300A
IGBTs
P/N 097067 P/N 097065
QTY 2 QTY 2
RgON 15.5 ohm 15.5 ohm
RgOFF 20 ohm 20 ohm
ROOS 1000 ohm 1000 ohm
Cge - -
CCB 10000424.72 10000424.72
GCB 10000428.05 10000428.05
3S x 3P 3S x 4P
Capacitance qty 9 Qty 12
10,000μF, 1350VDC 13,333μF, 1350VDC
10,000μF, 450V electrolytic
227mm (8.94in) high x 78mm(3.07in) OD
Capacitors
Jianghai: ECG2WPC103M P/N 099997
UCC: E36L451CSN103MEM9N P/N 0100786
BHC: ALS30C1049NT P/N 0100785
Eupec DD171N1800 QTY 3 Semikron SKKD162/18 Powerex CD611816B

1800V, 171A dual module P/N 0100787 P/N 0100788
Input Rectifiers
94x34mm
P/N 088173
9K tapped at 3K, 300W total QTY 1

P/N 13000405.00
Double tabs
Bleeder Resistor
Milwaukee Resistor Corp.
Ohmite
Huntington Electric
s
19001467: Version 1.0 2-9
10000494. 200 260
P/N 11004896.00 QTY 1

135in wide x 8in deep
2 Heat Sink
0.31" base plate, 3.41" fins
R-Theta: 11004896.00
ERM: 11004896.00
Western Electronic Company WPP4001-24 QTY 1

Thermodisc 100 ohm at 25°C, 250 ohm at 80°C
P/N 094595
P/N 099416 QTY 5

Power Plugs
Tyco: 538-17-00100
Anderson Power: PCL01
s
2-10 19001467: Version 1.0
2.9 Bill of Material Structure

The BOM is structured to take advantage of the common design 40-140A cells, and 200-260A cells. The top level
bill consists of:
1.
2.
Capacitors
Capacitor trays
2
3. Common parts (used on all cells regardless of current rating: input rectifier modules, heat sink, wire
harnesses, power plugs, thermodisc, and handles)
4. Hardware kit (screws, washers, thermal compound, bushings, etc.)
5. IGBT kits
6. Reference drawings
10000424.140
Capacitor Vendor #1 12
Capacitor Mounting Tray 2
Common Parts Kit 1
Chassis/Bus Kit 1
Glastic Kit 1
Hardware Kit 1
Misc Parts
IGBT Kit Fuji 200A 0
IGBT Kit Mitsubishi 200A 0
IGBT Kit Eupec 200A 1
Dual IGBT Module, 200A 1700V 2
Gate Clamp Board w/ resistor 2
Cell Control Board 2
Label, IGBT Install 2
Schematic
Outline
Assembly
Manual
Figure 2-5: Bill of Material Structure
s
19001467: Version 1.0 2-11
An example IGBT Kit is listed below:

Part Number: 14000424.IE200A IGBT KIT EUPEC 200A 1700V
Item Component Level Description Qty
2 0031 10000428.05
0032 097067
05
99
PCA GATE CLAMP BRD W/RESISTOR 2
DUAL IGBT MODULE, 200A 1700V 2
0052 10000432.71 05 PCA 630/690/750V CELL CONTROL 1
0053 12001673.00 05 LABEL,2X3,B/S IGBT INSTALL 1
The suffix in the kit part number is as follows: “I” stands for IGBT. “E” stands for Eupec. There can be other
vendors, such as “P” for Powerex, “F” for Fuji, “S” for Semikron, etc.; “200A” stands for 200A module. This is the
nameplate current rating of the IGBT device.
Note that the IGBT kit includes the gate clamp board, cell control board, IGBT module, and label. The gate resistors
change from one vendor to the next, which requires the correct board-IGBT combinations. A label is placed on the
cell chassis to identify what components are installed for replacement purposes.
Important Points:
NEVER SUBSTITUTE WITH NON APPROVED COMPONENTS. ALWAYS ADHERE TO THE
LATEST APPROVED BOM.
NEVER USE NON-IDENTICAL MANUFACTURER'S (OR SIEMENS MDIT NUMBERS) FOR
IGBTS OR CAPACITORS IN THE SAME POWER CELL.
Each capacitor vendor has its own MDIT number.
Each IGBT vendor has its own MDIT number and its own IGBT kit number.
Each rectifier vendor has its own MDIT number. Non-identical manufacturer's (or Siemens MDIT
numbers) can be installed in the same power cell, although this is not recommended.
When additional sources are approved, these are added to the BOM at qty 0. Purchasing then has the
ability to buy from any of the approved sources on the BOM, regardless of the quantity shown on the
bill.
This is a manual purchasing method that is outside the current MRP system, but if used correctly
takes full cost and delivery advantage of multiple sources.
s
2-12 19001467: Version 1.0
2.10 Assembly Notes

2.10.1 Heat Sink Thermal Compound
For proper thermal performance, the specified thermal compound and application procedure must be followed.
Failure to do so may result in excessive heating and catastrophic cell damage.
The assembly drawing identifies the approved compound and application procedure, which is shown below for the
2
40-140A cells. Thickness to be 0.004" thick using tape as a mask.
Figure 2-6: Assembly Drawing
s
19001467: Version 1.0 2-13
2.10.2 Semiconductor Torque Specifications

Proper heat sink mounting connections are just as important as proper thermal compound application. An insufficient
tightening torque may cause the contact thermal resistance at the base plate to increase or the screws to come loose
during shipping or operation. Excessive tightening torque may damage the IGBT's plastic case. The ordering of bolt
2 tightening is also important to ensure a uniform thermal bond to the heat sink. Likewise, proper electrical terminal
torque is required. Insufficient tightening torque may increase contact resistance and localized heating or the screws
may come loose. Too much torque can crack the case or damage the internal bond wires. The assembly drawing
identifies the proper application procedure, which is shown below for the 40-140A cells:
Do not exceed 5Nm (3.69 ft-lb)

mounting or terminal torque.
Do not exceed 4Nm (2.95ft-lb)
mounting or terminal torque.
Figure 2-7: IGBT and Diode Mounting Instructions
s
2-14 19001467: Version 1.0
2.10.3 Capacitors
Electrolytic capacitors are polarized. Check the polarity of the capacitor before energizing. Reverse voltage results
in capacitor destruction!
2
Do not over tighten the mounting bolts. Excessive torque will strip the threads. Should this occur, the capacitor
should not be used.
Always follow the assembly drawing for capacitor locations. This is not an issue on the 140A cell where all slots are
filled, but is a factor on smaller frames. The bus must have rear support and the second row from the front must be
occupied. Bus inductance is influenced by the distance between the capacitors and the IGBTs. Incorrect capacitor
location can cause IGBT stress.
The assembly drawing identifies the proper location and orientation. Some cells require a front bus support bracket.
+ BUS
+ 2/3 BUS
+ + 1/3 BUS
+ + + - BUS
+ + +
+ +
+ 100A 140A
140A 260A
70A 200A
40A 100A 260A
70A 140A
100A 200A
140A 260A
200A
260A
Figure 2-8: Location and Orientation of Capacitors
s
19001467: Version 1.0 2-15
2.10.4 Multiple Sources

Never substitute with non-approved components.
Never parallel or series non-identical manufacturer's (or Siemens MDIT numbers) for IGBTs or capacitors in the
2
same power cell.
For any given cell, all electrolytic power capacitors must be from the same vendor with identical MDIT and
manufacturer's part numbers. Mixing capacitors can cause voltage imbalance and damage the cell.
IGBTs must be from the same vendor with identical MDIT and manufacturer's part numbers. Make sure to use the
correct IGBT kit label on the outside of the cell chassis. Always use the correct gate clamp and cell control board.
Mixing IGBTs or using incorrect control boards can result in cell damage.
Rectifiers should be from the same vendor with identical MDIT and manufacturer's part numbers; however this is not
required.
∇ ∇ ∇
s
2-16 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Installation
CHAPTER
3 Installation
3.1 Packaging Requirements
The 40-260A MicroHarmony cells are designed to be shipped within the drive. For spare parts shipment, the cell
should be packaged as shown below:
3
Fill bottom of box with Place cell into box on top of Fill sides and top with Instapak
Instapak sealed air foam in foam. Be sure that the sealed air foam packaging
bag packaging material. locking latches are pointed material. Before cooling, close
up. box lid to form top. Check for air
pockets and fill as needed.
Seal box and ship.
The cell is designed to meet general shipping vibration as specified by Mil-Std-810, Method 514.3, category 1-basic
transportation, provided that the above procedure is met.
3.2 Lifting Preferences

The cell's weight ranges from 52-113 pounds. If a lifting device is not available, a cell can be lifted and handled
manually. It is recommended that two persons be used to lift and install a power cell. If a cell is lifted alone, the
following procedure should be followed.
Keep the cell close to your body and lift with the legs, not the back. Avoid twisting your back. Carry the cell close to
your body, not on extended arms.
When installing cells in the system, always have someone help.
Never carry the cell by the locking latches. They are not designed to support the weight of the cell. Always lift the
cell from the bottom. Do not lift the cell from the lid or the front grill.
s
19001467: Version 1.0 3-1
Installation MicroHarmony Cell Sizes 40 - 260A Manual
3.3 System Installation and Removal

A DC bus indicator light is located at the front of the cell on the cell control board and will stay lit at bus voltages
greater than 50VDC. The cell should not be touched, removed, or serviced if the indicator is illuminated. Remember
that the cell chassis is not grounded and when energized can float to lethal voltages.
Refer to Section 1.2.1, “Cell Racking System,” for details.
Figure 3-1: System Installation and Removal
The cell is installed by first placing the cell with the power plugs facing the rear of the drive on the mounting rails.
The locking latches should point towards the front of the drive. The cell is then pushed along the rails until the
locking latches can be rotated upwards 90 degrees, and latch into the mounting rail slot. Be sure that the latches slide
through the mounting rail slots. As the latches are rotated simultaneously, the cell will self-align and insert the blind
mate power plugs into the system I/O bus at the rear of the enclosure. The latches are locked in place when both
latches are pointing upward.
The cell is removed by simultaneously pulling down on the locking latches. As the latches are pulled down, the cell
will pull away from the rear I/O bus. Once the latches are pointing toward the front of the drive, the cell can be pulled
out of the drive by sliding the cell along the mounting rails.
When the cell is removed, check the condition of the back plane foam tape and replace if needed.
s
3-2 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Installation
3.4 System Requirements (40-140A)

For reference only; always refer to latest core design.
Figure 3-2: System Dimensions
∇ ∇ ∇
s
19001467: Version 1.0 3-3
Installation MicroHarmony Cell Sizes 40 - 260A Manual
s
3-4 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Electrical Description
CHAPTER
4 Electrical Description
4.1 Ratings and Performance
All ratings at Tamb ≤40 °C at 180CFM, 0.95 output power factor for the 40-140A cells.
All ratings at Tamb ≤40 °C at 300CFM, 0.95 output power factor for the 200-260A cells.
10000424. 040 070 100 140

10000494 10000492
4
.200 .260
Rated Output Current Rating1 40Arms 70Arms 100Arms 140Arms 200Arms 260Arms
110% 1min/10min (CL-1)2 40Arms 70Arms 100Arms 140Arms 200Arms 260Arms
150% 1min/10min (CL-2) 3 40Arms 70Arms 100Arms 130Arms 200Arms 260Arms
200% 3sec/10min (CL-3)4 40Arms 70Arms 100Arms 130Arms 200Arms 260Arms
Nuisance OOS Current5 141Arms 162Arms 198Arms 290Arms 660Arms 970Arms
Base VA Rating (watts)6 32,360 56,630 80,900 113,260 161,800 210,340
450 698 944 1,139 1,640 2,160

Cell Losses (watts,%)7 1.370% 1.217% 1.152% 0.995% 1.16% 1.18%
Cell Efficiency7 98.630% 98.783% 98.848% 99.005% 98.94% 98.82%
Rating Input Current8 28Arms 48Arms 73Arms 96Arms 140Arms 182Arms
Typical Operational Life, years9 17.2 20.91 22.19 20.91 17.7 24
Typical Operation Life, years,

12.87 15.65 16.61 15.65 13.3 18
10% high line input voltage10
Bleed down time, minutes11 0.84 1.68 2.53 3.37 4.51 6.02
750Vrms nominal, ±10% (675-825Vrms),

Input Voltage
3-phase, 50/60Hz
Rated DC Bus Voltage 1015VDC
1. Maximum continuous steady state output current rating.

2. Output Current Rating of cell with 110% output current for 1 minute out of every 10 minutes.
3. Output Current Rating of cell with 150% output current for 1 minute out of every 10 minutes.
4. Output Current Rating of cell with 200% output current for 3 seconds out of every 10 minutes.
5. Average nuisance out of saturation trip current. The IGBTs and Out of Saturation sense circuit on the cell
control board will trigger a fault at or above this output current.
s
19001467: Version 1.0 4-1
Electrical Description MicroHarmony Cell Sizes 40 - 260A Manual
6. Base volt-ampere output rating of the cell. With 5% over modulation, maximum output voltage of cell is
750 x 1.78 x 1.05 / sqrt(3) = 809Vrms. VA = rated output current rating x 809Vrms
7. Amount of no load and load losses of the cell at rated output power. Watts and % of base VA given.
%Losses = Cell losses / (Base VA + cell losses) x 100%
8. Iin,cell = Iout,cell x 0.687, typical at rated input voltage and rated output power. Cell input current is
typically 2/3rd of output current.
9. Life expectancy of capacitors at a 40°C ambient, rated air flow, rated input voltage, rated output current,
neglecting over loads. Once the life is exceeded, the ESR doubles and the capacitance is reduced by 50%.
The capacitors should be replaced prior to end of life.
4 10. Life expectancy of capacitors at a 40°C ambient, rated air flow, 110% rated input voltage, rated output
current, neglecting over loads. Once the life is exceeded, the ESR doubles and the capacitance is reduced by
50%. The capacitors should be replaced prior to end of life.
11. Typical time, in minutes, for dc bus voltage to decay from rated dc bus to 50VDC after input power is
removed. The cell must not be touched, removed, or accessed until after this time.
s
4-2 19001467: Version 1.0
4.2 De-ratings
In some cases the cell maximum output current capability must be de-rated in order to keep the maximum junction
temperature below the manufacturer's maximum rating. The following general de-ratings should be applied to all
cells sizes:
300 ≤ fc < 600Hz Fo > 10Hz,

No De-Rating No De-Rating
fc ≥ 600Hz Fo ≤ 10Hz
Base Current Rating x (1-((fc - 600) / 600) x 0.20) Iout (fo) = Base Current Rating x (0.5 + Fo / 20)
Tamb ≤ 45°C FASL ≤ 3,300ft

No De-Rating (overload and Cap life de-rated) No De-Rating
Tamb>45°C 3,300ft ≤ FASL ≤ 6,563ft

Base Current Rating x (60-K37) / 15)^0.67 Base Current Rating x (1-0.005 × (FASL-3,300)/330)
Note: Tamb applies to the inlet air temperature of the cell. Note: FASL = Feet above sea level
This can be higher than the actual room ambient depend- Maximum elevation is 6,563 FASL due to creep and
ing on site conditions. strike voltage limits. At max elevation, de-rate current
5%
Note: In the event that de-rating factors apply (i.e. 50 °C ambient and fc=1200Hz), calculate the de-rated
output current for each case and select the lowest current rating.
s
19001467: Version 1.0 4-3
4.3 Schematic- 40-140A cells (10000424S)
s
4-4 19001467: Version 1.0
4.4 Schematic- 200-260A cells (10000494S)
∇ ∇ ∇
s
19001467: Version 1.0 4-5
s
4-6 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Cell Control Board - 10000432
CHAPTER
5 Cell Control Board - 10000432

5.1 New Features
A new cell control board has been developed that is backwards compatible with the previous 10000092, 461E90, and
10000311 boards. New features include:
1. Up to 1200VDC input operation

2. 630, 690, 750V jumpers for high bus voltage fault. Jumper is soldered in place.
3.
4.
Resistor select for 400 or 450V electrolytic capacitors
Cell precharge compatible. Jumper installed if not used.
5
5. Out of Saturation latch handled in EPLD software, not in hardware.
6. Suffix .7X series specific to MicroHarmony
5.2 Outline, Mounting, and Connections
DC BUS
INDICATOR
CN4 CN3 CN2 CN1

CN6 CN5
CN8 CN7
Link ON
FAULT
Q1
Q2
8in Q3
CN9 Q4
WARNING
High Voltage
P/N, S/N, REV,
Date Code, etc
CN10
12.9in
Mating
Connector Function Pins
Connector
CN1 Temperature sensor 2 089591
CN2 3-phase cell input voltage 7 (3 used, remainder removed) 089399
CN3 2/3, 1/3 dc bus 4 (2 used, remainder removed) 089397
CN4 +/- dc bus 4 (2 used, remainder removed) 089397
s
19001467: Version 1.0 5-1
Cell Control Board - 10000432 MicroHarmony Cell Sizes 40 - 260A Manual
Mating
Connector Function Pins
Connector
CN5 Q4 gate drive 5 (3 used, remainder removed) 089398
Altera Byte
CN9 Programming port 10
Blaster
CN10 Precharge 2 089591

5 Part Number: 10000432
Outline: D10000432A.ALL
Schematic: D10000432S.ALL
5.3 Power Supply

A 20kHz discontinuous flyback converter is used to generate the appropriate control voltages to operate the cell.
Power is derived from the cell's DC bus, via CN4 pins 4 and 1.
Voltage Tolerance Level (V)

Symbol Description
(V) Minimum Maximum
Frequency Switching Frequency 20KHz 19KHz 21KHz
VCC - gnd +5V for ICs +5.0 +4.75 +5.25

P15 - gnd +15V for ICs +15.0 +14.0 +16.0
N15 - gnd -15V for ICs -15.0 -16.0 -14.0
P1 - N1 Gate Voltage for IGBT1

+28 +26.5 +29.5
P4 - N4 Gate Voltage for IBGT4

G1 - E1 Ch 1 Gate-Emitter Voltage
G2 - E2 Ch 2 Gate-Emitter Voltage +15.5 +15.0 +17

G3 - E3 Ch 3 Gate-Emitter Voltage -9.0 -10 -8.5
G4 - E4 Ch 4 Gate-Emitter Voltage
The above voltages are tested per TSI-131. The +5VDC (VCC) is regulated. The other power supplies are regulated
through their transformer secondary turns ratios. This provides a well regulated power supply with multiple isolated
auxiliary voltages.
s
5-2 19001467: Version 1.0
5.4 Gate Drive

Four independent and optically isolated gate drive circuits provide the proper IGBT gate drive and out of saturation
feedback between the control and IGBTs.
5.4.1 Typical Gate Drive Circuit
P1, C1, and E1 connects to a blocking test circuit used for verifying IGBT operation at start up.
P1 and N1 connect to the isolated +28VDC gate drive power supply.
OOS1 is an isolated OOS signal that connects to the EPLD.
PC5 connects to a start-up hold off circuit which prevents firing until the SMPS is fully operational.
Q1 is the gate drive signal derived from the EPLD.
5.4.2 Gate Drive Propagation Delay and Dead Time

There is a time delay inherent to the gate drive circuit, from the time the EPLD tells the gate to turn on to the actual
time in which the gate does turn on. The turn on propagation delay should be no more than 1.1μSec. The turn off
propagation delay should be no more than 0.5μSec.
PWM dead time is 18.0 to 22.0 μS. This prevents the possibility of two devices in a pole from firing at the same time.
s
19001467: Version 1.0 5-3
5.4.3 OOS Detection/Latch

Out of Saturation is detected by monitoring Vce of the IGBT. Each fault feedback from the gate drive channels goes
through a two-shot circuit that verifies that two consecutive OOS (Out-of SAT) faults occur before the drive trips.
This provides extra immunity from false OOS faults. OOS is annunciated within 10 to 14 μS after second OOS
pulse.
5.4.4 Bus Voltage Sensing and Protection

Three differential amplifiers are used to monitor + to - bus, +2/3 to - bus, and +1/3 to - bus. These analog signals are
filtered and scaled 1:-100, named P1DET, P2DET, and P3DET.
1. Capacitor Voltage Monitoring
P1DET and P2DET are summed and scaled to produce a 1/3 bus voltage signal divided by 100. Likewise,
P2DET and P3DET are summed and scaled, and P3DET and agnd are summed and scaled. Each of these 3
signals are compared to a fixed 10VDC reference to a diode AND circuit. In the event that any 1 signal
exceeds the scaled threshold (430V for 400V caps and 484V for 450V caps), then VCAP_OK annunciates a
“Cap share Fault” and trips the cell. Three select resistors are used for trip point scaling.
2. Bus Voltage Monitoring
P1DET is filtered and scaled for Vbus/255 and compared to a fixed 10V reference that is scaled for the
appropriate over voltage trip point. In the event that the bus voltage exceeds the scaled threshold, VDC_HIL
annunciates a “DC Bus over voltage Fault” and trips the cell. (630V cell trips at 1084VDC, 690V cell trips
at 1200V, 750V cell trips at 1300V). A solder blob jumper is used for trip point scaling.
The filtered and scaled P1DET (Vbus/255) is also compared to a scaled 10V reference for low bus fault
annunciation. If the DC bus drops below 475VDC, VDC_LOWL will annunciate a “Low Bus Fault” and
trip the cell.
The filtered and scaled P1DET (Vbus/255) is also compared to a scaled 10V reference for voltage available
fault annunciation. If the DC bus drops below 300VDC, POWER_OK will annunciate a “Control Power
Fault” and trip the cell. When the bus is below 300VDC, the CCB SMPS may not operate properly and must
shut down.
s
5-4 19001467: Version 1.0
5.5 Protection Features

The Cell Control Board (CCB) contains circuitry and firmware that protects the cell from various abnormal operating
conditions. A description of these protection functions as well as the resulting cell response and the detection
thresholds are described below:
CCB Board
Cell Protection Description and Thresholds
Ref. Signal
DC voltage between Plus-Minus bus has exceeded the upper limit of its
allowable range. This is set by a solder blob (SB) jumper on the CCB.
VDCHIL is active low when Vbus exceeds:
Over Voltage1 VDCHIL
630V: 1096 ± 30 vdc
690V: 1200 ± 30 vdc
750V: 1300 ± 30vdc 5
DC voltage between Plus-Minus bus has decreased below the lower limit
1 VDCLOWL of its allowable range. VDCLOWL is active low when Vbus drops below
Under Voltage
475 ± 24vdc
Control Power DC voltage between Plus-Minus bus is valid for control circuits. This does
POWEROK not necessarily mean that DC power is available for driving load.
Fault1 POWEROK is active high when Vbus exceeds 300 ± 30vdc
Voltage across power capacitors is all less than specified upper limit. This
is set by scaling resistors for either 400 or 450V capacitors. VCAPOK is
Cap-Share Fault1 VCAPOK active high when individual capacitor voltages are less than:
400V: 430 ± 10vdc
450V: 485 ± 10vdc
Voltage between collector and emitter of an IGBT has exceeded its upper
OOS1L to limit due to de-saturation with gate signal applied. This implies the IGBT
Out of Saturation1 OOS4L may have encountered a short circuit condition. OOS1L to OOS4L are
active low.
A PTC thermistor on the heat sink is used to monitor the critical tempera-
Cell Over ture between the IGBTs. Circuits on the CCB modulate the signal from this
OVERTMP thermistor to a PWM weighted bit, which is transmitted by the CCB on
Temperature2 every down packet. Refer to “Heat Sink Temperature Monitor”
section for more details. Trips at ~80°C.
If collector-emitter of IGBT fails to block minimum voltage threshold

3 Q1BLK to
Device Failure while gate signal is not applied, then QnBLK becomes low; “n” is 1 to 4
Q4BLK
indicating effected IGBT.
VAVLOW becomes active high when AC input voltage drops below

Input Power Low2 VAVLOW
470 ± 40Vrms. This is the allowable minimum input voltage.
s
19001467: Version 1.0 5-5
CCB Board
Cell Protection Description and Thresholds
Ref. Signal
This is complimentary meaning of LINK ON, which is displayed on CCB

Communication by means of LED lamp. Therefore, if LINK ON is off then CMFLT is
CMFLT
Fault1 active. CMFLT becomes active after either parity error occurred or QValid
from EPLD is not active. CMFLT is active low.
Notes:
1. These conditions generate a Cell Fault which disables all output IGBTs and is annunciated by Down Bit 2 in
5 Mode 00
2. These conditions do not generate a Cell Fault and can only be monitored by Down Bit packet in Mode 00
3. These conditions can only be monitored in the Non Run Mode 11 and are for cell diagnostic purposes only.
5.6 Communication
The cell control board communicates to the Perfect Harmony control system via a duplex fiber optic cable on a
proprietary communication protocol. See Chapter 11, Communication Protocol, for details.
∇ ∇ ∇
s
5-6 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Gate Clamp Board
CHAPTER
6 Gate Clamp Board

The gate clamp board protects the IGBT from over voltage transients. “Personality” gate resistors and capacitors are
installed on this board as well; they are specific to the IGBT used. The board also acts as a terminal block for
paralleling IGBT modules with a common gate drive. The board is designed to be installed directly to 62mm dual
IGBT modules. This reduces lead lengths to minimize noise and stray inductance.
A gate clamp circuit is installed across each IGBT. In the event of an over voltage condition across any IGBT, the bi-
directional transient voltage suppressor network turns on and provides enough gate current to partially turn the IGBT
on. This reduces the voltage stress across the device.
A 1550V nominal voltage turn on threshold is generated by connecting four transorbs in series; one 350V and three
400V devices, from collector to gate. An 18V transorb is connected from gate to emitter to protect the IGBT from
short circuit by clamping the gate to emitter voltage to 18V.
The transorb devices are intended for intermittent operation during out-of-saturation turn off where peak voltages can
exceed the 1700V device rating.
A gate resistor and gate emitter capacitor can be installed on this board, with options for through-hole or surface
mount components. If the resistor is not required, a zero ohm resistor or jumper must be installed to allow for proper
gate drive operation. If the capacitor is not required, it can be omitted.
The gate resistor conducts during the on and off switching pulses. This resistor serves two main purposes:
supplement the cell control board's turn on and turn off resistors to reduce the number of cell control board part
number variations, and decouple parallel IGBTs from a common gate drive.
s
19001467: Version 1.0 6-1
Gate Clamp Board MicroHarmony Cell Sizes 40 - 260A Manual
The gate resistor is connected in series with the cell control board's turn on resistor during turn on, and connected in
series with the cell control board's turn off resistor during turn off. The effective RgON is the sum of the cell control
board RgON and the gate clamp board resistor. Likewise, the effective RgOFF is the sum of the cell control board
RgOFF and the gate clamp board resistor.
The gate emitter capacitor allows independent control of the IGBT's dIc/dt without significantly increasing switching
losses and using a smaller value gate resistor. Cge increases switching losses by nearly 25% but reduces repetitive
turn on current by about 20%, reduces peak repetitive FWD turn off current by about 53%, reduces IGBT turn off
overshoot voltage by about 30%, and reduces IGBT OOS overshoot voltage by about 53%.
6 Typical Schematic.
Always refer to the latest archived
drawing.
Component Values
P/N D1 D2 D3 D4 D5 D6 D7
10000428.00 1.5KE350CA 1.5KE400CA 1.5KE400CA 1.5KE400CA 1.5KE1BCA 1.5KE350CA 1.5KE400CA
10000428.01 Not Installed Not Installed Not Installed Not Installed Jumper 1.5KE350CA 1.5KE400CA
Not Installed
10000428.02 1.5KE350CA 1.5KE400CA 1.5KE400CA 1.5KE400CA 1.5KE1BCA Not Installed
Component Values
P/N D8 D9 D10 R1, SR1 R2, SR2 C1, SC1 C2, SC2
10000428.00 1.5KE400CA 1.5KE400CA 1.5KE1BCA Jumper Jumper Not Installed Not Installed
10000428.01 1.5KE400CA 1.5KE400CA 1.5KE1BCA Jumper Jumper Not Installed Not Installed
10000428.02 Not Installed Not Installed Jumper Jumper Jumper Not Installed Not Installed
10000428.03 1.5KE400CA 1.5KE400CA 1.5KE1BCA 5.1 Ohms 5.1 Ohms 0.022 μF 0.022 μF
10000428.04 1.5KE400CA 1.5KE400CA 1.5KE1BCA Jumper Jumper 0.022 μF 0.022 μF
10000428.05 1.5KE400CA 1.5KE400CA 1.5KE1BCA 15 Ohms 15 Ohms Not Installed Not Installed
∇ ∇ ∇
s
6-2 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Testing
CHAPTER
7 Testing
7.1 Documents for Testing Cells
The following ISO documents should be used for testing cells:
• TSI-062 must be followed for testing.
• TSI-063 must be followed for repair testing.
• TSF-058 includes cell ratings and test parameters.
• QSI-013, section 4.3.4 includes instructions for product identification and traceability.
7.2 Testing Equipment

MicroHarmony cells can be tested on Siemens Automated Cell Tester or manually. If tested manually, the following
equipment is required.
1. Cell Tester P/N 469939.00.
7
2. Load inductors P/N 161661.13 (2mH in parallel, 8mH in series) or a suitable equivalent with required
minimum inductance and current specification (see following table).
3. Variable voltage source (Variac) with a voltage range of at least 0-500Vrms 50/60Hz, with at least 30Arms
secondary rating.
4. Step-up transformer 480:720Vrms minimum rating, with at least a 2kVA rating. P/N 164307.00 is
recommended.
5. Alternatively, the step-up transformer can be eliminated if a variac capable of at least 750Vrms secondary is
available.
6. IBM 286 or greater with Centronics port and EGA capability.
7. Clamp on Ammeter (Beckman CT-232 or equivalent).
8. DVM capable of measuring up to 1500Vrms.
7.3 Required Tests

• Inspection/ Ohm Check
• HIPOT Test
• Rectifier Test
• Preliminary Cell Tests
• Thermistor Burn-In Test
• Burn-In Test
• Diagnostic Display Check
s
19001467: Version 1.0 7-1
Testing MicroHarmony Cell Sizes 40 - 260A Manual
Table 7-1: Test Parameters for MicroHarmony Cells
10000494 10000494
10000424. 040 070 100 140
.200 .260
Minimum Load Inductance 16mH 8mH 8mH 8mH 8mH 8mH
3 Minute Input Rectifier Test1 34Arms 58Arms 84Arms 117Arms 265Arms 265Arms
10 sec nuisance Out of

125Arms 125Arms 180Arms 225Arms 450Arms 600Arms
Saturation Test2
Over Temperature Limit

30/40 52/70 75/100 105/140 200 260
Verification3
HIPOT4 3750VDC 1 minute
1. This test must be done if the input rectifiers are replaced. It requires, however, the ability to generate full
power through the cell in order to thermally stress the rectifiers. An alternative is to short circuit the DC bus
and use a suitable step-down transformer along with a variac to generate the required rectifier current.
7 Airflow through the heat sink should be at least 180CFM (300CFM for 200-260A cells).
2. This test verifies the immunity of the IGBTs and Out of Saturation sense circuit on the cell control board to
nuisance OOS faults. This test should be applied for no more than 10 seconds. Air flow through the heat
sink should be at least 180CFM (300CFM for 200-260A cells).
3. This test verifies that the over temperature sense circuit is properly communicating at the hub control. 75%
of rated output current is applied with no air flow through the heat sink until the over temperature bit starts to
modulate. Once modulation is achieved, the output current is raised to the 100% base rating until the cell
tester disables the cell on over temperature.
4. This test ensures adequate isolation between the power electronics, control, and the cell chassis. The cell
must be disconnected from the 1/3 common bus. All components on the cell are shorted together, and a
potential is applied between the power electronics, control, and cell chassis. During the test, the cell is
checked for any flash over to ground (or excessive leakage current).
∇ ∇ ∇
s
7-2 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Repair Hints
CHAPTER
8 Repair Hints
8.1 Reporting Failures
Cell failures or component failures must be reported to both the quality group and product development.
8.2 Approved Components

Always refer to the archived BOM and assembly drawings for approved component part numbers and procedures
when repairing any cell. Failure to use components not specifically listed on the BOM may result in poor cell
performance or further failures.
8.3 Basic Rules

1. Never parallel or series non-identical manufacturer's part numbers (or Siemens MDIT numbers) for IGBTs
or electrolytic capacitors in the same power cell, even if these part numbers are approved as 1st, 2nd, or 3rd
sources on the BOM.
2. Never substitute a non-specified cell control board/gate clamp board (or any specified component or
3.
subassembly) without formal approval from the Product Development Group.
Never change an input power fuse(s) without first determining the root cause for the fuse operation. Fuses
8
are not designed to protect components in the power cell against overload. If a fuse(s) open, there is usually
a component failure within the cell. Re-application of rated power may cause catastrophic damage.
4. In cases where the archived BOM specifies obsolete components that can no longer be procured, and the
substitution of an alternative cell(s) is not available or commercially not feasible, contact the Product
Development Group for assistance. In such events, Product Development may suggest alternative
components only after sufficient technical review and verification. In these instances, it will be Product
Development's responsibility to generate the required ECR and obsolescence information. It will be the
repair department’s responsibility to make the required label changes and notify Application Engineering
and Field Service of the part number revision.
8.4 General Repair Hints and Procedures

1. Input fuse(s) or control fuse(s) opening is almost always an indication of component failure in a cell.
2. Damage to the chassis ground wire is always an indication of an insulation failure internal to the power
circuit or its components, or the result of arcing between the power circuit and chassis. Always perform the
appropriate HIPOT test or look for arc damage.
3. A capacitor failure, which results in venting, bulging, or header expulsion, is usually caused by sustained
over voltage of 15 to 20% above its operating voltage rating.
4. If one or more capacitors have failed, but only in a particular parallel group, and there this no indication of
other component damage, look for a shorted or high leakage capacitor in the other parallel groups.
5. If capacitor damage is apparent in all parallel groups and there is further damage to the IGBTs or control
board, over voltage to the cell resulted from an outside source. Power fuses opening may indicate that an
over voltage was generated from the power transformer.
6. Over voltage damage may have also occurred from an output source. This is rare since the cells can protect
themselves against this type of over voltage.
s
19001467: Version 1.0 8-1
Repair Hints MicroHarmony Cell Sizes 40 - 260A Manual
7. An IGBT failure is usually also a result of an over voltage. Failures due to over current are rare since the
cell and system is much more capable of protecting itself from this condition. There are two types of IGBT
failures, catastrophic and non-catastrophic.
In non-catastrophic failures (those which do not result in case rupture), the root cause can often be found
by Product Development or the device manufacturer. Failures of this type during cell testing or early in the
commissioning cycle are often the result of infant mortality failures. These devices must be returned to
Product Development since they may be a result of insufficient process quality. In most cases, gate drive
and cell control circuits are left unaffected and can be presumed functional.
In catastrophic failures (those which result in case rupture), the root cause is more difficult to determine.
Failures of this type usually result in collateral damage to adjacent IGBTs, especially those IGBTs in the
same pole (for instance Q1/Q2 or Q3/Q4). These failures almost always cause damage to any connected
gate drive or gate circuit.
8.5 Component Re-use

It is often unnecessary to replace all components in a failed cell. Usually only failed components need replaced,
provided that the remaining components are determined re-usable.
8.5.1 Non-Catastrophic Rectifier Failures

If a non-catastrophic Rectifier failure occurs, it usually results in one upper diode and one lower diode failing short
circuit. This requires replacing two diode modules. The third diode module can be presumed OK if:
8 1.
2.
Device passes a 3400VDC (for 1700V devices) HIPOT, all terminals to baseplate.
Device passes A-K check.
3. Device passes all specified in-circuit cell tests.
8.5.2 Non-Catastrophic IGBT Failures

If a non-catastrophic IGBT failure occurred in only one pole (i.e., Q1/Q2 or Q3/Q4), replace only the failed IGBT
module with an approved device with the same part number. The other IGBT module can be presumed OK if:
1. Device passes a 3400VDC (for 1700V devices) HIPOT, all terminals to baseplate.
2. Device passes G-E, C-E, and A-K check.
3. Device passes all specified in-circuit cell tests.
The following tests can be performed to verify an IGBTs condition after a cell failure:
G-E Check
Short the collector to the emitter. Ohm check gate to emitter. Resistance should be 10M to infinite. A low resistance
indicates device destruction. Device must be replaced.
C-E Check
Short the gate to the emitter. Ohm check collector to emitter. Resistance should be 10M to infinite. A low resistance
indicates device destruction. Device must be replaced.
A-K Check
Use a diode checker to verify a small positive voltage drop (<1V) from emitter to collector (anode to cathode of the
FWD) and blocking from collector to emitter (cathode to anode of the FWD). If a short, or if >1V is measured, the
device must be replaced.
s
8-2 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Repair Hints
8.5.3 Electrolytic Capacitors

For capacitors that do not exhibit any signs of vent out gassing, bulging, leakage, sleeve damage, terminal damage,
and have less than 1 year of service (operating or non-operating), they may be re-used and supplemented with the
approved capacitor of the same manufacturer's part number or Siemens MDIT number, if:
1. The re-used capacitors are evenly re-distributed between parallel capacitor groups so that each group has the
same number of re-used capacitors and have no more than 2 years of operation life on them.
2. Capacitor does not exhibit leakage current of more than 1mA per can at rated voltage.
The following procedure may help in checking the general health of a capacitor bank following a cell failure due to
over voltage:
1. Disconnect the bleeder resistor and measure each section with an ohmmeter. Verify that resistance is within
spec.
2. Reconnect the resistor and slowly apply AC voltage to the cell, while measuring the voltage across each
series capacitor group, up to rated AC input voltage. If all capacitors are exhibiting less than normal leakage
current, then the voltage measured for any group should equal the ratio of the resistance connected, divided
by the total resistance measured, times the total sum of the voltage.
Vc1 = R1 x (Vc1 + Vc2 + Vc3) / (R1 + R2 + R3)
For any measured voltage that is not within ±10% of this calculation, it may be assumed that one or more
capacitors in that group is exhibiting abnormal leakage. These faulty capacitors must not be re-used.
8.5.4 In all cases the cell must pass all specified testing before re-using 8
∇ ∇ ∇
s
19001467: Version 1.0 8-3
Repair Hints MicroHarmony Cell Sizes 40 - 260A Manual
s
8-4 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Application Notes
CHAPTER
9 Application Notes
9.1 External Wiring
The table below identifies the approved input and output power wiring for use with MicroHarmony Cells. Always
refer to approved assembly drawing, MFI-014 Workmanship standard for wiring, QSI-011 Wiring Practices for
Products Requiring Third Party Approval, and MFI-025 Instructions for Fiber Optic Assembly.
All wire must be UL style 3499, 7500Vrms, 150°C or equivalent.
10000424. 040 070 100 140 200 260

Input Wiring #8 #6 #4 #2 2/0 3/0
Output Wiring #8 #6 #4 #2 2/0 3/0
Input/Output Bus 0.95” x 0.125” electroless nickel plated copper
Control Duplex fiber optic
9.2 Fusing
Fuses are external to the cell. The following fuses have been approved:
10000424. 040 070 100 140 9

P/N099725 P/N 099726 P/N 099727 P/N 099728
Bussman 170M4810 170M4812 170M4813 170M4814
1000V 100A 1000V 160A 1000V 200A 1000V 250A
P/N 099717
P/N 099718 P/N 099719 P/N 099720
1021CPURB27.60Q100D
Ferraz 1000C4URC160LD80 1000C4URC200LD80 1000C4URC250LD80
80
1000V 160A 1000V 200A 1000V 250A
1000V 100A
P/N 099721 P/N 099722 P/N 099723 P/N 099724

Siba 2056020.125 2056020.200 2056020.225 2056020.280
1000V 125A 1000V 200A 1000V 225A 1000V 280A
10000494. 200 260

P/N 0100500 P/N 0100503
Bussman 170M4744 170M4745
1250V 450A 1100V 500A
P/N 0100502 0100505

Ferraz A130URD71LLI0450 A120URD71LLI0500
1300V 450A 1200V 500A
0100501 0100504
Siba 2076632.450 2076632.500
1250V 450A 1100V 500A
Note: Approved fuses have similar fuse curves. Although not recommended, non-identical
manufacturer's and Siemens part numbers may be used with a cell and/or within a system. However,
this may cause confusion with the customer and should be avoided.
s
19001467: Version 1.0 9-1
Application Notes MicroHarmony Cell Sizes 40 - 260A Manual
9.3 Device Model Parameters

9.3.1 40-140A Rectifier Modules
Vendor Eupec Semikron
Vendor P/N: DD106N1800 SKKD100/18
Siemens P/N 099414 0100375
Package Dual 92 x 25 Dual 93 x 20 mm
Vrrm 1800 1800 V
Ifavm 106 87 A at Tc=100°C
Tjmax 150 125 °C
V(to) 0.7 0.72 V
Rt: 2.0 1.8 mohms

Rjc 0.39 0.35 °C/W per arm
Rcs 0.08 0.2 °C/W per arm
Mounting Torque 4 5 Nm
Terminal Torque 4 3 Nm
9 Baseplate Cu Al oxide ceramic
Rsa, 180CFM 0.395 0.36 °C/W
Cca, 180CFM 110 80 J/°C
s
9-2 19001467: Version 1.0
9.3.2 200-260A Rectifier Modules
Vendor Eupec Semikron
Vendor P/N: DD171N1800 SKKD162/18
Siemens P/N 088173 0100787
Package Dual 94 x 34 Dual 94 x 34 mm
Vrrm 1800 1800 V
Ifavm 171 162 A at Tc=100°C
Tjmax 150 150 °C
V(to) 0.7757 0.88 V
Rt: 1.166 1.45 mohms
Rjc 0.26 0.18 °C/W per arm

Rcs 0.06 0.05 °C/W per arm
Mounting Torque 6 5 Nm
Terminal Torque 6 5 Nm
Baseplate Cu Al oxide ceramic

Rsa, 300CFM 0.3 0.28 °C/W
9
Cca, 300CFM 333 115 J/°C
s
19001467: Version 1.0 9-3
9.3.3 IGBT Modules - Primary Sources
10000424. 040,070 100 140 10000494.200 10000494.260
Vendor Eupec Eupec Eupec Eupec Eupec
BSM100GB170 BSM150GB170 FF200R17KE3 FF300R17KE3

Vendor P/N: FF200R17KE3
DLC DLC x2 x2
Siemens P/N 097065 097066 097067 097067 x 2 097068 X 2
Package 106 x 62 106 x 62 106 x 62 106 x 62 106 x 62 mm
Vces 1700 1700 1700 1700 1700 V
Ic,nom, at 80°C 100 150 200 200 x 2 300 x 2 A
Icrm 200 300 400 400 x 2 600 x 2 A
Tjmax 125 125 125 125 125 °C
RtJC 0.13 0.1 0.1 0.05 0.0425 °C/W

RdJC 0.28 0.24 0.16 0.08 0.13 °C/W
Rcs 0.012 0.012 0.01 0.01 0.01 °C/W
Rca,igbt 0.238 0.226 0.224 0.1468 0.11862 °C/W
Cca,igbt 195 182 205 455 476 J/°C
9 Rsa,igbt 0.226 0.214 0.214 0.1368 0.10862 °C/W

Mounting Torque 5 5 3-6 3-6 3-6 Nm
Terminal Torque 5 5 2.5-5 2.5-5 2.5-5 Nm
Baseplate Cu Cu Cu Cu Cu
RgON 20 15 15 15.5 15.5 Ohm
RgOFF 25 20 20 20 20 Ohm
Roos 1000 1000 1000 1000 1000 Ohm
Cge 0.022 0.022 - - - μF
Vt 1.2 1.4 1.0 1 1.1 V
Rt 14.5 9.8 6.8 3.5 2.3 mohms
Vd 1.23 1.24 1.0 1 0.9 V
Rd 8.0 5.5 4.0 2 1.43 mohms
Eon 0.0628 0.087 0.1079 0.122 0.232 J
Eoff 0.0416 0.06 0.07 0.099 0.145 J
Erec 0.0145 0.022 0.0348 0.034 0.048 J
Icell 70 100 140 200 260 Arms
s
9-4 19001467: Version 1.0
9.4 General Information
10000424. 040 070 100 140 10000494.200 10000494.260
Bus Inductance1 229nH 91nH 73nH 63nH 126nH 127nH
Power Plug maximum current 300Arms at 55 °C plug ambient, 25CFM
Mechanical life test at 250 insertions/extractions with no significant change in

Power Plug useful life
resistance
1 Measured at nominal dc bus voltage, rated output current. Includes capacitor self inductance, bus inductance, and
IGBT module inductance.
s
19001467: Version 1.0 9-5
9.5 Cell Loss Calculations

The most accurate and quickest way to calculate cell losses is to use Drive Calc Express. However, losses can be
estimated using the tables, equations, and plots below. Cell losses consist of the following: rectifier, capacitor,
bleeder resistor, IGBT, FWD, control, bus work, and power plugs.
9.5.1 Rectifier Losses vs Output Current

The table and charts below can be used for estimating individual input rectifier losses as a function of cell output
current. All 40-140A cells use the same DD106N1800 rectifier modules. All 200-260A cells use the same
DD171N1800 rectifier modules. For total rectifier losses per cell, multiply the numbers below by 6.
Iout 40-140A 200-260A Losses vs Output Current 40-140A 200-260A

25 4.83 5.10 225
50 10.21 10.54
75 16.14 16.32
200
100 22.62 22.47
125 29.64 28.97
175
150 37.22 35.83
175 45.34 43.05
200 54.02 50.62
150
225 63.24 58.55

Losses, Watts
250 73.01 66.84 125

275 83.33 75.48
300 94.20 84.48 100
9 325
350
105.61
117.58
93.84
103.55
75
375 130.09 113.63
400 143.16 124.05
425 156.77 134.84
50
450 170.93 145.98

475 185.64 157.48 25
500 200.90 169.34
0
0
50
100
150
200
250
300
350
400
450
Output Current, Arms 500
Alternatively, individual rectifier losses can be estimated as follows:

40-140A cells: Prect = 0.000439 x Iout ^2 + 0.1823 x Iout - 0.00244
200-260A cells: Prect = 0.000286 x Iout ^2 + 0.1958 x Iout + 0.03017
0.85 motor power factor, 0.95 motor efficiency, 105% modulation, Iin=0.7 x Iout, and DD106N1800 or
DD171N1800 dual rectifier modules are assumed.
s
9-6 19001467: Version 1.0
9.5.2 Total IGBT/FWD Cell Losses vs Output Current

The table and charts below can be used for estimating IGBT losses as a function of cell output current. Primary
source values are used. Losses include conduction and switching losses for both the IGBT and FWD. Losses shown
are per cell. Individual IGBT/FWD losses are ¼ that of shown (40-140A) and 1/8 that of shown (200-260A).
Iout 40/70A 100A 140A 200A 260A Losses vs Output Current

25 98.9 100.9 77.3 69.1 77.7 40/70A 100A 140A 200A 260A
50 233.0 225.7 171.0 146.8 161.0 3000
75 402.0 374.3 282.0 233.0 250.0

2750
100 606.8 546.7 408.5 327.6 344.0
125 846.6 743.0 552.0 430.7 444.0 2500
150 1122.0 963.0 712.0 542.4 550.0
2250
175 1207.0 889.0 663.0 661.5
200 1475.0 1082.0 791.0 778.7 2000
225 1292.0 928.6 901.0
Losses, Watts
1750
250 1518.0 1074.0 1029.0
275 1761.0 1229.0 1163.0 1500
300 2021.0 1391.5 1302.0
1250
325 1562.8 1448.0
350 1742.6 1598.0 1000
375 1931.0 1755.0
750
400 2128.0 1916.5
500
9
425 2333.0 2084.0
450 2547.0 2257.0
250
475 2770.0 2436.0
0
0 50 100 150 200 250 300 350 400 450 500
Output Current, Arms
* The data above assumes 0.85 motor power factor, 0.95 motor efficiency, 105% modulation, 600Hz switching
frequency, 60Hz output frequency, Eupec IGBTs, and a 1015VDC bus.
Alternatively, total cell IGBT/FWD losses can be estimated as follows:
40/70Acell: Pigbt = 0.02828 x Iout ^2 + 3.23561 x Iout + 0.39
100A cell: Pigbt = 0.01908 x Iout ^2 + 3.55781 x Iout + 0.07857
For individual 40-140A IGBT/FWD individual module losses, divide PigbtFWD by 4.

For individual 200-260A IGBT/FWD individual module losses, divide PigbtFWD by 8.
s
19001467: Version 1.0 9-7
9.5.3 Individual IGBT Losses vs Output Current

The table and charts below can be used for estimating individual IGBT losses as a function of cell output current.
Primary source values are used. Losses include conduction and switching losses for a single IGBT only. FWD losses
are neglected.
Iout 40/70A 100A 140A 200A 260A

Losses vs Output Current
25 22.0 23.0 17.0 15.5 17.7
40/70A 100A 140A 200A 260A
700
50 53.0 52.0 38.5 33.0 36.8
650
75 92.0 86.0 63.6 52.6 57.2
600
100 140.0 126.0 93.0 74.2 78.9
550
125 196.0 171.0 126.0 97.8 102.0
500
150 261.0 223.0 163.0 123.4 126.0
450
175 280.0 204.0 151.0 152.0
Losses, Watts 400
200 343.0 249.0 181.0 179.0
350
225 297.0 213.0 208.0 300
250 350.0 246.3 237.3 250
275 407.0 282.2 268.0 200
9
300 468.0 320.0 301.0 150
325 360.0 335.0 100
350 402.0 370.0

50
0
375 446.0 406.0
0 50 100 150 200 250 300 350 400 450 500
400 492.0 444.0 Output Current, Arms
425 540.0 483.0
450 590.0 523.0
475 696.0 608.0
Alternatively, individual IGBT losses can be estimated as follows:

40/70Acell: Pigbt = 0.0068 x Iout ^2 + 0.72086 x Iout - 0.2
140A cell: Pigbt = 0.00315 x Iout ^2 + 0.61521 x Iout - 0.17955
For total cell IGBT losses (FWD losses are neglected), multiply Pigbt by 4.
s
9-8 19001467: Version 1.0
9.5.4 Capacitor Losses vs Output Current

Capacitor losses are based on I^2 x R losses using ESR at 120Hz. This is a conservative approach to estimating
capacitor losses. Furthermore, a conservative ESR of 9 mohms is used for the 40-140A capacitors, and 17 mohms for
the 200-260A cells. In actual use, the effective ESR will be lower than this and losses will be slightly lower. Also, a
conservative RMS ripple current factor of 78% output current is used.
Pcaps = (Iout x 0.78 / Np)^2 x ESR x Ncaps
The table and charts below can be used for estimating capacitor losses as a function of cell output current.
Iout 40A 70A 100A 140A 200A 260A Losses vs Output Current
25 10.3 5.1 3.4 2.6 6.5 4.8 40A 70A 100A 140A 200A 260A
900
50 41.1 20.5 13.7 10.3 25.9 19.4
75 92.4 46.2 30.8 23.1 58.2 43.6 800
100 82.1 54.8 41.1 103.4 77.6

700
125 85.6 64.2 161.6 121.2
600
150 123.2 92.4 232.7 174.5
Losses, Watts
500
175 125.8 316.7 237.6
200 164.3 413.7 310.3 400
225 523.6 392.7
9
300
250 646.4 484.8

200
275 782.2 586.6
100
300 698.1
325 819.3 0
0 50 100 150 200 250 300
The data above assumes 0.85 motor power factor, 0.95 motor efficiency, 600Hz switching frequency, 60Hz output
frequency, 9mohm ESR (17mohm ESR for 200/260A cell), and Icap=Iout x 0.78. For individual capacitor losses,
divide the total given by the number of capacitors within the cell.
Alternatively, capacitor bank losses can be estimated as follows:
40A cell: Pcaps = 0.0164 x Iout ^2 + 0.002 x Iout - 2.13E-14
70A cell: Pcaps = 0.0082 x Iout ^2 + 0.0018 x Iout - 0.075
140A cell: Pcaps = 0.0041 x Iout ^2 - 0.0004 x Iout + 0.0429
200A cell: Pcaps = 0.0103 x Iout ^2 - 0.0012 x Iout + 0.782
For individual capacitor losses, divide the above results by:
40A cell: 3
70A cell: 6
100A cell: 9
140A cell: 12
200A cell: 9
260A cell: 12
s
19001467: Version 1.0 9-9
9.5.5 Total Cell Losses

The table below lists the no load losses (constant regardless of output) and load losses at maximum output power
using primary source components, at rated 750Vrms input. The values shown are the cell TOTAL losses versus
output current.
Total Cell Losses vs Output Current

Iout 40A 70A 100A 140A 200A 260A
40A 70A 100A 140A 200A 260A
25 273 268 268 244 241 248 3000
50 470 450 436 378 371 379 2750
75 726 680 637 536 524 527

2500
100 1,042 960 873 720 700 692
2250
125 1,416 1,288 1,142 929 900 875
2000
150 1,850 1,665 1,445 1,163 1,124 1,076
Losses, Watts
1750
175 1,783 1,421 1,371 1,294
200 2,154 1,705 1,642 1,529 1500
225 2,014 1,936 1,782 1250
250 2,347 2,254 2,053 1000
275 2,706 2,595 2,341

750
9
300 3,090 2,960 2,646
500
325 3,348 2,970
250
350 3,760 3,310 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300
375 4,196 3,668
400 4,655 4,044
425 5,137 4,437
450 5,643 4,848
475 6,173 5,276
s
9-10 19001467: Version 1.0
9.6 Heat Sink Temperature Monitor

Siemens P/N 094595
A PTC over temperature protector is installed on the heat sink at the rear of the cell (hottest cell temperature) next to
the Q1/Q2 IGBT module. Positive Temperature Coefficient (PTC) thermistors are thermally sensitive semiconductor
resistors which exhibit an increase in resistance at a specified temperature. Change in the resistance of a PTC
thermistor can be brought about either by a change in the ambient temperature or internally by self heating resulting
from current flowing through the device.
s
19001467: Version 1.0 9-11
The following circuitry resides on the cell control board, and handles the heat sink temperature monitoring.
Sync signal from EPLD resets and synchronizes the 600Hz ramp generator U100 circuit. Ramp at TP34 starts at
4.88V and ramps up linearly to 8.8Vpk. At 8.8V, the ramp decays quickly back down to 4.88V and repeats. Period
of waveform is 1.667msec. The thermodisc resistance varies with temperature. The non inverting amplifier U3:B
circuit converts this variable resistance into a dc voltage which is compared to the ramp. U2 comparator generates a
PWM output at TP35. The PWM signal connects to the EPLD which sends this data over the fiber optic link to the
main controller. The CCB does not shut the cell down in the event of an over temperature condition.
Thermodisc
(installed on HS)
Figure 9-1: Heat Sink Temperature Monitoring Circuitry
s
9-12 19001467: Version 1.0
Figure 9-2: Resistance vs Temperature
Figure 9-3: Temperature vs Duty Cycle
The control trips the cell when the thermodisc temperature reaches approximately 80°C.
s
19001467: Version 1.0 9-13
9.7 Exiting Air Temperature

A simple formula can be used to predict the exiting air temperature of the cell:
Tair,out = Tair,in + 1.75 x Watts / CFM
For example, consider the 140A cell operating at rated current with a 45°C ambient:
Tair,in = 45 °C (given)
CFM = 180 (minimum allowable air flow)
Watts = 1160 (from losses chart)
Tair,out = 45°C + 1.75 x 1160 watts / 180 CFM = 56.3°C
Typically the exhaust air temperature of the cell is approximately the inlet air temperature of the drive's fan. If the
cell's air out temperature exceeds the fan's maximum air temperature, the cell must be de-rated or a higher
temperature rating fan must be used.
9.8 Capacitors
9.8.1 Flammability
Aluminum electrolytic capacitors contain materials which can catch fire and support combustion when contacted by
flames. Flammable parts include plastic parts, insulating sleeves, paper, and the electrolytes. Most capacitors will
pass the needle-flame test requirements of UL 94V-O and not support combustion to the requirements of Category B
or C. In rare cases the capacitor may self-ignite from heavy overload or capacitor defect. Hydrogen in the capacitor
can ignite if sparking occurs during capacitor failure.
9.8.2 Shelf Life and Reforming
9 Capacitors should not be stored in an ambient less than 85°C and above -55°C. It is recommended
that capacitors be stored at room temperature in a dry environment free of halogen gasses like
. chlorine and fluorine that can corrode aluminum. Keep out of direct sunlight.
When an aluminum electrolytic capacitor is stored under no load conditions for a long period of time, its leakage
current tends to increase. If the storage temperature is high, the leakage current will increase substantially. This is
due to a drop in the withstand voltage of the dielectric caused by the reaction of the anode oxide layer with the
electrolyte. At this point the capacitor should not be subjected to full voltage until the leakage current returns to its
initial level, which can be done by reforming the electrolyte. Reforming can be done by applying a voltage that is
slowly increased to maximum over a period of several hours, with current limited to rated leakage current.
If capacitors have been out of service for more than 6 months, they must be reformed.
The capacitors can be reformed with the cell in or out of the drive. If reformed out of the drive, then one cell must be
formed at a time. If reformed in the drive, then all the cells can be formed at the same time.
Follow all safety guidelines. The chassis of the Power cell is electrically hot. Isolate the Power cell when performed
outside the VFD. The chassis can be grounded if the cell is connected to an input isolation transformer.
Reforming Recommendations
It is advisable to use a three-phase variable voltage source capable of producing up to the 10% high line rating of the
cell (750V x 1.1 = 825Vrms). This can be generated with a 480V Variac connected to a step up transformer. If not
available, at least a 480V variac should be used, although this will only partially reform the capacitors and could be
damaged when rated voltage is applied.
s
9-14 19001467: Version 1.0
If reforming is performed with the cells connected in the drive, connect the variable voltage source to a cell who's
output is connected to the wye output connection of the drive (i.e., cell C1). Connect the leads to the cell's three
phase input terminals or to its transformer secondary.
Caution: Reforming the cells connected in the drive will back feed the main input transformer;
medium voltage will be present and the transformer will be energized. Exercise extreme caution.
Remember that the cell chassis are floating (not grounded).
If reforming is performed with the cell out of the drive, connect the variable voltage source to the three phase input of
the cell. Exercise extreme caution- unless an input isolation transformer is used and the chassis is wired to ground,
the voltage is present from the cell to ground.
1. Hook a voltmeter up to the variable voltage source, across two phases.
2. Slowly raise the voltage to 100Vrms. Hold for 15 minutes.
3. Slowly raise the voltage in 100Vrms increments, holding each for 15 minutes.
4. Once 825Vrms is reached, hold for 15 minutes and shut down.
5. Allow the cell bus voltage to bleed down completely before removing the variable voltage source.
Energize the drive by turning on the medium voltage input and leave power on for at least 1 hour before operating the
drive.
9.8.3 Failure Modes

Early-Life Failures
Early-life failures, infant mortals, are mostly short-circuit failures from weaknesses in the aluminum oxide dielectric.
Incidence can be reduced with extended aging or burn-in. 9
Wear-Out
In the case of large capacitors enduring high levels of ripple current, the increasing ESR can cause overheating and
short circuit failures as wear-out failures. Open-circuit wear-out failures are caused by a loss of electrolyte or ESR
increase from other causes.
9.8.4 Useful Life Calculations

Onset of wear-out is determined mainly by the capacitor's size and average operating temperature. Operating voltage
has some effect. For capacitors operating at moderate temperatures, the operating life doubles for each 10 °C that
operating temperature is reduced. The inevitable death of an aluminum electrolytic capacitor is defined differently
from one vendor to the next, and formulas for forecasting end of life differ as well.
United-Chemi Con's life model has been proven to be effective in forecasting the useful life of their capacitor. UCC
defines end of life as a 20% capacitance loss, 2 times the initial ESR specification and initial DC leakage current
specification. Life is not guaranteed beyond 15 years.
s
19001467: Version 1.0 9-15
LX = LR x 2 (Tx - To) / 10 x 2 (ΔTx - ΔTo) / k x (Vo/Vx) 4.4

LX: Expected Life (Hrs) 5600μF (40-140A) 10,000μF (200-260A)
LR: Endurance Test Life (Hrs) = 5000 = 10000

TX: Maximum Rated Ambient (°C) = 85 = 85
TO: Actual Ambient (°C) = drive ambient = drive ambient
ΔTX: Rated ΔT at Max Ambient (°C) =5 =5
ΔTO: Actual ΔT from Application (°C) = ΔTx x (Ix /Io)2 = ΔTx x (Ix /Io)2
k: Acceleration Factor = 10 = 10
Vo: Rated Voltage (V) = 450 = 450
Vx: Actual Applied Nominal Voltage (V) = Vcell x 1.35/3+12 = Vcell x 1.35/3+13
Io: Rated Ripple current = 21.4 = 34.7
Ix: Actual Ripple Current = 0.89 x Iout / Np = 0.89 x Iout / Np
Note: If Vo/Vx > 1.25, then use Vo/Vx = 1.25, otherwise use Vo/Vx
9
As an example, consider the 140A cell operating at rated output current with nominal input voltage in a 45°C
ambient:
TO = 45 °C
Vx = 1015 / 3=338 + 12V ripple = 350VDC
Ix =140A x 0.89 / 4 caps in parallel = 31.15Arms
ΔTO =5 x (31.15/21.4) = 7.28. (A safety factor of 6°C can be added to this)
Vo/Vx = 450 / 350 = 1.286 > 1.25, therefore = 1.25
LX = 5000 x 2 (85 - 45) / 10 x 2 (5 - 7.28 ) / 10 x (1.25) 4.4
= 5000 x 16 x 0.8538 x 2.67 = 182,330 hours (20.8 years)
9.8.5 Disposal
Aluminum electrolytic capacitors with non-solid electrolyte principally include high-purity aluminum foils, capacitor
paper, electrolyte, aluminum case, cover and sealing parts (phenolic, thermoplastic, rubber and phenolic board),
insulating sleeve (polypropylene, polyester or polyvinyl chloride) and, perhaps, safety-vent plugs made of synthetic
rubber. If incinerated, be certain that the temperature is more than 1200 °C. Disposal is permitted in appropriate
landfills.
9.9 Output Voltage Capability

9.9.1 Normal Operation
The maximum output voltage of the drive in terms of the number of ranks and the secondary-side cell voltage is given
as:
Vout = 1.78 x N x Vcell x Tap x Vin / Vin,rated x M
s
9-16 19001467: Version 1.0
where,
N = number of ranks in the drive (or the total number of cells = 3*N),
Vcell = 750,
Tap = 1.00 (for 0% tap), 0.95 (for +5% tap) or 1.05 (for -5% tap)
Vin = actual input line voltage,
Vin,rated = rated drive input voltage
M = 1.00 min (unity) to 1.08 max (over modulation)
9.9.2 Output Voltage capability after bypass
Vout_bypass = Vout * (2N - X) / 2N,
where,
Vout = maximum output voltage with all cells operating
X = largest number of cells in bypass in two of the three phases
N = number of cells connected in series
9.9.3 Example of calculating Drive Output Voltage capability
Consider a drive with 9 cells each rated for 750V.
The maximum output voltage that this drive can deliver on the 0% tap with rated line voltage and 4% over
modulation
(N = 3, Vcell = 750, Tap = 1.00, M = 1.04) is:
Vout = 1.78 x 3 x 750 x 1.0 x 1.0 x 1.04 = 4.165 kV.
Now, if after cell bypass, the drive has 3 cells operational in phase A, 2 cells in phase B, and 1 cell in phase C, then
the maximum voltage that the drive can produce with neutral shift from the above formula is (with X = 1 + 2 = 3,
because 1 cell in phase B and 2 cells in phase C are bypassed),
9
Vout_bypass = 4165 x (2 x 3 - 3) / (2 x 3) = 2.082 kV
9.10 Output Current Capability

Amps = HP x 746 / (Volts x 1.73 x Eff x PF)
Where,
Amps = motor current
HP = motor horsepower
Volts = motor line to line rms voltage
EFF = motor efficiency
PF = motor power factor
9.11 Output Frequency and Switching Frequency

Fc = 3.6 x Fo
Where,
Fc = switching frequency
Fo = output frequency
Fc, default: 600Hz Fo, default max: 167Hz
Fc max: 1200Hz Fo max: 330Hz
Default switching frequency is 600Hz, which can produce up to 600 / 3.6 = 167Hz output frequency. Beyond 600Hz
requires current de rating.
s
19001467: Version 1.0 9-17
9.12 MicroHarmony Volt Map
Note: 1PU = maximum cell DC bus voltage (MicroHarmony = 1200Vpk). For RMS, divide by 1.414.
Internal Cell Components
Between cell chassis and output terminals

(For 4,5,6,7, or 8 series cells, continue the
counting)
Any transformer secondary to ground-

4 pu /3 typical, 2Npu worst case (GF)
∇ ∇ ∇
s
9-18 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Drive Calc Express
CHAPTER
10 Drive Calc Express

Drive Calc Express is an excel spreadsheet tool that can be used to estimate the performance of a MicroHarmony
Drive. With easy to use scroll bars and drop down menus with error messages, many of the rather tedious
calculations previously shown can be performed in a few short steps. Furthermore, the program will calculate
junction temperatures for over load conditions, as well as aid in determining much of the important drive parameters.
10
∇ ∇ ∇
s
19001467: Version 1.0 10-1
Drive Calc Express MicroHarmony Cell Sizes 40 - 260A Manual
10
s
10-2 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual Communication Protocol
CHAPTER
11 Communication Protocol
This section summarizes the Siemens Harmony VFD message protocol and data handling between the Host and Cell
Control Boards (CCB). The scope of this document includes a detailed description of the actual message contents and
the CCB's implementation.
11.1 Operating Modes

The Harmony CCB supports 4 message modes where one of these modes is dedicated for normal power cell
operation. The remaining three modes are dedicated for cell diagnostic and test purposes. Each of these
communication modes are fully defined in Appendix B of this document.
11.2 Reference Documents

Description Part Number
Siemens Cell Control Board Schematic TBD
Siemens Cell Control Board GAL (U31) Logic TBD
Siemens FOLA TBD
11.3 Fiber Optic Message Protocol

The Master Link to CCB communication link is based on a pair of “FOLA” (SGS-Thomson IMS C011 cloned in
mode “0”) transceivers that operate in a Master/Slave mode. The Modulator Card serves as the master and the CCB is
the slave device. This means that the CCB only generates a message in response to receipt of a complete message
packet from the Modulator. If no message is received, the CCB does not transmit any messages. This fact in turn
causes all cells to be shut down. Any communication failures detected by the Modulator also cause a drive fault to
occur. Note that this communication link is always active when power is applied to the Harmony VFD. The message
protocol is summarized as follows: 11
Table 11-1: Host/CCB Communication Protocol
Inmos IMS C011

Transceiver
(from SGS-Thomson)
Message/Data Size 7 bit data + 1 parity bit
Parity Odd
Data Rate 5 M baud
Message Rate 9 - 11 microsecond update
Initiated approximately 1.2 micro-
Slave Response Time seconds after receipt of Link to
CCB message
Protocol Per TR-xxxxx
s
19001467: Version 1.0 11-1
Communication Protocol MicroHarmony Cell Sizes 40 - 260A Manual
11.4 Error Handling

Several levels of error handling are implemented on the CCB in order to validate each message. The IMS C011
Transceiver provides the following inputs/outputs that are implemented as follows on the CCB:
Table 11-2: IMS C011 Status Indicators
Indicates that data on pins Q0-7 is valid (data from Master Link)
Input for CCB 'ACTIVITY' circuit that verifies message activity from Master Link
QVALID Generates CCB Communication fault (COMFLT) if ‘ACTIVITY’ fault exceeds
approximately 15 microseconds
‘ACTIVITY’ is validated for every message by the 890485.02 GAL
Generates Acknowledge Signal from CCB to Master Link IMS C011 that Q0-7 data
QACK
was read
Indicates that data on I0-7 is valid
Initiates transmission of CCB response to Master Link message approximately 1.2
IVALID
μsec after QVALID received
Used as Latch Enable signal for CCB response data
Indicates that Acknowledge signal received from Master Link IMS C011 in
IACK
response to CCB transmission.
RESET Reset circuit enabled 1.2 msec after a CCB Communication failure (COMFLT)
11.5 Parity
The most significant data bit (bit 7) for each Modulator/CCB command/response message is used as an ODD parity
bit (i.e., 7 data bits + 1 parity bit result in an 8 bit data word with ODD parity).
The CCB parity check circuit generates a communication failure (COMFLT) if the parity is incorrect for more than
approximately 22 microseconds (i.e., 3 or more messages). Note that the 890485.02 GAL (U31) equations validate
parity for each received message.
11
s
11-2 19001467: Version 1.0
11.6 Cell Data

The following tables define the Perfect Harmony Modulator/CCB communication data bytes where bit 0 is the least
significant bit (LSB). Table A-3 shows the information that flows from the Modulator card to the CCB. Table A-4
shows the CCB response message for each of the 4 data modes. The Operating Mode is controlled by the Harmony
microprocessor where Mode ‘00’ is the default mode. Modes ‘01’, ‘10’, and ‘11’ are used for diagnostic purposes
only. All data sent to the CCB is processed by the Cell Control Gal (U31), therefore the functionality of these ‘Up’
bits are totally dependent on the GAL logic.
Table 11-3: Modulator to CCB Data (‘Up’ Bits)
‘Up’ Bits Mode ‘00’ Mode ‘01’ Mode ‘10’ Mode ‘11’
0 0 1 0 1
1 0 0 1 1
2 Enable Output Fault Reset Fault Reset Test Enable
3 Enable Left Pole 0 0 Device Test A
4 Enable Right Pole 0 0 Device Test B
5 Bypass Request 0 0 Not Test Enable
Temperature Sync Temperature Sync Temperature Sync Temperature Sync
6
Reference Reference Reference Reference
7 Parity Parity Parity Parity
Table 11-4: CCB to Modulator Data (‘Down’ Bits)
‘Down’ Bits Mode ‘00’ Mode ‘01’ Mode ‘10’ Mode ‘11’
0 0 1 0 1
1
2
0
Cell Fault
0
OOS Fault
1
Q1 OOS OK
1
Q1 Blocking
11
Not Over Voltage
3 Low DC Bus Voltage Q2 OOS OK Q2 Blocking
Fault
Cell Temperature Not Under Voltage
4 Q3 OOS OK Q3 Blocking
Feedback Signal Fault
5 Control PWR OK Not Cap Sharing Fault Q4 OOS OK Q4 Blocking
CCB Communication Bypass Option
6 Bypass Acknowledge Output Fuse OK
OK Available
7 Parity Parity Parity Parity
Note that the CCB is responsible for latching all CCB initiated fault conditions so that the Perfect Harmony CPU can
properly determine the cause of any CCB faults when cell diagnostics are performed. These CCB faults must remain
latched until a Cell Fault Reset is received by the CCB (bit 2 of Mode ‘01’ or ‘10’). The parity bit is “stripped off” at
the FOLA before getting to the Modulator cell data registers, and replaced with the OR’ed value of the parity fault
and the link fault (CommFault).
s
19001467: Version 1.0 11-3
11.7 Mode 00 Data

11.7.1 Modulator to CCB
Mode ‘00’ is the default communication mode, which has the capability of enabling the cell output, commanding the
left or right poles, or in the case of electronic bypass, requesting that cell bypass be enabled. Note that this method of
handling bypass (electronic or SCR) is no longer used (this function is maintained for compatibility). Therefore,
when the CPU enables the Bypass, both this bit and the equivalent one in the M.V. Bypass Control Board are sent.
Mode “00” also provides a 600 Hz reference signal to be used by the CCB for generating cell temperature response
data (for simplicity, all the modes send this bit, but only in mode 00 does the Modulator gets a proper response from
the CCB).
Table 11-5: Mode 00 Data from Modulator to CCB
Bit Description
0 0 -> Mode definition bit 0
2 Enable Output
3 Left Pole
4 Right Pole
5 Enable Cell Bypass
6 600 Hz Sync Pulse for Cell Temperature Circuit
7 Odd Parity Bit
11
s
11-4 19001467: Version 1.0
11.7.2 CCB to Modulator

The CCB Mode 00 response data to the Modulator is shown below, where the Hub/Modulator boards monitor
response bit 2 to determine the operational integrity of each power cell. The CCB indicates a cell fault condition by
setting the Fault flag (bit 2) in the Mode “00” CCB response message. When this condition occurs, the outputs of all
installed cells are disabled via dedicated hardware on the Modulator.
Table 11-6: Mode 00 Data from CCB to Modulator
Bit Description
2 Cell Fault detected by CCB
3 Cell DC Bus Voltage Low (Warning)
Cell Temperature Feedback (pwm at 600 Hz car-
4
rier)
5 Cell Control Input Power Valid
6 Cell Bypass Enabled
7 Odd Parity Bit
Note: All current Harmony Drives use the Cell Bypass Enabled Indicator (bit 6) to determine proper
settings of the Voltage Regulator circuit on the Power Interface board.
11
s
19001467: Version 1.0 11-5
11.8 Mode 01 Data

Mode 01 is dedicated for collecting diagnostic information from the CCB and is also used for issuing ‘Cell Fault
Reset’ commands by setting bit 2 high (‘1’).
Table 11-7: Mode 01 Modulator to CCB Data
Bit Description
0 1 -> Mode definition bit
2 Cell Fault Reset
3 0 (not used)
4 0 (not used)
5 0 (not used)
6 Sync pulse for temperature engine
7 Odd Parity Bit

The response data for Mode 01 is shown below, where bit 2 indicates a fault when set high (‘1’) and bits 3-6 indicate
a fault when set low (‘0’).
Table 11-8: Mode 01 Data from CCB to Modulator
Bit Description
11 1 0 -> Mode definition bit 1

2 Any Device Out of Saturation (OOS) Fault (Q1,Q2,Q3, or Q4)
3 Not Cell DC Bus Overvoltage
4 Not Cell DC Bus Undervoltage
5 Not Cell Capacitor Sharing Fault
6 Not Communication Fault detected by CCB
7 Odd Parity Bit
s
11-6 19001467: Version 1.0
11.9 Mode 10 Data

Mode 10 is dedicated to collecting diagnostic information from the CCB and is also used for issuing ‘Cell Fault
Reset’ commands by setting bit 2 high (‘1’).
Bit Description
2 Cell Fault Reset
3 0 (not used)
4 0 (not used)
5 0 (not used)
7 Odd Parity Bit

The response data for Mode 10 is shown below where bits 2 through 6 indicate a fault condition when set low (‘0’).
Table 11-10: Mode 10 Data from Power Cell to Modulator
Bit Description
2 Not Q1 Out of Saturation (OOS) Fault 11
3 Not Q2 Out of Saturation (OOS) Fault
6 Cell Output Fuse (OK)
7 Odd Parity Bit
s
19001467: Version 1.0 11-7
11.10 Mode 11 Data

Mode 11 is dedicated, for the purpose of diagnostics, to provide a means to test device status. It also provides an
indication if the Cell bypass option is available.
Bit Description
2 Enable Device Testing
3 Device Test A (Least Significant Bit)
4 Device Test B (Most Significant Bit)
5 Not Device Test Enable
7 Odd Parity Bit
11.11 Device Testing

In order to determine operational integrity of the Power cells, the status of each power switching device and bypass
components can be tested via Mode 11. In the case of Perfect Harmony Next Gen Control, cell bypass is not
available, so the bypass tests are not performed. These device tests are controlled by the Harmony microprocessor
and are performed one device at a time (and one cell at a time) where switching and bypass tests are not performed if
any blocking failures are detected.
11.11.1 Device Test Control Data
11 Table 11-12: Mode 11 Device Test Control Data
Test Bit 2 Bit 3 Bit 4 Bit 5

All Devices Blocking 1 1 1 1
Q1 Switching 0 1 1 1
Bypass (using Q1) 0 0 0 1
Bypass (using Q2) 0 1 0 1
s
11-8 19001467: Version 1.0

The response data for Mode 11 data from the cell provides discrete indicators that show whether voltage is present at
the output terminal of each of the power cell switching devices. Also included is a Bypass Available status bit that the
Host can query to determine if the Cell Bypass option is available on the cell. (The Next Gen Control Software
doesn't test this bit because the bypass, when it exists, is always mechanical.)
Table 11-13: Mode 11 Data from Power Cell to Modulator
Bit Description
2 Q1 Blocking Indicator (Blocking = 1)
6 Cell Bypass Option Available
7 Odd Parity Bit
∇ ∇ ∇
11
s
19001467: Version 1.0 11-9
11
s
11-10 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual NOTES
NOTES
19001467: Version 1.0

s N-1
NOTES MicroHarmony Cell Sizes 40 - 260A Manual
N-2
s 19001467: Version 1.0
MicroHarmony Cell Sizes 40 - 260A Manual NOTES
19001467: Version 1.0

s N-3
NOTES MicroHarmony Cell Sizes 40 - 260A Manual
∇ ∇ ∇
N-4
s 19001467: Version 1.0

GENIV CELL - Confidential - 19001467V1.0 PDF

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

GENIV CELL - Confidential - 19001467V1.0 PDF

Uploaded by

Copyright:

Available Formats

MICROHARMONY CELL

Manual Number: 19001467

FOR INTERNAL COMPANY USE ONLY!!

Siemens Energy & Automation, Inc.

500 Hunt Valley Road, New Kensington, PA, USA, 15068

40A BOM: 10000424.040

40-140A Assembly: D10000424A.ALL

Production Test Specification: TSI-062

Traceability Standard: QSF-013

Chapter 3: Installation .................................................................................................. 3-1

19001467: Version 1.0

Parity .................................................................................................................. 11-2

Safety Precautions and Warnings

Danger - Electrical Hazards!

19001467: Version 1.0

ESD Sensitive Equipment!

19001467: Version 1.0

Figure 1-1: MicroHarmony Cell

Figure 1-2: 40-140A Cell Anatomy (*Top Lid not shown)

Figure 1-3: 200-260A Cell Anatomy (*Top Lid not shown)

1.2.2 Rear Blind-Mate Power Connections

1.2.3 Snubberless design

1.2.5 Cell Control Board

1.2.6 Gate Clamp Board

1.2.8 Heat Sink Design

1.2.10 Increased input voltage rating

1.2.11 Multiple Sources

1.2.12 Simple Design

1.2.13 Electrolytic Capacitors with Plastic Mounting Tray

10000424. 040 070 100 140

52Lbs 57.5Lbs 63Lbs 68.5Lbs

13.496” W x 10.255” H x 22.086” D

12.62” W x 9.55” H x 21.77” D, neglecting latches and bolt heads

Volume 2623.74 in^3, 1.518 ft^3, 4.3 m^3, 90.866 pints

Table 2-2: 200-260A Mechanical Specifications

10000494. 200 260

102.8 Lbs 112.6 Lbs

13.998” W x 13.117” H x 25.885” D

13.62” W x 12.41” H x 25.57” D, neglecting latches and bolt heads

Volume 4753 in^3, 2.75 ft^3, 7.788 m^3, 164.6 pints

2.2 Connections 40-260A

2.3 Environmental Specifications

45 °C (113 °F, 318.15 °K), up to 60 °C with de-rating.

Storage Ambient -30 °C (-22 °F) minimum, 60 °C (140 °F) maximum

High humidity (93-95% RH) is not a concern unless there is a possibility of

Non conductive particulate contamination should be limited to <100 microns at

Air Flow vs Pressure Drop

2.4 40-140A Outline

*Refer to Installation Section for mounting and bus connection information.

2.5 200-260A Outline

Figure 2-2: 200-260A Outline

2.6 Access and Connections

2.7 Indicators and Labels

Fiber DC Bus Voltage Indicator

Figure 2-4: Indicators and Labels

2.8 Key Components

2 10000424. 040 070 100 140

Eupec Eupec Eupec Eupec

RgON 20 ohm 20 ohm 15 ohm 15 ohm

RgOFF 25 ohm 25 ohm 20 ohm 20 ohm

ROOS 1000 ohm 1000 ohm 1000 ohm 1000 ohm

Cge 0.022 μF 0.022 μF 0.022 μF Not Installed

CCB 10000424.71 10000424.71 10000424.71 10000424.71