Application Note Optoelectronics

Voltage Regulator Information

INTRODUCTION widely used in medium and high power applications,

A voltage regulator maintains a specific stable DC
voltage despite input voltage fluctuation, load current,
and ambient temperature. They are a key component
in power supplies, motor drives, controllers, and any-
where a stable voltage is required.
Regulators are divided into two classes, each with
two sub-classes. Linear regulators are classified into
series regulators and shunt regulators. Linear regula-
tors are widely used in audio equipment, VCRs, and
electronic musical instruments due to their their low rip-
ple and low noise characteristics.
Switching regulators are classified into switching
type and converter type. Switching regulators are
usually power supplies of more than 20 W, due to their
high efficiency. Sharp markets series regulators and
switching regulators.
SERIES REGULATOR CATEGORIES
Sharp’s series regulators are divided into two
types; NPN type and low drop-out PNP type. These
are available as fixed output voltage and variable out-
put voltage types.
Sharp also offers added functionality such as ON/
OFF controls and reset signal generation. See Figure 1
for how each category breaks out.

3-TERMINAL

FIXED OUTPUT VOLTAGE

MULTI-FUNCTION

NPN (4-TERMINAL)

(STANDARD)
3-TERMINAL

VARIABLE OUTPUT VOLTAGE

MULTI-FUNCTION

SERIES
REGULATORS

3-TERMINAL

FIXED OUTPUT VOLTAGE

MULTI-FUNCTION

PNP
(4/5-TERMINAL)
(LOW DROPOUT)

VARIABLE OUTPUT VOLTAGE MULTI-FUNCTION

NOTE: SHARP Part (4/5-TERMINAL)

OP16-1

Figure 1. Series Regulator Tree

Application Note 1
Optoelectronics Voltage Regulator Information

SWITCHING REGULATOR CATEGORIES • Various packages:

Switching regulators are divided into step-down/ – TO-92 (Lead forming type)
polarity inversion type, and step-up type. They regulate – TO-220 full-mold 4-terminal equivalent (Lead
the output voltage by swiching the output on and off. forming type is also available.)
Since it’s not a linear circuit, the internal power losses – TO-220 full-mold 5-terminal equivalent (Lead
are extremely low. This makes them ideal for high watt- forming type is also available.)
age, high differential voltage applications. See Figure 2 – TO-3P 5-terminal equivalent
for how each category breaks out. – TO-263 (Tape-packaged products are also avail-
able.)
LOW DROP-OUT REGULATOR – SC-63 3-terminal equivalent (Tape-packaged
FEATURES products are also available.)
Sharp’s voltage regulators offer these features: – SC-63 5-terminal equivalent (Tape-packaged
products are also available.)
• Low drop-out: Low drop-out voltage – SOT-89 equivalent (Tape-packaged products are
• Additional features are available: Built-in ON/OFF also available.)
control, precision adjustable output, variable voltage – SOT-23L 6-terminal equivalent
output, low dissipation current when OFF, built-in – SOT-23-5 5-terminal equivalent
reset signal generation, and overheat shut-down
• Built-in protections: Overcurrent protection, overheat
protection, input-output reverse voltage protection

STEP-DOWN/POLARITY INVERSION

SWITCHING REGULATORS

STEP-UP

NOTE: SHARP Part

OP16-2

Figure 2. Switching Regulator Tree

CONVENTIONAL REGULATOR DROPOUT VOLTAGE 2.5 V MAX.

This input-output difference voltage

causes power loss and subsequent heat.
Reducing the dropout voltage carries positive effects.

SHARP’S LOW DROPOUT VOLTAGE REGULATOR DROPOUT VOLTAGE 0.5 V MAX.

OP16-3

Figure 3. Reducing the Drop-out Voltage

2 Application Note
Voltage Regulator Information
Advantages of Low Drop-out Regulators
Low drop-out regulators offer these features:
• Smaller heat sinks due to lower power dissipation in
the device
• Smaller transformers (smaller cores) are required
since the input voltage can be reduced, plus the
higher frequencies are responsible for reducing size
as well
• Longer battery life
• Due to higher effeciencies, output current ratings per
package can be increased
• Overall design effeciency is increased
Additional Features
SHARP’s voltage regulators are also availble with
these features:
• ON/OFF control allows a power supply to operate in
stand-by mode or to switch off the main supply
• Precision output adjustment for variable output volt-
age devices; use two external resistors to precisely
set the output voltage
• Low current at OFF-state saves battery power
• Reset signal generation sends a specific-length
reset signal to the rest of the circuitry at switch-on, at
power interruption, or if the voltage drops, preventing
errors in MCU-based systems
• Overheat shut-down shuts down (crowbars) the out-
put to prevent damage to downstream circuitry when
junction temperature ≥ 110°C. Once crowbarred, the
output is held OFF until a power supply reset or Vc
at the ON/OFF control terminal goes from LOW to
HIGH. This method is used in some devices; others
use Overheat protection.
Application Note
Optoelectronics
• Overheat protection shuts down the output to prevent
damage to downstream circuitry when junction tem-
perature ≥ 125°C. As soon as the temperature drops
below this limit, output is automatically restored.
Some devices use this method of output protection;
others use Overheat shutdown.
• Overcurrent protection occurs when current exceed-
ing the device’s rating flows to its output, as in the
case of a short-circuit. The output current will
instantly stabilize at a lower value.
• I/O reverse-voltage protection prevents damage to
the component when the output voltage exceeds the
input voltage.
NOTE: The component protection functions are designed to protect
the component itself and minimize damage to subsequent
circutry in the event of trouble. SHARP recommends design-
ing circuitry around the Absolute Maximum Ratings rather
than the protection modes.
Packaging Features
SHARP’s devices have these features as part of
their packaging:
• Full-mold devices mean no need for an insulation
sheet between the device and the heat sink, there-
fore reduced production costs
• Full-mold devices may be placed close to adjacent
devices, improving safety
• Surface mount packages allow automatic high den-
sity mounting, and are available in tape-and-reel
configuations.
3
Optoelectronics Voltage Regulator Information

USAGE AND MOUNTING TIPS

Electrical Tips
The bypass capacitors, CO, CIN must be connected to
ground with the shortest traces possible. The waveform
can be influenced by capacitor type, value, and ground 1 2
trace length. Variations in type and value of the capacitor
may cause it to oscillate (see Figure 7). The actual out- OP16-5
put waveform should be validated with production PCBs.
Figure 4. Input Protection Diode
Incorrect voltage or polarity can damage this device.
Ensure proper voltage tolerance and polarity before
applying power.
The ON/OFF control terminal is LSTTL-compatible. If TO-220 Series TO-3P Series
the ON/OFF control terminal is not used, tie it HIGH, but not 4.8 mm MIN. 3.7 mm MIN.
to the output; instead use a pull-up resistor if necessary.
When the DC input terminal is at ground potential,
during normal operation, charge can accumulate in the
output capacitor (CO), causing current flow to the input
side and damage the device. If the input terminal can OP16-6
assume ground potential during normal operation, con-
nect a protection diode as shown in Figure 4. Figure 5. Lead Bending

Mechanical Tips
M3 FLAT FILLISTER HEAD SCREW
LEAD FORMING
(do not use a countersink head screw)
When forming leads, follow the specifications in
Figure 5 to keep mechanical stress from being applied FLAT WASHER
to the terminal and mold resin junction.
When mounting a device to a heat sink, do not bend
the terminals during the mounting process.
For TO-220 devices, 0.4 to 0.5 N•m fastener torque
is recommended. For TO-3P devices, use 0.4 to 0.6
N•m fastener torque. Use an M3 fillister head screw. Do
not use a countersunk head screw. See Figure 6.
AL PLATE
SPRING WASHER
SURFACE MOUNTING M3 NUT
The standard mounting pattern for surface mount OP16-7
type regulators appears in Figure 8. In actual use, the
Figure 6. Fixed Mounting
trace must be suffient to meet the power dissipation
based on derating curve for the particular regulator.

VIN VO
1 2
+
CO
4
LOAD
3

CMOS or TTL
OP16-4

Figure 7. Electrical Connections for TO-220 Series Devices

4 Application Note
Voltage Regulator Information Optoelectronics

3-PIN SC-63 CASE 5-PIN SC-63 CASE

7.0 7.0

A A

7.0

7.0

6.9
6.9

2.5
2.5

0.8 4 - 1.27 0.8

2.54 2.54 5.08

5.08

TO-263 CASE
10.0 R0.5 2.35 2.35
R0.5
1.0
8.5

φ.1
φ.1

4.6

9.9
8.4
9.5

1.2 1.2 1.2

3.0

0.60 0.60

0.75 0.75
4 - 1.7

6.8

NOTE: Dimensions are in mm. OP16-11

Figure 8. Surface Mounting Pattern

Application Note 5
Optoelectronics Voltage Regulator Information

Designing for Thermal Protection When the thermal resistance of a heat sink is known:
Maximum power dissipation of devices is obtained Tj = P × R'th (j – a) + Ta
by the equation: PD = IO × (VIN – VO) + VIN × Iq = (Vi – O × IO) × R'th (j – a) + Ta
Using the ambient temperature, Ta, and power dis- On condition that:
sipation, PD (MAX.), determine the heat sink area R'th (j – a) = Rth (j – c) + Rth (c – a)
required for safe operation within the Absolute Maxi-
Confirm Tj ≤TjMAX (125°C). Tj should be 70% to
mum specifications. Operating outside these tempera-
80% of TjMAX.
ture limits can result in degraded performance or
device failure.
HEAT SINK TIPS
Use of thermal shutdown circuits are recommended Do not allow any warping or unevenness in the con-
to keep the device from exceeding the Absolute Maxi- tact surface between the heat sink and device. Make
mum ratings. sure there are no burrs or shavings in the contact area.

HEAT SINK DESIGN Apply a recommended silicone grease uniformly to

the contact suface between the heat sink and device.
When the thermal resistance of a heat sink is
Recommended characteristics are:
unknown:
• No general variation in operating temperature range.
Take the case temperature (TC) with a φ 0.1 mm
thermocouple between the device case and the heat • Base oil does not separate and it does not permeate
sink. Ambient temperature is the MAX temperature for into the device.
ordinary operating conditions. • Even if base oil permeates into the device, operation
Tj = P × Rth (j – c) + Tc and lifetime are not influenced.
= (Vi – O × IO) × Rth (j – c) + Tc Some recommendations:
Confirm Tj ≤TjMAX (125°C). Tj should be 70% to • G-746 from Shin-Etsu Chemical Co., Ltd.
80% of TjMAX.
• SC-102 from Dow Corning Toray Silicone Co., Ltd.

HEAT SINK THERMAL RESISTANCE AREA

(2 mm aluminum plate) REGULATOR
100
THERMAL RESISTANCE RATIO (c-a) (°C/W)

HEAT SINK

10

5
DASHED LINE INDICATES
REGULATOR IS CENTERED ON HEAT SINK

1
10 50 100 1,000

HEAT SINK AREA (cm2)

OP16-8

Figure 9. Heat Sink Thermal Resistance

6 Application Note
Voltage Regulator Information Optoelectronics

DESIGNING WITH LOW DROPOUT Thermal Protection

VOLTAGE REGULATORS (SC-63 SERIES)
SHARP recommends these design practices to min-
imize any possibility of device or collateral circuitry
damage.
Electrical Connection
The bypass capacitors, CO and CIN must be con-
nected to ground with the shortest traces possible. The
waveform can be influenced by capacitor type, value,
and ground trace length. The actual output waveform
should be validated with production PCBs.
Incorrect voltage or polarity can damage this device.
Ensure proper voltage tolerance and polarity before
applying power.
Maximum power dissipation (PD) of these devices
can be calculated with:
PD = IO × (VIN – VO)
Using the ambient temperature, Ta, and power dis-
sipation, PD (MAX.), determine the heat sink area
required for safe operation within the Absolute Maxi-
mum specifications. Operating outside these tempera-
ture limits can result in degraded performance or
device failure.
Use of thermal shutdown circuits are recommended
to keep the device from exceeding the Absolute Maxi-
mum ratings.

VIN VO
1 2

+
CIN CO
LOAD
3

OP16-9

Figure 10. SC-63 Series External Connections

Application Note 7
Optoelectronics Voltage Regulator Information

DESIGNING WITH LOW DROP-OUT VOLT-

AGE REGULATORS
(SOT-23L SERIES)
SHARP recommends these design practices to min-
imize any possibility of device or collateral circuitry
damage. 6 4

Electrical Connection OP16-13

The bypass capacitors, CO and CIN must be con- Figure 11. Input Protection Diode
nected to ground with the shortest possible traces. The
waveform can be influenced by capacitor type, value,
and ground trace length. The actual output waveform Thermal Protection
should be validated with production PCBs. Maximum power dissipation (PD) of these devices
Incorrect voltage or polarity can damage this device. can be calculated with:
Ensure proper voltage tolerance and polarity before PD = IO × (VIN – VO)
applying power. Using the ambient temperature, Ta, and power dis-
The ON/OFF control pin is compatible with LSTTL, sipation, PD (MAX.), determine the heat sink area
and can be directly driven by TTL, LSTTL, or CMOS required for safe operation within the Absolute Maxi-
standard logic. mum specifications. Operating outside these tempera-
ture limits can result in degraded performance or
If voltage is applied to the output terminal which
device failure.
exceeds the voltage of DC input terminal, the device
may be damaged. Thermal shutdown circuits should be use so that the
device does not exceed Absolute Maximum ratings.
When the DC input terminal is at ground potential,
during normal operation, charge can accumulate in the
output capacitor (CO), causing current flow to the input
side and damage the device. If the input terminal can
assume ground potential during normal operation, con-

6 4

+
VIN CIN CO
1 3 LOAD

2 5 Cn

CMOS or TTL
OP16-12

Figure 12. SOT-23L Series External Connections

8 Application Note
Voltage Regulator Information Optoelectronics

DESIGNING WITH SWITCHING Thermal Protection

REGULATORS (PQ1CZ1) Internal power dissipation (P) of the device is
SHARP recommends these design practices to obtained using this equation:
minimize any possibility of device or collateral circuitry P = ISW × VSAT × D + VIN × I
damage.
Where:
Electrical Connection ISW = Average Current
Good printed circuit board layout and external wiring D = Duty cycle
practices are very important to keep noise low. Design- VIN = Input voltage referenced to ground
ers should also be on the lookout for induced noise
from wiring inductance. I = Consumption current

To minimuze inductance, traces should be thick and
short between large current diodes, input and output
capacitors, and terminals 1 and 2. Single-point ground-
ing should be used for best results.
If the output voltage is not as stable as desired, it can
be improved by adding a capacitor (from several nF to
several dozen nF) in parallel with external resistor R2.
A high-switching-speed diode is recommended for
the catch-diode D because of its higher efficiency.
Select a diode with current rating at least 1.2 times
greater than maximum switching current.
The output ripple voltage is highly dependent on the
ESR (Equivalent Series Resistor) of the output capacitor,
and can be minimized by selecting a Low ESR capacitor.
Inductors should not be operated beyond maximum
rated current to prevent saturation.
For Step down types:
Ton Vo + Vf
D ( Duty ) = --------------------------- = -----------------------------------------
T ( period ) Vin – Vsat + Vf
ISW (Average) = I (Output current)
For Polarity inversion types:
Ton Vo + Vf
D ( Duty ) = --------------------------- = ----------------------------------------------------------
T ( period ) Vin + Vo – Vsat + Vf
1
Isw ( Average ) = ------------- × I
1–D
Where Vf = diode forward voltage
Using the ambient temperature, Ta, and power dis-
sipation, PD (MAX.), determine the heat sink area
required for safe operation within the Absolute Maxi-
mum specifications. Operating outside these tempera-
ture limits can result in degraded performance or
device failure.
Thermal shutdown circuits should be used to keep
the device from exceeding Absolute Maximum ratings.

4
L VO
1 2

5
+
+ 3 R2
CS CO LOAD
D
VIN CIN
R1

OP16-14

Figure 13. PQ1CZ1 External Connections

Application Note 9
Optoelectronics Voltage Regulator Information

Vout Adjustment ON/OFF CONTROL WITH SOFT STARTUP

The output voltage can be adjusted by attaching For ON/OFF control with capacitor Cs, use a series
external resistors as shown in Figure 15. current limiting resistor to prevent destroying transistor
Tr by discharge current from Cs.
Adjustable range is:
a. Step-down voltage type APPLICATION CIRCUIT EXAMPLE
VO = Vref to 35 V A multi-output switching power supply (using a fixed
output voltage regulator) is shown in Figure 16.
The maximum value is limited to 0.9 × (VIN – VSAT).
b. Polarity inversion type
VO = -Vref to -30 V
VO is limited to (40 – VIN – VF) × VIN. (V)
Output voltage (VO) Vref × (1+R2/R1) (V) 3.55 DUTY DMAX

TERMINAL VOLTAGE
(VTHH)
ON/OFF Control Terminal DUTY 0%
2.25

ON/OFF
In the circuit in Figure 15, when the ON/OFF control (VTHL)
terminal is driven LOW by switching transistor Tr, the 1.4
output voltage may be turned OFF and the device (VTHON)
enters standby mode. Current at stand-by mode
becomes 400 µA (MAX.).

SOFT START 0

When capacitor C S is charged, the output pulse OFF- SOFT

STANDBY MODE STATE START
gradually increases and output voltage will rise gradu-
ally (See Figure 14).

TIME

OP16-16

Figure 14. Soft Startup Voltages

4 IO VO
L
1 2

5
R2
+ 3
VIN +
LOAD
CIN D
CS CO
Tr R1

OP16-15

Figure 15. ON/OFF Terminal Control

10 Application Note
Voltage Regulator Information Optoelectronics

ON/OFF
LINE CONTROL
FILTER DIODE
BRIDGE
+
INRUSH
AC CURRENT
INPUT CONTROL
_
CIRCUIT
LOW POWER-LOSS +
VOLTAGE REGULATOR
_

POWER MOSFET

SWITCHING
DEVIATION
CONTROL
DETECTION
CIRCUIT

PHOTOCOUPLER

OP16-17

Figure 16. Power Supply Circuit

ESD (Electrostatic Discharge) REFLOW SOLDERING

These devices employ a bipolar IC and may be dam-
aged by electrostatic discharge. The precautions listed
here should be taken to avoid ESD damage.
• Use proper human ESD protection.
• Use a static-safe work area and static-safe handling
equipment.
• Use static-safe manufacturing methods, including
soldering methods.
The temperature profile shown in Figure 17 provides
general soldering guidlines for these devices. It is
important to note that package-specific guidelines are
found in the ‘Voltage Regulator Soldering and Cleaning
Information’ document. The heating profiles of these
devices allow for a maximum of two soldering applica-
tions. The temperature shown in the Figure is mesured
on the fin portion of the devices. When using reflow sol-
dering, observe these requirements:

Cleaning • Infrared lamps may not uniformly preheat the resin.

Ensure that the temperature profile in Figure 17 is
When cleaning with solvent, the temperature must
observed across the entire surface. See the device-
be kept below 45° C and parts may not be immersed for
specific specifications for the exact temperature
more than 3 minutes.
measurements.
When cleaning with ultrasonic devices, use Ethyl
• The temperature rise during reflow should be 4°C
alcohol, Methyl alcohol, or Isoprophyl alcohol as the
solvent. Because cleaning conditions differ by bath per second or less.
size, ultrasonic power output, cleaning time, and PCB
size, testing under actual manufacturing conditions is HAND SOLDERING
recommended to determine optimum cleaning. These devices are designed for reflow soldering and
Before using alternative solvents, confirm that they hand soldering is not recommended. If hand soldering
do not dissolve the package resin nor promote corro- is necessary, it should be performed at 260°C or less
sion within the chip. Use of fluorocarbon type solvents (soldering iron tip temperature) and should only be
is internationally prohibited. Do not use solvents con- done once.
taining these substances. SHARP does not recommend mounting these
devices to a ceramic PWB.
Soldering
These devices are designed for reflow soldering
methods. If hand soldering is needed in an emergency,
follow the instructions outlined in ‘Hand Soldering’.

Application Note 11
Optoelectronics Voltage Regulator Information

40 s

10 s

260°C CRITICAL ZONE

RAMP
UP
RAMP
DOWN
TEMPERATURE

230°C
TS MAX. 120 s

180°C

150°C

25°C

TIME

OP16-10

Figure 17. Reflow Thermal Limits

TERMS AND SYMBOLS

Table 1. Terms and Symbols
SYMBOL TERM DEFINITION
Vin DC input voltage Maximum DC input voltage applied across input terminals
Vc ON/OFF control terminal voltage Maximum allowable voltage applied to ON/OFF control terminal
Io Output current Maximum allowable output current (continuous) with a resistive load
Maximum power dissipation: There are two types, no heat sink (PD1) and infi-
PD Power dissipation
nite heat sink (PD2).
Tj Junction temperature Maximum junction temperature allowable during operation of a device
Topr Operating temperature Ambient temperature range ensuring normal function of a device
Ambient temperature range where deterioration of characteristic and reduction
Tstg Storage temperature
of reliability do not occur during long term holding without input to a device
Tsol Soldering temperature Maximum temperature allowable in soldering. Required condition is time setting
Reset output applicable
Vr Maximum rating applicable to reset signal output terminal
voltage
Output minute adjustment termi-
Vadj nal voltage or output adjustment Maximum rating applicable to output voltage adjusting terminal
terminal voltage
VO–i Input-output reverse voltage Maximum reverse voltage between input and output
VB Bias supply voltage Maximum DC input voltage between bias supply voltage and GND terminal
Vadj Error input voltage Maximum voltage between Oadj and COM terminal
Vi–O Input-output voltage Maximum voltage between Vin and VOUT
VOUT Output-COM voltage Maximum reverse voltage applicable to VOUT terminal against COM terminal
Vc ON/OFF control voltage Maximum voltage between ON/OFF and COM terminal
ISW Switching current Maximum peak current between Vin and VOUT

12 Application Note
Voltage Regulator Information Optoelectronics

ABSOLUTE MAXIMUM RATINGS

Terms and Symbols
Table 2. Terms and Symbols
SYMBOL TERM DEFINITION
Vo Output voltage Voltage applied across output terminals
Represents the fluctuation of output voltage with respect to fluctuation of load
current. When the load current changes from IO1 to IO2, and the output volt-
age changes from VO1 to VO2, the RegL is expressed (in percent) as:
RegL Load regulation
Vo1 – Vo2
RegL = ------------------------------- × 100
Vo1
Represents the fluctuation of output voltage when the DC input voltage Vin
changes. When the DC input voltage changes from Vin1 to Vin2, and the out-
put voltage changes from VO1 to VO2, RegI is expressed (in percent) as:
RegI Line regulation
Vo1 – Vo2
RegI = ------------------------------- × 100
Vo1
Represents the fluctuation of output voltage when the device junction temper-
ature changes. When the device junction temperature changes from Tj1 to Tj2,
and the output voltage changes from VO1 to VO2, TcVo is expressed (in per-
Temperature coefficient of output cent) as:
TcVo
voltage
( Vo2 – Vo1 ) 1
TcVo = --------------------------------- × ------------------------ × 100
Vo ( Tj ) Tj2 – Tj1
Where Tj = 25°C
Rate of reduction of AC voltage superposed on output voltage against input
AC voltage when the AC sine voltage (frequency of 120 Hz, voltage of 0.5
Vrms) is superposed on the specified DC input voltage Vi. Assuming that ei
RR Ripple rejection (Vrms) and eo (Vrms) express the input AC wave component and output AC
wave component, respectively, RR is represented by:
ei
RR = 20 × log ------- ( dB )
eo
This represents the difference between DC input voltage Vin required for nor-
mal operation of a device and output voltage VO. Assuming that Vin1 and VO1
are DC input voltage and output voltage, respectively, in the case when Vin is
Vi–o Dropout voltage lowered and VO lowers by 5% below normal value (VO at specified Vin), Vi–o
is represented by:
Vi – o = Vin1 – Vo1 ( V )

Output control voltage VC which must be applied between ON/OFF control ter-
minal and GND which is necessary for normal output voltage VO. Even when
VC(ON) ON-state voltage for control
the ON/OFF control terminal is opened, the output voltage is in the ON-state.
(except the PQ05RA series, PQ05SZ series, and the PQ05TZ series)
Current which flows into the ON/OFF control terminal when the specified ON
IC(ON) ON-state current for control
control voltage is applied to the ON/OFF control terminal.
Output control voltage Vc which must be applied between ON/OFF control ter-
VC(OFF) OFF-state voltage for control
minal and GND which is necessary to turn off
Current which flows out from the ON/OFF control terminal when the specified
IC(OFF) OFF-state current for control
output OFF control voltage is applied to the ON/OFF control terminal
Vo(adj) Output voltage minute adjustment Adjustable range of output voltage (Vo)
Voltage between output minute adjustment terminal and GND, voltage be-
Vref Reference voltage
tween output adjustment terminal and GND.

Application Note 13
Optoelectronics Voltage Regulator Information

ELECTRICAL CHARACTERISTICS

Table 3. Terms and Symbols

SYMBOL TERM DEFINITION
Represents the fluctuation of reference voltage when the device junction temperature
changes. When the device junction temperature changes from Tj1 to Tj2, and refer-
ence voltage changes from Vref1 to Vref2, TcVref is expressed (in %/°C) as:
Temperature coefficient
TcVref Vref2 – Vref1 100
of reference voltage TcVref = ------------------------------------- × ------------------------
Vref ( Tj ) Tj2 – Tj1
Where Tj = 25°C
Voltage between reset output and GND when reset signal is active and fixed current is
Vrl LOW reset output voltage
applied between reset output and GND
Vrt Reset threshold voltage Output voltage when reset output is active (LOW), turning down the output voltage (Vo)
Current into reset output terminal when specified voltage is applied between reset out-
Irlk Reset output leak current
put and GND
Consumption current from the GND terminal when the specified input voltage is applied
Iq Quiescent current
between Vin and GND with no load
Output OFF-state Consumption current from the GND ternimal when the ON/OFF control terminal is
Iqs
dissipation current turned off and the specified input voltage is applied between Vin and GND
Current which flows into bias power supply terminal when the specified load, input volt-
IB(I) Bias inflow current
age, and bias power supply voltage are applied
IB(L) Bias limitation current Maximum current which flows into bias power supply terminal within a rating
Dissipation current which flows out from the GND terminal when no load, specified in-
Ig Ground current
put voltage, and bias power supply voltage are applied
OFF-state bias power Bias power supply voltage (VB) which should be applied to bias power supply terminal
VB(OFF)
supply voltage which is nesessary to turn off output
Overheat shut-down
Tsd Device temperature to shut down output voltage (Vo)
temperature
Output saturation
V(sat)* Voltage between Vin and Vout when output transistor is ON.
voltage*
Efficiency (in percent) is expressed as:
Efficiency η Vo × Io
η = ----------------------- × 100
Vin × Iin

NOTE: *Applicable to switching regulators.

14 Application Note
Voltage Regulator Information Optoelectronics

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.

Suggested applications (if any) are for standard use; See Important Restrictions for limitations on special applications. See Limited
Warranty for SHARP’s product warranty. The Limited Warranty is in lieu, and exclusive of, all other warranties, express or implied.
ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND
FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY EXCLUDED. In no event will SHARP be liable, or in any way responsible,
for any incidental or consequential economic or property damage.

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SHARP Electronic Components SHARP Electronics (Singapore) PTE., Ltd. SHARP Electronic Components
(Taiwan) Corporation 438A, Alexandra Road, #05-01/02 (Korea) Corporation
8F-A, No. 16, Sec. 4, Nanking E. Rd. Alexandra Technopark, RM 501 Geosung B/D, 541
Taipei, Taiwan, Republic of China Singapore 119967 Dohwa-dong, Mapo-ku
Phone: (886) 2-2577-7341 Phone: (65) 271-3566 Seoul 121-701, Korea
Fax: (886) 2-2577-7326/2-2577-7328 Fax: (65) 271-3855 Phone: (82) 2-711-5813 ~ 8
Fax: (82) 2-711-5819

CHINA HONG KONG

SHARP Microelectronics of China SHARP-ROXY (Hong Kong) Ltd.

(Shanghai) Co., Ltd. 3rd Business Division,
28 Xin Jin Qiao Road King Tower 16F 17/F, Admiralty Centre, Tower 1
Pudong Shanghai, 201206 P.R. China 18 Harcourt Road, Hong Kong
Phone: (86) 21-5854-7710/21-5834-6056 Phone: (852) 28229311
Fax: (86) 21-5854-4340/21-5834-6057 Fax: (852) 28660779
Head Office: www.sharp.com.hk
No. 360, Bashen Road, Shenzhen Representative Office:
Xin Development Bldg. 22 Room 13B1, Tower C,
Waigaoqiao Free Trade Zone Shanghai Electronics Science & Technology Building
200131 P.R. China Shen Nan Zhong Road
Email: smc@china.global.sharp.co.jp Shenzhen, P.R. China
Phone: (86) 755-3273731
Fax: (86) 755-3273735

©2006 by SHARP Corporation Reference Code SMA06001