Call for papers August 12 - 14 Lima, Peru The 2019 IEEE XXVI International Conference on Electronics, Electrical Engineering and Computing - INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity. 2019 INTERCON will be held in Lima, Peru, the Gastronomic Capital of Latin America and World Heritage Site by UNESCO. Museums with great works of art, archaeological sites, beaches, the boardwalk, valleys, natural reserves, the nightlife, the thrill of adventure sports, and the exquisite cuisine gives Peru's capital an authentic personality and makes tourism in Lima a unique experience in the country. 2019 INTERCON will be hosted at the Universidad Autonoma del Peru in Villa El Salvador, an urban, largely residential coastal district on the outskirts of Lima, Topics of interest include but are not limited to: Communication systems Semiconductor and devices mputers and information technology Signal processing Systems and control Emerging technologies Circuits and systems Power generation, transmission and distribution Renewable energy sources, smartgrids technologies and applications Power electronics, systems and applications Electrical machines and adjustable speed drives High voltage engineering and insulation technology Algorithms and complexity Architecture and organization Graphics andvisualization Information management, assurance and security Intelligent systems Parallel and distributed Computing Software engineering Social issues and professional practice www.intercon.org.pe IEEE aesArar The official language of INTERCON is ENGLISH. cea ae a ra acd four (4). Papers must be submmited in PDF and Peete RUC taC rece omc nian grat Conference Template available at: https://wwwieee.org/conferences/publishing/t Cocco We will use EasyChair system for submissions rcs eee Tenet een re ener Ure) Perec Every accepted paper will need one associated occa areca Coe etter hE ceca Te icy nt et eee a ary Neen tes cess Ty Final paper submission deadline:June 30 once OmPar) www.intercon.org.pe Cree ORSON aCe yg ae Com will implement a strict "No Show No. Cae CCl eS UCU Be occ papers that are not presented at the conference will not be submitted for publication in IEEE Rae cee Carts ee Puen race rare ne Mi giiceec ime) ae] RRM Reet cece Rea oe Poe esc ee estes aR icc BU eettme tee gies All the papers submitted through EasyChair will Peace eu Elegie acs ec caer ee oe Eee see ments Pte hog tetera sac Organizing Committee Conference Chair: César Gallegos Technical Program Chair: Carlos Silva csilva@pucp.edu.pe Publication Chair: Alvaro Talavera ag.talaveral@up.edu.pe Conference Treasurer: Isaac Castil Isaac.castillo.la@ieee.org Information Contact: Duran w.ieee.org.pe) Universidad Autonoma del Peru IEEE Student Branch