Applicable Country & Regions:

All Regions

Product Service Manual – Level 2

Service Manual for BenQ:

Projector/MP511+
<9J.08077.000>

Version: 00a
Date:2007/10/29
Notice:
For RO to input specific “Legal Requirement” in specific NS regarding to responsibility and liability
statements.
Please check BenQ’s eSupport web site, http://esupport.benq.com, to ensure that you have the most
recent version of this manual.

First Edition (Oct, 2007)

© Copyright BenQ Corporation 2007. All Right Reserved.

1
Content Index
Abbreviations & Acronyms……………………………………………………..……..3
About This Manual……………………………………………………..……………..4
Trademark…………………………………………………………...……………...4
Introduction……………………………………………………………………..……....4
Important Service Information………………………………………….……….....4
RoHS (2002/95/EC) Requirements – Applied to all countries require RoHS.……...4
Safety Notice…………………………....………………………....…………..…….5
Compliance Statement……………………………………………………….……..5
General Descriptions…………………………………………………………………….5
Related Service Information……………………………………………………………..5
Service Web Site…………………………………………………………………….5
Product Overview………………………………………………………………………..6
Specifications……………………………………………………………………….6
Packing……………………………………………………………………………17
Customer Acceptance……………………………………………………………..20
Disassembly/Assembly…………………………………………………………………23
Exploded View………………………………………………………………….....23
Module 1 – Total Exploded View..…………………………………………….23
Module 2 – ASSY UPPER CASE………………………………………………….25
Module 3 – ASSY LOWER CASE…….………………..……………...………..26
Module 4 – ASSY REAR CASE……………….………………………...………….27
Module 5 – ASSY ADJ FOOT.………….…………………………...…………28
Disassembly / Assembly………………….………………………………………..29
Level 1 Cosmetic / Appearance / Alignment Service…………………………..………39
Operational Inspection Criteria………….....……………………………………. 39
Software/Firmware Upgrade Process…………………………………………......42
Adjustment / Alignment Procedure………………………………………………45
Level 2 Circuit Board and Standard Parts Replacement……………………………….90
Block Diagram…………………………………………………………………...90
Troubleshooting………………………………………………………………....92
Appendix 1 – Screw List / Torque…………………….………………………………101
Appendix 2 – Code List: IR / RS232 / DDC Data. …...……………………………….103

2
Abbreviations & Acronyms
A
A/D Analog to Digital
B
BenQ BenQ Corporation
D
DLP Digital Light Processing / Texas Instruments®
DMD Digital Micro mirror Device
DVI Digital Video Interface
DVI-I Digital Video Interface-Integrated
P
POM Pond of Mirrors
R
RS232 Interface Between Data terminal Equipment and
Data Communications Equipment Employing
Serial Binary Data Interchange
S
SVGA Super Video Graphics Array, A screen resolution
of 800 x 600 pixels.
SXGA Super XGA. A screen resolution of 1280x1024
pixels.
V
VGA Video Graphics Array. A screen resolution of
640x480 pixels.
X
XGA A screen resolution of 1024x768 pixels.

3
About This Manual
This manual contains information about maintenance and service of BenQ products. Use this
manual to perform diagnostics tests, troubleshoot problems, and align the BenQ product.

Important
Only trained service personnel who are familiar with this BenQ Product shall perform
service or maintenance to it. Before performing any maintenance or service, the
engineer MUST read the “Important Safety Information”

Trademark
The following terms are trademarks of BenQ Corporation:
BenQ

Other companies, products, or service names may be the trademarks of their respective companies.

Introduction
This section contains general service information, please read through carefully. It should be stored
for easy access place.

Important Service Information

RoHS (2002/95/EC) Requirements – Applied to all countries require RoHS.

The RoHS (Restriction of Hazardous Substance in Electrical and Electronic Equipment Directive) is a
legal requirement by EU (European Union) for the global electronics industry which sold in EU and
some counties also require this requirement. Any electrical and electronics products launched in
the market after June 2006 should meet this RoHS requirements. Products launched in the market
before June 2006 are not required to compliant with RoHS parts. If the original parts are not RoHS
complaints, the replacement parts can be non ROHS complaints, but if the original parts are RoHS
compliant, the replacement parts MUST be RoHS complaints.
If the product service or maintenance require replacing any parts, please confirming the RoHS
requirement before replace them.

4
Safety Notice
1 Make sure your working environment is dry and clean, and meets all government safety
requirements.
2 Ensure that other persons are safe while you are servicing the product.
3 DO NOT perform any action that may cause a hazard to the customer or make the product
unsafe.
4 Use proper safety devices to ensure your personal safety.
5 Always use approved tools and test equipment for servicing.
6 Never assume the product’s power is disconnected from the mains power supply. Check that it is
disconnected before opening the product’s cabinet.
7 Modules containing electrical components are sensitive to electrostatic discharge (ESD). Follow
ESD safety procedures while handling these parts.
8 Some products contain more than one battery. Do not disassemble any battery, or expose it to
high temperatures such as throwing into fire or it may explode.
9 Refer to government requirements for battery recycling or disposal.

Compliance Statement
Caution: This Optical Storage Product contains a Laser device. Refer to the product specifications
and your local Laser Safety Compliance Requirements.

General Descriptions
This Service Manual contains general information. There are 2 levels of service:
Level 1: Cosmetic / Appearance / Alignment Service
Level 2: Circuit Board or Standard Parts Replacement

Related Service Information

Service Web Site

BenQ Global Service Website: http://support.benq.com/front/benqmain.asp
eSupport Website: http://esupport.benq.com/v2

5
Product Overview

Specifications:
1.0 Optical Performance
2.0 Image Quality
3.0 Mechanical Specification
4.0 Packaging
5.0 Thermal Specification
6.0 Environmental
7.0 Regulatory
8.0 Reliability
9.0 Power Requirements
10.0 Panel Specification
11.0 Compatibility
12.0 Image Interface
13.0 Control Interface
14.0 User Interface

6

1.0 Optical Performance
1.1 ANSI Brightness
1.2 Brightness Uniformity
1.2.1 ANSI Uniformity
1.2.2 Upper-Down
unbalance
1.2.3 Left-Right unbalance
1.3 Contrast Ratio
1.3.1 ANSI Contrast
1.3.2 FOFO Contrast
1.4 Light Leakage
1.4.1 Light Leakage in Active
Area
Tested under 60” (diagonal) image size with Wide projection lens
position unless other specified. Measurement Details refer to
Appendix A. Reference meter : BENQ Factory T10 meter
(SN:M040000850)
Minimum 1680 Lumens
Minimum 55%
0.5~2
0.6~1.67
Minimum 150:1
Minimum 1200:1
<0.5 lux compared to center point within 60” (Diagonal at 2.2m,
Wide) image size.
Note: This light leakage in Active area is only described as the spot
light with obvious shape. It is not included the uniformity
difference of the projector for black pattern.

1.4.2 Light Leakage out of

Active Area <0.65 lux with 50”~80“(Diagonal at 2m, Wide) image size
Reference meter: BenQ YM5A/Measurement Center Integral
1.5 Color
sphere
X Y
1.5.1 White 0.312±0.04 0.354±0.04
1.5.2 Red 0.640±0.04 0.345±0.04
1.5.3 Green 0.355±0.04 0.548±0.04
1.5.4 Blue 0.141±0.04 0.087±0.04
1.6 Color Uniformity X Y
1.6.1 White 0.040 0.040
1.6.2 Red 0.040 0.040
1.6.3 Green 0.040 0.040
1.6.4 Blue 0.040 0.040
2.0 Image Quality
2.1 Throw Ratio 50”±3% Diagonal at 2m
2.2 Zoom Ratio (tolerance
NA(Fix lens)
applied)
2.3 Distortion
2.3.1 Keystone Distortion <1.0%
2.3.2 Vertical TV Distortion <1.0%
2.3.3 Screen distorsion l W2-W1 l <6mm , l H2 –H1 l <6 mm
2.4 Projection Offset 120% ±5%
2.5 Focus Range
2.5.1 Visible Range 1~8 m
2.5.2 Clearly Focus Range 1.5~6 m(Spec. defined as item 2.6)
2.6 Focus
(1)If pattern can be uniformly focused, pass!
2.6.1 区 Pattern
(2)If not, check 2.6.2
2.6.2 Defocus and Flare Defocus: R<=2.5; G<=2.0; B<=2.5 pixel

7
 Flare: R<=3.5; G<=3.0; B<=4.0 pixel
Slight flare is not counted as flare.
Adjust focus from near to far until one corner clear, difference less
2.6.3 Focus unbalance
than 70 cm@60”
Center of
All other area
49”diagonal area
2.7 Lateral Color R-G <2/3 <1
G-B <2/3 <1
R-B <1 <1
2.8 Image Quality
2.8.1 DMD Image Quality
2.8.2 Image Imperfection
setups
1. 54” (Diagonal at 2m, Wide) image size.
2. Default preset mode “ Dynamic”
3. 区 to check the image.
Let the projector on the desk (don’t move it up/down or left/
right) and just inspect the pattern.
It is OK If the shadow or blur can not be observed obviously.

2.8.3 Image Shadow or Blur

3.0 Mechanical Specification

3.1 Dimensions 277 x 208 x 95 mm (L x W x H)
3.2 Weight 2.6Kgw ± 0.1Kgw
3.3 Security Slot Kensington compatible slot 150N break away force
3.5 Lens Cover Detached Lens Cover
Fast adjustable foot in front, Adjustable foot and Fixed foot in
3.6 Feet
rear. foot Tilt:0-6∘,right/left: +2.2∘/-0.5∘
4.0 Packaging Detail refer to C309 (Packing Description)
4.1 Outside Dimensions 370 x 186 x 297mm (L x W x H)
4.2 Weight 3.7Kgw ± 0.1Kgw (Including Accessories, Projector).
4.3 Palletization 48 by Air; 2688 /40’ container, or 1176 /20’ container by sea.
5.0 Thermal Specification Mechanical component temperature at ambience 0~40℃
5.1 Surface held or touched for Normal surface:

8
 short periods Metal < 60°C; Plastic<85°C
Bottom surface: @ 25° C
Metal < 55°C; Plastic<70°C
5.2 Surface which may be Metal Plastic
touched <70°C <95°C
5.3 Exhaust Air <95°C
6.0 Environmental
Operating 0~40°C, without condensation
6.1 Temperature
Storage -20~60°C, without condensation
Operating 10~90%RH, without condensation
6.2 Humidity
Storage 10~90%RH, without condensation
Normal mode: 32dBA @ 25°C
Typical
Eco mode: 28dBA @ 25°C
6.3 Audible Noise Level
Normal mode: 34dBA @ 25°C
Maximum
Eco mode: 30dBA @ 25°C
Operating:
Without high altitude mode 0°C~35°C @ 0~1499m above sea
level
6.4 Altitude With high altitude mode 0°C~30°C @ 1500~3000m above sea
level
Non-operating:
30℃@0~12,200m above sea level
Safety cTUVus, CE, TUV-GS, CCC, CB Report, PSE, GOST-R,
PSB, SASO, TUV-Argentina, eK,
7.0 Regulatory EMC CE, FCC Class B requirements, C-Tick, VCCI, MIC
ESD BENQ ESD Specification
8.0 Reliability
8.1 MTBF 20000 hours except DMD chip, Color wheel, Lamp and Fan
Normal : 2000 hours (50% brightness maintenance)
8.2 Lamp Lifetime
Eco: 3000 hours
9.0 Power Requirements Adhere to Appendix F
9.1 Power Supply (Normal) VAC 100 – 240 Auto-switch (50/60Hz), 3 Wire Grounded
Typical 260 W Max.
9.2 Power consumption
Standby 5 W Max.
9.3 Power Connector IEC-06
10.0 Panel Specification
10.1 Type Single Chip 0.55” SVGA 12° tilt DDR DMD
10.2 Pixels H: 800 X V: 600
10.3 Color Depth 24 Bits (16770000 colors)
11.0 Compatibility Appendix E3
11.1 PC PC Compatible 640X480 Æ 1024X768, compressed 1280X1024;
Composite-Sync; Sync-on-Green; Interlace Mode (8514A);
NTSC/ NTSC4.43/ PAL (Including PAL-M, PAL-N)/ SECAM/
11.2 Video
PAL60/
11.3 YPbPr NTSC (480i)/ 480p/ PAL (576i)/ 576p, HDTV (720p/ 1080i)
11.4 DDC DDC 2B
12.0 Image Interface Adhere to Appendix E.2

9
 15 pin D-Sub (Female) x 1
G(Y): Video amplitude 0.7/1.0 Vp-p : Impedance 75　
12.1 Analog RGB Input
RB(CbCr): Video amplitude 0.7 Vp-p : Impedance 75　
HD/VD/CS: TTL Level
RCA jack (Yellow)
12.2 Video Input
Video amplitude 1.0 Vp-p : Impedance 75Ω
4 pin Mini-Din (Female)
12.3 S-Video Input Y: Luminance amplitude 1.0 Vp-p : Impedance 75Ω
C: Chroma amplitude 0.268 Vp-p : Impedance 75Ω
12.4 YPbPr Input 15 pin D-Sub (Female) x 1 (Including 12.1)
Y: Luminance amplitude 1.0 Vp-p: Impedance 75Ω
PbPr/CbCr: Chroma amplitude 0.7 Vp-p : Impedance 75Ω
12.5 DVI-A Input N/A
12.6 Analog RGB Output N/A
13.0 Control Interface
13.1 IR Receiver IR Receiver x2 Angle: ±15° Distance 0~8m
13.2 Serial Connector RS232 8pin Mini DIN
13.3 USB Connector USBx1(For factory)
14.0 User Interface Adhere to Appendix E.3
9 Keys:
14.1 Operator Keypad On/Standby ; Source ; Auto Set ; Blank ; Mode ; Left; Right ; Up ;
Down/Menu
3 LEDs:
14.2 Indicators
Power On/Off Status; Lamp Status; Temperature Status
14.3 Electric Keystone vertical keystone and adjustable range ±7°

10
Appendix E Electrical Specification
1. Timing Table
The Default timing is as following:
Refresh rate H-frequency Clock
Resolution Mode
(Hz) (kHz) (MHz)
720 x 400 720x400_70 70.087 31.47 28.322
VGA_60 59.940 31.469 25.175
VGA_72 72.809 37.861 31.500
640 x 480
VGA_75 75.000 37.500 31.500
VGA_85 85.008 43.269 36.000
SVGA_60 60.317 37.879 40.000
SVGA_72 72.188 48.077 50.000
800 x 600
SVGA_75 75.000 46.875 49.500
SVGA_85 85.061 53.674 56.250
XGA_60 60.004 48.363 65.000
XGA_70 70.069 56.476 75.000
1024 x 768
XGA_75 75.029 60.023 78.750
XGA_85 84.997 68.667 94.500
1280 x 1024 SXGA3_60 60.020 63.981 108.000
1280 x 768 SXGA_60 60.09 47.77 80.768
1280 x 800 SXGA_60 59.96 49.65 83.458

YPbPr support timing is as following:

Signal format fh(kHz) fv(Hz)
480i(525i)@60Hz 15.73 59.94
480p(525p)@60Hz 31.47 59.94
576i(625i)@50Hz 15.63 50.00
576p(625p)@50Hz 31.25 50.00
720p(750p)@60Hz 45.00 60.00
720p(750p)@50Hz 37.50 50.00
1080i(1125i)@60Hz 33.75 60.00
1080i(1125i)@50Hz 28.13 50.00

Video, S-Video support timing is as following:

Video mode fh(kHz) fv(Hz) fsc(MHz)
NTSC 15.73 60 3.58
PAL 15.63 50 4.43
SECAM 15.63 50 4.25 or 4.41
PAL-M 15.73 60 3.58
PAL-N 15.63 50 3.58
PAL-60 15.73 60 4.43
NTSC4.43 15.73 60 4.43

11
2. Characteristics of inputs/outputs
Signal Parameter Min Type Max
Impedance 75 Ohm
RDATA
Amplitude 0.7 Volts peak-to-peak
GDATA
BDATA Black pedestal 0 Volts
Pixel Clock 110 M Hz
Impedance 75 Ohm
Amplitude 1 Volts peak-to-peak
Video amplitude 0.7 Volts peak-to-peak
GDATA_SOG
Sync amplitude 0.3 Volts peak-to-peak
Black pedestal 0 Volts
Pixel Clock 110 M Hz
Impedance 1 K ohm
Amplitude, low level 0 0.8 volt
HDATA
Amplitude, high level 2.5 5 Volt
Frequency 31 82 K Hz
Impedance 1 K ohm
Amplitude, low level 0 0.8 volt
VDATA
Amplitude, high level 2.5 5 Volt
Frequency 48 85 Hz
Amplitude, low level 0 0.8 volt
SDADATA
Amplitude, high level 2.5 5 Volt
Amplitude, low level 0 0.8 volt
SCLDATA
Amplitude, high level 2.5 5 Volt
RXD Amplitude -25 25 Volt
TXD Amplitude -25 25 Volt
Amplitude, total (video+
1 Volts peak to peak
sync)
CVBS
Amplitude, video 0.7 Volts peak to peak
Luminance
Amplitude, sync 0.3 Volts peak to peak
Impedance 75 ohm
m Volts peak to
CVBS Amplitude 300
peak
Chroma
Impedance 75 ohm
Impedance (audio in) 10 Kohm
Amplitude (audio in) 0 0.30 Volts rms
Audio Bandwidth 300Hz 16kHz
S/N Ratio 40 %
Total Harmonic Distortion 10 %

3. Electrical Interface Character

Interface Definition

z 15 pin definition of the mini D-sub male for DDC2B protocol

1 5
6 10

11 15

12
 Pin Definition Pin Definition Pin Definition Pin Definition
1 Red video 2 Green 3 Blue Video 4 NC
Video
5 NC 6 Red Video 7 Green Video 8 Blue Video
Return Return Return
9 NC 10 Sync. 11 Monitor ID 12 Bi-directional
bit 0 data (SDA)
Return
13 Horizontal 14 Vertical 15 Data clock
Sync Sync (SCL)

z Video & Component Input

Composite input

Pin Definition
1 Composite video
input

z S-Video input
Pin Description
4 3 1 GND
2 GND
2 1
3 Luminance
4 Chroma

z DVI Port

z Control Port
Pin Description Pin Description
1 DSR 2 CTS
8 7 6 3 RD 4 GND
5 RTS 6 NC
5 4 3
7 TX 8 NC
2 1

13
Local Keyboard Description (Detailed description refer to SW Specification)
Key Name Detailed Description
Power Use this button to turn your Data Projector on and off (standby mode).
Source To select input sources as Computer, Video, S-Video, YpbPr
Auto Toggle auto-tracking image function
Menu/Exit Press “Menu” key to open main menu
Mode Change to Different Picture Mode
Right (1) Move next page (2) OSD increment & move next sub-item (3)PanelKeyLock
Left (1) Move previous page (2) OSD decrement & move previous sub-item (3)Blank
Up (1) Move item bar. (2) Keystone+.
Down (1) Move item bar (2) Keystone-.
Remote Control Keys Description (Detailed description refer to SW Specification)
IR-Key Name Detailed Description
Power Use this button to turn your Data Projector on and off (standby mode).
Source To select input sources as Computer, YPbPr , Video, S-Video
Menu/Exit (1) OSD pop-up. (2) Move next item
4/Panel key lock (1) Move next page (2) OSD increment & move next sub-item (3) enter “Panel
Key Lock” setting
3/? (1) Move previous page (2) OSD decrement & move previous sub-item (3) FAQ
function
5 (1) Close OSD. (2) Move to page level
6 (1) Move item bar
Auto Toggle auto-tracking image function
Mode/ Enter Change different Preset mode
Freeze This button will freeze a picture. Press again to resume motion.
Blank Press “Blank” key first to blank the screen.
Timer On/Show Activate or display Presentation Timer
Timer Setup Setup Presentation Timer
Digital Zoom In Magnify picture gradually
Digital Zoom Out Reduce picture gradually
Keystone+

Keystone-

External Status indicator

LED Name Detailed Description
Power LED Display the power on/off sequence status
Lamp Status LED Display the Lamp status (Lamp fail, Lamp spoil etc.)
Temperature Status LED Display the Thermal status (Fan Fail, Over Temperature, etc.)

14
4. Functionality
The Following functionality will be supported: (Detailed description refer to SW Specification)
Functionality Data (Computer) Video/S-Video YPbPr/YCbCr
Picture Mode YES YES YES
Brightness YES YES YES
Contrast YES YES YES
Color NO YES YES
Tint NO YES YES
Sharpness NO YES NO
Color Temp YES YES YES
H. Position YES NO YES
V. Position YES NO YES
H. Phase YES NO YES
H. Size YES NO YES
Keystone YES YES YES
Language YES YES YES
Auto YES YES YES
Image Ratio YES YES YES
Auto Off YES YES YES
Mirror YES YES YES
Source YES YES YES
Freeze YES YES YES
Blank YES YES YES
Lamp Reset YES YES YES
OSD Timer YES YES YES
Source Scan YES YES YES
Keystone Hold YES YES YES
Mirror Hold YES YES YES
Blank Timer YES YES YES
Information YES YES YES
Reset YES YES YES

External Message indicator (Detailed description refer to SW Specification)

Message Occasion
PC/Composite Video /S-Video /Analog YPbPr The system does not detect the signal
Searching
Out of range The signal is over the specification
NOTICE: Order replacement lamp Lamp Hour is over 2000 hours
Lamp >2000 Hours
NOTICE: Replace lamp soon Lamp Hour is over 2950 hours
Lamp >2950 Hours
NOTICE: Replace lamp now Lamp Hour is over 3000 hours.
Lamp >3000 Hours
Lamp-usage time exceeded

15
Appendix F Power Supply Specification
1. Input Power Specification

Specification
Input Voltage Range
Frequency Range
Power Consumption
Regulation Efficiency
Description
The unit shall meet all the operating requirements with the range 90
~ 264 VAC
The unit shall meet all the operating requirements with an input
frequency range 50 Hz ~ 60 Hz
Normal operation: 260 W (Max)
standby mode: < 5W
80 % (typical) measuring at 115Vac and full load

2. Output Power Requirement

The power supply can provide DC output as below：

NO. Voltage Regulation Load Current Range Ripple & Noise
1 +5 V ±5 % 0.2A ~ 0.5 A 100 mV
2 +12 V ±10 % 0.26 A ~ 2.5 A 300 mV

3. Lamp Power specifications

Specification Description
Applicable Lamp 180 W, AC operation
Starting pulse from Igniter N/A

16
Packing
【NOTE】The updated Service BOM is on e-Support and SPO. Please check it to order service parts.

17
CTN LBL PRINTING

SPEC LBL PRINTING

18
CTN LBL PRINTING (for BQC)

SPEC LBL PRINTING (for BQC)

19
Customer Acceptance
1.0 SCOPE
This document establishes the general workmanship standards and functional
acceptance criteria for PROJECTOR produced by BENQ.
2.0 PURPOSE
The purpose of this publication is to define a procedure for inspection of the
PROJECTOR by means of a customer acceptance test, the method of evaluation of
defects and rules for specifying acceptance levels.
3.0 APPLICATION

The "Customer Acceptance Criteria" is applicable to the inspection of the

PROJECTOR, completely packed and ready for dispatch to customers. Unless
otherwise specified, the customer acceptance inspection should be conducted at
manufacturer's site.
4.0 DEFINITION

The "Customer Acceptance Criteria" is the document defining the process of

examining, testing or otherwise comparing the product with a given set of specified
technical, esthetic and workmanship requirements leading to an evaluation of the
"degree of fitness for use", including possible personal injury or property damage for
the use of the product.
5.0 CLASSIFICATION OF DEFECTS

The defects are grouped into the following classes:

5.1 Critical defect
A critical defect is a defect which judgment and experience indicate that there is
likely to result in hazardous or unsafe conditions for individuals using product.
5.2 Major defect
A major defect is a defect, other than critical one, is likely to result in failure, or
to reduce materially the usability of the product for its intended purpose.
5.3 Minor defect
A minor defect is a defect that is not likely to reduce materially the usability of
its intended purpose, or is a departure from established standards having little
bearing on the effective use of operation of the product.
Note: If BenQ defect undefined failure, and it judged that is reduce the merchandisebility, BenQ

20
 CM Inform this defect. After that parties make communication and decide how to solve.
6.0 EXPRESSION OF DEFECTIVES
Number of defects
Percent of defects = ------------------------------------------ X 100%
Number of products inspected
7.0 INSPECTION STANDARD
Unless otherwise specified, the inspection standard will be defined by MIL-STD-105E,
NORMAL INSPECTION LEVEL Ⅱ, SINGLE SAMPLING PLAN. Level Ⅱ is in use all
the time, inspection levels are normal, reduce and tighten.
7.1 Acceptance Quality Level
7.1.1 Critical Defect:
When a critical defect is found, this must be reported immediately upon
detection, the lot or batch shall be rejected and further shipments shall be
held up pending instructions from the responsible person in relevant
department.
7.1.2 under normal sampling

Critical Defective : 0% AQL

Major Defective : 0.65% AQL
Minor Defective : 2.5% AQL

7.1.3 under special sampling

Critical Defective : 0% AQL

Major Defective : 1.0% AQL
Minor Defective : 4.0% AQL
8.0 GENERAL RULES

8.1 The inspection must be carried out by trained inspectors who have good knowledge about
the product.

8.2 The inspection must be based upon the documents concerning the completely assembled
and packed product.

8.3 When more defects appear with the same unit only the most serious defect has to be taken
into account.

21
 8.4 Defects found in accessory packed with the product such as Cable, Connector, Manual, CD
and the like, and being inspected as a part of the complete product, must be included in the
evaluation.

8.5 The evaluation must be within the limits of the product specification and, for not specified
characteristics, refer to the sample machine or the judgment of BENQ QA Engineer. But any
kind of proposals or judgments must be reasonable and acceptable by both sides.

8.6 Faults must be able to be repeatedly demonstrated.

9.0 TEST CONDITIONS

Unless other prescription, the test conditions are as followings:

Nominal voltage: refer to operation manual
Environmental illumination:
Variable from 500 to 800 Lux (For appearance inspection)
Variable from 0 to 7 Lux (For functional inspection)
Temperature: 25±5℃
Visual inspection shall be done with the distance from eyes to the sample 45 cm.
Display mode: refer to operation manual
10.0 TEST EQUIPMENTS
Dark room
PC
Pattern Generator: Chroma 2327 or equivalent
Minolta color analyzer (CL-100)
DVD player
Power supply (100~240 VAC) with consumption meter
Measuring tape

22
Disassembly/Assembly

Exploded View

Module 1 – Total Exploded View

23
24
Module 2 – ASSY UPPER CASE

25
Module 3 – ASSY LOWER CASE

26
Module 4 – ASSY REAR CASE

27
Module 5 – ASSY ADJ FOOT

28
Disassembly / Assembly

Step Description Parts Concern

take off the cap

1 cap lens
lens
3
cap lens

1
3

disassembly the
2 screw*4
screw*4

2 4

take off the IR IR Sensor upper case

sensor wire and wire
3 module;
the upper case
upper case
module

upper
case

29
 mylar

mylar;
sponge*2;
take off the sponge logo;
upper case one
keypad;
mylar, sponge
sponge IR lens
4 *2,logo,
two module(w
keypad,IR lens
ith IR BD,
module from
IR lens,
upper case
lens
mylar)

BENQ keypad
LOGO

take off the left right case;

5
and right case left case;

right case
left case

disassembly the
screw*2, and screw*2
6
take off the rear 2 rear case
case 1
rear case

30
 disassembly the
7 cable tie and
core
core

cable
tie

disassembly the
double fan
double fan,and double
8 label must
take off the fan
be face out
double fan wire

double fan
label

1
disassembly the
5 screw*5;
screw*5, and
9 4 M/B
take off the M/B
shielding
shielding

2
3

31
 wire
saddle

take off the C/W

FPC wire,
blower fan wire,
C/W Wire
10 C/W sensor
sensor blower saddle
wire, Ballast
C/W fan wire
5Pin wire,IR
FPC
wire,wire saddle Ballast
IR 5Pin wire
i

11 take off the M/B M/B

disassembly the
screw*2, and
take off the lamp 1 screw*3;
door, 2 lamp
12 disassembly the door;
screw*1 and lamp
lamp wire, take module
off the lamp
module.

32
 disassembly the
screw*5,
disassembly the screw*6;
13 grounding power BD
screw*1 and SHD
take off the
Power B/D SHD

disassembly the
screw*2;
wire*2 and
power
screw*2, take off
14 BD;
the power BD
ballast
and ballast
mylar
Mylar

33
 disassembly the 1
screw*2, take off
the lamp box;
disassembly the
screw*2, take off
the blower fan
2

screw*4;
15 lamp box;
blower fan

disassembly the
screw*3;
screw*3, take off
16 OPT eng
the OPT eng
IR wire
and IR wire.

disassembly the
screw*4;
screw*4 and the
17 ballast BD
ballast
Wire*3
BD,wire*3

34
 adjust
foot

take off the push push

button and the button;
adjust foot, adjust
18 disassembly the push button foot;
screw*6 and screw*6
clip*3, the left is clip*3;
lower case lower case

sponge;
take off the
disassemb
sponge,disassem
ly the
19 bly the screw*2
screw*2;
and DMD
DMD
HSINK
HSINK

35
 disassembly the
screw*2,take off
screw*3;
the CW
CW
shielding,
20 shielding;
disassembly the
CW
screw*1 and
module
take off the CW
module

CW module

focus ring

Remove FOCUS
21 focus ring
ring

disassembly the
screw*3;
22 screw*3, take off
PL ass'y
the PL ass'y

36
 disassembly the
screw*4;
screw*4, and
Chip BD
take off the Chip
23 module;
BD module ,
Baffle
take off the
DMD
Baffle DMD

disassembly the
DMD IC;
screw, take off
Thermal
24 the DMD IC,
PAD;
take off the
Chip BD
Thermal PAD

disassembly ILL ILL

MODULE( scre module;
25
w*2),sponge,AS screw*2;
PH lens ASPH lens

37
 upper clip

front clip

disassembly the
clip*2;
front clip and
LP
upper clip, the
26 module
take off the LP
adjust
module,adjust
screw*2
screw*2

disassembly
HSG;
HSG baffle and
27 screw*1
screw*1 from
baffle
HSG

38
Level 1 - Cosmetic / Appearance / Alignment Service
OPERATIONAL INSPECTION CRITERIA
1. TEST PATTERN
PATTERN PATTERN TEST ITEM

ANSI Brightness、Bright Uniformity、FOFO

Full white
Contrast Ratio、CIE white coordinate、Throw
Ratio、Zoom Ratio、Distortion

Full Dark
FOFO Contrast Ratio

Full Red Impurity、CIE coordinate

Full Green Impurity、CIE coordinate

Full Blue Impurity、CIE coordinate

Chromo
Focus Range
800x600

General-1
Performance/ Timing check/ function check
pattern

16 Gray Gray Check

Check the DDC information,

DDC check Including S/N, model, manufacturer name,
product code.

39
2. TEST CONTENT:
Test Condition TEST ITEM Input Equipment
Chroma pattern 800x600 Focus/ Focus range
Impurity, CIE D-SUB Chroma
PC Mode FULL W , R , G , B
coordinate, pixel fail
At random PC sound check Audio CD-ROM
KEY Test Condition TEST ITEM Input Equipment
Chroma / BS
HDTV NTSC (480i) Picture performance YPbPr
Tuner
DVD Video
NTSC disk/ PAL disk Picture quality DVD player
picture S-video

3. SPECIFICATION:
Item Spec. Condition Pattern
Contrast: Preset
ANSI Brightness Minimum 1600 Lumens Full white
Brightness: Preset
Contrast: Preset
Bright Uniformity Minimum 55% Full white
Brightness: Preset
Contrast: Preset
ANSI Contrast Minimum 150:1 Chessboard
Brightness: Preset
Contrast: Preset Full white and
FOFO Contrast Ratio Minimum1200:1
Brightness: Preset Full dark
<0.5 lux compared to
Light Leakage center point within 50” Contrast: Preset
Full dark
(In Active Area) (Diagonal at 2m,wide) Brightness: Preset
image size
<0.5 within 60”
Light Leakage Contrast: Preset
(Diagonal at 2m, wide) Full dark
(Out of Active Area) Brightness: Preset
image size
x=0.323+0.04 Contrast: Preset
CIE white coordinate Full white
y=0.352+0.04 Brightness: Preset
x=0.642+0.04 Contrast: Preset
CIE red coordinate Full Red
y=0.345+0.04 Brightness: Preset
x=0.384+0.04 Contrast: Preset
CIE green coordinate Full Green
y=0.533+0.04 Brightness: Preset
x=0.141+0.04 Contrast: Preset
CIE blue coordinate Full Blue
y=0.080+0.04 Brightness: Preset
50”±3% Diagonal @ 2M Contrast: Preset
Throw Ratio Full white
(Wide) Brightness: Preset
(W2-W1) / (W1+W2) Contrast: Preset
Keystone Distortion Full white
<1.0% Brightness: Preset
(H1+H2-2×H3)/2H2 Contrast: Preset
Vertical TV Distortion Full white
<1.0% Brightness: Preset
Contrast: Preset Chromo 84 X
Visible Range 1~8m
Brightness: Preset pattern
Pixel clear and uniform Contrast: Preset Chromo 84 X
Clearly Focus Range
at 1.5~6m Brightness: Preset pattern
Should be clear and Brightness: Preset Chromo 16 gray
Gray Check
bright Contrast: Preset pattern
See See
See
DMD Image Quality Defect Classification Defect
Defect Classification
Classification

40
Item Spec. Condition Pattern
640X480Æ 1024X768,
compressed 1280X1024; Contrast: Preset Chromo Test
PC Composite-Sync; Brightness: Preset pattern
Sync-on-Green; Interlace
Mode (8514A);
NTSC/NTSC4.43/PAL(In
Contrast: Preset VG828 Test
Video cluding PAL-M, PAL-n)
Brightness: Preset pattern
/SECAM/PAL60
NTSC (480i)/ 480p/ PAL
Contrast: Preset VG828 Test
YPbPr (576i)/576p, HDTV
Brightness: Preset pattern
(720P/1080i)

3.1 POWER CONSUMPTION:

Mode Condition Power Consumption LED Color
Standby power - <5W Red
Normal - < 260 W Green

4. OPERATIONAL INSPECTION CRITERIA:

No Description Class
1 Noise
1.1 When power on or power off, fan or color wheel get abnormal noise. Major
1.2 When normal operation, noise exceed noise level (refer to C201 document) Major
2 Display Quality (include input: Video, S-video, YPbPr, and D-sub or RGB)
2.1 Focus range out of specification Major
2.2 Focus fail (focus not clear or flare/ defocus/ lateral color out of specification) Major
2.3 Brightness & Uniformity --- out of specification. Major
2.4 Contrast ratio --- out of specification Major
2.5 Color coordinates --- out of specification. Major
2.6 Light leakage out of specification (active area or out of active area) Major
2.7 Throw ratio out of specification Major
2.8 Room ratio out of specification Major
2.9 Picture distortion out of specification Major
2.10 DMD image out of specification Major
2.11 Picture dust or other image quality out of specification Major
2.12 Gray stage check --- Missing stage Major
2.13 Video noise --- If video noise presented Major
2.14 DDC data error / incorrect Major
2.15 Mode detection error Major
2.16 OSD Malfunction Major
3 Audio Quality
3.1 Audio malfunction Major
3.2 Speaker no function Major
3.4 Volume mute malfunction Major
4 Remote control malfunction Major
4.1 Receiver range: 0~7 m Receiver angle: ± 30 degree (vertical and horizontal) Major

41
Software/Firmware Upgrade Process

How to Download
Hardware required:
1. Standard USB Download cable (P/N: 5K.J1B01.501 )
2. Personal computer or laptop computer

Software required:
1. DDP2230 Composer lite
2. New version FW

DDP2230 Composer lite install procedure:

Installation Location
The default installation directory is:
C:\Program Files\DLP Composer Lite 7.0
If you want to install to a different directory (perhaps alongside a prior release of DLP
Composer™ Lite), click the "Browse" button on the "Select Features" page..

USB Support - Installation (All Platforms)

This release includes support for a USB communications interface to DDP2230-based projectors.
The setup program includes the files needed to install USB support (for
Win98/WinMe/Win2K/WinXP only -- Win95 and WinNT are not supported).
After DLP Composer™ Lite is installed, to install the USB support, choose the "Install DDP2230
USB Driver" icon under "DLP Composer™ Lite" in your Start menu.

USB Support - Win98/Me/XP Only

Installation on Windows 98/Me//XP may prompt "Please insert the disk labeled 'DLP Composer
Installation Directory', and then click OK". This message may be safely ignored by clicking the
OK button.
Another prompt will then appear: "The file 'windrvr6.sys' on DLP Composer Installation
Directory cannot be found". Again, click OK and the installation proceeds without further
problems.

42
USB Support - Using a projector for the first time

After installation is complete, and you plug a DDP2230-based projector into USB for the first
time, Windows will run the "New Hardware Wizard". When the wizard prompts to find the
necessary drivers, accept the recommended choice (let the system find the driver for you) and
click "Next" to complete the installation.
Note: The Windows 98/Me/XP "New Hardware Wizard" may not automatically find the driver.
You should use the "Advanced" option, and enter the directory where the DLP Composer™ Lite
Tool Suite was installed (normally "C:\Program Files\DLP Composer Lite"). The wizard will
find the file "DDP2230.inf " and complete the installation

USB Support - Choosing the USB interface

To select the USB communications interface, choose "Preferences" from the "Edit" menu, click the
"Communications" page and choose "USB (DDP2000/DDP3020 Only)". You can now use DLP
Composer™ Lite to communicate with a DDP2230-based projector via USB using the Flash
Loader tool.

Download procedure
1. Click on Flash Loader and browse the image file (new version firmware)
2. Make sure to check “Skip Boot loader area (load all but the first 32KB)”
3. Plug power cord into projector
4. Plug in USB cable between computer and projector side
5. Press start download to begin update new firmware

43
 6. Wait till composer lite notice upgrade completed
7. Download is completed. The factory settings should be restored.

How to enter factory menu:

a) Press Menu on keypad than the main menu popup

b) When showing main menu, press Source + Mode at the same time
c) Factory menu popup at the top-left of display

44
Adjustment / Alignment Procedure

Content

1. Main board check procedure

2. DMD Panel Alignment
3. PC Alignment Procedure
4. YUV Alignment Procedure
5. Optical Engine Assembly Procedure
6. Color Wheel Delay Alignment
7. sRGB Mode alignment procedure, Overfill adjustment
8. Power Assembly Concerns
9. Mechanical Assembly Concerns
10. EMI Parts Assembly Concerns

45
1. Main board check procedure
Equipment:
- Pattern generator
Procedure:
1. Connect power, D-sub into projector.
2. Light on projector.
3. Testing below patterns and resolution is 854*480@60Hz (480P)
(1) General-1 pattern. (Pattern 1)
(2) 32 grays pattern. (Pattern 48)
(3) White pattern. (Pattern 41)
(4) SMPTE pattern. (Pattern 5)
4. The main board would be note fail if above four image-quality is not good.
5. Test the connection between main board and IR board.
6. The main board would be note fail if there are some broken occur in wire or main board.

2. DMD Panel Alignment

Equipment:
- Pattern Generator
Procedure:
1. Connect power, Video signal into projector.
2. Light on projector
3. Change pattern generator to full white pattern.
4. Watch the image if any pixel lost
5. Change pattern to full black.
6. Watch the image if any pixel lost
7. Change pattern from full black to full white.
8. Watch the image if any pixel can not return
9. Change pattern from full black to full white.
10. Watch the image if any pixel can not return
11. If above 8 step has some pixel lost or can not return, it’s DMD chip has pixel defect
12. Change to the Slid Line pattern
13. Watch the image if any pixel lost
14. If above step has some pixel lost, it’s conductive socket has defect or assembly loosed.

3. PC Alignment Procedure
Equipment:
- Pattern generator (Chroma-2250)
OSD Default value:

46
 Item Value
Cal R Offset 127
Cal G Offset 127
Cal B Offset 127
Cal R Gain 127
Cal G Gain 127
Cal B Gain 127
YPbPr R Offset 127
YPbPr B Offset 127

Procedure:
Gray Level:
1. Connect power, D-sub, into projector.
2. Change Timing and pattern of pattern generator:
3. Timing: 800*600@60
4. Pattern: As Figure1 {A near white color (240,240,240) and a near black color(16,16,16), the
area of white is 101/200, black is 99/200}
5. Light on projector
6. Set user OSD values to default.
7. Enter factory mode.
8. Set Factory values to default.
9. Press “Calibration RGB” to let the black level to just distinguish, and the light output of
white level to just max.
10. Check the 32 levels of gray. All steps must appear.

Figure1

47
4. YUV Alignment Procedure
Equipment:
- Pattern generator (VG-828)
OSD Default value:
Item Value
Cal R Offset 127
Cal G Offset 127
Cal B Offset 127
Cal R Gain 127
Cal G Gain 127
Cal B Gain 127
YPbPr R Offset 127
YPbPr B Offset 127
Procedure:
1. Connect power core, YPbPr cable into projector.
2. Change timing and pattern of pattern generator:
Timing: 480i
Pattern: As Figure2
3. Light on projector
4. Adjust user OSD values to default.
5. Enter factory mode.
6. Adjust Factory values to default.
7. Press “Calibration YPbPr” to calibrate the mid level offset.

Figure2

48
5. Optical Engine Assembly Concerns
1. Assembly Lamp module:
1.1 Washer, Screw, Fin and Mesh Assembly
I. Assemble Washer and Screw to the HLD Lamp( Figure1-1)
II. Assemble “MESH” with Lamp holder .Mesh hooks HLD Lamp first( Figure1-2) and press it
assemble to the right position( Figure1-3)。
III. Assemble “FIN” with Lamp holder and fasten screw (Figure 1-4)。

Figure 1-1 Figure 1-2

Assembly of Fin_Mesh

Figure 1-3 Figure 1-4

1.2 Front Glass Assembly.
i. Front Glass UV coated surface (marked) must face to Lamp. (Figure 1-6)
ii. F/G must be placed on datum surfaces well. (Figure 1-7)

49
 iii. To make sure F/G Clip hooked well with HLD lamp. (Figure 1-8)

F/G datum

Figure 1-6 Figure 1-7

Figure 1-8

1.5 Lamp wire and Lamp Assembly.

Short wire

Long wire

Figure 1-9 Figure 1-10

50
i. Insert Lamp into HLD Lamp and push Lamp forward to touch DTM Lamp of HLD
Lamp (Figure 1-11)
ii. To make sure that three datum contact with the lamp well(Figure 1-12)
iii. After assemble Lamp to HLD Lamp, Hook “Clip down Lamp” first then Hook “Clip UP
Lamp” on the HLD Lamp to fix Lamp last. (Figure 1-13、1-14)
iv. Check assembly again and make sure the three datum contact with the lamp.
v. Assemble Plate Lamp to the HLD Lamp and fasten the screw(1-15)

DTM of Lamp

Figure 1-11 Figure 1-12

Figure 1-13 Figure 1-14

51
 Figure 1-15

2. BKT LINK Lamp and CW Shield Assembly

1. Insert CW Shield and hook BKT LINK Lamp
2. Fasten screw (Figure 2-1.2-2)
Insert and hook BKT
Link Lamp

Fasten Screw

Figure 2-1 Figure 2-2

3. Assembly CW Module
2.1 CW Module Assembly Sequence as blow (Figure 3-1):
(1) BKT CW (2) Damper CW (3) CW (4) Fixed screw (5) CVR CW
(6) M2 Screw (7) Sensor Board (8) M2 Screw

52
 1
3
4
5

2 8

Figure 3-1

Figure 3-2

53
4. Assembly Baffle Stop AL
1. Assemble Baffle Stop AL on HSG DMD and fasten screw (Figure 4-1)

Figure 4-1
5. Assembly LP Module
5.1 LP must datum well with “BKT_LP” show as Figure 5-1
5.2 Referring to Figure 5-2,there must be visible clearance between “BKT_LP” and ”LP opening”
after assembly。

TOP Datum
Clearance

RIGHT Datum
Figure 5-1 Figure 5-2

5.3 Glue “LP” and “BKT_LP” with “”UV5503 Glue” at two opening of “BKT_LP” show in Figure
5-3.

5.4 UV-5503 Glue curing process and concerns:

54
 vi. The UV-glue must fill up the whole opening area (shown in Figure 5-3) to contact well
with LP surfaces and BKT_LP.
vii. Exposed to visible light at 350 ~ 420nm(at least 100mW/cm2) wavelength for 60 seconds.
viii. After curing, the height of UV-glue should not exceed BKT_LP for more than 0.6mm

Glue 5503

Figure 5-3
5.5 Assembly LP Module to HSG DMD
i. Assembly two Overfill adjustment screw (8F.1A752.8R0) to HSG DMD( Figure5-4)。
** Adjustment criteria refer to item 5.6.
ii. Insert CLIP of BKT_LP into the hole
iii. Placed LP Module on LP datum and adjustment screw well, shown ( Figure 5-6)。
iv. Assembly “Baffle LP” first ( Figure 5-7)and make sure it hooks HSG DMD well
~ Assembly Criteria was shown in Figure 5-7-2.
v. Assembly “Clip_LP” second ( Figure 4-8)and make sure it hooks HSG DMD well。
(Figure 5-9).
vi. Push two hook places to make sure that Baffle_LP touches “BKT_LP “well, don’t push the
middle place of “Baffle_LP”.

5.6 Overfill Adjustment @ LP Module

Overfill Adjustment Criteria:
i. Pre-assembly 2 adjusting screws. Criteria shown as Figure 5-10.
ii. Alignment Sequence:
a. To adjust “Horizontal Adjustment Screw” firstly, then “Vertical Adjustment Screw”.
b. Refer to Figure 4-10.
For Overfill Re-adjustment:
1. Those 2 Adjustment Screws must be released closely to the “Pre-assembly”
positions first. (defined in 4.6-i )

55
 2. Follow adjustment steps shown in Item 4.6-ii.

(1) Overfill Vertical

Adjustment Screw

CLIP of BKT LP

Figure 5-4 (1) Overfill Horizontal Figure 5-5

Adjustment Screw

Overfill adjustment screw

LP DATUM

Figure 5-6

56
Baffle_LP hooks HSG DMD first

To ensure clip hooks

HSG DMD well.

BAFFLE LP
This area is not
allowed to be pressed
while assembling
Baffle LP.
Figure 5-7(1) Figure 5-7(2)

Clip LP

Figure 5-8

57
 Figure 5-9

Pre-assy this screw not over

the side surface.
(1) Overfill Horizontal
Adjustment Screw

(2) Overfill Vertical

Adjustment Screw

Pre-assy this screw not over

the bottom surface.

Figure 5-10

6. Assembly HSG ILL Module

6.1 FM1 Assembly
I. FM1 must be placed on datum surfaces well and breach of FM1 must be face to inside(Figure
6-1)
II. Insert the” CLIP of FM1” into the hole on the HSG ILL and make sure ” CLIP of FM” hook
on the HSG ILL well (Figure 6-2)
6.2 CM Assembly
III. Insert Clip CM Side and Clip CM Bottom first(Figure 6-3,6-5)
IV. Assemble CM to HSG ILL and to make CM contact three datums on the HSG ILL
well(Figure 6-8)

58
V. Assemble “CLIP of TOP” to the HSG ILL (Figure 6-9)
VI. To check and make sure “ CLIP of CM” hooks the HSG ILL very Well (Figure 6-4, 6-6,6-10)
VII. Assemble Baffle Stop to HSG ILL and fasten screw (Figure 6-10)
VIII. Paste Sponge tube AL on cannelure of HSG ILL(Figure 6-11)

Breach of FM1

Figure 6-1 Figure 6-2

CLIP CM SIDE

Figure 6-3 Figure 6-4

59
 CLUP CM DOWN

Figure 6-5 Figure 6-6

DTM of CM

Figure 6-7 Figure 6-8

CLIP CM TOP

Figure 6-9 Figure 6-10

60
 Baffle Stop

Figure 6-10

Sponge

Figure 6-11

7. DMD and Chip B/D Module

7.1. Judge Chip B/D and DMD feature of before assemble (Figure 7-1, 7-2)
7.2. Alight feature and Assemble DMD to Chip B/D (Figure 7-3)
7.3. Push DMD slightly and use screwdriver rotate button to lock DMD on Chip B/D (Figure 7-4)

61
 Feature of assembly
Figure 7-1 Figure 7-2

Button

Figure 7-3 Figure 7-4

8. AL, HSG ILL and HSG DMD Assembly:

8.1 Placed “AL” on the HSG DMD .The “raised surface” of “AL” shall toward “DMD direction”
(Figure 8-1)
8.2 Assemble” HSG ILL Module” to HSG DMD and cover over on “AL” (Figure 8-2)

AL

Figure 8-1

62
 Figure 8-2
9. Assembly OP ENG

9.1 Assemble Baffle DMD to HSG DMD (Figure 9-1)

9.2 Assemble Chip B/D Module to HSG DMD and fasten the screw (Figure9-2)

Figure 9-1

Figure9-2

63
 9.3 Fasten shoulder screw Sequence as blow (Figure 9-3)
i. Pre-fastening Sequence: [ 1 ] - [ 2 ] - [ 3 ] - [ 4 ]
ii. Fastening Sequence [ 2 ] - [ 1 ] - [ 4 ] - [ 3 ]
iii. Screw Torque must be confirmed to be 2 kg-cm.

1 3

4 2

Figure 9-3

9.4 Assemble PL Lens and fasten screw (Figure 9-4)

9.5 Assemble Ring Zoom (Figure9-5)

Screw Ring Zoom

Figure 9-4 Figure 9-5

9.6 Assemble CW Module and fasten screw (Figure 9-6)

64
 Figure 9-6

9.7 Assemble BKT Link and Shield CW (Figure 9-7)

Figure 9-7

9.8-1 Assemble Thermal pad and Heatsink

9-8-2 Fasten Assy spring screw Sequence as blow (Figure 9-8)
Pre-fastening Sequence: [1] - [2]
Fastening Sequence [2] - [1]
Screw Torque must be confirmed to be 6 kg-cm.

65
 1 2

Figure 9-8
9.9 Assemble Lamp Module and fasten screw (Figure 9-9)

Figure 9-9

66
6. Color Wheel Delay Alignment
Equipment:
- Battery Biased Silicon PIN Detector
- Oscilloscope (Vertical scale set to 10mV)
- Probe

Procedure:
1. Probe impedance matches 50 ohm
2. Open Factory OSD, and select color wheel delay item
3. Leave the image pure blue (DMD blue curtain)
4. Put the detector on the screen that blue image was projected.
5. Watch the oscilloscope and notice the square waveform
6. Use the “Æ” and “Å” key to increment or decrement the color wheel delay value
7. No matter the waveform is square or not, let the waveform was lagged first.(see picture 1)
8. Then increment or decrement the value to let the waveform just to be square.(see picture 2)
9. Change to green curtain and check waveform again. If waveform is square (see picture 3), CW
delay value is ok. If waveform is a little lag, then adjust CW value to let waveform square.

Lag OK

Picture
Picture1 1 Picture 2

OK
OK

Picture 3

67
7. sRGB Mode alignment procedure

Confirm CW delay adjustment OK

Confirm ADC adjustment OK

Choose sRGB Mode in PC source

Input W (128,128,128) by pattern generator

Read Wx, Wy

Set CSC table

If ‘NO’

Read Wx,Wy until Wx(0.313+/-6,0.329+/-10)

If ‘NO’

Input W(255,255,255) by pattern generator

Read Wx, wy

Read Wx,Wy until Wx(0.313+/-6,0.329+/-6)

If ‘Yes’

OK

68
Overfill adjustment

As the picture below, adjust light pipe to keep overfill image center.

69
8. Power Assembly Concerns

a. The wire from power to ballast

The connector near the core should be connected with the ballast.

70
9. Mechanical Assembly Concerns
Contents:

1. Grounding wire alignment

2. CW FPC, CW sensor wire and blower wire alignment
3. Between Ballast and lamp wire alignment
4. Ballast wire and ballast sensor wire alignment
5. Twin Fan wire assembly concern
6. Front IR wire assembly concern
7. Main board shielding assemble concern
8. Ballast Wire alignment concern
9. IR Board holder assemble concern
10. Ass’y Main Board wire alignment
11. Power board shielding constrain concern
12. Front IR holder and Upper case assemble concern
13. Optical engine assemble concern

71
 1. Grounding wire alignment
The grounding wire is come out from the left-opening area of the Power BD shielding, see figure 1-1,
it is the final assembly of this wire.

Figure 1-1. Grounding wire alignment

2. CW FPC, CW sensor wire and blower wire alignment
CW FPC wire is constrained by Wire-saddle clip, see figure 2-1. CW FPC wire has to be crossed above
blower wire and keep the redundant wire above lamp box.

Wire-saddle clip Lamp box

Blower fan wire

CW sensor wire
CW FPC wire

Figure 2-1. CW FPC wire alignment.

72
 Figure 2-2. Blower wire alignment

Figure 2-3. Final assembly wire alignment.

3. Between Ballast and lamp wire alignment

73
 Figure 3-1. Final assembly wire alignment.

Figure 3-2. Lamp connector wire location.

4. Ballast power wire and ballast sensor wire alignment

74
Figure 4-1. Ballast with thermal pad

75
 Figure 4-2. Ballast wire location.

NOTE: Please check ballast wire is connected to power board indeed before assembling Power BD.

76
 Assemble this corner first.

Figure 4-3. Ballast mylar assembly.

77
 Add EMI core and fix it
with cable tie

Cable tie must be pulled

tightly

Ballast sensor wire must

be between ballast mylar
and lower case boss

Figure 4-4-1. Ballast sensor wire location.

NOTE: Cable tie must be cut off when disassembly.

78
 Figure 4-4-2. Ballast sensor wire location.

5. Twin Fan wire assembly concern

After assembling power BD shielding, connect fan connector to Main board before put Fan body in
Lower case.

Figure 5-1. Twin Fan assembly concern.

79
 Do not plug in or
pull out the fan
connector by
Fan wire must keep holding the wire.
this location. Don’t Do not pinch the
put wire on top of wire together
the fan. when assembling

Figure 5-2. Twin Fan assembly concern.

6. Front IR wire assembly concern
Make sure IR wire is aligned between Optical engine housing and Upper case.

Figure 6-1-1. Front IR wire alignment.

80
Figure 6-1-2. Front IR wire alignment.

Figure 6-2 IR wire Grounding screw .

81
7.Main board shielding assemble concern
Main board shielding insert to the gap between Power board shielding and Lamp box, see Figure 8-1

Main BD shielding

Gap

Power BD shielding

Lamp Box

Figure 8-1 Main board shielding alignment.

Figure 8-2 Main board shielding alignment.

8. Ballast Wire alignment concern

82
 Figure 9-1 Ballast Wire alignment

9. IR Board assemble concern

IR Board assemble sequence is step (1) and step (2), Figure 9-1. IR Board assembly sequence

Step 2
Step 1

Figure 9-1 IR Board assembly sequence

83
 Figure 9-2 IR Board and IR holder constrain finish status

10. Assembly Main Board wire alignment

CW wire

Twin Fan wire

Photo sensor wire

IR wire

Ballast sensor wire

84
11. Power board shielding constrain concern

First screw constrain location

Second screw constrain location

Power board
shielding 3D.01205.

Be put hole into lower case boss

85
Be put whole into lower case boss and fixed

86
12. Front IR holder and Upper case assemble concern

IR holder clip

Constrain finish

87
13. Optical engine assemble concern

88
10. EMI Parts Assembly Concerns
Item 1 Remove 1 Spring
Solution

Item 2 Add 2 GASKET

Solution

Item 3 Add 1 GASKET

Solution

89
 Level 2 - Circuit Board and Standard Parts Replacement
Block Diagram
Hardware Architecture:

Thermal break
Keypad Main sensor Circuit
Circuit Operation
Fan Driver
Circuit Circuit

Input CW Index Ballast

Source sensor Module
board
Circuit

From AC Door To Lamp

socket interlock EMI PFC Circuit
switch Filter

Figure 1

90
 Main Board

USB
RAM
DDP ASIC
DLP Image
Front IR Rear IR Processor
16 M Flash
I I Memory
RGB888
D-Sub in A/D converter 24bits YUV422
RGB analog signal Digital Signal 16bits
YPbPr
Digital
Signal NTSC/PAL
/SECAM
Video Decoder

DMD Power MBRST DMD Color Wheel

And (15:0) Motor Driver
Reset Driver

S-Video CVBS

Figure 2 Main board & Input board BLOCK DIAGRAM

91
Troubleshooting

92
93
94
95
Trouble Shooting Guide - Power

96
97
Trouble Shooting Guide - Optical

98
Trouble Shooting Guide - Optical Engine Assembly

99
Trouble Shooting Guide –“Blue Edge”

100
Appendix 1 – Screw List /Torque

Model name : MP511

Description Torque Where use

No. Screw P/N Q’TY
Type Head Length Coating (kgf-cm)

Engine HSG & Power BD shielding (1*)

1 8F.1G524.5R0 MACH CAP 5 NI 2 4~5
EMI mylar wire & Power BD shielding (1*)
Blower BKT BTM & LOWER CASE(2*)
Ballast & Lower case(4*)

Ceiling mount plate & Lower case(3*)

2 8F.VA564.6R0 TAP PHM 6 NI 13 5~6
Power Board S/W & LOWER CSAE(2*)

Lamp Box & LOWER CSAE(2*)

3 8F.1A524.8R0 MACH PHM 8 NI 2 4~5 LAMP DOOR & LOWER CASE (2*)
M3.0
Blower BKT & Nozzle(1*)
4 8F.1A524.5R0 MACH PHM 5 NI 6 4~5
Main BD shielding & Power BD shielding(5*)

5 8F.VA564.100 TAP PHM 10 NI 4 5~6 Upper case & Lower case(4*)

6 8F.VG524.8R0 TAP CAP 8 NI 3 5~6 Lower case & Power BD shielding (3*)

7 8F.VA564.8R0 TAP PHM 8 NI 3 5.5~6.5 Engine HSG & Lower case(3*)

8 8G.00020.423 NUT HEX 3 NI 1 2~3 Rear adjust foot top(1*)

M2.0 1 8F.1A522.6R0 MACH PHM 6 NI 1 2~3 Holder adjust foot & Fix block (1*)

AC Wire & Power BD shielding(1*)

M4.0 1 8F.1D526.6R0 MACH TAPTILE 8 NI 4 5~6
Ceiling mount plate & Lower case(3*)
#4-40 1 8F.00480.120 MACH STAND 8 NI 2 4~5 Rear case & D-SUB(2*)

101
102
Appendix 2–Code List: IR / RS232 / DDC Data

Remote Control Code:

1. IR Code
CUSTOMER CODE DATA CODE FUNCTION
0030 02 POWER
0030 03
0030 04 SOURCE
0030 05 TIMER (ON)
0030 06 TIMER (SETUP)
0030 07 BLANK
0030 08 AUTO
0030 0B
0030 0C
0030 0D
0030 0E
0030 0F MENU
0030 10 MODE
0030 18 DIGITAL ZOOM +
0030 19 DIGITAL ZOOM -

2. RS-232 Command

CMD ACTION ASCII

Power on *pow=on#
off *pow=off#
status( on/off/cool down) *pow=?#
Reset OSD Reset *rst#
Mirror Normal *mir=nor#
H Inverse *mir=hinv#
V Inverse *mir=vinv#
H&V Inverse *mir=vhinv#
Mirror status *mir=?#
Contrast Contrast decrease *con=-#
Contrast increase *con=+#
Contrast ratio *con=?#
Brightness Brightness decrease *bri=-#
Brightness increase *bri=+#

103
 Brightness *bri=?#
Aspect ratio Aspect ratio 4:3 *asp=4:3#
Aspect ratio 16:9 *asp=16:9#
Aspect ratio *asp=?#
Auto Adjust Auto Adjust *auto#
Horizontal position Horizontal position shift right *hpos=left#
Horizontal position shift left *hpos=right#
Horizontal position *hpos=?#
Vertical position Vertical position shift up *vpos=up#
Vertical position shift down *vpos=down#
read Vertical position *vpos=?#
Color temperature color temperature low *ctmp=T3#
color temperature standard *ctmp=T2#
color temperature high *ctmp=T1#
color temperature status *ctmp=?#
Blank Blank on/off *blank#
Blank status *blank=?#
Keystone-Vertical Decrease *keyst=-#
Increase *keyst=+#
Keystone status *keyst=?#
Preset mode Preset mode presentation(PC) *appmod=preset#
preset mode brightness *appmod=bright#
preset mode srgb *appmod=srgb#
Preset mode gaming *appmod=game#
Preset mode video *appmod=video#
preset mode movie *appmod=mov#
Preset mode cinema *appmod=cine#
Preset mode game *appmod=game#
Preset mode photo *appmod=phot#
Preset mode status *appmod=?#
Freeze Freeze on/off *freeze#
Freeze status *freeze=?#
Source input Input source VGA *sour=vga#
Input source DVI *sour=dvi#
Input source HDTV *sour=hdtv#
Input source YPbPr *sour=YPbr#
Input source Composite *sour=comp#
Input source SVIDEO *sour=svid#
Input source YCbCr *sour=YCbr#
Status *sour=?#
Source scan Source scan on *scan=on#

104
 Source scan off *scan=off#
Source scan status *scan=?#
Mute Mute on *mute=on#
Mute off *mute=off#
Mute status *mute=?#
Volume Increase Volume *vol=-#
Decrease Volume *vol=+#
Volume *vol=?#
Language English *lang=eng#
FRE(Français) *lang=fre#
Deutsch *lang=ger#
Italiano *lang=ita#
Español *lang=spa#
*lang=pro#
繁體中文 *lang=cht#
简体中文 *lang=chs#
日本語 *lang=jap#
korean(한국어) *lang=kor#
swidish *lang=swd#
dutch *lang=dut#
turkish *lang=turk#
czech *lang=czech#
portugese *lang=portug#
thai *lang=thai#
polish *lang=pol#
Language *lang=?#
Lamp Time Reset Lamp usage hour *ltim=rst#
Lamp usage hour *ltim=?#
Error status *err#

105
DDC data:
+0 +1 +2 +3 +4 +5 +6 +7 +8 +9
0 00 FF FF FF FF FF FF 00 09 D1
10 01 9F 01 01 01 01 01 11 01 03
20 0E 00 00 78 0A 54 AC A1 5A 5A
30 89 23 18 50 58 AD CF 00 31 59
40 45 59 61 59 81 80 01 01 01 01
50 01 01 01 01 64 19 00 40 41 00
60 26 30 18 88 36 00 00 00 00 00
70 00 18 00 00 00 FE 00 42 45 4E
80 51 0A 20 20 20 20 20 20 20 20
90 00 00 00 FC 00 4D 50 35 31 31
100 2B 0A 20 20 20 20 20 20 00 00
110 00 FD 00 30 55 1F 52 0B 00 0A
120 20 20 20 20 20 20 00 3E

Address Data description

00 - 07 Fixed Data(EDID header)
08 - 09 ID Manufacturer Name: BNQ = 09h D1h
(Alphabet number transformed to hex scale from binary)

10 - 11
ID Product Code: 01h, 9Fh
12 - 15 Serial No.: 01010101 (for example; variable)
16 Week of Manufacture: 01 (for example; variable)
17 Year of Manufacture: 2007 (for example; variable)
18 EDID Structure Version No.: 1
19 EDID Structure Revision No.: 3
20 Video Input Definition: Analog Signal 0.700V/0.000V
Sync: Separate V Composite V On Green V
Set up - Serration -
21 - 22 Maximum Horizontal Image Size: 0cm Maximum Vertical Image Size: 0cm
23 Display Gamma: 2.2
24 DPMS Supported Feature: Stand by - Suspend - Active off -
Display Type: R/G/B color display Standard Default Color Space: unused
Preferred Timing Mode: supported GTF supported: not supported
25 - 34 Chroma Information: Red x = 0.629883 y =0.352539
Green x = 0.352539 y = 0.535156
Blue x = 0.138672 y =9.57031e-002
White x = 0.31543 y = 0.34375
35 Established Timing I Support:
720X400 @70Hz V 720X400 @88Hz - 640X480 @60Hz V 640X480 @67Hz -
640X480 @72Hz V 640X480 @75Hz V 800X600 @56Hz - 800X600 @60Hz V
36 Established Timing II Support:
800X600 @72Hz V 800X600 @75Hz V 832X624 @75Hz 1024X768 -
@87Hz
1024X768 V 1024X768 V 1024X768 V 1280X1024 V
@60Hz @70Hz @75Hz @75Hz

37 Established Timing III Support:

106
 Reserved - Reserved - Reserved - Reserved -
Reserved - Reserved - Reserved - Reserved -
38 - 53 Standard Timing Identification:
#1 640X480 @85Hz #2 800X600 @85Hz #3 1024X768 #4 1280X1024
@85Hz @60H
#5 Non-Description #6 Non-Description #7 Non-Description #8 Non-Description

Address Data description

54 - 125 Descriptor Description
54 - 71 Detailed Timing Description #1: 1024x768 @60Hz Pixel Clock = 65.00 MHz
Horizontal Image Size = 0 mm Vertical Image Size = 0 mm
Refresh mode: Non Interlaced Normal display, no stereo
Horizontal
Active Time = 1024 pixels Blanking Time = 320 pixels
Sync Offset = 24 pixels Sync Pulse Width = 136 pixels
Border = 0 pixels Frequency = 48.4 kHz
Vertical
Active Time = 768 lines Blanking Time = 38 lines
Sync Offset = 3 lines Sync Pulse Width = 6 lines
Border = 0 lines Frequency = 60 Hz
Sync configuration: Digital Separate V sync: NEGA H sync: NEGA
72 - 89 Monitor Description
Monitor Range Limits:
Vertical Frequency (min.) = 48Hz
Vertical Frequency (max.) = 85 Hz
Horizontal Frequency (min.) = 31 kHz
Horizontal Frequency (max.) = 82 kHz
Maximum Supported Pixel Clock = 110 MHz
GTF Standard is unused.
90 - 107 Monitor Description
Monitor Name: MP511+
108 - 125 Serial Number

(Each word to be transformed in ASCII code)

126 Extension Flag: 0
127 Checksum: 3E(for example; variable)

107