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Front. Mech. Eng.

2013, 8(3): 319–332


DOI 10.1007/s11465-013-0269-3

RESEARCH ARTICLE

Ravindra Nath YADAV, Vinod YADAVA, G.K. SINGH

Multi-objective optimization of process parameters in Elec-


tro-Discharge Diamond Face Grinding based on ANN-NSGA-II
hybrid technique

© Higher Education Press and Springer-Verlag Berlin Heidelberg 2013

Abstract The effective study of hybrid machining Keywords hybrid machining processes (HMPs), electri-
processes (HMPs), in terms of modeling and optimization cal discharge diamond grinding (EDDG), artificial neural
has always been a challenge to the researchers. The network (ANN), genetic algorithm, modeling and optimiza-
combined approach of Artificial Neural Network (ANN) tion
and Non-Dominated Sorting Genetic Algorithm-II
(NSGA-II) has attracted attention of researchers for
modeling and optimization of the complex machining 1 Introduction
processes. In this paper, a hybrid machining process of
Electrical Discharge Face Grinding (EDFG) and Diamond Recently, hybrid machining processes (HMPs) are show-
Face Grinding (DFG) named as Electrical Discharge ing potential applications for the machining of the difficult
Diamond face Grinding (EDDFG) have been studied to machine materials such as high temperature resistant
using a hybrid methodology of ANN-NSGA-II. In this steels, super alloys, wear resistant ceramics and multi
study, ANN has been used for modeling while NSGA-II is functional qualities composites. Basically, HMPs are
used to optimize the control parameters of the EDDFG combination of two or more (conventional or unconven-
process. For observations of input-output relations, the tional) machining processes, whose performances are
experiments were conducted on a self developed face better than the sum of the constituent machining processes
grinding setup, which is attached with the ram of EDM when they are individually applied [1,2]. The main aims of
machine. During experimentation, the wheel speed, pulse HMPs are utilizing the advantages and at the same time to
current, pulse on-time and duty factor are taken as input avoid or reduce the disadvantages of constituent processes.
parameters while output parameters are material removal Generally, HMPs are classified into two groups: colla-
rate (MRR) and average surface roughness (Ra). The borative and cooperative. In collaborative HMPs: the one
results have shown that the developed ANN model is machining process is directly involved in material removal
capable to predict the output responses within the while the other machining processes either assist in
acceptable limit for a given set of input parameters. It material removal or facilitate the machining by enhancing
has also been found that hybrid approach of ANN-NSGA- the main process. These HMPs are assisted by different
II gives a set of optimal solutions for getting appropriate techniques such as ultrasonic vibration, magnetic field,
value of outputs with multiple objectives. laser beam or plasma beam. In cooperative HMPs: all the
constituent processes are directly involved into material
removal activities. These processes are mainly developed
by combining the abrasive grinding process with most
Received April 17, 2013; accepted May 12, 2013 widely used unconventional machining processes such as
electrical discharge machining (EDM) and electro-

Ravindra Nath YADAV ( ), Vinod YADAVA, G.K. SINGH
chemical machining (ECM) process in different
Department of Mechanical Engineering, Motilal Nehru National
Institute of Technology, Allahabad-211004, India configurations.
E-mail: rnymnnit@yahoo.com In various HMPs, the abrasive action based HMPs are
widely acceptable in the modern manufacturing industries
G.K. SINGH due to their better performance over the conventional and
Department of Mechanical Engineering, Galgotias University, Gr.
Noida, India non-conventional machining processes. These HMPs are
320 Front. Mech. Eng. 2013, 8(3): 319–332

Electro-Discharge Abrasive Grinding (EDAG), Electro- Diamond Face Grinding (DFG) processes, which is shown
Chemical Abrasive Grinding (ECAG) and Electro-Chemi- in Fig. 2. In this process, metal bonded diamond grinding
cal-Discharge Abrasive Grinding (ECDAG) [3]. When the wheel rotates about its vertical spindle axis and fed
metal bonded diamond wheel is used as an abrasive wheel, downward direction toward machine table. The gap
then EDAG process is called as Electrical Discharge between rotating metal bonded diamond wheel and
Diamond Grinding (EDDG) process. The EDDG process workpiece is controlled by servo mechanism of the EDM
has been developed in three different grinding configura- machine. The metal bonded diamond wheel and workpiece
tions, which is shown in Fig. 1. These configurations are: are physically separated by inter electrode gap (IEG),
Electrical Discharge Diamond Cut-off Grinding which is filled with dielectric fluid. The spark is generated
(EDDCG), Electrical Discharge Diamond Face Grinding between metallic bond of diamond wheel and workpiece,
(EDDFG) and Electrical Discharge Diamond Surface when DC pulse power supply is applied to the EDM
Grinding (EDDSG). machine. Due to the spark, the workpiece material is
The different configurations of EDDG process are used melted and softened, which is removed by spark erosion
to create different features on workpiece surface with and abrasion actions. In this process, the workpiece is
application of either face or circumference of metal bonded simultaneously influenced by electrical discharge of EDM
diamond wheel. The EDDCG configuration is used to cut process and abrasive abrasion by diamond particles.
workpiece into pieces or making grooves into workpiece Hence, the material is removed by combined effect of
using abrasion and sparking actions at peripheral surface of spark erosion and abrasive abrasion. The main advantages
the grinding wheel. The EDDFG configuration is used for of this process are: higher material removal rate (MRR)
machining end surface of workpiece using abrasion and with good surface finish, requirement of low grinding
sparking at face surface of grinding wheel. The EDDSG forces, online dressing of diamond grinding wheel and
configuration is used for machining the flat surface using continuous removal of recast layer with micro cracks on
abrasion and sparking at peripheral surface of grinding machined surface.
wheel. All the configurations of EDDG process need a Most of the experimental research works on EDDG
rotating metal bonded diamond grinding wheel with a process are related to the cut-off grinding configuration [4–
provision of spark generation mechanism of the EDM 12]. Aoyama and Inasaki [4] applied EDDG process in cut-
process. off mode for machining of cemented carbide using resin
EDDFG configuration has been developed by combin- bonded diamond wheel. They experimentally studied the
ing the Electrical Discharge Face Grinding (EDFG) and effect of input process parameters such as voltage, pulse

Fig. 1 Different configurations of EDDG process

Fig. 2 EDDFG as combination of EDFG and DFG

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