Professional Documents
Culture Documents
Offices .................................................................................................................................. ii
Safety Notes ....................................................................................................................... xi
Electrical Safety .................................................................................................................. xi
Grounding .......................................................................................................................... xi
Personnel and Equipment Safety Information............................................................ xii
Warnings ..................................................................................................................... xii
Cautions ..................................................................................................................... xiv
Warning Labels ................................................................................................................. xv
Environmental Information ........................................................................................... xv
Electromagnetic Compatibility (EMC) ......................................................................... xvi
Special Warnings and Information.............................................................................. xvii
Equipment Used in Hazardous Locations........................................................... xvii
EC Declaration of Conformity ....................................................................................xviii
Warranty and Claims ....................................................................................................... xx
ChAPTEr 1 OvErvIEw
Principles of Operation .................................................................................................. 1-1
The Basis .................................................................................................................... 1-1
The Implementation ................................................................................................ 1-2
Microcontroller Board and Host Controller Board .............................................. 1-3
Sample Flow ........................................................................................................ 1-3
Discrete Wavelengths .......................................................................................... 1-4
Analyzer Features ............................................................................................................ 1-5
Sample System and Electronics .............................................................................. 1-5
About the Analyzer Sample System ............................................................................. 1-8
Aspiration Components and Functions ................................................................ 1-8
Sample Conditioning Unit (SCU) and Sample Line ........................................... 1-9
Calibration ................................................................................................................. 1-9
Air Supply....................................................................................................................... 1-11
Electronics Purge Air .............................................................................................. 1-11
Aspirator Drive Air ................................................................................................. 1-11
Velocimeter Purge Air ............................................................................................ 1-12
Status Relays .................................................................................................................. 1-12
ChAPTEr 2 SPECIfICATIOnS
Methodology .................................................................................................................... 2-1
Standard Ranges ...................................................................................................... 2-1
Analyzer Specifications .................................................................................................. 2-2
Response Time .......................................................................................................... 2-2
Measurement Accuracy ........................................................................................... 2-2
Repeatability .............................................................................................................. 2-2
Calibration ................................................................................................................. 2-2
Contents | iii
figure 3-4.
Optical bench board
component layout.
b. Swing the Optical Bench Assembly toward the Analyzer Oven and
then swing the Measuring Cell Assembly toward the Heater Plate.
Align the hole in the Heat Transfer Block with the Sample Cell
RTD tip and carefully push the Measuring Cell Assembly toward
the Heater Plate. Adjust the entire Measuring Cell/Optical Bench
Assembly as required to firmly seat the Measuring Cell Assembly
against the Heater Plate.
c. Using an Allen key, insert the 3 mm holding screw into the counter
bore hole in the Heat Transfer Block and thread it (until it is snug)
onto the Sample Cell RTD from which it was removed (see Figure
3-5). Do not use a ball driver – the head can break off inside the
screw. Do not tighten the screw at this time.
Example drawing only. Refer to the Final As-Built drawings for your
application in the “Supplemental Information” section of this manual
nOTE
or the Documentation Package shipped with the analyzer.
The purge air is normally obtained from the Instrument Air supply air
via a separate regulator and flow restrictor mounted on the left side of
the Electronics Enclosure. The required purge air pressure is indicated by
a label on the analyzer backpan. The Electronics Enclosure air pressure
can be verified by connecting a pressure gauge (e.g., Magnahelix™) to
the fitting (gauge port) located on the lower right side of the Electronics
Enclosure. The Electronics Enclosure air pressure should typically be be-
tween 0.1 and 0.2 inches of water with respect to the air pressure outside
the cabinet.
Status relays
The analyzer uses three relays which indicate the operational status of the
analyzer. Each relay provides a set of SPDT (Form C) dry (potential-free)
contacts. The relays are configured for fail-safe operation (i.e., energized
for the non-alarm condition).