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Irfp460, Sihfp460: Vishay Siliconix
Irfp460, Sihfp460: Vishay Siliconix
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Dynamic dV/dt Rating
VDS (V) 500
RDS(on) (Ω) VGS = 10 V 0.27 • Repetitive Avalanche Rated Available
ORDERING INFORMATION
Package TO-247
IRFP460PbF
Lead (Pb)-free
SiHFP460-E3
IRFP460
SnPb
SiHFP460
- 5.0 -
6 mm (0.25") from
package and center of G
nH
Internal Source Inductance LS die contact - 13 -
S
VGS
Top 15 V
10 V
8.0 V
7.0 V
6.0 V
150 °C
5.5 V
5.0 V
Bottom 4.5 V
101
101
25 °C
4.5 V
91237_01 VDS, Drain-to-Source Voltage (V) 91237_03 VGS, Gate-to-Source Voltage (V)
3.5
RDS(on), Drain-to-Source On Resistance
VGS ID = 20 A
Top 15 V VGS = 10 V
10 V 3.0
8.0 V
ID, Drain Current (A)
7.0 V 2.5
6.0 V
(Normalized)
5.5 V 4.5 V
101 2.0
5.0 V
Bottom 4.5 V
1.5
1.0
0.5
20 µs Pulse Width
TC = 150 °C
100 0.0
100 101 - 60 - 40 - 20 0 20 40 60 80 100 120 140 160
91237_02 VDS, Drain-to-Source Voltage (V) 91237_04 TJ, Junction Temperature (°C)
Fig. 2 - Typical Output Characteristics, TC = 150 °C Fig. 4 - Normalized On-Resistance vs. Temperature
10 000 102
VGS = 0 V, f = 1 MHz
6000
Ciss
4000 150 °C
Coss 25 °C
2000
Crss VGS = 0 V
0 101
100 101 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
91237_05 VDS, Drain-to-Source Voltage (V) 91237_07 VSD, Source-to-Drain Voltage (V)
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage Fig. 7 - Typical Source-Drain Diode Forward Voltage
20 103
ID = 20 A Operation in this area limited
VGS, Gate-to-Source Voltage (V)
5
VDS = 400 V by RDS(on)
16 2
ID, Drain Current (A)
VDS = 250 V
102
12 5 10 µs
VDS = 100 V
2
8 100 µs
10
5
4 1 ms
TC = 25 °C
For test circuit 2 TJ = 150 °C
Single Pulse 10 ms
see figure 13
0 1 2 5 2 5 2 5
0 40 80 120 160 200 1 10 102 103
91237_06 QG, Total Gate Charge (nC) 91237_08 VDS, Drain-to-Source Voltage (V)
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage Fig. 8 - Maximum Safe Operating Area
RD
VDS
VGS
D.U.T.
20 RG
+
- VDD
16 10 V
ID, Drain Current (A)
Pulse width ≤ 1 µs
Duty factor ≤ 0.1 %
12
Fig. 10a - Switching Time Test Circuit
8
VDS
4 90 %
0
25 50 75 100 125 150
10 %
91237_09 TC, Case Temperature (°C)
VGS
td(on) tr td(off) tf
Fig. 9 - Maximum Drain Current vs. Case Temperature Fig. 10b - Switching Time Waveforms
1
Thermal Response (ZthJC)
0 - 0.5
0.1 0.2
0.1
0.05 PDM
0.02 Single Pulse
0.01 (Thermal Response)
10-2 t1
t2
Notes:
1. Duty Factor, D = t1/t2
2. Peak Tj = PDM x ZthJC + TC
10-3
10-5 10-4 10-3 10-2 0.1 1 10
L
VDS VDS
Vary tp to obtain
tp
required IAS
VDD
RG D.U.T +
V DD
- VDS
IAS A
10 V
tp 0.01 Ω
IAS
Fig. 12a - Unclamped Inductive Test Circuit Fig. 12b - Unclamped Inductive Waveforms
2400
ID
Top 8.9 A
1200
800
400
VDD = 50 V
0
25 50 75 100 125 150
QG
10 V
QGS QGD
VG
Charge
Current regulator
Same type as D.U.T.
50 kΩ
12 V 0.2 µF
0.3 µF
+
VDS
D.U.T. -
VGS
3 mA
IG ID
Current sampling resistors
Fig. 13b - Gate Charge Test Circuit
- +
-
RG • dV/dt controlled by RG +
• Driver same type as D.U.T. VDD
-
• ISD controlled by duty factor "D"
• D.U.T. - device under test
VGS = 10 V*
Reverse
recovery Body diode forward
current current
dI/dt
D.U.T. VDS waveform
Diode recovery
dV/dt
VDD
Re-applied
voltage Body diode forward drop
Inductor current
Ripple ≤ 5 % ISD
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?91237.
MILLIMETERS MILLIMETERS
DIM. MIN. MAX. NOTES DIM. MIN. MAX. NOTES
A 4.83 5.21 D1 16.25 16.85 5
A1 2.29 2.55 D2 0.56 0.76
A2 1.50 2.49 E 15.50 15.87 4
b 1.12 1.33 E1 13.46 14.16 5
b1 1.12 1.28 E2 4.52 5.49 3
b2 1.91 2.39 6 e 5.44 BSC
b3 1.91 2.34 L 14.90 15.40
b4 2.87 3.22 6, 8 L1 3.96 4.16 6
b5 2.87 3.18 ØP 3.56 3.65 7
c 0.55 0.69 6 Ø P1 7.19 ref.
c1 0.55 0.65 Q 5.31 5.69
D 20.40 20.70 4 S 5.54 5.74
Notes
(1) Package reference: JEDEC® TO247, variation AC
(2) All dimensions are in mm
(3) Slot required, notch may be rounded
(4) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the
outermost extremes of the plastic body
(5) Thermal pad contour optional with dimensions D1 and E1
(6) Lead finish uncontrolled in L1
(7) Ø P to have a maximum draft angle of 1.5° to the top of the part with a maximum hole diameter of 3.91 mm
(8) Dimension b2 and b4 does not include dambar protrusion. Allowable dambar protrusion shall be 0.1 mm total in excess of b2 and b4
dimension at maximum material condition
4 4
2xR
D D1
(2)
1 2 3 D 4
Thermal pad
5 L1
C L 4
E1
See view B A
0.01 M D B M
2 x b2 C View A - A
2x e
3xb
b4 A1
0.10 M C A M
(b1, b3, b5)
Planting Base metal
Lead Assignments
1. Gate D DE E
2. Drain
3. Source (c) c1
C C
4. Drain
(b, b2, b4)
(4)
Section C - C, D - D, E - E
View B
MILLIMETERS MILLIMETERS
DIM. MIN. MAX. NOTES DIM. MIN. MAX. NOTES
A 4.58 5.31 D2 0.51 1.30
A1 2.21 2.59 E 15.29 15.87
A2 1.17 2.49 E1 13.72 -
b 0.99 1.40 e 5.46 BSC
b1 0.99 1.35 Øk 0.254
b2 1.53 2.39 L 14.20 16.25
b3 1.65 2.37 L1 3.71 4.29
b4 2.42 3.43 ØP 3.51 3.66
b5 2.59 3.38 Ø P1 - 7.39
c 0.38 0.86 Q 5.31 5.69
c1 0.38 0.76 R 4.52 5.49
D 19.71 20.82 S 5.51 BSC
D1 13.08 -
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC outline TO-247 with exception of dimension c
D2
B E P1
R/2 P
N A2
K M D BM
R
D1
D
D
L1
L
b4 C E1
b2 e A1
b 0.01 M D B M
0.10 M C A M
b1, b3, b5
Base metal
c1
c
b, b2, b4
Plating
MILLIMETERS MILLIMETERS
DIM. MIN. MAX. DIM. MIN. MAX.
A 4.65 5.31 D2 0.51 1.35
A1 2.21 2.59 E 15.29 15.87
A2 1.17 1.37 E1 13.46 -
b 0.99 1.40 e 5.46 BSC
b1 0.99 1.35 k 0.254
b2 1.65 2.39 L 14.20 16.10
b3 1.65 2.34 L1 3.71 4.29
b4 2.59 3.43 N 7.62 BSC
b5 2.59 3.38 P 3.56 3.66
c 0.38 0.89 P1 - 7.39
c1 0.38 0.84 Q 5.31 5.69
D 19.71 20.70 R 4.52 5.49
D1 13.08 - S 5.51 BSC
ECN: E20-0545-Rev. F, 19-Oct-2020
DWG: 5971
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
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