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® L5991A
PIN CONNECTION
SYNC 1 16 ST-BY
RCT 2 15 DC-LIM
DC 3 14 DIS
VREF 4 13 ISEN
VFB 5 12 SGND
COMP 6 11 PGND
SS 7 10 OUT
V CC 8 9 VC
THERMAL DATA
Symbol Parameter Value Unit
Rth j-amb Thermal Resistance Junction -Ambient (DIP16) 80 °C/W
Thermal Resistance Junction -Ambient (SO16) 120 °C/W
PIN FUNCTIONS
N. Name Function
1 SYNC Synchronization. A synchronization pulse terminates the PWM cycle and discharges Ct
2 RCT Oscillator pin for external CT, RA, RB components
3 DC Duty Cycle control
4 VREF 5.0V +/-1.5% reference voltage @ 25°C
5 VFB Error Amplifier Inverting input
6 COMP Error Amplifier Output
7 SS Soft start pin for external capacitor Css
8 VCC Supply for internal "Signal" circuitry
9 VC Supply for Power section
10 OUT High current totem pole output
11 PGND Power ground
12 SGND Signal ground
13 ISEN Current sense
14 DIS Disable. It must never be left floating. TIE to SGND if not used.
15 DC-LIM Connecting this pin to Vref, DC is limited to 50%. If it is left floating or grounded no limitation is
imposed
16 ST-BY Standby. Connect a resistor to RCT. Connect to VREF or floating if not used.
2/23
L5991 - L5991A
3/23
L5991 - L5991A
4/23
L5991 - L5991A
Figure 3. Quiescent current vs. input voltage. Figure 4. Quiescent current vs. input voltage
and switching frequency.
Iq [m A ] Iq [m A ]
9 .0 36
V 14 = 0, V 5 = V ref
30 C o = 1 nF, T j = 25°C
R t = 4.5Koh m ,T j = 25 °C
8 .5 D C = 0%
1 M hz 24
5 00K hz
1 M Hz
3 00K hz
8 .0 18
1 00K hz 5 00 K H z
12 3 00 K H z
7 .5
1 00 K H z
6
7 .0 0
8 10 12 14 16 18 20 22 24 8 10 12 14 16 18 20 22
V c c [V ] V cc [V ]
Figure 5. Quiescent current vs. input voltage Figure 6. IC Consumption vs. Temperature.
and switching frequency.
Iq [mA]
36 [mA]
Co = 1nF, Tj = 25°C 100
Operating current
30 Vcc =15V, after turn-on
DC = 100% RT=13.3kΩ, CT=1nF
DC=75%, Co=1nF
24 1MHz 10
Quiescent current
Vcc =15V, after turn-on
18 500KHz RT=13.3 kΩ, CT=1nF
1 DC = 0
300KHz
12
100KHz
0.1
6
Start-up current
Vc=Vcc= Vccon-0.5V, before turn-on
0 0.01
8 10 12 14 16 18 20 22 -50 -25 0 25 50 75 100 125 150
Vcc [V] Junction temperature [˚C]
Figure 7. Reference voltage vs. load current. Figure 8. Vref vs. junction temperature.
Vref [V]
Vref [V])
5.1 5.1
5 5
4.95 4.95
4.9
0 5 10 15 20 25 4.9
-50 -25 0 25 50 75 100 125 150
Iref [mA] Tj (°C)
5/23
L5991 - L5991A
Figure 9. Vref vs. junction temperature. Figure 10. Vref SVRR vs. switching frequency.
5.05 Vp-p=1V
Iref= 20mA
80
5
4.95 40
4.9 0
-50 -25 0 25 50 75 100 125 150 1 10 100 1000 10000
Tj (°C) fsw (Hz)
16 2.5
Vcc = Vc = 15V
14 2
Tj = 25°C Vc c = Vc = 15V
T j = 25°C
12 1.5
10 1
8 0.5
6 0
0 0.2 0.4 0.6 0.8 1 1.2 0 0.2 0.4 0.6 0.8 1 1.2
Isource [A] Isink [A ]
Figure 13. UVLO Saturation Figure 14. Timing resistor vs. switching frequency.
0 10
0 200 400 600 800 1,000 1,200 1,400 10 20 30 40
Vpin10 [mV] Rt (kohm)
6/23
L5991 - L5991A
Figure 15. Switching frequency vs. tempera- Figure 16. Switching frequency vs. temperature.
ture.
fsw (KHz)
fsw (KHz)
320
320
Rt= 4.5Kohm, Ct = 1nF
Rt= 4.5Kohm, Ct = 1nF
310 Vcc = 15V, V15= 0
310 Vcc = 15V, V15=Vref
300
300
290 290
280 280
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Tj (°C) Tj (°C)
Figure 17. Dead time vs Ct. Figure 18. Maximum Duty Cycle vs Vpin3.
1.5 Ct = 1nF
300
1
2 4 6 8 10 0 10 20 30 40 50 60 70 80 90 100
Timing capacitor Ct [nF] Duty Cycle [%]
Figure 19. Delay to output vs junction temperature. Figure 20. E/A frequency response.
38
100 100
36
80
34 50
60
32 PIN10 = OPEN
1V pulse
0 40
30 on PIN13
28 20
-50 -25 0 25 50 75 100 125 150
0.01 0.1 1 10 100 1000 10000 100000
Tj (°C)
f (KHz)
7/23
L5991 - L5991A
APPLICATION INFORMATION Pin 2. RCT (Oscillator). Two resistors (RA and RB)
Detailed Pin Function Description and one capacitor (CT), connected as shown in
fig. 23, allow to set separately the operating fre-
Pin 1. SYNC (In/Out Synchronization). This func- quency of the oscillator in normal operation (fosc)
tion allows the IC’s oscillator either to synchronize and in standby mode (fSB).
other controllers (master) or to be synchronized to
CT is charged from Vref through RA and RB in nor-
an external frequency (slave). mal operation (STANDBY = HIGH), through RA
As a master, the pin delivers positive pulses dur- only in standby ( STANDBY = LOW). See pin 16
ing the falling edge of the oscillator (see pin 2). In description to see how the STANDBY signal is gen-
slave operation the circuit is edge triggered. Refer erated.
to fig. 23 to see how it works. When several IC
When the voltage on CT reaches 3V, the capaci-
work in parallel no master-slave designation is
needed because the fastest one becomes auto- tor is quickly internally discharged. As the voltage
has dropped to 1V it starts being charged again.
Figure 22. Synchronizing the L5991.
RB RA
8/23
L5991 - L5991A
R1
D
Q
CLAMP R
600µA
RA R3 R2
+
RCT 2 CLK
-
D1
RB
CT 50Ω
ST-BY 16
STANDBY D97IN729A
The oscillation frequency can be established with from fig. 14 or resulting from (1) and (2).
the aid of the diagrams of fig. 14, where RT will be To prevent the oscillator frequency from switching
intended as the parallel of RA and RB in normal back and forth from fosc to fSB, the ratio fosc / fSB
operation and RT = RA in standby, or considering must not exceed 5.5.
the following approximate relationships: If during normal operation the IC is to be synchro-
nized to an external oscillator, RA, RB and CT
1 should be selected for a fosc lower than the master
fosc ≅ (1),
CT ⋅ (0.693 ⋅ (RA // RB) + KT frequency in any condition (typically, 10-20% ),
depending also on the tolerance of the parts.
which gives the normal operating frequency, and:
Pin 3. DC (Duty Cycle Control). By biasing this
1 pin with a voltage between 1 and 3 V it is possible
fSB ≅ (2),
CT ⋅ (0.693 ⋅ RA + KT) to set the maximum duty cycle between 0 and the
upper extreme Dx (see pin 15).
which gives the standby frequency, that is the one If Dmax is the desired maximum duty cycle, the
the converter will operate at when lightly loaded. voltage V3 to be applied to pin 3 is:
In the above expressions, RA // RB means:
V3 = 5 - 2(2-Dmax) (5)
RA ⋅ RB
RA//RB = ,
RA + RB
while KT is defined as: Dmax is determined by internal comparison be-
tween V3 and the oscillator ramp (see fig. 24),
90 V15 = VREF thus in case the device is synchronized to an ex-
KT = (3), ternal frequency fext (and therefore the oscillator
160 V15 = GND/OPEN amplitude is reduced), (5) changes into:
during ESD tests), it can be connected to VREF duce the oscillator frequency when the converter
through a 4.7kΩ resistor. is lightly loaded (standby).
Figure 24. Duty cycle control. Pin 7. SS (Soft-Start). At device start-up, a ca-
pacitor (Css) connected between this pin and
SGND (pin 12) is charged by an internal current
generator, ISSC, up to about 7V. During this
ramp, the E/A output is clamped by the voltage
VREF 4 across Css itself and allowed to rise linearly, start-
ing from zero, up to the steady-state value im-
R1 3µA posed by the control loop. The maximum time in-
DC 3 23K terval during which the E/A is clamped, referred to
as soft-start time, is approximately:
RA R2
28K
3 ⋅ Rsense ⋅ IQpk
ST-BY
Tss ≅ ⋅ Css (7)
16 ISSC
RB + TO PWM LOGIC
RCT 2
-
where Rsense is the current sense resistor (see pin
13) and IQpk is the switch peak current (flowing
CT through Rsense), which depends on the output
D97IN727A load. Usually, CSS is selected for a TSS in the or-
der of milliseconds.
Pin 4. VREF (Reference Voltage). The device is As mentioned before, the soft-start intervenes
provided with an accurate voltage reference also in case of severe overload or short circuit on
(5V±1.5%) able to deliver some mA to an external the output. Referring to fig. 25, pulse-by-pulse
circuit. current limitation is somehow effective as long as
A small film capacitor (0.1 µF typ.), connected
between this pin and SGND, is recommended to Figure 25. Regulation characteristic and re-
ensure the stability of the generator and to prevent lated quantities.
noise from affecting the reference.
Before device turn-on, this pin has a sink current ca- VOUT IQpk
A
pability of 0.5mA. D.C.M. C.C.M.
1-2 ·IQpk
IQpk(max)
Pin 5. VFB (Error Amplifier Inverting Input). The
C
feedback signal is applied to this pin and is com- B
pared to the E/A internal reference (2.5V). The TON
E/A output generates the control voltage which D
fixes the duty cycle.
TON(min)
The E/A features high gain-bandwidth product,
which allows to broaden the bandwidth of the D97IN495 ISHORT IOUT(max) IOUT
overall control loop, high slew-rate and current ca-
pability, which improves its large signal behavior.
Usually the compensation network, which stabi- the ON-time of the power switch can be reduced
lizes the overall control loop, is connected be- (from A to B). After the minimum ON-time is
tween this pin and COMP (pin 6). reached (from B onwards) the current is out of
control.
To prevent this risk, a comparator trips an over-
Pin 6. COMP (Error Amplifier Output). Usually, current handling procedure, named ’hiccup’ mode
this pin is used for frequency compensation and operation, when a voltage above 1.2V (point C) is
the relevant network is connected between this detected on current sense input (ISEN, pin 13).
pin and VFB (pin 5). Compensation networks to- Basically, the IC is turned off and then soft-started
wards ground are not possible since the L5991 as long as the fault condition is detected. As a re-
E/A is a voltage mode amplifier (low output im- sult, the operating point is moved abruptly to D,
pedance). See application ideas for some exam- creating a foldback effect. Fig. 26 illustrates the
ple of compensation techniques. operation.
It is worth mentioning that the calculation of the
part values of the compensation network must The oscillation frequency appearing on the soft-
take the standby frequency operation into ac- start capacitor in case of permanent fault, referred
count. In particular, this means that the open-loop to as ’hiccup" period, is approximately given by:
crossover frequency must not exceed fSB/4 ÷
fSB/5. 1 1
Thic ≅ 4.5 ⋅ + ⋅ Css (8)
The voltage on pin 6 is monitored in order to re-
ISSC ISSD
10/23
L5991 - L5991A
Since the system tries restarting each hiccup cy- MOS. At turn-on the gate resistance is Rg + Rg’, at
cle, there is not any latchoff risk. turn-off is Rg only.
"Hiccup" keeps the system in control in case of
short circuits but does not eliminate power com- Figure 27. Turn-on and turn-off speeds adjust-
ponents overstress during pulse-by-pulse limita- ment.
tion (from A to C). Other external protection cir- Rg'
cuits are needed if a better control of overloads is
required.
VCC VC Rg(ON)=Rg+Rg'
Rg(OFF)=Rg
8 9
Pin 8. VCC (Controller Supply). This pin supplies
the signal part of the IC. The device is enabled as 13V
10
VCC voltage exceeds the start threshold and DRIVE &
CONTROL
works as long as the voltage is above the UVLO OUT Rg
IOUT
SHORT
ISEN
FAULT
SS
5V 7V
0.5V
time
Thic D98IN986
11/23
L5991 - L5991A
in fig.28) holds the pin low in order to ensure that Pin 13. ISEN (Current Sense). This pin is to be
the external MOS cannot be turned on acciden- connected to the "hot" lead of the current sense
tally. The peculiarity of this circuit is its ability to resistor Rsense (being the other one grounded), to
mantain the same sink capability (typically, 20mA get a voltage ramp which is an image of the cur-
@ 1V) from VCC = 0V up to the start-up threshold. rent of the switch (IQ). When this voltage is equal
When the threshold is exceeded and the L5991 to:
starts operating, VREFOK is pulled high (refer to fig.
28) and the circuit is disabled.
It is then possible to omit the "bleeder" resistor VCOMP − 1.4
V13pk = IQpk ⋅ Rsense = (9)
(connected between the gate and the source of 3
the MOS) ordinarily used to prevent undesired
switching-on of the external MOS because of
some leakage current. the conduction of the switch is terminated.
To increase the noise immunity, a "Leading Edge
Figure 28. Pull-Down of the output in UVLO. Blanking" of about 100ns is internally realized as
shown in fig. 29. Because of that, the smoothing
RC filter between this pin and Rsense could be re-
moved or, at least, considerably reduced.
OUT
10
2V
I
3V +
0 -
CLK
PWM
13 COMPARATOR
ISEN + TO PWM
LOGIC
FROM E/A -
+ TO FAULT
LOGIC
1.2V - OVERCURRENT
COMPARATOR D97IN503
12/23
L5991 - L5991A
Figure 30. Disable (Latched). and the output switching frequency will be halved
with respect to the oscillator one because an in-
ternal T flip-flop (see block diagram) is activated.
Fig. 31 shows the operation.
DISABLE
SIGNAL The half duty cycle option speeds up the dis-
charge of the timing capacitor CT (in order to get
duty cycles as close to 50% as possible) so the
DIS 14 oscillator frequency - with the same timing compo-
+ D
Q
DISABLE nents will be slightly higher.
- R
C
2.5V Pin 16. S-BY (Standby Function). The resistor RB,
UVLO D97IN502
along with RA, sets the operating frequency of the
oscillator in normal operation (fosc). In fact, as long
as the STANDBY signal is high, the pin is inter-
connecting DC-LIM to VREF (half duty cycle op- nally connected to the reference voltage VREF by
tion), Dx will be set approximately at: a N-channel FET (see fig. 32), so the timing ca-
pacitor CT is charged through RA and RB. When
RT the STANDBY signal goes low the N-channel FET
Dx ≅ (11) is turned off and the pin becomes floating. RB is
2 ⋅ RT + 260
Figure 31. Half duty cycle option.
td
V15=GND
V5=V13=GND
V2 tc
DX =
tc + td
V10
tc
td
V15=VREF
V5=V13=GND
V2
tc
DX =
2 ·tc + td
V10
tc
D97IN498
COMP ISEN
6 13
+
2R - R DRIVER OUT
STANDBY
10V 4
5
FB - + VREF
STANDBY
+ - HIGH
2.5
2.5/4 ST-BY
LEVEL SHIFT
16
STANDBY BLOCK
LOW
RB RA VT1 VT2 VCOMP
2.5V 4V
2
RCT
CT
D97IN752B
13/23
L5991 - L5991A
14/23
C11 4700pF 4KV C12
16 14 9 5W
4 8 C56
470µF 25V
R5
C06 12K R08 22 Q01 11 C57
10 STP6 470µF 25V
2
NA60FI -15V
6800pF 10 D56 BYW100-100 5W
R9 R11 1K R52
24K L5991 13 47
C05
16 100pF
12 R10 R54 R53 C58
0.22 1K 4.7K 47µF 25V
Figure 33. Typical application circuit for computer monitors (90W).
7 11
C09 8.2nF R21 100
6 4N35
5 VR51
C08 100K C59
3.3nF 0.01µF
R55 R56
C61 300K 4.3K
0.056µF
Q51
VAC(V) 88 110 220 270 TL431
Pin(W) 2.95 3.10 3.90 4.40 R58
4.7K
Pout(W) 2
D97IN730A
application problems of L5991 based supplies.
either improving performance or solving common
L5991 - L5991A
15/23
16/23
4700pF 4KV 4700pF 4KV
28V / 0.7A
265 Vac 0.1µF 0.1µF 2 x 330µF
100µF BZW06-154 N2
10K 35V
400V BYW98-100
1.1M N1 12V / 1.5A
N3 2 x 470µF
1N4937
16V
GND
1.1M STK2N50 BAT46 BYW100-50
5V / 0.5A
BC337
22V
4.7K 33K Naux N4 470µF
47K 16V
22
5.6K
100nF 33µF/25V
4 15 14 9 8
5.6K
22K 3 22
10 STP4NA60
2
3.3nF 16 1K
L5991 13
5.6K
Figure 34. Typical application circuit for inkjet printers (40W).
0.47
1 470pF 1/2 W
12
220 1K
11
7 470
6 4N35
330nF 5
470pF
SGND L5991 10
12
4 13
VREF ISEN R
RA
RSENSE
OPTIONAL
D97IN751A
Figure 36. Isolated MOSFET Drive & Current Transformer Sensing in 2-switch Topologies.
VIN
ISOLATION
BOUNDARY
VC
9
10 OUT
L5991
ISEN
13
12 11
PGND SGND
D97IN761
VIN
2.2MΩ 33KΩ
STD1NB50-1
T
VCC
VREF 8 SELF-SUPPLY
20V 4 WINDING
47KΩ L5991
12 11
D97IN762B
VCC VC
8 9
10 OUT
ISEN
13
L5991 11
PGND
D97IN763
17/23
L5991 - L5991A
+
From VO 2.5V
1.3mA
Ri + 2R
VFB 5
-
EA
Rd Cf Rf R
COMP 6 12
SGND
Error Amp compensation circuit for stabilizing any current-mode topology except
for boost and flyback converters operating with continuous inductor current.
+
From VO 2.5V
1.3mA
RP + 2R
Ri VFB 5
-
EA
CP Rd Cf Rf R
COMP 6 12
SGND D97IN507
Error Amp compensation circuit for stabilizing current-mode boost and flyback
topologies operating with continuous inductor current.
VOUT
COMP
6
L5991
5 TL431
VFB
D97IN759
ST-BY
ST-BY 16
16 VREF OUT
VREF 4 10
4
RB RA R
RB RA
RCT
RCT 2
2
CT CSLOPE
CT
I RSLOPE L5991 I L5991 L5991
RSLOPE RSLOPE
ISEN ISEN ISEN
13 13 13
12 12 12
RSENSE SGND RSENSE SGND SGND RSENSE
18/23
L5991 - L5991A
RSTART RSTART
VCC VCC
VZ
8 8
DIS DIS
14 L5991 14 L5991
12 11 2.2K 12 11
D97IN754 D98IN905
DC L5991 ISEN
3 13
11 12
RSENSE
12 11 PGND SGND
OPTIONAL
D97IN755A D97IN756A
VIN
80 ÷ 400VDC Lp
RFF
6
R·Lp
OUT RFF = 6·10
RSENSE
10
L5991
ISEN
13
11 12 R
RSENSE
PGND SGND
D97IN757
DC
3
10K
L5991
6
COMP 12 13
SGND ISEN
D97IN758A
19/23
L5991 - L5991A
VIN
80÷400VDC
R1 VREF
4
4.7K
L5991
3
12 11
5.1 R2 10KΩ
SGND PGND
D97IN750B
SYNC
1 L5991
1KΩ
12
5.1V
SGND
D97IN753A
20/23
L5991 - L5991A
mm inch
DIM. OUTLINE AND
MIN. TYP. MAX. MIN. TYP. MAX. MECHANICAL DATA
a1 0.51 0.020
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
DIP16
Z 1.27 0.050
21/23
L5991 - L5991A
mm inch
DIM. OUTLINE AND
MIN. TYP. MAX. MIN. TYP. MAX. MECHANICAL DATA
A 1.75 0.069
a2 1.6 0.063
C 0.5 0.020
c1 45˚ (typ.)
e 1.27 0.050
e3 8.89 0.350
M 0.62 0.024
SO16 Narrow
S 8˚(max.)
(1) D and F do not include mold flash or protrusions. Mold flash or potrusions shall not exceed 0.15mm (.006inch).
22/23
L5991 - L5991A
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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