% (ULANSI:FR-4.0) High Performance, Low CTE, Hi-Tg Lead-free FR RFR-4OW 3Tg170C(DSC), UV Blocking “AOL ¥ . werk FEATURES «Lead-free compalibie FR-4.0 laminate 3 Ta70% (080). UVBiocking /AO1 compatible, 3 High neat resistance 3 (owerz-axie cre Excellent through-hole reliability. Excellent ant-CAF performance Cow water absorption Excellent mechanical processibility GENERAL PROPERTIES Noms Condition DSC ‘BMA ‘CaBr23/50, 6.24/25 After moisture Volume Resistivity resistance E-24/125 Aiier moisture Surface Resistivity resistance E-24/125 ‘Are Resistance (D-48/50+0-0.5/25 Dislectrie Breakdown | 0-46/50+D-0.5/25) Dielectric | GHZ) (S-24/23/50. Constant ameay (G-24/23/50. Dissipation [_CIGH2) (24/23/50. Factor | GMHay (G-24/23/50. a Flammability ‘Thermal Stress 288°C, solder dip, Peal Stenath @ OZ) eB CHS LW cw Water Absorption B-24/25, Betore Ta cTE@-axis) ‘After Ta, 50-260°C Ta Wis%ioss T2860 TMA, T2808 TMA. 7300. TMA. il TEG50112Method Flexural Strength BARE WAT AS EPCR Feame ee oAERES APPLICATIONS Suitable for high-layer count PCB Widely used in computer, communication, automotive electronics, and etc. Property Data Spee “Typical Vaio 180 185 v0) 8.665 +08 7AGE+08 2.476407 B.64E08 7135 S5KVENG. a5 a9) 0.018 0.015 =1008 No Delamination 13 367 aa 24 60 30. 75: PLES (200v>(ULANSI:FR-4.0) High Performance, Low CTE, Hi-Tg Lead-free High layer count application evaluation Aen (Nr a 2é-layer, core 0.13 HIM, PP: 1080/2116 Overall thickness: 4.0mm Min, hole size: 0.3mm Aspect ratio: 11.5:1 260°C Lead free reflow: 5X, OK SOR 00 ha te ti ft.08 Ist 3.1m, 1080+2116 prepreg construction, Hole size: 0.3mm 1,0mmP, 0.8mmP Precondition: 6X reflow (Peak 260°C) Test condition: Room temp. ~ 150°C Failure Method: Powerisense Result: Power cycles > 2000 Anti-CAF performance Heavy copper board application 16 12 Layer— 502 inner Copper 2 / | Sample Construction 10 \ Glass types(1080/106) Copper weights(202/502) ‘Thermal Stress: 288°C /"Osldip, 2X DMM Testrosut: No Resin crack No Delamination wy ne 201, TH-TH 16mil,20mil_——_—SXLF reflow (Peak 2600) Goss types(108/108012118) CAF test condition: Hole size: 0.0mm 85°01 87% 100V OC Precondition: Result Passed 1000 hours -32- vate i 3== -$1000-2MB PREPREG (ULANSI:FR-4.0) High Performance, Low CTE, Hi-Tg Lead-free PREPREG PARAMETERS 4106/1037 2 0.050 40 O.018 | 4 260m x150m 77 0.060 39 0.020 64 0.072 43 0.018 1080/1076 69 0.086 44 0.019 | 1.260m X300m 2313/3313 56 0.096 45 0.016 51 0.108 46 0.015 2116 55 0.120 45 0.016 | 1.260m X250m 57. 0.127 46 0.016 1506 45 0.150 48 0.014 44 0.187 48 0.014 46 0.196 48 0.014 | 1.260m X150m 7628 50 0.216 47 0.015 52. 0.227 46 0.015 ‘Remark: DK and Df are tested according to IPC TM-650 2.5.6.9 Prepreg type, resin content and size could be available upon request. Hot Pressing Cycle: Time (min) a5 sos 160480 Hoatuprate-t 0-2. 5timin (0-140) Curing time®>0min (185-195 ) ‘The hot pressing parameters is for your reference only, please turn to Shengyl Technology Co., Lis for detailed information ‘Storage Condition: + The hot pressing parameter i for your reference only. Please tum to Shengy Technology (Co, Lid for deal nfo + For shor term storage ts good to keep itn <23°C and <50% RH within three months + Forlong term storage, Keep in SC within § month, should be normalized in te room temperature at east ¢ hous before use. + Beware of moisture, kept in normal conditions, prepreg absorbs moisture an its bonding strenghnis weakened. So alvays Keep f wrapped in damp-proof material + Avoid uleavolt rays and strong lights -33- vate