Introduction

to PCB
(Printed Circuit Board)

By: Rodi Hartono

Roadmap Cource What`s PCB? Bread Board

Types of Boards General Purpose Board

Introduction to PCB

History Printed Circuit Board

Single Sided PCB

MK. Desain Elektronika Double Sided PCB

1. Using Datasheets
Types of PCB
Berbasis PCB 2. ….

Multilayer PCB 1. Multisim

2. ….

Part Research And

Selection 1. Manual Design
2. Computer Aided
Design Software
Step Involve In PCB Schematic Capture
CAD
Design And Selection

Board Layout 1. Schematic

Preparation
2. Layout Preparation
3. Etching Process
Fabrication
4. Drilling
5. Solder Mask
Verification And 6. Silkscreen
Validation 7. Electrical Test
What is PCB?
ü Printed Circuit Board is a plate used for placing
the different elements that conform an electrical
circuits that contains the electrical
interconnection between them.

ü It is a board that has lines and pads that

connects various points together.

PCB is the backbone of electrical devices.

Types of Boards

Breadboard Printed Circuit Board

General Purpose Board
 point construction was used.
This means some bulky and unreliable designs that required large sock
replacement.

Why PCB?
Most of these issues were directly addressed when PCB went into direc
Pcbs are rugged, inexpensive and can be highly reliable.
Mass manufacturing .
ü Before printed circuits became the common
component used in Professional.
electronics, Point to point
construction was used.
ü
Reduced space and time.
This means some bulky and unreliable designs
that required large sockets and regular
replacement.
ü Most of these issues were directly addressed Bulk
when PCB went into direct production.
ü Mass manufacturing
ü Professional.
ü Reduced space and time

Pcbs are rugged, inexpensive and can

be highly reliable.
For any Application needs
PCB Timeline

Source from: https://pcb-solutions.com/

Basic PCB Clasification
ü PCBs may be classified in many different ways
according to their various attributes. One
fundamental structure common to all of them is that
they must provide electrical conductor paths that Copper Foil Layer
interconnect components to be mounted on them.

ü There are two basic ways to form these conductors:

Subtractive. In the subtractive process, the Substrate Layer
unwanted portion of the copper foil on the base
substrate is etched away, leaving the desired conductor
pattern in place.
Basic Construction of PCB
Additive. In the additive process, formation of the
conductor pattern is accomplished by adding copper to
a bare (no copper foil) substrate in the pattern and
places desired. This can be done by plating copper,
screening conductive paste, or laying down insulating
wire onto the substrate on the predetermined
conductor paths.
PCB Clasification
Base Material of PCB
Base Material of PCB
Currently base materials:

ü Glass-reinforced epoxy (FR4)

ü Aluminium MCPCB (Metal Core PCB),
ü Teflon,
ü Ceramic (microwave)
Base Material of PCB
ü Glass-reinforced epoxy (FR4)
Base Material of PCB
ü Aluminium MCPCB (Metal Core PCB)
Base Material of PCB
ü Aluminium MCPCB (Metal Core PCB)
Base Material of PCB
ü Teflon
Base Material of PCB
ü Ceramic (microwave)
Base Material of PCB

Metal Core or Double Sided Plated Through Hole Metal PCBs Illustration
Material Parameters of PCB
Basic parameters:
ü Non-conductor and copper foil thickness – mechanical resistance,
fitting the case, current-carrying capacity, etc.;
ü CTI class – breakdown strength between traces in wet ambient
conditions;
ü Fire resistance class (UL) – specifies the flammability of materials.
Temperature parameters:
ü glass transition temperature (boundary): Tg – yield point;
ü chemical decomposition temperature of laminates: Td –
temperature causing 5% loss of laminate weight;
ü delamination time: T260/288 – time after which delamination
occurs (for temperatures 260 and 288°C);
ü the coefficient of thermal expansion of laminates that is projected
along the XY plane and the Z axis: CTEZ,XY;
ü max. operating temperature (MOT) – safe temperature for
continuous operation.
Humidity absorption:
ü max. moisture content in laminate;
ü resistance to CAF;
ü Electric parameters
ü dielectric constant Dk;
ü lossiness Df;
ü dielectric breakdown strength.